Polishing liquid composition for oxidized siliceous film

A polishing composition with cerium oxide particles, anionic condensate, and phosphorus-containing compound addresses the challenges of high selectivity and flatness in CMP processes by suppressing silicon nitride film removal, enhancing substrate flatness and efficiency.

JP7727510B2Active Publication Date: 2025-08-21KAO CORP
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Patent Information

Application Number
JP2021196388
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-12-02
Publication Date
2025-08-21
Estimated Expiration
2041-12-02

AI Technical Summary

Technical Problem

The semiconductor industry faces challenges in achieving high polishing selectivity and maintaining substrate flatness during chemical mechanical polishing (CMP) processes, particularly in the formation of shallow trench isolation structures, where silicon nitride films are not adequately suppressed, leading to dishing and degradation of surface flatness.

Method used

A polishing composition for silicon oxide films comprising cerium oxide particles, a water-soluble anionic condensate, and a phosphorus-containing compound is used, with specific molar ratios and formulations to enhance polishing selectivity and suppress the removal rate of silicon nitride films, thereby improving substrate flatness.

Benefits of technology

The composition achieves improved polishing selectivity and reduced dishing, resulting in enhanced substrate surface flatness and higher polishing efficiency.

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Patent Text Reader

Abstract

To provide a polishing liquid composition for a silicon oxide film which is capable of improving polishing selectivity in silicon oxide film polishing.SOLUTION: A polishing liquid composition for a silicon oxide film contains cerium oxide particles (component A), water-soluble anionic condensate (component B), phosphorus-containing compound (component C), and aqueous medium, where the component B is a co-condensate of monomers including specific monomers (constituent monomer b1) and specific monomers (constituent monomer b2), a molar ratio (%) of the constituent monomer b1 for the total of the constituent monomers b1 and the constituent monomers b2 in the component B exceeds 30%, and contains specific phosphorus-containing compound (component C).SELECTED DRAWING: None
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Citation Information

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