Printed circuit board, and air conditioner having the same

Abstract

To prevent lead breakage of mounted components due to vibration of heavy components on a substrate.SOLUTION: A printed circuit board 100 has a first component 10, which is a heavy component that stores electrical or inductive energy, a second component 20, which is a power device with a plurality of leads 200, and a substrate 30 on which the first component 10 and second component 20 are mounted. In the substrate 30, a slit 30a is provided between the first component 10 and the second component 20, and the lead of the second component 20 is soldered to the substrate. In the printed circuit board 100, the slit 30a suppresses the propagation of vibration from the heavy first component 10 to the second component 20, thus preventing vibration-induced breakage of the lead 200.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] It relates to a printed circuit board.

Background Art

[0002] When impact or vibration is applied to components mounted on a substrate, slits may be provided around the components for the purpose of alleviating the impact on the substrate. For example, in the printed circuit board described in Patent Document 1 (Japanese Utility Model Laid-Open No. 4-107875), discontinuous slits are provided so as to surround the mounting portion of a transformer, which is a heavy component, and the expansion of cracks is prevented.

Summary of the Invention

Problems to be Solved by the Invention

[0003] When vibration repeatedly acts on a substrate, the vibration of a heavy component may propagate to components away from the heavy component, and the leads of those components may break.

[0004] However, in Patent Document 1, no measures are taken against the vibration caused by heavy components leading to lead breakage of mounted components.

Means for Solving the Problems

[0005] The printed circuit board of the first aspect includes a first component, a second component, and a substrate. The first component is a heavy component that accumulates electrical energy or inductive energy. The second component is a power device having a plurality of leads. The substrate has the first component and the second component mounted thereon, a slit is provided between the first component and the second component, and the leads of the second component are soldered.

[0006] In this printed circuit board, the vibration from the heavy first component is suppressed from propagating to the second component by the slit, so lead breakage due to vibration is prevented.

[0007] The printed circuit board from the second perspective is the printed circuit board from the first perspective, and a plurality of leads includes a first lead closest to the first component. The slit is provided between the first component and the first lead.

[0008] In this printed circuit board, since the vibration from the heavy first component is suppressed from propagating to the second component by the slit, the breakage of the first lead closest to the first component is prevented.

[0009] The printed circuit board from the third perspective is the printed circuit board from the second perspective, and when vibration in the direction perpendicular to the substrate is applied, the stress on the first lead by the first component is larger than the stress on other components.

[0010] The printed circuit board from the fourth perspective is any one of the printed circuit boards from the first perspective to the third perspective, and a plurality of first components are mounted on the substrate. The plurality of first components includes a first heavy component. The first heavy component is the heavy component with the largest stress on the lead when vibration in the direction perpendicular to the substrate is applied. The slit is provided between the first heavy component and the second component.

[0011] The printed circuit board from the fifth perspective is any one of the printed circuit boards from the first perspective to the fourth perspective, and the first component is any one of an electrolytic capacitor, a reactor, and a coil.

[0012] The printed circuit board from the sixth perspective is any one of the printed circuit boards from the first perspective to the fifth perspective, and the second component is any one of an intelligent power module, an active filter module, an insulated gate bipolar transistor, a MOSFET, a diode, a thyristor, and a triac.

[0013] The printed circuit board from the seventh perspective is any one of the printed circuit boards from the first perspective to the sixth perspective, and the first component is mounted at the central part of the substrate.

[0014] In this printed circuit board, since the first component is located at the center of the substrate, the substrate is prone to deformation due to vibration, so the effect of providing slits in the substrate is high.

[0015] The printed circuit board according to the eighth aspect is any one of the printed circuit boards according to the first to seventh aspects, and the slit penetrates the substrate.

[0016] The printed circuit board according to the ninth aspect is any one of the printed circuit boards according to the first to eighth aspects, and the width of the slit is in the range of 1.0 to 4.0 mm.

[0017] In this printed circuit board, both the workability of the slit and the prevention of vibration propagation can be satisfied.

[0018] The printed circuit board according to the tenth aspect is any one of the printed circuit boards according to the first to ninth aspects, and the substrate is fixed to an object via a connecting member and a second component.

[0019] In this printed circuit board, since the lead of the second component also functions as a connecting member, it is more susceptible to repeated fatigue due to vibration than other mounted components. Therefore, by providing a slit between the first component and the second component, vibration propagation is blocked, and the lead is protected from repeated fatigue.

[0020] The air conditioner according to the eleventh aspect has any one of the printed circuit boards according to the first to tenth aspects.

Brief Description of the Drawings

[0021]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0022] (1) Configuration of Printed Circuit Board 100 FIG. 1 is a perspective view of an air conditioner 1 having a printed circuit board 100 according to the present disclosure. In FIG. 1, the air conditioner 1 includes an indoor unit 4 and an outdoor unit 5. The indoor unit 4 and the outdoor unit 5 are connected by a refrigerant connection pipe 6.

[0023] The indoor unit 4, the outdoor unit 5, and the refrigerant connection pipe 6 constitute a refrigerant circuit. In the refrigerant circuit, for example, a vapor compression refrigeration cycle is repeated during cooling operation, heating operation, and dehumidifying operation.

[0024] The indoor unit 4 is attached to an indoor wall, but is not limited thereto, and may be installed on the ceiling or the floor.

[0025] The outdoor unit 5 is installed outdoors and functions as a heat source unit that supplies heat energy to the indoor unit 4.

[0026] Electrical component boxes are mounted on the indoor unit 4 and the outdoor unit 5, and printed circuit boards are housed in the electrical component boxes. Here, the printed circuit board 100 of the outdoor unit 5 will be described as an example.

[0027] FIG. 2 is a circuit diagram of a power conversion circuit 110 configured in a printed circuit board 100 according to the present disclosure.

[0028] In FIG. 2, the power conversion circuit 110 rectifies AC power into DC power, converts the DC power into AC power of a predetermined frequency, and supplies it to the motor M. The motor M drives, for example, a compressor provided in the refrigerant circuit of the air conditioner 1.

[0029] (1-1) Diode module 20a for rectification The diode module 20a for rectification forms a bridge circuit with four diodes D1a, D1b, D2a, and D2b. Specifically, the diodes D1a and D1b, and D2a and D2b are connected in series with each other.

[0030] The connection point of the diode D1a and the diode D1b is connected to one pole of the AC power supply AC. The connection point of the diode D2a and the diode D2b is connected to the other pole of the AC power supply AC.

[0031] The diode module 20a for rectification rectifies the AC power output from the AC power supply AC to generate DC power, and supplies this to the first to third electrolytic capacitors 10a to 10c.

[0032] (1-2) First to third electrolytic capacitors 10a to 10c The first to third electrolytic capacitors 10a to 10c smooth the voltage rectified by the diode module 20a for rectification.

[0033] The second electrolytic capacitor 10b and the third electrolytic capacitor 10c are connected in series to perform smoothing and double voltage output, and together with the diode bridge rectifier circuit of the diode module 20a for rectification, form a double voltage rectifier circuit.

[0034] The voltages after smoothing by the first to third electrolytic capacitors 10a to 10c are supplied to the intelligent power module 20b.

[0035] (1-3) Reactor 10d As shown in FIG. 2, the reactor 10d is provided on the AC power line, one end of which is connected to the input side (coil 10e) of the AC power supply AC, and the other end is connected to the diode bridge rectifier circuit of the rectifier diode module 20a. The function of the reactor 10d is power factor improvement and harmonic suppression.

[0036] (1-4) Coil 10e The coil 10e is connected between the AC power supply AC and the reactor 10d. The coil 10e is a common mode choke coil for removing common mode noise.

[0037] (1-5) Intelligent power module 20b The intelligent power module 20b incorporates a switching circuit 25 and a control circuit 26 and is in one package. Hereinafter, the intelligent power module 20b is referred to as "IPM20b".

[0038] (1-5-1) Switching circuit 25 The switching circuit 25 is connected to the output side of the first electrolytic capacitor 10a with three upper and lower arms corresponding to the drive coils Lu, Lv, and Lw of the U-phase, V-phase, and W-phase of the motor M in parallel with each other.

[0039] In FIG. 2, the switching circuit 25 includes a plurality of IGBTs (insulated gate bipolar transistors, hereinafter simply referred to as transistors) Q3a, Q3b, Q4a, Q4b, Q5a, Q5b and a plurality of freewheeling diodes D3a, D3b, D4a, D4b, D5a, D5b.

[0040] Transistors Q3a and Q3b, Q4a and Q4b, Q5a and Q5b each form each upper and lower arm by being connected in series with each other, and output lines extend from the respective connection points NU, NV, NW formed thereby toward the drive coils Lu, Lv, Lw of the corresponding phases.

[0041] Each of the diodes D3a to D5b is connected in parallel to each of the transistors Q3a to Q5b such that the collector terminal of the transistor is connected to the cathode terminal of the diode and the emitter terminal of the transistor is connected to the anode terminal of the diode.

[0042] The switching circuit 25 generates a drive voltage for driving the motor M by applying a DC voltage and turning on and off each of the transistors Q3a to Q5b at the timing instructed by the control circuit 26. This drive voltage is output from the respective connection points NU, NV, NW of each of the transistors Q3a and Q3b, Q4a and Q4b, Q5a and Q5b to the drive coils Lu, Lv, Lw of the motor M.

[0043] (1-5-2) Control Circuit 26 The control circuit 26 changes the on and off states of each of the transistors Q3a to Q5b of the switching circuit 25 based on the command voltage from the inverter microcomputer 35.

[0044] Specifically, the control circuit 26 generates gate control voltages Gu, Gx, Gv, Gy, Gw, Gz such that a pulse-shaped drive voltage having an arbitrary duty ratio is output from the switching circuit 25 to the motor M. The duty ratio is determined by the inverter microcomputer 35.

[0045] The generated gate control voltages Gu, Gx, Gv, Gy, Gw, Gz are applied to the gate terminals of the respective transistors Q3a to Q5b.

[0046] (1-6) Inverter Microcomputer 35 The inverter microcomputer 35 is connected to the voltage detection unit 32, the current detection unit 33, and the control circuit 26. The inverter microcomputer 35 also monitors the detection value of the voltage detection unit 32 and performs protection control to turn off the transistors Q3a to Q5b when the detection value of the voltage detection unit 32 exceeds a predetermined threshold value.

[0047] (2) Component Arrangement on the Printed Circuit Board 100 FIG. 3 is an internal perspective view of the electrical component box 70 when viewed from the direction in which the first surface 301 of the printed circuit board 100 faces forward.

[0048] Further, FIG. 4 is an external view of the printed circuit board 100 when viewed from the direction in which the first surface 301 faces forward as shown in FIG. 3.

[0049] In FIGS. 3 and 4, the substrate 30 is a printed wiring board. The substrate 30 has a first surface 301 as a component mounting surface on the front side. The substrate 30 also has a second surface 302 as a component mounting surface on the back side.

[0050] (2-1) First Component 10 Mounted on the First Surface 301 In FIG. 4, on the first surface 301 of the substrate 30, as the first component 10, first to third electrolytic capacitors 10a to 10c and a coil 10e are mounted.

[0051] Here, the second electrolytic capacitor 10b and the third electrolytic capacitor 10c are arranged in a counterclockwise direction from the first electrolytic capacitor 10a located approximately at the center of the substrate 30.

[0052] The first to third electrolytic capacitors 10a to 10c store electrical energy when a voltage is applied between the terminals. The coil 10e stores inductive energy when a current flows through it.

[0053] The individual weights of the first to third electrolytic capacitors 10a to 10c and the coil 10e are larger than those of other components mounted on the first surface 301 of the substrate 30, and are generally known as heavy components.

[0054] Therefore, the first component 10 is defined as a heavy component that stores electrical energy or inductive energy. In addition to electrolytic capacitors and coils, reactors and transformers also correspond to the first component 10. The reactor 10d described in the circuit diagram of FIG. 2 is not shown in FIG. 4 because it is not on the substrate 30, but it is a heavy component that stores inductive energy.

[0055] (2-2) The second component 20 mounted on the second surface 302 FIG. 5 is an external view of the printed circuit board 100 shown in FIG. 3 as viewed from the direction in which the second surface 302 is the front.

[0056] In FIG. 5, the three circles drawn with a two-dot chain line indicate the positions of the first to third electrolytic capacitors 10a to 10c mounted on the first surface 301. Also, the rectangular frame drawn with a two-dot chain line indicates the position of the coil 10e mounted on the first surface 301.

[0057] On the second surface 302 of the substrate 30, a rectifying diode module 20a and an IPM 20b are mounted as the second component 20.

[0058] The rectifying diode module 20a and the IPM 20b have a plurality of leads. For example, as shown in FIG. 5, the IPM 20b has a package portion 150 and a plurality of leads 200 protruding from the package portion 150.

[0059] The rectifying diode module 20a and the IPM 20b are semiconductor elements used for power supply, and are generally known as power devices.

[0060] Therefore, the second component 20 is defined as a power device having a plurality of leads. In addition to the rectifying diode module and the IPM, the active filter module, the insulated gate bipolar transistor, the thyristor, and the triac also correspond to the second component 20.

[0061] As shown in FIGS. 4 and 5, in the substrate 30, a slit 30a is provided between the first to third electrolytic capacitors 10a to 10c and the IPM 20b. The function of the slit 30a will be described in the section of "(4) Function of the slit" later.

[0062] (3) Fixing of the electrical components on the printed circuit board 100 to the electrical component box 70 FIG. 6 is a schematic cross-sectional view of the electrical component box 70 housing the printed circuit board 100 of FIG. 3. In FIG. 6, the first component 10 corresponds to the first electrolytic capacitor 10a, and the second component 20 corresponds to the IPM 20b.

[0063] As shown in FIG. 6, the printed circuit board 100 is fixed with the second surface 302 facing the wall 60 of the electrical component box 70 and separated from the wall surface of the wall 60 by a predetermined distance. The predetermined distance is set so that the components mounted on the second surface 302 and the metal members protruding through the second surface 302 from the first surface 301 do not interfere with the wall 60.

[0064] (3-1) Connecting member 40 In order to maintain the distance between the printed circuit board 100 and the wall 60 of the electrical component box 70 at the predetermined distance, a connecting member 40 is attached to the corner of the printed circuit board 100. The connecting member 40 is made of resin. The connecting member 40 is rod-shaped and has a head 401, a body 402, a positioning portion 403, a retaining portion 404, and a groove portion 405.

[0065] The connecting member 40 is driven from the outside to the inside of the wall 60 of the electrical component box 70 until the head 401 hits the outer surface of the wall 60. The positioning portion 403 protrudes radially from the outer periphery of the body 402.

[0066] The anti - detachment part 404 is on a substantially conical shape and is located at the end of the body part 402. The groove part 405 is formed from the tip of the anti - detachment part 404 toward the positioning part 403. The distance between the positioning part 403 and the anti - detachment part 404 is slightly larger than the thickness of the substrate 30.

[0067] At the four corners of the printed circuit board 100, holding holes 310 for inserting the anti - detachment parts 404 of the connecting member 40 are provided in advance.

[0068] The holding holes 310 are placed so as to overlap with the tips of the anti - detachment parts 404, and the printed circuit board 100 is pushed toward the positioning part 403. At this time, the tip of the anti - detachment part 404 bends in the direction of narrowing the width of the groove part 405, and the periphery of the holding hole 310 fits between the positioning part 403 and the anti - detachment part 404. As a result, the printed circuit board 100 is fixed to the electrical component box 70.

[0069] (3 - 2) Heat sink 50 However, not all four corners of the printed circuit board 100 are fixed to the electrical component box 70 via the connecting member 40.

[0070] Since the second component 20 such as the IPM20b generates a large amount of heat compared with other mounted components, as shown in FIG. 6, a heat sink 50 for heat dissipation is attached by screws 90 to the surface that does not face the second surface 302.

[0071] Also, since the second component 20 is located closer to the corner of the second surface 302 than other mounted components, the second component 20 with the heat sink 50 is used as a member for positioning and connecting the substrate 30 with respect to the electrical component box 70.

[0072] The heat sink 50 attached to the second component 20 is fixed to the electrical component box 70 in a state of passing through the electrical component box 70. However, the heat sink 50 is not directly fixed to the electrical component box 70, and an insulator 56 is sandwiched between the heat sink 50 and the electrical component box 70.

[0073] The insulator 56 is made of resin. A hole 70a for inserting the insulator 56 is provided in the wall 60 of the electrical component box 70. The insulator 56 is formed in an annular shape so as to cover the edge of the hole 70a from the inside of the hole 70a.

[0074] The annular insulator 56 is provided with a hole 56a for inserting the heat sink 50. The heat sink 50 passes through the hole 56a and is exposed outside the electrical component box 70. The heat sink 50 and the insulator 56 are fastened by screws 90.

[0075] As described above, the second component 20 and the heat sink 50 function as connecting members for fixing the printed circuit board 100 to the electrical component box 70.

[0076] (4) Function of the slit As described above, in the IPM 20b as the second component 20, the lead 200 is soldered to the substrate 30, and the package portion 150 is fixed to the electrical component box 70 via the heat sink 50. Therefore, the IPM 20b is difficult to be displaced with respect to both the substrate 30 and the electrical component box 70.

[0077] For example, when vibration is applied in a direction perpendicular to the substrate 30 (the plate thickness direction) and the first component 10, which is a heavy component, vibrates, the vibration propagates to other mounted components on the substrate 30.

[0078] Since the IPM 20b is difficult to be displaced with respect to both the substrate 30 and the electrical component box 70, a large stress repeatedly acts on it compared to other mounted components. In particular, the lead 200 may break because its strength is weaker than that of the package portion 150.

[0079] Therefore, in the present embodiment, as shown in FIGS. 4 to 6, a slit 30a is provided between the first component 10 and the second component 20 on the substrate 30. The slit 30a suppresses the propagation of vibration from the heavy first component 10 to the second component 20, thereby preventing the lead 200 from breaking due to vibration.

[0080] Specifically, as shown in FIG. 5, among the plurality of leads 200 of the IPM20a, when the lead closest to the first to third electrolytic capacitors 10a to 10c, which are the first components 10, is defined as the first lead 201, a slit 30a is provided between the first lead 201 and the first to third electrolytic capacitors 10a to 10c.

[0081] Considering both workability and prevention of vibration propagation, the width of the slit 30a is preferably in the range of 1.0 mm to 4.0 mm.

[0082] Also, the slit 30a preferably penetrates the substrate 30. In this case, the vibration propagation from the first component 10 is blocked by the penetrating slit 30a, and the propagation to the second component 20 is suppressed.

[0083] (4-1) Regarding the length of the slit The slit does not necessarily need to be long enough to cover the entire space between all the first components (the first to third electrolytic capacitors 10a to 10c and the coil 10e) and the second component 20.

[0084] FIG. 7 is an external view of the second surface 302 of the printed circuit board 100 with the length of the slit in FIG. 5 changed.

[0085] In FIG. 7, a slit 30b is provided between the first electrolytic capacitor 10a located at the center of the substrate 30 and the first lead 201, which is the lead closest to the first electrolytic capacitor 10a. Therefore, the slit 30b is shorter in length than the slit 30a shown in FIG. 5 and is set to a length that suppresses only the vibration propagation from the first electrolytic capacitor 10a.

[0086] According to the applicant's experiments, it has been found that the slit 30b provides an effect equivalent to that of the slit 30a shown in FIG. 5. Since the vibration amplitude of the first component (the first electrolytic capacitor 10a) at the center of the substrate 30 among the first components 10 is the largest, it is considered that suppressing the vibration propagation from the first electrolytic capacitor 10a has exerted the greatest effect. The length of the slit is preferably 15 to 30 mm.

[0087] (4-2) Number and position of the slits FIG. 8 is an external view of the second surface 302 of the printed circuit board 100 in which the number of slits in FIG. 7 is changed.

[0088] In FIG. 8, a slit 30c is added between the coil 10e, which is the first component 10 farthest from the IPM20b, and the first lead 201 of the IPM20b and in the vicinity of the coil 10e.

[0089] According to the applicant's experiments, it is known that the vibration propagation from the coil 10e, which is the farthest from the IPM20b, may be greater than that from the first electrolytic capacitor 10a located at the center of the substrate 30 where the vibration amplitude is maximum.

[0090] This is presumably due to the influence of the weight balance between the coil 10e and the first to third electrolytic capacitors 10a to 10c. In such a case, by providing the slit 30c close to the coil 10e which is the vibration source, the vibration propagation from the coil 10e can be effectively suppressed.

[0091] (5) Features (5-1) The printed circuit board 100 includes a first component 10 which is a heavy component for storing electrical energy or inductive energy, a second component 20 which is a power device having a plurality of leads 200, and a substrate 30 on which the first component 10 and the second component 20 are mounted. In the substrate 30, slits (30a, 30b, 30c) are provided between the first component 10 and the second component 20, and the leads 200 of the second component 20 are soldered. In the printed circuit board 100, since the vibration from the heavy first component 10 is suppressed from propagating to the second component 20 by the slits (30a, 30b, 30c), the breakage of the leads 200 due to vibration can be prevented.

[0092] (5-2) A slit (30a, 30b, 30c) is provided between the first lead 201, which is the closest to the first component 10 among the plurality of leads 200 of the second component 20, and the first component 10.

[0093] (5-3) When vibration in a direction perpendicular to the substrate 30 is applied, the stress on the first lead 201 by the first component 10 is greater than the stress on other components.

[0094] (5-4) A slit (30a, 30b, 30c) is provided between the first component 10, which has the greatest stress on the lead 200 when vibration in a direction perpendicular to the substrate 30 is applied among the plurality of first components 10, and the second component 20.

[0095] (5-5) The first component 10 is any one of an electrolytic capacitor, a reactor, and a coil.

[0096] (5-6) The second component 20 is any one of an intelligent power module, an active filter module, an insulated gate bipolar transistor, a thyristor, and a triac.

[0097] (5-7) In the printed circuit board 100, since the first component 10 is at the center of the substrate 30, the substrate 30 is likely to be deformed by vibration, so the effect of providing the slits (30a, 30b) in the substrate 30 is high.

[0098] (5-8) The slits 30a, 30b, 30c penetrate the substrate 30.

[0099] (5-9) If the widths of the slits 30a, 30b, 30c are within the range of 1.0 to 4.0 mm, both workability and prevention of vibration propagation can be satisfied.

[0100] (5-10) The substrate 30 is fixed to the object via the connecting member 40 and the second component 20. Since the lead 200 of the second component 20 also functions as a connecting member, the second component 20 is more susceptible to repeated fatigue due to vibration than the other mounted components. Therefore, by providing slits (30a, 30b, 30c) between the first component 10 and the second component 20, vibration propagation can be blocked, and the lead 200 can be protected from repeated fatigue.

[0101] As described above, the embodiments of the present disclosure have been explained. It will be understood that various changes in form and details can be made without departing from the spirit and scope of the present disclosure described in the claims.

Industrial Applicability

[0102] The slits according to the present disclosure are applicable not only to the printed circuit board mounted on the outdoor unit, but also to the printed circuit board mounted on the indoor unit of the air conditioner, the printed circuit board mounted on the refrigeration device other than the air conditioner, and the printed circuit board mounted on the electrical equipment.

Explanation of Reference Numerals

[0103] 1 Air conditioner 10 First component 10a First electrolytic capacitor (first component) 10b Second electrolytic capacitor (first component) 10c Third electrolytic capacitor (first component) 10d Reactor (first component) 10e Coil 10e (first component) 20 Second component 20a Rectifier diode module (second component) 20b Intelligent power module (IPM; second component) 30 Substrate 30a Slit 30b Slit 30c Slit 40 Connecting member 70 Electrical component box (object) 100 Printed Circuit Board 200 Lead 201 First Lead

Prior Art Documents

Patent Documents

[0104]

Patent Document 1

Claims

1. A first component (10) which is a weight component for storing electrical energy or inductive energy, A second component (20) which is a power device having a plurality of leads (200), The first component (10) and the second component (20) are mounted, and slits (30a, 30b, 30c) are provided between the first component (10) and the second component (20), and a substrate (30) on which the leads (200) of the second component (20) are soldered, Comprising, The entire circumference of the slit (30a, 30b, 30c) is surrounded by the substrate (30), The first component (10) is mounted on one of the first surface (301) and the second surface of the substrate (30), and the second component (20) is mounted on the other second surface (302) of the substrate (30), The substrate (30) has the second surface (302) side fixed to an object (70). Printed circuit board (100).

2. The plurality of leads (200) include a first lead (201) closest to the first component (10), The slit (30a, 30b, 30c) is provided between the first component (10) and the first lead (201). The printed circuit board (100) according to Claim 1.

3. When vibration in a direction perpendicular to the substrate (30) is applied, the stress on the first lead (201) by the first component (10) is greater than the stress on other components. The printed circuit board (100) according to Claim 2.

4. A plurality of the first components (10) are mounted on the substrate (30), The plurality of the first components (10) include a first weight component having the greatest stress on the lead (200) when vibration in a direction perpendicular to the substrate (30) is applied, The slit (30a, 30b, 30c) is provided between the first weight component and the second component (20). The printed circuit board (100) according to Claim 1 or Claim 2.

5. The first component (10) is any one of an electrolytic capacitor, a reactor, and a coil. The printed circuit board (100) according to Claim 1 or Claim 2.

6. The second component (20) is any one of an intelligent power module, an active filter module, an insulated gate bipolar transistor, a MOSFET, a diode, a thyristor, and a triac. The printed circuit board (100) according to Claim 1 or Claim 2.

7. The first component (10) is mounted at the central portion of the substrate (30). The printed circuit board (100) according to claim 1 or claim 2.

8. The slits (30a, 30b, 30c) penetrate through the substrate (30). The printed circuit board (100) according to claim 1 or claim 2.

9. The width of the slits (30a, 30b, 30c) is within the range of 1.0 to 4.0 mm. The printed circuit board (100) according to claim 1 or claim 2.

10. The substrate (30) is fixed to the object (70) via the connecting member (40) and the second component (20). The printed circuit board (100) according to claim 1 or claim 2.

11. Having the printed circuit board (100) according to claim 1 or claim 2. An air conditioner (1).

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