Glass fiber reinforced thermoplastic resin substrate and printed wiring board

Abstract

To suppress a fluctuation of a dielectric dissipation factor accompanying a frequency fluctuation as to a glass fiber-reinforced thermoplastic resin substrate containing a thermoplastic resin composition in one aspect of the present invention.SOLUTION: A glass fiber-reinforced thermoplastic resin substrate comprises: a glass fiber woven fabric containing a glass fiber formed from a glass composition; and a thermoplastic resin composition containing a liquid crystal polymer impregnated in the glass fiber woven fabric. To mass of the glass composition, the glass composition includes 52.1-55.1 mass% of SiO2, 21.2-24.2 mass% of B2O3, 10.9-13.9 mass% of Al2O3, 1.6-4.6 mass% of CaO, 0.1-2.5 mass% of MgO, 2.6-5.6 mass% of SrO, 0.6-3.6 mass% of TiO2, and 0.2-1.8 mass% of F2. The liquid crystal polymer has a melting point of 265-300°C.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a glass fiber-reinforced thermoplastic resin substrate and a printed wiring board using the same.

Background Art

[0002] As a substrate for a printed wiring board of an electronic device component using a high-frequency alternating current, a glass fiber-reinforced resin substrate in which a curable resin composition and a glass fiber fabric having low dielectric properties are combined is known (for example, Patent Documents 1 and 2). Further, glass fibers showing a low dielectric tangent at high frequencies have also been developed (for example, Patent Document 3).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] A glass fiber-reinforced thermoplastic resin substrate containing a thermoplastic resin composition is advantageous in terms of recyclability and the like as compared with a resin substrate containing a curable resin. It is also desired to maintain a sufficiently low dielectric tangent at high frequencies for the glass fiber-reinforced thermoplastic resin substrate.

[0005] One aspect of the present invention relates to suppressing fluctuations in the dielectric tangent accompanying fluctuations in frequency for a glass fiber-reinforced thermoplastic resin substrate containing a thermoplastic resin composition.

Means for Solving the Problems

[0006] The present disclosure generally relates to the following means. [1]A glass fiber reinforced thermoplastic resin substrate comprising a glass fiber fabric formed from a glass composition and a thermoplastic resin composition containing a liquid crystal polymer impregnated in the glass fiber fabric. The glass composition contains, based on the mass of the glass composition, 52.1 to 55.1% by mass of SiO2, 21.2 to 24.2% by mass of B2O3, 10.9 to 13.9% by mass of Al2O3, 1.6 to 4.6% by mass of CaO, 0.1 to 2.5% by mass of MgO, 2.6 to 5.6% by mass of SrO, 0.6 to 3.6% by mass of TiO2, and 0.2 to 1.8% by mass of F2. The liquid crystal polymer has a melting point of 265 to 300 °C. When the dielectric tangent of the glass fiber reinforced thermoplastic resin substrate is A at a measurement frequency of 1 GHz and B at a measurement frequency of 10 GHz, the following formula: 100 × |A - B| / {(A + B) / 2} ≤ 5.00% is satisfied. [2] The glass fiber reinforced thermoplastic resin substrate according to [1], wherein the dielectric tangent A of the glass fiber reinforced thermoplastic resin substrate at a measurement frequency of 1 GHz and the dielectric tangent B of the glass fiber reinforced thermoplastic resin substrate at a measurement frequency of 10 GHz are 0.00090 to 0.00200, and the dielectric constant of the glass fiber reinforced thermoplastic resin substrate at a measurement frequency of 1 GHz and the dielectric constant of the glass fiber reinforced thermoplastic resin substrate at a measurement frequency of 10 GHz are 3.6 to 3.9. [3] A printed wiring board including the glass fiber reinforced thermoplastic resin substrate according to [1] or [2].

Advantages of the Invention

[0007] Regarding a glass fiber reinforced thermoplastic resin substrate containing a thermoplastic resin composition, fluctuations in the dielectric tangent accompanying fluctuations in frequency are suppressed.

[0008] The dielectric loss energy W is represented by the following formula (1). W = kfv 2 × ε 1 / 2 tan δ ··· (1) In the formula, k is a constant, f is the frequency, v 2Here, φ represents the potential gradient, ε represents the dielectric constant, and tanδ represents the dielectric loss tangent. Therefore, when the dielectric loss tangent at high frequencies is kept low, heat generation in the resin substrate is also suppressed.

[0009] A glass fiber-reinforced thermoplastic resin substrate containing a thermoplastic resin composition is easier to recycle compared to a glass fiber-reinforced resin substrate containing a curable resin, and is also advantageous from the viewpoint of reducing environmental impact.

Brief Description of the Drawings

[0010]

Figure 1

Embodiments for Carrying Out the Invention

[0011] The present invention is not limited to the following examples.

[0012] FIG. 1 is a perspective view showing an example of a glass fiber-reinforced thermoplastic resin substrate. The glass fiber-reinforced thermoplastic resin substrate 1 shown in FIG. 1 mainly comprises a glass fiber fabric 10 and a thermoplastic resin composition 15 impregnated into the glass fiber fabric 10. The glass fiber fabric 10 contains glass fibers as warp yarns 12 and weft yarns 14.

[0013] The glass fibers constituting the glass fiber fabric 10 are fibers formed from a glass composition and are usually fiber bundles composed of a plurality of glass filaments (monofilaments). The glass fibers can be obtained, for example, by preparing a glass composition (glass batch) containing components at a predetermined content rate, melting the glass composition in a melting furnace, drawing out the molten glass composition (molten glass) from a nozzle tip, cooling the drawn fibrous glass composition to form glass filaments, applying a sizing agent or binder to the glass filaments using an applicator, and winding up while converging the plurality of glass filaments. The temperature at which the glass composition is melted may be, for example, 1450 to 1550°C. The molten glass fibers are drawn out from 1 to 30,000 nozzle tips of a bushing controlled at a predetermined temperature. For example, a converging shoe is used to converge the plurality of glass filaments. The plurality of glass filaments are wound around a tube at high speed, for example, using a winder. The number of glass filaments constituting one glass fiber may be, for example, 2 to 30,000.

[0014] The glass composition for forming the glass fibers may contain at least one inorganic oxide selected from the group consisting of SiO2, B2O3, Al2O3, CaO, MgO, SrO, and TiO2. The glass composition may further contain F2.

[0015] For example, the glass composition may contain 52.1 to 55.1% by mass of SiO2, 21.2 to 24.2% by mass of B2O3, 10.9 to 13.9% by mass of Al2O3, 1.6 to 4.6% by mass of CaO, 0.1 to 2.5% by mass of MgO, 2.6 to 5.6% by mass of SrO, 0.6 to 3.6% by mass of TiO2, and 0.2 to 1.8% by mass of F2 based on the mass of the glass composition. Usually, the glass fibers contain elements such as Si, B, Al, Ca, Mg, Sr, and Ti at a content rate corresponding to the ratio of each inorganic oxide in the glass composition.

[0016] The content rate of each component in the glass composition or glass fiber can be measured, for example, by analysis using a wavelength-dispersive X-ray fluorescence analyzer. When analyzing glass fiber, the organic matter adhering to the surface of the glass fiber and / or the thermoplastic resin composition impregnated in the glass fiber fabric are removed in advance. For this purpose, for example, the glass fiber, glass fiber fabric, or glass fiber-reinforced thermoplastic resin substrate may be heated by a muffle furnace or the like. For example, the heating temperature may be 300 to 650 °C and the heating time may be about 0.5 to 24 hours. The method for determining the content rate of each component includes, for example, forming molten glass by heating the glass composition (glass batch) or glass fiber contained in a platinum crucible in an electric furnace while stirring, pouring the molten glass onto a carbon plate to form glass cullets, pulverizing the glass cullets to form glass powder, forming a disk-shaped sample by molding the glass powder with a press, and determining the content rate of each element in the sample by wavelength-dispersive X-ray fluorescence analysis. The heating conditions for forming molten glass from the glass composition (glass batch) may be, for example, 1550 °C for 6 hours. The heating conditions for forming molten glass from glass fiber may be, for example, 1500 °C for 6 hours. In wavelength-dispersive X-ray fluorescence analysis, specifically, the sample can be quantitatively analyzed by a calibration curve method using a calibration curve sample prepared based on the measurement results by the fundamental parameter method. The content rate of each component in the calibration curve sample can be quantified by ICP emission spectroscopic analysis. The content rate of each element obtained from the quantitative analysis is converted into the content rate of each oxide. When the glass composition or glass fiber contains Li, which is a light element, its content rate can be determined by ICP emission spectroscopic analysis. ICP emission spectroscopic analysis is performed using a sample obtained by heating and decomposing the glass powder with an acid.

[0017] The ratio of SiO2 in the glass composition may be 51.1 to 56.1 mass%, 51.6 to 55.6 mass%, 52.6 to 55.2 mass%, 52.6 to 54.7 mass%, 53.1 to 54.1 mass%, 53.2 to 54.0 mass%, or 53.6 to 54.0 mass% based on the mass of the glass composition.

[0018] The ratio of B2O3 in the glass composition may be 21.2 to 25.2% by mass, 21.2 to 24.7% by mass, 21.7 to 23.7% by mass, 22.2 to 23.2% by mass, 22.3 to 23.1% by mass, or 22.3 to 22.7% by mass based on the mass of the glass composition.

[0019] The ratio of Al2O3 in the glass composition may be 9.9 to 14.9% by mass, 10.4 to 14.4% by mass, 11.3 to 13.5% by mass, 11.5 to 13.5% by mass, 12.0 to 13.5% by mass, or 12.4 to 13.5% by mass based on the mass of the glass composition.

[0020] The ratio of CaO in the glass composition may be 0.6 to 5.6% by mass, 1.1 to 5.1% by mass, 2.1 to 4.1% by mass, 2.6 to 3.6% by mass, 3.1 to 3.6% by mass, or 3.1 to 3.5% by mass based on the mass of the glass composition.

[0021] The ratio of MgO in the glass composition may be 0.2 to 1.8% by mass, 0.5 to 1.5% by mass, or 0.6 to 1.4% by mass based on the mass of the glass composition.

[0022] The ratio of SrO in the glass composition may be 1.6 to 6.6% by mass, 2.1 to 6.1% by mass, 3.1 to 5.1% by mass, 3.6 to 4.6% by mass, or 3.6 to 4.1% by mass based on the mass of the glass composition.

[0023] The ratio of TiO2 in the glass composition may be 0.1 to 4.1% by mass, 1.1 to 3.1% by mass, 1.6 to 2.6% by mass, or 1.7 to 2.1% by mass based on the mass of the glass composition.

[0024] The ratio of F2 in the glass composition may be 0.5 to 1.5% by mass, or 0.6 to 1.4% by mass based on the mass of the glass composition.

[0025] The dielectric constant of the glass fibers constituting the glass fiber fabric 10 at a measurement frequency of 10 GHz may be 4.0 to 4.5, or 4.2 to 4.4. The dielectric tangent of the glass fibers constituting the glass fiber fabric 10 at a measurement frequency of 10 GHz may be 0.00090 to 0.00200, 0.00110 to 0.00190, 0.00120 to 0.00180, or 0.00130 to 0.00170. Here, the dielectric constant and dielectric tangent of the glass fibers are measured by the method described in the examples below.

[0026] The diameter (filament system) of the glass filaments constituting the fiber bundle of the glass fibers may be, for example, 2.0 μm or more and 9.0 μm or less. The mass per 1000 m of the glass fibers may be, for example, 0.35 to 70.00 tex (g / 1000 m). The number of twists of the glass fibers may be, for example, 4.4 turns / 25 mm or less.

[0027] The weave structure of the glass fiber fabric 10 may be, for example, plain weave, twill weave, nanako weave, or satin weave. The mass per unit area of the glass fiber fabric 10 may be, for example, 2.5 to 220.0 g / m 2 and may be. The thickness of the glass fiber fabric 10 may be, for example, 4.0 to 200.0 μm.

[0028] The glass fiber fabric 10 is composed of, for example, warp threads having a weaving density of 40 to 150 threads / 25 mm and weft threads having a weaving density of 40 to 150 threads / 25 mm. The ratio of the weaving density of the weft threads to the weaving density of the warp threads (weaving density of weft threads / weaving density of warp threads) may be, for example, 0.85 to 1.35.

[0029] The glass fiber fabric 10 can be obtained by weaving using ordinary looms with glass fibers as warp and weft threads. Examples of looms include jet looms such as air jet or water jet looms, shuttle looms, and rapier looms.

[0030] One or more treatments selected from degreasing treatment, surface treatment, and fiber opening treatment may be applied to the woven glass fiber fabric 10.

[0031] The defatting treatment includes, for example, disposing a glass fiber fabric in a heating furnace with an ambient temperature of 350°C to 400°C for 40 to 80 hours to thermally decompose the organic substances adhering to the glass fiber.

[0032] The surface treatment includes, for example, immersing the glass fiber fabric 10 in a solution containing a silane coupling agent, squeezing out the excess solution from the immersed glass fiber fabric 10, and drying the glass fiber fabric 10 by heating at a temperature of 80°C to 180°C for 1 to 30 minutes. The solution containing the silane coupling agent may further contain a surfactant.

[0033] The silane coupling agent contains one or more compounds selected from the group consisting of, for example, aminosilane, ureidosilane, chlorosilane, epoxysilane, mercaptosilane, vinylsilane, (meth)acrylsilane, phenylsilane, styrylsilane, and isocyanatosilane. Examples of aminosilane include γ-aminopropyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-β-(aminoethyl)-N’-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, and γ-anilinopropyltrimethoxysilane. Examples of ureidosilane include γ-ureidopropyltriethoxysilane, and chlorosilane (for example, γ-chloropropyltrimethoxysilane). Examples of epoxysilane include β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and γ-glycidoxypropyltrimethoxysilane. Examples of mercaptosilane include γ-mercaptotrimethoxysilane, and γ-mercaptopropyltrimethoxysilane. Examples of vinylsilane include vinyltrimethoxysilane, N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane, and N-benzyl-β-aminoethyl-γ-aminopropyltrimethoxysilane. Examples of (meth)acrylsilane include γ-acryloxypropyltrimethoxysilane, and γ-methacryloxypropyltrimethoxysilane. Examples of phenylsilane include phenyltrimethoxysilane. Examples of styrylsilane include p-styryltrimethoxysilane. Examples of isocyanatosilane include γ-isocyanatopropyltriethoxysilane. The silane coupling agent is used alone or in combination of two or more kinds.

[0034] The surfactant can include, for example, a nonionic surfactant, a cationic surfactant, an anionic surfactant, or an amphoteric surfactant. Examples of nonionic surfactants include ethylene oxide propylene oxide alkyl ether, polyoxyethylene alkyl ether, polyoxyethylene-polyoxypropylene-block copolymer, alkyl polyoxyethylene-polyoxypropylene-block copolymer ether, polyoxyethylene fatty acid ester, polyoxyethylene fatty acid monoester, polyoxyethylene fatty acid diester, polyoxyethylene sorbitan fatty acid ester, glycerol fatty acid ester ethylene oxide adduct, polyoxyethylene castor oil ether, hydrogenated castor oil ethylene oxide adduct, alkylamine ethylene oxide adduct, fatty acid amide ethylene oxide adduct, glycerol fatty acid ester, polyglycerol fatty acid ester, pentaerythritol fatty acid ester, sorbitol fatty acid ester, sorbitan fatty acid ester, sucrose fatty acid ester, polyhydric alcohol alkyl ether, fatty acid alkanolamide, acetylene glycol, acetylene alcohol, ethylene oxide adduct of acetylene glycol, and ethylene oxide adduct of acetylene alcohol. Examples of cationic surfactants include alkyl dimethyl benzyl ammonium chloride, alkyl trimethyl ammonium chloride, alkyl dimethyl ethyl ammonium ethyl sulfate, higher alkylamine acetate, higher alkylamine hydrochloride, ethylene oxide adduct of higher alkylamine, condensate of higher fatty acid and polyalkylene polyamine, salt of ester of higher fatty acid and alkanolamine, salt of higher fatty acid amide, imidazoline type cationic surfactant, and alkyl pyridinium salt. Examples of anionic surfactants include higher alcohol sulfate ester salt, higher alkyl ether sulfate ester salt, α-olefin sulfate ester salt, alkyl benzene sulfonate, α-olefin sulfonate, reaction product of fatty acid halide and N-methyl taurine, dialkyl sulfosuccinate salt, higher alcohol phosphate ester salt, and phosphate ester salt of higher alcohol ethylene oxide adduct.Examples of amphoteric surfactants include amino acid type amphoteric surfactants, betaine type amphoteric surfactants (such as alkyldimethylbetaine, etc.), and imidazoline type amphoteric surfactants. Examples of amino acid type amphoteric surfactants include alkali metal salts of alkylaminopropionic acid. The surfactant(s) may be used alone or in combination of two or more.

[0035] The fibrillation treatment includes, for example, widening the yarn widths of the warp and weft yarns by subjecting the warp of the glass fiber fabric to a tension of 20 to 200 N while performing fibrillation by water flow pressure, fibrillation by high-frequency vibration using a liquid as a medium, fibrillation by the pressure of a fluid having surface pressure, or fibrillation by pressing with a roll.

[0036] The surface-treated glass fiber fabric 10 may have a surface treatment layer containing a silane coupling agent formed on the surface of the glass fiber. The surface treatment layer may further contain a surfactant. When the glass fiber fabric 10 has a surface treatment layer, the mass ratio of the surface treatment layer may be, for example, 0.03 to 1.50% by mass based on the total amount of the glass fiber fabric 10 including the surface treatment layer.

[0037] The thermoplastic resin composition 15 contains a liquid crystal polymer. The melting point of the liquid crystal polymer is 265 to 300 °C. The melting point of the liquid crystal polymer may be 275 to 295 °C, or 282 to 292 °C. The thermoplastic resin composition 15 may have a melting point within these numerical ranges. The melting point of the liquid crystal polymer or the thermoplastic resin composition can be a value measured by a method according to the method specified in JIS K 7121:2012 using a differential scanning calorimeter. A liquid crystal polymer having a predetermined melting point can be selected, for example, from commercially available products.

[0038] The thermoplastic resin composition 15 may substantially contain only the liquid crystal polymer or may further contain other components. The ratio of the liquid crystal polymer in the thermoplastic resin composition 15 may be, for example, 80% by mass or more, 85% by mass or more, 90% by mass or more, 95% by mass or more, or 98% by mass or more based on the mass of the thermoplastic resin composition 15.

[0039] Other components that may be included in the thermoplastic resin composition 15 may include thermoplastic polymers other than liquid crystal polymers. Examples thereof include polyethylene terephthalate, modified polyethylene terephthalate, polyolefin, polycarbonate, polyarylate, polyamide, polyphenylene sulfide, polyether ether ketone, and fluororesin. The thermoplastic resin composition 15 may further contain various additives as long as the effects of the present invention are not impaired.

[0040] When the dielectric tangent of the glass fiber reinforced thermoplastic resin substrate 1 is A at a measurement frequency of 1 GHz and B at a measurement frequency of 10 GHz, the following formula: 100×|A - B| / {(A + B) / 2} ≦ 5.00% is satisfied. A small value of 100×|A - B| / {(A + B) / 2} means that the variation in the dielectric tangent in the frequency range from 1 GHz to 10 GHz is small. By combining glass fiber and a thermoplastic resin composition containing a liquid crystal polymer having a specific melting point, the glass fiber reinforced thermoplastic resin substrate 1 showing a dielectric tangent satisfying the above formula can be easily obtained. The value of 100×|A - B| / {(A + B) / 2} may be 3.00% or less, or 2.50% or less. The lower limit of the value of 100×|A - B| / {(A + B) / 2} is not particularly limited, but may be, for example, 0.05%.

[0041] From the viewpoint of suppressing heat generation at high frequencies, the dielectric tangents A and B may be 0.00090 to 0.00200, 0.00150 to 0.00200, 0.00160 to 0.00190, or 0.00170 to 0.00180, respectively.

[0042] From the viewpoint of suppressing heat generation at high frequencies, the dielectric constant of the glass fiber reinforced thermoplastic resin substrate 1 at a measurement frequency of 1 GHz and the dielectric constant of the glass fiber reinforced thermoplastic resin substrate 1 at a measurement frequency of 10 GHz may be 3.6 to 3.9, 3.5 to 4.0, 3.6 to 3.9, or 3.7 to 3.8, respectively.

[0043] The ratio of glass fiber in the glass fiber reinforced thermoplastic resin substrate 1 may be, for example, 35 to 60% by mass, or 40 to 55% by mass based on the mass of the glass fiber reinforced thermoplastic resin substrate 1. Here, the ratio of glass fiber in the glass fiber reinforced thermoplastic resin substrate 1 can be calculated in accordance with JIS K 7052:1999.

[0044] The glass fiber reinforced thermoplastic resin substrate 1 can be obtained, for example, by a method including impregnating a glass fiber fabric 10 with a molten thermoplastic resin composition 15. A resin film which is a molded body of the thermoplastic resin composition and the glass fiber fabric may be laminated, and the formed laminate may be heated and pressed by hot pressing.

[0045] The glass fiber reinforced thermoplastic resin substrate 1 can be used, for example, as a substrate of a printed wiring board where a high-frequency signal is used. The printed wiring board has, for example, the glass fiber reinforced thermoplastic resin substrate 1 and a metal wiring provided on the glass fiber reinforced thermoplastic resin substrate 1. The glass fiber reinforced thermoplastic resin substrate 1 can be used, for example, for an antenna in addition to being a substrate of a printed wiring board.

Examples

[0046] Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples.

[0047] 1. Glass fiber fabric Two types of glass fiber fabrics 1 and 2 having glass fibers as warp and weft were prepared. The glass fibers constituting each of the glass fiber fabrics 1 and 2 were formed by melt spinning of a glass composition containing each component at the blending ratio shown in Table 1. R2O in Table 1 indicates the total content rate of Li2O, K2O, and Na2O. The glass fiber fabrics 1 and 2 had glass fibers with a twist number of 1.0 turn / 25 mm as warp and weft, and were plain woven fabrics obtained through surface treatment and fibrillation treatment with a solution containing aminosilane. The glass fibers were fiber bundles containing 200 glass filaments with a diameter of 5.3 μm. In the glass fiber fabrics 1 and 2, the weaving density of the warp and weft was 53 threads / 25 mm, and the mass per unit area was 43.0 g / m 2 and the thickness was 43.0 μm.

[0048] The dielectric constant and dielectric tangent of the glass fibers constituting the glass fiber fabric 1 or 2 at a measurement frequency of 10 GHz are also shown in Table 1. The dielectric constant and dielectric tangent of each glass fiber are values measured by the following method. First, a glass composition (glass batch) for forming each glass fiber was melted by heating at 1500 °C to 1600 °C for 7 hours in a platinum crucible with a diameter of 80 mm. The formed molten glass was taken out from the platinum crucible to obtain a glass bulk. The obtained glass bulk was annealed by heating at 580 to 700 °C for 8 hours. Next, a test piece of 80 mm × 3 mm (thickness 1 mm) was cut out from the glass bulk and polished. After the polished test piece was dried to absolute dryness, it was stored in a room at 23 °C and a humidity of 60% for 24 hours. Then, the dielectric tangent (dissipation factor Df) of the test piece at 10 GHz was assumed using a cavity resonator method dielectric constant measuring device ADMS01Oc1 (trade name) manufactured by A&T Co., Ltd. according to the method compliant with JIS C2565:1992.

[0049] [Table 1]

[0050] 2. Fabrication of Glass Fiber Reinforced Thermoplastic Resin Substrate The following thermoplastic resin films were prepared. LCP1: A thermoplastic resin film containing a liquid crystal polymer having a melting point of 282 °C (LCP manufactured by Chiyoda Integral Co., Ltd., Pericul (registered trademark) LCP) LCP2: A thermoplastic resin film containing a liquid crystal polymer having a melting point of 320 °C PEEK: A thermoplastic resin film containing polyetheretherketone PPS: A thermoplastic resin film containing polyphenylene sulfide

[0051] A glass fiber reinforced thermoplastic resin substrate (thickness: about 1.0 mm) in which a glass fiber fabric was impregnated with a thermoplastic resin composition was obtained by laminating one or two glass fiber fabrics and each thermoplastic resin film and then hot pressing the formed laminate. The combinations of the glass fiber fabric and the thermoplastic resin composition are shown in Table 2. In the glass fiber reinforced thermoplastic resin substrate, the ratio of the glass fiber fabric was 52% by mass based on the mass of the glass fiber reinforced thermoplastic resin substrate.

[0052] 3. Evaluation Test pieces of 80 mm × 3 mm (thickness 1 mm) were prepared from each of the produced glass fiber reinforced thermoplastic resin substrates. After being dried to absolute dryness, the obtained test pieces were stored in a room at 23 °C and a humidity of 60% for 24 hours. Then, the dielectric constant (dielectric constant Dk) and dielectric tangent (dissipation factor Df) of the test pieces at 1 GHz or 10 GHz were measured using a cavity resonator method dielectric constant measuring device ADMS01Oc1 manufactured by A&T Co., Ltd. according to the method conforming to JIS C2565:1992. The measurement results are shown in Table 2.

Table 2

Explanation of Symbols

[0053] 1... Glass fiber reinforced thermoplastic resin substrate, 10... Glass fiber fabric, 12... Warp, 14... Weft, 15... Thermoplastic resin composition.

Claims

1. A glass fiber woven fabric containing glass fibers formed from a glass composition, and A thermoplastic resin composition containing a liquid crystal polymer, impregnated in the glass fiber woven fabric, A glass fiber reinforced thermoplastic resin substrate comprising: wherein the glass composition is based on the mass of the glass composition, 52.1 to 55.1 mass % of SiO ２ and B of 21.2 to 24.2 mass% ２ O ３ and 10.9 to 13.9 mass% of Al ２ O ３ and 1.6 to 4.6% by mass of CaO, 0.1 to 2.5% by mass of MgO, 2.6 to 5.6% by mass of SrO, 0.6 to 3.6 mass% of TiO ２ and 0.2 to 1.8% by mass of F ２ and and the liquid crystal polymer has a melting point of 265 to 300 °C, when the dielectric tangent of the glass fiber reinforced thermoplastic resin substrate is A at a measurement frequency of 1 GHz and B at a measurement frequency of 10 GHz, the following formula: 100 × |A - B| / {(A + B) / 2} ≤ 5.00% is satisfied, A glass fiber reinforced thermoplastic resin substrate.

2. The dielectric tangent A of the glass fiber reinforced thermoplastic resin substrate at a measurement frequency of 1 GHz and the dielectric tangent B of the glass fiber reinforced thermoplastic resin substrate at a measurement frequency of 10 GHz are 0.00090 to 0.00200, The dielectric constant of the glass fiber reinforced thermoplastic resin substrate at a measurement frequency of 1 GHz and the dielectric constant of the glass fiber reinforced thermoplastic resin substrate at a measurement frequency of 10 GHz are 3.6 to 3.9, The glass fiber reinforced thermoplastic resin substrate according to Claim 1.

3. A printed wiring board comprising the glass fiber reinforced thermoplastic resin substrate according to Claim 1 or 2.

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