Optical Module

Abstract

A carrier (3) is bonded to a thermoelectric cooler (2) with a first bonding material (4). A submount (5) is mounted on the side of the carrier (3) with a second bonding material (6). A semiconductor laser element (7) is mounted on the submount (5). A protrusion (8) is provided on the side of the carrier (3) between the thermoelectric cooler (2) and the submount (5). The height of the protrusion (8) is shorter than the height of the submount (5).

Description

[Technical Field]

[0001] The present disclosure relates to optical modules. [Background technology]

[0002] In a CAN-type optical module, a carrier is bonded to a thermoelectric cooler, a submount is mounted on the side of the carrier, and a semiconductor laser element is mounted on the submount (see, for example, Patent Document 1). Conventionally, a photodiode for monitoring the light emission intensity of the semiconductor laser element is placed behind the element. A mounting portion for the photodiode is provided on the carrier between the thermoelectric cooler and the submount. The bonding material bonding the thermoelectric cooler and carrier is blocked by this mounting portion for the photodiode and does not flow into the mounting portion of the submount. Furthermore, even when a photodiode is not mounted, a thermistor or wire exists between the thermoelectric cooler and the submount. Therefore, the submount cannot be brought close to the thermoelectric cooler, and the outflow of the bonding material does not pose a problem. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2019-140390 Summary of the Invention [Problem to be solved by the invention]

[0004] To shorten the optical module, the submount needs to be mounted close to the thermoelectric cooler. However, if the adhesive that joins the thermoelectric cooler and carrier flows out onto the mounting area of ​​the submount, the flatness decreases, causing the submount to tilt and resulting in variations in the direction of the optical output. This reduces the mountability of the submount, which is a problem.

[0005] The present disclosure has been made to solve the above-mentioned problems, and its object is to obtain an optical module that can improve the mountability of a submount. [Means for solving the problem]

[0006] The optical module according to the present disclosure comprises a thermoelectric cooler, a carrier joined to the thermoelectric cooler with a first bonding material, a submount mounted on a side of the carrier with a second bonding material, and a semiconductor laser element mounted on the submount, and is characterized in that a protrusion is provided on the side of the carrier between the thermoelectric cooler and the submount, and the height of the protrusion is shorter than the height of the submount. [Effects of the Invention]

[0007] In the present disclosure, a protrusion is provided on the side surface of the carrier between the thermoelectric cooler and the submount, which prevents the bonding material from flowing out to the mounting portion of the submount, thereby improving the mountability of the submount. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a cross-sectional view showing an optical module according to a first embodiment. [Figure 2] 10A and 10B are cross-sectional views showing a method for mounting a submount. [Figure 3] 1 is a top view showing an optical module according to a first embodiment. [Figure 4] FIG. 10 is a cross-sectional view showing an optical module according to a second embodiment. [Figure 5] FIG. 10 is a cross-sectional view showing an optical module according to a second embodiment. [Figure 6] FIG. 11 is a cross-sectional view showing an optical module according to a third embodiment. [Figure 7] FIG. 10 is a cross-sectional view showing an optical module according to a fourth embodiment. [Figure 8] FIG. 10 is a cross-sectional view showing an optical module according to a fifth embodiment. [Figure 9]FIG. 13 is a cross-sectional view showing an optical module according to a sixth embodiment. [Figure 10] FIG. 13 is a cross-sectional view showing an optical module according to a seventh embodiment. [Figure 11] FIG. 13 is a cross-sectional view showing an optical module according to an eighth embodiment. [Figure 12] FIG. 13 is a cross-sectional view showing a modified example of the optical module according to the eighth embodiment. [Figure 13] FIG. 13 is a cross-sectional view showing an optical module according to a ninth embodiment. [Figure 14] FIG. 13 is a cross-sectional view showing a modified example of the optical module according to the ninth embodiment. [Figure 15] FIG. 22 is a cross-sectional view showing an optical module according to a tenth embodiment. [Figure 16] FIG. 23 is a cross-sectional view showing a modified example of the optical module according to the tenth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] An optical module according to an embodiment will be described with reference to the drawings. The same or corresponding components are designated by the same reference numerals, and repeated description may be omitted.

[0010] Embodiment 1 FIG. 1 is a cross-sectional view showing an optical module according to a first embodiment. This optical module is a CAN-type optical module. However, the lens cap is not shown. A thermoelectric cooler 2 (TEC: ThermoElectric Cooler) is mounted on a metal stem 1. The thermoelectric cooler 2 has a Peltier element 2a sandwiched between a heat-absorbing substrate 2b and a heat-generating substrate 2c. The Peltier element 2a is made of BiTe, and the heat-absorbing substrate 2b and the heat-generating substrate 2c are made of AlN.

[0011] A carrier 3 is joined to a thermoelectric cooler 2 with AuSn solder 4. The carrier 3 is made of CuW. A submount 5 is mounted on the side of the carrier 3 with SnAgCu solder 6. The submount 5 is made of alumina. A semiconductor laser element 7 is mounted on the submount 5. The semiconductor laser element 7 is made of InP.

[0012] Here, the melting point of the SnAgCu solder 6 is 213°C, and the melting point of the AuSn solder 4 is lower than 283°C. First, the stem 1 and thermoelectric cooler 2 are joined using the AuSn solder 4, and then the thermoelectric cooler 2 is joined to the carrier 3. Next, the submount 5 is joined to the carrier 3 using the SnAgCu solder 6. At this time, by setting the temperature to be higher than 213°C and lower than 283°C, the submount 5 can be solder-joined while maintaining the bond between the thermoelectric cooler 2 and the carrier 3.

[0013] Since there are no elements such as photodiodes or wiring between the thermoelectric cooler 2 and the submount 5, the submount 5 can be placed close to the thermoelectric cooler 2. A protrusion 8 is provided on the side surface of the carrier 3 between the thermoelectric cooler 2 and the submount 5. The height of the protrusion 8 relative to the side surface of the carrier 3 is lower than the height of the submount 5.

[0014] In the present disclosure, a protrusion 8 is provided on the side surface of the carrier 3 between the thermoelectric cooler 2 and the submount 5. The protrusion 8 increases the creepage distance from the thermoelectric cooler 2 to the submount 5, thereby suppressing the outflow of the AuSn solder 4 onto the mounting portion of the submount 5. This prevents the submount 5 from tilting due to a decrease in flatness caused by the outflow of the AuSn solder 4, which can cause variations in the light output direction. This improves the mountability of the submount 5.

[0015] Furthermore, the protrusions 8 suppress the outflow of the AuSn solder 4, thereby preventing contact between the AuSn solder 4 and the SnAgCu solder 6. The Au content of the AuSn solder 4 is approximately 80%. On the other hand, the fixing strength of the SnAgCu solder 6 decreases when it contains a few percent of Au. The protrusions 8 prevent contact between the AuSn solder 4 and the SnAgCu solder 6, thereby improving reliability.

[0016] FIG. 2 is a cross-sectional view showing a submount mounting method. The collet 9 holds the submount 5 by suction. The collet 9 is vibrated to break the oxide film on the surface of the SnAgCu solder 6, soldering the submount 5 to the carrier 3. Vacuum suction of only the top surface of the submount 5 during this process would not be able to withstand the vibrations. Therefore, the collet 9 must clamp and secure the submount 5. The contact portion of the collet 9 is inclined at 45° and contacts the corner of the top surface of the submount 5. Therefore, the tip of the contact portion of the collet 9 is positioned below the top surface of the submount 5 on the side of the submount 5. Therefore, in this embodiment, the height of the protrusion 8 relative to the side surface of the carrier 3 is made lower than the height of the submount 5. This prevents interference between the collet 9 and the protrusion 8 during mounting of the submount 5. Therefore, the submount 5 can be mounted close to the thermoelectric cooler 2, just as if the protrusion 8 were not present, thereby achieving a shorter optical module. However, in order to more reliably avoid interference between the collet 9 and the protrusion 8, it is preferable that the height of the protrusion 8 relative to the side surface of the carrier 3 is lower than half the height of the submount 5.

[0017] 3 is a top view showing the optical module according to embodiment 1. The protrusions 8 may be provided across the entire width of the carrier 3, or may be provided only on a portion of the width of the carrier 3 as shown in FIG. 3. The protrusions 8 provided on only a portion of the width of the carrier 3 can be used as a positioning reference for the submount 5.

[0018] Embodiment 2 4 and 5 are cross-sectional views showing an optical module according to the second embodiment. A bonding material reservoir 10 for storing AuSn solder 4 is provided on the bonding surface of the carrier 3 bonded to the thermoelectric cooler 2. In FIG. 4, the bonding material reservoir 10 is provided in the center of the bonding surface of the carrier 3, and in FIG. 5, the bonding material reservoir 10 is provided on the protrusion 8. By storing the AuSn solder 4 in the bonding material reservoir 10, it is possible to further prevent the AuSn solder 4 from flowing out onto the mounting portion of the submount 5. The bonding material reservoir 10 may be provided across the entire width of the carrier 3, or may be provided only on a portion of the width of the carrier 3. The other configurations and effects are the same as those of the first embodiment.

[0019] Embodiment 3 6 is a cross-sectional view showing an optical module according to a third embodiment. In this embodiment, a coating film 11 is provided on the tip surface of the protrusion 8 and on the surface of the protrusion 8 opposite to the thermoelectric cooler 2. The coating film 11 is, for example, a Cr plating, which has poorer wettability with the AuSn solder 4 than the Au plating provided on the entire surface of the carrier 3. This further prevents the AuSn solder 4 from flowing out onto the mounting portion of the submount 5.

[0020] By limiting the coating film 11 to a portion of the protrusion 8, there is no effect on the bonding of the carrier 3 and the mounting of the submount 5. The coating film 11 may be provided over the entire width of the carrier 3, or may be provided only on a portion of the width of the carrier 3. The coating film 11 provided only on a portion of the width of the carrier 3 may be used as a positioning reference for the submount 5. The other configurations and effects are the same as those of the first embodiment.

[0021] Embodiment 4 7 is a cross-sectional view showing an optical module according to a fourth embodiment. In this embodiment, the carrier 3 has a base material 3a made of CuW, a Ni plating 3b as an undercoat film covering the base material 3a, and an Au plating 3c as an outermost surface film covering the Ni plating 3b. Ti plating may be used instead of the Ni plating 3b. Since solder bonding is not possible to the CuW base material 3a, the Au plating 3c is provided on the outermost surface of the carrier 3. The Au plating 3c has better wettability with the AuSn solder 4 than the Ni plating 3b. Therefore, the Au plating 3c is provided on the bonding surface of the carrier 3 bonded to the thermoelectric cooler 2 and on the mounting portion of the submount 5.

[0022] The Au plating 3c is removed from the tip surface of the protrusion 8 and the surface of the protrusion 8 opposite the thermoelectric cooler 2, exposing the Ni plating 3b. For example, the relevant areas can be covered with a mask during plating to prevent the Au plating 3c from being formed. Alternatively, laser marking can be performed, in which laser light is irradiated to remove the Au plating 3c and expose the underlying Ni plating 3b. The exposed Ni plating 3b is oxidized. Because the oxidized Ni plating 3b has poor wettability with the AuSn solder 4, this can further prevent the AuSn solder 4 from flowing out to the mounting portion of the submount 5.

[0023] By limiting the portion from which the Au plating 3c has been removed to a portion of the protrusion 8, there is no effect on the bonding of the carrier 3 and the mounting of the submount 5. The portion from which the Au plating 3c has been removed may be provided over the entire width of the carrier 3, or may be provided over only a portion of the width of the carrier 3. The portion from which the Au plating 3c has been removed over only a portion of the width of the carrier 3 may be used as a positioning reference for the submount 5. The other configurations and effects are the same as those of the first embodiment.

[0024] Fifth embodiment 8 is a cross-sectional view showing an optical module according to a fifth embodiment. In this embodiment, the protrusions 8 are provided at a location away from the bonding surface of the carrier 3 bonded to the thermoelectric cooler 2. The space between the bonding surface and the protrusions 8 functions as a bonding material reservoir for storing the AuSn solder 4. The protrusions 8 may be provided across the entire width of the carrier 3, or may be provided only on a portion of the width of the carrier 3. The protrusions 8 provided on only a portion of the width of the carrier 3 can be used as a positioning reference for the submount 5. The other configurations and effects are the same as those of the first embodiment.

[0025] Sixth embodiment 9 is a cross-sectional view showing an optical module according to a sixth embodiment. In this embodiment, a coating film 11 is provided on the side surface of the carrier 3 between the thermoelectric cooler 2 and the submount 5. The coating film 11 is, for example, a Cr plating, and has poorer wettability with the AuSn solder 4 than the Au plating provided on the entire surface of the carrier 3. This further prevents the AuSn solder 4 from flowing out to the mounting portion of the submount 5. The coating film 11 is also provided at a location away from the bonding surface of the carrier 3 that is bonded to the thermoelectric cooler 2. The space between the bonding surface and the coating film 11 functions as a bonding material reservoir that stores the AuSn solder 4.

[0026] The coating film 11 may be provided over the entire width of the carrier 3, or may be provided only on a portion of the width of the carrier 3. The coating film 11 provided only on a portion of the width of the carrier 3 may be used as a positioning reference for the submount 5. Other configurations and effects are the same as those of the first embodiment.

[0027] Embodiment 7 10 is a cross-sectional view showing an optical module according to a seventh embodiment. In this embodiment, the carrier 3 has a base material 3a made of CuW, a Ni plating 3b as an undercoat film covering the base material 3a, and an Au plating 3c as an outermost surface film covering the Ni plating 3b. Ti plating may be used instead of the Ni plating 3b. Since solder bonding is not possible to the CuW base material 3a, the Au plating 3c is provided on the outermost surface of the carrier 3. The Au plating 3c has better wettability with the AuSn solder 4 than the Ni plating 3b. Therefore, the Au plating 3c is provided on the bonding surface of the carrier 3 bonded to the thermoelectric cooler 2 and on the mounting portion of the submount 5.

[0028] In the region 13 on the side of the carrier 3 between the thermoelectric cooler 2 and the submount 5, the Au plating 3c is removed, exposing the Ni plating 3b. For example, during plating, the relevant area can be covered with a mask to prevent the Au plating 3c from being formed. Alternatively, laser marking can be performed, in which laser light is irradiated to remove the Au plating 3c and expose the underlying Ni plating 3b. The exposed Ni plating 3b is oxidized. Because the oxidized Ni plating 3b has poor wettability with the AuSn solder 4, it is possible to further prevent the AuSn solder 4 from flowing out onto the mounting portion of the submount 5.

[0029] The region 13 where the Ni plating 3b is exposed may be provided over the entire width of the carrier 3, or may be provided over only a portion of the width of the carrier 3. The region 13 where the Ni plating 3b is exposed over only a portion of the width of the carrier 3 may be used as a positioning reference for the submount 5. The other configurations and effects are the same as those of the first embodiment.

[0030] Embodiment 8 FIG. 11 is a cross-sectional view showing an optical module according to an eighth embodiment. In this embodiment, a recess 12 is provided on the side surface of the carrier 3 between the thermoelectric cooler 2 and the submount 5. Excess AuSn solder 4 accumulates in the recess 12, thereby preventing the AuSn solder 4 from flowing out to the mounting portion of the submount 5. The recess 12 may be provided across the entire width of the carrier 3, or may be provided across only a portion of the width of the carrier 3. The recess 12 is also provided at a location away from the bonding surface of the carrier 3 that is bonded to the thermoelectric cooler 2. Therefore, the recess 12 does not interfere with the bonding surface, increasing the area of ​​the bonding surface, thereby ensuring bonding strength and a heat dissipation path.

[0031] 12 is a cross-sectional view showing a modification of the optical module according to the eighth embodiment. A portion of the submount 5 protrudes above the recess 12. Because there is sufficient space below the protruding submount 5, the AuSn solder 4 accumulated in the recess 12 does not reach the joint of the submount 5. Therefore, the AuSn solder 4 and the SnAgCu solder 6 do not come into contact with each other, which would impair reliability.

[0032] Embodiment 9 13 is a cross-sectional view showing an optical module according to a ninth embodiment. In this embodiment, a recess 12 for storing AuSn solder 4 is provided at the corner between the bonding surface of the carrier 3 bonded to the thermoelectric cooler 2 and the side surface of the carrier 3 on which the submount 5 is mounted. By storing excess AuSn solder 4 in the recess 12, it is possible to prevent the AuSn solder 4 from flowing out to the side surface of the carrier 3 on which the submount 5 is mounted. The recess 12 may be provided across the entire width of the carrier 3, or may be provided only in a portion of the width direction of the carrier 3.

[0033] 14 is a cross-sectional view showing a modification of the optical module according to the ninth embodiment. A portion of the submount 5 protrudes above the recess 12. There is sufficient space below the protruding submount 5, so the AuSn solder 4 does not reach the joint of the submount 5. Therefore, there is no contact between the AuSn solder 4 and the SnAgCu solder 6, which would impair reliability.

[0034] Embodiment 10 15 is a cross-sectional view showing an optical module according to embodiment 10. In this embodiment, both the coating film 11 of embodiment 6 and the recess 12 of embodiment 8 are provided on the side surface of the carrier 3 between the thermoelectric cooler 2 and the submount 5. This makes it possible to obtain the effects of both embodiments 6 and 8.

[0035] 16 is a cross-sectional view showing a modified example of the optical module according to the tenth embodiment. On the side surface of the carrier 3, between the thermoelectric cooler 2 and the submount 5, both the area 13 where the Ni plating 3b of the seventh embodiment is exposed and the recess 12 of the eighth embodiment are provided. This makes it possible to obtain the effects of both the seventh and eighth embodiments.

[0036] It is possible to combine two or more of the configurations of the first to ninth embodiments, in addition to the combination of the configurations of the sixth and eighth embodiments and the combination of the configurations of the seventh and eighth embodiments, thereby further enhancing the effect of suppressing the outflow of the AuSn solder 4 onto the side surface of the carrier 3 on which the submount 5 is mounted. [Explanation of symbols]

[0037] 2 thermoelectric cooler, 3 carrier, 3a base material, 3b Ni plating (undercoat film), 3c Au plating (top surface film), 4 AuSn solder (first bonding material), 5 submount, 6 SnAgCu solder (second bonding material), 7 semiconductor laser element, 8 protrusion, 10 bonding material reservoir, 11 coating film, 12 recess, 13 region

Claims

1. a thermoelectric cooler; a carrier bonded to the thermoelectric cooler by a first bonding material; a submount mounted on a side surface of the carrier by a second bonding material; a semiconductor laser element mounted on the submount, a protrusion is provided on the side surface of the carrier between the thermoelectric cooler and the submount; The optical module is characterized in that the height of the protrusion is lower than the height of the submount.

2. 2. The optical module according to claim 1, wherein the height of the protrusion is less than half the height of the submount.

3. 3. The optical module according to claim 1, wherein the protrusion is provided only on a part of the carrier in the width direction.

4. 3. The optical module according to claim 1, wherein a bonding material reservoir for storing the first bonding material is provided on a bonding surface of the carrier bonded to the thermoelectric cooler.

5. The optical module according to claim 1 or 2, further comprising a coating film provided on the tip surface of the protrusion and on the surface of the protrusion opposite the thermoelectric cooler, the coating film having poorer wettability with the first bonding material than the surface of the carrier.

6. the carrier has a base material, an undercoat film covering the base material, and an outermost surface film covering the undercoat film; the outermost surface film has better wettability with the first bonding material than the base film, 3. The optical module according to claim 1, wherein the outermost surface film is removed from the tip end surface of the protrusion and the surface of the protrusion opposite the thermoelectric cooler, thereby exposing the base film.

7. 3. The optical module according to claim 1, wherein the protrusion is provided at a position away from a bonding surface of the carrier that is bonded to the thermoelectric cooler.

8. a thermoelectric cooler; a carrier bonded to the thermoelectric cooler by a first bonding material; a submount mounted on a side surface of the carrier by a second bonding material; a semiconductor laser element mounted on the submount; an optical module comprising: a coating film provided on the side surface of the carrier between the thermoelectric cooler and the submount, the coating film having poorer wettability with the first bonding material than the surface of the carrier.

9. 9. The optical module according to claim 8, wherein the coating film is provided only on a part of the width of the carrier.

10. a thermoelectric cooler; a carrier bonded to the thermoelectric cooler by a first bonding material; a submount mounted on a side surface of the carrier by a second bonding material; a semiconductor laser element mounted on the submount, the carrier has a base material, an undercoat film covering the base material, and an outermost surface film covering the undercoat film; the outermost surface film has better wettability with the first bonding material than the base film, an outermost surface film being removed to expose the base film in a region between the thermoelectric cooler and the submount on the side surface of the carrier;

11. 11. The optical module according to claim 10, wherein the region where the base film is exposed is provided only in a part of the width direction of the carrier.

12. 12. The optical module according to claim 1, wherein a recess is provided on the side surface of the carrier between the thermoelectric cooler and the submount.

13. a thermoelectric cooler; a carrier bonded to the thermoelectric cooler by a first bonding material; a submount mounted on a side surface of the carrier by a second bonding material; a semiconductor laser element mounted on the submount, a recess is provided on the side surface of the carrier between the thermoelectric cooler and the submount; The optical module is characterized in that the recess is provided at a location away from a bonding surface of the carrier that is bonded to the thermoelectric cooler.

14. 13. The optical module according to claim 12, wherein the recess is provided at a corner between the bonding surface of the carrier bonded to the thermoelectric cooler and the side surface of the carrier, and stores the first bonding material.

15. 13. The optical module according to claim 12, wherein a portion of the submount protrudes above the recess.

16. 13. The optical module according to claim 12, wherein the recess is provided only in a part of the width direction of the carrier.

17. 13. The optical module according to claim 12, wherein the recess is provided at a location away from a bonding surface of the carrier that is bonded to the thermoelectric cooler.

18. 14. The optical module according to claim 1, wherein the first bonding material and the second bonding material are different from each other.

19. A thermoelectric cooler; a carrier bonded to the thermoelectric cooler by a first bonding material; a submount mounted on a side surface of the carrier by a second bonding material; a semiconductor laser element mounted on the submount, a protrusion is provided on the side surface of the carrier between the thermoelectric cooler and the submount; the height of the protrusion is less than the height of the submount; the first bonding material and the second bonding material are different, the first bonding material is solder, The optical module is characterized in that the second bonding material is a solder having a lower melting point than the first bonding material.

20. A thermoelectric cooler; a carrier bonded to the thermoelectric cooler by a first bonding material; a submount mounted on a side surface of the carrier by a second bonding material; a semiconductor laser element mounted on the submount; a coating film provided on the side surface of the carrier between the thermoelectric cooler and the submount, the coating film having a lower wettability with the first bonding material than a surface of the carrier; the first bonding material and the second bonding material are different, the first bonding material is solder, The optical module is characterized in that the second bonding material is a solder having a lower melting point than the first bonding material.

21. A thermoelectric cooler; a carrier bonded to the thermoelectric cooler by a first bonding material; a submount mounted on a side surface of the carrier by a second bonding material; a semiconductor laser element mounted on the submount, the carrier has a base material, an undercoat film covering the base material, and an outermost surface film covering the undercoat film; the outermost surface film has better wettability with the first bonding material than the base film, the outermost surface film is removed to expose the base film in a region between the thermoelectric cooler and the submount on the side surface of the carrier; the first bonding material and the second bonding material are different, the first bonding material is solder, The optical module is characterized in that the second bonding material is a solder having a lower melting point than the first bonding material.

22. A thermoelectric cooler; a carrier bonded to the thermoelectric cooler by a first bonding material; a submount mounted on a side surface of the carrier by a second bonding material; a semiconductor laser element mounted on the submount, a recess is provided on the side surface of the carrier between the thermoelectric cooler and the submount; the first bonding material and the second bonding material are different, the first bonding material is solder, The optical module is characterized in that the second bonding material is a solder having a lower melting point than the first bonding material.

23. the first bonding material is AuSn solder, 23. The optical module according to claim 19, wherein the second bonding material is a SnAgCu solder.

24. 23. The optical module according to claim 1, wherein there are no elements or wiring between the thermoelectric cooler and the submount.

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