Method for manufacturing a light-emitting device

Abstract

To provide a manufacturing method of a light-emitting device which can improve light extraction efficiency.SOLUTION: A manufacturing method of a light-emitting device includes the steps of: preparing a light-emitting element having an upper face and a plurality of side faces continuous to the upper face; arranging an adhesive resin onto the upper face and the side faces of the light-emitting element, so that a lower end of the adhesive resin at a corner part between the side faces of the light-emitting element is positioned on a lower side of the lower end of the adhesive resin in a central part on the side faces of the light-emitting element; arranging a translucent member on the upper face of the light-emitting element, and pressing the adhesive resin by the translucent member; and curing the adhesive resin.SELECTED DRAWING: Figure 9

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a light-emitting device.

Background Art

[0002] A light-emitting device having a light-emitting element such as a light-emitting diode is known. As an example, it has a first surface serving as a light extraction surface, a second surface facing the first surface, and a plurality of third surfaces between the first surface and the second surface, and a light-emitting element having a pair of electrodes on the second surface side, a translucent member disposed on the first surface side, and an adhesive resin that is between the light-emitting element and the translucent member and covers from the first surface of the light-emitting element to the plurality of third surfaces, and that adheres the light-emitting element and the translucent member (see Patent Document 1).

[0003] In such a light-emitting device, the adhesive resin functions as a light guide member with respect to light emitted laterally from the light-emitting element. Therefore, the light emitted laterally from the light-emitting element is reflected toward the translucent member side at the side surface of the adhesive resin, and the light extraction efficiency of the light-emitting device is improved.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] An object of the present disclosure is to provide a method for manufacturing a light-emitting device capable of further improving light extraction efficiency.

Means for Solving the Problems

[0006] A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes a step of preparing a light-emitting element having an upper surface and a plurality of side surfaces connected to the upper surface, and a step of disposing an adhesive resin on the upper surface and the side surfaces of the light-emitting element, wherein the adhesive resin is disposed such that a lower end of the adhesive resin at a corner between the side surfaces of the light-emitting element is located below a lower end of the adhesive resin at a central portion of the side surface of the light-emitting element, a step of disposing a light-transmissive member on the upper surface of the light-emitting element and pressing the adhesive resin with the light-transmissive member, and a step of curing the adhesive resin. And, in the pressing step, the adhesive resin is pressed so as to cover the entire lower surface of the light-transmissive member, contact the lower ends of the side surfaces of each of the light-emitting elements, and have a shape with a convex curved surface on the outside. 。

Effect of the Invention

[0007] According to an embodiment of the present disclosure, it is possible to provide a method for manufacturing a light-emitting device capable of further improving the light extraction efficiency.

Brief Description of the Drawings

[0008]

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Figure 13

Mode for Carrying Out the Invention

[0009] Hereinafter, with reference to the drawings, a manufacturing method of an embodiment according to the present invention and a light-emitting device obtained by the manufacturing method (hereinafter sometimes referred to as "the light-emitting device according to the embodiment") will be described. In the following description, terms indicating a specific direction or position (for example, "up", "down", and other terms including those terms) are used as necessary. However, the use of those terms is for facilitating the understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meanings of those terms. Also, parts denoted by the same reference numerals in a plurality of drawings indicate the same or equivalent parts or members.

[0010] Further, the embodiments shown below exemplify a light-emitting device or the like for embodying the technical idea of the present invention, and do not limit the present invention below. Also, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are not intended to limit the scope of the present invention only to those, but are intended to be exemplified unless otherwise specifically described. Also, the content described in one embodiment is applicable to other embodiments and modifications. Also, the sizes and positional relationships of the members shown in the drawings may be exaggerated for clarity of explanation. Furthermore, in order to avoid the drawings becoming overly complicated, a schematic diagram omitting the illustration of some elements may be used, or an end view showing only the cut surface as a cross-sectional view may be used.

[0011] <Light-emitting device 1 according to the embodiment> FIG. 1 is a perspective view schematically showing a light-emitting device according to the present embodiment. FIG. 2 is a longitudinal sectional view taken along line II-II in FIG. 1. FIG. 3 is a longitudinal sectional view taken along line III-III in FIG. 1. FIG. 4 is a partial enlarged view of part A in FIG. 2. Note that the longitudinal section is a section obtained by cutting the light-emitting device 1 with a plane perpendicular to the upper surface of the light-emitting element 20.

[0012] As shown in FIGS. 1 to 3, the light-emitting device 1 includes a wiring substrate 10, a light-emitting element 20, a protection element 30, a light guide member 40, a light-transmissive member 50, and a covering member 60. Note that the light-emitting device 1 may be configured not to include the protection element 30 and the covering member 60.

[0013] In the light-emitting device 1, the light-emitting element 20 is disposed on the wiring substrate 10. Further, in the light-emitting device 1, the protection element 30 may be disposed on the wiring substrate 10. The light-emitting element 20 has an upper surface 20a, a plurality of side surfaces 20c continuous with the upper surface 20a, and a lower surface 20b opposite to the upper surface 20a. The plurality of side surfaces 20c are continuous with the upper surface 20a and the lower surface 20b. In other words, each of the plurality of side surfaces 20c has an outer edge that is continuous with the outer edge of the upper surface 20a and the outer edge of the lower surface 20b. In the light-emitting element 20, light is emitted from the upper surface 20a, the lower surface 20b, and the side surfaces 20c.

[0014] The light-emitting element 20 has an upper surface 20a having a substantially rectangular shape. For example, the light-emitting element 20 has an outer shape that is substantially a rectangular parallelepiped or a cube. In this case, the upper surface 20a and the lower surface 20b of the light-emitting element 20 are substantially rectangular, and the light-emitting element 20 has four substantially rectangular side surfaces 20c. The shape of the upper surface 20a of the light-emitting element 20 may be a polygon such as a triangle or a hexagon. Further, the light-emitting element 20 may have an outer shape that is a columnar body or a frustum of a cone having a polygon on the upper surface.

[0015] The light guide member 40 continuously covers the upper surface 20a of the light emitting element 20 and a plurality of side surfaces 20c continuous with the upper surface 20a. Specifically, the light guide member 40 covers the entire upper surface 20a of the light emitting element 20 and a part of at least the upper end side (that is, the outer edge side continuous with the upper surface 20a) of each side surface 20c. The light guide member 40 includes a side surface 40c that is in contact with the side surface 20c of the light emitting element 20 and the lower surface of the light transmissive member 50. Preferably, the light guide member 40 covers a larger area of each side surface 20c of the light emitting element 20, and more preferably covers substantially all of each side surface 20c. That is, the side surface 40c of the light guide member 40 preferably contacts the side surface 20c at a position close to the lower end side (that is, the side continuous with the lower surface 20b) of each side surface 20c of the light emitting element 20, and more preferably contacts the lower end of each side surface 20c. Specifically, in each side surface 20c of the light emitting element 20, it is preferable that an area of 75% or more and 100% or less in the height direction from the upper end side is covered by the light guide member 40, and more preferably an area of 90% or more and 100% or less is covered by the light guide member 40.

[0016] FIG. 3 shows a longitudinal section passing through the corner between the side surfaces 20c of the light emitting element 20. As shown in FIG. 3, the side surface 40c of the light guide member 40 preferably has a convex curve in a direction away from the side surface 20c of the light emitting element 20 in a longitudinal sectional view passing through the corner between the side surfaces 20c of the light emitting element 20. Further, as shown in FIG. 2, the side surface 40c of the light guide member 40 also preferably has a convex curve in a direction away from the side surface 20c of the light emitting element even in a longitudinal sectional view that does not pass through the corner between the side surfaces 20c of the light emitting element 20 (for example, a longitudinal sectional view passing through the central portion of the side surface 20c). Note that the corner between the side surfaces 20c of the light emitting element 20 is a corner where the adjacent side surfaces 20c contact each other between the adjacent side surfaces 20c.

[0017] Since the side surface 40c of the light guide member 40 is a convex curve in a direction away from the side surface 20c of the light emitting element, as shown in FIG. 4, the light L emitted laterally from the lower end side of the side surface 20c of the light emitting element 20 is likely to be reflected upward of the light emitting element 20 at the interface between the side surface 20c of the light guide member 40 and the covering member 60. Therefore, the light incident on the light transmissive member 50 increases, and the light extraction efficiency in the light emitting device 1 can be improved.

[0018] The light transmissive member 50 is disposed on the light emitting element 20 via the light guide member 40. The light transmissive member 50 has an upper surface, a lower surface 50b opposite to the upper surface, and side surfaces between the upper surface and the lower surface 50b. The upper surface 50a of the light transmissive member 50 constitutes the upper surface of the light emitting device 1 as the main light emitting surface of the light emitting device 1. The light transmissive member 50 is disposed on the light emitting element 20 such that the lower surface 50b of the light transmissive member 50 faces the upper surface 20a of the light emitting element 20 via the light guide member 40 disposed on the upper surface 20a of the light emitting element 20. The light transmissive member 50 is disposed such that the lower surface 50b of the light transmissive member 50 is substantially parallel to the upper surface 20a of the light emitting element. The shape of the lower surface 50b of the light transmissive member is preferably a shape similar to the shape of the upper surface 20a of the light emitting element. For example, when the upper surface 20a of the light emitting element is rectangular, the lower surface 50b of the light transmissive member is preferably also rectangular.

[0019] The lower surface 50b of the light transmissive member 50 is a flat surface. The upper surface 50a of the light transmissive member 50 may be a flat surface parallel to the lower surface 50b, or a part or all of the upper surface 50a may have a surface that is not parallel to the lower surface 50b. The side surface of the light transmissive member 50 may be any of a surface perpendicular to the upper surface 50a and / or the lower surface 50b, an inclined surface, a curved surface, etc. Note that the light transmissive member 50 may have an uneven structure on a part or all of its surface.

[0020] The lower surface 50b of the light-transmitting member 50 preferably has an area larger than the upper surface 20a of the light-emitting element 20. Also, the light-transmitting member 50 is preferably arranged such that the lower surface 50b of the light-transmitting member 50 encloses the light-emitting element 20 in a top view. Further, in the light-emitting device 1, the light guide member 40 interposed between the lower surface 50b of the light-transmitting member 50 and the upper surface 20a of the light-emitting element 20 preferably covers the lower surface 50b of the light-transmitting member 50 that does not overlap the upper surface 20a of the light-emitting element 20 in a top view. Furthermore, in the light-emitting device 1, the light guide member 40 is preferably arranged so as to reach the outer edge of the lower surface 50b of the light-transmitting member 50, and more preferably, all of the lower surface 50b is covered by the light guide member 40. Thereby, more of the light emitted from the light-emitting element 20 can be incident from the lower surface 50b of the light-transmitting member 50 through the light guide member 40.

[0021] The covering member 60 is provided on the wiring substrate 10, exposes the upper surface 50a of the light-transmitting member 50, and covers the side surface 40c of the light guide member 40 and the side surface of the light-transmitting member 50. When the light-emitting device 1 has the protection element 30, the covering member 60 preferably covers the upper surface, the lower surface, and the side surface of the protection element 30. Further, the covering member 60 may cover the side surface 20c of the light-emitting element 20 exposed from the light guide member 40 and the lower surface 20b of the light-emitting element 20.

[0022] When the covering member 60 covers the side surface 40c of the light guide member 40, the light emitted from the side surface 20c of the light-emitting element 20 and transmitted through the light guide member 40 is reflected by the covering member 60. Also, when the covering member 60 covers the lower surface 20b of the light-emitting element 20, the light traveling downward from the light-emitting element 20 is reflected by the covering member 60. Thereby, the light extraction efficiency in the light-emitting device 1 can be improved.

[0023] The covering member 60 may be composed of a single member or a plurality of members. In the examples shown in FIGS. 2 and 3, the covering member 60 is composed of a first covering member 61 and a second covering member 62. The first covering member 61 is provided, for example, on the wiring substrate 10 and covers at least a part of the lower surface 20b of the light-emitting element 20 and the side surface 40c of the light guide member 40. When the light-emitting device 1 has the protection element 30, the first covering member 61 covers, for example, at least a part of the lower surface and the side surface of the protection element 30.

[0024] The second covering member 62 is provided, for example, on the first covering member 61 and covers the side surface of the light-transmissive member 50. When the light-emitting device 1 has the protection element 30, the second covering member 62 covers, for example, the upper surface of the protection element 30. The second covering member 62 may cover a part of the side surface of the light-transmissive member 50 and a part of the side surface of the protection element 30.

[0025] The side surface of the second covering member 62 and the side surface of the base material 11 of the wiring substrate 10 constitute the side surface of the light-emitting device 1. The side surface of the second covering member 62 and the side surface of the base material 11 may be, for example, the same surface. Also, the upper surface of the second covering member 62 and the upper surface 50a of the light-transmissive member 50 may be, for example, the same surface.

[0026] Hereinafter, each element constituting the light-emitting device 1 according to the embodiment will be described in detail.

[0027] [Wiring Substrate 10] The wiring board 10 is a member on which the light-emitting element 20 is disposed. The wiring board 10 includes wiring for supplying power to the light-emitting element from the outside and a base material 11 that supports the wiring. As an example, the wiring board 10 has an upper surface wiring 12 disposed on the upper surface where the light-emitting element 20 is disposed and a lower surface wiring 13 disposed on the lower surface opposite to the upper surface. The base material 11 is, for example, in a substantially rectangular parallelepiped shape or a substantially cubic shape. It is preferable to use, as the base material 11, an insulating material and a material that hardly transmits light emitted from the light-emitting element 20, external light, or the like. Examples of the material of the base material 11 include ceramics such as aluminum oxide, aluminum nitride, silicon nitride, and mullite, epoxy resins, silicone resins, modified epoxy resins, urethane resins, phenol resins, polyimide resins, BT resins, polyphthalamide resins, semiconductors such as silicon, and single materials of metals such as copper and aluminum, and composite materials thereof. Among these, as the material of the base material 11, ceramics with excellent heat dissipation can be preferably used.

[0028] The upper surface wiring 12 includes wiring electrically connected to the light-emitting element 20 and wiring electrically connected to the protection element 30. The lower surface wiring 13 includes an anode electrode and a cathode electrode electrically connected to an external power source. For the upper surface wiring 12 and the lower surface wiring 13, for example, metals such as iron, copper, nickel, aluminum, gold, silver, platinum, titanium, tungsten, palladium, or alloys containing at least one of these can be used. Further, the wiring board 10 may include relay wiring for connecting the upper surface wiring 12 and the lower surface wiring 13 inside and / or on the side surface of the base material 11.

[0029] The wiring board 10 may not have the lower surface wiring 13. In this case, an anode electrode and a cathode electrode electrically connected to an external power source may be disposed on the upper surface or the side surface.

[0030] Note that the wiring board 10 may have a recess on its upper surface, and the light-emitting device 1 may have a structure in which the light-emitting element 20 is disposed at the bottom of the recess of the wiring board 10. Further, the light-emitting device 1 may have a structure that does not include the wiring board 10. For example, a light-emitting device having a structure including a metal member exposed from a covering member 60 covering the lower surface 20b of the light-emitting element 20 as an electrode of the light-emitting device 1 may be used.

[0031] (Light-emitting element 20) As the light-emitting element 20, a semiconductor light-emitting element such as a light-emitting diode (LED) chip or a semiconductor laser (LD) chip can be preferably used. The shape, size, etc. of the light-emitting element 20 can be arbitrarily selected. The light-emitting element 20 has, for example, a plurality of electrodes 25 on its lower surface 20b. The light-emitting element 20 is disposed on the wiring board 10. The light-emitting element 20 is flip-chip mounted on the wiring board 10 with its lower surface 25b provided with the electrodes 25 facing the wiring board 10 side, for example. The plurality of electrodes 25 of the light-emitting element 20 are electrically connected to the upper surface wiring 12. The plurality of electrodes 25 of the light-emitting element 20 and the upper surface wiring 12 can be connected using a known member such as eutectic solder, conductive paste, or bumps, for example.

[0032] The light-emitting element 20 includes, for example, a semiconductor structure and a support substrate that supports the semiconductor structure. The semiconductor structure includes an n-side semiconductor layer, a p-side semiconductor layer, and an active layer sandwiched between the n-side semiconductor layer and the p-side semiconductor layer. The active layer may have a single quantum well (SQW) structure or a multiple quantum well (MQW) structure including a plurality of well layers. The semiconductor structure includes a plurality of semiconductor layers made of a nitride semiconductor. The nitride semiconductor includes all compositions in which the composition ratios x and y are changed within their respective ranges in the chemical formula of In x Al y Ga 1-x-y N (0 ≦ x, 0 ≦ y, x + y ≦ 1). The emission peak wavelength of the active layer can be appropriately selected according to the purpose. The active layer is configured to emit visible light or ultraviolet light, for example.

[0033] The light-emitting element 20 may have one semiconductor structure on one support substrate, or may have a plurality of semiconductor laminate structures on one support substrate. Further, one semiconductor structure may have only one light-emitting layer, or may have a plurality of light-emitting layers. The structure of the semiconductor structure having a plurality of light-emitting layers may be a structure including a plurality of active layers between one n-side semiconductor layer and one p-side semiconductor layer, or may be a structure in which the structure including the n-side semiconductor layer, the active layer, and the p-side semiconductor layer in this order is repeated a plurality of times.

[0034] In the light-emitting element 20, a plurality of electrodes 25 are disposed on the semiconductor structure. The electrodes 25 include an n-electrode connected to the n-side semiconductor layer and a p-electrode connected to the p-side semiconductor layer. The p-electrode and the n-electrode may be disposed on different surfaces of the semiconductor laminate, or may be disposed on the same surface. Here, a plurality of electrodes 25 including the p-electrode and the n-electrode are disposed on the same surface of the semiconductor structure, the side on which the plurality of electrodes 25 are disposed constitutes the lower surface 20b of the light-emitting element 20, and the surface of the support substrate opposite to the surface on which the semiconductor structure is disposed constitutes the upper surface 20a of the light-emitting element 20. Examples of the support substrate include insulating substrates such as sapphire and spinel (MgAl 2 O 4 ), and nitride semiconductor substrates such as gallium nitride. In order to extract the light emitted from the active layer through the support substrate, it is preferable to use a material having translucency for the support substrate.

[0035] (Protection element 30) In addition to the light-emitting element 20, the light-emitting device 1 can include other electronic components such as a protection element 30. The protection element 30 is, for example, a Zener diode. Note that the light-emitting device 1 may be configured not to include the protection element 30.

[0036] (Light guide member 40) The light guide member 40 is disposed between the light emitting element 20 and the translucent member 50, and is a member that joins the light emitting element 20 and the translucent member 50. Further, the light guide member 40 is a member that guides the light emitted from the light emitting element 20 to the translucent member 50. By covering the side surface of the light emitting element 20 with the light guide member 40, it becomes easier to guide the light emitted from the side surface of the light emitting element 20 to the translucent member 50, and the light extraction efficiency in the light emitting device 1 can be improved.

[0037] The light guide member 40 is disposed so as to cover the upper surface 20a and each side surface 20c of the light emitting element 20. The light guide member 40 that covers the side surface 20c of the light emitting element 20 can be formed by the uncured adhesive resin that joins the translucent member 50 and the light emitting element 20 spreading over the side surface 20c of the light emitting element 20 and then being cured. As the adhesive resin that becomes the light guide member 40 after curing, for example, a translucent resin can be used. Examples of the translucent resin include thermosetting resins such as epoxy resin, modified epoxy resin, silicone resin, and modified silicone resin. Among them, a silicone resin with high heat resistance is preferably used. Note that the light guide member 40 may contain a light diffusion member or a phosphor, which will be described later.

[0038] (translucent member 50) The light-transmitting member 50 is a member that is disposed on the light-emitting element 20 and transmits the light emitted from the light-emitting element 20 to the outside. The light-transmitting member 50 includes those that transmit 60% or more of the light from the light-emitting element 20 and / or the light whose wavelength has been converted from the light from the light-emitting element 20 (for example, light in the range of 320 nm to 850 nm), and those that transmit 70% or more of the light are preferred. The light-transmitting member 50 may be formed of, for example, an inorganic material such as glass, ceramic, sapphire, etc., or an organic material such as a resin containing one or more of silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, phenol resin, fluororesin, or a hybrid resin. The light-transmitting member 50 may contain a phosphor capable of wavelength-converting at least a part of the incident light. Examples of the light-transmitting member 50 containing a phosphor include a sintered body of the phosphor and those in which the phosphor powder is contained in the above-described materials. Further, the light-transmitting member 50 may be one in which a light-transmitting layer such as a resin layer containing a phosphor or a glass layer containing a phosphor is formed on the surface of a molded body such as resin, glass, or ceramic. Further, the light-transmitting member 50 may contain a filler such as a diffusing material according to the purpose. When containing a filler such as a diffusing material, the light-transmitting member 50 may be one in which the filler is contained in resin, glass, ceramic, or other inorganic substances, or may be one in which a light-transmitting layer such as a resin layer containing a filler or a glass layer containing a filler is formed on the surface of a light-transmitting plate that is a molded body of resin, glass, ceramic, etc.

[0039] The phosphor is a yttrium aluminum garnet-based phosphor (for example, (Y,Gd) 3 (Al,Ga) 5 O 12 :Ce), a lutetium aluminum garnet-based phosphor (for example, Lu 3 (Al,Ga) 5 O 12 :Ce), a terbium aluminum garnet-based phosphor (for example, Tb 3 (Al,Ga) 5 O 12 :Ce), a CCA-based phosphor (for example, Ca 10 (PO 4 ) 6 Cl2 : Eu), SAE-based phosphors (e.g., Sr 4 Al 14 O 25 : Eu), chlorosilicate-based phosphors (e.g., Ca 8 MgSi 4 O 16 Cl 2 : Eu), silicate-based phosphors (e.g., (Ba, Sr, Ca, Mg) 2 SiO 4 : Eu), β-sialon-based phosphors (e.g., (Si, Al) 3 (O, N) 4 : Eu) or α-sialon-based phosphors (e.g., Ca(Si, Al) 12 (O, N) 16 : Eu), etc., oxynitride-based phosphors, LSN-based phosphors (e.g., (La, Y) 3 Si 6 N 11 : Ce), BSESN-based phosphors (e.g., (Ba, Sr) 2 Si 5 N 8 : Eu), SLA-based phosphors (e.g., SrLiAl 3 N 4 : Eu), CASN-based phosphors (e.g., CaAlSiN 3 : Eu) or SCASN-based phosphors (e.g., (Sr, Ca)AlSiN 3 : Eu), etc., nitride-based phosphors, KSF-based phosphors (e.g., K 2 SiF 6 : Mn), KSAF-based phosphors (e.g., K 2 (Si 1-x Al x )F 6-x : Mn Here, x satisfies 0 < x < 1.) or MGF-based phosphors (e.g., 3.5MgO·0.5MgF 2 ·GeO 2 : Mn), etc., fluoride-based phosphors, quantum dots having a perovskite structure (e.g., (Cs, FA, MA)(Pb, Sn)(F, Cl, Br, I) 3Here, FA and MA represent formamidinium and methylammonium, respectively.), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se) 2 ) etc. can be used.

[0040] As the light diffusing member, those known in the art can be used. For example, titanium oxide, silicon oxide, aluminum oxide, barium titanate, etc. can be used.

[0041] When a resin is used as the binder for the phosphor layer or the diffusion material layer, examples of the resin include thermosetting resins such as epoxy resins, modified epoxy resins, silicone resins, and modified silicone resins.

[0042] (Coating member 60) The coating member 60 preferably has light-shielding properties, specifically, preferably has light reflectivity and / or light absorptivity. Among them, it preferably contains a material that can preferably reflect the light emitted from the light-emitting element 20. For example, it preferably has a reflectivity of 60% or more with respect to the light emitted from the light-emitting element 20, and more preferably has a reflectivity of 70% or more, 80% or more, or 90% or more.

[0043] The covering member 60 is preferably made of an insulating material. The covering member 60 is, for example, a member in which particles of a light-reflective substance are contained in a translucent resin. Examples of the resin used for the covering member 60 include resins or hybrid resins containing one or more of silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, urea resin, acrylic resin, phenol resin, bismaleimide triazine resin, and polyphthalamide resin. Among these, it is particularly preferable to use a silicone resin that is excellent in light resistance, heat resistance, and electrical insulation and has flexibility. Examples of the light-reflective substance include titanium oxide, silicon oxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, barium titanate, zinc oxide, silicon nitride, aluminum nitride, boron nitride, calcium carbonate, calcium hydroxide, calcium silicate, and combinations thereof. Among these, from the viewpoint of light reflection, it is preferable to use titanium oxide having a relatively high refractive index.

[0044] As described above, the covering member 60 may be composed of a first covering member 61 and a second covering member 62. In this case, each of the first covering member 61 and the second covering member 62 can be formed using a material selected from the above-exemplified materials as the material of the covering member 60. By configuring the covering member 60 from the first covering member 61 and the second covering member 62, for example, a material with high mechanical strength can be used for the second covering member 62 that constitutes the outer surface of the light-emitting device 1, or a material with low elasticity and low linear expansion can be used for the first covering member 61 that covers the lower surface 20b of the light-emitting element 20 to relieve the stress of resin expansion.

[0045] (Operation of the light-emitting device 1) In the light-emitting device 1, when current is supplied from an external power source to the light-emitting element 20, the light-emitting element 20 emits light. Among the light emitted by the light-emitting element 20, the light traveling upward (i.e., the lower surface side of the light-transmissive member) is taken out of the light-emitting device 1 through the light guide member 40 and the light-transmissive member 50. Also, among the light emitted by the light-emitting element 20, the light traveling downward is reflected by the covering member 60 and the wiring board 10, and is taken out of the light-emitting device 1 through the light guide member 40 and the light-transmissive member 50. Further, among the light emitted by the light-emitting element 20, the light traveling in the lateral direction is reflected at the interface between the side surface 20c of the light guide member 40 and the covering member 60, and is taken out of the light-emitting device 1 through the light guide member 40 and the light-transmissive member 50. At this time, since the side surface 40c of the light guide member 40 is a convex curve in a direction away from the side surface 20c of the light-emitting element, the surface area of the interface between the light guide member 40 serving as a reflection surface and the covering member 60 increases, and light can be reflected more efficiently. Thereby, the light-emitting device 1 with more excellent light extraction efficiency can be obtained.

[0046] <Method for manufacturing a light-emitting device according to an embodiment> The method for manufacturing a light-emitting device according to an embodiment includes a step of preparing a light-emitting element having an upper surface and a plurality of side surfaces continuous with the upper surface, and a step of disposing an adhesive resin on the upper surface and the side surfaces of the light-emitting element, the step of disposing the adhesive resin such that the lower end of the adhesive resin at the corner between the side surfaces of the light-emitting element is located below the lower end of the adhesive resin at the central portion of the side surface of the light-emitting element, a step of disposing a light-transmissive member on the upper surface of the light-emitting element and pressing the adhesive resin with the light-transmissive member, and a step of curing the adhesive resin.

[0047] Furthermore, the method for manufacturing a light-emitting device according to an embodiment may include a step of disposing the light-emitting element on a wiring board before the step of disposing the adhesive resin.

[0048] Furthermore, the method for manufacturing a light-emitting device according to an embodiment may include a step of disposing a covering member that covers the side surfaces of the adhesive resin and the side surfaces of the light-transmissive member after the step of curing the adhesive resin.

[0049] Hereinafter, each manufacturing process of the manufacturing method of the light-emitting device according to the embodiment will be described with reference to the drawings.

[0050] Figs. 5 to 13 are schematic diagrams for explaining the manufacturing process of the light-emitting device according to the present embodiment. Specifically, Figs. 5 to 7, Fig. 10, and Fig. 11 are side views illustrating the manufacturing process of the light-emitting device. Further, Fig. 7 is a bottom view of the nozzle used for resin supply in the manufacturing process of the light-emitting device as viewed from the tip surface side. Fig. 9 is a perspective view illustrating the manufacturing process of the light-emitting device. Figs. 12 and 13 are cross-sectional views illustrating the manufacturing process of the light-emitting device.

[0051] (Step of preparing a light-emitting element) First, as shown in Fig. 5, a light-emitting element 20 including an upper surface 20a, a lower surface 20b, and a plurality of side surfaces 20c continuous with the upper surface 20a and the lower surface 20b is prepared. Also, a protective element 30 is prepared. The protective element 30 is prepared as necessary. Here, as an example, the following description will be made assuming that the upper surface 20a of the light-emitting element 20 is square.

[0052] (Step of arranging the light-emitting element on a wiring substrate) Next, as shown in Fig. 6, a substrate 10S including a plurality of regions 10A that will become the individual wiring substrates 10 included in the light-emitting device 1 after singulation is prepared. The regions 10A are two-dimensionally arranged in a matrix, for example, when viewed from above the substrate 10S. Then, the light-emitting element 20 and the protective element 30 are arranged on each region 10A of the substrate 10S. The light-emitting element 20 and the protective element 30 are flip-chip mounted on each region 10A with the surfaces on which the respective electrodes are arranged facing the upper surface wiring 12 side, for example.

[0053] (Step of arranging an adhesive resin) Next, as shown in FIGS. 7 to 10, an uncured adhesive resin 400 that will become the light guide member 40 after curing is disposed on the upper surface 20a and each side surface 20c of the light emitting element 20. Here, the adhesive resin 400 is disposed such that the lower end of the adhesive resin 400 covering the corner between the side surfaces 20c of the light emitting element 20 is located below the lower end of the adhesive resin 400 covering the central portion of the side surface 20c of the light emitting element 20. Here, the central portion of the side surface 20c of the light emitting element 20 is a portion located on a straight line equidistant from the sides located on both sides (that is, the boundary with the adjacent side surface) when the side surface 20c is viewed from the normal direction of the side surface 20c.

[0054] Specifically, first, as shown in FIGS. 7 and 8, a nozzle 100 having a discharge hole 102 at the tip surface 101 is prepared, and the nozzle 100 is disposed above the light emitting element 20 such that the tip surface 101 faces the upper surface 20a of the light emitting element 20.

[0055] The size of the tip surface 101 of the nozzle 100 is preferably larger than the upper surface 20a of the light emitting element 20. For example, if the upper surface 20a of the light emitting element 20 is a square of L mm × L mm, the size of the tip surface 101 can be a square of about 1.05L mm × 1.05L mm or more and 1.15L mm × 1.15L mm or less. As shown in FIG. 7, the nozzle 100 is disposed above the light emitting element 20 such that the tip surface 101 faces the upper surface 20a of the light emitting element 20 and the outer edge 101e of the tip surface 101 is located outside the outer edge of the upper surface 20a of the light emitting element 20.

[0056] Further, as shown in FIG. 8, the nozzle 100 preferably has a discharge hole 102 that opens at the center of the tip surface 101, and a plurality of grooves that open at the tip surface 101, communicate with the discharge hole 102, and extend from the discharge hole 102 toward the outer edge 101e of the tip surface 101. In the example of FIG. 8, in a bottom view, the shape of the discharge hole 102 is circular. Also, in the example of FIG. 8, in a bottom view, four grooves 103, 104, 105, and 106 are arranged in an X shape in the diagonal direction of the tip surface 101 from the discharge hole 102. When the shape of the upper surface 20a of the light-emitting element 20 is a polygon other than a rectangle, the tip surface of the nozzle 100 is preferably the same polygon, and the plurality of grooves are preferably a plurality of grooves extending from the center of the polygon toward each vertex.

[0057] In FIG. 8, in the tip surface 101, the regions where the discharge hole 102 and the grooves 103 to 106 are not provided are shown in a dot pattern. The regions shown in the dot pattern are substantially flat. Also, in FIG. 8, for the purpose of showing the positional relationship between the outer edge 101e of the tip surface 101 and the outer edge of the upper surface 20a of the light-emitting element 20, the outer edge of the upper surface 20a of the light-emitting element 20 is shown by a broken line for convenience.

[0058] By using the nozzle 100 having such a structure, it becomes easy to control the arrangement position of the adhesive resin 400. That is, the adhesive resin 400 can be easily moved from the upper surface 20a of the light-emitting element 20 to the corner between the side surfaces 20c, and the adhesive resin 400 can be easily accumulated at the corner between the side surfaces 20c of the light-emitting element 20 by surface tension.

[0059] In each of the grooves 103 to 106, for example, the bottom surface of the groove is flat, and the side surface of the groove is perpendicular to the tip surface 101. In each of the grooves 103 to 106, it is preferable that the width of the groove is substantially constant and the depth of the groove is substantially constant. Thereby, when the adhesive resin 400 moves in the groove, the flow state of the adhesive resin 400 is stabilized, so that the generation of voids in the adhesive resin 400 can be suppressed.

[0060] Note that the outer edge 101e of the front end face 101 refers to the outer edge of the front end face 101 in the bottom view shown in FIG. 8. That is, in the bottom view shown in FIG. 8, the four sides of the square including the portions where the grooves 103 to 106 are formed are the outer edge 101e of the front end face 101. Also, the size of the outer edge 101e of the front end face 101 in the bottom view shown in FIG. 8 is the size of the aforementioned front end face 101.

[0061] Next, the uncured adhesive resin 400 is discharged from the nozzle 100 toward the upper surface 20a of the light-emitting element 20. Then, after discharging a predetermined amount of the adhesive resin 400, the discharge is stopped and the nozzle 100 is moved from above the light-emitting element 20. As a result, as shown in FIGS. 9 and 10, the adhesive resin 400 is discharged from the discharge hole 102 and disposed on the upper surface 20a of the light-emitting element 20, and is also disposed at the corner between the side surfaces 20c of the light-emitting element 20. The lower end of the adhesive resin 400 at the corner between the side surfaces 20c of the light-emitting element 20 is located below the lower end of the adhesive resin 400 at the central portion of the side surface 20c of the light-emitting element 20.

[0062] Specifically, the adhesive resin 400 discharged from the discharge hole 102 is first disposed at the central portion of the upper surface 20a of the light-emitting element 20, and moves from the central portion of the light-emitting element 20 along the grooves 103 to 106 toward the corner of the upper surface 20a. Then, since the outer edge 101e of the front end face 101 of the nozzle 100 is located outside the outer edge of the upper surface 20a of the light-emitting element 20, the adhesive resin 400 can move beyond the outer edge of the upper surface 20a of the light-emitting element 20 to the corner between the side surfaces 20c of the light-emitting element 20. Note that at the central portion of the side surface 20c of the light-emitting element 20, since no discharge hole and groove are disposed above, the amount of the adhesive resin 400 disposed is less compared to the corner between the side surfaces 20c.

[0063] In this way, since the corner between the side surfaces 20c of the light-emitting element 20 is covered with the adhesive resin 400, when the adhesive resin 400 is pressed by the light-transmissive member 50 in a later process, the adhesive resin 400 can be disposed down to a position lower than the corner between the side surfaces 20c of the light-emitting element 20. Further, by adjusting the viscosity of the adhesive resin 400 such that the adhesive resin 400 easily accumulates on the side surface 20c due to surface tension, the amount of the adhesive resin covering the side surface 20c can be increased. Thereby, the shape of the light guide member 40 covering the side surface 20c of the light-emitting element 20 can be easily formed into a shape having a curved surface convex in a direction away from the side surface 20c of the light-emitting element 20. As a result, since light from the side surface 20c of the light-emitting element 20 is easily incident on the light guide member 40 and reflected upward, the light extraction efficiency in the light-emitting device 1 can be improved. Note that the viscosity of the uncured adhesive resin 400 can be adjusted, for example, according to the physical properties of the resin to be selected and the amount of the filler for viscosity adjustment contained in the resin.

[0064] In the step of disposing the adhesive resin 400, it is preferable to dispose the adhesive resin 400 on the light-emitting element 20 such that a first portion 401 located at the center of the upper surface 20a of the light-emitting element 20 has a higher height from the upper surface 20a of the light-emitting element 20 than a second portion 402 located at the corner of the upper surface 20a of the light-emitting element 20. Thereby, in the step of pressing the adhesive resin 400 with the light-transmissive member 50 described later, the pressed adhesive resin 400 moves so as to spread from the center of the upper surface 20a of the light-emitting element 20 toward the outer edge of the upper surface 20a. Thus, voids are less likely to be generated in the adhesive resin 400, and the generated voids can be moved to the outside and easily escape to the outside. Further, it becomes easier to dispose the adhesive resin 400 at the outer edge of the lower surface of the light-transmissive member 50.

[0065] Also, in the step of disposing the adhesive resin 400, the adhesive resin may be disposed to include a first portion 401, a second portion 402, and a third portion 403 located between the first portion 401 and the second portion 402. In this case, it is preferable that the height of the first portion 401 from the upper surface 20a of the light-emitting element 20 is higher than that of the second portion 402, and it is preferable that the height of the second portion 402 from the upper surface 20a of the light-emitting element 20 is higher than that of the third portion 403. Further, it is more preferable that the second portion 402 is continuous with the adhesive resin 400 disposed at the corner between the side surfaces 20c of the light-emitting element 20. In other words, it is more preferable that the second portion 402 is disposed so as to overlap the adhesive resin 400 disposed at the corner between the side surfaces 20c of the light-emitting element 20 in a top view. Thereby, in the step of pressing the adhesive resin 400 with the translucent member 50 described later, the adhesive resin 400 can be disposed further downward at the corner between the side surfaces 20c of the light-emitting element 20.

[0066] The arrangement of the adhesive resin 400 having the first portion 401, the second portion 402, and the third portion 403 of such a shape will be specifically described.

[0067] The adhesive resin 400 supplied from the discharge hole 102 first covers the central portion of the upper surface 20a of the light-emitting element 20. Then, it moves on the upper surface 20a along the groove and reaches the outside of the corner portion of the upper surface 20a. After reaching the corner portion between the side surfaces 20c, the supply of the adhesive resin 400 is stopped and the nozzle is moved upward. That is, when the adhesive resin 400 is supplied onto the light-emitting element 20, the starting point of the supply is the first portion 401 located at the central portion of the upper surface 20a, and the end point is also the first portion. In the resin discharge device, since the discharge amount of the resin tends to increase at the starting point and the end point of the supply, the height of the adhesive resin 400 from the upper surface 20a of the light-emitting element 20 is the highest at the first portion 401. Further, the starting point of the movement of the adhesive resin 400 is the first portion 401, and the end point is near the second portion 402. The adhesive resin 400 is disposed at the corner portion between the side surfaces 20c of the light-emitting element 20 beyond the upper surface 20a of the light-emitting element 20, and then the supply of the adhesive resin is stopped. The adhesive resin 400 maintains the height from the upper surface 20a of the light-emitting element 20 at the second portion 402 due to surface tension. The third portion 403 is a region where the adhesive resin 400 spreads mainly due to wettability after the supply is stopped, so the height from the upper surface 20a of the light-emitting element 20 is lower than that of the first portion 401 and the second portion 402.

[0068] By using the above-described manufacturing method, it becomes possible to dispose the adhesive resin 400 at desired positions on the upper surface and the side surfaces of the light-emitting element 20. When the adhesive resin 400 is disposed only on the upper surface 20a of the light-emitting element 20 and an attempt is made to move the adhesive resin 400 to the side surfaces 20c of the light-emitting element 20 by pressing, the amount of the adhesive resin 400 disposed at the corners between the side surfaces 20c that are relatively far from the central portion of the upper surface 20a of the light-emitting element 20 decreases. As described above, by disposing the adhesive resin 400 so as to include the first portion 401 and the second portion 402, and by making each second portion 402 continuous with the adhesive resin 400 disposed at the corners between the side surfaces 20c of the light-emitting element 20, the amount of the adhesive resin 400 covering the corners between the side surfaces 20c of the light-emitting element 20 can be relatively increased. Further, by setting the first portion 401, the second portion 402, and the third portion 403 in the height relationship as described above, when the adhesive resin 400 is pressed with the light-transmissive member 50 in a later process, the adhesive resin 400 easily spreads evenly on the upper surface 20a of the light-emitting element 20, and the adhesive resin 400 easily covers each side surface 20c of the light-emitting element 20. By the adhesive resin 400 covering each side surface 20c of the light-emitting element 20, when the light-emitting device 1 is completed, light from the side surfaces 20c of the light-emitting element 20 is easily incident on the light guide member 40 that has cured the adhesive resin 400 and is reflected upward. Therefore, the light extraction efficiency in the light-emitting device 1 can be improved.

[0069] (Step of pressing the adhesive resin) Next, as shown in FIG. 11, the adhesive resin 400 is pressed with the light-transmissive member 50. Specifically, first, as shown by the upper arrow in FIG. 11, the light-transmissive member 50 is disposed on the upper surface 20a of the light-emitting element 20. The light-transmissive member 50 preferably has a lower surface 50b with an area larger than the upper surface 20a of the light-emitting element 20. Further, the light-transmissive member 50 is preferably disposed so as to enclose the light-emitting element 20 in a top view.

[0070] Next, as shown below the arrow in Fig. 11, the light-transmissive member 50 presses the adhesive resin 400. Thereby, the adhesive resin 400 is disposed with a substantially constant thickness between the upper surface 20a of the light-emitting element 20 and the lower surface 50b of the light-transmissive member 50. Further, by the pressing, the adhesive resin 400 moves outward from the upper surface 20a of the light-emitting element 20, covers the lower surface of the light-transmissive member 50, and the adhesive resin 400 is disposed on a part or all of the side surface 20c of the light-emitting element 20. The adhesive resin 400 stays at the outer edge of the lower surface 50b of the light-transmissive member 50 or inside the outer edge, or at the lower end or above the lower end of the side surface 20c of the light-emitting element 20 due to the surface tension, and stabilizes in a shape having a convex curved surface on the outside. Thereby, the thickness of the adhesive resin 400 covering the side surface 20c of the light-emitting element 20 can be increased.

[0071] In the step of pressing the adhesive resin, it is preferable to press the adhesive resin 400 with the light-transmissive member 50 so that the adhesive resin 400 reaches the outer edge of the lower surface 50b of the light-transmissive member 50. Further, it is preferable to press the adhesive resin 400 with the light-transmissive member 50 so that the adhesive resin 400 reaches the lower end of each side surface 20c of the light-emitting element 20. That is, it is preferable that the adhesive resin 400 covers the entire lower surface of the light-transmissive member 50 and the entire side surface 20c of each light-emitting element 20. Thereby, when the light-emitting device 1 is completed, more light from the side surface 20c of the light-emitting element 20 can be guided to the light-transmissive member 50 through the light guide member 40, so that the light extraction efficiency of the light-emitting device 1 can be improved. Note that the lower side of the arrow in Fig. 11 illustrates the case where the adhesive resin 400 covers all of the lower surface of the light-transmissive member 50 and reaches the lower end of each side surface 20c of the light-emitting element 20.

[0072] In addition, in the pressing step, it is preferable that the adhesive resin 400 after pressing is disposed separated from the surface of the wiring substrate 10 (that is, the region 10A in the substrate 10S). Since the adhesive resin 400 is separated from the wiring substrate 10, it is possible to suppress the adhesive resin 400 from having a deformed shape and the light from the light-emitting element 20 being reflected in an unintended direction, so that the light extraction efficiency of the light-emitting device 1 can be improved. After the step of Fig. 11, the adhesive resin 400 is cured to produce the light guide member 40.

[0073] (Step of curing the resin) The step of curing the adhesive resin is a step of curing (or solidifying) the adhesive resin 400. By curing the adhesive resin 400, the light guide member 40 is formed, and through the light guide member 40, the translucent member 50 and the light emitting element 20 are joined. Curing can be performed by a known method such as heating in an oven.

[0074] Note that the curing step may be performed simultaneously with the step of pressing the translucent member 50. Further, in the curing step, with the adhesive resin 400 moved to a desired position in the pressing step, the translucent member 50 is held by a collet or the like, and curing may be completed while maintaining a desired position where the lower surface 50b of the translucent member 50 and the upper surface 20a of the light emitting element 20 are parallel.

[0075] (Step of arranging the covering member) Next, as shown in FIGS. 12 and 13, a covering member 60 that covers the side surface 40c of the cured adhesive resin 400 (i.e., the light guide member 40) and the side surface of the translucent member 50 is arranged. Specifically, first, as shown in FIG. 12, an uncured first covering member 61 that covers at least a part of the lower surface 20b of the light emitting element 20, at least a part of the side surface 40c of the light guide member 40, the lower surface of the protection element 30, and at least a part of the side surface of the protection element 30 is arranged on each region 10A. The first covering member 61 can be arranged on each region 10A by, for example, potting, spraying, printing, or the like. Then, the uncured first covering member 61 is cured.

[0076] Next, as shown in FIG. 13, an uncured second coating member 62 that covers the side surface of the light-transmissive member 50 is disposed on the cured first coating member 61. The second coating member 62 may cover the upper surface of the protection element 30, a part of the side surface of the protection element 30, and a part of the side surface of the light-transmissive member 50. The second coating member 62 can be disposed on the first coating member 61 by, for example, potting, spraying, printing, or the like. Thereafter, the uncured second coating member 62 is cured, and a coating member 60 composed of the cured first coating member 61 and second coating member 62 is formed. Thereafter, each region 10A is singulated by dicing or the like. Each wiring substrate 10 of the light-emitting device after the region 10A is singulated is obtained. Thereby, the light-emitting device 1 is obtained.

[0077] Note that instead of disposing the coating member 60 composed of the first coating member and the second coating member, a first coating member 61 that covers the side surface 40c of the adhesive resin 400 (that is, the light guide member 40) and the side surface of the light-transmissive member 50 may be disposed. That is, the coating member 60 may be composed of only the first coating member 61.

[0078] Further, the second coating member may be disposed while the first coating member is in an uncured state, and the first coating member and the second coating member may be cured simultaneously.

[0079] Although the preferred embodiments and the like have been described in detail above, the present invention is not limited to the above-described embodiments and the like, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope described in the claims.

[0080] In addition to the above embodiments, the following supplementary notes are further disclosed. (Supplementary Note 1) A step of preparing a light-emitting element having an upper surface and a plurality of side surfaces continuous with the upper surface; A step of disposing an adhesive resin on the upper surface and side surfaces of the light-emitting element, wherein the adhesive resin is disposed such that a lower end of the adhesive resin at a corner between the side surfaces of the light-emitting element is located below a lower end of the adhesive resin at a central portion of the side surface of the light-emitting element; A step of disposing a light-transmissive member on the upper surface of the light-emitting element and pressing the adhesive resin with the light-transmissive member; A method for manufacturing a light-emitting device, comprising: a step of curing the adhesive resin. (Appendix 2) In the step of disposing the adhesive resin, the adhesive resin is disposed such that a first portion located at the central portion of the upper surface of the light-emitting element has a higher height from the upper surface of the light-emitting element than a second portion located at a corner portion of the upper surface of the light-emitting element. The method for manufacturing a light-emitting device according to Appendix 1. (Appendix 3) In the step of disposing the adhesive resin, the adhesive resin is disposed to include the first portion, the second portion, and a third portion located between the first portion and the second portion. In the method for manufacturing a light-emitting device according to Appendix 2, the second portion has a higher height from the upper surface of the light-emitting element than the third portion. (Appendix 4) In the method for manufacturing a light-emitting device according to Appendix 3, the second portion is continuous with the adhesive resin disposed at a corner between side surfaces of the light-emitting element. (Appendix 5) The light-transmissive member includes a lower surface having an area larger than the upper surface of the light-emitting element and a plurality of side surfaces continuous with the lower surface. In the step of pressing the adhesive resin, the adhesive resin is pressed with the light-transmissive member such that the adhesive resin reaches an outer edge of the lower surface of the light-transmissive member. The method for manufacturing a light-emitting device according to any one of Appendices 1 to 4. (Appendix 6) In the step of pressing the adhesive resin, the adhesive resin is pressed with the light-transmissive member such that the adhesive resin reaches a lower end of a side surface of the light-emitting element. The method for manufacturing a light-emitting device according to any one of Appendices 1 to 5. (Appendix 7) Before the step of disposing the adhesive resin, the method includes a step of disposing the light-emitting element on a wiring board. In the step of pressing the adhesive resin, the pressed adhesive resin is disposed at a distance from the wiring board. The method for manufacturing a light-emitting device according to any one of Appendices 1 or 6. (Appendix 8) In the step of disposing the adhesive resin, before disposing the adhesive resin, a nozzle having a tip surface larger in size than the upper surface of the light-emitting element is prepared, and the nozzle is disposed above the light-emitting element such that the tip surface faces the upper surface of the light-emitting element and the outer edge of the tip surface is located outside the outer edge of the upper surface of the light-emitting element. A method for manufacturing a light-emitting device according to any one of Appendices 1 to 7. (Appendix 9) The nozzle has a discharge hole that opens at a central portion of the tip surface and a plurality of grooves that open at the tip surface, communicate with the discharge hole, and extend from the discharge hole toward the outer edge of the tip surface. The adhesive resin is discharged from the discharge hole and disposed on the upper surface of the light-emitting element, and also moves through the plurality of grooves from the discharge hole and is disposed at a corner between the side surfaces of the light-emitting element. A method for manufacturing a light-emitting device according to Appendix 8. (Appendix 10) A method for manufacturing a light-emitting device according to Appendix 9, wherein the width of the groove is constant and the depth of the groove is constant. (Appendix 11) After the step of curing the adhesive resin, the method includes a step of disposing a covering member that covers the side surface of the adhesive resin and the side surface of the light-transmissive member. A method for manufacturing a light-emitting device according to any one of Appendices 1 to 10.

Explanation of Reference Numerals

[0081] 1 Light-emitting device 10 Wiring board 10S Substrate 11 Base material 12 Upper surface wiring 13 Lower surface wiring 20 Light-emitting element 20a Upper surface 20b Lower surface 20c Side surface 25 Electrode 30 Protection element 40 Light guide member 40c Side surface 50 Light-transmissive member 50a Upper surface 50b Lower surface 60 Covering member 61 First covering member 62 Second covering member 100 Nozzle 101 Tip surface 101e Outer edge 102 Discharge hole 103, 104, 105, 106 Grooves 400 Adhesive resin 401 First part 402 Second part 403 Third part

Claims

1. preparing a light-emitting element having an upper surface and a plurality of side surfaces continuous with the upper surface; a step of disposing an adhesive resin on the upper surface and side surfaces of the light-emitting element, the step of disposing the adhesive resin such that a lower end of the adhesive resin at a corner between side surfaces of the light-emitting element is positioned below a lower end of the adhesive resin at a central portion of the side surface of the light-emitting element; disposing a light-transmissive member on the upper surface of the light-emitting element and pressing the adhesive resin with the light-transmissive member; curing the adhesive resin, and having, In the pressing step, the adhesive resin is pressed so as to cover an entire lower surface of the light-transmissive member, contact a lower end of each side surface of the light-emitting element, and have a shape having a curved surface convex outward, a method of manufacturing a light-emitting device.

2. In the step of disposing the adhesive resin, the adhesive resin is disposed such that a first portion located at a central portion of the upper surface of the light-emitting element has a higher height from the upper surface of the light-emitting element than a second portion located at a corner of the upper surface of the light-emitting element, the method of manufacturing a light-emitting device according to claim 1.

3. In the step of disposing the adhesive resin, the adhesive resin is disposed to include the first portion, the second portion, and a third portion located between the first portion and the second portion, The second portion has a higher height from the upper surface of the light-emitting element than the third portion, the method of manufacturing a light-emitting device according to claim 2.

4. The second portion is continuous with the adhesive resin disposed at a corner between side surfaces of the light-emitting element, the method of manufacturing a light-emitting device according to claim 3.

5. The light-transmissive member includes a lower surface having an area larger than an upper surface of the light-emitting element and a plurality of side surfaces continuous with the lower surface, In the step of pressing the adhesive resin, the adhesive resin is pressed with the light-transmissive member so that the adhesive resin reaches an outer edge of the lower surface of the light-transmissive member, the method of manufacturing a light-emitting device according to claim 1.

6. In the step of pressing the adhesive resin, the adhesive resin is pressed with the light-transmissive member so that the adhesive resin reaches a lower end of a side surface of the light-emitting element, the method of manufacturing a light-emitting device according to claim 1.

7. including a step of disposing the light-emitting element on a wiring board before the step of disposing the adhesive resin, In the step of pressing the adhesive resin, the adhesive resin after pressing is disposed spaced apart from the wiring board, the method of manufacturing a light-emitting device according to claim 1.

8. In the step of disposing the adhesive resin, before disposing the adhesive resin, a nozzle having a tip surface larger in size than the upper surface of the light-emitting element is prepared, and the nozzle is disposed above the light-emitting element such that the tip surface faces the upper surface of the light-emitting element and an outer edge of the tip surface is located outside an outer edge of the upper surface of the light-emitting element. A method of manufacturing a light-emitting device according to any one of claims 1 to 7.

9. The nozzle has a discharge hole that opens at a central portion of the tip surface, and a plurality of grooves that open at the tip surface and communicate with the discharge hole and extend from the discharge hole toward an outer edge of the tip surface. The adhesive resin is discharged from the discharge hole and disposed on the upper surface of the light-emitting element, and moves in the plurality of grooves from the discharge hole and is disposed at a corner portion between side surfaces of the light-emitting element. A method of manufacturing a light-emitting device according to claim 8.

10. A method of manufacturing a light-emitting device according to claim 9, wherein a width of the groove is constant and a depth of the groove is constant.

11. After the step of curing the adhesive resin, the method includes a step of disposing a covering member that covers side surfaces of the adhesive resin and side surfaces of the light-transmissive member. A method of manufacturing a light-emitting device according to any one of claims 1 to 7.

Images