Resin molding apparatus and method for manufacturing a resin molded product

Abstract

To provide a resin molding apparatus capable of taking out a molding target housed in a transport component and performing resin molding.SOLUTION: A resin molding apparatus comprises: a take-out mechanism that takes out a molding target from a transport component that houses the molding target; a first molding target transport mechanism that transports the molding target taken out from the transport component to a molding die; a transport component housing section capable of housing the transport component from which the molding target has been taken out; a transport component transport mechanism that transports the transport component from which the molding target has been taken out to the transport component housing section; a mold clamping mechanism that clamps the molding die into which the molding target is transported to perform resin molding; a second molding target transport mechanism that transports the molding target after molded from the molding die; and a molding target housing mechanism that houses the molding target transported from the molding die to the transport component that has been housed in the transport component housing section.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to the technology of resin molding apparatuses and methods for manufacturing resin molded products.

Background Art

[0002] Generally, a technique is known in which a plurality of objects to be molded, such as circuit boards, are accommodated in a transport member and transported collectively. Further, Patent Document 1 discloses a technique in which a molding process is performed while a plurality of circuit boards are accommodated in a transport member called a boat.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the technique described in Patent Document 1, in the molding process, a transport member accommodating a plurality of objects to be molded is supplied to a mold and resin molding is performed. Therefore, since it is necessary to accommodate the transport member in the mold, the mold may be enlarged. Further, in the technique described in Patent Document 1, alignment of the objects to be molded with respect to the mold is indirectly performed by aligning the transport member with respect to the mold. For this reason, there is a possibility that the positional accuracy of the objects to be molded with respect to the mold may decrease. Therefore, there is a need for a technique that can take out the objects to be molded accommodated in the transport member, perform resin molding, and then accommodate the objects to be molded in the transport member again.

[0005] The present invention has been made in view of the above circumstances, and the problem to be solved is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can take out the objects to be molded accommodated in a transport member, perform resin molding, and then accommodate the objects to be molded in the transport member again.

Means for Solving the Problem

[0006] The problem to be solved by the present invention is as described above. To solve this problem, a resin molding apparatus according to the present invention includes a take-out mechanism for taking out a molding object from a transport member that houses the molding object, a first molding object transport mechanism for transporting the molding object taken out from the transport member to a mold, a transport member housing portion capable of housing the transport member from which the molding object has been taken out, a transport member transport mechanism for transporting the transport member from which the molding object has been taken out to the transport member housing portion, a mold clamping mechanism for clamping the mold in which the molding object has been transported so as to perform resin molding, a second molding object transport mechanism for carrying out the molded object after molding from the mold, and a molding object housing mechanism for housing the molded object carried out from the mold in the transport member housed in the transport member housing portion.

[0007] Further, a method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, and includes a take-out step of taking out the molding object from the transport member, a molding object transport step of transporting the molding object taken out in the take-out step to the mold, a transport member transport step of transporting the transport member from which the molding object has been taken out, a resin molding step of resin-molding the molding object transported to the mold in the molding object transport step, and a molding object housing step of housing the molding object resin-molded in the resin molding step in the transport member transported in the transport member transport step.

Advantages of the Invention

[0008] According to the present invention, a molding object housed in a transport member can be taken out and resin-molded, and then the molding object can be housed again in the transport member.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Mode for Carrying Out the Invention

[0010] Hereinafter, the directions indicated by the arrows U, D, L, R, F, and B shown in the figures will be defined as the upward direction, downward direction, left direction, right direction, forward direction, and backward direction, respectively, for the description.

[0011] <Overall Configuration of the Resin Molding Apparatus 1> First, with reference to FIG. 1, the configuration of the resin molding apparatus 1 according to the present embodiment will be described. The resin molding apparatus 1 resin-seals an electronic element such as a semiconductor chip (hereinafter referred to as a "chip") to manufacture a resin molded product. In particular, in the present embodiment, a resin molding apparatus 1 that performs resin molding using the transfer molding method is exemplified.

[0012] The resin molding apparatus 1 includes, as components, a supply module A, a resin molding module B, and a carry-out module C. Each component is detachable and replaceable with respect to other components.

[0013] <Supply Module A> The supply module A supplies the substrate 2 on which the chip is fixed and the columnar resin tablet T to the resin molding module B. Note that the substrate 2 is an embodiment of an object to be molded according to the present invention. As the substrate 2, various substrates (lead frames, glass epoxy substrates, ceramic substrates, resin substrates, metal substrates, etc.) can be used. The supply module A mainly includes a carrier loading unit 11, a substrate alignment stage 12, a take-out mechanism 30, a carrier stage 13, a loader 40, a carrier transport unit 50, a carrier transfer unit 60, a first camera 14, and a control unit 15.

[0014] The carrier loading unit 11 is a portion where the carrier 3 carried into the supply module A from the outside is arranged. The carrier loading unit 11 can receive the carrier 3 containing the substrate 2 and place it on the upper surface.

[0015] Here, the substrate 2 and the carrier 3 capable of accommodating the substrate 2 will be described with reference to FIG. 2. The carrier 3 is a member capable of accommodating the substrate 2. Note that the carrier 3 is an embodiment of a transport member according to the present invention. The carrier 3 is formed in a substantially rectangular plate shape. Through holes 3a, pins 3b, and cords 3c are provided in the carrier 3.

[0016] The through hole 3a is formed to penetrate the carrier 3. Three through holes 3a are formed side by side in the longitudinal direction of the carrier 3. The pin 3b positions the substrate 2 accommodated in the carrier 3. The pin 3b is formed to protrude upward from the surface (upper surface) of the carrier 3. A plurality of pins 3b are provided so as to surround the periphery of the through hole 3a. By accommodating the substrate 2 inside the pin 3b, the substrate 2 can be arranged at a position facing the through hole 3a. The carrier 3 of the present embodiment can accommodate three substrates 2.

[0017] A code 3c is provided on the upper surface of the carrier 3. The code 3c is an identifier representing information capable of identifying the carrier 3. As the code 3c, for example, a barcode, a two-dimensional code, or the like can be used.

[0018] A code 2a is provided on the upper surface of the substrate 2. The code 2a is an identifier representing information capable of identifying the substrate 2. As the code 2a, a two-dimensional code or the like can be used in the same manner as the code 3c of the carrier 3.

[0019] The substrate alignment stage 12 shown in FIG. 1 is a portion where the substrate 2 taken out from the carrier 3 is arranged. Note that the substrate alignment stage 12 is an embodiment of the placement portion according to the present invention. The substrate alignment stage 12 can place a plurality of substrates 2 side by side on the upper surface. In the present embodiment, a total of six substrates 2 are aligned and placed on the substrate alignment stage 12 in three rows in the front-rear direction and two rows in the left-right direction (see FIG. 10(b)). The arrangement of the substrates 2 on the substrate alignment stage 12 corresponds to the arrangement of the substrates 2 in the molding die 16 described later. That is, the molding die 16 according to the present embodiment can perform resin molding on six substrates 2 at a time. The substrate alignment stage 12 is arranged behind the carrier loading portion 11.

[0020] The taking-out mechanism 30 takes out the substrate 2 from the carrier 3 of the carrier loading portion 11 and arranges it on the substrate alignment stage 12. As shown in FIG. 3, the taking-out mechanism 30 mainly includes a suction holding portion 31, a clamper 32, and a pressing portion 33.

[0021] The suction holding part 31 sucks and holds the substrate 2 placed on the carrier loading part 11. The suction holding part 31 can suck the substrate 2 from below through the through hole 3a of the carrier 3. The suction holding part 31 can move up and down by a lifting mechanism (not shown). Thereby, the suction holding part 31 can lift the sucked substrate 2 upward from the carrier 3.

[0022] The clamper 32 holds and conveys the substrate 2. The clamper 32 includes a pair of left and right and a pair of front and rear members in the shape of an L in side view. The clamper 32 can hold the substrate 2 by sandwiching it from four directions, left and right, and front and rear. Also, the clamper 32 can move by a moving mechanism (not shown).

[0023] The pressing part 33 presses the substrate 2 held by the clamper 32 from above. The pressing part 33 is arranged inside the clamper 32. The pressing part 33 can press the substrate 2 by its own weight when placed on the substrate 2.

[0024] When the substrate 2 is taken out from the carrier 3 of the carrier loading part 11 by the taking-out mechanism 30, first, as shown in Fig. 3(a), the substrate 2 is held by the suction holding part 31. Next, as shown in Fig. 3(b), the suction holding part 31 holding the target substrate 2 rises, and the substrate 2 is lifted. Next, the suction by the suction holding part 31 is released, and the substrate 2 is held by the clamper 32. Further, the substrate 2 is pressed from above by the pressing part 33. Thereby, the clamper 32 can stably hold the substrate 2.

[0025] Next, as shown in Fig. 3(c), the clamper 32 moves to the substrate alignment stage 12 and releases the holding of the substrate 2 at a predetermined position. Thereby, the substrate 2 can be placed on the substrate alignment stage 12. By repeating such an operation of the clamper 32, the substrate 2 can be taken out from the carrier 3 of the carrier loading part 11 and arranged on the substrate alignment stage 12.

[0026] The carrier stage 13 shown in FIG. 1 is a portion where the carrier 3 from which the substrate 2 has been taken out in the carrier loading section 11 is placed. The carrier stage 13 can place the carrier 3 transferred from the carrier loading section 11 on its upper surface.

[0027] The loader 40 conveys the substrate 2 aligned on the substrate alignment stage 12 to the resin molding module B. Further, the loader 40 receives and holds the resin tablet T from a resin supply device (not shown) and conveys it to the resin molding module B together with the substrate 2. Here, the loader 40 may receive either the substrate 2 or the resin tablet T first, or may receive the substrate 2 and the resin tablet T simultaneously. That is, the timing at which the loader 40 receives the substrate 2 and the resin tablet T is not particularly limited. Note that the loader 40 is an embodiment of the first object to be molded conveyance mechanism according to the present invention. The loader 40 is disposed at the rear of the resin molding apparatus 1. The loader 40 can move left and right along a rail X extending across the left and right ends of the resin molding apparatus 1. As shown in FIG. 4, the loader 40 mainly includes a main body portion 41, a head 42, and a clamper 43.

[0028] The main body portion 41 is a portion that constitutes the main structure of the loader 40. The main body portion 41 is configured to be movable left and right along the rail X (see FIG. 1). The main body portion 41 of the present embodiment is formed such that the front upper portion projects forward in order to stably support the head 42 described later. The portion of the main body portion 41 that projects forward overlaps with the rear portion of the substrate alignment stage 12 in the front-rear direction.

[0029] The head 42 is a portion where the clamper 43 described later is provided. The head 42 is supported so as to be movable back and forth with respect to the main body portion 41.

[0030] The clamper 43 holds and conveys the substrate 2. The number of clampers 43 provided is the same as the number corresponding to the plurality of substrates 2 aligned on the substrate alignment stage 12. In the present embodiment, six clampers 43 are provided on the head 42 so as to correspond to the six substrates 2.

[0031] When the loader 40 conveys the substrate 2 on the substrate alignment stage 12 to the resin molding module B, first, the loader 40 moves along the rail X (see FIG. 1) and stops behind the substrate alignment stage 12. Next, as shown in FIG. 4, the head 42 moves forward with respect to the main body 41 so that the substrate 2 on the substrate alignment stage 12 and the clamper 43 face each other vertically. Next, each clamper 43 holds the corresponding substrate 2, and the head 42 moves backward with respect to the main body 41.

[0032] The loader 40 can convey the substrate 2 to the resin molding module B by moving rightward along the rail X (see FIG. 1) while holding the substrate 2. Further, the loader 40 can load the substrate 2 into the mold 16 by releasing the holding of the substrate 2 above the mold 16 of the resin molding module B.

[0033] Although detailed description is omitted in the present embodiment, the loader 40 also loads the resin tablet T used for resin molding into the mold 16 simultaneously with the substrate 2.

[0034] The carrier transfer unit 50 shown in Fig. 1 transfers the carrier 3 placed on the carrier stage 13 to the unloading module C. Note that the carrier transfer unit 50 is an embodiment of the transfer member transfer mechanism according to the present invention. The carrier transfer unit 50 is arranged at the rear part of the resin molding apparatus 1. The carrier transfer unit 50 can move left and right along the rail X. In the present embodiment, the carrier transfer unit 50 is configured to move left and right integrally with the loader 40. That is, at least in the moving region along the rail X, both the loader 40 and the carrier transfer unit 50 can move. Thereby, the moving mechanisms (not shown) for moving the loader 40 and the carrier transfer unit 50 left and right can be shared. As shown in Fig. 5, the carrier transfer unit 50 mainly includes a main body part 51, a movable stage 52, and a carrier mounting part 53.

[0035] The main body part 51 is a part that constitutes the main structure of the carrier transfer unit 50. The main body part 51 is configured to be movable left and right along the rail X (see Fig. 1).

[0036] The movable stage 52 is a part where the carrier mounting part 53 described later is provided. The movable stage 52 is provided on the upper part of the main body part 51. The movable stage 52 is supported so as to be movable back and forth with respect to the main body part 51.

[0037] The carrier mounting part 53 is a part on which the carrier 3 received from the carrier stage 13 is mounted. The carrier mounting part 53 is provided on the upper part of the movable stage 52. In the present embodiment, two carrier mounting parts 53 are arranged side by side in the front - rear direction.

[0038] The carrier transfer part 60 transfers the carrier 3 from the carrier stage 13 to the carrier transfer unit 50. As shown in Fig. 5, the carrier transfer part 60 mainly includes a head 61 and a suction holding part 62.

[0039] The head 61 is a portion where the adsorption and holding part 62 described later is provided. The head 61 is supported so as to be movable by a moving mechanism (not shown).

[0040] The adsorption and holding part 62 adsorbs and holds the carrier 3. The adsorption and holding part 62 is provided below the head 61.

[0041] When the carrier transfer unit 50 transfers the carrier 3 on the carrier stage 13 to the unloading module C, first, the carrier transfer unit 50 moves along the rail X (see FIG. 1) and stops behind the carrier stage 13. Next, as shown in FIG. 5, the carrier 3 on the carrier stage 13 is held by the adsorption and holding part 62 of the carrier transfer part 60 and placed on the carrier placement part 53 of the carrier transfer unit 50. At this time, the movable stage 52 moves back and forth as appropriate so that the carrier placement part 53 moves to a position where the carrier 3 can be placed.

[0042] The carrier transfer unit 50 can transfer the carrier 3 to the unloading module C by moving rightward along the rail X (see FIG. 1) with the carriers 3 placed on the two carrier placement parts 53 respectively. The carrier 3 transferred to the unloading module C is accommodated in the carrier accommodation part 80 described later.

[0043] The first camera 14 is for reading the code 2a of the substrate 2 and the code 3c of the carrier 3. Note that the first camera 14 is an embodiment of the reading part and the first reading part according to the present invention. The first camera 14 is arranged at a position where the carrier 3 containing the substrate 2 can be imaged in the supply module A. In the present embodiment, the first camera 14 is arranged at a position where the carrier 3 arranged in the carrier loading part 11 can be imaged.

[0044] The control unit 15 controls the operations of the respective modules of the resin molding apparatus 1. The operations of the supply module A, the resin molding module B, and the unloading module C are controlled by the control unit 15. Also, the operations of the respective modules can be arbitrarily changed (adjusted) using the control unit 15. Further, the control unit 15 can manage the information of the substrate 2 and the carrier 3 acquired by the first camera 14 and the second camera 20 described later.

[0045] In the present embodiment, an example in which the control unit 15 is provided in the supply module A is shown, but the control unit 15 can also be provided in other modules. Also, it is possible to provide a plurality of control units 15. For example, the control unit 15 can be provided for each module or for each apparatus, and the operations of each module or the like can be individually controlled while interlocking with each other.

[0046] <Resin Molding Module B> The resin molding module B resin-seals the chips fixed to the substrate 2. In the present embodiment, two resin molding modules B are arranged side by side. By performing the resin sealing of the substrate 2 in parallel by the two resin molding modules B, the manufacturing efficiency of the resin molded product can be improved. The resin molding module B mainly includes a mold 16 and a mold clamping mechanism 17.

[0047] The mold 16 uses a molten resin material to resin-seal the chips fixed to the substrate 2. The mold 16 includes a pair of upper and lower molds, that is, a lower mold and an upper mold. The mold 16 is provided with a heating section (not shown) such as a heater.

[0048] The mold clamping mechanism 17 clamps or opens the mold 16 by moving the lower mold of the mold 16 up and down.

[0049] <Unloading Module C> The unloading module C receives the resin-sealed substrate 2 from the resin molding module B and unloads it. The unloading module C mainly includes an unloader 70, a molded substrate alignment stage 18, a carrier storage section 80, a carrier unloading section 19, a molding object storage mechanism 90, and a second camera 20.

[0050] The unloader 70 holds the substrate 2 resin-sealed in the resin molding module B and conveys it to the molded substrate alignment stage 18 of the unloading module C. Note that the unloader 70 is an embodiment of the second molding object conveyance mechanism according to the present invention. The unloader 70 is disposed at the rear of the resin molding apparatus 1. The unloader 70 can move left and right along the rail X.

[0051] The molded substrate alignment stage 18 is a portion where the molded substrate 2 conveyed from the resin molding module B is disposed. The molded substrate alignment stage 18 can place a plurality of substrates 2 side by side on the upper surface.

[0052] When the unloader 70 conveys the resin-sealed substrate 2 to the unloading module C, first, the unloader 70 moves along the rail X to the resin molding module B and adsorbs and holds the substrate 2 resin-molded by the mold 16. Next, the unloader 70 moves along the rail X to the unloading module C and places the molded substrate 2 on the molded substrate alignment stage 18.

[0053] The carrier storage section 80 stores the carrier 3 from which the substrate 2 has been taken out in the supply module A. Note that the carrier storage section 80 is an embodiment of the conveyance member storage section according to the present invention. As shown in FIG. 6, the carrier storage section 80 mainly includes a main body section 81, a rotation support section 82, a rotation connection section 83, and a lifting section 84.

[0054] The main body portion 81 constitutes the main structure of the carrier housing portion 80. The main body portion 81 includes a plurality of columns 81a arranged to face each other in the front and rear directions. Although not shown in FIG. 6, a plurality of columns 81a are arranged side by side in the depth direction of the paper surface. The main body portion 81 is formed in a frame shape with an open bottom by connecting the upper portions of the columns 81a to each other.

[0055] The rotation support portion 82 is a portion that supports the carrier 3. The rotation support portion 82 is provided so as to protrude from the front and rear columns 81a toward the inside of the main body portion 81. The rotation support portion 82 is connected to the column 81a via a rotation connection portion 83 described later. A plurality of rotation support portions 82 are provided at equal intervals in the vertical direction. The rotation support portions 82 provided on the front and rear columns 81a are arranged at corresponding positions (the same height).

[0056] The rotation connection portion 83 is a portion that connects the rotation support portion 82 so as to be rotatable vertically with respect to the column 81a. The rotation connection portion 83 supports the rotation support portion 82 so that it can freely rotate from a state where the rotation support portion 82 faces in a substantially horizontal direction to a state where it faces in a substantially vertical direction. As a result, the rotation support portion 82 rotates downward by its own weight in a state where no external force is applied and faces in a substantially horizontal direction. Also, when an upward external force is applied to the rotation support portion 82, the rotation support portion 82 can rotate upward.

[0057] The lifting portion 84 is for placing the carrier 3 on the rotation support portion 82. The lifting portion 84 includes columns 84a arranged to face each other in the front and rear directions and support portions 84b provided so as to protrude inward from the front and rear columns 84a. A plurality of support portions 84b are provided at equal intervals in the vertical direction. The vertical interval between the support portions 84b is formed to be the same as the vertical interval of the rotation support portions 82 provided on the main body portion 81.

[0058] The lifting part 84 can move relative to the main body part 81 in the front-rear direction and the up-down direction by a drive mechanism (not shown). Specifically, as shown in FIG. 6(a), the lifting part 84 can repeatedly perform a series of operations of horizontally moving to a position where the support part 84b protrudes inside the main body part 81, moving upward in that state, horizontally moving toward the outside of the main body part 81, and descending. Note that the lifting part 84 and the main body part 81 are arranged so as not to interfere with each other.

[0059] Also, the carrier accommodating part 80 can move as a whole in the front-rear direction and the up-down direction by a drive mechanism (not shown). Thereby, the carrier accommodating part 80 can move to a position where it is easy to accommodate the carrier 3. Specifically, as shown in FIG. 6, the carrier accommodating part 80 can move to a position facing the carrier placing part 53 on which the carrier 3 is placed from above.

[0060] The carrier unloading part 19 shown in FIG. 1 is a part where the carrier 3 unloaded from the unloading module C to the outside is placed. The carrier unloading part 19 can place the carrier 3 received from the carrier accommodating part 80 on its upper surface. The carrier 3 placed on the carrier unloading part 19 accommodates the formed substrate 2 by a formed object accommodating mechanism 90 described later. The carrier 3 accommodating the formed substrate 2 is unloaded from the carrier unloading part 19 to the outside.

[0061] The formed object accommodating mechanism 90 is for accommodating the substrate 2 placed on the formed substrate alignment stage 18 in the carrier 3 arranged in the carrier unloading part 19. As the formed object accommodating mechanism 90, for example, a mechanism capable of holding and conveying the substrate 2 can be used in the same manner as the taking-out mechanism 30 (see FIG. 3). Note that a detailed description of the configuration of the formed object accommodating mechanism 90 is omitted.

[0062] The second camera 20 is for reading the code 2a of the formed substrate 2 and the code 3c of the carrier 3. Note that the second camera 20 is an embodiment of the reading unit and the second reading unit according to the present invention. The second camera 20 is arranged at a position in the carry-out module C where the formed substrate 2 and the carrier 3 in which the formed substrate 2 is accommodated can be imaged. In the present embodiment, the second camera 20 is arranged at a position where the carrier 3 arranged in the carrier carry-out unit 19 can be imaged.

[0063] <Overview of the operation of the resin molding apparatus 1> Hereinafter, with reference to FIGS. 7 to 9, an overview of the operation of the resin molding apparatus 1 configured as described above (a method for manufacturing a resin molded product using the resin molding apparatus 1) will be described. The black arrows shown in FIGS. 8 and 9 indicate the state of movement of the carrier 3. The white arrows indicate the state of movement of the substrate 2.

[0064] As shown in FIG. 7, the method for manufacturing a resin molded product according to the present embodiment mainly includes a loading step S1, a first reading step S2, an unloading step S3, a conveying step S4, a resin molding step S5, a step of taking out the formed substrate S6, a step of accommodating the object to be molded S7, a second reading step S8, and an unloading step S9. For convenience of explanation, each step is described in order one by one in FIG. 7, but in actuality, operations of different steps may be executed simultaneously, or a specific step may be executed repeatedly a plurality of times.

[0065] First, the loading step S1 is executed. The loading step S1 is a step of loading the carrier 3 from the outside into the resin molding apparatus 1. In the loading step S1, the carrier 3 containing the substrate 2 is loaded into the carrier loading unit 11 of the supply module A (see FIG. 8).

[0066] Next, the first reading step S2 is executed. The first reading step S2 is a step of reading the code 3c of the carrier 3 and the code 2a of the substrate 2 accommodated in the carrier 3. In the first reading step S2, the first camera 14 images the carrier 3 and the substrate 2 carried into the carrier loading unit 11. The control unit 15 reads the code 3c of the carrier 3 and the code 2a of the substrate 2 from the video imaged by the first camera 14, and identifies the carrier 3 and the substrate 2. The control unit 15 associates and stores the correspondence between the carrier 3 and the substrate 2 accommodated in the carrier 3. That is, the control unit 15 stores which substrate 2 is accommodated in the carrier 3.

[0067] Next, the taking-out step S3 is executed. The taking-out step S3 is a step of taking out the substrate 2 from the carrier 3. In the taking-out step S3, the taking-out mechanism 30 takes out the substrate 2 from the carrier 3 in the carrier loading unit 11 and arranges the substrate 2 side by side on the substrate alignment stage 12 (see FIG. 8). In the present embodiment, since six substrates 2 can be arranged on the substrate alignment stage 12, a total of six substrates 2 are taken out from two carriers 3 to the substrate alignment stage 12.

[0068] Here, the order of arranging the substrate 2 on the substrate alignment stage 12 in the taking-out step S3 will be described. As shown in FIG. 4, the main body portion 41 of the loader 40 is formed so as to project forward. For this reason, when the loader 40 is located behind the substrate alignment stage 12, the taking-out mechanism 30 and the loader 40 may interfere with each other, and it may not be possible to arrange the substrate 2 at a position (rear part) close to the loader 40 on the substrate alignment stage 12. For example, in the present embodiment, as shown in FIG. 4, since the arrangement position of the substrate 2 in the rearmost row among the three front and rear rows overlaps with the main body portion 41 of the loader 40, there is a possibility that the taking-out mechanism 30 and the loader 40 may interfere with each other when arranging the substrate 2 in the rearmost row (positions (1) and (2) in FIG. 10(b)).

[0069] In addition, in this embodiment, an example where the arrangement positions of the main body 41 of the loader 40 and the substrate 2 overlap is given. However, even when the arrangement positions of the loader 40 and the substrate 2 do not overlap, it is assumed that the take-out mechanism 30 and the loader 40 may interfere with each other.

[0070] Therefore, in the take-out step S3, when taking out the substrate 2 from the first carrier 3, as shown in Fig. 10(a), the loader 40 is retracted to a retracted position shifted to the right from behind the substrate alignment stage 12. In this state, the take-out mechanism 30 does not interfere with the loader 40. In this state, the take-out mechanism 30 takes out the substrate 2 to the substrate alignment stage 12.

[0071] At this time, the take-out mechanism 30 arranges the substrates 2 in order from the side (rear side) close to the loader 40. For example, in this embodiment, as shown in Fig. 10(b), the arrangement order of (1) to (6) is set in order from the rear side of the substrate alignment stage 12. That is, the three substrates 2 taken out from the first carrier 3 are arranged at the positions of (1) to (3). As a result, the substrates 2 can be arranged at the positions of (1) and (2) where there is a possibility that the take-out mechanism 30 and the loader 40 may interfere with each other.

[0072] In addition, when the loader 40 is retracted to a position shifted to the right from the substrate alignment stage 12, it receives the resin tablet T from a resin supply device (not shown). In this way, by using the retracted time as the time for receiving the resin tablet T, the production efficiency can be improved.

[0073] When the three substrates 2 from the first carrier 3 are taken out to the substrate alignment stage 12, the loader 40 and the carrier transfer unit 50 move integrally to the left. As a result, the loader 40 moves to a position where it can receive the substrate 2 on the substrate alignment stage 12 (behind the substrate alignment stage 12), and the carrier transfer unit 50 moves to a position where it can receive the carrier 3 on the carrier stage 13 (behind the carrier stage 13).

[0074] Further, the first carrier 3 from which the substrate 2 has been removed is moved from the carrier loading section 11 to the carrier stage 13 by an appropriate transfer mechanism.

[0075] After the first carrier 3 has been moved from the carrier loading section 11 to the carrier stage 13, the loading process S1, the first reading process S2, and the unloading process S3 are executed again. As a result, the substrate 2 accommodated in the second carrier 3 is taken out onto the substrate alignment stage 12, and six substrates 2 are aligned on the substrate alignment stage 12.

[0076] At this time, since the loader 40 is positioned behind the substrate alignment stage 12, the rearmost row of the substrate alignment stage 12 (positions (1) and (2) in FIG. 10(b)) overlaps with the main body 41 of the loader 40. However, the substrate 2 taken out from the first carrier 3 is already arranged in this row. That is, since the substrate 2 taken out from the second carrier 3 is not arranged in the rearmost row of the substrate alignment stage 12, there is no possibility of interference between the unloading mechanism 30 and the loader 40.

[0077] Next, the transfer process S4 is executed. The transfer process S4 is a process of transferring the substrate 2 to the molding die 16 and transferring the carrier 3 to the carrier housing section 80. The transfer process S4 is an embodiment of the implementation of the transfer process for the object to be molded and the transfer process for the transfer member according to the present invention. In the transfer process S4, the loader 40 holds the six substrates 2 aligned on the substrate alignment stage 12 (see FIG. 4). Further, by the carrier transfer section 60, the carrier 3 on the carrier stage 13 is transferred to the carrier placement section 53 of the carrier transfer unit 50 (see FIG. 5). At this time, the two carriers 3 are respectively placed on the two carrier placement sections 53.

[0078] Next, as shown in FIG. 8, the loader 40 and the carrier transport unit 50 move integrally to the right. In the resin molding module B, the loader 40 delivers the substrate 2 and the resin tablet T to the mold 16. Then, the loader 40 and the carrier transport unit 50 move further to the right. In the unloading module C, the carrier housing portion 80 receives the carrier 3 from the carrier transport unit 50.

[0079] Here, with reference to FIG. 6, the state in which the carrier housing portion 80 receives the carrier 3 in the transport step S4 will be described. When the carrier housing portion 80 receives the carrier 3, first, as shown in FIG. 6(a), the carrier housing portion 80 moves above the carrier placement portion 53.

[0080] Next, as shown in FIG. 6(b), after the lifting portion 84 moves inside the main body portion 81, it moves upward. As a result, the support portion 84b provided at the bottom lifts the carrier 3 on the carrier placement portion 53 from below. By the lifted carrier 3, the rotation support portion 82 is pushed up from below, and the rotation support portion 82 rotates upward.

[0081] When the carrier 3 is lifted above the rotation support portion 82, as shown in FIG. 6(c), the rotation support portion 82 returns to a substantially horizontal posture again due to its own weight. In this state, the carrier 3 is placed on the rotation support portion 82, and the lifting portion 84 retracts to the outside of the main body portion 81. In this way, the carrier 3 on the carrier placement portion 53 is supported by the rotation support portion 82 provided at the bottom of the carrier housing portion 80.

[0082] Also at this time, the carrier 3 already accommodated in the carrier housing portion 80 is also lifted by the other support portion 84b of the lifting portion 84 to the upper stage (the upper rotation support portion 82). That is, the carrier 3 transported to the unloading module C is accommodated in the lowermost stage of the carrier housing portion 80, and each time another carrier 3 is transported, it moves to the upper stage one by one.

[0083] In this way, the plurality of carriers 3 conveyed to the unloading module C are accommodated in order from the upper stage above the carrier accommodating portion 80 based on the order in which they are conveyed. By providing the carrier accommodating portion 80 in the resin molding apparatus 1 in this way and securing accommodation locations for the plurality of carriers 3, the substrate 2 (carrier 3) can be smoothly carried into the resin molding apparatus 1, thereby preventing the occurrence of waiting time and improving the production efficiency of the resin molded product. Further, since the carriers 3 are accommodated in order from the top in the order in which they are conveyed, it is easy for the operator to intuitively grasp the conveyance order of the carriers 3, and confirmation work and the like of the carriers 3 can be efficiently performed.

[0084] Each of the above-described steps from the loading step S1 to the conveying step S4 is repeatedly executed according to the number of resin molding modules B. For example, in the present embodiment, since two resin molding modules B are provided, it is repeatedly executed until the substrate 2 is conveyed to the molds 16 of the two resin molding modules B.

[0085] Next, the resin molding step S5 is executed. The resin molding step S5 is a step of resin molding the substrate 2 conveyed to the mold 16. In the resin molding step S5, the mold clamping mechanism 17 raises the lower mold to clamp the mold 16. Then, the resin tablet T is heated and melted by a heating portion (not shown) of the mold 16, and the substrate 2 is resin-sealed using the generated molten resin.

[0086] Next, the molded substrate removal step S6 is executed. The molded substrate removal step S6 is a step of removing the substrate 2 resin-molded by the mold 16 from the mold 16. In the molded substrate removal step S6, the unloader 70 holds the substrate 2 resin-molded by the mold 16, moves along the rail X to the unloading module C, and arranges the molded substrate 2 on the molded substrate alignment stage 18 (see FIG. 9).

[0087] In addition, when a plurality of resin molding modules B (molding dies 16) are provided as in this embodiment, the unloader 70 unloads the molded substrates 2 in order from the molding die 16 where the substrate 2 was first conveyed in the conveying step S4. As a result, in the molded object housing step S7 described later, the correspondence between the substrate 2 and the carrier 3 can be maintained.

[0088] Next, the molded object housing step S7 is executed. The molded object housing step S7 is a step of housing the molded substrate 2 in the carrier 3. In the molded object housing step S7, first, the carrier 3 housed in the carrier housing portion 80 is taken out to the carrier unloading portion 19 by an appropriate moving mechanism. At this time, among the carriers 3 housed in the carrier housing portion 80, the carrier 3 housed in the uppermost stage is taken out. Next, the molded substrate alignment stage 18 on which the molded substrate 2 is placed is housed in the carrier 3 disposed in the carrier unloading portion 19 by the molded object housing mechanism 90.

[0089] Next, the second reading step S8 is executed. The second reading step S8 is a step of reading the code 3c of the carrier 3 and the code 2a of the molded substrate 2 housed in the carrier 3. In the second reading step S8, the second camera 20 images the carrier 3 housing the molded substrate 2. The control unit 15 reads the code 3c of the carrier 3 and the code 2a of the molded substrate 2 from the video imaged by the second camera 20, and identifies the carrier 3 and the substrate 2. Further, the control unit 15 determines whether the correspondence between the carrier 3 and the molded substrate 2 matches the correspondence stored in the first reading step S2. When the correspondence between the carrier 3 and the substrate 2 does not match, the control unit 15 issues a warning to the operator or stops the operation of the resin molding apparatus 1, for example.

[0090] Next, the unloading step S9 is executed. The unloading step S9 is a step of unloading the carrier 3 from the resin molding apparatus 1 to the outside. In the unloading step S9, the carrier 3 housing the molded substrate 2 is unloaded from the carrier unloading portion 19 of the unloading module C to the outside (see FIG. 9).

[0091] As described above, in the resin molding apparatus 1 according to the present embodiment, the substrate 2 accommodated in the carrier 3 can be taken out from the carrier 3 and resin molding can be performed. As a result, an increase in the size of the mold 16 can be suppressed. In addition, since the positioning of the substrate 2 with respect to the mold 16 can be directly performed, the positioning accuracy of the substrate 2 can be improved.

[0092] Further, the resin molding apparatus 1 according to the present embodiment can accommodate the substrate 2 after resin molding in the carrier 3 again. At this time, the substrate 2 is accommodated in the same carrier 3 as the carrier 3 in which it was accommodated before resin molding. As a result, for example, the substrate 2 can be managed (for example, lot management, etc.) using the carrier 3.

[0093] Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and appropriate modifications can be made within the scope of the technical idea of the invention described in the claims.

[0094] For example, the configurations (shape, number, etc.) of the respective members exemplified in the above embodiments are not particularly limited and can be arbitrarily changed. As an example, the method of holding the substrate 2 by the loader 40 and the unloader 70 is not particularly limited. Further, the method of holding the carrier 3 by the carrier transfer unit 50 is not particularly limited. Also, the number of substrates 2 and carriers 3 transported at one time by each device, and the arrangement of the substrates 2 in the substrate alignment stage 12 and the mold 16 can be arbitrarily changed.

[0095] In addition, in the present embodiment, an example in which codes such as two-dimensional codes are given to the substrate 2 and the carrier 3 respectively has been shown, but the present invention is not limited to this, and various other identifiers can be used. For example, it is also possible to use a character string, a color, etc. as an identifier, or to use an IC tag that can withstand the environment (heat, load, etc.) in the resin molding apparatus 1 as an identifier. When using an IC tag, instead of the first camera 14 or the like, a communication device capable of communicating with the IC tag can be used to read the information of the identifier.

[0096] Also, the reading steps (the first reading step S2 and the second reading step S8) shown in this embodiment are merely examples, and the codes 2a on the substrate 2 and the code 3c on the carrier 3 can be read at any location and at any timing. As an example, in this embodiment, an example of reading the code 3c of the carrier 3 taken out from the carrier housing portion 80 with the second camera 20 (see the second reading step S8) is shown, but it is also possible to read the code 3c of the carrier 3 to be housed in the carrier housing portion 80 in the conveying step S4. Thereby, the carrier 3 housed in the carrier housing portion 80 can be identified, and it can be grasped whether the carrier 3 is housed at an appropriate position or the like.

[0097] In addition, it is also possible to read the code 2a of the pre-formed substrate 2 (the substrate 2 placed on the formed substrate alignment stage 18) before being housed in the carrier 3 using the second camera 20. Further, it is also possible to read the code 2a of the substrate 2 arranged on the substrate alignment stage 12 and the code 3c of the carrier 3 arranged on the carrier stage 13 using the first camera 14.

[0098] Also, the carrier housing portion 80 (see FIG. 6) shown in this embodiment is merely an example, and the specific configuration of the carrier housing portion 80 can be arbitrarily changed. For example, as in the modified example of the carrier housing portion 80 shown in FIG. 11, it is also possible to house the carrier 3 in a plurality of non-rotatable support portions 80a instead of the rotatable rotation support portion 82. In this case, for example, according to the height of the conveyed carrier 3, the carrier housing portion 80 can be appropriately raised and lowered vertically, and the carrier 3 can be stored in each support portion 80a from the side. Also in this case, it is desirable to store the carriers 3 in order from the upper stage (or the lower stage) of the carrier housing portion 80 based on the order of the conveyed carriers 3.

[0099] In addition, in the present embodiment, an example is shown in which three substrates 2 are accommodated in one carrier 3 and six substrates 2 (substrates 2 carried in by two carriers 3) are molded by one molding die 16. However, this is merely an example, and the number of substrates 2 that can be accommodated in the carrier 3 and the number of substrates 2 that can be molded simultaneously by one molding die 16 can be arbitrarily changed. For example, while three substrates 2 can be accommodated in one carrier 3, the number of substrates 2 that can be molded by one molding die 16 can be eight, ten, twelve, etc. Even if the relationship between the number of substrates 2 that can be accommodated in the carrier 3 and the number of substrates 2 that can be molded by the molding die 16 is changed in this way, the resin molding apparatus 1 according to the present embodiment can maintain the correspondence between the substrate 2 and the carrier 3 before and after molding. That is, in the resin molding apparatus 1, the carriers 3 from which the substrates 2 have been taken out are sequentially accommodated in the carrier accommodating portion 80, and the molded substrates 2 are sequentially accommodated in the carriers 3, so the correspondence between the substrate 2 and the carrier 3 is maintained. Furthermore, in the resin molding apparatus 1, the correspondence between the substrate 2 and the carrier 3 can be confirmed by the first camera 14 and the second camera 20, so the correspondence between the substrate 2 and the carrier 3 can be more reliably maintained.

[0100] Also, the operation of the resin molding apparatus 1 illustrated in the present embodiment is merely an example, and the present invention is not limited thereto. That is, the operation order and operation mode of each part of the resin molding apparatus 1 can be arbitrarily changed.

[0101] <Appendix> The resin molding apparatus 1 according to the first aspect of the present disclosure a take-out mechanism 30 that takes out the substrate 2 from a carrier 3 (transport member) that accommodates the substrate 2 (object to be molded), a loader 40 (first object-to-be-molded transport mechanism) that transports the substrate 2 taken out from the carrier 3 to a molding die 16, a carrier accommodating portion 80 (transport member accommodating portion) that can accommodate the carrier 3 from which the substrate 2 has been taken out, a carrier transport unit 50 (transport member transport mechanism) that transports the carrier 3 from which the substrate 2 has been taken out to the carrier accommodating portion 80, A clamping mechanism 17 that clamps the mold 16 in which the substrate 2 is conveyed so as to be resin-molded, An unloader 70 (second molded object conveying mechanism) that unloads the substrate 2 after molding from the mold 16, A molded object accommodating mechanism that accommodates the substrate 2 unloaded from the mold 16 in the carrier 3 accommodated in the carrier accommodating portion 80, is provided. According to the resin molding apparatus 1 of the first aspect of the present disclosure, the substrate 2 accommodated in the carrier 3 can be taken out and resin-molded, and then the substrate 2 can be accommodated in the carrier 3 again. As a result, an increase in the size of the mold 16 can be suppressed. In addition, since the positioning of the substrate 2 can be directly performed with respect to the mold 16, the positioning accuracy of the substrate 2 can be improved.

[0102] In the resin molding apparatus 1 of the second aspect according to the first aspect, The loader 40 and the carrier transfer unit 50 are both movable in at least a part of the moving region. According to the resin molding apparatus 1 of the second aspect of the present disclosure, by sharing the moving region between the loader 40 and the carrier transfer unit 50, an increase in the size of the resin molding apparatus 1 can be suppressed.

[0103] The resin molding apparatus 1 of the third aspect according to the first or second aspect, is provided with a reading unit (first camera 14, second camera 20) capable of reading an identifier (code 3c, code 2a) given to at least one of the carrier 3 and the substrate 2. According to the resin molding apparatus 1 of the third aspect of the present disclosure, at least one of the carrier 3 and the substrate 2 can be identified and managed. As a result, it becomes easier to confirm whether the conveyance, molding, etc. of the substrate 2 and the carrier 3 are performed without problems.

[0104] The resin molding apparatus 1 of the fourth aspect according to the first or second aspect, A first camera 14 (first reading unit) capable of reading an identifier given to the substrate 2 before molding and the carrier 3 in which the substrate 2 before molding is accommodated, a second camera 20 (second reading unit) capable of reading identifiers assigned to the substrate 2 after shaping and the carrier 3 that houses the substrate 2 after shaping; It is provided with. According to the resin molding apparatus 1 of the fourth aspect of the present disclosure, the correspondence relationship between the substrate 2 and the carrier 3 before and after molding can be confirmed. As a result, it becomes easier to maintain the correspondence relationship between the substrate 2 and the carrier 3 before and after molding. For example, it becomes easier to manage (for example, lot management, etc.) the substrate 2 using the carrier 3.

[0105] In the resin molding apparatus 1 of the fifth aspect according to any one of the first to fourth aspects, The carrier housing unit 80 can house a plurality of carriers 3 based on the order in which the carriers 3 are conveyed by the carrier conveyance unit 50. According to the resin molding apparatus 1 of the fifth aspect of the present disclosure, since the carriers 3 can be housed in the order in which they are conveyed, it becomes easy to manage and grasp the order of the carriers 3.

[0106] The resin molding apparatus 1 of the sixth aspect according to any one of the first to fifth aspects includes a substrate alignment stage 12 (placement unit) on which the substrate 2 taken out by the take-out mechanism 30 is placed, The take-out mechanism 30 places the substrate 2 taken out from the carrier 3 on the substrate alignment stage 12 so as not to interfere with the loader 40. According to the resin molding apparatus 1 of the fifth aspect of the present disclosure, interference with the loader 40 when taking out the substrate 2 can be prevented.

[0107] In the resin molding apparatus 1 of the seventh aspect according to the sixth aspect, The take-out mechanism 30 places the substrate 2 at a predetermined position on the substrate alignment stage 12 when the loader 40 is retracted to the retracted position. According to the resin molding apparatus 1 of the seventh aspect of the present disclosure, interference with the loader 40 when taking out the substrate 2 can be prevented.

[0108] The manufacturing method of the resin molded product according to the eighth aspect of the present disclosure is a manufacturing method of a resin molded product using a resin molding apparatus according to any one of the first to seventh aspects, a take-out step S3 of taking out the substrate 2 from the carrier 3, a transfer step S4 (molding object transfer step) of transferring the substrate 2 taken out in the take-out step S3 to the mold 16, a transfer step S4 (transfer member transfer step) of transferring the carrier 3 from which the substrate 2 has been taken out, a resin molding step S5 of resin-molding the substrate 2 transferred to the mold 16 in the transfer step S4, a molding object accommodation step S7 of accommodating the substrate 2 resin-molded in the resin molding step S5 in the carrier 3 transferred in the transfer step S4, including. According to the manufacturing method of the resin molded product according to the eighth aspect of the present disclosure, the substrate 2 accommodated in the carrier 3 can be taken out and resin-molded. As a result, an increase in the size of the mold 16 can be suppressed. In addition, since the positioning of the substrate 2 can be directly performed with respect to the mold 16, the positional accuracy of the substrate 2 can be improved.

Explanation of reference numerals

[0109] 1 Resin molding apparatus 2 Substrate 3 Carrier 12 Substrate alignment stage 14 First camera 16 Mold 17 Mold clamping mechanism 20 Second camera 30 Take-out mechanism 40 Loader 50 Carrier transfer unit 70 Unloader 80 Carrier accommodation section

Claims

1. A take-out mechanism for taking out the object to be molded from a transport member that houses the object to be molded, a first object-to-be-molded transport mechanism for transporting the object to be molded taken out from the transport member to a mold, a transport member housing portion capable of housing the transport member from which the object to be molded has been taken out, a transport member transport mechanism for transporting the transport member from which the object to be molded has been taken out to the transport member housing portion, a mold clamping mechanism for clamping the mold in which the object to be molded is transported so as to perform resin molding, a second object-to-be-molded transport mechanism for carrying out the molded object from the mold after molding, an object-to-be-molded housing mechanism for housing the object to be molded carried out from the mold in the transport member housed in the transport member housing portion, A resin molding apparatus comprising:

2. The resin molding apparatus according to claim 1, wherein the first object-to-be-molded transport mechanism and the transport member transport mechanism are both movable in at least a partial movement region.

3. The resin molding apparatus according to claim 1, further comprising a reading unit capable of reading an identifier given to at least one of the transport member and the object to be molded.

4. A first reading unit capable of reading an identifier given to the object to be molded before molding and the transport member that houses the object to be molded before molding, A second reading unit capable of reading an identifier given to the object to be molded after molding and the transport member that houses the object to be molded after molding, The resin molding apparatus according to claim 1, comprising:

5. The resin molding apparatus according to claim 1, wherein the transport member housing portion is capable of housing a plurality of transport members based on the order in which they are transported by the transport member transport mechanism.

6. Comprising a placement portion on which the object to be molded taken out by the take-out mechanism is placed, The take-out mechanism places the object to be molded taken out from the transport member on the placement portion so as not to interfere with the first object-to-be-molded transport mechanism. The resin molding apparatus according to claim 1.

7. The take-out mechanism places the object to be molded at a predetermined position of the placement portion when the first object-to-be-molded transport mechanism is retracted to a retracted position. The resin molding apparatus according to claim 6.

8. A method for manufacturing a resin molded product using the resin molding apparatus according to any one of claims 1 to 7, a take-out step of taking out the object to be molded from the transport member, An object to be molded conveyance step of conveying the object to be molded taken out by the taking-out step to the mold; A conveyance member conveyance step of conveying the conveyance member from which the object to be molded has been taken out; A resin molding step of resin-molding the object to be molded conveyed to the mold by the object to be molded conveyance step; An object to be molded accommodation step of accommodating the object to be molded resin-molded by the resin molding step in the conveyance member conveyed by the conveyance member conveyance step; A method for manufacturing a resin molded product including the above steps.

Images