Cutting device

Abstract

To provide a cutting device capable of reducing an adhesion of sawdust to a rear side of a substrate.SOLUTION: A cutting device 1 cuts a substrate 100 held by a holding table 10 with a cutting blade 21 along a division schedule line 105 while supplying a cutting water to a processing point. The holding table 10 contains: a plurality of holding region 17 holding the cut substrate 100; an escape groove 18 into which the cutting blade 21 enters; and a holding surface 12 holding the substrate 100. The plurality of holding region 17 contains: an outer peripheral suction part 51 sucking and holding an outer peripheral part of the substrate 100 to be cut; a center suction part 52 sucking and holding a center of the substrate 100 to be cut; and a seal part 53 that is formed between the outer peripheral suction part 51 and the center suction part 52, in which one end is opened to the holding surface 12, and the other end is communicated with an air or an air supply source 79, and prevents the cutting water from entering into the center of the substrate 100.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a cutting device for cutting a substrate. [Background technology]

[0002] When cutting large substrates such as package substrates and printed circuit boards, a cutting device is known that does not use dicing tape but instead directly adsorbs the substrate to a holding table whose holding surface is formed of metal, resin, or the like in order to reduce running costs (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-024150 Summary of the Invention [Problem to be solved by the invention]

[0004] However, if the backside of the substrate being held by the holding surface is uneven or warped, vacuum leaks may occur, and cutting water and cutting debris may contaminate the backside of the cut-out substrate. In particular, the device is formed in the center of the divided substrate, which is the area used as a product, so contamination is undesirable.

[0005] The present invention has been made in view of the above problems, and an object of the present invention is to provide a cutting device that can reduce adhesion of cutting debris to the back surface side of a substrate. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the cutting device of the present invention is a cutting device that cuts a substrate held on a holding table along a planned division line with a cutting blade while supplying cutting water to a processing point, the holding table including a plurality of holding areas that hold the cut-out substrate and an escape groove into which the cutting blade enters, and a holding surface that holds the substrate, the plurality of holding areas including an outer periphery suction section that suction-holds the outer periphery of the substrate to be cut out, a central suction section that suction-holds the center of the substrate to be cut out, and a sealing section formed between the outer periphery suction section and the central suction section, one end of which opens to the holding surface and the other end of which is connected to the atmosphere or an air supply source, and which prevents the cutting water from entering the center of the substrate.

[0007] The peripheral suction portion and the central suction portion may each have a groove that follows the outer shape of the substrate and one or more holes that are formed in the groove and communicate with the air suction source, or a plurality of holes that are arranged along the outer shape of the substrate and communicate with the air suction source.

[0008] The sealing portion may have a groove that follows the outline of the substrate and one or more holes formed in the groove that communicate with the atmosphere or the air supply source, or a plurality of holes that are arranged along the outline of the substrate and communicate with the atmosphere or the air supply source. [Effects of the Invention]

[0009] The present invention can reduce adhesion of cutting debris to the back surface side of the substrate. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a cutting device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view showing a substrate to be cut by the cutting device of FIG. [Figure 3] 3 is a plan view showing a holding surface of the cutting device of FIG. [Figure 4] 4 is a cross-sectional view showing a holding table of the cutting device of FIG. [Figure 5]5 is an enlarged cross-sectional view of a part of the cross-sectional view of the holding table in FIG. [Figure 6] FIG. 6 is a perspective view showing an example of the configuration of a cutting device according to the second embodiment. [Figure 7] FIG. 7 is a top view showing a package substrate to be cut by the cutting device of FIG. [Figure 8] FIG. 8 is a bottom view showing a package substrate to be cut by the cutting device of FIG. [Figure 9] 9 is an enlarged plan view of a part of the plan view of the holding surface of the cutting device of FIG. 6. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0012] [Embodiment 1] A cutting device 1 according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing an example of the configuration of the cutting device 1 according to the first embodiment. As shown in Fig. 1, the cutting device 1 according to the first embodiment includes a holding table 10, a cutting unit 20, an imaging unit 29, a moving unit 30, and a control unit 40.

[0013] Fig. 2 is a perspective view showing a substrate 100 that is the cutting target of the cutting device 1 of Fig. 1. In the first embodiment, the substrate 100 that is the cutting target to be cut by the cutting device 1 is a so-called package substrate that has a rectangular flat plate shape in plan view, as shown in Figs. 1 and 2. The substrate 100 includes a rectangular flat plate-shaped plate member 101. In the first embodiment, the plate member 101 is made of a metal such as a 42 alloy (an alloy of iron and nickel) or a metal containing copper (i.e., a copper alloy), a wiring board, a wiring layer, or the like.

[0014] The substrate 100 has a device region 103 and a peripheral excess region 104 surrounding the device region 103 on a surface 102 of a plate member 101. The substrate 100 has a plurality of planned division lines 105 that intersect with each other set on the surface 102 of the plate member 101. The plurality of planned division lines 105 are set to extend along any side direction of the plate member 101. The substrate 100 is partitioned by the plurality of planned division lines 105 that intersect with each other, and devices 106 such as semiconductor devices such as ICs (Integrated Circuits), LSIs (Large Scale Integrations), and power devices, and LEDs (Light Emitting Diodes) are arranged in each region within the device region 103. In the substrate 100 of embodiment 1, a plurality of devices 106 (8 × 8 = 64 in the example shown in FIGS. 1 and 2 ) are arranged adjacent to each other with the planned division lines 105 in between. The substrate 100 may be coated with a synthetic resin in one block or in multiple blocks on the surface 102 of the plate member 101 so as to fill the dividing lines 105 between the devices 106 and the peripheries of the device regions 103. The substrate 100 has an electrode layer 108 (see FIG. 4, etc.) formed on the back surface 107 of the plate member 101. The electrode layer 108 is formed, for example, in areas corresponding to the devices 106 and their peripheries, including multiple electrode pads protruding into areas corresponding to the dividing lines 105. In the first embodiment, the back surface 107 of the plate member 101 on which the electrode layer 108 is formed is directly attracted to and held by the holding table 10. The electrode layer 108 may be a wiring layer.

[0015] The substrate 100 has unevenness formed by the electrode layer 108 formed on the back surface 107. Furthermore, due to differences in thermal shrinkage rates among the plate member 101, the device 106, and the electrode layer 108, the substrate 100 is curved in a direction such that, when viewed from the side, the center of the plate member 101 on which the device 106 is disposed is convex toward the front surface 102, and the center of the plate member 101 on which the electrode layer 108 is formed is concave toward the back surface 107, resulting in warpage.

[0016] 2, the cutting device 1 according to the first embodiment cuts the substrate 100 along two planned dividing lines 105 that pass through the center of the plate member 101, thereby dividing the substrate 100 into four 1 / 4-size substrates 110 each including a plurality of devices 106 (4 × 4 = 16 in the example shown in FIGS. 1 and 2). The substrate 100 is further cut along the remaining planned dividing lines 105, thereby dividing the substrate 100 into each of the plurality of devices 106.

[0017] As shown in FIG. 1 , the holding table 10 has a frame 11 and a holding surface 12 that holds a substrate 100. The holding surface 12 corresponding to the substrate 100 is detachably attached to an upper surface 13 of the frame 11 of the holding table 10. The frame 11 supports the holding surface 12 attached to the upper surface 13 from below. The frame 11 is connected to a rotational drive source (not shown) and is provided so as to be rotatable about a Z-axis that is vertical and perpendicular to a horizontal plane (XY plane) parallel to a surface 14 above the holding surface 12 by the rotational drive source (not shown). The frame 11 is provided so as to be movable relative to the cutting unit 20 in the X-axis direction, which is one horizontal direction parallel to the surface 14 above the holding surface 12, by an X-axis moving unit 31 of a moving unit 30 provided below the frame 11. The holding surface 12 attached to the upper surface 13 of the frame 11 moves together with the frame 11.

[0018] FIG. 3 is a plan view showing the holding surface 12 of the cutting device 1 of FIG. 1. FIG. 4 is a cross-sectional view showing the holding table 10 of the cutting device 1 of FIG. 1. FIG. 5 is an enlarged cross-sectional view of a portion of the cross-sectional view of the holding table 10 of FIG. 4. As shown in FIG. 3, the holding surface 12 is a rectangular, flat member (holding member, holding plate) corresponding to the substrate 100 in a plan view. As shown in FIG. 4, the holding surface 12 has an upper surface 14 formed with a surface that suction-holds the substrate 100, and a lower surface 15 formed so as to be detachably attached to the frame 11. When the lower surface 15 of the holding surface 12 is attached to the frame 11, the upper surface 14 becomes parallel to the XY plane, which is a horizontal plane. In the first embodiment, the holding surface 12 is made of urethane rubber such as nitrile rubber or ethylene rubber.

[0019] 3 and 4, the holding table 10 includes a plurality of holding areas 17 for holding the cut-out substrates 100, and clearance grooves 18 into which the cutting blades 21 of the cutting units 20 for cutting the substrates 100 enter. The clearance grooves 18 are formed on the upper surface 14 side of the holding surface 12 at positions corresponding to the planned division lines 105 along which the cutting blades 21 will cut the substrate 100. In the first embodiment, the clearance grooves 18 are formed at positions corresponding to the two planned division lines 105 that pass through the center of the plate member 101. The clearance grooves 18 are formed so that their width is wider than the width of the planned division lines 105 and the thickness of the cutting blades 21, and so that their depth is deeper than the cutting depth of the cutting blades 21.

[0020] 3, the surface 14 above the holding surface 12 is partitioned by a plurality of clearance grooves 18 into a plurality of holding regions 17 corresponding to the respective regions of the substrates 100 to be cut out after being divided along the planned division lines 105 (quarter-size substrates 110 in the first embodiment). In the first embodiment, the holding surface 12 has a plurality of holding regions 17 corresponding to the device regions 103 of the plurality of substrates 100 to be cut out, as shown in FIG. 4. For this reason, in the first embodiment, the portions of the peripheral excess region 104 cut out from the plurality of substrates 100 to be cut out are not held by the holding surface 12 but become scraps and are removed from the holding surface 12.

[0021] 3 and 4, each of the holding regions 17 includes an outer periphery suction portion 51, a central suction portion 52, and a sealing portion 53. The outer periphery suction portion 51 is formed to correspond to the outer periphery of the substrate 100 to be cut out and to follow the outline of the substrate 100 to be cut out. The central suction portion 52 is formed to correspond to the center of the substrate 100 to be cut out. The sealing portion 53 is formed between the outer periphery suction portion 51 and the central suction portion 52 and to follow the outline of the substrate 100 to be cut out. In other words, the sealing portion 53 surrounds the central suction portion 52, and the outer periphery suction portion 51 surrounds the sealing portion 53.

[0022] In embodiment 1, the peripheral suction portion 51 and the sealing portion 53 are each formed in a square frame shape along the rectangular cut-out substrate 100, and the central suction portion 52 is formed in a rectangular shape, but the present invention is not limited to this. For example, if the outer shape of the cut-out substrate 100 is a disk shape, the peripheral suction portion 51 and the sealing portion 53 are formed in an annular shape, and the central suction portion 52 is formed in a circular shape.

[0023] 3 and 4, in the first embodiment, the peripheral suction unit 51 is disposed and formed along the outer shape of the substrate 100 to be cut out, opens toward the surface 14 above the holding surface 12, and has a plurality of air suction holes 61 that communicate with the air suction source 78 via the peripheral suction path 71 and the suction valve 75 formed in the frame 11. The peripheral suction unit 51 introduces negative pressure from the air suction source 78 through the air suction holes 61 and via the peripheral suction path 71 and the suction valve 75, thereby suction-holding the region corresponding to the peripheral portion of the substrate 100 to be cut out from the back surface 107 side.

[0024] The peripheral suction section 51 is not limited to this configuration. It may have a continuous groove formed around the circumference of the substrate 100 to be cut out, and one or more air suction holes 61 formed in the groove and connected to the air suction source 78, similar to those in the first embodiment. The peripheral suction section 51 has such a groove and multiple air suction holes 61 formed in the groove, which enhances the suction holding force and fixing force at the outer periphery of the substrate 100 to be cut out. This reduces the risk of chipping or other cutting defects occurring when cutting along the planned division line 105 between the device region 103 and the outer surplus region 104, particularly when a large amount of cutting water is used or when the substrate 100 is prone to movement at its outer periphery. The groove may be formed around the circumference of the substrate 100 to be cut out, or it may be formed at a predetermined length without being continuous around the circumference. One or more grooves may be formed. A continuous groove around the circumference enhances fixing force, but if forming a groove reduces the strength of the holding surface or if a non-continuous groove is sufficient fixing force, it is sufficient to form one or more grooves of a predetermined length.

[0025] 3 and 4, in the first embodiment, the central suction section 52 has a plurality of air suction holes 62 that open toward the surface 14 above the holding surface 12 and communicate with an air suction source 78 via a central suction path 72 and a suction valve 76 formed in the frame 11. The central suction section 52 introduces negative pressure from the air suction source 78 through the air suction holes 62 and via the central suction path 72 and the suction valve 76, thereby suction-holding an area corresponding to the center of the substrate 100 to be cut out from the back surface 107 side.

[0026] The central suction section 52 is not limited to this configuration. It may have one or more grooves formed along the contour of the substrate 100 to be cut out, or may have a plurality of air suction holes 62 similar to those in the first embodiment. The grooves may be formed continuously around the contour of the substrate 100 to be cut out, or may be discontinuous and formed over a predetermined length. There may be one or more grooves. A continuous groove around the entire circumference increases the holding force. However, if forming a groove reduces the strength of the holding surface or if a non-continuous groove is sufficient, it is sufficient to form one or more grooves of a predetermined length. The central suction section 52 suction-holds the area corresponding to the center of the substrate 100 to be cut out from the back surface 107 side, thereby preventing the center of the substrate 100 from warping concavely toward the back surface 107. This reduces the risk of devices 106 and other components on the front surface 102 of the substrate 100 interfering with the side of the cutting blade 21, the spindle 22, the spindle housing 23, and other components when cutting with the cutting blade 21. The central suction unit 52 further suction-holds the area corresponding to the center of the substrate 100 to be cut out from the rear surface 107 side, thereby reducing the risk of the substrate 100 being deformed due to air introduced by the sealing unit 53 (described later) through the air supply grooves 63 and the air supply holes 64. In particular, when the substrate 100 before cutting and the quarter-size substrate 110 that is the substrate 100 to be cut out are large as in the first embodiment, warping tends to increase both before and after cutting, and therefore the effect of the central suction unit 52 in reducing the risk of interference and deformation is remarkable.

[0027] 3 and 4 , the sealing unit 53 has an air supply groove 63 formed continuously around the outer shape of the substrate 100 to be cut out, and one or more air supply holes 64 formed in the air supply groove 63, opening toward the surface 14 above the holding surface 12, and communicating with an air supply source 79 via an air supply path 73 and an air supply valve 77 formed in the frame 11. The sealing unit 53 introduces clean air that does not contain cutting debris, which is supplied from the air supply source 79 via the air supply path 73 and the air supply valve 77 through the air supply groove 63 and the air supply hole 64, thereby creating a positive pressure in the sealing unit 53 on the surface 14 above the holding surface 12, relative to the peripheral suction unit 51 and the central suction unit 52, on the back surface 107 side of the substrate 100 on the surface 14 above the holding surface 12. In addition, the sealing portion 53 is not limited to a form in which the other end is connected to the air supply source 79, but may also be a form in which the other end is open to clean atmosphere that does not contain cutting debris.In this case, by introducing atmospheric pressure, the sealing portion 53 on the upper surface 14 of the holding surface 12 is made to have a positive pressure relative to the peripheral suction portion 51 and the central suction portion 52 on the back surface 107 side of the substrate 100 on the upper surface 14 of the holding surface 12.

[0028] In the present invention, the sealing portion 53 is not limited to having the air supply groove 63 and one or more air supply holes 64. The sealing portion 53 may have a plurality of air supply holes 64 similar to those in the first embodiment, arranged along the contour of the substrate 100 to be cut. When the peripheral suction portion 51 is performing suction, the sealing portion 53 applies a positive pressure to the sealing portion 53 relative to the peripheral suction portion 51, thereby forming an air flow 65 from the sealing portion 53 toward the peripheral suction portion 51, as shown in FIG. 5 . By forming this air flow 65, the sealing portion 53 prevents cutting water 200 containing cutting chips generated during cutting of the substrate 100 from penetrating into the central region held by the central suction portion 52 on the back surface 107 of the substrate 100. In other words, by forming the air flow 65, the sealing portion 53 restricts the penetration of the cutting water 200 containing cutting chips to the peripheral region held by the peripheral suction portion 51 on the back surface 107 of the substrate 100. The groove (air supply groove 63) may be formed continuously around the circumference along the outline of the substrate 100 to be cut out, or may be formed discontinuously over a predetermined length. There may be one or more grooves. A continuous groove around the circumference increases the ability to prevent cutting water from entering, but in cases where forming a groove reduces the strength of the holding surface or where cutting water can be sufficiently prevented from entering without a continuous groove around the circumference, it is sufficient to form one or more grooves of a predetermined length.

[0029] Since introducing high-pressure air into the sealing portion 53 may cause the substrate 100 to float from the holding surface 12, it is preferable to keep the amount of air introduced into the sealing portion 53 to a minimum in order to make the sealing portion 53 at a positive pressure relative to the peripheral suction portion 51 and the central suction portion 52, or to introduce atmospheric pressure into the sealing portion 53.

[0030] The sealing portion 53 would be sufficient with only multiple air supply holes 64, but since the route by which cutting water 200 containing cutting chips enters the back surface 107 of the substrate 100 cannot be identified and may be different each time the substrate 100 is cut, a configuration in which air supply holes 64 are formed in an air supply groove 63 that is formed in a continuous circle around the circumference as in embodiment 1 is preferable because this can more reliably prevent the entry of cutting water 200 containing cutting chips in all directions around the outer periphery of the substrate 100.

[0031] The cutting unit 20 includes a cutting blade 21, a spindle 22 to which the cutting blade 21 is attached at its tip, a spindle housing 23, a blade cover 26, and a nozzle 27. The cutting unit 20 cuts the substrate 100 held on the holding surface 12 of the holding table 10 along a planned division line 105 using the cutting blade 21, which is rotated by the spindle 22 around an axis parallel to the Y-axis direction, which is another horizontal direction and perpendicular to the X-axis direction. The cutting device 1 is provided so as to be movable in the Y-axis direction and the Z-axis direction relative to the holding table 10 by a Y-axis movement unit 32 and a Z-axis movement unit 33 of the movement unit 30, respectively. As shown in FIG. 1 , the cutting device 1 is equipped with two cutting units 20, i.e., a two-spindle dicer, a so-called facing dual-type cutting device.

[0032] The spindle housing 23 exposes the tip of the spindle 22 and accommodates the rest of the spindle 22, allowing the spindle 22 to pass through. The spindle housing 23 supports the spindle 22 rotatably around an axis parallel to the Y-axis direction. The blade cover 26 is attached to the tip of the spindle housing 23 and covers the upper, front, and rear of the cutting blade 21 attached to the tip of the spindle 22. The blade cover 26 has multiple water channels formed therein. One lower end of the multiple water channels is provided with a nozzle 27 for supplying cutting water, and the other upper end of the multiple water channels is connected to a cutting water supply source (not shown). The nozzle 27 supplies cutting water from the cutting water supply source through the water channels inside the blade cover 26 to the processing point. Here, the processing point refers to the area of ​​the substrate 100 being cut by the rotating cutting blade 21, i.e., the area where the rotating cutting blade 21 and the substrate 100 come into contact. In the first embodiment, the cutting water is, for example, pure water.

[0033] The cutting device 1 supplies cutting water through the nozzle 27 of the cutting unit 20, rotates the cutting blade 21 of the cutting unit 20, and uses the X-axis moving unit 31, Y-axis moving unit 32, and Z-axis moving unit 33 to cause the rotating cutting blade 21 to cut into the substrate 100 on the holding table 10 and move along the planned dividing line 105 relative to the substrate 100, thereby cutting the substrate 100 along the planned dividing line 105 with the rotating cutting blade 21.

[0034] The imaging unit 29 includes an imaging element that captures images of the division lines 105 of the substrate 100 held on the holding table 10 before cutting, and the cutting grooves formed on the substrate 100 after cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. In the first embodiment, the imaging unit 29 is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20.

[0035] The imaging unit 29 images the substrate 100 before cutting that is held on the holding table 10, obtains images for performing alignment to align the substrate 100 with the cutting blade 21, and outputs the obtained images to the control unit 40. The imaging unit 29 also images the substrate 100 after cutting that is held on the holding table 10, obtains images for performing a so-called kerf check to automatically check whether the cut groove is within the planned division line 105 and whether any large chips have occurred, and outputs the obtained images to the control unit 40.

[0036] The X-axis moving unit 31, the Y-axis moving unit 32, and the Z-axis moving unit 33 relatively move the holding table 10 and the cutting unit 20 in the X-axis direction (processing feed direction), the Y-axis direction (indexing feed direction), and the Z-axis direction (cutting feed direction), respectively. The X-axis moving unit 31, the Y-axis moving unit 32, and the Z-axis moving unit 33 are each configured with, for example, a well-known ball screw rotatable about the X-axis, Y-axis, and Z-axis axis, a well-known pulse motor that rotates the ball screw about the axis, and a well-known guide rail that supports the holding table 10 or the cutting unit 20 movably in the X-axis, Y-axis, or Z-axis direction.

[0037] The X-axis moving unit 31, the Y-axis moving unit 32, and the Z-axis moving unit 33 each include an encoder that reads the rotational position of the pulse motor, and detects the relative positions of the holding table 10 and the cutting unit 20 in the X-axis, Y-axis, and Z-axis directions based on the rotational position of the pulse motor read by the encoder, and outputs the detected relative positions to the control unit 40. Note that the X-axis moving unit 31, the Y-axis moving unit 32, and the Z-axis moving unit 33 are not limited to a configuration in which the relative position of the holding table 10 and the cutting unit 20 is detected by an encoder, but may each be configured with a linear scale parallel to the X-axis, Y-axis, and Z-axis directions, and a read head that is movable by the X-axis moving unit 31, the Y-axis moving unit 32, and the Z-axis moving unit 33 in the X-axis, Y-axis, and Z-axis directions, respectively, and that reads the graduations of the linear scale.

[0038] The control unit 40 controls the operation of various components of the cutting device 1 and causes the cutting device 1 to perform a cutting process on the substrate 100 using the cutting unit 20. In the first embodiment, the control unit 40 includes a computer system. The computer system included in the control unit 40 includes an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having memory such as a ROM (Read Only Memory) or RAM (Random Access Memory), and an input / output interface device. The arithmetic processing device of the control unit 40 performs arithmetic processing in accordance with a computer program stored in the storage device of the control unit 40, and outputs control signals for controlling each component provided in the cutting device 1 to each component provided in the cutting device 1 via the input / output interface device of the control unit 40.

[0039] Next, this specification will explain the operation process of the cutting device 1 according to embodiment 1 with reference to the drawings. After the holding surface 12 is attached to the upper surface 13 of the frame 11 of the holding table 10 and the substrate 100 is placed on the upper surface 14 of the holding surface 12 with the back surface 107 facing the holding surface 12, the control unit 40 of the cutting device 1 switches the suction valves 75 and 76 and the air supply valve 77 to introduce negative pressure from the air suction source 78 to the upper surface 14 of the holding surface 12 via the peripheral suction unit 51 and the central suction unit 52, respectively, to suck and hold the back surface 107 of the substrate 100, and also introduces air supplied from the air supply source 79 or atmospheric pressure to the upper surface 14 of the holding surface 12 via the seal unit 53. The control unit 40 of the cutting device 1 then introduces negative pressure at the peripheral suction section 51 and the central suction section 52, and also introduces air or atmospheric pressure at the sealing section 53, and while supplying cutting water through the nozzle 27, cuts the substrate 100 along the planned division line 105 with the rotating cutting blade 21.The air flow 65 formed by the air or atmospheric pressure introduced by the sealing section 53 pushes back cutting water 200 containing cutting chips generated by cutting the substrate 100 to the outer periphery of the substrate 100, preventing the cutting water 200 from entering the central area on the back surface 107 of the substrate 100.

[0040] In the cutting device 1 according to the first embodiment having the above-described configuration, the holding regions 17 corresponding to the regions of the substrate 100 to be cut on the upper surface 14 of the holding surface 12 of the holding table 10 each have a triple pressure structure including, from the periphery toward the center, an outer periphery suction section 51 that introduces negative pressure, a seal section 53 that creates positive pressure, and a central suction section 52 that introduces negative pressure. Therefore, the cutting device 1 according to the first embodiment has an air flow 65 formed by air introduced by the seal section 53 or atmospheric pressure, which flows from the second region from the periphery of the triple structure (seal section 53) toward the first region (outer periphery suction section 51). This pushes back the cutting water 200 containing cutting chips generated by cutting the substrate 100 from the periphery of the triple structure toward the outer side of the first region (outer periphery suction section 51), i.e., prevents the cutting water 200 from entering the third region from the periphery of the triple structure (central suction section 52). This effectively reduces adhesion of cutting chips to the back surface 107 of the substrate 100, particularly to the central region.

[0041] Furthermore, the cutting device 1 according to the first embodiment further includes a peripheral suction unit 51 and a central suction unit 52, each of which has a groove along the outer shape of the substrate 100 and air suction holes 61, 62 formed in the groove, or a plurality of air suction holes 61, 62 arranged along the outer shape of the substrate 100. Therefore, the cutting device 1 according to the first embodiment can maximize the width of the third region from the outer periphery of the triple-layered structure (the central suction unit 52) ​​to fit the outer shape of the substrate 100, thereby achieving the advantageous effect of reducing adhesion of cutting debris to the widest possible area on the back surface 107 side of the substrate 100. Furthermore, the cutting device 1 according to the first embodiment can reduce the risk of chipping or other cutting defects occurring when cutting along the planned division line 105 between the device region 103 and the outer periphery excess region 104, because the peripheral suction unit 51 appropriately suction-holds and fixes the outer periphery of the substrate 100 along the outer shape of the substrate 100. Furthermore, in the cutting device 1 of embodiment 1, the central suction section 52 appropriately suctions and holds the center of the substrate 100 over the widest possible range along the outer shape of the substrate 100, thereby preferably preventing the substrate 100 from warping into a concave shape on the back surface 107 side, thereby further reducing the risk of devices 106 etc. on the front surface 102 side of the substrate 100 interfering with the side of the cutting blade 21, the spindle 22, the spindle housing 23 etc. when cutting with the cutting blade 21, and further reducing the risk of the substrate 100 being deformed due to the positive pressure (air or atmospheric pressure) introduced by the sealing section 53.

[0042] Furthermore, in the cutting device 1 according to the first embodiment, the seal unit 53 further has an air supply groove 63 that follows the outer shape of the substrate 100 and one or more air supply holes 64 formed in the air supply groove 63, or multiple air supply holes 64 that are arranged along the outer shape of the substrate 100. Therefore, in the cutting device 1 according to the first embodiment, the seal unit 53 appropriately forms an air flow 65 along the outer shape of the substrate 100, thereby appropriately preventing the cutting water 200 containing cutting chips from entering the central region of the substrate 100 along the outer shape of the substrate 100.

[0043] [Embodiment 2] A cutting device 1-2 according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a perspective view showing an example of the configuration of the cutting device 1-2 according to the second embodiment. FIG. 7 is a top view showing a substrate 100-2 to be cut by the cutting device 1-2 of FIG. 6. FIG. 8 is a bottom view showing the substrate 100-2 to be cut by the cutting device 1-2 of FIG. 6. FIG. 9 is an enlarged plan view of a portion of the plan view of the holding surface 12-2 of the cutting device 1-2 of FIG. 6. FIG. 9 is an enlarged view of the area on the holding surface 12-2 where the device 106 at the upper left edge of the substrate 100-2 is held. In FIGS. 6 to 9, the same parts as those in the first embodiment are designated by the same reference numerals, and description thereof will be omitted.

[0044] As shown in FIG. 6, the cutting device 1-2 of the second embodiment is the same as the cutting device 1 of the first embodiment except that the cutting object to be cut by the cutting device 1-2 is changed to a substrate 100-2, and in accordance with the change in the cutting process of the substrate 100-2, the holding table 10 is changed to a holding table 10-2; otherwise, the configuration is the same as that of the cutting device 1.

[0045] 7 and 8, the substrate 100-2, which is the cutting target to be cut by the cutting device 1-2, is the substrate 100 of embodiment 1, except that the settings of the device region 103, the peripheral excess region 104, and the planned division lines 105, the arrangement of the devices 106, and the formation of the electrode layer 108 are changed, and a synthetic resin 109 is further provided. As shown in FIGS. 7 and 8, the substrate 100-2 has three device regions 103 on the back surface 107 side of the plate member 101, and also has a peripheral excess region 104 between adjacent device regions 103. In the substrate 100-2, devices 106 are arranged in each region defined by a plurality of planned division lines 105 in each device region 103 on the back surface 107 side of the plate member 101, and further, the substrate 100-2 is coated with synthetic resin 109 so as to fill the planned division lines 105 between the devices 106 and the peripheries of the device regions 103. In the substrate 100-2, an electrode layer 108 is formed in each area on the front surface 102 of the plate member 101 corresponding to each area where the device 106 is disposed. The electrode layer 108 may be a wiring layer.

[0046] The substrate 100-2 has unevenness formed by the synthetic resin 109 that coats the rear surface 107. Furthermore, due to differences in thermal shrinkage rates among the plate member 101, the device 106, the electrode layer 108, and the synthetic resin 109, the substrate 100-2 is curved in a direction that is convex toward the front surface 102 of the plate member 101 on which the electrode layer 108 is formed and concave toward the rear surface 107 of the plate member 101 on which the device 106 is disposed and on which the synthetic resin 109 is coated, when viewed from the side, and thus has warpage.

[0047] The cutting device 1-2 according to the second embodiment cuts the substrate 100-2 along all of the division lines 105 to divide, that is, separate, the substrate 100-2 into a plurality of devices 106.

[0048] The holding table 10-2 of the second embodiment is the same as the holding table 10 of the first embodiment, except that the cutting target is changed from the substrate 100 to a substrate 100-2, and the cutting process is changed from dividing into four 1 / 4-size substrates 110 to singulating into individual devices 106, so that the frame 11 is changed to a frame 11-2 and the holding surface 12 is changed to a holding surface 12-2. The holding table 10-2 of the second embodiment holds the back surface 107 side of the substrate 100-2.

[0049] 9, the holding surface 12-2 of the second embodiment is obtained by changing the position of the clearance groove 18 in the holding surface 12 of the first embodiment due to the change in the cutting target and cutting process as described above, thereby changing the position, shape, and size of the holding area 17. Note that the holding areas 17 of the second embodiment are formed corresponding to the respective areas of each device 106 to be singulated, and each includes a peripheral suction portion 51, a central suction portion 52, and a sealing portion 53, similar to the first embodiment.

[0050] Furthermore, like the frame body 11 of embodiment 1, the frame body 11-2 of embodiment 2 has an outer suction passage 71 and a central suction passage 72 formed therein that connect the outer suction section 51 and the central suction section 52 to the air suction source 78, respectively, and an air supply passage 73 formed therein that connects the seal section 53 to the air supply source 79 or that opens the seal section 53 to the atmosphere.

[0051] The cutting device 1-2 of embodiment 2 having the above-described configuration is the same as embodiment 1 in that the holding table 10 is changed to holding table 10-2 due to changes in the cutting object and cutting process, and since the multiple holding areas 17 corresponding to each area of ​​each device 106 to be singulated have the same triple structure as embodiment 1, it has the same effect as embodiment 1.

[0052] The present invention is not limited to the above-described embodiment, and can be implemented in various modifications without departing from the gist of the present invention. [Explanation of symbols]

[0053] 1,1-2 Cutting equipment 10,10-2 Holding table 11,11-2 Frame 12,12-2 Holding surface 17 Holding area 18 Relief groove 20 Cutting unit 21 Cutting blade 51 Peripheral suction section 52 Central suction section 53 Seal part 61,62 Air suction holes 63 Air supply groove 64 Air supply hole 78 Air suction source 79 Air supply source 100,100-2 board 105 Planned division line

Claims

1. A cutting device that cuts a substrate held on a holding table along a planned division line with a cutting blade while supplying cutting water to a processing point, The holding table is a holding surface that holds the substrate and includes a plurality of holding areas that hold the cut substrate and a clearance groove into which the cutting blade enters; The plurality of retention regions include a periphery suction unit that suction-holds the periphery of the substrate to be cut out; a center suction unit that suctions and holds the center of the substrate to be cut out; a seal portion formed between the peripheral suction portion and the central suction portion, one end of which opens onto the holding surface and the other end of which communicates with the atmosphere or an air supply source, for preventing the cutting water from entering the center of the substrate; A cutting device comprising:

2. The cutting device according to claim 1, characterized in that the peripheral suction section and the central suction section each have a groove that follows the outer shape of the substrate and one or more holes formed in the groove and communicating with an air suction source, or a plurality of holes that are arranged along the outer shape of the substrate and communicating with an air suction source.

3. The cutting device according to claim 1, characterized in that the sealing portion has a groove that follows the outer shape of the substrate and one or more holes formed in the groove that communicate with the atmosphere or the air supply source, or a plurality of holes that are arranged along the outer shape of the substrate and communicate with the atmosphere or the air supply source.

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