Electronic component mounting apparatus and electronic component mounting method

Abstract

To provide a mounting device for an electronic component capable of performing positioning at a mounting position while picking up the electronic component with no contact, and a mounting method for the electronic component.SOLUTION: A mounting device 1 comprises: a mounting head 31 which mounts a sucked and held electronic component C on a substrate S; a pickup collet 700 which includes a porous member for holding the electronic component C with no contact, picks up the electronic component C from a supply unit 6 and delivers it to the mounting head 31; a moving device 7 which relatively moves the mounting head 31 and the pickup collet 700; and a control device 8 which causes the moving device 7 to bring the mounting head 31 and the pickup collet 700 close to each other at a predetermined interval, and causes the mounting head 31 to perform the suction in a non-contact holding state with the electronic component C by gas ejection from the porous member and a negative pressure of a suction hole provided in the porous member, after the lapse of a predetermined time, cancels the suction of the pickup collet 700, and causes the mounting head 31 to suck in and hold the electronic component C.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic component mounting apparatus and an electronic component mounting method.

Background Art

[0002] When mounting an electronic component, which is a semiconductor element such as a logic, memory, or image sensor, on a substrate, a wafer on which the semiconductor element is formed is diced into individual chips. Then, these chips are picked up one by one, transferred to the substrate, and mounted.

[0003] One surface of the chip, which is the surface, is a functional surface on which fine circuits are formed. When picking up this chip from the wafer, if the member for picking up directly contacts the functional surface, there is a risk of damaging the circuit or the like, so there is a requirement to avoid contact.

[0004] As a non-contact adsorption technique, a typical one is a Bernoulli chuck, but the adsorption force is very small despite requiring a large air flow rate. Therefore, when picking up a chip from a state where it is held by a UV tape, an adsorption holding force sufficient to peel the chip from the UV tape cannot be obtained.

[0005] Also, the connection terminals on the surface of the chip and the connection terminals on the substrate are opposed and joined. At this time, in order to ensure and improve the joinability between the connection terminals, surface treatment such as plasma treatment or surface activation treatment may be performed on the surface of the chip. In order to maintain the surface state of the chip subjected to such treatment, there is a requirement to avoid the member for picking up from directly contacting the surface of the chip.

[0006] Conventionally, in order to meet the requirement of not contacting the member with the surface of the chip, in a collet which is a member for picking up the chip, the surface for holding the chip is a tapered surface, and only the peripheral portion rather than the surface of the chip is in contact with the tapered surface of the collet, and the chip is sucked and held from the center of the chip (see Patent Document 1).

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] However, in the prior art as described above, the collet contacts only the peripheral portion of the chip and sucks from the center of the chip. For this reason, the chip is likely to be distorted, and there is a possibility that the chip may be chipped or cracked. In addition, since the collet contacts the edge portion around the chip and supports the chip sucked at the contact portion, stress concentrates on the peripheral portion, and chipping and cracking are likely to occur. Furthermore, since the holding position of the chip is fixed in the sucked and held state, if there is a deviation or inclination when the chip is sucked and held, it cannot be corrected later when it is delivered to the mounting device.

[0009] An embodiment of the present invention is proposed to solve the above - described problems, and an object thereof is to provide a mounting device for electronic components and a mounting method for electronic components that can position the electronic components at the mounting position while picking up the electronic components in a non - contact manner.

Means for Solving the Problems

[0010] The electronic component mounting apparatus according to an embodiment of the present invention includes a mounting head that mounts an electronic component held by suction by a negative pressure in a suction hole on a substrate, a porous member that ejects gas from pores and holds the electronic component in a non-contact manner by the negative pressure in the suction hole, a pickup collet that picks up the electronic component from a supply unit that supplies the electronic component and delivers it to the mounting head, and a moving device that relatively moves the mounting head and the pickup collet. the pickup collet is A control device that, while the gas is ejected from the porous member and the electronic component is held in a non-contact manner by the negative pressure in the suction hole, causes the mounting head and the pickup collet to approach each other to a predetermined distance by the moving device and causes the mounting head to perform suction, and after a predetermined time has elapsed at the predetermined distance, releases the suction of the pickup collet and causes the mounting head to suction-hold the electronic component.

[0011] In the electronic component mounting method according to an embodiment of the present invention, a pickup collet having a porous member that ejects gas from pores and holds an electronic component in a non-contact manner by a negative pressure in a suction hole holds and picks up the electronic component from a supply unit of the electronic component in a non-contact manner, a moving device approaches a mounting head that mounts the electronic component on a substrate and the pickup collet that has picked up and inverted the electronic component to a predetermined distance, starts suction by a negative pressure in a suction hole provided in the mounting head, and after a predetermined time has elapsed at the predetermined distance, releases the suction of the pickup collet, whereby the mounting head suction-holds the electronic component.

Advantages of the Invention

[0012] Embodiments of the present invention can provide an electronic component mounting apparatus and an electronic component mounting method capable of positioning an electronic component at a mounting position while picking up the electronic component in a non-contact manner.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Embodiments for Carrying Out the Invention

[0014] 1. First Embodiment Hereinafter, the first embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, this embodiment is a mounting apparatus 1 for mounting an electronic component C on a substrate S. FIG. 1 is a front view showing the schematic configuration of the mounting apparatus 1. FIG. 2 is a plan view showing the electronic component C and the substrate S. Note that the drawings are schematic, and the size (hereinafter also referred to as dimensions), shape, ratio of the sizes of each part to each other, etc. may be different from the actual ones.

[0015] [Electronic Component] First, examples of the electronic component C to be mounted in this embodiment include semiconductor elements such as ICs and LSIs. In this embodiment, as shown in FIG. 2, a rectangular parallelepiped semiconductor chip is used as the semiconductor element. The semiconductor chip is a bare chip obtained by singulating a semiconductor wafer by dicing it into a mesh shape. The bare chip has a functional surface that functions as a semiconductor element on one of the front and back surfaces. Bumps or bump-less electrodes are provided on the surface on the functional surface side, and it is mounted by flip-chip connection to an electrode pad on the substrate S.

[0016] The electronic component C is provided with a plurality of marks m for positioning. In the present embodiment, two marks m are provided, one at each of a pair of corner portions that are diagonal to each other of the rectangular electronic component C. The mark m is provided on the surface where the electrodes of the electronic component C are formed, that is, on the face. The present embodiment is an example of an apparatus for face-down mounting in which the face side is mounted facing the substrate S.

[0017] [Substrate] In the present embodiment, the substrate S on which the electronic component C as described above is mounted is, as shown in FIG. 2, a plate-like member such as a resin member on which printed wiring or the like is formed, or a silicon substrate on which a circuit pattern is formed. The substrate S is provided with a mounting region B that is a region where the substrate S is to be mounted, and a plurality of marks M for positioning are provided outside the mounting region B. In the present embodiment, two marks M are provided at positions outside the mounting region B and corresponding to the mark m of the electronic component C.

[0018] [Mounting apparatus] The mounting apparatus 1 of the present embodiment is a mounting apparatus 1 capable of realizing mounting with high precision, for example, a mounting accuracy of ±0.2 μm or less. As shown in FIGS. 1 and 3, it includes a substrate support mechanism 2, a mounting mechanism 3, a first imaging unit 4, a second imaging unit 5, a supply unit 6, a moving device 7, and a control device 8. FIG. 3(A) is a plan view of the mounting apparatus 1, and FIG. 3(B) is a plan view showing the mark M seen through the mounting head 31 described later.

[0019] In the following description, the direction in which the mounting mechanism 3 moves to mount the electronic component C on the substrate S is defined as the Z-axis, and two axes orthogonal to each other in a plane orthogonal to this are defined as the X-axis and the Y-axis. In the present embodiment, the Z-axis is vertical, the direction following gravity is downward, the direction against gravity is upward, and the position on the Z-axis is called the height. Also, the X-axis and the Y-axis are on a horizontal plane. When viewed from the front side of FIG. 1, the X-axis is in the left-right direction and the Y-axis is in the depth direction. However, the present invention is not limited to this installation direction. Regardless of the installation direction, with reference to the substrate S or the substrate support mechanism 2, the side on which the electronic component C is mounted is called the upper side, and the opposite side is called the lower side.

[0020] The substrate support mechanism 2 is a mechanism that supports the substrate S on which the electronic component C is mounted, i.e., a so-called substrate stage. The mounting mechanism 3 is a mechanism that mounts the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31. The mounting head 31 has a transmissive portion that allows the mark M on the substrate S facing the electronic component C to be recognized through it while holding the electronic component C.

[0021] The first imaging unit 4 is disposed below the substrate support mechanism 2 at the mounting position OA where the mounting head 31 mounts the electronic component C on the substrate S. With the substrate S retracted from the mounting position OA by the substrate support mechanism 2, the mark m of the electronic component C held by the mounting head 31 is imaged from a position facing the electronic component C, i.e., from below. The mounting position OA is the position where the electronic component C is mounted on the substrate S, and in the figure, it is indicated by a one-dot chain line in the direction along the Z-axis passing through a point (e.g., the center point) on the XY coordinates within the region of the electronic component C to be mounted. The mounting position OA coincides with the optical axes of the cameras of the first imaging unit 4 and the second imaging unit 5, as will be described later. The second imaging unit 5 is disposed above the mounting head 31 at the mounting position OA, and images the mark M on the substrate S through the transmissive portion of the mounting head 31 (hereinafter, this is referred to as "imaging through the mounting head 31"). Based on the images captured in this way, detection of the marks m and M, i.e., recognition of the marks m and M, becomes possible.

[0022] Note that the substrate support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from the images of the marks m and M captured by the first imaging unit 4 and the second imaging unit 5. Each part of the mounting apparatus 1 as described above is mounted on a support base 11 installed on the installation surface. The top surface of the support base 11 is a horizontal plane.

[0023] The supply unit 6 supplies the electronic component C. The transfer device 7 transfers the electronic component C from the supply unit 6 to the mounting position OA. The transfer device 7 includes a transfer head 71 and a transfer mechanism 73. The transfer head 71 non-contact picks up the electronic component C from the supply unit 6, inverts it, and delivers it to the mounting head 31. The transfer mechanism 73 moves the transfer head 71 into the space created by the substrate support mechanism 2 retracting the substrate S from the mounting position OA and positions it at the mounting position OA.

[0024] The control device 8 controls the operation of the mounting device 1. This control device 8 is constituted by, for example, an electronic circuit or a computer operating according to a predetermined program. That is, in the control device 8, a processing device such as a PLC or a CPU reads a program, data, etc. from a storage device and executes the control of the mounting device 1. Hereinafter, each part will be described in detail.

[0025] (Substrate Support Mechanism) As shown in FIGS. 1 and 3(A), the substrate support mechanism 2 is arranged on the support base 11 and has a stage 21 and a drive mechanism 22. The stage 21 is a plate-shaped member on which the substrate S is placed. The drive mechanism 22 has, for example, a guide rail 22a in the X-axis direction and a guide rail 22b in the Y-axis direction, and is a two-axis movement mechanism that moves the stage 21 in the horizontal plane by a belt or a ball screw using a motor (not shown) as a drive source. This drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. Although not shown, the drive mechanism 22 is provided with a θ drive mechanism for rotating and moving the stage 21 in the horizontal plane.

[0026] The drive mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along the guide rail 22b. A through hole 23a is formed in this moving plate 23 so that the first imaging unit 4 can image the electronic component C.

[0027] Although not shown in the drawings, a loader / unloader for supplying / storing the substrate S to / from the stage 21 is provided at one of the moving ends of the stage 21 of the substrate support mechanism 2 in the X-axis direction (specifically, the moving end on the right side in the drawing). Therefore, the substrate support mechanism 2 receives the supply of the substrate S from the loader or delivers the substrate S to the unloader with the stage 21 moved to the above-mentioned moving end.

[0028] (Mounting mechanism) The mounting mechanism 3 includes a mounting head 31 and a drive mechanism 32. The mounting head 31 is generally in the shape of a rectangular parallelepiped and has a hollow portion 31a and a holding portion 31b as a transmission portion. The hollow portion 31a is a cylindrical through-hole formed with the Z-axis direction as the axis. The holding portion 31b is a plate-like member capable of transmitting light for imaging, and is attached so as to close the opening on the side of the substrate S in the hollow portion 31a. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool and holds the electronic component C.

[0029] As shown in FIG. 3(B), a suction area D for sucking and holding the electronic component C is provided at the center of the holding portion 31b. This suction area D is the holding position of the electronic component C by the holding portion 31b. A suction hole 31c is formed in the suction area D. That is, a suction hole 31c communicating with the suction path formed in the holding portion 31b is formed at the center of the holding portion 31b. The center mentioned here is an area having a certain width including the center of the suction area D. The internal suction path of the holding portion 31b is a flow path for communicating the suction hole 31c with a negative pressure source, and is provided so that the electronic component C can be sucked and held by generating a negative pressure in the suction hole 31c.

[0030] The adsorption area D of the holding part 31b and its surroundings are a transmissive area T through which the electronic component C held by the pickup collet 700 can be imaged. Also, even when the adsorption area D adsorbs and holds the electronic component C, the transmissive area T around the adsorption area D enables imaging through the mark M on the substrate S. That is, the mounting head 31 has a transparent portion so that the second imaging unit 5 can image the mark M on the substrate S. Note that the holding surface (adsorption surface) that holds the electronic component C of the holding part 31b is referred to as the lower end surface.

[0031] The drive mechanism 32 includes moving bodies 33, 34, 35 and is a mechanism for driving the mounting head 31. The moving body 33 is provided so as to be movable along a Y-axis direction guide rail 33a provided on the support base 11. The moving body 34 is provided so as to be movable along an X-axis direction guide rail 34a provided on the top surface of the moving body 33. The moving body 35 is provided so as to be movable along a Z-axis direction guide rail 35a provided on the front surface of the moving body 34. The moving body 35 is formed in a substantially concave shape in plan view. These moving bodies 33, 34, 35 are driven by a ball screw, a linear motor, a cylinder, or the like having a motor as a drive source.

[0032] The mounting head 31 is provided below the moving body 35 that moves in the Z-axis direction. Therefore, the moving body 35 performs an operation for mounting the electronic component C held by the holding part 31b of the mounting head 31 on the substrate S. Also, the moving body 35 on which the mounting head 31 is provided moves in the X-axis direction and the Y-axis direction due to the movement of the moving bodies 33, 34. Therefore, the drive mechanism 32 functions as a positioning mechanism for positioning the electronic component C held by the mounting head 31. Note that although not shown in the figure, the drive mechanism 32 includes a θ drive mechanism for rotationally moving the mounting head 31 within a horizontal plane.

[0033] In the present embodiment, it is preferable to set the moving amounts in the X-axis direction, Y-axis direction, and Z-axis direction by the drive mechanism 32 to be as short as possible from the viewpoint of preventing movement errors. For example, the moving amounts in the X-axis direction and Y-axis direction by the moving bodies 33 and 34 are set to several millimeters to a dozen or so millimeters, respectively. Also, the moving amount in the Z-axis direction by the moving body 35 is set to about several millimeters to a dozen or so millimeters. That is, the mounting head 31 is at a height position where the lower end surface of the holding portion 31b has an opposing interval (separation distance in the vertical direction) of several millimeters, for example, 1 to 2 millimeters, with respect to the upper surface of the substrate S placed on the stage 21, and the receiving of the electronic component C and the imaging of the mark m of the received electronic component C are performed. Therefore, regarding the moving amount in the Z-axis direction of the moving body 35, at least a moving amount that can ensure that the electronic component C held by the holding portion 31b can be pressed against the substrate S with a predetermined pressing force for mounting should be secured from this height position.

[0034] (First imaging unit) The first imaging unit 4 includes a camera, a lens, a lens barrel, a light source, etc., and is fixed in a housing hole 11a provided in the support base 11. The optical axis of the camera of the first imaging unit 4 is arranged in a direction capable of imaging the mark m of the electronic component C held by the mounting head 31. Specifically, it is arranged such that the optical axis is in the vertical direction. The first imaging unit 4 is stationary with respect to the mounting position OA of the electronic component C. In the present embodiment, the first imaging unit 4 is arranged upward in the housing hole 11a of the support base 11, which is a position below the substrate support mechanism 2, with the optical axis of the camera aligned with the mounting position OA. The first imaging unit 4 is fixed to the support base 11 such that when the pickup collet 700 faces the mounting head 31 to pass the electronic component C, the electronic component C is within the imaging field of view. Also, the magnification of the imaging of the first imaging unit 4 is provided such that the accuracy of imaging and recognizing the position of the mark m of the electronic component C held by the mounting head 31 reaches the required accuracy. Of course, it has a field of view range capable of imaging the mark m. Also, this field of view range is set in consideration of the variation in the position where the electronic component C is held by the mounting head 31, that is, the holding position accuracy. Furthermore, when imaging a plurality of marks m to recognize the position of the electronic component C held by the mounting head 31, the field of view range can be set such that the plurality of marks m can be imaged simultaneously. Such magnification and field of view range are appropriately determined based on the required positioning accuracy.

[0035] Here, "stationary" means that the first imaging unit 4 (similarly for the second imaging unit 5 described later) does not move when imaging the marks m, M. For example, if the imaging units 4, 5 are equipped with driving devices in the X, Y-axis directions (horizontal direction) and the Z-axis direction (vertical direction), and the horizontal and vertical positions of the imaging units 4, 5 are adjusted as preparation work for the operation of the device by these driving devices and do not move during the subsequent operation of the device, such a configuration is included in "stationary".

[0036] (The second imaging unit) The second imaging unit 5 includes a camera, a lens, a lens barrel, a light source, etc., and is supported and fixed by a frame (not shown) or the like above the support base 11, more specifically, above the mounting head 31. The optical axis of the camera of the second imaging unit 5 is arranged in a direction capable of imaging the mark M around the mounting region B of the substrate S through the holding portion 31b of the mounting head 31. That is, in the present embodiment, the second imaging unit 5 is arranged downward at a position directly above the mounting head 31 with the optical axis of the camera aligned with the mounting position OA. The second imaging unit 5, like the first imaging unit 4, is stationary with respect to the mounting position OA of the electronic component C. That is, the magnification of the second imaging unit 5 is provided so that the accuracy of imaging and position recognition of the mark M attached to the mounting region B of the substrate S placed on the stage 21 becomes the required accuracy. At the same time, the imaging field of view of the second imaging unit 5 is set so as to include at least two marks M attached to the diagonal of the mounting region B of the substrate S. Further, the range of this imaging field of view is set in consideration of the variation in the position where the substrate S is placed on the stage 21, that is, the placement position accuracy.

[0037] (Supply unit) The supply unit 6 includes a support mechanism 61 and a drive mechanism 62. The support mechanism 61 is a device that supports the wafer sheet WS to which the electronic component C is attached. The drive mechanism 62 moves the support mechanism 61 along the X-axis direction and the Y-axis direction. In the supply unit 6, the surface (region) on which the electronic component C is mounted is referred to as the mounting surface F. In the present embodiment, the electronic component C is a wafer that has been diced into individual pieces and attached to the wafer sheet WS. Therefore, the surface of the wafer sheet WS to which the electronic component C is attached (the surface of the wafer) is the mounting surface F. The wafer sheet WS is attached to a wafer ring (not shown). The support mechanism 61 has a ring holder 61a for mounting the wafer ring. That is, it can be said that the surface of the support mechanism 61 that supports the wafer sheet WS is the mounting surface F.

[0038] Although not shown in the drawings, a loader / unloader for supplying / storing the wafer ring to the ring holder 61a is provided at one of the moving ends of the support mechanism 61 in the Y-axis direction (specifically, the moving end on the front side shown in the drawings). The support mechanism 61 receives the supply of the wafer ring from the loader or delivers the wafer ring to the unloader in the state of moving to the above-mentioned moving end.

[0039] Also, although not shown in the drawings, the support mechanism 61 has an expand mechanism for creating a gap between the electronic components C by stretching the wafer sheet WS, and a push-up mechanism for separating the electronic components C by sandwiching the stretched wafer sheet WS and individually pushing them up. Further, the support mechanism 61 includes a θ drive mechanism for rotationally moving the ring holder 61a in the horizontal plane. Note that the push-up mechanism is fixedly arranged on the support base 11, and the receiving of the electronic component C from the supply unit 6 by the moving device 7, that is, the pick-up, is performed at this position (pick-up position).

[0040] The drive mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the drive mechanism 62 has a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction, and is a mechanism for moving the support mechanism 61 in the X-axis and Y-axis directions in the horizontal plane by a belt or a ball screw using a motor (not shown) as a drive source. This drive mechanism 62 functions as a positioning mechanism for positioning the electronic component C with respect to the transfer head 71. Note that the drive mechanism 62 is arranged at a position lower than the height position L (see FIG. 5) of the mounting surface F.

[0041] (Moving Device) The moving device 7 relatively moves the mounting head 31 and the pickup collet 700. The moving device 7 includes a transfer head 71, an arm portion 72, and a transfer mechanism 73. As shown in FIG. 3(A), the transfer head 71 includes a pickup collet 700 and a reverse drive unit 710. As shown in FIGS. 4 to 6, the pickup collet 700 is a member that sucks and holds the electronic component C and releases the suction hold to release the electronic component C. The pickup collet 700 includes a porous member 701, a base 702, and a guide portion 703. In the present embodiment, the moving device 7 moves the pickup collet 700 to transfer the electronic component C to the mounting head 31. However, the movement for transfer only needs to be relative, and either one or both of the pickup collet 700 and the mounting head 31 may move.

[0042] The porous member 701 has air permeability and is a member that supplies the gas supplied inside through the pores of the opposing surface 701a facing the electronic component C (in the following description, the gas supplied toward the electronic component C is illustrated with the symbol G). The porous member 701 of the present embodiment has a rectangular parallelepiped plate shape, and fine spaces that communicate as a whole are formed densely and substantially uniformly. The porous member 701 has air permeability due to this structure, but its conductance is very small. One of the surfaces of the porous member 701 becomes the opposing surface 701a. When gas is supplied into the inside from the back surface 701b on the side opposite to the opposing surface 701a, the gas jets out from the pores that are dense and evenly present on the opposing surface 701a. This jetting becomes a substantially planar jetting that spreads over the entire opposing surface 701a where the jetting has occurred. This jetting is extremely gentle, like oozing out, and is such that one can feel a slight airflow by bringing a finger close. Note that the surfaces other than the opposing surface 701a and the back surface 701b may have their pores blocked.

[0043] The porous member 701 is a continuous structure in which the pores, which are fine internal spaces as described above, communicate with each other and through which gas can pass between the pores. As such a porous member 701, sintered metal, ceramic, resin, etc. can be used. From the viewpoint that the internal particles are difficult to separate and flow out, it is preferable to use sintered metal.

[0044] Furthermore, as shown in FIGS. 4 and 5, the porous member 701 is provided with suction holes 701c, which are through holes having openings 701d in the opposing surface 701a and sucking the electronic component C by negative pressure. The suction holes 701c of the present embodiment penetrate linearly from the center of the back surface 701b to the center of the opposing surface 701a.

[0045] The base 702 is a member that covers the surfaces of the porous member 701 other than the opposing surface 701a. The base 702 of the present embodiment is a rectangular parallelepiped box with an open bottom. The porous member 701 is inserted through the opening of the base 702 so that the bottom surface is exposed as the opposing surface 701a, and is assembled and fixed in the base 702.

[0046] As shown in FIGS. 4 and 6, an air supply hole 702a, an exhaust hole 702b, and a mounting hole 702c are provided on the top surface of the base 702. The air supply hole 702a is a through hole for supplying air to the porous member 701. The air supply hole 702a is formed at a position close to the outer edge of the base 702 for the piping connected to the air supply hole 702a. The exhaust hole 702b is a through hole for generating negative pressure in the opening 701d through the suction hole 701c. The exhaust hole 702b extends downward and is formed to align with the suction hole 701c of the porous member 701. A space for accumulating gas is formed between the inner surface of the base 702 and the porous member 701 around the exhaust hole 702b. Note that the exhaust hole 702b may penetrate through the suction hole 701c and reach the opposing surface 701a. In this case, the suction hole 701c and the opening 701d of the porous member 701 are provided so as to be in close contact with the outside of the exhaust hole 702b that has reached the opposing surface 701a of the porous member 701. The mounting hole 702c is a pair of recessed holes for preventing displacement when connecting to a detachable portion 704 described later.

[0047] The air supply hole 702a is connected to a gas supply circuit via a pipe (not shown). The supply circuit includes a gas supply source, a pump, a valve, etc. Here, the gas supplied to the porous member 701 through the air supply hole 702a is an inert gas. The exhaust hole 702b communicates with a negative pressure generation circuit including a vacuum pump, a valve, etc. via a pipe (not shown).

[0048] The guide portion 703 is a member that is arranged along the four sides of the side surface of the rectangular base 702 so as to follow the outer edge of the electronic component C and restricts the movement of the electronic component C held on the opposing surface 701a. The guide portion 703 is, for example, as shown in FIGS. 4, 5, and 6, a plurality of plate-like bodies provided along the four side surfaces of the base 702, that is, the four sides of the rectangular opposing surface 701a. In the guide portion 703 of the present embodiment, one is provided on each side of the opposing surface 701a, but it is not limited thereto. Also, the outer edge of the pickup collet 700 constituted by the base 702 is not limited to a rectangle. The guide portion 703 may be arranged at a position where it can restrict the movement of the electronic component C, for example, in a direction along the outer edge of the electronic component C, and is not limited to the mode of being arranged along the side surface of the base 702.

[0049] Each guide part 703 has a protruding part that protrudes more than the opposing surface 701a. The distance (protrusion amount) by which the guide part 703 protrudes from the opposing surface 701a only needs to be able to regulate the movement of the electronic component C held on the opposing surface 701a via the gas layer, and it is sufficient if it is at least more than the extent to which it acts on the electronic component C held on the opposing surface 701a via the gas layer. However, when the protruding part of this guide part 703 protrudes beyond the electronic component C held on the opposing surface 701a via the gas layer, it is necessary to consider not contacting the electronic components C around the electronic component C to be picked up when picking up non-contact from the wafer. Therefore, the distance by which the protruding part of the guide part 703 protrudes from the opposing surface 701a is preferably within the side surface of the electronic component C held on the opposing surface 701a via the gas layer. However, before the pickup collet 700 approaches the wafer sheet WS for pickup, by individually pushing up the electronic component C through the wafer sheet WS by the above-mentioned pushing-up mechanism, it is possible to avoid contacting the surrounding electronic components C corresponding to various protrusion amounts.

[0050] In the following description, one set of orthogonal guide parts 703 are designated as 703K and 703L, and the other set of orthogonal guide parts 703 are designated as 703M and 703N. When not distinguishing between them, they will be described as the guide part 703. The orthogonal as referred to here includes the case where two adjacent side guide parts 703 are in contact or continuous to form a right angle, and also includes the case where there are a plurality of guide parts 703 on one side, and these guide parts 703 are separated, and the straight lines (planes) along which they are located are orthogonal (see Fig. 16).

[0051] As shown in Figs. 7(A) and (B), the inversion drive part 710 inverts the electronic component C adsorbed and held by the pickup collet 700 in the vertical direction. That is, the pickup collet 700 is rotatably provided between the direction facing the wafer sheet WS and the direction facing the mounting head 31 by the inversion drive part 710. The inversion drive part 710 can use, for example, a rotary motor.

[0052] The pickup collet 700 is attached to the reverse drive unit 710 via a rotating body 720 and a detachable part 704. The rotating body 720 is connected to the reverse drive unit 710 and is provided so as to be rotatable about an axis in the Y direction. The detachable part 704 is attached to the rotating body 720 and is provided so as to be rotatable together with the rotating body 720. The detachable part 704 has a magnet inside, and adsorbs and holds the base 702 of the pickup collet 700 by the suction force of the magnet. As shown in FIGS. 5 and 6, a pair of pins 704a are provided on the contact surface of the detachable part 704 with the base 702. When the pins 704a are fitted into the mounting holes 702c provided in the base 702, displacement of the pickup collet 700 with respect to the detachable part 704 is prevented. Although not shown, the pipe connected to the exhaust hole 702b passes through the detachable part 704, and the pipe connected to the air supply hole 702a is supported by the detachable part 704.

[0053] Also, although not shown, the transfer head 71 drives the pickup collet 700 in the vertical direction and has a buffer member that applies an appropriate load and absorbs an excessive load when the tip of the pickup collet 700 contacts the electronic component C. As the buffer member, for example, an elastic member such as a spring or rubber, a magnet, an air cylinder, a damper, a voice coil motor, etc. can be used.

[0054] The arm part 72 is a member having a transfer head 71 provided at one end. As shown in FIG. 3(A), the arm part 72 has an extension part 72a and a base part 72b. The extension part 72a is a member formed in an L shape by a rectangular parallelepiped member linearly extending in the Y-axis direction facing the front and a rectangular parallelepiped member linearly extending in the X-axis direction facing the mounting mechanism 3. At one end of the extension part 72a facing the mounting mechanism 3, a reverse drive unit 710 is provided so that the rotation axis is in the Y-axis direction. The pickup collet 700 is attached to the rotation axis of the reverse drive unit 710, so that the pickup collet 700 is provided so as to be rotatable. The base part 72b is a plate-like body parallel to the X-axis direction and is fixed to the other end of the extension part 72a (see FIG. 8).

[0055] The tube for supplying negative pressure connected to the pickup collet 700, the reverse drive unit 710, and the cable for electrical connection connected to the buffer member are built into the arm unit 72. Being built in means that it is covered by the exterior of the arm unit 72 and is not exposed to the outside. In the present embodiment, the tube and the cable are inserted into the hollow portion formed inside the arm unit 72.

[0056] The transfer mechanism 73 moves the transfer head 71 between the supply unit 6 and the mounting position OA by driving the arm unit 72. The transfer mechanism 73 has a sliding portion SL provided at a position that does not overlap the mounting surface F in a plan view. In other words, the sliding portion SL of the transfer mechanism 73 is provided outside the movement range of the support mechanism 61. The transfer mechanism 73 drives the arm unit 72 in accordance with the sliding of the sliding portion SL. Here, the sliding portion SL refers to a component portion that moves while members are in contact with each other. Such a sliding portion SL becomes a source of dust generation. The sliding portion SL of the present embodiment includes a first sliding portion 732b and a second sliding portion 734b as shown in FIG. 5. The first sliding portion 732b and the second sliding portion 734b are provided at a position (lower) lower than the height position L of the mounting surface F.

[0057] As shown in FIG. 8, the transfer mechanism 73 includes a fixed body 731, a first drive unit 732, a moving body 733, and a second drive unit 734. The fixed body 731 is fixed to the support base 11 (see FIG. 3(A)) and is a rectangular parallelepiped-shaped member extending in the X-axis direction. The position of the fixed body 731 is fixed with respect to the mounting position OA.

[0058] The first driving unit 732 drives the arm unit 72 in the X-axis direction. The first driving unit 732 includes a first driving source 732a and a first sliding unit 732b. The first driving source 732a is a linear motor extending in the X-axis direction and is provided along the upper surface (a plane parallel to the XY plane) of the fixed body 731. The first sliding unit 732b is a linear guide extending in the X-axis direction and is provided on the front surface (a plane parallel to the XZ plane) of the fixed body 731. Note that since the linear motor moves with the mover non-contact with the stator, the first driving source 732a does not have a sliding part SL.

[0059] The moving body 733 is a rectangular parallelepiped block. The mover of the first driving source 732a is attached thereto, and the slider of the first sliding unit 732b is attached thereto, so that it is provided to be slidable in the X-axis direction according to the operation of the first driving source 732a.

[0060] The second driving unit 734 drives the arm unit 72 in the Z-axis direction. The second driving unit 734 includes a second driving source 734a and a second sliding unit 734b. The second driving source 734a is a linear motor extending in the Z-axis direction and is provided on the moving body 733. The second sliding unit 734b is a linear guide extending in the Z-axis direction and is provided on the moving body 733.

[0061] The base part 72b of the arm unit 72 has the mover of the second driving source 734a attached thereto and the slider of the second sliding unit 734b attached thereto, so that it is provided to be slidable in the Z-axis direction. Thus, the sliding part SL of the present embodiment has a first sliding unit 732b and a second sliding unit 734b that linearly slide along two orthogonal axes. The first sliding unit 732b and the second sliding unit 734b are arranged in a positional relationship where they overlap in the height direction on two opposing side surfaces of the common moving body 733. That is, the positions of the two orthogonal axes are close to each other. Also, it is preferable that the distance between the two side surfaces of the moving body 733 is short, that is, the moving body 733 is thin.

[0062] (Relationship between the Opposing Distance between the Substrate on the Stage and the Mounting Head and the Dimensions of the Transfer Head) In this embodiment, as shown in FIG. 1, in order for the transfer head 71 to move to the mounting position OA, the opposing distance between the substrate S at the mounting position OA and the mounting head 31 is set so that the substrate S needs to be retracted. In other words, in order for the transfer head 71 to move to the mounting position OA, the height position of the mounting head 31 when receiving the electronic component C at the mounting position OA is set close to the height position of the upper surface of the substrate S supported by the substrate support mechanism 2 to the extent that the substrate S needs to be retracted. More specifically, the distance h when the height position of the upper surface of the substrate S placed on the stage 21 of the substrate support mechanism 2 at the mounting position OA faces the lower end surface of the mounting head 31 when receiving the electronic component C is shorter than the height direction dimension H of the transfer head 71 at the tip of the arm portion 72 (h < H). Here, as described above, the distance from the lower end surface of the holding portion 31b to the height position of the upper surface of the substrate S is, for example, several millimeters.

[0063] (Dimensions of the Arm Portion) As shown in FIGS. 1, 3(A), and 7(A), the extending portion 72a of the arm portion 72 has a width w of a member linearly extending in the Y-axis direction and a width d of a member linearly extending in the X-axis direction, both of which are longer than the thickness t in the Z-axis direction (w > t, d > t). Thereby, while suppressing the expansion of the height direction dimension of the arm portion 72, the rigidity of the relatively long arm portion 72 can be ensured, and the position of the electronic component C transferred by the transfer head 71 can be stabilized. By suppressing the expansion of the height direction dimension of the arm portion 72, it becomes unnecessary to raise the receiving position of the mounting head 31.

[0064] (Control Device) The control device 8 controls the moving device 7, the negative pressure generation circuit, the positioning mechanism, etc. so that the electronic component C held in the adsorption region D is positioned at the mounting position OA. First, while the control device 8 holds the electronic component C in a non-contact manner by the negative pressure of the suction hole 701c along with the ejection of gas from the porous member 701 in the pickup collet 700, the transfer mechanism 73 moves the mounting head 31 and the pickup collet 700 closer to each other by a predetermined distance, then starts the suction of the mounting head 31, and after a predetermined time has elapsed at the predetermined distance, releases the suction of the pickup collet 700 to cause the mounting head 31 to suck and hold the electronic component C.

[0065] The predetermined distance is set to a first distance (see d1 in FIGS. 10(A), (B), and (C)) and a second distance (see d2 in FIG. 10(D)) smaller than the first distance d1. The first distance d1 and the second distance d2 in this embodiment are the distances between the opposing surface 701a and the holding portion 31b. This predetermined distance is set in advance through experiments or the like. The first distance d1 is the distance at which the electronic component C held in the pickup collet 700 can be attracted to the suction hole 31c of the holding portion 31b by the suction of the mounting head 31 at the center of the mounting head 31 within a predetermined allowable range, and the second distance d2 is the distance at which the electronic component C is adsorbed and held by the holding portion 31b of the mounting head 31. Also, the second distance d2 is set such that the holding portion 31b does not contact the guide portion 703 or just contacts the guide portion 703.

[0066] The predetermined time is the time required for the electronic component C held in the pickup collet 700 to be attracted to the center of the mounting head 31 within a predetermined allowable range. This predetermined time is set in advance through experiments or the like. The predetermined allowable range refers to the region within which positioning with respect to the substrate S described later is possible during mounting. The control device 8 starts the suction of the mounting head 31 in the state of the first distance d1, and after a predetermined time has elapsed, releases the suction of the pickup collet 700 in the state of the second distance d2.

[0067] Further, the control device 8 controls the positioning mechanism so that the substrate S and the electronic component C are positioned based on the marks m and M imaged by the first imaging unit 4 and the second imaging unit 5. That is, in the control device 8, the positions of the mark m of the electronic component C on the XY coordinates and the position of the mark M of the substrate S on the XY coordinates in the design are stored in the storage device as the respective reference positions corresponding to the positions where the electronic component C should be accurately mounted.

[0068] This reference position can also be the positions of the marks m and M when they are accurately mounted as a result of previously attempting to mount the electronic component C on the substrate S, rather than the designed positions. The control device 8 obtains the deviation between the mark m imaged by the first imaging unit 4, the mark M imaged by the second imaging unit 5, and the reference position, and controls the positioning mechanism (drive mechanisms 22 and 32) so that the electronic component C and the substrate S move in the direction in which the deviation is corrected and by the amount of movement.

[0069] Further, the control device 8 controls the transfer mechanism 73 of the transfer device 7 and the drive mechanism 62 of the supply unit 6 based on the map information indicating the position coordinates of the electronic component C on the wafer sheet WS, and sequentially positions the electronic component C to be picked up at the pickup position. Here, the term "pickup" means detaching and receiving the electronic component C from a member on which the electronic component C is placed, for example, the wafer sheet WS. Further, the control device 8 controls the holding of the electronic component C by the pickup collet 700 of the transfer head 71, the inversion of the pickup collet 700 by the inversion drive unit 710, the movement of the transfer head 71 by the transfer mechanism 73 to the mounting position OA where the mounting head 31 waits, the transfer of the electronic component C from the pickup collet 700 to the mounting head 31, and the like.

[0070] [Principle of suction and holding by pickup collet] Next, the principle of sucking and holding the electronic component C by the pickup collet 700 as described above will be explained. As shown in Fig. 4(A), the gas supplied from the air supply hole 702a jets out in a planar manner from the pores on the opposing surface 701a, thereby forming a gas layer between the gas and the electronic component C. This layer is, for example, 2 to 10 μm thick. Then, with a negative pressure applied to the suction hole 701c by the negative pressure generation circuit, the opposing surface 701a is brought close to the electronic component C, and the electronic component C is sucked and held. At this time, since a gas layer is formed between the opposing surface 701a and the electronic component C, a non-contact state is maintained between the opposing surface 701a and the electronic component C. Further, by releasing the negative pressure by the negative pressure generation circuit, the negative pressure no longer acts on the suction hole 701c, and the electronic component C is released from the pickup collet 700.

[0071] [Operation] The operation of the present embodiment as described above will be described with reference to the explanatory diagrams of Figs. 8 to 12, and the flowcharts of Figs. 13 and 14 in addition to the above-mentioned Figs. 1 to 7. In the initial state, the substrate S is transferred from the loader to the stage 21 of the substrate support mechanism 2, but it has retreated together with the stage 21 from the position facing the mounting head 31, that is, the mounting position OA.

[0072] [Transfer of Electronic Component] The transfer operation of the electronic component C will be described with reference to the explanatory diagrams of Figs. 8 to 12 and the flowchart of Fig. 13. A wafer ring with a wafer sheet WS attached thereto by an auto loader is mounted on the ring holder 61a of the support mechanism 61 in the supply unit 6 (see Fig. 3). The electronic component C divided into individual pieces by dicing is attached to this wafer sheet WS. In Fig. 8, those other than the electronic component C to be picked up are not shown.

[0073] First, as shown in FIGS. 8(A) and 3(A), the support mechanism 61 moves in the X-axis and Y-axis directions to position the electronic component C to be mounted at the pickup position. Also, by moving the arm portion 72 in the X-axis direction, the tip of the pickup collet 700 of the transfer head 71 is positioned directly above the electronic component C to be mounted, that is, at the pickup position (step S101).

[0074] At this time, the movement of the wafer sheet WS in the X-axis and Y-axis directions is performed by the drive mechanism 62 of the supply unit 6. The movement of the arm portion 72 in the X-axis direction is performed by the operation of the first drive source 732a of the first drive unit 732, and the moving body 733 moves along the first sliding portion 732b.

[0075] As shown in FIG. 8(B), a lifting mechanism (not shown) lifts the electronic component C to be mounted. Then, the pickup collet 700 of the transfer head 71 picks up the electronic component C (step S102). At this time, pressurized gas is supplied to the porous member 701 of the pickup collet 700 through the air supply hole 702a, and the gas is blowing out from the opposing surface 701a. Also, there is no exhaust from the exhaust hole 702b, and there is no suction from the opening 701d. In this way, the pickup collet 700 from which gas is supplied from the opposing surface 701a descends and approaches the electronic component C. When the pickup collet 700 approaches the electronic component C, the gas on the opposing surface 701a is sandwiched between the opposing surface 701a and the electronic component C to form a gas layer. It is considered that the sandwiched gas layer at this time is a viscous flow layer. Then, the pickup collet 700 stops descending with respect to the electronic component C by the gas layer that is not further compressed.

[0076] In this way, with the pickup collet 700 stopped via the gas layer, suction by the suction hole 701c is started by exhaust from the exhaust hole 702b, so that the electronic component C is adsorbed and held on the opposing surface 701a. At this time, although the adsorbed and held electronic component C may be displaced from the center, it is positioned at the center when it is passed to the mounting head 31 as described later.

[0077] In this way, after the arm portion 72 moves in the direction approaching the wafer sheet WS and the pickup collet 700 adsorbs and holds the electronic component C, the arm portion 72 moves in the direction away from the wafer sheet WS, so as to detach the electronic component C from the wafer sheet WS as shown in FIG. 8(C).

[0078] The movement of the arm portion 72 at this time is performed by the operation of the second drive source 734a of the second drive portion 734, and the base portion 72b moves along the second sliding portion 734b. Then, as shown in FIGS. 7(A), (B), 8(C), and (D), the inversion drive portion 710 rotates the pickup collet 700 by 180° to invert the electronic component C (step S103). Although the adsorbed and held electronic component C may be displaced from the center due to the inertial force acting on the electronic component C during inversion, as will be described later, the electronic component C is positioned at the center when being transferred to the mounting head 31.

[0079] Next, as shown in FIGS. 9(A) and (B), the arm portion 72 moves in the X-axis direction to position the transfer head 71 at the mounting position OA (step S104). That is, the pickup collet 700 of the transfer head 71 comes to a position facing the holding portion 31b of the mounting head 31 in the mounting mechanism 3. The movement of the arm portion 72 in the X-axis direction at this time is performed by the operation of the first drive source 732a of the first drive portion 732, and the moving body 733 moves along the first sliding portion 732b to move the distance from the pickup position to the mounting position OA. At this time, the mounting head 31 waits at a height position where the facing interval between the lower end surface of the holding portion 31b and the upper surface of the substrate S is a distance of several millimeters. The facing interval at this time is larger than the first interval d1. Although the adsorbed and held electronic component C may be displaced from the center due to the inertial force acting on the electronic component C by the movement of the transfer head 71, as will be described later, the electronic component C is positioned at the center when being transferred to the mounting head 31.

[0080] Then, as shown in FIGS. 9(C) and 10(A), when the arm portion 72 moves in the Z-axis direction, the distance between the holding portion 31b of the mounting head 31 and the opposing surface 701a of the pickup collet 700 is set to a first interval d1 (step S105). The movement of the arm portion 72 at this time is performed by the operation of the second drive source 734a of the second drive portion 734 and the movement of the base portion 72b along the second sliding portion 734b (see FIG. 8). Then, as shown in FIGS. 10(B) and 11(A), suction of the mounting head 31 is started by the negative pressure generation circuit (step S106), the suction force of the pickup collet 700 is weakened, and the passage of a predetermined time is awaited (NO in step S107).

[0081] Then, due to the suction from the suction hole 31c of the mounting head 31, as indicated by the arrow of the alternate long and short dash line in the figure, a suction flow Q that draws toward the center where the suction hole 31c is located acts on the electronic component C. That is, when suction is performed from the suction hole 31c, a suction flow Q that sucks the surrounding gas from the entire circumference in the horizontal direction is generated. This suction flow Q flows through the narrow interval between the holding portion 31b of the mounting head 31 and the electronic component C (see FIGS. 10(B) and (C)). At this time, a force that presses the electronic component C from the outer periphery of the mounting head 31 toward the suction hole 31c is generated between the suction flow Q and the surface of the electronic component C due to the friction between the two. This force becomes larger as the area of the surface of the electronic component C facing the suction flow Q is larger. Therefore, when the electronic component C is displaced from the center, since the area of the surface of the electronic component C in the displaced direction becomes larger, this pressing force becomes larger than the portion where the area of the opposite side becomes smaller (the pressing force is indicated by the dotted arrow in the figure). For this reason, as shown in FIGS. 10(C) and 11(B), the electronic component C is positioned so as to be drawn toward the center. At this time, since the suction force for adsorbing to the opposing surface 701a of the pickup collet 700 is weakened, the electronic component C moves more smoothly. Note that since the suction from the opening 701d of the porous member 701 is weakened but continues, a force that draws the electronic component C toward the center where the opening 701d is located acts on the electronic component C, and the force that draws it toward the center is strengthened.

[0082] After the elapse of a predetermined time (YES in step S107), as shown in FIG. 10(D), the suction of the pickup collet 700 is released, and the arm portion 72 moves in the Z-axis direction so that the distance between the holding portion 31b and the opposing surface 701a becomes a second interval d2 (step S108). Then, the electronic component C is attracted and held by the holding portion 31b of the mounting head 31 (step S109). At this time, a force that draws the electronic component C toward the center of the holding portion 31b acts due to the suction from the suction hole 31c, and since the distance between the electronic component C and the holding portion 31b is very close, when the electronic component C is held by the holding portion 31b, the position of the electronic component C hardly shifts or only slightly shifts. After that, as shown in FIG. 9(D), the arm portion 72 moves in a direction away from the holding portion 31b to release the electronic component C. The movement of the arm portion 72 at this time is performed by the second drive source 734a of the second drive portion 734 operating and the base portion 72b moving along the second sliding portion 734b (see FIG. 8).

[0083] Furthermore, as shown in FIG. 9(E), the arm portion 72 moves toward the supply unit 6, so that the transfer head 71 retracts from directly below the holding portion 31b. The movement of the arm portion 72 at this time is performed by the first drive source 732a of the first drive portion 732 operating and the moving body 733 moving in the X-axis direction along the first sliding portion 732b (see FIGS. 2 and 8). Since the transfer of the electronic component C to the holding portion 31b by the transfer device 7 is performed at the mounting position OA, at the time of transfer, the stage 21 remains retracted to avoid interference with the transfer mechanism 73.

[0084] [Mounting of Electronic Component] Next, the mounting operation of the electronic component C will be described with reference to the explanatory diagram of FIG. 12 and the flowchart of FIG. 14. Here, as shown in FIG. 12(A), the holding portion 31b of the mounting head 31 holding the electronic component C as described above is located directly below the second imaging unit 5. The first imaging unit 4 images the mark m of the electronic component C held by the mounting head 31 (step S201). The control device 8 obtains the amount of displacement between the position of the mark m imaged by the first imaging unit 4 and the reference position, and positions the electronic component C by operating the drive mechanism 32 so that the amount of displacement is eliminated (step S202).

[0085] Next, as shown in FIG. 12(B), the substrate support mechanism 2 moves the stage 21 so that the mounting area B of the substrate S (in this case, the mounting area B where the electronic component C is to be mounted) faces the electronic component C held by the mounting head 31, that is, the center of the mounting area B comes to the mounting position OA (step S203). Then, as shown in FIG. 3(B), the second imaging unit 5 images the mark M of the substrate S visible in the transmission area T around the electronic component C through the mounting head 31 (step S204).

[0086] The control device 8 obtains the amount of displacement between the position of the mark M imaged by the second imaging unit 5 and the reference position, and positions the substrate S by operating the drive mechanism 22 so that the amount of displacement is eliminated (step S205). Further, as shown in FIG. 12(C), the drive mechanism 32 drives the mounting head 31 toward the substrate S, and the electronic component C held by the mounting head 31 is mounted on the substrate S (step S206).

[0087] In this way, by repeating the operations of transferring the electronic component C from the wafer sheet WS, delivering the electronic component C to the mounting head 31, positioning the electronic component C and the substrate S, and mounting, the electronic component C is sequentially mounted in each mounting area B of the substrate S. The substrate S on which a predetermined number of electronic components C are mounted is conveyed by the substrate support mechanism 2 and stored in the unloader.

[0088] [Function and Effect] (1) The mounting apparatus 1 for the electronic component C of this embodiment includes a mounting head 31 that mounts the electronic component C held by suction by the negative pressure of the suction hole 31c onto the substrate S, and a porous member 701 that ejects gas from pores and holds the electronic component C in a non-contact manner by the negative pressure of the suction hole 701c. It has a pickup collet 700 that picks up the electronic component C from the supply unit 6 that supplies the electronic component C and delivers it to the mounting head 31, a moving device 7 that relatively moves the mounting head 31 and the pickup collet 700, and along with the ejection of gas from the porous member 701, while the electronic component C is held in a non-contact manner by the negative pressure of the suction hole 701c, the moving device 7 is made to approach the mounting head 31 and the pickup collet 700 to a predetermined interval and the mounting head 31 is made to perform suction, and after a predetermined time has elapsed at the predetermined interval, the suction of the pickup collet 700 is released to cause the mounting head 31 to suck and hold the electronic component C, and a control device 8.

[0089] Also, the mounting method for the electronic component C of this embodiment is such that the pickup collet 700 having a porous member 701 that ejects gas from pores and holds the electronic component C in a non-contact manner by the negative pressure of the suction hole 701c picks up the electronic component C in a non-contact manner from the supply unit 6 of the electronic component C, and the moving device 7 approaches the mounting head 31 that mounts the electronic component C on the substrate S and the pickup collet 700 that has picked up and inverted the electronic component C to a predetermined interval, starts suction by the negative pressure of the suction hole 31c provided in the mounting head 31, and after a predetermined time has elapsed at the predetermined interval, releases the suction of the pickup collet 700, whereby the mounting head 31 sucks and holds the electronic component C.

[0090] Therefore, in this embodiment, while the electronic component C is picked up in a non-contact manner by the pickup collet 700, it is possible to position it at the suction hole 31c when delivering it to the mounting head 31. Here, when the electronic component C is picked up in a non-contact manner by suction by the suction hole 31c while gas is ejected from the porous member 701, the electronic component C becomes easier to move within the region surrounded by the guide portion 703.

[0091] However, in the present embodiment, since the mounting head 31 attracts and positions the misaligned electronic component C to the suction hole 31c and then receives the electronic component C, the holding position of the electronic component C by the mounting head 31 is made constant, and it is possible to suppress the increase in time and error in the position recognition by imaging the mark m of the electronic component C and the subsequent correction movement. As a result, the positional deviation during mounting can be reduced. Even if the deviation in the horizontal direction and the θ direction of the holding position by the mounting head 31 is not completely corrected, the movement amount during position correction by positioning the electronic component C using the marks m and M as described above can be reduced later, enabling more accurate mounting.

[0092] Also, if the mounting head 31 continuously performs suction before receiving the electronic component C, it will continuously suck the surrounding dust and affect the approaching electronic component C. However, in the present embodiment, after the mounting head 31 and the pickup collet 700 approach to a predetermined distance, the suction by the negative pressure of the suction hole 31c is started, so the time for sucking dust can be minimized and the influence on the electronic component C can be reduced.

[0093] (2) The suction hole 31c is provided at the center of the adsorption region D of the electronic component C of the mounting head 31, and the predetermined time is the time during which the center of the electronic component C held by the pickup collet 700 is attracted to the center of the adsorption region D within a predetermined allowable range. For this reason, after ensuring the time during which the electronic component C can move horizontally with respect to the holding portion 31b of the mounting head 31 and be positioned at the center, it can be passed to the mounting head 31. Therefore, the possibility of being positioned at the center of the adsorption region D can be increased.

[0094] (3) The predetermined distance is set to a first distance d1 and a second distance d2 smaller than the first distance d1. The control device 8 moves the mounting head 31 and the pickup collet 700 to the second distance d2 from the first distance d1 in the moving device 7, sucks by the suction of the mounting head 31 for a predetermined time in the state of the first distance d1, and releases the suction of the pickup collet 700 in the state of the second distance d2.

[0095] Therefore, by setting the first interval d1, the electronic component C can be horizontally moved relative to the holding portion 31b, and after ensuring the state where the electronic component C is sucked into the suction hole 31c and positioned, by setting the second interval d2, the electronic component C can be held by the mounting head 31 in a very close state. Accordingly, the change in the posture (XYθ) of the electronic component C during the transfer of the electronic component C can be minimized as much as possible, the movement amount during the position correction by positioning the electronic component C by the marks m and M can be reduced, and more accurate mounting can be achieved.

[0096] In addition, at the start of suction of the mounting head 31, the suction force on the electronic component C may instantaneously become strong. In such a case, the electronic component C may jump, and there is a possibility of unintended contact with the mounting head 31 or dropping due to detachment from the pickup collet 700. For this reason, by starting the suction of the mounting head 31 at the first interval d1 where the distance of the mounting head 31 from the electronic component C is relatively far, the instantaneous strong suction force acting on the electronic component C is suppressed, and after positioning in a stable state, by setting the second interval d2, the mounting head 31 can hold the electronic component C.

[0097] Note that the start of suction of the mounting head 31 only needs to avoid the period when the suction force instantaneously becomes strong due to the rapid start of suction accompanying the start of the suction force. For this reason, suction may be started before reaching the first interval d1. Even immediately before reaching the first interval d1, if the period of instantaneous increase has passed, since it is quite close, by continuously sucking the surrounding dust, it will not affect the approaching electronic component C. Therefore, "causing the mounting head and the pickup collet to approach to a predetermined interval by the moving device and performing suction by the mounting head" includes the start of suction of the mounting head 31 immediately before or at the time when the predetermined interval is reached.

[0098] Further, it is not always necessary to set the second interval d2. The electronic component C may be sucked and held at the first interval d1. When the suction of the pickup collet 700 is stopped and the electronic component C is sucked to the holding portion 31b, if the damage to the electronic component C is within an allowable range or the deviation is within an allowable range even if it occurs, it is possible to suck and hold without shifting to the second interval d2. Further, by gradually stopping the suction of the pickup collet 700, the movement of the electronic component C when being sucked can be slowed down, and impact and positional deviation can be suppressed. At this time, a flow rate adjustment mechanism or a suction pressure adjustment mechanism for controlling suction may be provided to weaken the suction at the holding portion 31b. Weakening the suction of the holding portion 31b and gradually weakening and stopping the suction of the pickup collet 700 may be performed simultaneously. In this case, since it is not necessary to move to and stop at the second interval d2, the tact time can be shortened. Note that a mode that can be selected may be set in the control device 8 to suck and hold at the first interval d1 or at the second interval d2 depending on whether damage or positional deviation of the electronic component or tact time is prioritized.

[0099] (4) In the present embodiment, when the mounting head 31 sucks at a predetermined interval during the delivery of the electronic component C, the suction force of the pickup collet 700 is weakened. For this reason, the force pulling the electronic component C in the vertical direction to the pickup collet 700 is reduced, making it easier for the electronic component C to move horizontally and enabling smooth sucking and holding of the electronic component C by the mounting head 31.

[0100] [Modification Example] (1) In the above-described aspect, while the holding portion 31b holds the suction for attracting the electronic component C in a state where the mounting head 31 approaches the electronic component C, depending on the distance of the gap between the electronic component C and the holding portion 31b, the resistance when the gas flows is large, and depending on the size of the electronic component C, there may be a risk that sufficient air flow cannot be obtained. For this reason, as shown in FIG. 15, the mounting head 31 may be provided with an ejection port 31d for ejecting gas to the outer periphery of the electronic component C. For example, a through hole inclined in a direction toward the outer periphery of the electronic component C is used as the ejection port 31d in the holding portion 31b of the mounting head 31. A gas supply circuit (not shown) is connected to the ejection port 31d, and gas is ejected from the bottom surface side of the holding portion 31b toward the outer periphery of the electronic component C. Thereby, it becomes easier to move the electronic component C closer to the center. In this way, by ejecting gas from the outer peripheral side of the holding portion 31b and supplying gas to the outer peripheral portion of the electronic component C to increase the air pressure, it is possible to easily secure the necessary air flow. Therefore, it is only necessary to be able to supply the necessary gas, and the ejection port 31d does not necessarily have to be inclined so as to face the outer periphery of the electronic component C.

[0101] (2) In the above-described aspect, the moving device 7 approaches the mounting head 31 by moving the pickup collet 700 at the mounting position OA (see FIG. 9). However, it is only necessary that the movement is relative, and the pickup collet 700 may be approached by a moving device that moves the mounting head 31, or both may be approached by a moving device that moves both. For example, it may be configured such that the height is fixed at a position where the pickup collet 700 is inverted, and the mounting head 31 descends to perform the delivery.

[0102] (3) The guide portion 703 of the pickup collet 700 may be provided along the outer edge of the opposing surface 701a so that the movement of the electronic component C can be restricted. That is, it is sufficient if the movement of the electronic component C that causes the electronic component C to fall off the pickup collet 700 due to the movement or inversion of the pickup collet 700 can be restricted. For this reason, the guide portion 703 may be provided on the four sides of the opposing surface 701a, may be provided over the entire circumference of the opposing surface 701a, or may be provided on a part of each side. For example, as shown in Fig. 16(A), the guide portion 703 may be arranged sandwiching the corner portion, or as shown in Fig. 16(B), the guide portion 703 may be arranged continuously along the corner portion. Note that, as shown in Fig. 16(B), there may be a case where one orthogonal guide portion 703 and the other orthogonal guide portion 703 are continuous.

[0103] Furthermore, a pickup collet 700 without the guide portion 703 may be used. In this case, although the displacement of the electronic component C is likely to occur, a large displacement can be corrected by the above-described positioning by suction.

[0104] (4) The number and size of the suction holes 701c and the openings 701d are not limited to the above-described aspects. On the opposing surface 701a of the porous member 701, the balance between the area where the electronic component C is supported by the gas layer and the total area of the openings 701d can realize the maintenance of the suction holding state and the non-contact state.

[0105] (5) The position and shape of the suction holes 701c and the openings 701d are also not limited to the above-described aspects. For example, the shape of the opening 701d may be circular, rectangular, or other elliptical, polygonal, rounded polygonal, star-shaped, etc.

[0106] (6) By providing the pickup collet 700 so that it can be replaced, it can be replaced according to the shape and size of the electronic component C. As a configuration that enables this replacement, a structure that can be suction-held by a magnet is simple, and the replacement work is also easy. However, any configuration that enables the pickup collet 700 to be replaced is acceptable. For example, adsorption holding using negative pressure or a structure that mechanically holds it may be used.

[0107] (7) The supply unit 6 is not limited to a device that supplies the electronic component C attached to the wafer sheet WS. For example, it may be a device that supplies the electronic components C arranged on a tray. Also, regarding the configuration of the transfer mechanism 73, it is only necessary that the electronic component C can be individually picked up from the supply unit 6 and transferred. Therefore, the configuration in which the arm portion 72 moves in the X-axis and Y-axis directions, or the configuration in which the support mechanism 61 moves in the X-axis and Y-axis directions may be adopted.

[0108] (8) In the transfer mechanism 73, the drive unit that drives the arm portion 72 is not limited to a mechanism using a linear motor as a drive source. A mechanism using a ball screw or a belt with a motor whose shaft rotates as a drive source may be adopted. In the case of such a mechanism, since it includes the sliding portion SL, it is preferably provided at a position that does not overlap the mounting surface F in plan view. Further, it is preferable that the sliding portion SL is provided at a position lower than the height position of the mounting surface F. In the case where there are a plurality of sliding portions SL, some of the sliding portions SL may not be provided at positions that do not overlap the mounting surface F in plan view. Also, some of the sliding portions SL may not be provided at positions lower than the height position of the mounting surface F. In such a case, it is preferable to provide a shielding object such as an exterior, a wall, or other components between the sliding portion SL and the mounting surface F. Also, it is preferable to increase the distance between the sliding portion SL and the mounting surface F.

[0109] (9) The mounting head 31 only needs to be configured such that the second imaging unit 5 can image the mark M on the substrate S. Therefore, even if the transmission portion of the mounting head 31 is not formed of a transparent material, through holes may be formed at positions corresponding to the mark M. More specifically, the holding portion 31b may be formed of an opaque member, and through holes may be formed at positions corresponding to the mark M. Alternatively, there may be no hollow portion 31a, and the holding portion 31b may be formed of an opaque member, and through holes may be formed at positions corresponding to the mark M of the mounting head 31 and the holding portion 31b. That is, such through holes are also the transmission portions of the mounting head 31.

[0110] (10) The first imaging unit 4 and the second imaging unit 5 may be provided so as to be movable with respect to the position (mounting position OA) where the electronic component C is mounted. That is, when it is not possible to image a plurality of marks m of the electronic component C and a plurality of marks M of the substrate S collectively, the first imaging unit 4 and the second imaging unit 5 may be configured to move between the marks m or between the marks M for imaging. That is, a moving device for moving between the marks m may be provided in the first imaging unit 4, or a moving device for moving between the marks M may be provided in the second imaging unit 5. Even in this case, since the moving distance remains short within the range of the size of the mounting area B of the electronic component C and the substrate S, errors and dust generation can be suppressed. Since an imaging magnification corresponding to the required mounting accuracy can be selected, the position recognition accuracy can be improved.

[0111] (11) In the above aspect, the positions of the mark m of the electronic component C and the mark M of the mounting area B of the substrate S are aligned with the reference position (mounting position OA), respectively. However, it is not limited to this, and the position of the mounting area B may be aligned with the position of the electronic component C, or the position of the electronic component C may be aligned with the position of the mounting area B. The main point is that the positions of the mounting area B of the substrate S and the electronic component C can be aligned. When the stage 21 aligns the positions of the substrate S and the electronic component C without moving the correction amount for alignment, it is not necessary to move the relatively large and heavy stage 21 in the alignment of each mounting area B. Therefore, while improving the mounting accuracy, the time for position correction can also be shortened.

[0112] (12) The transfer of the substrate S to the stage 21 of the substrate support mechanism 2 may be performed at the mounting position OA. In this case, after the substrate S is supplied to the stage 21, it is preferable to retract the substrate S from the mounting position OA prior to imaging of the mark m of the electronic component C by the first imaging unit 4.

[0113] 2. Second Embodiment The second embodiment of the present invention will be described with reference to FIGS. 17, 18, and 19. The second embodiment employs a mounting head 31 different from that of the first embodiment. Since other parts are the same as those of the first embodiment, descriptions of parts other than the mounting head 31 are omitted. FIG. 17 is an example of the mounting head 31 employed in the second embodiment, and shows in a plan view a state in which a pickup collet 700 holding an electronic component C in a non-contact manner is close to the mounting head 31. FIG. 18 is a cross-sectional view showing such a state. FIG. 17 is a schematic view showing the mounting head 31 through the mounting head 31 from the side of the mounting head 31. [Configuration] In the second embodiment, as shown in FIG. 17, two suction holes 311c and 312c are provided in the holding portion 31b provided in the mounting head 31. The suction holes 311c and 312c are symmetrically arranged with respect to the center of the adsorption region D in the mounting head 31. For example, the two suction holes 311c and 312c are arranged at symmetric (line-symmetric) positions with respect to a straight line passing through the center of the adsorption region D. At this time, the straight line passing through the center of the adsorption region D can extend in a direction that is the direction required when mounting the electronic component C on the substrate S. In FIG. 17, it is a line (not shown) orthogonal to the center line extending vertically in the figure.

[0114] Also, if it is line-symmetric, the number of suction holes provided in the holding portion 31b does not have to be two, and the number can be increased or decreased according to the size of the electronic component C. At that time, in the assumed maximum deviation state of the electronic component C immediately before transferring the mounting head 31 from the pickup collet 700, it is preferable that the suction holes 311c and 312c are positioned so as not to protrude from the electronic component C. Also, in order to balance the suction force, it is preferable to make the number of suction holes and the distance from the center the same. Also, even when there is a difference in the number of suction holes in the direction along the straight line passing through the center of the adsorption region D, the balance of the suction force may be taken by adjusting the distance from the center point according to the number of suction holes. Note that the same applies to the case of the direction intersecting the straight line passing through the center of the adsorption region D.

[0115] It is preferable that the arrangement of each suction hole is such that the sucked electronic component moves in the direction of the center of the suction area D of the mounting head 31, and it is line-symmetric with respect to a straight line in the direction that coincides with the vertical and horizontal center lines of the suction area D, and point-symmetric with equal distance and equal angle with respect to the center point of the suction area D is preferable.

[0116] Furthermore, in the second embodiment, as shown in Fig. 20(A), suction holes are provided at equal distances and equal angles (180 degrees) from the center of the suction area. However, as shown in Figs. 20(B - H), even when more than two suction holes are provided, each suction hole may be arranged at a position of equal distance and equal angle from the center of the suction area. For example, as shown in Fig. 20(C), in the case of four suction holes, the angle may be 90 degrees or the like.

[0117] [Function] In the second embodiment having such a configuration, when gas is sucked from the suction holes 311c and the suction holes 312c provided symmetrically with respect to the center of the mounting head 31, the mounting head 31 sucks the surrounding gas from the entire circumference in the horizontal direction. Therefore, a suction flow Q that flows from the outer periphery of the mounting head 31 toward the suction holes 311c and the suction holes 312c on the center side is generated. This suction flow Q flows through the gap between the surface of the electronic component C supported by the air flow G blown out from the pores of the porous member 701 and the holding portion 31b of the mounting head 31, as shown in Fig. 18.

[0118] At this time, a force is generated between the suction flow Q and the surface of the electronic component C that presses the electronic component C from the outer periphery of the mounting head 31 toward the suction holes 311c and the suction holes 312c due to the friction between the two. Since this force becomes larger in the portion where the opposing area between the suction flow Q and the electronic component C is wider, when the center of the electronic component C and the mounting head 31 are displaced as shown in Fig. 18(A), the side with a larger displacement width and a wider contact area with the suction flow Q on the right side in the figure receives the force of the suction flow Q, and the electronic component C is strongly pressed toward the suction holes 311c and the suction holes 312c side, that is, the center side of the mounting head 31.

[0119] As shown in Fig. 17(A), since this effect occurs over the entire periphery of the electronic component C, as a result, the electronic component C will be arranged at the center of the mounting head 31 as shown in Fig. 17(B). In particular, in the second embodiment, by providing two or more suction holes 311c and suction holes 312c symmetrically with respect to the center of the holding portion 31b, even if the electronic component C has a rotational displacement in a certain direction, according to the position and rotational displacement of the electronic component C, the balance of the forces V that attract the electronic component C held by the respective suction holes 311c and 312c acts so as to be naturally achieved. Note that the wider the interval between the suction holes, the longer the distance from the fulcrum to the force point, and the greater the angle correction (attraction) force.

[0120] As a result, by the suction flows Q from two suction holes symmetric with respect to the center of the mounting tool, while being attracted to the center of the mounting tool, the deviation in the rotational direction is also balanced by the two suction holes, and the electronic component C is attracted in a state of taking the required posture and the rotational displacement is eliminated.

[0121] [Effect] In this way, by providing two or more suction holes in the holding portion 31b of the mounting head 31 symmetrically with respect to the center of the holding portion 31b, when transferring the electronic component C from the pickup collet 700 to the mounting head 31, the posture (horizontal position and rotation) of the electronic component C held in non-contact with the pickup collet 700 can be corrected to an angle corresponding to the shape of the holding portion 31b with respect to the center of the holding portion 31b. Therefore, having two or more suction holes rather than one suction hole enables the mounting head 31 to receive the electronic component C from the pickup collet at a more appropriate position. The electronic component C held in non-contact with the pickup collet 700 is likely to move or rotate during transfer or inversion, but even with these movements or rotations, it can be in a state of the required posture. Also, it is possible to prevent the electronic component C held by the holding portion 31b from rotating freely. As a result, the mounting head 31 can always hold the electronic component C at a fixed position and rotational position, enabling more accurate mounting.

[0122] Furthermore, since a plurality of suction holes are used to set the posture of the electronic component C as required, the force acting on the electronic component C increases, and the time required for the center of the electronic component C held by the pickup collet 700 to be attracted to the center of the suction region D within a predetermined allowable range can be shortened. As a result, the tact time can be shortened and the productivity can be improved.

[0123] In particular, by arranging the plurality of suction holes in a symmetric state (line symmetry) with respect to a straight line passing through the center of the suction region D corresponding to the direction required for mounting, that is, a straight line passing through the center of the holding portion 31b, the posture (position, orientation) of the electronic component C can be corrected to the required state more reliably and quickly. As a result, more accurate mounting can be performed.

[0124] 3. Other Embodiments The present invention is not limited to the above-described embodiments, and components can be modified and embodied without departing from the gist thereof at the implementation stage. Also, various inventions can be formed by appropriately combining a plurality of components disclosed in the above embodiments. For example, some components may be deleted from all the components shown in the embodiments. Furthermore, components from different embodiments may be appropriately combined.

[0125] Another arrangement example of the suction holes is shown in FIG. 19. Each suction hole is indicated by a circle in FIGS. 19(A) to (O). As shown in FIGS. 19(A) to (O), they may be arranged in a horizontal row, a vertical row, or crossed. Also, the plurality of suction holes may be located at the vertex positions of a square, rectangle, diamond, etc. or along their sides. Furthermore, they may be arranged in various other line-symmetric manners not included in FIG. 19. As long as the electronic component C is arranged to be attracted to the posture (position, orientation) required for mounting the electronic component C on the substrate S when being transferred from the pickup collet 700 to the holding portion 31b by suction.

[0126] For example, when a plurality of suction holes are arranged in a line, if the electronic component C is displaced in the rotational direction so as to intersect with the extending direction of the line, the orientation of the electronic component C is corrected along the line on which the suction holes are arranged. Further, the displacement of the electronic component C in the horizontal direction (XY direction) causes the center position of the electronic component C to be drawn to the center position of the arrangement of the plurality of suction holes. Such an operation is the same as that shown in FIGS. 17 and 18. The arrangement in FIG. 19(A) is the same as the arrangement in FIG. 17 with a 90° change in orientation, and the same effect is achieved. The arrangement in FIG. 19(D) can be regarded as the same as that in FIG. 17, and thus the same effect is achieved.

[0127] FIGS. 19(B), (E), and (J) can also be regarded as the same as these, and the same effect is achieved. However, the greater the number of suction holes, the stronger the corrective force in the horizontal direction and the rotational direction. Therefore, such a corrective force acts stronger in FIG. 19(B) than in FIG. 19(A), stronger in FIG. 19(J) than in FIG. 19(B), and stronger in FIG. 19(E) than in FIG. 19(D). As a result, the posture can be corrected more reliably and quickly.

[0128] FIGS. 19(C) and (D) show an arrangement in which four suction holes are arranged symmetrically with respect to the line (the line passing through the center of the adsorption region D) indicated by a dotted line in FIG. 19, in the extending direction of the line and the direction intersecting the line, in this case, the orthogonal direction. And the centers of the four suction holes are arranged to coincide with the center of the adsorption region D. In any case, similar to FIG. 17, the electronic component C can be drawn in the direction along the line passing through the center of the adsorption region D and to the center of the adsorption region D.

[0129] While achieving the same effect as FIG. 17, by moving away from the center of the adsorption region D in the direction orthogonal to the extending direction of the line passing through the center of the adsorption region D, the corrective force in the rotational direction becomes stronger. Therefore, the electronic component C can be corrected to the desired posture more reliably and quickly. The same operation is also exhibited in FIGS. 19(G), (H), (I), (K), (L), (M), (N), and (O). Therefore, the same effect is achieved in various arrangements that are symmetric with respect to the line passing through the center of the adsorption region D according to the desired posture of the electronic component C.

[0130] In addition, as described above, in FIG. 19, when the distance from the center of the adsorption region D to the suction hole in the extending direction of the line indicated by the dotted line is longer than the distance in the direction orthogonal to this line, the longer one has a greater correcting force particularly in the rotational direction, so that the posture of the electronic component C can be made into the desired one more reliably and quickly. Therefore, the correcting force of FIG. 19(F) is stronger than that of FIG. 19(C), and the correcting force of FIG. 19(L) is stronger than that of FIG. 19(K). That is, the posture of the electronic component C can be corrected more reliably and quickly.

[0131] Of course, when the suction hole is provided at the center of the adsorption region D as shown in FIGS. 19(B), (E), (K), (L), (N), and (O), the correcting force for positioning the electronic component C at the center of the adsorption region D acts strongly. Therefore, the electronic component C can be made into the desired posture more reliably and quickly.

[0132] Further, when arranging three suction holes, it is preferable to provide at least one suction hole on the line passing through the center of the adsorption region D. More preferably, as shown in FIG. 19(H), the suction hole located at one vertex is provided on the line passing through the center of the adsorption region D, and the other two suction holes are provided in the direction orthogonal to the line passing through the center of the adsorption region D and with respect to this line.

[0133] By doing so, the same effect as that of FIG. 17 can be achieved. In this case, since the center of the electronic component C is attracted toward the two suction holes, it is advisable to shift and arrange the electronic component C so that it is positioned at the center of the adsorption region D in consideration of that.

[0134] Regarding the correcting force in the rotational direction, it is better that the distance between the suction hole located at the vertex and the other suction holes is larger. Therefore, the triangle with three suction holes at the vertices is preferably an isosceles triangle.

Explanation of Signs

[0135] 1 Mounting device 2 Substrate support mechanism 3 Mounting mechanism 4 First imaging unit 5 Second imaging unit 6 Supply unit 7 Moving device 8 Control device 11 Support base 11a Accommodation hole 21 Stage 22 Driving mechanism 22a, 22b, 33a, 34a, 35a, 62a, 62b Guide rail 23 Moving plate 23a Through hole 31 Mounting head 31a Hollow part 31b Holding part 31c Suction hole 311c, 312c Suction hole 31d Jet outlet 32 Driving mechanism 33, 34, 35 Moving body 61 Support mechanism 61a Ring holder 62 Driving mechanism 71 Transfer head 71a Adsorption nozzle 71b Reversal drive part 72 Arm part 72a Extension part 72b Base part 73 Transfer mechanism 700 Pickup collet 701 Porous member 701a Opposing surface 701b Back surface 701c Suction hole 701d Opening 702 Base 702a Air supply hole 702b Exhaust hole 702c Mounting hole 703 Guide part 704 Detachable part 704a Pin 731 Fixed body 732 First drive part 732a First drive source 732b First sliding part 733 Moving body 734 Second drive unit 734a Second drive source 734b Second sliding part OA mounting position B mounting area C Electronic component D Adsorption area F Placement surface M, m Marks S Substrate T Transmission area WS Wafer sheet Q Suction flow Q V Force to attract the electronic component C

Claims

1. A mounting head for mounting an electronic component held by suction with negative pressure in a suction hole onto a substrate, having a porous member that ejects gas from pores and holds the electronic component in a non-contact manner by the negative pressure in the suction hole, picks up the electronic component from a supply unit that supplies the electronic component, and delivers it to the mounting head, a pickup collet, a moving device that relatively moves the mounting head and the pickup collet, a control device that, while the pickup collet holds the electronic component in a non-contact manner by the negative pressure in the suction hole along with the ejection of gas from the porous member, causes the mounting head and the pickup collet to approach each other to a predetermined distance by the moving device and causes the mounting head to perform suction, and after a predetermined time has elapsed at the predetermined distance, releases the suction of the pickup collet and causes the mounting head to hold the electronic component by suction; An electronic component mounting apparatus, characterized by comprising the above.

2. One suction hole of the mounting head is provided at the center of the suction area of the electronic component of the mounting head, The electronic component mounting apparatus according to claim 1, wherein the predetermined time is a time during which the center of the electronic component held by the pickup collet is attracted to the center of the suction area within a predetermined allowable range.

3. A plurality of suction holes of the mounting head are provided symmetrically with respect to a line passing through the center of the suction area of the electronic component of the mounting head, The electronic component mounting apparatus according to claim 1, wherein the predetermined time is a time during which the center of the electronic component held by the pickup collet is attracted to the center of the suction area within a predetermined allowable range.

4. A plurality of suction holes of the mounting head are provided at equal distances and at equal angles from the center of the suction area of the electronic component of the mounting head, The electronic component mounting apparatus according to claim 1, wherein the predetermined time is a time during which the center of the electronic component held by the pickup collet is attracted to the center of the suction area within a predetermined allowable range.

5. The predetermined distance is set to a first distance and a second distance smaller than the first distance, The control device, moves the mounting head and the pickup collet by the moving device from the first distance to the second distance, causes the mounting head to perform suction for a predetermined time in the state of the first distance, The mounting apparatus for electronic components according to any one of claims 1, wherein suction of the pickup collet is released in the state of the second interval.

6. The mounting apparatus for electronic components according to any one of claims 1 to 5, wherein the suction force of the pickup collet is weakened when the mounting head sucks at the predetermined interval during delivery of the electronic component.

7. The mounting apparatus for electronic components according to any one of claims 1 to 5, wherein the mounting head is provided with a jet outlet for jetting gas to the outer periphery of the electronic component.

8. A pickup collet having a porous member that holds an electronic component in a non-contact manner by the negative pressure of a suction hole while jetting gas from pores holds the electronic component in a non-contact manner and picks it up from a supply unit of the electronic component, a moving device brings a mounting head that mounts the electronic component on a substrate and the pickup collet that has picked up and inverted the electronic component close to each other to a predetermined interval, starts suction by the negative pressure of a suction hole provided in the mounting head, and after a lapse of a predetermined time at the predetermined interval, releases suction of the pickup collet, whereby the mounting head sucks and holds the electronic component. A method for mounting an electronic component, characterized by the above.

Images