Substrate device manufacturing method and manufacturing device

Abstract

To provide a manufacturing method of a substrate device that can suppress the characteristics difference of adjacently mounted elements on a substrate compared to a case not taking into account the distance on the wafer between a first element mounted on the substrate and an element mounted on the substrate adjacent to the first element.SOLUTION: A manufacturing method of a substrate device includes a first step of holding a first element cut out from a wafer and mounting the first element on a substrate, and a second step of gripping a third element that is cut out from the wafer and in which a distance between the first element and the third element is within a predetermined range on the wafer, and mounting the third element on the substrate adjacent to the first element when the distance between the second element cut out from the wafer and the first element is outside the predetermined range on the wafer.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a method and apparatus for manufacturing a substrate device. [Background technology]

[0002] Patent Document 1 discloses a method for manufacturing a substrate device, which includes a first step of placing a plurality of elements cut out from a wafer and having functional parts formed at one end thereof on a plurality of mounting parts while maintaining the orientation of the functional parts on the wafer, and a second step of rotating one mounting part relative to the other mounting parts so that the functional parts are oriented differently from each other, and then placing the elements on the one mounting part and the other mounting parts on a substrate while maintaining the orientation of the functional parts on the mounting parts. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6555100 Summary of the Invention [Problem to be solved by the invention]

[0004] If elements whose distance on the wafer is outside a predetermined range are mounted adjacent to each other on the substrate, the difference in characteristics between the elements may exceed the acceptance criteria.

[0005] The present invention aims to provide a manufacturing method and manufacturing apparatus for a substrate device that can reduce the difference in characteristics between elements mounted adjacent to each other on a substrate, compared to a method that does not take into account the distance on the wafer between a first element mounted on a substrate and an element mounted adjacent to the first element on the substrate. [Means for solving the problem]

[0006] A manufacturing method for a substrate device according to a first embodiment includes a first step of grasping a first element cut out from a wafer and mounting the first element on a substrate; and, if the distance between a second element cut out from the wafer and the first element is outside a predetermined range on the wafer, a second step of grasping a third element cut out from the wafer and the distance between the third element and the first element is within the predetermined range on the wafer, and mounting the third element on the substrate adjacent to the first element.

[0007] In the method for manufacturing a substrate device according to the second aspect, the order in which the elements cut out from the wafer are grasped is determined in advance, and the second step includes a step of grasping the second element and discarding the second element if the distance between the first element and the second element on the wafer is outside a predetermined range.

[0008] In the manufacturing method for a substrate device according to the third aspect, the order in which the elements cut out from the wafer are gripped is predetermined, and in the second step, when the distance between the first element and the second element on the wafer is outside a predetermined range, the third element is gripped without gripping the second element.

[0009] In the fourth aspect of the method for manufacturing a substrate device, the distance is determined by the difference between the distance between the center of gravity of the wafer and the center of gravity of one element on the wafer and the distance between the center of gravity of the wafer and the center of gravity of another element on the wafer.

[0010] In the method for manufacturing a substrate device according to the fifth aspect, the distance is defined by the distance between the center of gravity of one element on the wafer and the center of gravity of another element on the wafer.

[0011] A manufacturing apparatus according to a sixth embodiment includes a supply unit that supplies elements to be mounted on a substrate from a plurality of elements cut out from a wafer, and a transfer device that transfers the elements using a gripping tool for gripping the elements in the supply unit, wherein the supply unit has a moving mechanism that moves the elements for gripping by the gripping tool, and after the transfer device transfers a first element of the plurality of elements for mounting on the substrate, if the distance between a second element of the plurality of elements and the first element is outside a predetermined range on the wafer and the distance between a third element of the plurality of elements and the first element is within the predetermined range on the wafer, the moving mechanism moves the third element to a position where the gripping tool can grip the third element.

[0012] The manufacturing apparatus according to the seventh embodiment includes an element positioning device that positions the element transferred by the transfer device, a substrate positioning device that positions the substrate, and another transfer device that transfers the element in the element positioning device to the substrate in the substrate positioning device and mounts the element on the substrate. [Effects of the Invention]

[0013] According to the manufacturing method for a substrate device of the first aspect, the characteristic difference between elements mounted adjacent to the first element on the substrate can be reduced compared to a method that does not take into account the distance on the wafer between the first element and an element mounted adjacent to the first element.

[0014] According to the method for manufacturing a substrate device according to the second aspect, when the order in which elements are held is predetermined, elements that are not used can be discarded.

[0015] According to the manufacturing method of the substrate device of the third aspect, when the order in which the elements are held is predetermined, the third element can be mounted on the substrate in a shorter time than when unused elements are discarded.

[0016] According to the manufacturing method of the substrate device of the fourth aspect, the difference in characteristics between adjacent elements mounted on the substrate can be reduced compared to when the relative distance on the wafer between adjacent elements mounted on the substrate is used as the distance.

[0017] According to the manufacturing method of the substrate device of the fifth aspect, it is possible to easily manage element information compared to a case where the difference in distance between adjacent elements mounted on the substrate and the center of gravity of the wafer is used as the distance.

[0018] According to the manufacturing apparatus of the sixth aspect, the difference in characteristics between adjacent elements mounted on a substrate can be reduced compared to a case where the distance on the wafer between the first element and the element mounted adjacent to the first element is not taken into consideration.

[0019] According to the manufacturing apparatus of the seventh aspect, elements with reduced characteristic differences can be mounted adjacent to each other on a substrate, compared to when the distance on the wafer between the first element and the element mounted adjacent to the first element is not taken into consideration. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a plan view showing a light emitting substrate device according to an embodiment of the present invention; [Figure 2] 1 is a side cross-sectional view showing a light emitting substrate device according to an embodiment of the present invention. [Figure 3] 1 is a perspective view showing a part of a manufacturing apparatus according to an embodiment of the present invention. [Figure 4] 1 is a perspective view showing a part of a manufacturing apparatus according to an embodiment of the present invention. [Figure 5] 1 is a diagram showing a push-up mechanism according to an embodiment of the present invention; [Figure 6] 1 is a side cross-sectional view showing a grip portion according to an embodiment of the present invention. [Figure 7] 1A to 1C are diagrams illustrating steps for manufacturing a light-emitting element according to an embodiment of the present invention. [Figure 8] 1 is a perspective view showing an array of light emitting elements cut out from a wafer according to an embodiment of the present invention. [Figure 9] 1 is a side cross-sectional view showing a state in which a light emitting element according to an embodiment of the present invention is pushed up by a needle. [Figure 10] 1 is a perspective view showing an array of light emitting elements cut out from a wafer according to an embodiment of the present invention. [Figure 11] FIG. 10 is a plan view showing a state in which one tray is rotated relative to the other tray. [Figure 12] FIG. 10 is a plan view showing the distance between light-emitting elements in sections for the light-emitting elements on a wafer. [Figure 13] 10 is a plan view showing the gripping order from the light emitting element consumed in one tray and the gripping order from another tray in the embodiment. FIG. [Figure 14] FIG. 10 is a perspective view showing a part of a manufacturing apparatus according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0021] An example of an embodiment of the present invention will be described with reference to the drawings. First, a light emitting substrate device 100 will be described as an example of a substrate device. Next, a manufacturing apparatus 10 for manufacturing the light emitting substrate device 100, a manufacturing method for manufacturing the light emitting substrate device 100, and the operation of this embodiment will be described.

[0022] In the following explanation, the X direction, -X direction, Y direction, -Y direction, Z direction (upward), and -Z direction (downward) are the directions indicated by the arrows in the drawings. The X (-X) direction (horizontal direction), Y (-Y) direction (horizontal direction), and Z (-Z) direction (vertical direction) are directions that intersect with each other (specifically, directions that are perpendicular to each other).

[0023] In addition, in the figures, a symbol with a cross mark "x" inside a "circle" means an arrow pointing from the front to the back of the page. In addition, a symbol with a dot mark "·" inside a "circle" means an arrow pointing from the back to the front of the page. In addition, the dimensional ratios in the X, Y, and Z directions between each part of each component shown in each figure, and the dimensional ratios in the X, Y, and Z directions between each component may differ from the actual dimensional ratios.

[0024] (First embodiment) [Light emitting substrate device 100] First, the configuration of a light emitting substrate device 100 (an example of a substrate device) will be described. The configuration of the light emitting substrate device 100 is shown in Fig. 1 and Fig. 2. Specifically, Fig. 1 shows a portion (one end side) of the light emitting substrate device 100. Fig. 2 also shows a portion of a side cross-sectional view of the light emitting substrate device 100.

[0025] 1 and 2, the light emitting substrate device 100 has a printed circuit board 102 (an example of a substrate) and a light emitting element 200 (an example of an element) placed (mounted) on the printed circuit board 102. As shown in FIG. 1, the printed circuit board 102 extends (extends) in the X direction, for example, and is formed in a plate shape. In this embodiment, placing the light emitting element 200 on the printed circuit board 102 may be referred to as "mounting."

[0026] As shown in Fig. 1, each of the light emitting elements 200 is, for example, a light emitting element (e.g., an LED chip) formed long in the X direction. As shown in Fig. 2, the light emitting element 200 has a T-shaped cross section (cross-sectional shape) intersecting the longitudinal direction (X direction). The light emitting element 200 has a head 210 that forms the horizontal bar of the T, and legs 250 that form the vertical bar of the T.

[0027] Head 210 has protruding portions 213, 214 that protrude in the left-right directions (Y, -Y directions) from leg portion 250 in a side cross-sectional view (as viewed in the -X direction). Therefore, in a side cross-sectional view, the left-right width (length in the Y direction) of leg portion 250 is narrower than the left-right width of head 210. Due to this difference in width, the area of lower surface 259 of leg portion 250 is smaller than the area of surface (upper surface) 219 of head 210.

[0028] Light-emitting points 218 and a circuit pattern (not shown) are provided on a surface 219 of the head 210. The light-emitting element 200 has a plurality of light-emitting points 218, which are arranged along the X direction (longitudinal direction) on one end of the surface 219 of the head 210 (specifically, on the surface of the protruding portion 213). Note that in each drawing, the plurality of light-emitting points 218 may be indicated by solid lines (218 shown in FIG. 1).

[0029] The height (length in the Z direction) of the light emitting element 200 in a cross section intersecting the longitudinal direction (length in the X direction) is greater than the length in the width direction (length in the Y direction). Specifically, the dimensions of the light emitting element 200 are, for example, a length (length in the X direction) of 6 mm, a height (length in the Z direction) of 300 μm, a width (length in the Y direction) of the head portion 210 of 130 μm, and a width (length in the Y direction) of the leg portion 250 of 100 μm. Note that the dimensions of the light emitting element 200 are not limited to the above dimensions.

[0030] 2, the plurality of light-emitting elements 200 are mounted on the printed circuit board 102 so that the edges of the longitudinal ends of the protruding portions 213, on which the plurality of light-emitting points 218 are formed, face each other in a side cross-sectional view. Furthermore, the plurality of light-emitting elements 200 are mounted in a staggered pattern (alternately) along the longitudinal direction (X direction) of the printed circuit board 102 from one end side of the printed circuit board 102 shown in FIG. 1 to the other end side (not shown).

[0031] 1, the light emitting elements 200 form a first row 208 and a second row 209 on the printed circuit board 100, with the plurality of light emitting elements 200 mounted at intervals along the X direction. The first row 208 and the second row 209 are each composed of a plurality of light emitting elements 200 mounted at odd-numbered mounting positions and a plurality of light emitting elements 200 mounted at even-numbered mounting positions, counting in the −X direction from one longitudinal end 102A of the printed circuit board 102 (see FIG. 11). Counting in the −X direction from one longitudinal end 102A of the printed circuit board 102, the longitudinal end (−X direction end) of the nth (n is a natural number excluding the last) light emitting element 200 and the longitudinal end (X direction end) of the n+1th light emitting element 200 are mounted so as to face each other in the Y direction.

[0032] [Modification of the light-emitting element 200] The light emitting element 200 has a T-shaped cross section, but is not limited to this. For example, the light emitting element 200 may have an L-shaped cross section, or may not have the protruding portion 214. The light emitting element 200 may also have a quadrilateral cross section (for example, a rectangular or parallelogram shape).

[0033] [Manufacturing equipment 10] Next, a description will be given of the configuration of the manufacturing apparatus 10 that manufactures the light emitting substrate device 100. Each of Figures 3 and 4 shows a part of the configuration of the manufacturing apparatus 10.

[0034] 3, the manufacturing apparatus 10 includes an element manufacturing apparatus 300 that manufactures the light-emitting element 200. Also, as shown in FIG. 4, the manufacturing apparatus 10 includes a supply unit 13 that supplies the light-emitting element 200, an element positioning device 20 that positions the light-emitting element 200, and a board positioning device 40 that positions the printed board 102.

[0035] The manufacturing apparatus 10 also includes a transfer device 50 and a transfer device 60. The transfer device 50 transfers the light emitting element 200 from the supply unit 13 to the element positioning device 20. The transfer device 60 transfers the light emitting element 200 positioned by the element positioning device 20 to the printed circuit board 102 positioned by the board positioning device 40. As described above, the light emitting element 200 has a T-shaped cross section, but the shape of the light emitting element 200 is shown in a simplified form in FIGS. 3 and 4.

[0036] [Element manufacturing equipment 300] As shown in FIG. 3, the element manufacturing apparatus 300 includes a gripping device 302 for gripping the light emitting element 200, a table 304 on which trays 401 and 402 are placed, and a moving mechanism 306 for moving the table 304 in the X and Y directions.

[0037] These trays 401, 402 are intended to hold a plurality of light-emitting elements 200 cut out from the wafer 14. The trays 401, 402 have, for example, a plurality of recesses 406 in which a plurality of light-emitting elements 200 are placed. In other words, one recess 406 houses one light-emitting element 200. The trays 401, 402 are plate-like (flat) with a thickness in the vertical direction, and are rectangular in plan view. The trays 401, 402 may also be box-shaped cases or the like.

[0038] The moving mechanism 306 moves the base 304 in the X and Y directions, thereby aligning (positioning) the recess 406 on which the light emitting element 200 is to be placed, among the plurality of recesses 406 on the trays 401 and 402, at a predetermined pick-off position.

[0039] The gripping device 302 grips a plurality of light emitting elements 200 cut out from the wafer 14 and transports them to recesses 406 located at pick-off positions in the trays 401 and 402 .

[0040] Specifically, the gripping device 302 has a gripping mechanism 310 that grips the light-emitting element 200, a push-up mechanism 320 that pushes up the light-emitting element 200, a holding part 342 that holds the wafer 14, and a moving mechanism 344 that moves the holding part 342 in the X direction and the Y direction.

[0041] The moving mechanism 344 moves the holding part 342 in the X direction and the Y direction to align the light emitting element 200 to be gripped with a predetermined pick-up position (push-up position). The push-up position is set on the opposite side of other light emitting elements 200 adjacent to the light emitting element 200 to be pushed up, and away from the other light emitting elements 200, with reference to the center line in the width direction of the light emitting element 200 to be pushed up.

[0042] 5(A) and 5(B), the push-up mechanism 320 will be described. As shown in FIG. 5(B), the push-up mechanism 320 has a cylindrical portion 330, a needle 322, a suction portion 324, and a drive portion 326 (see FIG. 3).

[0043] The upper wall of the cylindrical portion 330 has a through-hole 332 through which the needle 322 protrudes. As shown in Figures 5(A) and 5(B), suction grooves 334 are formed on the upper surface of the upper wall of the cylindrical portion 330, and the suction grooves 334 are provided to adsorb the adhesive sheet 290 to which the wafer 14 is attached. A hollow portion 336 that communicates with the through-hole 332 is formed inside the cylindrical portion 330. The hollow portion 336 and the suction grooves 334 are connected to the suction portion 324 via a passage 338 formed in the side wall of the cylindrical portion 330.

[0044] When the gripping mechanism 310 grips the light emitting element 200, the needles 322 push up the light emitting element 200 located at the pick-up position (push-up position) together with the adhesive sheet 290. The needles 322 have a tapered cylindrical upper end portion. The diameter D of the needles 322 is, for example, several tens of μm. For example, a plurality of needles 322 are arranged along the longitudinal direction (X direction) of the light emitting element 200 located at the pick-up position (push-up position).

[0045] The driving portion 326 moves the needle 322 between a protruding position where the needle 322 protrudes upward from the cylindrical portion 330 through the through-hole 332 and a retracted position where the needle 322 is retracted into the hollow portion 336 of the cylindrical portion 330 .

[0046] 3, the gripping mechanism 310 has a housing 311, an arm 312, a gripping unit 370, a driving unit 360, and a suction unit 318. The housing 311 is formed, for example, in a box shape, and has an opening 313 at the top of the shape.

[0047] Arm 312 protrudes from opening 313 of housing 311. A base end of arm 312 is supported by drive unit 360 so as to be movable in the horizontal direction (X direction). A gripper 370 is attached to the tip of arm 312 via an expandable unit 315 that expands and contracts in the vertical direction.

[0048] As shown in FIG. 6, the gripping portion 370 has a main body 372 having a length along the longitudinal direction (X direction) of the light-emitting element 200, and abutment portions 374 provided at both longitudinal ends of the main body 372 and abutting against the ridge line 285 on the X direction side of the light-emitting element 200.

[0049] The abutting portion 374 has an abutting surface 375 formed so that the lower surface 373 of the main body 372 does not abut against the upper surface of the light emitting element 200 when the abutting portion 374 abuts against the ridge line 285 of the light emitting element 200 .

[0050] The main body 372 has a cavity 377 therein. A plurality of through holes 378 communicating with the cavity 377 are formed in the lower surface 373 of the main body 372. The upper part of the main body 372 is connected to the suction part 318 via a hose 399.

[0051] In the gripping mechanism 310, with the ridge line 285 of the light emitting element 200 abutting against the abutment surface 375 of each abutment portion 374, the gripping portion 370 grips the light emitting element 200 by sucking the light emitting element 200 with the suction portion 318 through the multiple through holes 378. With the gripping portion 370 gripping the light emitting element 200, the expandable portion 315 is contracted to peel the light emitting element 200 from the adhesive sheet 290. Next, by moving the arm 312 in the X direction and extending the expandable portion 315, the light emitting element 200 is placed on a recess 406 located at a pickoff position in the trays 401, 402.

[0052] The gripping device only needs to have a gripping function for gripping the light emitting element 200 as a minimum function, and may have a transporting function if necessary.

[0053] [Supply section 13] 4, the supply unit 13 includes a table 15 on which the trays 401, 402 are placed, and a movement mechanism 17 that moves the table 15 in the X and Y directions. In the supply unit 13, the movement mechanism 17 moves the table 15 in the X and Y directions, thereby positioning the light-emitting elements 200 to be mounted on the trays 401, 402 at predetermined pick-up positions by the transfer device 50.

[0054] [Transfer device 50] As shown in Fig. 4, the transfer device 50 includes a collet 57, a suction device 52, and a movement mechanism 53. The collet 57 serves as a gripping tool for gripping the light-emitting element 200. The suction device 52 is attached to the collet 57 and generates a suction force for the collet 57 to hold the light-emitting element 200. The movement mechanism 53 moves the suction device 52.

[0055] Specifically, a collet 57 is attached to the suction nozzle of the aspirator 52. The collet 57 has a suction port (not shown) that communicates with the suction nozzle .

[0056] In the transfer device 50, the collet 57 is brought into contact with, for example, the upper surface of the light-emitting element 200 located at the pickup position in the supply unit 13, and the light-emitting element 200 is sucked by the suction device 52. The collet 57 holds the light-emitting element 200 by this suction.

[0057] Next, with the light emitting element 200 held by the collet 57, the transfer device 50 moves the suction device 52 in the Y direction (along the dashed arrow line E1) using the movement mechanism 53, thereby transferring the light emitting element 200 onto the plate 34 of the positioning table 30, which will be described later. Note that, as the movement mechanism 53 of the transfer device 50, for example, a three-axis robot equipped with a mechanism for moving in the X, Y, and Z directions is used.

[0058] [Element positioning device 20] 4, the element positioning device 20 includes a positioning table 30, a positioning member 22, and a moving mechanism 29. The light-emitting element 200 is placed (mounted) on the positioning table 30. The positioning member 22 positions the light-emitting element 200 placed on the positioning table 30 at a predetermined position. The moving mechanism 29 moves the positioning member 22 in the X and Y directions.

[0059] The positioning table 30 includes a cylindrical portion 32 having an opening 33 at its top, a plate 34 provided at the opening 33 of the cylindrical portion 32, and a suction device 36 that sucks air from the internal space of the cylindrical portion 32 to create a negative pressure in the internal space. The plate 34 has a plurality of suction holes 38. These plurality of suction holes 38 extend through the plate 34 and communicate with the internal space of the cylindrical portion 32.

[0060] 4, the positioning member 22 includes a main body 22A and a pair of claws 22B extending in the X direction from the main body 22A, and is configured, for example, in a plate shape. The pair of claws 22B are spaced apart in the Y direction so that the light emitting element 200 can be positioned between the pair of claws 22B. The positioning member 22 moves while remaining out of contact with the plate 34 so as to be attracted to the plate 34 and not receive resistance to movement.

[0061] The positioning member 22 abuts the claw portion 22B against one of the side surfaces 252 (see FIG. 2) of the leg portion 250 of the light emitting element 200, moves the light emitting element 200, and positions (aligns) the light emitting element 200 at a predetermined position.

[0062] In the present embodiment, one of the pair of claw portions 22B is selected to position the light emitting element 200. Therefore, the positioning member 22 may be configured without one of the pair of claw portions 22B.

[0063] [Substrate positioning device 40] 4, the board positioning device 40 includes a pair of transport members 42 (e.g., conveyors) that transport the printed circuit board 102 in the X direction. The pair of transport members 42 are spaced apart in the Y direction so that the printed circuit board 102 can be introduced between the pair of transport members 42.

[0064] The board positioning device 40 is configured so that the printed circuit board 102 introduced between the pair of transport members 42 is positioned in the X, Y, and Z directions relative to the pair of transport members 42. The pair of transport members 42 transport the printed circuit board 102 in the X direction, so that the printed circuit board 102 moves relatively in the X direction while being positioned in the Y direction relative to a collet 70, which will be described later.

[0065] The substrate positioning device 40 has an application device (not shown) such as a dispenser for applying an adhesive such as an epoxy adhesive containing silver (Ag) to the mounting position on the printed circuit board 102 where the light emitting element 200 is to be mounted.

[0066] [Transfer device 60] As shown in Fig. 4, the transfer device 60 includes a collet 70, a suction device 62, and a movement mechanism 63. The collet 70 serves as a gripping tool for gripping the light-emitting element 200. The suction device 62 is attached to the collet 70 and generates a suction force for the collet 70 to hold the light-emitting element 200. The movement mechanism 63 moves the suction device 62.

[0067] Specifically, the collet 70 is attached to the suction nozzle 64 of the aspirator 62. The collet 70 has a suction port (not shown) that communicates with the suction nozzle 64.

[0068] The transfer device 60 uses the suction device 62 to suck the light emitting element 200 while the edge 271 (see FIG. 2 ) of the light emitting element 200 is in contact with the collet 70. This suction holds the light emitting element 200 on the collet 70. The transfer device 60 also stops the suction by the suction device 62, thereby releasing the state in which the collet 70 holds the light emitting element 200.

[0069] The movement mechanism 63 moves the suction device 62 in the Y direction (along the dashed arrow line E2), thereby moving the collet 70 in the Y direction relative to the printed circuit board 102. That is, in this embodiment, the movement mechanism 63 moves the collet 70 in the Y direction, and the transport member 42 of the board positioning device 40 moves the printed circuit board 102 in the X direction. These movements move the collet 70 relative to the printed circuit board 102 in the X and Y directions.

[0070] Furthermore, the movement mechanism 63 is configured to move the collet 70 in the Z direction (e.g., up and down) relative to the printed circuit board 102 by moving the suction device 62 in the Z direction (e.g., up and down). In this embodiment, with the light emitting element 200 held by the collet 70, the collet 70 is moved in the X direction and the Y direction relative to the printed circuit board 102. Thereafter, the collet 70 is lowered in the -Z direction (e.g., downward), thereby mounting the light emitting element 200 on the printed circuit board 102. As the movement mechanism 63, for example, a two-axis robot that can move in the Y direction and the Z direction is used.

[0071] [Method for manufacturing light emitting substrate device 100] A method for manufacturing the light emitting substrate device 100 will be described. The method for manufacturing the light emitting substrate device 100 according to this embodiment includes an element manufacturing process for manufacturing the light emitting element 200 from a wafer, and a mounting process for mounting the light emitting element 200 manufactured in the element manufacturing process onto the printed circuit board 102.

[0072] [Element manufacturing process] The element manufacturing process will be described. The element manufacturing process includes a forming process of cutting the light emitting element 200 from the wafer 14 (semiconductor substrate) to form the light emitting element 200, a pushing-up process of pushing up the light emitting element 200 with the needle 322, and a transporting process of transporting the pushed-up light emitting element 200 while holding it.

[0073] (Formation process) The formation process will be described. In the formation process, as shown in Fig. 7, first, a plurality of light-emitting points 218 are formed on a wafer 14 made of GaAs or the like. Electricity is applied to each section for the light-emitting elements 200 formed on the wafer 14, and the detected light intensity of the light-emitting points 218 is used as a reference to identify whether the section is a good product or not. Specifically, each light-emitting point 218 is made to emit light, and a section in which the light intensity of all light-emitting points 218 is equal to or greater than a reference value is determined to be a good section, and a section including even one light-emitting point 218 whose light intensity is equal to or less than the reference value is determined to be a defective section. The inspection results may be recorded in a storage device as data correlating the pass / fail status of the section with the section position.

[0074] After the inspection, first grooves 14A are formed on the surface of the wafer 14 by, for example, etching. A dicing adhesive sheet 295 is attached to the surface of the wafer 14 after the first grooves 14A have been formed. Thereafter, second grooves 14B are formed on the back surface of the wafer 14 by, for example, cutting using a cutting member 11 such as a dicing blade. In this embodiment, the second grooves 14B reach the first grooves 14A.

[0075] Next, an adhesive sheet 290 is attached to the backside of all of the light-emitting elements 200 cut out from the wafer 14. Thereafter, the dicing adhesive sheet 295 is peeled off from the front side of the light-emitting elements 200 to obtain an intermediate product 297 including the adhesive sheet 290 and an arrangement of the light-emitting elements 200 on the adhesive sheet 290, as shown in FIG.

[0076] The plurality of light emitting elements 200 in the intermediate product 297 are attached on the adhesive sheet 290 along the width direction (Y direction, short side direction) and length direction (X direction) of the light emitting elements 200. Each light emitting element 200 has a plurality of light emitting points 218 formed along the X direction on the Y direction side end, specifically on the protruding portion 213 (see FIG. 7).

[0077] (Topping process) The pushing-up process will be described with reference to Figure 9. In the pushing-up process, needles 322 push up the light emitting elements 200, which are lined up in order in the width direction (-Y, Y direction) of the light emitting elements 200 from one end of the outline of the wafer 14 (adhesive sheet 290) to the other end, in a predetermined order. As shown by the arrows in Figure 10, the predetermined order starts with the row closest to the X direction in the two-dimensional array of light emitting elements 200 on the adhesive sheet 290, and progresses within this row from the -Y direction to the Y direction. Next, the pushing-up by needles 322 moves to the adjacent row on the -X direction side, and progresses within this row from the Y direction to the -Y direction. That is, in odd-numbered rows counting from the X-direction side of the wafer 14 (hereinafter simply referred to as "odd-numbered rows"), the push-up is performed in order from the -Y-direction end of the wafer 14 toward the Y-direction, and in even-numbered rows counting from the X-direction side of the wafer 14 (hereinafter simply referred to as "even-numbered rows"), the push-up is performed in order from the Y-direction end of the wafer 14 toward the -Y-direction. Note that light-emitting elements 200 from sections that were not determined (identified) as non-defective in the formation process and elements 199 formed with an incomplete shape in the outer periphery of the wafer 14 will not be used as light-emitting elements in the subsequent process, and are therefore excluded from the push-up order (target).

[0078] Specifically, in the pushing-up step, first, the moving mechanism 344 moves the holding part 342 holding the wafer 14 in the X direction and the Y direction to position the light emitting element 200 to be pushed up at a predetermined pushing-up position (see FIGS. 3 and 5). Since the needles 322 push up the row of light emitting elements 200 on the adhesive sheet 290 in order from one end to the other, another light emitting element 200 adjacent to the light emitting element 200 to be pushed up is present on one side (Y direction or −Y direction) of the light emitting element 200 to be pushed up.

[0079] 5, suction unit 324 of push-up mechanism 320 sucks adhesive sheet 290 through through-holes 332 and suction grooves 334 formed in the upper wall of cylindrical portion 330. As a result, adhesive sheet 290 is adsorbed to the upper wall of cylindrical portion 330.

[0080] After the adhesive sheet 290 is adsorbed, the needles 322 are driven by the drive unit 326 to raise the needles 322. As a result, the needles 322 push up the lower surface of the light-emitting element 200 together with the adhesive sheet 290 at the push-up position, as shown in FIG. 9. Specifically, the back surface of the light-emitting element 200 to be pushed up is divided into a half back surface that is close to another light-emitting element 200 adjacent to the light-emitting element 200 and a half back surface that is far from the other light-emitting element 200, based on the center line of the back surface in the width direction. The push-up position is located within the far half back surface (half back surface). FIGS. 5 and 9 illustrate the case where light-emitting elements 200 in even-numbered rows on the wafer 14 are pushed up.

[0081] (Transportation process) In the transfer step, the light emitting elements 200 that have been pushed up by the needles 322 in order from one end of the wafer 14 to the other are placed in the recesses 406 of the trays 401 and 402 with the light emitting points 218 on the wafer 14 facing in the same direction (see FIG. 10) as shown in FIG. 11. Specifically, in the transfer step, the light emitting elements 200 are placed in the recesses 406 of the trays 401 and 402 with the light emitting points 218 positioned on the Y direction side of the light emitting elements 200 without being rotated during transfer.

[0082] Furthermore, in the transport step, only the light emitting elements 200 that are determined to be non-defective based on the inspection results of the formation step are alternately placed in the recesses 406 of the trays 401 and 402 in the predetermined order. The light emitting elements 200 are also placed in the trays 401 and 402 in the predetermined order. Therefore, it is possible to know from which section of the wafer 14 all of the light emitting elements 200 placed on the trays 401 and 402 they were cut out. In other words, all of the recesses 406 in the trays 401 and 402 are linked to the sections of the wafer 14.

[0083] Specifically, in the transport step, the light emitting elements 200 are gripped by grippers and transported as follows, and placed on the trays 401, 402. In the transport step, first, the light emitting elements 200, which have been pushed up by the needles 322 in a predetermined order from one end of the wafer 14 to the other, are gripped individually (one by one) by the gripping units 370 of the gripping device 302 (see FIG. 3). In the arrangement of the light emitting elements 200 on the adhesive sheet 290, which reflects the arrangement of the sections of the wafer 14, the gripping units 370 grip the light emitting elements 200 individually in order from the −Y direction end of the adhesive sheet 290 in the Y direction in the odd-numbered rows of the arrangement, and grip the light emitting elements 200 individually in order from the Y direction end of the adhesive sheet 290 in the −Y direction in the even-numbered rows of the arrangement.

[0084] In detail, the ridge 285 of the light-emitting element 200 pushed up by the needle 322 is brought into contact with the abutment surface 375 of each abutment portion 374 of the gripping portion 370, and the gripping portion 370 grips the light-emitting element 200 by sucking the light-emitting element 200 through the multiple through holes 378 using the suction portion 318 (see Figures 6 and 3).

[0085] Next, with the gripping portion 370 gripping the light-emitting element 200, the expandable portion 315 is contracted, thereby peeling the light-emitting element 200 from the adhesive sheet 290. Next, the arm 312 is moved in the X direction and the expandable portion 315 is extended, thereby placing the light-emitting element 200 on the recess 406 located at the pick-off position in the trays 401 and 402.

[0086] In this embodiment, the above-described push-up process and transport process are alternately repeated for each light-emitting element 200, and the plurality of light-emitting elements 200 cut out from the wafer 14 are placed one by one on the trays 401 and 402. By alternately repeating the transport process and the push-up process, the plurality of light-emitting elements 200 are placed on the trays 401 and 402 in a predetermined order, as described below. When the light-emitting elements 200 are sorted into the trays 401 and 402 in this manner, the light-emitting elements 200 that are close to each other in the arrangement of the light-emitting elements 200 in each of the trays 401 and 402 are also from sections of the wafer 14 that are close to each other. Position data and arrangement data on the wafer 14 for the light-emitting elements 200 on the trays 401 and 402 may be recorded in a storage device. In other words, the arrangement data of all recesses 406 on the trays 401 and 402 is linked to the position data of the sections on the wafer 14 and stored in the storage device.

[0087] The light emitting elements 200, which are arranged in order in the width direction (-Y, Y direction) of the light emitting elements 200 from one end of the wafer 14 (adhesive sheet 290) to the other end, are gripped by grippers in a predetermined order and alternately placed in the recesses 406 of the trays 401 and 402. The predetermined gripping order, as indicated by the arrows in FIG. 10 , starts from a corner on the X-direction end side and the -Y-direction end side of the wafer 14, and ends at a corner on the other end while the gripping direction is reversed for each row. Specifically, in odd-numbered rows of the wafer 14, the light emitting elements 200 gripped in order from the -Y-direction end of the wafer 14 to the Y direction are alternately placed on the trays 401 and 402, and in even-numbered rows of the wafer 14, the light emitting elements 200 gripped in order from the Y-direction end of the wafer 14 to the -Y direction are alternately placed on the trays 401 and 402.

[0088] 10 , for example, among the plurality of light-emitting elements 200, for light-emitting elements 200A, 200B, 200C, and 200D arranged in odd-numbered rows in the Y direction, light-emitting element 200A is placed in one recess 206 of tray 401 by a pushing-up process and a conveying process. Next, light-emitting element 200B is placed in one recess 206 of tray 402 by a pushing-up process and a conveying process. Next, light-emitting element 200C is placed in another recess 206 of tray 401 (another recess 206 adjacent to one recess 206 of tray 401) by a pushing-up process and a conveying process, and then light-emitting element 200D is placed in another recess 206 of tray 402 (another recess 206 adjacent to one recess 206 of tray 402) by a pushing-up process and a conveying process. In this way, the plurality of light-emitting elements 200 are placed alternately on trays 401 and 402 in a predetermined order by a pushing-up process and a conveying process. The light emitting elements 200 are also placed in the recesses of the trays 401 and 402 in a predetermined order.

[0089] According to this mounting order, the arrangement of the light-emitting elements 200 on the trays 401 and 402 reflects the proximity of the elements in the arrangement of the sections of the wafer 14. In other words, for each light-emitting element 200, the position of the recess 406 in the trays 401 and 402 is linked to the position (section) on the wafer 14. Specifically, the light-emitting elements 200 on both sides adjacent to one light-emitting element 200 in each column of the arrangement of the light-emitting elements 200 on the tray 401 are also close to the section of the one light-emitting element in the arrangement of the sections of the wafer 14. Similarly, the light-emitting elements 200 on both sides adjacent to one light-emitting element 200 in each column of the arrangement of the light-emitting elements 200 on the tray 402 are also positioned close to the section of the one light-emitting element in the arrangement of the sections of the wafer 14.

[0090] As a result, the light emitting element 200 is ready to be mounted on the printed circuit board 102. As described above, the light emitting element 200 is manufactured by the element manufacturing process. Note that this element manufacturing process is an example of a manufacturing method for manufacturing the light emitting element 200. In this embodiment, as shown in FIGS. 3 and 11, the trays 401 and 402 are arranged side by side in the Y direction. However, the arrangement of the trays 401 and 402 is not limited to this.

[0091] [Placement process] In the arrangement step, first, the tray 402 is rotated relative to the tray 401 so that the light-emitting points 218 face in different directions. Specifically, as shown in FIG. 11 , the trays are rotated such that the light-emitting points 218 of the light-emitting elements 200 on the tray 401 face the Y direction, while the light-emitting points 218 of the light-emitting elements 200 on the tray 402 face the −Y direction. This is achieved, for example, by rotating the tray 402 relative to the tray 401 by an angle of 180 degrees. The trays that are actually rotated may be either the tray 402 or the tray 401, or both the tray 401 and the tray 402, thereby rotating the tray 402 relative to the tray 401. When both the tray 401 and the tray 402 are rotated, for example, the tray 401 and the tray 402 may each be rotated by 90 degrees.

[0092] In this embodiment, as shown in Fig. 4, the trays 401 and 402 are placed on the platform 15 of the supply unit 13 in a state in which the light-emitting points 218 of the light-emitting elements 200 on the tray 401 face in a direction different from the light-emitting points 218 of the light-emitting elements 200 on the tray 402. In this embodiment, the trays 401 and 402 are lined up along the X direction in Fig. 4, but they may also be lined up along the Y direction.

[0093] Next, the light emitting elements 200 of the trays 401 and 402 are placed on the printed circuit board 102 with the light emitting points 218 of the trays 401 and 402 facing in the same direction. Also, the light emitting elements 200 of the trays 401 and 402 are placed on the printed circuit board 102 so that the light emitting elements 200 are lined up on the printed circuit board 102 along the longitudinal direction of the printed circuit board 102 in the order described above as shown in FIG.

[0094] Specifically, the light emitting elements 200 on the trays 401 and 402 are placed (mounted) on the printed circuit board 102 as follows.

[0095] As shown in FIG. 4, first, in the supply unit 13, the movement mechanism 17 moves the table 15 in the X direction and the Y direction to position the light emitting element 200 to be mounted at a predetermined pick-up position.

[0096] Next, the transfer device 50 grasps the light-emitting element 200 positioned at the pick-up position of the supply section 13 using the collet 57 as a gripping tool, transfers the light-emitting element 200 from the supply section 13 onto the plate 34 of the positioning table 30, and places the light-emitting element 200 on the plate 34.

[0097] (Element positioning process) In the element positioning device 20, the positioning member 22 moves and positions (locates) the light emitting element 200 placed on the plate 34 to a predetermined position on the plate 34.

[0098] In the board positioning device 40, a pair of conveying members 42 positions the printed board 102. This positioning of the printed board 102 does not need to be performed after the positioning of the light emitting element 200, and may be performed before or in parallel with the positioning of the light emitting element 200.

[0099] (Coating process) An adhesive is applied by an application device (not shown) to the mounting position of the light emitting element 200 on the printed circuit board 102. The application process may be performed before the printed circuit board 102 is positioned by the pair of conveying members 42.

[0100] (Mounting process) The transfer device 60 grips the light emitting element 200 positioned in the element positioning step using a collet 70 as a gripping tool, and transfers the light emitting element 200 to a mounting position on the printed circuit board 102. The light emitting element 200 transferred by the collet 70 is mounted on the mounting position on the printed circuit board 102.

[0101] This mounting process is repeated according to the number of light-emitting elements 200 to be mounted on the printed circuit board 102. In this embodiment, for example, the plurality of light-emitting elements 200 on the tray 401 are mounted in a row at intervals in the longitudinal direction (X direction) of the printed circuit board 102. Next, the plurality of light-emitting elements 200 on the tray 402 are mounted in a row at intervals in the longitudinal direction (X direction) of the printed circuit board 102. In this embodiment, as shown in FIG. 11 , for example, the plurality of light-emitting elements 200 on the tray 401 are mounted in the order of odd-numbered mounting positions T1, T3, T5, etc., using one end 102A in the longitudinal direction of the printed circuit board 102 as a reference. After all the odd-numbered light-emitting elements 200 have been mounted, the plurality of light-emitting elements 200 on the tray 402 are mounted in the order of even-numbered mounting positions T2, T4, etc., using the end 102A as a reference. In this case, when mounting the light emitting elements 200 at odd-numbered mounting positions, absolute coordinates indicating the mounting position of each light emitting element 200 can be used, for example, with reference to one longitudinal end 102A. When mounting the light emitting elements 200 at even-numbered mounting positions, relative coordinates based on adjacent light emitting elements 200 (light emitting elements 200 mounted at odd-numbered mounting positions) can be used, instead of the above-mentioned absolute coordinates. By mounting the light emitting elements 200 using these relative coordinates, the light emitting elements 200 mounted at the even-numbered mounting positions are positioned relative to the light emitting elements 200 mounted at the adjacent odd-numbered mounting positions, making it less likely that significant variations will occur in the spacing between adjacent light emitting elements 200 in the short-side direction (Y direction) of the printed circuit board 102. By mounting the light emitting elements 200 at odd-numbered and even-numbered mounting positions, a light emitting substrate device 100 in which the light emitting elements 200 are mounted in a staggered pattern can be provided. Further, in relation to the reference numerals of the light emitting elements 200 shown in FIG. 10, the light emitting elements 200A and 200C are mounted at mounting positions T1 and T3, respectively, and the light emitting elements 200B and 200D are mounted at mounting positions T2 and T4, respectively.

[0102] Through the above steps, the light emitting substrate device 100 is manufactured.

[0103] As already explained, by alternately repeating the pushing-up step and the transporting step, the light emitting elements 200 that are close to each other in the arrangement of the light emitting elements 200 in each of the trays 401 and 402 are also from sections that are close to each other on the wafer 14. In other words, the light emitting elements 200 cut out from the wafer 14 are alternately arranged in the recesses 406 of the trays 401 and 402 by alternately repeating the pushing-up step and the transporting step in a predetermined order (the order indicated by the arrows in FIG. 10 ). Therefore, it can be said that two light emitting elements 200 whose recesses 406 are close to each other on the tray 401 have sections that are close to each other on the wafer 14. Also, it can be said that two light emitting elements 200 whose recesses 406 are close to each other on the tray 402 have sections that are close to each other on the wafer 14. It can also be said that one light emitting element 200 accommodated in one recess 406 of the tray 401 and another light emitting element 200 accommodated in another recess 406 of the tray 402 that corresponds to the one recess 406 of the tray 401 have sections that are close to each other on the wafer 14. However, in an actual manufacturing process of the light emitting substrate device 100, a gripping tool such as a collet 57 or 70 may fail to grip a light emitting element 200. Such a gripping tool's failure to grip a light emitting element 200 occurs because the light emitting element 200 is not in the correct position (e.g., the light emitting element 200 is tilted in the tray). Therefore, when a gripping tool fails to grip a light emitting element 200, the gripping tool does not mount the light emitting element 200 on the printed circuit board 102, but instead grips another light emitting element 200 adjacent to the light emitting element 200 in the tray and mounts it on the printed circuit board 102. In other words, the light emitting element 200 is lost. The number of times that the gripping tool fails to grip a light emitting element 200 is the same when gripping multiple light emitting elements 200 from tray 401 and when gripping multiple light emitting elements 200 from tray 402. In other words, the number of lost light emitting elements 200 is very rarely the same between tray 401 and tray 402.

[0104] That is, the difference between the number of light-emitting elements 200 lost in the tray 401 and the number of light-emitting elements 200 lost in the tray 402 may become large during the actual manufacturing process of the light-emitting substrate device 100. This difference may lead to defects related to the characteristics of the manufactured light-emitting substrate device 100. Specifically, when one light-emitting element 200 in a certain section (one section) on the wafer 14 and another light-emitting element 200 in a section (another section) that is located outside a predetermined distance from the section (one section) are mounted on the same printed circuit board 102, this may lead to defects related to the light-emitting characteristics of the light-emitting substrate device 100. Here, an example of a defect related to the light-emitting characteristics of the light-emitting substrate device 100 is when the width (range) of light intensity adjustment for the plurality of light-emitting elements 200 mounted on the printed circuit board 102 is significantly different. Specifically, in a light emitting substrate device 100 having 20 light emitting elements 200 mounted on one printed circuit board 102, 19 of the elements can adjust the light intensity within a range of 80 to 90% of the reference light intensity, while the remaining element can only adjust the light intensity within a range of 60 to 70% of the reference light intensity. Such a light emitting substrate device 100 is deemed a defective product because it is not possible to adjust the light intensity of all the light emitting elements 200 to a substantially uniform level.

[0105] In this embodiment, the following configuration is adopted to avoid the occurrence of the above-mentioned problems in the light emitting substrate device 100. That is, first, one light emitting element 200 (an example of a first element) is grasped and mounted on the printed circuit board 102 (an example of a first step). Thereafter, if the distance between the next light emitting element 200 (an example of a second element) to be grasped and the one light emitting element 200 (an example of a first element) is outside a predetermined range on the wafer 14, the next light emitting element 200 (an example of a second element) to be grasped is not mounted on the printed circuit board 102, and instead a light emitting element 200 (an example of a third element) in the grasping queue, whose distance between the one light emitting element 200 (an example of a first element) and the light emitting element 200 (an example of a third element) is within a predetermined range on the wafer 14, is mounted on the printed circuit board 102 (an example of a second step). Note that the specific value of the predetermined range of distance is (can be) set to a different value depending on the structure of the light emitting element 200, the manufacturing process, etc. The storage device stores, for example, position data and arrangement data relating to the light emitting elements 200 on the wafer 14 and the trays 401 and 402. At least one of the position data and the arrangement data may be used to make a determination relating to a predetermined range.

[0106] Specifically, in one of the odd-numbered and even-numbered mountings (e.g., odd-numbered mounting), the light-emitting elements 200 are first mounted on the printed circuit board 102 in accordance with the arrangement order of the light-emitting elements 200 on one of the trays 401 and 402 (e.g., tray 401) (an example of a first step). Thereafter, when starting to mount the light-emitting elements 200 on the other of the odd-numbered and even-numbered mountings (e.g., even-numbered mounting), the following condition is imposed: the light-emitting element 200 to be next mounted on the printed circuit board 102 (the first even-numbered light-emitting element 200) and the first light-emitting element 200 already placed in the odd-numbered mounting are within a predetermined distance on the wafer 14. To satisfy this condition, the light-emitting element 200 to be next mounted is selected from the other of the trays 401 and 402 for even-numbered mounting (e.g., tray 402), and mounted on the printed circuit board 102 (an example of a second step). Any light emitting element 200 that does not satisfy the condition is not used from the other (for example, tray 402). At least one of position data and arrangement data of the light emitting elements 200 on the wafer 14 and / or on the trays 401, 402 is stored in a storage device. The stored data may be used when making a judgment regarding the condition.

[0107] According to this embodiment, a manufacturing method for an emitting substrate device can be provided that reduces the difference in characteristics between the emitting element 200 mounted adjacent to the printed circuit board 102, compared to a method that does not take into account the distance on the wafer 14 between the emitting element 200 (an example of a first element) and the emitting element 200 mounted adjacent to the emitting element 200 (an example of the first element).

[0108] In this embodiment, in each of the trays 401 and 402, the light emitting elements 200 on the tray (tray 401 or tray 402) are held in accordance with the arrangement order of the plurality of light emitting elements 200, and the order in which the light emitting elements 200 are held is determined in advance. If the next light emitting element 200 (an example of a second element) is not used for mounting, it may be discarded after being held.

[0109] When the light emitting element 200 is gripped using a gripping tool (e.g., collet 57) (see FIG. 4), a sensor is used to detect whether the posture of the light emitting element 200 is normal immediately before gripping. If the signal from the sensor does not detect that the posture is normal, the light emitting element 200 is gripped by the gripping tool and disposed of in a disposal location. On the other hand, when gripping a light emitting element 200 that should be discarded because it is outside a predetermined distance range on the wafer 14, the light emitting element 200 is gripped by the gripping tool and disposed of in a disposal location regardless of the value of the signal from the sensor.

[0110] According to this embodiment, even if the order in which the light-emitting elements 200 are gripped in each of the trays 401 and 402 is predetermined, the unused light-emitting elements are gripped by the gripping tool and discarded by processing the signal from the sensor.

[0111] Furthermore, if the next light-emitting element 200 (an example of the second element) on the tray (tray 401 or tray 402) is outside the predetermined distance range on the wafer 14, the next light-emitting element 200 (an example of the second element) may not be gripped with the gripper, and a further (further next) light-emitting element 200 (an example of the third element) may be gripped with the gripper. In other words, the next light-emitting element 200 (an example of the second element) remains unused on the tray (tray 401 or tray 402). Not gripping the next light-emitting element 200 (an example of the second element) can also be achieved by, for example, temporarily disabling the operation of the suction device 52 attached to the collet 57.

[0112] When the light-emitting element 200 is gripped using the collet 57 (see FIG. 4), the light-emitting element 200 is gripped using the suction force applied from the suction device 52 to the collet 57. If the suction device 52 does not apply suction force to the collet 57, the result is that the light-emitting element 200 is not gripped. In this way, when gripping a light-emitting element 200 that should not be mounted, the suction device 52 can also be controlled so as not to apply suction force to the collet 57.

[0113] According to this embodiment, even if the order in which the light emitting elements 200 are gripped on each of the trays 401 and 402 is predetermined, the unused light emitting elements can be left on the tray by controlling the suction device 52.

[0114] Furthermore, if the distance on the wafer between the light-emitting element 200 (an example of the first element) and the next light-emitting element 200 to be grasped (an example of the second element) is not within a predetermined range, a further light-emitting element 200 (an example of the third element) may be grasped directly without moving to the grasping position of the next light-emitting element 200 (an example of the second element) on the tray (tray 401 or tray 402).

[0115] The distance between the light-emitting elements 200 can be defined by the distance ED between the center of gravity of one section on the wafer 14 (e.g., center of gravity DCG1 shown in FIG. 12) and the center of gravity of another section on the wafer 14 (e.g., center of gravity DCG2 shown in FIG. 12).

[0116] The distance ED according to this definition is known as the Euclidean distance. The center of gravity of the section or light-emitting element 200 in Fig. 12 is defined as, for example, the intersection of two diagonal dashed lines in the rectangle shown in Fig. 12. In other words, the center of gravity of the light-emitting element 200 can be the intersection of two diagonal lines of the outline of the light-emitting element 200 when the wafer 14 is viewed in plan.

[0117] Furthermore, the distance between the light-emitting elements 200 can be defined by the absolute value of the difference between the distance R1 between the center of gravity of the wafer 14 (e.g., "CG" shown in Figure 12) and the center of gravity of one light-emitting element 200 located in one section of the wafer 14 (e.g., "DCG3" shown in Figure 12), and the distance R2 between the center of gravity CG of the wafer 14 and the center of gravity of another light-emitting element 200 located in another section of the wafer 14 (e.g., "DCG4" shown in Figure 12).

[0118] Specifically, the distance between the center of gravity CG of the wafer 14 and the centers of gravity DCG3 and DCG4 of the light-emitting elements 200 in the sections of the wafer 14 is defined in the radial direction centered on the center of gravity CG. The distance between the light-emitting elements 200 in two sections on different radial radii is defined as the absolute value of the difference (R2-R1) between the different radial radii. According to this definition, the distance between the light-emitting elements 200 in sections whose centers of gravity are located on the same radial radius is treated as zero. The advantage of this distance definition is based on the fact that semiconductor crystals grow outward from the center when the wafer 14 is fabricated. Due to this characteristic of crystal growth, the number of sections on larger radial radii increases compared to sections on smaller radial radii.

[0119] 13 , an embodiment of a method for manufacturing a light emitting substrate device 100 using at least one of position data and arrangement data stored in a storage device will be described, in which the order in which the light emitting elements 200 in each of the trays 401 and 402 are gripped is predetermined. In the tray 401, gripping by the gripping tool begins with the light emitting element 200 indicated by reference symbol S401. The light emitting elements 200 are used for manufacturing the light emitting substrate device 100 in the order indicated by the dashed arrow A401, and mounting of the light emitting elements 200 from the tray 401 is completed by gripping the light emitting element 200 indicated by reference symbol E401. In the tray 402, gripping by the gripping tool begins with the light emitting element 200 indicated by reference symbol S402. This light emitting element 200 is within a predetermined range on the wafer 14 relative to the light emitting element 200 indicated by reference symbol S401. For example, when the light-emitting element 200 designated by reference symbol S402 and the light-emitting element 200 designated by reference symbol S401 are cut out from the wafer 14, they are adjacent to each other in the short-side direction of the light-emitting element 200 (they are located in adjacent sections). In the tray 402, the light-emitting elements 200 are used to manufacture the light-emitting substrate device 100 in the order indicated by the dashed arrow A402, and the manufacture of the light-emitting substrate device 100 progresses. Suppose that during the manufacture of the light-emitting substrate device 100, it is found that the light-emitting element 200 for the mth mounting candidate (the light-emitting element 200 designated by reference symbol M402) is outside a predetermined range on the wafer 14 with respect to the light-emitting elements 200 (the light-emitting element 200 designated by reference symbol S401, the (m-1)th light-emitting element 200, or the (m+1)th light-emitting element 200) of the tray 401 already mounted on the printed circuit board 102. In this case, the light-emitting element 200 designated by reference symbol M402 is not used in the manufacture of the light-emitting substrate device 100. The next light emitting element 200 to be grasped is the light emitting element 200 designated by reference symbol J402 that is found to be within the predetermined range on the wafer 14. The manufacture of the light emitting substrate device 100 starts from this light emitting element 200.

[0120] (action) The operation of the manufacturing method for the substrate device according to the first embodiment will be described. Compared to a method that does not consider the distance on the wafer 14 between two light-emitting elements 200 mounted adjacently on the printed circuit board 102, it is possible to manufacture a light-emitting substrate device 100 in which the difference in characteristics between two light-emitting elements 200 mounted adjacently on the printed circuit board 102 is reduced. Furthermore, according to this manufacturing method, by replacing the next light-emitting element 200 with a further light-emitting element 200 (another light-emitting element 200 whose distance on the wafer 14 is within a predetermined range) and mounting it adjacent to one light-emitting element 200, it is possible to avoid manufacturing defective light-emitting substrate devices 100 or interrupting the manufacturing of the light-emitting substrate device 100.

[0121] (Second embodiment) Referring to Fig. 14, an example of another embodiment of the present invention will be described. The manufacturing apparatus 10 is a manufacturing apparatus that manufactures a light emitting substrate apparatus 100 as an example of a substrate apparatus. Specifically, as shown in Fig. 14, the manufacturing apparatus 10 includes a supply unit 13 that supplies light emitting elements 200 (an example of an element), an element positioning device 20 that positions the light emitting elements 200, and a substrate positioning device 40 that positions a printed circuit board 102 (an example of a substrate). The manufacturing apparatus 10 also includes a transfer device 50 that transfers the light emitting elements 200 from the supply unit 13 to the element positioning device 20, and a transfer device 60 that transfers the light emitting elements 200 positioned by the element positioning device 20 to the printed circuit board 102 positioned by the substrate positioning device 40.

[0122] In the manufacturing apparatus 10 , a mounting device 103 that mounts the light emitting element 200 on the printed circuit board 102 includes an element positioning device 20 , a substrate positioning device 40 , and a transfer device 60 .

[0123] (Supply section 13) As shown in FIG. 14 , the supply unit 13 includes a holder 15 and a moving mechanism 17 that moves the holder 15 in the X and Y directions. In this embodiment, as shown in FIG. 8 , the holder 15 holds an intermediate product 297 that includes an adhesive sheet 290 and an array of light-emitting elements 200 on the adhesive sheet 290. The intermediate product 297 excludes light-emitting elements 200 cut from sections that were not determined to be non-defective and light-emitting elements 199 (see FIG. 10 ) that are formed with an incomplete shape on the periphery of the wafer 14. Note that the supply unit 13 may cut the wafer 14 held by the holder 15 to cut a plurality of light-emitting elements 200 from the wafer 14. In addition, in the supply unit 13, the moving mechanism 17 moves the holder 15 in the X and Y directions to position the light-emitting elements 200 to be mounted at a predetermined pick-up position for the transfer device 50.

[0124] (transfer device 50) 14, the transfer device 50 includes a collet 57 as a gripping tool for gripping the light-emitting element 200, a suction device 52 attached to the collet 57 and generating a suction force for the collet 57 to hold the light-emitting element 200, and a movement mechanism 53 for moving the suction device 52. Specifically, the collet 57 is attached to a suction nozzle 54 of the suction device 52. The collet 57 has a suction port (not shown) that communicates with the suction nozzle 54. In the transfer device 50, with the light-emitting element 200 held by the collet 57 connected to the suction nozzle 54, the suction device 52 is moved by the movement mechanism 53 along the dashed arrow E3 to transfer the light-emitting element 200 onto the plate 34 of the positioning table 30. The movement mechanism 53 of the transfer device 50 can be, for example, a three-axis robot that is movable in the X, Y, and Z directions.

[0125] If necessary, the supply unit 13 may further include a push-up mechanism 320 (see FIG. 5) combined with the moving mechanism 17. The push-up mechanism 320 pushes up the light-emitting element 200 located at the pick-up position. The moving mechanism 53 of the transfer device 50 transfers the light-emitting element 200 onto the positioning table 30 while holding the light-emitting element 200 pushed up by the push-up mechanism 320.

[0126] The element positioning device 20, the substrate positioning device 40, and the transfer device 60 have already been described in the first embodiment, and therefore detailed description thereof will be omitted.

[0127] (Method of manufacturing the light emitting substrate device 100) A method for manufacturing the light emitting substrate device 100 according to the second embodiment will be described. In the method for manufacturing the light emitting substrate device 100 according to the present embodiment, in the supply unit 13 shown in Fig. 14, the movement mechanism 17 moves the holding unit 15 in the X direction and the Y direction to position the light emitting element 200 to be mounted at a predetermined pick-up position (position adjustment step).

[0128] Next, the transfer device 50 transfers the light emitting element 200 located at the pick-up position of the supply unit 13 onto the plate 34 of the positioning table 30, and temporarily places the light emitting element 200 on the plate 34 (temporary placement step). Subsequently, as described in the first embodiment, the following steps are performed in order: an element positioning step using the element positioning device 20; a board positioning step using the board positioning device 40; an application step of applying adhesive to the mounting position of the light emitting element 200 on the printed circuit board 102; and a mounting step of mounting the light emitting element 200 on the printed circuit board 102. This mounting step is repeated according to the number of light emitting elements 200 to be mounted on the printed circuit board 102. Note that the application step may be performed before the printed circuit board 102 is transported by the board positioning device 40.

[0129] Through the above steps, the light emitting substrate device 100 is manufactured. (action) The operation of the manufacturing method for a substrate device according to the second embodiment will be described. Compared to a method that does not consider the distance on the wafer 14 between two adjacent light-emitting elements 200 mounted on the printed circuit board 102, it is possible to manufacture a light-emitting substrate device 100 in which the difference in characteristics between two adjacent light-emitting elements 200 mounted on the printed circuit board 102 is reduced. Furthermore, according to this manufacturing method, an additional light-emitting element 200 can be mounted adjacent to one light-emitting element 200 in place of the next light-emitting element 200, thereby avoiding interruptions to manufacturing.

[0130] A manufacturing apparatus 10 according to the first and second embodiments will be described. As shown in Figs. 4 and 14, the manufacturing apparatus 10 includes a supply unit 13 and a transfer device 50. The supply unit 13 supplies the light emitting elements 200 to be mounted on the printed circuit board 102 from a plurality of light emitting elements 200 cut out from a wafer 14. The transfer device 50 transfers the light emitting elements 200 (an example of a first element) to be mounted using a gripping tool for gripping the light emitting elements 200 (an example of a first element) to be mounted in the supply unit 13. The supply unit 13 includes a moving mechanism for moving the light emitting elements 200 for gripping by the gripping tool. 17 It has.

[0131] The transfer device 50 transfers the light emitting element 200 to be mounted (an example of a first element) among the plurality of light emitting elements 200 in the supply unit 13 in order to mount it on the printed circuit board 102. After this transfer, if both of the following two conditions are satisfied, the movement mechanism 53 moves the gripping tool to a position where the gripping tool can grip a further light emitting element 200 (an example of a third element), and grips the further light emitting element 200 (an example of the third element).

[0132] The two conditions are as follows: The distance between the mounted light-emitting element 200 (an example of the first element) and the next light-emitting element 200 to be held (an example of the second element) among the light-emitting elements 200 in the supply unit 13 is outside a predetermined range on the wafer 14. The distance between a further light-emitting element 200 (an example of the third element) among the plurality of light-emitting elements 200 in the supply unit 13 and the mounted light-emitting element 200 (an example of the first element) is within a predetermined range on the wafer 14.

[0133] The manufacturing apparatus 10 may further include an element positioning apparatus 20, a substrate positioning apparatus 40, and a transfer apparatus 60. The element positioning apparatus 20 positions the light emitting element 200 transferred by the transfer apparatus 50, and the substrate positioning apparatus 40 positions the printed circuit board 102. The transfer apparatus 60 transfers the light emitting element 200 in the element positioning apparatus 20 to the printed circuit board 102 in the substrate positioning apparatus 20, and mounts the light emitting element 200 on the printed circuit board 102.

[0134] The manufacturing apparatus 10 according to this embodiment makes it possible to manufacture a substrate device that reduces the difference in characteristics between adjacently mounted light-emitting elements 200 on the printed circuit board 102, compared to when the light-emitting elements 200 are mounted only in a predetermined order, and also makes it possible to avoid interruptions in manufacturing by mounting a further light-emitting element 200 (an example of a third element) adjacent to the light-emitting element 200 (an example of a first element) in place of the next light-emitting element 200 (an example of a second element).

[0135] The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit and scope of the present invention, all of which are included in the technical concept of the present invention. [Explanation of symbols]

[0136] 10 Manufacturing equipment 13 Supply section 14 wafers 17 Moving mechanism 50 Transfer device 53 Moving mechanism 57 Colette 60 Transfer device 70 Colette 100 Light emitting substrate device 102 Printed Circuit Board 200, 200A, 200B, 200C, 200D Light-emitting element 300 Element manufacturing equipment 306 Moving mechanism 310 Gripping mechanism 401, 402 Tray CG, DCG1, DCG2, DCG3, DCG4 Center of Gravity

Claims

1. A first step of gripping first elements cut out from a wafer in a predetermined gripping order and mounting the first elements on a substrate; a second step of grasping a third element cut out from the wafer, the third element being a distance between the first element and a second element cut out from the wafer that is within the predetermined range on the wafer, and mounting the third element adjacent to the first element on a substrate, after grasping and discarding the second element, or without grasping the second element; A method for manufacturing a substrate device, comprising:

2. A first step of gripping a first element cut out from a wafer and mounting the first element on a substrate; a second step of gripping a third element cut out from the wafer, the third element being the first element, and the distance between the third element and the first element being within the predetermined range on the wafer, when the distance between the second element and the first element cut out from the wafer is outside the predetermined range on the wafer, and mounting the third element on a substrate adjacent to the first element; Equipped with A method for manufacturing a substrate device, wherein the distance is defined by the difference between the distance between the center of gravity of the wafer and the center of gravity of one element on the wafer and the distance between the center of gravity of the wafer and the center of gravity of another element on the wafer.

3. The distance is defined by the distance between the center of gravity of one element on the wafer and the center of gravity of another element on the wafer. A method for manufacturing a substrate device according to claim 1 .

4. a supply unit that supplies elements to be mounted on a substrate from a plurality of elements cut out from a wafer; a transfer device that transfers the element using a gripping tool for gripping the element in the supply section; Equipped with the supply unit has a moving mechanism that moves the element for gripping by the gripper; a transfer device that transfers a first element of the plurality of elements to be mounted on the substrate in accordance with a predetermined gripping order, and then, if a distance between a second element of the plurality of elements and the first element is outside a predetermined range on the wafer and a distance between a third element of the plurality of elements and the first element is within the predetermined range on the wafer, the transfer device grips the second element and discards the second element, or without gripping the second element, and then the moving mechanism moves the third element to a position where the gripping tool will grip the third element.

5. A supply unit that supplies elements to be mounted on a substrate from a plurality of elements cut out from a wafer; a transfer device that transfers the element using a gripping tool for gripping the element in the supply section; Equipped with the supply unit has a moving mechanism that moves the element for gripping by the gripper; a manufacturing apparatus, wherein, after the transfer device transfers a first element of the plurality of elements to mount it on the substrate, if a distance between a second element of the plurality of elements and the first element is outside a predetermined range on the wafer and a distance between a third element of the plurality of elements and the first element is within the predetermined range on the wafer, the moving mechanism moves the third element to a position where the gripping tool grips the third element, A manufacturing apparatus, wherein the distance is defined by the difference between the distance between the center of gravity of the wafer and the center of gravity of one element on the wafer and the distance between the center of gravity of the wafer and the center of gravity of another element on the wafer.

6. an element positioning device for positioning the element transferred by the transfer device; a substrate positioning device for positioning the substrate; 6. The manufacturing apparatus according to claim 4, further comprising: another transfer device that transfers the element in the element positioning device to the substrate in the substrate positioning device, and mounts the element on the substrate.

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