Processing device

Abstract

To provide a processing device which enables even an inexperienced operator to easily reproduce appropriate photographing conditions and suppresses frequent occurrence of failures and frequent stoppages of processing due to inappropriate photographing conditions.SOLUTION: In a control unit of a processing device, when an inspection unit determines that the contrast of an image captured with set light intensity is clear, the image is recorded as a sample image in association with the processing conditions of a workpiece, and when the inspection unit determines that the contrast of the image (inspection image 312) photographed with the set light amount intensity is unclear, the image determined to be unclear (inspection image 312) and a sample image 322 recorded in association with the processing conditions are displayed on a display 70, and a review screen 321 for comparing and reviewing lighting conditions is displayed.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a processing apparatus.

Background Art

[0002] When dividing a semiconductor wafer, a package substrate, or the like into a plurality of chips, a cutting apparatus equipped with a cutting blade or a laser processing apparatus that irradiates a laser beam is used. These processing apparatuses usually include a camera for imaging the workpiece. By imaging the processing marks formed on the workpiece with this camera, the processing apparatus automatically recognizes processing defects such as chipping accompanying the processing marks, meandering of the processing marks, and deviation between the position of the processing marks and the position to be processed (kerf check), and implements measures such as correction of the processing position, interruption of the processing, and calling of an operator (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In kerf check, depending on the setting of the shooting conditions, for example, changes in the light amount (such as dirt on the microscope, deterioration of the light source, etc.), the presence or absence of the influence of remaining water in the kerf (which varies depending on the setting of the air blow), and focus deviation (the focusing position is different from the height of the workpiece), even for the same processing mark, the inspection result may change between passing and failing. In addition, the light amount may gradually become darker due to deterioration of the illumination, etc., and even if the values set in the apparatus (voltage or current values) are the same, the actual light amount changes. Therefore, the operator needs to adjust to an appropriate light amount, but inexperienced operators may not notice this, resulting in frequent occurrence of failures and frequent stops of processing.

[0005] The present invention has been made in view of such problems, and its object is to provide a processing apparatus that can easily reproduce appropriate imaging conditions even for an operator with little experience, and can suppress the frequent occurrence of nonconformities due to inappropriate imaging conditions and the frequent occurrence of processing stops.

Means for Solving the Problems

[0006] In order to solve the above-described problems and achieve the object, a processing apparatus of the present invention includes a chuck table that holds a workpiece having a plurality of planned division lines, and a processing unit that processes the workpiece held on the chuck table along the planned division lines. The processing apparatus includes a camera having illumination for imaging the workpiece held on the chuck table, an inspection unit that detects a processing mark formed by the processing unit from an image of the planned division line and inspects the state of the processing mark with a predetermined inspection item, a recording unit that records inspection conditions of the inspection unit including the light quantity intensity of the illumination for each processing condition for forming the processing mark, a display, and a control unit that controls each component. When the inspection unit determines that the contrast of the image taken at the set light quantity intensity is clear, the control unit records the image as a reference image associated with the processing condition of the workpiece. When the inspection unit determines that the contrast of the image taken at the set light quantity intensity is unclear, the control unit displays the image determined to be unclear and the reference image recorded in association with the processing condition on the display, and displays an examination screen on which the state of the illumination can be compared and considered.

[0007] The inspection conditions of the inspection unit further include an air blow condition by an air blow nozzle provided below the camera when imaging the processing mark, and the inspection unit may image the image under the set light quantity intensity and air blow condition.

[0008] The inspection conditions of the inspection unit further include the distance from the workpiece of the camera when imaging the processing mark, and the inspection unit may image the image under the set light quantity intensity and the distance from the workpiece.

[0009] The processing unit is a cutting unit in which a cutting blade is attached to a spindle, or a laser beam irradiation unit that irradiates a laser beam, and the processing marks may be cutting grooves or laser processing marks.

Advantages of the Invention

[0010] The present invention can easily reproduce appropriate shooting conditions even for an inexperienced operator, and can suppress frequent occurrence of non-conformities due to inappropriate shooting conditions and frequent stoppages of processing.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Modes for Carrying Out the Invention

[0012] Embodiments for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the content described in the following embodiments. Also, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Also, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[0013] [Embodiment 1] The processing apparatus 1 according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the processing apparatus 1 according to Embodiment 1. FIG. 2 is a perspective view showing a main part of the processing apparatus 1 in FIG. 1. FIG. 3 is a cross-sectional view showing details of the camera 40 in FIG. 1. As shown in FIG. 1, the processing apparatus 1 includes a chuck table 10, a processing unit 20, a moving unit 30, a camera 40, an inspection unit 50, a recording unit 60, a display 70, and a control unit 80.

[0014] In Embodiment 1, the workpiece 100 to be processed by the processing apparatus 1 is, for example, a disk-shaped semiconductor device wafer or an optical device wafer having a base material such as silicon, sapphire, silicon carbide (SiC), or gallium arsenide. As shown in FIG. 1, the workpiece 100 includes a plurality of division planned lines 102 formed in a grid pattern on a flat surface 101, and a device 103 is formed in a region partitioned by the plurality of division planned lines 102. In Embodiment 1, an adhesive tape 105 is attached to the back surface 104 on the back side of the surface 101 of the workpiece 100, and an annular frame 106 is attached to the outer edge portion of the adhesive tape 105, but the present invention is not limited thereto. Also, in the present invention, the workpiece 100 may be a rectangular package substrate, a ceramic plate, or a glass plate having a plurality of devices sealed with resin.

[0015] The chuck table 10 has a disk-shaped frame body in which a recess is formed, and a disk-shaped suction portion fitted into the recess. The suction portion of the chuck table 10 is formed of a porous material such as porous ceramic and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). The upper surface of the suction portion of the chuck table 10 is a holding surface 11 on which the workpiece 100 is placed and which sucks and holds the placed workpiece 100. In the first embodiment, the workpiece 100 is placed with its surface 101 facing upward on the holding surface 11, and the placed workpiece 100 is sucked and held from the back surface 104 side via the adhesive tape 105. The holding surface 11 and the upper surface of the frame body of the chuck table 10 are arranged on the same plane and are formed parallel to the XY plane, which is a horizontal plane. The chuck table 10 is movable in the X-axis direction, which is one horizontal direction, by the X-axis moving unit 31 of the moving unit 30, and is rotatably provided around an axis parallel to the Z-axis direction, which is the vertical direction and perpendicular to the holding surface 11, by a rotation drive source (not shown).

[0016] In the first embodiment, as shown in FIG. 1, the machining unit 20 is a cutting unit including a spindle 22 to which a cutting blade 21 is attached at the tip. The cutting blade 21 attached to the tip of the spindle 22 is subjected to a rotational operation around an axis parallel to the Y-axis direction, which is another horizontal direction and orthogonal to the X-axis direction, by the rotational operation of the spindle 22, and cuts the workpiece 100 held by the chuck table 10. The machining unit 20 is movably provided in the Y-axis direction by the Y-axis moving unit 32 of the moving unit 30 and movably provided in the Z-axis direction (lifting direction) by the Z-axis moving unit 33 of the moving unit 30 with respect to the workpiece 100 held by the chuck table 10. As shown in FIG. 1, the machining apparatus 1 includes two machining units 20 (cutting units), that is, a so-called facing dual-type cutting apparatus with two spindles.

[0017] In Embodiment 1, the processing unit 20 includes a blade cover 25. The blade cover 25 is attached to the tip side of the spindle housing that rotatably supports the spindle 22, and covers the upper, front, and rear of the cutting blade 21 attached to the tip of the spindle 22. A plurality of water channels are formed inside the blade cover 25. The water channels formed inside the blade cover 25 are connected to a cutting water supply source (not shown) at the upper other end, and a processing water supply nozzle that supplies processing water (cutting water) toward the processing point is connected to one end at the lower side. The processing water (cutting water) supplied from the cutting water supply source to the processing point through the water channels inside the blade cover 25 and the processing water supply nozzle is, for example, pure water.

[0018] The moving unit 30 includes an X-axis moving unit 31, a Y-axis moving unit 32, and a Z-axis moving unit 33. The X-axis moving unit 31 moves the chuck table 10 relative to the processing unit 20 along the X-axis direction. The Y-axis moving unit 32 and the Z-axis moving unit 33 move the processing unit 20 relative to the chuck table 10 along the Y-axis direction and the Z-axis direction, respectively.

[0019] The X-axis movement unit 31, the Y-axis movement unit 32, and the Z-axis movement unit 33 are respectively provided with an X-axis position detection unit (not shown) for detecting the position of the chuck table 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the processing unit 20 in the Y-axis direction, and a Z-axis position detection unit for detecting the position of the processing unit 20 in the Z-axis direction. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the detected positions to the control unit 80 respectively. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit each include a linear scale parallel to the X-axis direction, the Y-axis direction, or the Z-axis direction, and a reading head that is movably provided in the X-axis direction, the Y-axis direction, and the Z-axis direction by the X-axis movement unit 31, the Y-axis movement unit 32, and the Z-axis movement unit 33 respectively to read the scale of the linear scale. Note that the X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit are not limited to the configuration having a linear scale and a reading head in the present invention, and may be encoders installed on the motors of the X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit respectively.

[0020] The processing apparatus 1 sets the cutting blade 21 at a predetermined position with respect to the workpiece 100 held on the chuck table 10 by the X-axis movement unit 31, the Y-axis movement unit 32, and the Z-axis movement unit 33, and while supplying machining water, relatively moves the cutting blade 21 along the division planned line 102 while rotating the cutting blade 21, thereby cutting the workpiece 100 with the cutting blade 21 along the division planned line 102 to form a machining mark 110 along the division planned line 102. In the first embodiment, the machining mark 110 is a cutting groove.

[0021] As shown in FIG. 2, the camera 40 photographs the workpiece 100 held on the chuck table 10. In the first embodiment, the camera 40 is fixed to the machining unit 20 so as to move integrally with the machining unit 20 as shown in FIG. 1. The camera 40 is moved along the Z-axis direction together with the machining unit 20 by the Z-axis moving unit 33, and the height is adjusted to a distance at which the focus of the camera 40 is on the imaging region on the surface 101 side of the workpiece 100 held on the chuck table 10.

[0022] As shown in FIG. 3, the camera 40 includes an illumination (light source) 41, an illumination (light source) 42, a half mirror 43, an objective lens 44, an image sensor 45, and an air blow nozzle 46. The camera 40 uses epi-illumination 48 formed by the illumination 41, the half mirror 43, and the objective lens 44 and irradiating light along the Z-axis direction toward the imaging region on the surface 101 side of the workpiece 100, and oblique illumination 49 formed by the illumination 42 and irradiating light from a direction inclined with respect to the Z-axis direction toward the imaging region on the surface 101 side of the workpiece 100 to photograph the imaging region on the surface 101 side of the workpiece 100.

[0023] As shown in FIG. 3, for the epi-illumination 48, the light supplied from the illumination 41 disposed on the side of the lens barrel of the camera 40 is guided into the lens barrel from the side, reflected downward by the half mirror 43 disposed inside the lens barrel and on the side of the illumination 41, condensed by the objective lens 44 disposed below the half mirror 43 inside the lens barrel, and transmitted through the cover member 47 that protects the inside of the lens barrel disposed at the lower end of the lens barrel below the objective lens 44, and is guided along the Z-axis direction toward the imaging region on the surface 101 side of the workpiece 100 held on the chuck table 10 below the cover member 47, thereby being formed.

[0024] As shown in FIG. 3, for the oblique illumination 49, the ring-shaped light emitted from the ring-shaped illumination 42 disposed on the outer periphery of the cover member 47 at the same height as the cover member 47 is guided in a direction inclined with respect to the Z-axis direction toward the imaging region on the surface 101 side of the workpiece 100, thereby being formed.

[0025] The formed epi-illumination 48 and oblique illumination 49 reflect the imaging area on the surface 101 side of the workpiece 100 to form reflected light, which passes through the objective lens 44 and the half mirror 43 and is guided to the upper imaging device 45. The imaging device 45 captures the imaging area on the surface 101 side of the workpiece 100 by receiving the reflected light from the imaging area on the surface 101 side of the workpiece 100 and acquires an image. The imaging device 45 is, for example, a CCD (Charge-Coupled Device) imaging device or a CMOS (Complementary MOS) imaging device.

[0026] As shown in FIG. 3, the air blow nozzle 46 is disposed on the outer periphery of the cover member 47, and the tip is directed toward the center side of the cover member 47. An air supply source (not shown) is connected to the base end side of the air blow nozzle 46. The air blow nozzle 46 ejects the air supplied from the air supply source from the tip and performs an air blow to blow off and remove the adhering processing water toward the imaging area on the surface 101 side of the workpiece 100 held by the chuck table 10.

[0027] The camera 40 is electrically connected to the inspection unit 50 and the control unit 80 so as to be capable of information communication. Under the control of the control unit 80, the camera 40 captures the division planned line 102 of the workpiece 100 before processing held by the chuck table 10 to obtain an image for performing alignment such as aligning the workpiece 100 with the cutting blade 21 of the processing unit 20, and outputs the obtained image to the control unit 80. Under the control of the inspection unit 50, the camera 40 captures the division planned line 102 and the processing marks 110 of the workpiece 100 after processing held by the chuck table 10 to obtain an image for performing a so-called kerf check for automatically inspecting the state of the processing marks 110 according to a predetermined inspection item, and outputs the obtained image to the inspection unit 50. Here, the kerf check is to detect the processing marks 110 based on the image of the processing marks 110 and detect chipping accompanying the processing marks 110, meandering of the processing marks 110, and deviation between the position of the processing marks 110 and the position to be processed.

[0028] FIG. 4 is a diagram showing the inspection conditions 200 of the processing apparatus 1 of FIG. 1. The inspection unit 50 acquires an image of the processing mark 110 for performing a kerf check by the camera 40 based on the inspection conditions 200 shown in FIG. 4, detects the processing mark 110 formed by the processing unit 20 from the acquired image of the processing mark 110, and inspects the state of the processing mark 110 with a predetermined inspection item. In this way, the inspection conditions 200 are the shooting conditions when the inspection unit 50 shoots an image of the processing mark 110 by the camera 40. The inspection unit 50 can adjust the inspection conditions 200 (shooting conditions). That is, the inspection unit 50 can acquire information on the light intensity of the illumination 41, 42 (epi-illumination 48 and oblique illumination 49) of the camera 40 and adjust the light intensity. Further, the inspection unit 50 can acquire the flow rate of the air ejected from the tip of the air blow nozzle 46 of the camera 40 and the length of the time for which the air is ejected (air blow length), and can adjust these. The inspection unit 50 acquires the height of the objective lens 44 of the camera 40 with respect to the holding surface 11 of the chuck table 10 from the Z-axis moving unit 33, and can adjust the height of the camera 40 to a distance (height) at which the focus of the camera 40 matches the object to be imaged (workpiece 100). Hereinafter, the distance (height) at which the focus of the camera 40 matches the workpiece is referred to as the distance from the workpiece 100 of the camera 40.

[0029] The inspection unit 50 sets inspection conditions 200 (imaging conditions) under which a skilled operator of the processing device 1 can clearly detect the machining marks 110 in advance. The surface 101 of the workpiece 100 is imaged by the camera 40 under the inspection conditions 200 to perform a kerf check. An image of the machining marks 110 that has passed all the predetermined inspection items (inspection items for the kerf check) inspected by the inspection unit 50 in the kerf check is registered in the control unit 80 as a reference image 322 (for example, shown in FIG. 7). Subsequently, the inspection unit 50 performs a kerf check by imaging the machining marks 110 under the registered inspection conditions 200. If any of the inspection items of the kerf check fails, it is tentatively determined that the contrast of the image of the machining marks 110 is unclear, and the reference image registered in advance for comparison with the image of the machining marks 110 is displayed on the display 70 by the control unit 80. The operator compares the image of the machining marks 110 displayed on the display 70 with the reference image. If it is not a simple processing defect but the inspection conditions 200 (imaging conditions) are inappropriate due to deterioration of lighting, etc., the inspection conditions 200 are adjusted. If a real processing defect has occurred, the processing is stopped or the processing conditions are corrected.

[0030] The predetermined inspection items inspected by the inspection unit 50 in the kerf check are, for example, kerf width, Max chipping size, cut position deviation, etc. The kerf width is the distance (interval) in the width direction of the machining marks 110 between both ends of the machining marks 110 within the area of the image confirmed in the kerf check. The Max chipping size is the maximum chipping size in the width direction of the machining marks 110 within the area of the image confirmed in the kerf check. The cut position deviation is the deviation (distance, interval) in the width direction between the position where the machining marks 110 are actually formed by processing and the position where the machining marks 110 should be formed. For example, it is the deviation in the width direction with respect to the center of the division planned line 102 at the center in the width direction of the machining marks 110. The inspection unit 50 evaluates that it is qualified if it is within the range of the allowable value preset for each of these predetermined inspection items, and unqualified (result error) if it is outside the range of the allowable value.

[0031] The recording unit 60 records the inspection conditions 200 when the inspection unit 50 photographs the machining marks 110 with the camera 40 for each machining condition for forming the machining marks 110. That is, the recording unit 60 records the inspection conditions 200 when the inspection unit 50 photographs the machining marks 110 with the camera 40 in association with the machining conditions of the workpiece 100 stored in the corresponding control unit 80. Here, the machining conditions for forming the machining marks 110 are, in the first embodiment, for example, the shape of the workpiece 100 (circular or rectangular, etc.), the outer diameter of the workpiece 100, the thickness of the workpiece 100, the machining feed rate which is the moving speed of the chuck table 10 during machining, the cutting depth which is the height from the holding surface 11 of the chuck table 10 to the lower end of the cutting edge of the cutting blade 21 during machining, an index amount indicating the distance between adjacent division planned lines 102, and the like. The inspection conditions 200 include, in the present invention, at least the light intensity of the illumination 41, 42 (epi-illumination 48 and oblique illumination 49) of the camera 40, and in the first embodiment, for example, as shown in FIG. 4, further include the air blow conditions by the air blow nozzle 46 and the distance from the camera 40 to the workpiece 100.

[0032] The light intensity of the illumination 41, 42 (epi-illumination 48 and oblique illumination 49) is defined by the output ratio when the maximum output is set to 100% for each of the illumination 41, 42 (epi-illumination 48 and oblique illumination 49) in the example of the inspection conditions 200 shown in FIG. 4. The air blow conditions by the air blow nozzle 46 are defined by the air flow rate and the air blow length in the example of the inspection conditions 200 shown in FIG. 4. The distance from the camera 40 to the workpiece 100 is defined by the value of the height added to the thickness of the workpiece 100 with respect to the holding surface 11 of the chuck table 10 in the example of the inspection conditions 200 shown in FIG. 4. Note that these items of the inspection conditions 200 are not limited to this in the present invention and may be defined in another form.

[0033] The display 70 is provided on an exterior cover (not shown) of the processing apparatus 1 with the display surface side facing outward, and displays for the operator to visually recognize screens for setting processing conditions and the like of the processing apparatus 1, images of the processing marks 110, screens indicating processing results such as kerf checks, and the like. The display 70 is configured by a liquid crystal display device or the like. The display 70 is provided with an input unit 71 that is used when an operator inputs command information regarding the processing conditions of the processing apparatus 1, the inspection conditions 200, images, and display of the screen. The input unit 71 provided in the display 70 is composed of at least one of a touch panel provided in the display 70 and a keyboard or the like.

[0034] The control unit 80 controls the operations of the respective components of the processing apparatus 1 to cause the processing apparatus 1 to perform a processing operation by the processing unit 20 and a kerf check using the camera 40. The control unit 80 stores the processing conditions of the workpiece 100 and a sample image 322 of the processing mark 110 that is appropriately photographed so that the processing mark 110 is normally detected for each processing condition.

[0035] In this embodiment, the control unit 80 includes an inspection unit 50 and a recording unit 60. In Embodiment 1, the control unit 80 includes a computer system. The computer system included in the control unit 80 has an arithmetic processing unit having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input / output interface device. In Embodiment 1, the function of the inspection unit 50 is realized in such a way that the storage device of the computer system stores the width of the machining mark 110 necessary for the processing of the inspection unit 50, the shape of both ends in the width direction, etc., and the arithmetic processing unit of the computer system executes the computer program stored in the storage device of the computer system. In Embodiment 1, the function of the recording unit 60 is realized in such a way that the storage device of the computer system records the inspection conditions 200 for each machining condition. In Embodiment 1, the function of the control unit 80 is realized in such a way that the storage device of the computer system stores information necessary for the processing of the control unit 80, such as the machining conditions of the workpiece 100 and the sample image 322 of the machining mark 110, and the arithmetic processing unit of the computer system performs arithmetic processing according to the computer program stored in the storage device of the computer system, and outputs a control signal for controlling the machining device 1 to each component of the machining device 1 via the input / output interface device of the machining device 1.

[0036] As shown in FIG. 1, the processing apparatus 1 further includes a cassette mounting portion 91, a cleaning unit 92, and a transport unit (not shown). The cassette mounting portion 91 is a mounting table for mounting a cassette 95 which is a container for accommodating a plurality of workpieces 100, and raises and lowers the mounted cassette 95 in the Z-axis direction. The cleaning unit 92 cleans the workpiece 100 after processing by the processing unit 20 and removes foreign matters such as machining chips attached to the workpiece 100. The transport unit (not shown) transports the workpiece 100 before processing from inside the cassette 95 onto the chuck table 10, transports the workpiece 100 after processing from the chuck table 10 to the cleaning unit 92, and transports the workpiece 100 after cleaning from the cleaning unit 92 into the cassette 95.

[0037] Next, this specification will describe an example of the operation process when the processing apparatus 1 according to Embodiment 1 performs a curvature check on the processing mark 110. FIGS. 5 to 8 are all diagrams showing the display screen of the processing apparatus 1 in FIG. 1. FIG. 5 shows the display screen in the first example of the operation process, and FIGS. 6 to 8 show the display screens in the second example of the operation process.

[0038] In the first example, the inspection unit 50 of the processing apparatus 1 refers to the inspection condition 200 of the recording unit 60, sets the light intensity of the epi-illumination 48 and the oblique illumination 49 to 80% and 0% respectively, and sets the air blow condition and the distance from the workpiece 100 (both not shown) based on the inspection condition 200, takes a picture of the inspection image 302 (see FIG. 5) which is an image of the processing mark 110, performs a curvature check on the inspection image 302 to obtain the curvature check result 304 (see FIG. 5), determines whether the contrast is clear or unclear from the result 304 to obtain the contrast determination result 305 (see FIG. 5), and outputs this information to the control unit 80. The control unit 80 of the processing apparatus 1 acquires this information from the inspection unit 50, and displays on the display 70 a screen 301 showing, for example, as shown in FIG. 5, the inspection image 302, the inspection condition 200, the curvature check result 304, the contrast determination result 305, and the buttons 306, 307.

[0039] In the first example, on screen 301, an inspection image 302 is taken based on inspection condition 200, and based on inspection image 302, a result 304 of the curl check is obtained, indicating that it is determined that the contrast of inspection image 302 is clear as shown by "OK" in the determination result 305. In this way, when the control unit 80 determines that the contrast of inspection image 302 taken by inspection unit 50 is clear, it records inspection image 302 as a sample image 322 (see FIG. 7) in association with the processing conditions of workpiece 100 with machining marks 110 formed thereon. Note that in the example shown in FIG. 5, screen 301 shows only the light intensity of incident illumination 48 and oblique illumination 49 as inspection condition 200, but the present invention is not limited thereto, and air blow conditions or the distance from workpiece 100 may be further displayed.

[0040] In the second example, inspection unit 50 of processing apparatus 1 refers to inspection condition 200 of the same recording unit 60 as in the first example, and takes inspection image 312, which is an image of machining marks 110 different from those in the first example, with the light intensity of incident illumination 48 and oblique illumination 49 being 80% and 0% respectively, in the same manner as in the first example. In the second example, the processing conditions of workpiece 100 with machining marks 110 formed thereon are also the same as in the first example. In the second example, although inspection unit 50 refers to the same inspection condition 200 as in the first example, it obtains a curl check result 314 (see FIG. 6) instead of curl check result 304, and a contrast determination result 315 (see FIG. 6) instead of contrast determination result 305 from result 314. Also, in the second example, as shown in FIG. 6 for example, control unit 80 displays on display 70 a screen 311 showing inspection image 312, inspection condition 200, curl check result 314, contrast determination result 315, and buttons 306, 307.

[0041] In the second example, on the screen 311, an inspection image 312 is captured based on the inspection condition 200, and as a result 314 of the curl check is obtained based on the inspection image 312. The determination result 315 indicates that it has been determined that the contrast of the inspection image 312 is unclear, showing "NG". In this way, when the control unit 80 determines that the contrast of the inspection image 312 captured by the inspection unit 50 is unclear, for example, as shown in FIG. 7, the control unit 80 simultaneously displays on the display 70 a consideration screen 321 that shows the inspection image 312 and a sample image 322 that is recorded in association with the processing conditions of the workpiece 100 used when the detected processing mark 110 was formed. In the second example of the first embodiment, when a button 306 described as "display sample image" on the screen 311 is selected by an operator or the like, the control unit 80 switches the screen 311 displayed on the display 70 to the consideration screen 321.

[0042] The consideration screen 321 shows the inspection image 312 and the sample image 322, the contrast of which has been determined to be unclear, side by side. Below each of the inspection image 312 and the sample image 322, the respective inspection conditions 200, 323, the results 314, 324 of the curl check, and the determination results 315, 325 of the contrast are shown side by side. The consideration screen 321 also shows the same buttons 306, 307 as those on the screen 311. Therefore, the consideration screen 321 enables the operator to comparatively examine the differences between the inspection image 312 and the sample image 322, and the differences between the inspection conditions 200 and the inspection conditions 323, such as the states of the illuminations 41, 42 (epi-illumination 48 and oblique illumination 49). Thereby, the consideration screen 321 encourages the operator to preferably examine which items of the inspection conditions 200 need to be changed and modified and how, so as to reproduce the capture of an image of the processing mark 110 with the same contrast as the sample image 322.

[0043] As shown in the example of FIG. 7, when there is a clear difference between the inspection image 312 and the sample image 322 even though there is no difference between the inspection condition 200 and the inspection condition 323, it indicates that it is highly likely to be caused by the deterioration of each component constituting the inspection condition 200, for example, the lighting 41, 42. Thus, the processing apparatus 1 according to the first embodiment can prompt the operator to take appropriate actions for both the incorrect setting of the inspection condition 200 by the operator and the deterioration of each component constituting the inspection condition 200, such as the lighting 41, 42 of the camera 40, through the examination screen 321. Further, when the processing apparatus 1 according to the first embodiment sets the inspection condition 200 and continues to use it as it is, and then changes the inspection condition 200, and if a non-conformance occurs in the inspection item of the curl check, similarly, by displaying the image acquired under the inspection condition 200 before the change side by side with the sample image 322 and the inspection image at the time of non-conformance occurrence, the influence of the changed inspection condition 200 on the imaging result can be clearly presented to the operator, which can be used as a reference when setting the inspection condition 200, and the inspection condition 200 can be optimized.

[0044] Further, when the control unit 80 determines that the contrast of the inspection image 312 captured by the inspection unit 50 is unclear, for example, as shown in FIG. 8, the control unit 80 may display an inspection result screen 331 on the display 70 that shows the inspection image 312 and a graph 336 of the time-series change of the results of past curl checks side by side. In the second example of the first embodiment, when the button 307 labeled "Inspection Result" on the screen 311 is selected by the operator or the like, the control unit 80 switches the screen 311 displayed on the display 70 to the inspection result screen 331.

[0045] The graph 336 shown on the inspection result screen 331 indicates the time-series changes of the inspection items of the curvature check obtained from the inspection images 302 and 312. In the second example of Embodiment 1, it shows the time-series changes of the curvature width and the Max chipping size respectively. In the second example of Embodiment 1, since the inspection image 312 is captured with the same luminance for the processing mark 110 and the TEG, the part corresponding to the TEG is misrecognized as the processing mark 110 and chipping. As a result, the Max chipping size of the curvature check result 314 is 0.020 mm / 0.010 mm, which is an abnormally large value compared to the Max chipping size of 0.005 mm / 0.010 mm in the curvature check results 304 and 324 of the inspection image 302.

[0046] The inspection result screen 331 shows the inspection image 312 determined to have unclear contrast and the graph 336 side by side, and below the inspection image 312, it shows the inspection conditions 200, the result 314 of the curvature check, and the determination result 315 of the contrast. The inspection result screen 331 also shows the same buttons 306 and 307 as the screen 311 and the consideration screen 321. Therefore, the inspection result screen 331 prompts the operator to recognize, for example, to what extent the abnormal inspection item of the curvature check in the result 314 of the curvature check has been abnormal from the beginning in the graph 336, and thereby prompts the operator to recognize to what extent the abnormal inspection conditions 200 that cause the determination result 315 of the contrast to be determined as unclear have occurred from the beginning. In the example of the inspection result screen 331 shown in FIG. 8, since the Max chipping size changes to almost the same value in the graph 336, it can be recognized that the Max chipping size is in an abnormal state during the display period of this graph 336, and there may be a possibility that the inspection conditions 200 induced such an abnormality of the Max chipping size.

[0047] The processing apparatus 1 according to Embodiment 1 having the configuration as described above is such that when the inspection unit 50 normally detects the processing mark 110, the control unit 80 records the image of the processing mark 110 (inspection image 302) as a reference image 322, and when the inspection unit 50 fails to normally detect the processing mark 110, the image of the processing mark 110 (inspection image 312) and the reference image 322 are simultaneously displayed on the display 70. For this reason, in the processing apparatus 1 according to Embodiment 1, since the operator can visually recognize an appropriate reference image 322 of the processing mark 110 that can normally detect the processing mark 110, even an operator with little experience in curl check can easily reproduce the imaging conditions (inspection conditions) of an appropriate image of the processing mark 110 that can normally detect the processing mark 110. As a result, it is possible to suppress the frequent occurrence of evaluations of nonconformity of inspection items in curl check due to inappropriate imaging conditions (inspection conditions) and the frequent occurrence of processing stops of the workpiece 100 associated therewith.

[0048] In the processing apparatus 1 according to Embodiment 1, the inspection conditions 200 (imaging conditions) when the inspection unit 50 captures an image of the processing mark 110 include, in addition to the light intensity of the epi-illumination 48 and the oblique illumination 49, the air blow conditions by the air blow nozzle 46 and the distance from the workpiece 100 to the camera 40. For this reason, the processing apparatus 1 according to Embodiment 1 not only fails to normally detect the processing mark 110 by capturing an inappropriate image of the processing mark 110 due to the light intensity of the epi-illumination 48 and the oblique illumination 49, but also due to the air blow conditions, an inappropriate image of the processing mark 110 is captured by the processing water adhering to the imaging area on the surface 101 side of the workpiece 100 held on the chuck table 10 and the processing mark 110 cannot be normally detected, or due to the distance from the workpiece 100, the focus of the camera 40 is shifted, and an inappropriate image of the processing mark 110 is captured and the processing mark 110 cannot be normally detected. The frequent occurrence of such cases can also be appropriately suppressed.

[0049] 〔Embodiment 2〕 The processing apparatus 1-2 according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 9 is a perspective view showing a configuration example of the processing apparatus 1-2 according to Embodiment 2. In FIG. 9, the same parts as those in Embodiment 1 are denoted by the same reference numerals and the description thereof is omitted.

[0050] As shown in FIG. 9, the processing apparatus 1-2 according to Embodiment 2 is obtained by changing the processing unit 20 to a processing unit 20-2 in the processing apparatus 1 according to Embodiment 1, and changing the arrangement and functions of the other respective components accordingly.

[0051] In Embodiment 2, as shown in FIG. 9, the processing unit 20-2 is a laser beam irradiation unit that irradiates the workpiece 100 held on the chuck table 10 with a laser beam and performs laser processing on the workpiece 100 with the laser beam. The processing unit 20-2 performs so-called ablation processing in which a laser beam having a wavelength that is absorbable by the workpiece 100 is irradiated onto the workpiece 100, and the workpiece 100 is ablated (sublimated or evaporated) by this laser beam.

[0052] In Embodiment 2, the chuck table 10 is provided above the X-axis movement unit 31 and the Y-axis movement unit 32 with the holding surface 11 facing upward, and is movable in the X-axis direction and the Y-axis direction by the X-axis movement unit 31 and the Y-axis movement unit 32, respectively. In Embodiment 2, the processing unit 20-2 is fixedly provided within the processing apparatus 1-2. In Embodiment 2, the Z-axis movement unit 33 is omitted from the movement unit 30.

[0053] While irradiating the processing unit 20-2 with a laser beam, the processing apparatus 1-2 moves the workpiece 100 relative to the processing unit 20-2 along the planned division line 102 by the X-axis movement unit 31 and the Y-axis movement unit 32, thereby performing laser processing on the workpiece 100 with the laser beam along the planned division line 102 and forming a processing mark 110 along the planned division line 102. In Embodiment 2, the processing mark 110 is a laser processing mark.

[0054] In Embodiment 2, the camera 40 adjusts the distance from the workpiece 100 to the imaging region on the surface 101 side of the workpiece 100 held by the chuck table 10 by a mechanism (not shown) different from that in Embodiment 1. The camera 40 is provided with an air blow nozzle 46 similar to that in Embodiment 1 in order to remove the machining debris (debris) of the workpiece 100 generated during laser machining. In Embodiment 2, the other configurations and functions of the camera 40, such as epi-illumination 48 and oblique illumination 49, are the same as those in Embodiment 1.

[0055] In Embodiment 2, the machining conditions for forming the machining marks 110 are changed in Embodiment 1 to include the wavelength and focal height of the laser beam during machining instead of the cutting depth. The operation process when the machining apparatus 1-2 according to Embodiment 2 performs a kerf check on the machining marks 110 is the same as that in Embodiment 1.

[0056] The machining apparatus 1-2 according to Embodiment 2 having the above configuration changes the machining unit 20, which is a cutting unit in Embodiment 1, to a machining unit 20-2, which is a laser beam irradiation unit for irradiating a laser beam. Accordingly, since the machining marks 110 are changed from cutting grooves to laser machining marks, it exhibits the same effects as those in Embodiment 1.

[0057] Note that the present invention is not limited to the above embodiments. That is, various modifications can be made without departing from the gist of the present invention. For example, the laser beam may have a wavelength that is transmissive to the workpiece, and in that case, the modified layer formed inside the workpiece is the inspection target for the kerf check. Also, for one machining condition, a plurality of sample images may be registered, and a plurality of sample images may be displayed on the examination screen, or a sample image selected from among the plurality of sample images may be displayed.

Explanation of Reference Numerals

[0058] 1, 1-2 Machining apparatus 10 Chuck table 20, 20-2 Machining unit 21 Cutting blade 22 Spindle 40 Camera 41, 42 Lighting 46 Air Blow Nozzle 48 Episcopic Illumination 49 Oblique Lighting 50 Inspection Unit 60 Recording Unit 70 Display 80 Control Unit 100 Workpiece 102 Scheduled Division Line 200, 323 Inspection Conditions 302, 312 Inspection Images 321 Consideration Screen 322 Sample Image

Claims

1. A processing apparatus comprising: a chuck table that holds a workpiece having a plurality of planned division lines; and a processing unit that processes the workpiece held on the chuck table along the planned division lines, a camera with illumination for photographing the workpiece held on the chuck table, an inspection unit that detects a processing mark formed by the processing unit from an image of the planned division line and inspects the state of the processing mark according to a predetermined inspection item, a recording unit that records inspection conditions of the inspection unit, including the light intensity of the illumination, for each processing condition for forming the processing mark when photographing the processing mark, a display, and a control unit that controls each component, wherein the control unit, when the inspection unit determines that the contrast of the image photographed at the set light intensity is clear, records the image as a reference image associated with the processing condition of the workpiece, when the inspection unit determines that the contrast of the image photographed at the set light intensity is unclear, displays the image determined to be unclear and the reference image recorded in association with the processing condition on the display, and displays a consideration screen on which the state of the illumination can be considered. The processing apparatus is characterized by this.

2. The inspection conditions of the inspection unit further include an air blow condition by an air blow nozzle provided below the camera when photographing the processing mark, and the inspection unit photographs the image under the set light intensity and air blow condition. The processing apparatus according to claim 1 is characterized by this.

3. The inspection conditions of the inspection unit further include the distance of the camera from the workpiece when photographing the processing mark, and the inspection unit photographs the image under the set light intensity and the distance from the workpiece. The processing apparatus according to claim 1 is characterized by this.

4. The processing unit is a cutting unit in which a cutting blade is attached to a spindle or a laser beam irradiation unit that irradiates a laser beam, and the processing mark is a cutting groove or a laser processing mark. The processing apparatus according to claim 1.

Images