Holder plate, method for processing the holder plate, and method for manufacturing chips

Abstract

To increase a manufacturing cost of a chip manufactured in a cutting device with a chuck table containing a holding plate and suppress prolongation of a time required for manufacturing the chip.SOLUTION: A holding plate comprises a holding part formed with a plurality of penetration holes for making each of a work piece that holds a suction force occurred in a lower surface side on an upper surface and a plurality of chips action. Then the holding part is made of a material into which the plurality of penetration holes can be embedded by plastic deformation or heating.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a holding plate used in a cutting device that divides a workpiece along multiple planned division lines to produce multiple chips, to apply suction force to the workpiece and each of multiple chips, a processing method for this holding plate, and a method for manufacturing chips using this holding plate. [Background technology]

[0002] A workpiece such as a package substrate is divided into a plurality of regions by a plurality of division lines arranged in a grid pattern, and a semiconductor device is formed in each of the regions. When such a workpiece is divided along the division lines, a plurality of chips each including a semiconductor device are manufactured.

[0003] To divide such a package substrate, for example, a cutting device is used that includes a cutting unit having a spindle with an annular cutting blade attached to the tip and a chuck table that holds the workpiece by applying suction to the workpiece. In this cutting device, the workpiece is divided into multiple chips by bringing a rotating cutting blade into contact with the workpiece held on the chuck table along multiple planned division lines.

[0004] However, to divide the workpiece into multiple chips, the rotating cutting blade must cut into the workpiece so that it penetrates the workpiece, which can cause damage to the chuck table that holds the workpiece.

[0005] Therefore, when dividing a workpiece into multiple chips, a dicing tape is often attached to the workpiece and the workpiece is held on the chuck table via the dicing tape. This allows the workpiece to be divided into multiple chips with the outer edge of the cutting blade that penetrates the workpiece positioned inside the dicing tape. As a result, damage to the chuck table is prevented.

[0006] Furthermore, in this case, the dicing tape is not divided in the areas corresponding to the division lines of the workpiece. That is, the chips are integrated through the dicing tape. Therefore, the possibility of some chips scattering when dividing the workpiece into chips can be reduced.

[0007] Such dicing tape is a consumable item. Therefore, manufacturing chips using this method may increase the manufacturing cost of the chips. In view of this, it has been proposed to divide a workpiece into multiple chips while the workpiece is held on a chuck table that includes a holding plate (jig) having a holding surface that directly holds the workpiece (see, for example, Patent Document 1).

[0008] Specifically, grooves (cutting blade relief grooves) are formed on the holding surface of the holding plate in areas corresponding to the planned dividing lines of the workpiece, and each of the areas (chip corresponding areas) defined by the grooves has a through hole (eject hole) formed therein for applying a suction force to the workpiece and each of the chips.

[0009] When a cutting device is equipped with such a chuck table, the workpiece can be divided into a plurality of chips with the outer edge of the cutting blade that penetrates the workpiece positioned within the internal space of the groove. In this case, the workpiece can be divided into a plurality of chips with suction force acting on the workpiece via the through-hole, reducing the likelihood that some of the chips will fly off during division. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-273546 Summary of the Invention [Problem to be solved by the invention]

[0011] The holding plate is a dedicated product that can only be used for a specific workpiece. In other words, if the arrangement of the multiple planned dividing lines set on the workpiece does not correspond to the arrangement of the grooves formed on the holding plate, the holding plate cannot be used to divide the workpiece.

[0012] Therefore, when a cutting device is equipped with a chuck table including a holding plate, it is necessary to prepare in advance a number of holding plates corresponding to the types of workpieces having different arrangements of multiple planned dividing lines, etc. This may increase the manufacturing cost of chips manufactured using this cutting device and / or lengthen the time required to manufacture the chips.

[0013] In view of the above, an object of the present invention is to suppress an increase in the manufacturing cost of a chip manufactured in a cutting device equipped with a chuck table including a holding plate and a prolongation of the time required to manufacture the chip. [Means for solving the problem]

[0014] According to one aspect of the present invention, in a cutting device for producing a plurality of chips by dividing a workpiece along a plurality of planned dividing lines, a holding plate used for applying a suction force to the workpiece and each of the plurality of chips includes: a holding portion having upper and lower surfaces parallel to each other and having a plurality of through holes formed therein for applying a suction force generated on the lower surface side to the workpiece held on the upper surface side and each of the plurality of chips; and a mounting portion having a surface flush with the lower surface of the holding portion, being thinner than the holding portion and being integrated with the holding portion; and the holding portion is plastically deformable. In shape Therefore, the plurality of through holes can be buried. metal A retainer plate made of material is provided.

[0015] According to another aspect of the present invention , In a cutting device for producing a plurality of chips by dividing a workpiece along a plurality of planned dividing lines, the holding plate is used to apply a suction force to the workpiece and each of the plurality of chips, the holding portion having upper and lower surfaces parallel to each other and having a plurality of through holes formed therein for applying a suction force generated on the lower surface side to the workpiece held on the upper surface side and each of the plurality of chips, and an attached portion having a surface flush with the lower surface of the holding portion, being thinner than the holding portion and being integrated with the holding portion; a resin sheet provided on the upper surface of the holding portion; and, picture The holding portion is provided with a holding plate made of a material that can fill the plurality of through holes by plastic deformation or heating. .

[0016] According to another aspect of the present invention, there is provided a method for processing a holding plate, which includes contacting a rotating annular cutting blade with the upper surface of the holding portion of the holding plate to form grooves on the upper surface of the holding portion in areas corresponding to the plurality of planned dividing lines of the workpiece, and burying the through holes that open at the bottom of the grooves, thereby forming a holding surface that can apply suction force to the workpiece and each of the plurality of chips produced by dividing the workpiece along the plurality of planned dividing lines, while preventing suction force from acting on the internal space of the grooves.

[0017] According to yet another aspect of the present invention, there is provided a method for manufacturing chips by dividing a workpiece along a plurality of planned dividing lines to manufacture a plurality of chips, the method comprising the steps of: or in a cutting device for dividing the workpiece along the plurality of planned dividing lines to produce the plurality of chips, a holding plate used to apply a suction force to the workpiece and each of the plurality of chips, the holding plate comprising: a holding portion having upper and lower surfaces parallel to each other and formed with a plurality of through holes for allowing the suction force generated on the lower surface side to act on the workpiece held on the upper surface side and each of the plurality of chips; and an attached portion having a surface flush with the lower surface of the holding portion, being thinner than the holding portion and being integrated with the holding portion, the holding portion being made of a material that can have the plurality of through holes buried therein by plastic deformation or heating.a holding surface forming step of forming a holding surface that can apply a suction force to the workpiece and each of a plurality of chips produced by dividing the workpiece along the plurality of planned dividing lines, while preventing the suction force from acting on the internal space of the groove, by bringing a rotating annular holding plate cutting blade into contact with the upper surface of the holding part after the mounting step, thereby forming grooves on the upper surface of the holding part in areas corresponding to the plurality of planned dividing lines of the workpiece, and by sinking through holes of the plurality of through holes that open at bottom surfaces of the grooves; a holding step of holding the workpiece on the holding surface by applying a suction force to the workpiece via through holes of the plurality of through holes that open at areas other than the bottom surfaces of the grooves after the holding step; and a dividing step of bringing a rotating annular workpiece cutting blade into contact with the workpiece along the plurality of planned dividing lines, thereby dividing the workpiece into the plurality of chips after the holding step.

[0018] Furthermore, in the chip manufacturing method of the present invention, it is preferable that the holding surface forming step comprises a groove forming step in which a cutting blade for the holding plate made of abrasive grains and a bonding material is rotated and brought into contact with the area to form the groove, and an embedding step in which an annular friction member made only of resin is rotated and brought into contact with the bottom surface of the groove to embed the through holes that open at the bottom surface of the groove among the plurality of through holes.

[0019] According to yet another aspect of the present invention, there is provided a method for manufacturing chips by dividing a workpiece along a plurality of planned division lines to produce a plurality of chips, the method comprising: an attachment step of attaching the attachment portion of the holding plate to a table base; a holding step of, after the attachment step, holding the workpiece on the upper surface of the holding portion by applying a suction force to the workpiece through the plurality of through holes; and a simultaneous machining step of, after the holding step, contacting a rotating cutting blade with the workpiece along the plurality of planned division lines to divide the workpiece into the plurality of chips, while contacting the rotating cutting blade with the upper surface of the holding portion to form a groove on the upper surface of the holding portion, and burying the through holes among the plurality of through holes that open at the bottom surface of the groove, thereby forming a holding surface that is capable of preventing a suction force from acting on the internal space of the groove. [Effects of the Invention]

[0020] The holding plate of the present invention includes a holding portion having a plurality of through holes formed therein for applying a suction force generated on the lower surface to the workpiece and the plurality of tips held on the upper surface, and the holding portion is made of a material that can be plastically deformed or heated to fill the through holes.

[0021] Therefore, for example, by contacting a rotating cutting blade with this holding portion, grooves can be formed in the areas of the workpiece corresponding to the multiple planned dividing lines, and the through holes present in these areas can be filled in. This allows a holding surface to be formed on the holding plate that can hold the workpiece and multiple chips.

[0022] Specifically, the suction force generated on the underside of the holding plate can be applied to the workpiece and each of the chips through the remaining through-holes. Furthermore, because there are no through-holes communicating with the internal space of the groove, the suction force does not act on the internal space of the groove. In other words, no leaks occur when the holding plate holds the workpiece or chips.

[0023] In this way, the holding plate of the present invention can easily form a desired holding surface according to the arrangement of multiple planned dividing lines set on the workpiece, etc. As a result, an increase in the manufacturing cost of chips manufactured by a cutting machine equipped with a chuck table including this holding plate and an increase in the time required to manufacture the chips are suppressed. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 1(A) is a perspective view that schematically shows an example of a holding plate, and FIG. 1(B) is a cross-sectional view that schematically shows an example of a holding plate. [Figure 2] FIG. 2 is a perspective view schematically illustrating an example of a cutting device. [Figure 3] FIG. 3 is an exploded perspective view schematically illustrating an example of a table base and an example of a chuck table. [Figure 4] FIG. 4 is a perspective view schematically showing the front surface side of an example of a workpiece. [Figure 5] FIG. 5 is a perspective view schematically showing the back side of an example of a workpiece. [Figure 6] FIG. 6 is a flow chart showing a schematic example of a method for manufacturing a chip. [Figure 7] FIG. 7(A) is a perspective view that schematically shows the state of the holding surface forming step, and FIG. 7(B) is a cross-sectional view that schematically shows an example of the holding plate after the holding surface forming step. [Figure 8] FIG. 8(A) is a perspective view that schematically shows the state of the holding step, and FIG. 8(B) is a partially cross-sectional side view that schematically shows the state of the holding step. [Figure 9] Figure 9(A) is an oblique view schematically showing the division step (S4), and Figure 9(B) is a partially cross-sectional side view schematically showing an example of a holding plate and an example of multiple chips after the division step (S4). [Figure 10] 10 is a flowchart schematically showing a modified example of the chip manufacturing method. [Figure 11]10 is a flowchart schematically showing another modified example of the chip manufacturing method. DETAILED DESCRIPTION OF THE INVENTION

[0025] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] An embodiment of the present invention will be described with reference to the accompanying drawings, in which Fig. 1(A) is a perspective view schematically showing an example of a holding plate, and Fig. 1(B) is a cross-sectional view schematically showing an example of the holding plate.

[0026] 1 has a rectangular parallelepiped mounting portion 4. This mounting portion 4 has an upper surface 4a and a lower surface 4b that are parallel to each other. Furthermore, cylindrical through holes 4c that open to the upper surface 4a and the lower surface 4b are formed near each of the four corners of the mounting portion 4. Bolts are inserted into these through holes 4c to mount a chuck table including the holding plate 2 to a table base (described later).

[0027] Furthermore, a rectangular parallelepiped opening is present in the center of the attachment portion 4, and a rectangular parallelepiped holding portion 6 that is thicker than the attachment portion 4 is provided in this opening. The holding portion 6 has an upper surface 6a and a lower surface 6b that are parallel to each other, and is integrated with the attachment portion 4 so that the lower surface 6b is flush with the lower surface 4b of the attachment portion 4. Therefore, the upper portion of the holding portion 6 protrudes upward from the attachment portion 4.

[0028] For example, the lower portion of the side surface of the holding portion 6 is fixed to the inner circumferential surface of the attachment portion 4 via an adhesive. Alternatively, the attachment portion 4 and the holding portion 6 may be a single structure. Furthermore, a plurality of through holes 6c are formed throughout the entirety of the holding portion 6, each opening on the upper surface 6a and the lower surface 6b. Furthermore, each of the plurality of through holes 6c has a cylindrical shape with a diameter of, for example, 0.3 mm to 0.5 mm.

[0029] Each of the plurality of through holes 6c functions as a suction path for applying a suction force generated on the lower surface 6b to the upper surface 6a when the chuck table including the holding plate 2 is attached to a table base (described later). This allows the holding plate 2 to hold a workpiece such as a package substrate on the upper surface 6a of the holding portion 6.

[0030] The holding portion 6 is made of a material that can be plastically deformed or heated to fill the through-holes 6c. Examples of such a material include metal materials with excellent malleability, such as copper (Cu), tin (Sn), or aluminum (Al), and resins, such as solid wax.

[0031] For example, when the holding portion 6 is made of such a metal material, the metal material present near the upper surface 6a of the holding portion 6 can be plastically deformed, and the plastically deformed metal material can be embedded in the through holes 6c, thereby burying at least a portion of the multiple through holes 6c.

[0032] Furthermore, when the holding portion 6 is made of such a resin, the resin present near the upper surface 6a of the holding portion 6 can be heated and melted, and the melted resin can be cooled and solidified inside the through holes 6c, thereby burying at least a portion of the multiple through holes 6c.

[0033] Furthermore, a resin sheet (not shown) may be provided on the upper surface 6a of the holding part 6. This resin sheet is formed, for example, by spraying a liquid resin in a mist onto the upper surface 6a of the holding part 6 and then drying the liquid resin. This makes it possible to suppress leakage when holding a workpiece on the upper surface 6a side of the holding part 6 and to strengthen the suction force acting on the workpiece.

[0034] Fig. 2 is a perspective view schematically showing an example of a cutting device equipped with a chuck table including a holding plate 2. Note that the X-axis direction (front-back direction) and the Y-axis direction (left-right direction) shown in Fig. 2 are directions perpendicular to each other on a horizontal plane, and the Z-axis direction (up-down direction) is a direction (vertical direction) perpendicular to the X-axis and Y-axis directions.

[0035] 2 includes a base 10 that supports multiple components. An opening 10a that is long in the X-axis direction is formed on the top surface of the base 10. A ball screw type table movement mechanism 12 is disposed within this opening 10a.

[0036] The table moving mechanism 12 includes an X-axis moving table (not shown) and moves the X-axis moving table along the X-axis direction. The tops of the table moving mechanism 12 and the X-axis moving table are covered with a table cover 14 and a bellows-like cover 16.

[0037] On the X-axis moving table, for example, a rectangular parallelepiped table base 18 is arranged in a manner that it is exposed upward from the table cover 14. This table base 18 is connected to a rotary drive source (not shown) such as a motor, and rotates around a straight line parallel to the Z-axis direction as its rotation axis.

[0038] The table base 18 is moved in the X-axis direction together with the X-axis moving table by the above-mentioned table moving mechanism 12. Furthermore, a chuck table 20 for holding the rectangular parallelepiped workpiece 11 is attached to the top of the table base 18 in a manner that allows it to be removed from the table base 18 as needed.

[0039] 3 is an exploded perspective view schematically showing the table base 18 and the chuck table 20. The table base 18 has an upper surface 18a and a lower surface 18b that are parallel to each other, and a rectangular parallelepiped recess 18c is formed on the upper surface 18a side.

[0040] A cylindrical through-hole 18d is formed in the center of the table base 18, and this through-hole 18d opens at the bottom surface of the recess 18c and the lower surface 18b. This through-hole 18d is connected to a suction source such as an ejector.

[0041] Furthermore, an inner wall 18e is provided on the bottom surface of the recess 18c, surrounding the through hole 18d and having an upper surface lower than the upper surface 18a. Also, cylindrical grooves 18f that open to the upper surface 18a are formed near each of the four corners of the table base 18. A spiral groove (thread groove) is formed on the side surface of each groove 18f.

[0042] The chuck table 20 attached to the table base 18 has a rectangular parallelepiped base plate 22. The base plate 22 has a rectangular parallelepiped frame 24 having an upper surface 24a and a lower surface 24b that are parallel to each other.

[0043] A rectangular parallelepiped recess is formed on the upper surface 24a side of the frame 24, and a rectangular parallelepiped porous plate 26 made of ceramics or the like is fixed in this recess. The porous plate 26 has an upper surface 26a and a lower surface (not shown) that are parallel to each other, and the sizes of the upper surface 26a and the lower surface are approximately equal to the size of the bottom surface of the recess 18c of the table base 18.

[0044] Furthermore, a cylindrical through-hole (not shown) is formed in the center of the frame body 24, opening at the bottom surface of the recess and at the lower surface 24b of the frame body 24. Therefore, the recess 18c and through-hole 18d of the table base 18 communicate with the lower surface side of the porous plate 26 via this through-hole.

[0045] An upper surface 24a of the frame 24 has substantially the same shape as an upper surface 18a of the table base 18. A lower surface 24b of the frame 24 has substantially the same shape as a lower surface 18b of the table base 18.

[0046] Furthermore, cylindrical through-holes 24c that open to the upper surface 24a and the lower surface 24b are formed near each of the four corners of the frame body 24. A spiral groove (thread groove) is formed on the side surface of each through-hole 24c.

[0047] Furthermore, this through hole 24c is provided so as to overlap with a groove 18f formed in the table base 18 when the table base 18 and the base plate 22 are stacked together so that the side surface of the table base 18 and the side surface of the base plate 22 (the outer surface of the frame 24) are flush with each other. Then, the holding plate 2 is disposed on the base plate 22.

[0048] The upper surface 4a and lower surface 4b of the mounting portion 4 of the holding plate 2 have substantially the same shape as the upper surface 18a of the table base 18 and the upper surface 24a of the frame 24. The upper surface 6a and lower surface 6b of the holding portion 6 have substantially the same size as the bottom surface of the recess 18c of the table base 18 and the upper surface 26a and lower surface of the porous plate 26.

[0049] Furthermore, the through hole 4c formed in the mounting portion 4 is arranged to overlap with the through hole 24c formed in the frame body 24 and the groove 18f formed in the table base 18 when the table base 18, the base plate 22 and the holding plate 2 are stacked so that the side of the table base 18, the side of the base plate 22 (the outer surface of the frame body 24) and the side of the holding plate 2 (the outer surface of the mounting portion 4) are flush with each other.

[0050] Then, with the table base 18, base plate 22, and holding plate 2 stacked in this manner, by inserting and tightening bolts 28 into the through holes 4c, 24c, and grooves 18f, the mounting portion 4 of the holding plate 2 is mounted to the table base 18 together with the base plate 22 having the frame body 24. In other words, by tightening the bolts 28 in this manner, the chuck table (holding plate 2 and base plate 22) 20 is mounted to the table base 18.

[0051] Furthermore, when the suction source communicating with the through-hole 18d is operated with the chuck table 20 attached to the table base 18, a suction force acts on the upper surface 6a of the holding part 6 via the through-hole 18d, the recess 18c, the porous plate 26, and the plurality of through-holes 6c formed in the holding part 6. This allows the workpiece 11 to be held on the upper surface 6a of the holding part 6.

[0052] Fig. 4 is a perspective view schematically showing the front side of workpiece 11, and Fig. 5 is a perspective view schematically showing the back side of workpiece 11. Workpiece 11 is, for example, a package substrate obtained by sealing a plurality of devices with resin.

[0053] The workpiece 11 includes a substrate 13 having a front surface 13a and a back surface 13b that are substantially the same in shape as the upper surface 6a and the lower surface 6b of the holding portion 6 of the holding plate 2. The substrate 13 is made of a metal material such as 42 alloy (an alloy of iron and nickel) or copper, and includes a plurality of device regions 15 (here, three device regions 15) and a surplus region 17 that surrounds each of the plurality of device regions 15.

[0054] Furthermore, each of the plurality of device regions 15 is divided into a plurality of regions (here, 16 regions) by a plurality of mutually intersecting planned division lines 19. Specifically, each of the plurality of planned division lines 19 is provided in a grid pattern parallel to the long sides or short sides of the front surface 13 a and the back surface 13 b.

[0055] A plurality of stages 21, which are partitioned by a plurality of planned division lines 19, are exposed on the surface 13a side of the substrate 13. A plurality of metal layers (not shown) insulated from each other by, for example, resin or the like are arranged around each of the plurality of stages 21 (areas overlapping with the plurality of planned division lines 19).

[0056] On the rear surface 13b side of each of the stages 21, a device (device chip) (not shown) such as an IC (Integrated Circuit), an LED (Light Emitting Diode), or a MEMS (Micro Electro Mechanical System) is mounted.

[0057] The electrodes of this device are connected to a metal layer disposed around the stage 21 by metal wires (not shown) or the like. Parts of this metal layer become the electrodes of each of the multiple chips obtained by dividing the workpiece 11.

[0058] A resin layer 23 that seals the devices, metal wires, etc. is provided on the back surface 13b side of the substrate 13. The resin layer 23 has a predetermined thickness and protrudes from the back surface 13b of the substrate 13. The resin layer 23 also covers the entire back surface 13b side of each of the multiple device regions 15.

[0059] 2, the remaining components of the cutting device 8 will be described. A gate-shaped support structure 30 is disposed on the upper surface of the base 10 so as to straddle the opening 10a. A pair of cutting unit movement mechanisms 32 are provided on the upper front surface of the support structure 30.

[0060] The pair of cutting unit moving mechanisms 32 are arranged in front of the support structure 30 and share a pair of Y-axis guide rails 34 extending along the Y-axis direction. A Y-axis moving plate 36 constituting each of the pair of cutting unit moving mechanisms 32 is attached to the Y-axis guide rails 34 in a manner that allows it to slide along the Y-axis direction.

[0061] A nut (not shown) constituting a ball screw is fixed to the back surface (rear surface) of this Y-axis moving plate 36. A screw shaft 38 extending along the Y-axis direction is rotatably connected to this nut.

[0062] A Y-axis pulse motor 40 is connected to one end of the screw shaft 38. When the screw shaft 38 is rotated by the Y-axis pulse motor 40, the Y-axis moving plate 36 moves along the Y-axis direction.

[0063] A pair of Z-axis guide rails 42 extending along the Z-axis direction are arranged on the surface (front surface) of the Y-axis moving plate 36. A Z-axis moving plate 44 is attached to the Z-axis guide rails 42 in a manner that allows it to slide along the Z-axis direction.

[0064] A nut (not shown) constituting a ball screw is fixed to the back surface (rear surface) of this Z-axis moving plate 44. A screw shaft 46 extending along the Z-axis direction is rotatably connected to this nut.

[0065] A Z-axis pulse motor 48 is connected to one end of the screw shaft 46. When the screw shaft 46 is rotated by the Z-axis pulse motor 48, the Z-axis moving plate 44 moves along the Z-axis direction.

[0066] A cutting unit 50 is provided below the Z-axis moving plate 44. This cutting unit 50 has, for example, a cylindrical spindle housing that houses a spindle extending along the Y-axis direction and a rotation drive source such as a motor connected to the base end of the spindle.

[0067] The tip of the spindle is exposed to the outside from the spindle housing, and an annular cutting blade 52 or an annular friction member is attached to the tip of the spindle via a blade mount. Therefore, when the rotation drive source connected to the base end of the spindle operates, the cutting blade 52 or friction member rotates together with the spindle, with a straight line along the Y-axis direction as the rotation axis.

[0068] The cutting blade 52 is used to cut the workpiece 11 and the holding portion 6 of the holding plate 2. That is, the cutting blade 52, which rotates together with the spindle, is brought into contact with the workpiece 11 and the holding portion 6 of the holding plate 2, thereby cutting the workpiece 11.

[0069] This cutting blade 52 is a hub-type cutting blade that is configured by integrating an annular base made of, for example, metal, with an annular cutting edge that follows the outer periphery of the base. The cutting edge of the hub-type cutting blade is obtained by fixing abrasive grains made of, for example, diamond or cubic boron nitride (cBN) with a bonding material such as nickel.

[0070] Furthermore, a washer-type cutting blade consisting only of an annular cutting edge may be applied as the cutting blade 52. A washer-type cutting blade (cutting edge) is obtained by fixing abrasive grains made of, for example, diamond or cBN with a bonding material such as resin.

[0071] Furthermore, the cutting blade 52 used to cut the holding portion 6 of the holding plate 2 is designed so that the width of the cutting edge is wider than the width of the plurality of through holes 6c formed in the holding portion 6. For example, if each of the plurality of through holes 6c has a cylindrical shape, the width of the cutting edge of the cutting blade 52 is designed to be 1.1 to 2.5 times the diameter of the cylinder.

[0072] The friction member is also used to heat the holding portion 6 etc. of the holding plate 2. That is, by bringing the friction member, which rotates together with the spindle, into contact with the holding portion 6 etc., heat is generated due to friction between the friction member and the holding portion 6 etc., and this heat can be used to heat the holding portion 6 etc.

[0073] This friction member has the same structure as the cutting blade 52. However, the portion of this friction member that corresponds to the cutting edge of the cutting blade 52 is made only of resin, and the friction member is designed so that its width is equal to or smaller than the width of the cutting edge of the cutting blade 52 that is used to cut the holding portion 6 of the holding plate 2.

[0074] Additionally, an imaging unit 54, which is disposed adjacent to the cutting unit 50 in the X-axis direction, is fixed to the lower part of the Z-axis moving plate 44. The imaging unit 54 includes, for example, a two-dimensional optical sensor such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor that is sensitive to visible light, and an imaging lens, and is used when capturing an image of the workpiece 11 held on the chuck table 20, etc.

[0075] When the Y-axis moving plate 36 of the cutting unit moving mechanism 32 is moved along the Y-axis direction, both the cutting unit 50 and the imaging unit 54 move along the Y-axis direction. When the Z-axis moving plate 44 of the cutting unit moving mechanism 32 is moved along the Z-axis direction, both the cutting unit 50 and the imaging unit 54 move along the Z-axis direction.

[0076] The top of the base 10 is covered with a cover (not shown). A touch screen (not shown) that serves as a user interface is provided on the side of this cover. For example, various conditions to be applied when cutting the workpiece 11 are input to this touch screen.

[0077] Instead of a touch screen in which a display device (output device) and an input device are integrated, a display device (output device) such as a liquid crystal display and an input device such as a keyboard and / or a mouse may be provided.

[0078] Each of the components, such as the table moving mechanism 12, the cutting unit moving mechanism 32, the cutting unit 50, the imaging unit 54, and the touch screen, is connected to a control unit (not shown). This control unit controls each of the above-mentioned components in accordance with a series of processes required to cut the workpiece 11.

[0079] The control unit is configured, for example, with a processing device such as a central processing unit (CPU), a main storage device such as a dynamic random access memory (DRAM), and an auxiliary storage device such as a hard disk drive or flash memory. For example, the functions of the control unit are realized by the processing device operating in accordance with software stored in the auxiliary storage device.

[0080] Below, we will explain a chip manufacturing method in which the workpiece 11 is held on a chuck table 20 including a holding plate 2 having a holding portion 6 made of a metal material with excellent ductility such as copper (Cu), tin (Sn) or aluminum (Al), and then the workpiece 11 is divided to produce multiple chips.

[0081] 6 is a flow chart showing a typical example of a method for manufacturing such a chip. In this method, first, the chuck table (holding plate 2 and base plate 22) 20 is mounted on the table base 18 (mounting step: S1).

[0082] Specifically, in this mounting step (S1), first, the table base 18, the base plate 22, and the holding plate 2 are stacked in this order so that the side of the table base 18, the side of the base plate 22 (the outer surface of the frame body 24), and the side of the holding plate 2 (the outer surface of the mounting portion 4) are flush with each other.

[0083] Then, the bolts 28 are inserted into the through holes 4c formed in the mounting portion 4, the through holes 24c formed in the frame 24, and the grooves 18f formed in the table base 18, and tightened. This causes the mounting portion 4 of the holding plate 2 to be mounted to the table base 18 together with the base plate 22. In other words, the chuck table 20 is mounted to the table base 18.

[0084] After the mounting step (S1), grooves are formed on the upper surface 6a of the holding portion 6 of the holding plate 2, and the through holes 6c opening at the bottom of the grooves are buried to form a holding surface (holding surface forming step: S2). The region where the grooves are formed on the upper surface 6a of the holding portion 6 corresponds to the plurality of planned dividing lines 19 of the workpiece 11.

[0085] 7(A) is a perspective view showing the holding surface forming step (S2) in a simplified manner. In this holding surface forming step (S2), first, a cutting blade (holding plate cutting blade) 52a having a cutting edge suitable for cutting the holding portion 6 made of a metal material with excellent ductility and plastically deforming the holding portion 6 is attached to the tip of the spindle of the cutting unit 50.

[0086] Next, the cutting unit 50 is moved along the Z-axis direction so that the position of the lower end of the cutting edge of the holding plate cutting blade 52a is lower than the upper surface 6a of the holding part 6 and higher than the upper surface 4a of the attachment part 4. Next, the chuck table 20 including the holding plate 2 is rotated so that the short side of the upper surface 6a of the holding part 6 is parallel to the X-axis direction.

[0087] Next, the holding portion 6 is cut for each portion extending linearly along the short side of the holding portion 6 in the region where the groove is formed on the upper surface 6a of the holding portion 6. Specifically, first, the cutting unit 50 is moved along the Y-axis direction so that the portion to be cut is positioned in the X-axis direction as viewed from the holding plate cutting blade 52a.

[0088] Then, while rotating the holding plate cutting blade 52a together with the spindle, the chuck table 20 including the holding plate 2 is moved along the X-axis direction. As a result, grooves are formed on the upper surface 6a of the holding part 6. By repeating the same operation, grooves are formed in all of the portions of the upper surface 6a of the holding part 6 that extend linearly along the short sides of the holding part 6 within the region where grooves are to be formed.

[0089] Next, the chuck table 20 including the holding plate 2 is rotated 90° so that the long sides of the upper surface 6a of the holding portion 6 are parallel to the X-axis direction. Next, by repeating the same operation, grooves are formed in all of the portions of the upper surface 6a of the holding portion 6 that extend linearly along the long sides of the holding portion 6 within the region where grooves are to be formed. As a result, grooves are formed in regions of the upper surface 6a of the holding portion 6 that correspond to the multiple planned dividing lines 19 of the workpiece 11.

[0090] 7(B) is a cross-sectional view schematically showing the holding plate 2 after the holding surface forming step (S2). Because the holding portion 6 is made of a metal material with excellent ductility, a portion of the upper surface 6a of the holding portion 6 is plastically deformed as the grooves 6d are formed. At this time, the plastically deformed portion of the upper surface 6a of the holding portion 6 is embedded in some of the multiple through-holes 6c.

[0091] That is, the through holes 6c present in the region where the grooves 6d are formed are buried. As a result, a holding surface is formed in the holding part 6 that allows a suction force to act on the upper surface 6a of the holding part 6 via the plurality of through holes 6c that remain without being buried, while preventing the suction force from acting on the internal space of the grooves 6d.

[0092] After the holding surface forming step (S2), the workpiece 11 is held by the holding surface of the holding part 6 (holding step: S3). Fig. 8(A) is a perspective view that schematically shows the state of the holding step (S3), and Fig. 8(B) is a partially cross-sectional side view that schematically shows the state of the holding step (S3).

[0093] In this holding step (S3), first, the workpiece 11 is placed on the holding plate 2 with the resin layer 23 facing up so that the side surface of the substrate 13 of the workpiece 11 is flush with the side surface of the holding plate 2. Next, the suction source communicating with the through-hole 18d of the table base 18 is operated.

[0094] As a result, a suction force acts on the surface 13a of the substrate 13 of the workpiece 11 via the through-holes 18d and recesses 18c of the table base 18, the porous plate 26 of the base plate 22, and the plurality of through-holes 6c that remain without being buried in the holding portion 6 of the holding plate 2. As a result, the workpiece 11 is held by the holding surface of the holding portion 6.

[0095] After the holding step (S3), the workpiece 11 is divided into a plurality of chips (dividing step: S4). Fig. 9(A) is a perspective view that schematically illustrates the dividing step (S4). In this dividing step (S4), first, a cutting blade (workpiece cutting blade) 52b having a cutting edge suitable for cutting the workpiece 11 including the substrate (e.g., a substrate made of a metal material such as 42 alloy or copper) 13 and having a width narrower than that of the holding plate cutting blade 52a is attached to the tip of the spindle of the cutting unit 50.

[0096] Next, the cutting unit 50 is moved along the Z-axis direction so that the lower end of the cutting edge of the cutting blade 52b is positioned lower than the surface 13a of the substrate 13 of the workpiece 11 and higher than the bottom surface of the groove 6d of the holding portion 6 of the holding plate 2.

[0097] Next, the chuck table 20 including the holding plate 2 is rotated so that the short sides of the front surface 13a and back surface 13b of the substrate 13 of the workpiece 11 are parallel to the X-axis direction. Next, the workpiece 11 is cut into each of the multiple planned dividing lines 19 of the workpiece 11 that extend linearly along the short sides of the holding part 6.

[0098] Specifically, first, the cutting unit 50 is moved along the Y-axis direction so that the portion to be cut is positioned in the X-axis direction as viewed from the cutting blade 52b. Then, while rotating the cutting blade 52b together with the spindle, the chuck table 20 including the holding plate 2 is moved along the X-axis direction. As a result, a portion of the workpiece 11 is cut and removed.

[0099] Furthermore, by repeating the same operation, all of the portions of the multiple planned dividing lines 19 of the workpiece 11 that extend linearly along the short sides of the front surface 13a and back surface 13b of the substrate 13 of the workpiece 11 are cut and removed.

[0100] Next, the chuck table 20 including the holding plate 2 is rotated by 90° so that the long sides of the front surface 13a and the back surface 13b of the substrate 13 of the workpiece 11 are parallel to the X-axis direction. Next, by repeating the same operation, all of the portions of the multiple planned dividing lines 19 of the workpiece 11 that extend linearly along the long sides of the front surface 13a and the back surface 13b of the substrate 13 of the workpiece 11 are cut and removed.

[0101] 9(B) is a partial cross-sectional side view schematically showing the holding plate 2 after the dividing step (S4) and a plurality of chips produced by dividing the workpiece 11. In the holding plate 2 that holds the workpiece 11, grooves 6d are formed in areas corresponding to the plurality of planned dividing lines 19 of the workpiece 11.

[0102] Furthermore, since the holding plate 2 does not have through holes 6c that communicate with the internal spaces of the grooves 6d, no leaks occur while cutting the workpiece 11. Furthermore, in this holding plate 2, a suction force can be applied to the workpiece 11 and each of the plurality of chips 25 produced by dividing the workpiece 11 via the plurality of through holes 6c that remain without being buried.

[0103] That is, in this dividing step (S4), the workpiece 11 is divided through the remaining through holes 6c without being buried, and each of the plurality of chips 25 produced is held on the chuck table 20. This reduces the possibility that some of the chips 25 will scatter in the dividing step (S4).

[0104] As described above, the holding plate 2 has the holding portion 6 in which a plurality of through holes 6c are formed to allow the suction force generated on the lower surface 6b side to act on the workpiece 11 held on the upper surface 6a side and on each of the plurality of tips 25. The holding portion 6 is made of a material that can fill the plurality of through holes 6c by plastic deformation.

[0105] Therefore, for example, by bringing the rotating holding plate cutting blade 52a into contact with the holding part 6, grooves 6d can be formed in areas corresponding to the plurality of planned dividing lines 19 of the workpiece 11, and the through holes 6c present in these areas can be buried. This allows a holding surface to be formed on the holding plate 2 that can hold the workpiece 11 and the plurality of chips 25.

[0106] Specifically, the suction force generated on the underside 6b of the holding plate 2 can be applied to the workpiece 11 and each of the chips 25 via the remaining through-holes 6c. Furthermore, since there are no through-holes 6c communicating with the internal space of the grooves 6d, the suction force does not act on the internal space of the grooves 6d. In other words, no leaks occur when the holding plate 2 holds the workpiece 11 or the chips 25.

[0107] In this way, the holding plate 2 can easily form a desired holding surface according to the arrangement of the plurality of planned dividing lines 19 of the workpiece 11. As a result, an increase in the manufacturing cost of the tip 25 manufactured by the cutting device 8 equipped with the chuck table 20 including the holding plate 2 and an increase in the time required to manufacture the tip 25 are suppressed.

[0108] Below, we will explain a method for manufacturing chips in which the workpiece 11 is held on a chuck table 20 including a holding plate 2 having a holding portion 6 made of a resin such as solid wax, and then divided to produce multiple chips 25.

[0109] 10 is a flow chart showing a schematic example of a method for manufacturing such chips. In this method, first, the above-mentioned mounting step (S1) is performed. Next, grooves are formed on the upper surface 6a of the holding portion 6 of the holding plate 2 (groove forming step: S21). The area where the grooves are formed on the upper surface 6a of the holding portion 6 corresponds to the multiple planned dividing lines 19 of the workpiece 11.

[0110] In this groove forming step (S21), first, a cutting blade (cutting blade for holding plate) suitable for cutting the holding part 6 made of resin is attached to the tip of the spindle of the cutting unit 50.

[0111] Next, the cutting unit 50 is moved along the Z-axis direction so that the position of the lower end of the cutting edge of the cutting blade is lower than the upper surface 6a of the holding part 6 and higher than the upper surface 4a of the attachment part 4. Next, the chuck table 20 including the holding plate 2 is rotated so that the short side of the upper surface 6a of the holding part 6 is parallel to the X-axis direction.

[0112] Next, the holding portion 6 is cut for each portion extending linearly along the short side of the holding portion 6 in the region where the groove is formed on the upper surface 6a of the holding portion 6. Specifically, first, the cutting unit 50 is moved along the Y-axis direction so that the portion to be cut is positioned in the X-axis direction as viewed from the cutting blade.

[0113] Next, while rotating the cutting blade together with the spindle, the chuck table 20 including the holding plate 2 is moved along the X-axis direction. As a result, grooves are formed on the upper surface 6a of the holding part 6. By repeating the same operation, grooves are formed in all of the portions of the upper surface 6a of the holding part 6 that extend linearly along the short sides of the holding part 6 within the region where grooves are to be formed.

[0114] Next, the chuck table 20 including the holding plate 2 is rotated 90° so that the long sides of the upper surface 6a of the holding portion 6 are parallel to the X-axis direction. Next, by repeating the same operation, grooves are formed in all of the portions of the upper surface 6a of the holding portion 6 that extend linearly along the long sides of the holding portion 6 within the region where grooves are to be formed. As a result, grooves are formed in regions of the upper surface 6a of the holding portion 6 that correspond to the multiple planned dividing lines 19 of the workpiece 11.

[0115] After the groove forming step (S21), the holding part 6 is heated to bury the through hole 6c opening at the bottom of the groove (burying step: S22). In this burying step (S22), first, the friction member is attached to the tip of the spindle of the cutting unit 50.

[0116] Next, the cutting unit 50 is moved along the Z-axis direction so that the position of the lower end of the friction member is at the same position as or slightly lower than the bottom surface of the groove formed in the upper surface 6a of the holding part 6. Next, the chuck table 20 including the holding plate 2 is rotated so that the short side of the upper surface 6a of the holding part 6 is parallel to the X-axis direction.

[0117] Next, the holding part 6 is heated for each groove extending linearly along the short side of the holding part 6 in the region where the grooves are formed on the upper surface 6a of the holding part 6. Specifically, first, the cutting unit 50 is moved along the Y-axis direction so that the grooves to be heated are positioned in the X-axis direction as viewed from the cutting blade.

[0118] Next, while rotating the friction member together with the spindle, the chuck table 20 including the holding plate 2 is moved along the X-axis direction. At this time, friction occurs between the bottom surface of the groove formed on the upper surface 6a of the holding part 6 and the friction member, and the heat generated by this friction heats the area near the bottom surface of the groove.

[0119] The heated grooves melt near their bottoms, and the molten resin flows into the through-holes 6c that open into the grooves. The resin that flows into the through-holes 6c cools and solidifies. As a result, the through-holes 6c are filled. By repeating the same process, all of the through-holes 6c that open into the grooves that extend linearly along the short sides of the holder 6 within the groove-forming region of the upper surface 6a of the holder 6 are filled.

[0120] Next, the chuck table 20 including the holding plate 2 is rotated 90° so that the long sides of the upper surface 6a of the holding portion 6 are parallel to the X-axis direction. Next, by repeating the same operation, all of the through holes 6c opening in the grooves extending linearly along the long sides of the holding portion 6 in the region where the grooves are formed on the upper surface 6a of the holding portion 6 are buried. As a result, all of the through holes 6c opening in the grooves formed in the regions of the upper surface 6a of the holding portion 6 that correspond to the multiple planned dividing lines 19 of the workpiece 11 are buried.

[0121] After the embedding step (S22), the above-mentioned holding step (S3) and dividing step (S4) are performed in this order, whereby the workpiece 11 can be divided into a plurality of chips 25 in the dividing step (S4) while reducing the possibility that some chips 25 will scatter.

[0122] As described above, the holding plate 2 has the holding portion 6 in which a plurality of through holes 6c are formed to allow the suction force generated on the lower surface 6b side to act on the workpiece 11 held on the upper surface 6a side and on each of the plurality of tips 25. The holding portion 6 is made of a material that can fill the plurality of through holes 6c by heating.

[0123] Therefore, for example, by bringing a rotating cutting blade into contact with the holding part 6, grooves are formed in the area of the workpiece 11 corresponding to the plurality of planned dividing lines 19, and then by bringing a rotating friction member into contact with the bottom surface of the groove, all of the through holes 6c opening at the bottom surface of the groove can be buried. In this way, a holding surface capable of holding the workpiece 11 and the plurality of chips 25 can be formed on the holding plate 2.

[0124] Specifically, the suction force generated on the underside 6b of the holding plate 2 can be applied to the workpiece 11 and each of the chips 25 via the remaining through-holes 6c. Furthermore, since there are no through-holes 6c communicating with the internal space of the groove, the suction force does not act on the internal space of the groove. In other words, no leaks occur when the holding plate 2 holds the workpiece 11 or the chips 25.

[0125] In this way, the holding plate 2 can easily form a desired holding surface according to the arrangement of the plurality of planned dividing lines 19 of the workpiece 11. As a result, an increase in the manufacturing cost of the tip 25 manufactured by the cutting device 8 equipped with the chuck table 20 including the holding plate 2 and an increase in the time required to manufacture the tip 25 are suppressed.

[0126] The above-described content is one aspect of the present invention, and the content of the present invention is not limited to the above. For example, the method of manufacturing a tip shown in Figure 6 may be applied as a method of manufacturing a tip in which a workpiece 11 is held on a chuck table 20 including a holding plate 2 having a holding portion 6 made of resin and the workpiece 11 is divided to manufacture a plurality of tip 25.

[0127] That is, in the present invention, the frictional heat generated by contact between the holding plate 2 having the holding portion 6 made of resin and the rotating holding plate cutting blade 52a can be utilized to bury the through hole 6c opening at the bottom surface of the groove formed on the upper surface 6a of the holding portion 6.

[0128] In the present invention, the manufacturing of the plurality of chips 25 by dividing the workpiece 11 and the formation of holding surfaces capable of holding each of the plurality of chips 25 without causing leakage may be performed simultaneously. Fig. 11 is a flow chart showing a schematic example of such a method for manufacturing chips.

[0129] In this method, first, the above-mentioned mounting step (S1) is performed. Next, the workpiece 11 is held by the upper surface 6a of the holding portion 6 of the holding plate 2 (holding step: S30). In this holding step (S30), first, the workpiece 11 is placed on the holding plate 2 with the resin layer 23 facing up so that the side surface of the substrate 13 of the workpiece 11 and the side surface of the holding plate 2 are flush with each other.

[0130] Next, the suction source communicating with the through-hole 18d of the table base 18 is operated. As a result, a suction force acts on the surface 13a of the substrate 13 of the workpiece 11 via the through-hole 18d and the recess 18c of the table base 18, the porous plate 26 of the base plate 22, and the multiple through-holes 6c formed in the holding portion 6 of the holding plate 2. As a result, the workpiece 11 is held on the upper surface 6a of the holding portion 6.

[0131] After the holding step (S30), the workpiece 11 is divided into multiple chips 25, and a groove is formed on the upper surface 6a of the holding portion 6, and a through hole 6c opening at the bottom of the groove is buried to form a holding surface (simultaneous processing step: S40).

[0132] In this simultaneous machining step (S40), first, a cutting blade having a cutting edge suitable for cutting a workpiece 11 including a substrate 13 (e.g., a substrate made of a metal material such as 42 alloy or copper) and plastically deforming or heating the holding portion 6 of the holding plate 2 is attached to the tip of the spindle of the cutting unit 50.

[0133] Next, the cutting unit 50 is moved along the Z-axis direction so that the lower end of the cutting edge of the cutting blade is positioned lower than the surface 13a of the substrate 13 of the workpiece 11 and higher than the upper surface 4a of the mounting portion 4 of the holding plate 2.

[0134] Next, the chuck table 20 including the holding plate 2 is rotated so that the short sides of the front surface 13a and back surface 13b of the substrate 13 of the workpiece 11 are parallel to the X-axis direction. Next, the workpiece 11 is cut into each of the multiple planned dividing lines 19 of the workpiece 11 that extend linearly along the short sides of the holding part 6.

[0135] Specifically, first, the cutting unit 50 is moved along the Y-axis direction so that the portion to be cut is positioned in the X-axis direction as viewed from the cutting blade. Then, while rotating the cutting blade together with the spindle, the chuck table 20 including the holding plate 2 is moved along the X-axis direction. As a result, a portion of the workpiece 11 is cut and removed, and a groove is formed on the upper surface 6a of the holding part 6.

[0136] Furthermore, by repeating the same operation, all of the portions of the multiple planned dividing lines 19 of the workpiece 11 that extend linearly along the short sides of the front surface 13a and back surface 13b of the substrate 13 of the workpiece 11 are cut and removed, and grooves are formed in the area of the upper surface 6a of the holding portion 6 that overlap with the portions.

[0137] Next, the chuck table 20 including the holding plate 2 is rotated 90° so that the long sides of the front surface 13a and back surface 13b of the substrate 13 of the workpiece 11 are parallel to the X-axis direction. Next, by repeating the same operation, all of the portions of the multiple planned dividing lines 19 of the workpiece 11 that extend linearly along the long sides of the front surface 13a and back surface 13b of the substrate 13 of the workpiece 11 are cut and removed, and grooves are formed in the areas of the upper surface 6a of the holding part 6 that overlap with these portions.

[0138] Here, the holding portion 6 is made of a metal material or resin with excellent ductility. Therefore, as described above, in this holding portion 6, the through-holes 6c present in the region where the grooves 6d are formed are buried as the grooves 6d are formed. In other words, a holding surface is formed in the holding portion 6 that can prevent suction force from acting on the internal space of the grooves 6d.

[0139] This prevents leakage even when the workpiece 11 is divided into a plurality of chips 25 while held on the upper surface 6a of the holding portion 6. Furthermore, in this holding plate 2, a suction force can be applied to the workpiece 11 and each of the plurality of chips 25 produced by dividing the workpiece 11 via the plurality of through-holes 6c that remain without being buried.

[0140] That is, in this simultaneous machining step (S40), each of the plurality of chips 25 produced by dividing the workpiece 11 through the plurality of through holes 6c that remain without being buried is held on the chuck table 20. This reduces the likelihood that some of the chips 25 will fly off in the simultaneous machining step (S40).

[0141] Furthermore, in the present invention, the through holes 6c opening at the bottom surfaces of the grooves 6d do not have to be completely buried, as long as the workpiece 11 and each of the plurality of chips 25 can be held on the chuck table 20. In other words, in the present invention, the workpiece 11 may be divided into the plurality of chips 25 in a state where slight leakage occurs through the through holes 6c opening at the bottom surfaces of the grooves 6d.

[0142] Furthermore, in the cutting device used in the present invention, it is sufficient that the chuck table 20 and the cutting unit 50 can move relatively along the X-axis direction, the Y-axis direction, and the Z-axis direction, and the components for this purpose are not limited.

[0143] In addition, the structures and methods according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0144] 2: Retaining plate 4: Mounted part (4a: top surface, 4b: bottom surface, 4c: through hole) 6: Holding part (6a: top surface, 6b: bottom surface, 6c: through hole, 6d: groove) 8:Cutting device 10: Base (10a: opening) 12: Table movement mechanism 14: Table cover 16: Accordion-shaped cover 18: Table base (18a: upper surface, 18b: lower surface, 18c: recess) (18d: through hole, 18e: inner wall, 18f: groove) 20: Chuck table 22: Base plate 24: Frame (24a: top surface, 24b: bottom surface, 24c: through hole) 26: Porous plate (26a: top surface) 28: Bolt 30:Support structure 32: Cutting unit movement mechanism 34: Y-axis guide rail 36: Y-axis moving plate 38: Screw shaft 40: Y-axis pulse motor 42: Z-axis guide rail 44: Z-axis moving plate 46: Screw shaft 48: Z-axis pulse motor 50: Cutting unit 52: Cutting blade (52a: cutting blade for holding plate, 52b: cutting blade for workpiece) 54: Imaging unit 11: Workpiece 13: Substrate (13a: front surface, 13b: back surface) 15: Device area 17: Excess area 19: Planned division line 21: Stage 23: Resin layer 25: Tip

Claims

1. In a cutting device that divides a workpiece along a plurality of planned division lines to produce a plurality of chips, a holding plate is used to apply a suction force to the workpiece and each of the plurality of chips, a holding portion having upper and lower surfaces parallel to each other and having a plurality of through holes formed therein for applying a suction force generated on the lower surface side to the workpiece held on the upper surface side and each of the plurality of tips; a mounting portion having a surface flush with the lower surface of the holding portion, being thinner than the holding portion, and being integrated with the holding portion; The holding portion is made of a metal material that can fill the plurality of through holes by plastic deformation.

2. In a cutting device that produces a plurality of chips by dividing a workpiece along a plurality of planned dividing lines, a holding plate is used to apply suction force to the workpiece and each of the plurality of chips, a holding portion having upper and lower surfaces parallel to each other and having a plurality of through holes formed therein for applying a suction force generated on the lower surface side to the workpiece held on the upper surface side and each of the plurality of tips; a mounting portion having a surface flush with the lower surface of the holding portion, being thinner than the holding portion, and being integrated with the holding portion; a resin sheet provided on the upper surface of the holding portion, The holding portion is made of a material that can be plastically deformed or heated to fill the plurality of through holes.

3. A method for processing a holding plate, characterized in that a rotating annular cutting blade is brought into contact with the upper surface of the holding portion of the holding plate described in claim 1 or 2 to form grooves on the upper surface of the holding portion in areas corresponding to the plurality of planned dividing lines of the workpiece, and those of the plurality of through holes that open at the bottom of the groove are buried, thereby forming a holding surface that can apply suction force to the workpiece and each of the plurality of chips produced by dividing the workpiece along the plurality of planned dividing lines, while preventing suction force from acting on the internal space of the groove.

4. A chip manufacturing method for manufacturing a plurality of chips by dividing a workpiece along a plurality of planned dividing lines, 3. The holding plate according to claim 1 or 2, or a cutting device for dividing the workpiece along the planned dividing lines to produce the plurality of chips, the holding plate being used to apply a suction force to the workpiece and each of the plurality of chips, the holding plate comprising: a holding portion having upper and lower surfaces parallel to each other and formed with a plurality of through holes for allowing the suction force generated on the lower surface side to act on the workpiece held on the upper surface side and each of the plurality of chips; and an attachment portion having a surface flush with the lower surface of the holding portion, being thinner than the holding portion and being integrated with the holding portion, the holding portion being made of a material in which the plurality of through holes can be buried by plastic deformation or heating; and a mounting step of mounting the attachment portion of the holding plate to a table base; a holding surface forming step in which, after the mounting step, a rotating annular holding plate cutting blade is brought into contact with the upper surface of the holding part to form grooves on the upper surface of the holding part in areas corresponding to the plurality of planned dividing lines of the workpiece, and through holes among the plurality of through holes that open at the bottom surface of the grooves are buried, thereby forming a holding surface that can apply a suction force to the workpiece and each of the plurality of chips produced by dividing the workpiece along the plurality of planned dividing lines, but that can prevent a suction force from acting on the internal space of the groove; a holding step of holding the workpiece on the holding surface by applying a suction force to the workpiece via through holes among the plurality of through holes that open at a location other than the bottom surface of the groove after the holding surface forming step; A method for manufacturing chips, characterized by comprising, after the holding step, a dividing step in which a rotating annular workpiece cutting blade is brought into contact with the workpiece along the plurality of planned dividing lines to divide the workpiece into the plurality of chips.

5. The holding surface forming step includes: a groove forming step of forming the groove by rotating a cutting blade for the holding plate, which is made of abrasive grains and a bond material, and bringing the cutting blade into contact with the region; an embedding step of embedding through holes that open at the bottom surface of the groove among the plurality of through holes by rotating an annular friction member made only of resin and bringing it into contact with the bottom surface of the groove; The method for manufacturing a chip according to claim 4, further comprising:

6. A chip manufacturing method for manufacturing a plurality of chips by dividing a workpiece along a plurality of planned dividing lines, a mounting step of mounting the mounting portion of the holding plate according to claim 1 or 2 to a table base; a holding step of holding the workpiece on the upper surface of the holding portion by applying a suction force to the workpiece via the plurality of through holes after the mounting step; a simultaneous machining step in which, after the holding step, a rotating cutting blade is brought into contact with the workpiece along the plurality of planned division lines to divide the workpiece into the plurality of chips, while the rotating cutting blade is brought into contact with the upper surface of the holding part to form grooves on the upper surface of the holding part, and through holes that open at the bottom surface of the grooves among the plurality of through holes are buried to form a holding surface that can prevent suction force from acting on the internal space of the grooves; A method for manufacturing a chip, comprising:

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