Wafer storage container cleaning device

Abstract

To suppress cleaning liquid from entering the internal space of a door.SOLUTION: A wafer storage container cleaning device in which one side has a key hole that can be rotated with a latch key inserted to switch between locking and unlocking a wafer storage container body, and that cleans a door of the wafer storage container, which has a protrusion hole formed on the side surface through which the latch can protrude when locked includes a door holding portion that holds the door, a cleaning liquid nozzle that supplies cleaning liquid to the other side of the door, and a gas nozzle that generates gas flow that prevents the cleaning liquid from entering through the protrusion hole at least when the cleaning liquid is being supplied to the door from the cleaning liquid nozzle.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] Embodiments of the present invention relate to a wafer storage container cleaning device.

Background Art

[0002] Conventionally, there is a wafer storage container cleaning device for cleaning a wafer storage container such as a FOUP (Front Opening Unified Pod) or FOSB (Front Opening Shipping Box) that stores (accommodates) semiconductor wafers. The wafer storage container includes a wafer storage container body that stores semiconductor wafers, and a door that is provided to be openable and closable with respect to the wafer storage container body. On the side surface of the door, a hole is formed through which a latch for connecting to the wafer storage container body can protrude. Further, since the latch is provided inside the door in a slidable state, an internal space communicating with the above-described hole is formed. When the latch protruding from the door engages with the wafer storage container body, the door and the wafer storage container body are connected. Further, when the engagement between the latch and the wafer storage container body is released, the door and the wafer storage container are separated (disassembled).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a wafer storage container cleaning device, the wafer storage container body and the door are cleaned by discharging a cleaning liquid onto the wafer storage container body and the door in a state where the wafer storage container body and the door are separated. For this reason, the cleaning liquid may enter the internal space through the hole formed in the side surface of the door, resulting in liquid residue.

[0005] The present invention has been made to solve the above-described problems, and an object thereof is to provide a wafer storage container cleaning apparatus capable of suppressing liquid from entering the internal space of a door.

Means for Solving the Problems

[0006] In order to solve the above-described problems and achieve the object, a wafer storage container cleaning apparatus according to an aspect of the present invention has, on one side, a keyhole that can be rotated with a latch key inserted therein to switch between locking and unlocking with a wafer storage container body, and a protruding hole through which a latch can protrude during locking is formed on a side surface. The wafer storage container cleaning apparatus cleans the door of the wafer storage container, and includes a door holding portion that holds the door, a cleaning liquid nozzle that supplies a cleaning liquid to the other side surface of the door, and a gas nozzle that generates a gas flow that inhibits the intrusion of the cleaning liquid from the protruding hole at least when the cleaning liquid is being supplied from the cleaning liquid nozzle to the door. An opening / closing lid that is provided so as to be openable and closable with respect to a cleaning tank opening and includes the door holding part, and a cleaning tank body in which a processing space is formed when the cleaning tank opening is closed by the opening / closing lid. and is characterized by including The gas nozzle supplies the gas to a gas supply space formed between the opening / closing lid including the side surface and the door from one surface side of the door in a state where the door is held by the door holding part. the above.

Effects of the Invention

[0007] According to an aspect of the present invention, it is possible to suppress liquid from entering the internal space of the door.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3A

Figure 3B

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

MODE FOR CARRYING OUT THE INVENTION

[0009] Hereinafter, embodiments of the wafer storage container cleaning apparatus disclosed in the present application will be described in detail with reference to the accompanying drawings. Note that the wafer storage container cleaning apparatus disclosed in the present application is not limited to the following embodiments. Also, each embodiment and each modified example can be appropriately combined within a range where no contradiction occurs. In the following embodiments, a case where the wafer storage container to be cleaned is a FOUP will be described as an example, but the wafer storage container to be cleaned is not limited thereto. For example, the wafer storage container to be cleaned may be a FOSB.

[0010] (First Embodiment) FIG. 1 is a plan view showing an example of the schematic configuration of a wafer storage container cleaning apparatus 1 according to the first embodiment. The wafer storage container cleaning apparatus 1 is provided, for example, inside a factory that manufactures semiconductor wafers, and cleans wafer storage containers. As shown in FIG. 1, the wafer storage container cleaning apparatus 1 includes a load port 2, a robot 3, a disassembling / connecting stage 4, a cleaning tank 5, a vacuum tank 6, an unload port 7, and a control unit 8.

[0011] The robot 3, the disassembling / connecting stage 4, the cleaning tank 5, the vacuum tank 6, and the control unit 8 are provided inside the casing 1a of the wafer storage container cleaning apparatus 1. On the other hand, the load port 2 and the unload port 7 are provided straddling the inside and outside of the casing 1a of the wafer storage container cleaning apparatus 1.

[0012] The load port 2 carries the FOUP 20 to be cleaned, which is placed on the external portion of the casing 1a of the load port 2, into the casing 1a. The FOUP 20 includes a FOUP main body (shell) 20a and a door (lid) 20b. The FOUP main body 20a has an opening (FOUP main body opening) and a storage space for storing semiconductor wafers. The storage space exists inside the FOUP main body opening and communicates with the FOUP main body opening. The FOUP main body 20a is an example of a wafer storage container main body, and the FOUP main body opening is an example of a container opening. The door 20b can be disassembled / connected to the FOUP main body 20a and is mounted in an openable / closable state with respect to the FOUP main body opening when connected to the FOUP main body 20a. Further, a flange 20c is provided on the FOUP main body 20a. The flange 20c is a portion that is gripped (held) when the FOUP 20 is transported by an OHT (Overhead Hoist Transport) or a robot 3 or the like.

[0013] For example, on the external portion of the casing 1a of the load port 2, the FOUP 20 carried while being gripped by the flange 20c by the OHT is placed. For example, as shown in FIG. 1, the door 20b of the FOUP 20 faces the casing 1a when the FOUP 20 is placed. When the FOUP 20 is placed on the load port 2 in this manner, the shutter 2a provided at the opening 1b of the casing 1a rises. As a result, the FOUP 20 can be carried into the inside of the casing 1a from the opening 1b. That is, the FOUP 20 can be carried into the inside of the wafer storage container cleaning device 1. Then, the FOUP 20 is slid in the direction of arrow 2b by the slide device of the load port 2. As a result, the FOUP 20 is carried into the inside of the casing 1a. The slide by the slide device will be described. For example, a pin provided in the slide device is inserted into a hole provided in the bottom (placement surface) of the FOUP 20, whereby the placement surface of the FOUP 20 is fixed to the slide device. In this state, when the slide device is slid in the direction of arrow 2b, the FOUP 20 is also slid along with it. As a result, the FOUP 20 is placed on a predetermined portion inside the casing 1a of the load port 2. When the FOUP 20 is carried into the inside of the casing 1a in this manner, the shutter 2a descends and the opening 1b of the casing 1a is closed. The slide device descends together with the pin to a position lower than the lower end of the shutter 2a (the placement surface of the FOUP 20) and returns to the original position outside the casing 1a.

[0014] The robot 3 conveys the FOUP 20 to each part while gripping the flange 20c of the FOUP 20. The robot 3 includes a robot arm 3a and a robot hand 3b. The robot 3 conveys the FOUP 20 to each part by expanding and contracting or rotating the robot arm 3a while the robot hand 3b grips the flange 20c.

[0015] The disassembling / connecting stage 4 disassembles the FOUP 20 into the FOUP main body 20a and the door 20b, or connects the FOUP main body 20a and the door 20b. A latch key 4a is provided on the disassembling / connecting stage 4. By rotating the latch key 4a while it is inserted into the keyhole formed in the door 20b of the FOUP 20, the FOUP 20 is disassembled (separated) into the FOUP main body 20a and the door 20b, or the FOUP main body 20a and the door 20b are connected. For example, the FOUP 20 carried into the inside of the casing 1a is conveyed by the robot 3 to the disassembling / connecting stage 4. In this case, the disassembling / connecting stage 4 disassembles the FOUP 20 into the FOUP main body 20a and the door 20b. Note that disassembling can be rephrased as unlocking, and connecting can be rephrased as locking.

[0016] FIG. 2 is a schematic diagram of the door 20b according to the first embodiment, and shows an example of the configuration of the door 20b. FIGS. 3A and 3B are cross-sectional views taken along line A-A of FIG. 2. FIG. 3A shows the locked state, and FIG. 3B shows the unlocked state. As shown in FIGS. 2, 3A, and 3B, two keyholes 20e are formed at predetermined intervals on the outer surface 20d of the door 20b. That is, on the outer surface 20d, keyholes 20e are formed that can switch the locking / unlocking between the FOUP main body 20a and the door 20b by rotating while the latch key 4a is inserted. Further, a hole (protrusion hole) 20g through which a latch 20i described later can protrude is formed on the side surface 20f of the door 20b. No hole is formed in the surface (inner surface) 20m on the side opposite to the outer surface 20d of the door 20b. Therefore, there is no opening for communicating with the internal space of the door 20b on the inner surface 20m. Note that the positions where the two keyholes 20e are formed are defined by standards.

[0017] Also, inside the door 20b, a space (latch sliding space) 20k is formed where a latch mechanism 20j including a key cylinder 20h, a latch 20i, and a connecting portion 20t is provided. The latch sliding space 20k is an internal space of the door 20b. The latch sliding space 20k communicates with the keyhole 20e and the protruding hole 20g. The key cylinder 20h is provided at a position corresponding to the keyhole 20e. Specifically, the key cylinder 20h is provided in the latch sliding space 20k of the door 20b so that the latch key 4a can be inserted into the key cylinder 20h through the keyhole 20e.

[0018] When the latch key 4a inserted into the key cylinder 20h rotates in a predetermined direction, the key cylinder 20h rotates, and the connecting portion 20t connected to the key cylinder 20h pushes out the latch 20i, and the latch 20i protrudes from the protruding hole 20g of the latch mechanism 20j in the direction of the arrow 20l (see FIG. 3A). In this way, when the protruding latch 20i engages with the FOUP main body 20a, the FOUP main body 20a and the door 20b are connected and locked. A recess is provided at the end of the opening of the FOUP main body 20a, and the latch 20i protruding from the protruding hole 20g shown in FIG. 3A is inserted into the recess. In this way, the latch 20i is a member for connecting with the FOUP main body 20a. Also, with the FOUP main body 20a and the door 20b connected, when the latch key 4a inserted into the key cylinder 20h rotates in the opposite direction to the locked state and returns to its original position, the connecting portion 20t that pushed out the latch 20i also returns to its original position, and the latch 20i inserted into the recess retracts into the latch sliding space 20k of the door 20b (see FIG. 3B). Thereby, the FOUP main body 20a and the door 20b are disassembled and unlocked. That is, inside the door 20b, a latch mechanism 20j is provided that can switch the locking / unlocking between the FOUP main body 20a and the door 20b by rotating with the latch key 4a inserted through the keyhole 20e.

[0019] The cleaning tank 5 is a tank for cleaning the FOUP 20. FIG. 4 is a side perspective view schematically showing the configuration inside the cleaning tank 5 according to the first embodiment. For example, as shown in FIG. 4, the cleaning tank 5 includes a cleaning tank main body 50 and an opening / closing lid (lid portion) 5a. The cleaning tank main body 50 has an opening (cleaning tank opening) at the upper side and a processing space for placing the FOUP main body 20a. This processing space exists inside the cleaning tank opening and communicates with the cleaning tank opening. The FOUP main body 20a is carried into the processing space of the cleaning tank main body 50 from this cleaning tank opening. And in the processing space of the cleaning tank main body 50, a FOUP main body holding portion for holding the carried-in FOUP main body 20a is provided. In this way, by the FOUP main body holding portion holding the FOUP main body 20a, the FOUP main body 20a is stored in the processing space of the cleaning tank main body 50. Further, the opening / closing lid 5a is provided above the cleaning tank main body 50. Specifically, it is provided so as to be openable and closable with respect to the cleaning tank opening of the cleaning tank main body 50. The opening / closing lid 5a opens and closes with respect to the cleaning tank opening of the cleaning tank main body 50 when the air cylinder operates. Inside the opening / closing lid 5a, there is a door holding portion 5e (See Figure 7) for holding the door 20b. The configuration of the opening / closing lid 5a will be described later.

[0020] Also, inside the cleaning tank body 50, a cleaning liquid nozzle 52 for supplying a cleaning liquid (liquid) used when cleaning the FOUP body 20a and the door 20b is provided. Further, inside the cleaning tank body 50, a rotating part 53 for rotating the FOUP body 20a held by the FOUP body holding part is provided. Furthermore, on the opening / closing lid 5a of the cleaning tank body 50, a rotating part 5r (see Fig. 7) for rotating the door 20b held by the door holding part 5e is provided. By spraying the cleaning liquid from the cleaning liquid nozzle 52 onto the FOUP body 20a and the door 20b rotated by the rotating part 53 and the rotating part 5r, the FOUP 20 is cleaned. Specifically, with the door 20b held by the door holding part 5e and the opening / closing lid closed with respect to the cleaning tank opening of the cleaning tank body 50, the cleaning liquid nozzle 52 discharges the cleaning liquid onto the inner surface (inner face) 20m (see Figs. 2, 3A, and 3B) of the FOUP body 20a and the door 20b. The temperature of the discharged cleaning liquid is set, for example, to about 60 degrees to 90 degrees and is relatively high.

[0021] Also, inside the cleaning tank body 50, an air blow nozzle (not shown) for injecting gas is provided. After the cleaning process with the liquid, the gas from the air blow nozzle is injected onto the FOUP body 20a and the door 20b, thereby drying the FOUP body 20a and the door 20b. Note that even during the drying process with the gas from the air blow nozzle, the FOUP body 20a and the door 20b are rotated by the rotating part 53 and the rotating part 5r. Also, instead of injecting gas from the air blow nozzle, the liquid adhering to the FOUP body 20a and the door 20b may be dried by the rotation of the rotating parts 53 and 5r. The temperature of the gas injected from the air blow nozzle is set, for example, to about 90 degrees to 120 degrees.

[0022] In this embodiment, when the FOUP 20 is being cleaned in the cleaning tank 5, the robot 3 transports the FOUP main body 20a and the door 20b on the disassembly / connection stage 4 to the cleaning tank 5 separately. For example, the robot 3 transports the FOUP main body 20a from the cleaning tank opening of the cleaning tank main body 50 into the cleaning tank main body 50 with the opening of the FOUP main body 20a facing downward. Then, the FOUP main body holding part holds the FOUP main body 20a with the opening of the FOUP main body 20a facing downward. Also, the robot 3 transports the door 20b to the door holding part 5e so that the outer surface 20d of the door 20b is held by the door holding part 5e of the opening / closing lid. When the opening / closing lid is closed, the inner surface (inner face) (see FIGS. 2, 3A, and 3B) 20m of the door 20b faces downward. Then, the cleaning liquid nozzle 52 discharges liquid onto the inner surface 20m of the door 20b.

[0023] When the cleaning of the FOUP 20 in the cleaning tank 5 is completed, the robot 3 transports the FOUP main body 20a and the door 20b in the cleaning tank 5 to the vacuum tank 6 separately.

[0024] The vacuum tank 6 is a tank for vacuum-drying the FOUP 20. Inside the vacuum tank 6, there are a holding part for holding the FOUP main body 20a and the door 20b transported into the vacuum tank 6, a halogen lamp, and a turbo pump capable of evacuating the inside of the vacuum tank 6. The vacuum tank 6 vacuum-dries the FOUP main body 20a and the door 20b by heating them with the halogen lamp while evacuating the inside of the vacuum tank 6 with the turbo pump in a state where the FOUP main body 20a and the door 20b are held by the holding part.

[0025] When the vacuum drying of the FOUP 20 in the vacuum tank 6 is completed, the robot 3 transports the FOUP main body 20a and the door 20b in the vacuum tank 6 to the disassembly / connection stage 4 separately. Then, the disassembly / connection stage 4 connects the FOUP main body 20a and the door 20b.

[0026] The unloading port 7 unloads the cleaned and vacuum-dried FOUP 20 placed by the robot 3 inside the casing 1a of the unloading port 7 to the outside of the casing 1a.

[0027] For example, after vacuum drying, the FOUP 20 in which the FOUP main body 20a and the door 20b are connected at the disassembling / connecting stage 4 is conveyed and placed by the robot 3 in the inner part of the casing 1a of the unloading port 7. When the FOUP 20 is placed on the unloading port 7 in this way, the shutter 7a provided at the opening 1c of the casing 1a rises. As a result, the FOUP 20 can be unloaded from the opening 1c to the outside of the casing 1a. That is, the FOUP 20 can be unloaded to the outside of the wafer storage container cleaning device 1. Then, the FOUP 20 is slid in the direction of the arrow 7b by the slide device of the unloading port 7 (having the same mechanism as the slide device of the load port 2), so that the FOUP 20 is unloaded to the outside of the casing 1a. When the FOUP 20 is unloaded to the outside of the casing 1a in this way, the shutter 7a descends and the opening 1c of the casing 1a is closed.

[0028] The control unit 8 controls the operation of the entire wafer storage container cleaning device 1. For example, the control unit 8 operates the load port 2, the robot 3, the disassembling / connecting stage 4, the cleaning tank 5, the vacuum tank 6, and the unloading port 7 by controlling the load port 2, the robot 3, the disassembling / connecting stage 4, the cleaning tank 5, the vacuum tank 6, and the unloading port 7 as described above.

[0029] FIG. 5 is a diagram showing an example of the configuration of the control unit 8 according to the first embodiment. As shown in FIG. 5, the control unit 8 includes a CPU (Central Processing Unit) 8a, a ROM (Read Only Memory) 8b, a RAM (Random Access Memory) 8c, an HDD (Hard Disk Drive) 8d, and a communication interface 8e. These are connected via an internal bus.

[0030] While using the storage area of the RAM 8c as a temporary storage area for data used in various processes, the CPU 8a executes various processes. The processes executed by the CPU 8a will be described later. The ROM 8b and the HDD 8d store programs for executing various processes, various databases used when executing various processes, various tables, and the like.

[0031] The communication interface 8e is an interface for communicating with the above-described respective parts of the wafer storage container cleaning apparatus 1 and for communicating with an external apparatus connected to the wafer storage container cleaning apparatus 1 via a network. For example, the communication interface 8e is a network interface card.

[0032] Next, the configuration of the opening / closing lid of the cleaning tank 5 will be described. FIGS. 6 and 7 are diagrams showing an example of the configuration of the opening / closing lid 5a according to the first embodiment. FIG. 6 shows a state in which the door 20b is held by a door holding portion 5e provided in the opening / closing lid 5a. As shown in FIG. 6, a cover 5b that covers the outside of the door 20b is attached to the door holding portion 5e. The cover 5b is rotatably provided together with the door holding portion 5e by a rotating portion 5r. A gap is formed between the cover 5b and the opening / closing lid 5a and the wall surface of the cleaning tank main body 50 located outside the cover 5b during rotation so as not to interfere with each other. The cover 5b is a hollow cylindrical member. An opening 5c is formed in the cover 5b so as to partially cut out the bottom surface on the front side of the paper surface in FIG. 6, and the inner surface 20m, which is the surface to be cleaned of the door 20b, is held in a state of being exposed in the opening 5c. Therefore, the opening 5c is formed to conform to the shape of the door 20b, and a notch 5d is formed to secure a space necessary when the door 20b is gripped by the robot 3. Note that the lower end of the cover 5b (the end on the cleaning tank main body 50 side when the opening / closing lid 5a is closed) protrudes downward more than the lower end of the opening / closing lid 5a (the end on the cleaning tank main body 50 side when the opening / closing lid 5a is closed). Thereby, it is possible to prevent the cleaning liquid adhering to the opening / closing lid 5a from flowing according to gravity and adhering to the door 20b when the opening / closing lid 5a is opened.

[0033] FIG. 7 is a view showing the cover 5b and the door holding portion 5e as seen from the side of the opening / closing lid 5a, with the opening / closing lid 5a omitted. Note that in FIG. 7, a state where the door 20b is not held by the door holding portion 5e is shown. The door holding portion 5e is provided on the inner surface 5f (see FIG. 6) of the opening / closing lid 5a. As shown in FIG. 7, the door holding portion 5e includes two suction pads 5g for vacuum-sucking the door 20b. By vacuum-sucking the outer surface 20d of the door 20b with these suction pads 5g, the door 20b is held by the door holding portion 5e.

[0034] Further, the door holding portion 5e includes four pads 5h, 5i, 5j, 5k. Among these, two pads 5i, 5j are formed with positioning pins. By engaging the positioning pins with the positioning holes formed in the outer surface 20d of the door 20b, the door 20b is positioned with respect to the door holding portion 5e. The aforementioned suction pads 5g are also the same as these four pads 5h, 5i, 5j, 5k, and are only different in that they have suction holes to which suction force is applied by a suction source (not shown).

[0035] Also, as shown in FIG. 7, a plurality of holes (purge holes) 5l are formed in a circumferential shape in the cover 5b. A gas (e.g., N2, etc.) is supplied from a gas nozzle 5n (see FIG. 8) through the plurality of holes 5l.

[0036] Also, a dispersion plate 5m is provided at a position facing the door holding portion 5e of the opening / closing lid 5a. The dispersion plate 5m is, for example, a plate-like member bent in an L shape. When the gas supplied from the gas nozzle 5n hits the dispersion plate 5m, the flow direction of the gas is dispersed by the dispersion plate 5m.

[0037] Next, the operation during the cleaning of the FOUP 20 in the wafer storage container cleaning apparatus 1 according to the first embodiment will be described. FIG. 8 is a diagram for explaining an example of the operation during the cleaning (during the cleaning process) of the FOUP 20 in the wafer storage container cleaning apparatus 1 according to the first embodiment. Note that FIG. 8 is a schematic diagram of the opening / closing lid 5a, the door holding portion 5e, the cover 5b, the gas nozzle 5n, the door 20b, and the like.

[0038] As shown in FIG. 8, the gas nozzle 5n is provided in the opening / closing lid 5a, and the space between the gas nozzle 5n and the opening / closing lid 5a is sealed with a packing or the like. Then, while the cleaning tank 5 is cleaning each of the FOUP main body 20a and the door 20b with the opening / closing lid 5a closed, the gas nozzle 5n supplies gas to the hole 5l. As a result, the gas supplied by the gas nozzle 5n flows in the direction of the dashed arrow 5p.

[0039] That is, the gas nozzle 5n supplies gas to a slight space 20n formed between the door holding portion 5e and the outer surface 20d of the door 20b. The gas from the gas nozzle 5n is also supplied to a gap 20p communicating with the space 20n. This gap 20p is a gap between the side surface 20f of the door 20b and the surface (opposing surface) 5x of the inner wall surface of the cover 5b that faces the side surface 20f. Further, the gap 20p also communicates with the processing space of the cleaning tank main body 50. The space 20n and the gap 20p are each an example of a gas supply space. 、 side surface 20f that faces the side surface 20f. Further, the gap 20p also communicates with the processing space of the cleaning tank main body 50. The space 20n and the gap 20p are each an example of a gas supply space.

[0040] As a result, the space 20n and the gap 20p are maintained at a positive pressure by the gas supplied by the gas nozzle 5n. Also, a gas flow in the direction toward the cleaning tank body 50 is formed in the gap 20p around the protruding hole 20g of the door 20b. Therefore, according to the wafer storage container cleaning apparatus 1 according to the first embodiment, it is possible to suppress the cleaning liquid from adhering to the side surface 20f and the outer surface 20d of the door 20b, and it is possible to suppress the cleaning liquid from entering the latch sliding space 20k of the door 20b. That is, the flow of the gas from the gas nozzle 5n can inhibit the cleaning liquid from the cleaning liquid nozzle 52 from entering through the protruding hole 20g. Further, by having the cover 5b, the space 20n and the gap 20p, which are gas supply spaces, can be created (the space to which the gas should be supplied can be made as narrow as possible), and thereby the intrusion of the cleaning liquid from the protruding hole 20g can be inhibited efficiently. It is desirable that the lower end of the cover 5b (the end on the cleaning tank body 50 side when the opening / closing lid 5a is closed) has an extended portion extending toward the inside of the cleaning tank 5 as shown in FIG. 8. Thereby, since the location where the gas from the gas nozzle 5n is discharged from the gap 20p can be narrowed, the flow velocity of the gas can be increased, and a positive pressure state can be maintained more preferably above the lower end of the cover 5b.

[0041] As described above, since the door 20b performs the cleaning process while being rotated by the rotating portion 5r, the gas from the gas nozzle 5n is supplied only to a specific location, and there is no unevenness in the cleaning process. Further, due to the rotation of the door 20b, the gas from the gas nozzle 5n is supplied to the entire space 20n and the gap 20p, so that it is possible to prevent the cleaning liquid from adhering to the side surface 20f and the outer surface 20d of the door 20b.

[0042] In the first embodiment, after the cleaning tank 5 cleans the FOUP 20, the vacuum tank 6 performs vacuum drying on the FOUP 20. Here, if, after the cleaning in the cleaning tank 5, cleaning liquid adheres to the side surface 20f and the outer surface 20d of the door 20b, or if the cleaning liquid enters the latch sliding space 20k, the time required to reduce the pressure to the target pressure in the vacuum tank 6 will become longer due to the presence of this cleaning liquid. However, according to the wafer storage container cleaning apparatus 1 according to the first embodiment, it is possible to suppress the adhesion of the cleaning liquid to the side surface 20f and the outer surface 20d of the door 20b, and to suppress the entry of the cleaning liquid into the latch sliding space 20k of the door 20b, so that it is possible to suppress the increase in the time required to reduce the pressure to the target pressure in the vacuum tank 6.

[0043] Further, by providing the dispersion plate 5m on the opening / closing lid 5a, the gas can more easily spread throughout the spaces of the space 20n and the gap 20p, and the positive pressure state can be maintained more preferably.

[0044] (Second Embodiment) Next, the wafer storage container cleaning apparatus 1 according to the second embodiment will be described. In the second embodiment, the point that the gas nozzle 5n supplies gas inside the door 20b is different from the wafer storage container cleaning apparatus 1 according to the first embodiment.

[0045] FIG. 9 is a diagram showing a state in which the door holding portion 5e of the wafer storage container cleaning apparatus 1 according to the second embodiment holds the door 20b, with the cover 5b, the opening / closing lid 5a, etc. omitted.

[0046] In the first embodiment, a keyhole 20e is formed at the position of the outer surface 20d of the door 20b facing each of the two pads 5h and 5k provided in the door holding portion 5e shown in FIG. 7. In the second embodiment, the two pads 5h and 5k are removed from the door holding portion 5e, and thus, as shown in FIG. 9, a gas nozzle 5n is inserted into each of the two holes exposed in the door holding portion 5e. The gas nozzle 5n is connected to a gas supply pipe that supplies gas from a gas supply source provided outside the opening / closing lid 5a. One end of this gas supply pipe is connected to the gas nozzle 5n, and the other end is connected to an external gas supply source via a rotary joint.

[0047] FIG. 10 is a cross-sectional view taken along line B-B of FIG. 9 in the second embodiment, in a state where the two pads 5h and 5k are removed from the door holding portion 5e and the gas nozzles 5n are inserted into the two holes exposed in the door holding portion 5e. FIG. 10 is a schematic view of the door holding portion 5e, the gas nozzle 5n, the door 20b, etc.

[0048] As shown in FIG. 10, the gas nozzle 5n is provided at a position facing the keyhole 20e and supplies gas to the keyhole 20e. Thus, the gas supplied by the gas nozzle 5n flows in the direction of the dashed arrow 5s.

[0049] That is, the gas supplied to the keyhole 20e is supplied from the protruding hole 20g to the gap 20p (see FIG. 8) via the latch sliding space 20k. As a result, the wafer storage container cleaning device 1 according to the second embodiment can obtain the same effects as the wafer storage container cleaning device 1 according to the first embodiment. Further, since gas is directly supplied to the latch sliding space 20k, it is possible to further suppress the entry of the cleaning liquid into the latch sliding space 20k compared to the first embodiment. Also, during the cleaning of the FOUP 20, since the door 20b is rotating, the gas supplied to the keyhole 20e is supplied from the protruding hole 20g to the space between the cover 5b and the door 20b. Thereby, the gas supplied by the gas nozzle 5n forms a swirling flow, making it difficult for the cleaning liquid to enter the region above the inner surface 20m of the door 20b.

[0050] In addition, in the present embodiment, it has been exemplified that gas is supplied from the gas nozzle 5n to the keyhole 20e. Similarly, in the first embodiment, a gas nozzle 5n may be further provided for the keyhole 20e to more reliably prevent the cleaning liquid from entering the protruding hole 20g of the door 20b and the outer surface 20d side of the door 20b.

[0051] (Modification of the Second Embodiment) Next, the wafer storage container cleaning apparatus 1 according to a modification of the second embodiment will be Using Figure 11 described. In the modification of the second embodiment, the point that the gas nozzle 5n supplies gas to the inside of the door 20b by supplying gas to the through hole 5n2 formed in the latch key 5n1 is different from the wafer storage container cleaning apparatus 1 according to the second embodiment. The latch key 5n1 is a latch key having the same structure as the latch key 4a provided in the disassembling / connecting stage 4. In this modification, the latch key 5n1 is held by the door holding portion 5e in a state where it is inserted into the key cylinder 20h of the door 20b. The latch key 5n1 may be attached to the door holding portion 5e in advance, or may be attached when being transported to the cleaning tank 5. When it is attached to the door holding portion 5e in advance, the door 20b may be held by the door holding portion 5e by the latch key 5n1 instead of the suction pad 5g.

[0052] FIG. 11 is a cross-sectional view taken along line B-B of FIG. 9 in a state where two pads 5h and 5k are removed from the door holding portion 5e and the gas nozzles 5n are inserted into the two exposed holes in the door holding portion 5e in a modification of the second embodiment. However, FIG. 11 is a schematic view of the door holding portion 5e, the gas nozzle 5n, the door 20b, etc., similar to FIG. 10.

[0053] As shown in FIG. 11, in a modification of the second embodiment, the door 20b is washed with the latch key 5n1 inserted into the key cylinder 20h. A through hole 5n2 is formed in the latch key 5n1. Also, a through hole 20s (latch mechanism hole) is formed in the key cylinder 20h. The through hole 20s communicates with the latch sliding space 20k. Also, with the latch key 5n1 inserted into the key cylinder 20h, as shown in FIG. 11, the through hole 20s communicates with the through hole 5n2. The gas nozzle 5n is provided at a position facing the through hole 5n2 of the latch key 5n1 and supplies gas to the through hole 5n2. Thereby, the gas supplied by the gas nozzle 5n flows in the direction of the dashed arrow 5t.

[0054] That is, the gas supplied to the through hole 5n2 formed in the latch key 5n1 is supplied from the protruding hole 20g to the gap 20p (see FIG. 8) via the through hole 20s and the latch sliding space 20k of the key cylinder 20h. Also, during the cleaning of the FOUP 20, since the door 20b is rotating, as in the second embodiment, the gas supplied to the key hole 20e becomes a swirling flow. As a result, the wafer storage container cleaning device 1 according to the modification of the second embodiment can obtain the same effects as the wafer storage container cleaning device 1 according to the second embodiment. Furthermore, since gas is directly supplied to the latch sliding space 20k, it is possible to more effectively suppress the entry of the cleaning liquid into the latch sliding space 20k compared to the first embodiment.

[0055] (Other Modifications) In the various embodiments or modifications described above, the case where the gas nozzle 5n supplies gas during the cleaning of the FOUP 20 has been described. However, in the various embodiments or modifications described above, the gas nozzle 5n may supply gas not only during cleaning but also during the operation of removing the door 20b from the door holding portion 5e of the cleaning tank 5 after the cleaning is completed.

[0056] When the opening / closing lid 5a of the cleaning tank 5 is opened at a location where the inside of the cleaning tank 5 is at a relatively high temperature because a relatively high-temperature cleaning liquid is used, the temperature inside the cleaning tank 5 drops. As a result, the mist-like cleaning liquid liquefies, and it becomes easier for the liquefied cleaning liquid to flow into the protruding hole 20g formed on the side surface 20f of the door 20b and the outer surface 20d of the door 20b.

[0057] When performing the operation of removing the door 20b (at least when opening the opening / closing lid 5a), by supplying gas from the gas nozzle 5n, it is possible to suppress the liquefied cleaning liquid from flowing into the protruding hole 20g and the outer surface 20d of the door 20b. Also, it is possible to prevent the mist-like cleaning liquid from entering from the protruding hole 20g itself. Furthermore, by supplying gas from the gas nozzle 5n, gas is also blown onto the cover 5b, so even when the cleaning liquid adheres to the cover 5b after the cleaning process, it is possible to prevent the cleaning liquid from adhering to the protruding hole 20g and the outer surface 20d of the door 20b.

[0058] Also, during the period from the cleaning of the FOUP 20 until the operation of opening the opening / closing lid 5a and removing the door 20b is performed, the gas nozzle 5n may continuously supply gas.

[0059] In addition, in the above-described various embodiments or modifications, it is exemplified that the FOUP main body 20a and the door 20b are cleaned and dried in the same cleaning tank, but it is not limited thereto, and they may be cleaned at different timings. A dedicated cleaning tank for the door 20b may be provided.

[0060] In addition, in the above-described various embodiments or modifications, the cleaning tank 5 having the cleaning liquid nozzle 52 and the air blow nozzle is exemplified, but it is not limited thereto, and the supply source of the same nozzle may be switched to supply the cleaning liquid and gas.

[0061] In addition, in each of the above-described various embodiments or modified examples, although it has been exemplified that the cover 5b is provided with a plurality of holes 5l, the present invention is not limited to this. As long as the door holding portion 5e and the cover 5b are connected, and the gas from the gas nozzle 5n passes from the upper side to the lower side of the cover 5b, and the gas reaches the space 20n and the gap 20p. For example, the connecting portion of the cover 5b with the door holding portion 5e does not have to be a surface provided over the entire outer peripheral surface of the door holding portion 5e, and a part of the cover 5b may be connected only to the four corners of the door holding portion 5e. In this case, the surface of the cover 5b on the opening / closing lid 5a side has a shape in which four beams are provided. The number of connecting portions does not have to be four, and it is sufficient that the door holding portion 5e and the cover 5b are connected, and it may be two or three portions.

Explanation of Reference Numerals

[0062] 1 Wafer storage container cleaning device 5 Cleaning tank 5a Opening / closing lid 5n Gas nozzle

Claims

1. A wafer storage container washing device for washing a door of a wafer storage container, the door having a keyhole that can be rotated with a latch key inserted therein to switch between locking / unlocking with the wafer storage container main body, and a protruding hole formed on a side surface through which a latch can protrude when locked. The device comprises: a door holding part for holding the door; a cleaning liquid nozzle for supplying a cleaning liquid to the other side of the door; a gas nozzle for generating a gas flow that inhibits the intrusion of the cleaning liquid from the protruding hole, at least when the cleaning liquid is being supplied from the cleaning liquid nozzle to the door; an opening / closing lid provided so as to be openable and closable with respect to a cleaning tank opening, and having the door holding part; a cleaning tank main body in which a processing space is formed when the cleaning tank opening is closed by the opening / closing lid; comprising; The gas nozzle is characterized in that, with the door held by the door holding part, the gas is supplied from one side of the door to a gas supply space formed between the opening / closing lid including the side surface and the door.

2. The wafer storage container washing device according to claim 1, wherein the wafer storage container main body is placed in the processing space of the cleaning tank main body.

3. The door holding part is provided with a cover that covers the door, The gas nozzle supplies gas to a gas supply space communicating with a gap between the side surface and an opposing surface of the inner wall surface of the cover that faces the side surface. The wafer storage container washing device according to claim 2.

4. The gas nozzle supplies the gas to the keyhole. The wafer storage container washing device according to any one of claims 1 to 3.

5. The latch key and the keyhole have through holes, With the latch key inserted into the door, the gas is supplied from the gas nozzle to the through hole. The wafer storage container washing device according to any one of claims 1 to 3.

6. The gas nozzle further supplies the gas when the opening / closing lid is opened after the cleaning process of the wafer storage container. The wafer storage container washing device according to claim 2 or 3.

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