Compounds, molded products and cured products

Abstract

To provide a compound with superior fluidity and filling ability.SOLUTION: A compound includes metal powder, an epoxy resin, and a wax. A content of the metal powder is 96 mass% or more to less than 100 mass%. The wax includes at least one kind selected from a group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid esters.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a compound, a molded article, and a cured product. [Background technology]

[0002] Compounds containing metal powder and thermosetting resins are used as raw materials for a variety of industrial products, such as inductors, electromagnetic shields, or bonded magnets, depending on the physical properties of the metal powder (see Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-13803 Summary of the Invention [Problem to be solved by the invention]

[0004] When manufacturing industrial products from compounds, the compound is supplied and filled into a mold through a channel, and components such as coils are embedded in the compound within the mold. These processes require the compound to have good fluidity. However, when the metal powder content in the compound is 96% by mass or more, the compound's fluidity is significantly reduced. In particular, when the height (depth) of the compound's channel is 1 mm or less, compounds with a high metal powder content have difficulty flowing. Furthermore, when the metal powder content in the compound is 96% by mass or more, the compound is difficult to fill into a mold. For example, when a mold has a minute cavity on the scale of a millimeter or less, a compound with a high metal powder content has difficulty filling the cavity uniformly. With the recent trend toward miniaturization of electronic devices, the dimensions of the elements (devices) installed in electronic devices have also become smaller. Therefore, when a compound is used in the manufacture of an element, it is necessary for the compound to flow in a narrow flow path and to fill the minute cavities uniformly after passing through the narrow flow path.

[0005] An object of the present invention is to provide a compound having excellent flowability and fillability, a molded article containing the compound, and a cured product of the compound. [Means for solving the problem]

[0006] A compound according to one aspect of the present invention includes a metal powder, an epoxy resin, and a wax, wherein the metal powder content is 96% by mass or more but less than 100% by mass, and the wax includes at least one selected from the group consisting of a metal salt of lauric acid, a metal salt of stearic acid, and a saponified montanic acid ester.

[0007] The wax may include a metal salt of lauric acid and a saponified montanic acid ester.

[0008] At least one selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid ester may contain zinc.

[0009] At least one selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid ester may contain at least one selected from the group consisting of alkali metal elements and alkaline earth metal elements.

[0010] The saponified montanic acid ester may contain calcium.

[0011] The saponified Montan acid ester may be a partially saponified Montan acid ester.

[0012] The partially saponified Montan acid ester may have a saponification value of 102 mgKOH / g or more and 122 mgKOH / g or less.

[0013] The compound may be used in transfer molding.

[0014] A molded article according to one aspect of the present invention includes the above-described compound.

[0015] A cured product according to one aspect of the present invention is a cured product of the above-described compound. [Effects of the Invention]

[0016] According to the present invention, there are provided a compound having excellent fluidity and filling properties, a molded article containing the compound, and a cured product of the compound. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a schematic cross-sectional view of a flow tester for evaluating the fluidity of a compound. [Figure 2] (a) in FIG. 2 and (b) in FIG. 2 are schematic cross-sectional views of a mold for evaluating the filling property of a compound. [Figure 3] FIG. 3 is a schematic diagram of the upper surface of the mold shown in FIG. 2(a) and FIG. 2(b). [Figure 4] FIG. 4 is a schematic diagram of the upper surface of a molded body formed using the mold shown in FIG. 2(a), FIG. 2(b), and FIG. DETAILED DESCRIPTION OF THE INVENTION

[0018] Preferred embodiments of the present invention will be described below, but the present invention is not limited to the following embodiments.

[0019] <Compound Overview> The compound according to this embodiment includes at least a metal powder, an epoxy resin, and a wax. The metal powder is composed of a plurality (numerous) of metal particles. The metal powder may contain, for example, at least one selected from the group consisting of an elemental metal, an alloy, an amorphous powder, and a metallic chemical compound. The compound may further contain other components in addition to the metal powder, the epoxy resin, and the wax. For example, the compound may further contain a curing agent. The compound may further contain a curing accelerator. The compound may further contain an additive. The additive may be, for example, a coupling agent or a flame retardant. The "resin composition" described below refers to a component including an epoxy resin and a wax. The resin composition may be a component that may include an epoxy resin, a wax, a curing agent, a curing accelerator, and an additive, and may be the remaining components (non-volatile components) excluding the metal powder and the organic solvent.

[0020] The resin composition may adhere to the surface of each metal particle constituting the metal powder. The resin composition may cover a portion of the surface of each metal particle, or may cover the entire surface of the particle. The compound may include a metal powder and an uncured resin composition. The compound may include a metal powder and a semi-cured resin composition (e.g., a B-stage resin composition). The compound may include both an uncured resin composition and a semi-cured resin composition. The compound may be a powder. The compound may be a tablet. The compound may be a paste.

[0021] The wax contained in the compound includes at least one wax selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified Montan acid esters. The wax improves the fluidity of the compound. The wax also functions as a mold release agent. The metal salts of lauric acid, metal salts of stearic acid, and saponified Montan acid esters may each be metal soaps. The compound may include only one wax selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified Montan acid esters. The compound may include multiple waxes selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified Montan acid esters.

[0022] The metal powder content in the compound is 96% by mass or more but less than 100% by mass. The metal powder content in the compound may preferably be 96% by mass or more but less than 99.8% by mass, 96% by mass or more but less than 99% by mass, 96% by mass or more but less than 98% by mass, or 96.1% by mass or more but less than 97.5% by mass. As the metal powder content increases, the metal powder filling rate in the compound increases, and the relative permeability of the compound increases. Compounds with high relative permeability are suitable, for example, as sealing materials for inductors or as raw materials for inductor cores. However, if the metal powder content in a wax-free compound is 96% by mass or more, the fluidity of the compound significantly decreases. On the other hand, the compound according to this embodiment contains at least one wax selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid esters. As a result, even though the metal powder content in the compound is 96% by mass or more, the compound according to the present embodiment has superior fluidity to the conventional compound. For example, the compound according to the present embodiment can easily flow even when the height (depth) of the flow path in the compound is 1 mm or less. Even if the conventional compound contains a wax different from the wax described above and the total wax content in the conventional compound is the same as the total wax content in the compound according to the present embodiment, the fluidity of the conventional compound is significantly inferior to that of the compound according to the present embodiment.

[0023] If the metal powder content in a wax-free compound is 96% by mass or more, the compound is difficult to fill into a mold. On the other hand, the compound according to the present embodiment contains at least one wax selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid esters. As a result, despite the metal powder content being 96% by mass or more, the compound according to the present embodiment is superior to conventional compounds in terms of filling ability. For example, when a minute cavity on the scale of millimeters or less is formed in a mold, the compound according to the present embodiment is likely to fill the cavity uniformly. Even if the conventional compound contains a wax different from the waxes described above and the total wax content in the conventional compound is the same as the total wax content in the compound according to the present embodiment, the conventional compound is significantly inferior to the compound according to the present embodiment in terms of filling ability.

[0024] The decrease in fluidity of the compound is due to friction between the metal powder and the resin composition, and friction between the metal particles that make up the metal powder. When the metal powder content in the compound is 96% by mass or more, friction between the metal particles becomes significant. However, the metal salt of lauric acid, the metal salt of stearic acid, or the saponified Montan acid ester reduces friction between the metal particles. The mechanism by which friction between the metal particles is reduced is presumed to be as follows. Because the molecules of the metal salt of lauric acid, the metal salt of stearic acid, and the saponified Montan acid ester each contain a metal, polarization is likely to occur within each molecule. In other words, the molecules of the metal salt of lauric acid, the metal salt of stearic acid, and the saponified Montan acid ester each tend to have polarity. Therefore, the metal salt of lauric acid, the metal salt of stearic acid, and the saponified Montan acid ester are more likely to adsorb or coordinate to the surface of metal particles than other waxes. As a result, friction between the metal particles is reduced. Furthermore, the relatively long carbon chains of the metal salt of lauric acid, the metal salt of stearic acid, and the saponified montanic acid ester contribute to fluidity. For these reasons, the fluidity of the compound is improved. As the fluidity improves, the filling ability also improves. However, the mechanism by which the fluidity and filling ability of the compound are improved is not limited to the above mechanism.

[0025] As described above, the compound according to this embodiment has excellent fluidity and filling properties, and therefore the compound according to this embodiment flows through a narrow flow path and easily fills a minute cavity formed in a mold uniformly.

[0026] <Compound composition details> (wax) The saponified Montan acid ester may be a partially saponified Montan acid ester. The partially saponified Montan acid ester may be a mixture of a Montan acid ester and a metal salt of Montan acid. The partially saponified Montan acid ester may further contain an alcohol (e.g., glycerin). The alcohol is produced by saponification of the Montan acid ester. Saponification of the Montan acid ester may be expressed as hydrolysis of the Montan acid ester with an alkali. The saponified Montan acid ester (particularly the partially saponified Montan acid ester) is superior to the unsaponified Montan acid ester in terms of improving the fluidity and filling property of a compound having a metal powder content of 96% by mass or more. The saponification value of the partially saponified Montan acid ester may be 102 mg KOH / g or more and 122 mg KOH / g or less. Partially saponified montanic acid esters having a saponification value within the above range are superior to partially saponified montanic acid esters having a saponification value outside the above range in terms of improving the fluidity and filling property of compounds having a metal powder content of 96% by mass or more.

[0027] The saponified montanic acid ester may contain calcium. That is, the saponified montanic acid ester may contain calcium montanate. A saponified montanic acid ester containing calcium montanate is superior to a saponified montanic acid ester containing a metal salt other than calcium montanate in terms of improving the fluidity and filling property of a compound having a metal powder content of 96 mass% or more.

[0028] The wax may contain both a metal salt of lauric acid and a saponified Montan acid ester. A compound containing both a metal salt of lauric acid and a saponified Montan acid ester tends to have better fluidity than a compound containing only one selected from the group consisting of a metal salt of lauric acid, a metal salt of stearic acid, and a saponified Montan acid ester.

[0029] The mass of the metal salt of lauric acid in the compound is M L and the mass of the saponified Montan acid ester in the compound is M M and ML / M M The ratio may be 1 / 3 or more and 6 / 1 or less, preferably 1 / 2 or more and 4 / 1 or less, and more preferably 1.0 or more and 2.0 or less. As the content of metal powder in the compound increases, the mold releasability of the molded body formed from the compound tends to deteriorate. However, M L / M M When the content is within the above range, the molded article has improved releasability.

[0030] At least one selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid esters may contain zinc (Zn). In other words, the metal salt of lauric acid may be zinc laurate. The metal salt of stearic acid may be zinc stearate. The metal salt of montanic acid contained in the saponified montanic acid ester may be zinc montanate. Zinc laurate and zinc stearate are superior to other metal soaps in terms of improving the fluidity and filling properties of compounds having a metal powder content of 96% by mass or more.

[0031] At least one selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid esters (metal salts of montanic acid) may contain at least one selected from the group consisting of alkali metal elements and alkaline earth metal elements. The alkali metal element may be, for example, at least one selected from the group consisting of lithium (Li), sodium (Na), potassium (K), rubidium (Rb), and cesium (Ce). The alkaline earth metal element may be, for example, at least one selected from the group consisting of calcium (Ca), strontium (Sr), and barium (Ba). At least one selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid esters (metal salts of montanic acid) may contain at least one of aluminum (Al) and magnesium (Mg).

[0032] The total content of the metal salt of lauric acid, the metal salt of stearic acid, and the saponified montanic acid ester in the compound may be 2 parts by mass or more and 20 parts by mass or less, or 2 parts by mass or more and 15 parts by mass or less, relative to 100 parts by mass of the epoxy resin. When the total content of the metal salt of lauric acid, the metal salt of stearic acid, and the saponified montanic acid ester is within the above range, the fluidity and filling ability of the compound are likely to be improved, and the mechanical strength of a molded body formed from the compound is likely to be increased, and the releasability of the molded body is likely to be improved.

[0033] The compound may further contain other waxes in addition to the wax selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified Montan acid esters. The other waxes may be appropriately selected depending on the flowability, filling property, releasability, molding temperature and pressure of the compound, and the melting point, dropping point, melt viscosity, etc. of the wax.

[0034] For example, other waxes include carnauba wax, paraffin wax, amide wax, ester wax, microcrystalline wax, polyethylene, polypropylene, polyethylene oxide, grafted polyolefins, copolymers, lauric acid, stearic acid, montanic acid, 12-acetyloxystearic acid, 12-acetyloxystearic acid esters, metal salts of 12-acetyloxystearic acid, linoleic acid, linoleic acid esters, metal salts of linoleic acid, zinc 2-ethylhexanoate, stearic acid amide, oleic acid amide, erucic acid amide, behenic acid amide, palmitic acid amide, lauric acid amide, hydroxystearic acid amide, The amide may be at least one selected from the group consisting of methylene bisstearic acid amide, ethylene bisstearic acid amide, ethylene bislauric acid amide, distearyl adipamide, ethylene bisoleic acid amide, dioleyl adipamide, N-stearyl stearic acid amide, N-oleyl stearic acid amide, N-stearyl erucic acid amide, methylol stearic acid amide, methylol behenic acid amide, ethylene glycol, stearyl alcohol, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, silicone oil, silicone grease, fluorine-based oil, and fluorine-based grease.

[0035] (Resin composition) The resin composition functions as a binder for the metal particles that make up the metal powder, imparting mechanical strength to a molded body formed from the compound. For example, when the compound is molded under high pressure using a mold, the resin composition contained in the compound fills between the metal particles and binds the metal particles together. When the resin composition in the molded body is cured, the cured resin composition further firmly binds the metal particles together, resulting in a cured compound with excellent mechanical strength.

[0036] The content of the resin composition in the compound may be greater than 0% by mass and less than or equal to 4% by mass, preferably 0.2% by mass or more and 4% by mass or less, 1% by mass or more and 4% by mass or less, 2% by mass or more and 4% by mass or less, or 2.5% by mass or more and 3.9% by mass or less.

[0037] The resin composition contains at least an epoxy resin as a thermosetting resin. The inclusion of an epoxy resin, which has relatively excellent fluidity among thermosetting resins, improves the fluidity, filling property, storage stability, and moldability of the compound. However, the compound may contain other resins in addition to the epoxy resin, as long as the effects of the present invention are not impaired. For example, the resin composition may contain at least one of a phenolic resin and a polyamide-imide resin as a thermosetting resin. When the resin composition contains both an epoxy resin and a phenolic resin, the phenolic resin may function as a curing agent for the epoxy resin. The resin composition may further contain a thermoplastic resin in addition to the thermosetting resin. The thermoplastic resin may be, for example, at least one selected from the group consisting of acrylic resin, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyethylene terephthalate, and rubber (elastomer). The resin composition may also contain a silicone resin.

[0038] The epoxy resin may be, for example, a resin having two or more epoxy groups in one molecule. Examples of the epoxy resin include biphenyl-type epoxy resins, biphenylaralkyl-type epoxy resins, biphenylenearalkyl-type epoxy resins, stilbene-type epoxy resins, diphenylmethane-type epoxy resins, sulfur-containing epoxy resins, novolac-type epoxy resins, dicyclopentadiene-type epoxy resins, salicylaldehyde-type epoxy resins, naphthol- and phenol-copolymerized epoxy resins, epoxidized aralkyl-type phenolic resins, bisphenol-type epoxy resins, epoxy resins containing a bisphenol skeleton, glycidyl ether-type epoxy resins of alcohols, and glycidyl ether-type epoxy resins of paraxylylene and / or metaxylylene-modified phenolic resins. , glycidyl ether type epoxy resins of terpene-modified phenolic resins, cyclopentadiene type epoxy resins, glycidyl ether type epoxy resins of polycyclic aromatic ring-modified phenolic resins, glycidyl ether type epoxy resins of naphthalene ring-containing phenolic resins, glycidyl ester type epoxy resins, glycidyl or methylglycidyl type epoxy resins, alicyclic type epoxy resins, halogenated phenol novolac type epoxy resins, orthocresol novolac type epoxy resins, hydroquinone type epoxy resins, trimethylolpropane type epoxy resins, and linear aliphatic epoxy resins obtained by oxidizing an olefin bond with a peracid such as peracetic acid.

[0039] In terms of excellent fluidity, the epoxy resin may be at least one selected from the group consisting of biphenyl-type epoxy resins, orthocresol novolac-type epoxy resins, phenol novolac-type epoxy resins, bisphenol-type epoxy resins, epoxy resins having a bisphenol skeleton, salicylaldehyde novolac-type epoxy resins, and naphthol novolac-type epoxy resins.

[0040] The epoxy resin may be a crystalline epoxy resin. Although the molecular weight of the crystalline epoxy resin is relatively low, the crystalline epoxy resin has a relatively high melting point and excellent fluidity. The crystalline epoxy resin (highly crystalline epoxy resin) may be, for example, at least one selected from the group consisting of hydroquinone-type epoxy resin, bisphenol-type epoxy resin, thioether-type epoxy resin, and biphenyl-type epoxy resin. Commercially available crystalline epoxy resins include, for example, Epiclon 860, Epiclon 1050, Epiclon 1055, Epiclon 2050, Epiclon 3050, Epiclon 4050, Epiclon 7050, Epiclon HM-091, Epiclon HM-101, Epiclon N-730A, Epiclon N-740, Epiclon N-770, Epiclon N-775, Epiclon N-860 ... Clon N-865, Epiclon HP-4032D, Epiclon HP-7200L, Epiclon HP-7200, Epiclon HP-7200H, Epiclon HP-7200HH, Epiclon HP-7200HHH, Epiclon HP-4700, Epiclon HP-4710, Epiclon HP-4770, Epiclon HP-5000, Epiclon HP-6000, N 500P-2, and N500P-10 (all product names manufactured by DIC Corporation), NC-3000, NC-3000-L, NC-3000-H, NC-3100, CER-3000- L, NC-2000-L, XD-1000, NC-7000-L, NC-7300-L, EPPN-501H, EPPN-501HY, EPPN-502H, EOCN-1020, It may be at least one selected from the group consisting of EOCN-102S, EOCN-103S, EOCN-104S, CER-1020, EPPN-201, BREN-S, BREN-10S (all of which are trade names of Nippon Kayaku Co., Ltd.), YX-4000, YX-4000H, YL4121H, and YX-8800 (all of which are trade names of Mitsubishi Chemical Corporation).

[0041] In order to reduce the molding shrinkage of the compound, the resin composition may contain an isocyanate-modified epoxy resin as the epoxy resin. A commercially available isocyanate-modified epoxy resin may be, for example, AER-4001 manufactured by Asahi Kasei Corporation (formerly Asahi Kasei E-materials Corporation).

[0042] The resin composition may contain one type of epoxy resin from among the above. The resin composition may contain two or more types of epoxy resins from among the above.

[0043] Curing agents are classified into those that cure epoxy resins at temperatures ranging from low to room temperature, and heat-curing curing agents that cure epoxy resins when heated. Examples of curing agents that cure epoxy resins at temperatures ranging from low to room temperature include aliphatic polyamines, polyaminoamides, and polymercaptans. Examples of heat-curing curing agents include aromatic polyamines, acid anhydrides, phenol novolac resins, and dicyandiamide (DICY).

[0044] When a curing agent that cures an epoxy resin in the range from low temperature to room temperature is used, the glass transition point of the cured epoxy resin tends to be low and the cured epoxy resin tends to be soft. As a result, a molded body formed from the compound also tends to be soft. On the other hand, from the viewpoint of improving the heat resistance of the molded body, the curing agent may preferably be a heat-curing type curing agent, more preferably a phenolic resin, and even more preferably a phenolic novolac resin. In particular, by using a phenolic novolac resin as a curing agent, it is easy to obtain a cured epoxy resin with a high glass transition point. As a result, the heat resistance and mechanical strength of the molded body are easily improved.

[0045] The phenolic resin may be at least one selected from the group consisting of aralkyl phenolic resins, dicyclopentadiene phenolic resins, salicylaldehyde phenolic resins, novolac phenolic resins, copolymerized phenolic resins of benzaldehyde phenols and aralkyl phenols, paraxylylene and / or metaxylylene-modified phenolic resins, melamine-modified phenolic resins, terpene-modified phenolic resins, dicyclopentadiene naphthol resins, cyclopentadiene-modified phenolic resins, polycyclic aromatic ring-modified phenolic resins, biphenyl phenolic resins, and triphenylmethane phenolic resins. The phenolic resin may also be a copolymer composed of two or more of the above. Commercially available phenolic resins include, for example, Tamanol 758 manufactured by Arakawa Chemical Industries, Ltd. and HP-850N manufactured by Hitachi Chemical Co., Ltd.

[0046] The phenol novolac resin may be, for example, a resin obtained by condensing or co-condensing phenols and / or naphthols with aldehydes under an acidic catalyst. The phenols constituting the phenol novolac resin may be, for example, at least one selected from the group consisting of phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol. The naphthols constituting the phenol novolac resin may be, for example, at least one selected from the group consisting of α-naphthol, β-naphthol, and dihydroxynaphthalene. The aldehydes constituting the phenol novolac resin may be, for example, at least one selected from the group consisting of formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde.

[0047] The curing agent may be, for example, a chemical compound having two phenolic hydroxyl groups in one molecule. The chemical compound having two phenolic hydroxyl groups in one molecule may be, for example, at least one selected from the group consisting of resorcinol, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenols.

[0048] The resin composition may contain one type of phenolic resin from among the above. The resin composition may comprise multiple types of phenolic resins from among the above. The resin composition may contain one type of curing agent from among the above. The resin composition may contain multiple types of curing agents from among the above.

[0049] The ratio of active groups (phenolic OH groups) in the curing agent that react with epoxy groups in the epoxy resin may be preferably 0.5 to 1.5 equivalents, more preferably 0.6 to 1.4 equivalents, and even more preferably 0.8 to 1.2 equivalents per equivalent of epoxy groups in the epoxy resin. If the ratio of active groups in the curing agent is less than 0.5 equivalents, it is difficult to obtain a sufficient elastic modulus of the resulting cured product. On the other hand, if the ratio of active groups in the curing agent is more than 1.5 equivalents, the mechanical strength of a molded article formed from the compound after curing tends to decrease.

[0050] The curing accelerator is not limited as long as it is a composition that reacts with the epoxy resin to accelerate the curing of the epoxy resin. The curing accelerator may be, for example, an imidazole such as an alkyl group-substituted imidazole or benzimidazole. The resin composition may contain one type of curing accelerator. The resin composition may contain multiple types of curing accelerators. When the resin composition contains a curing accelerator, the moldability and releasability of the compound are likely to be improved. Furthermore, when the resin composition contains a curing accelerator, the mechanical strength of a molded product (e.g., electronic component) produced using the compound is improved, and the storage stability of the compound under high temperature and high humidity environments is improved. As a commercially available imidazole curing accelerator, for example, at least one selected from the group consisting of 2MZ-H, C11Z, C17Z, 1,2DMZ, 2E4MZ, 2PZ-PW, 2P4MZ, 1B2MZ, 1B2PZ, 2MZ-CN, C11Z-CN, 2E4MZ-CN, 2PZ-CN, C11Z-CNS, 2P4MHZ, TPZ, and SFZ (all of which are trade names manufactured by Shikoku Chemicals Corporation) may be used.

[0051] The amount of the curing accelerator to be added is not particularly limited as long as it is an amount that can achieve a curing acceleration effect. However, from the viewpoint of improving the curability and fluidity of the resin composition when absorbing moisture, the amount of the curing accelerator to be added may be preferably 0.1 to 30 parts by mass, more preferably 1 to 15 parts by mass, per 100 parts by mass of the epoxy resin. The content of the curing accelerator is preferably 0.001 to 5 parts by mass, per 100 parts by mass of the total mass of the epoxy resin and the curing agent (e.g., phenolic resin). If the amount of the curing accelerator to be added is less than 0.1 part by mass, it is difficult to achieve a sufficient curing acceleration effect. If the amount of the curing accelerator to be added exceeds 30 parts by mass, the storage stability of the compound is likely to decrease.

[0052] The coupling agent improves the adhesion between the resin composition and the metal particles constituting the metal powder, thereby improving the flexibility and mechanical strength of the molded body formed from the compound. The coupling agent may be, for example, at least one selected from the group consisting of silane-based compounds (silane coupling agents), titanium-based compounds, aluminum compounds (aluminum chelates), and aluminum / zirconium-based compounds. The silane coupling agent may be, for example, at least one selected from the group consisting of epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, acid anhydride silane, and vinyl silane. Aminophenyl-based silane coupling agents are particularly preferred. The resin composition may contain one or more of the above coupling agents. Commercially available coupling agents include, for example, vinyltrimethoxysilane (KBM-1003), vinyltriethoxysilane (KBE-1003), 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane (KBM-303), 3-glycidoxypropylmethyldimethoxysilane (KBM-402), 3-glycidoxypropyltrimethoxysilane (KBM-403), p-styryltrimethoxysilane (KBM-1403), 3-methacryloxypropylmethyldimethoxysilane (KBM-502), 3-methacryloxypropyltrimethoxysilane (KBM-503), and the like. ), 3-methacryloxypropylmethyldiethoxysilane (KBE-502), 3-methacryloxypropyltriethoxysilane (KBE-503), 3-acryloxypropyltrimethoxysilane (KBM-5103), N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane (KBM-602), N-2-(aminoethyl)-3-aminopropyltrimethoxysilane (KBM-603), 3-aminopropyltrimethoxysilane (KBM-903), 3-aminopropyltriethoxysilane (KBE-903), 3-triethoxysilyl-N-(1,3-Dimethyl-butylidene)propylamine (KBE-9103), N-phenyl-3-aminopropyltrimethoxysilane (KBM-573), N-vinylbenzyl-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride (KBM-575), tris-(trimethoxysilylpropyl)isocyanurate (KBM-9659), 3-ureidopropyltrialkoxysilane (KBE-585), 3-mercaptopropylmethyldimethoxysilane (KBM-802), 3-mercaptopropyltrimethoxysilane (KBM-803), 3-isocyanatopropyltriethoxysilane (KBM-9007), octenyltrimethoxysilane (KBM-1083), glycidoxyoctyltrimethoxysilane (KBM-4803), methacryloxyoctyltrimethoxysilane (KBM-5803), methyltrimethoxysilane (KBM-13), methyltriethoxysilane (KBE-13), dimethyldimethoxysilane (KBM-22), dimethyldiethoxysilane (KBE-22), phenyltrimethoxysilane (KBM-103), phenyltriethoxysilane (KBE-103), n-propyltrimethoxysilane (KBM-3033), n-propyltriethoxysilane (KBE-3033), hexyltrimethoxysilane (KBM-3063), hexyltriethoxysilane (KBE-3063), octyltriethoxysilane (KBE-3083), decyltrimethoxysilane (KBM-3103C), 1,The coupling agent may be at least one selected from the group consisting of 6-(trimethoxysilyl)hexane (KBM-3066), trifluoropropyltrimethoxysilane (KBM-7103), hexamethyldisilazane (SZ-31), and hydrolyzable group-containing siloxane (KPN-3504) (all of which are product names manufactured by Shin-Etsu Chemical Co., Ltd.). The coupling agent may be a silicone alkoxy oligomer (a silicone oligomer having an alkoxy group). The silicone alkoxy oligomer may have at least one alkoxy group selected from the group consisting of a methoxy group and an ethoxy group. The silicone alkoxy oligomer may have at least one organic substituent selected from the group consisting of an epoxy group, a methyl group, a mercapto group, an acryloyl group, a methacryloyl group, a vinyl group, and a phenyl group. The silicone alkoxy oligomer may be, for example, at least one selected from the group consisting of KR-517, X-41-1059A, X-24-9590, KR-516, X-41-1805, X-41-1818, X-41-1810, KR-513, X-40-9296, KR-511, KC-89S, KR-515, KR-500, X-40-9225, X-40-9246, X-40-9250, KR-41N, X-40-9227, KR-510, KR-9218, and KR-213 (all of which are trade names manufactured by Shin-Etsu Chemical Co., Ltd.).

[0053] The compound may contain a flame retardant to improve the environmental safety, recyclability, moldability, and low cost of the compound. The flame retardant may be, for example, at least one selected from the group consisting of bromine-based flame retardants, bulb flame retardants, hydrated metal compound-based flame retardants, silicone-based flame retardants, nitrogen-containing compounds, hindered amine compounds, organometallic compounds, and aromatic engineering plastics. The resin composition may contain one or more of the above flame retardants.

[0054] (metal powder) The metal powder may be referred to as a filler. The metal powder may contain, for example, at least one selected from the group consisting of an elemental metal and an alloy. The metal powder may be, for example, at least one selected from the group consisting of an elemental metal, an alloy, an amorphous powder, and a metal compound. The alloy may include at least one selected from the group consisting of a solid solution, a eutectic, and an intermetallic chemical compound. The alloy may be, for example, stainless steel (Fe-Cr alloy, Fe-Ni-Cr alloy, etc.). The metal powder may contain one metal element or multiple metal elements. The metal element contained in the metal powder may be, for example, a base metal element, a noble metal element, a transition metal element, or a rare earth element. The compound may contain one metal powder or multiple metal powders.

[0055] The metal element contained in the metal powder may be, for example, at least one selected from the group consisting of iron (Fe), copper (Cu), titanium (Ti), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), aluminum (Al), tin (Sn), chromium (Cr), barium (Ba), strontium (Sr), lead (Pb), silver (Ag), praseodymium (Pr), neodymium (Nd), samarium (Sm), and dysprosium (Dy). The metal powder may also contain elements other than metal elements. For example, the metal powder may contain oxygen (O), beryllium (Be), phosphorus (P), boron (B), or silicon (Si). The metal powder may be a magnetic powder. The metal powder may be a soft magnetic alloy or a ferromagnetic alloy. The metal powder may be, for example, a magnetic powder consisting of at least one selected from the group consisting of Fe-Si alloys, Fe-Si-Al alloys (Sendust), Fe-Ni alloys (Permalloy), Fe-Cu-Ni alloys (Permalloy), Fe-Co alloys (Permendur), Fe-Cr-Si alloys (electromagnetic stainless steel), Nd-Fe-B alloys (rare earth magnets), Sm-Fe-N alloys (rare earth magnets), and Al-Ni-Co alloys (Alnico magnets). The metal powder may also be a copper alloy such as a Cu-Sn alloy, a Cu-Sn-P alloy, a Cu-Ni alloy, or a Cu-Be alloy. The metal powder may consist of only one type of element or composition. The metal powder may also contain multiple types of elements or compositions.

[0056] The metal powder may be Fe elemental. The metal powder may be an alloy containing iron (Fe-based alloy). The Fe-based alloy may be, for example, an Fe-Si-Cr-based alloy or an Nd-Fe-B-based alloy. The metal powder may be at least one of amorphous iron powder and carbonyl iron powder. When the metal powder contains at least one of Fe elemental and an Fe-based alloy, it is easy to produce a compound with a high space factor and excellent magnetic properties. The metal powder may be an Fe amorphous alloy. As a commercially available product of Fe amorphous alloy powder, for example, at least one selected from the group consisting of AW2-08, KUAMET-6B2 (all of which are trade names of Epson Atmix Corporation), DAP MS3, DAP MS7, DAP MSA10, DAP PB, DAP PC, DAP MKV49, DAP 410L, DAP 430L, DAP HYB series (all of which are trade names of Daido Steel Co., Ltd.), MH45D, MH28D, MH25D, and MH20D (all of which are trade names of Kobe Steel, Ltd.) may be used.

[0057] The average particle size of the metal powder is not particularly limited, but may be, for example, 1 μm or more and 300 μm or less. The average particle size may be measured, for example, using a particle size distribution analyzer. The shape of the individual metal particles constituting the metal powder is not limited, but may be, for example, spherical, flat, prismatic, or acicular. The compound may contain multiple types of metal powder with different average particle sizes.

[0058] <Uses of the compound> The compound may be used for transfer molding. Transfer molding is a type of injection molding method for thermosetting resins. Transfer molding may also be referred to as pressure injection molding. Transfer molding may include the steps of heating and fluidizing the compound in a heating chamber, and supplying (pressurizing) the fluidized compound from the heating chamber into a mold through a casting runner. Transfer molding may include the steps of heating and fluidizing the compound in a heating chamber, supplying the fluidized compound powder from the heating chamber into a plunger, and supplying (pressurizing) the compound from the plunger into a mold through the runner. The compound according to this embodiment exhibits excellent fluidity and filling properties when heated, so it easily flows through a narrow runner and easily fills the space (cavity) in the mold evenly. Therefore, by processing the compound by transfer molding, it is possible to produce a molded product and a cured product with few defects such as voids or burrs. The compound may be molded by compression molding.

[0059] Depending on the composition or combination of metal powders contained in the compound, the properties (e.g., electromagnetic properties or magnetic properties) of the molded body and cured body formed from the compound can be freely controlled. Therefore, the molded body and cured body can be used for various industrial products or their raw materials. The molded body formed from the compound may contain at least one of an uncured resin composition and a B-stage resin composition (semi-cured resin composition). The molded body may consist only of the compound. The cured product of the compound or the cured product of the molded body may contain a C-stage resin composition (cured resin composition).

[0060] Industrial products manufactured using the compound may include, for example, automobiles, medical devices, electronic devices, electrical devices, information and communication devices, home appliances, audio equipment, and general industrial equipment. For example, when the compound contains a permanent magnet such as an Sm-Fe-N alloy or an Nd-Fe-B alloy as the metal powder, the compound may be used as a bonded magnet material. When the compound contains a soft magnetic material such as an Fe-Si-Cr alloy as the metal powder, the compound may be used as an inductor (e.g., an EMI filter) or a transformer material (e.g., a sealant or magnetic core). A molded product (e.g., a sheet) formed from the compound may be used as an electromagnetic wave shield.

[0061] <Compound manufacturing method> A compound can be obtained by mixing a metal powder and a resin composition while heating. For example, the metal powder and the resin composition can be kneaded using a kneader, roll, agitator, or the like while heating. By heating and mixing the metal powder and the resin composition, the resin composition adheres to part or all of the surface of each metal particle constituting the metal powder, coating each metal particle. By kneading, part or all of the epoxy resin in the resin composition can become semi-cured.

[0062] For example, a metal powder, an epoxy resin, a wax, a curing agent such as a phenolic resin, a curing accelerator, and a coupling agent may be kneaded together in a tank. After the metal powder and the coupling agent are mixed in the tank, the metal powder, the coupling agent, the wax, the epoxy resin, the curing agent, and the curing accelerator may be further kneaded in the tank. After the metal powder, the epoxy resin, the wax, the curing agent, and the coupling agent are kneaded in the tank, the mixture of these and the curing accelerator may be further kneaded in the tank. The epoxy resin, the wax, the curing agent, and the curing accelerator may be mixed in advance to prepare a resin mixed powder. The metal powder and the coupling agent may be mixed in advance to prepare a metal mixed powder. The metal mixed powder and the above-mentioned resin mixed powder may be kneaded to obtain a compound.

[0063] The kneading time depends on the type of kneading machine, the capacity of the kneading machine, and the amount of compound produced. The kneading time is, for example, preferably 1 minute or more, more preferably 2 minutes or more, and even more preferably 3 minutes or more. Furthermore, the kneading time is preferably 20 minutes or less, more preferably 15 minutes or less, and even more preferably 10 minutes or less. If the kneading time is less than 1 minute, the kneading is insufficient, the compound's moldability is impaired, and the degree of cure of the compound varies. If the kneading time exceeds 20 minutes, for example, the resin composition (e.g., epoxy resin and phenolic resin) is cured in the tank, which is likely to impair the fluidity, filling ability, and moldability of the compound. When the raw materials in the tank are kneaded using a kneader while being heated, the heating temperature may be, for example, a temperature at which a semi-cured epoxy resin (B-stage epoxy resin) is produced and the production of a cured epoxy resin (C-stage epoxy resin) is suppressed. The heating temperature may be lower than the activation temperature of the curing accelerator. The heating temperature is, for example, preferably 50° C. or higher, more preferably 60° C. or higher, and even more preferably 70° C. or higher. The heating temperature is preferably 150° C. or lower, more preferably 120° C. or lower, and even more preferably 110° C. or lower. When the heating temperature is within the above range, the resin composition in the tank softens and tends to coat the surfaces of the metal particles that make up the metal powder, making it easier to produce a semi-cured epoxy resin and to inhibit complete curing of the epoxy resin during kneading. [Example]

[0064] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples in any way.

[0065] Example 1 [Making the compound] 100g of biphenylene aralkyl epoxy resin, 38g of phenol novolac resin (curing agent), 2g of 2-undecylimidazole (curing accelerator), 2g of 2-ethyl-4-methylimidazole (curing accelerator), and 2.0g of zinc laurate (wax) were placed in a plastic container. The contents of the plastic container were mixed for 10 minutes to produce a resin mixture. The resin mixture corresponds to all components of the resin composition except for the coupling agent. As the biphenylene aralkyl type epoxy resin, NC-3000 (epoxy equivalent: 200 g / eq) manufactured by Nippon Kayaku Co., Ltd. was used. As the phenol novolac resin (curing agent), HP-850N (hydroxyl group equivalent: 106 g / eq) manufactured by Hitachi Chemical Co., Ltd. was used. As 2-undecylimidazole (curing accelerator), C11Z manufactured by Shikoku Chemicals Corporation was used. As 2-ethyl-4-methylimidazole (curing accelerator), 2E4MZ manufactured by Shikoku Chemicals Corporation was used. As zinc laurate (wax), Powder Base L manufactured by NOF Corporation was used. In Table 1 below, zinc laurate is represented as "ZnLa."

[0066] Amorphous iron powder 1 and amorphous iron powder 2 were uniformly mixed for 5 minutes in a pressure twin-screw kneader to produce a metal powder. The mass of amorphous iron powder 1 is shown in Table 1 below. The mass of amorphous iron powder 2 is shown in Table 1 below. The mass of the entire metal powder is the sum of the mass of amorphous iron powder 1 and the mass of amorphous iron powder 2. 9A4-II 075C03 manufactured by Epson Atmix Corporation was used as the amorphous iron powder 1. The average particle size of the amorphous iron powder 1 was 24 μm. AW2-08 manufactured by Epson Atmix Corporation was used as the amorphous iron powder 2. The average particle size of the amorphous iron powder 2 was 5.3 μm. The pressure twin-screw kneader used was a pressure twin-screw kneader manufactured by Nihon Spindle Mfg. Co., Ltd. The capacity of the pressure twin-screw kneader was 5 L.

[0067] 7.5 g of methacryloxyoctyltrimethoxysilane (coupling agent) and 30 g of caprolactone-modified dimethyl silicone (stress relaxation agent) were added to the metal powder in the twin-screw kneader. The contents of the twin-screw kneader were then heated to 90°C, and the contents were mixed for 10 minutes while maintaining that temperature. The resin mixture was then added to the contents of the twin-screw kneader, and the contents were kneaded for 15 minutes while maintaining the temperature at 120°C. The resulting kneaded mixture was then cooled to room temperature and pulverized with a hammer until it reached the desired particle size. As methacryloxyoctyltrimethoxysilane, KBM-5803 manufactured by Shin-Etsu Chemical Co., Ltd. was used. As the caprolactone-modified dimethyl silicone (stress relaxation agent), DBL-C32 manufactured by Gelest Co., Ltd. was used.

[0068] By the above method, the compound of Example 1 was produced. The content of metal powder in the compound was 96.5 mass %.

[0069] [Liquidity evaluation] The fluidity of the compound of Example 1 was evaluated using a flow tester according to the following method. The flow tester used was a CFT-100 manufactured by Shimadzu Corporation. FIG. 1 is a schematic cross-sectional view of a flow tester 10. The flow tester 10 includes a cylinder 2, a heater 5 surrounding the side of the cylinder 2, and a plunger 6 fitted into the cylinder 2. The plunger 6 is inserted into the cylinder 2 through an opening 3. A circular discharge hole 4 (orifice) is formed at the end of the cylinder 2 opposite the opening 3. The inner diameter of the discharge hole 4 is 1 mm. A tablet-shaped compound 1 made of the compound was prepared by molding 7 g of compound. The compound 1 was placed in the cylinder 2. The compound 1 in the cylinder 2 was preheated to 130°C for 20 seconds using the heater 5. Following preheating, the plunger 6 was pushed into the cylinder 2, and the compound 1 in the cylinder 2 was pressurized by the plunger 6. The load applied by the plunger 6 to the compound 1 was 100 kg. The time when the compound started to flow out of the discharge hole 4 is represented as t0. The time when the compound stopped flowing out of the discharge hole 4 is represented as t1. The flow time T is defined as t1-t0. The flow stroke L is defined as the distance traveled by the plunger 6 during the flow time T.

[0070] Using the above methods, the flow time T and flow stroke L of the compound of Example 1 were measured. The measurement results are shown in Table 1 below. Excellent fluidity of a compound means a short flow time T and a long flow stroke L. In other words, the larger the L / T, the better the fluidity of the compound.

[0071] (Evaluation of filling ability) The filling property of the compound of Example 1 was evaluated by the following method. Figures 2(a) and 2(b) are schematic cross-sectional views of a mold 20 used in the evaluation of filling property. Figure 3 is a schematic top view of the mold 20. The cross sections shown in Figures 2(a) and 2(b) are parallel to the vertical direction. The mold 20 includes a lower mold 19, a frame 21 placed on the lower mold 19, and an upper mold 17 overlapping the frame 21. The surface of the frame 21 is coated with silver (Ag). A cavity 14 (space) is formed within the mold 20. The overall dimensions of the cavity 14 are approximately 49.4 mm × 43.4 mm. 168 cylindrical protrusions 15 are formed in a lattice pattern on the surface of the upper mold 17 facing the frame 21. The end faces of each protrusion 15 of the upper mold 17 contact the surface of the frame 21, resulting in 168 cylindrical protrusions 15 arranged in a grid pattern within the cavity 14. Fourteen protrusions 15 are equally spaced horizontally within the cavity 14, and 12 protrusions 15 are equally spaced vertically within the cavity 14. The spacing between a pair of protrusions 15 aligned horizontally is 3.2 mm. The spacing between a pair of protrusions 15 aligned vertically is also 3.2 mm. The spacing between a pair of protrusions 15 can be rephrased as the distance between the central axes of the cylindrical protrusions 15. The thickness (diameter) of each protrusion 15 is 2.4 mm. The height of each protrusion 15 is approximately 300 μm. In other words, the depth of the cavity 14 is approximately 300 μm. The depth of the cavity 14 corresponds to the thickness of the molded body 1a formed from the compound 1 using the mold 20. The frame 21 has a thickness of 200 μm. The cavity 14 communicates with the storage chamber 11 via a plurality of gates 12 (flow paths) arranged in the lateral (horizontal) direction. The compound 1 is stored in the storage chamber 11. The minimum height of each gate 12 is 200 μm. In other words, the minimum width of each gate 12 in the vertical direction is 200 μm. The width of each gate 12 in the horizontal direction is 800 μm. A plurality of vents 13 (grooves) communicating with the cavity 14 are formed on the side of the mold 20 opposite the gates 12. The depth of each vent 13 is 10 μm.

[0072] Transfer molding was performed using the mold 20 described above. In the transfer molding, the entire mold 20, including the storage chamber 11, was heated at 140°C for 360 seconds while the compound 1 in the storage chamber 11 was pressurized. The compound 1 was pressurized at 20 MPa. The heating and pressurization caused the compound 1 in the storage chamber 11 to fluidize. The fluidized compound 1 flowed through the gate 12 and was then filled into the cavity 14. A molded body was obtained by the above transfer molding. FIG. 4 is a schematic top view of a molded body 1a formed from the compound 1. In the transfer molding, the compound 1 was filled between the multiple protrusions 15 in the cavity 14, so that multiple through holes 16 were formed in the molded body 1a. The shape, arrangement, and number of the through holes 16 correspond to the shape, arrangement, and number of the protrusions 15 in the cavity 14. In other words, the total number N of through holes 16 formed in the molded body 1a is equal to the total number N' of protrusions 15 in the cavity 14. The number n of through holes 16 with no defects on the inner walls and edges of the through holes 16 was counted. The filling rate of the compound 1 is defined as 100×n / N%. The smaller the gap between the compound 1 in the cavity 14 and the mold 20, the fewer defects there are in the molded body 1a, and the higher 100×n / N% is. In other words, the higher 100×n / N%, the better the compound's filling ability. The filling rate of Example 1 is shown in Table 1 below.

[0073] (Evaluation of releasability) The releasability of the compound of Example 1 was evaluated by the following method.

[0074] After forming the molded body 1a by the above method, the molded body 1a was released from the mold 20 (surface of the frame 21). The releasability of the compound refers to the property of the compound 1 derived from the molded body 1a not remaining in the cavity 14 after the molded body 1a is released from the mold 20. In other words, the releasability of the compound refers to the property of the compound 1 derived from the molded body 1a not remaining on the surface of the frame 21 after the molded body 1a is released from the frame 21. The evaluation of the releasability of Example 1 is shown in Table 1 below. A in Table 1 means that the compound 1 derived from the molded body 1a did not remain in the cavity 14. In other words, A means that the molded body 1a was released from the cavity 14 without being damaged. B in Table 1 means that the percentage of the area of the portion of the entire surface of the frame 21 where the compound 1 derived from the molded body 1a remained was greater than 0% and less than 50%.

[0075] Example 2 The mass of zinc laurate used in preparing the resin mixture of Example 2 was 4.0 g. The mass of amorphous iron powder 1 used in Example 2 is shown in Table 1 below. The mass of amorphous iron powder 2 used in Example 2 is shown in Table 1 below. The mass of the total metal powder in Example 2 is shown in Table 1 below. Except for these details, the compound of Example 2 was prepared in the same manner as Example 1. The flowability, filling property, and demolding property of the compound of Example 2 were evaluated in the same manner as Example 1. The evaluation results of Example 2 are shown in Table 1 below.

[0076] Example 3 In preparing the resin mixture of Example 3, zinc stearate was used instead of zinc laurate. The mass of zinc stearate used in preparing the resin mixture of Example 3 was 4.0 g. Zinc stearate manufactured by NOF Corporation was used as the zinc stearate. In Table 1 below, zinc stearate is abbreviated as "ZnSt." The mass of amorphous iron powder 1 used in Example 3 is shown in Table 1 below. The mass of amorphous iron powder 2 used in Example 3 is shown in Table 1 below. The total mass of the metal powder in Example 3 is shown in Table 1 below. Except for these details, the compound of Example 3 was prepared in the same manner as Example 1. The fluidity, filling property, and demolding property of the compound of Example 3 were evaluated in the same manner as Example 1. The evaluation results of Example 3 are shown in Table 1 below.

[0077] Example 4 In preparing the resin mixture of Example 4, a partially saponified Montan acid ester was used instead of zinc laurate. The mass of the partially saponified Montan acid ester used in preparing the resin mixture of Example 4 was 4.0 g. Licowax OP manufactured by Clariant Chemicals Co., Ltd. was used as the partially saponified Montan acid ester. Licowax OP is a Montan acid ester partially saponified with calcium hydroxide. The saponification value of Licowax OP is 102 mg KOH / g or more and 122 mg KOH / g or less. The mass of amorphous iron powder 1 used in Example 4 is shown in Table 1 below. The mass of amorphous iron powder 2 used in Example 4 is shown in Table 1 below. The mass of the total metal powder in Example 4 is shown in Table 1 below. The compound of Example 4 was prepared in the same manner as Example 1, except for these details. The fluidity, filling property, and demolding property of the compound of Example 4 were evaluated in the same manner as Example 1. The evaluation results of Example 4 are shown in Table 1 below.

[0078] Example 5 The mass of the partially saponified Montanic acid ester used in preparing the resin mixture of Example 5 was 8.0 g. The mass of amorphous iron powder 1 used in Example 5 is shown in Table 1 below. The mass of amorphous iron powder 2 used in Example 5 is shown in Table 1 below. The mass of the total metal powder in Example 5 is shown in Table 1 below. Except for these details, the compound of Example 5 was prepared in the same manner as in Example 4. The flowability, filling property, and demolding property of the compound of Example 5 were evaluated in the same manner as in Example 1. The evaluation results of Example 5 are shown in Table 1 below.

[0079] Example 6 In preparing the resin mixture of Example 6, a partially saponified Montan acid ester was used in addition to zinc laurate. The partially saponified Montan acid ester used in Example 6 was the above-mentioned Licowax OP. The mass of zinc laurate used in preparing the resin mixture of Example 6 was 4.0 g. The mass of partially saponified Montan acid ester used in preparing the resin mixture of Example 6 was 2.0 g. The mass of amorphous iron powder 1 used in Example 6 is shown in Table 1 below. The mass of amorphous iron powder 2 used in Example 6 is shown in Table 1 below. The mass of the total metal powder in Example 6 is shown in Table 1 below. Except for these details, the compound of Example 6 was prepared in the same manner as Example 1. The fluidity, filling property, and demolding property of the compound of Example 6 were evaluated in the same manner as Example 1. The evaluation results of Example 6 are shown in Table 1 below.

[0080] Example 7 The mass of zinc laurate used in preparing the resin mixture of Example 7 was 4.0 g. The mass of partially saponified montanic acid ester used in preparing the resin mixture of Example 7 was 4.0 g. The mass of amorphous iron powder 1 used in Example 7 is shown in Table 1 below. The mass of amorphous iron powder 2 used in Example 7 is shown in Table 1 below. The mass of the total metal powder in Example 7 is shown in Table 1 below. Except for these details, the compound of Example 7 was prepared in the same manner as in Example 6. The fluidity, filling property, and demolding property of the compound of Example 7 were evaluated in the same manner as in Example 1. The evaluation results of Example 7 are shown in Table 1 below.

[0081] (Comparative Example 1) In preparing the resin mixture of Comparative Example 1, Montan acid ester (natural wax) was used instead of zinc laurate. The mass of Montan acid ester used in preparing the resin mixture of Comparative Example 1 was 4.0 g. As the Montan acid ester, Licowax E manufactured by Clariant Chemicals Co., Ltd. was used. The mass of amorphous iron powder 1 used in Comparative Example 1 is shown in Table 1 below. The mass of amorphous iron powder 2 used in Comparative Example 1 is shown in Table 1 below. The mass of the total metal powder in Comparative Example 1 is shown in Table 1 below. Depending on the blending ratio of the metal mixed powder and the resin mixed powder, the content of metal powder in the compound of Comparative Example 1 was adjusted to 95.5 mass%. Except for these details, the compound of Comparative Example 1 was prepared in the same manner as in Example 1. The fluidity, filling property, and demolding property of the compound of Comparative Example 1 were evaluated in the same manner as in Example 1. The evaluation results of Comparative Example 1 are shown in Table 1 below.

[0082] (Comparative Example 2) The mass of Montanic acid ester (Licowax E) used to prepare the resin mixture of Comparative Example 2 was 8.0 g. The mass of amorphous iron powder 1 used in Comparative Example 2 is shown in Table 1 below. The mass of amorphous iron powder 2 used in Comparative Example 2 is shown in Table 1 below. The mass of the total metal powder in Comparative Example 2 is shown in Table 1 below. The content of metal powder in the compound of Comparative Example 2 was adjusted to 96.0 mass% depending on the blending ratio of the metal mixed powder and the resin mixed powder. Except for these details, the compound of Comparative Example 2 was prepared in the same manner as Comparative Example 1. The fluidity and filling property of the compound of Comparative Example 2 were evaluated in the same manner as Example 1. However, the compound of Comparative Example 2 hardly flowed. The compound of Comparative Example 2, which had poor fluidity, was not filled into the mold. Therefore, the flow time, flow stroke, and filling rate of the compound of Comparative Example 2 could not be measured. The mold release property of the compound of Comparative Example 2 was not evaluated.

[0083] (Comparative Example 3) The mass of amorphous iron powder 1 used in Comparative Example 3 is shown in Table 1 below. The mass of amorphous iron powder 2 used in Comparative Example 3 is shown in Table 1 below. The mass of the total metal powder in Comparative Example 3 is shown in Table 1 below. The content of metal powder in the compound of Comparative Example 3 was adjusted to 96.5 mass% depending on the blending ratio of the metal mixed powder and the resin mixed powder. Except for these details, the compound of Comparative Example 3 was prepared in the same manner as Comparative Example 2. The fluidity and filling property of the compound of Comparative Example 3 were evaluated in the same manner as Example 1. However, the compound of Comparative Example 3 hardly flowed. The compound of Comparative Example 3, which had poor fluidity, was not filled into the mold. Therefore, the flow time, flow stroke, and filling rate of the compound of Comparative Example 3 could not be measured. The releasability of the compound of Comparative Example 3 was not evaluated.

[0084] Comparative Example 4 In preparing the resin mixture of Comparative Example 4, carnauba wax (natural wax) was used instead of zinc laurate. The mass of the carnauba wax used in preparing the resin mixture of Comparative Example 4 was 8.0 g. Carnauba No. 1 manufactured by Cerarica NODA Co., Ltd. was used as the carnauba wax. The mass of amorphous iron powder 1 used in Comparative Example 4 is shown in Table 1 below. The mass of amorphous iron powder 2 used in Comparative Example 4 is shown in Table 1 below. The mass of the total metal powder in Comparative Example 4 is shown in Table 1 below. Except for these details, the compound of Comparative Example 4 was prepared in the same manner as in Example 1. The fluidity and filling property of the compound of Comparative Example 4 were evaluated in the same manner as in Example 1. However, the compound of Comparative Example 4 hardly flowed. The compound of Comparative Example 4 had poor fluidity and was not filled into the mold. Therefore, the flow time, flow stroke, and filling rate of the compound of Comparative Example 4 could not be measured. The release property of the compound of Comparative Example 4 was not evaluated.

[0085] (Comparative Example 5) In preparing the resin mixture of Comparative Example 5, a biphenyl-type epoxy resin was used in addition to a biphenyl-type epoxy resin (NC-3000). The biphenyl-type epoxy resin used was YX-4000H (epoxy equivalent: 192 g / eq) manufactured by Mitsubishi Chemical Corporation. The mass of the biphenyl-type epoxy resin (NC-3000) used in Comparative Example 5 was 90 g. The mass of the biphenyl-type epoxy resin (YX-4000H) used in Comparative Example 5 was 10 g. The mass of 2-ethyl-4-methylimidazole (2E4MZ) used in preparing the resin mixture of Comparative Example 5 was 1.9 g. In preparing the resin mixture of Comparative Example 5, polyethylene (synthetic wax) was used instead of zinc laurate. The mass of polyethylene used in preparing the resin mixture of Comparative Example 5 was 8.0 g. Ricothene PE3101TP manufactured by Clariant Chemicals Co., Ltd. was used as the polyethylene. The mass of amorphous iron powder 1 used in Comparative Example 5 is shown in Table 1 below. The mass of amorphous iron powder 2 used in Comparative Example 5 is shown in Table 1 below. The mass of the total metal powder in Comparative Example 5 is shown in Table 1 below. Except for these details, the compound of Comparative Example 5 was prepared in the same manner as in Example 1. The fluidity and filling property of the compound of Comparative Example 5 were evaluated in the same manner as in Example 1. However, the compound of Comparative Example 5 hardly flowed. The compound of Comparative Example 5, which had poor fluidity, was not filled into the mold. Therefore, the flow time, flow stroke, and filling rate of the compound of Comparative Example 5 could not be measured. The releasability of the compound of Comparative Example 5 was not evaluated.

[0086] [Table 1]

[0087] The metal powder content was less than 96% by mass in Comparative Example 1. As a result, Comparative Example 1 had fluidity and filling properties despite not containing any of a metal salt of lauric acid, a metal salt of stearic acid, and a saponified montanic acid ester.

[0088] The metal powder content was 96% by mass or more in all of Examples 1 to 7 and Comparative Examples 2 to 4. However, Comparative Examples 2 to 4 lacked fluidity and filling properties despite containing wax. On the other hand, Examples 1 to 7 contained either a metal salt of stearic acid or a saponified montanic acid ester, and therefore had fluidity and filling properties. [Industrial Applicability]

[0089] The compound according to the present invention has excellent fluidity and filling properties, and therefore can be molded to produce industrial products of various shapes, such as inductors. [Explanation of symbols]

[0090] 1...compound, 1a...molded body, 2...cylinder, 3...opening, 4...discharge hole, 5...heater, 6...plunger, 10...flow tester, 11...container chamber, 12...gate (flow path), 13...vent, 14...cavity, 15...protrusion, 16...through hole, 20...mold

Claims

1. A compound containing metal powder, epoxy resin, wax, and a curing accelerator, the metal powder is a soft magnetic material, The content of the metal powder is 96% by mass or more and less than 100% by mass, the wax contains at least one selected from the group consisting of a metal salt of lauric acid, a metal salt of stearic acid, and a saponified montanic acid ester; the total content of the metal salt of lauric acid, the metal salt of stearic acid, and the saponified montanic acid ester in the compound is 2 parts by mass or more and 20 parts by mass or less per 100 parts by mass of the epoxy resin, Used in transfer molding, Compound.

2. the amount of the curing accelerator is 0.1 parts by mass or more and 30 parts by mass or less relative to 100 parts by mass of the epoxy resin; The compound of claim 1.

3. The curing accelerator comprises at least one selected from the group consisting of 2-undecylimidazole and 2-ethyl-4-methylimidazole.

3. The compound according to claim 1 or 2.

4. The epoxy resin includes a biphenyl aralkyl epoxy resin. The compound according to any one of claims 1 to 3.

5. further comprising a curing agent; the curing agent comprises a phenolic novolac resin; A compound according to any one of claims 1 to 4.

6. further comprising a coupling agent; the coupling agent comprises methacryloxyoctyltrimethoxysilane; A compound according to any one of claims 1 to 5.

7. further comprising a stress relief agent; The stress relaxation agent contains caprolactone-modified dimethyl silicone. A compound according to any one of claims 1 to 6.

8. The wax contains the metal salt of lauric acid and the saponified montanic acid ester. A compound according to any one of claims 1 to 7.

9. At least one selected from the group consisting of a metal salt of lauric acid, a metal salt of stearic acid, and a saponified montanic acid ester contains zinc. A compound according to any one of claims 1 to 7.

10. the at least one selected from the group consisting of the metal salt of lauric acid, the metal salt of stearic acid, and the saponified montanic acid ester contains at least one selected from the group consisting of an alkali metal element and an alkaline earth metal element; A compound according to any one of claims 1 to 7.

11. The saponified montanic acid ester contains calcium. A compound according to any one of claims 1 to 7.

12. The saponified Montan acid ester is a partially saponified Montan acid ester. A compound according to any one of claims 1 to 11.

13. The saponification value of the partially saponified Montan acid ester is 102 mg KOH / g or more and 122 mg KOH / g or less. The compound of claim 12.

14. Comprising a compound according to any one of claims 1 to 13, Molded body.

15. A cured product of the compound according to any one of claims 1 to 13.

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