Cutting device

Abstract

To provide a cutting device excellent in workability.SOLUTION: A cutting device 2 comprises: cutting means 6 that applies cutting processing to a work-piece W held on a chuck table 4; X-axis feeding means 32 and Y-axis feeding means which feed the chuck table and the cutting means relatively in X and Y-axis directions for processing; Z-axis feeding means 36 that feeds the chuck table and the cutting means relatively in a Z-axis direction for incising; a placement table 38 on which the work-piece is placed; and conveying means 40 that conveys the work-piece placed on the placement table to the chuck table while holding the work-piece. The placement table includes a first table 54 on which the work-piece not yet cut is placed and a second table 56, arranged adjacently to the first table in the X-axis direction, on which the work-piece already cut is placed. The cutting device further comprises lifting means that moves the first and second tables up and down, and positioning means 74 that positions the conveying means 40, which is moved in the X-axis direction, on a conveyance path.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cutting device including a chuck table for holding a plate-shaped workpiece, and cutting means for cutting the workpiece held on the chuck table. [Background technology]

[0002] A wafer with multiple devices such as ICs and LSIs formed on its surface, separated by planned dividing lines, is divided into individual device chips by a cutting machine, and each divided device chip is used in electrical equipment such as mobile phones and personal computers.

[0003] Furthermore, ceramic substrates, ferrite substrates, etc. are also divided into chips by cutting devices (see, for example, Patent Document 1).

[0004] The cutting device disclosed in Patent Document 1 is generally composed of a chuck table that holds a plate-shaped workpiece, cutting means that performs cutting processing on the workpiece held on the chuck table, a loading area where the workpiece is placed, an unloading unit that unloads the workpiece after cutting processing, and a transport means having a transport pad that transports the workpiece before cutting processing from the loading area to the chuck table and transports the workpiece after cutting processing from the chuck table to the unloading unit.

[0005] In this cutting device, the conveying pad is moved by the moving means that moves the cutting means, so there is no dedicated moving means for moving the conveying pad. Therefore, despite its simple configuration, the cutting device can automatically transport the workpiece in addition to cutting. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2019-111628 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in the cutting device disclosed in Patent Document 1, the area where the workpiece is placed before cutting is provided on the front of the cutting device, and the area where the workpiece is transported after cutting is provided on the side of the cutting device, which results in poor workability.

[0008] Furthermore, the operator must place the workpieces one by one on the placement area, which is a hassle that cannot be tolerated.

[0009] An object of the present invention is to provide a cutting device with good operability. [Means for solving the problem]

[0010] According to the present invention, the following cutting device is provided to solve the above problems: "A cutting device comprising a chuck table for holding a plate-shaped workpiece and cutting means for cutting the workpiece held on the chuck table, the apparatus comprises an X-axis feed means for relatively feeding the chuck table and the cutting means in the X-axis direction for processing, a Y-axis feed means for relatively indexing the chuck table and the cutting means in the Y-axis direction perpendicular to the X-axis direction, a Z-axis feed means for relatively cutting the chuck table and the cutting means in the Z-axis direction perpendicular to the X-axis direction, a mounting table on which a workpiece is placed, and a transport means for holding the workpiece placed on the mounting table and moving it in the Y-axis and Z-axis directions to transport it to the chuck table, the placement table includes a first table on which a workpiece before cutting is placed, and a second table disposed adjacent to the first table in the X-axis direction and on which a workpiece after cutting is placed, The present invention provides a cutting device that includes an elevating means for raising and lowering the first table and the second table in the Z-axis direction, and a positioning means for moving the first table and the second table in the X-axis direction to position them on the conveying path of the conveying means.

[0011] Preferably, the first table and the second table are provided with support portions for supporting the peripheries of the workpieces so that the workpieces can be placed one on top of the other.

[0012] It is desirable that the conveying means comprises a holding pad for holding the workpiece and an arm having one end connected to the holding pad and the other end connected to the cutting means, and that the holding pad is moved in the Y-axis direction and the Z-axis direction by the Y-axis feed means and the Z-axis feed means.

[0013] Preferably, one end of the arm and the holding pad are detachably connected to a holding pad table on which the holding pad is placed. The workpiece may be a rectangular plate-like object. [Effects of the Invention]

[0014] The cutting device of the present invention comprises: A cutting device comprising a chuck table for holding a plate-shaped workpiece, and cutting means for performing cutting on the workpiece held on the chuck table, the apparatus comprises an X-axis feed means for relatively feeding the chuck table and the cutting means in the X-axis direction for processing, a Y-axis feed means for relatively indexing the chuck table and the cutting means in the Y-axis direction perpendicular to the X-axis direction, a Z-axis feed means for relatively cutting the chuck table and the cutting means in the Z-axis direction perpendicular to the X-axis direction, a mounting table on which a workpiece is placed, and a transport means for holding the workpiece placed on the mounting table and moving it in the Y-axis and Z-axis directions to transport it to the chuck table, the placement table includes a first table on which a workpiece before cutting is placed, and a second table disposed adjacent to the first table in the X-axis direction and on which a workpiece after cutting is placed, The system is equipped with a lifting means for raising and lowering the first table and the second table in the Z-axis direction, and a positioning means for moving the first table and the second table in the X-axis direction to position them on the conveying path of the conveying means, so that the operator can place the workpiece before cutting on the first loading table and then retrieve the workpiece after cutting from the second loading table without having to move it, resulting in good operability. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a perspective view of a cutting device constructed in accordance with the present invention; [Figure 2] FIG. 2 is a perspective view of a chuck table and a mounting table shown in FIG. [Figure 3] FIG. 2 is a perspective view of the cutting means shown in FIG. 1; [Figure 4] FIG. 2 is a perspective view of the conveying means shown in FIG. [Figure 5] 10 is a schematic plan view showing a state in which a first table on which a workpiece before cutting is placed and a chuck table are positioned in a conveyance path of a holding pad. FIG. [Figure 6] FIG. 10 is a schematic plan view showing a state in which a workpiece before cutting is transferred from the first table to the chuck table. [Figure 7] FIG. 2 is a schematic plan view showing a state in which a cutting process is being performed on a workpiece. [Figure 8] 10 is a schematic plan view showing a state in which the chuck table holding the workpiece after cutting and the second table are positioned in the transport path of the holding pad. FIG. [Figure 9] FIG. 10 is a schematic plan view showing a state in which the workpiece after cutting is transported from the chuck table to the second table. DETAILED DESCRIPTION OF THE INVENTION

[0016] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a cutting device constructed according to the present invention will now be described with reference to the drawings.

[0017] (Cutting device 2) As shown in FIG. 1, the cutting device 2 includes a chuck table 4 that holds a plate-shaped workpiece W, and cutting means 6 that performs cutting on the workpiece W held on the chuck table 4.

[0018] (Chuck table 4) 2 together with Fig. 1, cutting device 2 includes an X-axis movable plate 10 supported on the upper surface of base 8 so as to be movable in the X-axis direction, and a support column 12 fixed to the upper surface of X-axis movable plate 10. Chuck table 4 is rotatably mounted on the upper end of support column 12. A cover plate 14 is disposed below chuck table 4.

[0019] The X-axis direction is the direction indicated by the arrow X in Fig. 1. The Y-axis direction indicated by the arrow Y in Fig. 1 is the direction perpendicular to the X-axis direction, and the Z-axis direction indicated by the arrow Z in Fig. 1 is the up-down direction perpendicular to the X-axis and Y-axis directions. The XY plane defined by the X-axis and Y-axis directions is substantially horizontal.

[0020] A porous suction chuck 16 connected to suction means (not shown) is disposed at the upper end of the chuck table 4. The suction means generates a suction force on the upper surface of the suction chuck 16, thereby suction-holding the workpiece W placed on the upper surface of the suction chuck 16. The chuck table 4 is rotated about the Z-axis by a chuck table motor (not shown) built into the support column 12.

[0021] (Cutting means 6) 3, a support wall 18 that supports the cutting means 6 is provided on the upper surface of the base 8. The cutting means 6 includes a Y-axis movable member 20 supported by the support wall 18 so as to be movable in the Y-axis direction, a Z-axis movable member 22 supported by the Y-axis movable member 20 so as to be movable up and down in the Z-axis direction, and a spindle housing 24 fixed to the Z-axis movable member 22.

[0022] A spindle 26 is supported in the spindle housing 24 so as to be rotatable about the Y-axis direction, and an annular cutting blade 28 for cutting the workpiece W is fixed to the tip of the spindle 26. The spindle housing 24 also includes a motor (not shown) for rotating the spindle 26 and an imaging means 30 for detecting the area to be cut.

[0023] As shown in FIG. 1, the cutting device 2 further includes an X-axis feed means 32 that feeds the chuck table 4 and the cutting means 6 relatively in the X-axis direction for machining, a Y-axis feed means 34 that feeds the chuck table 4 and the cutting means 6 relatively in the Y-axis direction for indexing, a Z-axis feed means 36 that feeds the chuck table 4 and the cutting means 6 relatively in the Z-axis direction for cutting, a loading table 38 on which the workpiece W is placed, and a transport means 40 that holds the workpiece W placed on the loading table 38 and moves it in the Y-axis and Z-axis directions to transport it to the chuck table 4.

[0024] (X-axis feed means 32) 2, X-axis feed means 32 has a ball screw 42 connected to X-axis movable plate 10 and extending in the X-axis direction, and a motor 44 that rotates ball screw 42. X-axis feed means 32 converts the rotational motion of motor 44 via ball screw 42 into linear motion and transmits it to X-axis movable plate 10, moving X-axis movable plate 10 along guide rail 8a of base 8. As a result, chuck table 4 is fed for processing in the X-axis direction relative to cutting means 6.

[0025] (Y-axis feed means 34) Explaining with reference to Figure 3, Y-axis feed means 34 has a ball screw 46 that is connected to Y-axis movable member 20 and extends in the Y-axis direction, and a motor 48 that rotates ball screw 46. Y-axis feed means 34 converts the rotational motion of motor 48 into linear motion using ball screw 46 and transmits it to Y-axis movable member 20, moving Y-axis movable member 20 in the Y-axis direction along guide rails 18a of support wall 18. As a result, cutting means 6 is indexed and fed in the Y-axis direction relative to chuck table 4.

[0026] (Z-axis feed means 36) Z-axis feed means 36 has a ball screw 50 connected to Z-axis movable member 22 and extending in the Z-axis direction, and a motor 52 that rotates ball screw 50. Z-axis feed means 36 converts the rotational motion of motor 52 into linear motion using ball screw 50 and transmits it to Z-axis movable member 22, moving Z-axis movable member 22 in the Z-axis direction along guide rails 20a of Y-axis movable member 20. As a result, cutting means 6 is fed to cut into chuck table 4 in the Z-axis direction.

[0027] (Placement table 38) 2, the placement table 38 includes a first table 54 on which the workpiece W before cutting is placed, and a second table 56 disposed adjacent to the first table 54 in the X-axis direction and on which the workpiece W after cutting is placed. In the illustrated embodiment, the first and second tables 54, 56 are formed as a single unit.

[0028] Support portions 58 are provided on the first table 54 and the second table 56 to support the outer periphery of the workpiece W so that the workpieces W can be placed one on top of the other. The support portions 58 extend upward from the four corners of the upper surfaces of the first and second tables 54, 56.

[0029] (Transportation means 40) Explaining with reference to FIG. 4, the conveying means 40 includes a holding pad 60 for holding the workpiece W, and an arm 62 having one end connected to the holding pad 60 and the other end connected to the cutting means 6.

[0030] A porous suction chuck (not shown) connected to suction means is disposed at the lower end portion of the holding pad 60. Also, as shown in Fig. 4, a connecting piece 64 extending upward and then substantially horizontally is attached to the upper surface of the holding pad 60. Although not shown, a truncated pyramidal recess is formed downward at the end of the connecting piece 64, and a suction hole (not shown) connected to the suction chuck is formed in the recess.

[0031] In the illustrated embodiment, one end of the arm 62 is detachably connected to the holding pad 60. As shown enlarged in Figure 4, one end of the arm 62 has an upwardly-facing truncated pyramidal protrusion 66 that corresponds to the recess of the connecting piece 64. A suction hole 68 that corresponds to the suction hole of the connecting piece 64 is formed at the upper end of the protrusion 66, and the suction hole 68 is connected to a suction means.

[0032] The recessed portion of the connecting piece 64 fits into the protruding portion 66 of the arm 62, thereby connecting the holding pad 60 to the arm 62. The position of the connecting piece 64 is adjusted so that the holding pad 60 becomes substantially horizontal when the holding pad 60 is connected to the arm 62 and raised. Furthermore, when the suction means is activated with the holding pad 60 and arm 62 connected, a suction force is generated on the underside of the holding pad 60 via the suction holes 68 of the arm 62 and the suction holes of the connecting piece 64, and the holding pad 60 and arm 62 are connected more firmly.

[0033] In the illustrated embodiment, a holding pad table 70 is installed on the upper surface of the base 8, and when the holding pad 60 and the arm 62 are not connected, the holding pad 60 is placed on the holding pad table 70.

[0034] The other end of the arm 62 is connected to the Z-axis movable member 22 of the cutting means 6. Therefore, the holding pad 60 connected to the arm 62 is moved in the Y-axis direction and the Z-axis direction together with the cutting means 6 by the Y-axis feed means 34 and the Z-axis feed means 36. In other words, the cutting device 2 does not require a dedicated moving means just for moving the holding pad 60, so the configuration is not complicated, and increases in the size and cost of the device are suppressed.

[0035] In the conveying means 40, a suction force is generated by the suction means on the lower surface of the suction chuck of the holding pad 60, and the workpiece W is held by suction on the lower surface of the holding pad 60. The conveying means 40 also conveys the suction-held workpiece W in the Y-axis and Z-axis directions by the Y-axis feed means 34 and the Z-axis feed means 36. The conveying path in the Y-axis direction of the conveying means 40 is indicated by the symbol R in FIG. 4.

[0036] As shown in Figures 1 and 2, the cutting device 2 further includes a lifting means 72 (see Figure 2) that raises and lowers the first table 54 and the second table 56 in the Z-axis direction, and a positioning means 74 that moves the first table 54 and the second table 56 in the X-axis direction to position them on the conveying path R of the conveying means 40.

[0037] (Lifting means 72) The lifting means 72 has a lifting member 76 connected to the lower part of the first and second tables 54, 56, and a lifting mechanism (not shown) that raises and lowers the lifting member 76. This lifting mechanism may have a configuration that includes a ball screw that is connected to the lifting member 76 and extends in the Z-axis direction, and a motor that rotates this ball screw.

[0038] (Positioning means 74) The positioning means 74 has an X-axis movable member 78 connected to the first and second tables 54, 56 via an elevating member 76, and an X-axis movement mechanism (not shown) that moves the X-axis movable member 78 in the X-axis direction. This X-axis movement mechanism may be configured to have a ball screw that is connected to the X-axis movable member 78 and extends in the X-axis direction, and a motor that rotates the ball screw, or may be composed of an air cylinder.

[0039] The positioning means 74 operates the X-axis movement mechanism to move the X-axis movable member 78 along the guide groove 8b of the base 8, thereby moving the first and second tables 54, 56 in the X-axis direction and positioning them on the transport path R of the transport means 40.

[0040] (Workpiece W) The illustrated workpiece W is a rectangular plate-like object, and may be made of, for example, ceramics. The surface of the workpiece W is divided into a plurality of rectangular regions by grid-like division lines (not shown). A dicing tape T is attached to the back surface of the workpiece W.

[0041] (Cutting method) Next, a method for cutting the workpiece W using the cutting device 2 will be described.

[0042] (Placement process) First, a loading step is performed in which the workpiece W is loaded on the first table 54 of the loading table 38. As described above, in the cutting device 2 of the illustrated embodiment, the first and second tables 54, 56 are provided with support parts 58 that support the outer peripheries of the workpiece W, so the operator can load a plurality of workpieces W in a stacked manner on the first table 54. When loading the workpieces W on the first table 54, the back surface to which the dicing tape T is attached faces downward.

[0043] (First conveying step) After the placing step is performed, a first transfer step is performed in which the workpiece W is transferred from the first table 54 to the chuck table 4.

[0044] In the first transport step, first, the arm 62 of the transport means 40 is moved by the Y-axis feed means 34 and the Z-axis feed means 36, and the convex portion 66 of the arm 62 is fitted into the concave portion of the holding pad 60 placed on the holding pad table 70, and the holding pad 60 is connected to one end of the arm 62.

[0045] Next, the X-axis feed means 32 moves the chuck table 4 in the X-axis direction, and as shown in Fig. 5, the chuck table 4 is positioned on the transport path R of the transport means 40. In addition, the positioning means 74 moves the loading table 38 in the X-axis direction, and the first table 54 is also positioned on the transport path R.

[0046] Once the chuck table 4 and the first table 54 are positioned on the transfer path R, the holding pad 60 is moved by the Y-axis feed means 34 and the Z-axis feed means 36, and the holding pad 60 is positioned above the workpiece W placed on the first table 54. Next, the holding pad 60 is lowered while avoiding interference with the support portion 58, and the lower surface of the holding pad 60 is brought into contact with the upper surface of the workpiece W. Next, a suction force is generated on the lower surface of the holding pad 60, and the workpiece W is suction-held by the holding pad 60.

[0047] Next, the Z-axis feed means 36 raises the holding pad 60 and removes the workpiece W from the support portion 58. Then, as shown in FIG. 6, the Y-axis feed means 34 and the Z-axis feed means 36 transport the workpiece W held by suction on the holding pad 60 to the chuck table 4, generating a suction force on the upper surface of the chuck table 4, and releasing the suction force of the holding pad 60, and the workpiece W is transferred from the holding pad 60 to the chuck table 4.

[0048] Next, the Y-axis feed means 34 and the Z-axis feed means 36 are operated to place the holding pad 60 on the upper surface of the holding pad table 70, and the connection between the holding pad 60 and the arm 62 is released. This prevents interference between the holding pad 60 and other members of the cutting device 2 when the cutting means 6 contacts the workpiece W.

[0049] (cutting process) After the first conveying step is performed, a cutting step is performed in which the workpiece W is cut along the dividing lines by the cutting blade 28 of the cutting means 6 to divide the workpiece W into individual chips.

[0050] In the cutting process, first, the chuck table 4 is moved and the workpiece W is positioned below the imaging means 30. Next, the workpiece W is imaged by the imaging means 30, and the planned dividing line is aligned in the X-axis direction based on the image of the workpiece W imaged by the imaging means 30. In addition, the cutting blade 28 is positioned above the planned dividing line aligned in the X-axis direction.

[0051] Next, the cutting edge of the cutting blade 28, which is being rotated at high speed, is caused to cut into the workpiece W from the front surface to the back surface, and the chuck table 4 is moved in the X-axis direction while cutting water is supplied to the part where the cutting edge of the cutting blade 28 is to be cut. This allows a dividing groove 80 (see FIG. 7) deep enough to completely divide the workpiece W to be formed along the intended dividing line.

[0052] 7, the cutting blade 28 is indexed and fed in the Y-axis direction relative to the chuck table 4 by an amount corresponding to the spacing between the planned division lines in the Y-axis direction, and the formation of the division grooves 80 is repeated. In this way, the division grooves 80 are formed along all of the planned division lines aligned in the X-axis direction.

[0053] Furthermore, the chuck table 4 is rotated 90 degrees, and the forming of the dividing grooves 80 is repeated while indexing and feeding, so that dividing grooves 80 are formed along all of the dividing lines that are perpendicular to the dividing lines along which the dividing grooves 80 were previously formed (see FIG. 8). In this way, the workpiece W can be divided into individual chips.

[0054] It should be noted that when forming the division grooves 80, the dicing tape T is not completely cut. This allows the dicing tape T to maintain the shape of the workpiece W before cutting even after it has been divided into chips.

[0055] (Second transport step) After the cutting step is performed, a second transfer step is performed in which the workpiece W is transferred from the chuck table 4 to the second table 56 .

[0056] In the second conveying step, first, the arm 62 of the conveying means 40 is moved by the Y-axis feed means 34 and the Z-axis feed means 36, and the convex portion 66 of the arm 62 is fitted into the concave portion of the holding pad 60 placed on the holding pad table 70, and the holding pad 60 is connected to one end of the arm 62.

[0057] 8, the chuck table 4 is positioned on the transport path R of the transport means 40. The second table 56 is also positioned on the transport path R by the positioning means 74.

[0058] Once the chuck table 4 and second table 56 are positioned on the transfer path R, the Y-axis feed means 34 and the Z-axis feed means 36 move the holding pad 60 so that the underside of the holding pad 60 comes into contact with the upper surface of the post-cut workpiece W that is held by suction on the chuck table 4. Next, a suction force is generated on the underside of the holding pad 60, and the workpiece W is held by suction with the holding pad 60. The suction force of the chuck table 4 is then released.

[0059] Next, the holding pad 60 is moved by the Y-axis feed means 34 and the Z-axis feed means 36, and the workpiece W held by suction on the holding pad 60 is transported to the second table 56, as shown in Fig. 9. Then, the suction force of the holding pad 60 is released, and the workpiece W after cutting is transferred from the holding pad 60 to the second table 56.

[0060] Although the workpiece W is supported by the dicing tape T after cutting, it is weak and sagging, so it is preferable to place a tray on the second table 56 for transporting the workpiece W.

[0061] As described above, in the cutting device 2, the first table 54 on which the workpiece W before cutting is placed and the second table 56 on which the workpiece W after cutting is placed are disposed adjacent to each other in the X-axis direction. Therefore, the operator can place the workpiece W before cutting on the first placing table 54 and then retrieve the workpiece W after cutting from the second placing table 56 without moving, which improves operability.

[0062] Furthermore, in the illustrated embodiment, the first and second tables 54, 56 are provided with supports 58 for supporting the outer peripheries of the workpieces W, so that the operator can stack and place a plurality of workpieces W on the first table 54. This eliminates the problem that the workpieces before cutting must be placed one by one on the placement area, which is cumbersome. [Explanation of symbols]

[0063] 2:Cutting device 4: Chuck table 6:Cutting means 32: X-axis feed means 34: Y-axis feed means 36: Z-axis feed means 38: Loading table 40: Means of transport 54: First Table 56: Second Table 58: Support part 60: Holding pad 62: Arm 72: Lifting means 74: Positioning means W: Workpiece

Claims

1. A cutting device comprising a chuck table for holding a plate-shaped workpiece, and cutting means for performing cutting on the workpiece held on the chuck table, the apparatus comprises an X-axis feed means for relatively feeding the chuck table and the cutting means in the X-axis direction for machining, a Y-axis feed means for relatively indexing the chuck table and the cutting means in the Y-axis direction perpendicular to the X-axis direction, a Z-axis feed means for relatively cutting the chuck table and the cutting means in the Z-axis direction perpendicular to the X-axis direction, a mounting table on which a workpiece is placed, and a transport means for holding the workpiece placed on the mounting table and moving it in the Y-axis and Z-axis directions to transport it to the chuck table, the placement table includes a first table on which a workpiece before cutting is placed, and a second table disposed adjacent to the first table in the X-axis direction and on which a workpiece after cutting is placed, A cutting device comprising: an elevating means for raising and lowering the first table and the second table in the Z-axis direction; and a positioning means for moving the first table and the second table in the X-axis direction to position them on the conveying path of the conveying means.

2. 2. The cutting device according to claim 1, wherein said first table and said second table are provided with support portions for supporting the outer peripheries of the workpieces so that the workpieces can be placed one on top of the other.

3. 2. The cutting device according to claim 1, wherein the conveying means comprises a holding pad for holding the workpiece, and an arm having one end connected to the holding pad and the other end connected to the cutting means, and the Y-axis feed means and the Z-axis feed means move the holding pad in the Y-axis and Z-axis directions.

4. 4. A cutting device according to claim 3, further comprising a holding pad table on which one end of said arm and said holding pad are detachably connected and on which said holding pad is placed.

5. 2. The cutting device according to claim 1, wherein the workpiece is a rectangular plate-like object.

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