Expansion device

Abstract

This expansion device (100) comprises: an expansion unit (6) for expanding a sheet member (220) in a first position (P1); a movement mechanism (62) for horizontally moving the expansion unit from the first position to a second position (P2) with the sheet member being expanded by the expansion unit; and a heat shrink unit (10) for heating and shrinking, in the second position, slack in a portion (220b) of the sheet member around a wafer.

Description

Technical Field

[0001] The present invention relates to an expanding device, and more particularly to an expanding device for expanding a sheet member to which a wafer and a ring-shaped member are attached.

Background Art

[0002] Conventionally, an expanding device for expanding a sheet member to which a wafer and a ring-shaped member are attached is known. Such an expanding device is disclosed, for example, in Japanese Patent No. 4288392.

[0003] Japanese Patent No. 4288392 discloses an expanding device for expanding an adhesive sheet (sheet member) to which a wafer and a ring-shaped frame (ring-shaped member) surrounding the wafer are attached. This expanding device includes an expansion and contraction table for expanding the adhesive sheet and a frame chuck. In this expanding device, with the frame fixed by the frame chuck, the portion of the adhesive sheet to which the wafer is attached is lifted upward by the expansion and contraction table, so that the adhesive sheet is stretched and the adhesive sheet is expanded. Further, this expanding device further includes an injection pipe for heat-shrinking (heating and shrinking) the slack of the adhesive sheet generated in the adhesive sheet due to the expansion. In this expanding device, hot air is injected from the injection pipe into the slack of the adhesive sheet to heat-shrink the slack of the adhesive sheet. Also, in this expanding device, the expansion of the adhesive sheet and the heat-shrinking of the adhesive sheet are performed at the same position.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the expanding device described in the above-mentioned Patent Publication No. 4288392, the expansion of the adhesive sheet and the heat shrinking of the adhesive sheet are performed in the same position, which causes the problem that it is difficult to easily secure space for arranging structures related to the heat shrinking, such as an injection pipe.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide an expansion device that can easily secure space for arranging a structure related to heat shrinking, even when expanding a sheet member and heat shrinking it. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention 1st The expanding device according to this aspect includes an expanding section that expands, at a first position, a sheet member of a wafer ring structure including a wafer, a ring-shaped member surrounding the wafer, and a heat-shrinkable sheet member having elasticity to which the wafer and the ring-shaped member are attached; a moving mechanism that horizontally moves the expanding section from the first position to a second position horizontally spaced from the first position in a plan view in a state in which the sheet member is expanded by the expanding section; and a heat shrink section that heats and shrinks, at the second position, slack in a portion of the sheet member around the wafer that occurs due to expansion by the expanding section. It is arranged at the 1st position, and when expanding the sheet member by the expanding part, it further includes a suction part that sucks and removes the scattered matter generated from the wafer ring structure due to the expansion of the sheet member. The suction part includes an annular suction part main body and an annular suction port provided on the suction part main body and facing the outer edge of the wafer when sucking the scattered matter. . In order to achieve the above object, an expandable device according to a second aspect of the present invention includes a wafer, a ring-shaped member surrounding the wafer, and a heat-shrinkable sheet member having elasticity to which the wafer and the ring-shaped member are attached. An expandable part that expands the sheet member of the wafer ring structure at the 1st position, a moving mechanism that moves the expandable part horizontally from the 1st position to a 2nd position horizontally spaced from the 1st position in a plan view in a state where the sheet member is expanded by the expandable part, and a heat shrinkage part that heats and shrinks the slack of the portion around the wafer of the sheet member generated by the expansion by the expandable part at the 2nd position. It is arranged at the 1st position, and when expanding the sheet member by the expanding part, it further includes a suction part that sucks and removes the scattered matter generated from the wafer ring structure due to the expansion of the sheet member. The suction part is configured to be movable in the vertical direction between a lower position for sucking the scattered matter and an upper position for not sucking the scattered matter.

[0008] This invention 1st and 2ndIn the expanding device according to the above situation, as described above, an expandable heat-shrinkable sheet member to which a wafer and a ring-shaped member are attached is expanded at a first position by an expanding portion, and in a state where the sheet member is expanded by the expanding portion, a moving mechanism that horizontally moves the expanding portion to a second position that is horizontally separated from the first position in a plan view, and a heat shrinkage portion that heats and shrinks the slack of the peripheral portion of the wafer of the sheet member at the second position are provided. Thereby, since the expansion of the sheet member can be performed at the first position and the heat shrinkage of the sheet member can be performed at the second position that is horizontally separated from the first position, the expansion of the sheet member and the heat shrinkage of the sheet member can be performed at separate positions. As a result, even when expanding and heat shrinking the sheet member, it is possible to easily secure a space for arranging the structure related to the heat shrinkage of the sheet member at the second position. Further, at the second position, since the structure necessary for achieving high quality can be easily arranged, it is possible to easily achieve heat shrinkage of a higher quality sheet member. Also, in the expanding device according to the first and second aspects, when disposed at the first position and expanding the sheet member by the expanding portion, it further includes a suction portion that sucks and removes scattered matter generated from the wafering structure due to the expansion of the sheet member. With this configuration, since the scattered matter can be sucked and removed, it is possible to suppress the occurrence of quality defects caused by the scattered matter flying onto the wafer. Also, different from the case of blowing (blowing away) and removing the scattered matter within the expanding device, it is possible to suppress the scattered matter from remaining within the expanding device. Therefore, it is possible to suppress the scattered matter that remains within the expanding device from re-scattering and flying onto the wafer, resulting in the occurrence of quality defects. Further, as described above, since the expansion of the sheet member and the heat shrinkage of the sheet member are performed at separate positions, it is possible to secure a space for arranging the suction portion as a removal structure during expansion. Also, in the expanding device according to the first aspect, the suction portion includes an annular suction portion main body and an annular suction port provided in the suction portion main body and facing the outer edge of the wafer when sucking the scattered matter. With this configuration, since the suction port of the suction portion is provided so as to face the outer edge of the wafer where scattered matter is likely to occur, the suction portion can effectively suck the scattered matter. Also, in the expanding device according to the second aspect, the annular suction port is constituted by a plurality of suction ports arranged annularly with a predetermined interval therebetween. With this configuration, compared to the case where the annular suction port is constituted by a single suction port, the suction force for each suction port can be increased. Therefore, the suction portion can more effectively suck the scattered matter.

[0009] Further, by performing the expansion of the sheet member and the heat shrinkage of the sheet member at separate positions, when there is a cooling structure for cooling the sheet member during expansion and a removal structure for removing scattered matter generated during expansion, etc., at the first position, it is also possible to secure a space for arranging the cooling structure and the removal structure, etc. Thereby, when there is a cooling structure and a removal structure, etc., at the first position, since the cooling structure and the removal structure, etc. necessary for achieving high quality can be arranged, it is possible to achieve expansion of a higher quality sheet member.

[0010] The above First and Second In the expanding device according to the situation, preferably, the heat shrinkage part is arranged above the expanding part moved by the moving mechanism at the second position. With such a configuration, at the second position, the heat shrinkage part can be arranged above the expanding part where it is relatively easy to secure space. As a result, at the second position, the structure necessary for achieving high quality can be arranged more easily, so that heat shrinkage of the high-quality sheet member can be achieved more easily.

[0011] In this case, preferably, the heat shrinkage part is configured to be movable in the vertical direction between an upper position where the sheet member is not heated and a lower position where the sheet member is heated at the second position. With such a configuration, by moving the heat shrinkage part to the upper position, the heat shrinkage part can be retracted so as not to interfere with the movement of the expanding part, and thus the movement of the expanding part can be easily performed. Also, by moving the heat shrinkage part to the lower position, after the expanding part moves to the second position, heat shrinkage of the sheet member can be easily performed.

[0013] In the expanding device according to the second aspect , preferably, the suction part includes an annular suction part main body and an annular suction port provided on the suction part main body and facing the outer edge of the wafer when sucking scattered matter. With such a configuration, since the suction port of the suction part is provided so as to face the outer edge of the wafer where scattered matter is likely to occur, the suction part can effectively suck the scattered matter.

[0014] The above In the expanding device according to the first and second aspects In the configuration where the suction part includes an annular suction port, preferably, the annular suction port is composed of a plurality of suction ports arranged annularly at a predetermined interval. With such a configuration, compared with the case where the annular suction port is composed of a single suction port, the suction force of each suction port can be increased, so that the suction part can more effectively suck the scattered matter.

[0015] The above The expanding device according to the first aspect In this case, preferably, the suction part is configured to be movable in the vertical direction between a lower position for sucking scattered matter and an upper position for not sucking scattered matter. With this configuration, by moving the suction part to the upper position, the suction part can be retracted so as not to interfere with the movement of the expand part, and thus the movement of the expand part can be easily performed. Further, by moving the suction part to the lower position, scattered matter can be easily sucked when the sheet member is expanded.

[0016] The above First and Second In the expand device according to the above aspect, preferably, a cooling part for cooling the sheet member is further provided, which is arranged at the first position and expands the sheet member by the expand part. With this configuration, the sheet member can be cooled and hardened during expansion, so that it can be suppressed that only the outer peripheral part of the sheet member extends because the sheet member is soft, and the wafer cannot be divided without generating sufficient dividing force on the wafer. Further, when the wafer has a soft thin film layer (such as a Low-K film and a DAF (Die Attached Film)), since the film layer is soft, even if the silicon part of the wafer is divided by expansion, the film layer may remain cracked. However, with the above configuration, the film layer can be cooled and hardened during expansion, so that it can be suppressed that the film layer remains cracked. Further, as described above, since the expansion of the sheet member and the heat shrinkage of the sheet member are performed at separate positions, a space for arranging the cooling part as a cooling structure during expansion can be secured.

[0017] In this case, preferably, the moving mechanism is configured to horizontally move the expand part from the first position to the second position independently of the cooling part without moving the cooling part from the first position. With this configuration, compared with the case where the moving mechanism is configured to move the expand part together with the cooling part, the driving force required for the moving mechanism can be reduced. As a result, the moving mechanism can be miniaturized.

[0018] The aboveFirst and Second In the expanding device according to the situation of First and Second , preferably, a housing portion that is disposed at a position different from the first position and the second position in a plan view and houses a plurality of wafer ring structures, and a first position and a second position in a plan view. And a take-out part that is disposed at a position different from the position and takes out the wafer ring structure from the housing part, and the direction in which the take-out part takes out the wafer ring structure from the housing part is substantially parallel to the direction in which the moving mechanism moves the expanding part. With this configuration, unlike the case where the direction in which the take-out part takes out the wafer ring structure from the housing part is substantially orthogonal to the direction in which the moving mechanism moves the expanding part, the direction in which the take-out part takes out the wafer ring structure from the housing part and the moving mechanism It is possible to suppress the increase in the size of the expanding device in a direction substantially orthogonal to the direction in which the expanding part is moved.

Effect of the Invention

[0019] According to the present invention, as described above, even when the sheet member is expanded and heat-shrunk, it is possible to provide an expanding device capable of easily securing a space for arranging a structure related to heat-shrinking of the sheet member.

Brief Description of the Drawings

[0020]

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DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

[0022] With reference to FIGS. 1 to 21, the configuration of an expand device 100 according to an embodiment of the present invention will be described.

[0023] (Configuration of Expand Device) As shown in FIGS. 1 and 2, the expand device 100 is configured to divide a wafer 210 to form a plurality of semiconductor chips. Further, the expand device 100 is configured to form a sufficient gap between the plurality of semiconductor chips. Here, a modified layer is previously formed on the wafer 210 by irradiating a laser having a wavelength that is transmissive to the wafer 210 along a dividing line (street). The modified layer indicates cracks, voids, etc. formed inside the wafer 210 by the laser. In this way, the method of forming a modified layer on the wafer 210 is called stealth dicing.

[0024] Therefore, in the expand device 100, by expanding the sheet member 220, the wafer 210 is divided along the modified layer. Further, in the expand device 100, by expanding the sheet member 220, the gap between the plurality of semiconductor chips formed by division is widened.

[0025] The expand device 100 includes a base plate 1, a cassette unit 2, a lift-up hand unit 3, a suction hand unit 4, a base 5, an expand unit 6, a cold air supply unit 7, a cooling unit 8, a debris cleaner 9, a heat shrink unit 10, and an ultraviolet irradiation unit 11. Note that the cassette unit 2 is an example of the "accommodation unit" in the claims. Further, the lift-up hand unit 3 is an example of the "take-out unit" in the claims. Further, the cold air supply unit 7 and the cooling unit 8 are examples of the "cooling unit" in the claims. Further, the debris cleaner 9 is an example of the "suction unit" in the claims.

[0026] Here, among the horizontal directions, the direction in which the cassette unit 2 and the heat shrinkage unit 10 are arranged is defined as the X direction. Among the X direction, the side of the cassette unit 2 is defined as the X1 direction, and the side of the heat shrinkage unit 10 in the X direction is defined as the X2 direction. Also, among the horizontal directions, the direction orthogonal to the X direction is defined as the Y direction. Among the Y direction, the side of the cassette unit 2 is defined as the Y1 direction, and the direction opposite to the Y1 direction is defined as the Y2 direction. Further, the vertical direction is defined as the Z direction, the upward direction is defined as the Z1 direction, and the downward direction is defined as the Z2 direction.

[0027] 〈Base Plate〉 The base plate 1 is a base on which the cassette unit 2 and the suction hand unit 4 are installed. The base plate 1 has a rectangular shape that is long in the Y direction in plan view.

[0028] 〈Cassette Unit〉 The cassette unit 2 is configured to be able to accommodate a plurality (five) of wafer ring structures 200. Here, as shown in FIGS. 3 and 4, the wafer ring structure 200 has a wafer 210, a sheet member 220, and a ring-shaped member 230.

[0029] The wafer 210 is a circular thin plate made of a crystal of a semiconductor substance that is a material for semiconductor integrated circuits. Inside the wafer 210, as described above, a modified layer in which the inside is modified along the dividing line is formed. That is, the wafer 210 is configured to be dividable along the dividing line. The sheet member 220 is a stretchable adhesive tape. An adhesive layer is provided on the upper surface 220a of the sheet member 220. The wafer 210 is attached to the adhesive layer of the sheet member 220. The ring-shaped member 230 is a ring-shaped metal frame in plan view. Notches 240 and 250 are formed on the outer surface 230a of the ring-shaped member 230. The ring-shaped member 230 is attached to the adhesive layer of the sheet member 220 while surrounding the wafer 210.

[0030] As shown in FIGS. 1 and 2, the cassette unit 2 includes a Z-direction movement mechanism 21, a wafer cassette 22, and a pair of mounting portions 23. The Z-direction movement mechanism 21 is configured to move the wafer cassette 22 in the Z direction using a motor 21a as a drive source. Further, the Z-direction movement mechanism 21 has a mounting table 21b that supports the wafer cassette 22 from below. The wafer cassette 22 is manually supplied and placed on the mounting table 21b. The wafer cassette 22 has a storage space capable of storing a plurality of wafer ring structures 200. A plurality (five) of the pair of mounting portions 23 are arranged inside the wafer cassette 22. A ring-shaped member 230 of the wafer ring structure 200 is placed on the pair of mounting portions 23 from the Z1 direction side. One of the pair of mounting portions 23 protrudes from the inner surface on the X1 direction side of the wafer cassette 22 toward the X2 direction side. The other of the pair of mounting portions 23 protrudes from the inner surface on the X2 direction side of the wafer cassette 22 toward the X1 direction side.

[0031] 〈Lift-up Hand Portion〉 The lift-up hand portion 3 is configured to be able to take out the wafer ring structure 200 from the cassette unit 2. Further, the lift-up hand portion 3 is configured to be able to accommodate the wafer ring structure 200 in the cassette unit 2.

[0032] Specifically, the lift-up hand portion 3 includes a Y-direction movement mechanism 31 and a lift-up hand 32. The Y-direction movement mechanism 31 is configured to move the lift-up hand 32 in the Y direction using a motor 31a as a drive source. The lift-up hand 32 is configured to support the ring-shaped member 230 of the wafer ring structure 200 from the Z2 direction side.

[0033] 〈Suction Hand Portion〉 The suction hand portion 4 is configured to suck the ring-shaped member 230 of the wafer ring structure 200 from the Z1 direction side.

[0034] Specifically, the suction hand part 4 includes an X-direction movement mechanism 41, a Z-direction movement mechanism 42, and a suction hand 43. The X-direction movement mechanism 41 is configured to move the suction hand 43 in the X direction using the motor 41a as a drive source. The Z-direction movement mechanism 42 is configured to move the suction hand 43 in the Z direction using the motor 42a as a drive source. The suction hand 43 is configured to support the ring-shaped member 230 of the wafering structure 200 from the Z1-direction side.

[0035] 〈Base〉 The base 5 is a base on which the expand part 6, the cooling unit 8, and the ultraviolet irradiation part 11 are installed. The base 5 has a rectangular shape that is long in the Y direction in plan view.

[0036] 〈Expand Part〉 The expand part 6 is configured to divide the wafer 210 along the dividing line by expanding the sheet member 220 of the wafering structure 200.

[0037] Specifically, the expand part 6 includes a Z-direction movement mechanism 61, a Y-direction movement mechanism 62, a clamp part 63, and an expand ring 64. The Z-direction movement mechanism 61 is configured to move the clamp part 63 in the Z direction using the motor 61a as a drive source. The Y-direction movement mechanism 62 is configured to move the Z-direction movement mechanism 61, the clamp part 63, and the expand ring 64 in the Y direction using the motor 62a as a drive source. Note that the Y-direction movement mechanism 62 is an example of the "movement mechanism" in the claims.

[0038] The clamp part 63 is configured to grip the ring-shaped member 230 of the wafering structure 200. The clamp part 63 has a lower gripping part 63a and an upper gripping part 63b. The lower gripping part 63a supports the ring-shaped member 230 from the Z2-direction side. The upper gripping part 63b presses the ring-shaped member 230 in the state supported by the lower gripping part 63a from the Z1-direction side. In this way, the ring-shaped member 230 is gripped by the lower gripping part 63a and the upper gripping part 63b.

[0039] The expanding ring 64 is configured to expand the sheet member 220 by supporting the sheet member 220 from the Z2 direction side. The expanding ring 64 has a ring shape in a plan view.

[0040] <Cold air supply section> The cold air supply section 7 is configured to supply cold air to the sheet member 220 from the Z1 direction side when the sheet member 220 is expanded by the expanding section 6.

[0041] Specifically, the cold air supply section 7 has a plurality of nozzles 71. The nozzle 71 has a cold air supply port 71a (see FIG. 5) for discharging the cold air supplied from a cold air supply source (not shown). The nozzle 71 is attached to the debris cleaner 9. The cold air supply source is a cooling device for generating cold air. The cold air supply source supplies, for example, air cooled by a cooling device provided with a heat pump or the like. Such a cold air supply source is installed on the base 5. The cold air supply source and each of the plurality of nozzles 71 are connected by a hose (not shown).

[0042] <Cooling unit> The cooling unit 8 is configured to cool the sheet member 220 from the Z2 direction side when the sheet member 220 is expanded by the expanding section 6.

[0043] Specifically, the cooling unit 8 includes a cooling member 81 having a cooling body 81a and a Peltier element 81b, and a cylinder 82. The cooling body 81a is made of a member having a large heat capacity and a high thermal conductivity. The cooling body 81a is formed of a metal such as aluminum. The Peltier element 81b is configured to cool the cooling body 81a. Note that the cooling body 81a is not limited to aluminum, and other members having a large heat capacity and a high thermal conductivity may be used.

[0044] The cooling unit 8 is configured to be movable in the Z direction by a cylinder 82. Thereby, the cooling unit 8 can move to a position in contact with the seat member 220 and a position spaced apart from the seat member 220.

[0045] 〈Fragment Cleaner〉 The fragment cleaner 9 is configured to suck fragments of the wafer 210 and the like when the seat member 220 is expanded by the expansion part 6.

[0046] As shown in FIG. 5, the fragment cleaner 9 includes a ring-shaped member 91 and a plurality of suction ports 92. The ring-shaped member 91 is a member having a ring shape when viewed from the Z1 direction side. The plurality of suction ports 92 are openings for sucking fragments of the wafer 210 and the like. The plurality of suction ports 92 are formed on the lower surface of the ring-shaped member 91 on the Z2 direction side. Note that the ring-shaped member 91 is an example of the "suction unit main body" in the claims.

[0047] As shown in FIG. 2, the fragment cleaner 9 is configured to be movable in the Z direction by a cylinder (not shown). Thereby, the fragment cleaner 9 can move to a position close to the wafer 210 and a position where the suction hand 43 moving in the X direction can be avoided.

[0048] 〈Heat Shrinkage Part〉 The heat shrinkage part 10 is configured to heat and shrink the seat member 220 expanded by the expansion part 6 while maintaining the gap between the plurality of semiconductor chips.

[0049] As shown in FIG. 1, the heat shrinkage part 10 includes a Z-direction movement mechanism 110, a heating ring 111, an intake ring 112, and an expansion maintenance ring 113. The Z-direction movement mechanism 110 is configured to move the heating ring 111 and the intake ring 112 in the Z direction using the motor 110a as a drive source.

[0050] As shown in FIG. 6, the heating ring 111 has a ring shape in plan view. Further, the heating ring 111 has a sheathed heater for heating the sheet member 220. The intake ring 112 is integrally formed with the heating ring 111. The intake ring 112 has a ring shape in plan view. A plurality of intake ports 112a are formed on the lower surface of the intake ring 112 on the Z2 direction side. The expansion maintaining ring 113 is configured to press the sheet member 220 from the Z1 direction side so that the sheet member 220 near the wafer 210 does not contract due to the heating by the heating ring 111.

[0051] The expansion maintaining ring 113 has a ring shape in plan view. The expansion maintaining ring 113 is configured to be movable in the Z direction by a cylinder (not shown). Thereby, the expansion maintaining ring 113 can move to a position where it presses the sheet member 220 and a position away from the sheet member 220.

[0052] 〈Ultraviolet irradiation unit〉 The ultraviolet irradiation unit 11 is configured to irradiate the sheet member 220 with ultraviolet rays in order to reduce the adhesive force of the adhesive layer of the sheet member 220. Specifically, the ultraviolet irradiation unit 11 has ultraviolet illumination.

[0053] (Controlled configuration of the expand device) As shown in FIG. 7, the expand device 100 includes a first control unit 12, a second control unit 13, a third control unit 14, a fourth control unit 15, a fifth control unit 16, an expand control arithmetic unit 17, a handling control arithmetic unit 18, and a storage unit 19.

[0054] The first control unit 12 is configured to control the heat shrinkage unit 10. The first control unit 12 includes a CPU (Central Processing Unit) and a storage unit having a ROM (Read Only Memory) and a RAM (Random Access Memory). Note that the first control unit 12 may include an HDD (Hard Disk Drive) or the like in which information stored even after voltage cutoff is retained as the storage unit. Also, the HDD may be provided in common for the first control unit 12, the second control unit 13, the third control unit 14, the fourth control unit 15, and the fifth control unit 16.

[0055] The second control unit 13 is configured to control the cold air supply unit 7, the cooling unit 8, and the debris cleaner 9. The second control unit 13 includes a CPU and a storage unit having a ROM and a RAM. The third control unit 14 is configured to control the expand unit 6. The third control unit 14 includes a CPU and a storage unit having a ROM and a RAM. Note that the second control unit 13 and the third control unit 14 may include an HDD or the like in which information stored even after voltage cutoff is retained as the storage unit.

[0056] The fourth control unit 15 is configured to control the cassette unit 2 and the lift-up hand unit 3. The fourth control unit 15 includes a CPU and a storage unit having a ROM and a RAM. The fifth control unit 16 is configured to control the suction hand unit 4. The fifth control unit 16 includes a CPU and a storage unit having a ROM and a RAM. Note that the fourth control unit 15 and the fifth control unit 16 may include an HDD or the like in which information stored even after voltage cutoff is retained as the storage unit.

[0057] The expand control arithmetic unit 17 is configured to perform arithmetic operations related to the expand process of the sheet member 220 based on the processing results of the first control unit 12, the second control unit 13, and the third control unit 14. The expand control arithmetic unit 17 includes a CPU and a storage unit having a ROM and a RAM.

[0058] The handling control arithmetic unit 18 is configured to perform an operation related to the movement process of the wafer ring structure 200 based on the processing results of the fourth control unit 15 and the fifth control unit 16. The handling control arithmetic unit 18 includes a CPU and a storage unit having a ROM, a RAM, and the like.

[0059] The storage unit 19 stores a program for operating the expandable device 100. The storage unit 19 includes a ROM, a RAM, and the like.

[0060] (Semiconductor chip manufacturing process by expandable device) The overall operation of the expandable device 100 will be described below.

[0061] In step S1, the wafer ring structure 200 is taken out from the cassette unit 2. That is, after the wafer ring structure 200 accommodated in the cassette unit 2 is supported by the lift-up hand 32, the lift-up hand 32 is moved to the Y2 direction side by the Y-direction movement mechanism 31, and the wafer ring structure 200 is taken out from the cassette unit 2. In step S2, the wafer ring structure 200 is transferred to the expandable unit 6 by the suction hand 43. That is, the wafer ring structure 200 taken out from the cassette unit 2 is moved to the X2 direction side by the X-direction movement mechanism 41 while being adsorbed by the suction hand 43. Then, the wafer ring structure 200 moved to the X2 direction side is transferred from the suction hand 43 to the clamp unit 63 and then gripped by the clamp unit 63.

[0062] In step S3, the sheet member 220 is expanded by the expandable portion 6. At this time, the sheet member 220 of the wafer ring structure 200 held by the clamp portion 63 is cooled by the cooling unit 8. Also, if necessary, the sheet member 220 is cooled by the cold air supply unit 7. The wafer ring structure 200 cooled to a predetermined temperature descends by the Z-direction movement mechanism 61 while being held by the clamp portion 63. Then, as the sheet member 220 is expanded by the expandable ring 64, the wafer 210 is divided along the dividing line. At this time, the wafer 210 is divided while the debris is sucked by the debris cleaner 9.

[0063] In step S4, while maintaining the expanded state of the sheet member 220, the expandable portion 6 is moved to the Z2-direction side of the heat shrinkable portion 10. That is, after the wafer 210 is divided, the wafer ring structure 200 with the sheet member 220 in the expanded state is moved in the Y1 direction by the Y-direction movement mechanism 62. In step S5, the heat shrinkable portion 10 heats and shrinks the sheet member 220. At this time, the wafer ring structure 200 moved in the Y1 direction is heated by the heating ring 111 while being sandwiched between the expansion maintaining ring 113 and the expandable ring 64. At this time, intake is performed by the intake ring 112 and ultraviolet rays are irradiated by the ultraviolet irradiation unit 11.

[0064] In step S6, the expandable part 6 is returned to its original position. That is, the wafer ring structure 200 with the sheet member 220 contracted is moved to the Y2 direction side by the Y-direction moving mechanism 31. In step S7, with the wafer ring structure 200 transferred from the expandable part 6 to the lift-up hand part 3 by the suction hand 43, it is moved to the X1 direction side by the X-direction moving mechanism 41 and delivered to the lift-up hand 32. In step S8, the wafer ring structure 200 is accommodated in the cassette part 2. Then, the wafer ring structure 200 supported by the lift-up hand 32 is moved to the Y1 direction side by the Y-direction moving mechanism 31, and the wafer ring structure 200 is accommodated in the cassette part 2. Thus, the processing performed on one wafer ring structure 200 is completed.

[0065] (Configuration related to expansion and heat shrinkage) Referring to FIGS. 1 and 9 to 14, the configuration related to expansion and heat shrinkage will be described in detail.

[0066] Here, in the present embodiment, as shown in FIGS. 1 and 9 to 14, the expandable part 6 is configured to expand the heat-shrinkable sheet member 220 having elasticity at the first position P1. Further, the Y-direction moving mechanism 62 is configured to move the Z-direction moving mechanism 61, the clamp part 63, and the expandable ring 64 of the expandable part 6 in the horizontal direction (Y1 direction) from the first position P1 to the second position P2 spaced apart from the first position P1 in the horizontal direction (Y1 direction) in plan view with the sheet member 220 expanded by the expandable part 6. Further, the heat shrinkage part 10 is configured to heat and shrink (heat-shrink) the slack of the peripheral part 220b of the wafer 210 of the sheet member 220 generated by the expansion by the expandable part 6 at the second position P2.

[0067] 〈Configuration related to expansion〉 As shown in FIGS. 9 to 11, when expanding the sheet member 220, the expanding portion 6 is configured to grip the ring-shaped member 230 in the vertical direction (Z direction) by the clamping portion 63. Specifically, the upper gripping portion 63b of the clamping portion 63 is constituted by a plurality (four) of slide moving bodies 63ba arranged so as to surround the wafer ring structure 200. When gripping the ring-shaped member 230, the plurality of slide moving bodies 63ba are configured to slide horizontally toward the wafer 210 side. Further, the lower gripping portion 63a of the clamping portion 63 is configured to rise toward the Z1 direction side toward the upper gripping portion 63b (the plurality of slide moving bodies 63ba) that has slid toward the wafer 210 side by the driving force of a cylinder such as an air cylinder. Thereby, the ring-shaped member 230 is gripped and fixed between the upper gripping portion 63b and the lower gripping portion 63a of the clamping portion 63.

[0068] Further, the clamping portion 63 is configured to descend toward the Z2 direction side toward the expanding ring 64 by the driving force of the motor 61a of the Z direction moving mechanism 61 in a state where the ring-shaped member 230 is gripped between the upper gripping portion 63b and the lower gripping portion 63a. Thereby, the sheet member 220 is pressed against the expanding ring 64 and the sheet member 220 is expanded. The expanding ring 64 is disposed on the Z2 direction side with respect to the sheet member 220. Further, the expanding ring 64 is formed in a circular ring shape coaxially with the ring-shaped member 230 so as to surround the wafer 210. The diameter of the expanding ring 64 is larger than the diameter of the wafer 210 and smaller than the diameter (inner diameter) of the ring-shaped member 230. That is, the expanding ring 64 is disposed between the wafer 210 and the ring-shaped member 230 in the horizontal direction.

[0069] Also, in the present embodiment, at the first position P1 which is the expand position, a debris cleaner 9 is disposed on the Z1 direction side with respect to the wafer ring structure 200 to suck and remove the flying objects generated from the wafer ring structure 200 due to the expansion of the sheet member 220. The flying objects are, for example, fragments of the wafer 210. Since the fragments such as the wafer 210 are small in the vicinity of the outer edge 210a (see FIG. 12) of the wafer 210, the position becomes unstable during the expansion of the sheet member 220 and is likely to become flying objects. Further, when there is a die attach film between the wafer 210 and the sheet member 220, the die attach film may also become flying objects. The debris cleaner 9 is configured to suck and remove the flying objects by the negative pressure supplied from the negative pressure generator.

[0070] Also, in the present embodiment, as shown in FIGS. 5 and 12, the suction port 92 of the debris cleaner 9 is formed in a circular ring shape so as to face the outer edge 210a of the circular ring-shaped wafer 210 when sucking the flying objects (such as fragments of the wafer 210 and fragments of the die attach film). Specifically, the circular ring-shaped suction port 92 is constituted by a plurality of suction ports 92 arranged in a circular ring shape at a predetermined interval. The debris cleaner 9 is configured to suck the flying objects in a direction away from the center of the wafer 210 by the circular ring-shaped suction port 92.

[0071] Also, in the present embodiment, as shown in FIGS. 9 to 11, the debris cleaner 9 is configured to be movable in the vertical direction (Z direction) between a lower position where debris is sucked and an upper position where debris is not sucked at the first position P1 which is the expand position, by the driving force of a cylinder such as an air cylinder. The lower position is a position near the wafer 210. Also, the upper position is a retracted position where the adsorption hand 43 moving in the X direction can be avoided. The debris cleaner 9 is configured to descend to the Z2 direction side from the upper position to the lower position when expanding the sheet member 220. Also, the debris cleaner 9 starts the suction operation before pressing the sheet member 220 against the expand ring 64, and is configured to continue the suction operation until at least the pressing of the sheet member 220 against the expand ring 64 is completed (when the movement to the Z2 direction side by the Z direction movement mechanism 61 is completed).

[0072] Also, in the present embodiment, when expanding the sheet member 220 by the expand portion 6 at the first position P1 which is the expand position, a cold air supply unit 7 and a cooling unit 8 for cooling the sheet member 220 are arranged. The cold air supply unit 7 is provided integrally with the debris cleaner 9 on the Z1 direction side with respect to the wafer ring structure 200. For this reason, the cold air supply unit 7 is configured to be movable integrally with the debris cleaner 9 in the vertical direction (Z direction) between a lower position where cold air is supplied and an upper position where cold air is not supplied at the first position P1. The cold air supply unit 7 is configured to descend to the Z2 direction side from the upper position to the lower position when expanding the sheet member 220. Also, the cold air supply unit 7 starts the cold air supply operation before pressing the sheet member 220 against the expand ring 64, and is configured to continue the cold air supply operation until at least the pressing of the sheet member 220 against the expand ring 64 is completed.

[0073] Further, the cooling unit 8 is disposed on the Z2 direction side with respect to the wafer ring structure 200. Also, the cooling unit 8 is configured to be movable in the vertical direction (Z direction) between an upper position for cooling the sheet member 220 and a lower position for not cooling the sheet member 220 by the driving force of a cylinder 82 such as an air cylinder at the first position P1. The cooling unit 8 is configured to rise in the Z1 direction side from the lower position to the upper position when expanding the sheet member 220. Further, the cooling unit 8 is configured to start and complete the cooling operation before pressing the sheet member 220 against the expand ring 64. Also, the cooling unit 8 is configured to retract to the lower position before pressing the sheet member 220 against the expand ring 64.

[0074] Further, when the expansion of the sheet member 220 by the expansion unit 6 (pressing the sheet member 220 against the expand ring 64) is completed, the Y-direction movement mechanism 62 moves the expansion unit 6 (Z-direction movement mechanism 61, clamp unit 63, and expand ring 64) in the Y1 direction from the first position P1 where the sheet member 220 is expanded by the expansion unit 6 to the second position P2 where heat shrinkage of the sheet member 220 is performed while maintaining the state where the sheet member 220 is expanded by the expansion unit 6. At this time, the Y-direction movement mechanism 62 is configured to move the expansion unit 6 in the Y1 direction from the first position P1 to the second position P2 independently of the debris cleaner 9, the cold air supply unit 7, and the cooling unit 8 without moving the debris cleaner 9, the cold air supply unit 7, and the cooling unit 8. At this time, the debris cleaner 9 and the cold air supply unit 7 are retracted to the upper position, and the cooling unit 8 is retracted to the lower position.

[0075] The Y-direction movement mechanism 62 further includes a placement portion 62b and a rail portion 62c in addition to the motor 62a. The placement portion 62b is configured such that the Z-direction movement mechanism 61, the clamp portion 63, and the expand ring 64 are placed on the upper surface. Further, the placement portion 62b is formed in a plate shape that is substantially rectangular in plan view. Also, the placement portion 62b is movably provided on the rail portion 62c. The rail portion 62c is provided in a pair spaced apart in the X direction. The pair of rail portions 62c is provided so as to extend in the Y direction between the first position P1 and the second position P2. The Y-direction movement mechanism 62 is configured to move the Z-direction movement mechanism 61, the clamp portion 63, and the expand ring 64 in the Y direction between the first position P1 and the second position P2 by moving the placement portion 62b along the pair of rail portions 62c by the driving force of the motor 62a.

[0076] Further, the placement portion 62b is provided with a hole portion 62ba that penetrates the placement portion 62b in the vertical direction (Z direction). The hole portion 62ba is formed in a circular shape in plan view. Also, the hole portion 62ba has a size that allows the cooling unit 8 to pass through at the first position P1. Thereby, it is possible to move the cooling unit 8 between the upper position and the lower position through the hole portion 62ba. Also, the hole portion 62ba has a size that allows the ultraviolet irradiation unit 11 to pass through at the second position P2. Thereby, it is possible to move the ultraviolet irradiation unit 11 between the upper position and the lower position through the hole portion 62ba. Also, the hole portion 62ba is provided inside the expand ring 64. The cooling unit 8 and the ultraviolet irradiation unit 11 are configured to move inside the expand ring 64 through the hole portion 62ba.

[0077] <Configuration Regarding Heat Shrinkage> Also, in the present embodiment, as shown in FIGS. 13 and 14, the heat shrinkage portion 10 is disposed on the Z1-direction side of the expand portion 6 moved by the Y-direction movement mechanism 62 at the second position P2 which is the heat shrinkage position. Further, the heating ring 111 and the intake ring 112 of the heat shrinkage portion 10 are configured to be movable in the vertical direction (Z direction) between an upper position where the sheet member 220 is not heated and a lower position where the sheet member 220 is heated at the second position P2 by the driving force of the motor 110a of the Z-direction movement mechanism 110. Further, the expansion maintaining ring 113 of the heat shrinkage portion 10 is configured to be movable in the vertical direction between an upper position where the sheet member 220 is not pressed and a lower position where the sheet member 220 is pressed at the second position P2 by the driving force of a cylinder such as an air cylinder. Further, the upper position is a retracted position where the expand portion 6 and the wafer ring structure 200 moving in the Y1 direction can be avoided. Further, the lower position is a position in the vicinity of the sheet member 220.

[0078] Further, the heat shrinkage part 10 (heating ring 111, intake ring 112, and expansion maintaining ring 113) is configured to descend in the Z2 direction from an upper position to a lower position when heat shrinking the sheet member 220. Note that the vertical mechanism (Z-direction moving mechanism 110) for the heating ring 111 and the intake ring 112 and the vertical mechanism (cylinder) for the expansion maintaining ring 113 are separate mechanisms. Therefore, the heating ring 111 and the intake ring 112 and the expansion maintaining ring 113 can move vertically independently of each other. The expansion maintaining ring 113 is configured to sandwich the sheet member 220 in the vertical direction (Z direction) with the expand ring 64. Thereby, the expansion maintaining ring 113 is configured to maintain the expanded state of the portion of the sheet member 220 corresponding to the wafer 210. Further, the heating ring 111 is configured to heat the peripheral portion 220b (the portion outside the expansion maintaining ring 113) of the wafer 210 of the sheet member 220 by the sheet heater which is a heating mechanism, with the expanded state of the sheet member 220 maintained by the expansion maintaining ring 113. Further, the intake ring 112 is configured to intake the gas generated from the sheet member 220 due to heating during the heating of the sheet member 220 by the heating ring 111.

[0079] Also, in the present embodiment, when heat shrinking the sheet member 220 by the heat shrinkage part 10 at the second position P2 which is the heat shrinkage position, an ultraviolet irradiation part 11 for irradiating the sheet member 220 with ultraviolet rays is arranged. The ultraviolet irradiation part 11 is arranged on the Z2 direction side with respect to the wafer ring structure 200. Further, the ultraviolet irradiation part 11 is configured to be movable in the vertical direction (Z direction) between an upper position for irradiating ultraviolet rays and a lower position for not irradiating ultraviolet rays by the driving force of a cylinder 121 such as an air cylinder at the second position P2. The ultraviolet irradiation part 11 is configured to ascend in the Z1 direction from a lower position to an upper position when heat shrinking the sheet member 220.

[0080] In addition, when the heat shrinkage of the sheet member 220 by the heat shrinkage portion 10 is completed, the Y-direction moving mechanism 62 moves the expansion portion 6 (the Z-direction moving mechanism 61, the clamp portion 63, and the expansion ring 64) from the second position P2 where the heat shrinkage has been performed to the first position P1 where the expansion has been performed in the Y2 direction. At this time, the Y-direction moving mechanism 62 is configured to move the expansion portion 6 from the second position P2 to the first position P1 in the Y2 direction independently of the heat shrinkage portion 10 and the ultraviolet irradiation portion 11 without moving the heat shrinkage portion 10 and the ultraviolet irradiation portion 11. At this time, the heat shrinkage portion 10 is retracted to the upper position, and the ultraviolet irradiation portion 11 is retracted to the lower position.

[0081] <Configuration related to the cassette portion and the lift-up hand portion> In addition, in the present embodiment, as shown in FIG. 1, the cassette portion 2 is disposed at a position different from the first position P1 and the second position P2 in a plan view. The lift-up hand portion 3 is also disposed at a position different from the first position P1 and the second position P2 in a plan view. The direction (Y2 direction) in which the lift-up hand portion 3 takes out the wafer ring structure 200 from the cassette portion 2 is substantially parallel to the direction (Y1 direction) in which the Y-direction moving mechanism 62 moves the expansion portion 6. That is, the insertion and extraction direction (Y direction) of the wafer ring structure 200 by the lift-up hand portion 3 and the moving direction (Y direction) of the expansion portion 6 by the Y-direction moving mechanism 62 are substantially parallel to each other. The cassette portion 2 is arranged side by side in the X direction with the second position P2 which is the heat shrinkage position. The take-out position of the wafer ring structure 200 by the lift-up hand portion 3 is arranged side by side in the X direction with the first position P1 which is the expansion position.

[0082] (Take-out process) Referring to FIG. 15, the take-out process in the expansion device 100 will be described. The take-out process is a process performed in step S1 in the above semiconductor chip manufacturing process.

[0083] As shown in FIG. 15, in step S101, it is determined whether the lift-up hand 32 of the lift-up hand portion 3 is empty. If the lift-up hand 32 is not empty, the take-out process is terminated. If the lift-up hand 32 is empty, the process proceeds to step S102.

[0084] Then, in step S102, it is determined whether the lift-up hand 32 is within the wafer cassette 22 of the cassette portion 2. If the lift-up hand 32 is not within the wafer cassette 22, the process proceeds to step S104. If the lift-up hand 32 is within the wafer cassette 22, the process proceeds to step S103.

[0085] Then, in step S103, the lift-up hand 32 is moved in the Y2 direction from within the wafer cassette 22 to outside the wafer cassette 22 by the Y-direction moving mechanism 31.

[0086] Then, in step S104, the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21 so that the lift-up hand 32 can take out the wafer ring structure 200 to be taken out within the wafer cassette 22. Specifically, in step S104, the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21 so that the upper surface of the lift-up hand 32 is positioned slightly at the height on the Z2-direction side of the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be taken out within the wafer cassette 22.

[0087] Then, in step S105, the lift-up hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31 so as to be positioned directly below the ring-shaped member 230 of the wafer ring structure 200 to be taken out within the wafer cassette 22.

[0088] Then, in step S106, the wafer ring structure 200 to be taken out in the wafer cassette 22 is transferred to the lift-up hand 32. Specifically, in step S106, the wafer cassette 22 is moved in the Z2 direction by the Z-direction moving mechanism 21 so that the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be taken out in the wafer cassette 22 slightly lifts from the upper surface of the pair of placement portions 23 by the lift-up hand 32.

[0089] Then, in step S107, with the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be taken out supported by the upper surface of the lift-up hand 32, the lift-up hand 32 is moved in the Y2 direction by the Y-direction moving mechanism 31. As a result, the wafer ring structure 200 to be taken out is taken out from the wafer cassette 22 by the lift-up hand 32. Then, the take-out process is completed.

[0090] (Transfer process) Referring to FIG. 16, the transfer process in the expand device 100 will be described. The transfer process is a process performed in step S2 or S7 in the above semiconductor chip manufacturing process.

[0091] As shown in FIG. 16, in step S201, the suction hand 43 of the suction hand portion 4 is lifted by the Z-direction moving mechanism 42.

[0092] Then, in step S202, the suction hand 43 is moved above the wafer ring structure 200 by the X-direction moving mechanism 41. Specifically, in the case of step S2 in the above semiconductor chip manufacturing process, the suction hand 43 is moved above the wafer ring structure 200 supported by the lift-up hand 32. Also, in the case of step S7 in the above semiconductor chip manufacturing process, the suction hand 43 is moved above the wafer ring structure 200 supported by the expand portion 6.

[0093] Then, in step S203, the suction hand 43 is lowered by the Z-direction moving mechanism 42 toward the wafer ring structure 200.

[0094] Then, in step S204, the suction hand 43 sucks the ring-shaped member 230 of the wafer ring structure 200 by the negative pressure supplied from the negative pressure generating device.

[0095] Then, in step S205, the suction hand 43 is lifted by the Z-direction moving mechanism 42.

[0096] Then, in step S206, the suction hand 43 is moved above the transfer destination by the X-direction moving mechanism 41. Specifically, in the case of step S2 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the expandable portion 6 at the first position P1. Also, in the case of step S7 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the lift-up hand 32.

[0097] Then, in step S207, the suction hand 43 is lowered by the Z-direction moving mechanism 42 toward the transfer destination (the expandable portion 6 or the lift-up hand 32).

[0098] Then, in step S208, the suction of the ring-shaped member 230 of the wafer ring structure 200 by the suction hand 43 is released. Thereby, the transfer of the wafer ring structure 200 to the transfer destination is completed. Then, the transfer process is terminated.

[0099] (Expand Process) With reference to FIGS. 17 and 18, the expand process in the expand device 100 will be described. The expand process is a process performed in step S3 in the semiconductor chip manufacturing process. The expand process is performed at the first position P1.

[0100] As shown in FIG. 17, in step S301, the suction hand 43 is lifted by the Z-direction movement mechanism 42. At this time, the ring-shaped member 230 of the wafer ring structure 200 is supported by the lower gripping portion 63a of the clamp portion 63.

[0101] Then, in step S302, the plurality of slide moving bodies 63ba of the upper gripping portion 63b are slid horizontally toward the wafer 210 side.

[0102] Then, in step S303, with the ring-shaped member 230 of the wafer ring structure 200 being supported, the lower gripping portion 63a is lifted. As a result, the ring-shaped member 230 is gripped and fixed between the upper gripping portion 63b and the lower gripping portion 63a.

[0103] Then, in step S304, the debris cleaner 9 and the cold air supply unit 7 are lowered toward the wafer ring structure 200 by a cylinder.

[0104] Then, in step S305, it is determined whether cooling by supplying cold air from the cold air supply unit 7 to the sheet member 220 is necessary. If cooling by supplying cold air from the cold air supply unit 7 to the sheet member 220 is necessary, the process proceeds to step S305a. Then, in step S305a, the supply of cold air from the cold air supply unit 7 to the sheet member 220 is started. Note that when cooling by the cold air supply unit 7 is performed, cooling by the cooling unit 8 is also performed in step S307 described later. Then, the process proceeds to step S306. Also, if cooling by supplying cold air from the cold air supply unit 7 to the sheet member 220 is not necessary, the process proceeds to step S306 without performing the process of step S305a.

[0105] Then, in step S306, it is determined whether cooling by the cooling unit 8 of the sheet member 220 is necessary. If cooling by the cooling unit 8 of the sheet member 220 is necessary, the process proceeds to step S307. Then, in step S307, in addition to the cooling by the cold air supply unit 7 of the sheet member 220, cooling by the cooling unit 8 of the sheet member 220 is performed. Then, the process proceeds to step S308. Also, if cooling by the cooling unit 8 of the sheet member 220 is not necessary, the process proceeds to step S308 without performing the process of step S307.

[0106] Then, as shown in FIG. 18, in step S308, suction by the debris cleaner 9 of the scattered matter is started.

[0107] Then, in step S309, the clamp portion 63 is rapidly lowered by the Z-direction moving mechanism 61 and the sheet member 220 is pressed against the expander 64, whereby expansion of the sheet member 220 is executed. As a result, the wafer 210 on the sheet member 220 is divided into a plurality of matrix-shaped semiconductor chips, and the gaps between the plurality of semiconductor chips are widened. Also, in step S309, the clamp portion 63 is lowered from the expansion start position to the expansion completion position.

[0108] Then, in step S310, the supply of cold air to the sheet member 220 by the cold air supply unit 7 is stopped. Note that if it is determined in step 305 that cooling by the supply of cold air to the sheet member 220 by the cold air supply unit 7 is not necessary, the process proceeds to step S311 without performing the process of step S310.

[0109] Then, in step S311, the suction by the debris cleaner 9 of the scattered matter is stopped.

[0110] Then, in step S312, the debris cleaner 9 is lifted by the cylinder together with the cold air supply unit 7. Then, the expansion process is completed. Then, while maintaining the state where the sheet member 220 is expanded, the expansion unit 6 (Z-direction movement mechanism 61, clamp unit 63, and expansion ring 64) is moved from the first position P1 to the second position P2 by the Y-direction movement mechanism 62.

[0111] (Heat shrinkage process) Referring to FIGS. 19 and 20, the heat shrinkage process in the expansion device 100 will be described. The heat shrinkage process is a process performed in step S5 in the above semiconductor chip manufacturing process.

[0112] As shown in FIG. 19, in step S401, the ultraviolet irradiation unit 11 is lifted by the cylinder 121.

[0113] Then, in step S402, the expansion maintenance ring 113 is lowered by the cylinder. As a result, the sheet member 220 is sandwiched between the expansion maintenance ring 113 and the expansion ring 64.

[0114] Then, in step S403, the heating ring 111 and the intake ring 112 are lowered by the Z-direction movement mechanism 110. Note that the vertical mechanism (Z-direction movement mechanism 110) for the heating ring 111 and the intake ring 112 and the vertical mechanism (cylinder) for the expansion maintenance ring 113 are separate mechanisms.

[0115] Then, in step S404, the intake by the intake ring 112 is started.

[0116] Then, in step S405, heating of the sheet member 220 by the heating ring 111 and irradiation of the sheet member 220 by the ultraviolet irradiation unit 11 of ultraviolet rays are started. By heating the sheet member 220 with the heating ring 111, the slack of the peripheral portion 220b of the wafer 210 of the sheet member 220 is contracted and removed. Further, by irradiating the sheet member 220 with the ultraviolet irradiation unit 11 of ultraviolet rays, the adhesive force of the adhesive layer of the sheet member 220 is reduced.

[0117] Then, in step S406, it is determined whether or not the heating time of the sheet member 220 by the heating ring 111 has reached the set time. If the heating time of the sheet member 220 by the heating ring 111 has not reached the set time, the process of step S406 is repeated. If the heating time of the sheet member 220 by the heating ring 111 has reached the set time, the process proceeds to step S407.

[0118] Then, in step S407, the heating of the sheet member 220 by the heating ring 111 is stopped.

[0119] Then, in step S408, the clamp portion 63 is lifted at a low speed by the Z-direction movement mechanism 61.

[0120] Then, in step S409, it is determined whether or not the clamp portion 63 has been lifted to the expand start position. If the clamp portion 63 has not been lifted to the expand start position, the process of step S409 is repeated. If the clamp portion 63 has been lifted to the expand start position, the process proceeds to step S410.

[0121] In the processes of steps S406 to S409, an example is shown in which heating by the heating ring 111 of the sheet member 220 and raising by the Z-direction moving mechanism 61 of the clamp portion 63 are performed at once. However, the configuration of heat shrinkage is not limited to this. For example, heating by the heating ring 111 of the sheet member 220 and raising by the Z-direction moving mechanism 61 of the clamp portion 63 may be performed in multiple divisions. That is, while repeating heating by the heating ring 111 of the sheet member 220 and raising by the Z-direction moving mechanism 61 of the clamp portion 63, the clamp portion 63 may be raised to the expand start position.

[0122] Then, in step S410, intake by the intake ring 112 and irradiation of the sheet member 220 by the ultraviolet irradiation unit 11 of ultraviolet rays are stopped.

[0123] Then, in step S411, the heating ring 111 and the intake ring 112 are raised by the Z-direction moving mechanism 110.

[0124] Then, in step S412, the expansion maintenance ring 113 is raised by a cylinder.

[0125] Then, in step S413, the ultraviolet irradiation unit 11 is lowered by the cylinder 121. Then, the heat shrinkage process is completed. Then, from the second position P2 to the first position P1, the expand portion 6 (Z-direction moving mechanism 61, clamp portion 63, and expand ring 64) is moved by the Y-direction moving mechanism 62. Then, from the expand portion 6 at the first position P1 to the lift-up hand 32, the wafer ring structure 200 for which expansion and heat shrinkage have been completed is transferred by the adsorption hand 43.

[0126] (Storage process) With reference to FIG. 21, the storage process in the expand device 100 will be described. The storage process is a process performed in step S8 in the above semiconductor chip manufacturing process.

[0127] As shown in FIG. 21, in step S501, it is determined whether the lift-up hand 32 of the lift-up hand portion 3 is empty. If the lift-up hand 32 is not empty, the accommodation process ends. Also, if the lift-up hand 32 is empty, the process proceeds to step S502.

[0128] Then, in step S502, it is determined whether the lift-up hand 32 is present within the wafer cassette 22 of the cassette portion 2. If the lift-up hand 32 is not present within the wafer cassette 22, the process proceeds to step S504. Also, if the lift-up hand 32 is present within the wafer cassette 22, the process proceeds to step S503.

[0129] Then, in step S503, the lift-up hand 32 is moved in the Y2 direction from within the wafer cassette 22 to outside the wafer cassette 22 by the Y-direction moving mechanism 31.

[0130] Then, in step S504, the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21 so that the wafer cassette 22 can accommodate the wafer ring structure 200 to be accommodated on the lift-up hand 32. Specifically, in step S504, the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21 so that the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be accommodated on the lift-up hand 32 is positioned at a slightly higher height on the Z1-direction side of the upper surfaces of the pair of mounting portions 23 within the wafer cassette 22.

[0131] Then, in step S505, the lift-up hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31 so that the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be accommodated on the lift-up hand 32 is positioned at the accommodation position (directly above the pair of mounting portions 23) within the wafer cassette 22.

[0132] Then, in step S506, the wafer ring structure 200 to be accommodated on the lift-up hand 32 is transferred to a pair of mounting portions 23 in the wafer cassette 22. Specifically, in step S506, the wafer cassette 22 is moved in the Z1 direction by the Z-direction moving mechanism 21 so that the upper surface of the lift-up hand 32 is slightly lower than the upper surfaces of the pair of mounting portions 23.

[0133] Then, in step S508, with the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be accommodated supported by the upper surfaces of the pair of mounting portions 23, the lift-up hand 32 is moved in the Y2 direction by the Y-direction moving mechanism 31. As a result, with the wafer ring structure 200 to be accommodated being accommodated in the wafer cassette 22, the lift-up hand 32 is removed. Then, the accommodation process is completed.

[0134] (Effects of this Embodiment) In this embodiment, the following effects can be obtained.

[0135] In the present embodiment, as described above, the expandable heat-shrinkable sheet member 220 to which the wafer 210 and the ring-shaped member 230 are attached is expanded at the first position P1 by the expandable portion 6, and in a state where the sheet member 220 is expanded by the expandable portion 6, the expandable portion 6 is horizontally moved to the second position P2 horizontally spaced from the first position P1 in a plan view by the Y-direction moving mechanism 62, and the slack of the peripheral portion 220b of the wafer 210 of the sheet member 220 is heated and shrunk at the second position P2 by the heat shrinkage portion 10. Thereby, the expansion of the sheet member 220 can be performed at the first position P1, and the heat shrinkage of the sheet member 220 can be performed at the second position P2 horizontally spaced from the first position P1, so that the expansion of the sheet member 220 and the heat shrinkage of the sheet member 220 can be performed at separate positions. As a result, even when the sheet member 220 is expanded and heat-shrunk, a space for arranging the structure related to the heat shrinkage of the sheet member 220 can be easily secured at the second position P2. Further, since the structure necessary for achieving high quality can be easily arranged at the second position P2, more high-quality heat shrinkage of the sheet member 220 can be easily achieved.

[0136] Also, by performing the expansion of the sheet member 220 and the heat shrinkage of the sheet member 220 at separate positions, when there is a cooling structure for cooling the sheet member 220 during expansion and a removal structure for removing scattered matter generated during expansion, etc., a space for arranging the cooling structure and the removal structure, etc. can also be secured at the first position P1. Thereby, when there is a cooling structure and a removal structure, etc., since the cooling structure and the removal structure, etc. necessary for achieving high quality can be arranged at the first position P1, more high-quality expansion of the sheet member 220 can be achieved.

[0137] Also, in the present embodiment, as described above, the heat shrinkage portion 10 is disposed above the expandable portion 6 that has been moved by the Y-direction movement mechanism 62 at the second position P2. As a result, at the second position P2, the heat shrinkage portion 10 can be disposed above the expandable portion 6 where it is relatively easy to secure a space. Consequently, at the second position P2, the structure necessary for achieving high quality can be disposed more easily, so that heat shrinkage of the high-quality sheet member 220 can be achieved more easily.

[0138] Also, in the present embodiment, as described above, the heat shrinkage portion 10 is configured to be movable in the vertical direction between an upper position where the sheet member 220 is not heated and a lower position where the sheet member 220 is heated at the second position P2. Thereby, by moving the heat shrinkage portion 10 to the upper position, the heat shrinkage portion 10 can be retracted so as not to interfere with the movement of the expandable portion 6, and thus the movement of the expandable portion 6 can be easily performed. Further, by moving the heat shrinkage portion 10 to the lower position, after the expandable portion 6 has moved to the second position P2, heat shrinkage of the sheet member 220 can be easily performed.

[0139] Also, in the present embodiment, as described above, the expander device 100 is disposed at the first position P1. When the sheet member 220 is expanded by the expanding unit 6, the expander device 100 includes a debris cleaner 9 that sucks and removes debris generated from the wafering structure 200 due to the expansion of the sheet member 220. Thereby, since the debris can be sucked and removed, it is possible to suppress the occurrence of quality defects caused by the debris scattering onto the wafer 210. Also, unlike the case where the debris is blown (blown away) and removed within the expander device 100, it is possible to suppress the debris from remaining within the expander device 100. Therefore, it is possible to suppress the occurrence of quality defects caused by the debris remaining within the expander device 100 and re-scattering onto the wafer 210. Further, as described above, since the expansion of the sheet member 220 and the heat shrinkage of the sheet member 220 are performed at separate positions, a space can be secured for arranging the debris cleaner 9 as a removal structure during expansion.

[0140] Also, in the present embodiment, as described above, the debris cleaner 9 includes an annular ring-shaped member 91 and an annular suction port 92 provided in the ring-shaped member 91 and facing the outer edge of the wafer 210 when sucking debris. Thereby, since the suction port 92 of the debris cleaner 9 is provided so as to face the outer edge of the wafer 210 where debris is likely to occur, the debris cleaner 9 can effectively suck the debris.

[0141] Also, in the present embodiment, as described above, the annular suction port 92 is constituted by a plurality of suction ports 92 arranged annularly at a predetermined interval. Thereby, compared with the case where the annular suction port 92 is constituted by a single suction port 92, the suction force for each suction port 92 can be increased, so that the debris cleaner 9 can more effectively suck the debris.

[0142] Also, in the present embodiment, as described above, the debris cleaner 9 is configured to be movable in the vertical direction between a lower position for sucking scattered objects and an upper position for not sucking scattered objects. By moving the debris cleaner 9 to the upper position, the debris cleaner 9 can be retracted so as not to interfere with the movement of the expandable portion 6, and thus the movement of the expandable portion 6 can be easily performed. Further, by moving the debris cleaner 9 to the lower position, it is possible to easily suck scattered objects when the sheet member 220 is expanded.

[0143] Also, in the present embodiment, as described above, the expandable device 100 is disposed at the first position P1 and includes a cold air supply unit 7 and a cooling unit 8 for cooling the sheet member 220 when the expandable portion 6 expands the sheet member 220. Thereby, the sheet member 220 can be cooled and hardened during expansion, so that it is possible to prevent the situation where only the outer peripheral portion of the sheet member 220 extends due to the softness of the sheet member 220 and the wafer 210 cannot be divided because a sufficient dividing force is not generated with respect to the wafer 210. Further, when the wafer 210 has a soft thin film layer (such as a Low-K film and a DAF (Die Attached Film)), since the film layer is soft, even if the silicon portion of the wafer 210 is divided by expansion, the film layer may remain cracked. However, with the above configuration, the film layer can be cooled and hardened during expansion, so that it is possible to prevent the film layer from remaining cracked. Also, as described above, since the expansion of the sheet member 220 and the heat shrinkage of the sheet member 220 are performed at separate positions, a space for arranging the cold air supply unit 7 and the cooling unit 8 as a cooling structure during expansion can be secured.

[0144] Also, in the present embodiment, as described above, the Y-direction movement mechanism 62 is configured to horizontally move the expansion unit 6 from the first position P1 to the second position P2 independently of the cold air supply unit 7 and the cooling unit 8 without moving the cold air supply unit 7 and the cooling unit 8 from the first position P1. As a result, compared with the case where the Y-direction movement mechanism 62 is configured to move the expansion unit 6 together with the cold air supply unit 7 and the cooling unit 8, the driving force required for the Y-direction movement mechanism 62 can be reduced. Consequently, the Y-direction movement mechanism 62 can be miniaturized.

[0145] Also, in the present embodiment, as described above, the expansion device 100 is arranged at a position different from the first position P1 and the second position P2 in a plan view, and includes a cassette unit 2 that houses a plurality of wafering structures 200, and a lift-up hand unit 3 that is arranged at a position different from the first position P1 and the second position P2 in a plan view and takes out the wafering structure 200 from the cassette unit 2. Further, the direction in which the lift-up hand unit 3 takes out the wafering structure 200 from the cassette unit 2 is substantially parallel to the direction in which the Y-direction movement mechanism 62 moves the expansion unit 6. Thus, unlike the case where the direction in which the lift-up hand unit 3 takes out the wafering structure 200 from the cassette unit 2 is substantially orthogonal to the direction in which the Y-direction movement mechanism 62 moves the expansion unit 6, it is possible to suppress the increase in size of the expansion device 100 in a direction substantially orthogonal to the direction in which the lift-up hand unit 3 takes out the wafering structure 200 from the cassette unit 2 and the direction in which the Y-direction movement mechanism 62 moves the expansion unit 6.

[0146] [Modification Example] It should be noted that the disclosed embodiment should be considered as illustrative in all respects and not restrictive. The scope of the present invention is shown by the claims rather than the description of the above-described embodiment, and further includes all modifications (modification examples) within the meaning and scope equivalent to the claims.

[0147] For example, in the above embodiment, an example is shown in which the heat shrinkage part is arranged above the expansion part at the second position, but the present invention is not limited to this. In the present invention, the heat shrinkage part may be arranged below the expansion part at the second position.

[0148] Also, in the above embodiment, an example is shown in which the heat shrinkage part has a heating ring, but the present invention is not limited to this. In the present invention, as long as the sheet member can be heated, the heat shrinkage part may have a heating part other than the heating ring.

[0149] Also, in the above embodiment, an example is shown in which the heat shrinkage part has an intake ring and an expansion maintenance ring, but the present invention is not limited to this. In the present invention, the heat shrinkage part may not have an intake ring and an expansion maintenance ring.

[0150] Also, in the above embodiment, an example is shown in which the expansion device includes a debris cleaner (suction part), but the present invention is not limited to this. In the present invention, the expansion device may not include a suction part.

[0151] Also, in the above embodiment, an example is shown in which the debris cleaner (suction part) has an annular suction port facing the outer edge of the wafer, but the present invention is not limited to this. In the present invention, as long as the scattered matter can be sucked, the shape of the suction port of the suction part can be any shape.

[0152] Also, in the above embodiment, an example is shown in which the annular suction port is composed of a plurality of suction ports, but the present invention is not limited to this. In the present invention, the annular suction port may be composed of a single suction port.

[0153] In the above embodiment, an example in which the expand device includes a cold air supply unit and a cooling unit (cooling section) has been shown. However, the present invention is not limited to this. In the present invention, the expand device may include only one of the cold air supply unit and the cooling unit as the cooling section. Further, the expand device may not include a cooling section.

[0154] In the above embodiment, an example in which the direction in which the lift-up hand part (take-out part) takes out the wafer ring structure from the cassette part (accommodation part) is substantially parallel to the direction in which the Y-direction moving mechanism (moving mechanism) moves the expand part has been shown. However, the present invention is not limited to this. In the present invention, the direction in which the take-out part takes out the wafer ring structure from the accommodation part may intersect the direction in which the moving mechanism moves the expand part.

[0155] In the above embodiment, for the sake of convenience of explanation, an example in which the control process has been described using a flow-driven type flowchart that processes the processes in order along the process flow has been shown. However, the present invention is not limited to this. In the present invention, the control process may be performed by an event-driven type (event-driven type) process that executes the process in units of events. In this case, it may be performed in a completely event-driven manner, or it may be performed by combining event driving and flow driving.

Explanation of reference numerals

[0156] 2 Cassette part (accommodation part) 3 Lift-up hand part (take-out part) 6 Expand part 7 Cold air supply unit (cooling section) 8 Cooling unit (cooling section) 9 Fragment cleaner (suction part) 10 Heat shrinkage part 62 Y-direction moving mechanism (moving mechanism) 91 Ring-shaped member (suction part main body) 92 Suction port 100 Expand device 200 Wafer ring structure 210 Wafer 220 Sheet member 220b Portion around the wafer of the sheet member 230 Ring-shaped member P1 First position P2 Second position

Claims

1. A wafer, a ring-shaped member surrounding the wafer, and a heat-shrinkable sheet member having elasticity to which the wafer and the ring-shaped member are attached. The sheet member of the wafer ring structure includes an expandable portion that expands the sheet member at a first position, a moving mechanism that horizontally moves the expandable portion from the first position to a second position that is horizontally spaced from the first position in a plan view in a state where the sheet member is expanded by the expandable portion, and a heat shrink portion that heats and shrinks the slack of the portion around the wafer of the sheet member generated by the expansion by the expandable portion at the second position. The expandable device further includes a suction portion that is disposed at the first position and sucks and removes flying objects generated from the wafer ring structure due to the expansion of the sheet member when the sheet member is expanded by the expandable portion. The suction portion includes an annular suction portion main body and an annular suction port provided in the suction portion main body and facing the outer edge of the wafer when sucking the flying objects.

2. A wafer, a ring-shaped member surrounding the wafer, and a heat-shrinkable sheet member having elasticity to which the wafer and the ring-shaped member are attached. The sheet member of the wafer ring structure includes an expandable portion that expands the sheet member at a first position, a moving mechanism that horizontally moves the expandable portion from the first position to a second position that is horizontally spaced from the first position in a plan view in a state where the sheet member is expanded by the expandable portion, and a heat shrink portion that heats and shrinks the slack of the portion around the wafer of the sheet member generated by the expansion by the expandable portion at the second position. The expandable device further includes a suction portion that is disposed at the first position and sucks and removes flying objects generated from the wafer ring structure due to the expansion of the sheet member when the sheet member is expanded by the expandable portion. The suction portion is configured to be movable in the vertical direction between a lower position where the flying objects are sucked and an upper position where the flying objects are not sucked.

3. The heat shrinkage part is arranged above the expandable part moved by the moving mechanism at the second position, according to the expandable device of claim 1 or 2.

4. The heat shrinkage part is configured to be movable in the vertical direction between an upper position where the sheet member is not heated and a lower position where the sheet member is heated at the second position, according to the expandable device of claim 3.

5. The suction part includes an annular suction part main body and an annular suction port provided in the suction part main body and facing the outer edge of the wafer when sucking the scattered matter, according to the expandable device of claim 2.

6. The annular suction port is composed of a plurality of suction ports arranged annularly at a predetermined interval, according to the expandable device of claim 1 or 5.

7. The suction part is configured to be movable in the vertical direction between a lower position where the scattered matter is sucked and an upper position where the scattered matter is not sucked, according to the expandable device of claim 1.

8. The expandable device according to any one of claims 1 to 7 further includes a cooling part that is arranged at the first position and cools the sheet member when the expandable part expands the sheet member.

9. The moving mechanism is configured to horizontally move the expandable part from the first position to the second position independently of the cooling part without moving the cooling part from the first position, according to the expandable device of claim 8.

10. A housing part that is arranged at a position different from the first position and the second position in a plan view and houses a plurality of the wafer ring structures, A take-out part that is arranged at a position different from the first position and the second position in a plan view and takes out the wafer ring structure from the housing part, and The direction in which the take-out part takes out the wafer ring structure from the housing part is substantially parallel to the direction in which the moving mechanism moves the expandable part, according to the expandable device of any one of claims 1 to 9.

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