Inspection Equipment

Abstract

To prevent the interference between an object to be inspected and an inspection device without complicating a configuration.SOLUTION: An inspection device comprises: an object-to-be-inspected information acquisition unit that, in order to avoid the interference between an object to be inspected and an inspection device, acquires information on the object to be inspected including a non-interference index related to a space area to be ensured in relation to the object to be inspected; and an allowable imaging condition determination unit that determines an allowable imaging condition that is an imaging condition in which an image of the object to be inspected can be picked up without interfering with the object to be inspected.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an inspection device. [Background technology]

[0002] Conventionally, an object to be inspected is irradiated with X-rays, and the quality of the object is judged based on the obtained two-dimensional projected image or three-dimensional data. Such X-ray inspection devices are used to inspect, for example, the soldering condition of mounted components soldered to a printed circuit board or the quality of wiring patterns on the board.

[0003] In recent years, with the increase in demand for EVs (Electric Vehicles), there has been an increasing demand for inspection of EV inverter boards, which have larger vertical clearances than conventional boards.The larger vertical clearances of these inspection objects than conventional boards place restrictions on how X-ray inspection equipment can be used.

[0004] For this reason, for example, in order to measure the three-dimensional shape of a long measurement object that does not fit on the rotating stage on which the measurement object is placed, such as in the three-dimensional shape measuring device described in Patent Document 1, a configuration has been proposed to prevent collision between the measurement object and the device by using a collision detection unit and a movement control unit that controls the movement of the placement unit and stops the movement of the placement unit when a collision detection signal is output by the collision detection unit. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-25913 Summary of the Invention [Problem to be solved by the invention]

[0006] However, providing a sensor to detect collisions between the inspection object and the device increases the complexity and cost of the device, and the inclusion of a collision detection sensor may cause interference between the inspection object and the device depending on how the user uses it.

[0007] The present invention has been made in view of the above-mentioned problems, and has as its object to prevent interference between an inspection object and an inspection device without complicating the configuration. [Means for solving the problem]

[0008] To solve the above problems, the present invention provides: An inspection device that captures and inspects an object to be inspected, an inspection object information acquisition unit that acquires information about the inspection object, including a non-interference index related to a spatial region that should be secured for the inspection object; an allowable imaging condition determination unit that determines allowable imaging conditions that are imaging conditions under which an image of the inspection object can be captured without interfering with the inspection object; The present invention is characterized by the following.

[0009] According to this, information about the inspection object including a non-interference index, which is an index related to a spatial region that should be secured for the inspection object, is acquired by input by a user, and allowable imaging conditions, which are imaging conditions under which the inspection object can be imaged without interfering with the inspection object, are determined based on the acquired non-interference index. By imaging the inspection object according to the allowable imaging conditions thus determined, interference between the inspection object and the inspection device can be prevented without complicating the configuration. It is possible.

[0010] In addition, in the present invention, The imaging device may further include an allowable imaging condition display unit that displays the allowable imaging conditions.

[0011] This allows the user to recognize the allowable imaging conditions under which the inspection of the inspection object can be performed without interference between the inspection object and the inspection device. If there are multiple allowable imaging conditions, the user may select one, or the inspection device may select an appropriate imaging condition from the multiple allowable imaging conditions.

[0012] In addition, in the present invention, The apparatus may further include a notification unit that notifies the user that the inspection object cannot be inspected if the allowable imaging conditions do not exist for the acquired information about the inspection object.

[0013] This allows the user to recognize that the desired inspection object cannot be inspected without interference between the inspection object and the inspection device, thereby preventing the user from causing interference between the inspection object and the inspection device when attempting to inspect the object. The notification method for the fact that inspection of the inspection object is not possible is not limited, and may be an audio notification such as a buzzer, a flashing lamp, or a message displayed on a display unit. Furthermore, imaging conditions that cause interference between the inspection object and the inspection device may be displayed.

[0014] In addition, in the present invention, an input imaging condition acquisition unit that acquires input imaging conditions, The allowable imaging condition determination unit may determine the allowable imaging conditions from the input imaging conditions.

[0015] According to this, when the user inputs the imaging conditions he or she desires, the allowable imaging conditions are determined from the input imaging conditions, so that an examination can be performed under the imaging conditions he or she desires.

[0016] In addition, in the present invention, a non-interference condition storage unit that stores a non-interference condition associated with an imaging condition in order to image the inspection object according to the imaging condition without interfering with the inspection object; The allowable imaging condition determination unit may determine, based on the non-interference index and the non-interference condition, the imaging condition that is determined to be capable of imaging the object to be inspected without interfering with the object to be inspected, as the allowable imaging condition.

[0017] According to this, the allowable imaging conditions are determined by determining whether or not imaging of the object to be inspected according to the imaging conditions is permissible based on information about the object to be inspected, including a non-interference index, which is an index regarding the spatial region that should be secured for the object to be inspected, and based on the non-interference conditions associated with the imaging conditions in order to image the object to be inspected according to the imaging conditions without interfering with the object to be inspected, thereby making it possible to prevent interference without complicating the configuration.

[0018] In addition, in the present invention, The inspection object may be imaged according to the allowable imaging conditions.

[0019] According to this, the inspection object is imaged according to the determined allowable imaging conditions, so that the inspection can be carried out without having to change the inspection object and the inspection device.

[0020] In addition, in the present invention, The imaging conditions may include a resolution of the captured image.

[0021] In addition, in the present invention, The inspection object may be imaged by irradiating it with X-rays. [Effects of the Invention]

[0022] According to the present invention, it is possible to prevent interference between an object to be inspected and an inspection device without complicating the configuration. [Brief explanation of the drawings]

[0023] [Figure 1] 1 is a schematic diagram of a hardware configuration of an X-ray inspection apparatus according to an embodiment of the present invention. [Figure 2]1 is a block diagram showing the configuration of an X-ray inspection apparatus according to an embodiment of the present invention. [Figure 3] 10 is a flowchart illustrating a procedure for an imaging condition prohibition process of the X-ray inspection apparatus according to the embodiment of the present invention. [Figure 4] 10 shows an example of a display on a UI unit of an X-ray inspection apparatus according to an embodiment of the present invention. [Figure 5] 10A and 10B are diagrams showing other display examples of the UI unit of the X-ray inspection apparatus according to the embodiment of the present invention. [Figure 6] FIG. 3 is a diagram showing an imaging condition table of the X-ray inspection apparatus according to the embodiment of the present invention. [Figure 7] 3A and 3B are diagrams showing examples of display on a result display unit of the X-ray inspection apparatus according to the embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0024] [Application example] Hereinafter, application examples of the present invention will be described with reference to the drawings.

[0025] FIG. 1 shows a schematic configuration of an X-ray inspection apparatus 1 to which the present invention is applied. The X-ray inspection device 1 irradiates an object to be inspected, such as a substrate 14, placed on a stage 11 with X-rays from an X-ray generator 12, detects the X-rays that pass through the object to be inspected with an X-ray detector 13, and processes the detected signal to generate a 2D or 3D image of the object to be inspected.

[0026] When various components are mounted on the substrate 14 that is the object to be inspected, or when the object to be inspected is a package including multiple substrates 14, there is a possibility that the object to be inspected will interfere with the X-ray inspection device 1. In particular, when setting the resolution, it is necessary to change the positional relationship between the X-ray generator 12 and the X-ray detector 13 and the object to be inspected, and therefore it may not be possible to select a specific resolution due to interference between the object to be inspected and the X-ray inspection device 1. Furthermore, depending on the object to be inspected, it may not be possible to select any resolution.

[0027] For this reason, the X-ray inspection apparatus 1 is provided with a UI 311 for allowing a user to input information about an object to be inspected, as shown in Fig. 4. Through this UI 311, the X-ray inspection apparatus 1 acquires, for example, an upper clearance above (from PCB top) 311g from the top surface of the board, a board thickness 311f, and a lower clearance below (from PCB bottom) 311h from the bottom surface of the board, as indicators related to a spatial region that should be secured above the board 14 to avoid interference with the X-ray inspection apparatus 1.

[0028] On the other hand, as shown in Figure 6, the X-ray inspection apparatus 1 stores an imaging condition table 41 in which, in association with each resolution, the upper clearance threshold and the lower clearance threshold of the inspection object that can be imaged at that resolution are set.

[0029] The threshold values stored in the imaging condition table 41 are compared with the upper and lower clearances input by the user via the UI 311 to determine whether or not each resolution can be used. If the upper clearance of the object is 10 mm and the lower clearance is 30 mm, it is determined that resolutions of 5 to 25 μm are usable but resolution 30 μm is not usable under the imaging conditions shown in Fig. 6. In accordance with this determination result, usable resolutions are displayed to notify the user, and inspection at a resolution that may cause interference between the object under inspection and the X-ray inspection device 1 is prohibited, while inspection at a resolution that does not cause interference between the object under inspection and the X-ray inspection device 1 is permitted, thereby making it possible to prevent interference between the object under inspection and the X-ray inspection device 1 without complicating the configuration with sensors, etc.

[0030] Example 1 Hereinafter, the configuration of an X-ray inspection apparatus 1 according to a first embodiment of the present invention will be described with reference to the drawings. However, the configuration of the apparatus described in this embodiment should be appropriately modified depending on various conditions. In other words, it is not intended that the scope of the present invention be limited to the following embodiment.

[0031] (X-ray inspection equipment) FIG. 1 is a diagram schematically showing a hardware configuration of an X-ray inspection apparatus according to an embodiment of the present invention.

[0032] The X-ray inspection apparatus 1 generally includes a control device 10, a stage 11, an X-ray generator 12, and an X-ray detector 13. This X-ray inspection apparatus 1 is an X-ray board inspection apparatus that inspects an object to be inspected, such as a board 14 placed on the stage 11 (for example, inspecting solder joints of components 15 mounted on the board 14).

[0033] The X-ray generator 12 is a means for irradiating the substrate 14 with X-rays and is composed of, for example, a cone beam or fan beam X-ray generator. The X-ray detector 13 is an imaging means for detecting X-rays that have passed through the substrate 14 and outputting data of the X-ray transmission image and is composed of, for example, a scintillator and a two-dimensional CMOS sensor. The stage 11 is a means for holding and transporting the substrate 14 and aligns the field of view of the imaging system consisting of the X-ray generator 12 and the X-ray detector 13 with the position of the component 15. Note that when moving the field of view, the stage 11 may be moved, or the imaging system (X-ray generator 12 and X-ray detector 13) may be moved, or both the stage 11 and the imaging system may be moved.

[0034] The X-ray inspection device 1 is capable of performing both 2D imaging, which acquires a 2D image by irradiating X-rays once, and 3D imaging, which acquires a 3D image by irradiating X-rays multiple times. When performing 2D imaging, X-rays are irradiated from a direction perpendicular to the substrate surface (i.e., the Z direction). On the other hand, when performing 3D imaging, one field of view is imaged multiple times while changing the X-ray irradiation direction. Therefore, the X-ray inspection device 1 also has a movement mechanism (not shown) for changing the X-ray irradiation direction with respect to the substrate 14. There are various configurations of the movement mechanism, such as a system in which the X-ray generator 12 and the X-ray detector 13 rotate around the substrate 14, a system in which the X-ray generator 12 and the X-ray detector 13 are fixed and the substrate 14 rotates, or a system in which the X-ray generator 12 and the X-ray detector 13 each rotate with the substrate 14 sandwiched between them, and any of these systems may be adopted.

[0035] The control device 10 is a device that controls and processes the X-ray inspection device 1 (for example, movement of the field of view, irradiation of X-rays, capture of X-ray transmission images, generation of 2D images, generation of 3D images, estimation of 3D geometric information, inspection processing, cooperation with external devices, data transmission, etc.). The control device 10 can be configured, for example, by a general-purpose computer equipped with a CPU (processor), memory, input devices (keyboard, mouse, touch panel, etc.), display device, communication I / F, etc. The memory includes a main memory device and an auxiliary memory device. The main memory device is used as a working area for the CPU 15, a storage area for programs and data, and a buffer area for communication data. The main memory device is formed, for example, by Random Access Memory (RAM) or a combination of RAM and Read Only Memory (ROM). The auxiliary memory device stores data executed by the CPU 15. Auxiliary storage devices are used to store programs and data used when executing the programs. Examples of auxiliary storage devices include hard disk drives (HDDs), solid state drives (SSDs), flash drives, and flash memory cards. Flash memory, Electrically Erasable Programmable Read-Only Memory (EEPRO M). The auxiliary storage device also includes a portable storage medium that is detachable from the control device 10. In this case, the control device 10 may be configured by one computer, or may be realized by the cooperation of multiple computers. For example, distributed computing or cloud computing technology may be used. The functions of the control device 10, which will be described later, are realized by a CPU (processor) executing the necessary programs. However, it is also possible to configure some or all of the functions using circuits such as ASIC or FPGA.

[0036] (Control device) 2 is a block diagram of the X-ray inspection apparatus 1 including the functional configuration of the control device 10. The control device 10 mainly includes a calculation unit 20, a UI unit 30, and an imaging condition storage unit 40. The control device 10 includes known functional units that realize the various controls and processes described above, but descriptions of these will be omitted.

[0037] The calculation unit 20 includes a clearance calculation unit 21, a clearance information storage unit 22, and an imaging condition prohibition processing unit .

[0038] The UI unit 30 includes an inspection object information acquisition unit 31 and a result display unit 32 .

[0039] The imaging condition storage unit 40 stores imaging conditions such as resolution, which will be described later. The imaging condition storage unit 40 can be configured by a predetermined area of the main storage device of the control device 10.

[0040] (Image capture condition prohibition processing) The procedure for the imaging condition prohibition process will be described below with reference to the flowchart shown in FIG.

[0041] First, the user inputs information about the board 14, which is the object to be inspected (step S1). Fig. 4 shows an example of the configuration of a UI (User Interface) 311 displayed on the display unit of the control device 10 so that the user can input information about the board 14. On the left side of the screen of the UI 311, there are displayed a board name (PCB Name), a board width (PCB Width 311a), a board length (PCB Length 311b), a transport Transport Width 311c, Clamping Amount 311d, Reference Position 311e, PCB Thickness 311f, from the top of the board Clearance above (from PCB top) 311g, clearance below (from PCB bottom) Clearance below (from PCB bottom) 311h, Inspection height (from PCB bottom) 311i, Library Name, Comments The items that the user can input or select, such as Comment and Others, are displayed. In addition, an area for displaying various detailed information is provided. Also, on the left side of the screen of UI 311, there is provided an OK button 311j for confirming input or selected information, and a Cancel button 311k for canceling input or selected information. Also, on the right side of the screen of the inspection object information acquisition UI, a rectangular shape representing the board is displayed along with guidance 311m explaining the board length and board width, and further, guidance 311n explaining the board thickness, upper clearance, and lower clearance for the board supported on the conveyor is displayed. UI 311 shown in FIG. 4 shows the case where the inspection object is a single board.

[0042] The above-mentioned board name, board width 311a, board length 311b, conveyance width 311c, clamp length 311d, reference position 311e, board thickness 311f, and upper clearance (from the top surface of the board) 311 The information about the substrate 14, the bottom clearance 311g (from the bottom surface of the substrate), the bottom clearance 311h (from the bottom surface of the substrate), and the inspection height 311i (from the bottom surface of the substrate) are information about the substrate 14, and correspond to information about the inspection object of the present invention. Here, the top clearance 311g (from the top surface of the substrate) is an index indicating the height of a spatial region (represented by a rectangle above the substrate in the guidance 311n) that should be secured from the top surface of the substrate 14 to avoid interference between the substrate 14 and the X-ray inspection apparatus 1, as shown in the guidance 311n. The bottom clearance 311h (from the bottom surface of the substrate) is also an index indicating the height of a spatial region (represented by a rectangle below the substrate in the guidance 311n) that should be secured from the bottom surface of the substrate 14 to avoid interference between the substrate 14 and the X-ray inspection apparatus 1, as shown in the guidance 311n. The top clearance 311g and the bottom clearance 311h correspond to non-interference indexes of the present invention. The UI 311 corresponds to an inspection object information acquisition unit of the present invention.

[0043] FIG. 5 shows an example of the configuration of the inspection target information acquisition UI 312 when the inspection target includes multiple stacked substrates or a package containing a substrate. The same components as those in UI 311 are designated by the same reference numerals and will not be described again. The display on the left and upper right sides of the screen of UI 312 is the same as that of UI 311, but the display on the lower left side of the screen is different. Here, guidance 312n is displayed, explaining the substrate thickness, upper clearance, inspection height, and lower clearance (here, the lower surface of the stage is used as the reference) for a substrate included in the inspection target placed on a stage supported on a conveyor. As shown in guidance 312n, the substrate, which is the inspection target, is contained inside a package or the like placed on the stage and is arranged as an internal structure of the package or the like, rather than as a single unit. Here, upper clearance 311g, as shown in guidance 312n, is an indicator indicating the height of a spatial region (corresponding to the upper portion of the rectangle containing the substrate in guidance 312n) that must be secured from the top surface of substrate 14 to avoid interference between the inspection target including substrate 14 and the X-ray inspection apparatus 1. As shown in guidance 312n, inspection height 311i is an indicator indicating the height of a spatial region extending from the underside of substrate 14 to the underside of stage 11 to avoid interference between the X-ray inspection apparatus 1 and the inspection object including substrate 14 (which corresponds to the stage and the portion below the substrate in the rectangle including the substrate in guidance 312n). Also, bottom clearance 311h is an indicator indicating the height of a spatial region extending from the underside of the stage to avoid interference between the X-ray inspection apparatus 1 and the inspection object including substrate 14 (which corresponds to the portion below the stage in guidance 312n) as shown in guidance 312n. Top clearance 311g, inspection height 311i, and bottom clearance 311h correspond to non-interference indicators in the present invention. UI 312 corresponds to an inspection object information acquisition unit in the present invention. The spatial area to be secured to avoid interference between the object to be inspected, including the substrate 14, and the X-ray inspection device 1 is not limited to a spatial area having a rectangular parallelepiped shape with a rectangular cross section as exemplified by the guidance 311n and the guidance 312n, but may also be an irregularly shaped spatial area whose height in the Z direction varies depending on the position of the XY plane parallel to the substrate 14 shown in Figure 1, and the largest height of the non-interference indicator for such a spatial area may be represented as an upper clearance, or multiple non-interference indicators may be used for one spatial area.

[0044] 4 or UI 312 shown in Fig. 5, the user inputs information about the substrate, which is the object to be inspected, such as the substrate width, substrate length, substrate thickness, upper clearance, lower clearance, and inspection height, and this information is acquired by the X-ray inspection apparatus 1. The acquired information about the object to be inspected is stored in the imaging condition storage unit 40.

[0045] Next, the clearance calculation unit 21 performs a clearance check (step S2). The clearance calculation unit 21 acquires the inspection object information input by the user from the imaging condition storage unit 40. For example, the upper clearance of the substrate, which is the inspection object, is set to 10 and the lower clearance is set to 30. The clearance calculation unit 21 acquires the set values associated with each resolution from the imaging condition storage unit 40. The imaging condition storage unit 40 stores an imaging condition table 41 in which the upper clearance threshold and the lower clearance threshold for each resolution are registered, as shown in FIG. 6. When the resolution is finer, the X-ray generator 12 is moved closer to the object under inspection, and when the resolution is coarser, the X-ray detector 13 is moved closer to the object under inspection. Therefore, when the resolution is finer, the upper clearance threshold is smaller and the lower clearance threshold is larger. When the resolution is coarser, the lower clearance threshold is smaller and the upper clearance threshold is larger. Therefore, the upper clearance and lower clearance of the object under inspection as described above are compared with the thresholds for each resolution to determine whether or not the resolution can be used. In the example shown in FIG. 6, the upper clearance 10 of the object under inspection is smaller than the upper clearance threshold for any of the resolutions of 5 to 30 (μm). On the other hand, the bottom clearance 30 (mm) of the inspection object is smaller than the bottom clearance threshold for a resolution of 5 to 25 (μm), but larger than the bottom clearance threshold 10 (mm) for a resolution of 30 (μm). Therefore, although the above-mentioned inspection object can be imaged at a resolution of 5 to 25 (μm), it cannot be imaged at a resolution of 30 (μm) due to interference between the inspection object and the X-ray inspection device 1. In other words, when inspecting the above-mentioned inspection object with the X-ray inspection device 1, a resolution of 5 to 25 (μm) is usable, but a resolution of 30 (μm) is not usable. In this way, the resolution used to inspect the substrate 14 is determined. The results of the clearance check in the clearance calculation unit are stored in the clearance information storage unit 22. Here, the top clearance threshold and bottom clearance threshold for each resolution, as well as the imaging condition table 41 in which these are registered, correspond to the non-interference conditions of the present invention. Furthermore, the imaging condition storage unit 40 corresponds to the non-interference condition storage unit of the present invention.

[0046] In the example described above, since it is determined that there are imaging conditions that can be used in the clearance check, the process proceeds from step S3 to step S4, and imaging condition prohibition processing unit 23 displays the usable resolutions (and unusable resolutions) on the display unit. Fig. 7 shows an example screen 321 of result display unit 32 that displays the usable resolutions and unusable resolutions, which are the imaging conditions. Here, of the resolutions 5 to 30 (µm) prepared in X-ray inspection apparatus 1, usable resolutions 5 to 25 (µm) are displayed as active buttons that the user can select, and the unusable resolution 30 (µm) is displayed as an inactive button that the user cannot select. Furthermore, imaging condition prohibition processing unit 23 stores in imaging condition storage unit 40 specific imaging conditions, in this case, resolutions of 5 to 25 (μm) that can be used and resolutions of 30 (μm) that cannot be used, so that when inspecting the inspection object, the information stored in imaging condition storage unit 40 is read out, and imaging at resolutions of 5 to 25 (μm) is permitted and imaging at resolution 30 (μm) is prohibited in X-ray inspection apparatus 1. Here, result display unit 32 corresponds to the allowed imaging condition display unit of the present invention.

[0047] In step S4, available imaging conditions (here, resolution) are displayed and it is determined that the inspection of the substrate, which is the object to be inspected, is possible, so the process proceeds to step S5, a step for carrying in the object to be inspected, and the inspection is carried out.

[0048] If it is determined in the clearance check of step S2 that there is no usable resolution, it is determined that the inspection of the substrate, which is the object to be inspected, is not possible, so the process proceeds from step S3 to step S5, a warning to the effect that there is no usable resolution is displayed on the result display unit 32, and the inspection of the substrate, which is the object to be inspected, is not carried out, and the process returns to step S1 to accept input of information regarding the next object to be inspected. Here, the result display unit 32 corresponds to the notification unit of the present invention.

[0049] In this way, inspection under imaging conditions that would cause interference between the inspection object and the X-ray inspection apparatus 1 is prohibited in advance based on the information on the inspection object. Interference between the inspection object and X-ray inspection apparatus 1 can be prevented.

[0050] In the above-described embodiment, the user inputs inspection object information including non-interference indicators such as upper clearance, but the user may also input imaging conditions such as the resolution that the user desires to use. A field or the like for inputting the resolution may be provided in UI 311 shown in Fig. 4 or UI 312 shown in Fig. 5. In this case, the input resolution corresponds to the input imaging condition of the present invention, and the inspection object information acquisition unit 31 and UI 311 or UI 312 correspond to the input imaging condition acquisition unit of the present invention.

[0051] Furthermore, in the above-described embodiment, the clearance calculation unit 21 determines whether or not the resolution is sufficient to allow imaging without interference based on the threshold value associated with the resolution stored in the imaging condition table 41 and the top clearance, etc. input by the user, but the method for determining the resolution at which imaging can be performed without interference is not limited to this. A table that associates non-interference indicators, such as the top clearance of the substrate to be inspected, with resolutions at which imaging can be performed without interference (which may include interfering resolutions) may be stored in the imaging condition storage unit 40, and the clearance calculation unit 21 may refer to this table to determine the resolution at which imaging can be performed without interference for the non-interference indicator, such as the top clearance, input.

[0052] <Appendix 1> An inspection device (1) that captures and inspects an inspection object (14), an inspection object information acquisition unit (31) that acquires information about the inspection object including a non-interference index related to a spatial region to be secured for the inspection object; an allowable imaging condition determination unit (21) that determines allowable imaging conditions that are imaging conditions under which an image of the inspection object can be captured without interfering with the inspection object; An inspection device comprising: [Explanation of symbols]

[0053] 10: X-ray inspection equipment 14: Substrate 21: Clearance calculation section 31: Inspection object information acquisition unit 40: Imaging condition storage unit

Claims

1. An inspection device that captures and inspects an object to be inspected, an inspection object information acquisition unit that acquires information about the inspection object, including a non-interference index related to a spatial region that should be secured for the inspection object; an allowable imaging condition determination unit that determines allowable imaging conditions, which are imaging conditions under which the inspection object can be imaged without interfering with the inspection object, based on the non-interference index; Equipped with The non-interference indicator is an upper clearance regarding the spatial region to be secured on the upper surface side of the inspection object; a lower clearance regarding the spatial region to be secured on the lower surface side of the inspection object; An inspection device comprising:

2. The non-interference indicator is 2. The inspection device according to claim 1, further comprising an inspection height for the spatial region to be secured when the inspection object is disposed as an internal structure.

3. 3. The inspection apparatus according to claim 1, further comprising an allowable imaging condition display unit that displays the allowable imaging conditions.

4. An inspection device according to any one of claims 1 to 3, characterized in that it is provided with a notification unit that notifies the user that inspection of the object to be inspected is not possible if the allowable imaging conditions do not exist for the acquired information about the object to be inspected.

5. an input imaging condition acquisition unit that acquires input imaging conditions, 4. The inspection apparatus according to claim 1, wherein the allowable imaging condition determining unit determines the allowable imaging conditions from the input imaging conditions.

6. In order to image the inspection object according to imaging conditions without interfering with the inspection object, a non-interference condition storage unit that stores a non-interference condition associated with the imaging condition; The inspection device according to any one of claims 1 to 5, characterized in that the allowable imaging condition determination unit determines, based on the non-interference index and the non-interference condition, the imaging condition that is determined to be capable of imaging the inspection object without interfering with the inspection object as the allowable imaging condition.

7. 7. The inspection apparatus according to claim 1, wherein the inspection object is imaged in accordance with the allowable imaging conditions.

8. 8. The inspection apparatus according to claim 1, wherein the imaging conditions include a resolution of the captured image.

9. 9. The inspection apparatus according to claim 1, wherein the inspection object is imaged by irradiating it with X-rays.

Images