Laser soldering device

Abstract

To provide laser soldering equipment that can supply solder along an irradiation center.SOLUTION: An irradiation head 1 has: a plurality of optical paths 3a, 3b, 3c and 3d arranged in such a way as to surround an irradiation center O; and a solder supply nozzle 4 arranged at the irradiation center O. The plurality of optical paths include: irradiation optical paths 3a through which a soldering point 2 is irradiated with laser beams L; imaging optical paths 3b for imaging the soldering point 2; illumination optical paths 3c for irradiating the soldering point 2 with illuminating light Lc; and measurement optical paths 3d for measuring temperature of the soldering point 2, wherein the laser beams L of the irradiation optical paths 3a are emitted to the soldering point 2 while keeping an angle at which the beams do not impinge solder 8 supplied from the solder supply nozzle 4.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a laser soldering apparatus that irradiates a soldering point with laser light to perform soldering. More specifically, the present invention relates to a laser soldering apparatus that supplies solder from a solder supply nozzle disposed at or near the center (irradiation center) of an irradiation head to a soldering point to perform soldering.

Background Art

[0002] A conventional laser soldering apparatus disclosed in Patent Document 1 includes an irradiation head that irradiates laser light and a solder supply nozzle that supplies linear solder. The laser light is irradiated from the irradiation head to a soldering point along the irradiation center, which is the center of the irradiation head, and linear solder is supplied from the solder supply nozzle to the soldering point to perform soldering. The solder supply nozzle is attached to the side surface of the irradiation head, and linear solder is supplied from the solder supply nozzle to the soldering point in a manner that crosses the laser light emitted from the irradiation head.

[0003] However, the soldering point is usually the joint portion between an annular land formed on a substrate and the lead of an electronic component inserted inside the land. However, not all soldering points are always in a location where solder can be easily supplied. Depending on the type, shape, or size of the electronic component, etc., they may be arranged in various high and low locations, complex locations, or in the shadow of other electronic components mounted on the substrate. For this reason, during soldering, it is necessary to adjust or set the supply direction, supply angle, etc. of the solder according to the situation of the soldering point, and the work is very detailed and troublesome.

[0004] Such a problem can be solved by arranging the solder supply nozzle at the irradiation center of the irradiation head so that the solder is supplied from the irradiation center to the soldering point. However, in a conventional irradiation head, an optical path is arranged at the irradiation center, and the laser light is irradiated along this optical path. Therefore, the solder supply nozzle cannot be arranged at the irradiation center.

[0005] On the other hand, Patent Document 2 discloses a laser processing apparatus for performing surface modification processing, welding processing, etc. of a base material. This laser processing apparatus arranges the optical paths of a plurality of laser lights around the axis (irradiation center) of the processing head portion, and arranges a supply nozzle for supplying a molten material on the axis, that is, at the irradiation center, and can supply the molten material along the irradiation center of the processing head portion.

[0006] However, the configuration of this laser processing apparatus cannot be directly applied to a soldering apparatus. The reason is that the optical paths of the plurality of laser lights arranged around the irradiation center are directed at the molten material, and the molten material supplied from the supply nozzle is melted by the laser light and supplied to the base material. Therefore, if this configuration is applied to a soldering apparatus and the linear solder is melted by the laser light, the melted linear solder becomes spherical and is likely to be in a state where it is not supplied to the soldering point while adhering to the tip of the linear solder. Even if it is supplied, the melted solder will be supplied to the unheated soldering point. Therefore, the supplied molten solder contacts the low-temperature soldering point and is rapidly cooled, so that it solidifies without sufficiently spreading at the soldering point and becomes defective solder, and correct soldering cannot be performed.

[0007] Also, in the devices described in Patent Document 1 and Patent Document 2, for example, when it is necessary to observe soldering points, processing sites, etc., that is, when it is necessary to image soldering points or measure the temperature of soldering points, etc., an optical path system for observation, that is, an optical path system for imaging, an optical path system for temperature measurement, etc. must be externally attached to the processing head unit, and the complication and enlargement of the structure of the processing head could not be avoided.

Prior Art Documents

Patent Documents

[0008]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0009] The technical problem of the present invention is to enable solder to be supplied from the center (irradiation center) of the irradiation head to the soldering point, and in addition to the irradiation optical path for irradiating laser light to the irradiation head, an optical path for observing the soldering point, that is, an imaging optical path, an illumination optical path, or a temperature measurement optical path, etc. are integrally incorporated, thereby realizing simplification and miniaturization of the structure of the irradiation head.

Means for Solving the Problems

[0010] To solve the above problems, the laser soldering apparatus of the present invention has an irradiation head for irradiating laser light. The irradiation head has a plurality of optical paths arranged so as to surround the center of the irradiation head, i.e., the irradiation center, and a solder supply nozzle arranged at or near the irradiation center. The plurality of optical paths include at least one irradiation optical path for irradiating laser light onto a soldering point, an imaging optical path for imaging the soldering point, an illumination optical path for irradiating illumination light onto the soldering point, and a measurement optical path for measuring the temperature of the soldering point. The irradiation optical path has a semiconductor laser element capable of controlling the output of laser light, an optical fiber connected to the semiconductor laser element, a collimating lens for making the laser light emitted from the optical fiber into parallel light, and a condensing lens for condensing the laser light emitted from the collimating lens. The laser light of the irradiation optical path is irradiated onto the soldering point at an angle that does not hit the solder supplied from the solder supply nozzle to the soldering point with respect to the irradiation center.

[0011] In the present invention, there may be a plurality of the irradiation optical paths, and the laser light of the plurality of irradiation optical paths is irradiated onto the soldering point so as to surround the irradiation center while maintaining an angle that does not hit the solder supplied from the solder supply nozzle with respect to the irradiation center.

[0012] Further, in the present invention, it is preferable that the laser soldering apparatus has a first gas flow path for supplying an inert gas to the soldering point. In this case, it is desirable that the first gas flow path surrounds the laser light emitted from the condensing lens in a conical shape, and has a ring-shaped injection port at its tip for injecting an inert gas so as to surround the soldering point. Also, an optical path cover having a double structure forming a conical shape as a whole composed of an inner cylinder and an outer cylinder may be attached to the tip of the irradiation head. The optical path cover surrounds the plurality of optical paths in a conical shape, and the first gas flow path may be formed between the inner cylinder and the outer cylinder.

[0013] In the present invention, the irradiation head has a second gas flow path for supplying an inert gas to the soldering point, and the second gas flow path is preferably formed between the inner cylinder and the outer cylinder of a double-cylindrical flow path cylinder surrounding the solder Supply nozzle.

[0014] Further, in the present invention, the irradiation head may have a gas flow path for supplying an inert gas to the soldering point and a suction flow path for sucking fumes generated during soldering. In this case, an optical path cover having a double structure that is conical as a whole and composed of an inner cylinder and an outer cylinder is attached to the tip of the irradiation head. The optical path cover surrounds the plurality of optical paths in a conical shape, and the suction flow path is formed between the inner cylinder and the outer cylinder. In addition, a ring-shaped suction port communicating with the suction flow path is formed at the tip of the optical path cover, and the gas flow path is preferably formed inside the optical path cover. Further, the gas flow path Supply preferably has an inner flow path formed between the inner cylinder and the outer cylinder of a double-cylindrical flow path cylinder surrounding the solder nozzle, and an outer flow path formed between the inner circumference of the optical path cover and the outer circumference of the flow path cylinder.

[0015] In the present invention, the imaging optical path includes a CCD camera, a parallel lens and a condenser lens interposed between the CCD camera and the soldering point. An image of the soldering point is captured by the CCD camera through the parallel lens and the condenser lens. The illumination optical path includes a light source, a parallel lens and a condenser lens interposed between the light source and the soldering point. Illumination light from the light source is irradiated onto the soldering point through the parallel lens and the condenser lens. The measurement optical path includes a radiation thermometer, a parallel lens and a condenser lens interposed between the radiation thermometer and the soldering point. Infrared light radiated from the soldering point is received by the radiation thermometer through the condenser lens and the parallel lens, thereby measuring the temperature of the soldering point.

Advantages of the Invention

[0016] According to the present invention, since the solder can be supplied from the solder supply nozzle disposed at or near the irradiation center of the irradiation head to the soldering point, there is no need to adjust or reset the supply direction, supply angle, etc. of the solder according to the situation of the soldering point as in the conventional soldering apparatus, and the solder can be reliably and accurately supplied to the soldering point. Further, since the laser light in the irradiation optical path does not hit the solder supplied from the solder supply nozzle to the soldering point, the solder is not melted by the laser light before being supplied to the soldering point. Furthermore, since the irradiation head incorporates, in a unified manner, the irradiation optical path for irradiating laser light, the optical paths for observing the soldering point, i.e., the imaging optical path, the illumination optical path, and the temperature measurement optical path, it has been possible to simplify and miniaturize the structure of the irradiation head.

Brief Description of the Drawings

[0017]

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Embodiments for Carrying Out the Invention

[0018] Hereinafter, a laser soldering apparatus according to the present invention will be described in detail with reference to the drawings. As shown in FIGS. 1 and 2, the laser soldering apparatus has an irradiation head 1 for irradiating a soldering point 2 with laser light. This irradiation head 1 has a plurality of optical paths 3a, 3b, 3c, 3d arranged at equal angular intervals around an irradiation center O which is the center of the irradiation head 1, a solder supply nozzle 4 arranged at the irradiation center O or in the vicinity of the irradiation center O, and a first gas flow path 5 (see FIG. 5) for supplying an inert gas to the soldering point 2. In the illustrated example, nine optical paths 3a, 3b, 3c, 3d are arranged at 40-degree intervals around the irradiation center O. Further, the solder supply nozzle 4 is connected to a solder supply device 6 for supplying a linear solder, and the first gas flow path 5 is connected to a gas supply device 7 for supplying an inert gas such as nitrogen gas or argon gas. Then, the solder supply device 6 is connected to a control device 14, and by controlling the solder supply device 6 in this control device 14, in addition to the supply and stop of the solder, the feed speed and feed amount of the solder are controlled. Similarly, the gas supply device 7 is also connected to the control device 14, and by controlling the gas supply device 7 in this control device 14, in addition to the supply and stop of the inert gas, the flow rate and flow velocity of the inert gas are adjusted.

[0019] As shown in FIGS. 3 and 4, the soldering point 2 is composed of an annular land 11 formed on the printed circuit board 10 and a lead 12 extending from the electronic component 13. The lead 12 is inserted upward from the lower surface side of the printed circuit board 10 into the through hole 11a of the land 11. The land 11 is formed by applying a tin plating to a copper body, and the lead 12 is formed by applying a gold plating to a copper body.

[0020] As shown in FIG. 2, the plurality of optical paths 3a, 3b, 3c, 3d include a plurality (six in the illustrated example) of irradiation optical paths 3a for irradiating the soldering point 2 with the laser light L and a plurality (three in the illustrated example) of observation optical paths 3b, 3c, 3d for observing the soldering point 2.

[0021] As is apparent from FIG. 5, the irradiation optical path 3a has a semiconductor laser element 15 whose output of the laser light can be controlled by the control device 14, an optical fiber 16 connected to the semiconductor laser element 15, a collimating lens 17a for making the laser light L emitted from the optical fiber 16 in a divergent shape into parallel light, and a condensing lens 18 for condensing the laser light L made parallel by the collimating lens 17a. Note that semiconductor laser elements 15 having different wavelengths of laser light can be used for the plurality of irradiation optical paths 3a.

[0022] The collimating lenses 17a of the plurality of irradiation optical paths 3a are arranged along a circumference surrounding the irradiation center O in a plane S orthogonal to the irradiation center O inside the irradiation head 1. On the other hand, the condenser lens 18 is a single ring-shaped lens having a central hole 18a, and is a large-diameter lens facing the plurality of collimating lenses 17a of the plurality of irradiation optical paths 3a. This single condenser lens 18 is shared by the plurality of optical paths 3a, 3b, 3c, 3d, and the solder supply nozzle 4 penetrates through the inside of the central hole 18a of this condenser lens 18. And at the time of soldering, as shown in FIG. 6, the laser light L of the plurality of irradiation optical paths 3a irradiates the soldering point 2, surrounds the irradiation center O, and as shown in FIGS. 5 and 6, with respect to the irradiation center O, It is irradiated while maintaining an angle that does not hit the linear solder 8 supplied from the solder supply nozzle 4.

[0023] In the example shown in FIG. 6, the laser light L is irradiated on the land 11 and is not directly irradiated on the lead 12. However, since the laser light L reflected by the land 11 is indirectly irradiated on the lead 12, the lead 12 is also heated. However, by increasing the spot diameter of the laser light L by changing the focal point of the collimating lens 17a or adjusting the distance from the condenser lens 18 to the soldering point 2, the laser light L can be directly irradiated so as to straddle both the land 11 and the lead 12.

[0024] The plurality of semiconductor laser elements 15 connected to the plurality of irradiation optical paths 3a can be individually controlled by the control device 14 to output the laser light L according to the shape of the land 11, the lead 12, etc. By this control, the intensity distribution of the plurality of laser lights L irradiated on the soldering point 2 can be arbitrarily changed.

[0025] Then, when the soldering point 2 is heated to a predetermined temperature by the irradiation of the laser beam L, the linear solder 8 sent from the solder supply device 6 is supplied from the solder supply nozzle 4 to the soldering point 2 for soldering. At this time, as shown in FIG. 7, the linear solder 8 is supplied toward the land 11, melts by contacting the land 11, and diffuses throughout the soldering point 2. However, the linear solder 8 can also be supplied so as to contact the side surface of the lead 12. In this case, by arranging the solder supply nozzle 4 in a state slightly inclined with respect to the irradiation center O in the vicinity of the irradiation center O, the linear solder 8 can be supplied obliquely downward toward a position near the lower end of the side surface of the lead 12.

[0026] Also, at this time, as shown in FIGS. 5 and 7, the laser beam L of the plurality of irradiation optical paths 3a is irradiated onto the land 11 at an angle that does not hit the linear solder 8 supplied from the solder supply nozzle 4 with respect to the irradiation center O. Therefore, the linear solder 8 is not melted by the laser beam L before contacting the soldering point 2. For this reason, the melted portion of the linear solder 8 does not become spherical and adhere to the tip of the linear solder 8, thus not hindering the supply of solder.

[0027] Further, during the soldering, the inert gas from the gas supply device 7 is jetted from the injection port 5a at the tip of the first gas flow path 5 so as to surround the laser beam L of the irradiation optical path 3a and also surround the soldering point 2.

[0028] As is apparent from FIG. 5, the first gas flow path 5 is formed inside a conical optical path cover 20 attached to the tip of the irradiation head 1. The optical path cover 20 has a double structure consisting of a conical inner cylinder 20a and a conical outer cylinder 20b. The first gas flow path 5 is formed between the inner cylinder 20a and the outer cylinder 20b. At the tip of the optical path cover 20, a ring-shaped injection port 5a for injecting an inert gas so as to surround the soldering point 2 is formed. At the base end portion of the optical path cover 20, a connection portion 21 for connecting the first gas flow path 5 to the gas supply device 7 is formed. Therefore, the first gas flow path 5 surrounds the plurality of laser beams L emitted from the condenser lens 18 in a conical shape, and has the ring-shaped injection port 5a at its tip for injecting an inert gas so as to surround the soldering point 2. The flow path width of the first gas flow path 5 (the distance between the inner cylinder 20a and the outer cylinder 20b) gradually narrows from the base end side to the tip end side of the optical path cover 20.

[0029] Then, by injecting the inert gas from the first gas flow path 5, the soldering point 2 is surrounded by an atmosphere of the inert gas. For this reason, oxidation of the land 11, the lead 12, and the solder 8 is prevented, not only does the wetting spread of the molten solder proceed smoothly, but also the entry of foreign matter in the atmosphere into the solder is prevented by blocking the atmosphere. Further, since the optical path cover 20 and the inert gas injected from the optical path cover 20 surround the soldering point 2, the soldering point 2 is blocked from the outside, so that scattering of solder balls generated during melting of the linear solder 8 to the periphery is prevented. As a result, high-quality soldering is performed. FIG. 8 shows the state of the soldering point 2 after soldering. It is desirable that the inert gas be injected in a state where it is heated and warmed to an appropriate temperature by a heater provided at an appropriate position in the flow path so that the soldering point is not cooled by the injection. When the soldering of one soldering point 2 is completed in this way, the irradiation head 1 and the printed circuit board 10 are relatively displaced by the control device 14, so that all the soldering points 2 are successively soldered.

[0030] Here, one of the three observation optical paths 3b, 3c, 3d is an imaging optical path 3b for imaging the soldering point 2, another one is an illumination optical path 3c for irradiating the soldering point 2 with illumination light, and the remaining one is a measurement optical path 3d for measuring the temperature of the soldering point 2.

[0031] As shown in FIG. 9, the imaging optical path 3b includes a CCD camera 23, a light guide fiber 24 connected to the CCD camera 23, and a collimator lens 17b and a condenser lens 18 interposed between the light guide fiber 24 and the soldering point 2. An image of the soldering point 2 is captured by the CCD camera 23 through the collimator lens 17b and the condenser lens 18. The image of the soldering point 2 captured by the CCD camera 23 is displayed on a monitor (not shown). Then, the image by the CCD camera is used, for example, when setting the irradiation position of the laser light on the soldering point 2, the supply position of the solder, etc. during the teaching operation performed prior to soldering.

[0032] Also, as shown in FIG. 10, the illumination optical path 3c includes a light source 25, and a collimator lens 17c and a condenser lens 18 interposed between the light source 25 and the soldering point 2. During the teaching operation or the like, the illumination light Lc from the light source 25 is irradiated onto the soldering point 2 through the collimator lens 17c and the condenser lens 18.

[0033] Furthermore, as shown in FIG. 11, the measurement optical path 3d includes an infrared radiation thermometer 26, and a collimating lens 17d and a condenser lens 18 interposed between the radiation thermometer 26 and the soldering point 2. The infrared light Ld emitted from the soldering point 2 is received by the radiation thermometer 26 through the condenser lens 18 and the collimating lens 17d, thereby measuring the temperature of the soldering point 2. Based on the measured temperature, the control device 14 controls the output of the semiconductor laser element 15, the irradiation time of the laser light L, etc., and performs control over the entire soldering process.

[0034] As shown in FIG. 2, one observation optical path 3b or 3c or 3d is arranged between every two of the irradiation optical paths 3a. In other words, by arranging the observation optical paths 3b, 3c, 3d one by one between the irradiation optical paths 3a, the observation optical paths 3b, 3c, 3d are not directly adjacent to each other, and the three observation optical paths 3b, 3c, 3d are arranged at equal angular intervals (120 degrees in the example of the streaks) around the irradiation center O. This is to prevent uneven irradiation of the laser light L on the soldering point 2 due to a large increase in the interval between the adjacent irradiation optical paths 3a, 3a at that part when the observation optical paths 3b, 3c, 3d are directly adjacent to each other. However, the positions where the three observation optical paths 3b, 3c, 3d are arranged among the plurality of optical paths are arbitrary, and it is not necessarily required to arrange them in the order as shown in FIGS. 1 and 2.

[0035] The collimating lenses 17b, 17c, 17d of the three observation optical paths 3b, 3c, 3d are located on the same circumference within the same plane S as the collimating lenses 17a of the six irradiation optical paths 3a, and the condenser lenses 18 of the observation optical paths 3b, 3c, 3d are common with the condenser lenses 18 of the irradiation optical paths 3a. However, the condenser lens 18 may be independent for each of the optical paths 3a, 3b, 3c, 3d. In that case, the plurality of independent condenser lenses 18 need to be arranged so that the solder supply nozzle 4 can be arranged along the irradiation center O.

[0036] In this way, by incorporating the irradiation optical path 3a and the observation optical paths 3b, 3c, 3d into the irradiation head 1 in the manner described above, it becomes possible to reduce the size and weight of the irradiation head 1, that is, the soldering device, compared to the case where these observation optical paths 3b, 3c, 3d are externally attached to the irradiation head 1.

[0037] In addition to the first gas flow path 5, a second gas flow path 27 can be provided in the irradiation head 1. As schematically shown in FIG. 12, this second gas flow path 27 is formed inside a flow path cylinder 28 disposed so as to surround the solder supply nozzle 4. The flow path cylinder 28 has a double cylindrical shape composed of an inner cylinder 28a and an outer cylinder 28b. The second gas flow path 27 is formed between the inner cylinder 28a and the outer cylinder 28b, and a ring-shaped injection port 27a for injecting an inert gas is formed at the tip (lower end) of the flow path cylinder 28 so as to surround the solder supply nozzle 4. However, this second gas flow path 27 is not necessarily required if there is the first gas flow path 5.

[0038] In the first embodiment, six irradiation optical paths 3a are provided, but the number of the irradiation optical paths 3a may be more or less than six, and even one may be sufficient. When there is one irradiation optical path 3a, as in the second embodiment shown in FIGS. 13 and 14, four optical paths, that is, the irradiation optical path 3a, the imaging optical path 3b, the illumination optical path 3c, and the measurement optical path 3d, are arranged around the irradiation center O at 90-degree intervals. However, the four optical paths 3a, 3b, 3c, 3d do not necessarily have to be arranged at exactly equal intervals, and the angles between them may be slightly different. Also, the positional relationship of the four optical paths 3a, 3b, 3c, 3d is arbitrary.

[0039] Also, when there is one optical path 3a for irradiation in this way, as the soldering point 2, in order to be able to uniformly heat the entire soldering point 2 in a short time with one laser beam L, rather than the one composed of the annular land 11 and the lead 12 as shown in FIGS. 3 and 4, for example, as shown in FIG. 15, it is preferably composed of a flat linear terminal 30 formed on the printed circuit board 10 and a flat linear or pin-shaped terminal 31 of the electronic component.

[0040] FIG. 16 shows a main part of the third embodiment of the present invention. The irradiation head 1A of the soldering apparatus of this third embodiment has gas flow paths 34, 35 for injecting an inert gas and a suction flow path 36 for sucking the fumes generated when the solder melts.

[0041] Therefore, at the tip of the irradiation head 1A, an optical path cover 32 having a double structure that is conical as a whole and composed of an inner cylinder 32a and an outer cylinder 32b is attached. Between the inner cylinder 32a and the outer cylinder 32b of the optical path cover 32, the suction flow path 36 is formed, and at the tip of the optical path cover 32, a ring-shaped suction port 36a communicating with the suction flow path 36 is formed.

[0042] Also, on the outer periphery of the solder supply nozzle 4, a flow path cylinder 33 having a double cylindrical shape composed of an inner cylinder 33a and an outer cylinder 33b is attached. Between the inner cylinder 33a and the outer cylinder 33b of the flow path cylinder 33, an inner gas flow path 34 for injecting an inert gas is formed, and between the outer periphery of the flow path cylinder 33 and the inner periphery of the optical path cover 32, an outer gas flow path 35 for injecting an inert gas is formed. The inner gas flow path 34 is connected to the gas supply device 7, and the outer gas flow path 35 is also connected to the gas supply device 7 through a communication path 35a formed inside the irradiation head 1. Since the inner gas flow path 34 and the outer gas flow path 35 are covered by the optical path cover 32, it can be said that they are formed inside the optical path cover 32.

[0043] In the third embodiment, during soldering, the inert gas from the gas supply device 7 is supplied through the inner gas flow path 34 and the outer gas flow path 35 toward the soldering point 2 as indicated by the arrow a in FIG. 16. On the other hand, the air containing the fumes generated during soldering is sucked into the suction flow path 36 from the suction port 36a as indicated by the arrow b in FIG. 16, purified by being filtered by the suction device 37, and then discharged into the atmosphere.

[0044] The gas supply device 7 and the suction device 37 are connected to the control device 14, and by controlling the gas supply device 7 and the suction device 37 by the control device 14, the injection amount and injection speed of the inert gas from the inner gas flow path 34 and the outer gas flow path 35, and the suction amount and suction speed of the air containing the fumes into the suction flow path 36, etc. are controlled. In addition, the configurations and operations other than those described above in the third embodiment are substantially the same as those in the first embodiment or the second embodiment.

[0045] In each of the above embodiments, the solder supplied from the solder supply nozzle 4 is the linear solder 8, but it does not necessarily have to be the linear solder 8, and it may be a solder piece cut to a certain length, or a solder paste. In this case, the solder piece or the solder paste is supplied to the soldering point 2 in a state of falling or jetting from the solder supply nozzle 4.

Explanation of Reference Numerals

[0046] 1 Irradiation head 2 Soldering point 3a Optical path for irradiation 3b Optical path for imaging 3c Optical path for illumination 3d Optical path for measurement 4 Solder supply nozzle 5 First gas flow path 15 Semiconductor laser element 16 Optical fiber 17a, 17b, 17c, 17d Parallel lens 18 light-collecting lenses 20, 32 optical path covers 20a, 32a inner cylinders 20b, 32b outer cylinders 23 CCD cameras 25 light sources 26 radiation thermometers 27 second gas flow paths 27a injection ports 28 flow path cylinders 28a inner cylinders 28b outer cylinders 34 inner gas flow paths 35 outer gas flow paths 36 suction flow paths 36a suction ports L laser light

Claims

1. having an irradiation head for irradiating laser light, the irradiation head having a plurality of optical paths arranged so as to surround an irradiation center which is the center of the irradiation head, and a solder supply nozzle arranged at or near the irradiation center, the plurality of optical paths including at least one irradiation optical path for irradiating laser light to a soldering point, an imaging optical path for imaging the soldering point, an illumination optical path for irradiating illumination light to the soldering point, and a measurement optical path for measuring the temperature of the soldering point, the irradiation optical path having a semiconductor laser element capable of controlling the output of laser light, an optical fiber connected to the semiconductor laser element, a collimating lens for making the laser light emitted from the optical fiber into parallel light, and a condensing lens for condensing the laser light emitted from the collimating lens, the laser light of the irradiation optical path being irradiated to the soldering point at an angle that does not hit the solder supplied from the solder supply nozzle to the soldering point with respect to the irradiation center, a laser soldering apparatus characterized by the above.

2. there are a plurality of the irradiation optical paths, and the laser light of the plurality of irradiation optical paths is irradiated to the soldering point so as to surround the irradiation center in a state of maintaining an angle that does not hit the solder supplied from the solder supply nozzle with respect to the irradiation center, the laser soldering apparatus according to claim 1, characterized by the above.

3. the laser soldering apparatus according to claim 1 or 2, characterized by having a first gas flow path for supplying an inert gas to the soldering point.

4. the first gas flow path surrounds the laser light emitted from the condensing lens in a conical shape and has a ring-shaped injection port at the tip for injecting an inert gas so as to surround the soldering point, the laser soldering apparatus according to claim 3, characterized by the above.

5. at the tip of the irradiation head, an optical path cover having a double structure forming a conical shape as a whole composed of an inner cylinder and an outer cylinder is attached, the optical path cover surrounds the plurality of optical paths in a conical shape, and the first gas flow path is formed between the inner cylinder and the outer cylinder, the laser soldering apparatus according to claim 4, characterized by the above.

6. having a second gas flow path for supplying an inert gas to the soldering point, The laser soldering apparatus according to any one of claims 1 to 5, wherein the second gas flow path is formed between an inner cylinder and an outer cylinder of a flow path cylinder having a double-cylindrical shape surrounding the solder supply nozzle.

7. The laser soldering apparatus according to claim 1 or 2, further comprising: a gas flow path for supplying an inert gas to the soldering point; and a suction flow path for sucking fumes generated during soldering.

8. At the tip of the irradiation head, an optical path cover having a double structure that is conical as a whole and composed of an inner cylinder and an outer cylinder is attached. The optical path cover surrounds the plurality of optical paths in a conical shape, and the suction flow path is formed between the inner cylinder and the outer cylinder. A ring-shaped suction port communicating with the suction flow path is formed at the tip of the optical path cover, and the gas flow path is formed inside the optical path cover. The laser soldering apparatus according to claim 7, characterized in that.

9. The gas flow path includes an inner flow path formed between an inner cylinder and an outer cylinder of a flow path cylinder having a double-cylindrical shape surrounding the solder supply nozzle, and an outer flow path formed between the inner periphery of the optical path cover and the outer periphery of the flow path cylinder. The laser soldering apparatus according to claim 7 or 8, characterized in that.

10. The imaging optical path includes a CCD camera, a parallel lens and a condenser lens interposed between the CCD camera and the soldering point, and an image of the soldering point is captured by the CCD camera through the parallel lens and the condenser lens. The illumination optical path includes a light source, a parallel lens and a condenser lens interposed between the light source and the soldering point, and the illumination light from the light source is irradiated onto the soldering point through the parallel lens and the condenser lens. The measurement optical path includes a radiation thermometer, a parallel lens and a condenser lens interposed between the radiation thermometer and the soldering point, and the temperature of the soldering point is measured by receiving infrared light radiated from the soldering point with the radiation thermometer through the condenser lens and the parallel lens. The laser soldering apparatus according to any one of claims 1 to 9, characterized by the above.

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