Processing method and processing device

Abstract

To provide a processing method capable of appropriately removing a ring-like reinforcement part from a wafer by cutting the wafer at a required position.SOLUTION: A processing method comprises: a frame preparation step of preparing a ring-like frame 64 in which an open part 64a housing a wafer 4 is formed; a wafer preparation step of preparing the wafer 4 in which a ring-like reinforcement part 24 is formed in a convex shape on a back surface 4b corresponded to an outer peripheral residual region; a frame unit generation step of generating a frame unit U by bonding a tape 96 to the frame 64 and the back surface 4b of the wafer 4; a center setting step of setting a center of an inner peripheral circle of the ring-like reinforcement part 24 by imaging the ring-like reinforcement part 24; a cutting step of cutting the wafer 4 along an inner peripheral circle of the ring-like reinforcement part 24 by rotating the frame unit U on the basis of the center; and a reinforcement part removing step of removing the ring-like reinforcement part 24 cut from the frame unit U.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a processing method and processing apparatus for removing a ring-shaped reinforcing portion from a wafer having a convex ring-shaped reinforcing portion formed on the back surface corresponding to a peripheral excess region. [Background technology]

[0002] A wafer has on its surface a device region where a plurality of devices such as ICs and LSIs are partitioned by planned division lines, and a peripheral excess region surrounding the device region.The back surface of the wafer is ground to a desired thickness, and then the wafer is divided into individual device chips using a dicing machine and a laser processing machine, and each of the divided device chips is used in electrical equipment such as mobile phones and personal computers.

[0003] The applicant has proposed a technology in which, in order to facilitate the transportation of ground wafers, a ring-shaped reinforcing portion is left on the back surface corresponding to the peripheral excess area, and the wafer is subjected to a predetermined processing, and then a dicing tape is attached to the back surface of the wafer, the wafer is supported by a frame, and the ring-shaped reinforcing portion is removed from the wafer (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-62375 Summary of the Invention [Problem to be solved by the invention]

[0005] However, it is difficult to cut the wafer at the required position and properly remove the ring-shaped reinforcing portion from the wafer, which results in poor productivity.

[0006] SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a processing method and processing apparatus that can cut a wafer at a desired position and properly remove a ring-shaped reinforcing portion from the wafer. [Means for solving the problem]

[0007] According to the present invention, the following processing method is provided to solve the above-mentioned problems: That is, a processing method for removing a ring-shaped reinforcement portion from a wafer having the ring-shaped reinforcement portion formed in a convex shape on the back surface corresponding to the peripheral excess area, the method comprising a frame preparation step of preparing a ring-shaped frame having an opening for accommodating the wafer, a wafer preparation step of preparing a wafer having the ring-shaped reinforcement portion formed in a convex shape on the back surface corresponding to the peripheral excess area, a frame unit generation step of attaching tape to the frame and the back surface of the wafer to generate a frame unit, and a step of capturing an image of the ring-shaped reinforcement portion. The coordinates of at least three points on the inner circumference of the ring-shaped reinforcing part are measured, and based on the coordinates of the three measured points, The processing method includes a center setting step of setting the center of the inner circumference of the ring-shaped reinforcement part, a cutting step of rotating the frame unit based on the center and cutting the wafer along the inner circumference of the ring-shaped reinforcement part, and a reinforcement part removing step of removing the cut ring-shaped reinforcement part from the frame unit.

[0008] Preferably, an image of the wafer surface corresponding to the ring-shaped reinforcing portion is taken to inspect whether or not a device exists in the region where the ring-shaped reinforcing portion is to be cut, and if a device exists, processing is interrupted. In the center setting step, if a region where the ring-shaped reinforcing portion and the tape are not in close contact is detected, processing is preferably interrupted.

[0009] The present invention also provides the following processing apparatus that solves the above-mentioned problems: Namely, a processing apparatus for removing a ring-shaped reinforcing portion from a wafer having a convex ring-shaped reinforcing portion formed on the back surface corresponding to a peripheral excess area, the processing apparatus comprising: a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed, wafer carrying-out means for carrying out wafers from the wafer cassette placed on the wafer cassette table, a wafer table for supporting the front surface sides of the wafers carried out by the wafer carrying-out means, and frame accommodating means for accommodating a plurality of ring-shaped frames each having an opening formed therein for accommodating a wafer; a frame carrying-out means for carrying out the frame from the frame storage means; a frame table for supporting the frame carried out by the frame carrying-out means; a tape applying means disposed above the frame table for applying tape to the frame; a tape-attached frame transport means for transporting the frame with the tape attached to it to the wafer table and positioning the opening of the frame on the backside of the wafer supported on the wafer table to place the tape-attached frame on the wafer table; and a tape applying means for pressing the tape of the tape-attached frame onto the backside of the wafer. a frame cassette table on which a frame cassette containing a ring-free unit carried out by the ring-free unit carry-out means is placed, the frame unit carry-out means comprising a frame unit holding section including a wafer holding section for holding a wafer and a frame holding section for holding a frame, and a transport section for transporting the frame unit holding section to a temporary placement table; an upper camera is disposed between the wafer table and the temporary placement table, the upper camera capturing an image of the back surface of the wafer from above the frame unit via the tape, and the processing device is configured to determine the center of the inner circumference of the ring-shaped reinforcing section formed on the back surface of the wafer.

[0010] Preferably, the frame unit carrying-out means includes a two-dimensional movement mechanism that moves the frame unit holding portion horizontally in two dimensions, and operates the two-dimensional movement mechanism to align the center of the inner circumference of the ring-shaped reinforcement portion with the center of the temporary placement table.

[0011] A lower camera is disposed opposite the upper camera so as to sandwich the frame unit, and the lower camera takes an image of the surface of the wafer corresponding to the ring-shaped reinforcement portion to inspect whether or not a device is present in the area where the ring-shaped reinforcement portion is to be cut, and if a device is present, processing is conveniently interrupted.

[0012] When an area where the ring-shaped reinforcing portion and the tape are not in close contact is detected by the image captured by the upper camera, it is preferable to interrupt the processing.

[0013] The tape pressing means preferably comprises an upper chamber disposed above the wafer table, a lower chamber accommodating the wafer table, a lifting mechanism that raises and lowers the upper chamber to create a closed state in which it is in contact with the lower chamber and an open state in which it is separated from the lower chamber, a vacuum section that evacuates the upper chamber and the lower chamber in the closed state, and an atmosphere opening section that opens the upper chamber and the lower chamber to the atmosphere, and with the tape of the tape-attached frame positioned on the backside of the wafer supported on the wafer table, the lifting mechanism is operated to evacuate the upper chamber and the lower chamber while maintaining the closed state, and a pressure roller disposed in the upper chamber presses the tape of the tape-attached frame against the backside of the wafer.

[0014] the reinforcing portion removing means comprises: a laser beam applying means for applying a laser beam along an inner circumferential circle of a ring-shaped reinforcing portion formed on the outer periphery of the wafer to form a cutting groove; a first lifting table for holding and lifting a frame unit temporarily placed on the temporary placement table and positioning it on the laser beam applying means; and a separating unit for separating the ring-shaped reinforcing portion from the cutting groove; The separation section preferably includes an ultraviolet irradiation section that irradiates ultraviolet light onto the tape corresponding to the cutting groove to reduce the adhesive strength of the tape, a second lifting table that exposes the ring-shaped reinforcement section to the outer periphery and holds the inside of the wafer by suction, a separator that acts on the outer periphery of the ring-shaped reinforcement section with a wedge-equipped block to separate the ring-shaped reinforcement section, and a disposal section in which the separated ring-shaped reinforcement section is disposed of. [Effects of the Invention]

[0015] The processing method of the present invention is a processing method for removing a ring-shaped reinforcing portion from a wafer having a convex ring-shaped reinforcing portion formed on the back surface corresponding to the peripheral excess area, and includes a frame preparation step of preparing a ring-shaped frame having an opening for accommodating the wafer, a wafer preparation step of preparing a wafer having a convex ring-shaped reinforcing portion formed on the back surface corresponding to the peripheral excess area, a frame unit generation step of attaching tape to the frame and the back surface of the wafer, and a frame unit generation step of capturing an image of the ring-shaped reinforcing portion. The coordinates of at least three points on the inner circumference of the ring-shaped reinforcing part are measured, and based on the coordinates of the three measured points, The method includes a center setting step of setting the center of the inner circumference of the ring-shaped reinforcement part, a cutting step of rotating the frame unit based on the center and cutting the wafer along the inner circumference of the ring-shaped reinforcement part, and a reinforcement part removal step of removing the ring-shaped reinforcement part cut from the frame unit, so that the wafer can be cut along the inner circumference of the ring-shaped reinforcement part and the ring-shaped reinforcement part can be properly removed from the wafer.

[0016] In the processing apparatus of the present invention, an upper camera is disposed between the wafer table and the temporary placement table, which images the back surface of the wafer from above the frame unit via the tape, and determines the inner circumference of the ring-shaped reinforcing portion formed on the back surface of the wafer.By irradiating a laser beam along the inner circumference of the ring-shaped reinforcing portion formed on the back surface of the wafer, the wafer can be cut at the required position and the ring-shaped reinforcing portion can be properly removed from the wafer. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a perspective view of a processing device constructed in accordance with the present invention; [Figure 2] FIG. 2 is a perspective view of a wafer to be processed by the processing apparatus shown in FIG. [Figure 3] FIG. 2 is a perspective view of a wafer cassette table and the like shown in FIG. [Figure 4] FIG. 2 is a perspective view of the hand shown in FIG. 1 . [Figure 5] FIG. 2 is a perspective view of a frame receiving means and the like shown in FIG. [Figure 6] (a) is a perspective view of the tape application means, etc. when the frame table shown in Figure 1 is in a lowered position, (b) is a perspective view of the tape application means, etc. when the frame table shown in Figure 1 is in an raised position. [Figure 7] FIG. 2 is an exploded perspective view of the tape pressing means shown in FIG. 1. [Figure 8] FIG. 10 is a cross-sectional view showing a state in which the pressure roller starts to press the tape in the tape pressing step. [Figure 9] 10 is a cross-sectional view showing a state in which pressing of the tape by the pressing roller has finished in the tape pressing step. FIG. [Figure 10] FIG. 2A is a perspective view of a frame unit as viewed from the front surface side of a wafer, and FIG. 2B is a perspective view of a frame unit as viewed from the back surface side of a wafer. [Figure 11] FIG. 2 is a perspective view of the reinforcement portion removing means shown in FIG. 1. [Figure 12] FIG. 10 is a perspective view showing a state in which the frame unit is positioned between the upper camera and the lower camera of the frame unit carrying-out means. [Figure 13] (a) A partial cross-sectional view of a frame unit when there is no device in the ring-shaped reinforcement section and the ring-shaped reinforcement section and the tape are in close contact, (b) a partial cross-sectional view of a frame unit when there is a device in the ring-shaped reinforcement section, and (c) a partial cross-sectional view of a frame unit when the ring-shaped reinforcement section and the tape are not in close contact. [Figure 14] Schematic diagram showing a state in which a laser beam is irradiated onto the base of a wafer in a cutting process. [Figure 15] FIG. 2 is a perspective view of a first lifting table of the reinforcement-portion removing means shown in FIG. [Figure 16]2(a) is a perspective view of a separation part of the reinforcing part removing means shown in FIG. 1, and FIG. 2(b) is an enlarged perspective view of the support substrate shown in FIG. [Figure 17] 2 is a perspective view of a discarding portion of the reinforcing portion removing means shown in FIG. 1. FIG. [Figure 18] FIG. 10 is a schematic view showing a state in which the wafer is suction-held by the second lifting table in the reinforcing portion removing step. [Figure 19] 10 is a schematic diagram showing a state in which a piece of the reinforcing portion removing means is applied to the outer periphery of the ring-shaped reinforcing portion in the reinforcing portion removing step. FIG. [Figure 20] FIG. 10 is a schematic diagram showing a state in which the reinforcing portion is separated from the wafer in the reinforcing portion removing step. [Figure 21] FIG. 2 is a perspective view of a reversing mechanism of the ring-free unit carrying-out means shown in FIG. [Figure 22] 2 is a perspective view of a ring-free unit supporting portion and a pushing portion of the ring-free unit carrying-out means shown in FIG. 1. FIG. [Figure 23] FIG. 10 is a perspective view showing a state in which a ring-less unit accommodating step is being performed. DETAILED DESCRIPTION OF THE INVENTION

[0018] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a processing method and a processing apparatus constructed according to the present invention will now be described with reference to the drawings.

[0019] First, an embodiment of the processing apparatus of the present invention will be described. Referring to Figure 1, the processing apparatus, generally designated by reference numeral 2, includes a wafer cassette table 8 on which a wafer cassette 6 containing a plurality of wafers is placed, wafer carrying-out means 10 for carrying out wafers from the wafer cassette 6 placed on the wafer cassette table 8, and a wafer table 12 for supporting the front side of the wafer carried out by the wafer carrying-out means 10.

[0020] FIG. 2 shows a wafer 4 to be processed by a processing apparatus 2. A device region 18, in which a plurality of devices 14 such as ICs and LSIs are partitioned by grid-like dividing lines 16, and a peripheral surplus region 20 surrounding the device region 18 are formed on the front surface 4a of the wafer 4. In FIG. 2, a boundary 22 between the device region 18 and the peripheral surplus region 20 is shown by a two-dot chain line for convenience, but in reality, there is no line indicating the boundary 22. On the back surface 4b side of the wafer 4, a ring-shaped reinforcing portion 24 is formed in a convex shape in the peripheral surplus region 20, and the thickness of the peripheral surplus region 20 is greater than the thickness of the device region 18. In addition, a notch 26 indicating the crystal orientation is formed on the periphery of the wafer 4.

[0021] 3, a wafer cassette 6 accommodates a plurality of wafers 4 spaced apart in the vertical direction with their surfaces 4a facing upward. The wafer cassette table 8 in the illustrated embodiment has a top plate 28 on which the wafer cassette 6 is placed, and a support plate 30 that supports the top plate 28. The top plate 28 is movable up and down, and an elevator means may be provided to raise and lower the top plate 28 to position it at any height.

[0022] Continuing the explanation with reference to FIG. 3, the wafer unloading means 10 includes a Y-axis movable member 32 that is movable in the Y-axis direction indicated by the arrow Y in FIG. 3, and a Y-axis feed means 34 that moves the Y-axis movable member 32 in the Y-axis direction. The Y-axis feed means 34 includes a ball screw 36 that is connected to the lower end of the Y-axis movable member 32 and extends in the Y-axis direction, and a motor 38 that rotates the ball screw 36. The Y-axis feed means 34 converts the rotational motion of the motor 38 into linear motion using the ball screw 36 and transmits it to the Y-axis movable member 32, thereby moving the Y-axis movable member 32 in the Y-axis direction along a pair of guide rails 40 that extend in the Y-axis direction. Note that the X-axis direction indicated by the arrow X in FIG. 3 is a direction perpendicular to the Y-axis direction, and the Z-axis direction indicated by the arrow Z in FIG. 3 is an up-down direction perpendicular to the X-axis and Y-axis directions. The XY plane defined by the X-axis and Y-axis directions is substantially horizontal.

[0023] 3, the wafer carrying-out means 10 of the illustrated embodiment includes a transfer arm 42 and a hand 44 disposed at the tip of the transfer arm 42, which supports the back surface 4b of the wafer 4 housed in the wafer cassette 6 and turns the wafer 4 upside down. The transfer arm 42 is provided on the upper surface of the Y-axis movable member 32 and is driven by an appropriate drive source (not shown), such as an air drive source or an electric drive source. This drive source drives the transfer arm 42 to position the hand 44 at any position in each of the X-axis, Y-axis, and Z-axis directions and to turn the hand 44 upside down.

[0024] Explaining with reference to Fig. 4, the hand 44 is preferably a Bernoulli pad that generates negative pressure by jetting air and supports the wafer 4 without contact. The hand 44 in the illustrated embodiment is C-shaped overall, and one side of the hand 44 is formed with a plurality of air jets 46 connected to a compressed air supply source (not shown). A plurality of guide pins 48 are attached to the outer periphery of the hand 44 at intervals in the circumferential direction. Each guide pin 48 is configured to be movable radially of the hand 44.

[0025] 3 and 4, the wafer unloading means 10 positions the hand 44 on the back surface 4b side (underside) of the wafer 4 in the wafer cassette 6 placed on the wafer cassette table 8, and then ejects compressed air from the air ejection ports 46 of the hand 44 to generate negative pressure on one side of the hand 44 by the Bernoulli effect, causing the hand 44 to suction-support the wafer 4 from the back surface 4b side without contact. The horizontal movement of the wafer 4 suction-supported by the hand 44 is regulated by each guide pin 48. The wafer unloading means 10 then moves the Y-axis movable member 32 and the transfer arm 42 to unload the wafer 4 suction-supported by the hand 44 from the wafer cassette 6.

[0026] 4, the wafer carrying-out means 10 of the illustrated embodiment is equipped with a notch detection means 50 that detects the position of the notch 26 of the wafer 4. The notch detection means 50 may be configured to include, for example, a light-emitting element 52 and a light-receiving element 54 that are spaced apart from each other in the vertical direction, and a drive source (not shown) that rotates at least one of the guide pins 48 of the hand 44.

[0027] The light-emitting element 52 and the light-receiving element 54 can be attached to the Y-axis movable member 32 or the transport path via an appropriate bracket (not shown). When the guide pin 48 is rotated by the drive source, the rotation of the guide pin 48 causes the wafer 4 supported by suction by the hand 44 to rotate. In order to reliably transmit the rotation from the guide pin 48 to the wafer 4, it is preferable that the outer circumferential surface of the guide pin 48, which is rotated by the drive source, is formed from an appropriate synthetic rubber.

[0028] The notch detection means 50 can detect the position of the notch 26 by rotating the wafer 4 via the guide pin 48 using a drive source while the wafer 4 is supported by suction with the hand 44 and the outer periphery of the wafer 4 is positioned between the light emitting element 52 and the light receiving element 54. This makes it possible to adjust the orientation of the wafer 4 to any desired orientation.

[0029] As shown in Figure 3, the wafer table 12 is disposed adjacent to the wafer carrying-out means 10. The wafer table 12 in the illustrated embodiment includes an annular support portion 56 that supports the peripheral excess region 20 of the wafer 4 and keeps the portion inside the peripheral excess region 20 out of contact, and a frame support portion 58 that is disposed on the outer periphery of the annular support portion 56 and supports a frame 64 (see Figure 5), which will be described later. A plurality of suction holes 60 are formed in the upper surface of the annular support portion 56 and are spaced apart in the circumferential direction, and each suction hole 60 is connected to a suction means (not shown). A portion of the wafer table 12 radially inward of the annular support portion 56 forms a circular recess 62 that is recessed downward.

[0030] When the hand 44 is turned 180° to invert the wafer 4 and place the wafer 4 on the wafer table 12 with the front surface 4a of the wafer 4 facing downward, the peripheral excess region 20 of the wafer 4 is supported by the annular support portion 56 and the device region 18 of the wafer 4 is located in the recess 62. Therefore, even if the wafer 4 is placed on the wafer table 12 with the front surface 4a on which the devices 14 are formed facing downward, the devices 14 and the wafer table 12 do not come into contact with each other, preventing damage to the devices 14. Furthermore, after the wafer table 12 supports the peripheral excess region 20 with the annular support portion 56, it activates the suction means to generate suction force in each suction hole 60 to suction-hold the peripheral excess region 20, thereby preventing the wafer 4 from shifting position.

[0031] Referring to Figure 5, the processing apparatus 2 further includes a frame accommodating means 66 for accommodating a plurality of ring-shaped frames 64 each having an opening 64a for accommodating a wafer 4, a frame unloading means 68 for unloading the frames 64 from the frame accommodating means 66, and a frame table 70 for supporting the frames 64 unloaded by the frame unloading means 68.

[0032] As shown in Fig. 5, the frame accommodating means 66 of the illustrated embodiment includes a housing 72, a lift plate 74 arranged within the housing 72 so as to be able to move up and down, and a lifting means (not shown) for raising and lowering the lift plate 74. In Fig. 5, a Z-axis guide member 78 extending in the Z-axis direction is arranged on the side surface of the housing 72 on the far side in the X-axis direction. The lift plate 74 is supported by the Z-axis guide member 78 so as to be able to move up and down, and the lifting means for raising and lowering the lift plate 74 is arranged inside the Z-axis guide member 78. The lifting means may include, for example, a ball screw connected to the lift plate 74 and extending in the Z-axis direction, and a motor for rotating the ball screw.

[0033] 5, a door 76 with a handle 76a is provided on the side surface of the housing 72 on the front side in the X-axis direction, and in the frame accommodating means 66, the handle 76a is grasped to open the door 76, thereby allowing the frame 64 to be accommodated inside the housing 72. In addition, an opening 80 is provided at the upper end of the housing 72.

[0034] 5, frames 64 are stored in a stack on the upper surface of lift plate 74 inside housing 72. The uppermost frame 64 of the stacked frames 64 is carried out by frame carry-out means 68 through an opening 80 in housing 72. Furthermore, when a frame 64 is carried out through opening 80, frame storage means 66 appropriately raises lift plate 74 using the lifting means, and positions the uppermost frame 64 at a position where it can be carried out by frame carry-out means 68.

[0035] 5, frame carry-out means 68 includes an X-axis guide member 82 fixed to an appropriate bracket (not shown) and extending in the X-axis direction, an X-axis movable member 84 supported by X-axis guide member 82 so as to be movable in the X-axis direction, an X-axis feed means (not shown) for moving X-axis movable member 84 in the X-axis direction, a Z-axis movable member 86 supported by X-axis movable member 84 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving Z-axis movable member 86 in the Z-axis direction. The X-axis feed means of frame carry-out means 68 may be configured to include a ball screw connected to X-axis movable member 84 and extending in the X-axis direction, and a motor for rotating the ball screw, and the Z-axis feed means may be configured to include a ball screw connected to Z-axis movable member 86 and extending in the Z-axis direction, and a motor for rotating the ball screw.

[0036] The Z-axis movable member 86 of the frame carry-out means 68 has a holding portion 88 that holds the frame 64. In the illustrated embodiment, the holding portion 88 has a rectangular base plate 90 and a plurality of suction pads 92 provided on the underside of the base plate 90, and each suction pad 92 is connected to suction means (not shown).

[0037] The frame ejection means 68 holds the top frame 64 housed in the frame storage means 66 by suction using the suction pad 92 of the holding portion 88, and then moves the X-axis movable member 84 and the Z-axis movable member 86 to eject the top frame 64 held by suction from the frame storage means 66.

[0038] 5, the frame table 70 is supported by a Z-axis guide member 94 so as to be able to move up and down between a lowered position indicated by a solid line and an upper position indicated by a two-dot chain line. An appropriate drive source (for example, an air drive source or an electric drive source) is attached to the Z-axis guide member 94 for raising and lowering the frame table 70 between the lowered position and the upper position. The frame table 70 is designed to receive the frame 64 carried out by the frame carry-out means 68 at the lowered position.

[0039] As shown in Figures 1 and 5, the processing device 2 includes a tape applying means 98 (see Figure 1) that is arranged above the frame table 70 and applies tape 96 to the frame 64, a tape-attached frame transport means 100 (see Figure 5) that transports the frame 64 with the tape 96 attached (hereinafter sometimes referred to as the "tape-attached frame 64'") to the wafer table 12 and positions the opening 64a of the frame 64 over the back surface 4b of the wafer 4 supported on the wafer table 12, thereby placing the tape-attached frame 64' on the wafer table 12, and a tape pressing means 102 (see Figure 1) that presses the tape 96 of the tape-attached frame 64' onto the back surface 4b of the wafer 4.

[0040] Referring to Figure 6, the tape application means 98 of the illustrated embodiment includes a roll tape support section 104 that supports a roll tape 96R on which unused tape 96 is wound, a tape winding section 106 that winds up the used tape 96, a tape pulling section 108 that pulls out the tape 96 from the roll tape 96R, a crimping section 110 that crimps the pulled-out tape 96 to the frame 64, and a cutting section 112 that cuts off the tape 96 that protrudes beyond the outer periphery of the frame 64 along the frame 64.

[0041] 6, the roll tape support unit 104 includes a support roller 114 supported by an appropriate bracket (not shown) so as to be rotatable about an axis extending in the X-axis direction. The support roller 114 supports a roll tape 96R that is wound into a cylindrical shape and has a release paper 116 attached to the adhesive surface of the tape 96 to protect the adhesive surface of the tape 96.

[0042] The tape winding unit 106 includes a winding roller 118 supported by an appropriate bracket (not shown) so as to be rotatable about an axis extending in the X-axis direction, and a motor (not shown) that rotates the winding roller 118. As shown in Fig. 6, the tape winding unit 106 rotates the winding roller 118 with the motor, thereby winding up the used tape 96, which has a circular opening 120 that corresponds to the portion attached to the frame 64.

[0043] Continuing the explanation with reference to Figure 6, the tape pull-out section 108 includes a pull-out roller 122 arranged below the support roller 114 of the roll tape support section 104, a motor (not shown) that rotates the pull-out roller 122, and a driven roller 124 that rotates in conjunction with the rotation of the pull-out roller 122. The tape pull-out section 108 rotates the driven roller 124 together with the pull-out roller 122 using the motor, thereby pulling out the tape 96 sandwiched between the pull-out roller 122 and the driven roller 124 from the roll tape 96R.

[0044] The release paper 116 is peeled off from the tape 96 that has passed between the pull-out roller 122 and the driven roller 124, and the peeled release paper 116 is taken up by a release paper take-up unit 126. In the illustrated embodiment, the release paper take-up unit 126 has a release paper take-up roller 128 that is arranged above the driven roller 124, and a motor (not shown) that rotates the release paper take-up roller 128. In addition, the tape 96 from which the release paper 116 has been peeled off is guided to the take-up roller 118 via a guide roller 130 that is arranged at a distance from the pull-out roller 122 in the Y-axis direction.

[0045] The pressure bonding unit 110 includes a pressure roller 132 that is arranged to be movable in the Y-axis direction, and a Y-axis feed means (not shown) that moves the pressure roller 132 in the Y-axis direction. The Y-axis feed means of the pressure bonding unit 110 can be configured from an appropriate drive source (for example, an air drive source or an electric drive source).

[0046] 6, cutting unit 112 includes a Z-axis guide member 134 fixed to an appropriate bracket (not shown) and extending in the Z-axis direction, a Z-axis movable member 136 supported by Z-axis guide member 134 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) that moves Z-axis movable member 136 in the Z-axis direction. The Z-axis feed means of cutting unit 112 may be configured to include a ball screw connected to Z-axis movable member 136 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0047] Cutting section 112 also includes a motor 138 fixed to the underside of the tip of Z-axis movable member 136, and an arm piece 140 that is rotated by motor 138 about an axis extending in the Z-axis direction. First and second hanging pieces 142a, 142b are attached to the underside of arm piece 140 at a distance from each other. A circular cutter 144 is supported on first hanging piece 142a so as to be rotatable about an axis perpendicular to the Z-axis direction, and a presser roller 146 is supported on second hanging piece 142b so as to be rotatable about an axis perpendicular to the Z-axis direction.

[0048] Before the frame table 70, which has received the frame 64 from the frame discharge means 68, is moved from the lowered position (the position shown in FIG. 6(a)) to the raised position (the position shown in FIG. 6(b)), the tape application means 98 draws out the unused tape 96 using the draw-out roller 122 and driven roller 124. Next, the frame table 70 is raised to a position where the pressure roller 132 of the pressure bonding unit 110 can press the tape 96 against the frame 64, and the pressure roller 132 is brought into contact with the frame 64 via the tape 96. Then, the pressure roller 132 rolls in the Y-axis direction while pressing the adhesive surface of the tape 96 against the frame 64. This allows the tape 96 drawn out from the roll tape 96R by the tape draw-out unit 108 to be pressure-bonded to the frame 64.

[0049] After the tape 96 has been pressed against the frame 64, the tape application means 98 lowers the Z-axis movable member 136 of the cutting unit 112 using the Z-axis feed means, pressing the cutter 144 against the tape 96 on the frame 64 and pressing the frame 64 from above the tape 96 with the pressure roller 146. Next, the motor 138 rotates the arm piece 140, moving the cutter 144 and pressure roller 146 in a circular motion along the frame 64. This allows the tape 96 that extends beyond the outer periphery of the frame 64 to be cut along the frame 64. In addition, because the pressure roller 146 presses the frame 64 from above the tape 96, displacement of the frame 64 and the tape 96 while cutting the tape 96 is prevented. Then, after the frame table 70 is lowered, the used tape 96, now with the circular opening 120 corresponding to the portion of the tape 96 that was attached to the frame 64, is taken up by the tape take-up unit 106.

[0050] 5, the tape-attached frame transport means 100 includes a Y-axis guide member 148 fixed to an appropriate bracket (not shown) and extending in the Y-axis direction, a Y-axis movable member 150 supported by the Y-axis guide member 148 so as to be movable in the Y-axis direction, a Y-axis feed means (not shown) for moving the Y-axis movable member 150 in the Y-axis direction, a Z-axis movable member 152 supported by the Y-axis movable member 150 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving the Z-axis movable member 152 in the Z-axis direction. The Y-axis feed means of the tape-attached frame transport means 100 may be configured to include a ball screw connected to the Y-axis movable member 150 and extending in the Y-axis direction, and a motor for rotating the ball screw, and the Z-axis feed means may be configured to include a ball screw connected to the Z-axis movable member 152 and extending in the Z-axis direction, and a motor for rotating the ball screw.

[0051] The Z-axis movable member 152 of the tape-attached frame transport means 100 has a holding portion 154 that holds the tape-attached frame 64'. In the illustrated embodiment, the holding portion 154 has a rectangular base plate 156 and a plurality of suction pads 158 provided on the underside of the base plate 156, and each suction pad 158 is connected to suction means (not shown).

[0052] The tape-attached frame transport means 100 suction-holds the upper surface of the tape-attached frame 64' supported on the frame table 70 with the adhesive side of the tape 96 facing downwards using each suction pad 158 of the holding portion 154, and by moving the Y-axis movable member 150 and the Z-axis movable member 152, transports the tape-attached frame 64' held by suction by the holding portion 154 from the frame table 70 to the wafer table 12, and places the tape-attached frame 64' on the wafer table 12 by positioning the opening 64a of the frame 64 on the back surface 4b of the wafer 4 supported on the wafer table 12.

[0053] The tape pressing means 102 will be described with reference to Figures 7 to 9. As shown in Figure 7, the tape pressing means 102 includes an upper chamber 160 disposed above the wafer table 12, a lower chamber 162 accommodating the wafer table 12, an elevation mechanism 164 that raises and lowers the upper chamber 160 to create a closed state in which it is in contact with the lower chamber 162 and an open state in which it is separated from the lower chamber 162, a vacuum section 166 that evacuates the upper chamber 160 and the lower chamber 162 in the closed state, and an atmosphere opening section 168 that opens the upper chamber 160 and the lower chamber 162 to the atmosphere.

[0054] 7, the upper chamber 160 in the illustrated embodiment includes a circular top plate 170 and a cylindrical side wall 172 that hangs down from the periphery of the top plate 170. An elevation mechanism 164, which may be composed of an appropriate actuator such as an air cylinder, is attached to the upper surface of the top plate 170. In the storage space defined by the lower surface of the top plate 170 and the inner peripheral surface of the side wall 172, there are disposed a pressure roller 174 for pressing the tape 96 of the tape-attached frame 64' against the back surface 4b of the wafer 4 supported on the wafer table 12, a support piece 176 for rotatably supporting the pressure roller 174, and a Y-axis feed means 178 for moving the support piece 176 in the Y-axis direction.

[0055] Y-axis feed means 178 has a ball screw 180 that is connected to support piece 176 and extends in the Y-axis direction, and a motor 182 that rotates ball screw 180. Y-axis feed means 178 converts the rotational motion of motor 182 into linear motion using ball screw 180 and transmits the linear motion to support piece 176, moving support piece 176 along a pair of guide rails 184 that extend in the Y-axis direction.

[0056] 7, the lower chamber 162 has a cylindrical side wall 186, with the upper part of the side wall 186 open and the lower part of the side wall 186 closed. A connection opening 188 is formed in the side wall 186. A vacuum part 166, which may be constituted by an appropriate vacuum pump, is connected to the connection opening 188 via a flow path 190. The flow path 190 is provided with an atmosphere opening part 168, which may be constituted by an appropriate valve that can open the flow path 190 to the atmosphere.

[0057] With the tape 96 of the tape-attached frame 64' positioned on the back surface 4b of the wafer 4 supported on the wafer table 12, the tape pressing means 102 lowers the upper chamber 160 using the lifting mechanism 164, bringing the lower end of the side wall 172 of the upper chamber 160 into contact with the upper end of the side wall 186 of the lower chamber 162, thereby closing the upper chamber 160 and the lower chamber 162 and bringing the pressure roller 174 into contact with the tape-attached frame 64'.

[0058] Next, the tape pressing means 102 operates the vacuum pump that constitutes the vacuum section 166 with the valve that constitutes the atmosphere release section 168 closed to evacuate the inside of the upper chamber 160 and the lower chamber 162, and then, as shown in Figures 8 and 9, the Y-axis feed means 178 rolls the pressure roller 174 in the Y-axis direction to press the tape 96 onto the back surface 4b of the wafer 4, thereby generating a frame unit U. Figure 10 shows perspective views of the frame unit U as viewed from the front surface side and the back surface side.

[0059] When the tape 96 is pressed onto the back surface 4b of the wafer 4 by the pressure roller 174, a small gap is formed between the wafer 4 and the tape 96 at the base of the ring-shaped reinforcing portion 24, but because the wafer 4 and the tape 96 are pressed together with the interior of the upper chamber 160 and the lower chamber 162 held in a vacuum, the pressure in the small gap between the wafer 4 and the tape 96 is lower than atmospheric pressure, and when the air vent portion 168 is opened after the tape 96 has been pressed together, the atmospheric pressure presses the tape 96 against the wafer 4. This eliminates the gap between the wafer 4 and the tape 96 at the base of the ring-shaped reinforcing portion 24, and the tape 96 comes into close contact with the back surface 4b of the wafer 4 along the base of the ring-shaped reinforcing portion 24.

[0060] As shown in Figures 1 and 11, the processing apparatus 2 further includes a frame unit carrying-out means 192 that carries out from the wafer table 12 the frame unit U in which the tape 96 of the tape-attached frame 64' and the back surface 4b of the wafer 4 have been pressed together by the tape pressing means 102; a reinforcement portion removing means 194 that cuts and removes the ring-shaped reinforcing portion 24 from the wafer 4 of the frame unit U carried out by the frame unit carrying-out means 192; a ring-less unit carrying-out means 196 (see Figure 1) that carries out from the reinforcement portion removing means 194 the ring-less unit from which the ring-shaped reinforcing portion 24 has been removed; and a frame cassette table 200 (see Figure 1) on which a frame cassette 198 containing the ring-less unit carried out by the ring-less unit carrying-out means 196 is placed.

[0061] As shown in FIG. 11, the frame unit carrying-out means 192 of the illustrated embodiment includes a frame unit holding section 202 including a wafer holding section 202a that holds the wafer 4 and a frame holding section 202b that holds the frame 64, and a transport section 206 that transports the frame unit holding section 202 to the temporary placement table 204.

[0062] The wafer holding portion 202a of the frame unit holding portion 202 includes a circular substrate 208 and a circular suction piece 210 attached to the underside of the substrate 208. A plurality of suction holes (not shown) are formed in the underside of the suction piece 210, and each suction hole is connected to suction means (not shown). The frame holding portion 202b includes a plurality of (four in the illustrated embodiment) protruding pieces 212 that protrude radially outward from the periphery of the substrate 208 of the wafer holding portion 202a at intervals in the circumferential direction, and suction pads 214 attached to the undersides of the protruding pieces 212, and each suction pad 214 is connected to suction means (not shown).

[0063] The transport unit 206 includes an X-axis guide member 216 fixed to an appropriate bracket (not shown) and extending in the X-axis direction, an X-axis movable member 218 supported by the X-axis guide member 216 so as to be movable in the X-axis direction, an X-axis feed mechanism (not shown) for moving the X-axis movable member 218 in the X-axis direction, a Z-axis movable member 220 supported by the X-axis movable member 218 so as to be movable in the Z-axis direction, a Z-axis feed mechanism (not shown) for moving the Z-axis movable member 220 in the Z-axis direction, a Y-axis movable member 222 supported by the Z-axis movable member 220 so as to be movable in the Y-axis direction, and a Y-axis feed mechanism (not shown) for moving the Y-axis movable member 222 in the Y-axis direction. The base plate 208 of the wafer holder 202a is connected to the tip of the Y-axis movable member 222. Each of the X-axis, Y-axis, and Z-axis feed mechanisms of the transport unit 206 may include a ball screw and a motor for rotating the ball screw.

[0064] The frame unit carry-out means 192 preferably includes a two-dimensional movement mechanism that moves the frame unit holding part 202 two-dimensionally in the horizontal direction. In the illustrated embodiment, the frame unit holding part 202 moves two-dimensionally in the horizontal direction on the XY plane by the X-axis feed means and Y-axis feed means of the transport part 206, and the two-dimensional movement mechanism is configured by the transport part 206.

[0065] 11 and 12, the frame unit carry-out means 192 is disposed between the wafer table 12 and the temporary placement table 204 and includes an upper camera 223 that captures an image of the back surface 4b of the wafer 4 from above the frame unit U via the tape 96, and a lower camera 224 that is disposed opposite the upper camera 223 so as to sandwich the frame unit U therebetween and captures an image of the front surface 4a corresponding to the ring-shaped reinforcing portion 24 of the wafer 4. The lower camera 224 is positioned directly below the upper camera 223.

[0066] Then, in the frame unit carrying-out means 192, the wafer 4 is held by suction from the back surface 4b side (tape 96 side) by the suction piece 210 of the wafer holding portion 202a, and the frame 64 is held by suction from the suction pad 214 of the frame holding portion 202b. In this state, the transport portion 206 is operated to carry out the frame unit U held by the frame unit holding portion 202 from the wafer table 12.

[0067] Furthermore, the frame unit carry-out means 192 of the illustrated embodiment operates the transport unit 206 constituting the two-dimensional movement mechanism, and images the back surface 4b of the wafer 4 via the tape 96 from above the frame unit U held by the frame unit holding unit 202 using the upper camera 223. Specifically, images of at least three points on the inner circumferential circle of the ring-shaped reinforcing portion 24 are captured by the upper camera 223. This makes it possible to measure the coordinates of at least three points on the inner circumferential circle of the ring-shaped reinforcing portion 24, and to determine the coordinates of the center of the inner circumferential circle of the ring-shaped reinforcing portion 24 formed on the back surface 4b of the wafer 4 based on the coordinates of the three measured points.

[0068] Furthermore, in the frame unit unloading means 192, the transport part 206 is operated to have the lower camera 224 take an image of the surface 4a corresponding to the ring-shaped reinforcing part 24 from below the frame unit U. This makes it possible to inspect whether or not there are any devices 14 in the area (the inner circumference of the ring-shaped reinforcing part 24) where the wafer 4 is cut to remove the ring-shaped reinforcing part 24.

[0069] Then, as shown in Figure 13(a), if there are no devices 14 in the area where the wafer 4 is cut to remove the ring-shaped reinforcement portion 24, the frame unit carrying-out means 192 activates the transport section 206 that constitutes the two-dimensional movement mechanism, aligns the center of the inner circumference of the ring-shaped reinforcement portion 24 with the center of the temporary placement table 204, and temporarily places the frame unit U on the temporary placement table 204.

[0070] On the other hand, for frame units U in which devices 14 exist in the region where the wafer 4 is cut to remove the ring-shaped reinforcing portions 24, processing by the processing device 2 is suspended. For example, as shown in Figure 13(b), if the ring-shaped reinforcing portions 24 and the devices 14 overlap, a grinding device (not shown) is used to grind the ring-shaped reinforcing portions 24 so that the ring-shaped reinforcing portions 24 and the devices 14 do not overlap, thereby narrowing the width of the ring-shaped reinforcing portions 24. This makes it possible to prevent the devices 14 from being cut when the wafer 4 is cut to remove the ring-shaped reinforcing portions 24.

[0071] Furthermore, the processing device 2 is configured to suspend processing when it detects an area where the ring-shaped reinforcement 24 and the tape 96 are not in close contact, based on an image captured by the upper camera 223 along the ring-shaped reinforcement 24. For example, as shown in FIG. 13(c), processing by the processing device 2 is suspended for a frame unit U where a gap V exists between the ring-shaped reinforcement 24 and the tape 96. This makes it possible to prevent defects from occurring in the devices 14 when the wafer 4 is diced into device chips for each device 14 in a later process.

[0072] 11 , the temporary placement table 204 is disposed at a distance in the X-axis direction from the wafer table 12. The temporary placement table 204 in the illustrated embodiment includes an annular support part 226 that supports the outer peripheral surplus region 20 of the wafer 4 of the frame unit U and keeps the portion inside the outer peripheral surplus region 20 out of contact, and a frame support part 228 that is disposed on the outer periphery of the annular support part 226 and supports the frame 64.

[0073] The radially inner portion of the annular support portion 226 forms a downwardly recessed circular depression 230. The frame support portion 228 of the temporary placement table 204 is preferably equipped with a heater (not shown), and the tape 96 of the frame unit U temporarily placed on the temporary placement table 204 is heated by the heater to soften the tape 96, thereby allowing the tape 96 to adhere more closely to the base of the ring-shaped reinforcing portion 24 under atmospheric pressure.

[0074] The processing apparatus 2 in the illustrated embodiment includes a temporary placement table transport unit 232 that transports the temporary placement table 204 in the Y-axis direction. The temporary placement table transport unit 232 includes a Y-axis guide member 234 extending in the Y-axis direction, a Y-axis movable member 236 supported by the Y-axis guide member 234 so as to be movable in the Y-axis direction, and a Y-axis feed unit 238 that moves the Y-axis movable member 236 in the Y-axis direction. The temporary placement table 204 is fixed to an upper portion of the Y-axis movable member 236. The Y-axis feed unit 238 includes a ball screw 240 that is connected to the Y-axis movable member 236 and extends in the Y-axis direction, and a motor 242 that rotates the ball screw 240. The temporary placement table transport unit 232 converts the rotational motion of the motor 242 into linear motion using the ball screw 240 and transmits the linear motion to the Y-axis movable member 236, thereby transporting the temporary placement table 204 together with the Y-axis movable member 236 in the Y-axis direction.

[0075] As shown in Figures 1 and 11, the reinforcing portion removal means 194 includes a laser beam application means 244 that applies a laser beam toward the base of the ring-shaped reinforcing portion 24 formed on the outer periphery of the wafer 4 to form a cutting groove, a first lifting table 246 (see Figure 1) that holds and lifts the frame unit U temporarily placed on the temporary placement table 204 and moves it in the X-axis direction to position it on the laser beam application means 244, and a separation unit 248 that separates the ring-shaped reinforcing portion 24 from the cutting groove.

[0076] As shown in FIG. 11, the laser beam application means 244 includes a housing 250 arranged adjacent to the temporary placement table 204 in the X-axis direction, an oscillator (not shown) housed in the housing 250 and emitting a laser beam, a condenser 252 that focuses the laser beam emitted by the oscillator and applies it to the base of the ring-shaped reinforcing portion 24 formed on the outer periphery of the wafer 4, a suction nozzle 254 that sucks up debris generated when the wafer 4 is irradiated with the laser beam, and a suction means (not shown) connected to the suction nozzle 254.

[0077] Collector 252 extends upward from the top surface of housing 250 at an incline toward suction nozzle 254, thereby preventing debris generated during irradiation with the laser beam from falling onto collector 252. In addition, suction nozzle 254 extends upward from the top surface of housing 250 at an incline toward collector 252.

[0078] 14, the laser beam application means 244 rotates the frame unit U held by the first lift table 246, while applying a laser beam LB toward the base of the ring-shaped reinforcing portion 24 formed on the outer periphery of the wafer 4, thereby forming a ring-shaped cutting groove 256 along the base of the ring-shaped reinforcing portion 24 by ablation processing. In addition, the laser beam application means 244 uses a suction nozzle 254 to suck up debris generated by the ablation processing.

[0079] 1, first lift table 246 is disposed above temporary placement table 204 so as to be movable in the X-axis direction and the Z-axis direction. Referring to FIG. 15, first lift table 246 includes an X-axis guide member 258 fixed to an appropriate bracket (not shown) and extending in the X-axis direction, an X-axis movable member 260 supported by X-axis guide member 258 so as to be movable in the X-axis direction, an X-axis feed mechanism (not shown) for moving X-axis movable member 260 in the X-axis direction, a Z-axis movable member 262 supported by X-axis movable member 260 so as to be movable in the Z-axis direction, and a Z-axis feed mechanism (not shown) for moving Z-axis movable member 262 in the Z-axis direction. Each of the X-axis and Z-axis feed mechanisms of first lift table 246 may include a ball screw and a motor for rotating the ball screw.

[0080] A support shaft 264 extending downward is rotatably supported on the lower surface of the tip of Z-axis movable member 262, and a motor 266 that rotates support shaft 264 around an axis extending in the Z-axis direction is attached to the upper surface of the tip of Z-axis movable member 262. A circular suction piece 268 is fixed to the lower end of support shaft 264. A plurality of suction holes (not shown) are formed on the lower surface of suction piece 268 at intervals in the circumferential direction on a circumference corresponding to the size of frame 64, and each suction hole is connected to suction means.

[0081] The first lifting table 246 uses the suction piece 268 to suction and hold the frame 64 portion of the frame unit U where the tape 96 is heated by the heater of the frame support portion 228 of the temporary placement table 204 and where the tape 96 is in close contact with the base of the ring-shaped reinforcing portion 24, and then moves the Z-axis movable member 262 and the X-axis movable member 260 to lift the frame unit U suction-held by the suction piece 268 and move it in the X-axis direction to position it at the laser beam application means 244. Note that if the frame 64 is made of a magnetic material, an electromagnet (not shown) may be attached to the underside of the suction piece 268 so that the suction piece 268 attracts the frame 64 by magnetic force.

[0082] Furthermore, when the laser beam LB is irradiated onto the wafer 4 by the laser beam application means 244, the first lifting table 246 operates the motor 266 to rotate the frame unit U sucked and held by the suction piece 268. Furthermore, the first lifting table 246 moves the frame unit U, in which the cutting groove 256 is formed at the base of the ring-shaped reinforcing portion 24, in the X-axis direction and the Z-axis direction, and temporarily places it on the temporary placement table 204.

[0083] 1, the separating unit 248 is disposed at a distance in the Y-axis direction from the first lifting table 246 within the movable range of the temporary placement table 204 in the Y-axis direction. Explaining with reference to FIGS. 16 and 17, the separating unit 248 includes an ultraviolet irradiating unit 270 (see FIG. 16) that irradiates ultraviolet light onto the tape 96 corresponding to the cutting grooves 256 to reduce the adhesive strength of the tape 96, a second lifting table 272 (see FIG. 16) that exposes the ring-shaped reinforcing portions 24 to the outer periphery and holds the inside of the wafer 4 by suction, a separator 274 (see FIG. 16) that applies a wedge-equipped block 402 to the outer periphery of the ring-shaped reinforcing portions 24 to separate the ring-shaped reinforcing portions 24, and a discarding unit 276 (see FIG. 17) that discards the separated ring-shaped reinforcing portions 24.

[0084] 16, separation unit 248 in the illustrated embodiment includes a Z-axis guide member 278 fixed to an appropriate bracket (not shown) and extending in the Z-axis direction, a Z-axis movable member 280 supported by Z-axis guide member 278 so as to be movable in the Z-axis direction, and an elevating means (not shown) for moving Z-axis movable member 280 in the Z-axis direction. The elevating means may be configured to include a ball screw connected to Z-axis movable member 280 and extending in the Z-axis direction, and a motor for rotating this ball screw.

[0085] A support piece 282 is supported on the lower surface of the tip of Z-axis movable member 280, and second lift-up table 272 is rotatably supported on it. A motor 284 that rotates second lift-up table 272 is attached to the upper surface of the tip of Z-axis movable member 280. In the illustrated embodiment, a pair of the ultraviolet ray irradiation units 270 are attached to support piece 282 at an interval in the Y-axis direction.

[0086] The second lifting table 272 has a support shaft 286 extending downward from the lower surface of the tip of the Z-axis movable member 280, and a circular table head 287 detachably attached to the lower end of the support shaft 286. A plurality of suction holes (not shown) are formed in the lower surface of the table head 287, and each suction hole is connected to a suction means.

[0087] The separator 274 is also attached to the support piece 282. The separator 274 includes a pair of movable pieces 288 arranged on the lower surface of the support piece 282 at a distance from each other so as to be movable in the longitudinal direction of the support piece 282, a pair of feed means 290 for moving the pair of movable pieces 288, a pair of support substrates 400 supported on each movable piece 288 so as to be movable up and down, and a pair of Z-axis feed means 294 for raising and lowering the pair of support substrates 400 in the Z-axis direction. Each of the pair of feed means 290 and the Z-axis feed means 294 can be formed from an appropriate actuator such as an air cylinder or an electric cylinder.

[0088] Continuing the explanation with reference to Figure 16, the upper surface of each support substrate 400 is equipped with a wedge-equipped top 402, a frame support portion 404 that supports the frame 64, and an ionizer 406 that removes static electricity from the frame unit U.

[0089] The top 402 has an inverted truncated cone shape with a diameter that gradually decreases from top to bottom, and a wedge is formed by the top surface 402a and the side surface 402b of the top 402. A pair of tops 402 are arranged at a distance from each other on the top surface of each support substrate 400, and are supported by the support substrate 400 so as to be rotatable about an axis extending in the Z-axis direction.

[0090] A pair of frame support parts 404 are arranged on the upper surface of the support substrate 400 adjacent to the tops 402. The frame support parts 404 have a housing 404a fixed to the support substrate 400 and spheres 404b rotatably supported by the housing 404a. In the frame support parts 404, the spheres 404b support the frame 64.

[0091] The ionizer 406 is disposed adjacent to the top 402. The ionizer 406 blows ionized air toward the frame unit U to remove static electricity from the frame unit U.

[0092] 17, the disposal section 276 includes a belt conveyor 300 that transports the separated ring-shaped reinforcement parts 24, and a dust box 302 that stores the ring-shaped reinforcement parts 24 transported by the belt conveyor 300. The belt conveyor 300 is positioned by an appropriate actuator (not shown) at a collection position (position shown by a solid line in FIG. 17) that extends substantially horizontally, and at a standby position (position shown by a two-dot chain line in FIG. 17) that extends substantially vertically.

[0093] 17, a door 304 with a handle 304a attached is provided on the side surface of the dust box 302 on the front side in the X-axis direction. A crusher (not shown) for crushing the collected ring-shaped reinforcement parts 24 is attached inside the dust box 302. In the dust box 302, by gripping the handle 304a and opening the door 304, crushed pieces of the ring-shaped reinforcement parts 24 stored in the dust box 302 can be taken out.

[0094] When the temporary placement table 204, on which the frame unit U having the cutting groove 256 formed at the base of the ring-shaped reinforcement 24 is temporarily placed, is positioned below the separation unit 248 by the temporary placement table transport unit 232, the separation unit 248 exposes the ring-shaped reinforcement 24 to the outer periphery and suction-holds the inner side of the wafer 4 with the second lift-up table 272, as shown in FIG. 18 . Next, the feed unit 290 moves the movable piece 288, and the Z-axis feed unit 294 moves the support substrate 400, so that the wedge-equipped block 402 acts on the outer periphery of the ring-shaped reinforcement 24, as shown in FIG. 19 . Specifically, the wedge of the block 402 is positioned between the tape 96 and the ring-shaped reinforcement 24. Furthermore, the lower surface of the frame 64 is brought into contact with the sphere 404b of the frame support unit 404, and the sphere 404b supports the frame 64.

[0095] Next, ultraviolet light is irradiated from the pair of ultraviolet irradiation units 270 to reduce the adhesive strength of the tape 96 adhering to the ring-shaped reinforcement portion 24, and the frame unit U is rotated by the motor 284 together with the second lifting table 272 relative to the separator 274. As a result, the tape 96, whose adhesive strength has been reduced, and the ring-shaped reinforcement portion 24 are pulled apart by the wedges of the blocks 402, and as shown in FIG. 20, the ring-shaped reinforcement portion 24 can be separated from the frame unit U. The separated ring-shaped reinforcement portion 24 is transported by the belt conveyor 300 to a dust box 302 and collected. Note that the separator 274 may be rotated relative to the frame unit U when separating the ring-shaped reinforcement portion 24.

[0096] Furthermore, when separating the ring-shaped reinforcement part 24, ionized air is blown from the ionizer 406 toward the frame unit U. As a result, even if static electricity is generated due to the contact of the link 402 with the tape 96 and the ring-shaped reinforcement part 24, the static electricity is removed by the ionized air blown from the ionizer 406. Therefore, the tape 96 and the ring-shaped reinforcement part 24 are not attracted to each other by static electricity, and the ring-shaped reinforcement part 24 is reliably separated from the frame unit U.

[0097] When separating the ring-shaped reinforcement portion 24, the relative rotation between the frame unit U and the separator 274 causes the top 402 acting on the frame unit U to rotate, and also causes the sphere 404b in contact with the underside of the frame 64 to rotate, so that the relative rotation between the frame unit U and the separator 274 is carried out smoothly.

[0098] 1, the ring-free unit carry-out means 196 is disposed adjacent to the reinforcing portion removing means 194. Explaining with reference to FIGS. 21 and 22, the ring-free unit carry-out means 196 in the illustrated embodiment includes an inversion mechanism 308 (see FIG. 21) that faces the ring-free unit supported by the second lift table 272 and has a frame holding part 306 that holds the frame 64, moves toward the frame cassette table 200, and inverts the frame holding part 306, a ring-free unit support part 310 (see FIG. 22) that supports the ring-free unit that has been inverted by the inversion mechanism 308 so that the front surface 4 a of the wafer 4 faces upward, and a pusher part 312 (see FIG. 22) that inserts and accommodates the ring-free unit supported by the ring-free unit support part 310 into the frame cassette 198 placed on the frame cassette table 200.

[0099] 21 , reversing mechanism 308 includes a Y-axis guide member 314 extending in the Y-axis direction, a Y-axis movable member 316 supported by Y-axis guide member 314 so as to be movable in the Y-axis direction, a Y-axis feed means (not shown) for moving Y-axis movable member 316 in the Y-axis direction, an arm 318 supported by Y-axis movable member 316 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving arm 318 in the Z-axis direction. Each of the Y-axis and Z-axis feed means of reversing mechanism 308 may be configured to include a ball screw and a motor for rotating the ball screw.

[0100] The frame holding unit 306 is supported on the arm 318 so as to be capable of being turned upside down, and a motor 320 is attached to turn the frame holding unit 306 upside down. In the illustrated embodiment, the frame holding unit 306 includes a substrate 324 rotatably supported on the arm 318 via a pair of rotation shafts 322, and a plurality of suction pads 326 attached to one side of the substrate 324, with each suction pad 326 connected to suction means (not shown). One of the rotation shafts 322 is connected to the motor 320.

[0101] With the suction pads 326 facing upward, the inversion mechanism 308 sucks and holds the lower surface of the frame 64 of the ring-free unit U' supported by the second lift table 272 with the suction pads 326, and receives the ring-free unit U' from the second lift table 272. The inversion mechanism 308 also inverts the frame holding part 306 with the motor 320 so that the front surface 4a of the wafer 4 faces upward, and then moves the Y-axis movable member 316 to move the ring-free unit U' held by the frame holding part 306 toward the frame cassette table 200.

[0102] 22, the ring-less unit support section 310 of the illustrated embodiment includes a pair of support plates 328 supported via suitable brackets (not shown) so as to be movable in the X-axis direction, and a gap adjustment means (not shown) for adjusting the gap in the X-axis direction between the pair of support plates 328. The gap adjustment means may be constituted by a suitable actuator such as an air cylinder or an electric cylinder.

[0103] Heaters (not shown) are attached to the pair of support plates 328 that support the ring-less unit U'. When the gap between the pair of support plates 328 is narrowed, the pair of support plates 328 heats the tape 96 of the ring-less unit U' with the heater, thereby smoothing out any sagging or wrinkles in the tape 96 that have occurred due to the removal of the ring-shaped reinforcing portion 24.

[0104] 22 , pushing unit 312 in the illustrated embodiment includes a Y-axis guide member 330 extending in the Y-axis direction, a Y-axis movable member 332 supported by Y-axis guide member 330 so as to be movable in the Y-axis direction, and a Y-axis feed means (not shown) for moving Y-axis movable member 332 in the Y-axis direction. Y-axis movable member 332 has a base 334 supported by Y-axis guide member 330, a support column 336 extending upward from the top surface of base 334, and a pressing piece 338 attached to the upper end of support column 336. The Y-axis feed means of pushing unit 312 may include a ball screw connected to Y-axis movable member 332 and extending in the Y-axis direction, and a motor for rotating the ball screw.

[0105] 23 , before receiving the ring-free unit U′, the ring-free unit supporting section 310 widens the gap between the pair of support plates 328 using a gap adjusting means, and then receives the ring-free unit U′ held by the suction pad 326. Then, when the ring-free unit supporting section 310 receives the ring-free unit U′, the pushing section 312 moves the Y-axis movable member 332 in the Y-axis direction using the Y-axis feed means, thereby causing the ring-free unit U′ supported by the ring-free unit supporting section 310 to enter the frame cassette 198 placed on the frame cassette table 200 with the pressing piece 338 and accommodate it therein.

[0106] 1 and 23 accommodates a plurality of ring-less units U' spaced apart in the vertical direction with the surfaces 4a of the wafers 4 facing upward. As shown in FIGS. 22 and 23, the frame cassette table 200 includes a mounting section 340 on which the frame cassette 198 is placed, and an elevator section 342 that raises and lowers the mounting section 340 to position it at a desired height. The elevator section 342 may include a ball screw that is connected to the mounting section 340 and extends in the Z-axis direction, and a motor that rotates the ball screw.

[0107] Next, an embodiment of the processing method of the present invention will be described. In the illustrated embodiment, the processing method will be described using the processing device 2 as described above, but the processing method of the present invention is not limited to using the processing device 2.

[0108] In the illustrated embodiment, a wafer preparation step is first performed to prepare a wafer having a convex ring-shaped reinforcing portion formed on the back surface corresponding to the peripheral excess region. The wafer prepared in the wafer preparation step may be the wafer 4 described above (see FIG. 2), and it is preferable to prepare a plurality of wafers 4. After the plurality of wafers 4 are prepared, the plurality of wafers 4 are placed in a wafer cassette 6 with the front surface 4a of each wafer 4 facing upward and spaced apart in the vertical direction (see FIGS. 1 and 3). Then, the wafer cassette 6 containing the wafers 4 is placed on a wafer cassette table 8.

[0109] Also, a frame preparation step is carried out to prepare a ring-shaped frame having an opening for accommodating a wafer. The frame prepared in the frame preparation step may be the frame 64 (see FIG. 5), and it is preferable to prepare a plurality of frames 64. The frame preparation step may be carried out before or after the wafer preparation step.

[0110] Once multiple frames 64 have been prepared, the lifting plate 74 of the frame storage means 66 is lowered to a desired position, and then the handle 76a is grasped to open the door 76, and multiple frames 64 are stacked and stored on the upper surface of the lifting plate 74. The height of the lifting plate 74 is then adjusted appropriately, and the uppermost frame 64 is positioned so that it can be carried out by the frame carrying-out means 68.

[0111] After the wafer preparation step and the frame preparation step are performed, a frame unit creation step is performed in which tape 96 is attached to the frame 64 and the back surface 4b of the wafer 4 to create a frame unit U. In the frame unit creation step, first, a wafer unloading step is performed in which the wafer 4 is unloaded from the wafer cassette 6 placed on the wafer cassette table 8.

[0112] Explaining with reference to Figure 3, in the wafer unloading step, first, the Y-axis feed means 34 of the wafer unloading means 10 is operated to position the Y-axis movable member 32 near the wafer cassette table 8. Next, the transfer arm 42 is driven to position the hand 44, with the air outlet 46 facing upward, on the back surface 4b side (lower side) of the wafer 4 in the wafer cassette 6. When the hand 44 is positioned on the back surface 4b side of the wafer 4, a gap is provided between the back surface 4b of the wafer 4 and the hand 44, and each guide pin 48 is positioned radially outward.

[0113] Next, compressed air is ejected from the air ejection ports 46 of the hand 44 to generate a negative pressure on one side of the hand 44 by the Bernoulli effect, and the hand 44 suction-supports the wafer 4 from the back surface 4b side without contact. Next, each guide pin 48 is moved radially inward, and the horizontal movement of the wafer 4 suction-supported by the hand 44 is restricted by each guide pin 48. Then, the Y-axis movable member 32 and the transfer arm 42 of the wafer unloading means 10 are moved, and the wafer 4 suction-supported by the hand 44 is unloaded from the wafer cassette 6.

[0114] After the wafer carrying-out step is performed, it is preferable to perform a notch detection step of detecting the position of the notch 26 in the wafer 4. In the notch detection step, as shown in Fig. 4, the outer periphery of the wafer 4 supported by suction with the hand 44 is positioned between the light-emitting element 52 and the light-receiving element 54 of the notch detection means 50. Next, the wafer 4 is rotated by the drive source via the guide pin 48, thereby detecting the position of the notch 26 in the wafer 4. This makes it possible to adjust the orientation of the wafer 4 to any desired orientation.

[0115] After the notch detection step is performed, a wafer supporting step is performed in which the front surface 4 a side of the wafer 4 carried out by the wafer carrying-out means 10 is supported by the wafer table 12 .

[0116] 3, in the wafer supporting step, first, the hand 44 of the wafer unloading means 10 is turned upside down so that the front surface 4a of the wafer 4 faces downward. Next, the Y-axis movable member 32 and the transfer arm 42 of the wafer unloading means 10 are moved so that the peripheral excess region 20 of the front surface 4a of the wafer 4, which is suction-supported by the hand 44, comes into contact with the annular support portion 56 of the wafer table 12. At this time, because the device region 18 on the front surface 4a of the wafer 4 is located in the recess 62 of the wafer table 12, the device 14 does not come into contact with the wafer table 12, and damage to the device 14 is prevented.

[0117] Next, the suction means of the wafer table 12 is activated to generate suction force in each suction hole 60, thereby suction-holding the peripheral excess region 20 of the front surface 4a of the wafer 4. Next, suction support of the wafer 4 by the hand 44 is released, and the hand 44 is moved away from the wafer table 12. In this manner, the wafer 4 is transferred from the wafer transfer means 10 to the wafer table 12. Because the wafer 4 transferred to the wafer table 12 is held by suction by each suction hole 60, the position of the wafer 4 does not shift.

[0118] In the frame unit production process, a frame carrying-out step of carrying out the frame 64 from the frame receiving means 66 is carried out in parallel with the wafer carrying-out step and wafer supporting step.

[0119] Explaining with reference to Figure 5, in the frame carry-out step, first, the X-axis movable member 84 and Z-axis movable member 86 of the frame carry-out means 68 are moved so that the suction pad 92 of the holding unit 88 comes into contact with the upper surface of the top frame 64 housed in the frame housing means 66. Next, the suction means of the frame carry-out means 68 is activated to generate a suction force in the suction pad 92, thereby suction-holding the top frame 64 with the suction pad 92. Then, the X-axis movable member 84 and Z-axis movable member 86 of the frame carry-out means 68 are moved so that the top frame 64, which has been suction-held by the suction pad 92 of the holding unit 88, is carried out of the frame housing means 66.

[0120] After the frame unloading step is performed, a frame supporting step is performed in which the frame 64 unloaded by the frame unloading means 68 is supported by the frame table 70.

[0121] Continuing the explanation with reference to Figure 5, in the frame supporting step, first, the X-axis movable member 84 and Z-axis movable member 86 of the frame carry-out means 68 are moved so that the frame 64, which is suction-held by the suction pad 92, comes into contact with the upper surface of the frame table 70. At this time, the frame table 70 is positioned in the lowered position (the position indicated by the solid line in Figure 5). Next, the suction force of the suction pad 92 of the frame carry-out means 68 is released, and the frame 64 is placed on the frame table 70. Then, the X-axis movable member 84 and Z-axis movable member 86 of the frame carry-out means 68 are moved so that the holder 88 is separated from above the frame table 70.

[0122] After the frame supporting step is performed, a tape applying step is performed in which tape 96 is applied to frame 64 .

[0123] Explaining with reference to Figure 6, in the tape application step, first, before moving the frame table 70 from the lowered position (the position shown in Figure 6(a)) to the raised position (the position shown in Figure 6(b)) where the tape 96 can be applied to the frame 64, the tape 96 is pulled out from the roll tape 96R and the tape 96 from which the release paper 116 has been peeled is positioned above the frame table 70. Note that the adhesive side of the tape 96 positioned above the frame table 70 faces downward.

[0124] Next, the frame table 70 is raised to an extent that the pressure roller 132 of the pressure applying unit 110 of the tape applying means 98 can press the tape 96 from above onto the frame 64. Then, the pressure roller 132 is rolled in the Y-axis direction while pressing the adhesive surface of the tape 96 against the frame 64. This allows the tape 96, which has been pulled out from the roll tape 96R by the tape pull-out unit 108, to be pressure-bonded to the frame 64.

[0125] Next, the cutter 144 and pressure roller 146 of the cutting unit 112 of the tape application means 98 are lowered, pressing the cutter 144 against the tape 96 on the frame 64, and the pressure roller 146 presses the frame 64 from above the tape 96. Next, the motor 138 rotates the arm piece 140, causing the cutter 144 and pressure roller 146 to move in a circular motion along the frame 64. This allows the tape 96 that extends beyond the outer periphery of the frame 64 to be cut along the frame 64. In addition, because the pressure roller 146 presses the frame 64 from above the tape 96, displacement of the frame 64 and the tape 96 while cutting the tape 96 is prevented. The used tape 96 with the circular opening 120 formed therein is taken up by the tape take-up unit 106.

[0126] After the tape application step is performed, the frame 64 with the tape 96 applied thereto is transported to the wafer table 12, and a tape-attached frame transport step is performed in which the opening 64a of the frame 64 is positioned on the back surface 4b of the wafer 4 supported on the wafer table 12 and the tape-attached frame 64' is placed on the wafer table 12.

[0127] In the tape-attached frame transport step, first, the frame table 70 is moved from the raised position to the lowered position. Next, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-attached frame transport means 100 (see FIG. 5) are moved, and each suction pad 158 of the holding part 154 of the tape-attached frame transport means 100 is brought into contact with the upper surface of the tape-attached frame 64' (see FIG. 7) supported on the frame table 70 with the adhesive side of the tape 96 facing downward.

[0128] Next, the suction means of the tape-attached frame transport means 100 is activated to generate suction force in the suction pads 158, thereby suction-holding the upper surface of the tape-attached frame 64' with the suction pads 158. Next, the Y-axis movable member 150 and Z-axis movable member 152 of the tape-attached frame transport means 100 are moved, and the tape-attached frame 64' held by suction with the suction pads 158 is carried out from the frame table 70.

[0129] Next, the tape-attached frame 64' held by suction with the suction pads 158 of the tape-attached frame transport means 100 is transported to the wafer table 12, and as shown in Fig. 7, the opening 64a of the frame 64 is positioned over the back surface 4b of the wafer 4 supported on the wafer table 12, and the tape-attached frame 64' is brought into contact with the frame support portion 58 of the wafer table 12. At this time, the adhesive surface of the tape 96 of the tape-attached frame 64' faces downward, and the back surface 4b of the wafer 4 faces upward, facing the adhesive surface of the tape 96.

[0130] Next, the suction force of the suction pad 158 of the tape-attached frame transport means 100 is released, and the tape-attached frame 64' is placed on the frame support part 58 of the wafer table 12. Then, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-attached frame transport means 100 are moved, and the holding part 154 is moved away from above the wafer table 12.

[0131] After the tape-attached frame transport step is performed, a tape pressing step is performed in which the tape 96 of the tape-attached frame 64' is pressed onto the back surface 4b of the wafer 4.

[0132] 7 to 9, in the tape pressing step, first, the upper chamber 160 is lowered by the lifting mechanism 164 of the tape pressing means 102, and the lower end of the side wall 172 of the upper chamber 160 is brought into contact with the upper end of the side wall 186 of the lower chamber 162. This closes the upper chamber 160 and the lower chamber 162, and brings the pressure roller 174 into contact with the tape-attached frame 64'. Then, as shown in FIG. 8, the upper end of the ring-shaped reinforcing portion 24 of the wafer 4 is stuck to the adhesive surface of the tape 96 of the tape-attached frame 64'.

[0133] Next, with the atmosphere vent portion 168 of the tape pressing means 102 closed, the vacuum portion 166 is operated to evacuate the interior of the upper chamber 160 and the lower chamber 162. Next, as shown in FIGS. 8 and 9, the pressure roller 174 of the tape pressing means 102 is rolled in the Y-axis direction to press the tape 96 onto the back surface 4b of the wafer 4. This allows a frame unit U (see FIG. 10) to be produced in which the back surface 4b of the wafer 4 and the tape 96 are pressed together. Next, the atmosphere vent portion 168 is opened, and atmospheric pressure causes the tape 96 to adhere tightly to the back surface 4b of the wafer 4 along the base of the ring-shaped reinforcing portion 24. Then, the upper chamber 160 is raised by the lifting mechanism 164. In this manner, the frame unit production process, which includes the wafer carry-out step through the tape pressing step, is carried out.

[0134] Although the suction force of the wafer table 12 on the wafer 4 is lost by creating a vacuum inside the upper chamber 160 and the lower chamber 162, when the upper chamber 160 and the lower chamber 162 are closed, the upper end of the ring-shaped reinforcing portion 24 of the wafer 4 adheres to the adhesive surface of the tape 96 of the tape-attached frame 64', so the position of the wafer 4 does not shift during the tape pressing step.

[0135] After the frame unit generating step is performed, a center setting step is performed in which the ring-shaped reinforcing portion 24 is imaged and the center of the inner circumference of the ring-shaped reinforcing portion 24 is set. In the center setting step, first, a frame unit carrying-out step is performed in which the frame unit U in which the tape 96 of the tape-attached frame 64′ and the back surface 4b of the wafer 4 are pressure-bonded is carried out from the wafer table 12.

[0136] Referring to Figure 5, in the frame unit carrying-out step, first, the transport section 206 of the frame unit carrying-out means 192 is operated to bring the lower surface of the suction piece 210 of the wafer holding section 202a of the frame unit holding section 202 into contact with the tape 96 on the back surface 4b side of the wafer 4, and also bring the suction pad 214 of the frame holding section 202b into contact with the frame 64.

[0137] Next, suction force is generated in the suction pieces 210 of the wafer holder 202a and the suction pads 214 of the frame holder 202b, and with the ring-shaped reinforcing portion 24 exposed on the outer periphery, the suction pieces 210 of the wafer holder 202a suction-hold the inside of the wafer 4 from the back surface 4b side (tape 96 side), and the suction pads 214 of the frame holder 202b suction-hold the frame 64. Next, the suction-holding of the wafer 4 by the wafer table 12 is released. Then, the transport unit 206 is operated to carry out the frame unit U held by the frame unit holder 202 from the wafer table 12.

[0138] After the frame unit carrying-out step is performed, a center detecting step is performed to detect the center of the inner circumferential circle of the ring-shaped reinforcing portion 24.

[0139] Explaining with reference to Figures 11 and 12, in the center detection step, first, the frame unit U held by the frame unit holding unit 202 is positioned between the upper camera 223 and the lower camera 224. Next, the transport unit 206 constituting the two-dimensional movement mechanism of the frame unit carry-out means 192 is operated, and at least three points on the inner circumferential circle of the ring-shaped reinforcement part 24 are captured by the upper camera 223 from above the frame unit U held by the frame unit holding unit 202. This measures the coordinates of at least three points on the inner circumferential circle of the ring-shaped reinforcement part 24. Next, the center coordinates of the inner circumferential circle of the ring-shaped reinforcement part 24 are detected based on the measured coordinates of the three points. The detected center coordinates are then set as the center of the inner circumferential circle of the ring-shaped reinforcement part 24.

[0140] When the frame unit U is positioned between the upper camera 223 and the lower camera 224, it is desirable to operate the transport unit 206 and have the lower camera 224 capture an image of the surface 4a corresponding to the ring-shaped reinforcing portion 24 from below the frame unit U. This makes it possible to inspect whether or not there are any devices 14 in the region (the inner circumference of the ring-shaped reinforcing portion 24) where the wafer 4 is cut to remove the ring-shaped reinforcing portion 24.

[0141] For frame units U in which devices 14 exist in the region where the wafer 4 is cut to remove the ring-shaped reinforcing portions 24, processing by the processing device 2 is suspended. For example, as shown in FIG. 13(b), if the ring-shaped reinforcing portions 24 and the devices 14 overlap, a grinding device (not shown) is used to grind the ring-shaped reinforcing portions 24 so that the ring-shaped reinforcing portions 24 and the devices 14 do not overlap, thereby narrowing the width of the ring-shaped reinforcing portions 24. This makes it possible to prevent the devices 14 from being cut when the wafer 4 is cut to remove the ring-shaped reinforcing portions 24.

[0142] Furthermore, when the frame unit U is positioned between the upper camera 223 and the lower camera 224, it is preferable to image the back surface 4b side of the wafer 4 along the ring-shaped reinforcing portion 24 with the upper camera 223. Then, if an area where the ring-shaped reinforcing portion 24 and the tape 96 are not in close contact is detected, processing is interrupted. For example, as shown in FIG. 13(c), processing by the processing device 2 is interrupted for a frame unit U where a gap V exists between the ring-shaped reinforcing portion 24 and the tape 96. This makes it possible to prevent defects from occurring in the devices 14 when the wafer 4 is diced into device chips for each device 14 in a later process.

[0143] Then, if there are no devices 14 in the area where the wafer 4 is cut to remove the ring-shaped reinforcement portion 24 (see Figure 13(a)), and no area is detected where the ring-shaped reinforcement portion 24 and the tape 96 are not in close contact, the transport unit 206 constituting the two-dimensional movement mechanism is activated, the center of the inner circumference of the ring-shaped reinforcement portion 24 is aligned with the center of the temporary placement table 204, and a temporary placement process is performed in which the frame unit U is temporarily placed on the temporary placement table 204.

[0144] In the temporary placement step, first, the transport unit 206 is operated to position the center of the inner circumference of the ring-shaped reinforcing portion 24 at the center of the annular support portion 226 of the temporary placement table 204, and the outer peripheral excess region 20 of the front surface 4a of the wafer 4 is brought into contact with the upper surface of the annular support portion 226 of the temporary placement table 204, and the lower surface of the frame 64 is brought into contact with the upper surface of the frame support portion 228 of the temporary placement table 204. At this time, although the front surface 4a of the wafer 4 faces downward, the device region 18 is located in the recess 230 of the temporary placement table 204, so that the device 14 does not come into contact with the temporary placement table 204, and damage to the device 14 is prevented.

[0145] Then, the suction hold of the wafer 4 by the wafer holder 202a is released, and the suction hold of the frame 64 by the frame holder 202b is released, and the frame unit U is transferred from the frame unit carry-out means 192 to the temporary placement table 204. In this manner, the temporary placement step is carried out.

[0146] In the temporary placement step, after the frame unit U is transferred from the frame unit carry-out means 192 to the temporary placement table 204, it is preferable to operate the heater of the frame support portion 228 and heat the tape 96 of the frame unit U temporarily placed on the temporary placement table 204 with the heater. This softens the tape 96, allowing the tape 96 to be tightly attached to the base of the ring-shaped reinforcing portion 24 of the wafer 4.

[0147] After the temporary placement step, the frame unit U is rotated based on the center of the inner circumference of the ring-shaped reinforcing portion 24, and a cutting step is performed in which the wafer 4 is cut along the inner circumference of the ring-shaped reinforcing portion 24.

[0148] Referring to Figures 1, 11 and 15, in the cutting process, first, the X-axis movable member 260 and the Z-axis movable member 262 of the first lifting table 246 of the reinforcing part removal means 194 are moved so that the lower surface of the suction piece 268 comes into contact with the upper surface of the frame 64 of the frame unit U temporarily placed on the temporary placement table 204.

[0149] The position of the suction piece 268 when it is brought into contact with the frame 64 is set in advance to a position where the center of rotation of the suction piece 268 coincides with the center of the temporary placement table 204. As described above, in the temporary placement step, the frame unit U is temporarily placed on the temporary placement table 204 with the center of the inner circumference of the ring-shaped reinforcement part 24 coincided with the center of the temporary placement table 204, so when the suction piece 268 is brought into contact with the frame 64, the center of rotation of the suction piece 268 coincides with the center of the inner circumference of the ring-shaped reinforcement part 24.

[0150] Next, suction force is generated in each suction hole of the suction pieces 268 of the first lifting table 246, and the frame 64 portion of the frame unit U is suction-held. Next, the X-axis movable member 260 and Z-axis movable member 262 of the first lifting table 246 are operated, and the frame unit U suction-held by the suction pieces 268 is positioned above the laser beam application means 244. Next, the focal point of the laser beam LB is positioned on the inner circumferential circle of the ring-shaped reinforcing portion 24 of the wafer 4 of the frame unit U.

[0151] 14 , while the suction piece 268 is rotated by the motor 266 of the first lift table 246, that is, while the frame unit U is rotated based on the center of the inner circumferential circle of the ring-shaped reinforcing portion 24, a laser beam LB is irradiated onto the inner circumferential circle of the ring-shaped reinforcing portion 24 of the wafer 4. This allows ablation processing to be performed on the inner circumferential circle of the ring-shaped reinforcing portion 24 of the wafer 4, forming a ring-shaped cutting groove 256, and therefore the wafer 4 can be cut along the inner circumferential circle of the ring-shaped reinforcing portion 24. Furthermore, when the laser beam LB is irradiated onto the wafer 4, the suction means of the laser beam application means 244 is operated to generate a suction force in the suction nozzle 254, and debris generated by the ablation processing is sucked by the suction nozzle 254.

[0152] The cutting step may be performed using a dicing device (not shown) separate from the processing device 2. Specifically, the frame unit U may be rotated based on the center of the inner circumferential circle of the ring-shaped reinforcing portion 24 while a cutting blade is cut into the inner circumferential circle of the ring-shaped reinforcing portion 24, thereby forming a cutting groove along the inner circumferential circle of the ring-shaped reinforcing portion 24 and cutting the wafer 4.

[0153] After the cutting step is performed, a reinforcement part removing step is performed to remove the ring-shaped reinforcement part 24 cut off from the frame unit U. In the reinforcement part removing step, first, the X-axis movable member 260 and the Z-axis movable member 262 of the first lift-up table 246 are moved so that the peripheral excess region 20 of the front surface 4a of the wafer 4 of the frame unit U, which is suction-held by the suction pieces 268, comes into contact with the upper surface of the annular support part 226 of the temporary placement table 204, and the lower surface of the frame 64 comes into contact with the upper surface of the frame support part 228 of the temporary placement table 204. Next, the suction force of the suction pieces 268 of the first lift-up table 246 is released, and the frame unit U is transferred from the first lift-up table 246 to the temporary placement table 204.

[0154] Next, the temporary placement table 204 that has received the frame unit U is positioned below the separation section 248 of the reinforcement removing means 194 by the temporary placement table transport section 232 (see FIG. 11). At this time, the belt conveyor 300 of the disposal section 276 is positioned at the standby position. Next, the second lifting table 272 of the separation section 248 is lowered so that the underside of the second lifting table 272 comes into contact with the tape 96 on the back surface 4b of the wafer 4. Next, a suction force is generated on the underside of the second lifting table 272, and as shown in FIG. 18, the inner side of the wafer 4 in the frame unit U is suction-held by the table head 287 of the second lifting table 272 with the ring-shaped reinforcement 24 exposed on the outer periphery.

[0155] Next, the second lift table 272, which holds the wafer 4 of the frame unit U by suction, is raised to separate the frame unit U from the temporary placement table 204, and the temporary placement table 204 is moved below the first lift table 246. Next, the movable piece 288 is moved by the feeding means 290, and the support substrate 400 is moved by the Z-axis feeding means 294, so that the wedged piece 402 acts on the outer periphery of the ring-shaped reinforcing part 24, as shown in Figure 19, and the wedge of the piece 402 is positioned between the tape 96 and the ring-shaped reinforcing part 24, and the spheres 404b of the frame support part 404 support the frame 64. Also, the belt conveyor 300 of the disposal part 276 is moved from the standby position to the recovery position.

[0156] Next, ultraviolet light is irradiated from the pair of ultraviolet irradiation units 270 to reduce the adhesive force of the tape 96 attached to the ring-shaped reinforcement portion 24, and the frame unit U, together with the second lifting table 272, is rotated by the motor 284 relative to the separator 274. Ionized air is also blown toward the frame unit U from the ionizer 406. As a result, as shown in FIG. 20 , the ring-shaped reinforcement portion 24 can be separated from the frame unit U, and static electricity generated during separation of the ring-shaped reinforcement portion 24 does not remain in the frame unit U. The ring-shaped reinforcement portion 24 that has fallen from the frame unit U is transported to the dust box 302 by the belt conveyor 300 and collected. The separator 274 may be rotated relative to the frame unit U when separating the ring-shaped reinforcement portion 24.

[0157] After the reinforcing portion removing step is performed, a ring-free unit carrying-out step is performed in which the ring-free unit U′ from which the ring-shaped reinforcing portion 24 has been removed is carried out from the reinforcing portion removing means 194 .

[0158] In the ring-free unit carrying-out process, first, the belt conveyor 300 of the disposal section 276 of the reinforcing part removing means 194 is moved from the recovery position to the standby position. Next, the frame holding section 306 of the reversing mechanism 308 (see FIG. 21 ) of the ring-free unit carrying-out means 196 is positioned below the ring-free unit U′ held by suction on the second lift table 272.

[0159] Next, with the suction pad 326 of the frame holding portion 306 facing upward, the arm 318 is raised and the suction pad 326 of the frame holding portion 306 is brought into contact with the underside of the frame 64 of the ring-less unit U', which is supported by the second lift table 272 and has the front surface 4a of the wafer 4 facing downward.

[0160] Next, suction force is generated in the suction pad 326 of the frame holding portion 306, and the frame 64 of the ring-free unit U' is held by suction with the suction pad 326. Next, the suction hold of the ring-free unit U' by the second lift table 272 is released. As a result, the ring-free unit U' is transferred from the second lift table 272 of the reinforcing part removing means 194 to the frame holding portion 306 of the ring-free unit carry-out means 196.

[0161] After the ring-free unit unloading step is performed, a ring-free unit storing step is performed in which the ring-free unit U' unloaded by the ring-free unit unloading means 196 is stored.

[0162] In the ring-free unit accommodating step, first, the inverting mechanism 308 of the ring-free unit carrying-out means 196 is turned upside down, and the ring-free unit U' held by suction on the frame holding part 306 is turned upside down. As a result, the ring-free unit U' is positioned below the frame holding part 306, and the front surface 4a of the wafer 4 faces upward.

[0163] Next, the Y-axis movable member 316 and arm 318 of the reversing mechanism 308 are moved to bring the ring-free unit U' into contact with the upper surfaces of the pair of support plates 328 of the ring-free unit support section 310. At this time, the gap between the pair of support plates 328 is narrowed by the gap adjustment means, and the pair of support plates 328 are in close contact with each other. Next, the suction hold of the ring-free unit U' by the frame holding section 306 is released, and the ring-free unit U' is placed on the pair of support plates 328. Next, the heaters attached to each support plate 328 are activated to heat the tape 96 of the ring-free unit U', thereby smoothing out any sagging or wrinkles in the tape 96 caused by the removal of the ring-shaped reinforcing member 24. Finally, the ring-free unit U' is again suction-held by the frame holding section 306 and raised.

[0164] Next, after widening the gap between the pair of support plates 328 by the gap adjusting means, the ring-less unit U' is placed on the upper surface of the support plate 328. Then, as shown in Figure 23, the pressing piece 338 of the pushing portion 312 pushes the ring-less unit U' supported by the ring-less unit supporting portion 310, causing it to enter and be housed in the frame cassette 198 placed on the frame cassette table 200.

[0165] As described above, in the illustrated embodiment, the ring-shaped reinforcement portion 24 is imaged and the center of the inner circumference of the ring-shaped reinforcement portion 24 is set, and the frame unit U is rotated based on the set center while a cutting groove is formed along the inner circumference of the ring-shaped reinforcement portion 24. Therefore, the wafer 4 can be cut along the inner circumference of the ring-shaped reinforcement portion 24, and the ring-shaped reinforcement portion 24 can be properly removed from the wafer 4. [Explanation of symbols]

[0166] 2: Processing equipment 4: Wafer 4a: Surface of wafer 4b: Backside of wafer 6: Wafer cassette 8: Wafer cassette table 10: Wafer carrying means 12: Wafer table 20: Surplus outer area 24: Ring-shaped reinforcement 64: Frame 64a: Opening 64': Frame with tape 66: Frame accommodation means 68: Frame carrying means 70: Frame table 96: Tape 98: Tape attachment means 100: Tape-attached frame transport means 102: Tape crimping means 192: Frame unit carrying means 194:Reinforcement part removal means 196: Ring-less unit carrying-out means 198: Frame cassette 200: Frame cassette table 204: Temporary table 223: Upper camera 224: Lower camera 244: Laser beam irradiation means 246: First lift table 248: Separation part 256: Cutting groove 270: UV irradiation unit 272: Second lift table 274: Separator 276: Disposal Department 402: Frame U: Frame unit U': Unit without ring

Claims

1. A processing method for removing a ring-shaped reinforcing portion from a wafer having a convex ring-shaped reinforcing portion formed on a back surface corresponding to a peripheral excess region, comprising: a frame preparation step of preparing a ring-shaped frame having an opening formed therein for accommodating a wafer; a wafer preparation step of preparing a wafer having a ring-shaped reinforcing portion formed in a convex shape on a back surface corresponding to an outer peripheral excess region; a frame unit forming step of forming a frame unit by attaching tape to the frame and the back surface of the wafer; a center setting step of capturing an image of the ring-shaped reinforcement portion, measuring the coordinates of at least three points on the inner circumferential circle of the ring-shaped reinforcement portion, and setting the center of the inner circumferential circle of the ring-shaped reinforcement portion based on the coordinates of the measured three points; a cutting step of rotating the frame unit based on the center to cut the wafer along an inner circumferential circle of the ring-shaped reinforcing portion; a reinforcing portion removing step of removing the ring-shaped reinforcing portion cut off from the frame unit; A processing method comprising:

2. 2. The processing method according to claim 1, further comprising the steps of: imaging the surface of the wafer corresponding to the ring-shaped reinforcement portion; inspecting whether or not a device is present in the region where the ring-shaped reinforcement portion is to be cut; and suspending processing if a device is present.

3. 2. The processing method according to claim 1, wherein processing is interrupted if a region where the ring-shaped reinforcing portion and the tape are not in close contact is detected in the center setting step.

4. A processing device for removing a ring-shaped reinforcing portion from a wafer having a ring-shaped reinforcing portion formed in a convex shape on a back surface corresponding to a peripheral excess region, comprising: a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed; a wafer carrying-out means for carrying out wafers from the wafer cassette placed on the wafer cassette table; a wafer table that supports the front surface side of the wafer carried out by the wafer carrying-out means; a frame receiving means for receiving a plurality of ring-shaped frames each having an opening for receiving a wafer; a frame carrying-out means for carrying out the frame from the frame storing means; a frame table for supporting the frame carried out by the frame carrying-out means; a tape applying means disposed above the frame table for applying tape to the frame; a tape-attached frame transport means for transporting the frame with the tape attached to the wafer table and placing the tape-attached frame on the wafer table by positioning the opening of the frame over the back surface of the wafer supported on the wafer table; a tape pressing means for pressing the tape of the tape-attached frame onto the back surface of the wafer; a frame unit carrying-out means for carrying out, from the wafer table, a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure-bonded by the tape pressure-bonding means; a reinforcing portion removing means for cutting and removing the ring-shaped reinforcing portion from the wafer of the frame unit carried out by the frame unit carrying-out means; a ring-free unit carrying-out means for carrying out the ring-free unit from the reinforcing part removing means; a frame cassette table on which a frame cassette containing the ring-free unit carried out by the ring-free unit carrying-out means is placed; Including, the frame unit carrying-out means comprises a frame unit holding section including a wafer holding section for holding a wafer and a frame holding section for holding a frame, and a transport section for transporting the frame unit holding section to the temporary placement table; an upper camera is disposed between the wafer table and the temporary placement table, and captures an image of the back surface of the wafer from above the frame unit through the tape; A processing device that determines the center of the inner circumference of a ring-shaped reinforcement portion formed on the backside of a wafer.

5. the frame unit carrying-out means includes a two-dimensional movement mechanism that moves the frame unit holding portion two-dimensionally in the horizontal direction, 5. The processing apparatus according to claim 4, wherein the two-dimensional movement mechanism is operated to align the center of the inner circumferential circle of the ring-shaped reinforcing portion with the center of the temporary placement table.

6. 5. The processing apparatus according to claim 4, wherein a lower camera is disposed opposite the upper camera so as to sandwich the frame unit, and the lower camera takes an image of the surface of the wafer corresponding to the ring-shaped reinforcement portion to inspect whether or not a device is present in the area where the ring-shaped reinforcement portion is to be cut, and if a device is present, processing is interrupted.

7. 5. The processing device according to claim 4, wherein processing is interrupted when an area where the ring-shaped reinforcing portion and the tape are not in close contact is detected by the image captured by the upper camera.

8. the tape pressing means comprises an upper chamber disposed above the wafer table, a lower chamber accommodating the wafer table, a lifting mechanism that raises and lowers the upper chamber to create a closed state in which it is in contact with the lower chamber and an open state in which it is separated from the lower chamber, a vacuum section that evacuates the upper chamber and the lower chamber in the closed state, and an atmosphere opening section that opens the upper chamber and the lower chamber to the atmosphere, 5. The processing apparatus according to claim 4, wherein, with the tape of the tape-attached frame positioned on the backside of the wafer supported on the wafer table, the lifting mechanism is operated to evacuate the upper chamber and the lower chamber while maintaining the closed state, and the tape of the tape-attached frame is pressed against the backside of the wafer by a pressure roller disposed in the upper chamber.

9. the reinforcing portion removing means comprises: a laser beam applying means for applying a laser beam along an inner circumferential circle of a ring-shaped reinforcing portion formed on the outer periphery of the wafer to form a cutting groove; a first lifting table for holding and lifting a frame unit temporarily placed on the temporary placement table and positioning it on the laser beam applying means; and a separating unit for separating the ring-shaped reinforcing portion from the cutting groove; 5. The processing apparatus according to claim 4, wherein the separating section comprises an ultraviolet irradiation section that irradiates ultraviolet light onto the tape corresponding to the cutting groove to reduce the adhesive strength of the tape, a second lifting table that exposes the ring-shaped reinforcing section to the outer periphery and holds the inside of the wafer by suction, a separator that acts on the outer periphery of the ring-shaped reinforcing section with a wedge-equipped block to separate the ring-shaped reinforcing section, and a disposal section that discards the separated ring-shaped reinforcing section.

Images