Method and system for manufacturing a circuit board having a perforated forming component

Abstract

The invention relates to a method and a system for manufacturing a printed circuit board 1 with a perforated molded part 2. The object of the invention is to allow a high degree of positioning accuracy of the pressed elements of the printed circuit board 1 during the pressing process. This is achieved in that the perforated molded parts 2 are arranged and fixed relative to one another in a specific configuration to form a semi-finished product 9 with a perforated mask L, which is then positioned in a press 4 using the perforated mask L and pressed together with at least one other element 8, 10, 12 to form a printed circuit board substrate for manufacturing the printed circuit board 1. The invention also relates to a system for manufacturing the printed circuit board 1 to prepare the corresponding semi-finished product 9 and for processing it to form a printed circuit board substrate for manufacturing the printed circuit board 1.

Description

Technical Field

[0001] The present invention relates to a method and a system for manufacturing a circuit board having a perforated molded part.

Background Art

[0002] German Patent Application Publication No. 102018203715 discloses a method for manufacturing a circuit board having at least one conductor extending between connection points. The conductor is placed in a receptacle of a mold and connected to a metal foil at the positions of the intended connection points. The conductor is then embedded in an insulating material. Finally, a conductor structure interconnecting several conductors is processed from the metal foil, for example by etching.

[0003] In order to achieve a reliable interconnection by the conductor structure of the embedded conductor, the position of the conductor structure must precisely match the embedded conductor. For this purpose, so-called alignment holes for aligning the conductor structure are usually inserted into the metal foil. These alignment holes are used as receiving holes for the positioning pins of the press when pressing the elements to be pressed of the circuit board. Subsequently, these holes are inserted into the inner layer of the circuit board. In this way, all the connected layers of the circuit board can be aligned in a plane perpendicular to the pressing direction using the positioning pins of the press.

[0004] However, there are alignment holes of various shapes such as long holes and round holes, and the positioning accuracy can vary depending on the shape of the holes.

[0005] In addition, the receiving holes must always be handled carefully so that the edges of these receiving holes do not get damaged or spread. Otherwise, it will affect the positioning accuracy when applying the metal foil to the pins. In addition, the receiving holes are a cost factor (even if they are small) and become significant in large quantities. Furthermore, the receiving holes are almost always arranged at different positions according to the shape and size of the metal foil. Different press tools and positioning pins need to be available to process films of different shapes and sizes.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The present invention is based on the object of providing an improved method and system for manufacturing a circuit board that enables higher positioning accuracy of the elements to be pressed of the circuit board during the pressing process.

Means for Solving the Problems

[0007] To meet this object, the present invention provides the method according to claim 1 and the system according to claim 12.

[0008] A method for manufacturing a circuit board having a perforated formed part according to the present invention is to form a semi-finished product having a perforated mask, in which the perforated formed parts are arranged and fixed relative to each other in a predetermined configuration, and then the semi-finished product is positioned or aligned in a press by the perforated mask and pressed together with at least one further element to form a circuit board substrate for manufacturing a circuit board.

[0009] The perforated mask is formed by the perforated formed part or its receiving holes. In the context of the present invention, a two-dimensional or in some cases three-dimensional arrangement of at least two openings spaced apart from each other is referred to as a perforated mask. This perforated mask essentially forms a "key", i.e., a "lock" into which the arrangement formed by the positioning pins of the press fits.

[0010] Compared with the conventional methods, the main advantage of the claimed invention is that the perforated shaped parts are not only aligned and fixed relative to each other in a predetermined configuration (as in the prior art), but here they also serve as reference elements for positioning the semi-finished products that are formed together within the press. Different from the conventional process, there is no need to align the shaped parts with the holes in the metal foil (the conductive elements on the surface). On the contrary, the holes in the metal foil (the conductive elements on the surface) can be aligned with the shaped parts. As a result, the step of aligning the shaped parts with the alignment holes in the metal foil is eliminated, and thus the positioning accuracy can be significantly improved by the method according to the invention.

[0011] Advantageous developments of the invention are the subject of the dependent claims.

[0012] In a further advantageous development, the method comprises Step A: preparing a press for pressing the elements of the circuit board, the press comprising positioning pins for positioning the perforated shaped parts during the pressing process; Step B: preparing perforated shaped parts having receiving holes that match the outer contour of the positioning pins; Step C: preparing a mold in which the perforated shaped parts can be arranged so as to form together a perforated mask into which the positioning pins for positioning the perforated shaped parts can be inserted, preferably with a precise fit; Step D: arranging the shaped parts using the mold to form the perforated mask; Step E: connecting the perforated shaped parts to the conductive elements on the surface and optionally the electrical insulating elements on the surface to form a semi-finished product while fixing the perforated mask; Step F: positioning the semi-finished product and at least one electrical insulating element on the surface within the press while introducing the positioning pins into the perforated mask; Step G: pressing the semi-finished product together with the electrical insulating elements on the surface in the press in order to embed the perforated shaped parts into the electrical insulating elements on the surface. Step H: A step of manufacturing a circuit board by processing a conductor structure part from a conductive element on the surface, including.

[0013] By using a mold adapted to a press, a semi-finished product can be manufactured with high positioning accuracy and then processed in the press to form a circuit board substrate for manufacturing a circuit board.

[0014] It may be advantageous to have a press with at least two parts that are movable relative to each other, pulled together in the press direction (e.g., in step G), and pressed against each other with a circuit board element to be pressed interposed therebetween. By controlling the direction of movement of the press parts, since only a small transverse force perpendicular to the press direction is generated, the positioning accuracy when pressing the circuit board element can be further improved.

[0015] It may be useful to arrange the semi-finished product in a plane aligned perpendicular to the press direction (e.g., in step F) and / or fix it in a plane aligned perpendicular to the press direction (e.g., in step G). In a plane aligned perpendicular to the press direction, the semi-finished product can be ideally aligned by a perforated mask formed by a molded part and fixed by a conductive element on the surface, since the transverse force acting when the circuit board element is pressed is minimized.

[0016] In step F, it can be proven useful to insert a positioning pin into the perforated mask in the press direction or the opposite direction. This simplifies the positioning of the semi-finished product with the perforated mask in the press.

[0017] The shaped part is connected to the conductive element on the surface in step E, preferably with an intervening (conductive) connection section, by adhesion or welding, preferably through an electrically insulating element on the surface that is arranged as a spacer element between the shaped part and the conductive element on the surface, and it may be practical to bridge mechanically and possibly also conductively. In the simplest variant of the method, the shaped part is connected directly to the conductive element on the surface. A reliable material bond or welded connection between the shaped part and the conductive element on the surface is easily achieved and can be configured to be conductive, for example, when using a conductive adhesive, while forming a large contact or transfer surface if necessary. To embed the shaped part as completely as possible in the insulating material, an electrically insulating element on the surface can be interposed between the shaped part and the conductive element on the surface. For example, a resin-impregnated fiber mat (prepreg) can be used as the electrically insulating element on the surface. Also, to obtain a mechanical (and possibly also conductive) connection between the shaped part and the conductive element on the surface, the electrically insulating element on the surface must be bridged, for example, by a plate-shaped connection section received in a corresponding opening in the electrically insulating element on the surface. These connection sections, when attached to the shaped part, can fill each opening in the electrically insulating element on the surface and terminate flush with the surface of the electrically insulating element on the surface. Subsequently, the conductive element on the surface is positioned on the side of the electrically insulating element on the surface that does not face the shaped part and is connected, for example, adhesively or welded, to the connection section. The shaped part is almost completely embedded in the insulating material and is connected only indirectly to the conductive element on the surface via the connection section. The contact or transfer surface between the shaped part and the conductive element on the surface can be precisely dimensioned by these connection sections. This somewhat more complex design offers significant advantages, especially for high-precision applications.

[0018] It can be proven useful to perforate the conductive element on the surface, preferably after step E and / or before step F, in order to transfer (or extend) the perforated mask onto the conductive element on the surface. For this purpose, the conductive element on the surface is perforated, for example cut, at a location corresponding to the receiving hole of the molded part in order to expose the receiving hole under the molded part. The edge of the receiving hole can serve as a guide for the cutting tool (for example, a cutter). The material of the cut-out conductive element on the surface is preferably removed or separated from the remaining part of the conductive element on the surface and, in some cases, is further recycled, especially for manufacturing new conductive elements on the surface.

[0019] It may be useful to remove the semi-finished product from the mold and / or turn it over after step E and / or before step F so that the conductive element on the surface faces down and the perforated molded part faces up. To connect the conductive element on the surface to the molded part, it may be useful to place the conductive element on the surface of the mold so as to cover the molded part disposed within the receptacle of the mold. For subsequent processing of the semi-finished product formed from the molded part and the conductive element on the surface in a press, it may be useful to turn it over before positioning the semi-finished product within the press. Alternatively, it is also possible to use a special mold whose receptacle has the same contour as the molded part and is open from top to bottom in order to arrange the molded part in a predetermined configuration. Using such a mold, the molded part can simply be placed later in a predetermined configuration on the conductive element on the surface and finally connected from above to the conductive element disposed below. Also in this embodiment, the connection section and the electrically insulating element on the surface can be interposed between the molded part and the conductive element on the surface. After connecting the molded part to the conductive element on the surface, the mold with open sides can be easily removed or lifted upwards.

[0020] In step F, it may be useful to position the semi-finished product in the press with the conductive element on the surface facing forward, preferably such that the conductive element on the surface is horizontally in contact with and positioned against the lower die of the press. The electrical insulating element on the surface can be placed on the upward-facing molded part and then pressed against the molded part by the upper die of the press for embedding in the insulating material. For example, a resin-impregnated fiber mat (prepreg) can be used as the electrical insulating element on the surface.

[0021] In step D, a mold is used to place the conductor element, and in step E, it is connected to the conductive element on the surface and optionally the electrical insulating element on the surface to form a semi-finished product, and it can be proven useful that these conductor elements are electrically connected by the conductor structure to be processed in step H. Thereby, it is possible to functionally separate the elements of the circuit board. In the context of the present invention, the molded part mainly serves as a reference element for positioning the semi-finished product in the press (by means of the perforated mask formed by the receiving holes of the molded part). In principle, the molded part not only serves as a reference element but can also be used as a conductor element and can be formed from a conductive material. However, if the molded part only serves as a reference element, there is no need to manufacture the molded part from a conductive material. In this case, the mechanical strength of the molded part is important to prevent the receiving holes in the positioning pins from being torn. For this purpose, the molded part can be made from a plastic material, particularly a fiber-reinforced plastic. Separate from the molded part, additional conductor elements can be embedded in the insulating material and integrated into the circuit board. Different from the molded part, these conductor elements do not serve as a reference element for positioning in the press and thus are not perforated. Even when separate conductor elements are used in addition to the molded part, the advantages of the present invention can be equally achieved because by using the method according to the present invention, a high level of positioning accuracy of all elements of the circuit board relative to each other can always be achieved.

[0022] It may be useful to produce the perforated shaped part partially or entirely from a conductive material and electrically interconnect it by means of the conductor structure parts processed in step H. As a result, the shaped part can not only be replaceable as a reference element or positioning element, but can in particular also be used as a conductor element for heat dissipation or connection of electrical components mounted on a circuit board.

[0023] The object of the invention first mentioned is also satisfied by a system for manufacturing a circuit board, in particular used in a method according to one of the said embodiments. The system comprises - a press for pressing elements of the circuit board, the press comprising positioning pins for positioning the perforated shaped part during the pressing process, - a perforated shaped part having receiving holes that match the outer contour of the positioning pins, - a mold in which the perforated shaped part can be arranged so as to together form a perforated mask into which the positioning pins for positioning the perforated shaped part can preferably be inserted with a precise fit, and is provided with.

[0024] It may be useful for the mold to comprise at least one dedicated receptacle for each shaped part, the inner contour of which matches the outer contour of the shaped part, and the shaped part arranged in the receptacle preferably fills the receptacle entirely and / or the surface of the shaped part extends flush with the surface of the mold. Thereby, for example, the fixing of the perforated mask is significantly simplified by subsequently connecting the shaped part to the conductive elements on the surface.

[0025] At least one of the shaped parts can be arranged in different rotational positions within the same receptacle of the mold, and preferably, it can be proven useful that the receiving holes of the shaped parts have the same shape and alignment (or different shapes and alignments) with respect to the contour of the mold at these different rotational positions of the shaped parts. Thereby, the user's effort in positioning the shaped parts within the receptacle of the mold in their respective arrangements and alignments is reduced so that the intended result is achieved. In the simplest example, the shaped part is formed in a ring shape and has a circular outer circumference and a central receiving hole with a circular inner circumference. Such a shaped part can be inserted into the corresponding receptacle of the mold at any rotational position, whether the lower side is facing forward or the upper side is facing forward, and the receiving hole always has the same correct alignment with respect to the contour of the mold. However, it is also possible to form different perforated masks with shaped parts that generate receiving holes that are aligned differently at different rotational positions with respect to the contour of the mold. For example, the positioning tolerances in different directions can be selectively brought about by using elongated receiving holes, where the receiving holes of different shaped parts extend in different directions, particularly perpendicular to each other. Depending on the alignment of the elongated holes with respect to the contour of the mold, the direction of the positioning tolerance can be changed. When using two shaped parts with elongated receiving holes, the elongated holes can be aligned in two mutually perpendicular directions. Thus, one shaped part with a receiving hole provides a certain positioning tolerance in a first direction, and another shaped part with a receiving hole provides a certain positioning tolerance in a different direction perpendicular to the first direction. This facilitates aligning the semi-finished product with the perforated mask in the positioning plane. As a result, the positioning tolerance becomes ineffective because only at one position does the distance between the two elongated holes correspond to the distance between the positioning pins. Also, since the semi-finished product has a certain mobility when aligned with the positioning pins, it is easier to attach the semi-finished product to the positioning pins, and moreover, the semi-finished product can be precisely aligned with the positioning pins.

[0026] It may be useful for each positioning pin to have an insertion bevel that is preferably located at the foot of the positioning pin and is tapered from the maximum cross-section of the positioning pin that preferably fits precisely into the receiving hole of the perforated molded part to the tip of the positioning pin. This facilitates the insertion of the positioning pin into the perforated mask.

[0027] It may be useful for the molded part to exhibit at least one of the following characteristics. - The molded part is formed partially or entirely from a conductive material. - The molded part is manufactured partially or entirely from a metal, preferably copper, or preferably a fiber-reinforced plastic material, preferably a glass fiber-reinforced plastic material. - The molded part is formed in a plate shape. - The molded part has a thickness in the range of 100 μm to 300 μm, preferably in the range of 150 μm to 250 μm. - The molded part is formed from a blank by etching, punching, milling, or otherwise. - The molded part has a symmetric, preferably mirror-symmetric and / or point-symmetric contour (= the outer contour of the molded part). - The molded part has a circular or oval contour. - The molded part has a polygonal, particularly rectangular or square contour.

[0028] On the other hand, it may be useful for the receiving hole of the molded part to exhibit at least one of the following characteristics. - The receiving hole is centered with respect to the contour of the molded part. - The receiving hole has a symmetric, preferably mirror-symmetric and / or point-symmetric contour (= the outer contour of the molded part). - The receiving hole has a circular or oval contour. - The receiving hole is formed as an elongated hole, preferably connected by a semi-circular arc, preferably having two parallel edges, and the elongated hole extends, in particular preferably, in a transverse direction, in particular a perpendicular direction, with respect to another receiving hole formed as an elongated hole in a state where the perforated mask is fixed to the mold. Therefore, for example, with respect to a positioning pin having a circular cross-section whose diameter corresponds to the distance between the edges of the elongated hole, the positioning tolerance occurs in two different directions and is equal to each other. - The receiving hole has a polygonal, in particular rectangular or square, contour. - The receiving hole is etched, punched, or milled from the molded part.

[0029] Further advantageous developments of the invention will become apparent from the combinations of features disclosed in this specification, the claims, and the drawings.

Brief Description of the Drawings

[0030]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0031] The present invention will be described in more detail below with reference to the accompanying drawings.

[0032] Briefly summarized, the present embodiment relates to a method of manufacturing a circuit board 1 using a mold 6. Here, elements to be embedded in the circuit board 1, such as the molded parts 2 and, in some cases, the conductor elements 12, are positioned relative to each other in a predetermined configuration, connected to the conductive elements 8 on the surface, such as copper foil, to form a semi-finished product 9. Then, this semi-finished product 9 thus manufactured is press-worked in a press 4 having positioning pins 5 together with the surface electrical insulating elements or insulating material mats 10. Thereafter, the conductor structure 11 for interconnecting the embedded elements is processed from the conductive elements 8 on the surface, for example, by etching.

[0033] Since the elements 2, 12 embedded in the circuit board 1 are positioned in the mold 6 while being connected to the conductive elements 8 on the surface, they have the intended configuration or alignment relative to each other defined by the mold 6. In the state where the connected elements form the semi-finished product 9 and are connected to the conductive elements 8 on the surface, the configuration or alignment of the embedded elements 2, 12 predetermined by the mold 6 is fixed relative to each other. Thereafter, even when the semi-finished product 9 is removed from the mold 6, its configuration or alignment cannot change.

[0034] A similar method is known from German Patent Application Publication No. 102018203715, the content of which is incorporated herein by reference.

[0035] As a deviation from German Patent Application Publication No. 102018203715, during the pressing process in the press 4, in the present invention, it is not the conductive element 8 on the surface that serves as a reference for positioning the embedded elements 2, 12, but the perforated molded part 2. However, the conductive element 8 on the surface used in the context of the present invention does not initially have an opening.

[0036] The mold 6 is useful for achieving a predetermined configuration of the molded part 2, but is not absolutely necessary. For example, the molded part 2 can also be arranged in a predetermined configuration by, for example, a mask in the form of a mark or protrusion on the conductive element 8 on the surface, or by computer-aided positioning.

[0037] However, this embodiment of the method for manufacturing the circuit board 1 having the perforated molded part 2 uses such a mold 6 and particularly includes the following steps.

[0038] Step A: Prepare a press 4 having a positioning pin 5 for positioning the perforated molded part 2 during the pressing process.

[0039] In this embodiment, the press 4 consists of two parts 4a, 4b, namely, an upper die 4a and a lower die 4b, and the upper die 4a and the lower die 4b can move relative to each other, for example, in the vertical pressing direction P. The lower die 4b is provided with a horizontally aligned support surface extending in a horizontal plane E perpendicular to the pressing direction P.

[0040] The positioning pin 5 projects from this plane E in a direction opposite to the pressing direction P (for example, vertical). At the upper end facing the upper die 4a, the positioning pin 5 has an insertion chamfer. Each insertion chamfer is tapered from the maximum cross-section of the positioning pin 5, which has an outer contour that matches the receiving hole 3 of the perforated molded part 2 (see FIG. 2), to its tip. The upper die 4a has an opening corresponding to the perforated mask L. When the upper die 4a and the lower die 4b are pressed together, the positioning pin 5 can penetrate this opening and, at the same time, penetrate the elements of the circuit board 1 to be pressed. The number of positioning pins 5 can be freely selected. For example, the press 4 has a total of two positioning pins 5, which are arranged, for example, at the opposite corners on the diagonal of the rectangular support surface of the lower die 4b. The positioning pins 5 may have the same configuration or different configurations. Alternatively, in principle, it is also possible for the positioning pins 5 to be located in the upper die 4a and the lower die 4b to have corresponding openings for receiving the positioning pins 5. In this example, the positioning pin 5 has, for example, a circular cross-sectional shape over its entire length, and the diameter in the region of the insertion chamfer decreases towards the tip.

[0041] Step B: Prepare the perforated molded part 2 having the receiving hole 3 that matches the outer contour of the positioning pin 5.

[0042] The perforated forming part 2 preferably has a rectangular, particularly square, oval, or circular contour. As a result, the forming part 2 can optionally be arranged in several different rotational positions within the same receptacle 7 of the mold 6, while the receiving holes 3 each have the same shape and alignment with respect to the contour of the mold 6. For example, in the case of a circular forming part 2 with a central round hole, the position and alignment of the round hole 3 with respect to the contour of the mold 6 are always the same regardless of which side of this forming part 2 is facing up or down. What is important is that the receiving holes 3 of the forming part 2 arranged within the mold 6 coincide with the positioning pins 5 of the press 4 with respect to position and alignment. Preferably, the number of forming parts 2 corresponds to the number of positioning pins 5 of the press 4. However, it is also possible to use a forming part 2 having a plurality of receiving holes 3 through which a plurality of positioning pins 5 pass, so that the number of forming parts 2 may be less than the number of positioning pins 5. In this example, the forming part 2 is in the shape of a metal, for example copper, plate and has a thickness in the range of 100 μm to 500 μm, preferably in the range of 200 μm to 300 μm. The receiving holes 3 are each configured as elongated holes. The distance between the two parallel edges of the elongated hole preferably corresponds to the maximum diameter of the positioning pin 5. Thus, each positioning pin 5 (see FIG. 2) in its extending direction within the corresponding elongated hole has a certain positioning tolerance that can be determined by the length of the elongated hole. In one of the forming parts 2, the elongated hole extends parallel to the longer side of the contour of the mold 6, and in the other forming part 2, it extends parallel to the shorter side of the contour of the mold 6. Thereby, the positioning tolerance is brought about in two mutually perpendicular directions and as a result, they become equal to each other.

[0043] Step C: Prepare a mold 6 in which the perforated forming part 2 can be arranged so as to form together with a perforated mask L into which the positioning pins 5 for positioning the perforated forming part 2 can be inserted, preferably with a precise fit.

[0044] In this embodiment, the mold 6 has a rectangular outline and has two respective rectangular receptacles 7 for the rectangular perforated molded parts 2 and two L-shaped receptacles 13 for the L-shaped conductor elements 12. The receptacles 7 for the perforated molded parts 2 are open on one side (for example, the upper side is open and the lower side is closed) and are arranged at the corner portions facing each other on the diagonal of the mold 6. However, it is also possible to use a mold 6 that is open on both sides and into which the molded part can be inserted into the receptacle 7 with the mold 6 already in contact with the conductive element 8 on the surface. The receptacles 13 for the conductor elements 12 are arranged at the center between the receptacles 7 for the perforated molded parts 2. By increasing the spacing between the perforated molded parts 2 relative to each other, the positioning accuracy of the elements embedded in the circuit board 1 can be improved. Therefore, the spacing between the corresponding receptacles 7 should be selected to be as large as possible. For example, the most distant receptacles 7 of the mold 6 have a spacing of at least 50%, preferably at least 60%, 70%, or 80% of the maximum dimension of the mold 6 corresponding to the diagonal across the rectangular surface of the mold 6.

[0045] Step D: To form the perforated mask L, the molded part 2 is arranged in a predetermined configuration using the mold 6.

[0046] The perforated molded parts are preferably arranged in the corresponding receptacles 7 of the mold 6 such that each molded part 2 completely fills the corresponding receptacle 7 and the surface of the molded part 2 terminates flush with the surface of the mold 6 and, optionally, also its lower surface. In addition to the molded parts 2, the conductor elements 12 can optionally also be arranged using the mold 6 and precisely aligned with the molded parts 2 in the corresponding receptacles 13 for later connection to the conductive element 8 on the surface. These conductor elements 12 are particularly advantageous when the perforated molded parts 2 serve only as reference elements for positioning the semi-finished product 9 in the press 4 and do not themselves have a conductive function. These conductor elements 12 can be electrically connected later by the conductor structure 11 processed in step H.

[0047] Step E: Connect the perforated forming part 2 to the conductive element 8 on the surface and, optionally, to the electrically insulating element on the surface, and form the semi-finished product 9 while fixing the perforated mask L.

[0048] In a simple deformation form, the surface conductive element 8 is positioned on the upper surface of the mold 6, which upper surface is flush with the molded part 2 arranged and directly connected in the receptacle 7. For example, an unperforated copper foil is used as the surface conductive element 8. The thickness of this copper foil is preferably in the range of 10 μm to 200 μm, more preferably in the range of 50 μm to 100 μm. The molded part 2 is, for example, adhered or welded to the surface conductive element 8. For this purpose, the mold 6 can have corresponding die openings, as disclosed in German Patent Application Publication No. 102018203715. The presence of the conductive connection section V can be useful for completely embedding the molded part 2 in an insulating material. Such a connection section V is configured, for example, as a metal plate, for example a metal plate made of silver or copper, and is adhered or welded to the upward-facing surface, for example, at the corners of the molded part 2 or the conductor element 12 (see FIG. 1). By means of these connection sections V, a surface electrical insulating element (not shown), which is arranged as a spacer element between the molded part 2 and the surface conductive element 8 in step E and ideally has exactly the same thickness as the connection section V, can be mechanically and possibly conductively bridged. An opening having a corresponding contour is inserted into this surface electrical insulating element at a position that coincides with the connection section V. When the surface electrical insulating element is arranged on the surface of the mold 6, the connection section V fills these openings. The upper surface of the molded part 2 and the upper surface of the mold 6 abut against the lower surface of the surface electrical insulating element. The upper surface of the connection section V terminates flush with the upper surface of the surface electrical insulating element. Then, in this state, the surface conductive element 8 is adhered or welded to the connection section V. The use of the connection section V has the particular advantage that the molded part 2 and possibly the conductor element 12 can be completely embedded in an insulating material and are mechanically and optionally conductively connected to the surface conductive element 8 only by means of the connection section V. Since the number, shape, and size of the connection section V, as well as the contact surfaces on the one hand to the molded part 2 or the conductor element 12 and on the other hand to the surface conductive element 8, can be precisely dimensioned by the connection section V, the electrical resistance and thermal resistance between them, which are generally determined by the connection section V, can be precisely calculated.However, since the connection section V is not absolutely necessary, it is only schematically shown by a dotted line in FIG. 1. For simplicity, the connection section V is omitted in the subsequent figures, and the insulating material mat (surface electrical insulating element) bridged by the connection section V is also omitted.

[0049] Step F: While introducing the positioning pin 5 into the perforated mask L, position the semi-finished product 9 and at least one surface electrical insulating element 10 within the press 4.

[0050] For this purpose, take out the semi-finished product 9 pre-formed in step E from the mold 6 and turn it over so that the surface conductive element 8 faces downward and the perforated molded part 2 faces upward. Then, the semi-finished product 9 is placed within the press 4 with the surface conductive element 8 in front until the surface conductive element 8 is horizontally abutted and positioned against the lower die 4b of the press 4. For this purpose, the semi-finished product 9 is "inserted" into the positioning pin 5 from above in the press direction P, whereby the positioning pin 5 penetrates the perforated mask L and penetrates the semi-finished product 9 in the direction opposite to the press direction P. The semi-finished product 9 abuts against the lower die 4b in a plane E aligned perpendicular to the press direction P. By the perforated mask L, the semi-finished product 9 is fixed and aligned by the positioning pin 5 in a plane E aligned perpendicular to the press direction P. Ideally, the surface conductive element 8 is perforated to transfer the perforated mask L to the surface conductive element 8 after step E and before step F. For this purpose, a part of the surface conductive element 8 is perforated inside the edge of the receiving hole 3 of the molded part 2, for example, cut out, so that the semi-finished product 9 fits exactly onto the positioning pin 5 of the press 4. Alternatively, it is also possible to perforate the surface conductive element 8 only when the semi-finished product 9 is inserted into the positioning pin 5 of the press 4 and the positioning pin 5 penetrates the semi-finished product 9. However, in that case, there is a risk that a part of the surface conductive element 8 remains connected to the remaining part of the surface conductive element 8 inside the edge of the receiving hole 3 of the molded part 2, forming an unwanted electrical connection.

[0051] Step G: In order to embed the perforated molded part 2 into the surface electrical insulation element 10, in a press 4, the semi-finished product 9 is pressed together with the surface electrical insulation element 10.

[0052] For this purpose, the upper die 4a and the lower die 4b are drawn together in the pressing direction P and are pressed against each other by the interconnection of the elements of the circuit board 1 to be pressed. The surface electrical insulation element 10 is deformed there and adheres closely to the contour of the molded part 2 and possibly the conductor element 12. The upper surface of the surface electrical insulation element 10 facing away from the lower die 4b is flattened there by the upper die 4a and aligned parallel to the downward-facing surface of the surface conductive element 8. When a resin-impregnated fiber mat (prepreg) is used as the surface electrical insulation element 10, the surface electrical insulation element 10 is pressed while the resin is still in a flowable state and ideally conforms to the contour formed by the molded part 2 and possibly the conductor element 12 on the upward-facing surface of the semi-finished product 9. After the semi-finished product 9 is pressed together with the surface electrical insulation element 10, the resin is cured and the shape of the circuit board substrate is fixed.

[0053] Step H: Process the conductor structure 11 from the surface conductive element 8 to manufacture the circuit board 1.

[0054] This step is achieved, for example, by etching the conductive elements 8 on the surface according to a predetermined mask. For this purpose, the circuit board substrate manufactured by pressing the semi-finished product 9 together with the electrically insulating elements 10 on the surface is first removed from the press and ideally turned over, whereby the conductive elements 8 on the surface face upwards again. Next, a mask corresponding to the conductor structure 11 is applied to the conductive elements 8 on the surface to cover the area of the conductive elements 8 on the surface corresponding to the conductor structure 11. Thereafter, the remaining areas of the conductive elements 8 on the surface are removed, for example, by etching. In this example, the conductor structure 11 includes connection points 11a and conductor traces 11b. The connection points 11a are used for the electrical connection of electronic elements to the embedded molded parts 2 or conductor elements 12. The conductive connection between the connection points 11a can be established by the conductor traces 11b, but can also be established by the molded parts 2 or conductor elements 12. The molded parts 2 or conductor elements 12 are preferably electrically connected by the conductor structure 11 processed in step H.

[0055] A system according to the present invention for manufacturing the circuit board 1 using the method described above in particular includes the following elements. - A press 4 for pressing the elements of the circuit board 1. The press 4 includes positioning pins 5 for positioning the perforated molded parts 2 during the pressing process. - A perforated molded part 2 having receiving holes 3 that match the outer contour of the positioning pins 5. - A mold 6 in which the perforated molded part 2 can be arranged so as to form together with a perforated mask L into which the positioning pins 5 for positioning the perforated molded part 2 can be inserted preferably with a precise fit.

[0056] These three compatible elements can improve the alignment of the embedded elements 2, 12 with respect to the conductor structure 11 of the circuit board 1.

[0057] The mold 6 is provided with a dedicated receptacle 7 for each formed part 2. The inner contour of the receptacle 7 coincides with the outer contour of the formed part 2, so that the formed part 2 arranged in the receptacle 7 preferably completely fills the receptacle 7, and the surface of the formed part 2 preferably extends flush with the surface of the mold 6 or, in some cases, the lower surface. These deformation forms facilitate connecting the perforated formed part 2 to the conductive element 8 on the surface to form the semi-finished product 9.

[0058] The formed part 2 can be arranged at different rotational positions within the same receptacle 7 of the mold 6. On the other hand, the receiving holes 3 of the formed part 2 preferably have the same shape and alignment (or different shapes and alignments) with respect to the contour of the mold 6 at these different rotational positions of the formed part 2. This reduces the effort for the user of this system to position the formed part 2 correctly and in alignment within the mold 6.

[0059] Each positioning pin 5 preferably has an insertion taper that is tapered from the maximum cross-section of the positioning pin 5, which is preferably located at the foot of the positioning pin 5 and preferably fits precisely into the receiving hole 3 of the perforated formed part 2, to the tip of the positioning pin 5. This facilitates positioning the formed part 2 and the semi-finished product 9 formed with the conductive element 8 on the surface within the press 4.

[0060] This embodiment is selected only for illustrative purposes and is not based on actual situations, especially actual dimensions. The shape and size of the mold 6, as well as the shape, size, and position and alignment of the receptacle 7, can be freely selected within the scope of the teachings according to the present invention and are not limited to this embodiment.

[0061] As a result, the method according to the present invention enables precise positioning of the elements to be pressed of the circuit board 1 without labor and without being restricted with respect to the size, shape, and position of the receiving holes 3.

Explanation of Reference Numerals

[0062] 1 Circuit board 2 Formed part 3 Receiving hole 4 Press machine 5 Positioning pin 6 Mold (negative-side mold) 7 Receptacle 8 Conductive element on the surface (copper foil) 9 Semi-finished product 10 Electrical insulating element on the surface (prepreg) 11 Conductor structure part 11a Connection point 11b Conductor trace 12 Conductor element 13 Receptacle for the conductor element E Plane perpendicular to the press direction L Perforated mask P Press direction V Connection section

Claims

1. A method for manufacturing a circuit board (1) having a perforated forming part (2), wherein the perforated forming parts (2) are arranged and fixed relative to each other in a predetermined configuration, whereby a semi-finished product (9) having a perforated mask (L) is formed, and then the semi-finished product (9) is positioned and aligned in a press (4) by means of the perforated mask (L) and pressed together with at least one further element (8, 10, 12) to form a circuit board substrate for manufacturing the circuit board (1).

2. a. Step A: Preparing a press (4) for pressing elements of the circuit board (1), the press (4) comprising positioning pins (5) for positioning the perforated forming part (2) during the pressing process; b. Step B: Preparing a perforated forming part (2) having receiving holes (3) that match the outer contour of the positioning pins (5); c. Step C: Preparing a mold (6) in which the perforated forming part (2) can be arranged so as to form, together with the perforated forming part (2), a perforated mask (L) into which the positioning pins (5) for positioning the perforated forming part (2) can be inserted; d. Step D: Arranging the forming part (2) using the mold (6) to form the perforated mask (L); e. Step E: Connecting the perforated forming part (2) to conductive elements (8) on the surface and optionally to electrically insulating elements on the surface to form a semi-finished product (9) while fixing the perforated mask (L); f. Step F: Positioning the semi-finished product (9) and at least one electrically insulating element (10) on the surface in the press (4) while introducing the positioning pins (5) into the perforated mask (L); g. Step G: Pressing the semi-finished product (9) together with the electrically insulating element (10) on the surface in the press (4) to embed the perforated forming part (2) into the electrically insulating element (10) on the surface; h. Step H: Manufacturing the circuit board (1) by processing a conductor structure part (11) from the conductive elements (8) on the surface; The method according to claim 1, comprising the above steps.

3. The press (4) comprises at least two parts (4a, 4b), the at least two parts (4a, 4b) being movable relative to one another and being drawn towards one another in the pressing direction (P), and being pressed against one another with the element to be pressed of the circuit board (1) interposed therebetween, the method according to claim 1, characterized in that.

4. The semi-finished product (9) is arranged in a plane (E) aligned perpendicular to the pressing direction (P) and / or fixed to a plane (E) aligned perpendicular to the pressing direction (P), the method according to claim 1, characterized in that.

5. The positioning pin (5) of the press (4) is inserted into the perforated mask (L) in the pressing direction (P) or the opposite direction, the method according to claim 2, characterized in that.

6. The shaped part (2) is connected to the conductive element (8) on the surface by adhesion or welding in step E, the method according to claim 2, characterized in that.

7. The conductive element (8) on the surface is perforated in order to transfer the perforated mask (L) to the conductive element (8) on the surface, the method according to claim 2, characterized in that.

8. The semi-finished product (9) is removed from the mold (6) and / or turned over after step E and / or before step F so that the conductive element (8) on the surface faces downwards and the perforated shaped part (2) faces upwards, the method according to claim 2, characterized in that.

9. In step F, the semi-finished product (9) is positioned in the press (4) with the conductive element (8) on the surface facing forward, the method according to claim 2, characterized in that.

10. In step D, a conductor element (12) is arranged using the mold (6), and in step E, it is connected to the conductive element (8) on the surface and optionally the electrically insulating element on the surface to form the semi-finished product (9), and these conductor elements (12) are electrically interconnected by the conductor structure part (11) to be processed in step H, the method according to claim 2, characterized in that.

11. The perforated shaped part (2) is partially or wholly formed from a conductive material and is electrically interconnected by the conductor structure part (11) to be processed in step H, the method according to claim 2, characterized in that.

12. A system for manufacturing a circuit board (1) used in the method according to any one of claims 1 to 11, a. A press (4) for pressing elements of the circuit board (1), the press (4) comprising positioning pins (5) for positioning the perforated formed part (2) during the pressing process, the press (4); b. A perforated formed part (2) having receiving holes (3) that match the outer contour of the positioning pins (5); c. A mold (6) in which the perforated formed part (2) can be arranged so as to together form a perforated mask (L) into which the positioning pins (5) for positioning the perforated formed part (2) can be inserted; A system comprising.

13. The system according to claim 12, wherein the mold (6) comprises at least one dedicated receptacle (7) for each formed part (2), and the inner contour of the receptacle (7) matches the outer contour of the formed part (2).

14. The system according to claim 13, wherein at least one of the formed parts (2) can be arranged in different rotational positions in the same receptacle (7) of the mold (6).

15. The system according to claim 12, wherein each positioning pin (5) has an insertion taper that is tapered from the maximum cross-section of the positioning pin (5) to the tip of the positioning pin (5).

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