Probe Card Monitoring System and Monitoring Method Thereof

Abstract

To provide a probe card monitoring system and a monitoring method thereof which are capable of improving measurement accuracy while reducing the risk of damaging a probe card and a wafer.SOLUTION: A probe card monitoring system 100 is applied to either a probe card 110 including a stiffener plate and a printed circuit board or a prober 120 including a head plate 121 and a clamping mechanism 122, and includes at least one sensor 130 and a control unit 150. The at least one sensor is disposed on one of the probe card and the prober to measure a distance between the probe card and the prober in at least one axial direction. The control unit is coupled to the at least one sensor and generates an alarm.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a probe card monitoring system and a monitoring method thereof.

Background Art

[0002] In the field of semiconductor testing, due to continuous technological innovation and development, as chips are miniaturized, the pitch between each pad has become narrower and narrower, so that the risk of probe card shift due to clamps or excessive downforce that are adversely affected during the wafer test process gradually increases. The positional deviation between the probe and the measurement point on the wafer may damage (e.g., pin burn) the probe card, the wafer, and the integrated circuit (IC).

[0003] However, currently, after the test, it is only possible to check for a shift (positional deviation) through a camera mounted on the probe, or to determine whether there is a shift (positional deviation) from the probe marks remaining on the test pads. These methods may increase the test time and cannot reflect the status of the probe card during the test process in real time.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The positional deviation between the probe and the wafer test point may damage (e.g., pin burn) the probe card, the wafer, and the integrated circuit (IC). The current methods may extend the test time and cannot reflect the status of the probe card during the test process in real time.

Means for Solving the Problems

[0005] The present invention provides a probe card monitoring system and a monitoring method thereof that can reflect the status of a probe card in real time during a test process, reduce the risk of damaging the probe card and the wafer, and improve the measurement accuracy.

[0006] In one embodiment of the present invention, the probe card monitoring system is applicable to either a probe card or a probe. The probe card includes a reinforcing plate and a printed circuit board. The probe includes a head plate and a clamping mechanism. The probe card monitoring system includes at least one sensor and a control unit. The at least one sensor is disposed on one of the probe card and the probe, and measures the distance between the probe card and the probe in at least one axial direction. The control unit is coupled to the at least one sensor and is configured to sound an alarm.

[0007] In one embodiment of the present invention, the probe card monitoring method is applicable to either a probe card or a probe. The probe card includes a reinforcing plate and a printed circuit board. The probe includes a head plate and a clamping mechanism. The probe card monitoring method includes at least the following. Dispose at least one sensor on one of the probe card and the probe. Determine whether the distance between the probe card and the probe in at least one axial direction obtained from the at least one sensor exceeds an abnormal condition. If it exceeds the abnormal condition, accordingly, an alarm is issued by the control unit.

Effects of the Invention

[0008] As described above, an embodiment of the present invention introduces a sensor and an alarm control unit configured to measure the relative distance between a probe card and a probe in at least one axial direction into a probe card monitoring system. In this way, by monitoring the numerical value of the distance, the status of the probe card during the test process can be reflected in real time, reducing the risk of damaging the probe card and the wafer, and improving the measurement accuracy.

[0009] To better understand the above, several embodiments will be described in detail below in conjunction with the drawings.

Brief Description of the Drawings

[0010] The accompanying drawings are included to further understand the principles of the present invention, incorporated herein, and constitute a part thereof. The drawings illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0011]

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Figure 11

Embodiments for Carrying Out the Invention

[0012] In the following detailed description, for purposes of explanation and not limitation, exemplary embodiments are set forth to provide a complete understanding of the various principles of the present invention. Specific details are disclosed. However, it will be apparent to those skilled in the art who enjoy the benefits of the present invention that the present invention can be practiced in other embodiments different from the specific details disclosed herein. Furthermore, descriptions of well-known devices, methods, and materials may be omitted so as not to obscure the description of the various principles of the present invention.

[0013] Hereinafter, exemplary embodiments of the present invention will be fully described with reference to the drawings. However, the present invention can be implemented in many different forms and should not be construed as being limited to the embodiments described herein. In the drawings, for clarity, the sizes and thicknesses of each region, component, and layer do not need to be created based on actual scale, and some components can also be omitted.

[0014] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present invention belongs.

[0015] Embodiments of the present invention introduce a sensor and an alarm control unit configured to measure the relative distance between a probe card and a prober in at least one axial direction into a probe card monitoring system. In this way, by monitoring the numerical value of the distance, the state of the probe card during the test process can be reflected in real time, reducing the risk of damaging the probe card and the wafer, and improving the measurement accuracy. The sensor can be disposed on one of the probe card and the prober, and at least one axial direction may be one, two, or three of the X-axis, Y-axis, and Z-axis. Hereinafter, embodiments of various probe card monitoring systems and probe card monitoring methods corresponding to the monitoring system will be described. Here, the probe card and the prober may be of any suitable type not limited by the present invention.

[0016] FIG. 1 is a schematic partial side view of a probe card monitoring system according to some embodiments of the present invention. FIG. 2 is a schematic partial enlarged view based on FIG. 1. FIG. 3 is a schematic partial side view of a probe card monitoring system according to some embodiments of the present invention. FIG. 4 is a schematic partial enlarged view based on FIG. 3. FIG. 5 is a schematic partial side view of a probe card monitoring system according to some embodiments of the present invention. FIGS. 6A and 6B are schematic partial enlarged views from different viewpoints based on FIG. 5. FIG. 7 is a schematic partial side view of a probe card monitoring system according to some embodiments of the present invention. FIGS. 8A and 8B are schematic partial enlarged views from different viewpoints based on FIG. 7. FIG. 9 is a schematic partial top view of a probe card monitoring system according to some embodiments of the present invention.

[0017] It should be emphasized that the following embodiments are illustrative and do not limit the present invention to these embodiments. FIGS. 1, 2, 3, and 4 can be used to explain embodiments for monitoring either the X-axis or the Y-axis, FIGS. 5, 6A, 6B, 7, 8A, and 8B can be used to explain embodiments for monitoring the Z-axis, FIG. 9 can be used to explain the design of monitoring measurement points corresponding to the X-axis, Y-axis, and Z-axis, and FIGS. 10A, 10B, and 11 can be used to explain the probe card monitoring method. Also, contact tabs (for example, contact tab 114 shown in FIGS. 6A, 6B, 8A, and 8B) that connect at least the probe card and the probe are omitted in FIGS. 1, 3, 5, and 7 for clarity of explanation.

[0018] Referring to FIG. 1, the probe card monitoring system 100 is applicable to either the probe card 110 or the probe 120 connected to the probe card 110. The probe 120 can include a head plate 121 configured to measure the distance between the probe card 110 and the probe 120 on the X-axis or Y-axis (first axis direction D1), and a clamp mechanism 122 configured to measure the distance between the probe card 110 and the probe 120 on the Z-axis (second axis direction D2). Here, the clamp mechanism 122 may be a bridge beam, but the present invention is not limited thereto, and other suitable clamping methods can also be used for the clamp mechanism 122.

[0019] Also, in the present embodiment, the probe card monitoring system 100 includes a sensor 130 and a control unit 150 disposed within the head plate 121 of the probe 120. The sensor 130 may be disposed on a side surface 121s of the head plate 121 close to the probe card 110. The control unit 150 is coupled to the sensor 130 and configured to give an alarm. As a result, the sensor 130 measures the linear distance between the probe card 110 and the probe 120 in the horizontal direction (X-axis or Y-axis). FIG. 1 may be a schematic side view shown in the X-axis direction or a schematic side view shown in the Y-axis direction. In other words, as shown in FIG. 1, the sensor 130 is disposed on the X-axis and / or Y-axis and can measure the linear distance between the probe card 110 and the probe 120 on the X-axis and / or Y-axis. Here, for example, the sensor 130 is separated from the end of the head plate 121 by a shortest distance 130d in the range of 0.1 millimeter (mm) to 3 mm (that is, the sensor 130 is not in contact with the measurement position). The sensor may be a current sensor, a capacitance sensor, or a laser sensor, but the present invention is not limited thereto. Also, specific examples of the control unit 150 will be described in the relevant paragraphs of FIG. 11.

[0020] Referring to FIGS. 1 and 2, the probe card 110 and the head plate 121 in FIG. 1 are enlarged in FIG. 2. In some embodiments, the probe card 110 includes a reinforcing plate 111 and a printed circuit board 112. Among them, the specific position of the sensor 130 on the head plate 121 of the probe 120 may be as indicated by the sensor 130a in FIG. 2. For example, the reinforcing plate 111 may be between the sensor 130a and the printed circuit board 112, but the present invention is not limited herein.

[0021] Referring to FIG. 3, the probe card monitoring system 200 in FIG. 3 is similar to the probe card monitoring system 100 in FIG. 1, except that the sensor 230 of the probe card monitoring system 200 is disposed within the probe card 110 and the sensor 230 is disposed on the side surface 110s close to the head plate 121 of the probe card 110. As a result, the sensor 230 can be configured to measure the linear distance between the probe card 110 and the probe 120 in the horizontal direction (X-axis or Y-axis). Here, the sensor 230 is, for example, separated from the end of the reinforcing plate 111 by a shortest distance 230d in the range of 0.1 mm to 3 mm (i.e., the sensor 230 is not in contact with the measurement position).

[0022] Referring to FIGS. 3 and 4, the probe card 110 and the head plate 121 in FIG. 3 are enlarged in FIG. 4. In some embodiments, the specific position of the sensor 230 in the probe card 110 may be as shown by the sensor 230a in FIG. 4. For example, the sensor 230a can be disposed within the reinforcing plate 111, but the present invention is not limited thereto.

[0023] Referring to FIGS. 1, 3, and 9, further, when viewing the structures of FIGS. 1 and 3 from above, the probe card monitoring system shown in FIG. 9 is obtained. In other words, on the X-axis, the measurement point T1 on the probe card monitoring system can be located in the peripheral region of the probe card 110 (e.g., the upper and lower sides in FIG. 9), and the sensor can be located at one of the two positions pointed by the measurement point T1 (either in the head plate 121 of the probe 120 or in the reinforcing plate 111 of the probe card 110). Similarly, on the Y-axis, the measurement point T2 on the probe card monitoring system can be located in the peripheral region of the probe card 110 (e.g., the left and right sides in FIG. 9), and the sensor can be located at one of the two positions pointed by the measurement point T2 (either in the head plate 121 of the probe 120 or in the reinforcing plate 111 of the probe card 110). However, the present invention is not limited thereto.

[0024] Referring to FIG. 5, the probe card monitoring system 300 of FIG. 5 is similar to the probe card monitoring system 100 of FIG. 1, except that the sensor 330 of the probe card monitoring system 300 is disposed within the clamping mechanism 122 of the probe 120, and the sensor 330 is disposed on the bottom surface 122s close to the probe card 110 of the clamping mechanism 122. As a result, the sensor 330 can be configured to measure the linear distance between the probe card 110 and the probe 120 in the vertical direction (Z-axis). Here, the sensor 330 is, for example, separated from the end of the clamping mechanism 122 by a shortest distance 330d in the range of 0.1 mm to 3 mm (i.e., the sensor 330 is not in contact with the measurement position).

[0025] Referring to FIGS. 5, 6A, 6B, and 9, the probe card 110 and the clamping mechanism 122 of FIG. 5 are enlarged. FIG. 6A is shown from a perspective view looking from left to right in FIG. 9, for example, and FIG. 6B is shown from a perspective view looking from bottom to top in FIG. 9, for example. In some embodiments, the specific position of the sensor 330 in the clamping mechanism 122 of the probe 120 is indicated by the sensor 330a in FIG. 6A or the sensor 330b in FIG. 6B. Since one of the sensor 330a and the sensor 330b is selectively disposed, it is shown by a dashed line.

[0026] Also referring to FIGS. 7, 8A, 8B, and 9, the probe card 110 and the clamping mechanism 122 of FIG. 7 are enlarged. FIG. 8A is shown from a perspective view looking from left to right in FIG. 9, for example, and FIG. 8B is shown from a perspective view looking from bottom to top in FIG. 9, for example. Further, FIGS. 7, 8A, and 8B are similar to FIGS. 5, 6A, and 6B, except that the sensor 430 of the probe card monitoring system in FIGS. 7, 8A, and 8B is disposed on the upper surface 110t close to the clamping mechanism 122 of the probe card 110. Here, the sensor 430 is, for example, separated from the end of the probe card 110 by a shortest distance 430d in the range of 0.1 mm to 3 mm (i.e., the sensor 430 is not in contact with the measurement position).

[0027] Furthermore, as shown in FIGS. 6A, 6B, 8A, and 8B, the probe card 110 further includes a probe head 113 and at least one contact tab 114 (which may be physically connected to the clamping mechanism 122 if necessary). The contact tab 114 is disposed on the reinforcing plate 111. The probe head 113 can include a base 113a and a probe 113b. The sensor may be disposed around the contact tab 114.

[0028] For example, as shown in FIGS. 6A, 8A, and 9, the probe card monitoring system may have four contact tabs 114, and the reinforcing plate 111 beside the contact tab 114 may have four measurement points T3. The sensor 330a can be located at four positions indicated by the measurement points T3 (i.e., within the clamping mechanism 122 of the probe 120 or the reinforcing plate 111 of the probe card 110, but only two positions can be shown from the perspective of FIG. 6A). Alternatively, the central region of the probe card monitoring system (where the probe head 113 of the probe card 110 is located) can also have the measurement point T3. The sensor 330b can be located at the position indicated by the measurement point T3 (i.e., within the clamping mechanism 122 of the probe 120 or the printed circuit board 112 of the probe card 110). However, the present invention is not limited thereto.

[0029] In some embodiments, the measurement points T3 on the probe card monitoring system are separated from the contact tab 114 by a pitch in the range of 0.1 mm to 3 mm (i.e., the sensor is not in contact with the measurement position). In the above pitch design, the contact tab 114 may be adjacent to the probe head 113. As a result, the influence of other factors (such as the vertical displacement caused by the external force at the end) can be removed, and the monitoring accuracy can be improved. However, the present invention is not limited thereto. Here, the measurement points T1, T2, and T3 on the probe card monitoring system may not be on the contact tab 114, but the present invention is not limited thereto.

[0030] FIG. 10A is a schematic side view when the probe card monitoring system of FIG. 1 generates a position deviation during monitoring. FIG. 10B is a schematic side view when the probe card monitoring system of FIG. 5 generates a position deviation during monitoring. FIG. 11 is a schematic flowchart of a probe card monitoring method according to some embodiments of the present invention.

[0031] Referring to FIGS. 1, 10A, and 11, an example of a position deviation in the first axis direction D1 and a corresponding monitoring method will be described. First, as shown in FIG. 1, when the probe 113b of the probe card 110 is in contact with the wafer 10 at the correct position L1, the linear distance between the side surface 121s of the head plate 121 and the probe card 110 is d1. In comparison, as shown in FIG. 10A, when the probe card 110 generates a position deviation in the direction away from the head plate 121 (for example, the right direction in FIGS. 1 and 10A), the probe 113b of the probe card 110 contacts the wafer 10 at the deviation position L2, and there is a linear distance d2 greater than d1 between the head plate 121 and the probe card 110. In this way, by monitoring the numerical value of the distance, the abnormality (for example, deformation or displacement) of the probe card 110 during the test process can be reflected in real time, the risk of damaging the probe card 110 and the wafer 10 can be reduced, and the measurement accuracy can be improved. Here, the wafer 10 may be disposed on a chuck 20, but the present invention is not limited thereto.

[0032] For example, the monitoring method applied to either a probe card or a prober is executed in the following steps, and the prober can clamp the probe card. First, at least one sensor is disposed on one of the probe card and the prober (step S200). Next, it is determined whether the distance between the probe card and the prober in at least one axial direction from at least one sensor exceeds an abnormal condition (step S300). Thereafter, if it exceeds the abnormal condition, in response thereto, an alarm is issued by the control unit (step S400).

[0033] In some embodiments, the monitoring method can include the following steps between step S200 and step S300. Provide a workstation with an abnormal condition set, and transmit the distance to the workstation to determine whether it exceeds the abnormal condition (step S250). In other words, the workstation can set a monitoring range standard, save the distance data measured by the sensor and feedback it to the workstation, and determine whether it exceeds the set standard, but the present invention is not limited thereto. Here, the standard setting can be determined according to actual design requirements and is not limited by the present invention.

[0034] In some embodiments, the monitoring method can include the following steps between step S300 and step S400. If it exceeds the abnormal condition, in response thereto, a command for issuing an alarm is transmitted to the prober, a tester electrically connected to the prober, or a controller (not shown) electrically connected to the workstation (step S350). The control unit can be the prober, the tester, or the controller, but the present invention is not limited thereto. Here, the controller can be, for example, a host, a computer, etc.

[0035] In some embodiments, when the control unit is a prober or a tester, the sensor is coupled to the prober or the tester via a network (communication protocols such as Ethernet, RS232, RS485, etc.). In contrast, when the control unit is a controller, the sensor and the controller are coupled via a cable. However, the present invention is not limited thereto.

[0036] In some embodiments, the monitoring method can be executed during any process such as wafer testing, probe cleaning, etc., and can be applied to a suitable interface, but the present invention is not limited thereto.

[0037] In some embodiments, the probe card monitoring system and its monitoring method are further useful for adjustment to obtain relatively stable test parameters and can improve test quality, but the present invention is not limited thereto.

[0038] Referring to FIGS. 5, 10B, and 11, an example of the position deviation in the second axial direction D2 and the corresponding monitoring method will be described. First, as shown in FIG. 5, when the probe card 110 and the wafer 10 are in the correct positions, the linear distance between the clamp mechanism 122 and the probe card 110 is d3. In contrast, as shown in FIG. 10B, when the probe card 110 generates a position deviation in the second axial direction D2 (for example, the vertical direction in FIGS. 5 and 10B), the probe card 110 and the wafer 10 are in a deviated position, and there is a linear distance d4 between the clamp mechanism 122 and the probe card 110 that is greater than the distance d3. In this way, by monitoring the numerical value of the distance, the abnormality (such as deformation or displacement) of the probe card 110 during the test process can be reflected in real time, the risk of damaging the probe card 110 and the wafer 10 can be reduced, and the measurement accuracy can be improved.

[0039] The above examples of positional deviation and the corresponding monitoring methods correspond to all embodiments described in this specification and can be adjusted according to actual design requirements, so they are not limited by the present invention. As long as the sensor is arranged on one of the probe card and the probe, and measures the distance between the probe card and the probe in at least one axial direction, all are included within the protection scope of the present invention.

[0040] As described above, the embodiment of the present invention introduces a sensor configured to measure the relative distance between a probe card and a probe in at least one axial direction into a probe card monitoring system. In this way, by monitoring the numerical value of the distance, the state of the probe card during the test process can be reflected in real time, the risk of damaging the probe card and the wafer can be reduced, and the measurement accuracy can be improved.

[0041] Those of ordinary skill in the art will understand that various modifications and changes can be made to the disclosed embodiments without departing from the scope or spirit of the present invention. Considering this, the present invention is intended to include modifications and changes within the scope of the following claims and their equivalents.

Industrial Applicability

[0042] The probe card monitoring system and its monitoring method can be applied to the field of probe card monitoring.

Explanation of Signs

[0043] 10 Wafer 20 Chuck 100, 200, 300 Probe Card Monitoring System 110 Probe Card 110t Upper Surface 110s, 121s Side Surface 111 Reinforcing Plate 112 Printed Circuit Board 113 Probe Head 113a base 113b probe 114 contact tab 120 probe 121 head plate 122 clamping mechanism 122s bottom surface 130, 130a, 230, 230a, 330, 330a, 330b, 430, 430a, 430b sensors 130d, 230d, 330d, 430d, d1, d2, d3, d4 distances 150 control unit D1, D2 axial directions L1, L2 deviation positions S200, S250, S300, S350, S400 steps T1, T2, T3 measurement points

Claims

1. A probe card monitoring system applicable to either a probe card including a reinforcing plate and a printed circuit board or a prober including a head plate and a clamping mechanism, comprising: at least one sensor disposed on one of the probe card and the prober to measure the distance between the probe card and the prober in at least one axial direction; a control unit coupled to the at least one sensor and configured to give an alarm; at least one contact tab disposed on the reinforcing plate; The probe card monitoring system, wherein the measurement point on the probe card monitoring system is not on the at least one contact tab.

2. The probe card monitoring system according to claim 1, wherein the at least one axial direction is one, two, or three of the X-axis, Y-axis, and Z-axis.

3. The probe card monitoring system according to claim 1, wherein the at least one axial direction is the X-axis and / or Y-axis, and the at least one sensor is disposed in the head plate of the prober.

4. The probe card monitoring system according to claim 3, wherein the at least one sensor is disposed on the side surface of the head plate close to the probe card.

5. The probe card monitoring system according to claim 3, wherein the reinforcing plate is located between the at least one sensor and the printed circuit board.

6. The probe card monitoring system according to claim 1, wherein the at least one axial direction is the X-axis and / or Y-axis, and the at least one sensor is disposed in the probe card.

7. The probe card monitoring system according to claim 6, wherein the at least one sensor is disposed on the side surface of the probe card close to the head plate.

8. The probe card monitoring system according to claim 6, wherein the at least one sensor is disposed in the reinforcing plate.

9. The probe card monitoring system according to claim 1, wherein the at least one axial direction is the Z-axis, and the at least one sensor is disposed in the clamping mechanism.

10. The probe card monitoring system according to claim 9, wherein the at least one sensor is disposed on the bottom surface of the clamping mechanism close to the probe card.

11. The probe card monitoring system according to claim 1, wherein at least one of the axial directions is the Z-axis, and at least one of the sensors is disposed within the probe card.

12. The probe card monitoring system according to claim 11, wherein at least one of the sensors is disposed on an upper surface of the probe card near the clamping mechanism.

13. The probe card monitoring system according to claim 1, wherein the probe card further includes at least one contact tab disposed on the reinforcing plate, and a measurement point on the probe card monitoring system is separated from the at least one contact tab by a pitch in the range of 0.1 millimeter (mm) to 3 mm.

14. The probe card monitoring system according to claim 1, wherein at least one of the axial directions is the X-axis and / or the Y-axis, and a measurement point on the probe card monitoring system is located in a peripheral region of the probe card.

15. The probe card monitoring system according to claim 1, wherein at least one of the axial directions is the Z-axis, and a measurement point on the probe card monitoring system is located in a central region of the probe card.

16. The probe card monitoring system according to claim 15, wherein the probe card further includes a probe head, and the central region is a region where the probe head is disposed.

17. A probe card monitoring method applicable to either a probe card including a reinforcing plate and a printed circuit board or a probe including a head plate and a clamping mechanism, the method comprising: disposing at least one sensor on one of the probe card and the probe, the probe card further including at least one contact tab disposed on the reinforcing plate, and a measurement point on the probe card monitoring method not being on the at least one contact tab; determining whether a distance between the probe card and the probe in at least one axial direction obtained from the at least one sensor exceeds an abnormal condition; and when the abnormal condition is exceeded, reporting in response thereto by a control unit.

18. providing a work station in which the abnormal condition is set. The probe card monitoring method according to claim 17, further comprising: transmitting the distance to the workstation to determine whether the abnormal condition is exceeded.

19. The probe card monitoring method according to claim 18, wherein the control unit is a probe, a tester electrically connected to the probe, or a controller electrically connected to the workstation.

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