Substrate processing apparatus

Abstract

To provide a substrate processing device which can exhaust a gas of a process housing properly.SOLUTION: A substrate processing device 1 includes a process housing 23A1, a holding part 31, and a liquid supply part 33. The holding part 31 is housed in the process housing 23A1. The holding part 31 holds a substrate W. The liquid supply part 33 is housed in the process housing 23A1. The liquid supply part 33 supplies a process liquid to the substrate W held by the holding part 31. The substrate processing device 1 includes exhaust pipes 41A, 42A. The exhaust pipes 41A, 42A are disposed at the side of the process housing 23A1. The exhaust pipes 41A, 42A discharge a gas. The substrate processing device 1 includes a switch mechanism 51A1. The switch mechanism 51A1 is disposed at the same height position as the process housing 23A1. The switch mechanism 51A1 switches an exhaust passage of the process housing 23A1 to one of the exhaust pipes 41A, 42A.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate. The substrate is, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (Electroluminescence), a substrate for an FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, or a substrate for a solar cell.

Background Art

[0002] Patent Document 1 discloses a substrate processing system. Hereinafter, the reference numerals described in Patent Document 1 are denoted in parentheses. The substrate processing system (1) includes a processing unit (16) for processing a wafer (W). The processing unit (16) includes a chamber (20), a substrate holding mechanism (30), and a processing fluid supply unit (40). The chamber (20) is a processing housing. The substrate holding mechanism (30) and the processing fluid supply unit (40) are installed inside the chamber (20). The substrate holding mechanism (30) holds the wafer (W). The processing fluid supply unit (40) supplies a processing fluid to the wafer (W) held by the substrate holding mechanism (30). The processing fluid is, for example, an alkaline processing solution, an acidic processing solution, or an organic processing solution.

[0003] The substrate processing system (1) includes a second exhaust pipe (200), an exhaust switching unit (300), and three individual exhaust pipes (101, 102, 103). The second exhaust pipe (200) connects the chamber (20) and the exhaust switching unit (300). The second exhaust pipe (200) includes a horizontal portion (201) and a rising portion (202). The horizontal portion (201) is connected to the chamber (20). The horizontal portion (201) extends horizontally from the chamber (20). The rising portion (202) extends upward from the horizontal portion (201). The rising portion (202) has an upper end. The upper end of the rising portion (202) is connected to the exhaust switching unit (300). The exhaust switching unit (300) is further connected to the three individual exhaust pipes (101, 102, 103). The exhaust switching unit (300) communicates the second exhaust pipe (200) with one of the three individual exhaust pipes (101, 102, 103). The gas in the chamber (20) flows into one of the three individual exhaust pipes (101, 102, 103) via the second exhaust pipe (200).

[0004] For example, when the processing fluid supply unit (40) supplies an alkaline processing liquid, the exhaust switching unit (300) communicates the second exhaust pipe (200) with the individual exhaust pipe (101). When the processing fluid supply unit (40) supplies an acidic processing liquid, the exhaust switching unit (300) communicates the second exhaust pipe (200) with the individual exhaust pipe (102). When the processing fluid supply unit (40) supplies an organic processing liquid, the exhaust switching unit (300) communicates the second exhaust pipe (200) with the individual exhaust pipe (103). As a result, when the alkaline processing liquid is used in the chamber (20), the individual exhaust pipe (101) discharges the gas in the chamber (20). When the acidic processing liquid is used in the chamber (20), the individual exhaust pipe (102) discharges the gas in the chamber (20). When the organic processing liquid is used in the chamber (20), the individual exhaust pipe (103) discharges the gas in the chamber (20).

[0005] The exhaust switching unit (300) is arranged at a position higher than that of the processing unit (16). The rising portion (202) of the second exhaust pipe (200) extends to a position higher than that of the processing unit (16). Therefore, it is difficult for the mist contained in the gas to rise through the rising portion (202). The mist is difficult to rise up to the exhaust switching unit (300). Thus, the exhaust switching unit (300) can be protected from the mist.

[0006] As described above, the exhaust switching unit (300) is arranged at a position higher than that of the processing unit (16). Therefore, the individual exhaust pipes (101, 102, 103) are also arranged at positions higher than that of the processing unit (16).

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] However, the coating development apparatus (1) disclosed in Patent Document 1 has the following problems. The chamber (20) and the exhaust switching unit (300) are connected by the second exhaust pipe (200). Since the exhaust switching unit (300) is arranged at a position higher than that of the processing unit (16), the second exhaust pipe (200) has a rising portion (202). Therefore, the second exhaust pipe (200) is relatively long.

[0009] The gas in the chamber (20) always flows through the second exhaust pipe (200). For example, even when any of an alkaline treatment liquid, an acidic treatment liquid, and an organic treatment liquid is used in the chamber (20), the second exhaust pipe (200) discharges the gas in the chamber (20).

[0010] Thus, since the second exhaust pipe (200) is relatively long and discharges various gases, the second exhaust pipe (200) is likely to be fouled. For example, crystals (salts) are likely to form inside the second exhaust pipe (200). For example, the crystals are likely to accumulate inside the second exhaust pipe (200).

[0011] When the second exhaust pipe (200) is fouled, the gas does not flow smoothly through the second exhaust pipe (200). That is, the second exhaust pipe (200) cannot smoothly discharge the gas in the chamber (20). Therefore, it is necessary to periodically maintain the second exhaust pipe (200). The maintenance of the second exhaust pipe (200) is, for example, cleaning the second exhaust pipe (200) or replacing the second exhaust pipe (200).

[0012] When maintaining the second exhaust pipe (200), the processing unit (16) cannot process the wafer (W). When maintaining the second exhaust pipe (200), the substrate processing system (1) stops processing the wafer (W). Therefore, the throughput of the substrate processing system (1) decreases.

[0013] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate processing apparatus that can appropriately exhaust the gas in the processing housing.

Means for Solving the Problems

[0014] In order to achieve such an object, the present invention has the following configuration. That is, the present invention is a substrate processing apparatus, including a first processing housing, a first holding unit installed inside the first processing housing for holding a substrate, a first liquid supply unit installed inside the first processing housing for supplying a processing liquid to the substrate held by the first holding unit, a first exhaust pipe installed on the side of the first processing housing for discharging gas, a second exhaust pipe installed on the side of the first processing housing for discharging gas, and a first switching mechanism disposed at the same height position as the first processing housing for switching the exhaust path of the first processing housing to one of the first exhaust pipe and the second exhaust pipe.

[0015] The substrate processing apparatus includes a first processing housing, a first holding unit, and a first liquid supply unit. The substrate processing apparatus supplies a processing liquid to the substrate inside the first processing housing. That is, the substrate processing apparatus performs liquid processing on the substrate inside the first processing housing.

[0016] The substrate processing apparatus includes a first exhaust pipe, a second exhaust pipe, and a first switching mechanism. The first switching mechanism switches the exhaust path of the first processing housing to one of the first exhaust pipe and the second exhaust pipe. Specifically, the first switching mechanism switches between a state in which the first processing housing is communicated with the first exhaust pipe and the first processing housing is blocked from the second exhaust pipe, and a state in which the first processing housing is communicated with the second exhaust pipe and the first processing housing is blocked from the first exhaust pipe. When the exhaust path of the first processing housing is the first exhaust pipe, the first exhaust pipe discharges gas from the first processing housing, and the second exhaust pipe does not discharge gas from the first processing housing. When the exhaust path of the first processing housing is the second exhaust pipe, the second exhaust pipe discharges gas from the first processing housing, and the second exhaust pipe does not discharge gas from the first processing housing.

[0017] The first switching mechanism is disposed at the same height position as the first processing housing. Therefore, the flow path between the first processing housing and the first switching mechanism can be preferably shortened. Thus, it is preferably possible to suppress the flow path between the first processing housing and the first switching mechanism from being contaminated. Therefore, gas smoothly flows from the first processing housing to the first switching mechanism. As a result, the gas in the first processing housing can be appropriately exhausted.

[0018] The first exhaust pipe is disposed on the side of the first processing housing. Therefore, the first switching mechanism can be easily connected to the first exhaust pipe. The second exhaust pipe is disposed on the side of the first processing housing. Therefore, the first switching mechanism can be easily connected to the second exhaust pipe.

[0019] As described above, the present substrate processing apparatus can appropriately exhaust the gas in the first processing housing.

[0020] In the above-described substrate processing apparatus, it is preferable that the first switching mechanism is disposed at a position equal to or lower than the upper end of the first holding portion. The size of the first switching mechanism is relatively small. Therefore, an increase in the size of the substrate processing apparatus can be suitably suppressed.

[0021] In the above-described substrate processing apparatus, it is preferable that the first switching mechanism is disposed at a position that does not overlap the first holding portion in a plan view. Interference between the first switching mechanism and the first holding portion can be easily avoided.

[0022] In the above-described substrate processing apparatus, it is preferable that the first exhaust pipe extends in the vertical direction and the second exhaust pipe extends in the vertical direction. The installation space for the first exhaust pipe and the second exhaust pipe in a plan view can be suitably reduced.

[0023] In the above-described substrate processing apparatus, the substrate processing apparatus includes a transfer space that extends in a horizontal first direction and is adjacent to the first processing housing, a transfer mechanism that is installed in the transfer space and transfers a substrate to the first holding portion, and a first piping space that is adjacent to the first processing housing and houses the first exhaust pipe and the second exhaust pipe. It is preferable that the first processing housing and the first piping space are arranged in the first direction, and the first exhaust pipe and the second exhaust pipe are arranged orthogonal to the first direction and in a horizontal second direction. The substrate processing apparatus includes a transfer space and a transfer mechanism. The transfer space is adjacent to the first processing housing. Therefore, the transfer mechanism can easily transfer the substrate to the first holding portion. The substrate processing apparatus includes a first piping space. Thus, the first exhaust pipe and the second exhaust pipe can be suitably installed. The first piping space is adjacent to the first processing housing. Therefore, the first exhaust pipe and the second exhaust pipe can be installed in the vicinity of the first processing housing. The transfer space extends in the first direction. The first processing housing and the first piping space are arranged in the first direction. Therefore, the transfer space adjacent to the first processing housing and the first piping space adjacent to the first processing housing can be suitably arranged respectively. Thus, it is possible to suitably prevent the transfer mechanism from interfering with the first exhaust pipe and the second exhaust pipe. The first piping space and the first processing housing are arranged in the first direction. The first exhaust pipe and the second exhaust pipe are arranged in the second direction. Therefore, the first exhaust pipe and the second exhaust pipe can be installed in the vicinity of the first processing housing respectively.

[0024] In the above-described substrate processing apparatus, it is preferable that at least a part of the first switching mechanism is installed in the first piping space. The first switching mechanism can be installed in the vicinity of the first processing housing.

[0025] In the above-described substrate processing apparatus, it is preferable that the first switching mechanism includes a first opening / closing portion movable between a position where the first processing housing communicates with the first exhaust pipe and a position where the first processing housing is blocked from the first exhaust pipe, and a second opening / closing portion, independent of the first opening / closing portion, movable between a position where the first processing housing communicates with the second exhaust pipe and a position where the first processing housing is blocked from the second exhaust pipe. The first opening / closing portion and the second opening / closing portion are movable independently of each other. Therefore, the first switching mechanism can individually communicate the first exhaust pipe and the second exhaust pipe with the first processing housing. The switching mechanism can individually block the first exhaust pipe and the second exhaust pipe from the first processing housing.

[0026] In the above-described substrate processing apparatus, it is preferable that the first switching mechanism includes a switching housing connected to the first processing housing and accommodating the first opening / closing portion and the second opening / closing portion. The switching housing can preferably form a flow path from the first processing housing to the first opening / closing portion and the second opening / closing portion.

[0027] In the substrate processing apparatus described above, the switching housing is connected to the first processing housing, and includes an introduction portion extending in the first direction and a distribution portion connected to the introduction portion, extending in the second direction, connected to both the first exhaust pipe and the second exhaust pipe, and accommodating both the first opening / closing portion and the second opening / closing portion, which is preferable. The introduction portion is connected to the first processing housing. Therefore, gas can be easily introduced from the first processing housing into the switching housing. The introduction portion extends in the first direction. As described above, the transfer space extends in the first direction. Therefore, the transfer space adjacent to the first processing housing and the introduction portion connected to the first processing housing can be suitably arranged. Thus, it is possible to suitably prevent the transfer mechanism from interfering with the introduction portion. The distribution portion is connected to the introduction portion. The distribution portion is connected to the first exhaust pipe and the second exhaust pipe. Therefore, gas can be easily discharged from the switching housing to the first exhaust pipe and the second exhaust pipe. The distribution portion accommodates both the first opening / closing portion and the second opening / closing portion. Thus, the first switching mechanism can easily switch the exhaust path of the first processing housing between the first exhaust pipe and the second exhaust pipe. The distribution portion extends in the second direction. As described above, the first exhaust pipe and the second exhaust pipe are arranged side by side in the second direction. Therefore, the distribution portion can be easily connected to the first exhaust pipe and the second exhaust pipe.

[0028] In the substrate processing apparatus described above, in a plan view, it is preferable that the separation distance between the introduction portion and the transfer space is smaller than the separation distance between the first holding portion and the transfer space. The introduction portion is arranged at a position relatively close to the transfer space. Therefore, gas can be smoothly introduced from the first processing housing into the switching housing.

[0029] In the above-described substrate processing apparatus, the substrate processing apparatus includes an air supply pipe that supplies gas to the first processing housing, and a second pipe space that is adjacent to the first processing housing and houses the air supply pipe. Preferably, the first pipe space, the first processing housing, and the second pipe space are arranged in this order in the first direction. The substrate processing apparatus includes an air supply pipe and a second pipe space. The second pipe space is adjacent to the first processing housing. Therefore, the air supply pipe can easily supply gas to the first processing housing. The first pipe space, the first processing housing, and the second pipe space are arranged in the first direction in this order. For this reason, the first pipe space and the second pipe space are separated by the first processing housing. Therefore, the arrangement of the first exhaust pipe and the second exhaust pipe is not restricted by the air supply pipe. That is, the degree of freedom in the arrangement of the first exhaust pipe and the second exhaust pipe can be suitably increased.

[0030] In the above-described substrate processing apparatus, the substrate processing apparatus preferably includes a second processing housing disposed below the first processing housing, a second holding unit installed inside the second processing housing for holding a substrate, a second liquid supply unit installed inside the second processing housing for supplying a processing liquid to the substrate held by the second holding unit, and a second switching mechanism disposed at the same height position as the second processing housing for switching the exhaust path of the second processing housing to one of the first exhaust pipe and the second exhaust pipe.

[0031] The substrate processing apparatus includes a second processing housing, a second holding unit, and a second liquid supply unit. Therefore, liquid processing can be performed on the substrate inside the second processing housing. Thus, the throughput of the substrate processing apparatus can be suitably improved.

[0032] The second processing housing is disposed below the first processing housing. Therefore, an increase in the footprint of the substrate processing apparatus can be suitably suppressed.

[0033] The substrate processing apparatus includes a second switching mechanism. The second switching mechanism switches the exhaust path of the second processing housing to one of a first exhaust pipe and a second exhaust pipe. Specifically, the second switching mechanism switches between a state in which the second processing housing is communicated with the first exhaust pipe and the second processing housing is blocked from the second exhaust pipe, and a state in which the second processing housing is communicated with the second exhaust pipe and the second processing housing is blocked from the first exhaust pipe. When the exhaust path of the second processing housing is the first exhaust pipe, the first exhaust pipe discharges gas from the second processing housing, and the second exhaust pipe does not discharge gas from the second processing housing. When the exhaust path of the second processing housing is the second exhaust pipe, the second exhaust pipe discharges gas from the second processing housing, and the first exhaust pipe does not discharge gas from the second processing housing. Therefore, the first exhaust pipe discharges the gas of the second processing housing in addition to the gas of the first processing housing. The second exhaust pipe also discharges the gas of the second processing housing in addition to the gas of the first processing housing. Thus, the structure of the substrate processing apparatus can be simplified.

[0034] The second switching mechanism is disposed at the same height position as the second processing housing. For this reason, the flow path between the second processing housing and the second switching mechanism can be suitably shortened. Thus, it is possible to suitably suppress the flow path between the second processing housing and the second switching mechanism from being contaminated. Therefore, the gas smoothly flows from the second processing housing to the second switching mechanism. As a result, the gas in the second processing housing can be appropriately exhausted.

[0035] As described above, the present substrate processing apparatus can appropriately exhaust the gas of the second processing housing in addition to the gas of the first processing housing.

[0036] In the above-described substrate processing apparatus, it is preferable that the second processing housing is arranged at the same position as the first processing housing in a plan view, the second switching mechanism is arranged at the same position as the first switching mechanism in a plan view, the first exhaust pipe extends in the vertical direction, and the second exhaust pipe extends in the vertical direction. The second processing housing is arranged at the same position as the first processing housing in a plan view. The second switching mechanism is arranged at the same position as the first switching mechanism in a plan view. Therefore, the relative positions of the second processing housing and the second switching mechanism are substantially the same as the relative positions of the first processing housing and the first switching mechanism. Thus, the conditions for discharging gas can be easily made equal between the first processing housing and the second processing housing. As a result, the quality of the processing performed on the substrate can be suitably made equal between the first processing housing and the second processing housing. The first exhaust pipe extends in the vertical direction. Therefore, the first switching mechanism and the second switching mechanism can each be easily connected to the first exhaust pipe. The second exhaust pipe extends in the vertical direction. Therefore, the first switching mechanism and the second switching mechanism can each be easily connected to the second exhaust pipe.

[0037] In the above-described substrate processing apparatus, the substrate processing apparatus preferably includes a third processing housing arranged at the same height position as the first processing housing, a third holding portion installed inside the third processing housing for holding a substrate, a third liquid supply portion installed inside the third processing housing for supplying a processing liquid to the substrate held by the third holding portion, a third exhaust pipe installed on the side of the third processing housing for discharging gas, a fourth exhaust pipe installed on the side of the third processing housing for discharging gas, and a third switching mechanism arranged at the same height position as the third processing housing for switching the exhaust path of the third processing housing to one of the third exhaust pipe and the fourth exhaust pipe.

[0038] The substrate processing apparatus includes a third processing housing, a third holding portion, and a third liquid supply portion. Therefore, liquid processing can be performed on the substrate inside the third processing housing. Thus, the throughput of the substrate processing apparatus can be suitably improved.

[0039] The third processing housing is arranged at the same height position as the first processing housing. The substrate processing apparatus includes a third switching mechanism, a third exhaust pipe, and a fourth exhaust pipe. The third switching mechanism switches the exhaust path of the third processing housing to one of the third exhaust pipe and the fourth exhaust pipe. Specifically, the third switching mechanism switches between a state in which the third processing housing is communicated with the third exhaust pipe and the third processing housing is blocked from the fourth exhaust pipe, and a state in which the third processing housing is communicated with the fourth exhaust pipe and the third processing housing is blocked from the third exhaust pipe. When the exhaust path of the third processing housing is the third exhaust pipe, the third exhaust pipe discharges gas from the third processing housing, and the fourth exhaust pipe does not discharge gas from the third processing housing. When the exhaust path of the third processing housing is the fourth exhaust pipe, the fourth exhaust pipe discharges gas from the third processing housing, and the third exhaust pipe does not discharge gas from the third processing housing.

[0040] The third switching mechanism is arranged at the same height position as the third processing housing. Therefore, the flow path between the third processing housing and the third switching mechanism can be suitably shortened. Thus, it is possible to suitably suppress the flow path between the third processing housing and the third switching mechanism from being fouled. Therefore, gas smoothly flows from the third processing housing to the third switching mechanism. As a result, the gas in the third processing housing can be appropriately exhausted.

[0041] The third exhaust pipe is arranged on the side of the third processing housing. Therefore, the third switching mechanism can be easily connected to the third exhaust pipe. The fourth exhaust pipe is arranged on the side of the third processing housing. Therefore, the third switching mechanism can be easily connected to the fourth exhaust pipe.

[0042] As described above, the present substrate processing apparatus can appropriately exhaust the gas in the third processing housing.

[0043] In the above-described substrate processing apparatus, the substrate processing apparatus preferably includes a first pressure sensor that measures the pressure of the gas on the primary side of the first switching mechanism, a first pressure adjustment mechanism that adjusts the pressure of the gas on the primary side of the first switching mechanism based on the detection result of the first pressure sensor, a third pressure sensor that measures the pressure of the gas on the primary side of the third switching mechanism, and a third pressure adjustment mechanism that adjusts the pressure of the gas on the primary side of the third switching mechanism based on the detection result of the third pressure sensor. The substrate processing apparatus includes the first pressure sensor and the first pressure adjustment mechanism. Therefore, the pressure on the primary side of the first switching mechanism can be suitably adjusted. Similarly, the substrate processing apparatus includes the third pressure sensor and the third pressure adjustment mechanism. Therefore, the pressure on the primary side of the third switching mechanism can be suitably adjusted.

[0044] In the above-described substrate processing apparatus, it is preferable that the first pressure adjustment mechanism and the third pressure adjustment mechanism equalize the pressure of the gas on the primary side of the first switching mechanism and the pressure of the gas on the primary side of the third switching mechanism. The quality of the processing performed on the substrate can be suitably equalized between the first processing housing and the third processing housing.

[0045] In the above-described substrate processing apparatus, the substrate processing apparatus preferably includes a fifth exhaust pipe connected to the first exhaust pipe and the third exhaust pipe for discharging the gas in the first exhaust pipe and the gas in the third exhaust pipe, and a sixth exhaust pipe connected to the second exhaust pipe and the fourth exhaust pipe for discharging the gas in the second exhaust pipe and the gas in the fourth exhaust pipe. The structure of the substrate processing apparatus can be simplified.

[0046] In the substrate processing apparatus described above, the substrate processing apparatus preferably includes a fifth pressure sensor that measures the pressure of the gas inside the fifth exhaust pipe, a fifth pressure adjustment mechanism that adjusts the pressure of the gas inside the fifth exhaust pipe based on the detection result of the fifth pressure sensor, a sixth pressure sensor that measures the pressure of the gas inside the sixth exhaust pipe, and a sixth pressure adjustment mechanism that adjusts the pressure of the gas inside the sixth exhaust pipe based on the detection result of the sixth pressure sensor. The substrate processing apparatus includes a fifth pressure sensor and a fifth switching mechanism. Therefore, the pressure inside the fifth exhaust pipe can be suitably adjusted. Similarly, the substrate processing apparatus includes a sixth pressure sensor and a sixth switching mechanism. Therefore, the pressure inside the sixth exhaust pipe can be suitably adjusted.

[0047] In the substrate processing apparatus described above, the fifth pressure sensor is preferably installed downstream of the connection position between the first exhaust pipe and the fifth exhaust pipe and the connection position between the third exhaust pipe and the fifth exhaust pipe, and the sixth pressure sensor is preferably installed downstream of the connection position between the second exhaust pipe and the sixth exhaust pipe and the connection position between the fourth exhaust pipe and the sixth exhaust pipe. The fifth pressure sensor can suitably detect the overall exhaust pressure of the first exhaust pipe and the third exhaust pipe. The sixth pressure sensor can appropriately detect the overall exhaust pressure of the second exhaust pipe and the fourth exhaust pipe.

[0048] In the substrate processing apparatus described above, the first liquid supply unit can supply a first processing liquid and a second processing liquid. When the first liquid supply unit supplies the first processing liquid, the first switching mechanism switches the discharge path of the first processing housing to the first exhaust pipe. When the first liquid supply unit supplies the second processing liquid, it is preferable that the first switching mechanism switches the discharge path of the first processing housing to the second exhaust pipe. When the first liquid supply unit supplies the first processing liquid, the first exhaust pipe discharges the gas of the first processing housing. When the first liquid supply unit supplies the second processing liquid, the first exhaust pipe does not discharge the gas of the first processing housing. Therefore, it is possible to suitably suppress the inside of the first exhaust pipe from being contaminated. Similarly, when the first liquid supply unit supplies the second processing liquid, the second exhaust pipe discharges the gas of the first processing housing. When the first liquid supply unit supplies the first processing liquid, the second exhaust pipe does not discharge the gas of the first processing housing. Therefore, it is possible to suitably suppress the inside of the second exhaust pipe from being contaminated. As a result, the gas in the first processing housing can be exhausted more appropriately.

Advantages of the Invention

[0049] According to the substrate processing apparatus of the present invention, the gas in the processing housing can be exhausted appropriately.

Brief Description of the Drawings

[0050]

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Embodiments for Carrying Out the Invention

[0051] Hereinafter, the substrate processing apparatus of the present invention will be described with reference to the drawings.

[0052] <Outline of the Substrate Processing Apparatus> Figure 1 is a plan view showing the inside of the substrate processing apparatus according to the embodiment. The substrate processing apparatus 1 performs processing on a substrate (for example, a semiconductor wafer) W.

[0053] The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (Electroluminescence), a substrate for an FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, or a substrate for a solar cell. The substrate W has a thin flat plate shape. The substrate W has a substantially circular shape in plan view.

[0054] The substrate processing apparatus 1 includes an indexer unit 3 and a processing block 11. The processing block 11 is connected to the indexer unit 3. The indexer unit 3 and the processing block 11 are arranged side by side in the horizontal direction. The indexer unit 3 supplies the substrate W to the processing block 11. The processing block 11 performs processing on the substrate W. The indexer unit 3 recovers the substrate W from the processing block 11.

[0055] In this specification, for convenience, the horizontal direction in which the indexer unit 3 and the processing block 11 are arranged is referred to as the "front-rear direction X". Among the front-rear direction X, the direction from the processing block 11 toward the indexer unit 3 is referred to as "front". The direction opposite to the front is referred to as "rear". The horizontal direction orthogonal to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as "right". The direction opposite to the right is referred to as "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, for reference, front, rear, right, left, up, and down are appropriately shown.

[0056] When "front", "rear", "right", and "left" are not particularly distinguished, they are referred to as "side".

[0057] The indexer unit 3 includes a plurality (for example, four) of carrier placement units 4. The carrier placement units 4 are arranged side by side in the width direction Y. Each carrier placement unit 4 places one carrier C. The carrier C accommodates a plurality of substrates W. The carrier C is, for example, a FOUP (front opening unified pod).

[0058] The indexer unit 3 includes a conveyance space 5. The conveyance space 5 is arranged behind the carrier placement unit 4. The conveyance space 5 extends in the width direction Y.

[0059] The indexer unit 3 includes a conveyance mechanism 6. The conveyance mechanism 6 is installed in the conveyance space 5. The conveyance mechanism 6 is arranged behind the carrier placement unit 4. The conveyance mechanism 6 conveys the substrate W. The conveyance mechanism 6 can access the carrier C placed on the carrier placement unit 4.

[0060] The processing block 11 includes a conveyance space 12A. The conveyance space 12A is arranged at the central portion of the processing block 11 in the width direction Y. The conveyance space 12A extends in the front-rear direction X. The front portion of the conveyance space 12A is connected to the conveyance space 5 of the indexer unit 3.

[0061] The processing block 11 includes a substrate placement unit 14A. The substrate placement unit 14A is installed in the conveyance space 12A. The substrate placement unit 14A is arranged at the front portion of the conveyance space 12A. The conveyance mechanism 6 of the indexer unit 3 can also access the substrate placement unit 14A. The substrate placement unit 14A places the substrate W.

[0062] The processing block 11 includes a conveyance mechanism 16A. The conveyance mechanism 16A is installed in the conveyance space 12A. The conveyance mechanism 16A conveys the substrate W. The conveyance mechanism 16A can access the substrate placement unit 14A.

[0063] The processing block 11 includes processing units 21A1, 21B1, 21C1, and 21D1. The processing units 21A1 and 21B1 are arranged on the right side of the conveyance space 12A. The processing units 21A1 and 21B1 are arranged side by side in the front-rear direction X. The processing unit 21B1 is arranged behind the processing unit 21A1. The processing units 21C1 and 21D1 are arranged on the left side of the conveyance space 12A. The processing units 21C1 and 21D1 are arranged side by side in the front-rear direction X. The processing unit 21D1 is arranged behind the processing unit 21C1.

[0064] When not distinguishing the processing units 21A1, 21B1, 21C1, and 21D1, they are called the processing unit 21. Each processing unit 21 performs processing on the substrate W. The processing performed by each processing unit 21 is the same.

[0065] The structure of the processing unit 21 will be briefly described. Each processing unit 21 includes a processing housing 23.

[0066] Each processing unit 21 includes a holding unit 31. The holding unit 31 is installed inside the processing housing 23. The holding unit 31 holds the substrate W. FIG. 1 shows the substrate W held by the holding unit 31 with a dashed line.

[0067] The processing unit 21 includes a liquid supply unit 33. The liquid supply unit 33 is installed inside the processing housing 23. The liquid supply unit 33 supplies a processing liquid to the substrate W held by the holding unit 31.

[0068] The transfer mechanism 16A is accessible to each processing unit 21. Specifically, the transfer mechanism 16A is accessible to the holding unit 31 of each processing unit 21.

[0069] Hereinafter, the processing housing 23 of the processing unit 21A1 will be appropriately referred to as the processing housing 23A1. Similarly, the processing housings 23 of the processing units 21B1, 21C1, and 21D1 will be appropriately referred to as the processing housings 23B1, 23C1, and 23D1. The processing housings 23A1, 23B1, 23C1, and 23D1 are arranged at the same height position.

[0070] The processing block 11 includes exhaust pipes 41A, 42A, and 43A. All of the exhaust pipes 41A, 42A, and 43A are installed outside the processing housing 23. The exhaust pipes 41A - 43A are respectively installed on the side of the processing housing 23A1. The exhaust pipes 41A - 43A respectively pass through the side positions of the processing housing 23A1. The exhaust pipes 41A - 43A respectively discharge gas. The exhaust pipes 41A - 43A are not communicated with each other. The exhaust pipes 41A - 43A respectively have exhaust paths separated from each other.

[0071] Similarly, the processing block 11 includes exhaust pipes 41B - 43B, 41C - 43C, and 41D - 43D. The exhaust pipes 41B - 43B, 41C - 43C, and 41D - 43D are respectively installed on the sides of the processing casings 23B1, 23C1, and 23D1. The exhaust pipes 41B - 43B, 41C - 43C, and 41D - 43D each discharge gas.

[0072] The processing block 11 includes switching mechanisms 51A1, 51B1, 51C1, and 51D1. The switching mechanism 51A1 is arranged at a position substantially the same height as the processing casing 23A1. Similarly, the switching mechanisms 51B1, 51C1, and 51D1 are respectively arranged at positions substantially the same height as the processing casings 23B1, 23C1, and 23D1.

[0073] The switching mechanism 51A1 switches the exhaust path of the processing casing 23A1 to one of the exhaust pipes 41A - 43A. The switching mechanism 51A1 switches the exhaust path of the gas from the processing casing 23A1 among the exhaust pipes 41A - 43A.

[0074] Specifically, the switching mechanism 51A1 switches to a first state, a second state, and a third state. In the first state, the switching mechanism 51A1 connects the processing casing 23A1 to the exhaust pipe 41A and blocks the processing casing 23A1 from the exhaust pipes 42A and 43A. In the second state, the switching mechanism 51A1 connects the processing casing 23A1 to the exhaust pipe 42A and blocks the processing casing 23A1 from the exhaust pipes 41A and 43A. In the third state, the switching mechanism 51A1 connects the processing casing 23A1 to the exhaust pipe 43A and blocks the processing casing 23A1 from the exhaust pipes 41A and 42A. Thus, the switching mechanism 51A1 is configured to individually connect the exhaust pipes 41A - 43A to the processing casing 23A1 and individually block the exhaust pipes 41A - 43A from the processing casing 23A1.

[0075] Similarly, the switching mechanism 51B1 switches the discharge path of the processing housing 23B1 to one of the exhaust pipes 41B - 43B. The switching mechanism 51C1 switches the discharge path of the processing housing 23C1 to one of the exhaust pipes 41C - 43C. The switching mechanism 51D1 switches the discharge path of the processing housing 23D1 to one of the exhaust pipes 41D - 43D.

[0076] In FIG. 1, the switching mechanism 51A1 switches the exhaust path of the processing housing 23A1 to the exhaust pipe 41A. The switching mechanism 51B1 switches the exhaust path of the processing housing 23B1 to the exhaust pipe 41B. The switching mechanism 51C1 switches the exhaust path of the processing housing 23C1 to the exhaust pipe 42C. The switching mechanism 51D1 switches the exhaust path of the processing housing 23D1 to the exhaust pipe 43D.

[0077] Specifically, the switching mechanism 51A1 connects the processing housing 23A1 to the exhaust pipe 41A and blocks the processing housing 23A1 from the exhaust pipes 42A and 43A. The exhaust pipe 41A discharges gas from the processing housing 23A1. The exhaust pipes 42A and 43A do not discharge gas from the processing housing 23A1.

[0078] The switching mechanism 51B1 connects the processing housing 23B1 to the exhaust pipe 41B and blocks the processing housing 23B1 from the exhaust pipes 42B and 43B. The exhaust pipe 41B discharges gas from the processing housing 23B1. The exhaust pipes 42B and 43B do not discharge gas from the processing housing 23B1.

[0079] The switching mechanism 51C1 connects the processing housing 23C1 to the exhaust pipe 42C and blocks the processing housing 23C1 from the exhaust pipes 41C and 43C. The exhaust pipe 42C discharges gas from the processing housing 23C1. The exhaust pipes 41C and 43C do not discharge gas from the processing housing 23C1.

[0080] The switching mechanism 51D1 connects the processing housing 23D1 to the exhaust pipe 43D and blocks the processing housing 23D1 from the exhaust pipes 41D and 42D. The exhaust pipe 43D discharges gas from the processing housing 23D1. The exhaust pipes 41D and 42D do not discharge gas from the processing housing 23D1.

[0081] Here, the processing housing 23A1 is an example of the first processing housing in the present invention. The holding part 31 of the processing unit 21A1 is an example of the first holding part in the present invention. The liquid supply part 33 of the processing unit 21A1 is an example of the first liquid supply part in the present invention. The exhaust pipe 41A is an example of the first exhaust pipe in the present invention. The exhaust pipe 42A is an example of the second exhaust pipe in the present invention. The switching mechanism 51A1 is an example of the first switching mechanism in the present invention.

[0082] The processing housing 23B1 is an example of the third processing housing in the present invention. The holding part 31 of the processing unit 21B1 is an example of the third holding part in the present invention. The liquid supply part 33 of the processing unit 21B1 is an example of the third liquid supply part in the present invention. The exhaust pipe 41B is an example of the third exhaust pipe in the present invention. The exhaust pipe 42B is an example of the fourth exhaust pipe in the present invention. The switching mechanism 51B1 is an example of the third switching mechanism in the present invention.

[0083] The substrate processing apparatus 1 operates as follows, for example. The transfer mechanism 6 transfers the substrate W from the carrier C on the carrier placement part 4 to the substrate placement part 14A. The transfer mechanism 16A transfers the substrate W from the substrate placement part 14A to the processing unit 21. Specifically, the transfer mechanism 16A places the substrate W on the holding part 31. The processing unit 21 performs liquid processing on the substrate W inside the processing housing 23. Each processing unit 21 processes one substrate W at a time. Specifically, the liquid supply part 33 supplies the processing liquid to the substrate W held by the holding part 31. After the substrate W is processed, the transfer mechanism 16A transfers the substrate W from the processing unit 21 to the substrate placement part 14A. The transfer mechanism 6 transfers the substrate W from the substrate placement part 14A to the carrier C on the carrier placement part 4.

[0084] When one processing unit 21 processes the substrate W, another processing unit 21 may process another substrate W. The number of processing units 21 to which each substrate W is transferred is, for example, one.

[0085] When processing the substrate W inside the processing housing 23, the switching mechanism 51 switches the exhaust path of the processing housing 23. For example, when processing the substrate W, the switching mechanism 51A1 switches the exhaust path one or more times. For example, the period of processing one substrate W in one processing housing 23 may include two or more of a first period, a second period, and a third period. Here, the first period is a period in which the first exhaust pipe exhausts the gas of the processing housing 23. The second period is a period in which the second exhaust pipe exhausts the gas of the processing housing 23. The third period is a period in which the third exhaust pipe exhausts the gas of the processing housing 23.

[0086] According to the above-described substrate processing apparatus 1, the following effects can be obtained. That is, the switching mechanism 51A1 is disposed at substantially the same height position as the processing housing 23A1. Therefore, the flow path between the processing housing 23A1 and the switching mechanism 51A1 can be preferably shortened.

[0087] Furthermore, the processing housing 23A1 and the switching mechanism 51A1 are connected without passing through a pipe. Therefore, the flow path between the processing housing 23A1 and the switching mechanism 51A1 can be preferably shortened.

[0088] Since the flow path between the processing housing 23A1 and the switching mechanism 51A1 can be preferably shortened, it is possible to preferably suppress the flow path between the processing housing 23A1 and the switching mechanism 51A1 from being contaminated. Therefore, the gas smoothly flows from the processing housing 23A1 to the switching mechanism 51A1. As a result, the gas in the processing housing 23A1 can be appropriately exhausted.

[0089] Incidentally, the switching timing is determined by, for example, the gas change timing and the delay time. Here, the switching timing is the timing at which the switching mechanism 51 switches the discharge path. The gas change timing is the timing at which the components of the gas in the processing housing 23 change. The delay time is the time required for the gas to reach the switching mechanism 51 from the processing housing 23. The shorter the flow path between the processing housing 23 and the switching mechanism 51, the shorter the delay time. The shorter the flow path between the processing housing 23 and the switching mechanism 51, the smaller the variation in the delay time. As described above, according to the substrate processing apparatus 1, the flow path between the processing housing 23A1 and the switching mechanism 51A1 can be preferably shortened. Therefore, the delay time can be preferably shortened. Further, the variation in the delay time can be preferably suppressed. Thus, the switching timing can be accurately determined. Therefore, the switching mechanism 51A1 can switch the discharge path of the processing housing 23A1 at an accurate timing.

[0090] Since the switching mechanism 51A1 is disposed at substantially the same height position as the processing housing 23A1, the flow path between the processing housing 23A1 and the switching mechanism 51A1 extends in a substantially horizontal direction. Therefore, the gas flows more smoothly from the processing housing 23A1 to the switching mechanism 51A1. As a result, the gas in the processing housing 23A1 can be exhausted more appropriately.

[0091] Similarly, the switching mechanisms 51B1, 51C1, and 51D1 are respectively disposed at substantially the same height positions as the processing housings 23B1, 23C1, and 23D1. Therefore, the gas in the processing housings 23A1, 23C1, and 23D1 can be exhausted appropriately.

[0092] The exhaust pipe 41A is disposed on the side of the processing housing 23A1. Therefore, the switching mechanism 51A1 can be easily connected to the exhaust pipe 41A. The exhaust pipes 42A and 43A are also disposed on the side of the processing housing 23A1. Therefore, the switching mechanism 51A1 can be easily connected to the exhaust pipes 42A and 43A.

[0093] Similarly, the exhaust pipes 41B - 43B are arranged on the side of the processing housing 23B1. Therefore, the switching mechanism 51B1 can be easily connected to the exhaust pipes 41B - 43B. The exhaust pipes 41C - 43C are arranged on the side of the processing housing 23C1. Therefore, the switching mechanism 51C1 can be easily connected to the exhaust pipes 41C - 43C. The exhaust pipes 41D - 43D are arranged on the side of the processing housing 23D1. Therefore, the switching mechanism 51D1 can be easily connected to the exhaust pipes 41D - 43D.

[0094] Hereinafter, the structure of the substrate processing apparatus 1 will be described in more detail.

[0095] <Indexer unit 3> Refer to FIGS. 1 and 2. FIG. 2 is a right side view showing the configuration of the central portion of the substrate processing apparatus 1 in the width direction Y. The structure of the transfer mechanism 6 will be described. The transfer mechanism 6 includes a hand 7 and a hand drive unit 8. The hand 7 supports one substrate W in a horizontal posture. The hand drive unit 8 is connected to the hand 7. The hand drive unit 8 moves the hand 7. The hand drive unit 8 moves the hand 7 in the front - rear direction X, the width direction Y, and the vertical direction Z.

[0096] The structure of the hand drive unit 8 is illustrated. The hand drive unit 8 includes, for example, a rail 8a, a horizontal movement unit 8b, a vertical movement unit 8c, a rotation unit 8d, and a forward and backward movement unit 8e. The rail 8a is fixedly installed. The rail 8a is disposed at the bottom of the conveyance space 5. The rail 8a extends in the width direction Y. The horizontal movement unit 8b is supported by the rail 8a. The horizontal movement unit 8b moves in the width direction Y with respect to the rail 8a. The vertical movement unit 8c is supported by the horizontal movement unit 8b. The vertical movement unit 8c moves in the vertical direction Z with respect to the horizontal movement unit 8b. The rotation unit 8d is supported by the vertical movement unit 8c. The rotation unit 8d rotates with respect to the vertical movement unit 8c. The rotation unit 8d rotates around a rotation axis parallel to the vertical direction Z. The forward and backward movement unit 8e moves with respect to the rotation unit 8d. The forward and backward movement unit 8e reciprocates in a horizontal one direction determined by the direction of the rotation unit 8d. The forward and backward movement unit 8e is connected to the hand 7. Since the hand drive unit 8 has such a configuration, the hand 7 can move parallel to the vertical direction Z. The hand 7 can move parallel in any horizontal direction. The hand 7 can rotate within a horizontal plane.

[0097] <Overview of Processing Block 11> Refer to FIGS. 2 and 3. FIG. 3 is a front view of the processing block 11. In FIG. 3, illustration of the substrate placement unit 14A and the like is omitted. The processing block 11 includes a conveyance space 12B in addition to the conveyance space 12A. The conveyance space 12B is disposed below the conveyance space 12A. The conveyance space 12B is also connected to the conveyance space 5 of the indexer unit 3. Although illustration is omitted, the conveyance space 12B is disposed at the same position as the conveyance space 12A in a plan view.

[0098] When the conveyance spaces 12A and 12B are not distinguished, they are referred to as the conveyance space 12.

[0099] The processing block 11 includes one partition wall 13. The partition wall 13 is disposed below the conveyance space 12A and above the conveyance space 12B. The partition wall 13 has a horizontal plate shape. The partition wall 13 separates the conveyance space 12A and the conveyance space 12B.

[0100] Refer to FIG. 2. Processing block 11 includes a substrate placement unit 14B in addition to the substrate placement unit 14A. The substrate placement unit 14B places the substrate W. The substrate placement unit 14B is disposed below the substrate placement unit 14A. The substrate placement unit 14B is installed in the transfer space 12B. The substrate placement unit 14B is disposed at the front of the transfer space 12B. The transfer mechanism 6 of the indexer unit 3 can also access the substrate placement unit 14B. The transfer mechanism 6 alternately transfers the substrate W to the substrate placement units 14A and 14B, for example.

[0101] Processing block 11 includes a transfer mechanism 16B in addition to the transfer mechanism 16A. The transfer mechanism 16B is installed in the transfer space 12B. The transfer mechanism 16B transfers the substrate W. The transfer mechanism 16B can access the substrate placement unit 14B.

[0102] When the transfer mechanisms 16A and 16B are not distinguished, they are referred to as the transfer mechanism 16.

[0103] Refer to FIGS. 1, 2, and 3. The structure of the transfer mechanism 16 will be described. The transfer mechanism 16 includes a hand 17 and a hand drive unit 18. The hand 17 supports one substrate W in a horizontal posture. The hand drive unit 18 is connected to the hand 17. The hand drive unit 18 moves the hand 17. The hand drive unit 18 moves the hand 17 in the front-rear direction X, the width direction Y, and the vertical direction Z.

[0104] The structure of the hand drive unit 18 is illustrated. The hand drive unit 18 includes, for example, two support columns 18a, a vertical movement unit 18b, a horizontal movement unit 18c, a rotation unit 18d, and a forward and backward movement unit 18e. The support columns 18a are fixedly installed. The support columns 18a are arranged on the side portions of the conveyance space 12. The two support columns 18a are arranged in the front-rear direction X. Each support column 18a extends in the vertical direction Z. The vertical movement unit 18b is supported by the support columns 18a. The vertical movement unit 18b extends in the front-rear direction X across the two support columns 18a. The vertical movement unit 18b moves in the vertical direction Z with respect to the support columns 18a. The horizontal movement unit 18c is supported by the vertical movement unit 18b. The horizontal movement unit 18c moves in the front-rear direction X with respect to the vertical movement unit 18b. The rotation unit 18d is supported by the horizontal movement unit 18c. The rotation unit 18d rotates with respect to the horizontal movement unit 18c. The rotation unit 18d rotates around a rotation axis parallel to the vertical direction Z. The forward and backward movement unit 18e moves with respect to the rotation unit 18d. The forward and backward movement unit 18e reciprocates in a horizontal one-way direction determined by the direction of the rotation unit 18d. The forward and backward movement unit 18e is connected to the hand 17. Since the hand drive unit 18 is configured in this way, the hand 17 can move parallel in the vertical direction Z. The hand 7 can move parallel in any horizontal direction. The hand 7 can rotate within the horizontal plane.

[0105] FIG. 4 is a right side view showing the configuration of the right part of the substrate processing apparatus 1. The processing block 11 includes, in addition to the processing unit 21A1, five processing units 21A2 - 21A6. The processing units 21A2 - 21A6 each include a processing housing 23A2 - 23A6. The processing housings 23A2 - 23A6 are arranged below the processing housing 23A1. The processing housings 23A1 - 23A6 are arranged in a row from top to bottom. The processing housings 23A1 - 23A6 are arranged in a single column in the vertical direction Z. Although not shown, the processing housings 23A2 - 23A6 are each arranged at the same position as the processing housing 23A1 in a plan view. The processing housings 23A1 - 23A6 are stacked on top of each other.

[0106] Similarly, in addition to the processing unit 21B1, the processing block 11 includes processing units 21B2 - 21B6. Each of the processing units 21B2 - 21B6 includes a processing housing 23B2 - 23B6. The relative positions of the processing housings 23B1 - 23B6 are the same as the relative positions of the processing housings 23A1 - 23A6.

[0107] FIG. 5 is a left side view showing the configuration of the left part of the substrate processing apparatus 1. In addition to the processing units 21C1 and 21D1, the processing block 11 includes processing units 21C2 - 21C6 and 21D2 - 21D6. Each of the processing units 21C2 - 21C6 and 21D2 - 21D6 includes a processing housing 23C2 - 23C6 and 23D2 - 23D6, respectively. The processing housings 23C1 - 23C6 and 23D1 - 23D6 are arranged in the same manner as the processing housings 23A1 - 23A6, respectively.

[0108] Referring to FIGS. 3, 4, and 5. As described above, the processing housings 23A1, 23B1, 23C1, and 23D1 are arranged at the same height position. The processing housings 23A2 - 23A6, 23B2 - 23B6, 23C2 - 23C6, and 23D2 - 23D6 are also arranged in the same manner. That is, the processing housings 23An, 23Bn, 23Cn, and 23Dn are arranged at the same height position. Here, "n" is an integer from 1 to 6.

[0109] Referring to FIG. 3. The processing housings 23A1 - 23A3, 23B1 - 23B3, 23C1 - 23C3, and 23D1 - 23D3 are each arranged at the same height position as the transfer space 12A. Therefore, the transfer mechanism 16A can access the processing housings 23A1 - 23A3, 23B1 - 23B3, 23C1 - 23C3, and 23D1 - 23D3.

[0110] The processing housings 23A4 - 23A6, 23B4 - 23B6, 23C4 - 23C6, and 23D4 - 23D6 are arranged at the same height position as the transfer space 12B. Therefore, the transfer mechanism 16B can access the processing housings 23A4 - 23A6, 23B4 - 23B6, 23C4 - 23C6, and 23D4 - 23D6.

[0111] When not distinguishing between processing units 21A1 - 21A6, they are called processing unit 21A. When not distinguishing between processing units 21B1 - 21B6, they are called processing unit 21B. When not distinguishing between processing units 21C1 - 21C6, they are called processing unit 21C. When not distinguishing between processing units 21D1 - 21D6, they are called processing unit 21D. When not distinguishing between processing units 21A, 21B, 21C, and 21D, they are called processing unit 21.

[0112] When not distinguishing between processing enclosures 23A1 - 23A6, they are called processing enclosure 23A. When not distinguishing between processing enclosures 23B1 - 23B6, they are called processing enclosure 23B. When not distinguishing between processing enclosures 23C1 - 23C6, they are called processing enclosure 23C. When not distinguishing between processing enclosures 23D1 - 23D6, they are called processing enclosure 23D. When not distinguishing between processing enclosures 23A, 23B, 23C, and 23D, they are called processing enclosure 23.

[0113] Refer to FIG. 1. Each processing enclosure 23 is adjacent to the conveyance space 12 respectively. Each of the processing enclosures 23A and 23B is arranged on the right side of the conveyance space 12. Each of the processing enclosures 23C and 23D is arranged on the left side of the conveyance space 12.

[0114] The processing block 11 includes first piping spaces 44A, 44B and second piping spaces 46A, 46B. The first piping spaces 44A, 44B and the second piping spaces 46A, 46B are adjacent to the conveyance space 12 respectively. The first piping spaces 44A, 44B and the second piping spaces 46A, 46B are arranged on the right side of the conveyance space 12.

[0115] The first piping space 44A, the processing enclosure 23A, and the second piping space 46A are arranged in the front - rear direction X. The first piping space 44A, the processing enclosure 23A, and the second piping space 46A are arranged in this order. The first piping space 44A is arranged in front of the processing enclosure 23A. The first piping space 44A is adjacent to the processing enclosure 23A. The second piping space 46A is arranged behind the processing enclosure 23A. The second piping space 46A is adjacent to the processing enclosure 23A.

[0116] The relative positions of the processing housing 23B, the first pipe space 44B, and the second pipe space 46B are the same as the relative positions of the processing housing 23A, the first pipe space 44A, and the second pipe space 46A. The first pipe space 44B is arranged behind the second pipe space 46A. The first pipe space 44B is adjacent to the second pipe space 46A.

[0117] The processing block 11 includes first pipe spaces 44C and 44D and second pipe spaces 46C and 46D. The first pipe spaces 44C and 44D and the second pipe spaces 46C and 46D are each adjacent to the conveyance space 12. The first pipe spaces 44C and 44D and the second pipe spaces 46C and 46D are arranged to the left of the conveyance space 12. The relative positions of the processing housing 23C, the first pipe space 44C, and the second pipe space 46C are the same as the relative positions of the processing housing 23A, the first pipe space 44A, and the second pipe space 46A, except that the orientation is different. The relative positions of the processing housing 23C, the first pipe space 44C, and the second pipe space 46C correspond to those obtained by rotating the relative positions of the processing housing 23A, the first pipe space 44A, and the second pipe space 46A by 180 degrees around an axis parallel to the vertical direction Z. For this reason, the first pipe space 44C is arranged behind the processing housing 23C. The second pipe space 46C is arranged in front of the processing housing 23C. Thus, the relative positions of the processing housing 23C, the first pipe space 44C, and the second pipe space 46C are the same as the relative positions of the processing housing 23A, the first pipe space 44A, and the second pipe space 46A. The processing housing 23C, the first pipe space 44C, and the second pipe space 46C are only different in the installation orientation from the processing housing 23A, the first pipe space 44A, and the second pipe space 46A. The relative positions of the processing housing 23D, the first pipe space 44D, and the second pipe space 46D are also the same as the relative positions of the processing housing 23A, the first pipe space 44A, and the second pipe space 46A. The processing housing 23D, the first pipe space 44D, and the second pipe space 46D are only different in the installation orientation from the processing housing 23A, the first pipe space 44A, and the second pipe space 46A.

[0118] The first pipe space 44A houses the exhaust pipes 41A - 43A. In other words, the exhaust pipes 41A - 43A are installed in the first pipe space 44A. Similarly, the first pipe space 44B houses the exhaust pipes 41B - 43B. The first pipe space 44C houses the exhaust pipes 41C - 43C. The first pipe space 44D houses the exhaust pipes 41D - 43D.

[0119] The exhaust pipes 41A - 43A are arranged in front of the processing housing 23A. The exhaust pipes 41B - 43B are arranged in front of the processing housing 23B. The exhaust pipes 41C - 43C are arranged behind the processing housing 23C. The exhaust pipes 41D - 43D are arranged behind the processing housing 23D.

[0120] The exhaust pipes 41A - 43A are arranged side by side in the width direction Y. Each of the exhaust pipes 41A - 43A is adjacent to the processing housing 23A. Similarly, the exhaust pipes 41B - 43B are arranged side by side in the width direction Y. Each of the exhaust pipes 41B - 43B is adjacent to the processing housing 23B. The exhaust pipes 41C - 43C are arranged side by side in the width direction Y. Each of the exhaust pipes 41C - 43C is adjacent to the processing housing 23C. The exhaust pipes 41D - 43D are arranged side by side in the width direction Y. Each of the exhaust pipes 41D - 43D is adjacent to the processing housing 23C.

[0121] The processing block 11 includes the air supply pipes 48A, 48B, 48C, 48D. The air supply pipe 48A is installed in the second pipe space 46A. The air supply pipe 48A supplies gas (e.g., clean air) to the processing housing 23A. Similarly, the air supply pipes 48B, 48C, 48D are respectively housed in the second pipe spaces 46B, 46C, 46C. The air supply pipes 48B, 48C, 48D respectively supply gas to the processing housings 23B, 23C, 23D.

[0122] Refer to FIGS. 3, 4, and 5. Each of the exhaust pipes 41A - 43A extends in the vertical direction Z. Each of the exhaust pipes 41A - 43A extends from the height position of the processing housing 23A1 to the height position of the processing housing 23A6. Similarly, each of the exhaust pipes 41B - 43B, 41C - 43C, 41D - 41D extends in the vertical direction Z.

[0123] Refer to FIGS. 4 and 5. The air supply pipes 48A - 48D each extend in the vertical direction. The air supply pipes 48A - 48D are each installed on the side of the processing casings 23A - 23D.

[0124] The front - rear direction X is an example of the first direction in the present invention. The width direction Y is an example of the second direction in the present invention.

[0125] When not distinguishing the exhaust pipes 41A - 41D, they are called the exhaust pipe 41. When not distinguishing the exhaust pipes 42A - 42D, they are called the exhaust pipe 42. When not distinguishing the exhaust pipes 43A - 43D, they are called the exhaust pipe 43. When not distinguishing the first pipe spaces 44A, 44B, 44C, 44D, they are called the first pipe space 44. When not distinguishing the second pipe spaces 46A, 46B, 46C, 46D, they are called the second pipe space 46. When not distinguishing the air supply pipes 48A - 48D, they are called the air supply pipe 48.

[0126] The first pipe space 44 does not accommodate the pipes for supplying gas to the processing casing 23. The first pipe space 44 does not accommodate the pipes for supplying the processing liquid to the processing unit 21 (liquid supply unit 33). The first pipe space 44 does not accommodate the pipes for discharging the processing liquid from the processing unit 21.

[0127] The second pipe space 46 may accommodate, for example, the pipes for supplying the processing liquid to the processing unit 21 (liquid supply unit 33). The second pipe space 46 may accommodate, for example, the pipes for discharging the processing liquid from the processing unit 21.

[0128] Refer to FIGS. 3 and 4. As described above, the switching mechanism 51A1 is disposed at substantially the same height position as the processing housing 23A1. In a front view, the switching mechanism 51A1 overlaps with the processing housing 23A1. Specifically, the entire switching mechanism 51A1 overlaps with the processing housing 23A1 in a front view. The relative positions of the switching mechanism 51B1 and the processing housing 23B1 are the same as the relative positions of the switching mechanism 51A1 and the processing housing 23A1. The relative positions of the switching mechanisms 51C1, 51D1 and the processing housings 23C1, 23D1 are also the same as the relative positions of the switching mechanism 51A1 and the processing housing 23A1.

[0129] In addition to the switching mechanism 51A1, the processing block 11 includes switching mechanisms 51A2 - 51A6. The relative positions of the switching mechanism 51A2 and the processing housing 23A2 are the same as the relative positions of the switching mechanism 51A1 and the processing housing 23A1. Specifically, the switching mechanism 51A2 is disposed at substantially the same height position as the processing housing 23A2. In a front view, the switching mechanism 51A2 overlaps with the processing housing 23A2. Similarly, the relative positions of the switching mechanisms 51A3 - 51A6 and the processing housings 23A3 - 23A6 are the same as the relative positions of the switching mechanism 51A1 and the processing housing 23A1.

[0130] The switching mechanism 51A2 switches the exhaust passage of the processing housing 23A2 to one of the exhaust pipes 41A - 43A. Similarly, each of the switching mechanisms 51A3 - 51A6 switches the exhaust passage of the processing housing 23A3 - 23A6 to one of the exhaust pipes 41A - 43A. Therefore, each of the exhaust pipes 41A - 43A discharges gas from the processing housings 23A1 - 23A6.

[0131] Refer to FIG. 4. Processing block 11 includes switching mechanisms 51B2 - 51B6 in addition to switching mechanism 51B1. The relative positions of switching mechanisms 51B2 - 51B6 and processing casings 23B2 - 23B6 are the same as the relative positions of switching mechanism 51B1 and processing casing 23B1. Each of the switching mechanisms 51B2 - 51B6 switches the exhaust passage of the processing casing 23B2 - 23B6 to one of the exhaust pipes 41B - 43B. Therefore, the exhaust pipes 41B - 43B each discharge gas from the processing casings 23B1 - 23B6.

[0132] Refer to FIG. 5. Processing block 11 includes switching mechanisms 51C2 - 51C6 in addition to switching mechanism 51C1. The relative positions of switching mechanisms 51C2 - 51C6 and processing casings 23C2 - 23C6 are the same as the relative positions of switching mechanism 51C1 and processing casing 23C1. Each of the switching mechanisms 51C2 - 51C6 switches the exhaust passage of the processing casing 23C2 - 23C6 to one of the exhaust pipes 41C - 43C. Therefore, the exhaust pipes 41C - 43C each discharge gas from the processing casings 23C1 - 23C6.

[0133] Processing block 11 includes switching mechanisms 51D2 - 51D6 in addition to switching mechanism 51D1. The relative positions of switching mechanisms 51D2 - 51D6 and processing casings 23D2 - 23D6 are the same as the relative positions of switching mechanism 51D1 and processing casing 23D1. Each of the switching mechanisms 51D2 - 51D6 switches the exhaust passage of the processing casing 23D2 - 23D6 to one of the exhaust pipes 41D - 43D. Therefore, the exhaust pipes 41D - 43D discharge gas from the processing casings 23D1 - 23D6.

[0134] Although illustration is omitted, each of the switching mechanisms 51A2 - 51A6 is arranged at the same position as the switching mechanism 51A1 in plan view. Similarly, each of the switching mechanisms 51B2 - 51B6 is arranged at the same position as the switching mechanism 51B1 in plan view. The switching mechanisms 51C2 - 51C6 are each arranged at the same position as the switching mechanism 51B1 in plan view. The switching mechanisms 51D2 - 51D6 are each arranged at the same position as the switching mechanism 51B1 in plan view.

[0135] When not distinguishing the switching mechanisms 51A1 - 51A6, they are called the switching mechanism 51A. When not distinguishing the switching mechanisms 51B1 - 51B6, they are called the switching mechanism 51B. When not distinguishing the switching mechanisms 51C1 - 51C6, they are called the switching mechanism 51C. When not distinguishing the switching mechanisms 51D1 - 51D6, they are called the switching mechanism 51D. When not distinguishing the switching mechanisms 51A, 51B, 51C, and 51D, they are called the switching mechanism 51.

[0136] Refer to FIG. 1. The switching mechanism 51 is installed at a position that does not overlap with the holding portion 31 in plan view. At least a part of the switching mechanism 51 is installed outside the processing housing 23. At least a part of the switching mechanism 51 is installed on the side of the processing housing 23. At least a part of the switching mechanism 51 is installed in the first piping space 44. At least a part of each switching mechanism 51A is installed in the first piping space 44A. At least a part of each switching mechanism 51B is installed in the first piping space 44B. At least a part of each switching mechanism 51C is installed in the first piping space 44C. At least a part of each switching mechanism 51D is installed in the first piping space 44D.

[0137] <Structure of the processing unit 21> FIG. 6 is a plan view of the processing unit 21. FIG. 7 is a side view of the processing unit 21. Each processing unit 21 includes a processing housing 23, a holding portion 31, and a liquid supply portion 33 as described above. Note that since FIG. 1 shows the liquid supply portion 33 in a simplified manner for convenience, the liquid supply portion 33 shown in FIG. 6 is slightly different from the liquid supply portion 33 shown in FIG. 1.

[0138] The structure of the processing housing 23 will be described. The processing housing 23 has a substantially box shape. The processing housing 23 has a substantially rectangular shape in plan view, front view, and side view.

[0139] Each processing housing 23 includes four side walls 25a, 25b, 25c, 25d, an upper plate 25e, and a bottom plate 25f. The side walls 25a - 25d are each in a substantially vertical plate shape. The upper plate 25e and the bottom plate 25f have a substantially horizontal plate shape.

[0140] Each processing housing 23 has a processing space 24 inside thereof. The substrate W is processed in the processing space 24. The processing space 24 is partitioned by the side walls 25a - 25d, the upper plate 25e, and the bottom plate 25f.

[0141] The side walls 25a, 25c extend in the front - rear direction X in plan view. The side wall 25c is provided opposite to the side wall 25a. The side walls 25b, 25d extend in the width direction Y in plan view. The side walls 25b, 25d each extend from the side wall 25a to the side wall 25c. The side wall 25d is provided opposite to the side wall 25b.

[0142] The processing housing 23B has the same structure as the processing housing 23A. The processing housings 23C, 23D also have the same structure as the processing housing 23A. The processing housings 23C, 23D only differ from the processing housing 23A in the installation direction. The processing housings 23C, 23D correspond to the processing housing 23A rotated 180 degrees around an axis parallel to the vertical direction Z. Therefore, in any of the processing housings 23A - 23D, the side wall 25a is in contact with the transfer space 12. In any of the processing housings 23A - 23D, the side wall 25b is in contact with the first pipe space 44. In any of the processing housings 23A - 23D, the side wall 25d is in contact with the second pipe space 46.

[0143] The processing housing 23 has a substrate transfer port 27. The substrate transfer port 27 is formed in the side wall 25a. The substrate W can pass through the substrate transfer port 27. The substrate W moves between the outside and the inside of the processing housing 23 through the substrate transfer port 27. Specifically, the substrate W moves between the transfer space 12 and the processing space 24 through the substrate transfer port 27.

[0144] Each processing unit 21 may be provided with a shutter (not shown). The shutter is attached to the side wall 25a. The shutter opens and closes the substrate transfer port 27.

[0145] The holding part 31 holds one substrate W in a horizontal posture. The holding part 31 has an upper surface 31a. The upper surface 31a is substantially horizontal. The substrate W is placed on the upper surface 31a.

[0146] Figures 6 and 7 show the center point G. The center point G is the position of the center of the substrate W when the substrate W is held by the holding part 31.

[0147] Referring to Figure 7. Each processing unit 21 further includes a rotation driving part 32. The rotation driving part 32 is installed inside the processing housing 23. The rotation driving part 32 is connected to the holding part 31. The rotation driving part 32 rotates the holding part 31. The substrate W held by the holding part 31 rotates integrally with the holding part 31. The holding part 31 and the substrate W rotate around the rotation axis Aw. The rotation axis Aw is, for example, an imaginary line parallel to the vertical direction Z. The rotation axis Aw, for example, passes through the center point G.

[0148] Referring to Figure 6. The liquid supply part 33 supplies the first processing liquid, the second processing liquid, and the third processing liquid. The first processing liquid, the second processing liquid, and the third processing liquid are different from each other in type. That is, the liquid supply part 33 supplies a plurality (three) of types of processing liquids.

[0149] The first processing liquid is classified as, for example, an acidic liquid. The first processing liquid contains, for example, at least one of hydrofluoric acid (hydrogen fluoride acid), hydrochloric acid hydrogen peroxide solution, sulfuric acid, sulfuric acid hydrogen peroxide solution, fluonitric acid (a mixed solution of hydrofluoric acid and nitric acid), and hydrochloric acid.

[0150] The second processing liquid is classified as, for example, an alkaline liquid. The second processing liquid includes, for example, at least one of aqueous ammonia hydrogen peroxide (SC1), aqueous ammonia, ammonium fluoride solution, and tetramethylammonium hydroxide (TMAH).

[0151] The third processing liquid is classified as, for example, an organic liquid. The organic liquid includes at least one of isopropyl alcohol (IPA), methanol, ethanol, hydrofluoroether (HFE), and acetone.

[0152] The liquid supply unit 33 includes nozzles 34A, 34B, and 34C. The nozzles 34A, 34B, and 34C each discharge a processing liquid. The nozzle 34A discharges, for example, the first processing liquid. The nozzle 34B discharges, for example, the second processing liquid. The nozzle 34C discharges, for example, the third processing liquid.

[0153] Each of the nozzles 34A, 34B, and 34C has a tubular shape extending linearly. The nozzles 34A, 34B, and 34C each include a tip portion 35A, 35B, 35C and a base portion 36A, 36B, 36C. The tip portions 35A, 35B, and 35C each have a discharge port (not shown) for discharging the processing liquid.

[0154] The liquid supply unit 33 includes base portions 37A, 37B, and 37C. The base portions 37A, 37B, and 37C each support the nozzles 34A, 34B, and 34C. Specifically, the base portions 37A, 37B, and 37C are connected to the base portions 36A, 36B, and 36C.

[0155] The base portion 37A further moves the nozzle 34A. For example, the base portion 37A rotates the nozzle 34A around a rotation axis parallel to the vertical direction Z through the base portion 37A. Similarly, the base portions 37B and 37C each move the nozzles 34B and 34C.

[0156] The base portion 37A enables the nozzle 34A to move between a processing position and a retracted position. When the nozzle 34A is at the processing position, the tip portion 35A (the discharge port) is positioned above the substrate W held by the holding portion 31. When the nozzle 34A is at the processing position, the tip portion 35A (the discharge port) overlaps the substrate W held by the holding portion 31 in plan view. When the nozzle 34A is at the retracted position, the entire nozzle 34A does not overlap the substrate W held by the holding portion 31 in plan view. Similarly, the nozzles 34B and 34C are each movable between a processing position and a retracted position. FIG. 6 shows the nozzles 34A, 34B, and 34C at the retracted position.

[0157] The base portions 37A - 37C are respectively arranged in the vicinity of the side wall 25c. The base portion 37A is arranged at the corner where the side wall 25c and the side wall 25b are connected. The base portions 37B and 37C are arranged at the corners where the side wall 25c and the side wall 25d are connected.

[0158] Each processing unit 21 includes a cup 38. The cup 38 is arranged around the holding portion 31. The cup 38 surrounds the side of the substrate W held by the holding portion 31. The cup 38 receives the processing liquid scattered from the substrate W held by the holding portion 31.

[0159] Referring to FIG. 7, each processing unit 21 includes a blowing unit 39. The blowing unit 39 supplies gas to the processing space 24. The blowing unit 39 is attached to the upper plate 25e. The blowing unit 39 is arranged above the holding portion 31. The blowing unit 39 blows gas (e.g., clean air) downward.

[0160] The blowing unit 39 is connected to an air supply pipe 48. The air supply pipe 48 supplies gas to the blowing unit 39.

[0161] The relative positions of the processing housing 23, the holding unit 31, and the liquid supply unit 33 are the same among the processing units 21A - 21D. The relative positions of the processing housing 23, the holding unit 31, and the liquid supply unit 33 in the processing units 21C and 21D are different only in orientation from the relative positions of the processing housing 23, the holding unit 31, and the liquid supply unit 33 in the processing unit 21A.

[0162] <Structure of the switching mechanism 51> Refer to FIGS. 6 and 7. The switching mechanism 51 includes a switching housing 53. The size of the switching housing 53 is smaller than that of the processing housing 23. The switching housing 53 is connected to the processing housing 23. The switching housing 53 is further connected to the exhaust pipes 41 - 43. Each switching housing 53 extends in the horizontal direction. Each switching housing 53 bends in a substantially L - shape in plan view. The switching housing 53 has a switching space 54 inside it.

[0163] Each switching housing 53 includes an introduction part 55. The introduction part 55 is connected to the processing housing 23. The introduction part 55 is connected to the side wall 25b of the processing housing 23.

[0164] The introduction part 55 extends in the front - rear direction X from the processing housing 23. The introduction part 55 has a first end 55a and a second end 55b. The first end 55a corresponds to the upstream end of the switching space 54. The switching space 54 is open to the processing space 24 at the first end 55a. Thus, the switching housing 53 communicates with the processing housing 23 at the introduction part 55. The gas flows from the processing housing 23 into the switching space 54 through the first end 55a1.

[0165] The introduction part 55 penetrates the processing housing 23. The first end 55a is arranged inside the processing housing 23. That is, the first end 55a is arranged in the processing space 24. The second end 55b is arranged outside the processing housing 23. Specifically, the second end 55b is arranged in the first pipe space 44.

[0166] The introduction part 55 is arranged at a position close to the side wall 25a. In contrast, the base parts 37A - 37C are arranged at positions close to the side wall 25c. In other words, the introduction part 55 is arranged at a position close to the conveyance space 12. The base parts 37A - 37C are arranged at positions far from the conveyance space 12.

[0167] Taking the side wall 25a as a reference, the positions of the introduction part 55 and the like will be described. Fig. 6 shows the distances D1, D2, D3, and D4. The distance D1 is the separation distance between the introduction part 55 and the side wall 25a in plan view. The distance D2 is the separation distance between the holding part 31 and the side wall 25a in plan view. The distance D3 is the separation distance between the center point G and the side wall 25a in plan view. The distance D4 is the separation distance between the base part 37A and the side wall 25a in plan view. The distance D1 is smaller than the distance D2. The distance D2 is smaller than the distance D3. The distance D3 is smaller than the distance D4.

[0168] Here, the side wall 25a is in contact with the conveyance space 12. Therefore, the above-mentioned distances D1 - D4 approximate the distances based on the conveyance space 12. That is, the distance D1 approximates the separation distance between the introduction part 55 and the conveyance space 12 in plan view. The distance D2 approximates the separation distance between the holding part 31 and the conveyance space 12 in plan view. The distance D3 approximates the separation distance between the center point G and the conveyance space 12 in plan view. The distance D4 approximates the separation distance between the base part 37A and the conveyance space 12 in plan view. Thus, in plan view, the separation distance between the introduction part 55 and the conveyance space 12 is smaller than the separation distance between the holding part 31 and the conveyance space 12. In plan view, the separation distance between the holding part 31 and the conveyance space 12 is smaller than the separation distance between the center point G and the conveyance space 12. In plan view, the separation distance between the center point G and the conveyance space 12 is smaller than the separation distance between the base part 37A and the conveyance space 12.

[0169] Each switching housing 53 is provided with a distribution part 56. The distribution part 56 is connected to the introduction part 55. The distribution part 56 is connected to the second end 55b of the introduction part 55. The distribution part 56 extends in the width direction Y.

[0170] The distribution unit 56 is disposed outside the processing housing 23. The distribution unit 56 is disposed in the first pipe space 44. The distribution unit 56 is disposed in the vicinity of the exhaust pipes 41 - 43.

[0171] Each of the exhaust pipes 41 - 43 is in contact with the processing housing 23. In a plan view, the exhaust pipes 41 - 43 are disposed between the processing housing 23 and the distribution unit 56. Specifically, each of the exhaust pipes 41 - 43 is in contact with the side wall 25b of the processing housing 23. The exhaust pipes 41 - 43 are disposed between the side wall 25b and the distribution unit 56.

[0172] The distribution unit 56 is connected to the exhaust pipes 41 - 43. The distribution unit 56 is connected to the outer surface of the exhaust pipes 41 - 43. The switching housing 53 communicates with the exhaust pipes 41 - 43 in the distribution unit 56.

[0173] Specifically, the exhaust pipe 41 has an opening 41k. The opening 41k is formed on the outer surface of the exhaust pipe 41. The opening 41k communicates with the flow path inside the exhaust pipe 41. The distribution unit 56 is connected to the portion of the exhaust pipe 41 located around the opening 41k. Thereby, the switching space 54 communicates with the flow path inside the exhaust pipe 41 through the opening 41k. Similarly, the exhaust pipes 42 and 43 each have openings 42k and 43k. The distribution unit 56 is connected to the exhaust pipes 42 and 43 around the openings 42k and 43k.

[0174] Refer to FIGS. 6 and 8. FIG. 8 is a front view of the switching mechanism 51. For convenience, the switching housing 53 is shown by a dashed line in FIG. 8. Each switching housing 53 includes three opening / closing parts 61, 62, and 63. The opening / closing parts 61 - 63 are respectively installed inside the switching housing 53. That is, the switching housing 53 houses the opening / closing parts 61 - 63. Specifically, the opening / closing parts 61 - 63 are respectively installed inside the distribution part 56. The opening / closing parts 61 - 63 are installed outside the processing housing 23. The opening / closing parts 61 - 63 are installed in the first pipe space 44. The opening / closing parts 61, 62, and 63 are respectively arranged at positions facing the openings 41k, 42k, and 43k. The opening / closing parts 61, 62, and 63 are each movable between a position where they open the openings 41k, 42k, and 43k and a position where they close the openings 41k, 42k, and 43k.

[0175] In FIGS. 6 and 8, the opening / closing part 61 is in a position where it opens the opening 41k, and the opening / closing parts 62 and 63 are respectively in positions where they close the openings 42k and 43k.

[0176] When the opening / closing part 61 opens the opening 41k, the exhaust pipe 41 communicates with the processing housing 23. When the opening / closing part 61 closes the opening 41k, the exhaust pipe 41 is blocked from the processing housing 23. Thus, the position of the opening / closing part 61 that opens the opening 41k corresponds to the position of the opening / closing part 61 that connects the processing housing 23 to the exhaust pipe 41. The position of the opening / closing part 61 that closes the opening 41k corresponds to the position of the opening / closing part 61 that blocks the processing housing 23 from the exhaust pipe 41.

[0177] Similarly, when the opening / closing parts 62 and 63 respectively open the openings 42k and 43k, the exhaust pipes 42 and 43 respectively communicate with the processing housing 23. When the opening / closing parts 62 and 63 respectively close the openings 42k and 43k, the exhaust pipes 42 and 43 are respectively blocked from the processing housing 23. Thus, the positions of the opening / closing parts 62 and 63 that open the openings 42k and 43k respectively correspond to the positions of the opening / closing parts 62 and 63 that connect the processing housing 23 to the exhaust pipes 42 - 43. The positions of the opening / closing parts 62 and 63 that close the openings 42k and 43k respectively correspond to the positions of the opening / closing parts 62 and 63 that block the processing housing 23 from the exhaust pipes 42 - 43.

[0178] The opening and closing parts 61, 62, and 63 are movable independently of each other. For this reason, the exhaust pipes 41, 42, and 43 can communicate with the processing housing 23 individually. The exhaust pipes 41, 42, and 43 can be blocked from the processing housing 23 individually.

[0179] The opening and closing parts 61, 62, and 63 have, for example, the following structure. The opening and closing part 61 has a substantially vertical flat plate shape. The opening and closing part 61 is installed so as to be swingable around the rotation axis A1. The rotation axis A1 is an imaginary line parallel to the vertical direction Z. The rotation axis line A1 passes through the first end of the opening and closing part 61. The opening and closing part 61 swings around the rotation axis line A1. The opening and closing parts 62 and 63 also have the same structure as the opening and closing part 61. The opening and closing parts 62 and 63 swing around the rotation axes A2 and A3, respectively.

[0180] The opening and closing parts 61, 62, and 63 are moved by a power source (for example, an electric motor) not shown. Here, the power source is not an element of the switching mechanism 51. The power source is an external element of the switching mechanism 51. The power source may be arranged, for example, outside the switching housing 53.

[0181] The opening and closing part 61 is an example of the first opening and closing part in the present invention. The opening and closing part 62 is an example of the second opening and closing part in the present invention.

[0182] As described above, the switching mechanism 51 is arranged at a position that does not overlap with the holding part 31 in a plan view. The position of the switching mechanism 51 in the plan view will be described in detail.

[0183] FIG. 6 shows a virtual circle E3r by a dashed line. The virtual circle E3r is centered on the center point G. The radius of the virtual circle E3r is three times the radius of the substrate W. The switching mechanism 51 is arranged outside the virtual circle E3r in a plan view. That is, the distance from the center point G to the switching mechanism 51 is greater than three times the radius of the substrate W in a plan view.

[0184] FIG. 6 shows the virtual circle E5r in a dashed line. The virtual circle E5r is centered at the center point G. The radius of the virtual circle E5r is five times the radius of the substrate W. The switching mechanism 51 is arranged inside the virtual circle E5r in a plan view. That is, the distance from the center point G to the switching mechanism 51 is smaller than five times the radius of the substrate W in a plan view.

[0185] As described above, the switching mechanism 51 is arranged at substantially the same height position as the processing housing 23. The height position of the switching mechanism 51 will be described in more detail.

[0186] Referring to FIG. 7. The switching mechanism 51 has an upper end P1 and a lower end Q1. The upper end P1 and the lower end Q1 correspond to the upper end and the lower end of the switching housing 53, respectively. The processing housing 23 has an upper end P2 and a lower end Q2. The upper end P2 corresponds to the upper surface of the upper plate 25e. The lower end Q2 corresponds to the lower surface of the bottom plate 25f. The upper end P1 is arranged at a position equal to or lower than the upper end P2. Specifically, the upper end P1 is arranged at a position lower than the upper end P2. The lower end Q1 is arranged at a position equal to or higher than the lower end Q2. Specifically, the lower end Q1 is arranged at a position higher than the lower end Q2.

[0187] The switching mechanism 51 is arranged at a position equal to or lower than the upper surface 31a of the holding portion 31. That is, the upper end P1 is arranged at a position equal to or lower than the upper surface 31a. Specifically, the upper end P1 is arranged at a position lower than the upper surface 31a. Here, the upper surface 31a of the holding portion 31 is an example of the upper end of the holding portion 31 in the present invention.

[0188] <Configuration of the exhaust passage> FIG. 9 is a system diagram of the exhaust passage from the processing housing 23. The substrate processing apparatus 1 includes a pressure sensor 71A1. The pressure sensor 71A1 detects the exhaust pressure. Specifically, the pressure sensor 71A1 measures the pressure of the gas on the primary side (upstream side) of the switching mechanism 51A1. The pressure sensor 71A1 measures the pressure of the gas flowing from the processing housing 23A1 into the switching mechanism 51A1.

[0189] The substrate processing apparatus 1 includes a pressure adjustment mechanism 73A1. The pressure adjustment mechanism 73 adjusts the exhaust pressure. Specifically, the pressure adjustment mechanism 73A1 adjusts the pressure of the gas on the primary side of the switching mechanism 51A1. More specifically, the pressure adjustment mechanism 73A1 adjusts the pressure of the gas on the primary side of the switching mechanism 51 based on the detection result of the pressure sensor 71A1.

[0190] Similarly, the substrate processing apparatus 1 includes pressure sensors 71A2 - 71A6, 71B1 - 71B6, 71C1 - 71C6, and 71D1 - 71D6. When not distinguishing between the pressure sensors 71A1 - 71A6, 71B1 - 71B6, 71C1 - 71C6, and 71D1 - 71D6, they are referred to as the pressure sensor 71. Each pressure sensor 71 detects the exhaust pressure respectively. Each pressure sensor 71 measures the pressure of the gas on the primary side of the switching mechanism 51 respectively.

[0191] The substrate processing apparatus 1 includes pressure adjustment mechanisms 73A2 - 73A6, 73B1 - 73B6, 73C1 - 73C6, and 73D1 - 73D6. When not distinguishing between the pressure adjustment mechanisms 73A1 - 73A6, 73B1 - 73B6, 73C1 - 73C6, and 73D1 - 73D6, they are referred to as the pressure adjustment mechanism 73. Each pressure adjustment mechanism 73 adjusts the pressure on the primary side of the switching mechanism 51 based on the detection result of the pressure sensor 71.

[0192] The substrate processing apparatus 1 includes exhaust pipes 81A, 82A, and 83A. The exhaust pipe 81A is connected to the exhaust pipes 41A and 41B. The exhaust pipe 81A discharges the gas in the exhaust pipe 41A and the gas in the exhaust pipe 41B. The exhaust pipe 82A is connected to the exhaust pipes 42A and 42B. The exhaust pipe 82A discharges the gas in the exhaust pipe 42A and the gas in the exhaust pipe 42B. The exhaust pipe 83A is connected to the exhaust pipes 43A and 43B. The exhaust pipe 83A discharges the gas in the exhaust pipe 43A and the gas in the exhaust pipe 43B.

[0193] Similarly, the substrate processing apparatus 1 includes exhaust pipes 81B, 82B, and 83B. The connection relationship between the exhaust pipes 81B - 83B and the exhaust pipes 41C - 43C, 41D - 43D is the same as the connection relationship between the exhaust pipes 81A - 83A and the exhaust pipes 41A - 43A, 41B - 43B.

[0194] The substrate processing apparatus 1 includes a pressure sensor 84A. The pressure sensor 84A detects the exhaust pressure. Specifically, the pressure sensor 84A measures the gas inside the exhaust pipe 81A.

[0195] The substrate processing apparatus 1 includes a pressure adjustment mechanism 87A. The pressure adjustment mechanism 87A adjusts the exhaust pressure. Specifically, the pressure adjustment mechanism 87A adjusts the pressure of the gas inside the exhaust pipe 81A. More specifically, the pressure adjustment mechanism 87A adjusts the pressure of the gas inside the exhaust pipe 81A based on the detection result of the pressure sensor 84A.

[0196] Similarly, the substrate processing apparatus 1 includes pressure sensors 85A, 86A, 84B, 85B, and 86B. The pressure sensors 85A - 86A, 84B - 86B each detect the exhaust pressure. The pressure sensors 85A - 86A, 84B - 86B each measure the gas inside the exhaust pipes 82A - 83A, 81B - 83B.

[0197] The substrate processing apparatus 1 includes pressure adjustment mechanisms 88A, 89A, 87B, 88B, and 89B. The pressure adjustment mechanisms 88A - 89A, 87B - 89B each adjust the pressure of the gas inside the exhaust pipes 82A - 83A, 81B - 83B based on the detection results of the pressure sensors 85A - 86A, 84B - 86B.

[0198] When not distinguishing between the exhaust pipes 81A and 81B, they are referred to as the exhaust pipe 81. When not distinguishing between the exhaust pipes 82A and 82B, they are referred to as the exhaust pipe 82. When not distinguishing between the exhaust pipes 83A and 83B, they are referred to as the exhaust pipe 83. When not distinguishing between the pressure sensors 84A and 84B, they are referred to as the pressure sensor 84. When not distinguishing between the pressure sensors 85A and 85B, they are referred to as the pressure sensor 85. When not distinguishing between the pressure sensors 86A and 86B, they are referred to as the pressure sensor 86. When not distinguishing between the pressure adjustment mechanisms 87A and 87B, they are referred to as the pressure adjustment mechanism 87. When not distinguishing between the pressure adjustment mechanisms 88A and 88B, they are referred to as the pressure adjustment mechanism 88. When not distinguishing between the pressure adjustment mechanisms 89A and 89B, they are referred to as the pressure adjustment mechanism 89.

[0199] Refer to FIG. 6. The pressure sensor 71 is installed, for example, in the flow path between the processing housing 23 and the switching mechanism 51. The pressure sensor 71 is installed, for example, inside the switching housing 53 (i.e., the switching space 54). The pressure sensor 71 is installed, for example, in the introduction part 55. The pressure sensor 71 is installed, for example, on the primary side of the distribution part 56. The pressure sensor 71 is installed, for example, on the primary side of the opening / closing parts 61-63.

[0200] The pressure adjustment mechanism 73 is installed, for example, in the flow path between the processing housing 23 and the switching mechanism 51. The pressure adjustment mechanism 73 is installed, for example, inside the switching housing 53 (i.e., the switching space 54). The pressure adjustment mechanism 73 is installed, for example, in the introduction part 55. The pressure adjustment mechanism 73 is installed, for example, on the primary side of the distribution part 56. The pressure adjustment mechanism 73 is installed, for example, on the primary side of the opening / closing parts 61-63. The pressure adjustment mechanism 73 is installed, for example, in the vicinity of the pressure sensor 71. The pressure adjustment mechanism 73 is arranged, for example, on the secondary side (downstream side) of the pressure sensor 71. The pressure adjustment mechanism 73 is arranged, for example, on the primary side of the pressure sensor 71.

[0201] The pressure adjustment mechanism 73 may adjust the pressure of the gas, for example, by adjusting the flow rate of the gas. The pressure adjustment mechanism 73 is, for example, a damper or a fan.

[0202] Note that FIG. 7 omits the illustration of the pressure sensor 71 and the pressure adjustment mechanism 73.

[0203] Refer to FIGS. 3, 4, and 5. Each of the exhaust pipes 81-83 is arranged at a position higher than the processing housing 23. Each exhaust pipe 81 is connected to two exhaust pipes 41 at a position higher than the processing housing 23. Each exhaust pipe 82 is connected to two exhaust pipes 42 at a position higher than the processing housing 23. Each exhaust pipe 83 is connected to two exhaust pipes 43 at a position higher than the processing housing 23.

[0204] The exhaust pipes 41 - 43 each extend to a position higher than the processing housing 23. The gas flows upward within the exhaust pipes 41 - 43. The exhaust pipes 41 - 43 each have a lower end. The lower ends of the exhaust pipes 41 - 43 are each closed.

[0205] Refer to FIG. 3. The exhaust pipes 81A - 83A are disposed above the processing housings 23A, 23B. The exhaust pipes 81A - 83A are arranged in the width direction Y. The exhaust pipes 81A - 83A are disposed at the same height position. The exhaust pipes 81B - 83B are disposed above the processing housings 23C, 23D. The exhaust pipes 81B - 83B are arranged in the width direction Y. The exhaust pipes 81B - 83B are disposed at the same height position. The exhaust pipes 81B - 83B are disposed at the same height position as the exhaust pipes 81A - 83A.

[0206] FIG. 10 is a plan view showing the upper part of the processing block 11. The exhaust pipes 81A - 83A, 81B - 83B each extend in the front - rear direction X. The exhaust pipes 81A - 83A have the same length. The exhaust pipes 81B - 83B have the same length. The exhaust pipes 81B - 83B are shorter than the exhaust pipes 81A - 83A.

[0207] The exhaust pipes 81A, 82A, 83A each have front ends 81Af, 82Af, 83Af. The exhaust pipes 81B, 82B, 83B each have front ends 81Bf, 82Bf, 83Bf. The front ends 81Af - 83Af are disposed in front of the front ends 81Bf - 83Bf. The front ends 81Af - 83Af are disposed behind the indexer unit 3.

[0208] The exhaust pipe 81 extends to a position behind the processing block 11 and is communicatively connected to a first exhaust treatment facility (not shown). The first exhaust treatment facility recovers gas from the exhaust pipe 81. Similarly, the exhaust pipes 82, 83 each extend to a position behind the processing block 11 and are communicatively connected to second and third exhaust treatment facilities (not shown). The second and third exhaust treatment facilities each recover gas from the exhaust pipes 82, 83. The first - third exhaust treatment facilities are all external elements of the substrate processing apparatus 1. The first - third exhaust treatment facilities are each provided, for example, in the factory where the substrate processing apparatus 1 is installed.

[0209] The gas flows rearwardly within exhaust pipes 81 - 83. The front ends 81Af - 83Af, 81Bf - 83Bf respectively correspond to the upstream ends of exhaust pipes 81A - 83A, 81B - 83B.

[0210] The front ends 81Af - 83Af, 81Bf - 83Bf are open to the outside of the substrate processing apparatus 1. For example, the front ends 81Af - 83Af, 81Bf - 83Bf are open to the clean room in which the substrate processing apparatus 1 is installed.

[0211] The pressure sensor 84 is installed in the exhaust pipe 81. The pressure sensor 84 is installed downstream of the connection position between the exhaust pipe 81 and the exhaust pipe 41. For example, the pressure sensor 84A is installed downstream of the connection position between the exhaust pipe 81A and the exhaust pipe 41A, and the connection position between the exhaust pipe 81A and the exhaust pipe 41B. The pressure sensor 84A is installed rearward of the connection position between the exhaust pipe 81A and the exhaust pipe 41A, and the connection position between the exhaust pipe 81A and the exhaust pipe 41B.

[0212] Similarly, the pressure sensors 85, 86 are respectively installed in the exhaust pipes 82, 83.

[0213] The pressure adjustment mechanism 87 is installed in the exhaust pipe 81. The pressure adjustment mechanism 87 is installed upstream of the pressure sensor 84. The pressure adjustment mechanism 87 is provided upstream of the connection position between the exhaust pipe 81 and the exhaust pipe 41. For example, the pressure adjustment mechanism 87A is provided upstream of the connection position between the exhaust pipe 81A and the exhaust pipe 41A, and the connection position between the exhaust pipe 81A and the exhaust pipe 41B. The pressure adjustment mechanism 87A is installed forward of the connection position between the exhaust pipe 81A and the exhaust pipe 41A, and the connection position between the exhaust pipe 81A and the exhaust pipe 41B. The pressure adjustment mechanism 87A is installed at the front end 81Af of the exhaust pipe 81A. The pressure adjustment mechanism 87A adjusts the flow rate of the gas flowing into the exhaust pipe 81A from the outside of the substrate processing apparatus 1 through the front end 81Af of the exhaust pipe 81A.

[0214] Similarly, the pressure adjustment mechanisms 88, 89 are respectively installed in the exhaust pipes 82, 83.

[0215] The pressure adjustment mechanism 87-89 may adjust the pressure of the gas, for example, by adjusting the flow rate of the gas. The pressure adjustment mechanism 87-89 is, for example, a damper or a fan.

[0216] <Control of the substrate processing apparatus 1> Refer to FIG. 1. The substrate processing apparatus 1 includes a control unit 91. The control unit 91 is installed, for example, in the indexer unit 3. The control unit 91 controls the substrate processing apparatus 1.

[0217] FIG. 11 is a control block diagram of the substrate processing apparatus 1. The control unit 91 controls the transfer mechanisms 6 and 16. Specifically, the control unit 91 controls the hand drive units 8 and 18. The control unit 91 controls the processing unit 21. Specifically, the control unit 91 controls the holding unit 31, the rotation drive unit 32, the liquid supply unit 33, the cup 38, and the blowing unit 39. The control unit 91 controls the switching mechanism 51. Specifically, the control unit 91 controls the opening / closing units 61-63. The control unit 91 acquires the detection results of the pressure sensors 71, 84, 85, and 86. The control unit 91 controls the pressure adjustment mechanisms 73, 87, 88, and 89. The control unit 91 is communicably connected to these elements.

[0218] The control unit 91 is realized by a central processing unit (CPU) that executes various processes, a random-access memory (RAM) that serves as a work area for arithmetic processing, a storage medium such as a fixed disk, etc. The storage medium stores various kinds of information in advance. The storage medium stores, for example, information (processing recipe) that defines the operating conditions for the processes performed by each processing unit 21. The storage medium stores, for example, information that defines the operating conditions related to the switching of the exhaust passage performed by the switching mechanism 51. The storage medium stores information that defines the operating conditions related to the adjustment of the exhaust pressure performed by the pressure adjustment mechanisms 73, 87-89.

[0219] Here, the processing housing 23A2 is an example of the second processing housing in the present invention. The holding portion 32 of the processing unit 21A2 is an example of the second holding portion in the present invention. The liquid supply portion 33 of the processing unit 21A2 is an example of the second liquid supply portion in the present invention. The switching mechanism 51A2 is an example of the second switching mechanism in the present invention.

[0220] The pressure sensor 71A1 is an example of the first pressure sensor in the present invention. The pressure sensor 71B1 is an example of the third pressure sensor in the present invention. The pressure adjustment mechanism 73A1 is an example of the first pressure adjustment mechanism in the present invention. The pressure adjustment mechanism 73B1 is an example of the third pressure adjustment mechanism in the present invention.

[0221] The exhaust pipe 81A is an example of the fifth exhaust pipe in the present invention. The exhaust pipe 82A is an example of the sixth exhaust pipe in the present invention. The pressure sensor 84A is an example of the fifth pressure sensor in the present invention. The pressure sensor 85A is an example of the sixth pressure sensor in the present invention. The pressure adjustment mechanism 87A is an example of the fifth pressure adjustment mechanism in the present invention. The pressure adjustment mechanism 88A is an example of the sixth pressure adjustment mechanism in the present invention.

[0222] <Operation Example of Substrate Processing Apparatus 1> FIG. 12 is a flowchart showing the procedure of the operation for processing the substrate W. An operation example related to one processing unit 21 will be described. It is assumed that the substrate W is already held by the holding portion 31. Each element operates according to the control by the control unit 91.

[0223] <<Step S1>> The liquid supply portion 33 supplies the first processing liquid. Specifically, the nozzle 34A moves from the retracted position to the processing position. The nozzle 34A supplies the first processing liquid to the substrate W held by the holding portion 31. The gas in the processing housing 23 contains components derived from the first processing liquid.

[0224] The switching mechanism 51 switches the discharge path of the processing housing 23 to the exhaust pipe 41. Specifically, the switching mechanism 51 communicates the processing housing 23 with the exhaust pipe 41. The gas flows from the processing housing 23 through the switching mechanism 51 to the exhaust pipe 41. The exhaust pipe 41 discharges the gas of the processing housing 23. The gas further flows from the exhaust pipe 41 to the exhaust pipe 81. The exhaust pipe 81 discharges the gas from the exhaust pipe 41.

[0225] Note that when step S1 is being executed, at least one of the exhaust pipes 42 and 43 may discharge the gas of another processing housing 23. The same applies to steps S2 and S3 described later.

[0226] The pressure sensor 71 measures the pressure of the gas on the primary side of the switching mechanism 51. The pressure adjustment mechanism 73 adjusts the pressure on the primary side of the switching mechanism 51 based on the detection result of the pressure sensor 71.

[0227] A more detailed operation of the pressure adjustment mechanism 73 is exemplified below. In steps S2 and S3 described later, the pressure adjustment mechanism 73 may also execute the following operation examples. Each pressure adjustment mechanism 73 adjusts, for example, so that the exhaust pressure becomes constant. Each pressure adjustment mechanism 73 adjusts, for example, so that the detection result of the pressure sensor 71 becomes constant. The pressure adjustment mechanisms 73A1 and 73A2 equalize, for example, the pressure of the gas on the primary side of the switching mechanism 51A1 and the pressure of the gas on the primary side of the switching mechanism 51A2. The pressure adjustment mechanisms 73A1 - 73A6 equalize, for example, the pressures of the gases on the primary sides of the switching mechanisms 51A1 - 51A6. The pressure adjustment mechanisms 73A1 and 73B1 equalize, for example, the pressures of the gases on the primary sides of the switching mechanisms 51A1 and 51B1. The pressure adjustment mechanisms 73A1, 73B1, 73C1, and 73D1 equalize, for example, the pressures of the gases on the primary sides of the switching mechanisms 51A1, 51B1, 51C1, and 51D1. The pressure adjustment mechanism 73 equalizes, for example, the pressures of the gases on the primary sides of each switching mechanism 51.

[0228] The pressure sensors 84 - 86 respectively measure the gas inside the exhaust pipes 81 - 83. The pressure adjustment mechanisms 87 - 89 respectively adjust the pressure of the gas inside the exhaust pipes 81 - 83 based on the detection results of the pressure sensors 84 - 86.

[0229] The more detailed operations of the pressure adjustment mechanisms 87 - 89 are exemplified below. Note that in Steps S2 and S3 described later, the pressure adjustment mechanisms 87 - 89 may also execute the following operation examples. Each of the pressure adjustment mechanisms 87 - 89 adjusts, for example, so that the exhaust pressure becomes constant. For example, the pressure adjustment mechanism 87A adjusts so that the detection result of the pressure sensor 84A becomes constant. The pressure adjustment mechanisms 87A - 89A make the pressures of the gases inside the exhaust pipes 81A - 83A equal to each other, for example. The pressure adjustment mechanisms 87A and 87B make the pressures of the gases inside the exhaust pipes 81A and 81B equal, for example. The pressure adjustment mechanisms 87A - 89A and 87B - 89B make the pressures of the gases inside the exhaust pipes 81A - 83A and 81B - 83B equal, for example.

[0230] <<Step S2>> The liquid supply unit 33 supplies the second processing liquid. Specifically, the nozzle 34A moves from the processing position to the retracted position, and the nozzle 34B moves from the retracted position to the processing position. The nozzle 34B supplies the second processing liquid to the substrate W held by the holding unit 31. The gas inside the processing housing 23 contains components derived from the second processing liquid.

[0231] The switching mechanism 51 switches the discharge path of the processing housing 23 to the exhaust pipe 42. Specifically, the switching mechanism 51 connects the processing housing 23 to the exhaust pipe 42. The gas flows from the processing housing 23 through the switching mechanism 51 to the exhaust pipe 42. The exhaust pipe 42 discharges the gas of the processing housing 23. The gas further flows from the exhaust pipe 42 to the exhaust pipe 82. The exhaust pipe 82 discharges the gas from the exhaust pipe 42.

[0232] The pressure sensor 71 measures the pressure of the gas on the primary side of the switching mechanism 51. The pressure adjustment mechanism 73 adjusts the pressure on the primary side of the switching mechanism 51 based on the detection result of the pressure sensor 71.

[0233] The pressure sensors 84 - 86 respectively measure the gas inside the exhaust pipes 81 - 83. The pressure adjustment mechanisms 87 - 89 respectively adjust the pressure of the gas inside the exhaust pipes 81 - 83 based on the detection results of the pressure sensors 84 - 86.

[0234] <<Step S3>> The liquid supply unit 33 supplies the third processing liquid. Specifically, the nozzle 34B moves from the processing position to the retracted position, and the nozzle 34C moves from the retracted position to the processing position. The nozzle 34C supplies the third processing liquid to the substrate W held by the holding unit 31. The gas inside the processing housing 23 contains components derived from the third processing liquid.

[0235] The switching mechanism 51 switches the discharge path of the processing housing 23 to the exhaust pipe 43. Specifically, the switching mechanism 51 connects the processing housing 23 to the exhaust pipe 43. The gas flows from the processing housing 23 through the switching mechanism 51 to the exhaust pipe 43. The exhaust pipe 43 discharges the gas inside the processing housing 23. The gas further flows from the exhaust pipe 43 to the exhaust pipe 83. The exhaust pipe 83 discharges the gas from the exhaust pipe 43.

[0236] The pressure sensor 71 measures the pressure of the gas on the primary side of the switching mechanism 51. The pressure adjustment mechanism 73 adjusts the pressure on the primary side of the switching mechanism 51 based on the detection result of the pressure sensor 71.

[0237] The pressure sensors 84 - 86 respectively measure the gas inside the exhaust pipes 81 - 83. The pressure adjustment mechanisms 87 - 89 respectively adjust the pressure of the gas inside the exhaust pipes 81 - 83 based on the detection results of the pressure sensors 84 - 86.

[0238] <Effects of the Embodiment> As described above, according to the substrate processing apparatus 1, since the switching mechanism 51 is arranged at substantially the same height position as the processing housing 23, the flow path between the switching mechanism 51 and the processing housing 23 can be preferably shortened. As a result, the gas can be appropriately discharged from the processing housing 23.

[0239] Furthermore, the substrate processing apparatus 1 can obtain the following effects.

[0240] At least a part of the switching mechanism 51 is disposed laterally of the processing housing 23. Therefore, the overall height of the processing housing 23 and the switching mechanism 51 can be suppressed. For this reason, the height of the substrate processing apparatus 1 can be kept low. Furthermore, the number of processing housings 23 arranged in the vertical direction Z can be easily increased. In this way, while suppressing the increase in size of the substrate processing apparatus 1, the throughput of the substrate processing apparatus 1 can be suitably improved. Here, the "height" is the length in the vertical direction Z.

[0241] The upper end P1 of the switching mechanism 51 is equal to or lower than the upper end P2 of the processing housing 23. The lower end Q1 of the switching mechanism 51 is equal to or higher than the lower end Q2 of the processing housing 23. In this way, the entire switching mechanism 51 is disposed at a position equal to or lower than the upper end P2 and equal to or higher than the lower end Q2. For this reason, the flow path between the switching mechanism 51 and the processing housing 23 can be suitably shortened.

[0242] The switching housing 53 is disposed at a position equal to or lower than the upper surface 31a of the holding unit 31. For this reason, the size of the switching mechanism 51 is relatively small. Specifically, the height of the switching mechanism 51 is smaller than the height of the processing housing 23. Thus, an increase in size of the substrate processing apparatus 1 can be suitably suppressed.

[0243] The switching mechanism 51 is disposed at a position that does not overlap the holding unit 31 in plan view. For this reason, interference between the holding unit 31 and the switching mechanism 51 can be easily avoided.

[0244] The distance from the center point G to the switching mechanism 51 is larger than three times the radius of the substrate W in plan view. That is, the switching mechanism 51 is disposed in an area where the distance from the center point G is larger than three times the radius of the substrate W in plan view. Thus, interference between the holding unit 31 and the switching mechanism 51 can be surely avoided.

[0245] The distance from the center point G to the switching mechanism 51 is smaller than five times the radius of the substrate W in a plan view. That is, the switching mechanism 51 is arranged in an area where the distance from the center point G is smaller than five times the radius of the substrate W in a plan view. Therefore, the flow path between the switching mechanism 51 and the processing housing 23 can be effectively shortened. Further, the switching mechanism 51 is relatively small in a plan view. Thus, an increase in the footprint of the substrate processing apparatus 1 can be suitably suppressed.

[0246] The exhaust pipes 41 - 43 each extend in the vertical direction Z. For this reason, the installation area of the exhaust pipes 41 - 43 in a plan view can be suitably reduced. Thus, an increase in the footprint of the substrate processing apparatus 1 can be suitably suppressed.

[0247] The substrate processing apparatus 1 includes a first pipe space 44. For this reason, the exhaust pipes 41 - 43 can be suitably installed.

[0248] The transfer mechanism 16 transfers the substrate W to the holding unit 31. The transfer mechanism 16 is installed in the transfer space 12. The transfer space 12 is adjacent to the processing housing 23. Thus, the transfer mechanism 16 can easily transfer the substrate W to the holding unit 31.

[0249] The substrate processing apparatus 1 includes a first pipe space 44. For this reason, the exhaust pipes 41 - 43 can be suitably installed.

[0250] The first pipe space 44 is adjacent to the processing housing 23. For this reason, the exhaust pipes 41 - 43 can be installed in the vicinity of the processing housing 23.

[0251] The transfer space 12 extends in the front - rear direction X. The processing housing 23 and the first pipe space 44 are arranged side by side in the front - rear direction X. For this reason, the transfer space 12 adjacent to the processing housing 23 and the first pipe space 44 adjacent to the processing housing 23 can be suitably arranged respectively. Thus, it can be suitably prevented that the transfer mechanism 16 interferes with the exhaust pipes 41 - 43.

[0252] The first pipe space 44 and the processing housing 23 are arranged in the front-rear direction X. The exhaust pipes 41-43 are arranged in the width direction Y. Therefore, the exhaust pipes 41-43 can be installed near the processing housing 23 respectively.

[0253] At least a part of the switching mechanism 51 is installed in the first pipe space 44. Therefore, the switching mechanism 51 can be installed near the processing housing 23. Further, the switching mechanism 51 can be easily connected to the exhaust pipes 41-43.

[0254] The switching mechanism 51 includes opening / closing parts 61, 62, 63. The opening / closing part 61 is movable between a position where the processing housing 23 is communicated with the exhaust pipe 41 and a position where the processing housing 23 is blocked from the exhaust pipe 41. The opening / closing part 62 is movable between a position where the processing housing 23 is communicated with the exhaust pipe 42 and a position where the processing housing 23 is blocked from the exhaust pipe 42. The opening / closing part 63 is movable between a position where the processing housing 23 is communicated with the exhaust pipe 43 and a position where the processing housing 23 is blocked from the exhaust pipe 43. The opening / closing parts 61, 62, 63 are movable independently of each other. Therefore, the switching mechanism 51 can communicate the exhaust pipes 41-43 with the processing housing 23 individually. The switching mechanism 51 can block the exhaust pipes 41-43 from the processing housing 23 individually.

[0255] The switching mechanism 51 includes a switching housing 53. The switching housing 53 is connected to the processing housing 23. The switching housing 53 houses the opening / closing parts 61-63. Therefore, the switching housing 53 can preferably form a flow path from the processing housing 23 to the opening / closing parts 61-63.

[0256] The switching housing 53 is connected to the processing housing 23 and the exhaust pipe 41. Therefore, the switching housing 53 can preferably form a flow path from the processing housing 23 to the exhaust pipe 41. Further, the switching housing 53 is connected to the exhaust pipes 42, 43. Therefore, the switching housing 53 can preferably form a flow path from the processing housing 23 to the exhaust pipes 42, 43.

[0257] The opening and closing parts 61 - 63 are installed in one switching housing 53. Therefore, the flow path from the processing housing 23 to the opening and closing parts 61 - 63 can be made shorter.

[0258] The opening and closing parts 61 - 63 are installed in one switching space 54. Therefore, under the same conditions, the opening and closing parts 61 - 63 can open and close the openings 41k - 43k of the exhaust pipes 41 - 43. Thus, the conditions for discharging gas from the processing housing 23 can be easily made equal among the exhaust pipes 41 - 43. For example, variation in the exhaust pressure among the exhaust pipes 41 - 43 can be suppressed. For example, variation in the exhaust flow rate among the exhaust pipes 41 - 43 can be suppressed. Therefore, the quality of the processing performed on the substrate W in the processing housing 23 can be suitably improved.

[0259] The switching housing 53 includes an introduction part 55. The introduction part 55 is connected to the processing housing 23. Therefore, gas can be easily introduced from the processing housing 23 into the switching housing 53.

[0260] The introduction part 55 extends in the front - rear direction X. As described above, the conveyance space 12 extends in the front - rear direction X. Therefore, the conveyance space 12 adjacent to the processing housing 23 and the introduction part connected to the processing housing 23 can be suitably arranged respectively. Thus, interference between the conveyance mechanism 16 and the introduction part 55 can be suitably prevented.

[0261] The switching housing 53 includes a distribution part 56. The distribution part 56 is connected to the introduction part 55. The distribution part 56 is connected to the exhaust pipes 41 - 43. Therefore, gas can be easily discharged from the switching housing 53 to the exhaust pipes 41 - 43.

[0262] The distribution part 56 is connected to the exhaust pipes 41 - 43. The distribution part 56 houses the opening and closing parts 61 - 63. Thus, the switching mechanism 51 can easily switch the exhaust path of the processing housing 23 among the exhaust pipes 41 - 43.

[0263] The distribution unit 56 extends in the width direction Y. As described above, the exhaust pipes 41 - 43 are arranged in the width direction Y. Thus, the direction in which the distribution unit 56 extends is parallel to the direction in which the exhaust pipes 41 - 43 are arranged. Therefore, the distribution unit 56 can be easily connected to the exhaust pipes 41 - 43.

[0264] The introduction unit 55 is disposed at a position relatively close to the transport space 12. Specifically, in a plan view, the separation distance between the introduction unit 55 and the transport space 12 is smaller than the separation distance between the holding unit 31 and the transport space 12. For this reason, it is possible to easily prevent the introduction unit 55 from interfering with members (for example, the base portions 37A - 37C) installed in the processing housing 23. Therefore, gas can be smoothly introduced from the processing housing 23 into the introduction unit 55. For example, it is possible to preferably avoid the flow of gas entering the introduction unit 55 from the processing housing 23 from being disturbed by members installed in the processing housing 23.

[0265] The air supply pipe 48 supplies gas to the processing housing 23. The second pipe space 46 houses the air supply pipe 48. The second pipe space 46 is adjacent to the processing housing 23. Therefore, the air supply pipe 48 can easily supply gas to the processing housing 23.

[0266] The first pipe space 44A, the processing housing 23A, and the second pipe space 46 are arranged in the front - rear direction X in this order. For this reason, the first pipe space 44 and the second pipe space 46 are separated by the processing housing 23. Therefore, the arrangement of the exhaust pipes 41 - 43 is not restricted by the air supply pipe 48. That is, the degree of freedom in the arrangement of the exhaust pipes 41 - 43 can be preferably increased. For example, the exhaust pipes 41 - 43 can be easily installed in the vicinity of the processing housing 23.

[0267] Taking the processing housing 23A as an example, an explanation will be given. The substrate processing apparatus 1 includes a processing housing 23A2. The processing housing 23A2 is disposed below the processing housing 23A1. For this reason, the installation areas of the processing housings 23A1 and 23A2 in a plan view can be preferably reduced. Therefore, an increase in the footprint of the substrate processing apparatus 1 can be preferably suppressed.

[0268] The substrate processing apparatus 1 includes a switching mechanism 51A2. The switching mechanism 51A2 switches the exhaust passage of the processing housing 23A2 to one of the exhaust pipes 41A - 43A. Therefore, each of the exhaust pipes 41A - 43A discharges the gas in the processing housing 23A2 in addition to the gas in the processing housing 23A1. Thus, the structure of the substrate processing apparatus 1 can be simplified.

[0269] The switching mechanism 51A2 is disposed at a position substantially the same height as the processing housing 23A2. For this reason, the flow path between the processing housing 23A2 and the switching mechanism 51A2 can be preferably shortened. As a result, the gas can be appropriately discharged from the processing housing 23A2.

[0270] The processing housing 23A2 is disposed at the same position as the processing housing 23A1 in plan view. The switching mechanism 51A2 is disposed at the same position as the switching mechanism 51A1 in plan view. For this reason, the relative positions of the processing housing 23A2 and the switching mechanism 51A2 are substantially the same as the relative positions of the processing housing 23A1 and the switching mechanism 51A1. Thus, the flow path between the processing housing 23A2 and the switching mechanism 51A2 has the same length and the same shape as the flow path between the processing housing 23A1 and the switching mechanism 51A1. Therefore, the conditions for discharging the gas can be easily made equal between the processing housings 23A1 and 23A2. For example, it is possible to suppress variations in the exhaust pressure between the processing housings 23A1 and 23A2. For example, it is possible to suppress variations in the exhaust flow rate between the processing housings 23A1 and 23A2. As a result, the quality of the processing performed on the substrate W can be preferably made equal between the processing housings 23A1 and 23A2.

[0271] The switching mechanism 51A2 is disposed at the same position as the switching mechanism 51A1 in plan view. The exhaust pipe 41A extends in the vertical direction Z. Therefore, each of the switching mechanisms 51A1 and 51A2 can be easily connected to the exhaust pipe 41A. Similarly, each of the exhaust pipes 42A and 43A extends in the vertical direction Z. Therefore, each of the switching mechanisms 51A1 and 51A2 can be easily connected to the exhaust pipes 42A and 43A.

[0272] Similarly, the substrate processing apparatus 1 includes processing casings 23A3 - 23A6. The processing casings 23A3 - 23A6 are each disposed below the processing casing 23A1. Thus, an increase in the footprint of the substrate processing apparatus 1 can be more suitably suppressed.

[0273] The substrate processing apparatus 1 includes switching mechanisms 51A3 - 51A6. The switching mechanisms 51A3 - 51A6 each switch the exhaust path of the processing casing 23A3 - 23A6 to one of the exhaust pipes 41A - 43A. Accordingly, the exhaust pipes 41A - 43A each discharge the gas of the processing casings 23A1 - 23A6. Thus, the structure of the substrate processing apparatus 1 can be further simplified.

[0274] In plan view, the processing casings 23A3 - 23A6 are disposed at the same position as the processing casing 23A1. In plan view, the switching mechanisms 51A3 - 51A6 are each disposed at the same position as the switching mechanism 51A1. Therefore, the relative positions of the processing casings 23A3 - 23A6 and the switching mechanisms 51A3 - 51A6 are substantially the same as the relative positions of the processing casing 23A1 and the switching mechanism 51A1. As a result, the quality of the processing performed on the substrate W can be suitably made equal among the processing casings 23A1 - 23A6.

[0275] In plan view, the switching mechanisms 51A3 - 51A6 are each disposed at the same position as the switching mechanism 51A1. The exhaust pipes 41A - 43A each extend in the vertical direction Z. Therefore, the switching mechanisms 51A3 - 51A6 can each be easily connected to the exhaust pipes 41A - 43A.

[0276] The pressure sensor 71 measures the pressure of the gas on the primary side of the switching mechanism 51. The pressure adjustment mechanism 73 adjusts the pressure of the gas on the primary side of the switching mechanism 51 based on the detection result of the pressure sensor 71. For this reason, the pressure on the primary side of the switching mechanism 51 can be suitably adjusted. Thus, the quality of the processing performed on the substrate W in the processing casing 23 can be suitably improved.

[0277] The pressure adjustment mechanism 73 adjusts, for example, so that the exhaust pressure becomes constant. Thereby, when processing the substrate W in the processing housing 23, it is possible to suppress fluctuations in the exhaust pressure. Therefore, the quality of the processing performed on the substrate W in the processing housing 23 can be suitably improved.

[0278] The pressure adjustment mechanisms 73A1 and 73A2 equalize, for example, the pressures of the gases on the primary sides of the switching mechanisms 51A1 and 51A2. Thereby, the exhaust pressure when processing the substrate W in the processing housing 23A1 and the exhaust pressure when processing the substrate W in the processing housing 23A2 can be suitably made equal. Therefore, the quality of the processing performed on the substrate W can be suitably made equal between the processing housings 23A1 and 23A2 arranged in the vertical direction Z.

[0279] The pressure adjustment mechanisms 73A1 - 73A6 equalize, for example, the pressures of the gases on the primary sides of the switching mechanisms 51A1 - 51A6 with each other. Thereby, the quality of the processing performed on the substrate W can be suitably made equal among all the processing housings 23A1 - 23A6 arranged in the vertical direction Z.

[0280] The pressure adjustment mechanisms 73A1 and 73B1 equalize, for example, the pressures of the gases on the primary sides of the switching mechanisms 51A1 and 51B1. Thereby, the quality of the processing performed on the substrate W can be suitably made equal between the processing housings 23A1 and 23B1 arranged at the same height position.

[0281] The pressure adjustment mechanisms 73A1, 73B1, 73C1, and 73D1 equalize, for example, the pressures of the gases on the primary sides of the switching mechanisms 51A1, 51B1, 51C1, and 51D1. Thereby, the quality of the processing performed on the substrate W can be suitably made equal among all the processing housings 23A1, 23B1, 23C1, and 23D1 arranged at the same height position.

[0282] The pressure adjustment mechanism 73 equalizes, for example, the pressures of the gases on the primary sides of the respective switching mechanisms 51. Thereby, the quality of the processing performed on the substrate W can be suitably made equal among all the processing housings 23.

[0283] The exhaust pipe 81A is connected to the exhaust pipes 41A and 41B. The exhaust pipe 81A discharges gas from the exhaust pipes 41A and 41B. In this way, the two exhaust pipes 41A and 41B are aggregated into one exhaust pipe 81A. Therefore, the structure of the substrate processing apparatus 1 can be simplified.

[0284] Similarly, the exhaust pipe 82A is connected to the exhaust pipes 42A and 42B. The exhaust pipe 82A discharges the gas from the exhaust pipes 41A and 42B. The exhaust pipe 83A is connected to the exhaust pipes 43A and 43B. The exhaust pipe 83A discharges the gas from the exhaust pipes 43A and 43B. Therefore, the structure of the substrate processing apparatus 1 can be further simplified.

[0285] The pressure sensor 84 measures the pressure of the gas inside the exhaust pipe 81. The pressure adjustment mechanism 87 adjusts the pressure of the gas inside the exhaust pipe 81 based on the detection result of the pressure sensor 84. Therefore, the pressure inside the exhaust pipe 81 can be suitably adjusted. Thus, the quality of the process performed on the substrate W in the processing housing 23 can be further suitably improved.

[0286] Similarly, the pressure sensors 85 and 86 measure the pressure of the gas inside the exhaust pipes 82 and 83. The pressure adjustment mechanisms 88 and 89 adjust the pressure of the gas inside the exhaust pipes 82 and 83 based on the detection results of the pressure sensors 85 and 86. Therefore, the pressures inside the exhaust pipes 82 and 83 can be suitably adjusted. Thus, the quality of the process performed on the substrate W in the processing housing 23 can be suitably improved.

[0287] Taking the exhaust pipe 81A as an example, an explanation will be given. The pressure sensor 84A is installed downstream of the connection position between the exhaust pipe 81A and the exhaust pipe 41A and the connection position between the exhaust pipe 81A and the exhaust pipe 41B. At the position downstream of the connection position between the exhaust pipe 81A and the exhaust pipe 41A and the connection position between the exhaust pipe 81A and the exhaust pipe 41B, both the gas from the exhaust pipe 41A and the gas from the exhaust pipe 41B flow. Therefore, the pressure sensor 84A can suitably detect the total exhaust pressure of the exhaust pipes 41A and 41B.

[0288] Similarly, the pressure sensor 85A is installed downstream of the connection positions between the exhaust pipe 82A and the exhaust pipe 42A, and between the exhaust pipe 82A and the exhaust pipe 42B. Therefore, the pressure sensor 85A can suitably detect the exhaust pressure of the entire exhaust pipes 42A and 42B. The pressure sensor 86A is installed at a position downstream of the connection positions between the exhaust pipe 83A and the exhaust pipe 43A, and between the exhaust pipe 83A and the exhaust pipe 43B. Therefore, the pressure sensor 86A can suitably detect the exhaust pressure of the entire exhaust pipes 43A and 43B.

[0289] For example, the pressure adjustment mechanism 87 adjusts so that the exhaust pressure becomes constant. Similarly, the pressure adjustment mechanisms 88 and 89 adjust so that the exhaust pressure becomes constant. Thereby, when processing the substrate W in the processing housing 23, it is possible to suppress fluctuations in the exhaust pressure. Therefore, the quality of the processing performed on the substrate W in the processing housing 23 can be suitably improved.

[0290] The pressure adjustment mechanisms 87A - 89A equalize, for example, the pressures of the gases inside the exhaust pipes 81A - 83A. Thereby, the exhaust pressures can be suitably equalized between the exhaust pipes 41A - 43A and 41B - 43B. Therefore, when switching the exhaust paths of the processing housings 23A and 23B, it is possible to suppress fluctuations in the exhaust pressure. Therefore, the quality of the processing performed on the substrate W in the processing housings 23A and 23B can be suitably improved.

[0291] The pressure adjustment mechanisms 87A and 87B equalize, for example, the pressures of the gases inside the exhaust pipes 81A and 81B. Thereby, even if the exhaust pipes 81A and 81B have different lengths from each other, it is possible to suppress variations in the exhaust pressure between the exhaust pipes 81A and 81B. Therefore, the exhaust pressures can be made equal between the exhaust paths 41A and 41B, and the exhaust paths 41C and 41D. Therefore, the quality W of the processing performed on the substrate W can be suitably made equal between the processing housings 23A and 23B and the processing housings 23C and 23D.

[0292] The pressure adjustment mechanisms 87A - 89A, 87B - 89B equalize, for example, the pressures of the gases inside the exhaust pipes 81A - 83A, 81B - 83B. Thereby, even if the exhaust pipes 81A - 83A, 81B - 83B have different lengths from each other, variation in the exhaust pressure can be suppressed among the exhaust pipes 81A - 83A, 81B - 83B. Thus, the exhaust pressures can be made equal among the exhaust paths 41A - 43A, 41B - 43B, 41C - 43C, 41D - 43D. Therefore, the quality of the processing performed on the substrate W can be made more suitably equal among the processing casings 23A, 23B, 23C, 23D.

[0293] The liquid supply unit 33 can supply the first processing liquid, the second processing liquid, and the third processing liquid. The liquid supply unit 33 switches the processing liquid to be supplied among the first processing liquid, the second processing liquid, and the third processing liquid. In response to the switching of the processing liquid used within the processing casing 23, the switching mechanism 51 switches the discharge path of the processing casing 23 among the exhaust pipes 41 - 43. When the liquid supply unit 33 supplies the first processing liquid, the switching mechanism 51 switches the discharge path of the processing casing 23 to the exhaust pipe 41. When the liquid supply unit 33 supplies the second processing liquid, the switching mechanism 51 switches the discharge path of the processing casing 23 to the exhaust pipe 42. When the liquid supply unit 33 supplies the third processing liquid, the switching mechanism 51 switches the discharge path of the processing casing 23 to the exhaust pipe 43. As a result, when the liquid supply unit 33 supplies the first processing liquid, the exhaust pipe 41 discharges the gas of the processing casing 23. When the liquid supply unit 33 supplies the second processing liquid or the third processing liquid, the exhaust pipe 41 does not discharge the gas of the processing casing 23. Thus, soiling of the inside of the exhaust pipe 41 can be suitably suppressed. For the same reason, soiling of the inside of the exhaust pipes 42 and 43 can also be suitably suppressed. Therefore, the gas flows smoothly through the exhaust pipes 41 - 43. As a result, the gas of the processing casing 23 can be discharged more appropriately.

[0294] Furthermore, soiling of the inside of the exhaust pipes 81 - 83 can be suitably suppressed. Therefore, the gas flows smoothly through the exhaust pipes 81 - 83. As a result, the gas of the processing casing 23 can be discharged more appropriately.

[0295] The present invention is not limited to the embodiments and can be implemented with modifications as follows.

[0296] In the embodiment, the switching mechanism 51 switches the exhaust path of the gas in the processing housing 23 to one of the exhaust pipes 41 - 43. That is, the switching mechanism 51 switches among the three exhaust pipes (specifically, exhaust pipes 41 - 43). However, it is not limited thereto. The switching mechanism 51 may switch between two exhaust pipes. For example, the exhaust pipe 43 may be omitted. In this case, the switching mechanism 51 switches the discharge path of the processing housing 23 to one of the exhaust pipes 41 and 42. The switching mechanism 51 switches the discharge path of the processing housing 23 between the exhaust pipes 41 and 42. The switching mechanism 51 may switch among four or more exhaust pipes. For example, in addition to the exhaust pipes 41 - 43, the substrate processing apparatus 1 may be provided with additional exhaust pipes. In this case, the switching mechanism 51 switches the discharge path of the processing housing 23 to one of the exhaust pipes 41 - 43 and the additional exhaust pipes. The switching mechanism 51 switches the discharge path of the processing housing 23 between the exhaust pipes 41 - 43 and the additional exhaust pipes.

[0297] In the embodiment, the exhaust pipes 41 - 43 are arranged between the processing housing 23 and the distribution unit 56 in a plan view. However, it is not limited thereto. The distribution unit 56 may be arranged between the exhaust pipes 41 - 43 and the processing housing 23 in a plan view.

[0298] FIG. 13 is a plan view of the processing unit 21 in a modified embodiment. For the same configurations as in the embodiment, the detailed description is omitted by attaching the same reference numerals.

[0299] The substrate processing apparatus 1 includes a switching mechanism 101. The switching mechanism 101 includes a switching housing 103. The switching housing 103 includes a distribution unit 106. The distribution unit 106 is installed outside the processing housing 23. The distribution unit 106 is installed in the first pipe space 44. The distribution unit 106 is in contact with the processing housing 23. In a plan view, the distribution unit 106 is disposed between the processing housing 23 and the exhaust pipes 41 - 43. Specifically, the distribution unit 106 is in contact with the side wall 25b of the processing housing 23. The distribution unit 106 is disposed between the side wall 25b and the exhaust pipes 41 - 43.

[0300] In the embodiment, a part (for example, the first end 55a) of the switching mechanism 51 is disposed inside the processing housing 23. However, it is not limited thereto. All of the switching mechanism 51 may be disposed outside the processing housing 23. Similarly, in the embodiment, a part (for example, the first end 55a) of the switching housing 53 is disposed inside the processing housing 23. However, it is not limited thereto. All of the switching housing 53 may be disposed outside the processing housing 23.

[0301] Referring to FIG. 13, the switching mechanism 101 includes an introduction unit 105. The introduction unit 105 extends in the front - rear direction X. The introduction unit 105 has a first end 105a and a second end 105b. The first end 105a corresponds to the upstream end of the switching space 54. The first end 105a is disposed on the side wall 25b of the processing housing 23. The first end 105a is connected to the side wall 25b of the processing housing 23. The first end 105a is not disposed inside the processing housing 23. The second end 105b is installed outside the processing housing 23. Therefore, the entire introduction unit 105 is installed outside the processing housing 23. As a result, the entire switching housing 103 is installed outside the processing housing 23. The entire switching mechanism 101 is installed outside the processing housing 23. Here, the outside of the processing housing 23 is specifically the first pipe space 44.

[0302] In the embodiment, a part of the switching mechanism 51 (for example, the first end 55a) is installed inside the processing housing 23. However, it is not limited to this. All of the switching mechanism 51 may be installed inside the processing housing 23. Similarly, in the embodiment, a part of the switching housing 53 is arranged inside the processing housing 23. However, it is not limited to this. All of the switching housing 53 may be arranged inside the processing housing 23. In the embodiment, the opening / closing parts 61 - 63 are arranged outside the processing housing 23. However, it is not limited to this. The opening / closing parts 61 - 63 may be arranged inside the processing housing 23.

[0303] FIG. 14 is a plan view of the processing unit 21 in a modified embodiment. Note that the same components as those in the embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. FIG. 14 schematically shows the liquid supply unit 33 for convenience.

[0304] The exhaust pipes 41 - 43 are installed in the first pipe space 44. The openings k1 - k3 of the exhaust pipes 41 - 43 are each in contact with the processing housing 23 (specifically, the side wall 25b).

[0305] The substrate processing apparatus 1 includes a switching mechanism 111. The switching mechanism 111 includes opening / closing parts 113, 114, 115. The opening / closing parts 113 - 115 are each installed inside the processing housing 23. The opening / closing parts 113 - 115 are each installed in the vicinity of the side wall 25b. The opening / closing parts 113 - 115 are each arranged at a position facing the openings 41k - 43k.

[0306] Each of the opening / closing parts 113 - 115 has the same structure as the opening / closing parts 61 - 63. The opening / closing part 113 is movable between a position where the processing housing 23 is communicated with the exhaust pipe 41 and a position where the processing housing 23 is blocked from the exhaust pipe 41. The opening / closing part 114 is movable between a position where the processing housing 23 is communicated with the exhaust pipe 42 and a position where the processing housing 23 is blocked from the exhaust pipe 42. The opening / closing part 115 is movable between a position where the processing housing 23 is communicated with the exhaust pipe 43 and a position where the processing housing 23 is blocked from the exhaust pipe 43.

[0307] Thus, all of the switches 111 are installed inside the processing housing 23.

[0308] In the modified embodiment shown in FIG. 14, the switching mechanism 111 may or may not include a switching housing. When the switching mechanism 111 includes a switching housing, the entire switching housing of the switching mechanism 111 may be installed inside the processing housing 23.

[0309] In the embodiment, the switching mechanism 51 includes a switching housing 53. However, it is not limited thereto. As illustrated in the modified embodiment of FIG. 14, the switching housing 53 may be appropriately omitted.

[0310] In the embodiment, the switching housing 53 is not connected to the cup 38. However, it is not limited thereto. The switching housing 53 may be connected to the cup 38. The switching housing 53 may form a flow path from the inside of the cup 38 to the exhaust pipes 41 - 43.

[0311] In the embodiment, when the opening / closing part 61 is in a position where it communicates the processing housing 23 with the exhaust pipe 41, the opening / closing part 61 does not block the processing housing 23 from the exhaust pipes 42 and 43. However, it is not limited thereto. When the opening / closing part 61 is in a position where it communicates the processing housing 23 with the exhaust pipe 41, the opening / closing part 61 may block the processing housing 23 from the exhaust pipes 42 and 43. Similarly, in the embodiment, when the opening / closing part 62 is in a position where it communicates the processing housing 23 with the exhaust pipe 42, the opening / closing part 62 does not block the processing housing 23 from the exhaust pipe 43. However, it is not limited thereto. When the opening / closing part 62 is in a position where it communicates the processing housing 23 with the exhaust pipe 42, the opening / closing part 62 may block the processing housing 23 from the exhaust pipe 43.

[0312] FIG. 15 is a plan view of the processing unit 21 in a modified embodiment. Note that the same components as those in the embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

[0313] The substrate processing apparatus 1 includes a switching mechanism 121. The switching mechanism 121 includes opening / closing portions 123 and 124. The opening / closing portions 123 and 124 are installed inside the switching housing 53. That is, the opening / closing portions 123 and 124 are installed in the switching space 54. The opening / closing portions 123 and 124 are respectively arranged at positions facing the openings 41k and 42k. The opening / closing portion 123 opens and closes the opening 41k. The opening / closing portion 124 opens and closes the opening 42k. Note that the switching mechanism 121 does not include a member corresponding to the opening / closing portion 63.

[0314] The gas flows in one direction through the switching space 54. The gas flows from the introduction portion 55 to the distribution portion 56. The openings 41k, 42k, and 43k communicate with the switching space 54 respectively. The position where the opening 42k communicates with the switching space 54 is downstream of the position where the opening 41k communicates with the switching space 54. The position where the opening 43k communicates with the switching space 54 is downstream of the position where the opening 42k communicates with the switching space 54.

[0315] Here, the switching space 54 is divided into a first area 126, a second area 127, and a third area 128 by virtual boundaries B1 and B2. FIG. 15 exemplifies the positions of the boundaries B1 and B2 with a dashed-dotted line. The boundary B1 is located downstream of the position where the opening 41k communicates with the switching space 54 and upstream of the position where the opening 42k communicates with the switching space 54. The boundary B2 is located downstream of the position where the opening 42k communicates with the switching space 54 and upstream of the position where the opening 43k communicates with the switching space 54. The first area 126 is a portion of the switching space 54 located upstream of the boundary B1. The second area 127 is a portion of the switching space 54 located downstream of the boundary B1 and upstream of the boundary B2. The third area 128 is a portion of the switching space 54 located downstream of the boundary B2.

[0316] The opening / closing part 123 is movable between a position where the processing housing 23 communicates with the exhaust pipe 41 and a position where the processing housing 23 is blocked from the exhaust pipe 41. FIG. 15 shows the opening / closing part 123 in the position where the processing housing 23 communicates with the exhaust pipe 41 by a solid line. FIG. 15 shows the opening / closing part 123 in the position where the processing housing 23 is blocked from the exhaust pipe 41 by a dashed line.

[0317] When the opening / closing part 123 is in the position where the processing housing 23 communicates with the exhaust pipe 41, in addition to opening the opening 41k, the opening / closing part 123 blocks the first area 126 from the second area 127. That is, when the opening / closing part 123 makes the processing housing 23 communicate with the exhaust pipe 41, the opening / closing part 123 blocks the processing housing 23 from the exhaust pipes 42 and 43. When the opening / closing part 123 is in the position where the processing housing 23 is blocked from the exhaust pipe 41, in addition to closing the opening 41k, the opening / closing part 123 makes the first area 126 communicate with the second area 127. That is, when the opening / closing part 123 blocks the processing housing 23 from the exhaust pipe 41, the opening / closing part 123 does not block the processing housing 23 from the exhaust pipes 42 and 43.

[0318] The opening / closing part 124 is movable between a position where the processing housing 23 communicates with the exhaust pipe 42 and a position where the processing housing 23 is blocked from the exhaust pipe 42. FIG. 15 shows the opening / closing part 124 in the position where the processing housing 23 communicates with the exhaust pipe 42 by a solid line. FIG. 15 shows the opening / closing part 124 in the position where the processing housing 23 is blocked from the exhaust pipe 42 by a dashed line.

[0319] When the opening / closing part 124 is in the position where the processing housing 23 communicates with the exhaust pipe 42, in addition to opening the opening 42k, the opening / closing part 124 blocks the second area 127 from the third area 128. That is, when the opening / closing part 124 makes the processing housing 23 communicate with the exhaust pipe 42, the opening / closing part 124 blocks the processing housing 23 from the exhaust pipe 43. When the opening / closing part 124 is in the position where the processing housing 23 is blocked from the exhaust pipe 42, in addition to closing the opening 42k, the opening / closing part 124 makes the second area 127 communicate with the third area 128. That is, when the opening / closing part 124 blocks the processing housing 23 from the exhaust pipe 42, the opening / closing part 124 does not block the processing housing 23 from the exhaust pipe 43.

[0320] When the switching mechanism 121 switches the exhaust passage of the processing housing 23 to the exhaust pipe 41, the opening / closing part 123 moves to a position where the processing housing 23 is communicated with the exhaust pipe 41. The opening / closing part 124 may move to either a position where the processing housing 23 is communicated with the exhaust pipe 42 or a position where the processing housing 23 is blocked from the exhaust pipe 42.

[0321] When the switching mechanism 121 switches the exhaust passage of the processing housing 23 to the exhaust pipe 42, the opening / closing part 123 moves to a position where the processing housing 23 is blocked from the exhaust pipe 41. The opening / closing part 124 moves to a position where the processing housing 23 is communicated with the exhaust pipe 42.

[0322] When the switching mechanism 121 switches the exhaust passage of the processing housing 23 to the exhaust pipe 43, the opening / closing part 123 moves to a position where the processing housing 23 is blocked from the exhaust pipe 41. The opening / closing part 124 moves to a position where the processing housing 23 is blocked from the exhaust pipe 42.

[0323] According to this modified embodiment, the member corresponding to the opening / closing part 63 can be omitted. That is, the number of the opening / closing parts 123 and 124 may be one less than the number of the exhaust pipes 41 - 43. Therefore, the structure of the switching mechanism 121 can be simplified.

[0324] When the switching mechanism 121 switches the exhaust passage of the processing housing 23 to the exhaust pipe 41, it is possible to prevent the gas from flowing into the second area 127 and the third area 128, and it is possible to preferably prevent the gas from staying in the second area 127 and the third area 128. Therefore, the gas in the processing housing 23 can be discharged more appropriately.

[0325] When the switching mechanism 121 switches the exhaust passage of the processing housing 23 to the exhaust pipe 42, it is possible to prevent the gas from flowing into the third area 128, and it is possible to preferably prevent the gas from staying in the third area 128. Therefore, the gas in the processing housing 23 can be discharged more appropriately.

[0326] In the embodiment, the rotation axis line A1 of the opening / closing part 61 passes through the first end of the opening / closing part 61. However, it is not limited to this. The position of the rotation axis line A1 of the opening / closing part 61 can be changed appropriately.

[0327] FIG. 16 is a plan view of the processing unit 21 in a modified embodiment. The same components as those in the embodiment are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0328] The substrate processing apparatus 1 includes a switching mechanism 131. The switching mechanism 131 includes opening / closing portions 133 and 134. The opening / closing portions 133 and 134 are installed inside the switching housing 53. The opening / closing portions 133 and 134 are respectively disposed at positions facing the openings 41k and 42k. The opening / closing portion 133 opens and closes the opening 41k. The opening / closing portion 134 opens and closes the opening 42k. Note that the switching mechanism 131 does not include a member corresponding to the opening / closing portion 63.

[0329] The opening / closing portion 133 has a substantially T-shaped configuration in a plan view. The opening / closing portion 133 includes a plate portion 133a and a base portion 133b. The plate 133a has a substantially vertical flat plate shape. The base portion 133b is connected to the central portion of the plate portion 133a in a plan view. The base portion 133b protrudes in a horizontal direction from the plate portion 133a. The opening / closing portion 133 swings around a rotation axis A4. The rotation axis A4 is an imaginary line parallel to the vertical direction Z. The rotation axis A4 passes through the base portion 133b. The rotation axis A4 does not pass through the plate portion 133a. The opening / closing portion 133 swings around the rotation axis A4.

[0330] The opening / closing portion 134 has the same structure as the opening / closing portion 133. That is, the opening / closing portion 134 includes a plate portion 134a and a base portion 134b. The opening / closing portion 134 swings around a rotation axis A5.

[0331] The opening / closing portion 133 is movable to a position where the processing housing 23 communicates with the exhaust pipe 41 and a position where the processing housing 23 is blocked from the exhaust pipe 41. FIG. 16 shows the opening / closing portion 133 at the position where the processing housing 23 communicates with the exhaust pipe 41 by a solid line. FIG. 16 shows the opening / closing portion 133 at the position where the processing housing 23 is blocked from the exhaust pipe 41 by a dashed line.

[0332] The opening / closing part 134 is movable between a position where the processing housing 23 communicates with the exhaust pipe 42 and a position where the processing housing 23 is blocked from the exhaust pipe 42. FIG. 16 shows the opening / closing part 134 at the position where the processing housing 23 communicates with the exhaust pipe 42 by a dashed line. FIG. 16 shows the opening / closing part 134 at the position where the processing housing 23 is blocked from the exhaust pipe 42 by a solid line.

[0333] The opening / closing parts 133 and 134 have the same functions as the opening / closing parts 123 and 124 shown in FIG. 15. For example, when the opening / closing part 133 is at the position where the processing housing 23 communicates with the exhaust pipe 41, the opening / closing part 133 blocks the processing housing 23 from the exhaust pipes 42 and 43. When the opening / closing part 134 is at the position where the processing housing 23 communicates with the exhaust pipe 42, the opening / closing part 134 blocks the processing housing 23 from the exhaust pipe 43.

[0334] In the embodiment, the liquid supply unit 33 supplies the first processing liquid, the second processing liquid, and the third processing liquid. That is, the number of types of processing liquids that the liquid supply unit 33 can supply is three. However, it is not limited to this. The number of types of processing liquids that the liquid supply unit 33 can supply may be less than three. The number of types of processing liquids that the liquid supply unit 33 can supply may be more than three.

[0335] For example, the liquid supply unit 33 may be able to supply a fourth processing liquid. The fourth processing liquid is classified as, for example, a rinse liquid. The fourth processing liquid includes, for example, at least one of pure water, carbonated water, electrolyzed ion water, hydrogen water, ozone water, and diluted hydrochloric acid water.

[0336] In the embodiment, the processing unit 21 may further include a processing gas supply unit. The processing gas supply unit is installed inside the processing housing 23. The processing gas supply unit supplies a processing gas to the substrate W held by the holding unit 31. The processing gas supply unit supplies at least one type of processing gas. The processing gas is, for example, a gas other than clean air.

[0337] When the processing unit 21 includes a processing gas supply unit, the switching mechanism 51 may operate as follows. In response to switching between use and non-use of the processing gas within the processing housing 23, the switching mechanism 51 may switch the discharge path of the processing housing 23. When switching between a plurality of types of processing gases for the processing gas used within the processing housing 23, in response to switching of the type of processing gas, the switching mechanism 51 may switch the discharge path of the processing housing 23. In response to switching between supply of the processing liquid and supply of the processing gas, the switching mechanism 51 may switch the discharge path of the processing housing 23.

[0338] In the embodiment, the liquid supply unit 33 supplies the first processing liquid, the second processing liquid, and the third processing liquid to the substrate W held by the holding unit 31 in this order. However, it is not limited to this. The order of supplying the first processing liquid, the second processing liquid, and the third processing liquid may be changed as appropriate.

[0339] In the embodiment, the number of processing housings 23 installed at substantially the same height position is four. However, it is not limited to this. The number of processing housings 23 installed at substantially the same height position may be less than four or more than four. In the above-described embodiment, the number of processing housings 23 arranged in the vertical direction Z is six. However, it is not limited to this. The number of processing housings 23 arranged in the vertical direction Z may be less than six or more than six.

[0340] In the embodiment, the substrate processing apparatus 1 includes two transfer spaces 12A and 12B. That is, the number of transfer spaces 12 is two. However, it is not limited to this. For example, the number of transfer spaces 12 may be one. For example, the transfer space 12B may be omitted. For example, the number of transfer spaces 12 may be three or more.

[0341] In the embodiment, the number of transfer mechanisms 16 installed in one transfer space 12 is one. However, it is not limited to this. For example, the number of transfer mechanisms 16 installed in one transfer space 12 may be two or more.

[0342] In the embodiment, the first pipe space 44A is disposed in front of the processing housing 23A. The second pipe space 46A is disposed behind the processing housing 23A. However, the present invention is not limited to this. The relative positions of the processing housing 23A, the first pipe space 44A, and the second pipe space 46A may be changed as appropriate.

[0343] FIG. 17 is a plan view showing the interior of the substrate processing apparatus 141 in a modified embodiment. The same components as those in the embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0344] In the substrate processing apparatus 141, the first pipe space 44A is disposed behind the processing housing 23A. The second pipe space 46A is disposed in front of the processing housing 23A.

[0345] Furthermore, in the substrate processing apparatus 141, the first pipe space 44B is disposed behind the processing housing 23B. The second pipe space 46B is disposed in front of the processing housing 23B. The first pipe space 44C is disposed in front of the processing housing 23C. The second pipe space 46C is disposed behind the processing housing 23C. The first pipe space 44D is disposed in front of the processing housing 23D. The second pipe space 46D is disposed behind the processing housing 23D.

[0346] Also in the substrate processing apparatus 141, the relative positions of the processing housing 23B, the first pipe space 44B, and the second pipe space 46B are the same as the relative positions of the processing housing 23A, the first pipe space 44A, and the second pipe space 46A. The relative positions of the processing housing 23C, the first pipe space 44C, and the second pipe space 46C are the same as the relative positions of the processing housing 23A, the first pipe space 44A, and the second pipe space 46A. The relative positions of the processing housing 23D, the first pipe space 44D, and the second pipe space 46D are the same as the relative positions of the processing housing 23A, the first pipe space 44A, and the second pipe space 46A.

[0347] In the embodiment, the exhaust pipes 41A - 43A are disposed in front of the processing housing 23A. However, the present invention is not limited to this.

[0348] Refer to FIG. 17. In the substrate processing apparatus 141, the exhaust pipes 41A - 43A are arranged behind the processing housing 23A.

[0349] Furthermore, in the substrate processing apparatus 141, the exhaust pipes 41B - 43B are arranged behind the processing housing 23B. The exhaust pipes 41C - 43C are arranged in front of the processing housing 23C. The exhaust pipes 41D - 43D are arranged in front of the processing housing 23D.

[0350] In the embodiment, the structure of the transfer mechanism 6 of the indexer unit 3 is illustrated. However, it is not limited thereto. The structure of the transfer mechanism 6 may be changed as appropriate.

[0351] Refer to FIG. 17. The indexer unit 3 includes a transfer mechanism 146. The transfer mechanism 146 includes a hand 147 and a hand drive unit 148. The hand 147 holds one substrate W in a horizontal posture. The hand drive unit 148 is connected to the hand 147. The hand drive unit 148 moves the hand 147. The hand drive unit 8 moves the hand 7 in the front - rear direction X, the width direction Y, and the vertical direction Z.

[0352] The hand drive unit 148 includes a first drive unit 148a and a second drive unit 148b. The second drive unit 148b is supported by the first drive unit 148a. The first drive unit 148a moves the second drive unit 148b in the vertical direction Z. The first drive unit 148a further rotates the second drive unit 148b around a rotation axis parallel to the vertical direction Z. However, the first drive unit 148a does not move the second drive unit 148b in the horizontal direction. The first drive unit 148a itself is immovable in the horizontal direction. The second drive unit 148b moves horizontally with respect to the first drive unit 148a. The second drive unit 148b is constituted by, for example, a multi - joint arm. The second drive unit 148b is connected to the hand 147. Since the hand drive unit 148 has such a configuration, the hand 147 is movable in parallel in the vertical direction Z. The hand 147 is movable in parallel in any horizontal direction. The hand 147 is rotatable in the horizontal plane.

[0353] In the embodiment, the structure of the transport mechanism 16 of the processing block 11 is illustrated. However, it is not limited thereto. The structure of the transport mechanism 16 may be changed as appropriate. For example, the transport mechanism 16 may have the same structure as the above-described transport mechanism 146.

[0354] In the embodiment, as shown in FIG. 8, the opening / closing part 61 has a substantially rectangular shape when viewed from the front. However, it is not limited thereto. The shape of the opening / closing part 61 may be changed as appropriate. Similarly, the shapes of the opening / closing parts 62 and 63 may be changed as appropriate.

[0355] FIG. 18 is a front view of the switching mechanism of the modified embodiment. FIGS. 19(a) and 19(b) are side views of the switching mechanism of the modified embodiment. Note that the same components as those in the embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

[0356] Referring to FIG. 18, the substrate processing apparatus 1 includes a switching mechanism 141. The switching mechanism 141 includes opening / closing parts 142, 143, and 144. The opening / closing parts 142 to 144 are each installed inside the switching housing 53. The opening / closing parts 142 to 144 each have a substantially circular shape.

[0357] The opening / closing part 142 is swingable around the rotation axis A6. The rotation axis A6 is a horizontal virtual line. The rotation axis A6 is parallel to the width direction Y. The rotation axis A6 is disposed above the opening / closing part 142. The rotation axis A6 does not pass through the center of the opening / closing part 142. When the opening / closing part 142 swings around the rotation axis A6, the opening / closing part 142 moves to a position where the processing housing 23 is communicated with the first exhaust pipe 41 and a position where the processing housing 23 is blocked from the first exhaust pipe 41. Similarly, the opening / closing parts 143 and 144 are each swingable around the rotation axes A7 and A8, respectively.

[0358] In FIG. 18, the opening / closing part 142 is disposed at a position where the processing housing 23 is blocked from the exhaust pipe 41. Similarly, the opening / closing parts 143 and 144 are each disposed at a position where the processing housing 23 is blocked from the exhaust pipes 42 and 43, respectively.

[0359] In Fig. 19(a), the opening / closing part 142 is disposed at a position where the processing housing 23 is blocked from the exhaust pipe 41. The opening / closing part 142 closes the opening 41k of the exhaust pipe 41. In Fig. 19(b), the opening / closing part 142 is disposed at a position where the processing housing 23 is communicated with the exhaust pipe 41. The opening / closing part 142 opens the opening 41k.

[0360] Refer to Figs. 19(a) and 19(b). The opening / closing part 142 is supported by the switching housing 53. The opening / closing part 142 is supported by the distribution part 56. Specifically, the switching mechanism 141 includes a stay 146 and a mounting member 147. The stay 146 is fixed to the switching housing 53. The stay 146 is fixed to the distribution part 56. The mounting member 147 is supported by the stay 146. The mounting member 147 is rotatable around the rotation axis A6 with respect to the stay 146. The mounting member 147 is fixed to the opening / closing part 142.

[0361] Refer to Fig. 18. Similar to the opening / closing part 142, the opening / closing parts 143 and 144 are respectively fixed to the mounting members 148 and 149.

[0362] In the embodiment, a mechanism for moving the opening / closing parts 61 - 63 is not specifically exemplified. Therefore, with reference to Figs. 19(a) and 19(b), a mechanism for moving the opening / closing part 142 is exemplified.

[0363] The processing block 11 includes a drive part 151 for moving the opening / closing part 142. Note that the drive part 151 is not an element of the switching mechanism 141.

[0364] The drive part 151 includes an actuator 152. The actuator 152 generates power for moving the opening / closing part 142. The actuator 152 is, for example, an air cylinder, a hydraulic cylinder or an electric motor. The actuator 152 is disposed outside the switching housing 53. The actuator 152 is disposed in the first pipe space 44. The actuator 152 is disposed above the switching housing 53. The actuator 152 is disposed above the distribution part 56.

[0365] The drive unit 151 includes a rod 153. The rod 153 is connected to the actuator 152. The rod 153 extends downward from the actuator 152. The rod 153 penetrates the switching housing 53. At least a part of the rod 153 is disposed inside the switching housing 53. The actuator 152 moves the rod 153 in the vertical direction Z.

[0366] The drive unit 151 includes a link 154. The link 154 is disposed inside the switching housing 53. The link 154 connects the rod 153 and the mounting member 148. The link 154 is rotatable about the axis A11 with respect to the rod 153. The link 154 is rotatable about the axis A12 with respect to the mounting member 148. The axes A11 and A12 are each a horizontal virtual line. The axes A11 and A12 are each parallel to the width direction Y.

[0367] When the actuator 152 moves the rod 153 in the vertical direction Z, the opening / closing part 142 rotates about the rotation axis A6. When the actuator 152 moves the rod 153 upward, the opening / closing part 142 moves to a position where the processing housing 23 communicates with the exhaust pipe 41. When the actuator 152 moves the rod 153 downward, the opening / closing part 142 moves to a position where the processing housing 23 is blocked from the exhaust pipe 41.

[0368] In the embodiment, further, a gas leak in the exhaust passage of the processing housing 23 may be detected. For example, a gas leak from the opening / closing parts 61 - 63 may be detected.

[0369] Referring to FIGS. 18, 19(a), and 19(b). The processing block 11 includes wind speed sensors 162, 163, and 164. The wind speed sensor 162 is disposed near the opening / closing part 142. The wind speed sensor 162 is disposed, for example, inside the switching housing 53. The wind speed sensor 162 is disposed, for example, inside the distribution part 56. When the rotation axis A6 is disposed above the opening / closing part 142, it is preferable that the wind speed sensor 162 is disposed below the opening / closing part 142. Similarly, the wind speed sensors 163 and 164 are disposed near the opening / closing parts 143 and 144.

[0370] The wind speed sensor 162 detects the wind speed of the gas (specifically, the moving speed of the gas) in the vicinity of the opening / closing part 142. Similarly, the wind speed sensors 163 and 164 detect the wind speed of the gas in the vicinity of the opening / closing parts 143 and 144. The wind speed sensors 162 - 164 are, for example, hot-wire anemometers.

[0371] The wind speed sensor 162 may further detect the wind direction of the gas (specifically, the moving direction of the gas) in the vicinity of the opening / closing part 142. Similarly, the wind speed sensors 163 and 164 may further detect the wind direction of the gas in the vicinity of the opening / closing parts 143 and 144.

[0372] Although not shown in the figure, the control unit 91 is communicably connected to the wind speed sensors 162 - 164. The control unit 91 acquires the detection results of the wind speed sensors 162 - 164.

[0373] Based on the detection result of the wind speed sensor 162, the control unit 91 determines whether there is gas leakage from the opening / closing part 142. Gas leakage from the opening / closing part 142 means that when the opening / closing part 142 is arranged at a position where the processing housing 23 is blocked from the exhaust pipe 41, the opening / closing part 142 leaks gas from the processing housing 23 to the exhaust pipe 41.

[0374] Specifically, based on the detection result of the wind speed sensor 162, the control unit 91 calculates the wind speed of the gas in the vicinity of the opening / closing part 142. The calculated wind speed of the gas in the vicinity of the opening / closing part 142 is referred to as the "measured value".

[0375] When the opening / closing part 142 is arranged at a position where the processing housing 23 is blocked from the exhaust pipe 41, the control unit 91 monitors whether the measured value satisfies a predetermined condition. The predetermined condition is, for example, that the measured value is less than a preset first reference value. The predetermined condition is, for example, that the change in the measured value per unit time is less than a second reference value. And when the measured value does not satisfy the predetermined condition when the opening / closing part 142 is arranged at a position where the processing housing 23 is blocked from the exhaust pipe 41, the control unit 91 determines that gas leakage has occurred from the opening / closing part 142.

[0376] Here, at least one of the first reference value and the second reference value is preferably a variable, for example. At least one of the first reference value and the second reference value may change according to the positions of the other opening / closing parts 143 and 144, for example. At least one of the first reference value and the second reference value may change according to the position of the opening / closing part 142 belonging to the other switching mechanism 51, for example. At least one of the first reference value and the second reference value may change according to the positions of the opening / closing parts 142, 143, and 144 belonging to the other switching mechanism 51, for example. According to this, even when the wind speed of the gas in the vicinity of the opening / closing part 142 is liable to be disturbed, the control unit 91 can accurately determine the presence or absence of gas leakage from the opening / closing part 142.

[0377] Alternatively, at least one of the first reference value and the second reference value may be a constant.

[0378] Similarly, the control unit 91 determines the presence or absence of gas leakage from the opening / closing parts 143 and 144 based on the detection results of the wind speed sensors 163 and 164.

[0379] According to this modified embodiment, it is possible to suitably monitor whether or not the exhaust passage of the processing housing 23 is normally switched between the exhaust pipes 41 - 43.

[0380] Furthermore, the wind speed sensors 162 - 164 can suitably detect a minute gas flow. Therefore, it is possible to accurately monitor whether or not the exhaust passage of the processing housing 23 is normally switched between the exhaust pipes 41 - 43.

[0381] In this modified embodiment, further, when the control unit 91 detects a gas leak in the exhaust passage, the control unit 91 may perform at least one of issuing an alarm and stopping the operation of the liquid supply unit 33. When the control unit 91 issues an alarm, the user of the substrate processing apparatus 1 can be promptly notified of the gas leak in the exhaust passage. When the control unit 91 stops the operation of the liquid supply unit 33, the amount of components derived from the processing liquid contained in the gas in the processing housing 23 can be promptly suppressed. In any case, it is possible to preferably suppress the interior of the exhaust pipes 41 - 43 from being contaminated. For example, it is possible to preferably suppress the generation of crystals (salts) inside the exhaust pipes 41 - 43. For example, it is possible to preferably suppress the deposition of crystals inside the exhaust pipes 41 - 43.

[0382] In the modified embodiments shown in FIGS. 18, 19(a), and 19(b), the wind speed sensors 162 - 164 are arranged inside the switching housing 53. However, it is not limited to this.

[0383] For example, the wind speed sensor 162 may be arranged inside the exhaust pipe 41. Even when the wind speed sensor 162 is arranged inside the exhaust pipe 41, an appropriate reference value can be set in advance. Therefore, the control unit 91 can appropriately determine the presence or absence of a gas leak from the opening / closing unit 142. The arrangements of the wind speed sensors 163 and 164 may be changed in the same manner.

[0384] For example, the wind speed sensor 162 may be arranged inside the processing housing 23. Even when the wind speed sensor 162 is arranged inside the processing housing 23, an appropriate reference value can be set in advance. Therefore, the control unit 91 can appropriately determine the presence or absence of a gas leak from the opening / closing unit 142. The arrangements of the wind speed sensors 163 and 164 may be changed in the same manner.

[0385] Referring to the drawings, the arrangement of the wind speed sensors 162-164 is illustrated. FIG. 20(a) is a plan view in which an arrangement example of the wind speed sensors is drawn in addition to FIG. 6. FIG. 20(b) is a plan view in which an arrangement example of the wind speed sensors is drawn in addition to FIG. 13. FIG. 21(a) is a plan view in which an arrangement example of the wind speed sensors is drawn in addition to FIG. 15. FIG. 21(b) is a plan view in which an arrangement example of the wind speed sensors is drawn in addition to FIG. 16. For the same configurations as in the embodiments, detailed descriptions are omitted by attaching the same reference numerals.

[0386] Referring to FIG. 20(a). The wind speed sensor 162 includes at least one of the wind speed sensors 162a and 162b. The wind speed sensors 162a and 162b are respectively arranged in the vicinity of the opening / closing part 61. The wind speed sensor 162a is arranged inside the exhaust pipe 41. The wind speed sensor 162a is arranged in the vicinity of the opening 41k. The wind speed sensor 162b is arranged inside the switching housing 53. Similarly, the wind speed sensor 163 includes at least one of the wind speed sensors 163a and 163b. The wind speed sensor 164 includes at least one of the wind speed sensors 164a and 164b.

[0387] Referring to FIG. 20(b). The wind speed sensor 162 includes at least one of the wind speed sensors 162c and 162d. The wind speed sensors 162c and 162d are respectively arranged in the vicinity of the opening / closing part 113. The wind speed sensor 162c is arranged inside the processing housing 23. The wind speed sensor 162d is arranged inside the exhaust pipe 41. The wind speed sensor 162d is arranged in the vicinity of the opening 41k. Similarly, the wind speed sensor 163 includes at least one of the wind speed sensors 163c and 163d. The wind speed sensor 164 includes at least one of the wind speed sensors 164c and 164d.

[0388] Refer to Fig. 21(a). The wind speed sensor 162 includes at least any one of the wind speed sensors 162e, 162f, and 162g. The wind speed sensors 162e - 162g are each arranged in the vicinity of the opening / closing part 123. The wind speed sensor 162e is arranged inside the exhaust pipe 41. The wind speed sensor 162e is arranged in the vicinity of the opening 41k. The wind speed sensors 162f and 162g are each arranged inside the switching housing 53. As described above, when the opening / closing part 123 is arranged at a position where the processing housing 23 communicates with the exhaust pipe 41, the opening / closing part 123 blocks the first area 126 from the second area 127. At this time, in order to detect the gas leak from the opening / closing part 123, the wind speed sensor 162g is provided. When the opening / closing part 123 is arranged at a position where the processing housing 23 communicates with the exhaust pipe 41, the wind speed sensor 162g can preferably detect the amount of gas leaking from the opening / closing part 123 from the first area 126 to the second area 127. Similarly, the wind speed sensor 163 includes at least any one of the wind speed sensors 163e, 163f, and 163g. The wind speed sensor 163g is provided for a purpose similar to that of the wind speed sensor 162g. The wind speed sensor 164 includes at least any one of the wind speed sensors 164e and 164f.

[0389] Refer to FIG. 21(b). The wind speed sensor 162 includes at least any one of wind speed sensors 162h, 162i, 162j, 162k, and 162l. The wind speed sensors 162h-162l are each arranged near the opening / closing part 123. The wind speed sensors 162h and 162i are arranged inside the exhaust pipe 41. The wind speed sensors 162h and 162i are arranged near the opening 41k. The wind speed sensors 162j-162l are each arranged inside the switching housing 53. As described above, when the opening / closing part 133 is arranged at a position where the processing housing 23 communicates with the exhaust pipe 41, the opening / closing part 133 blocks the processing housing 23 from the exhaust pipes 42 and 43. At this time, in order to detect the gas leak from the opening / closing part 123, the wind speed sensors 162k and 162l are provided. When the opening / closing part 133 is arranged at a position where the processing housing 23 communicates with the exhaust pipe 41, the wind speed sensors 162k and 162l can preferably detect the amount of gas leaking from the opening / closing part 123 to the exhaust pipes 42 and 43 from the processing housing 23. Similarly, the wind speed sensor 163 includes at least any one of wind speed sensors 163h, 163i, 163j, 163k, and 163l. The wind speed sensors 163k and 163l are provided for a purpose similar to that of the wind speed sensors 162k and 162l. The wind speed sensor 164 includes at least any one of wind speed sensors 164h, 164i, and 164j.

[0390] Regarding the embodiments and each modified embodiment, each configuration may be appropriately changed by substituting or combining it with the configuration of other modified embodiments.

Explanation of Reference Numerals

[0391] 1, 141 … Substrate processing apparatus 11 … Processing block 12A, 12B, 12 … Transfer space 16A, 16B, 16 … Transfer mechanism 21 … Processing unit 23 … Processing housing 23A1 … Processing housing (first processing housing) 23A2 … Processing housing (second processing housing) 23B1 … Processing housing (third processing housing) 24 … Processing space 31 … Holding part (first holding part, second holding part, third holding part) 33 … Liquid supply part (first liquid supply part, second liquid supply part, third liquid supply part) 41, 42, 43 … Exhaust pipe 41A … Exhaust pipe (first exhaust pipe) 42A … Exhaust pipe (second exhaust pipe) 41B … Exhaust pipe (third exhaust pipe) 42B … Exhaust pipe (fourth exhaust pipe) 44 … First piping space 46 … Second piping space 48 … Air supply pipe 51, 101, 111, 121, 131, 141 … Switching mechanism 51A1 … Switching mechanism (first switching mechanism) 51A2 … Switching mechanism (second switching mechanism) 51B1 … Switching mechanism (third switching mechanism) 53, 103, … Switching housing 54 … Switching space 55, 105 … Introduction part 56, 106 … Distribution part 61 - 63, 113 - 115, 123 - 124, 133 - 134, 142 - 144 … Opening / closing part 61, 113, 123, 133, 142 … Opening / closing part (first opening / closing part) 62, 114, 124, 134, 143 … Opening / closing part (second opening / closing part) 71 … Pressure sensor 71A1 … Pressure sensor (first pressure sensor) 71B1 … Pressure sensor (third pressure sensor) 73 … Pressure adjustment mechanism 73A1 … Pressure adjustment mechanism (first pressure adjustment mechanism) 73B1 … Pressure adjustment mechanism (third pressure adjustment mechanism) 81, 82, 83 … Exhaust pipe 81A … Exhaust pipe (fifth exhaust pipe) 82A … Exhaust pipe (sixth exhaust pipe) 84 - 86 … Pressure sensor 84A … Pressure sensor (the 5th pressure sensor) 85A … Pressure sensor (the 6th pressure sensor) 87 - 89 … Pressure adjustment mechanism 87A … Pressure adjustment mechanism (the 5th pressure adjustment mechanism) 88A … Pressure adjustment mechanism (the 6th pressure adjustment mechanism) 91 … Control unit W … Substrate X … Front - rear direction (the 1st direction) Y … Width direction (the 2nd direction) Z … Vertical direction

Claims

1. A substrate processing apparatus, comprising: A first processing housing; a first holding part that is installed inside the first processing housing and that holds a substrate; a first liquid supply unit that is installed inside the first processing housing and supplies a processing liquid to the substrate held by the first holder; A second processing housing disposed below the first processing housing; a second holding part that is installed inside the second processing housing and that holds a substrate; a second liquid supply unit that is installed inside the second processing housing and supplies a processing liquid to the substrate held by the second holder; a first exhaust pipe that is installed on a side of the first processing housing and the second processing housing and that exhausts gas; a second exhaust pipe installed on a side of the first processing housing and the second processing housing and configured to exhaust gas; a first switching mechanism that switches an exhaust path of the first processing case to one of the first exhaust pipe and the second exhaust pipe; a second switching mechanism that switches an exhaust path of the second processing case to one of the first exhaust pipe and the second exhaust pipe; a first piping space adjacent to the first processing casing and the second processing casing and accommodating the first exhaust pipe, the second exhaust pipe, the first switching mechanism, and the second switching mechanism; Equipped with the second processing casing is disposed at the same position as the first processing casing in a plan view, The second switching mechanism is disposed at the same position as the first switching mechanism in a plan view. Substrate processing equipment.

2. In the substrate processing apparatus according to claim 1, The first exhaust pipe, the second exhaust pipe, the first switching mechanism, the second switching mechanism, and the first piping space are provided in one processing block. Substrate processing equipment.

3. In the substrate processing apparatus according to claim 1 or 2, The substrate processing apparatus includes: a third processing housing disposed at the same height as the first processing housing; a third holding part that is installed inside the third processing housing and that holds a substrate; a third liquid supply unit that is installed inside the third processing housing and supplies a processing liquid to the substrate held by the third holder; a third exhaust pipe installed on a side of the third processing housing and configured to exhaust gas; a fourth exhaust pipe installed on a side of the third processing housing and configured to exhaust gas; a third switching mechanism that is disposed at the same height as the third processing casing and switches an exhaust path of the third processing casing to one of the third exhaust pipe and the fourth exhaust pipe; Equipped Substrate processing equipment.

4. A substrate processing apparatus, comprising: A first processing housing; a first holding part that is installed inside the first processing housing and that holds a substrate; a first liquid supply unit that is installed inside the first processing housing and supplies a processing liquid to the substrate held by the first holder; A second processing housing disposed below the first processing housing; a second holding part that is installed inside the second processing housing and that holds a substrate; a second liquid supply unit that is installed inside the second processing housing and supplies a processing liquid to the substrate held by the second holder; a first exhaust pipe that is installed on a side of the first processing housing and the second processing housing and that exhausts gas; a second exhaust pipe installed on a side of the first processing housing and the second processing housing and configured to exhaust gas; a first switching mechanism that switches an exhaust path of the first processing case to one of the first exhaust pipe and the second exhaust pipe; a second switching mechanism that switches an exhaust path of the second processing case to one of the first exhaust pipe and the second exhaust pipe; a first piping space adjacent to the first processing housing and the second processing housing and accommodating the first exhaust pipe and the second exhaust pipe; a third processing housing disposed at the same height as the first processing housing; a third holding part that is installed inside the third processing housing and that holds a substrate; a third liquid supply unit that is installed inside the third processing housing and supplies a processing liquid to the substrate held by the third holder; a third exhaust pipe installed on a side of the third processing housing and configured to exhaust gas; a fourth exhaust pipe installed on a side of the third processing housing and configured to exhaust gas; a third switching mechanism that is disposed at the same height as the third processing casing and switches an exhaust path of the third processing casing to one of the third exhaust pipe and the fourth exhaust pipe; a fifth exhaust pipe connected to the first exhaust pipe and the third exhaust pipe and discharging gas from the first exhaust pipe and the third exhaust pipe; a sixth exhaust pipe connected to the second exhaust pipe and the fourth exhaust pipe and discharging gas from the second exhaust pipe and the fourth exhaust pipe; a fifth pressure sensor that measures a pressure of gas inside the fifth exhaust pipe; a fifth pressure adjustment mechanism that adjusts a pressure of gas inside the fifth exhaust pipe based on a detection result of the fifth pressure sensor; a sixth pressure sensor that measures a pressure of gas inside the sixth exhaust pipe; a sixth pressure adjustment mechanism that adjusts a pressure of gas inside the sixth exhaust pipe based on a detection result of the sixth pressure sensor; Equipped with the second processing casing is disposed at the same position as the first processing casing in a plan view, the second switching mechanism is disposed at the same position as the first switching mechanism in a plan view, the fifth pressure sensor is installed downstream of a connection position between the first exhaust pipe and the fifth exhaust pipe and a connection position between the third exhaust pipe and the fifth exhaust pipe, The sixth pressure sensor is installed downstream of a connection position between the second exhaust pipe and the sixth exhaust pipe and a connection position between the fourth exhaust pipe and the sixth exhaust pipe. Substrate processing equipment.

5. In the substrate processing apparatus according to claim 3 or 4, The substrate processing apparatus includes: a first pressure sensor that measures a pressure of gas on a primary side of the first switching mechanism; a first pressure adjustment mechanism that adjusts a pressure of gas on a primary side of the first switching mechanism based on a detection result of the first pressure sensor; a third pressure sensor that measures a pressure of gas on a primary side of the third switching mechanism; a third pressure adjustment mechanism that adjusts a pressure of the gas on a primary side of the third switching mechanism based on a detection result of the third pressure sensor; Equipped Substrate processing equipment.

6. In the substrate processing apparatus according to claim 5, The first pressure adjustment mechanism and the third pressure adjustment mechanism equalize the pressure of the gas on the primary side of the first switching mechanism and the pressure of the gas on the primary side of the third switching mechanism. Substrate processing equipment.

7. In the substrate processing apparatus according to any one of claims 1 to 6, the first switching mechanism is disposed at the same height as the first processing casing, a center point is a center position of the substrate when the substrate is held by the first holding part, The distance from the center point to the first switching mechanism is less than five times the radius of the substrate in a plan view. Substrate processing equipment.

8. In the substrate processing apparatus according to any one of claims 1 to 7, The first switching mechanism is disposed at a position not overlapping with the first holding portion in a plan view. Substrate processing equipment.

9. In the substrate processing apparatus according to any one of claims 1 to 8, The first exhaust pipe extends in a vertical direction, The second exhaust pipe extends vertically. Substrate processing equipment.

10. The substrate processing apparatus according to claim 1, The substrate processing apparatus includes: a transport space extending in a horizontal first direction and adjacent to the first processing housing and the second processing housing; a transport mechanism that is installed in the transport space and transports a substrate to the first holding part and the second holding part; Equipped with The first processing housing and the first piping space are aligned in the first direction, The first exhaust pipe and the second exhaust pipe are aligned in a second direction that is perpendicular to the first direction and is horizontal. Substrate processing equipment.

11. The substrate processing apparatus according to claim 1, The first switching mechanism includes: a first opening / closing unit that is movable between a position that connects the first processing casing to the first exhaust pipe and a position that blocks the first processing casing from the first exhaust pipe; a second opening / closing unit that is movable, independently of the first opening / closing unit, between a position that connects the first processing case to the second exhaust pipe and a position that blocks the first processing case from the second exhaust pipe; Equipped Substrate processing equipment.

12. The substrate processing apparatus according to claim 11, The first switching mechanism includes: a switching housing connected to the first processing housing and housing the first opening / closing unit and the second opening / closing unit; Equipped Substrate processing equipment.

13. The substrate processing apparatus according to claim 12, The switching housing is bent into a substantially L-shape in a plan view. Substrate processing equipment.

14. The substrate processing apparatus according to claim 12, The switching housing includes: An introduction part connected to the first processing housing; a distributor connected to the introduction section, connected to both the first exhaust pipe and the second exhaust pipe, and housing both the first opening / closing section and the second opening / closing section; Equipped Substrate processing equipment.

15. The substrate processing apparatus according to claim 14, The first exhaust pipe and the second exhaust pipe are disposed between the first processing housing and the distributor in a plan view. Substrate processing equipment.

16. The substrate processing apparatus according to claim 14, The introduction portion extends in a horizontal first direction, The distributor extends in a horizontal second direction perpendicular to the first direction. Substrate processing equipment.

17. The substrate processing apparatus according to claim 14, In a plan view, a separation distance between the introduction section and a transport space adjacent to the first processing casing is smaller than a separation distance between the first holding section and the transport space. Substrate processing equipment.

18. The substrate processing apparatus according to claim 1, The substrate processing apparatus includes: an air supply pipe for supplying gas to the first processing case and the second processing case; a second piping space adjacent to the first processing housing and the second processing housing and accommodating the air supply pipe; Equipped with The first piping space, the first processing housing, and the second piping space are arranged in this order in a horizontal first direction. Substrate processing equipment.

19. The substrate processing apparatus according to claim 1, the first liquid supply unit is capable of supplying a first processing liquid and a second processing liquid; when the first liquid supply unit supplies the first processing liquid, the first switching mechanism switches the exhaust path of the first processing casing to the first exhaust pipe; When the first liquid supply unit supplies the second processing liquid, the first switching mechanism switches the exhaust path of the first processing housing to the second exhaust pipe. Substrate processing equipment.

20. The substrate processing apparatus according to claim 1, The substrate processing apparatus includes: a first pressure sensor that measures a pressure of gas on a primary side of the first switching mechanism; a first pressure adjustment mechanism that adjusts a pressure of gas on a primary side of the first switching mechanism based on a detection result of the first pressure sensor; a second pressure sensor that measures a pressure of gas on a primary side of the second switching mechanism; a second pressure adjustment mechanism that adjusts a pressure of the gas on the primary side of the second switching mechanism based on a detection result of the second pressure sensor; Equipped Substrate processing equipment.

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