Electronic component mounting device

Abstract

To provide an electronic component mounting device that can be mounted while suppressing the effects of generated dust.SOLUTION: A mounting device 1 of an electronic component C according to an embodiment includes a mounting mechanism 3 in which a mounting head 31 holding an electronic component C mounts the electronic component C on a substrate S at a mounting position OA, a board support mechanism 2 that supports the substrate S on which the electronic component C is mounted, a supply unit 6 that supplies the electronic component C, and a transfer unit 7 that transfers the electronic component C from the supply unit 6 to the mounting position OA, and the transfer unit 7 includes a transfer head 71 that picks up the electronic component C from the mounting surface F of the electronic component C in the supply unit 6 and transfers it to the mounting head 31, an arm unit 72 provided with the transfer head 71 at one end, and a transfer mechanism 73 that has a sliding unit provided at a position that does not overlap the mounting surface F in plan view, and moves the transfer head 71 between the supply unit 6 and the mounting position OA by driving the arm unit 72 according to the sliding movement of the sliding unit.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic component mounting apparatus.

Background Art

[0002] In the method of mounting a semiconductor chip, which is an electronic component, on a substrate, there are face-up and face-down methods. The surface on which the semiconductor layer of the semiconductor chip is formed is called the face. The method of mounting with this face side on the opposite side of the substrate is face-up. For example, when mounting a semiconductor chip on a lead frame or the like and wiring between the electrodes and the frame with wires, the mounting is by face-up.

[0003] The method of mounting with the face side facing the substrate is face-down. For example, in the case of flip-chip connection in which bump electrodes are provided on the surface of the semiconductor layer and the bump electrodes are pressed against the wiring of the substrate to perform fixing and electrical connection, the mounting is by face-down.

[0004] When mounting an electronic component such as a semiconductor chip on a substrate, the electronic component must be precisely positioned with respect to the substrate. To address this, for example, a camera capable of imaging in both the up and down directions is inserted between the mounting tool that adsorbs and holds the electronic component and the substrate. Based on the image captured by this camera, the horizontal relative position between the substrate and the electronic component is recognized. Then, based on the recognized relative position, after correcting the position of the mounting tool, the electronic component is mounted on the substrate.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In recent years, in 3D packages and hybrid bonding that increase the integration density by arranging semiconductor chips in multiple layers, it is necessary to bond electrodes with a very narrow pitch. For this reason, when mounting electronic components on a substrate, higher accuracy, for example, accuracy on the order of sub-microns, has been required. Furthermore, during mounting, errors due to the operation of the mechanism part for mounting and dust generated by the operation may cause poor bonding. Therefore, it is preferable to make the distance that the mechanism part operates as short as possible.

[0007] However, the electronic component is picked up and inverted by a transfer tool or the like from the state of being attached to the wafer sheet, and then received by a mounting tool that has moved to the receiving position, and is transported to the mounting position. Thus, when the mounting tool moves between the receiving position where the mounting tool receives the electronic component and the mounting position where the electronic component is mounted on the substrate, the amount of dust generated at the mounting position increases. To address this, it is conceivable to increase the moving distance of the transfer tool and suppress the moving distance of the mounting tool. However, if the moving distance of the transfer tool is increased, the possibility that the electronic component attached to the wafer sheet will be affected by the generation of dust from the transfer tool increases.

[0008] The present invention has been proposed to solve the above-described problems, and an object thereof is to provide a mounting apparatus for an electronic component that can perform mounting while suppressing the influence of generated dust.

Means for Solving the Problems

[0009] In the mounting apparatus for an electronic component of the present invention, a mounting head that holds the electronic component has a mounting mechanism that mounts the electronic component on a substrate at a mounting position, and the substrate on which the electronic component is mounted Having a stage for placementIt has a substrate support mechanism, a supply unit that supplies the electronic components, and a transfer unit that transfers the electronic components from the supply unit to the mounting position. The transfer unit picks up the electronic components from the mounting surface of the electronic components in the supply unit and passes them to the mounting head. It has a transfer head, an arm portion provided with the transfer head at one end, and a sliding portion provided at a position that does not overlap the mounting surface in a plan view. By driving the arm portion according to the sliding of the sliding portion, it has a transfer mechanism that moves the transfer head between the supply unit and the mounting position. The mounting head is provided in the mounting mechanism and has a transmission portion that can recognize the mark of the substrate through the electronic component held. The mounting head is disposed below the substrate support mechanism at the mounting position where the electronic component is mounted on the substrate. The stage on which the substrate is placed by the substrate support mechanism is A first imaging unit that images the mark of the electronic component held by the mounting head in a state of being retracted from the mounting position, a second imaging unit that is disposed above the mounting head at the mounting position and images the mark of the substrate through the transmission portion, and a positioning mechanism that positions the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the images of the marks imaged by the first imaging unit and the second imaging unit.

Effect of the Invention

[0010] The present invention can provide a mounting device for electronic components that can be mounted while suppressing the influence of generated dust.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Mode for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, this embodiment is a mounting device 1 for mounting an electronic component C on a substrate S. FIG. 1 is a front view showing the schematic configuration of the mounting device 1. FIG. 2 is a plan view showing the electronic component C and the substrate S. Note that the drawings are schematic, and the size (hereinafter also referred to as dimensions), shape, ratio of the sizes of each part to each other, etc. may be different from the actual ones. [Electronic Component] First, examples of the electronic component C to be mounted in this embodiment include semiconductor elements such as ICs and LSIs.

[0013] In this embodiment, as shown in FIG. 2, a semiconductor chip having a rectangular parallelepiped shape is used as the electronic component C. Each semiconductor chip is a bare chip obtained by dicing a semiconductor wafer into individual pieces. The bare chip has bump electrodes provided on the exposed semiconductor and is mounted by flip chip connection to be joined to pads on the substrate S.

[0014] A plurality of marks m for positioning are formed on the electronic component C. In this embodiment, two marks m are formed, one at each of a pair of corner portions that are the diagonals of the rectangular electronic component C. The mark m is formed on the face of the electronic component C where the electrodes are formed, that is, the face. This embodiment is a device for face-down mounting in which the face side is mounted toward the substrate S. [Substrate] As shown in Fig. 2, the substrate S on which the electronic component C is mounted as described above is a plate-like member made of resin or the like on which printed wiring or the like is formed, or a silicon substrate or the like on which a circuit pattern is formed. The substrate S is provided with a mounting region B which is a region where the substrate S is mounted, and a plurality of marks M for positioning are provided outside the mounting region B. In the present embodiment, two marks M are formed at positions outside the mounting region B and corresponding to the mark m of the electronic component C. [Mounting apparatus] The mounting apparatus 1 of the present embodiment is a mounting apparatus 1 capable of realizing mounting with high precision, for example, a mounting accuracy of ±0.2 μm or less. As shown in Figs. 1 and 3, it has a substrate support mechanism 2, a mounting mechanism 3, a first imaging unit 4, a second imaging unit 5, a supply unit 6, a transfer unit 7, and a control device 8. Fig. 3(A) is a plan view of the mounting apparatus 1, and Fig. 3(B) is a plan view showing the mark M through the mounting head 31.

[0015] In the following description, the direction in which the mounting mechanism 3 moves to mount the electronic component C on the substrate S is defined as the Z-axis, and two axes orthogonal to each other in a plane orthogonal to this are defined as the X-axis and the Y-axis. In the present embodiment, the Z-axis is vertical, the direction following gravity is downward, the direction against gravity is upward, and the position on the Z-axis is called the height. Also, the X-axis and the Y-axis are on a horizontal plane. When viewed from the front side of Fig. 1, the X-axis is in the left-right direction and the Y-axis is in the depth direction. However, the present invention is not limited to this installation direction. Regardless of the installation direction, with reference to the substrate S or the substrate support mechanism 2, the side on which the electronic component C is mounted is called the upper side, and the opposite side is called the lower side.

[0016] The substrate support mechanism 2 is a mechanism for supporting the substrate S on which the electronic component C is mounted, that is, a so-called substrate stage. The mounting mechanism 3 is a mechanism for mounting the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31. As shown in Fig. 3(B), the mounting head 31 has a transmissive portion that allows the mark M of the substrate S facing the electronic component C to be recognized through while holding the electronic component C.

[0017] The first imaging unit 4 is disposed below the substrate support mechanism 2 at the mounting position OA where the mounting head 31 mounts the electronic component C on the substrate S. With the substrate S retracted from the mounting position OA by the substrate support mechanism 2, the mark m of the electronic component C held by the mounting head 31 is imaged from a position facing the electronic component C, that is, from below. The mounting position OA is the position where the electronic component C is mounted on the substrate S, and in the figure, it is indicated by a dashed line along the Z-axis passing through a point (for example, the center point) on the XY coordinates within the area of the electronic component C to be mounted. As will be described later, the mounting position OA coincides with the optical axes of the cameras of the first imaging unit 4 and the second imaging unit 5. The second imaging unit 5 is disposed above the mounting head 31 at the mounting position OA, and images the mark M of the substrate S through the transmissive portion of the mounting head 31 (hereinafter, this is referred to as "imaging through the mounting head 31"). Based on the image thus captured, detection of the marks m and M, that is, recognition of the marks m and M becomes possible.

[0018] Note that the substrate support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism performs positioning between the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from the images of the marks M and m captured by the first imaging unit 4 and the second imaging unit 5. Each part of the mounting apparatus 1 as described above is mounted on a support base 11 installed on the installation surface. The top surface of the support base 11 is a horizontal plane.

[0019] The supply unit 6 supplies the electronic component C. The transfer unit 7 transfers the electronic component C from the supply unit 6 to the mounting position OA. The transfer unit 7 has a transfer head 71 and a transfer mechanism 73. The transfer head 71 picks up the electronic component C from the supply unit 6, inverts it, and delivers it to the mounting head 31. The transfer mechanism 73 moves the transfer head 71 into the space created by the substrate support mechanism 2 retracting the substrate S from the mounting position OA and positions it at the mounting position OA.

[0020] The control device 8 controls the operation of the mounting device 1. This control device 8 is constituted by, for example, a dedicated electronic circuit or a computer that operates according to a predetermined program. That is, in the control device 8, a processing device such as a PLC or a CPU reads a program, data, etc. from a storage device and executes the control of the mounting device 1. Each part will be described in detail below. (Substrate support mechanism) As shown in FIGS. 1 and 3(A), the substrate support mechanism 2 is disposed on the support base 11 and includes a stage 21 and a drive mechanism 22. The stage 21 is a plate-shaped member on which the substrate S is placed. The drive mechanism 22 has, for example, a guide rail 22a in the X-axis direction and a guide rail 22b in the Y-axis direction, and is a two-axis movement mechanism that moves the stage 21 in a horizontal plane using a motor (not shown) as a drive source by a belt or a ball screw. This drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. Although not shown, the drive mechanism 22 includes a θ drive mechanism for rotating and moving the stage 21 in a horizontal plane.

[0021] The drive mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along the guide rail 22b. A through hole 23a is formed in the moving plate 23 so that the first imaging unit 4 can image the electronic component C.

[0022] Although not shown, a loader / unloader for supplying / storing the substrate S to / from the stage 21 is provided at one of the moving ends of the stage 21 of the substrate support mechanism 2 in the X-axis direction (specifically, the moving end on the right side in the figure). Therefore, the substrate support mechanism 2 receives the supply of the substrate S from the loader or delivers the substrate S to the unloader in a state where the stage 21 is moved to the above-mentioned moving end. (Mounting mechanism) The mounting mechanism 3 includes a mounting head 31 and a drive mechanism 32. The mounting head 31 is generally in the shape of a rectangular parallelepiped and has a hollow portion 31a and a holding portion 31b as a transmission portion. The hollow portion 31a is a cylindrical through-hole formed with the Z-axis direction as the axis. The holding portion 31b is a plate-like member capable of transmitting light for imaging, and is attached so as to close the opening on the side of the substrate S in the hollow portion 31a. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool and holds the electronic component C.

[0023] As shown in FIG. 3(B), a suction area D for sucking and holding the electronic component C is provided at the center of the holding portion 31b. Although not shown, suction holes are formed in the suction area D. A flow path for communicating the suction holes with a negative pressure source is formed inside the holding portion 31b, and the electronic component C can be suction-held by generating a negative pressure in the suction holes. The periphery of the suction area D of the holding portion 31b is a transmission area T that can transmit the mark M of the substrate S and be imaged even when the electronic component C is sucked. That is, the mounting head 31 has a transparent portion so that the mark M of the substrate S can be imaged by the second imaging unit 5. Note that the holding surface (suction surface) for holding the electronic component C of the holding portion 31b is called the lower end surface.

[0024] The drive mechanism 32 includes moving bodies 33, 34, and 35 and is a mechanism for driving the mounting head 31. The moving body 33 is provided so as to be movable along a Y-axis direction guide rail 33a provided on the support base 11. The moving body 34 is provided so as to be movable along an X-axis direction guide rail 34a provided on the top surface of the moving body 33. The moving body 35 is provided so as to be movable along a Z-axis direction guide rail 35a provided on the front surface of the moving body 34. The moving body 35 is generally formed in a concave shape in plan view. These moving bodies 33, 34, and 35 are driven by a ball screw, a linear motor, a cylinder, or the like having a motor as a drive source.

[0025] The mounting head 31 is provided at the lower part of a moving body 35 that moves in the Z-axis direction. Therefore, the moving body 35 performs an operation for mounting the electronic component C held by the holding part 31b of the mounting head 31 on the substrate S. Further, the moving body 35 provided with the mounting head 31 moves in the X-axis direction and the Y-axis direction due to the movement of the moving bodies 33 and 34. Therefore, the drive mechanism 32 functions as a positioning mechanism for positioning the electronic component C held by the mounting head 31. Although not shown, the drive mechanism 32 includes a θ drive mechanism for rotationally moving the mounting head 31 within a horizontal plane.

[0026] In this embodiment, it is preferable to set the moving amounts in the X-axis direction, Y-axis direction, and Z-axis direction by the drive mechanism 32 to be as short as possible from the viewpoint of preventing movement errors. For example, the moving amounts in the X-axis direction and Y-axis direction by the moving bodies 33 and 34 are set to several millimeters to a dozen or so millimeters, respectively. Also, the moving amount in the Z-axis direction by the moving body 35 is set to about several millimeters to a dozen or so millimeters. That is, the mounting head 31 is at a height position where the lower end surface of the holding part 31b has an opposing interval (vertical separation distance) of several millimeters, for example, 1 to 2 mm, with respect to the upper surface of the substrate S placed on the stage 21, and the receiving of the electronic component C and the imaging of the mark m of the received electronic component C are performed. Therefore, regarding the moving amount of the moving body 35 in the Z-axis direction, at least a moving amount that can ensure that the electronic component C held by the holding part 31b can be pressed and mounted on the substrate S with a predetermined pressing force from this height position is sufficient. (First imaging unit) The first imaging unit 4 includes a camera, a lens, a lens barrel, a light source, etc., and is fixed in a housing hole 11a provided in the support base 11. The optical axis of the camera of the first imaging unit 4 is arranged in a direction capable of imaging the mark m of the electronic component C held by the mounting head 31. Specifically, it is arranged such that the optical axis is in the vertical direction. The first imaging unit 4 is immovable relative to the mounting position OA of the electronic component C. In the present embodiment, the first imaging unit 4 is arranged upward in the housing hole 11a of the support base 11, which is a position below the substrate support mechanism 2, with the optical axis of the camera aligned with the mounting position OA. The first imaging unit 4 is fixed to the support base 11 in a size and positional relationship such that even if the electronic component C moves maximally for positioning, the two marks m do not go out of the imaging field. That is, the imaging field of the first imaging unit 4 is set in consideration of the range within which the two marks m of the electronic component C can move maximally for positioning in a state where the optical axis is fixed to coincide with the mounting position OA.

[0027] Here, "immovable" means that the first imaging unit 4 (similarly for the second imaging unit 5 described later) does not move when imaging the marks m and M. For example, if the imaging units 4 and 5 are provided with drive devices in the X and Y axis directions (horizontal direction) and the Z axis direction (vertical direction), and the horizontal and vertical positions of the imaging units 4 and 5 are adjusted as preparatory operations for the operation of the device by these drive devices and do not move during the subsequent operation of the device, such a configuration is included in "immovable". (The second imaging unit) The second imaging unit 5 includes a camera, a lens, a lens barrel, a light source, etc., and is supported and fixed by a frame (not shown) or the like above the support base 11, more specifically, above the mounting head 31. The optical axis of the camera of the second imaging unit 5 is arranged in a direction capable of imaging the mark M around the mounting region B of the substrate S through the holding portion 31b of the mounting head 31. That is, in the present embodiment, the second imaging unit 5 is arranged downward at a position directly above the mounting head 31 with the optical axis of the camera aligned with the mounting position OA. Similar to the first imaging unit 4, the second imaging unit 5 is stationary with respect to the mounting position OA of the electronic component C. That is, the imaging field of view of the second imaging unit 5 is set in consideration of the maximum range in which the two marks attached to the mounting region B of the substrate S can move for positioning. Therefore, the size of the transmission portion of the mounting head 31 is set according to the imaging field of view of the second imaging unit 5.

[0028] Here, the arrangement of the first imaging unit 4 and the second imaging unit 5 of the present embodiment will be described. It is preferable for the mounting apparatus 1 of the present embodiment to obtain a mounting accuracy of 0.2 μm or less. For this purpose, the first imaging unit 4 and the second imaging unit 5 need to have performance capable of high-magnification and high-definition imaging commensurate with that accuracy.

[0029] Generally, it is known that in order to capture a high-definition image, it is necessary to arrange the imaging unit at a position close to the electronic component C or the substrate S that is the imaging target. Therefore, it is also preferable to arrange the first imaging unit 4 and the second imaging unit 5 as close as possible to the electronic component C or the substrate S, that is, to shorten the imaging distance.

[0030] However, in the mounting device 1 of the present embodiment, in order to minimize the downward movement amount of the electronic component C during mounting, the electronic component C is positioned at a position close to the upper surface height of the substrate S, and the imaging of the mark m of the electronic component C and the imaging of the mark M of the substrate S are performed. Therefore, between the first imaging unit 4 and the electronic component C, there are the stage 21 and the moving plate 23 of the drive mechanism 22, and between the second imaging unit 5 and the substrate S, there is the mounting head 31. Then, since it is necessary to avoid interference with the moving plate 23 and the mounting head 31, there is a limit to shortening the distance between the first imaging unit 4 and the electronic component C and shortening the distance between the second imaging unit 5 and the substrate S.

[0031] Therefore, the inventor of the present application considered the maximum value of the imaging distance at which an image capable of realizing the above mounting accuracy can be captured. As a result, it was derived that it is approximately 100 mm. From this result, in the present embodiment, the first imaging unit 4 is fixedly arranged at a height position where the distance from the electronic component C is within 100 mm, and the second imaging unit 5 is fixedly arranged at a height position where the distance from the substrate S is within 100 mm.

[0032] Note that the mounting head 31 located between the second imaging unit 5 and the substrate S is a member having a relatively large height dimension (dimension in the Z-axis direction) for reasons such as ensuring rigidity. Therefore, interference may occur in a normal configuration. Therefore, as a result of intensive studies, the inventor of the present application succeeded in minimizing the height dimension while maintaining the functions and rigidity required for the mounting head 31. Specifically, the height dimension of the mounting head 31 (the dimension from the lower end of the holding portion 31b to the upper opening of the hollow portion 31a) was configured to be about 70 mm. Thereby, it became possible to arrange the second imaging unit 5 at a height position of 100 mm or less with respect to the substrate S. (Supply Unit) The supply unit 6 includes a support mechanism 61 and a drive mechanism 62. The support mechanism 61 is a device that supports the wafer sheet WS to which the electronic component C is attached. The drive mechanism 62 moves the support mechanism 61 along the X-axis direction and the Y-axis direction. The electronic component C is diced into individual pieces. In the supply unit 6, the surface on which the electronic component C is mounted is referred to as the mounting surface F. In this embodiment, the surface of the wafer sheet WS to which the electronic component C is attached is the mounting surface F. The wafer sheet WS is attached to a wafer ring (not shown). The support mechanism 61 has a ring holder 61a for mounting the wafer ring. That is, it can be said that the surface of the support mechanism 61 that supports the wafer sheet WS is the mounting surface F.

[0033] Although not shown in the figure, a loader / unloader for supplying / storing the wafer ring to / from the ring holder 61a is provided at one of the moving ends of the support mechanism 61 in the Y-axis direction (specifically, the moving end on the front side in the figure). The support mechanism 61 receives the supply of the wafer ring from the loader or delivers the wafer ring to the unloader in the state of moving to the above-mentioned moving end.

[0034] Also, although not shown in the figure, the support mechanism 61 has an expand mechanism that creates a gap between the electronic components C by expanding the wafer sheet WS, and a push-up mechanism that separates the electronic components C individually by sandwiching the expanded wafer sheet WS and pushing it up. Further, the support mechanism 61 includes a θ drive mechanism that rotates the ring holder 61a in the horizontal plane. The push-up mechanism is fixedly arranged on the support base 11, and the receiving of the electronic component C from the supply unit 6 by the transfer unit 7, that is, the pickup, is performed at this position (pickup position).

[0035] The drive mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the drive mechanism 62 has a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction, and is a mechanism that uses a belt or a ball screw with a motor (not shown) as a drive source to move the support mechanism 61 in the X-axis and Y-axis directions within a horizontal plane. This drive mechanism 62 functions as a positioning mechanism for positioning the electronic component C with respect to the transfer head 71. Note that the drive mechanism 62 is disposed at a position lower than the height position L (see FIG. 5) of the mounting surface F. (Transfer section) The transfer section 7 includes a transfer head 71, an arm section 72, and a transfer mechanism 73. As shown in the enlarged view of FIG. 4, the transfer head 71 has a suction nozzle 71a and a reverse drive section 71b. The suction nozzle 71a is connected via a tube to a pneumatic circuit (not shown), adsorbs the electronic component C at the tip by negative pressure, and releases the electronic component C by releasing the negative pressure or applying positive pressure. As shown in FIGS. 4(A) and 4(B), the reverse drive section 71b reverses the electronic component C adsorbed by the suction nozzle 71a in the vertical direction. That is, the suction nozzle 71a is rotatably provided between the direction facing the wafer sheet WS and the direction facing the mounting head 31 by the reverse drive section 71b. The reverse drive section 71b is, for example, a motor.

[0036] Although not shown, the transfer head 71 has a buffer member that drives the suction nozzle 71a in the vertical direction and applies an appropriate load and absorbs an excessive load when the tip of the suction nozzle 71a contacts the electronic component C. As the buffer member, for example, a voice coil motor is used.

[0037] The arm part 72 is a member provided with a transfer head 71 at one end. As shown in Fig. 3(A), the arm part 72 has an extension part 72a and a base part 72b. The extension part 72a is a member formed in an L shape by a cuboid-shaped member linearly extending in the Y-axis direction facing the front and a cuboid-shaped member linearly extending in the X-axis direction facing the mounting mechanism 3. At one end of the extension part 72a facing the mounting mechanism 3, a reverse drive part 71b is provided such that the rotation axis is in the Y-axis direction. By attaching the suction nozzle 71a to the rotation axis of the reverse drive part 71b, the suction nozzle 71a is provided so as to be rotatable. The base part 72b is a plate-like body parallel to the X-axis direction and is fixed to the other end of the extension part 72a (see Fig. 5).

[0038] The tube for supplying negative pressure connected to the suction nozzle 71a, the reverse drive part 71b, and the cable for electrical connection connected to the buffer member are built in the arm part 72. Being built in means that it is covered by the exterior of the arm part 72 and is not exposed to the outside. In the present embodiment, the tube and the cable are inserted into the hollow part formed inside the arm part 72.

[0039] The transfer mechanism 73 moves the transfer head 71 between the supply part 6 and the mounting position OA by driving the arm part 72. The transfer mechanism 73 has a sliding part provided at a position that does not overlap the placement surface F in a plan view. In other words, the sliding part of the transfer mechanism 73 is provided outside the movement range of the support mechanism 61. The transfer mechanism 73 drives the arm part 72 according to the sliding of the sliding part. Here, the sliding part refers to a component part that moves while members are in contact with each other. Such a sliding part becomes a source of dust. The sliding part of the present embodiment includes a first sliding part 732b and a second sliding part 734b as shown in Fig. 5. The first sliding part 732b and the second sliding part 734b are provided at a position lower (downward) than the height position L of the placement surface F.

[0040] As shown in FIG. 5, the transfer mechanism 73 includes a fixed body 731, a first drive unit 732, a moving body 733, and a second drive unit 734. The fixed body 731 is a rectangular parallelepiped-shaped member that is fixed to the support base 11 and extends in the X-axis direction as shown in FIGS. 1 and 3(A). The position of the fixed body 731 is fixed with respect to the mounting position OA.

[0041] The first drive unit 732 drives the arm unit 72 in the X-axis direction. The first drive unit 732 includes a first drive source 732a and a first sliding portion 732b. The first drive source 732a is a linear motor that extends in the X-axis direction and is provided along the upper surface of the fixed body 731. The first sliding portion 732b is a linear guide that extends in the X-axis direction and is provided on the front surface of the fixed body 731. Note that since the mover of the linear motor moves without contact with the stator, it does not have a sliding portion.

[0042] The moving body 733 is a rectangular parallelepiped-shaped block. The mover of the first drive source 732a is attached thereto, and the slider of the first sliding portion 732b is attached thereto, so that it is provided to be slidable in the X-axis direction according to the operation of the first drive source 732a.

[0043] The second drive unit 734 drives the arm unit 72 in the Z-axis direction. The second drive unit 734 includes a second drive source 734a and a second sliding portion 734b. The second drive source 734a is a linear motor that extends in the Z-axis direction and is provided on the moving body 733. The second sliding portion 734b is a linear guide that extends in the Z-axis direction and is provided on the moving body 733.

[0044] The base portion 72b of the arm portion 72 is provided so as to be slidable in the Z-axis direction by attaching the mover of the second drive source 734a and attaching the slider of the second sliding portion 734b thereto. Thus, the sliding portion of the present embodiment has a first sliding portion 732b and a second sliding portion 734b that linearly slide along two orthogonal axes. The first sliding portion 732b and the second sliding portion 734b are arranged in a positional relationship where they overlap in the height direction on two opposite side surfaces of the common moving body 733. That is, the positions of the two orthogonal axes are in close proximity. Also, it is preferable that the distance between the two side surfaces of the moving body 733 is short, that is, the moving body 733 is thin. (Relationship between the opposing interval between the substrate on the stage and the mounting head and the dimensions of the transfer head) In the present embodiment, as shown in FIG. 1, in order for the transfer head 71 to move to the mounting position OA, the opposing interval between the substrate S at the mounting position OA and the mounting head 31 is set so that the substrate S needs to be retracted. In other words, in order for the transfer head 71 to move to the mounting position OA, the height position of the mounting head 31 when receiving the electronic component C at the mounting position OA is set in proximity to the height position of the upper surface of the substrate S supported by the substrate support mechanism 2 to the extent that the substrate S needs to be retracted. More specifically, the interval h when the height position of the upper surface of the substrate S placed on the stage 21 of the substrate support mechanism 2 at the mounting position OA faces the lower end surface of the mounting head 31 when receiving the electronic component C is shorter than the height dimension H of the transfer head 71 at the tip of the arm portion 72 (h < H). Here, as described above, the distance from the lower end surface of the holding portion 31b to the height position of the upper surface of the substrate S is, for example, several millimeters. (Dimensions of the arm portion) As shown in FIGS. 1, 3(A), and 4(A), the extending portion 72a of the arm portion 72 has a width w of a member linearly extending in the Y-axis direction and a width d of a member linearly extending in the X-axis direction, both of which are longer than the thickness t in the Z-axis direction (w>t, d>t). Thereby, while suppressing an increase in the dimension in the height direction of the arm portion 72, the rigidity of the relatively long arm portion 72 can be ensured, and the position of the electronic component C transferred by the transfer head 71 can be stabilized. By suppressing an increase in the dimension in the height direction of the arm portion 72, it becomes unnecessary to raise the receiving position of the mounting head 31. (Control device) Based on the marks m and M imaged by the first imaging unit 4 and the second imaging unit 5, the control device 8 controls the positioning mechanism so that the substrate S and the electronic component C are positioned. That is, in the control device 8, the position of the mark m of the electronic component C on the XY coordinates and the position of the mark M of the substrate S on the XY coordinates are stored in the storage device as reference positions corresponding to the positions where the electronic component C should be accurately mounted.

[0045] This reference position can be set as the positions of the marks m and M when the electronic component C is accurately mounted as a result of previously attempting to mount the electronic component C on the substrate S. The control device 8 obtains the deviation between the mark m imaged by the first imaging unit 4, the mark M imaged by the second imaging unit 5, and the reference position, and controls the positioning mechanism (the drive mechanisms 22 and 32) so that the electronic component C and the substrate S move in the direction in which the deviation is corrected and by the amount of movement.

[0046] Further, based on the map information indicating the position coordinates of the electronic component C on the wafer sheet WS, the control device 8 controls the transfer mechanism 73 of the transfer unit 7 and the drive mechanism 62 of the supply unit 6 to sequentially position the electronic component C to be picked up at the pickup position. Here, the term "pickup" means detaching and receiving the electronic component C from a member on which the electronic component C is placed, for example, the wafer sheet WS. Further, the control device 8 controls the holding of the electronic component C by the suction nozzle 71a of the transfer head 71, the inversion of the suction nozzle 71a by the inversion drive unit 71b, the movement of the transfer head 71 to the mounting head 31 by the transfer mechanism 73, and the delivery of the electronic component C to the mounting head 31 by the suction nozzle 71a, etc. [Operation] The operation of the present embodiment as described above will be described with reference to the explanatory diagrams of FIGS. 4 to 7 and the flowcharts of FIGS. 8 and 9. In the initial state, the substrate S is transferred from the loader to the stage 21 of the substrate support mechanism 2, but it is retracted together with the stage 21 from the position facing the mounting head 31, that is, the mounting position OA. [Transfer of Electronic Component] The transfer operation of the electronic component C will be described with reference to the explanatory diagrams of FIGS. 4 to 6 and the flowchart of FIG. 8. A wafer ring to which the wafer sheet WS is attached is mounted on the ring holder 61a of the support mechanism 61 in the supply unit 6 by an autoloader. The electronic component C divided into individual pieces by dicing is attached to this wafer sheet WS. In FIG. 5, those other than the electronic component C to be picked up are not shown.

[0047] First, as shown in FIGS. 5(A) and 3(A), the support mechanism 61 moves in the X-axis and Y-axis directions to position the electronic component C to be mounted at the pickup position. Further, by moving the arm portion 72 in the X-axis direction, the tip of the suction nozzle 71a of the transfer head 71 is positioned directly above the electronic component C to be mounted, that is, at the pickup position (step S101).

[0048] At this time, the movement of the wafer sheet WS in the X-axis and Y-axis directions is performed by the drive mechanism 62 of the supply unit 6. The movement of the arm unit 72 in the X-axis direction is performed by the movement of the moving body 733 along the first sliding portion 732b when the first drive source 732a of the first drive unit 732 operates.

[0049] As shown in FIG. 5(B), the lifting mechanism lifts up the electronic component C to be mounted. Then, the suction nozzle 71a of the transfer head 71 picks up the electronic component C (step S102). That is, the arm unit 72 and the buffer member move in a direction approaching the wafer sheet WS, adsorb and hold the electronic component C, and then move in a direction away from the wafer sheet WS, thereby detaching the electronic component C from the wafer sheet WS.

[0050] The movement of the arm unit 72 at this time is performed by the movement of the base body portion 72b along the second sliding portion 734b when the second drive source 734a of the second drive unit 734 operates. Then, as shown in FIGS. 4(A), (B), 5(C), and (D), the inversion drive unit 71b rotates the suction nozzle 71a by 180° to invert the electronic component C (step S103).

[0051] Next, as shown in FIGS. 6(A) and (B), the arm unit 72 moves in the X-axis direction to position the transfer head 71 at the mounting position OA (step S104). That is, the electronic component C held by the suction nozzle 71a of the transfer head 71 comes to a position facing the holding portion 31b of the mounting head 31 in the mounting mechanism 3. The movement of the arm unit 72 in the X-axis direction at this time is performed by the movement of the moving body 733 along the first sliding portion 732b when the first drive source 732a of the first drive unit 732 operates, covering the distance from the pickup position to the mounting position OA. At this time, the mounting head 31 is waiting at a height position where the facing interval between the lower end surface of the holding portion 31b and the upper surface of the substrate S is a distance of several millimeters. Also, this height position is maintained until immediately before the positioning of the electronic component C and the substrate S is completed and the mounting head 31 is driven toward the substrate S, which will be described later.

[0052] As shown in Fig. 6(C), the arm portion 72 moves in a direction approaching the holding portion 31b, pressing the electronic component C against the holding portion 31b. As shown in Fig. 6(D), the holding portion 31b of the mounting head 31 sucks and holds the electronic component C by negative pressure and receives it (step S105). At the same time, the suction nozzle 71a releases the negative pressure, and the arm portion 72 moves in a direction away from the holding portion 31b to release the electronic component C. The movement of the arm portion 72 at this time is performed by the second driving source 734a of the second driving portion 734 operating, and the base portion 72b moves along the second sliding portion 734b.

[0053] Furthermore, as shown in Fig. 6(E), the arm portion 72 moves toward the supply portion 6, causing the transfer head 71 to retract from directly below the holding portion 31b. The movement of the arm portion 72 at this time is performed by the first driving source 732a of the first driving portion 732 operating, and the moving body 733 moves in the X-axis direction along the first sliding portion 732b. Since the transfer of the electronic component C to the holding portion 31b by the transfer portion 7 is performed at the mounting position OA, the stage 21 remains in the retracted position to avoid interference with the transfer mechanism 73 during the transfer. [Mounting of Electronic Component] Next, the mounting operation of the electronic component C will be described with reference to the explanatory diagram of Fig. 7 and the flowchart of Fig. 9. Here, as shown in Fig. 7(A), the holding portion 31b of the mounting head 31 holding the electronic component C as described above is positioned directly below the second imaging portion 5. The first imaging portion 4 images the mark m of the electronic component C held by the mounting head 31 (step S201). The control device 8 obtains the amount of deviation between the position of the mark m imaged by the first imaging portion 4 and the reference position, and positions the electronic component C by operating the drive mechanism 32 so as to eliminate the deviation amount (step S202).

[0054] ​Next, as shown in FIG. 7(B), the substrate support mechanism 2 moves the stage 21 so that the mounting area B of the substrate S (in this case, the mounting area B where the electronic component C is mounted) faces the electronic component C held by the mounting head 31, that is, the center of the mounting area B comes to the mounting position OA (step S203). Then, as shown in FIG. 3(B), the second imaging unit 5 images the mark M on the substrate S visible in the transmission area T around the electronic component C through the mounting head 31 (step S204).

[0055] The control device 8 obtains the amount of positional deviation between the position of the mark M imaged by the second imaging unit 5 and the reference position, and positions the substrate S by operating the drive mechanism 22 so that the deviation amount is eliminated (step S205). Further, as shown in FIG. 7(C), the drive mechanism 32 drives the mounting head 31 toward the substrate S, and the electronic component C held by the mounting head 31 is mounted on the substrate S (step S206).

[0056] In this way, by repeating the operations of transferring the electronic component C from the wafer sheet WS, delivering the electronic component C to the mounting head 31, positioning the electronic component C and the substrate S, and mounting, the electronic component C is sequentially mounted on each mounting area B of the substrate S. The substrate S on which a predetermined number of electronic components C are mounted is conveyed by the substrate support mechanism 2 and stored in the unloader. [Operation and Effect] (1) The mounting apparatus 1 for the electronic component C according to the present embodiment includes a mounting mechanism 3 that mounts the electronic component C on the substrate S at the mounting position OA with the mounting head 31 that holds the electronic component C, a substrate support mechanism 2 that supports the substrate S on which the electronic component C is mounted, a supply unit 6 that supplies the electronic component C, and a transfer unit 7 that transfers the electronic component C from the supply unit 6 to the mounting position OA.

[0057] Then, the transfer unit 7 includes a transfer head 71 that picks up the electronic component C from the placement surface F of the supply unit 6 and delivers it to the mounting head 31, an arm unit 72 provided with the transfer head 71 at one end, and sliding portions (732b, 734b) provided at positions that do not overlap the placement surface F in a plan view. By driving the arm unit 72 according to the sliding of the sliding portions, it has a transfer mechanism 73 that moves the transfer head 71 between the supply unit 6 and the mounting position OA.

[0058] In this way, since the sliding portions are located at positions that do not overlap the placement surface F of the electronic component C in a plan view, when the arm unit 72 moves according to the sliding of the sliding portions, it is difficult for dust generated from the sliding portions to fall onto the placement surface F, and it is possible to suppress joint failures caused by dust adhering to the electronic component C. (2) The sliding portions are provided at positions lower than the height position of the placement surface F. For this reason, dust generated from the sliding portions will fall below the placement surface F, so it hardly reaches the placement surface F, and joint failures can be further suppressed. (3) The transfer head 71 has a suction nozzle 71a that sucks the electronic component C by negative pressure, and a tube that supplies negative pressure to the suction nozzle 71a is built into the arm unit 72. For this reason, even if dust is generated from the tube that deforms as the arm unit 72 moves, it does not come out of the arm unit 72, so it does not affect the surroundings. (4) The transfer head 71 is a reversing head that is driven by a motor which is a reversing drive unit 71b and reverses the electronic component C, and a cable that supplies power to the motor is built into the arm unit 72. For this reason, even if dust is generated from the tube that deforms as the arm unit 72 moves, it does not come out of the arm unit 72, so it does not affect the surroundings. (5) The sliding portions have a first sliding portion 732b and a second sliding portion 734b that linearly slide along two orthogonal axes. The first sliding portion 732b and the second sliding portion 734b are arranged in a positional relationship where they overlap in the height direction on two opposing side surfaces of a common moving body 733.

[0059] Therefore, the two axes of the first sliding portion 732b and the second sliding portion 734b are arranged in positions close to each other via a common member, and it is possible to prevent the displacement of the transfer head 71 caused by the play of the first sliding portion 732b and the second sliding portion 734b from expanding. Therefore, by providing the sliding portion at a position that does not overlap the placement surface F in plan view, even if the arm portion 72 is long, accurate positioning and transfer of the electronic component C are possible. (6) The transfer unit 7 includes a transfer head 71 that picks up the electronic component C from the supply unit 6, inverts it, and delivers it to the mounting head 31, and a transfer mechanism 73 that moves the transfer head 71 to a space created by the substrate support mechanism 2 retracting the substrate S (stage 21) from the mounting position OA.

[0060] Therefore, in order to receive the electronic component C from the transfer mechanism 73, it is not necessary for the mounting head 31 to move, the position of the electronic component C at the mounting position OA can be kept constant, and the electronic component C can be received at a height position close to the height position of the upper surface of the substrate S, and high mounting accuracy can be obtained. In this way, since the movement amount of the mounting head 31 can be reduced, the amount of dust generated at the mounting position OA can also be reduced. (7) The distance between the substrate S at the mounting position OA and the mounting head 31 is set so that the substrate S needs to be retracted in order for the transfer head 71 to move to the mounting position OA. Therefore, the position of the mounting head 31 when receiving the electronic component C can be set to a position close to the substrate S at the time of mounting. As a result, after the mounting head 31 receives the electronic component C, the distance that the mounting head 31 moves for mounting can be made very short, preventing displacement due to the movement of the mounting head 31 and improving the mounting accuracy. (8) The mounting head 31 has a transmissive portion that allows the mark M on the substrate S to be recognized while holding the electronic component C, and is disposed below the substrate support mechanism 2 at the mounting position OA. In a state where the substrate S has been retracted from the mounting position OA, a first imaging unit 4 that images the mark m of the electronic component C held by the mounting head 31, a second imaging unit 5 that is disposed above the mounting head 31 at the mounting position OA and images the mark M of the substrate S through the transmissive portion, and a positioning mechanism that positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from the images of the marks m and M imaged by the first imaging unit 4 and the second imaging unit 5.

[0061] According to such an embodiment, the electronic component C held by the mounting head 31 is imaged by the first imaging unit 4 disposed below the substrate support mechanism 2 at the mounting position OA in a state where the substrate S has been retracted from the mounting position OA, and the substrate S supported by the substrate support mechanism 2 is imaged through the transmissive portion of the mounting head 31 by the second imaging unit 5 disposed above the mounting head 31 at the mounting position OA. Therefore, it is possible to image the mark m of the electronic component C and the mark M of the substrate S in a state where the electronic component C and the substrate S are brought as close as possible to each other.

[0062] For this reason, the amount of movement of the electronic component C (mounting head 31) and the substrate S (substrate support mechanism 2) when imaging the marks m and M, and the relative amount of movement between the electronic component C (mounting head 31) and the substrate S (substrate support mechanism 2) after imaging the marks m and M can be made as short as possible. Therefore, it is possible to suppress the expansion of errors caused by moving the mounting head 31 or the substrate support mechanism 2 over a long distance. Also, the longer the moving distance of the mechanism, the more dust is generated. However, in this embodiment, since the moving distance can be suppressed, it is possible to prevent the cleanliness from decreasing due to dust and the occurrence of bonding failures.

[0063] Here, when imaging the mark M not through the mounting head 31 but by a camera provided adjacent to the mounting head 31, it is realistically impossible to achieve high required accuracy using a high-magnification camera. That is, the area on the substrate S where the mark M is attached is only about several millimeters larger than the area where the electronic component C is mounted, and the diameter of the mounting head 31 is also only about several millimeters larger than the area where the mark M is attached. For this reason, even if the lens barrel of the camera is arranged adjacent to the mounting head 31, multiple marks M do not enter the field of view of the camera, and multiple marks M cannot be imaged by the camera simultaneously.

[0064] Then, in order to image a plurality (two) of marks M on the substrate S, it is necessary to move the camera (mounting head 31) so that it is larger than the separation distance between the two marks M, and an error will occur during this movement. That is, after recognizing and aligning the mark m of the electronic component C, in order to recognize the mark M of the substrate S, the camera must be moved together with the mounting head 31. Then, even if it is returned to the original position, there is a possibility that the position of the electronic component C will shift.

[0065] To address this, if the recognition and alignment of the mark M on the substrate S are performed first, the position of the electronic component C cannot be recognized when the substrate S is in the position to be mounted. Therefore, the substrate S after alignment must be moved, and a positional deviation of the substrate S will occur.

[0066] Furthermore, it is also conceivable to prepare a template with a mark corresponding to the mark M on the substrate S at a position different from the position to be mounted, and perform positioning based on the relative position between the mark on this template and the mark M on the substrate S. However, in this case, every time the electronic component C is mounted, the mounting head 31 and the camera must be moved to recognize the mark on the template. Then, since the time required to recognize the mark on the template and the time required for positioning are additionally required, productivity decreases. Also, since the moving distance of the mechanism increases, the amount of dust generation also increases.

[0067] In this embodiment, after imaging the marks m and M, the moving distances of the electronic component C and the substrate S can be suppressed, so that misalignment, reduction in productivity, and amount of generated dust can all be suppressed. (9) The transmission part has a transparent plate-like member. Therefore, in a narrow region corresponding to the size of the minute electronic component C, it is possible to realize holding of the electronic component C and ensuring transmissive imaging of the mark M on the substrate S. (10) The first imaging unit 4 and the second imaging unit 5 are provided immovably with respect to the mounting position OA. Therefore, no shift occurs in the imaging regions of the first imaging unit 4 and the second imaging unit 5, and dust generation due to movement can also be prevented. [Modification Example] The supply unit 6 is not limited to a device that supplies the electronic component C attached to the wafer sheet WS. For example, a device that supplies the electronic components C arranged on a tray may also be used. Also, regarding the configuration of the transfer mechanism 73, it is only necessary that the electronic component C can be individually picked up from the supply unit 6 and transferred. For this reason, a configuration in which the arm part 72 moves in the X-axis and Y-axis directions, or a configuration in which the support mechanism 61 moves in the X-axis and Y-axis directions may be used.

[0068] In the transfer mechanism 73, the drive unit that drives the arm part 72 is not limited to a mechanism having a linear motor as a drive source. A mechanism using a ball screw or a belt with a motor whose shaft rotates as a drive source may also be used. In the case of such a mechanism, since it includes a sliding part, it is preferably provided at a position that does not overlap the mounting surface F in plan view. Further, it is preferably provided at a position lower than the height position of the mounting surface F. When there are a plurality of sliding parts, some of the sliding parts may not be provided at a position that does not overlap the mounting surface F in plan view. Also, some of the sliding parts may not be provided at a position lower than the height position of the mounting surface F. In such a case, it is preferable to provide a shielding object such as an exterior, a wall, or other components between the sliding part and the mounting surface F. Also, it is preferable to increase the distance between the sliding part and the mounting surface F.

[0069] The mounting head 31 only needs to be configured such that the second imaging unit 5 can image the mark M on the substrate S. Therefore, even if it is not formed of a transparent material, through holes may be formed at positions corresponding to the mark M. More specifically, the holding portion 31b may be formed of an opaque member, and through holes may be formed at positions corresponding to the mark M. Alternatively, there may be no hollow portion 31a, the holding portion 31b may be formed of an opaque member, and through holes may be formed at positions corresponding to the mark M of the mounting head 31 and the holding portion 31b. Further, the mounting head 31 may move for the transfer of the electronic component C.

[0070] The first imaging unit 4 and the second imaging unit 5 may be provided so as to be movable with respect to the position (mounting position OA) where the electronic component C is mounted. That is, when a plurality of marks m of the electronic component C and a plurality of marks M of the substrate S cannot be imaged collectively, the first imaging unit 4 and the second imaging unit 5 may be configured to move between the marks m or between the marks M for imaging. That is, a moving device for moving between the marks m may be provided in the first imaging unit 4, or a moving device for moving between the marks M may be provided in the second imaging unit 5. Even in this case, since the moving distance remains short within the range of the size of the mounting area B of the electronic component C and the substrate S, errors and dust generation can be suppressed.

[0071] Also, although the positions of the mark m of the electronic component C and the mark M of the mounting area B of the substrate S are aligned with the reference positions respectively, the present invention is not limited to this, and the position of the mounting area B may be aligned with the position of the electronic component C, or the position of the electronic component C may be aligned with the position of the mounting area B. In short, it is only necessary to be able to align the position of the mounting area B of the substrate S and the position of the electronic component C.

[0072] Also, the transfer of the substrate S to the stage 21 of the substrate support mechanism 2 may be performed at the mounting position OA. In this case, after the substrate S is supplied to the stage 21, it is preferable to retract the substrate S from the mounting position OA prior to the imaging of the mark m of the electronic component C by the first imaging unit 4. [Other Embodiments] The embodiments of the present invention and the modifications of each part have been described above. However, these embodiments and the modifications of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention and are also included in the invention described in the claims.

Explanation of Signs

[0073] 1 Mounting device 2 Substrate support mechanism 3 Mounting mechanism 4 First imaging unit 5 Second imaging unit 6 Supply unit 7 Transfer unit 8 Control device 11 Support base 11a Accommodation hole 21 Stage 22 Driving mechanism 22a, 22b, 33a, 34a, 35a, 62a, 62b Guide rail 23 Moving plate 23a Through hole 31 Mounting head 31a Hollow part 31b Holding part 32 Driving mechanism 33, 34, 35 Moving body 61 Support mechanism 61a Ring holder 62 Driving mechanism 71 Transfer head 71a Suction nozzle 71b Reversal drive part 72 Arm part 72a Extension part 72b Base part 73 Transfer mechanism 731 Fixed body 732 First drive part 732a First drive source 732b First sliding part 733 Mobile body 734 Second drive unit 734a Second drive source 734b Second sliding part

Claims

1. A mounting head for holding an electronic component includes a mounting mechanism for mounting the electronic component on a substrate at a mounting position, a substrate support mechanism having a stage for placing the substrate on which the electronic component is to be mounted, a supply unit for supplying the electronic component, a transfer unit for transferring the electronic component from the supply unit to the mounting position, and has, wherein the transfer unit includes a transfer head that picks up the electronic component from a mounting surface of the electronic component in the supply unit and delivers it to the mounting head, an arm portion provided with the transfer head at one end, and has a sliding portion provided at a position that does not overlap the mounting surface in a plan view, and drives the arm portion according to the sliding of the sliding portion to move the transfer head between the supply unit and the mounting position, and has a transfer mechanism, the mounting head is provided in the mounting mechanism and has a transmission portion that allows the mark of the substrate to be recognized through while holding the electronic component, a first imaging unit that images a mark of the electronic component held by the mounting head in a state where the mounting head is disposed below the substrate support mechanism at the mounting position where the mounting head mounts the electronic component on the substrate, and the stage for placing the substrate by the substrate support mechanism is retracted from the mounting position, a second imaging unit that is disposed above the mounting head at the mounting position and images a mark of the substrate through the transmission portion, and a positioning mechanism that positions the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the images of the marks imaged by the first imaging unit and the second imaging unit, and an electronic component mounting apparatus characterized by having the above.

2. The electronic component mounting apparatus according to claim 1, wherein the sliding portion is provided at a position lower than the height position of the mounting surface.

3. The transfer head has a suction nozzle that sucks the electronic component by negative pressure, and the electronic component mounting apparatus according to claim 1 or claim 2, wherein a tube for supplying negative pressure to the suction nozzle is built in the arm portion.

4. The sliding portion has a first sliding portion and a second sliding portion that linearly slide along two orthogonal axes, and the electronic component mounting apparatus according to any one of claims 1 to 3, wherein the first sliding portion and the second sliding portion are disposed on two side surfaces of a common moving body.

Images