Pickup collet, pickup device, and mounting device

Abstract

To provide a pick-up collet, a pick-up device, and a mounting device capable of picking up an electronic component without contact.SOLUTION: A pick-up collet 200 according to an embodiment that picks up an electronic component 2 by sucking and holding the electronic component includes a porous member 201 that has air permeability and ejects gas supplied inside in a planar manner through the pores of a facing surface 201a that faces the electronic component 2, the porous member 201 has an opening 201d on the facing surface 201a, and is provided with a suction hole 201c for sucking the electronic component 2 by negative pressure, and a guide portion 201e is provided that restricts the movement of the electronic component 2 along the outer edge of the facing surface 201a.SELECTED DRAWING: Figure 9

Description

Technical Field

[0001] The present invention relates to a pickup collet, a pickup device, and a mounting device.

Background Art

[0002] When mounting electronic components, which are semiconductor elements such as logic, memory, and image sensors, on a substrate, a wafer on which the semiconductor elements are formed is diced into individual chips. Then, these chips are picked up one by one, transferred to the substrate, and mounted.

[0003] One surface of the chip, which is the front surface, is a functional surface on which fine circuits are formed. When picking up this chip from the wafer, if the member for picking up directly contacts the functional surface, there is a risk of damaging the circuit or the like, so there is a requirement to avoid contact.

[0004] In addition, the connection terminals on the surface of the chip and the connection terminals on the substrate are also opposed and joined. At this time, in order to ensure and improve the joinability between the connection terminals, surface treatment such as plasma treatment or surface activation treatment may be performed on the surface of the chip. In order to maintain the surface state of the chip that has been subjected to such treatment, there is also a requirement to avoid the member for picking up from directly contacting the surface of the chip.

[0005] In order to meet the requirement of not contacting the surface of the chip, conventionally, in a collet that is a member for picking up the chip, the surface for holding the chip is a tapered surface, and only the peripheral edge of the chip, rather than the surface, is held in contact with the tapered surface of the collet (see Patent Document 1).

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] However, even in the prior art as described above, there is contact with the collet at the peripheral portion of the chip. For this reason, by contacting the peripheral edge of the surface of the chip, there is a possibility that the chip may be chipped or cracked. Also, the contact between the chip and the collet itself leads to the generation of particles. For this reason, there is a demand for a collet that can hold the peripheral edge of the surface of the chip without contact.

[0008] The present invention has been made to solve the above-described problems, and an object thereof is to provide a pickup collet, a pickup device, and a mounting device that can pick up an electronic component without contact.

Means for Solving the Problems

[0009] The present invention is a pickup collet that sucks and holds an electronic component to pick it up, and has a porous member having air permeability and ejecting the gas supplied therein in a planar manner through pores on the opposing surface facing the electronic component. The porous member has an opening on the opposing surface and is provided with suction holes for sucking the electronic component by negative pressure, and a guide portion for restricting the movement of the electronic component is provided along the outer edge of the opposing surface. and, while the guide part is sucking and holding the electronic component, the guide part ejects gas from a position facing the side surface of the electronic component and toward the side surface of the electronic component in parallel with the facing surface .

[0010] Further, the present invention is a pickup device that picks up an electronic component from a sheet to which the electronic component is attached, and includes the pickup collet and a collet moving mechanism that approaches the pickup collet to a position where the electronic component on the sheet can be sucked and held, sucks and holds the electronic component, and can peel it off from the sheet and transfer it.

[0011] Further, the mounting device of the present invention is provided so as to be movable relative to the pickup collet, and includes a bonding head that receives the electronic component from the pickup collet, and a mounting unit that transfers and mounts the electronic component held by the bonding head onto a substrate. It has.

Advantages of the Invention

[0012] According to the pickup collet, pickup device, and mounting device of the present invention, an electronic component can be picked up in a non-contact manner.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Embodiments for Carrying Out the Invention

[0014] Embodiments of the present invention will be described with reference to the drawings. Note that the drawings are schematic diagrams, and the sizes, ratios, etc. of each part include parts exaggerated for easy understanding. As shown in FIGS. 1 and 2, the pickup collet 200 of the present embodiment is used for the transfer device 1 of the electronic component 2. The transfer device 1 includes a pickup device 20, a mounting device 30, and a control device 50, and is a device that transfers the electronic component 2 from the pickup device 20 to the mounting device 30.

[0015] The electronic component 2 is, for example, a chip-shaped component. In the present embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces. The mounting device 100 is a device that mounts the electronic component 2 supplied from the supply device 10 on a substrate through transfer by the transfer device 1. That is, the mounting device 100 includes, in addition to the configuration of the transfer device 1, a supply device 10 and a substrate stage 60 that supports the substrate.

[0016] The supply device 10 is a device that supplies the electronic components 2 to the pickup device 20. The supply device 10 moves the electronic components 2 to be picked up to the supply position P1. The supply position P1 is the position where the pickup device 20 picks up the electronic components 2 to be picked up. The supply device 10 includes a supply stage 12 that supports the sheet 11 to which the electronic components 2 are attached, and a stage moving mechanism 13 that moves the supply stage 12. This stage moving mechanism 13 is, for example, a ball screw mechanism driven by a servo motor.

[0017] The sheet 11 to which the electronic components 2 are attached is, here, an adhesive wafer sheet attached to a wafer ring (not shown). The electronic components 2 are arranged in a matrix (row and column) on the sheet 11. In the present embodiment, it is assumed that the electronic components 2 are arranged in a face-up state with the functional surface exposed upward.

[0018] The supply stage 12 is a table that horizontally supports the wafer ring to which the sheet 11 is attached. That is, the supply stage 12 supports the sheet 11 to which the electronic components 2 are attached via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by the stage moving mechanism 13. Since the sheet 11 is horizontally supported by the stage moving mechanism 13 together with the supply stage 12, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.

[0019] As shown in FIG. 1, among the horizontal directions, the direction in which the supply device 10 and the mounting device 30 are arranged is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. Also, the direction orthogonal to the plane of the sheet 11 is called the Z-axis direction or the vertical direction. The upward direction is the direction on the side where the electronic components 2 are placed with the plane of the sheet 11 as a boundary, and the downward direction is the direction on the side where the electronic components 2 are not placed with the plane of the sheet 11 as a boundary.

[0020] [Pickup Device] The pickup device 20 is a device that picks up the electronic component 2 from the supply device 10 and delivers the picked-up electronic component 2 to the mounting device 30. This pickup device 20 includes a pickup collet 200, a collet moving mechanism 22, a direction changing unit 23, and a push-up pin 24.

[0021] As shown in FIGS. 3 to 5, the pickup collet 200 is a member that sucks and holds the electronic component 2 and releases the suction hold to release the electronic component 2. The pickup collet 200 has a porous member 201 and a base 202.

[0022] The porous member 201 has air permeability and is a member that supplies the gas supplied inside to the electronic component 2 through the pores of the facing surface 201a facing the electronic component 2. The porous member 201 of the present embodiment has a rectangular parallelepiped plate shape, and fine spaces that communicate as a whole are densely and substantially uniformly formed. The porous member 201 has air permeability due to this structure, but its conductance is very small. When one of the surfaces of the porous member 201 becomes the facing surface 201a and gas is supplied from the back surface 201b on the side opposite to the facing surface 201a to the inside, the gas jets out from the dense and evenly distributed pores of the facing surface 201a. This jetting becomes a substantially planar jetting that spreads over the entire facing surface 201a where the jetting occurs. This jetting is extremely gentle, like oozing out, and is such that one can feel a slight air current by bringing a finger close. Note that the surfaces other than the facing surface 201a and the back surface 201b may have their pores blocked.

[0023] As described above, the porous member 201 is a continuous structure in which the pores, which are the fine spaces inside, communicate with each other and gas can pass between the pores. As such a porous member 201, sintered metal, ceramic, resin, etc. can be used. From the viewpoint that the internal particles are difficult to separate and flow out, it is preferable to use sintered metal.

[0024] Furthermore, as shown in FIGS. 3 and 4, the porous member 201 is provided with suction holes 201c, which are through holes having openings 201d on the opposing surface 201a and sucking the electronic component 2 by negative pressure. The suction holes 201c of the present embodiment linearly penetrate from the center of the back surface 201b to the center of the opposing surface 201a.

[0025] The base 202 is a member that covers the surfaces of the porous member 201 other than the opposing surface 201a. The base 202 of the present embodiment is a rectangular parallelepiped box with an open bottom. The porous member 201 is inserted through the opening of the base 202 so that the bottom surface is exposed as the opposing surface 201a, and is assembled and fixed in the base 202.

[0026] As shown in FIGS. 3 and 5, an air supply hole 202a, an exhaust hole 202b, and a mounting hole 202c are provided on the top surface of the base 202. The air supply hole 202a is a through hole for supplying air to the porous member 201. The air supply hole 202a is formed at a position close to the outer edge of the base 202 for the piping connected to the air supply hole 202a. The exhaust hole 202b is a through hole for generating negative pressure at the opening 201d through the suction hole 201c. The exhaust hole 202b extends downward and is formed to align with the suction hole 201c of the porous member 201. A space for gas accumulation is formed between the inner surface of the base 202 and the porous member 201 around the exhaust hole 202b. Note that the exhaust hole 202b may penetrate through the suction hole 201c and reach the opposing surface 201a. In this case, the suction hole 201c and the opening 201d of the porous member 201 are provided so as to be in close contact with the outside of the exhaust hole 202b that has reached the opposing surface 201a of the porous member 201. The mounting hole 202c is a pair of recessed holes for preventing displacement when connecting to the collet moving mechanism 22.

[0027] The air supply hole 202a is connected to a gas supply circuit through a pipe (not shown). The supply circuit includes a gas supply source, a pump, a valve, etc. Here, the gas supplied to the porous member 201 through the air supply hole 202a is an inert gas. The exhaust hole 202b communicates with a negative pressure generation circuit including a vacuum pump, a valve, etc. through a pipe (not shown).

[0028] The collet moving mechanism 22 is a mechanism that reciprocates the pickup head 21 equipped with the pickup collet 200 between the supply position P1 and the transfer position P2, and also raises and lowers it at the supply position P1 and the transfer position P2. The transfer position P2 is the position where the pickup device 20 transfers the electronic component 2 picked up at the supply position P1 to the bonding head 31 that functions as a receiving part described later. The supply position P1 and the transfer position P2 mainly mean positions in the XY direction and do not necessarily mean positions in the Z-axis direction.

[0029] Also, even when it means the position (height) in the Z-axis direction, it is assumed that the height has a predetermined width. The predetermined width includes the thickness of the electronic component 2, the distance to push up the electronic component 2, the distance at which the electronic component 2 can be adsorbed, etc. when transferring the electronic component 2. Particularly when it means the position (height) in the Z-axis direction, at the supply position P1, let the height at the approaching position be H1 and the height at the peeling position be H2 (see Fig. 8).

[0030] The collet moving mechanism 22 has an arm 222a to which the pickup head 21 is attached, and by moving the arm 222a, the pickup collet 200 attached to the pickup head 21 is moved. At the tip of the pickup head 21, a detachable part 222b is provided. The detachable part 222b has a magnet inside, and the base 202 of the pickup collet 200 is adsorbed and held by the suction force of the magnet. As shown in Figs. 4 and 5, a pair of pins 222c are provided on the contact surface of the detachable part 222b with the base 202. When the pins 222c fit into the mounting holes 202c provided in the base 202, displacement of the pickup collet 200 with respect to the detachable part 222b is prevented. Although not shown, the pipe connected to the exhaust hole 202b passes through the detachable part 222b, and the pipe connected to the air supply hole 202a is supported by the detachable part 222b.

[0031] The collet moving mechanism 22 includes a slide mechanism 221 and a lifting mechanism 222. The slide mechanism 221 reciprocates the pickup collet 200 between the supply position P1 and the transfer position P2 by moving the arm 222a to which the pickup head 21 is attached. Here, the slide mechanism 221 extends parallel to the X-axis direction and has a rail 221b fixed to the support frame 221a and a slider 221c traveling on the rail 221b.

[0032] The lifting mechanism 222 moves the pickup collet 200 in the vertical direction by moving the arm 222a to which the pickup head 21 is attached. Specifically, the lifting mechanism 222 can use a ball screw mechanism driven by a servo motor. That is, by driving the servo motor, the pickup collet 200 moves up and down along the Z-axis direction. The pickup collet 200 is elastically supported by the pickup head 21 via the detachable part 222b and is provided so as to be slidable in the Z-axis direction with respect to the pickup head 21 vertically. And the pickup head 21 has a sensor for detecting this slide movement.

[0033] The direction changing part 23 is provided between the pickup collet 200 and the collet moving mechanism 22. Here, the direction changing part 23 is an actuator including a drive source such as a motor for changing the direction of the pickup collet 200. The direction of the pickup collet 200 is defined as the direction from the base 202 side of the pickup collet 200 toward the opposing surface 201a. Changing the direction means rotating it 0° to 180° in the vertical direction. For example, the pickup collet 200 with the opposing surface 201a facing the supply stage 12 adsorbs and holds the electronic component 2 at the supply position P1. Then, the direction changing part 23 changes the direction of the pickup collet 200 so that the adsorption surface faces upward. At this time, the rotation angle is 180°.

[0034] The push-up pin 24 is provided below the sheet 11 of the supply device 10. The push-up pin 24 is a needle-shaped member with a pointed tip. The push-up pin 24 is provided inside the backup body 241 such that its longitudinal direction is parallel to the Z-axis direction.

[0035] The backup body 241 has a drive mechanism for advancing or retracting the push-up pin 24 from or into its interior. This advancement or retraction is performed in the vertical direction. This drive mechanism is driven by, for example, an air cylinder or a cam mechanism.

[0036] [Mounting device] The mounting device 30 is a device that conveys the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate. The mounting position P3 is the position where the electronic component 2 is mounted on the substrate. The mounting device 30 has a bonding head 31 and a head movement mechanism 32.

[0037] The bonding head 31 has a function as a receiving part for receiving the electronic component 2 from the pickup collet 200 at the handover position P2, and is also a device for mounting the electronic component 2 on the substrate at the mounting position P3. The bonding head 31 holds the electronic component 2 and releases the holding state after mounting to release the electronic component 2.

[0038] Specifically, the bonding head 31 includes a nozzle 31a. The nozzle 31a holds the electronic component 2 and releases the holding state to release the electronic component 2. The nozzle 31a has a nozzle hole. The nozzle hole opens to the suction surface at the tip of the nozzle 31a. The nozzle hole communicates with a negative pressure generation circuit (not shown) such as a vacuum pump, and when the circuit generates a negative pressure, the electronic component 2 is suction-held on the suction surface of the nozzle 31a. Also, by releasing the negative pressure, the holding state of the electronic component 2 is released from the suction surface.

[0039] The head movement mechanism 32 is a mechanism that reciprocates the bonding head 31 between the transfer position P2 and the mounting position P3, and also raises and lowers the bonding head 31 at the transfer position P2 and the mounting position P3. Specifically, the head movement mechanism 32 includes a slide mechanism 321 and a lifting mechanism 322.

[0040] The slide mechanism 321 reciprocates the bonding head 31 between the transfer position P2 and the mounting position P3. Here, the slide mechanism 321 includes two rails 321b extending parallel to the X-axis direction and fixed to the support frame 321a, and a slider 321c traveling on the rails 321b.

[0041] Although not shown in the figure, the slide mechanism 321 has a slide mechanism for sliding the bonding head 31 in the Y-axis direction. This slide mechanism can also be constituted by a rail in the Y-axis direction and a slider traveling on the rail. The lifting mechanism 322 moves the bonding head 31 in the vertical direction. Specifically, the lifting mechanism 322 can use a ball screw mechanism driven by a servo motor. That is, by driving the servo motor, the bonding head 31 moves up and down along the Z-axis direction.

[0042] The substrate stage 60 is a stage for supporting the substrate on which the electronic component 2 is to be mounted. The substrate stage 60 is provided on the stage movement mechanism 61. The stage movement mechanism 61 is a movement mechanism that slides the substrate stage 60 on the XY plane to align the planned mounting position of the electronic component 2 on the substrate with the mounting position P3. The stage movement mechanism 61 is, for example, a ball screw mechanism driven by a servo motor.

[0043] [Control device] The control device 50 controls the startup, stop, speed, operation timing, etc. of the supply device 10, the pickup device 20, the mounting device 30, and the substrate stage 60. That is, the control device 50 is the control device of the transfer device 1 and the mounting device 100. The control device 50 can be realized by, for example, a dedicated electronic circuit or a computer operating according to a predetermined program. An input device for an operator to input instructions and information necessary for control and an output device for checking the state of the device are connected to the control device 50. As the input device, a switch, a touch panel, a keyboard, a mouse, etc. can be used. As the output device, a display unit such as a liquid crystal or an organic EL can be used.

[0044] FIG. 6 is a functional block diagram of the control device 50. As shown in FIG. 6, the control device 50 includes a supply device control unit 51, a push-up pin control unit 52, a pickup control unit 53, a bonding head control unit 54, a substrate stage control unit 56, and a storage unit 57.

[0045] The supply device control unit 51 controls the movement of the supply stage 12. That is, it controls the movement of the electronic component 2 to be picked up placed on the sheet 11. The push-up pin control unit 52 controls the movement of the push-up pin 24, that is, the operation of the backup body 241.

[0046] The pickup control unit 53 controls the movement of the pickup collet 200. That is, the pickup control unit 53 controls the operations of the collet movement mechanism 22 and the direction conversion unit 23. Further, the pickup control unit 53 controls the supply circuit communicating with the air supply hole 202a and the negative pressure generation circuit communicating with the exhaust hole 202b, and controls the holding and release of the electronic component 2.

[0047] The bonding head control unit 54 controls the movement of the bonding head 31, that is, the operation of the head movement mechanism 32. Further, the bonding head control unit 54 controls the negative pressure generation circuit communicating with the nozzle hole of the bonding head 31, and controls the holding and release of the electronic component 2. The substrate stage control unit 56 controls the movement of the substrate stage 60, that is, the operation of the stage movement mechanism 61.

[0048] The storage unit 57 is a recording medium including various memories, HDDs, SSDs, etc. In the storage unit 57, data and programs necessary for the operation of the transfer device 1 are stored in advance, and data necessary for the operation of the transfer device 1 is also stored. This necessary data includes, for example, the supply amount of gas, the exhaust pressure, the supply position P1, the handover position P2, the position coordinates of the mounting position P3, and the position coordinates of each moving mechanism. Each of the above-mentioned moving mechanisms performs movement control of each component based on these coordinates.

[0049] [Principle of suction and holding by the pickup collet] Next, the principle by which the pickup collet 200 as described above can suck and hold the electronic component 2 will be explained. As shown in Fig. 3(A), the gas G supplied from the air supply hole 202a jets out in a planar manner from the pores of the opposing surface 201a, thereby forming a gas layer between the gas G and the electronic component 2. This layer is, for example, 2 to 10 μm thick. Then, with a negative pressure applied to the suction hole 201c by the negative pressure generation circuit, the opposing surface 201a is brought close to the electronic component 2, and the electronic component 2 is sucked and held. At this time, since a gas layer is formed between the opposing surface 201a and the electronic component 2, the opposing surface 201a and the electronic component 2 are maintained in a non-contact state. Also, by releasing the negative pressure by the negative pressure generation circuit, the negative pressure no longer acts on the suction hole 201c, and the electronic component 2 is released from the pickup collet 200.

[0050] [Operation] In the transfer device 1 as described above, the operation of picking up the electronic component 2 from the supply device 10 by the pickup device 20 and delivering the electronic component 2 to the mounting device 30 will be described below with reference to the flowchart of Fig. 7 and the explanatory diagram of Fig. 8 in addition to Figs. 1 to 6.

[0051] First, the pickup device 20 and the supply device 10 move the pickup collet 200 to the supply position P1 where the push-up pin 24 is located, and oppose the opposing surface 201a of the pickup collet 200 to the push-up pin 24 (step S01). At this time, pressurized gas is supplied to the porous member 201 through the air supply hole 202a, and the gas is blowing out from the opposing surface 201a. Also at this time, there is no exhaust from the exhaust hole 202b, and there is no suction from the opening 201d.

[0052] On the other hand, the supply device 10 moves the supply stage 12 and positions the electronic component 2 to be picked up at the supply position P1 as shown in FIG. 8(A) (step S02). After that, the pickup collet 200 from which the gas G is supplied from the opposing surface 201a descends together with the pickup head 21 and approaches the electronic component 2. When the pickup collet 200 approaches the electronic component 2, the gas G on the opposing surface 201a is sandwiched between the opposing surface 201a and the electronic component 2 to form a gas layer. The sandwiched gas layer at this time is considered to be a viscous flow layer. Then, as shown in FIG. 8(B), the pickup collet 200 stops descending with respect to the electronic component 2 due to the gas layer that is no longer compressed (step S03).

[0053] Here, when the pickup collet 200 contacts the electronic component 2, the pickup collet 200 itself stops. However, since the pickup collet 200 is elastically supported by the pickup head 21, even if the pickup collet 200 stops, the pickup head 21 continues to descend, and the pickup head 21 slides relative to the pickup collet 200. When this slide is detected by the sensor, the pickup control unit 53 recognizes that the pickup collet 200 has contacted the electronic component 2 and stops the descent of the pickup head 21. At this time, the pickup collet 200 is not in contact with the electronic component 2. However, since a gas layer is formed between the opposing surface 201a and the electronic component 2, the opposing surface 201a cannot approach the electronic component 2 any further and stops. The height position of the pickup collet 200 at this time becomes the approach position H1. That is, the approach position H1 is not set in advance as a specific stop position.

[0054] In this way, with the pickup collet 200 stopped via the gas layer and the pickup head 21 further stopped, suction by the suction hole 201c is started by exhausting from the exhaust hole 202b (step S04). That is, suction is started in a state where the pickup collet 200 presses the electronic component 2 against the sheet 11 supported by the backup body 241 via the gas layer, that is, in a state where the sheet 11 and the electronic component 2 are sandwiched between the backup body 241.

[0055] In this state, as shown in FIG. 8(C), as the pickup collet 200 rises, the pushing-up by the upward movement of the push-up pin 24 starts synchronously therewith (step S05). As a result, the sheet 11 starts to peel off from the back surface of the electronic component 2. Further, as shown in FIG. 8(D), the push-up pin 24 stops when it rises by a predetermined amount set in advance. Then, by the further rising pickup collet 200, the electronic component 2 sucked by negative pressure while maintaining a gap by a gas layer on the pickup collet 200 is picked up by being peeled off from the sheet 11 (step S06). Although the height position at which the electronic component 2 is completely peeled off is the peeling position H2 in this way, it is not set in advance as a specific stop position.

[0056] The pickup device 20 reverses the pickup collet 200 by the direction changing unit 23 (step S07). That is, the direction of the pickup collet 200 is rotated 180° in the vertical direction, and the opposing surface 201a of the pickup collet 200 is directed upward. Here, the reversing operation in step S07 is performed immediately after picking up the electronic component 2, but it may be performed at any point between the supply position P1 and the delivery position P2.

[0057] The pickup device 20 moves the picked-up electronic component 2 to the delivery position P2 by the collet moving mechanism 22 (step S08). At the delivery position P2, the bonding head 31 of the mounting device 30 is waiting and faces the opposing surface 201a of the pickup collet 200 through the electronic component 2.

[0058] Lower the bonding head 31 toward the pickup collet 200 positioned at the handover position P2. After holding the electronic component 2 with the bonding head 31, the pickup collet 200 releases the negative pressure, thereby handing over the electronic component 2 from the pickup collet 200 to the bonding head 31 (step S09). After that, the bonding head 31 rises so as to be separated from the pickup collet 200 and moves to the mounting position P3 to mount the electronic component 2 on the substrate.

[0059] [Effect] (1) The pickup collet 200 of the present embodiment is a pickup collet 200 that sucks and holds the electronic component 2 for pickup. It has a porous member 201 that has air permeability and supplies the gas supplied therein to the electronic component 2 through the pores of the facing surface 201a facing the electronic component 2. The porous member 201 is provided with a suction hole 201c having an opening 201d that sucks the electronic component 2 to the facing surface 201a by negative pressure on the facing surface 201a.

[0060] Further, the pickup device 20 of the present embodiment has a collet moving mechanism 22 that moves the pickup collet 200 close to a position where the electronic component 2 on the sheet 11 can be sucked and held, and peels off and transfers the sucked and held electronic component 2 from the sheet 11.

[0061] Furthermore, the mounting device 100 of the present embodiment is provided so as to be relatively movable with respect to the pickup collet 200, and has a bonding head 31 that receives the electronic component 2 from the tip of the pickup collet 200, and a mounting unit that transfers and mounts the electronic component 2 held by the bonding head 31 on the substrate.

[0062] Therefore, when picking up the electronic component 2 by suction from the suction holes 201c, the layer of gas discharged from the pores of the porous member 201 can keep the electronic component 2 and the facing surface 201a non-contact, and damage to the electronic component 2 can be suppressed. Also, even when the electronic component 2 is being transferred, while reducing the possibility of damage to the electronic component 2 by contacting the facing surface 201a, the electronic component 2 can be held to prevent dropping or the like.

[0063] Here, consider the case where the electronic component 2 is held by a Bernoulli chuck that generates a suction force by utilizing the negative pressure generated by a large amount of air flow by flowing the gas discharged from this space between the electronic component 2 and the surface facing the electronic component 2. In this case, the suction force is very weak, and even if the electronic component 2 can be held at a certain distance from the collet, the suction force required to peel off the electronic component 2 adhered to the sheet 11 cannot be obtained. Also, in order to obtain the Bernoulli effect, it is necessary to make the gas flow rate per unit time very large, so it is very difficult to adjust the suction force for holding while maintaining non-contact. Furthermore, there is a risk of generating particles due to a large amount of gas being blown out around the pickup location.

[0064] Also, when gas ejection holes of the same size as the suction holes instead of pores like the porous member 201 are provided on the surface of the collet facing the electronic component 2, and gas is injected toward the electronic component 2 to float the electronic component 2, and the electronic component 2 is attracted by the suction holes against the floating force of the electronic component 2 due to this injection, similarly to the above, it is very difficult to adjust the suction force for holding while maintaining non-contact (floating), and there is a risk of generating particles due to a large amount of gas being blown out around the pickup location.

[0065] In contrast, in the present embodiment, the flow rate of the gas blown out in a planar manner from the entire surface of the opposing surface 201a through the fine holes in the opposing surface 201a is extremely small. Therefore, there is no risk of generating particles. The blowing from the opposing surface 201a does not actively float the electronic component 2, but forms a layer of viscous-flow gas when the opposing surface 201a and the electronic component 2 are close to each other. Therefore, keeping the opposing surface 201a and the electronic component 2 in a non-contact state is easier as the suction force is stronger. Even when the suction force due to the negative pressure from the suction hole 201c is sufficient to peel the electronic component 2 from the sheet 11, the gas layer between the opposing surface 201a and the electronic component 2 can prevent contact. Thus, obtaining a strong suction force and adjusting the suction force are both easy.

[0066] As a result of the study by the inventor of the present application, for example, under the following conditions, it was found that the pickup collet 200 could maintain non-contact with the electronic component 2 while performing suction and holding. First, as the porous member 201, a member having a ventilation rate such that, for example, when the supply pressure is 0.3 MPa, the flow rate of the gas flowing out from the porous member 201 is about 0.7 L / min was used. The pressure of the gas (nitrogen gas) supplied to the porous member 201 may be in the range of about 0.1 to 0.7 MPa. At this time, the flow rate of the gas flowing through the porous member 201 is in the range of about 0.3 to 1.5 L / min, and it was ensured that non-contact between the pickup collet 200 and the electronic component 2 could be maintained. Also, as the suction pressure, in the range of -10 to -90 kPa, it was ensured that the electronic component 2 could be picked up from the sheet 11. At this time, the pressure in the gas layer between the electronic component 2 and the opposing surface 201a was obtained as 0.1 to 0.5 MPa.

[0067] As a comparative example, a collet made of stainless steel (SUS) having the same size as the above-described pickup collet 200 and having no pores as a material was used. When 50 holes with a diameter of 0.3 mm were arranged in a matrix in this collet and the gas supplied at a pressure of 0.02 MPa was ejected from the holes, the suction pressure was -50 kPa, and the pressure between the electronic component 2 and the opposing surface 201a that could maintain non-contact was extremely small, 0.025 to 0.035 MPa, and its width was also narrow. That is, unlike the pores of the porous member 201, in the ejection of gas through a plurality of holes formed in the collet, even with a slight pressing force or suction force, or even if the slight pressing force or suction force changes, it was found that the electronic component 2 easily comes into contact with the opposing surface. Furthermore, when the supply pressure was increased to increase the pressure between the electronic component 2 and the opposing surface 201a, the electronic component 2 easily fell off.

[0068] (2) In a state where the opposing surface 201a faces the electronic component 2, the opening 201d is provided within the projection plane of the electronic component 2, that is, at a position overlapping the electronic component 2. In the present embodiment, one opening 201d communicating with the suction hole 201c is provided at the center of the opposing surface 201a. For this reason, there is no inflow of gas from the outer edge of the electronic component 2, and a strong suction force can be ensured by utilizing atmospheric pressure. Note that there may be a plurality of openings 201d, and the position thereof is not limited to the center as long as the opposing surface 201a overlaps the electronic component 2.

[0069] [Modification Example] The present invention is not limited to the above-described embodiment. With the basic configuration being the same as the above-described embodiment, the following modification examples are also applicable. (1) In the case of the pickup collet 200 as described above, the held electronic component 2 easily moves within the horizontal opposing surface 201a. In particular, when the acceleration and deceleration of the operation are increased during the inversion, transfer, delivery, etc. of the electronic component 2, there is a possibility of positional deviation. Furthermore, there is also a risk of falling off without being able to maintain the holding.

[0070] To address this, a guide portion for restricting the movement of the electronic component 2 may be provided along the outer edge of the opposing surface 201a. For example, as shown in FIGS. 9, 10, and 11, the guide portion 201e is a rectangular plate-like body provided on the four side surfaces of the base 202. Each guide portion 201e has a protruding portion that protrudes more than the opposing surface 201a. The distance (protrusion amount) by which the guide portion 201e protrudes from the opposing surface 201a only needs to be such that the movement of the electronic component 2 held on the opposing surface 201a via the gas layer can be restricted, and it is sufficient if it is at least more than the extent to which the electronic component 2 held via the gas layer is applied to the opposing surface 201a. However, when the protruding portion of this guide portion 201e protrudes beyond the electronic component 2 held on the opposing surface 201a via the gas layer, it is necessary to consider not contacting the electronic components 2 around the electronic component 2 to be picked up when picking up from the wafer. Therefore, the distance by which the protruding portion of the guide portion 201e protrudes from the opposing surface 201a is preferably within the side surface of the electronic component 2 held on the opposing surface 201a via the gas layer. However, as will be described later, by controlling the push-up pins 24 during picking up, it is possible to prevent contact with the surrounding electronic components 2 corresponding to various protrusion amounts.

[0071] In such a modification, even if the electronic component 2 moves horizontally on the opposing surface 201a where the electronic component 2 is held non - contact due to the inertial force accompanying the movement of the electronic component 2 during inversion or the like, it is possible to prevent the electronic component 2 from coming off the pickup collet 200. Further, even if the position of the electronic component 2 is displaced within the region surrounded by the guide portion 201e, as long as the suction by the opening 201d is within the projection plane of the electronic component 2, suction holding is possible regardless of the position of the opening 201d.

[0072] However, if the electronic component 2 comes into contact with the guide portion 201e, the electronic component 2 may be affected. Therefore, by causing the guide portion 201e to eject gas so as to be non - contact with the electronic component 2, it is possible to prevent deviation from the pickup collet 200 and eliminate the occurrence of damage to the electronic component 2 caused by contact with the guide portion 201e.

[0073] For example, as shown in FIG. 12, a guide porous member 201f is provided at a position facing the side surface of the electronic component 2 of the protruding portion in the guide portion 201e. Inside the guide portion 201e, a ventilation path 201g that communicates with the outside and the guide porous member 201f is provided. The ventilation path 201g is connected to a gas supply circuit via a pipe (not shown).

[0074] The guide portion 201e ejects the gas G through the guide porous member 201f. As a result, a layer of the gas G is formed along the side surface of the electronic component 2, so that the displacement and detachment of the electronic component 2 are suppressed, and non-contact with the guide portion 201e can also be maintained for the electronic component 2. Therefore, chipping and cracking of the electronic component 2 can be reduced, and the generation of particles due to contact can also be suppressed. Since the ejection amount of the gas G can be small, the generation of particles due to the air flow can also be suppressed. Furthermore, the displacement and dropping of the electronic component 2 during transfer can be reduced.

[0075] Also, as shown in FIG. 13, even by ejecting the gas G from the ejection port 201h communicating with the ventilation path 201g toward the side surface of the electronic component 2 without providing the guide porous member 201f, it is possible to suppress the displacement and detachment of the electronic component 2 and the contact with the electronic component 2. Also in this case, since it is only necessary to form a layer of the gas G that avoids contact with the electronic component 2, the ejection amount can be small.

[0076] Note that, as described above, when there is a guide portion 201e protruding from the opposing surface 201a, it is necessary to prevent the guide portion 201e from contacting the electronic components 2 around the pickup target on the sheet 11 during pickup. Therefore, it is advisable to push up the electronic components 2 in advance during pickup. That is, as shown in FIG. 14, in order to prevent the guide portion 201e from hitting the surrounding electronic components 2, in accordance with the amount of protrusion of the guide portion 201e from the opposing surface 201a, as the pickup collet 200 starts to descend, the push-up pin 24 rises to push up the electronic component 2 that is the pickup target, so as to raise it to a height where the guide portion 201e does not hit the surrounding electronic components 2. After the pickup collet 200 approaches and stops via the gas layer in this state, by starting suction, pickup can be performed as described above.

[0077] Furthermore, the guide portion 201e does not necessarily need to protrude from the opposing surface 201a. For example, as shown in FIG. 15, with the lower end of the guide portion 201e flush with or above the base 202 and the opposing surface 201a, the jet outlet 201h is provided on the lower surface of the guide portion 201e. Then, the gas G is jetted from the jet outlet 201h. In this way, since the guide portion 201e jets the gas G in a direction along the side surface of the electronic component 2, a wall formed by the gas G is formed, so that the displacement and detachment of the electronic component 2 are suppressed. Also, since there is no protruding portion at the position facing the side surface of the electronic component 2, it does not contact the side surface of the electronic component 2 and does not contact other electronic components 2 during pickup.

[0078] Note that, as shown in FIG. 16, the ventilation path 201g may be inclined so that the jet direction of the gas G from the jet outlet 201h becomes a direction toward the side surface of the electronic component 2. In this case, since the gas G can be applied more strongly to the side surface of the electronic component 2, the jet amount of the gas G can be suppressed.

[0079] The guide portion 201e as described above may be provided along the outer edge of the opposing surface 201a so that the movement of the electronic component 2 can be restricted. Therefore, it does not have to be provided around the entire circumference of the opposing surface 201a, and a part thereof may be sufficient. For example, as shown in FIG. 17(A), along the corner, or as shown in FIG. 17(B), by arranging the guide portion 201e across the corner, the gas G is ejected in the direction of sandwiching from four directions, so that the positioning effect can be enhanced. (2) The number and size of the suction holes 201c and the openings 201d are not limited to the above-described aspects. On the opposing surface 201a of the porous member 201, the balance between the area where the electronic component 2 is supported by the gas layer and the total area of the openings 201d can realize the maintenance of the suction holding state and the non-contact state.

[0080] (3) The positions and shapes of the suction holes 201c and the openings 201d are also not limited to the above-described aspects. For example, the shape of the opening 201d may be circular or rectangular as described above, or may be other shapes such as an ellipse, a polygon, a rounded polygon, a star shape, etc.

[0081] (4) By providing the pickup collet 200 in a replaceable manner, it can be replaced according to the shape and size of the electronic component 2. As a configuration that enables such replacement, a structure that can be suction-held by a magnet is simple, and the replacement work is also easy. However, any configuration that enables the pickup collet 200 to be replaced is acceptable. For example, suction holding using negative pressure or a mechanically holding structure may be used.

[0082] [Other Embodiments] The present invention is not limited to the above-described embodiments, and also includes other embodiments shown below. Further, the present invention includes forms in which all or any combination of the above-described embodiments and the following other embodiments are combined. Furthermore, various omissions, replacements, and changes can be made without departing from the scope of the invention, and such modifications are also included in the present invention. [Explanation of Reference Numerals]

[0083] 1 Transfer device 2 Electronic component 10 Supply device 11 Sheet 12 Supply stage 13 Stage moving mechanism 20 Pickup device 21 Pickup head 22 Collet moving mechanism 23 Direction changing part 24 Pushing pin 30 Mounting device 31 Bonding head 31a Nozzle 32 Head moving mechanism 50 Control device 51 Supply device control unit 52 Pushing pin control unit 53 Pickup control unit 54 Bonding head control unit 56 Substrate stage control unit 57 Memory unit 60 Substrate stage 61 Stage moving mechanism 100 Mounting device 200 Pickup collet 201 Porous member 201a Opposing surface 201b Back surface 201c Suction hole 201d Opening 201e Guide part 201f Porous member for guiding 201g Ventilation path 201h Jet outlet 202 Base 202a Air supply hole 202b Exhaust hole 202c Mounting hole 221 Slide mechanism 221a Support frame 221b Rail 221c Slider 222 Lifting mechanism 222a Arm 222b Attachment / detachment part 222c Pin 241 Backup body 321 Slide mechanism 321a Support frame 321b Rail 321c Slider 322 Lifting mechanism

Claims

1. A pickup collet for sucking and holding an electronic component for pickup, comprising: a porous member having air permeability and ejecting the gas supplied therein in a planar manner through pores on the opposing surface facing the electronic component; the porous member is provided with suction holes having openings on the opposing surface and sucking the electronic component by negative pressure; a guide portion for restricting the movement of the electronic component is provided along the outer edge of the opposing surface; the guide portion ejects gas toward the side surface of the electronic component in parallel with the opposing surface from a position facing the side surface of the electronic component while sucking and holding the electronic component. The pickup collet is characterized by this.

2. The pickup collet according to claim 1, wherein the guide portion ejects gas through a porous member for guiding.

3. A pickup device for picking up an electronic component from a sheet to which the electronic component is attached, comprising: the pickup collet according to claim 1 or 2; a collet moving mechanism for approaching the pickup collet to a position where the electronic component on the sheet can be sucked and held, sucking and holding the electronic component, and peeling it off from the sheet for transfer; The pickup device is characterized by having the above.

4. The pickup device according to claim 3, further comprising: a bonding head provided to be movable relative to the pickup collet and receiving the electronic component from the pickup collet; a mounting portion for transferring and mounting the electronic component held by the bonding head onto a substrate; The mounting device is characterized by having the above.

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