Cable connection structure

Abstract

To provide a cable connection structure capable of easily suppressing air bubble occurrence in an embedding member.SOLUTION: A cable connection structure comprises: an electronic part having four electrodes 532 on an electrode formation plane 531; four solders 6 provided on four electrode planes 532s; a cable having four electric wires 30 each of which is connected to one of four solders 6; and an embedding member 4 embedding the four solders 6 and the four electric wires 30. As a boundary between the solder 6 and the electric wires 30, in view from a normal line X of the electrode formation plane 531, there is formed an eccentric boundary 8 which is eccentric to a distant side from the at least another one boundary 8 to the electrode plane 532s. In view from the normal direction X, a direction where a center C1 of the eccentric boundary 8 and a center C2 of the electrode plane 532s are arranged, is an arrangement direction, and the center C1 side to the center C2 is an eccentric side, the solders 6 are configured so that a width W1 in the arrangement direction on a part on a non-eccentric side from the eccentric boundary 8 is greater than a width W2 of the arrangement direction on a part on the eccentric side from the eccentric boundary 8.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a cable connection structure. [Background technology]

[0002] Patent Document 1 discloses an endoscope including an imaging device with an imaging element and a coaxial cable having four electric wires connected to four electrodes arranged vertically and horizontally on the electrode formation surface of the imaging device. In the endoscope described in Patent Document 1, the ends of the multiple electric wires on the electrode formation surface side are embedded in an embedding member made of adhesive or the like. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-180603 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the endoscope described in Patent Document 1, the molten resin that makes up the embedded member does not easily enter the gaps between the electric wires, and there is a risk of air bubbles forming inside the embedded member after it hardens. If air bubbles form inside the embedded member, they will expand or contract due to, for example, changes in temperature or air pressure, making it easier for external pressure to be applied to the connection portion.

[0005] The present invention has been made in view of the above circumstances, and has an object to provide a cable connection structure that can easily prevent air bubbles from being formed in a buried member. [Means for solving the problem]

[0006] In order to achieve the above object, the present invention provides an electronic component comprising a plurality of electrodes on an electrode formation surface, a plurality of solders provided on the electrode surfaces of the plurality of electrodes, a cable having a plurality of electric wires connected to the plurality of solders, and an embedding member formed by hardening a molten resin filled around the plurality of solders and the plurality of electric wires, and for embedding the plurality of solders and the plurality of electric wires, wherein an eccentric boundary portion exists at a boundary portion between the solders and the plurality of electric wires when viewed from a normal direction of the electrode formation surface, and the eccentric boundary portion a portion that is eccentric with respect to the electrode surface on a side farther from at least one other boundary portion, and when the direction in which the center of the eccentric boundary portion and the center of the electrode surface are aligned when viewed from the normal direction is defined as an alignment direction, one side of the alignment direction on which the eccentric boundary portion is eccentric with respect to the electrode surface is defined as an eccentric side, and the side opposite to the eccentric side is defined as an anti-eccentric side, the width of the solder that constitutes the eccentric boundary portion in the alignment direction from the eccentric boundary portion to the anti-eccentric side is greater than the width of the solder in the alignment direction from the eccentric boundary portion to the eccentric side. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a cable connection structure that is likely to prevent air bubbles from forming in the embedded member. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic configuration diagram of an endoscope system equipped with a cable connection structure according to a first embodiment. [Figure 2] FIG. 2 is an end view showing the tip surface of the camera head in the first embodiment. [Figure 3] FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 2. [Figure 4] 3 is an enlarged plan view of the periphery of a connection portion between a cable of the cable connection structure and an imaging device in the first embodiment. FIG. [Figure 5]3 is an enlarged side view of the periphery of a connection portion between a cable and an imaging device in the cable connection structure according to the first embodiment. FIG. [Figure 6] 1 is an enlarged perspective view of the periphery of a connection portion between a cable of a cable connection structure and an imaging device in the first embodiment, with the embedded member omitted from the drawing. FIG. [Figure 7] 7 is a cross-sectional view taken along line VII-VII in FIG. 4, passing through the boundary between the solder and the electric wire. [Figure 8] FIG. 8 is a cross-sectional view taken along the line VIII-VIII in FIG. 4. [Figure 9] FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. [Figure 10] 1 is a cross-sectional view of a cable connection structure including a separation region and a close region of electric wires in a first embodiment. [Figure 11] FIG. 11 is an enlarged view of the vicinity of the solder in FIG. 10. [Figure 12] FIG. 8 is an enlarged view of the solder area located in the upper left of FIG. 7. [Figure 13] 3A to 3C are side views of the cable illustrating a bending process of the cable connection structure in the first embodiment. [Figure 14] 4 is a plan view showing a positioning step of the cable connection structure in the first embodiment. FIG. [Figure 15] 4 is a front view showing an alignment step of the cable connection structure in the first embodiment. FIG. [Figure 16] 4A to 4C are plan views illustrating a joining step of the cable connection structure in the first embodiment. [Figure 17] 10 is an enlarged side view of the periphery of a connection portion between a cable and an imaging device in the cable connection structure according to the second embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] [First embodiment] A first embodiment of the present invention will be described with reference to Figures 1 to 16. The embodiment described below is shown as a preferred specific example for carrying out the present invention, and although various technically preferable technical matters are specifically illustrated in some parts, the technical scope of the present invention is not limited to this specific embodiment.

[0010] 1 is a schematic diagram of an endoscope system 10 equipped with a cable connection structure of this embodiment. The endoscope system 10 includes an endoscope 100, an image processing device 15 that processes image information obtained by the endoscope 100, a display device 16 that displays images processed by the image processing device 15 on a screen 161, and a liquid supply device 17 that dispenses a liquid for cleaning a camera lens or the like in response to operation of a foot switch 171.

[0011] The endoscope 100 comprises an operation unit 11, an insertion tube 12, and a camera head 13. The operation unit 11 is the part operated by a doctor. The operation unit 11 is connected to an image processing device 15 via a communication cable 14, and is also connected to a liquid supply device 17 via a hose 18. The insertion tube 12 connects the operation unit 11 and the camera head 13. The length of the insertion tube 12 is, for example, 1 m or more and 4 m or less. The camera head 13 is inserted into the body of a subject together with a part of the insertion tube 12. Hereinafter, the side of the insertion tube 12 where the camera head 13 is located will be referred to as the distal end side, and the opposite side will also be referred to as the proximal end side.

[0012] Fig. 2 is an end view showing the tip surface of the camera head 13. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 2. The camera head 13 has a resin outer cylinder 131 and a cover 132 that closes the tip surface of the outer cylinder 131. A tube 19 for circulating a liquid supplied from a liquid supply device 17, an optical fiber (not shown), and a cable 3 (described later) are inserted inside the outer cylinder 131 and the insertion tube 12. An imaging device 5 (described later) is also disposed inside the outer cylinder 131.

[0013] The cover body 132 is formed with a through-hole 132a into which the tip of the imaging device 5 is fitted, and a through-hole 132b into which the tip of the tube 19 is fitted. The cover body 132 is also provided with an irradiation window 132c that emits irradiation light for irradiating the imaging target site. Light guided by an optical fiber (not shown) is irradiated through the irradiation window 132c.

[0014] 3, the imaging device 5 has a cylindrical body 51, a light-transmitting imaging window 52 fixed to one end of the cylinder 51, an imaging element 53 fixed to the other end of the cylinder 51, and a plurality of lenses 54 arranged between the imaging window 52 and the imaging element 53. The imaging element 53 may be, for example, a CMOS image sensor or a CCD (Charge-Coupled Device) image sensor. The imaging device 5 converts information of an optical image formed on the imaging element 53 into an electrical signal and outputs the electrical signal to the image processing device 15 via the cable 3.

[0015] FIG. 4 is an enlarged plan view of the periphery of the connection portion between the cable 3 of the cable connection structure 1 and the imaging device 5. FIG. 5 is an enlarged side view of the periphery of the connection portion between the cable 3 of the cable connection structure 1 and the imaging device 5. FIG. 6 is an enlarged perspective view of the periphery of the connection portion between the cable 3 of the cable connection structure 1 and the imaging device 5, with the embedded member (see reference numeral 4 in FIGS. 4, 5, etc.) described below not shown. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 4, and is a cross-sectional view passing through the boundary portion 8 between the solder 6 and the electric wire 30. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 4. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 4.

[0016] 6 to 8, four electrodes 532 are formed on an electrode formation surface 531, which is the surface on the base end side of the imaging device 5. As shown in Fig. 7, the electrode formation surface 531 is formed in a rectangular shape, and the length L of each side can be set to 0.6 mm or more and 1.1 mm or less. The four electrodes 532 are formed as electrodes of the imaging element 53.

[0017] As shown in FIG. 7, the four electrodes 532 are arranged on an imaginary circle C whose center is C0 at a point on the electrode formation surface 531, and are disposed at the four vertices of a square. In this embodiment, the four electrodes 532 are composed of a power supply electrode 532a for powering the imaging device 5, an information output electrode 532b for outputting an imaging signal converted from information on an optical image coupled to the imaging element 53, a command receiving electrode 532c for receiving a command signal for causing the imaging device 5 to perform a predetermined operation (e.g., an imaging operation), and a ground electrode 532d connected to ground. Also, as shown in FIGS. 4, 5, and 7, the shortest distance SD1 between adjacent electrodes 532 in the circumferential direction along the imaginary circle C can be, for example, 0.1 mm or more and 0.3 mm or less. Cables 3 are disposed so as to be electrically connected to each of the four electrodes 532.

[0018] 9, the cable 3 is a multi-core cable including four electric wires 30 connected to four electrodes 532, a shield conductor 36 that collectively covers the four electric wires 30, and an outer jacket 37 that covers the shield conductor 36. The four electric wires 30 include three coaxial wires 31 and one drain wire 32.

[0019] The three coaxial lines 31 are composed of a power supply coaxial line 31a connected to the power supply electrode 532a, an information transmission coaxial line 31b connected to the information output electrode 532b, and a command transmission coaxial line 31c connected to the command receiving electrode 532c. The power supply coaxial line 31a supplies power to the imaging device 5. The information transmission coaxial line 31b transmits the imaging signal output from the information output electrode 532b. The command transmission coaxial line 31c transmits the command signal output from the command receiving electrode 532c. Hereinafter, when there is no need to distinguish between the power supply coaxial line 31a, the information transmission coaxial line 31b, and the command transmission coaxial line 31c, they will simply be referred to as coaxial lines 31.

[0020] The coaxial cable 31 includes an inner conductor 311 as a core wire, an inner insulator 312 that covers the outer periphery of the inner conductor 311, and an outer conductor 313 that covers the outer periphery of the inner insulator 312. The inner conductor 311 is a stranded wire formed by twisting together a plurality of strands 311a. The diameter of the inner conductor 311 is 0.1 mm or less. More specifically, the diameter of the inner conductor 311 can be, for example, 40 to 46 AWG (diameter 0.048 mm or more and 0.093 mm or less). AWG stands for American Wire Gauge. Note that when the inner conductor 311 is configured as a stranded wire as in this embodiment, the diameter of the inner conductor 311 is the diameter of a circumscribed circle of the plurality of strands that make up the inner conductor 311.

[0021] Internal insulator 312 surrounding internal conductor 311 is made of an electrically insulating resin. The diameter of internal insulator 312 can be, for example, 0.1 mm or more and 0.25 mm or less.

[0022] The outer conductor 313 is formed by spirally winding a plurality of wires 313a horizontally so as to contact the outer peripheral surface of the internal insulator 312. The outer conductor 313 may be formed by braiding a plurality of wires, or by using a metal foil that covers the outer peripheral surface of the internal insulator 312. The outer conductor 313 may also be formed by attaching a conductive tape, which is a strip of resin with a conductive layer formed on one or both sides, to the internal insulator 312 and winding it vertically or horizontally.

[0023] The drain wire 32 is connected to the ground electrode 532d. The drain wire 32 is made by twisting together a plurality of strands 32a. The drain wire 32 does not have an electrically insulating coating and is electrically connected to the outer conductor 313 and the shield conductor 36 of each coaxial line 31, thereby providing a ground potential.

[0024] The shield conductor 36 is formed by spirally winding a plurality of wires 36a of the coaxial cable 31. The shield conductor 36 may be formed by a braided wire in which a plurality of wires are braided, or by a metal foil disposed on the inner peripheral surface of the outer sheath 37. The shield conductor 36 may also be formed by longitudinally or transversely winding a conductive tape, which is a resin strip with a conductive layer formed on one or both sides, around the four electric wires 30.

[0025] The outer jacket 37 collectively covers the four electric wires 30 and the shield conductor 36 except for the ends on the electrode formation surface 531 side. The outer jacket 37 is made, for example, of an electrically insulating resin formed into a cylindrical shape. The shield conductor 36 and the outer conductors 313 of the three coaxial wires 31 are cut off at the tip of the outer jacket 37, and the inner conductors 311 and inner insulators 312 of the three coaxial wires 31 and the drain wire 32 are exposed from the tip of the outer jacket 37, as shown in FIGS.

[0026] The portion of the coaxial wire 31 exposed distally from the outer sheath 37 includes an exposed insulation portion 314, where the internal insulator 312 is exposed distally from the outer conductor 313 and the outer sheath 37, and an exposed conductor portion 315, where the end of the internal conductor 311 connected to the electrode 532 is exposed distally from the internal insulator 312. The exposed insulation portion 314 is longer than the exposed conductor portion 315. In each coaxial wire 31, the distal ends of the exposed insulation portions 314 are positioned at the same position in the normal direction to the electrode-forming surface 531. Hereinafter, the normal direction to the electrode-forming surface 531 will be referred to as the X-direction. The distal ends of the exposed conductor portion 315 and the distal end of the drain wire 32 are mechanically and electrically connected to the electrode 532 using solder 6 provided on the electrode surface 532s, which is the surface of the base end of the electrode 532. The entire portions of the four electric wires 30 exposed distally from the outer sheath 37 are embedded within the embedding member 4, which will be described later.

[0027] 4 to 6, the four electric wires 30 are separated electric wires 300 that have, inside the embedded member 4, portions that become increasingly separated from one another in the X direction as they move away from the electrode-forming surface 531. In this embodiment, the four electric wires 30 have, inside the embedded member 4, separated regions 33 that become increasingly separated from one another as they move from the electrode-forming surface 531 toward the outer skin 37, and close regions 34 that become closer to one another as they move from the separated regions 33 toward the outer skin 37.

[0028] 7 and 8, the four separated regions 33 are inclined in the X direction so as to move radially outward as they move away from the electrode formation surface 531. The radially outward direction is the radially outward direction of the imaginary circle C described above, and in this embodiment, is also the radially outward direction of the cable 3. As shown in FIGS. 4 and 5, the separated regions 33 of each of the four electric wires 30 are formed linearly.

[0029] In three of the four coaxial wires 31 of the electric wires 30, the proximity region 34 is constituted by a covered wire portion (i.e., exposed insulation portion 314) in which the inner conductor 311 serving as a core wire is covered with an insulator (i.e., inner insulator 312), and the separation region 33 is constituted by a bare wire portion (i.e., exposed conductor portion 315) of the inner conductor 311 exposed from the insulator (i.e., inner insulator 312).

[0030] The three coaxial wires 31 are bent so as to convex outward in the radial direction at the base portions of the conductor exposed portions 315 (i.e., the ends of the conductor exposed portions 315 on the side of the insulation exposed portion 314), and the bent portions 35 serve as a boundary to separate the distant region 33 from the approaching region 34. That is, in the three coaxial wires 31, the distant region 33 is constituted only by the conductor exposed portions 315, and the approaching region 34 is constituted mainly by the insulation exposed portion 314, although its tip portion is constituted by the conductor exposed portion 315. In addition, the drain wire 32 also has a bent portion 35 that is bent so as to convex outward in the radial direction. The bent portion 35 of the electric wire 30 is bent so as to convex in the direction away from the adjacent electric wire 30 in the circumferential direction along the imaginary circle C.

[0031] Fig. 10 is a cross-sectional view of a cable connection structure 1 including a separation region 33 and an approach region 34 of an electric wire 30. As shown in Fig. 10, in the electric wire 30, the angle α between the longitudinal direction of the separation region 33 and the longitudinal direction of the approach region 34 can be, for example, not less than 3° and not more than 15°. Furthermore, the angle β between the separation region 33 and the X direction can be, for example, not less than 10° and not more than 45°.

[0032] 4 to 6, the bent portions 35 of the four electric wires 30 are located at the same positions as each other in the X direction. As shown in Fig. 4 and Fig. 5, the shortest distance SD2 between the bent portions 35 of the electric wires 30 adjacent to each other in the circumferential direction along the imaginary circle C is greater than the shortest distance SD1 and can be set to 0.25 mm or more and 0.75 mm or less. In this embodiment, the entire bent portion 35 is located radially outward of the electrode 532 to which the bent portion 35 is connected.

[0033] As shown in FIG. 7 , when viewed from the X direction, the boundary 8 between the solder 6 and the wire 30 is eccentric to the outside in the radial direction relative to the electrode surface 532s. That is, when viewed from the X direction, the center of the boundary 8 (see reference symbol C1 in FIGS. 11 and 12 described below) is located radially outward from the center C2 of the electrode surface 532s. As a result, when viewed from the X direction, each boundary 8 is eccentric to the electrode surface 532s, away from all other boundaries 8. In this way, a boundary 8 that is eccentric to the side away from at least one other boundary 8 relative to the electrode surface 532s when viewed from the X direction is referred to as an eccentric boundary. In this embodiment, all boundaries 8 are eccentric boundaries, and hereinafter, the boundaries 8 are also referred to as eccentric boundaries 8. In addition, when describing a specific eccentric boundary portion 8, references to an electric wire 30, solder 6, electrode 532, electrode surface 532s, etc. are made, unless otherwise specified, to the electric wire 30, solder 6, electrode 532, and electrode surface 532s that are electrically connected to that eccentric boundary portion 8.

[0034] The boundary 8 is the boundary between the solder 6 and the electric wire 30 when viewed from the outside. That is, the boundary 8 is the portion where the surface of the solder 6 and the electric wire 30 come into contact, and is formed in the shape of a closed curve. The center C1 of the boundary 8 refers to the center of gravity (i.e., the geometric center) of the two-dimensional figure enclosed by the closed curve. In addition, in this embodiment, the electrode surface 532s is formed in a circular shape, and the center C2 of the electrode surface 532s is the center of the circle. However, if the electrode surface 532s is non-circular, the center C2 of the electrode surface 532s refers to the center of gravity of the electrode surface 532s. FIGS. 7 and 8 show an example in which the solder 6 is disposed over the entire electrode surface 532s, and the outer shape of the solder 6 coincides with the outer shape of the electrode surface 532s when viewed from the base end side.

[0035] Fig. 11 is an enlarged view of the vicinity of the solder 6 in Fig. 10. Fig. 12 is an enlarged view of the vicinity of the solder 6 located in the upper left of Fig. 7. The solder 6 constituting the eccentric boundary portion 8 has a radial width W1 at a portion radially inward from the eccentric boundary portion 8 that is larger than a radial width W2 at a portion radially outward from the eccentric boundary portion 8. The width W1 can be set to be at least twice the width W2, and can also be set to be at least 10 times the width W2.

[0036] In a cross section (e.g., FIGS. 10 and 11 ) that passes through the center C1 of the eccentric boundary 8 and the center C2 of the electrode surface 532s and is parallel to the X direction, the angle θ1 between the radial direction and a surface 61 of the solder 6 located radially inward from the eccentric boundary 8 is smaller than the angle θ2 between the radial direction and a surface 62 of the solder 6 located radially outward from the eccentric boundary 8. Note that if the cross-sectional shape of the surface 61 is curved rather than linear, the angle θ1 is the angle between the radial direction and the most distal portion of the surface 61. Similarly, if the cross-sectional shape of the surface 62 is curved rather than linear, the angle θ2 is the angle between the radial direction and the most distal portion of the surface 62.

[0037] The embedded member 4 embeds the entire portions of the four electric wires 30 exposed from the outer sheath 37, including the connection portions between the electric wires 30 and the electrodes 532. In the X direction, the embedded member 4 is formed from the electrode forming surface 531 to the tip surface 371 of the outer sheath 37. The embedded member 4 also fills the inner peripheries of the four electric wires 30. The portions of the embedded member 4 arranged on the inner peripheries of the four electric wires 30 are arranged up to the vicinity of the tip surface 371 of the outer sheath 37.

[0038] The tip side of the embedded member 4 is disposed over substantially the entire electrode forming surface 531 so as not to protrude from the electrode forming surface 531, and the base end side of the embedded member 4 is disposed on the tip surface 371 of the outer skin 37. The embedded member 4 is formed so that its outer diameter decreases toward the outer skin 37. As shown in FIG. 9 , when viewed from the X direction, the embedded member 4 is located at the same position as the outer contour of the electrode forming surface 531 or is located more inward than the outer contour of the electrode forming surface 531. In this embodiment, as described above, the tip side of the embedded member 4 is formed over substantially the entire electrode forming surface 531, and when viewed from the X direction, the outer contour of the embedded member 4 is formed at substantially the same position as the outer contour of the electrode forming surface 531.

[0039] The embedding member 4 is made of an insulating material, such as an adhesive such as acrylate, or a resin such as epoxy resin. In this embodiment, the embedding member 4 has a viscosity of 900 mPa·s or more and 2000 mPa·s or less in a molten state before hardening.

[0040] Next, an example of a method for manufacturing the cable connection structure 1 of this embodiment will be described with reference to Figures 13 to 16. The method for manufacturing the cable connection structure 1 of this embodiment involves performing a bending step, an alignment step, a joining step, and an embedding step in this order, but is not limited to this, and for example, the alignment step may be performed before the bending step.

[0041] 13 is a side view of the cable 3 illustrating the bending process of the cable connection structure 1. In the bending process, the base portions of the conductor exposed portions 315 of the four electric wires 30 that are in a substantially straight state and protruding from the outer sheath 37 are bent to form the bent portions 35 in each of the four electric wires 30. It is also possible to apply solder to the conductor exposed portions 315 and the drain wire 32 before the bending process. This makes it possible to prevent the twist of the conductor exposed portions 315 and the drain wire 32, which are made of twisted wires, from untwisting during the bending process, and also makes it easier to bend the conductor exposed portions 315 and the drain wire 32.

[0042] Fig. 14 is a plan view showing the alignment step of the cable connection structure 1. Fig. 15 is a front view showing the alignment step of the cable connection structure 1. As shown in Fig. 14, in the alignment step, first, the imaging device 5, in which solder 6 is provided on each of the four electrodes 532, and the cable 3 are aligned in a two-dimensional direction perpendicular to the X direction. Here, the electrode formation surface 531 and the tip surface 371 of the outer sheath 37 of the cable 3 are made to face each other in the X direction.

[0043] 14 and 15 , each of the four electric wires 30 protruding in random directions from the outer sheath 37 is gripped by a chuck 70. The chuck 70 gripping the coaxial wire 31 grips the tip of the exposed insulation portion 314, and the chuck 70 gripping the drain wire 32 grips the same position in the X direction as the chuck 70 gripping the coaxial wire 31. Note that the chuck 70 gripping the coaxial wire 31 may grip the exposed conductor portion 315 of the coaxial wire 31. Then, each chuck 70 is moved in two-dimensional directions YZ orthogonal to the X direction so that the tip of each of the four electric wires 30 is positioned to overlap the electrode 532 to be connected in the X direction.

[0044] 14 also shows a first heater 71 for heating the solder 6 from the tip end side of the imaging device 5 and a second heater 72 for heating the solder 6 from the base end side of the chuck 70. As an example, the first heater 71 and the second heater 72 may be configured to have a coiled heating wire that generates heat in response to electrical current disposed in an electrically insulating case. Four second heaters 72 are provided corresponding to the chucks 70, and each is fixed to each chuck 70. During the alignment process, the first heater 71 and the second heater 72 are in a non-heating state.

[0045] Fig. 16 is a plan view showing the joining process of the cable connection structure 1. Unlike Fig. 14, the first heater 71 and the second heater 72 are hatched in Fig. 16, which means that the first heater 71 and the second heater 72 shown in Fig. 16 are in the on state (heating state).

[0046] In the joining process, the electric wire 30 is soldered to the electrode 532 after the bending process and the alignment process. In the joining process, the first heater 71 and the second heater 72 are turned on and heated. In addition, in the joining process, an inert gas G such as high-temperature nitrogen gas is sprayed around the solder 6 by the inert gas inlet 73. In this state, the imaging device 5 is moved toward the cable 3 in the X direction, and the electric wire 30 is inserted into the molten solder 6 to solder the electric wire 30 to the electrode 532. At this time, the position of the electric wire 30 relative to the electrode 532 is adjusted so that the position of the eccentric boundary portion 8 between the electric wire 30 and the solder 6 is eccentric radially outward from the electrode surface 532s. Note that spraying the high-temperature inert gas G around the solder 6 can promote melting of the solder 6 and prevent oxidation of the solder 6.

[0047] Next, in the embedding process (not shown), the molten embedding material 4 is filled from the electrode formation surface 531 to the tip surface 371 of the outer cover 37 using, for example, a syringe with a sharp tip. If the volume of the space surrounded by the four electric wires 30 is excessively small, the viscous molten resin of the embedding material 4 cannot sufficiently fill the space surrounded by the four electric wires 30, which may result in the formation of air bubbles within the embedding material 4. Furthermore, if the amount of the molten embedding material 4 filled in the embedding process is small, additional molten embedding material 4 may be added. In this case, air is particularly likely to be trapped inside the embedding material 4. Therefore, as in this embodiment, by forming separation regions 33 in the four electric wires 30 that are spaced apart as they move away from the electrode formation surface 531 in the X direction, the space surrounded by the four electric wires 30 can be expanded, making it easier to prevent air bubbles from being formed inside the embedding material 4. In this manner, the cable connection structure 1 of this embodiment can be manufactured.

[0048] (Functions and Effects of the First Embodiment) In the cable connection structure 1 of this embodiment, the boundary 8 between the solder 6 and the electric wire 30 includes an eccentric boundary 8 that is eccentric with respect to the electrode surface 532s when viewed from the X direction. The eccentric boundary 8 is eccentric with respect to the electrode surface 532s, away from at least one other boundary 8. This allows for a wider gap between the eccentric boundary 8 and the at least one other boundary 8, thereby allowing for a wider gap between the electric wires 30 that make up these boundaries 8. This makes it possible to prevent air bubbles from forming in the embedded member 4 that is disposed between the electric wires 30 connected to the eccentric boundary 8 and the at least one other boundary 8. If air bubbles form in the embedded member 4, the bubbles expand or contract due to, for example, temperature or air pressure changes, making it more likely that external pressure will be applied to the connection between the electrode 532 and the electric wire 30. However, this embodiment prevents such problems from occurring.

[0049] Furthermore, the direction in which the center C1 of the eccentric boundary portion 8 and the center C2 of the electrode surface 532s are aligned when viewed from the X direction is defined as the alignment direction (radial direction in this embodiment), and the side of the alignment direction where the eccentric boundary portion 8 is eccentric with respect to the electrode surface 532s is defined as the eccentric side (radial outer side in this embodiment), and the side opposite the eccentric side is defined as the anti-eccentric side (radial inner side in this embodiment). In this case, the width W1 of the solder 6 constituting the eccentric boundary portion 8 at the anti-eccentric side from the eccentric boundary portion 8 in the alignment direction is larger than the width W2 of the solder 6 at the eccentric side from the eccentric boundary portion 8 in the alignment direction. This makes it possible to prevent the strength of the solder 6 constituting the boundary portion 8 from being excessively reduced, even when the boundary portion 8 is eccentric with respect to the electrode surface 532s.

[0050] Furthermore, in a cross section passing through the center C1 of the eccentric boundary portion 8 and the center C2 of the electrode surface 532s and parallel to the X direction, the angle θ1 formed between the arrangement direction and a surface 61 of the solder 6 located on the anti-eccentric side of the eccentric boundary portion 8 is smaller than the angle θ2 formed between the arrangement direction and a surface 62 of the solder 6 located on the eccentric side of the eccentric boundary portion 8. Due to this inclination of the surface 61, the molten resin constituting the embedded member 4 is easily guided to the anti-eccentric side of the solder 6 (the radially inner side in this embodiment).

[0051] Moreover, the electric wire 30 constituting the eccentric boundary portion 8 is a separated electric wire 300 having a separated region 33 inclined toward the eccentric side as it becomes farther away from the electrode formation surface 531 in the X direction inside the embedded member 4. Therefore, it is possible to increase the space between the separated electric wire 300 and at least one other electric wire 30, and to suppress the formation of air bubbles inside the embedded member 4 injected into the space.

[0052] Furthermore, the angle β between the separation region 33 and the X direction is equal to or greater than 10° and equal to or less than 45°. When the angle β is 10° or greater, the space between the separation wire 300 and at least one other wire 30 can be further increased. When the angle β is 45° or less, it is possible to prevent the gap between the separation region 33 and the electrode formation surface 531 from narrowing, making it difficult for the molten resin that constitutes the embedded member 4 to enter the gap.

[0053] The separated electric wire 300 has a separated region 33 and an approach region 34, and the angle formed between the longitudinal direction of the separated region 33 and the longitudinal direction of the approach region 34 is 3° or more and 15° or less. By making the angle α a small angle of 3° or more and 15° or less, it is possible to prevent the gap between the separated region 33 and the approach region 34 from becoming excessively narrow, making it difficult for the molten resin that forms the embedded member 4 to enter between the separated region 33 and the approach region 34.

[0054] Furthermore, a bent portion 35 is formed in the exposed core wire (i.e., the inner conductor 311) of the separated electric wire 300, and the portion of the core wire from the bent portion 35 to the electrode 532 side forms the separated region 33. This makes it possible to easily form the separated region 33 in the separated electric wire 300.

[0055] Furthermore, the plurality of electrodes 532 includes four electrodes 532 arranged side by side on an imaginary circle C, and the four electric wires 30 include four electric wires 30 connected to the four electrodes 532. When the plurality of electric wires 30 are arranged three-dimensionally in this manner, there is a concern that the molten resin constituting the embedding member 4 may not be able to spread throughout the space surrounded by the plurality of electric wires 30. Therefore, in this embodiment, each of the four boundaries 8 constitutes an eccentric boundary portion 8, and the eccentric boundary portion 8 is eccentric radially outward relative to the electrode surface 532s. This makes it possible to increase the space surrounded by the four electric wires 30, making it easier for the molten resin constituting the embedding member 4 to fill the space.

[0056] Furthermore, the electronic component 2 is an imaging device 5 equipped with an endoscopic imaging element 53, and the diameter of each of the core wires (i.e., the inner conductor 311) of the four electric wires 30 is 0.1 mm or less. In other words, the core wire of each of the four electric wires 30 is an extremely thin conductor, and the endoscopic imaging device 5 as the electronic component 2 to which the cable 3 is connected is configured to be extremely small so that it can be inserted into the human body. When such a configuration is configured, the gaps between the electric wires 30 tend to become very narrow, making it difficult for the molten resin that constitutes the embedded member 4 to enter the gaps, increasing the risk of air bubbles being generated within the embedded member 4. Therefore, when such a configuration is configured, providing an eccentric boundary portion 8 is highly effective in suppressing the generation of air bubbles within the embedded member 4.

[0057] Furthermore, the cable 3 has an outer sheath 37 that collectively covers the portions of the multiple electric wires 30 except for the ends on the electrode-forming surface 531 side. Therefore, the multiple electric wires 30 are subjected to a force that tries to draw them closer to each other due to the restraining force of the outer sheath 37, and therefore, unless special measures are taken, the multiple electric wires 30 are configured to approach each other as they move farther away from the electrode-forming surface 531, and the volume of the area surrounded by the multiple electric wires 30 tends to become smaller. Therefore, in this embodiment, even in a situation where the area surrounded by the multiple electric wires 30 tends to become smaller due to the outer sheath 37 that collectively covers the multiple electric wires 30, by forming portions of the four electric wires 30 inside the embedding member 4 that become more distant from each other as they move farther away from the electrode-forming surface 531, it is possible to more effectively prevent air bubbles from forming inside the embedding member 4.

[0058] Furthermore, inside the embedding member 4, the conductor exposed portion 315 of the coaxial line 31 is shorter than the insulation exposed portion 314. Here, since the embedding member 4 is directly disposed around the conductor exposed portion 315, the impedance of the conductor exposed portion 315 is likely to increase, but by shortening the conductor exposed portion 315, it is possible to suppress the increase in impedance of the coaxial line 31. Furthermore, by lengthening the insulation exposed portion 314, it is easier to grip the insulation exposed portion 314 during the above-mentioned alignment step.

[0059] In addition, the embedded member 4 is disposed from the electrode formation surface 531 to the outer sheath 37 in the X direction. The four separated electric wires 300 have, inside the embedded member 4, separated regions 33 that become more distant from each other as they move from the electrode formation surface 531 toward the outer sheath 37, and close regions 34 that become closer to each other as they move from the separated regions 33 toward the outer sheath 37. Therefore, the regions surrounded by the four separated electric wires 300 become larger as they move closer to each other in the X direction, and are formed approximately symmetrically in the X direction, so to speak. This makes it easier for the molten embedded member 4 to fill the space surrounded by the four separated electric wires 300, and makes it easier to suppress the formation of bubbles in the embedded member 4.

[0060] Furthermore, the three coaxial wires 31 have close regions 34 formed by covered wire portions (i.e., exposed insulation portions 314) in which the core wires (i.e., inner conductors 311) of the electric wires 30 are covered with an insulator (i.e., inner insulators 312), and separate regions 33 formed by bare wire portions of the core wires exposed from the insulator (i.e., exposed conductor portions 315). The separate regions 33 are close to the joints between the electric wires 30 and the electrodes 532, and are prone to large stress at the joints due to the formation of air bubbles in the embedding member 4. However, by forming such regions using bare wire portions, it is easy to ensure the distance between the separate regions 33 and to prevent air bubbles from forming in the regions between the separate regions 33 in the embedding member 4. Furthermore, by forming the close regions 34 of the three coaxial wires 31 using covered wire portions, it is easy to ensure electrical insulation between the close regions 34 of the multiple electric wires 30.

[0061] Furthermore, the three coaxial wires 31 are bent at the ends of the bare wire portions opposite the electrode 532, and the region of the coaxial wires 31 from the bent portion 35 to the tip side (i.e., the separated region 33) is formed in a straight line. The boundary between the bare wire portion and the covered wire portion, and the bent portion 35 of the electric wire 30 are likely to be regions where the flow of the molten embedded material 4 is likely to be stagnant, but by concentrating such regions in one place and making the separated region 33 straight, it is easy to suppress the formation of bubbles in the embedded material 4.

[0062] Furthermore, when viewed from the X direction, the embedded member 4 is located inside the outer periphery of the electrode-forming surface 531. This effectively prevents the cable connection structure 1 from becoming larger. That is, when the four electric wires 30 are formed with portions that become more distant from each other in the X direction as they move away from the electrode-forming surface 531, as in this embodiment, without any special measures, the vicinity of these portions may protrude outward from the electric wire-forming surface 531 when viewed from the X direction, potentially causing interference with other components. Therefore, by forming the embedded member 4 to be located inside the outer periphery of the electrode-forming surface 531 when viewed from the X direction as in this embodiment, even when the four electric wires 30 are formed with portions that become more distant from each other as they move away from the electrode-forming surface 531 in the X direction, it is possible to prevent the embedded member 4 from protruding outward from the electrode-forming surface 531 when viewed from the X direction, and thereby prevent interference between the cable 3 and other components.

[0063] Furthermore, the core wire of each of the four electric wires 30 is a twisted wire. This effectively improves the productivity of the cable connection structure 1. That is, when the four electric wires 30 are configured, as in this embodiment, to have portions inside the embedded member 4 that become increasingly separated from each other the farther they are from the electrode formation surface 531 in the X direction, it tends to be difficult to align the tip of each electric wire 30 with the electrode 532. However, by configuring the core wires of the four electric wires 30 from highly flexible twisted wires, it becomes easier to align the tip of each electric wire 30 with the electrode 532.

[0064] As described above, according to this embodiment, it is possible to provide a cable connection structure that can easily prevent air bubbles from being formed in the embedded member.

[0065] [Second embodiment] 17 is an enlarged plan view of the vicinity of the connection portion between the cable 3 and the imaging device 5 in the cable connection structure 1 in this embodiment. In this embodiment, the core wires of the four electric wires 30 are all made of a single wire. That is, in this embodiment, the inner conductors 311 of the three coaxial wires 31 and the one drain wire 32, which serve as core wires, are each made of a single wire.

[0066] Other configurations of this embodiment are the same as those of the first embodiment. It should be noted that, among the symbols used in the second and subsequent embodiments, the same symbols as those used in the previously described embodiments represent the same components, etc. as those in the previously described embodiments, unless otherwise specified.

[0067] (Functions and Effects of the Second Embodiment) In this embodiment, the core wire of each of the four electric wires 30 is a solid wire. Therefore, the portion of the core wire from the bent portion 35 toward the electrode 532 can be easily maintained straight, which makes it easier to align the multiple electric wires 30 with the electrode 532. Furthermore, the embedded member 4 is disposed around the core wires, and because the core wire is made of a single wire, it is possible to prevent minute irregularities from being formed around the core wire, and it is easy to prevent air bubbles from remaining in the embedded member 4. In addition, this embodiment also has the same functions and effects as the first embodiment.

[0068] (Summary of the embodiment) Next, the technical ideas grasped from the above-described embodiments will be described by using the reference numerals and the like in the embodiments. However, the reference numerals and the like in the following description do not limit the components in the claims to the members and the like specifically shown in the embodiments.

[0069] [1] An electronic component (2) having a plurality of electrodes (532) on an electrode forming surface (531); a plurality of solders (6) provided on the electrode surfaces (532s) of the plurality of electrodes (532); a cable (3) having a plurality of electric wires (30) connected to the plurality of solders (6); and an embedding member (4) formed by hardening a molten resin filled around the plurality of solders (6) and the plurality of electric wires (30), for embedding the plurality of solders (6) and the plurality of electric wires (30), wherein an eccentric boundary portion (8) exists at a boundary portion (8) between the solders (6) and the plurality of electric wires (30) that is eccentric with respect to the electrode surface (532s) when viewed from a normal direction (X) of the electrode forming surface (531), and the eccentric boundary portion (8) exists at a boundary portion (8) between the solders (6) and the plurality of electric wires (30). a cable connection structure (1) in which the eccentric boundary portion (8) is eccentric with respect to the electrode surface (532s) on a side farther from at least one other boundary portion (8); when the direction in which the center (C1) of the eccentric boundary portion (8) and the center (C2) of the electrode surface (532s) are aligned when viewed from the normal direction (X) is defined as an alignment direction, one side of the alignment direction on which the eccentric boundary portion (8) is eccentric with respect to the electrode surface (532s) is defined as an eccentric side, and the side opposite to the eccentric side is defined as an anti-eccentric side, the width (W1) of the solder (6) constituting the eccentric boundary portion (8) in the alignment direction at a portion on the anti-eccentric side from the eccentric boundary portion (8) is greater than a width (W2) of the portion on the eccentric side from the eccentric boundary portion (8) in the alignment direction.

[0070] [2] The cable connection structure (1) described in [1], wherein in a cross section passing through the center (C1) of the eccentric boundary portion (8) and the center (C2) of the electrode surface (532s) and parallel to the normal direction (X), an angle (θ1) formed between a surface (61) of the solder (6) located on the anti-eccentric side of the eccentric boundary portion (8) and the arrangement direction is smaller than an angle (θ2) formed between a surface (62) of the solder (6) located on the eccentric side of the eccentric boundary portion (8) and the arrangement direction.

[0071] [3] The cable connection structure (1) described in [1] or [2], wherein the electric wire (30) constituting the eccentric boundary portion (8) is a separated electric wire (300) having a separation region (33) inside the embedded member (4) that is inclined toward the eccentric side as it moves away from the electrode forming surface (531) in the normal direction (X).

[0072] [4] The cable connection structure (1) according to [3], wherein the angle (β) between the separation region (33) and the normal direction (X) is 10° or more and 45° or less.

[0073] [5] The cable connection structure (1) described in [3] or [4], wherein the separated electric wire (300) has an approach region (34) that extends from the separated region (33) toward the opposite side of the electrode forming surface (531) in the normal direction (X) toward the anti-eccentric side, and the angle (α) between the longitudinal direction of the separated region (33) and the longitudinal direction of the approach region (34) is 3° or more and 15° or less.

[0074] [6] A cable connection structure (1) described in any one of [3] to [5], wherein a bent portion (35) is formed in the exposed core wire of the separation wire (300), and the portion of the core wire from the bent portion (35) to the electrode (532) constitutes the separation region (33).

[0075] [7] The plurality of electrodes (532) includes three or more electrodes (532) arranged side by side on an imaginary circle (C), and the plurality of electric wires (30) includes three or more electric wires (30) connected to the three or more electrodes (532). 、3 More than The solder ( 6 The cable connection structure (1) according to any one of [1] to [6], wherein each of three or more boundaries (8) between the electrode surface (532s) and the three or more electric wires (30) constitutes the eccentric boundary portion (8), and the eccentric boundary portion (8) is eccentric radially outward of the imaginary circle (C) relative to the electrode surface (532s).

[0076] [8] The cable connection structure (1) described in any one of [1] to [7], wherein the electronic component (2) is an imaging device (5) equipped with an endoscopic imaging element (53), and the diameter of each core wire in the plurality of electric wires (30) is 0.1 mm or less.

[0077] Although the embodiments of the present invention have been described above, the invention according to the claims is not limited to the above-described embodiments. It should be noted that not all of the combinations of features described in the embodiments are necessarily essential to the means for solving the problems of the invention. Furthermore, the present invention can be appropriately modified and implemented within the scope of its spirit.

[0078] For example, in each embodiment, four electrodes are formed on the electrode forming surface, but depending on the specifications of the endoscope device, this can be, for example, two, three, five or more, and correspondingly, the number of electric wires can also be two, three, five or more.

[0079] In each embodiment, all four boundaries are eccentric boundaries, but this is not limiting, and it is sufficient that there is at least one eccentric boundary. In each embodiment, the eccentric boundary is eccentric to the electrode surface away from all other boundaries, but this is not limiting, and it is sufficient that the eccentric boundary is eccentric to the electrode surface away from at least one other boundary.

[0080] In each embodiment, all four electric wires are spaced apart within the embedded member, with portions of the wires that become increasingly spaced apart in the direction normal to the electrode-forming surface as they move away from the electrode-forming surface. However, this is not limited to this, and it is sufficient that there are at least two spaced apart electric wires. If there are at least two spaced apart electric wires, it is possible to widen the area between the spaced apart electric wires within the embedded member, and to prevent air bubbles from forming within the embedded member.

[0081] In each embodiment, a separated region and a close region are formed in the region of the separated electric wire exposed from the outer sheath, but it is sufficient if a separated region is formed in multiple electric wires, and for example, the close regions of four electric wires in each embodiment may be formed parallel to each other. Also, all of the portions of the four electric wires protruding from the outer sheath may be separated regions.

[0082] In each of the embodiments, the embedded member is formed from the electrode-forming surface to the tip end surface of the outer cover, but this is not limited thereto. For example, in each of the embodiments, the edge of the embedded member on the outer cover side may be located away from the tip end surface of the outer cover toward the electrode-forming surface. [Explanation of symbols]

[0083] 1... Cable connection structure 2... Electronic component 3...Cable 30...Electric wire 300...Separated electric wire 33...Separated area 34...Approach area 35...Bending part 4...Buried member 5...Imaging device 53...imaging element 531...electrode formation surface 532...electrode 532s...electrode surface 6...Solder 8...Boundary, eccentric boundary C: Virtual circle C1: Center of eccentric boundary C2: Center of electrode surface X: Normal direction of electrode surface

Claims

1. an electronic component having a plurality of electrodes on an electrode formation surface; a plurality of solders provided on the electrode surfaces of the plurality of electrodes; a cable having a plurality of electric wires connected to the plurality of solders, respectively; an embedding member formed by hardening a molten resin filled around the plurality of solders and the plurality of electric wires, and for embedding the plurality of solders and the plurality of electric wires; a tip of each of the plurality of electric wires faces the electrode surface of a connection target; an eccentric boundary portion exists at the boundary between the solder and the electric wire, the eccentric boundary portion being eccentric with respect to the electrode surface when viewed from the normal direction of the electrode formation surface, the eccentric boundary portion is eccentric with respect to the electrode surface on a side farther from at least one other boundary portion, When viewed from the normal direction, the direction in which the center of the eccentric boundary portion and the center of the electrode surface are aligned is defined as an alignment direction, one side of the alignment direction where the eccentric boundary portion is eccentric with respect to the electrode surface is defined as an eccentric side, and the side opposite to the eccentric side is defined as an anti-eccentric side, the width of the solder constituting the eccentric boundary portion from the anti-eccentric side in the alignment direction is larger than the width of the solder from the eccentric boundary portion in the alignment direction, Each of a plurality of boundaries between the plurality of solders and the plurality of electric wires constitutes the eccentric boundary. Cable connection structure.

2. In a cross section passing through the center of the eccentric boundary and the center of the electrode surface and parallel to the normal direction, an angle formed between the surface of the solder located on the anti-eccentric side of the eccentric boundary and the arrangement direction is smaller than an angle formed between the surface of the solder located on the eccentric side of the eccentric boundary and the arrangement direction. The cable connection structure according to claim 1 .

3. the electric wire constituting the eccentric boundary portion is a separated electric wire having a separated region inside the embedded member that is inclined toward the eccentric side as it becomes farther away from the electrode formation surface in the normal direction. The cable connection structure according to claim 1 or 2.

4. an angle between the separation region and the normal direction is 10° or more and 45° or less; The cable connection structure according to claim 3 .

5. the separating wire has an approaching region that approaches the anti-eccentric side as it moves from the separating region toward the side opposite to the electrode forming surface side in the normal direction, The angle between the longitudinal direction of the separation region and the longitudinal direction of the approach region is equal to or greater than 3° and equal to or less than 15°. The cable connection structure according to claim 3 or 4.

6. a bent portion is formed in the exposed core wire of the separation wire, a portion of the core wire extending from the bent portion toward the electrode constitutes the separation region; The cable connection structure according to any one of claims 3 to 5.

7. the plurality of electrodes includes three or more electrodes arranged side by side on an imaginary circle; the plurality of electric wires includes three or more electric wires connected to the three or more electrodes, three or more boundaries between three or more of the solders and the three or more of the electric wires respectively constitute the eccentric boundary portions, the eccentric boundary portion is eccentric to the electrode surface radially outward of the imaginary circle. The cable connection structure according to any one of claims 1 to 6.

8. the electronic component is an imaging device including an imaging element of an endoscope, The diameter of each core wire in the plurality of electric wires is 0.1 mm or less. The cable connection structure according to any one of claims 1 to 7.

9. The plurality of electrodes are formed on the imaging element. The cable connection structure according to claim 8 .

10. When viewed from the normal direction, the embedded member is located at the same position as the outer periphery of the electrode formation surface or inside the outer periphery. The cable connection structure according to any one of claims 1 to 9.

Images