Wafer Inspection Equipment

Abstract

An object of the present invention is to provide a wafer inspection device. [Solution] A wafer inspection apparatus includes a base, a chuck, a first lifting device, and a bridge assembly. The base is movable in a first axial direction. The chuck can be used to place an object under test. The first lifting device is used to bring the chuck into contact with or away from the object under test by lifting or lowering the chuck in the first axial direction relative to the base. The bridge assembly includes an electrical connection device and a second lifting device. The electrical connection device includes a first connection module and a second connection module electrically connected to each other. The second lifting device is used to bring the first connection module into contact with or away from the probe card and the second connection module into contact with or away from the chuck by lifting or lowering the electrical connection device in the first axial direction relative to the base.

Description

[Technical field]

[0001] The present disclosure relates to an inspection apparatus, and more particularly to a wafer inspection apparatus that provides a short signal transmission path to a wafer under inspection. [Background technology]

[0002] The manufacturing process for semiconductor components includes a wafer probe test, in which electrical characteristics and functionality tests are performed on each die in a wafer to identify die with defective electrical characteristics and functionality before the IC mounting process, and to prevent such defective die from entering later processes.

[0003] The steps of the wafer probe test process include contacting the probe needles of a probe card with test points (e.g., pads on a die) on the wafer as input terminals, inputting test signals to the corresponding die via the probe needles to determine whether the die is good or bad, and inspecting the state of the electrical characteristics of the circuit.

[0004] There are many components or actuators inside a wafer inspection equipment, but in order to shorten the path that the test signal output from the probe card takes after it enters the die being inspected and returns to the probe card, new parts must be installed, which often makes it difficult to arrange the space inside the narrow wafer inspection equipment, and makes it necessary to redesign and arrange each component or actuator inside the wafer inspection equipment, significantly increasing construction costs. Summary of the Invention [Problem to be solved by the invention]

[0005] In some embodiments of the present invention, an apparatus is provided that can be easily configured into existing design equipment through retrofit and / or retrofitting and can be used to shorten signal transmission paths. [Means for solving the problem]

[0006] According to some embodiments, a wafer inspection apparatus is provided, the apparatus including a base, a chuck, a first lifting device, and at least one bridge assembly. The base is movable in a first axial direction and is used to lift or lower a test object to contact or separate from a probe card. The chuck is made of a conductive material and is used to selectively place the test object on the base. The first lifting device is disposed on the base and abuts against the chuck, and is used to lift or lower the chuck in the first axial direction relative to the base to contact or separate from the test object. The bridge assembly includes an electrical connection device and a second lifting device. The electrical connection device includes a first connection module and a second connection module electrically connected to each other. The second lifting device is disposed on the base and abuts against the electrical connection device, and is used to lift or lower the electrical connection device in the first axial direction relative to the base to contact or separate the first connection module from the probe card and the second connection module from the chuck.

[0007] According to some embodiments, when the first connection module contacts the probe card and the second connection module contacts the chuck, a bridge path between the wafer under test and the probe card can be established, which provides a short signal transmission path between the wafer under test and the probe card.

[0008] According to some embodiments, the object under test may include a wafer under test and a carrier for placing the wafer under test.

[0009] According to some embodiments, the electrical connection device may have a step at its top. The step may have a higher portion and a lower portion relative to the higher portion. The first connection module is disposed on the higher portion and the second connection module is disposed on the lower portion. When the second lifting device lifts the electrical connection device to allow the second connection module to contact the lower surface of the chuck, the first connection module is located on the periphery of the chuck and protrudes from the upper surface of the chuck.

[0010] According to some embodiments, the chuck may have at least one lug portion disposed on its periphery and formed thereon, the lower surface of the lug portion being adapted to contact the second connection module.

[0011] According to some embodiments, the chuck may include a plurality of spaced apart lugs, the number of bridge assemblies corresponding to the number of lugs, each of the bridge assemblies corresponding to one of the lugs, and the second connection module of each of the bridge assemblies contacts the corresponding lug after the electrical connection device is lifted by the second lifting device.

[0012] According to some embodiments, each of the first connection modules can be electrically connected to a conductive sheet at the bottom of the probe card via a plurality of first terminals protruding upward, and each of the second connection modules can be electrically connected to the bottom surface of the corresponding lug portion via a plurality of second terminals protruding upward.

[0013] According to some embodiments, the periphery of the chuck may be provided with a number of notches, each of which is adapted for a claw of a corresponding support device to extend into, and the support device is fixed to the base, and when the chuck is not yet in contact with the test piece, the claws of the two support devices abut and support the test piece. Effect of the Invention

[0014] Therefore, the combination of the chuck, first lifting device and bridge assembly not only allows it to be placed directly on an existing base and move together with the base, but also forms a configuration relationship between the bridge assembly and the chuck that allows them to operate independently without interfering with each other, ensuring the integrity and continuity of the test signal and greatly improving compatibility with existing equipment. [Brief description of the drawings]

[0015] [Figure 1] 1 is a cross-sectional side view of a wafer inspection apparatus according to some embodiments. [Diagram 2] 2 is a schematic view of the embodiment of FIG. 1 after the base has been moved upward. [Diagram 3] 2 is a schematic diagram showing a case where the base in the embodiment of FIG. 1 is moved downward and the bridge assembly is also moved downward. [Figure 4] 1 is a schematic three-dimensional view of some devices of a wafer inspection apparatus according to some embodiments. [Diagram 5] FIG. 5 is a schematic three-dimensional view of a bridge assembly in the embodiment of FIG. 4. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] In order to make the objects, features and effects of the present invention fully comprehensible, the present invention will be described in detail below in conjunction with specific embodiments and the accompanying drawings.

[0017] As used herein, the terms "a" or "one" are used to describe a unit, component, structure, device, module, system, site, or area, etc. This is done for convenience of description only and to give a general sense of the scope of the invention. Thus, unless the context clearly indicates otherwise, such descriptions should be understood to include one or at least one, and the singular forms also include the plural.

[0018] As used herein, the terms "including," "comprising," "having," or other similar terms are not limited to those elements listed herein and may include other elements that, although not expressly listed, are generally inherent to a unit, component, structure, device, module, system, portion, or area.

[0019] As used herein, similar ordinal terms such as "first" or "second" are used to distinguish or refer to the same or similar elements or structures, regions, or areas and do not necessarily imply a spatial order to these elements, structures, regions, or areas. It will be understood that in some instances or configurations, the ordinal terms may be used interchangeably without affecting the implementation of the invention.

[0020] 1 and 2, Fig. 1 is a side cross-sectional view of a wafer inspection apparatus according to some embodiments, and Fig. 2 is a schematic view after a base in the embodiment of Fig. 1 is moved upward. The wafer inspection apparatus includes a base 100, a chuck 200, a first lifting device 300, and at least one bridge assembly 400.

[0021] The base 100 is typically configured to have a multi-axial movement capability within a wafer inspection apparatus and is configured to follow the wafer inspection apparatus to provide a wafer inspection method. For example, the base 100 may have the ability to move in a first axis (Z-axis), a second axis (X-axis, not shown, FIG. 4), and a third axis (Y-axis, not shown, FIG. 4), and the ability to rotate about at least one axis.

[0022] In this embodiment, the base 100 provides a moving capability in a first axial direction (Z-axis), and allows a certain degree of moving relationship between the chuck 200 and the probe card 500. Usually, the base 100 is driven to move the chuck 200 carrying the object under test 600 closer, and the probing step is advanced by moving the inspection point of the wafer under test 610 of the object under test 600 closer to the probe card 500. For example, the base 100 lifts or lowers the object under test 600 to contact the bottom of the probe card 500 or to move away from the probe card 500. However, moving the probe card 500 closer to the object under test 600, or moving both the chuck 200 and the probe card 500 to advance the probing step, can be applied to the embodiments disclosed in the present invention.

[0023] The chuck 200 is used to place the object under test 600 on it, and is made of a conductive material having electrical conductivity, including a metallic material or a nonmetallic material having electrical conductivity. The chuck 200 is provided with a bridge assembly 400 that can establish an electrical connection with the object under test 600 on the chuck 200 by contacting the chuck 200. The bridge assembly 400 includes an electrical connection device 410 and a second lifting device 420. The electrical connection device 410 includes a first connection module 411 for contacting the bottom of the probe card 500 and a second connection module 412 for contacting the chuck 200.

[0024] For example, when the second lifting device 420 arranged on the base 100 operates, the electrical connection device 410 is raised or lowered in the first axial direction Z relative to the base 100, thereby moving the first connection module 411 closer to or away from the bottom of the probe card 500, and moving the second connection module 412 closer to or away from the bottom of the chuck 200.

[0025] 1 and 2, the electrical connection device 410 has a step on the top, and the step has a high part and a low part relative to the high part. The first connection module 411 is disposed on the high part, and the second connection module 412 is disposed on the low part. When the second lifting device 420 lifts the electrical connection device 410 so that the second connection module 412 can contact the lower surface of the chuck 200, the first connection module 411 is located on the periphery of the chuck 200 and protrudes from the upper surface of the chuck 200.

[0026] 2, after the base 100 moves upward, an electrical connection between the first connection module 411 and the probe card 500 and an electrical connection between the second connection module 412 and the bottom of the chuck 200 can be established. In the electrical connection device 410, the first connection module 411 is electrically connected to the second connection module 412 via a method such as a conductive wire, thereby establishing a short path from the chuck 200 to the middle of the probe card 500, and forming a bridge path between the wafer under test 600 and the probe card 500. This bridge path provides a short signal transmission path between the wafer under test 610 and the probe card 500.

[0027] The first lifting device 300 is disposed on the base 100 and is used to abut and support the chuck 200. The first lifting device 300 is used to lift or lower the chuck 200 in the first axial direction Z relative to the base 100, thereby moving the chuck 200 closer to or farther from the test object 600. The first lifting device 300 is extended on the base 100 to lift the chuck 200 and bring it into contact with the bottom surface of the test object 600, and then the first stage of positioning is completed. Next, the second lifting device 420 is extended on the base 100 to lift the electrical connection device 410 and bring the second connection module 412 into contact with the bottom surface of the chuck 200, and then the second stage of positioning is completed, and the preparation step of the test procedure is now complete. Next, the base 100 is operated in the first axis direction Z, and the first lifting device 300 and the second lifting device 420 fixed to the base 100 are also lifted together, thereby lifting the test subject 600 and bringing it into contact with the inspection and measurement unit 510 (FIG. 2) of the probe card 500, and at this time, the first connection module 411 simultaneously contacts the conductive sheet 520 on the bottom surface of the probe card 500, completing a short signal transmission path between the test subject 600 and the probe card 500. Next, under the control of the base 100, each die of the test subject wafer 610 on the test subject 600 is brought into contact with the inspection and measurement unit 510 at the bottom of the probe card 500 one by one to perform the probing step.

[0028] The first lifting device 300 and the second lifting device 420 can be, for example, a pneumatic displacement mechanism that can be used in a telescopic manner, or any other device that can achieve an axial displacement effect.

[0029] 3 is a schematic diagram showing a case where the base in the embodiment of FIG. 1 is moved downward and the bridge assembly is also moved downward. Meanwhile, after the probing step of the wafer 610 under test on the object under test 600 is completed, the base 100 first moves downward to move the object under test 600 away from the probe card 500, and then the second lifting device 420 contracts to move the first connection module 411 away from the probe card 500 and the chuck 200, so that the top surface of the first connection module 411 is lower than the bottom surface of the chuck 200, and at the same time, the second connection module 412 is also moved away from the chuck 200, thereby forming the state shown in FIG. 3. Therefore, the bridge assembly 400 does not hinder the pick and place of the object under test 600 by other machine components. In some embodiments, from the standpoint of subsequent operation control, the first lifting device 300 can be retracted to allow the descent of the chuck 200 to be performed in the first axial direction Z, thereby providing the space required for pick-and-place of the inspected object 600 by other mechanical components.

[0030] 1 to 3, as described above, the probe card 500 includes an inspection and measurement unit 510, a conductive sheet 520, and a substrate 530. After the alignment and movement steps in the inspection procedure are completed, the inspection and measurement unit 510 can contact a selected die to be inspected on the wafer 610 to be inspected (the inspection and measurement unit 510 is, for example, a probe needle) to transmit a test signal into the die to be inspected. Although the inspection and measurement unit 510 is illustrated as only a single probe needle in FIGS. 1 and 2, the inspection and measurement unit 510 is not limited thereto. The inspection and measurement unit 510 can be fixed to the substrate 530.

[0031] The substrate 530 is generally configured to have various electronic components on its top surface and to lay out related lines on the top surface and inside of the substrate, and has an insulating layer on its bottom surface, and the conductive sheet 520 is generally added under the insulating layer to form a contact surface for electrical connection of the bridge assembly 400 on the bottom of the probe card 500. The conductive sheet 520 may be disposed around the inspection and measurement unit 510. The conductive sheet 520 disposed on the bottom surface of the substrate 530 is electrically connected to the electronic components on the probe card 500 through lines disposed on and / or inside the substrate 530, and transmits the received test signals to corresponding functional modules, whereby some electrical characteristic analysis steps are performed.

[0032] 4 and 5, Fig. 4 is a schematic three-dimensional view of some devices of a wafer inspection apparatus according to some embodiments, and Fig. 5 is a schematic three-dimensional view of a bridge assembly in the embodiment of Fig. 4. In Fig. 4, the object under test 600 is not placed on the support device 700 or the chuck 200 so that the spatial arrangement relationship of each structure can be seen.

[0033] Two support devices 700 are fixed on the base 100, and each support device 700 includes a pair of upright supports 710 and a claw portion 720 supported by the upright supports 710. The tip of the claw portion 720 is used to abut and support the object to be tested 600 so that other machine components can pick or place the object to be tested 600. The object to be tested 600 includes a wafer to be tested 610 and a carrier 620 for placing the wafer to be tested 610. The carrier 620 is made of, for example, a conductive material (including a metallic material or a non-metallic material having conductivity) and can be provided as a thin sheet.

[0034] The chuck 200 has a plurality of notches 210 on its periphery. Each notch 210 is for the tip of a corresponding claw 720 of the support device 700 to extend therethrough. Specifically, when the chuck 200 is lifted, each notch 210 of the chuck 200 receives the tip of the corresponding claw 720 so that the upper surface of the chuck 200 contacts the lower surface of the carrier 620 of the test object 600 to form an electrical connection, and thus the test object 600 can be abutted and supported by the support device 700 after the chuck 200 is lowered.

[0035] In some embodiments, the chuck 200 includes at least one peripherally disposed protruding lug 220. The lower surface of the lug 220 is adapted to contact the second connection module 412 to form an electrical connection.

[0036] 4 and 5, the chuck 200 includes four spaced apart lug portions 220. The number of bridge assemblies 400 corresponds to the number of the lug portions 220, which is four. Each bridge assembly 400 corresponds to one lug portion 220. After the electrical connection device 410 is lifted by the second lifting device 420, the second connection module 412 of each bridge assembly 400 can contact the bottom surface of the corresponding lug portion 220.

[0037] In some embodiments, each first connection module 411 can be electrically connected to a conductive sheet 520 (not shown in FIG. 4) at the bottom of a probe card 500 (not shown in FIG. 4) through a plurality of first terminals protruding upward. Each second connection module 412 can be electrically connected to the bottom surface of a corresponding lug portion 220 through a plurality of second terminals protruding upward. As shown in the embodiment of FIG. 4, the first connection module 411 and the second connection module 412 are, for example, pogo pins.

[0038] In short, through the configuration and arrangement of the first lifting device and the bridge assembly, a short path from the chuck to the probe card is established by the bridge assembly, and a bridge path is formed between the test object and the probe card, thereby providing a short signal transmission path; and through the configuration of the first lifting device and the second lifting device, the chuck and the electrical connection device can be properly positioned within the wafer inspection apparatus, forming a configuration relationship that allows them to operate independently without interfering with each other, thereby ensuring the integrity and continuity of the test signal, and greatly improving compatibility with existing equipment.

[0039] The present invention has been disclosed in the above best embodiment, but as can be understood by those skilled in the art, this embodiment is merely used to explain the present invention and should not be understood as limiting the scope of the present invention. It should be noted that all modifications and replacements having the same effect as this embodiment are included in the scope of the present invention. Therefore, the protection scope of the present invention is subject to the definition of the claims. [Explanation of symbols]

[0040] 100 Bases 200 Chuck 210 Notch 220 Lug section 300 First lifting device 400 Bridge Assembly 410 Electrical connection device 411 First Connection Module 412 Second Connection Module 420 Second lifting device 500 Probe Card 510 Inspection and Measurement Department 520 Conductive Sheet 530 Substrate 600 Test subject 610 Inspected wafer 620 Career 700 Support device 710 Upright Post 720 Claw part Z 1st axis direction X 2nd axis direction Y 3rd axis direction

Claims

1. a base that is movable in a first axial direction and that lifts or lowers the device under test to bring the device under test into contact with or away from the probe card; a chuck made of a conductive material for selectively placing the object under test; a first lifting device disposed on the base, for supporting the chuck in contact with the base and for lifting or lowering the chuck in a first axial direction relative to the base; an electrical connection device including a first connection module and a second connection module electrically connected to each other; a second lifting device disposed on the base, abutting and supporting the electrical connection device, and used to bring the first connection module into contact with and separate from the probe card and bring the second connection module into contact with and separate from the chuck by lifting or lowering the electrical connection device in a first axial direction relative to the base; At least one bridge assembly comprising:

1. A wafer inspection apparatus comprising:

2. 2. The wafer inspection apparatus of claim 1, wherein a bridge path between the test object and the probe card is established when the first connection module contacts the probe card and the second connection module contacts the chuck.

3. 2. The wafer inspection apparatus according to claim 1, wherein the object to be inspected comprises a wafer to be inspected and a carrier for placing the wafer to be inspected.

4. 4. The wafer inspection apparatus of claim 3, wherein the carrier is a thin sheet of conductive material.

5. 2. The wafer inspection apparatus of claim 1, wherein the electrical connection device has a step on a top portion, the step having a higher portion and a lower portion relative to the higher portion, the first connection module is disposed on the higher portion and the second connection module is disposed on the lower portion, and when the second lifting device lifts the electrical connection device so that the second connection module can contact the lower surface of the chuck, the first connection module is located on the periphery of the chuck and protrudes from the upper surface of the chuck.

6. The wafer inspection apparatus according to any one of claims 1 to 5, wherein the chuck has at least one lug portion arranged on its periphery and formed to protrude therefrom, and a lower surface of the lug portion is used for contacting the second connection module.

7. 7. The wafer inspection apparatus of claim 6, wherein the chuck comprises a plurality of spaced apart lug portions, the number of the bridge assemblies corresponds to the number of the lug portions, each of the bridge assemblies corresponds to one of the lug portions, and the second connection module of each of the bridge assemblies contacts a corresponding lug portion after the electrical connection device is lifted by the second lifting device.

8. 8. The wafer inspection apparatus of claim 7, wherein each of the first connection modules is electrically connected to a conductive sheet at the bottom of the probe card via a plurality of first terminals protruding upward, and each of the second connection modules is electrically connected to the bottom surface of the corresponding lug portion via a plurality of second terminals protruding upward.

9. The wafer inspection apparatus of claim 8 , wherein the first terminal and each of the second terminals are pogo pins.

10. 7. The wafer inspection apparatus of claim 6, wherein the periphery of the chuck is provided with a plurality of notches, each of which is used for a claw portion of a corresponding support device to extend into, the support device is fixed to the base, and when the chuck is not yet in contact with the test object, the claw portions of the two support devices abut and support the test object, and when the first lifting device lifts or lowers the chuck relative to the base, the chuck comes into contact with or moves away from the test object.

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