Pickup collet, pickup device, and mounting device

Abstract

To provide a pick-up collet, a pick-up device, and a mounting device that can pick up an electronic component without contact.SOLUTION: A pick-up collet 200 according to an embodiment that picks up an electronic component 2 by sucking and holding the electronic component includes a porous member 201 that has air permeability and ejects gas supplied to the inside in a planar manner through the pores of the facing surface 201a that faces the electronic component 2, and the porous member 201 has an opening 201d on the facing surface 201a, and is provided with a suction hole 201c for sucking the electronic component 2 by negative pressure, and a non-supporting region is provided in which the electronic component 2 is not supported by a gas layer formed by blowing gas from the facing surface 201a is provided around an opening 201d of the suction hole 201c.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present invention relates to a pickup collet, a pickup device, and a mounting device.

Background Art

[0002] When mounting electronic components, which are semiconductor elements such as logic, memory, and image sensors, on a substrate, a wafer on which the semiconductor elements are formed is diced into individual chips. Then, each of these chips is picked up and transferred to the substrate for mounting.

[0003] One surface of the chip, which is the surface, is a functional surface on which a fine circuit is formed. When picking up this chip from the wafer, if the member for picking up directly contacts the functional surface, there is a risk of damaging the circuit or the like, so there is a demand to avoid contact.

[0004] In addition, the connection terminals on the surface of the chip and the connection terminals on the substrate are also opposed and joined. At this time, in order to ensure and improve the joinability between the connection terminals, surface treatment such as plasma treatment or surface activation treatment may be performed on the surface of the chip. In order to maintain the state of the surface of the chip that has been subjected to such treatment, there is also a demand to avoid the member for picking up from directly contacting the surface of the chip.

[0005] In order to meet the requirement of not contacting the surface of the chip, conventionally, in a collet which is a member for picking up the chip, the surface for holding the chip is a tapered surface, and only the peripheral portion instead of the surface of the chip is held in contact with the tapered surface of the collet (see Patent Document 1).

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] However, even in the prior art as described above, there is contact with the collet at the peripheral portion of the chip. For this reason, by contacting the peripheral edge of the surface of the chip, there is a possibility that the chip may be chipped or cracked. Also, the contact between the chip and the collet itself leads to the generation of particles. For this reason, there is a demand for a collet that can hold the peripheral edge of the surface of the chip without contact.

[0008] The present invention has been made to solve the above problems, and an object thereof is to provide a pickup collet, a pickup device, and a mounting device that can pick up electronic components without contact.

Means for Solving the Problems

[0009] The present invention is a pickup collet that sucks and holds an electronic component for pickup, and has a porous member having air permeability and jetting the gas supplied inside in a planar manner through pores on the opposing surface facing the electronic component. The porous member has an opening on the opposing surface, and suction holes for sucking the electronic component by negative pressure are provided. Around the opening of the suction holes, a gas layer formed by the jetting of gas from the opposing surface is provided with a non-supporting region that does not support the electronic component. and the unsupported area is an inclined area between the opposing surface and the opening.

[0010] Also, the pickup device of the present invention is a pickup device that picks up an electronic component from a sheet to which the electronic component is attached, and includes the pickup collet and a collet moving mechanism that approaches the pickup collet to a position where the electronic component on the sheet can be sucked and held, sucks and holds the electronic component, and can peel it off from the sheet and transfer it.

[0011] Further, the mounting apparatus of the present invention includes the pickup apparatus, a bonding head that is provided so as to be movable relative to the pickup collet and receives the electronic component from the pickup collet, and a mounting unit that transfers and mounts the electronic component held by the bonding head onto a substrate.

Advantages of the Invention

[0012] According to the pickup collet, pickup apparatus, and mounting apparatus of the present invention, an electronic component can be picked up in a non-contact manner.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Embodiments for Carrying Out the Invention

[0014] Embodiments of the present invention will be described with reference to the drawings. Note that the drawings are schematic diagrams, and the sizes, ratios, etc. of each part include parts that are exaggerated for easy understanding. As shown in FIGS. 1 and 2, the pickup collet 200 of the present embodiment is used in the transfer device 1 for the electronic component 2. The transfer device 1 includes a pickup device 20, a mounting device 30, and a control device 50, and is a device that transfers the electronic component 2 from the pickup device 20 to the mounting device 30.

[0015] The electronic component 2 is, for example, a chip-shaped component. In the present embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces. The mounting device 100 is a device that mounts the electronic component 2 supplied from the supply device 10 on a substrate through the transfer by the transfer device 1. That is, the mounting device 100 includes, in addition to the configuration of the transfer device 1, a supply device 10 and a substrate stage 60 that supports the substrate.

[0016] The supply device 10 is a device that supplies the electronic component 2 to the pickup device 20. The supply device 10 moves the electronic component 2 to be picked up to the supply position P1. The supply position P1 is the position where the pickup device 20 picks up the electronic component 2 to be picked up. The supply device 10 includes a supply stage 12 that supports the sheet 11 to which the electronic component 2 is attached, and a stage movement mechanism 13 that moves the supply stage 12. This stage movement mechanism 13 is, for example, a ball screw mechanism driven by a servo motor.

[0017] The electronic component 2 is attached, and the sheet 11 is an adhesive wafer sheet attached to a wafer ring (not shown here). The electronic components 2 are arranged in a matrix (row and column) on the sheet 11. In this embodiment, it is assumed that the electronic components 2 are arranged in a face-up state with the functional surface exposed upward.

[0018] The supply stage 12 is a table that horizontally supports the wafer ring to which the sheet 11 is attached. That is, the supply stage 12 supports the sheet 11 to which the electronic component 2 is attached via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by a stage moving mechanism 13. Since the sheet 11 is horizontally supported by the stage moving mechanism 13 together with the supply stage 12, the sheet 11 and the electronic component 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.

[0019] As shown in FIG. 1, among the horizontal directions, the direction in which the supply device 10 and the mounting device 30 are arranged is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. Also, the direction orthogonal to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The upward direction is the direction on the side where the electronic component 2 is placed with the plane of the sheet 11 as the boundary, and the downward direction is the direction on the side where the electronic component 2 is not placed with the plane of the sheet 11 as the boundary.

[0020] [Pickup device] The pickup device 20 is a device that picks up the electronic component 2 from the supply device 10 and delivers the picked-up electronic component 2 to the mounting device 30. This pickup device 20 includes a pickup collet 200, a collet moving mechanism 22, a direction changing unit 23, and a push-up pin 24.

[0021] As shown in FIGS. 3 to 5, the pickup collet 200 is a member that sucks and holds the electronic component 2 and releases the suction hold to release the electronic component 2. The pickup collet 200 has a porous member 201 and a base 202.

[0022] The porous member 201 has air permeability and is a member that supplies the gas supplied therein to the electronic component 2 through the pores on the opposing surface 201a facing the electronic component 2. The porous member 201 of the present embodiment has a rectangular parallelepiped plate shape, and fine spaces communicating with each other are densely and substantially uniformly formed as a whole. The porous member 201 has air permeability due to this structure, but its conductance is very small. One of the surfaces of the porous member 201 serves as the opposing surface 201a. When gas is supplied into the interior from the back surface 201b on the side opposite to the opposing surface 201a, the gas jets out from the pores densely and evenly present on the opposing surface 201a. This jetting becomes a substantially planar jetting that spreads over the entire surface of the jetted opposing surface 201a. This jetting is extremely gentle, like oozing out, and is at a level where one can feel a slight air current by bringing a finger close. Note that the surfaces other than the opposing surface 201a and the back surface 201b may have their pores blocked.

[0023] As described above, the pores, which are the fine spaces inside the porous member 201, communicate with each other, and the porous member 201 is a continuous structure through which gas can pass between the pores. As such a porous member 201, sintered metal, ceramic, resin, etc. can be used. From the viewpoint that the internal particles are difficult to separate and flow out, it is preferable to use sintered metal.

[0024] Furthermore, as shown in FIGS. 3 and 4, the porous member 201 is provided with a suction hole 201c, which is a through-hole that has an opening 201d on the opposing surface 201a and sucks the electronic component 2 by negative pressure. The suction hole 201c of the present embodiment linearly penetrates from the center of the back surface 201b to the center of the opposing surface 201a.

[0025] The base 202 is a member that covers the surfaces of the porous member 201 other than the opposing surface 201a. The base 202 of the present embodiment is a rectangular parallelepiped box with an open bottom. The porous member 201 is inserted through the opening of the base 202 so that the bottom surface is exposed as the opposing surface 201a, and is assembled and fixed within the base 202.

[0026] On the top surface of the base 202, as shown in FIGS. 3 and 5, an air supply hole 202a, an exhaust hole 202b, and a mounting hole 202c are provided. The air supply hole 202a is a through hole for supplying air to the porous member 201. The air supply hole 202a is formed at a position closer to the outer edge of the base 202 for the piping connected to the air supply hole 202a. The exhaust hole 202b is a through hole for generating a negative pressure at the opening 201d via the suction hole 201c. The exhaust hole 202b extends downward and is formed to align with the suction hole 201c of the porous member 201. A space for gas accumulation is formed between the inner surface of the base 202 and the porous member 201 around the exhaust hole 202b. Note that the exhaust hole 202b may penetrate through the suction hole 201c and reach the opposing surface 201a. In this case, the suction hole 201c and the opening 201d of the porous member 201 are provided so as to be in close contact with the outside of the exhaust hole 202b reaching the opposing surface 201a of the porous member 201. The mounting hole 202c is a pair of recessed holes for preventing displacement when connecting to the collet moving mechanism 22.

[0027] The air supply hole 202a is connected to a gas supply circuit via a piping (not shown). The supply circuit includes a gas supply source, a pump, a valve, etc. Here, the gas supplied to the porous member 201 through the air supply hole 202a is an inert gas. The exhaust hole 202b communicates with a negative pressure generating circuit including a vacuum pump, a valve, etc. via a piping (not shown).

[0028] The collet moving mechanism 22 is a mechanism that reciprocates the pickup head 21 with the pickup collet 200 mounted between the supply position P1 and the transfer position P2, and also raises and lowers it at the supply position P1 and the transfer position P2. Note that the transfer position P2 is the position where the pickup device 20 transfers the electronic component 2 picked up at the supply position P1 to the bonding head 31 that functions as a receiving part described later. The supply position P1 and the transfer position P2 mainly mean positions in the XY direction and do not necessarily mean positions in the Z-axis direction.

[0029] Also, even when meaning the position (height) in the Z-axis direction, assume that the height has a predetermined width. The predetermined width includes the thickness of the electronic component 2, the distance to push up the electronic component 2, the distance at which the electronic component 2 can be adsorbed, etc. when delivering the electronic component 2. Particularly when meaning the position (height) in the Z-axis direction, at the supply position P1, let the height at the approach position be H1 and the height at the peeling position be H2 (see Fig. 8).

[0030] The collet moving mechanism 22 has an arm 222a to which the pickup head 21 is attached, and by moving the arm 222a, the pickup collet 200 attached to the pickup head 21 is moved. At the tip of the pickup head 21, a detachable part 222b is provided. The detachable part 222b has a magnet inside and adsorbs and holds the base 202 of the pickup collet 200 by the suction force of the magnet. As shown in Figs. 4 and 5, a pair of pins 222c are provided on the contact surface of the detachable part 222b with the base 202. By fitting the pins 222c into the mounting holes 202c provided in the base 202, displacement of the pickup collet 200 with respect to the detachable part 222b is prevented. Although not shown, the pipe connected to the exhaust hole 202b passes through the detachable part 222b, and the pipe connected to the air supply hole 202a is supported by the detachable part 222b.

[0031] The collet moving mechanism 22 includes a slide mechanism 221 and a lifting mechanism 222. The slide mechanism 221 reciprocates the pickup collet 200 between the supply position P1 and the delivery position P2 by moving the arm 222a to which the pickup head 21 is attached. Here, the slide mechanism 221 extends parallel to the X-axis direction and has a rail 221b fixed to the support frame 221a and a slider 221c that travels on the rail 221b.

[0032] The lifting mechanism 222 moves the pickup collet 200 vertically by moving the arm 222a to which the pickup head 21 is attached. Specifically, the lifting mechanism 222 can use a ball screw mechanism driven by a servo motor. That is, when the servo motor is driven, the pickup collet 200 moves up and down along the Z-axis direction. The pickup collet 200 is elastically supported by the pickup head 21 via the detachable part 222b, and is provided so as to be slidable in the Z-axis direction with respect to the pickup head 21 vertically. And the pickup head 21 has a sensor for detecting this slide movement.

[0033] The direction changing part 23 is provided between the pickup collet 200 and the collet moving mechanism 22. Here, the direction changing part 23 is an actuator including a drive source such as a motor for changing the direction of the pickup collet 200. The direction of the pickup collet 200 is defined as the direction from the base 202 side of the pickup collet 200 toward the opposing surface 201a. Changing the direction means rotating it 0° to 180° in the vertical direction. For example, the pickup collet 200 with the opposing surface 201a facing the supply stage 12 adsorbs and holds the electronic component 2 at the supply position P1. Then, the direction changing part 23 changes the direction of the pickup collet 200 so that the adsorption surface faces upward. At this time, the rotation angle is 180°.

[0034] The push-up pin 24 is provided below the sheet 11 of the supply device 10. The push-up pin 24 is a needle-shaped member with a pointed tip. The push-up pin 24 is provided inside the backup body 241 so that its longitudinal direction is parallel to the Z-axis direction.

[0035] The backup body 241 has a drive mechanism for advancing or retracting the push-up pin 24 from inside it. This advancement or retraction is performed in the vertical direction. This drive mechanism is driven by, for example, an air cylinder or a cam mechanism.

[0036] [Mounting device] The mounting device 30 is a device that conveys the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate. The mounting position P3 is the position where the electronic component 2 is mounted on the substrate. The mounting device 30 has a bonding head 31 and a head moving mechanism 32.

[0037] The bonding head 31 functions as a receiving part that receives the electronic component 2 from the pickup collet 200 at the delivery position P2, and is also a device that mounts the electronic component 2 on the substrate at the mounting position P3. The bonding head 31 holds the electronic component 2 and releases the holding state after mounting to release the electronic component 2.

[0038] Specifically, the bonding head 31 includes a nozzle 31a. The nozzle 31a holds the electronic component 2 and releases the holding state to release the electronic component 2. The nozzle 31a has a nozzle hole. The nozzle hole opens on the suction surface at the tip of the nozzle 31a. The nozzle hole communicates with a negative pressure generating circuit (not shown) such as a vacuum pump, and when the circuit generates a negative pressure, the electronic component 2 is adsorbed and held on the suction surface of the nozzle 31a. Also, by releasing the negative pressure, the holding state of the electronic component 2 is released from the suction surface.

[0039] The head moving mechanism 32 is a mechanism that reciprocates the bonding head 31 between the delivery position P2 and the mounting position P3, and also raises and lowers the bonding head 31 at the delivery position P2 and the mounting position P3. Specifically, the head moving mechanism 32 includes a slide mechanism 321 and a lifting mechanism 322.

[0040] The slide mechanism 321 reciprocates the bonding head 31 between the delivery position P2 and the mounting position P3. Here, the slide mechanism 321 extends parallel to the X-axis direction and has two rails 321b fixed to the support frame 321a and a slider 321c that travels on the rails 321b.

[0041] Although not shown in the figures, the slide mechanism 321 has a slide mechanism that slides the bonding head 31 in the Y-axis direction. This slide mechanism can also be composed of a rail in the Y-axis direction and a slider that travels on the rail. The lifting mechanism 322 moves the bonding head 31 in the vertical direction. Specifically, the lifting mechanism 322 can use a ball screw mechanism driven by a servo motor. That is, when the servo motor is driven, the bonding head 31 moves up and down along the Z-axis direction.

[0042] The substrate stage 60 is a stage that supports the substrate for mounting the electronic component 2. The substrate stage 60 is provided on the stage moving mechanism 61. The stage moving mechanism 61 is a moving mechanism that slides the substrate stage 60 on the XY plane and aligns the planned mounting position of the electronic component 2 on the substrate with the mounting position P3. The stage moving mechanism 61 is, for example, a ball screw mechanism driven by a servo motor.

[0043] [Control Device] The control device 50 controls the startup, stop, speed, operation timing, etc. of the supply device 10, the pickup device 20, the mounting device 30, and the substrate stage 60. That is, the control device 50 is the control device of the transfer device 1 and the mounting device 100. The control device 50 can be realized by, for example, a dedicated electronic circuit or a computer that operates according to a predetermined program. An input device for the operator to input instructions and information necessary for control and an output device for checking the state of the device are connected to the control device 50. The input device can use a switch, a touch panel, a keyboard, a mouse, etc. The output device can use a display unit such as a liquid crystal or an organic EL.

[0044] FIG. 6 is a functional block diagram of the control device 50. As shown in FIG. 6, the control device 50 has a supply device control unit 51, a push-up pin control unit 52, a pickup control unit 53, a bonding head control unit 54, a substrate stage control unit 56, and a storage unit 57.

[0045] The supply device control unit 51 controls the movement of the supply stage 12. That is, it controls the movement of the electronic component 2 to be picked up placed on the sheet 11. The push-up pin control unit 52 controls the movement of the push-up pin 24, that is, the operation of the backup body 241.

[0046] The pickup control unit 53 controls the movement of the pickup collet 200. That is, the pickup control unit 53 controls the operations of the collet movement mechanism 22 and the direction conversion unit 23. Further, the pickup control unit 53 controls the supply circuit communicating with the air supply hole 202a and the negative pressure generation circuit communicating with the exhaust hole 202b, and controls the holding and releasing of the electronic component 2.

[0047] The bonding head control unit 54 controls the movement of the bonding head 31, that is, the operation of the head movement mechanism 32. Further, the bonding head control unit 54 controls the negative pressure generation circuit communicating with the nozzle hole of the bonding head 31, and controls the holding and releasing of the electronic component 2. The substrate stage control unit 56 controls the movement of the substrate stage 60, that is, the operation of the stage movement mechanism 61.

[0048] The storage unit 57 is a recording medium including various memories, HDDs, or SSDs. In the storage unit 57, data and programs necessary for the operation of the transfer device 1 are stored in advance, and data necessary for the operation of the transfer device 1 are stored. This necessary data is, for example, the supply amount of gas, the exhaust pressure, the position coordinates of the supply position P1, the handover position P2, and the mounting position P3, and the position coordinates of each movement mechanism. Each of the above movement mechanisms performs movement control of each component based on these coordinates.

[0049] [Principle of suction holding by pickup collet] Next, the principle of sucking and holding the electronic component 2 by the pickup collet 200 as described above will be explained. As shown in Fig. 3(A), the gas G supplied from the air supply hole 202a jets out in a planar manner from the pores on the opposing surface 201a, thereby forming a gas layer between the gas and the electronic component 2. This layer is, for example, 2 to 10 μm thick. Then, with a negative pressure applied to the suction hole 201c by the negative pressure generating circuit, the opposing surface 201a is brought close to the electronic component 2, and the electronic component 2 is sucked and held. At this time, since a gas layer is formed between the opposing surface 201a and the electronic component 2, the opposing surface 201a and the electronic component 2 are maintained in a non-contact state. Also, by releasing the negative pressure by the negative pressure generating circuit, the negative pressure no longer acts on the suction hole 201c, and the electronic component 2 is released from the pickup collet 200.

[0050] [Operation] In the transfer device 1 as described above, the operation of picking up the electronic component 2 from the supply device 10 by the pickup device 20 and delivering the electronic component 2 to the mounting device 30 will be described below with reference to the flowchart of Fig. 7 and the explanatory diagram of Fig. 8 in addition to Figs. 1 to 6.

[0051] First, the pickup device 20 and the supply device 10 move the pickup collet 200 to the supply position P1 where the push-up pin 24 is located, and the opposing surface 201a of the pickup collet 200 is opposed to the push-up pin 24 (step S01). At this time, pressurized gas is supplied to the porous member 201 through the air supply hole 202a, and gas is blowing out from the opposing surface 201a. Also, at this time, no exhaust is being performed from the exhaust hole 202b, and no suction is being performed from the opening 201d.

[0052] On the one hand, the supply device 10 moves the supply stage 12 and positions the electronic component 2 to be picked up at the supply position P1 as shown in FIG. 8(A) (step S02). After that, the pickup collet 200 from which the gas G is supplied from the opposing surface 201a descends together with the pickup head 21 and approaches the electronic component 2. When the pickup collet 200 approaches the electronic component 2, the gas G on the opposing surface 201a is sandwiched between the opposing surface 201a and the electronic component 2 to form a gas layer. The sandwiched gas layer at this time is considered to be a viscous flow layer. Then, as shown in FIG. 8(B), the descent of the pickup collet 200 with respect to the electronic component 2 stops due to the gas layer that is no longer compressed (step S03).

[0053] Here, when the pickup collet 200 contacts the electronic component 2, the pickup collet 200 itself stops. However, since the pickup collet 200 is elastically supported by the pickup head 21, even if the pickup collet 200 stops, the pickup head 21 continues to descend and slides relative to the pickup collet 200. When this slide is detected by the sensor, the pickup control unit 53 recognizes that the pickup collet 200 has contacted the electronic component 2 and stops the descent of the pickup head 21. At this time, the pickup collet 200 is not in contact with the electronic component 2. However, since a gas layer is formed between the opposing surface 201a and the electronic component 2, the opposing surface 201a cannot approach the electronic component 2 any further and stops. The height position of the pickup collet 200 at this time becomes the approach position H1. That is, the approach position H1 is not set in advance as a specific stop position.

[0054] In this way, with the pickup collet 200 stopped via the gas layer and further with the pickup head 21 stopped, suction by the suction hole 201c is started by exhaust from the exhaust hole 202b (step S04). That is, in a state where the pickup collet 200 presses the electronic component 2 against the sheet 11 supported by the backup body 241 via the gas layer, that is, in a state where the sheet 11 and the electronic component 2 are clamped between the backup body 241, suction is started.

[0055] In this state, as shown in FIG. 8(C), as the pickup collet 200 rises, simultaneously, pushing-up by the rising of the push-up pin 24 is started in synchronization therewith (step S05). Thereby, the sheet 11 starts to peel from the back surface of the electronic component 2. Further, as shown in FIG. 8(D), the push-up pin 24 stops when it rises by a preset predetermined amount. Then, by the further rising pickup collet 200, the electronic component 2 sucked by negative pressure while maintaining a gap by the gas layer is peeled off from the sheet 11 and picked up (step S06). Although the height position at which the electronic component 2 is completely peeled off in this way is the peeling position H2, it is not set in advance as a specific stop position.

[0056] The pickup device 20 reverses the pickup collet 200 by the direction changing unit 23 (step S07). That is, the direction of the pickup collet 200 is rotated 180° in the vertical direction, and the opposing surface 201a of the pickup collet 200 is directed upward. Here, the reversing operation in step S07 is performed immediately after picking up the electronic component 2, but it may be performed at any point between the supply position P1 and the delivery position P2.

[0057] The pickup device 20 moves the picked-up electronic component 2 to the delivery position P2 by the collet moving mechanism 22 (step S08). At the delivery position P2, the bonding head 31 of the mounting device 30 waits and faces the opposing surface 201a of the pickup collet 200 via the electronic component 2.

[0058] The bonding head 31 is lowered toward the pickup collet 200 located at the delivery position P2. After holding the electronic component 2 with the bonding head 31, the pickup collet 200 releases the negative pressure, thereby delivering the electronic component 2 from the pickup collet 200 to the bonding head 31 (step S09). After that, the bonding head 31 rises so as to be separated from the pickup collet 200 and moves to the mounting position P3 to mount the electronic component 2 on the substrate.

[0059] [Effect] (1) The pickup collet 200 of the present embodiment is a pickup collet 200 that sucks and holds the electronic component 2 for pickup. It has a porous member 201 that has air permeability and supplies the gas supplied inside through the pores of the opposing surface 201a facing the electronic component 2. The porous member 201 is provided with a suction hole 201c having an opening 201d for sucking the electronic component 2 to the opposing surface 201a by negative pressure on the opposing surface 201a.

[0060] In addition, the pickup device 20 of the present embodiment has a collet moving mechanism 22 that brings the pickup collet 200 close to a position where the electronic component 2 on the sheet 11 can be sucked and held, and peels off the sucked and held electronic component 2 from the sheet 11 for transfer.

[0061] Furthermore, the mounting device 100 of the present embodiment is provided so as to be relatively movable with respect to the pickup collet 200, and has a bonding head 31 that receives the electronic component 2 from the tip of the pickup collet 200, and a mounting unit that transfers and mounts the electronic component 2 held by the bonding head 31 on the substrate.

[0062] Therefore, when picking up the electronic component 2 by suction from the suction holes 201c, the layer of gas discharged from the pores of the porous member 201 can keep the electronic component 2 and the facing surface 201a non-contact, and damage to the electronic component 2 can be suppressed. Also, even when transporting the electronic component 2, while reducing the possibility of damage to the electronic component 2 by contacting the facing surface 201a, the electronic component 2 can be held to prevent dropping and the like.

[0063] Here, consider the case of holding the electronic component 2 by a Bernoulli chuck that generates a suction force by utilizing the negative pressure generated by a large amount of air flow by flowing the gas discharged from this space between the electronic component 2 and the surface facing the electronic component 2. In this case, the suction force is very weak, and even if the electronic component 2 can be held at a certain distance from the collet, the suction force to peel off the electronic component 2 adhered to the sheet 11 cannot be obtained. Also, in order to obtain the Bernoulli effect, it is necessary to make the gas flow rate per unit time very large, so it is very difficult to adjust the suction force for holding while maintaining non-contact. Furthermore, there is a risk of generating particles due to a large amount of gas being blown out around the pickup location.

[0064] Also, when providing ejection holes for gas with a size equivalent to the suction holes, instead of pores such as the porous member 201, on the surface of the collet facing the electronic component 2, injecting gas toward the electronic component 2 to float the electronic component 2, and attempting to suck the electronic component 2 by the suction holes against the floating force of the electronic component 2 due to this injection, as in the above case, it is very difficult to adjust the suction force for holding while maintaining non-contact (floating), and there is a risk of generating particles due to a large amount of gas being blown out around the pickup location.

[0065] In contrast, in the present embodiment, the flow rate of the gas blown out in a planar manner from the entire surface of the opposing surface 201a through the fine holes in the opposing surface 201a is extremely small. Therefore, there is no risk of generating particles. The blowing from the opposing surface 201a does not actively float the electronic component 2, but forms a layer of viscous-flow gas when the opposing surface 201a and the electronic component 2 are close to each other. Therefore, keeping the opposing surface 201a and the electronic component 2 in a non-contact state is easier as the suction force is stronger. Even when the suction force due to the negative pressure from the suction hole 201c is sufficient to peel the electronic component 2 from the sheet 11, the gas layer between the opposing surface 201a and the electronic component 2 can prevent contact. Thus, obtaining a strong suction force and adjusting the suction force are both easy.

[0066] As a result of the study by the inventor of the present application, for example, under the following conditions, it was found that the pickup collet 200 could maintain non-contact with the electronic component 2 while performing suction and holding. First, as the porous member 201, a member having a ventilation rate such that, for example, when the supply pressure is 0.3 MPa, the flow rate of the gas flowing out from the porous member 201 is about 0.7 L / min was used. The pressure of the gas (nitrogen gas) supplied to the porous member 201 may be in the range of about 0.1 to 0.7 MPa. At this time, the flow rate of the gas flowing through the porous member 201 is in the range of about 0.3 to 1.5 L / min, and the non-contact between the pickup collet 200 and the electronic component 2 could be reliably maintained. Also, as the suction pressure, in the range of -10 to -90 kPa, the electronic component 2 could be reliably picked up from the sheet 11. At this time, the pressure in the gas layer between the electronic component 2 and the opposing surface 201a was obtained as 0.1 to 0.5 MPa.

[0067] As a comparative example, a collet made of stainless steel (SUS) having the same size as the above-described pickup collet 200 and having no pores as a material was used. When 50 holes with a diameter of 0.3 mm were arranged in a matrix in this collet and the gas supplied at a pressure of 0.02 MPa was ejected from the holes, the suction pressure was -50 kPa, and the pressure between the electronic component 2 and the opposing surface 201a that could maintain non-contact was extremely small, 0.025 to 0.035 MPa, and the width was also narrow. That is, unlike the pores of the porous member 201, in the ejection of gas through a plurality of holes formed in the collet, even with a slight pressing force or suction force, or even if the slight pressing force or suction force changes, it was found that the electronic component 2 easily comes into contact with the opposing surface. Furthermore, when the supply pressure was increased to increase the pressure between the electronic component 2 and the opposing surface 201a, the electronic component 2 easily fell off.

[0068] (2) In a state where the opposing surface 201a faces the electronic component 2, the opening 201d is provided within the projection plane of the electronic component 2, that is, at a position overlapping the electronic component 2. In the present embodiment, one opening 201d communicating with the suction hole 201c is provided at the center of the opposing surface 201a. For this reason, there is no inflow of gas from the outer edge of the electronic component 2, and a strong suction force can be ensured using atmospheric pressure. Note that there may be a plurality of openings 201d, and the position thereof is not limited to the center as long as the opposing surface 201a overlaps the electronic component 2.

[0069] [Modification Example] The present invention is not limited to the above-described embodiment, and the following modification examples can also be applied with the same basic configuration as the above-described embodiment. (1) An unsupported region where a gas layer formed by the ejection of gas from the opposing surface 201a does not support the electronic component 2 may be provided around the opening 201d of the suction hole 201c. The reason for providing such an unsupported region is as follows.

[0070] In the case of the pickup collet 200 as described above, the held electronic component 2 is likely to move within the horizontal opposing surface 201a. In particular, when the acceleration and deceleration of the operation are increased during the inversion, transfer, handover, etc. of the electronic component 2, positional deviation may occur. Furthermore, there is also a risk that the component may fall off without being able to maintain the hold.

[0071] Here, in the opening 201d portion where the suction force acts, a force is generated by the electronic component 2 being drawn (pushed in from the outside) toward the center of the opening 201d. This force acts as a bending stress on the electronic component 2 as shown by the shaded arrows in Fig. 9. In Fig. 9, the electronic component 2 is shown as being deformed for ease of understanding. In practice, it is preferable that the suction force is such that no deformation occurs, but even in that case, such a force acts on the electronic component 2.

[0072] When such stress acts, the electronic component 2 is attracted to the center of the opening 201d and the movement in the direction parallel to the opposing surface 201a is restricted, so that the deviation and disengagement of the electronic component 2 from the position where it was once held can be reduced. It is considered that this attracting force increases as the distance from the opening 201d to the position that becomes the stress fulcrum becomes longer. Here, the suction force in the opening 201d acts evenly over the entire area directly below the opening 201d. However, as shown in Fig. 9, in the area deviating from directly below the opening 201d, there is a gas layer from the opposing surface 201a, so the suction force does not act and the electronic component 2 is supported by the gas layer. Therefore, in this case, the edge portion of the opening 201d becomes the stress fulcrum. Thus, by providing an unsupported area, which is an area around the opening 201d where there is no layer due to gas ejection, and moving the position that becomes the stress fulcrum away from the center of the opening 201d, it is possible to increase the stress applied to the electronic component 2.

[0073] More specifically, a region around the opening that sucks the electronic component 2 and does not support the electronic component 2 by a gas layer is defined as a non-support region. For example, as shown in FIG. 10, a non-jetting portion 201e, which is a region where gas is not ejected, formed around the opening 201d of the opposing surface 201a, is defined as the non-support region. The non-jetting portion 201e can be configured by embedding or covering a member or material that does not have a vent portion concentric with the opening 201d.

[0074] Also, a region where the opposing surface 201a is recessed is defined as the non-support region. For example, as shown in FIG. 11, a recessed portion 201f formed around the opening 201d of the opposing surface 201a is defined as the non-support region. The recessed portion 201f can be configured by forming a portion that is recessed concentrically with the opening 201d. In this case, although gas ejection occurs in the non-support region, compared to the surface where the gas layer is formed, the distance to the electronic component 2 is longer, so a sufficiently compressed gas layer is not formed and support by the gas layer is not possible.

[0075] Furthermore, an inclined region between the opposing surface 201a and the opening 201d is defined as the non-support region. For example, as shown in FIG. 12, an inclined portion 201g between the opposing surface 201a and the opening 201d is defined as the non-support region. The inclined portion 201g can be configured as a tapered surface that is concentric with the opening 201d and inclined so as to expand downward from the opening 201d. In this case, although gas ejection occurs in the non-support region, compared to the surface where the gas layer is formed, it includes a portion where the distance to the electronic component 2 is long and an even thin gap is not formed, so a sufficiently compressed gas layer is not formed and support by the gas layer is not possible.

[0076] By providing the unsupported area as described above, the stress that causes the electronic component 2 to be pushed into the center of the opening 201d increases due to the suction from the opening 201d. Then, since the movement in the direction parallel to the opposing surface 201a of the electronic component 2 is restricted, even without providing a special mechanism or the like, it is possible to reduce the displacement or detachment from the position where the electronic component 2 is held. Even during transfer, displacement and dropping can be further reduced. In FIGS. 9 to 12, although the state where the electronic component 2 is deformed is shown, it is preferably set to a suction force such that deformation does not actually occur. Even in that case, such a force acts on the electronic component 2, which is the same as in FIG. 9.

[0077] (2) The shapes and positions of the suction holes 201c and the opening 201d are not limited to the above-described aspects. The shape of the opening 201d may be circular, rectangular, as described above, or may be other elliptical, polygonal, rounded polygonal, star-shaped, etc. However, when providing the unsupported area as described above, if the opening 201d is circular, the stress towards the center of the opening 201d acts evenly in all directions, so damage to the electronic component 2 can be reduced. Also, when the opening 201d is rectangular, stress from two adjacent sides of the rectangle acts concentratedly on the part of the electronic component 2 corresponding to the corner part of the rectangle. However, if the opening 201d is polygonal, damage due to stress concentration can be reduced.

[0078] Also, as described above, when there is one opening 201d in the center of the opposing surface 201a, the electronic component 2 can be positioned in the center of the opposing surface 201a. However, when there is one in the center, the electronic component 2 may rotate in the direction parallel to the opposing surface 201a. For this reason, it is preferable to suppress rotation by providing a plurality of openings 201d, that is, at least two openings 201d. For example, as shown in FIG. 13, within the projection plane of the electronic component 2 indicated by the dotted line, that is, within the area overlapping the electronic component 2, as shown in FIG. 13(A), the opening 201d may be provided at two positions, one at the center of the opposing surface 201a and the other at a position shifted from the center. Alternatively, as shown in FIG. 13(B), a plurality of openings may be provided symmetrically with respect to the center of the opposing surface 201a.

[0079] (3) The number and size of the openings 201d are not limited to the above-described embodiments. On the opposing surface 201a of the porous member 201, the balance between the area where the electronic component 2 is supported by the gas layer and the total area of the openings 201d can realize the maintenance of the suction holding state and the non-contact state.

[0080] (4) By providing the pickup collet 200 in a replaceable manner, it can be replaced according to the shape and size of the electronic component 2. As a configuration that enables such replacement, a structure that can be suction-held by a magnet is simple, and the replacement operation is also easy. However, any configuration that allows the pickup collet 200 to be replaced is acceptable. For example, adsorption holding using negative pressure or a structure that mechanically holds it may also be used.

[0081] [Other Embodiments] The present invention is not limited to the above-described embodiments, but also includes other embodiments shown below. Further, the present invention also includes a form in which all or any combination of the above-described embodiments and the following other embodiments are combined. Furthermore, various omissions, replacements, and changes can be made without departing from the scope of the invention, and such modifications are also included in the present invention.

Explanation of Reference Numerals

[0082] 1 Transfer device 2 Electronic component 10 Supply device 11 Sheet 12 Supply stage 13 Stage movement mechanism 20 Pickup device 21 Pickup head 22 Collet movement mechanism 23 Direction conversion part 24 Pushing pin 30 Mounting device 31 Bonding head 31a Nozzle 32 Head movement mechanism 50 Control device 51 Supply device control unit 52 Push-up Pin Control Unit 53 Pick-up Control Unit 54 Bonding Head Control Unit 56 Substrate Stage Control Unit 57 Memory Unit 60 Substrate Stage 61 Stage Moving Mechanism 100 Mounting Device 200 Pick-up Collet 201 Porous Member 201a Opposite Surface 201b Back Surface 201c Suction Hole 201d Opening 201e Non-ejection Portion 201f Depression 201g Inclined Portion 202 Cover 202a Air Supply Hole 202b Exhaust Hole 202c Mounting Hole 221 Slide Mechanism 221a Support Frame 221b Rail 221c Slider 222 Lifting Mechanism 222a Arm 222b Detachable Portion 222c Pin 241 Backup Body 321 Slide Mechanism 321a Support Frame 321b Rail 321c Slider 322 Lifting Mechanism

Claims

1. A pickup collet for sucking and holding an electronic component for pickup, comprising: a porous member having air permeability and ejecting the gas supplied therein in a planar manner through pores on the facing surface facing the electronic component; the porous member is provided with suction holes that have openings on the facing surface and suck the electronic component by negative pressure; around the opening of the suction hole, a non-supporting region where a gas layer formed by the ejection of gas from the facing surface does not support the electronic component is provided; the non-supporting region is an inclined region between the facing surface and the opening. A pickup collet characterized by the above.

2. The pickup collet according to claim 1, wherein the non-supporting region is a region where the gas does not eject.

3. The pickup collet according to claim 1 or 2, characterized in that when the suction hole becomes negative pressure, the electronic component is held on the facing surface through a gas layer formed by the gas supplied from the facing surface.

4. The pickup collet according to any one of claims 1 to 3, characterized in that with the facing surface facing the electronic component, the opening is within the projection plane of the electronic component.

5. A pickup device for picking up an electronic component from a sheet to which the electronic component is attached, comprising: a pickup collet according to any one of claims 1 to 4; a collet moving mechanism that approaches the pickup collet to a position where the electronic component on the sheet can be sucked and held, sucks and holds the electronic component, and can peel it off from the sheet and transfer it. A pickup device characterized by the above.

6. The pickup device according to claim 5, further comprising: a bonding head provided to be movable relative to the pickup collet and receiving the electronic component from the pickup collet; a mounting unit that transfers and mounts the electronic component held by the bonding head onto a substrate. A mounting device characterized by the above.

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