Substrate processing system for processing a substrate

Abstract

To provide a semiconductor processing system for processing semiconductor substrates and provided with a housing formed by a wall.SOLUTION: A system may further comprise a processing module and a cassette module, the cassette module located adjacent to the processing module. An electronics module may be provided with a support for mounting electronic components, whereby the electronics module is located behind a door in a wall of the system to create access for maintenance. The electronic components have a straight mounting basis for mounting of the electronic components whereby the mounting basis is mounted in the system under an angle between 10 and 80 degrees with respect to the door when the door is closed.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates generally to substrate processing systems for processing substrates, and more particularly to providing maintenance to semiconductor processing systems. [Background technology]

[0002] A substrate processing system for processing a substrate may be provided with a housing including a side wall, a rear wall, and a front wall. a processing module provided with a reactor for processing the substrate; a cassette module provided with a load port for supporting a substrate cassette, the cassette module being located near the front wall and in front of the processing module; and an electronics module provided with supports for mounting electronic components. The electronics module may be located behind a door in a wall of the system to create access for working on the electronic components.

[0003] A substrate processing system may have many parts that may require maintenance. For safety reasons, it may be necessary to turn off power before work can begin on certain parts of the system. Therefore, the electronics module may be provided with electronic components, such as, for example, circuit breakers, for switching off power.

[0004] A check is required to measure the power on the cable with a voltage tester to ensure that the power is switched off properly. Such a check may be considered electrical work, and as a result, safety precautions may be required to ensure that maintenance personnel providing electrical work to electronic components have sufficient space to move away from the system in the event of an electronic hazard. Because there is very limited space within cleanroom manufacturing sites where processing systems may be used, only very narrow corridors are left between systems. Therefore, maintenance personnel providing electrical work may have very limited space to move away from electrical components in the event of an electronic hazard. Summary of the Invention

[0005] This Summary is provided to introduce selected concepts in a simplified form. These concepts are described in more detail below in the Detailed Description of the exemplary embodiments of this disclosure. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0006] For certain purposes, it may be desirable to provide a system that can be safely maintained even in confined spaces.

[0007] As a result, a semiconductor processing system for processing semiconductor substrates may be provided, and may be provided with a housing formed by walls. a processing module provided with a reactor for processing the substrate; The system may further include a cassette module provided with a load port for supporting a substrate cassette, the cassette module being located adjacent to the processing module. The electronics module may be provided with a support for mounting electronic components, whereby the electronics module is located behind a door in a wall of the system to create access for maintenance. The electronic components may have a straight mounting base for mounting the electronic components, whereby the mounting base is mounted within the system at an angle of 10 to 80 degrees relative to the door when the door is closed.

[0008] A narrow passageway used by maintenance personnel to perform electrical work on electronic components may be bounded by the walls of adjacent semiconductor processing systems. The front walls of the adjacent semiconductor processing systems may be aligned and form straight walls. This may occur on both sides of the passageway, so the passageway may be small and narrow.

[0009] By attaching the mounting base of the electronic component at an angle between 10 degrees and 80 degrees to the door when the door is closed, the maintenance worker will work through the open door at an angle between 10 degrees and 80 degrees to the electronic component. If there is a danger, the maintenance worker will move away from the electronic component, and the maintenance worker will not move in a direction perpendicular to the wall where the door is located, but will move in a direction at an angle between 10 degrees and 80 degrees to the door. The width of the narrow passage in this direction is much larger than the width in the direction perpendicular to the wall. Therefore, there is more space for the maintenance worker to ensure his or her own safety within the narrow passage.

[0010] For purposes of summarizing the invention and the advantages achieved over the prior art, certain objects and advantages of the invention have been described hereinabove. It is, of course, to be understood that not necessarily all such objects or advantages may be achieved in accordance with any particular embodiment of the invention. Thus, those skilled in the art will recognize that the invention may be embodied or carried out in a manner to achieve or optimize one advantage or group of advantages, for example, as taught or suggested herein, without necessarily achieving other objects or advantages that may be taught or suggested herein.

[0011] All of these embodiments are intended to be within the scope of the invention disclosed herein. These and other embodiments will be readily apparent to those skilled in the art from the following Detailed Description of Certain Embodiments, which refers to the accompanying drawings, and the invention is not limited to any particular embodiment disclosed. [Brief explanation of the drawings]

[0012] While this specification concludes with claims particularly pointing out and distinctly claiming what are regarded as embodiments of the present disclosure, the advantages of embodiments of the present disclosure may be more readily apparent from the following description of certain specific examples of embodiments of the present disclosure when read in conjunction with the accompanying drawings.

[0013] [Figure 1] FIG. 1 shows a schematic top view of an example substrate processing system according to one embodiment. [Figure 2] FIG. 2 shows a portion of the system of FIG. 1 with the electronics module in an expanded view. DETAILED DESCRIPTION OF THE INVENTION

[0014] While specific embodiments and examples are disclosed below, it will be understood by those skilled in the art that the present invention extends beyond the specifically disclosed embodiments and / or uses of the invention, and obvious modifications and equivalents thereof. Therefore, it is intended that the scope of the disclosed invention should not be limited by the specific disclosed embodiments described below. The illustrations presented herein are not intended to be the actual appearance of any particular material, structure or device, but merely idealized representations used to describe embodiments of the present disclosure.

[0015] As used herein, the terms "substrate" or "wafer" may refer to any underlying material that may be used or upon which a device, circuit, or film may be formed. The term "semiconductor device structure" may refer to any portion of a processed or partially processed semiconductor structure that is, includes, or defines at least a portion of an active or passive component of a semiconductor device formed on or in a semiconductor substrate. For example, semiconductor device structures may include active and passive components of an integrated circuit, such as transistors, memory elements, transducers, capacitors, resistors, conductive lines, conductive vias, conductive contact pads, etc.

[0016] 1 shows a schematic top view of an example of a substrate processing system, such as a furnace 1, according to an embodiment. The furnace 1 comprises a housing 2 having a front wall 4 and a rear wall 6.

[0017] The furnace 1 may include a cassette module 3 having a storage device, such as a cassette storage carousel 5, for storing a plurality of wafer cassettes C, each containing a plurality of substrates. The cassette storage carousel 5 may include multiple platform stages for supporting the cassettes. The platform stages may be connected to a central shaft rotatably mounted about a vertical axis. Each platform stage is configured to accommodate a number of cassettes C. A drive assembly is operably connected to the central shaft for rotating the central shaft with the multiple platform stages about the vertical axis.

[0018] The cassette module 3 may have a cassette handler 7 having a cassette handler arm 9 configured to transfer cassettes C between the cassette storage carousel 5, the cassette entry / exit port 11 adjacent the front wall 4 of the housing 2 of the furnace 1, and / or the loading port 15. The cassette handler 7 may include a lifting mechanism to reach cassettes at different heights. Each platform stage for storing cassettes may have a cutout therein sized and shaped to allow the cassette handler arm 9 to pass vertically therethrough and to allow the platform stage to support a cassette C thereon.

[0019] An interior wall 19 may be provided separating the cassette module 3 from the processing module 8. The interior wall 19 may have a closable substrate access opening 33 adjacent to a load port 15 that may be constructed and positioned to open the cassette C. A cassette turntable may be provided at the load port 15 to rotate the cassette C and / or press the cassette C against the closable substrate access opening 33.

[0020] The substrate processing module 8 may comprise a substrate handling robot 35 provided with a substrate handling arm 36 for transferring substrates from a cassette C positioned in the load port 15 to a substrate rack through a closable substrate access opening 33 and vice versa. The furnace may comprise a substrate handling chamber 37 in which the substrate handling robot 35 is housed.

[0021] The housing 2 may have first and second side walls 47 that extend the entire length of the furnace 1. The distance between the furnace side walls 47, which may define the width of the system, may be 190-250 cm, preferably 210-230 cm, and most preferably approximately 220 cm. Maintenance of the furnace 1 may be performed from the rear 6 or front 4 of the furnace, thereby eliminating the need for doors on the side walls 47.

[0022] By constructing side walls 47 without doors, multiple furnaces 1 may be positioned side by side within a semiconductor fabrication facility. The side walls of adjacent furnaces may thereby be positioned very close together, or even in contact with one another. Advantageously, multiple furnaces may form a wall with the front side 4 of the furnace 1 interconnecting with a cassette transport system located in the very clean environment of a so-called "clean room" that has very strict requirements for particles. The back side 6 of the furnace 1 may interconnect with a narrow maintenance aisle that may have less strict particle requirements than the front side 4.

[0023] The furnace 1 may be provided with a first reactor and a second reactor 45 for processing multiple substrates. The use of two reactors may increase the productivity of the furnace 1. The substrate processing system in top view may be configured substantially in a U-shape. The first reactor and the second reactor 45 may be constructed and arranged on legs. A maintenance area 43 may be constructed and arranged between the legs of the U-shape.

[0024] Figure 2 shows a portion of the substrate processing system of Figure 1, and more particularly, in an enlarged view, the cassette module 3 with the electronics module 21. Different internal components of the cassette module 3 in Figure 1 have been removed in Figure 2 for clarity.

[0025] The electronics modules 21 may be provided with supports, such as mounting walls 23, for rigidly mounting the electronic components 25 thereto. The mounting walls 23 may be rigidly connected to the frame of the cassette module 3. The mounting walls 23 may be mounted parallel to the front wall 4. The electronics modules 21 may be located behind a door 29 on the front wall 4 of the system. The door 29 may be opened to create access for maintenance on the electronic components 25.

[0026] The electronic component 25 may have a straight mounting base 31 for mounting the electronic component. The mounting base 31 may be mounted within the system at an angle A. The angle A may be determined about a substantially vertical axis, for example, an axis substantially perpendicular to the floor on which the system is supported. The angle A may be 5 to 85 degrees, preferably 10 to 60 degrees, more preferably 20 to 50 degrees, and most preferably approximately 35 degrees, relative to the door 29 when the door is closed. When the door 29 is closed, the door may be parallel to the front wall 4. The electronic component 25 may be mounted within the system 5 to 25 cm behind the door 29.

[0027] The electronic components may include circuit breakers. The circuit breakers may be used by maintenance personnel to switch off power to the system, for example, to switch off power to the cassette handler 7 or any other electrical actuators in the system. To check whether the 220 / 230 volt power supply has been properly switched off, the maintenance personnel may use a voltage tester to measure that no voltage remains. Therefore, the test probes of the voltage tester may be moved into holes provided on the front of the electrical components 25 to connect to the power carriers. This test is considered electrical work, and strict safety standards apply.

[0028] A narrow passageway used by maintenance personnel to provide electrical work to electronic components 25 may be bounded on one side by the front walls 4 of adjacent semiconductor processing systems 1. The front walls 4 of these adjacent semiconductor processing systems may be aligned and form a straight wall. Another adjacent semiconductor processing system may be aligned and form a straight wall on the other side of the narrow passageway. The narrow passageway may be small and narrow to keep the manufacturing floor compact.

[0029] By attaching the mounting base 31 of the electronic component 25 at an angle A of 10 to 80 degrees relative to the door 29 when the door is closed, a maintenance worker may perform work on the electronic component 25 through the door, which is opened at an angle between 10 and 80 degrees relative to the direction perpendicular to the front wall 4. In the event of an electrical hazard, the maintenance worker may need to move quickly away from the electronic component 25. The maintenance worker does not move in a direction perpendicular to the front wall 4 where the door 29 is located, but moves in a safety direction S that is at an angle between 10 and 80 degrees relative to the front wall. The width of the passageway in this direction may be greater than that in the direction perpendicular to the front wall 4. Thus, the maintenance worker has more space to ensure his or her own safety within the passageway. In addition, because the maintenance worker is moving at an angle unequal to 90 degrees relative to the front wall 4, there may be less risk of the object bouncing off the wall on the opposite side of the passageway and bouncing back onto the electrical component.

[0030] While illustrative embodiments of the invention have been described above, in part with reference to the accompanying drawings, it should be understood that the invention is not limited to these embodiments. Variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims.

[0031] Throughout this specification, a reference to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification do not necessarily refer to the same embodiment. Furthermore, it is noted that particular features, structures, or characteristics of one or more embodiments may be combined in any suitable manner to form new embodiments not expressly described.

Claims

1. 1. A semiconductor processing system provided with a housing for processing semiconductor substrates and formed by walls, the housing comprising: a processing module provided with a reactor for processing the substrate; a cassette module located adjacent to the processing module and having a load port for supporting a substrate cassette; 1. The semiconductor processing system of claim 1, further comprising: an electronics module provided with a support for mounting an electronic component, the electronics module being positioned behind a door in a wall of the semiconductor processing system to create access to the electronic component, the electronic component having a straight mounting base for mounting the electronic component, whereby the mounting base is mounted within the semiconductor processing system at an angle of between 5 degrees and 85 degrees relative to the door when the door is closed.

2. 10. The semiconductor processing system of claim 1, wherein said mounting base of said electronic component is mounted at an angle of between 10 degrees and 60 degrees relative to said door when said door is closed.

3. 10. The semiconductor processing system of claim 1, wherein the mounting wall of the electronics module is mounted at an angle of between 20 degrees and 50 degrees relative to the door when the door is closed.

4. The semiconductor processing system of claim 1 , wherein the electronics module is mounted within the semiconductor processing system.

5. 5. The semiconductor processing system of claim 4, wherein said electronic components are mounted on a mounting wall at an angle between 5 degrees and 85 degrees relative to said mounting wall.

6. 6. The semiconductor processing system of claim 5, wherein said mounting wall is mounted within said housing parallel to said door when said door is closed.

7. The semiconductor processing system of claim 1 , wherein the electronic component comprises a circuit breaker.

8. 8. The semiconductor processing system of claim 7, wherein the semiconductor processing system comprises a wafer handling robot configured to transfer semiconductor substrates between a wafer boat and a substrate cassette of the processing module at the load port of the cassette module.

9. The semiconductor processing system according to any one of claims 1 to 8, wherein a front wall of the semiconductor processing system faces a clean room.

10. The cassette module comprises: a substrate cassette receiving platform disposed on a front wall of the semiconductor processing system; 10. The semiconductor processing system of claim 1, further comprising: a cassette handler configured to transport substrate cassettes between the substrate cassette receiving platform and the load port.

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