Dresser board and dressing method of cutting blade

Abstract

To provide a dresser board which enables proper dressing of a cutting blade.SOLUTION: A dresser board is used to correct a shape of a cutting blade and includes: a first layer including first abrasive grains and a first binder for fixing the first abrasive grains; and multiple second layers which are laminated on the first layer so as to sandwich the first layer. A thickness of the first layer is smaller than a width of the cutting blade. The second layer includes second abrasive grains whose average grain diameter is smaller than that of the first abrasive grain; and a second binder for fixing the second abrasive grains.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a dresser board used for modifying the shape of a cutting blade for cutting a workpiece, and a dressing method for a cutting blade using the dresser board.

Background Art

[0002] By dividing a wafer on which a plurality of devices are formed into individual pieces, a plurality of device chips each having a device are manufactured. Further, a plurality of device chips are mounted on a predetermined substrate, and the mounted device chips are covered with a sealing material (mold resin) made of resin, thereby obtaining a package substrate. By dividing this package substrate into individual pieces, a plurality of package devices each having a plurality of packaged device chips are manufactured. The device chips and package devices are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] For dividing workpieces such as the above-described wafers and package substrates, a cutting device is used. The cutting device includes a chuck table for holding the workpiece and a cutting unit for performing cutting on the workpiece, and an annular cutting blade is mounted on the cutting unit. By rotating the cutting blade and cutting into the workpiece held by the chuck table, the workpiece is cut and divided.

[0004] When the cutting of the workpiece by the cutting blade is continued, the tip of the cutting blade gradually wears, and the tip surface of the cutting blade changes to a rounded shape (R shape). Then, when the worn cutting blade is used to cut the workpiece into a plurality of chips, the R shape of the cutting blade is reflected in the chips, and the shape of the chips may collapse, resulting in a deterioration in the quality of the chips.

[0005] Therefore, before cutting a workpiece with a cutting blade, dressing is performed to intentionally wear the tip of the cutting blade to correct the shape of the cutting blade. Dressing is carried out by holding a member (dresser board) for dressing the cutting blade with a chuck table of a cutting device and causing the cutting blade to cut into the dresser board. For example, Patent Document 1 discloses a method of flattening the tip surface of a cutting blade by causing the cutting blade to cut into a convex portion formed on the dresser board.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] As described above, when flattening the tip surface of a cutting blade, for example, a dresser board having convex portions is used. A dresser board having convex portions is manufactured by cutting a flat dresser board with a cutting blade to form a plurality of linear grooves (concave portions) on the surface side of the dresser board. These grooves are formed to be deeper than the cutting depth of the cutting blade into the dresser board during dressing.

[0008] However, when deep grooves are formed in the dresser board, the rigidity of the dresser board decreases and a stress difference occurs between the surface side and the back side of the dresser board, which may cause the dresser board to warp. In particular, when a thin dresser board is used for material reduction or the like, warping is more likely to occur when the grooves are formed. As a result, it may be difficult to hold the dresser board flat by the chuck table and accurately cut the cutting blade into the convex portions of the dresser board.

[0009] The present invention has been made in view of such problems, and an object thereof is to provide a dresser board that enables appropriate dressing of a cutting blade, and a method for dressing a cutting blade using the dresser board.

Means for Solving the Problems

[0010] According to one aspect of the present invention, there is provided a dresser board used for modifying the shape of a cutting blade, including a first layer containing first abrasive grains and a first binder for fixing the first abrasive grains, and a plurality of second layers laminated on the first layer so as to sandwich the first layer. The thickness of the first layer is smaller than the width of the cutting blade, and the second layer contains second abrasive grains having an average particle size smaller than that of the first abrasive grains and a second binder for fixing the second abrasive grains. See, by contacting the lower surface of the cutting blade with the first layer and contacting both side surfaces of the tip of the cutting blade with the second layer, the shape of the tip of the cutting blade is corrected so that the lower surface of the cutting blade approaches a flat shape A dresser board is provided.

[0011] Preferably, the first abrasive grains and the second abrasive grains are green carborundum or white alumina, and the first binder and the second binder are resin bonds. Also, preferably, the average particle size of the first abrasive grains is 1 μm or more and 200 μm or less, and the average particle size of the second abrasive grains is 0.1 μm or more and 20 μm or less.

[0012] According to another aspect of the present invention, there is provided a dresser board used for modifying the shape of a cutting blade, including a first layer containing abrasive grains and a binder for fixing the abrasive grains, and a plurality of second layers laminated on the first layer so as to sandwich the first layer. , the The thickness of the first layer is smaller than the width of the cutting blade, and the second layer contains abrasive grains. , see, by contacting the lower surface of the cutting blade with the first layer and contacting both side surfaces of the tip of the cutting blade with the second layer, the shape of the tip of the cutting blade is corrected so that the lower surface of the cutting blade approaches a flat shape A dresser board is provided.

[0013] Furthermore, according to another aspect of the present invention, there is provided a dressing method for a cutting blade that corrects the shape of the cutting blade using a dresser board, the dresser board including a first layer containing first abrasive grains and a first binder for fixing the first abrasive grains, and a plurality of second layers laminated on the first layer so as to sandwich the first layer, the thickness of the first layer being smaller than the width of the cutting blade, the second layer including second abrasive grains having an average particle size smaller than that of the first abrasive grains and a second binder for fixing the second abrasive grains, and holding the dresser board by a chuck table such that the surfaces on which the first layer and the second layer are exposed become the upper surfaces, and relatively moving the cutting blade and the dresser board to cut the tip of the cutting blade along the first layer to the upper surface side of the dresser board, thereby bringing the lower surface of the cutting blade into contact with the first layer and bringing both side surfaces of the tip of the cutting blade into contact with the second layer, so that the lower surface of the cutting blade approaches a flat shape A dressing method for a cutting blade is provided, including a step of correcting the shape of the tip of the cutting blade.

[0014] Furthermore, according to another aspect of the present invention, there is provided a dressing method for a cutting blade that corrects the shape of the cutting blade using a dresser board, the dresser board including a first layer containing abrasive grains and a binder for fixing the abrasive grains, and a plurality of second layers laminated on the first layer so as to sandwich the first layer, the thickness of the first layer being smaller than the width of the cutting blade, the second layer not containing abrasive grains, and holding the dresser board by a chuck table such that the surfaces on which the first layer and the second layer are exposed become the upper surfaces, and relatively moving the cutting blade and the dresser board to cut the tip of the cutting blade along the first layer to the upper surface side of the dresser board, thereby bringing the lower surface of the cutting blade into contact with the first layer and bringing both side surfaces of the tip of the cutting blade into contact with the second layer, so that the lower surface of the cutting blade approaches a flat shape A dressing method for a cutting blade is provided, including a step of correcting the shape of the tip of the cutting blade.

Advantages of the Invention

[0015] The dresser board according to one aspect of the present invention is configured to include a first layer containing abrasive grains and a plurality of second layers laminated on the first layer so as to sandwich the first layer. As a result, it becomes possible to perform dressing of the cutting blade without previously forming deep grooves in the dresser board, and the occurrence of warping of the dresser board is suppressed. As a result, the dresser board is appropriately held by the chuck table, and the shape of the cutting blade can be appropriately corrected.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0017] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. First, a configuration example of the dresser board according to the present embodiment will be described. The dresser board according to the present embodiment is used for dressing (shaping) a cutting blade. The cutting blade is an annular machining tool that cuts into a workpiece to cut the workpiece.

[0018] Examples of workpieces that can be cut by a cutting blade include disk-shaped silicon wafers. For example, a silicon wafer is divided into a plurality of rectangular regions by a plurality of streets (planned division lines) arranged in a grid pattern so as to intersect each other. In addition, devices such as IC (Integrated Circuit), LSI (Large Scale Integration), LED (Light Emitting Diode), and MEMS (Micro Electro Mechanical Systems) devices are formed in the regions partitioned by the streets. By cutting this silicon wafer with a cutting blade and dividing it along the streets, a plurality of device chips each having a device are manufactured.

[0019] However, there are no restrictions on the material, shape, structure, size, etc. of the workpiece. For example, the workpiece may be a wafer made of a semiconductor other than silicon (such as GaAs, InP, GaN, SiC, etc.), glass, ceramics, resin, metal, or the like. In addition, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the devices formed on the workpiece, and the workpiece may not have any devices formed thereon. Furthermore, the workpiece may be a package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate.

[0020] When processing a workpiece with a cutting blade, first, dressing of the cutting blade is performed. Dressing is performed by rotating the cutting blade and cutting the tip of the cutting blade into a dresser board. As a result, the tip of the cutting blade comes into contact with the dresser board and wears, and the shape of the tip surface of the cutting blade is corrected.

[0021] FIG. 1 is a perspective view showing a dresser board 11. The dresser board 11 is a rectangular parallelepiped member used for dressing a cutting blade, and includes a plurality of first layers 13 and a plurality of second layers 15. The first layer 13 and the second layer 15 are plate-like members formed in a rectangular shape, and are alternately laminated in the thickness direction of the dresser board 11 (the thickness direction of the first layer 13 and the second layer 15).

[0022] The first layer 13 includes abrasive grains (first abrasive grains) and a binder (first binder) for fixing the abrasive grains. The second layer 15 also includes abrasive grains (second abrasive grains) and a binder (second binder) for fixing the abrasive grains. As the first abrasive grains and the second abrasive grains, green carborundum (GC), white alumina (WA), etc. can be used.

[0023] Note that the average particle size of the abrasive grains (second abrasive grains) included in the second layer 15 is smaller than the average particle size of the abrasive grains (first abrasive grains) included in the first layer 13. For example, the average particle size of the first abrasive grains is 1 μm or more and 200 μm or less, and the average particle size of the second abrasive grains is 0.1 μm or more and 20 μm or less.

[0024] As the first binder and the second binder, a resin bond made of resin or a vitrified bond made of ceramics can be used. In particular, when a resin bond is used as the first binder and the second binder, damage to the cutting blade when the cutting blade is cut into the dresser board 11 is suppressed, which is preferable.

[0025] For example, after impregnating the abrasive grains with a resin such as a phenolic resin or an epoxy resin, the resin is formed into a plate shape and fired at a predetermined temperature (for example, 150 ° C or more and about 200 ° C or less), whereby the plate-like first layer 13 and second layer 15 are formed. Note that when the first layer 13 and the second layer 15 contain abrasive grains, the fluidity of the resin bond decreases, and the shapes of the first layer 13 and the second layer 15 are more easily maintained.

[0026] FIG. 2(A) is a perspective view showing the first layer 13 and the second layer 15. For example, the dresser board 11 is manufactured by alternately laminating the large first layer 13 and the second layer 15 and then simultaneously cutting the first layer 13 and the second layer 15.

[0027] The first layer 13 includes a first surface (front surface) 13a and a second surface (back surface) 13b that are generally parallel to each other. Similarly, the second layer 15 includes a first surface (front surface) 15a and a second surface (back surface) 15b that are generally parallel to each other. And the second layer 15 is laminated on the first layer 13 so as to sandwich the first layer 13. Specifically, the second surface 15b side of the second layer 15 is fixed to the first surface 13a side of the first layer 13, and the first surface 15a side of the second layer 15 is fixed to the second surface 13b side of the first layer 13. For example, the first layer 13 and the second layer 15 are bonded together via an adhesive.

[0028] FIG. 2(B) is a perspective view showing the alternately laminated first layer 13 and second layer 15. By simultaneously cutting the laminated first layer 13 and second layer 15 with a cutting blade or the like, a dresser board 11 having a desired shape and dimensions can be obtained.

[0029] Note that there is no limit to the number of layers of the first layer 13 and the second layer 15 to be laminated. However, the top layer and the bottom layer of the dresser board 11 are the second layer 15. Thereby, a structure is formed in which all the first layers 13 are sandwiched by the second layers 15. Also, as will be described later, the first layer 13 is used for shaping the tip surface of the cutting blade. Therefore, the number of layers of the first layer 13 is preferably 2 or more. Thereby, it becomes possible to perform shaping of the tip surface of the cutting blade a plurality of times using one dresser board 11.

[0030] As shown in FIG. 1, the dresser board 11 includes a first surface (front surface) 11a and a second surface (back surface) 11b that are generally parallel to each other. The first surface 11a corresponds to the first surface 15a of the topmost second layer 15, and the second surface 11b corresponds to the second surface 15b of the lowermost second layer 15.

[0031] Further, the dresser board 11 includes a pair of third surfaces (side surfaces) 11c connected to the long sides of the first surface 11a and the second surface 11b, and a pair of fourth surfaces (side surfaces) 11d connected to the short sides of the first surface 11a and the second surface 11b. The pair of third surfaces 11c are rectangular flat surfaces that are generally parallel to the length direction of the dresser board 11 (the length direction of the first layer 13 and the second layer 15) and the thickness direction of the dresser board 11. Also, the pair of fourth surfaces are rectangular flat surfaces that are generally parallel to the width direction of the dresser board 11 (the width direction of the first layer 13 and the second layer 15) and the thickness direction of the dresser board 11.

[0032] On the third surface 11c and the fourth surface 11d, the side surfaces of the first layer 13 and the side surfaces of the second layer 15 are exposed. Therefore, a periodic stripe pattern (horizontal stripe pattern) formed by the alternating arrangement of the side surfaces of the first layer 13 and the side surfaces of the second layer 15 appears on the third surface 11c and the fourth surface 11d.

[0033] Using the above-described dresser board 11, dressing of the cutting blade is performed. When dressing the cutting blade, first, the dresser board 11 is supported by an annular frame. FIG. 3 is a perspective view showing the dresser board 11 supported by the annular frame 17.

[0034] The frame 17 is made of a metal such as SUS (stainless steel), for example. A circular opening 17a penetrating the frame 17 in the thickness direction is provided at the center of the frame 17. Note that the diameter of the opening 17a is larger than the length of each side of the dresser board 11. And the dresser board 11 is disposed inside the opening 17a.

[0035] A tape 19 is attached to the dresser board 11 and the frame 17. Specifically, the central portion of the tape 19 is attached to the dresser board 11, and the outer peripheral portion of the tape 19 is attached to the frame 17. As a result, the dresser board 11 is supported by the frame 17 via the tape 19.

[0036] The tape 19 includes a film-shaped base material formed in a circular shape and an adhesive layer (paste layer) provided on the base material. For example, the base material is made of a resin such as polyolefin, polyvinyl chloride, polyethylene terephthalate, etc., and the adhesive layer is made of an epoxy-based, acrylic-based, or rubber-based adhesive, etc. Further, the adhesive layer may be an ultraviolet curable resin that cures by irradiation with ultraviolet rays.

[0037] Note that the dresser board 11 is arranged so that the tape 19 is attached to one of the pair of third surfaces 11c. Therefore, the dresser board 11 is supported by the frame 17 in a state where the other of the pair of third surfaces 11c having a striped pattern is exposed upward, and the first surface 11a, the second surface 11b, and the pair of fourth surfaces 11d having a striped pattern are exposed laterally.

[0038] By cutting a cutting blade into the dresser board 11 supported by the frame 17, dressing of the cutting blade is performed. A cutting device is used for dressing the cutting blade. FIG. 4 is a perspective view showing the cutting device 2. In FIG. 4, the X-axis direction (machining feed direction, first horizontal direction) and the Y-axis direction (indexing feed direction, second horizontal direction) are perpendicular to each other. Further, the Z-axis direction (vertical direction, up and down direction, height direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0039] The cutting device 2 includes a chuck table (holding table) 4 capable of holding a workpiece and the dresser board 11. The upper surface of the chuck table 4 is a flat surface substantially parallel to the horizontal direction (XY plane direction), and constitutes a holding surface 4a (see FIG. 5) for holding the workpiece or the dresser board 11. The holding surface 4a is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), etc. formed inside the chuck table 4.

[0040] The chuck table 4 is connected with a ball screw type moving mechanism (not shown) for moving the chuck table 4 along the X-axis direction and a rotational drive source such as a motor (not shown) for rotating the chuck table 4 around a rotation axis substantially parallel to the Z-axis direction. Further, a plurality of clamps 6 (see FIG. 5) for gripping and fixing the frame 17 are provided around the chuck table 4.

[0041] Above the chuck table 4, a cutting unit 8 capable of cutting a workpiece and a dresser board 11 is provided. The cutting unit 8 includes a cylindrical housing 10, and a cylindrical spindle 12 (see FIG. 5) arranged along the Y-axis direction is accommodated in the housing 10. The tip (one end) of the spindle 12 is exposed outside the housing 10, and a rotational drive source such as a motor is connected to the base end (the other end) of the spindle 12.

[0042] An annular cutting blade 14 for cutting a workpiece is mounted on the tip of the spindle 12. The cutting blade 14 rotates around a rotation axis substantially parallel to the Y-axis direction by the power transmitted from the rotational drive source through the spindle 12.

[0043] As the cutting blade 14, for example, a hub type cutting blade (hub blade) is used. The hub blade is a cutting blade in which an annular base made of metal or the like and an annular cutting edge formed along the outer peripheral edge of the base are integrated. The cutting edge of the hub blade can be constituted by an electroformed grindstone including abrasive grains made of diamond, cubic boron nitride (cBN), or the like and a binder such as a nickel plating layer for fixing the abrasive grains.

[0044] However, a washer type cutting blade (washer blade) can also be used as the cutting blade 14. The washer blade is constituted only by an annular cutting edge including abrasive grains and a binder (metal bond, resin bond, vitrified bond, etc.) for fixing the abrasive grains.

[0045] When the cutting blade 14 is attached to the cutting unit 8, the cutting blade 14 is covered by a blade cover 16 fixed to the housing 10. The blade cover 16 includes a pair of connection parts 18 connected to a tube (not shown) to which a cutting fluid such as pure water is supplied, and a pair of nozzles 20 connected to the pair of connection parts 18. The pair of nozzles 20 are arranged on both side surfaces (front and back surfaces) of the cutting blade 14 so as to sandwich the lower end portion of the cutting blade 14. Further, each of the pair of nozzles 20 is provided with a supply port (not shown) that opens toward the cutting blade 14.

[0046] When the cutting fluid is supplied to the pair of connection parts 18, the cutting fluid flows into the pair of nozzles 20, and the cutting fluid is supplied from the injection ports of the pair of nozzles 20 toward both side surfaces (front and back surfaces) of the cutting blade 14. By this cutting fluid, the cutting blade 14 and the workpiece or dresser board 11 held by the chuck table 4 are cooled, and the chips (cutting chips) generated by the cutting process are washed away.

[0047] A ball screw type moving mechanism (not shown) for moving the cutting unit 8 is connected to the cutting unit 8. The moving mechanism moves the cutting unit 8 along the Y-axis direction and raises and lowers it along the Z-axis direction. By the moving mechanism, the position of the cutting blade 14 in the indexing feed direction and the cutting depth of the cutting blade 14 into the workpiece or dresser board 11 are adjusted.

[0048] A workpiece such as a silicon wafer is cut by the above-described cutting device 2. For example, the cutting blade 14 cuts the silicon wafer along the streets to divide it into a plurality of device chips.

[0049] Note that when the cutting of the workpiece by the cutting blade 14 is continued, the tip of the cutting blade 14 wears, and the tip surface of the cutting blade 14 changes to a rounded shape (R shape) (see FIG. 5). Then, when the worn cutting blade 14 is used to cut the workpiece into a plurality of chips, the R shape of the cutting blade 14 is reflected in the chips, which may cause the chip shape to collapse and the chip quality to deteriorate.

[0050] Therefore, before machining the workpiece with the cutting blade 14, dressing is performed to intentionally wear the tip of the cutting blade 14 to correct the shape of the cutting blade 14. The dressing is performed by cutting the cutting blade 14 into the dresser board 11. Hereinafter, a specific example of a dressing method for a cutting blade for correcting the shape of the cutting blade 14 using the dresser board 11 will be described.

[0051] First, the dresser board 11 is held by the chuck table 4 (holding step). FIG. 5 is a partial cross-sectional front view showing the dresser board 11 held by the chuck table 4.

[0052] In the holding step, the dresser board 11 supported by the frame 17 is placed on the holding surface 4a of the chuck table 4 via the tape 19. Further, the frame 17 is fixed by a plurality of clamps 6. When the suction force (negative pressure) of the suction source is applied to the holding surface 4a in this state, the dresser board 11 is suction-held by the chuck table 4 via the tape 19. As a result, the dresser board 11 is held by the chuck table 4 such that the side surfaces of the first layer 13 and the second layer 15 are exposed and the third surface 11c (see FIG. 1 etc.) presenting a striped pattern becomes the upper surface.

[0053] Next, the shape of the tip of the cutting blade 14 is corrected by cutting the cutting blade 14 into the upper surface side of the dresser board 11 (dressing step). FIG. 6(A) is a partial cross-sectional front view showing the dresser board 11 and the cutting blade 14 in the dressing step.

[0054] In the dressing step, first, the chuck table 4 is rotated to align the length direction (longitudinal direction of the third surface 11c) of the dresser board 11 with the X-axis direction. As a result, the dresser board 11 is arranged such that the length direction is along the X-axis direction, the thickness direction is along the Y-axis direction, and the width direction is along the Z-axis direction.

[0055] Also, move the cutting unit 8 (see FIGS. 4 and 5) along the Y-axis direction to align the positions of the first layer 13 of the dresser board 11 and the cutting blade 14 in the Y-axis direction. For example, the cutting blade 14 is positioned such that the positions in the Y-axis direction of the center in the thickness direction of the first layer 13 (the left-right direction on the paper surface in FIG. 6(A)) and the center in the width direction of the cutting blade 14 (the left-right direction on the paper surface in FIG. 6(A)) coincide. Further, move the cutting unit 8 (see FIGS. 4 and 5) along the Z-axis direction to position the lower end of the cutting blade 14 below the upper surface (the third surface 11c) of the dresser board 11.

[0056] Thereafter, while rotating the cutting blade 14, move the chuck table 4 along the X-axis direction. As a result, the dresser board 11 and the cutting blade 14 relatively move along the machining feed direction, and the tip of the cutting blade 14 cuts into the upper surface side of the dresser board 11 along the first layer 13. As a result, the upper surface side of the dresser board 11 is cut by the cutting blade 14, and a linear groove is formed along the first layer 13 on the upper surface side of the dresser board 11. Also, the tip of the cutting blade 14 is worn due to contact with the dresser board 11, and the shape of the lower surface (the tip surface) 14a of the cutting blade 14 is corrected.

[0057] Here, the thickness d1 of the first layer 13 is smaller than the width D of the cutting blade 14. Therefore, the lower surface 14a of the cutting blade 14 contacts the first layer 13 containing abrasive grains with a large particle size (the first abrasive grains), and both side surfaces of the tip of the cutting blade 14 contact the second layer 15 containing abrasive grains with a small particle size (the second abrasive grains). Therefore, wear easily progresses on the lower surface 14a of the cutting blade 14, and wear hardly progresses on both side surfaces of the tip of the cutting blade 14.

[0058] Note that the thicknesses of the first layer 13 and the second layer 15 can be appropriately set according to the width D of the cutting blade 14. Also, the sum (d2 + 2d1) of the thickness d2 of the second layer 15 and the thicknesses d1 of the two first layers sandwiching the second layer 15 may be smaller than the width D of the cutting blade 14. In this case, when the cutting blade 14 is cut into the dresser board 11, the lower surface 14a of the cutting blade 14 contacts two or more first layers 13.

[0059] FIG. 6(B) is a front view showing the cutting blade 14 after the dressing process. When the cutting blade 14 is cut into the dresser board 11 along the first layer 13 as described above, the area of the tip of the cutting blade 14 that contacts the first layer 13 is preferentially worn, and the roundness of the lower surface 14a of the cutting blade 14 is gradually eliminated. Then, when the lower surface 14a of the cutting blade 14 becomes flat, the dressing of the cutting blade 14 is completed.

[0060] Note that the number of times the cutting blade 14 is cut into the dresser board 11 is appropriately set according to the shape, material, size, etc. of the cutting blade 14. When the cutting blade 14 is cut into the dresser board 11 multiple times, after the cutting blade 14 is cut into the dresser board 11 along the first layer 13 of the first layer, the cutting blade 14 is moved in the Y-axis direction and cut into the dresser board 11 along the first layer 13 of the second layer. By repeating this operation, the cutting blade 14 can be cut into the dresser board 11 the desired number of times. Then, when grooves are formed along all the first layers 13, the used dresser board 11 is replaced with a new dresser board 11 (unused dresser board 11).

[0061] As described above, the dresser board 11 according to the present embodiment includes a first layer 13 containing abrasive grains and a plurality of second layers 15 laminated on the first layer 13 so as to sandwich the first layer 13. As a result, it becomes possible to dress the cutting blade 14 without previously forming deep grooves in the dresser board 11, and the occurrence of warping of the dresser board 11 is suppressed. As a result, the dresser board 11 is appropriately held by the chuck table 4, and the shape of the cutting blade 14 can be appropriately corrected.

[0062] In addition, in the above embodiment, the case where the second layer 15 contains abrasive grains (second abrasive grains) having a smaller average particle size than the first layer 13 has been described. However, as the second layer 15, a layer not containing abrasive grains can also be used. In this case, wear hardly occurs on both side surfaces of the tip of the cutting blade 14 that contacts the second layer 15, and the lower surface 14a of the cutting blade 14 is easily corrected to a flat shape.

[0063] In addition, the structure, method, etc. according to the above embodiment can be appropriately changed and implemented as long as they do not deviate from the scope of the object of the present invention.

Explanation of reference numerals

[0064] 11 Dresser board 11a First surface (front surface) 11b Second surface (back surface) 11c Third surface (side surface) 11d Fourth surface (side surface) 13 First layer 13a First surface (front surface) 13b Second surface (back surface) 15 Second layer 15a First surface (front surface) 15b Second surface (back surface) 17 Frame 17a Opening 19 Tape 2 Cutting device 4 Chuck table (holding table) 4a Holding surface 6 Clamp 8 Cutting unit 10 Housing 12 Spindle 14 Cutting blade 14a Bottom surface (end face) 16 Blade cover 18 Connection part 20 Nozzle

Claims

1. A dresser board used for modifying the shape of a cutting blade, comprising: a first layer including first abrasive grains and a first binder for fixing the first abrasive grains; a plurality of second layers laminated on the first layer so as to sandwich the first layer; the thickness of the first layer is smaller than the width of the cutting blade; the second layer includes second abrasive grains having an average particle size smaller than that of the first abrasive grains and a second binder for fixing the second abrasive grains; A dresser board, characterized in that, by contacting the lower surface of the cutting blade with the first layer and contacting both side surfaces of the tip of the cutting blade with the second layer, the shape of the tip of the cutting blade is modified so that the lower surface of the cutting blade approaches a flat shape.

2. The first abrasive grains and the second abrasive grains are green carborundum or white carborundum, The dresser board according to claim 1, characterized in that the first binder and the second binder are resin bonds.

3. The average particle size of the first abrasive grains is 1 μm or more and 200 μm or less, The dresser board according to claim 1 or 2, characterized in that the average particle size of the second abrasive grains is 0.1 μm or more and 20 μm or less.

4. A dresser board used for modifying the shape of a cutting blade, comprising: a first layer including abrasive grains and a binder for fixing the abrasive grains; a plurality of second layers laminated on the first layer so as to sandwich the first layer; the thickness of the first layer is smaller than the width of the cutting blade; the second layer does not contain abrasive grains; A dresser board, characterized in that, by contacting the lower surface of the cutting blade with the first layer and contacting both side surfaces of the tip of the cutting blade with the second layer, the shape of the tip of the cutting blade is modified so that the lower surface of the cutting blade approaches a flat shape.

5. A dressing method for a cutting blade for modifying the shape of the cutting blade using a dresser board, wherein the dresser board includes a first layer including first abrasive grains and a first binder for fixing the first abrasive grains, and a plurality of second layers laminated on the first layer so as to sandwich the first layer; the thickness of the first layer is smaller than the width of the cutting blade; the second layer includes second abrasive grains having an average particle size smaller than that of the first abrasive grains and a second binder for fixing the second abrasive grains; A step of holding the dresser board by a chuck table such that the surfaces on which the first layer and the second layer are exposed become the upper surfaces; A step of relatively moving the cutting blade and the dresser board and cutting the tip of the cutting blade along the first layer to the upper surface side of the dresser board, thereby bringing the lower surface of the cutting blade into contact with the first layer and bringing both side surfaces of the tip of the cutting blade into contact with the second layer, and correcting the shape of the tip of the cutting blade so that the lower surface of the cutting blade approaches a flat shape, the dressing method of a cutting blade being characterized by including the steps.

6. A dressing method of a cutting blade for correcting the shape of the cutting blade using a dresser board, The dresser board includes a first layer containing abrasive grains and a binder for fixing the abrasive grains, and a plurality of second layers laminated on the first layer so as to sandwich the first layer, The thickness of the first layer is smaller than the width of the cutting blade, The second layer does not contain abrasive grains, A step of holding the dresser board by a chuck table such that the surfaces on which the first layer and the second layer are exposed become the upper surfaces; A step of relatively moving the cutting blade and the dresser board and cutting the tip of the cutting blade along the first layer to the upper surface side of the dresser board, thereby bringing the lower surface of the cutting blade into contact with the first layer and bringing both side surfaces of the tip of the cutting blade into contact with the second layer, and correcting the shape of the tip of the cutting blade so that the lower surface of the cutting blade approaches a flat shape, the dressing method of a cutting blade being characterized by including the steps.

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