Pickup method and pickup device

Abstract

To provide a pickup device and method for which it is not necessary to exchange a push-up member in correspondence with the size of a chip and which are capable of dealing with chips in different sizes and more effectively prevent damage to the chip.SOLUTION: The present invention relates to a method for picking up a chip 23 from a tape 19. The method includes the steps of: positioning the chip above a mechanism comprising a suction part 52 including a face on which a rear face of the tape is sucked and held, and a push-up part disposed inside of a surface and including a pressing plane smaller than the chip, and releasing the chip from the tape by pushing up the chip via the tape with the push-up part in a state where the tape is sucked on a sucking face 76a; and picking up the chip with a chip holder 76 opposed to a push-up mechanism 50 while holding the chip therebetween after the push-up step. In the push-up step, the push-up mechanisms are successively positioned in a plurality of locations at an outer peripheral side of the chip and after push-up, the push-up mechanisms are positioned inside of the outer peripheral side of the chip and push up the chip.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present invention relates to a method for picking up a chip adhered to a tape.

Background Art

[0002] Conventionally, as disclosed in, for example, Patent Document 1, a method is known in which a chip adhered to a tape is pushed up from below by a pushing member and peeled off, and the upper surface of the chip is sucked and held by a chip holding member to pick up the chip.

[0003] When the chip is pushed up from below, if stress acts locally on the chip, the chip may be damaged. In particular, when the chip is thin, such as 100 μm or less, the risk of damage is very high.

[0004] From the above viewpoints, it is ideal to configure the area of the pressing surface of the pushing member to correspond to the size of the chip, and position the pushing member at the center position of the chip and push it up so that stress is not locally applied to the chip as much as possible.

[0005] In Patent Document 1, the pushing member is composed of a plurality of first to third pressing portions. After all the pushing members are raised to a predetermined position, the pressing portion closer to the center of the chip is raised step by step, and it is configured to be pushed up in a pyramid shape by the plurality of pressing portions.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] According to the conventional method, it is necessary to set the area of the pressing surface of the pushing-up member according to the size of the chip. When picking up chips of different sizes, it is necessary to prepare a pushing-up member corresponding to the size of the chip each time.

[0008] For this reason, conventionally, it was necessary to manufacture a plurality of types of pushing-up members with different sizes and replace the pushing-up members according to the size of the chip each time.

[0009] The replacement of the pushing-up member as described above requires labor and working time for the replacement work. Furthermore, it involves the manufacturing cost burden and management burden of a plurality of types of pushing-up members, and improvement has been demanded.

[0010] Also, in the chip, it was found that there are portions that are relatively difficult to peel from the tape and portions that are easy to peel, and a method for more effectively preventing chip breakage by further optimizing the order of pushing-up was earnestly studied.

[0011] The present invention is made in view of the above, and proposes a pickup device and a pickup method that do not require preparation or replacement of a pushing-up member according to the size of the chip, can handle chips of different sizes, and can more effectively prevent damage to the chips.

Means for Solving the Problems

[0012] The problem to be solved by the present invention is as described above. Next, the means for solving this problem will be described.

[0013] According to one aspect of the present invention, a pickup method for picking up a chip attached to the surface of a tape from the tape, A pushing-up mechanism having a suction portion with a suction surface for sucking and holding the back surface of the tape, and a vertically movable pushing-up portion disposed inside the suction surface and having a pressing surface smaller than the chip to be picked up at the top. The chip is positioned above the pushing-up mechanism, and in a state where the tape is sucked by the suction surface, the pushing-up portion pushes up the chip through the tape to peel the chip from the tape. A pushing-up step. After performing the pushing-up step, a pickup step of picking up the chip pushed up by the pushing-up mechanism with a chip holder facing the pushing-up mechanism across the chip. In the pushing-up step, at least one location among a plurality of locations on the outer peripheral side of the chip is sequentially pushed up by the pushing-up mechanism, and then the inside of the chip is pushed up by the pushing-up mechanism from the outer peripheral side. This is a pickup method.

[0014] Also, according to one aspect of the present invention, In the pushing-up step, the pushing-up speed of the pushing-up portion when pushing up the outer peripheral side is set lower than the pushing-up speed of the pushing-up portion when pushing up the inside from the outer peripheral side.

[0015] Also, according to one aspect of the present invention, In the pushing-up step, the pushing-up amount by the pushing-up portion when pushing up the outer peripheral side is set lower than the pushing-up amount by the pushing-up portion when pushing up the inside from the outer peripheral side.

[0016] Also, according to one aspect of the present invention, A pickup device for picking up a chip adhered to the surface of a tape from the tape, A pushing-up mechanism having a suction portion with a suction surface for sucking and holding the back surface of the tape, and a vertically movable pushing-up portion disposed inside the suction surface and having a pressing surface smaller than the chip to be picked up at the top. A chip holder provided facing the pushing-up mechanism across the chip for picking up the chip pushed up by the pushing-up mechanism. The pickup device is configured such that after the pushing-up mechanism is sequentially positioned at a plurality of locations on the outer peripheral side of the chip and the chip is pushed up, the pushing-up mechanism is positioned inside the outer peripheral side of the chip and the chip is pushed up.

Advantages of the Invention

[0017] According to the present invention, the chip is pushed up multiple times by a pushing-up mechanism having a pressing surface smaller than the chip to be picked up, peeled off from the tape, and picked up. At this time, by first pushing up and peeling the outer peripheral side of the chip that is more firmly adhered to the tape and then pushing up and peeling the inner side of the chip, it becomes possible to pick up the chip while preventing damage to the chip. Further, it is not necessary to prepare or replace the pushing-up member according to the size of the chip, and it is possible to handle a plurality of types of chips.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Mode for Carrying Out the Invention

[0019] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 and FIG. 2 are diagrams showing the configuration of the pickup device 2. As shown in FIG. 1, the pickup device 2 includes a base 4 that supports each component constituting the pickup device 2. A cassette mounting table 5 is provided at one side corner of the base 4, and a cassette 5a is mounted on the cassette mounting table 5. A plurality of wafer units 11 shown in FIG. 3 are accommodated in the cassette 5a, for example. In the wafer unit 11, the wafer 13 is fixed to the annular frame 21 via the tape 19, and the wafer 13 is in a state of being singulated into chips 23 by cutting or the like.

[0020] A temporary placement mechanism 10 capable of temporarily placing the wafer unit in two stages is provided at a position adjacent to the cassette mounting table 5 shown in FIG. 1. The temporary placement mechanism 10 includes a pair of guide rails 12 arranged in parallel to each other. Each of the pair of guide rails 12 is configured to form a two-stage shelf, and includes a first support surface 12a and a second support surface 12b that are substantially parallel to the X-axis direction (first horizontal direction, left-right direction) and the Y-axis direction (second horizontal direction, front-back direction).

[0021] As shown in FIG. 1, each of the first support surfaces 12a is disposed above the second support surface 12b so as to overlap the second support surface 12b. The pair of first support surfaces 12a and the pair of second support surfaces 12b each support the lower surface side of the end portion (annular frame 21 (FIG. 3)) of the wafer unit. For example, the pair of first support surfaces 12a supports the wafer unit conveyed from the cassette mounting table 5, and the pair of second support surfaces 12b supports the wafer unit conveyed from the frame holding mechanism 14 described later.

[0022] As shown in FIG. 1, a frame holding mechanism 14 is provided at a position adjacent to the temporary placement mechanism 10. The frame holding mechanism 14 includes a frame support portion 16 that supports the lower surface side of the annular frame (FIG. 3), and a frame pressing portion 18 that is disposed above the frame support portion 16 and contacts the upper surface side of the annular frame (FIG. 3). The frame support portion 16 and the frame pressing portion 18 are each formed in an annular shape corresponding to the shape of the annular frame (FIG. 3) and are arranged so as to overlap each other.

[0023] The frame support portion 16 shown in FIG. 1 is configured to be movable along the Z-axis direction (vertical direction, up and down direction). When the wafer unit is arranged such that the annular frame 21 (FIG. 3) is supported by the frame support portion 16 and the frame support portion 16 is moved upward, the annular frame 21 (FIG. 3) is sandwiched and fixed between the frame support portion 16 and the frame pressing portion 18.

[0024] Whether or not the annular frame 21 (FIG. 3) is appropriately fixed by the frame holding mechanism 14 is confirmed, for example, by detecting whether or not the frame support portion 16 and the frame pressing portion 18 are electrically connected via the annular frame (FIG. 3).

[0025] Also, as shown in FIG. 1, above the temporary placement mechanism 10 and the frame support portion 16, a transfer mechanism 20 for transferring the wafer unit 11 between the cassette 5a and the frame holding mechanism 14 is provided. The transfer mechanism 20 is configured to be movable along the Y-axis direction and the Z-axis direction, and includes a first gripping portion 22a and a second gripping portion 22b that grip the annular frame 21 (FIG. 3) of the wafer unit 11 from above and below. The first gripping portion 22a is provided on the cassette mounting table 5 side of the transfer mechanism 20, and the second gripping portion 22b is provided on the frame holding mechanism 14 side of the transfer mechanism 20.

[0026] As shown in FIG. 1, when unloading the wafer unit 11 from the cassette 5a, with the end portion of the wafer unit 11 accommodated in the cassette 5a gripped by the first gripping portion 22a, the transfer mechanism 20 is moved along the Y-axis direction toward the temporary placement mechanism 10. As a result, the wafer unit 11 is pulled out from the cassette 5a and is placed on a pair of first support surfaces 12a (upper stage) provided in the temporary placement mechanism 10. Thereafter, the gripping by the first gripping portion 22a is released.

[0027] Next, with the end portion of the wafer unit 11 on the cassette 5a side gripped by the second gripping portion 22b of the transfer mechanism 20, the transfer mechanism 20 is moved along the Y-axis direction toward the frame holding mechanism 14. As a result, the wafer unit 11 is transferred between the frame support portion 16 and the frame pressing portion 18, and the annular frame 21 (FIG. 3) is supported by the frame support portion 16.

[0028] As shown in FIGS. 1 and 2, on the temporary placement mechanism 10 side of the frame pressing portion 18, a notch portion 18a formed by notching the frame pressing portion 18 is provided. The notch portion 18a is configured to have a size through which the transfer mechanism 20 can pass. Thereby, when the wafer unit 11 is transferred to the frame holding mechanism 14, it is possible to prevent the transfer mechanism 20 from contacting the frame pressing portion 18.

[0029] As shown in FIG. 1, after transporting the wafer unit 11 to the frame holding mechanism 14, the gripping by the second gripping portion 22b is released, and the frame support portion 16 is moved upward. As a result, the annular frame 21 (FIG. 3) is sandwiched and fixed between the frame support portion 16 and the frame pressing portion 18.

[0030] As shown in FIGS. 1 and 2, the frame holding mechanism 14 is supported by a positioning mechanism 30 that controls the position of the frame holding mechanism 14. The positioning mechanism 30 includes an X-axis moving mechanism 32 that moves the frame holding mechanism 14 along the X-axis direction, and a Y-axis moving mechanism 42 that moves the frame holding mechanism 14 along the Y-axis direction. By these X-axis moving mechanism 32 and Y-axis moving mechanism 42, the position of the frame holding mechanism 14 in the horizontal direction is controlled.

[0031] The X-axis moving mechanism 32 includes a pair of guide rails 34 arranged along the X-axis direction on the base 4. Between the pair of guide rails 34, a ball screw 36 arranged substantially parallel to the pair of guide rails 34 is provided. Further, a pulse motor 38 for rotating the ball screw 36 is connected to one end of the ball screw 36.

[0032] A moving block 40 is slidably arranged on the pair of guide rails 34. A nut portion (not shown) is provided on the lower surface side (back surface side) of the moving block 40, and this nut portion is screwed onto the ball screw 36. When the ball screw 36 is rotated by the pulse motor 38, the moving block 40 moves in the X-axis direction along the pair of guide rails 34.

[0033] The Y-axis moving mechanism 42 includes a pair of guide rails 44 arranged along the Y-axis direction on the moving block 40. Between the pair of guide rails 44, a ball screw 46 arranged substantially parallel to the pair of guide rails 44 is provided. Further, a pulse motor 48 for rotating the ball screw 46 is connected to one end of the ball screw 46.

[0034] As shown in Fig. 1, a frame holding mechanism 14 is slidably disposed on a pair of guide rails 44. A nut portion (not shown) is provided on a support portion 14f of the frame holding mechanism 14, and this nut portion is screwed onto a ball screw 46. When the ball screw 46 is rotated by a pulse motor 48, the frame holding mechanism 14 moves in the Y-axis direction along the pair of guide rails 44.

[0035] As shown in Figs. 1 and 2, the moving block 40 is configured in a plate shape, and an opening 41 penetrating in the vertical direction is formed at a position below the frame holding mechanism 14. Pushing up from below by a pushing-up mechanism 50 described later becomes possible through this opening 41.

[0036] In a region between a pair of guide rails 36 on the base 4, a rectangular opening 4b is provided. Inside this opening 4b, a cylindrical pushing-up mechanism 50 for pushing up a chip 23 (Fig. 3) included in the wafer 13 of the wafer unit 11 from the lower surface side upward is provided. The pushing-up mechanism 50 is connected to a lifting mechanism (not shown) composed of a motor or the like and moves up and down along the Z-axis direction.

[0037] With the annular frame 21 of the wafer unit 11 fixed by the frame holding mechanism 14, when the frame holding mechanism 14 is moved along the X-axis direction by the positioning mechanism 30, the wafer unit 11 is positioned above the opening.

[0038] As shown in Figs. 1, 2, and 4, on the path for moving the frame holding mechanism 14 above the pushing-up mechanism 50, a wafer imaging camera 60 as imaging means for imaging the upper surface of the wafer 13 (Fig. 4) attached to the annular frame 21 fixed by the frame holding mechanism 14 is provided.

[0039] Imaging by the wafer imaging camera 60 may be performed while being fixed to the frame holding mechanism 14, or may be performed at the timing of being conveyed by the conveying mechanism 20 before being fixed to the frame holding mechanism 14, the timing of being placed on the temporary placement mechanism 10, etc. Also, the arrangement of the wafer imaging camera 60 can be designed according to an appropriate position corresponding to each timing.

[0040] As shown in FIGS. 1 and 2, the frame holding mechanism 14 positioned above the opening 4b is position-adjusted by the positioning mechanism 30 (FIGS. 1, 2) so as to align the position of the chip 23 to be picked up directly above the pushing-up mechanism 50 as shown in FIG. 5(A). In the present embodiment, the chip 23 is horizontally moved in the XY plane by the positioning mechanism 30 (FIGS. 1, 2) and the relative position of the chip 23 with respect to the pushing-up mechanism 50 is determined. However, the pushing-up mechanism 50 may be configured to horizontally move in the XY plane, and the relative position between the pushing-up mechanism 50 and the chip 23 may be determined.

[0041] FIG. 5(A) is a cross-sectional view showing the wafer unit 11 arranged above the pushing-up mechanism 50. The pushing-up mechanism 50 includes a suction portion 52 formed in a hollow cylindrical shape and constituting an outer layer portion, and a square columnar pushing-up portion 54 arranged inside the suction portion 52 as shown in FIG. 5(B).

[0042] As shown in FIG. 5(B), a plurality of suction grooves 52b formed concentrically along the circumferential direction of the suction portion 52 are formed at the upper end of the suction portion 52, so that the upper end surface of the suction portion 52 is configured as a suction surface 52a. Each of the suction grooves 52b is connected to a suction source 58 formed of an ejector or the like via a suction path (not shown) and a valve 56 formed inside the pushing-up mechanism 50. The suction portion 52 is connected to a lifting mechanism 52c formed of a motor or the like and moves up and down along the Z-axis direction.

[0043] The pushing-up portion 54 includes a first pushing-up pin 54a formed in a quadrangular prism shape and a second pushing-up pin 54b formed in a hollow quadrangular prism shape and surrounding the first pushing-up pin 54a. The first pushing-up pin 54a and the second pushing-up pin 54b are each connected to lifting mechanisms 55a, 55b composed of a motor or the like and move up and down along the Z-axis direction.

[0044] The upper surfaces 57a, 57b of the first pushing-up pin 54a and the second pushing-up pin 54b are formed as flat surfaces, forming a single pressing surface 57 as a whole. As will be described in detail later, they contact the lower surface of the tape and push up the chip from below.

[0045] Note that, like the pushing-up portion 54A shown in FIG. 5(C), it may be configured to include a single pushing-up pin 54c, and a pressing surface 57A may be formed on the upper surface 57c of the pushing-up pin 54c.

[0046] As shown in FIG. 6(A), the area 57M of the pressing surface 57 of the pushing-up portion 54, that is, the combined area of the two upper surfaces 57a, 57b, is set to be smaller than the area 23M (the area of the back surface) of the chip 23 to be picked up. In the example of FIG. 6(A), the area 57M of the pressing surface 57 is set to be about 1 / 25 of the area 23M of the chip 23, but it is not limited to this. Note that the smaller the area 57M of the pressing surface 57, the more chips of different sizes can be accommodated. Also, in the present embodiment, the pressing surface 57 formed by the upper surface of the pushing-up portion 54 is a rectangle similar to the shape of the chip 23, but it may also be a non-similar shape.

[0047] FIG. 6(B) shows the case of the configuration of the pushing-up portion 54A in FIG. 5(C). The area 57AM of the pressing surface 57A formed on the upper surface 57c is set to be smaller than the area 23M (the area of the back surface) of the chip 23 to be picked up. In the example of FIG. 6(B), the area 57AM of the pressing surface 57A is set to be about 1 / 25 of the area 23M of the chip 23, but it is not limited to this. Note that the smaller the area 57AM of the pressing surface 57A is, the more chips of different sizes can be accommodated. Further, in the present embodiment, the pressing surface 57A formed on the upper surface of the pushing-up portion 54A is a rectangle similar to the shape of the chip 23, but it may be a non-similar shape.

[0048] Next, the pickup mechanism 70 shown in FIG. 2 will be described. The chip pushed up by the pushing-up mechanism 50 is picked up by the pickup mechanism 70. The pickup mechanism 70 includes a chip holder 76 (collet) that picks up the chip pushed up by the pushing-up mechanism 50, and is connected to a chip holder moving mechanism 80 that controls the position of the chip holder 76.

[0049] FIG. 7 is a perspective view showing the pickup mechanism 70. The pickup mechanism 70 includes a moving base 72 connected to the chip holder moving mechanism 80, and a columnar arm 74 that is arranged along the X-axis direction from the moving base 72 toward the side opposite to the chip holder moving mechanism 80 and connects the chip holder 76 and the chip holder moving mechanism 80. The arm 74 includes a columnar first support portion 74a connected to the chip holder moving mechanism 80 via the moving base 72, and a second support portion 74b that protrudes downward from the tip of the first support portion 74a.

[0050] Note that the first support portion 74a and the second support portion 74b are configured to be separable and connectable to each other. For example, the first support portion 74a and the second support portion 74b are configured to be detachable from each other by a tool changer or the like. Further, the first support portion 74a is configured to move in the X-axis direction by an X-axis direction movement mechanism 74d, whereby the second support portion 74b is configured to be movable in the X-axis direction. Thereby, when accommodating in the chip accommodating tool 501 shown in FIG. 1, the accommodating position in the X-axis direction can be selected.

[0051] As shown in FIG. 7, a chip holder 76 for holding a chip is fixed to the lower end side of the second support portion 74b. The lower surface of the chip holder 76 constitutes a suction surface 76a for sucking and holding the chip. The suction surface 76a is connected to a suction source (not shown) via a suction path (not shown) formed inside the chip holder 76. With the chip in contact with the suction surface 76a of the chip holder 76, by applying the negative pressure of the suction source to the suction surface 76a, the chip is sucked and held by the chip holder 76.

[0052] As shown in FIG. 2, the pickup mechanism 70 is connected to a chip holder movement mechanism 80. The chip holder movement mechanism 80 includes a Y-axis movement mechanism 82 that moves the pickup mechanism 70 along the Y-axis direction, and a Z-axis movement mechanism 92 that moves the pickup mechanism 70 along the Z-axis direction. By the Y-axis movement mechanism 82 and the Z-axis movement mechanism 92, the position of the chip holder 76 in the Y-axis direction and the Z-axis direction is controlled.

[0053] The Y-axis movement mechanism 82 includes a pair of guide rails 84 arranged along the Y-axis direction. Between the pair of guide rails 84, a ball screw 86 arranged substantially parallel to the pair of guide rails 84 is provided. Further, a pulse motor 88 for rotating the ball screw 86 is connected to one end of the ball screw 86.

[0054] A pair of guide rails 84 has a moving block 90 slidably mounted thereon. Further, the moving block 90 is provided with a nut portion (not shown), and this nut portion is screwed onto a ball screw 86. When the ball screw 86 is rotated by a pulse motor 88, the moving block 90 moves in the Y-axis direction along the pair of guide rails 84.

[0055] As shown in FIGS. 2 and 7, the Z-axis moving mechanism 92 includes a pair of guide rails 94 arranged along the Z-axis direction on the side surface of the moving block 90. Between the pair of guide rails 94, a ball screw 96 is provided which is arranged substantially parallel to the pair of guide rails 94. Further, a pulse motor 98 for rotating the ball screw 96 is connected to one end of the ball screw 96.

[0056] As shown in FIG. 7, a moving base 72 of the pickup mechanism 70 is slidably mounted on the pair of guide rails 94. Further, the moving base 72 is provided with a nut portion (not shown), and this nut portion is screwed onto the ball screw 96. When the ball screw 96 is rotated by the pulse motor 98, the moving base 72 moves in the Z-axis direction along the pair of guide rails 94.

[0057] The pickup mechanism 70 configured as described above picks up the chip 23 pushed up by the pushing-up mechanism 50. The picked-up chip is appropriately conveyed to a chip observation mechanism 100, a strength measurement mechanism 200, and is also appropriately accommodated in a chip container 501, as shown in FIG. 1.

[0058] Next, a pickup method using the above configuration will be described. Hereinafter, the case of the configuration of the pushing-up portion 54 shown in FIGS. 5(B) and 6(A) will be described, but the case of the pushing-up portion 54A shown in FIGS. 5(C) and 6(B) is the same. Also, various processes such as the control of each operation necessary to implement the following method and the calculation of position coordinates based on the captured image can be executed by a program stored in a controller 1 (FIG. 1) that controls the pickup device.

[0059] <Wafer imaging step> As shown in FIG. 4, the wafer imaging camera 60 images the wafer 13 from above to capture an image for identifying the arrangement of each chip 23. The controller 1 (FIG. 1) calculates the center position and corner position coordinates of each chip 23 based on the captured image. In addition, the position coordinates of the center of the pushing-up portion 54 (FIG. 5(B)) are also stored in advance in the controller 1 (FIG. 1), whereby the relative positional relationship on the horizontal plane between each chip 23 and the pushing-up portion 54 (FIG. 5(B)) can be identified.

[0060] <Pushing-up step> As shown in FIGS. 5(A) and 8(B), this is a step of positioning the chip 23 above the pushing-up mechanism 50 and pushing up the chip 23 through the tape 19 with the pushing-up portion 54 while sucking the tape 19 with the suction surface 52a to peel the chip 23 from the tape 19.

[0061] Specifically, as shown in FIG. 5(A), the picked-up chip 23 is moved above the pushing-up mechanism 50, and as shown in FIG. 8(A), the chip 23 is positioned so that the center Kc of the first portion K1 of the chip 23 coincides with the center 54d of the pushing-up portion 54 (pressing surface 57) (first positioning step).

[0062] Here, as shown in FIG. 8(A), the position of the center Kc of the first portion K1 in the first direction (X-axis direction) corresponds to the center of the edge 23a of the rectangular chip 23 in the first direction (X-axis direction). Also, the position of the center Kc of the first portion K1 in the second direction (Y-axis direction) is a position where the edge 23a of the chip 23 is made to coincide with one side 57m of the pressing surface 57 of the pushing-up portion 54. In addition to completely matching the edge 23a of the chip 23 with one side 57m of the pressing surface 57, one side 57m of the pressing surface 57 may be positioned inside the edge 23a of the chip 23.

[0063] As shown in Fig. 1, the positioning of the chip 23 is performed by moving the frame holding mechanism 14 by the positioning mechanism 30.

[0064] Next, as shown in Fig. 8(B), the suction surface 52a of the suction portion 52 is raised until it abuts against the tape 19, and suction is started to suck and hold the tape 19 on the suction surface 52a. Next, by pushing up the first push-up pin 54a and the second push-up pin 54b, the first portion K1 of the chip 23 is peeled off from the tape 19 (first push-up step). In the example of Fig. 8(B), the first push-up pin 54a is pushed up higher than the second push-up pin 54b. Note that a device 24 is formed on the upper surface of the chip 23.

[0065] As shown in Fig. 9(A), the same operations as the above-described first positioning step and first push-up step are sequentially performed for the second portion K2 to the fifth portion K5 of the chip 23.

[0066] As shown in Fig. 9(A), the second portion K2, the third portion K3, and the fourth portion K4, which are respectively located along the respective edges 23b, 23c, 23d of the chip 23 in the same manner as the first portion K1, are positioned with respect to the push-up mechanism and pushed up in clockwise order. Finally, the fifth portion K5 located at the center of the chip 23 is positioned with respect to the push-up mechanism and pushed up.

[0067] In the above manner, a total of five push-up steps are performed. Here, as shown in Fig. 9(A), the first portion K1 to the fourth portion K4 are portions arranged along the edge portion of the rectangular chip 23 and are boundary portions with the groove 25 formed between the chips 23. This groove 25 is a groove formed in a direction orthogonal to each other by cutting with a cutting blade, for example. Strong stress is generated in the edge portion of the chip 23 during cutting, and it is strongly pressed against the tape 19. Therefore, the edge portion of the chip 23, that is, the outer peripheral side of the chip, is in a difficult situation where it is difficult to peel off from the tape 19.

[0068] In this embodiment, in view of this situation, first, the first location K1 to the fourth location K4 on the outer peripheral side of the chip that is difficult to peel off are pushed up, and finally, the fifth location K5 in the center that is easy to peel off is pushed up. That is, after the pushing mechanism 50 pushes up a plurality of locations on the outer peripheral side of the chip 23, the pushing mechanism 50 pushes up the inner side of the chip 23 more than the outer peripheral side.

[0069] By performing the pushing up of the fifth location K5 on the inner side that is easy to peel off last in the above manner, the load acting on the chip 23 is reduced, and damage to the chip 23 can be effectively suppressed.

[0070] Also, in the pushing step, the pushing speed of the pushing portion 54 when pushing up the outer peripheral side may be set lower than the pushing speed of the pushing portion 54 when pushing up the inner side more than the outer peripheral side.

[0071] As a result, the difficult-to-peel-off locations on the outer peripheral side of the chip 23 are slowly pushed up, preventing a sudden load from acting on the chip 23, and effectively suppressing damage to the chip 23.

[0072] Furthermore, in the pushing step, the pushing amount by the pushing portion 54 when pushing up the outer peripheral side may be set lower than the pushing amount by the pushing portion 54 when pushing up the inner side more than the outer peripheral side.

[0073] As a result, for example, it becomes possible to reduce the pushing amount of the easily peelable locations inside the chip 23 compared to the outer peripheral side, and by reducing the load applied to the chip 23, damage to the chip 23 can be effectively suppressed.

[0074] Note that the number and order of the pushing-up positions are not particularly limited to the example of FIG. 9(A), and the example of FIG. 9(B) may also be used. Each number in each region indicates the order. Also, as in the example of FIG. 9(C), after being positioned and pushed up at at least one of a plurality of positions on the outer peripheral side of the chip 23, the inner position is pushed up, and then, the outer peripheral side and the inner position are alternately repeated diagonally, such as pushing up another outer peripheral side position and then pushing up the inner position, and so on.

[0075] <Pick-up step> As shown in FIG. 10, after performing the pushing-up step, this is a step of picking up the chip 23 pushed up by the pushing-up mechanism 50 with the chip holder 76 facing the pushing-up mechanism 50 with the chip 23 sandwiched therebetween.

[0076] Specifically, the chip holder moving mechanism 80 (FIG. 2) positions the chip holder 76 of the pick-up mechanism 70 above the chip 23, and the chip 23 is sucked and held by the suction surface 76a of the chip holder 76, so that the chip 23 is separated from the tape 19 and picked up.

[0077] Note that when the chip holder 76 of the pick-up mechanism 70 does not move in the horizontal direction, the pushing-up is released once, and the position of the chip 23 is adjusted to the position of the chip holder 76 by moving the frame holding mechanism 14 (FIG. 1).

[0078] Also, as shown in FIG. 10, the pick-up step may be performed simultaneously with the state in which the chip 23 is pushed up, that is, the pushing-up step performed for the fifth time as described above, or may be performed in a state where the pushing-up mechanism 50 (pushing-up portion 54) is lowered.

[0079] As described above, according to the present invention, as shown in FIGS. 8(A) and (B) and FIG. 9(A), the chip 23 is pushed up multiple times by the pushing-up mechanism 50 having a pressing surface 57 smaller than the chip 23 to be picked up, peeled off from the tape 19, and picked up. At this time, after first pushing up and peeling the outer peripheral side of the chip 23 that is more firmly adhered to the tape 19, the inner side of the chip 23 is pushed up and peeled off, enabling picking up while preventing damage to the chip 23. Further, it is not necessary to prepare or replace the pushing-up member according to the size of the chip, and it is possible to handle multiple types of chips.

Explanation of Signs

[0080] 2 Pickup device 11 Wafer unit 13 Wafer 19 Tape 23 Chip 23a Edge 24 Device 25 Groove 50 Pushing-up mechanism 52 Suction part 52a Suction surface 52b Suction groove 52c Lifting mechanism 54 Pushing-up part 54a First pushing-up pin 54b Second pushing-up pin 57 Pressing surface 57M Area 70 Pickup mechanism 76 Chip holder 76a Suction surface 80 Chip holder moving mechanism K1 First location K2 Second location K3 Third location K4 Fourth location K5 Fifth location Kc Center

Claims

1. A pick-up method for picking up a chip adhered to the surface of a tape from the tape, comprising: positioning the chip above a pushing-up mechanism including a suction portion having a suction surface for sucking and holding the back surface of the tape, and a vertically movable pushing-up portion disposed inside the suction surface and having a pressing surface smaller than the chip to be picked up at the upper part thereof; and a pushing-up step of pushing up the chip through the tape with the pushing-up portion in a state where the tape is sucked by the suction surface to peel the chip from the tape; a pick-up step of picking up the chip pushed up by the pushing-up mechanism with a chip holder facing the pushing-up mechanism across the chip after the pushing-up step; in the pushing-up step, at least one location among a plurality of locations on the outer peripheral side of the chip is sequentially pushed up by the pushing-up mechanism, and then the inside of the chip is pushed up by the pushing-up mechanism rather than the outer peripheral side thereof; In the pushing-up step, the pushing-up speed of the pushing-up portion when pushing up the outer peripheral side is set lower than the pushing-up speed of the pushing-up portion when pushing up the inside rather than the outer peripheral side. A pick-up method.

2. A pick-up method for picking up a chip adhered to the surface of a tape from the tape, comprising: positioning the chip above a pushing-up mechanism including a suction portion having a suction surface for sucking and holding the back surface of the tape, and a vertically movable pushing-up portion disposed inside the suction surface and having a pressing surface smaller than the chip to be picked up at the upper part thereof; and a pushing-up step of pushing up the chip through the tape with the pushing-up portion in a state where the tape is sucked by the suction surface to peel the chip from the tape; a pick-up step of picking up the chip pushed up by the pushing-up mechanism with a chip holder facing the pushing-up mechanism across the chip after the pushing-up step; in the pushing-up step, at least one location among a plurality of locations on the outer peripheral side of the chip is sequentially pushed up by the pushing-up mechanism, and then the inside of the chip is pushed up by the pushing-up mechanism rather than the outer peripheral side thereof; In the pushing-up step, the pushing-up amount by the pushing-up portion when pushing up the outer peripheral side is set lower than the pushing-up amount by the pushing-up portion when pushing up the inside rather than the outer peripheral side. A pick-up method. A pickup device for performing the pickup method according to claim 1 or claim 2, a pushing-up mechanism including a suction part having a suction surface for sucking and holding the back surface of the tape, and a vertically movable pushing-up part disposed inside the suction surface and having a pressing surface smaller than the chip to be picked up at the top, a chip holder provided facing the pushing-up mechanism with the chip therebetween, for picking up the chip pushed up by the pushing-up mechanism, wherein the pushing-up mechanism is configured to be sequentially positioned at a plurality of locations on the outer peripheral side of the chip and pushed up, and then positioned inside the outer peripheral side of the chip and pushed up.

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