Substrate cleaning apparatus and substrate cleaning method

Abstract

To provide a substrate cleaning apparatus and a substrate cleaning method capable of reducing the amount of cleaning liquid required for cleaning the upper and lower surfaces of a substrate.SOLUTION: A substrate cleaning apparatus includes upper holding devices 10A and 10B. The upper holding devices 10A and 10B hold a substrate W in a horizontal posture while contacting the outer peripheral edge of the substrate W without rotating it. A lower surface brush 51 wetted with a cleaning liquid is pressed against the central region of the lower surface of the substrate W held by the upper holding devices 10A and 10B. In this state, the lower surface brush 51 rotates or moves relative to the central area of the lower surface of the substrate W. Therefore, the central area of the lower surface of the substrate W is cleaned.SELECTED DRAWING: Figure 17

Description

[Technical field]

[0001] The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning the upper and lower surfaces of a substrate. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on various substrates such as FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, solar cell substrates, etc. Substrate cleaning apparatuses are used to clean substrates.

[0003] For example, a cleaning apparatus (substrate cleaning apparatus) described in Patent Document 1 includes a front surface scrubber, a back surface scrubber, and a front / back surface inversion unit. The front / back surface inversion unit switches a substrate having a front surface and a back surface between a state in which the front surface (device surface) faces upward and a state in which the front surface faces downward.

[0004] The front surface scrubber receives a substrate with its front surface facing upward by a front / back surface inversion unit. In the front surface scrubber, the substrate is rotated in a horizontal position, and a rinse liquid (cleaning liquid) is supplied to the front surface of the substrate facing upward, and a cleaning brush is pressed against the front surface. This cleans the front surface of the substrate.

[0005] Meanwhile, the back surface scrubber receives a substrate whose back surface is facing upward by the front / back surface inversion unit. In the back surface scrubber, the substrate is rotated in a horizontal position, and a rinse liquid (cleaning liquid) is supplied to the back surface of the substrate facing upward, and a cleaning brush is pressed against the back surface. This cleans the back surface of the substrate. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2003-229398 A Summary of the Invention [Problem to be solved by the invention]

[0007] As described above, when cleaning is performed while supplying a cleaning liquid to one of the front and back surfaces of a rotating substrate, the cleaning liquid flowing on the one surface may flow from the outer peripheral edge of the substrate to the other surface of the substrate. In this case, the peripheral portion of the other surface of the substrate may be contaminated. Therefore, when cleaning is performed while supplying a cleaning liquid to one surface of a rotating substrate, the cleaning liquid is usually supplied to the other surface of the substrate (so-called back rinse) to prevent the cleaning liquid from flowing from one surface of the substrate to the other surface of the substrate.

[0008] However, when back rinsing is performed when cleaning one side and the other side of a substrate, a large amount of cleaning liquid is required to clean one substrate. In this case, depending on the type of cleaning liquid used, the cost required for the cleaning process increases. In addition, a large amount of waste liquid needs to be disposed of.

[0009] An object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method capable of reducing the amount of cleaning liquid required to clean the upper and lower surfaces of a substrate. [Means for solving the problem]

[0010] (1) A substrate cleaning apparatus according to a first aspect of the present invention is a substrate cleaning apparatus which cleans the upper and lower surfaces of a substrate using cleaning liquid, and which comprises: a first substrate holding part which holds the substrate in a horizontal position without rotating it by abutting against multiple portions of the outer peripheral edge of the substrate; a cleaning brush configured to be able to contact the underside of the substrate; a brush drive part which presses the cleaning brush against the underside of the substrate held by the first substrate holding part and is configured to move the cleaning brush relatively to the substrate held by the first substrate holding part; and a control part, wherein the control part controls the first substrate holding part and the brush drive part so that the cleaning brush, wetted with cleaning liquid, moves over the central region of the underside of the substrate while being pressed against the central region of the underside of the substrate while no cleaning liquid is supplied to the substrate.

[0011] In the substrate cleaning apparatus, the central region of the lower surface of the substrate held by the first substrate holder is cleaned by the cleaning brush wetted with the cleaning liquid without the cleaning liquid being supplied to the substrate. At this time, the substrate is not rotating. Therefore, while the central region of the lower surface of the substrate is being cleaned, the cleaning liquid hardly reaches the outer peripheral edge of the substrate. In other words, the cleaning liquid does not flow from the lower surface of the substrate to the upper surface of the substrate. Therefore, it is not necessary to supply the cleaning liquid to the upper surface of the substrate in order to protect the peripheral portion of the upper surface of the substrate. As a result, it is possible to reduce the amount of cleaning liquid required to clean the upper and lower surfaces of the substrate.

[0012] (2) The substrate cleaning apparatus further includes a first underside liquid supply unit that supplies cleaning liquid to a central region of the underside of the substrate held by the first substrate holding unit, and the control unit may control the brush drive unit and the first underside liquid supply unit so that cleaning liquid is supplied to the central region of the underside of the substrate held by the first substrate holding unit while the cleaning brush is positioned below the central region of the underside of the substrate before the cleaning brush is pressed against the central region of the underside of the substrate.

[0013] In this case, the cleaning liquid is supplied to the central region of the lower surface of the substrate before the cleaning brush is pressed against the central region of the lower surface of the substrate. Also, at this time, the cleaning brush is positioned below the central region of the lower surface of the substrate. Therefore, the cleaning liquid supplied to the central region of the lower surface of the substrate falls from the underside of the substrate onto the cleaning brush. This causes the cleaning brush and the central region of the lower surface of the substrate to become wet. As a result, the central region of the lower surface of the substrate is smoothly cleaned by the cleaning brush.

[0014] (3) The substrate cleaning apparatus further includes a second substrate holding unit that holds the substrate in a horizontal position by adsorbing a central region of the underside of the substrate while rotating it about an axis extending in the vertical direction, an upper surface liquid supply unit that supplies cleaning liquid to the upper surface of the substrate held by the second substrate holding unit, and a second lower surface liquid supply unit that supplies cleaning liquid to an outer underside region surrounding the central region of the underside of the substrate held by the second substrate holding unit, wherein the brush driving unit is configured to further press a cleaning brush against the outer underside region of the substrate held by the second substrate holding unit, and the control unit may control the second substrate holding unit, upper surface liquid supply unit, second lower surface liquid supply unit and brush driving unit so that cleaning liquid is supplied to the upper surface of the substrate rotated by the second substrate holding unit and cleaning liquid is supplied to the outer underside region of the substrate while the cleaning brush is pressed against the outer underside region of the substrate.

[0015] In this case, the upper surface of the rotating substrate is cleaned while the lower surface outer region of the substrate is cleaned. At this time, the cleaning liquid supplied to the lower surface outer region of the substrate functions as a back rinse to prevent the cleaning liquid supplied to the upper surface of the substrate from flowing around to the lower surface of the substrate, together with the cleaning liquid for cleaning the lower surface outer region of the substrate. Therefore, it is not necessary to separately supply the cleaning liquid for cleaning the lower surface outer region of the substrate and the back rinse to prevent the cleaning liquid supplied to the upper surface of the substrate from flowing around to the lower surface of the substrate. As a result, the consumption of the cleaning liquid can be reduced.

[0016] (4) The cleaning brush is an underside brush used to clean the underside of a substrate, and may include a base portion having a flat surface facing upward, and a first cleaning portion provided on the flat surface of the base portion so as to protrude upward from the flat surface of the base portion and follow the outer edge of the base portion.

[0017] In this case, before cleaning the central region of the underside of the substrate, cleaning liquid can be stored in the region inside the first cleaning part of the lower surface brush, so that the central region of the underside of the substrate can be smoothly cleaned by the cleaning liquid stored inside the first cleaning part of the lower surface brush even in a state in which cleaning liquid is not supplied to the underside of the substrate.

[0018] (5) The underside brush may further include a second cleaning portion provided on the flat surface of the base portion so as to protrude upward from the flat surface of the base portion and extend in one direction through the geometric center of the base portion in a planar view.

[0019] In this case, the contact area of ​​the lower surface brush with the substrate is increased compared to a configuration in which only the first cleaning part is formed on the base part, thereby achieving a higher cleaning power for the lower surface of the substrate.

[0020] (6) A substrate cleaning method according to a second aspect of the present invention is a substrate cleaning method for cleaning an upper and lower surface of a substrate using a cleaning liquid, the method comprising the steps of: holding the substrate in a horizontal position without rotating it using a first substrate holding part that abuts multiple portions of an outer peripheral edge of the substrate; and pressing a cleaning brush configured to be able to contact the underside of the substrate against the underside of the substrate held by the first substrate holding part and moving the cleaning brush relatively to the substrate held by the first substrate holding part, wherein the step of pressing the cleaning brush against the underside of the substrate and moving it relative to the substrate includes moving the cleaning brush wetted with cleaning liquid over a central region of the underside of the substrate while pressing the cleaning brush against the central region of the underside of the substrate while no cleaning liquid is supplied to the substrate.

[0021] In the substrate cleaning method, the central region of the lower surface of the substrate held by the first substrate holder is cleaned by a cleaning brush wetted with cleaning liquid without supplying cleaning liquid to the substrate. At this time, the substrate is not rotating. Therefore, while the central region of the lower surface of the substrate is being cleaned, the cleaning liquid hardly reaches the outer peripheral edge of the substrate. In other words, the cleaning liquid does not flow from the lower surface of the substrate to the upper surface of the substrate. Therefore, it is not necessary to supply cleaning liquid to the upper surface of the substrate in order to protect the peripheral portion of the upper surface of the substrate. As a result, it is possible to reduce the amount of cleaning liquid required to clean the upper and lower surfaces of the substrate.

[0022] (7) The substrate cleaning method may further include a step of supplying a cleaning liquid to the central region of the underside of the substrate while the cleaning brush is positioned below the central region of the underside of the substrate held by the first substrate holding part before the cleaning brush is pressed against the central region of the underside of the substrate.

[0023] In this case, the cleaning liquid is supplied to the central region of the lower surface of the substrate before the cleaning brush is pressed against the central region of the lower surface of the substrate. Also, at this time, the cleaning brush is positioned below the central region of the lower surface of the substrate. Therefore, the cleaning liquid supplied to the central region of the lower surface of the substrate falls from the underside of the substrate onto the cleaning brush. This causes the cleaning brush and the central region of the lower surface of the substrate to become wet. As a result, the central region of the lower surface of the substrate is smoothly cleaned by the cleaning brush.

[0024] (8) A substrate cleaning method further includes the steps of rotating the substrate about an axis extending in the vertical direction while holding the substrate in a horizontal position using a second substrate holding part that adsorbs a central region of the underside of the substrate, supplying a cleaning liquid to an upper surface of the substrate held and rotated by the second substrate holding part, and, with the cleaning liquid supplied to the upper surface of the substrate, supplying the cleaning liquid to an outer underside region surrounding the central region of the underside of the substrate held and rotated by the second substrate holding part. IncludingThe step of pressing the cleaning brush against the underside of the substrate and moving it relative to the substrate may include pressing the cleaning brush against the underside of the substrate and moving it over the underside of the substrate while cleaning liquid is supplied to the upper surface of the substrate rotated by the second substrate holding part and cleaning liquid is supplied to the underside of the substrate.

[0025] In this case, the upper surface of the rotating substrate is cleaned while the lower surface outer region of the substrate is cleaned. At this time, the cleaning liquid supplied to the lower surface outer region of the substrate functions as a back rinse to prevent the cleaning liquid supplied to the upper surface of the substrate from flowing around to the lower surface of the substrate, together with the cleaning liquid for cleaning the lower surface outer region of the substrate. Therefore, it is not necessary to separately supply the cleaning liquid for cleaning the lower surface outer region of the substrate and the back rinse to prevent the cleaning liquid supplied to the upper surface of the substrate from flowing around to the lower surface of the substrate. As a result, the consumption of the cleaning liquid can be reduced.

[0026] (9) The cleaning brush is an underside brush used to clean the underside of a substrate, and may include a base portion having a flat surface facing upward, and a first cleaning portion provided on the flat surface of the base portion so as to protrude upward from the flat surface of the base portion and follow the outer edge of the base portion.

[0027] In this case, before cleaning the central area of ​​the lower surface of the substrate, the cleaning liquid can be stored in the area inside the first cleaning part of the lower surface brush. This allows the cleaning liquid to be stored in the area inside the first cleaning part of the lower surface brush before the cleaning liquid is supplied to the lower surface of the substrate. Even The central area of ​​the lower surface of the substrate is smoothly cleaned by the cleaning liquid stored inside the first cleaning portion of the lower surface brush.

[0028] (10) The underside brush may further include a second cleaning portion provided on the flat surface of the base portion so as to protrude upward from the flat surface of the base portion and extend in one direction through the geometric center of the base portion in a planar view.

[0029] In this case, the contact area of ​​the lower surface brush with the substrate is increased compared to a configuration in which only the first cleaning part is formed on the base part, thereby achieving a higher cleaning power for the lower surface of the substrate. Effect of the Invention

[0030] According to the present invention, it is possible to reduce the amount of cleaning liquid required to clean the upper and lower surfaces of a substrate. [Brief description of the drawings]

[0031] [Figure 1] 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention; [Diagram 2] 2 is an external perspective view showing an internal configuration of the substrate cleaning apparatus of FIG. 1. [Diagram 3] 2 is a block diagram showing the configuration of a control system of the substrate cleaning apparatus of FIG. 1. [Figure 4] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Diagram 5] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 6] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 7] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 8] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 9] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 10] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 11] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 12] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 13] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 14]2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 15] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 16] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 17] FIG. 17 is a diagram for explaining main effects of the present invention obtained by a series of operations of the substrate cleaning apparatus shown in FIGS. [Figure 18] FIG. 2 is an external perspective view showing a preferred configuration example of a brush unit. [Figure 19] FIG. 19 is an external perspective view of the lower brush of FIG. 18. [Figure 20] FIG. 19 is a plan view of the lower brush of FIG. 18. [Figure 21] FIG. 19 is a vertical cross-sectional view of the brush unit of FIG. 18. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] Hereinafter, a substrate cleaning apparatus and a substrate cleaning method according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate, a substrate for FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. The substrate used in this embodiment has at least a partially circular outer periphery. For example, the outer periphery excluding a positioning notch has a circular shape.

[0033] 1. Structure of the substrate cleaning equipment Fig. 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention. Fig. 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1 of Fig. 1. In the substrate cleaning apparatus 1 according to this embodiment, mutually orthogonal X-, Y-, and Z-directions are defined to clarify the positional relationship. In Fig. 1 and certain figures following Fig. 2, the X-, Y-, and Z-directions are appropriately indicated by arrows. The X- and Y-directions are mutually orthogonal in a horizontal plane, and the Z-direction corresponds to the vertical direction.

[0034] 1, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a pedestal device 30, a delivery device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an edge cleaning device 80, and an opening / closing device 90. These components are provided in a unit housing 2. In FIG. 2, the unit housing 2 is indicated by a dotted line.

[0035] The unit housing 2 has a rectangular bottom surface portion 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom surface portion 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall portion 2b. This opening is an entrance / exit 2x for the substrate W, and is used when the substrate W is carried into and carried out of the unit housing 2. In FIG. 2, the entrance / exit 2x is indicated by a thick dotted line. In the following description, the direction from inside the unit housing 2 through the entrance / exit 2x toward the outside of the unit housing 2 (the direction from the side wall portion 2c to the side wall portion 2b) in the Y direction is referred to as the front, and the opposite direction (the direction from the side wall portion 2b to the side wall portion 2c) is referred to as the rear.

[0036] An opening / closing device 90 is provided in a portion of the side wall 2b where the loading / unloading opening 2x is formed and in an area in the vicinity thereof. The opening / closing device 90 includes a shutter 91 configured to be able to open and close the loading / unloading opening 2x, and a shutter driver 92 that drives the shutter 91. In FIG. 2, the shutter 91 is indicated by a thick two-dot chain line. The shutter driver 92 drives the shutter 91 to open the loading / unloading opening 2x when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1. The shutter driver 92 also drives the shutter 91 to close the loading / unloading opening 2x when the substrate W is cleaned in the substrate cleaning apparatus 1.

[0037] A pedestal device 30 is provided in the center of the bottom surface portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails and is provided so as to extend in the Y direction from the vicinity of the side wall portion 2b to the vicinity of the side wall portion 2c in a plan view. The movable pedestal 32 is provided so as to be movable in the Y direction on the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction on the linear guide 31.

[0038] The lower holding device 20 and the lower surface cleaning device 50 are provided on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 includes an adsorption holding part 21, an adsorption holding drive part 22, and two back rinse nozzles 29. The adsorption holding part 21 is a so-called spin chuck, and has a circular adsorption surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to be rotatable around an axis (axis in the Z direction) extending in the vertical direction. In the following description, when the substrate W is adsorbed and held by the adsorption holding part 21, the region of the lower surface of the substrate W to be adsorbed by the adsorption surface of the adsorption holding part 21 is referred to as a lower surface central region. On the other hand, the region of the lower surface of the substrate W surrounding the lower surface central region is referred to as a lower surface outer region.

[0039] The suction hold driving unit 22 includes a motor. The motor of the suction hold driving unit 22 is provided on the movable base 32 so that the rotation shaft protrudes upward. The suction hold unit 21 is attached to the upper end of the rotation shaft of the suction hold driving unit 22. A suction path is formed in the rotation shaft of the suction hold driving unit 22 for suctioning and holding the substrate W in the suction hold unit 21. The suction path is connected to a suction device (not shown). The suction hold driving unit 22 rotates the suction hold unit 21 around the rotation shaft.

[0040] As shown in FIG. 1, the two back rinse nozzles 29 are disposed near the suction holding drive unit 22 so as to sandwich the suction holding unit 21 in the X direction in a plan view. A back rinse liquid supply unit 28 (FIG. 3) is connected to each back rinse nozzle 29. The back rinse liquid supply unit 28 supplies a cleaning liquid to the back rinse nozzle 29. As will be described later, when the upper surface, the outer peripheral edge, and the lower surface outer region of the substrate W are simultaneously cleaned in the substrate cleaning apparatus 1, the back rinse nozzle 29 discharges the cleaning liquid supplied from the back rinse liquid supply unit 28 toward the lower surface outer region of the substrate W. In this embodiment, pure water (DIW: De-Ionized Water) is used as the cleaning liquid supplied to the back rinse liquid supply unit 28.

[0041] A delivery device 40 is further provided on the movable base 32 near the lower holding device 20. The delivery device 40 includes a plurality of support pins 41 (three in this example), a pin connecting member 42, and a pin lifting and lowering drive unit 43. The pin connecting member 42 is formed so as to surround the suction holding unit 21 in a plan view, and connects the plurality of support pins 41. The plurality of support pins 41 extend upward a certain length from the pin connecting member 42 while being connected to one another by the pin connecting member 42. The pin lifting and lowering drive unit 43 raises and lowers the pin connecting member 42 above the movable base 32. As a result, the plurality of support pins 41 rise and lower relative to the suction holding unit 21.

[0042] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection unit 53, a lifting support unit 54, a moving support unit 55, a lower surface brush rotation drive unit 55a, a lower surface brush lifting drive unit 55b, and a lower surface brush moving drive unit 55c. The moving support unit 55 is provided so as to be movable in the Y direction relative to the lower holding device 20 within a certain area on the movable base 32. As shown in Fig. 2, the lifting support unit 54 is provided on the moving support unit 55 so as to be liftable. The lifting support unit 54 has an upper surface 54u that is inclined obliquely downward in a direction away from the suction holding unit 21 (rearward in this example).

[0043] 1, the lower brush 51 has a circular outer shape in a plan view, and is formed to be relatively large in this embodiment. Specifically, the diameter of the lower brush 51 is larger than the diameter of the adsorption surface of the adsorption holding unit 21, for example, 1.3 times the diameter of the adsorption surface of the adsorption holding unit 21. The diameter of the lower brush 51 is also larger than 1 / 3 and smaller than 1 / 2 the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0044] The lower surface brush 51 is formed of a relatively soft resin material such as PVA (polyvinyl alcohol) or PTFE (polytetrafluoroethylene). The lower surface brush 51 has a cleaning surface capable of contacting the lower surface of the substrate W. The lower surface brush 51 is provided on the upper surface 54u of the lifting support part 54 so that the cleaning surface faces upward and is rotatable around an axis that passes through the center of the cleaning surface and extends in the vertical direction.

[0045] Each of the two liquid nozzles 52 is attached to the upper surface 54u of the lift support part 54 so as to be located near the lower surface brush 51 and so as to have a liquid discharge port facing above the lower surface brush 51. A lower surface cleaning liquid supply part 56 (FIG. 3) is connected to the liquid nozzle 52. The lower surface cleaning liquid supply part 56 supplies cleaning liquid to the liquid nozzle 52. As will be described later, the liquid nozzle 52 discharges the cleaning liquid supplied from the lower surface cleaning liquid supply part 56 onto the lower surface central region of the substrate W immediately before the lower surface central region of the substrate W is cleaned in the substrate cleaning apparatus 1. On the other hand, the liquid nozzle 52 does not discharge the cleaning liquid onto the lower surface central region of the substrate W while the lower surface central region of the substrate W is being cleaned in the substrate cleaning apparatus 1. In this embodiment, pure water (DIW) is used as the cleaning liquid supplied to the liquid nozzle 52.

[0046] The gas ejection part 53 is a slit-shaped gas ejection nozzle having a gas ejection port extending in one direction. The gas ejection part 53 is attached to the upper surface 54u of the lift support part 54 so that it is located between the lower surface brush 51 and the suction holding part 21 in a plan view and the gas ejection port faces upward. A gas ejection supply part 57 (FIG. 3) is connected to the gas ejection part 53. The gas ejection supply part 57 supplies gas to the gas ejection part 53. In this embodiment, an inert gas such as nitrogen gas is used as the gas supplied to the gas ejection part 53. The gas ejection part 53 ejects the gas supplied from the gas ejection supply part 57 onto the lower surface of the substrate W when the substrate W is cleaned by the lower surface brush 51 and when the lower surface of the substrate W is dried, which will be described later. In this case, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding part 21.

[0047] The lower surface brush rotation drive unit 55a includes a motor and rotates the lower surface brush 51 when the lower surface brush 51 cleans the substrate W. The lower surface brush lift drive unit 55b includes a stepping motor or an air cylinder and lifts and lowers the lift support unit 54 relative to the moving support unit 55. The lower surface brush movement drive unit 55c includes a motor and moves the moving support unit 55 in the Y direction on the movable base 32. Here, the position of the lower holding device 20 on the movable base 32 is fixed. Therefore, when the moving support unit 55 is moved in the Y direction by the lower surface brush movement drive unit 55c, the moving support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 when it is closest to the lower holding device 20 on the movable base 32 is called the approach position, and the position of the lower surface cleaning device 50 when it is farthest from the lower holding device 20 on the movable base 32 is called the separation position.

[0048] A cup device 60 is further provided in the center of the bottom surface portion 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the base device 30 in a plan view and is movable up and down. In FIG. 2, the cup 61 is indicated by a dotted line. The cup drive unit 62 moves the cup 61 between a lower cup position and an upper cup position depending on which part of the lower surface of the substrate W is to be cleaned by the lower surface brush 51. The lower cup position is a height position where the upper end of the cup 61 is below the substrate W adsorbed and held by the adsorption holding unit 21. The upper cup position is a height position where the upper end of the cup 61 is above the adsorption holding unit 21.

[0049] A pair of upper holding devices 10A, 10B are provided at a height position above cup 61 so as to face each other across base device 30 in a plan view. Upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck driving unit 13A, and an upper chuck driving unit 14A. Upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck driving unit 13B, and an upper chuck driving unit 14B.

[0050] The lower chucks 11A, 11B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding part 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A, 11B has two support pieces capable of supporting the peripheral portion of the lower surface of the substrate W from below the substrate W. The lower chuck driving parts 13A, 13B move the lower chucks 11A, 11B so that the lower chucks 11A, 11B approach each other or so that the lower chucks 11A, 11B move away from each other.

[0051] The upper chucks 12A, 12B, like the lower chucks 11A, 11B, are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) passing through the center of the suction holding unit 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A, 12B has two holding pieces configured to be able to hold the outer circumferential end of the substrate W by abutting against two portions of the outer circumferential end of the substrate W. The upper chuck driving units 14A, 14B move the upper chucks 12A, 12B so that the upper chucks 12A, 12B approach each other or move the upper chucks 12A, 12B away from each other.

[0052] 1, an upper surface cleaning device 70 is provided on one side of the cup 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0053] The rotating support shaft 71 is supported on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable by an upper surface cleaning drive unit 74. As shown in Fig. 2, the arm 72 is provided at a position above the upper holding device 10B and extends horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is attached to the tip of the arm 72.

[0054] An upper surface cleaning fluid supply unit 75 (FIG. 3) is connected to the spray nozzle 73. The upper surface cleaning fluid supply unit 75 supplies a cleaning liquid and a gas to the spray nozzle 73. In this embodiment, deionized water (DIW) is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and the gas supplied from the upper surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0055] The upper surface cleaning drive unit 74 includes one or more pulse motors, an air cylinder, etc., and raises and lowers the rotary support shaft 71 and rotates the rotary support shaft 71. According to the above configuration, by moving the spray nozzle 73 in an arc above the upper surface of the substrate W that is attracted and held by the suction holding unit 21 and rotated, it is possible to clean the entire upper surface of the substrate W.

[0056] 1, an edge cleaning device 80 is provided on the other side of the cup 61 so as to be located near the upper holding device 10A in a plan view. The edge cleaning device 80 includes a rotating support shaft 81, an arm 82, a bevel brush 83, and a bevel brush driving unit 84.

[0057] The rotating support shaft 81 is supported by a bevel brush driving unit 84 on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable. As shown in Fig. 2, the arm 82 is provided at a position above the upper holding device 10A and extends horizontally from the upper end of the rotating support shaft 81. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and to be rotatable around a vertical axis.

[0058] The upper half of the bevel brush 83 has an inverted truncated cone shape, and the lower half has a truncated cone shape. With this bevel brush 83, the outer periphery edge of the substrate W can be cleaned by the central portion in the up-down direction of the outer periphery surface.

[0059] The bevel brush driving unit 84 includes one or more pulse motors and air cylinders, and raises and lowers the rotary support shaft 81 and rotates the rotary support shaft 81. According to the above configuration, by bringing the central portion of the outer circumferential surface of the bevel brush 83 into contact with the outer circumferential edge of the substrate W that is attracted and held by the attracting and holding unit 21 and rotated, the entire outer circumferential edge of the substrate W can be cleaned.

[0060] Here, the bevel brush driving unit 84 further includes a motor built into the arm 82. The motor rotates the bevel brush 83 provided at the tip of the arm 82 about an axis in the vertical direction. Therefore, when cleaning the outer circumferential edge of the substrate W, the cleaning power of the bevel brush 83 at the outer circumferential edge of the substrate W is improved by the rotation of the bevel brush 83.

[0061] Fig. 3 is a block diagram showing the configuration of a control system of substrate cleaning apparatus 1 of Fig. 1. Control unit 9 of Fig. 3 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and a storage device. The RAM is used as a working area for the CPU. The ROM stores system programs. The storage device stores control programs. The CPU executes the substrate cleaning program stored in the storage device on the RAM to control the operation of each part of substrate cleaning apparatus 1.

[0062] 3, the control unit 9 mainly controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B in order to receive the substrate W carried into the substrate cleaning apparatus 1 and hold it at a position above the suction holding unit 21. The control unit 9 also mainly controls the suction holding driving unit 22 in order to suction and hold the substrate W by the suction holding unit 21 and to rotate the suction-held substrate W. Furthermore, the control unit 9 mainly controls the back-rinse liquid supply unit 28 in order to prevent the cleaning liquid from flowing from the upper surface to the lower surface and to clean the outer region of the lower surface of the substrate W when cleaning the upper surface of the substrate W.

[0063] The control unit 9 also mainly controls the pedestal drive unit 33 to move the movable pedestal 32 relative to the substrate W held by the upper holding devices 10A, 10B. The control unit 9 also controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A, 10B and the height position of the substrate W held by the suction holder 21.

[0064] Furthermore, the control unit 9 controls a lower surface brush rotation drive unit 55a, a lower surface brush lift drive unit 55b, a lower surface brush movement drive unit 55c, a lower surface cleaning liquid supply unit 56, and a jet gas supply unit 57 in order to clean the lower surface of the substrate W. Furthermore, the control unit 9 controls a cup drive unit 62 in order to use a cup 61 to receive the cleaning liquid splashed from the substrate W when the substrate W adsorbed and held by the suction holding unit 21 is cleaned.

[0065] The control unit 9 also controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W adsorbed and held by the suction holding unit 21. The control unit 9 also controls the bevel brush drive unit 84 to clean the outer circumferential edge of the substrate W adsorbed and held by the suction holding unit 21. Furthermore, the control unit 9 controls the shutter drive unit 92 to open and close the load / unload opening 2x of the unit housing 2 when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1.

[0066] 2. Outline of Operation of Substrate Cleaning Apparatus 1 4 to 16 are schematic diagrams for explaining the general operation of the substrate cleaning apparatus 1 of FIG. 1. In each of FIGS. 4 to 16, a plan view of the substrate cleaning apparatus 1 is shown in the upper part. A side view of the lower holding device 20 and its periphery as viewed along the Y direction is shown in the middle part, and a side view of the lower holding device 20 and its periphery as viewed along the X direction is shown in the lower part. The side view in the middle part corresponds to the side view along the line AA in FIG. 1, and the side view in the lower part corresponds to the side view along the line BB in FIG. 1. In addition, in order to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, the enlargement and reduction ratios of some components are different between the plan view in the upper part and the side views in the middle and lower parts. In addition, in FIGS. 4 to 16, the cup 61 is indicated by a two-dot chain line, and the outer shape of the substrate W is indicated by a thick dashed line.

[0067] In an initial state before the substrate W is loaded into the substrate cleaning apparatus 1, the shutter 91 of the opening / closing device 90 closes the loading / unloading port 2x. As shown in FIG. 1, the lower chucks 11A and 11B are maintained in a state in which the distance between them is sufficiently larger than the diameter of the substrate W. The upper chucks 12A and 12B are also maintained in a state in which the distance between them is sufficiently larger than the diameter of the substrate W. The movable base 32 of the base device 30 is disposed so that the center of the suction holding part 21 is located at the center of the cup 61 in a plan view. The lower surface cleaning device 50 is disposed at a close position on the movable base 32. The lifting support part 54 of the lower surface cleaning device 50 is disposed so that the cleaning surface (upper end) of the lower surface brush 51 is located below the suction holding part 21.

[0068] In addition, in the delivery device 40, the multiple support pins 41 are located below the suction holding unit 21. Furthermore, in the cup device 60, the cup 61 is in the lower cup position. In the following description, the center position of the cup 61 in a plan view is referred to as the planar reference position rp. Furthermore, the position of the movable base 32 on the bottom surface portion 2a when the center of the suction holding unit 21 is at the planar reference position rp in a plan view is referred to as the first horizontal position.

[0069] The substrate W is loaded into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading / unloading opening 2x immediately before the substrate W is loaded. Thereafter, as indicated by the thick solid arrow a1 in Fig. 4, a hand (substrate holding part) RH of a substrate transport robot (not shown) loads the substrate W into a substantially central position in the unit housing 2 through the loading / unloading opening 2x. At this time, the substrate W held by the hand RH is positioned between the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B as shown in Fig. 4.

[0070] Next, as indicated by thick solid arrow a2 in Fig. 5, the lower chucks 11A, 11B approach each other so that the multiple support pieces of the lower chucks 11A, 11B are positioned below the peripheral portion of the lower surface of the substrate W. In this state, the hand RH descends and exits from the loading / unloading opening 2x. As a result, multiple portions of the peripheral portion of the lower surface of the substrate W held by the hand RH are supported by the multiple support pieces of the lower chucks 11A, 11B. After the hand RH exits, the shutter 91 closes the loading / unloading opening 2x.

[0071] Next, as shown by a thick solid arrow a3 in FIG. 6, the upper chucks 12A and 12B approach each other so that the holding pieces of the upper chucks 12A and 12B come into contact with the outer peripheral end of the substrate W. The holding pieces of the upper chucks 12A and 12B come into contact with the outer peripheral end of the substrate W, so that the substrate W supported by the lower chucks 11A and 11B is further held by the upper chucks 12A and 12B. Also, as shown by a thick solid arrow a4 in FIG. 6, the suction holding unit 21 is shifted a predetermined distance from the planar reference position rp and the movable base 32 moves forward from the first horizontal position so that the center of the lower brush 51 is located at the planar reference position rp. As a result, the cleaning surface of the lower brush 51 faces the lower central region of the substrate W at a position below the substrate W held by the upper chucks 12A and 12B. At this time, the position of the movable base 32 located on the bottom portion 2a is called the second horizontal position.

[0072] 7, liquid nozzle 52 ejects cleaning liquid toward above lower surface brush 51. The cleaning liquid ejected from liquid nozzle 52 collides with the central region of the lower surface of substrate W. This causes the central region of the lower surface of substrate W to become wet with the cleaning liquid. The flow rate of the cleaning liquid ejected from liquid nozzle 52 (the flow rate of the cleaning liquid ejected per unit time) is determined so that the cleaning liquid supplied to the central region of the lower surface of substrate W does not reach the outer circumferential edge of substrate W.

[0073] Most of the cleaning liquid that collides with the central region of the lower surface of the substrate W falls below the substrate W. The cleaning liquid falling from the central region of the lower surface of the substrate W is received by the cleaning surface of the lower surface brush 51. This wets the cleaning surface of the lower surface brush 51. When an amount of cleaning liquid sufficient to sufficiently wet the cleaning surface of the lower surface brush 51 is discharged from the liquid nozzle 52, the discharge operation of the cleaning liquid by the liquid nozzle 52 stops.

[0074] Next, as shown by a thick solid arrow a5 in FIG. 8, the lifting support 54 rises so that the cleaning surface of the lower brush 51 comes into contact with the central region of the lower surface of the substrate W. Also, as shown by a thick solid arrow a6 in FIG. 8, the lower brush 51 wetted with the cleaning liquid rotates (spins) around a vertical axis. As a result, contaminants adhering to the central region of the lower surface of the substrate W are physically peeled off by the lower brush 51. At this time, the rotation speed of the lower brush 51 is set, for example, within a range of 100 rpm or more and 250 rpm or less. By setting the rotation speed of the lower brush 51 to 100 rpm or more, it is possible to ensure the ability to remove contamination required to clean the central region of the lower surface of the substrate W. Also, by setting the rotation speed of the lower brush 51 to 250 rpm or less, the cleaning liquid splashed from the lower brush 51 during cleaning of the central region of the lower surface of the substrate W is contained within the range of the outer edge of the substrate W in a plan view.

[0075] 8, an enlarged side view of the portion where lower surface brush 51 contacts the lower surface of substrate W is shown in a bubble. As shown in the bubble, with lower surface brush 51 in contact with substrate W, liquid nozzle 52 and gas ejection part 53 are held in positions close to the lower surface of substrate W. At this time, no cleaning liquid is ejected from liquid nozzle 52 onto substrate W.

[0076] However, the central region of the lower surface of the substrate W and the cleaning surface of the lower surface brush 51 are wet immediately before the lower surface brush 51 comes into contact with the substrate W. As a result, a part of the cleaning liquid present between the central region of the lower surface of the substrate W and the lower surface brush 51 flows below the lower surface brush 51 or splashes below the lower surface brush 51 together with the contaminants removed from the back surface of the substrate W.

[0077] Here, the upper surface 54u of the lifting support part 54 is inclined obliquely downward in a direction away from the suction holding part 21. In this case, when the cleaning liquid containing contaminants drops from the lower surface of the substrate W onto the lifting support part 54, the cleaning liquid received by the upper surface 54u is guided in a direction away from the suction holding part 21.

[0078] Moreover, when the lower surface central region of the substrate W is cleaned by the lower surface brush 51, the gas ejection unit 53 ejects gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the suction holding unit 21, as shown by the white arrow a52 in the blowout of FIG. 8. In this embodiment, the gas ejection unit 53 is attached on the lift support unit 54 so that the gas ejection port extends in the X direction. In this case, when the gas ejection unit 53 ejects gas toward the lower surface of the substrate W, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding unit 21. This prevents the cleaning liquid containing contaminants from scattering toward the suction holding unit 21 when the lower surface central region of the substrate W is cleaned by the lower surface brush 51. Therefore, when the lower surface central region of the substrate W is cleaned by the lower surface brush 51, the cleaning liquid containing contaminants is prevented from adhering to the suction holding unit 21, and the suction surface of the suction holding unit 21 is kept clean.

[0079] 8, the gas jetting part 53 jets gas obliquely upward from the gas jetting part 53 toward the lower surface brush 51 as shown by the outlined arrow a52, but the present invention is not limited to this. The gas jetting part 53 may jet gas from the gas jetting part 53 toward the lower surface of the substrate W along the Z direction.

[0080] 8, when cleaning of the central region of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped, and the lifting support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is spaced a predetermined distance from the substrate W. At this time, the injection of gas from the gas ejection part 53 to the substrate W continues.

[0081] 9, the movable base 32 moves backward so that the suction holder 21 is located at the planar reference position rp. That is, the movable base 32 moves from the second horizontal position to the first horizontal position. At this time, the gas ejection unit 53 continues to eject gas onto the substrate W, so that the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

[0082] Next, as shown by a thick solid arrow a8 in Fig. 10, the lifting support part 54 descends so that the cleaning surface of the lower surface brush 51 is positioned below the suction surface (upper end) of the suction holding part 21. Also, as shown by a thick solid arrow a9 in Fig. 10, the upper chucks 12A, 12B move away from each other so that the multiple holding pieces of the upper chucks 12A, 12B are separated from the outer circumferential end of the substrate W. At this time, the substrate W is supported by the lower chucks 11A, 11B.

[0083] 10, the pin connecting member 42 is raised so that the upper ends of the plurality of support pins 41 are positioned slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the plurality of support pins 41.

[0084] Next, the lower chucks 11A and 11B move away from each other as indicated by a thick solid arrow a11 in Fig. 11. At this time, the lower chucks 11A and 11B move to positions where they do not overlap the substrate W supported by the multiple support pins 41 in a plan view. As a result, both of the upper holding devices 10A and 10B return to their initial states.

[0085] 12, the pin connecting member 42 is lowered so that the upper ends of the multiple support pins 41 are positioned below the suction holding unit 21. As a result, the substrate W supported on the multiple support pins 41 is received by the suction holding unit 21. In this state, the suction holding unit 21 suction-holds the central region of the lower surface of the substrate W. Simultaneously with the descent of the pin connecting member 42 or after the descent of the pin connecting member 42 is completed, the cup 61 is raised from the lower cup position to the upper cup position, as shown by the thick solid arrow a13 in FIG.

[0086] 13, the suction holder 21 rotates around the vertical axis (the axis of the rotation shaft of the suction holder drive unit 22). As a result, the substrate W suctioned and held by the suction holder 21 rotates in a horizontal position. Also, as shown by the hollow arrow AB in the middle of FIG. 13, the back rinse nozzle 29 ejects the cleaning liquid toward the outer region of the lower surface of the substrate W. At this time, since the substrate W is rotating, the cleaning liquid ejected from the back rinse nozzle 29 spreads over the entire outer region of the lower surface of the substrate W and splashes outward from the substrate W.

[0087] Next, the rotary support shaft 71 of the upper surface cleaning device 70 rotates and descends. As a result, as shown by a thick solid arrow a15 in FIG. 13, the spray nozzle 73 moves to a position above the center of the substrate W, and descends so that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of a cleaning liquid and a gas onto the upper surface of the substrate W. The rotary support shaft 71 also rotates. Furthermore, as shown by a thick solid arrow a16 in FIG. 13, the spray nozzle 73 moves outward from the center of the rotating substrate W. The mixed fluid is sprayed onto the entire upper surface of the substrate W, so that the entire upper surface of the substrate W is cleaned. When the upper surface of the substrate W is cleaned, the cleaning liquid supplied from the back rinse nozzle 29 to the outer region of the lower surface of the substrate W prevents the cleaning liquid from flowing from the upper surface of the substrate W to the lower surface of the substrate W.

[0088] In addition, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotary support shaft 81 of the edge cleaning device 80 also rotates and descends. As a result, the bevel brush 83 moves to a position above the outer circumferential edge of the substrate W, as shown by a thick solid arrow a17 in FIG. 13. Also, the central portion of the outer circumferential surface of the bevel brush 83 descends so as to contact the outer circumferential edge of the substrate W. In this state, the bevel brush 83 rotates (spins) around an axis in the vertical direction. As a result, the contaminants adhering to the outer circumferential edge of the substrate W are physically peeled off by the bevel brush 83. The contaminants peeled off from the outer circumferential edge of the substrate W are washed away by the cleaning liquid discharged from the back rinse nozzle 29 onto the substrate W and the cleaning liquid of the mixed fluid sprayed from the spray nozzle 73 onto the substrate W.

[0089] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the lifting support part 54 rises so that the cleaning surface of the lower surface brush 51 comes into contact with the outer region of the lower surface of the substrate W. Also, as shown by a thick solid arrow a18 in Fig. 13, the lower surface brush 51 rotates (spins) about an axis in the vertical direction. At this time, the gas ejection part 53 ejects gas toward the lower surface of the substrate W. This allows the lower surface brush 51 to clean the entire outer region of the lower surface of the substrate W that is sucked and held by the suction holding part 21 and rotated. The rotation speed of the lower surface brush 51 when the outer region of the lower surface of the substrate W is cleaned is set, for example, within a range of 5 rpm to 60 rpm.

[0090] The rotation direction of the lower surface brush 51 may be opposite to that of the suction holding part 21. In this case, the outer region of the lower surface of the substrate W can be efficiently cleaned. In this embodiment, the rotation direction of the suction holding part 21 is clockwise, and the rotation direction of the lower surface brush 51 is counterclockwise in a plan view. In addition, if the lower surface brush 51 is not relatively large, the moving support part 55 may move forward and backward between the approach position and the separated position on the movable base 32, as shown by the thick solid arrow a19 in FIG. 13. Even in this case, the entire outer region of the lower surface of the substrate W that is suction-held and rotated by the suction holding part 21 can be cleaned by the lower surface brush 51.

[0091] Next, when cleaning of the upper surface, the outer peripheral end, and the outer region of the lower surface of the substrate W is completed, the spray nozzle 73 stops spraying the mixed fluid onto the substrate W. Also, as shown by a thick solid arrow a20 in FIG. 14, the spray nozzle 73 moves to a position on one side of the cup 61 (initial state position). Also, as shown by a thick solid arrow a21 in FIG. 14, the bevel brush 83 moves to a position on the other side of the cup 61 (initial state position). Furthermore, the rotation of the lower surface brush 51 is stopped, and the lift support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is separated from the substrate W by a predetermined distance. Also, the discharge of the cleaning liquid from the back rinse nozzle 29 onto the substrate W and the spray of the gas from the gas blowing part 53 onto the substrate W are stopped. In this state, the suction holding part 21 rotates at high speed, so that the cleaning liquid adhering to the substrate W is shaken off, and the entire substrate W is dried.

[0092] Next, the cup 61 descends from the upper cup position to the lower cup position, as shown by a thick solid arrow a22 in Fig. 15. Furthermore, in preparation for a new substrate W being carried into the unit housing 2, the lower chucks 11A and 11B approach each other to positions where they can support the new substrate W, as shown by a thick solid arrow a23 in Fig. 15.

[0093] Finally, the substrate W is unloaded from within the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the load / unload opening 2x immediately before the substrate W is unloaded. Thereafter, as indicated by a thick solid arrow a24 in Fig. 16, a hand (substrate holder) RH of a substrate transport robot (not shown) enters the unit housing 2 through the load / unload opening 2x. Next, the hand RH receives the substrate W on the suction holder 21, and exits through the load / unload opening 2x. After the hand RH exits, the shutter 91 closes the load / unload opening 2x.

[0094] 3.Effects FIG. 17 is a diagram for explaining the main effect of the present invention obtained by a series of operations of the substrate cleaning apparatus 1 shown in FIGS. 4 to 16. In the substrate cleaning apparatus 1, first, the substrate W is held by the upper holding devices 10A and 10B in a state where it cannot rotate. Furthermore, the central region of the lower surface of the substrate W held by the upper holding devices 10A and 10B is cleaned. During this cleaning, as shown in the upper part of FIG. 17, a predetermined amount of cleaning liquid is supplied from the liquid nozzle 52 to the central region of the lower surface of the substrate W before the cleaning surface of the lower surface brush 51 is pressed against the central region of the lower surface of the substrate W. At this time, the lower surface brush 51 is located below the central region of the lower surface of the substrate W. Therefore, the cleaning liquid supplied to the central region of the lower surface of the substrate W falls from the lower surface of the substrate W onto the lower surface brush 51. As a result, the lower surface brush 51 and the central region of the lower surface of the substrate W are wetted.

[0095] 17, a lower surface brush 51 wetted with a cleaning liquid is pressed against the central region of the lower surface of the substrate W. In addition, the lower surface brush 51 rotates around an axis extending in the vertical direction. This allows the lower surface brush 51 to smoothly clean the central region of the lower surface of the substrate W.

[0096] When cleaning the central region of the lower surface of the substrate W, the substrate W is not rotating. Therefore, while the central region of the lower surface of the substrate W is being cleaned, the cleaning liquid hardly reaches the outer peripheral edge of the substrate W. In other words, the cleaning liquid does not flow from the lower surface of the substrate W to the upper surface of the substrate W. As a result, there is no need to supply cleaning liquid to the upper surface of the substrate W to protect the peripheral edge of the upper surface of the substrate W. Therefore, it is possible to reduce the amount of cleaning liquid required to clean the lower surface of the substrate W.

[0097] When the cleaning of the central region of the lower surface of the substrate W is completed, the substrate W held by the upper holding devices 10A and 10B is transferred to the lower holding device 20. The lower holding device 20 holds and rotates the transferred substrate W. In this state, the surface of the substrate W except for the central region of the lower surface, that is, the upper surface, the outer peripheral edge, and the outer region of the lower surface of the substrate W are cleaned. During this cleaning, as shown in the lower part of FIG. 17, a mixed fluid of a cleaning liquid and a gas is supplied from a spray nozzle 73 to the upper surface of the substrate W, and the spray nozzle 73 is scanned over the upper surface of the substrate W. In addition, the cleaning liquid is supplied from two back rinse nozzles 29 to the outer region of the lower surface of the substrate W. In addition, a bevel brush 83 is pressed against the outer peripheral edge of the substrate W, and a lower brush 51 is pressed against the outer region of the lower surface of the substrate W.

[0098] Here, the cleaning liquid supplied from the back rinse nozzle 29 to the outer region of the lower surface of the substrate W prevents the cleaning liquid supplied to the upper surface of the substrate W from flowing around to the lower surface of the substrate W. This eliminates the need to separately supply the cleaning liquid for cleaning the outer region of the lower surface of the substrate W and perform back rinsing to prevent the cleaning liquid supplied to the upper surface of the substrate W from flowing around to the lower surface of the substrate W. As a result, the amount of cleaning liquid required to clean the upper and back surfaces of the substrate W can be reduced.

[0099] 4. Preferred Configuration of the Lower Brush 51 The lower surface brush 51 is attached to a brush base, and is then attached, via the brush base, to a rotating shaft of a motor included in the lower surface brush rotation drive unit 55a in Fig. 1. In the following description, the assembly of the lower surface brush 51 and the brush base is referred to as a brush unit.

[0100] Fig. 18 is an external perspective view showing a preferred configuration example of the brush unit. As shown in Fig. 18, the brush unit 300 is configured by attaching the lower brush 51 onto the brush base 200. The lower brush 51 may be formed of a relatively soft resin material such as PVA or PTFE as described above. The brush base 200 may be formed of a relatively hard resin such as PVC (polyvinyl chloride) or PP (polypropylene).

[0101] Fig. 19 is an external perspective view of the lower surface brush 51 of Fig. 18. Fig. 20 is a plan view of the lower surface brush 51 of Fig. 18. As shown in Figs. 19 and 20, the lower surface brush 51 includes a base portion 110 and cleaning portions 120, 130. The base portion 110 has a disk shape. In a plan view, a geometric center 101 (Fig. 20) of the base portion 110 is defined.

[0102] The cleaning portions 120 and 130 are formed on the upper surface of the base portion 110 so as to protrude upward from the upper surface of the base portion 110. The cleaning portion 120 is disposed so as to extend in the radial direction of the base portion 110 through the geometric center 101 of the base portion 110. The cleaning portion 130 is disposed so as to follow the outer edge of the base portion 110. The cleaning portion 130 may be in contact with both ends of the cleaning portion 120. The protruding amount of the cleaning portions 120 and 130 from the upper surface of the base portion 110 is, for example, 5 mm to 6 mm. The width of the cleaning portion 120 and the width of the cleaning portion 130 may be the same or different.

[0103] The base portion 110 is formed with a plurality of through holes 111, a plurality of through holes 112, and a plurality of through holes 113. Each of the through holes 111 to 113 extends in the vertical direction. The through holes 111 are used to connect the base portion 110 to the brush base 200 of FIG. 18, and ten through holes 111 are provided in this example. Specifically, the eight through holes 111 are arranged in the peripheral region of the base portion 110 at approximately equal angular intervals. Two through holes 111 are arranged in the central region of the base portion 110 so as to face each other with the cleaning portion 120 in between.

[0104] The through holes 112 are used to connect the brush base 200 to a motor or the like that rotates the brush unit 300, and four through holes 112 are provided in this example. The four through holes 112 are arranged in the central region of the base 110 at approximately equal angular intervals so as to surround the geometric center 101 of the base 110. The through holes 113 are used to discharge cleaning liquid when cleaning the substrate, and ten through holes 113 are provided in this example. The ten through holes 113 are regularly arranged in the peripheral region of the base 110 so as to follow the cleaning portion 130.

[0105] The brush base 200 is a plate-like member having an external shape similar to that of the base portion 110 of the lower brush 100. Fig. 21 is a vertical cross-sectional view of the brush unit 300 of Fig. 18. As shown in Fig. 21, a recess 210 is formed in the central region of the lower surface of the brush base 200. In addition, an inclined portion 220 that slopes diagonally downward toward the outside is formed in the peripheral region of the lower surface of the brush base 200. Furthermore, a plurality of screw holes 201, a plurality of through holes 202, and a plurality of through holes 203 are formed in the brush base 200.

[0106] The multiple screw holes 201 are provided on the upper surface of the brush base 200 so as to respectively correspond to the multiple through holes 111 of the lower brush 100. The multiple through holes 202 extend vertically and are arranged so as to respectively correspond to the multiple through holes 112 of the lower brush 100. The multiple through holes 203 extend vertically and are arranged so as to respectively correspond to the multiple through holes 113 of the lower brush 100.

[0107] A plurality of screw members 310 (FIG. 18) are inserted from above into the plurality of through holes 111 of the underside brush 100. The lower end of each screw member 310 is attached to the corresponding screw hole 201 of the brush base 200. This connects the underside brush 100 and the brush base 200, completing the brush unit 300. In the brush unit 300, the plurality of through holes 113 of the underside brush 100 each communicate with the plurality of through holes 203 of the brush base 200.

[0108] As described above, the brush unit 300 is attached to the rotating shaft 400 of the motor of the lower surface brush rotation drive section 55a. Specifically, the upper end of the rotating shaft 400 is fitted into the recess 210 of the brush base 200 from below. The rotating shaft 400 is formed with a plurality of screw holes 401 that respectively correspond to the through holes 202 of the brush base 200. A plurality of screw members 320 (FIG. 18) are inserted from above into the plurality of through holes 112 of the lower surface brush 100, respectively. The lower end of each screw member 320 is attached to the corresponding screw hole 401 of the rotating shaft 400 through the corresponding through hole 202 of the brush base 200.

[0109] In the brush unit 300 of FIG. 18, for example, when cleaning liquid is supplied onto the lower surface brush 51, a portion of the cleaning liquid is temporarily stored in the inner region of the cleaning portion 130. The stored cleaning liquid is gently discharged downward through the multiple through holes. Therefore, according to the above-mentioned brush unit 300, a predetermined amount of cleaning liquid can be stored in the inner region of the cleaning portion 130 of the lower surface brush 51 immediately before starting cleaning of the lower surface central region of the substrate W. As a result, even when cleaning the lower surface central region of the substrate W where no cleaning liquid is supplied to the underside of the substrate W, contaminants adhering to the lower surface central region of the substrate W are smoothly removed by the cleaning liquid stored in the cleaning portion 130 of the lower surface brush 51.

[0110] 18, the cleaning part 120 is disposed so as to extend in the radial direction of the base part 110 through the geometric center 101 of the base part 110. This increases the contact area of ​​the lower surface brush 51 with the substrate W compared to a configuration in which only the cleaning part 130 is formed on the base part 110. This makes it possible to obtain a higher cleaning power for the lower surface of the substrate W.

[0111] 19, the lower surface brush 51 may have a configuration that does not include the cleaning unit 120. Even in this case, when cleaning the central region of the lower surface of the substrate W, the central region of the lower surface of the substrate W is smoothly cleaned by the cleaning liquid stored in the cleaning unit 130 of the lower surface brush 51 even in a state in which the cleaning liquid is not supplied.

[0112] 5. Other embodiments (1) In the substrate cleaning apparatus 1 according to the above embodiment, when the lower surface brush 51 cleans the lower surface central region and the lower surface outer region of the substrate W, the lower surface brush 51 pressed against the lower surface of the substrate W rotates about a vertical axis, but the present invention is not limited to this. Instead of rotating about a vertical axis, the lower surface brush 51 may clean the lower surface central region and the lower surface outer region of the substrate W by moving or reciprocating in a linear or arc shape on the lower surface of the substrate W.

[0113] (2) In the substrate cleaning apparatus 1 according to the above embodiment, the two liquid nozzles 52 of the lower surface cleaning apparatus 50 eject cleaning liquid toward above the lower surface brush 51, but the present invention is not limited to this. The liquid nozzles 52 may be configured to eject cleaning liquid directly toward the cleaning surface of the lower surface brush 51. In this case, when cleaning the central region of the lower surface of the substrate W, cleaning liquid is supplied from the liquid nozzles 52 to the lower surface brush 51 in advance before the lower surface brush 51 moves below the substrate W. As a result, the central region of the lower surface of the substrate W is cleaned by the wetted lower surface brush 51.

[0114] According to the above configuration, the lower surface brush 51 can be cleaned by ejecting the cleaning liquid onto the lower surface brush 51 in a state in which the lower surface of the substrate W has not been cleaned. Also, by ejecting the cleaning liquid onto the lower surface brush 51 in a state in which the lower surface of the substrate W has not been cleaned, the lower surface brush 51 can be prevented from drying out.

[0115] (3) In the substrate cleaning apparatus 1 according to the above embodiment, deionized water is used as the cleaning liquid for cleaning the substrate W, but the present invention is not limited thereto. The cleaning liquid for cleaning the substrate W may be a rinse liquid such as deionized water (DIW), or a chemical liquid such as ammonia hydrogen peroxide (SC1), hydrochloric acid hydrogen peroxide (SC2), sulfuric acid hydrogen peroxide (SPM), sulfuric acid water, or hydrofluoric acid.

[0116] Furthermore, the cleaning liquid discharged from the back-rinse nozzle 29, the cleaning liquid discharged from the liquid nozzle 52, and the cleaning liquid contained in the mixed fluid discharged from the spray nozzle 73 may be the same or different types of cleaning liquid. When multiple types of cleaning liquids are used in the substrate cleaning apparatus 1, the cleaning liquids may include a rinsing liquid, may include a chemical liquid, or may include a rinsing liquid and a chemical liquid.

[0117] (4) In the above embodiment, after the upper holding device 10A, 10B cleans the central region of the underside of the substrate W, the lower holding device 20 cleans the outer region of the underside of the substrate W, but the embodiment is not limited to this. After the lower holding device 20 cleans the outer region of the underside of the substrate W, the upper holding device 10A, 10B may clean the central region of the underside of the substrate W.

[0118] (5) In the above embodiment, the spray nozzle 73 cleans the upper surface of the substrate W by scanning from the center of the substrate W toward the outer circumferential edge thereof in a plan view, but the embodiment is not limited to this. The spray nozzle 73 may clean the upper surface of the substrate W by scanning from the outer circumferential edge of the substrate W toward the center of the substrate W in a plan view. In addition, the upper surface of the substrate W is cleaned using the spray nozzle 73 that sprays the mixed fluid, but the embodiment is not limited to this. The upper surface of the substrate W may be cleaned using a brush or a cleaning liquid nozzle that ejects a cleaning liquid.

[0119] (6) In the above embodiment, substrate cleaning apparatus 1 includes controller 9, but the embodiment is not limited to this. When substrate cleaning apparatus 1 is configured to be controllable by an external information processing device, substrate cleaning apparatus 1 does not need to include controller 9.

[0120] 6. Correspondence between each component of the claims and each part of the embodiment Below, examples of the correspondence between each component of the claims and each element of the embodiment will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0121] In the above embodiment, the substrate W is an example of a substrate, the substrate cleaning apparatus 1 is an example of a substrate cleaning apparatus, the upper holding devices 10A, 10B are examples of a first substrate holding unit, the lower surface brush 51 is an example of a cleaning brush and a lower surface brush, the lower surface brush rotation drive unit 55a, the lower surface brush lift drive unit 55b and the lower surface brush movement drive unit 55c are examples of brush drive units, and the control unit 9 is an example of a control unit.

[0122] In addition, the liquid nozzle 52 and the lower surface cleaning liquid supply unit 56 are an example of a first lower surface liquid supply unit, the suction holding unit 21 of the lower holding device 20 is an example of a second substrate holding unit, the spray nozzle 73 and the upper surface cleaning fluid supply unit 75 are an example of an upper surface liquid supply unit, and the back rinse liquid supply unit 28 and the back rinse nozzle 29 are an example of a second lower surface liquid supply unit.

[0123] Furthermore, the top surface of brush base 200 is an example of a flat surface, brush base 200 is an example of a base portion, cleaning portion 130 is an example of a first cleaning portion, geometric center 101 is an example of a geometric center, and cleaning portion 120 is an example of a second cleaning portion. [Explanation of symbols]

[0124] 1...substrate cleaning apparatus, 2...unit housing, 2a...bottom surface portion, 2b to 2e...side wall portion, 2x...loading / unloading port, 9...control portion, 10A, 10B...upper holding device, 11A, 11B...lower chuck, 12A, 12B...upper chuck, 13A, 13B...lower chuck drive portion, 14A, 14B...upper chuck drive portion, 20...lower holding device, 21...suction holding portion, 22...suction holding drive portion, 28...back rinse liquid Supply unit, 29... back rinse nozzle, 30... pedestal device, 31... linear guide, 32... movable pedestal, 33... pedestal drive unit, 40... delivery device, 41... support pin, 42... pin connecting member, 43... pin lift drive unit, 50... underside cleaning device, 51... underside brush, 52... liquid nozzle, 53... gas ejection unit, 54... lift support unit, 54u... upper surface, 55... moving support unit, 55a... underside brush rotation drive unit, 55b ...lower surface brush lifting drive unit, 55c...lower surface brush movement drive unit, 56...lower surface cleaning liquid supply unit, 57...jet gas supply unit, 60...cup device, 61...cup, 62...cup drive unit, 70...upper surface cleaning device, 71, 81...rotating support shaft, 72, 82...arm, 73...spray nozzle, 74...upper surface cleaning drive unit, 75...upper surface cleaning fluid supply unit, 80...edge cleaning device, 83...bevel brush, 84...bevel Bell brush drive unit, 90...opening and closing device, 91...shutter, 92...shutter drive unit, 101...geometric center, 110...base unit, 111, 112, 113, 202, 203...through holes, 120, 130...cleaning unit, 200...brush base, 201, 401...screw hole, 210...recess, 300...brush unit, 310, 320...screw member, 400...rotation axis, rp...planar reference position, W...substrate

Claims

1. A substrate cleaning apparatus for cleaning an upper surface and a lower surface of a substrate using a cleaning liquid, comprising: a first substrate holder that holds the substrate in a horizontal position without rotating the substrate by contacting a plurality of portions of an outer peripheral edge of the substrate; A cleaning brush configured to be able to contact the lower surface of the substrate; a brush drive unit configured to press the cleaning brush against the underside of the substrate held by the first substrate holding unit and to move the cleaning brush relatively to the substrate held by the first substrate holding unit; A control unit. The control unit controls the first substrate holding unit and the brush driving unit so that the cleaning brush, wetted with cleaning liquid, is pressed against a central region of the underside of the substrate while moving over the central region of the underside of the substrate while no cleaning liquid is supplied to the substrate.

2. a first lower surface liquid supply unit that supplies a cleaning liquid to a central region of the lower surface of the substrate held by the first substrate holding unit; The substrate cleaning apparatus of claim 1, wherein the control unit controls the brush drive unit and the first underside liquid supply unit so that cleaning liquid is supplied to the underside central region of the substrate while the cleaning brush is positioned below the underside central region of the substrate held by the first substrate holding unit before the cleaning brush is pressed against the underside central region of the substrate.

3. a second substrate holding section that holds the substrate in a horizontal position by sucking a central region of the lower surface of the substrate and rotates the substrate around an axis extending in a vertical direction; an upper surface liquid supply unit that supplies a cleaning liquid to the upper surface of the substrate held by the second substrate holding unit; a second lower surface liquid supply unit that supplies a cleaning liquid to a lower surface outer region surrounding the lower surface central region of the substrate held by the second substrate holding unit, the brush driving unit is configured to be capable of further pressing the cleaning brush against the outer region of the lower surface of the substrate held by the second substrate holding unit, 3. The substrate cleaning apparatus of claim 1, wherein the control unit controls the second substrate holding unit, the upper surface liquid supply unit, the second lower surface liquid supply unit and the brush drive unit so that cleaning liquid is supplied to the upper surface of the substrate rotated by the second substrate holding unit and cleaning liquid is supplied to the lower surface outer region of the substrate while the cleaning brush is pressed against the lower surface outer region of the substrate.

4. the cleaning brush is a bottom surface brush used to clean the bottom surface of a substrate; The lower surface brush is A base portion having a flat surface facing upward; The substrate cleaning apparatus according to any one of claims 1 to 3, further comprising: a first cleaning section provided on the flat surface of the base portion so as to protrude upward from the flat surface of the base portion and to follow an outer edge of the base portion.

5. The lower surface brush is The substrate cleaning apparatus according to claim 4 , further comprising a second cleaning section provided on the flat surface of the base section so as to protrude upward from the flat surface of the base section and extend in one direction through a geometric center of the base section in a plan view.

6. 1. A substrate cleaning method for cleaning an upper surface and a lower surface of a substrate using a cleaning liquid, comprising the steps of: holding the substrate in a horizontal position without rotating the substrate using a first substrate holder that contacts a plurality of portions of an outer peripheral edge of the substrate; pressing a cleaning brush configured to be able to contact the lower surface of the substrate against the lower surface of the substrate held by the first substrate holding part, and moving the cleaning brush relative to the substrate held by the first substrate holding part; The step of pressing the cleaning brush against the underside of the substrate and moving it relative to the substrate includes, in a state in which no cleaning liquid is supplied to the substrate, pressing the cleaning brush wetted with cleaning liquid against a central region of the underside of the substrate and moving it over the central region of the underside of the substrate.

7. 7. The substrate cleaning method according to claim 6, further comprising the step of supplying a cleaning liquid to the central region of the lower surface of the substrate while the cleaning brush is positioned below the central region of the lower surface of the substrate held by the first substrate holding part before the cleaning brush is pressed against the central region of the lower surface of the substrate.

8. holding the substrate in a horizontal position using a second substrate holding part that adsorbs the central region of the lower surface of the substrate and rotating the substrate around an axis extending in a vertical direction; supplying a cleaning liquid to the top surface of the substrate held and rotated by the second substrate holder; supplying a cleaning liquid to an outer lower surface region surrounding the lower surface central region of the substrate held and rotated by the second substrate holding part while the cleaning liquid is supplied to the upper surface of the substrate; 8. The substrate cleaning method according to claim 6, wherein the step of pressing the cleaning brush against the underside of the substrate and moving it relative to the substrate includes: pressing the cleaning brush against the underside outer region of the substrate while moving it over the underside outer region of the substrate in a state in which cleaning liquid is supplied to the upper surface of the substrate rotated by the second substrate holding part and cleaning liquid is supplied to the underside outer region of the substrate.

9. the cleaning brush is a bottom surface brush used to clean the bottom surface of a substrate; The lower surface brush is A base portion having a flat surface facing upward; The substrate cleaning method according to any one of claims 6 to 8, further comprising: a first cleaning part provided on the flat surface of the base part so as to protrude upward from the flat surface of the base part and to follow an outer edge of the base part.

10. The lower surface brush is The substrate cleaning method according to claim 9 , further comprising a second cleaning portion provided on the flat surface of the base portion so as to protrude upward from the flat surface of the base portion and extend in one direction through a geometric center of the base portion in a plan view.

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