Sensor Module

Abstract

To provide a small-sized sensor module that has a shape suitable for being housed in an electronic device.SOLUTION: A sensor module is a sensor module 508 having a base member 503 and a sensor 501, the base member 503 is an injection molded component on which pattern wiring 500 is directly formed, the base member 503 includes at least a principal surface 503Y, a first side wall 503P orthogonal to the principal surface 503Y, and a second side wall 503R orthogonal to the principal surface 503Y and the first side wall 503P, and a larger width W of a width of the first side wall 503P and a width of the second side wall 503R in a first direction Y perpendicular to the principal surface 503Y is greater than a width Z of the principal surface 503Y in the first direction Y.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a sensor module, and more particularly to a sensor module using MID technology. [Background technology]

[0002] BACKGROUND ART In recent years, electronic devices such as cameras and smartphones, and transportation devices such as automobiles, have incorporated modularized sensor modules equipped with various sensors.

[0003] As such a sensor module, one that applies MID technology is known.

[0004] MID technology involves irradiating a base material with a laser at required locations, forming a metal plating film only on the irradiated areas. The metal plating film forms the conductive pattern.

[0005] For example, Patent Document 1 discloses an MID package having a gyro element mounted on each of three inclined surfaces of a body having a substantially triangular pyramid shape in which a first pyramidal surface, a second pyramidal surface, and a third pyramidal surface are perpendicular to each other. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-44645 Summary of the Invention [Problem to be solved by the invention]

[0007] In recent years, there has been an increasing demand for smaller electronic devices, and along with this, there is a demand for small sensor modules that can be easily accommodated in the miniaturized electronic devices.

[0008] In the conventional techniques disclosed in the above-mentioned patent documents, the dimensions of the MID package are large in length, width and thickness, which hinders miniaturization of the device.

[0009] Furthermore, when the MID package is housed in an electronic device, the triangular pyramid shape is not desirable because it tends to create dead space inside the device.

[0010] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a small sensor module that has a shape suitable for being housed in an electronic device. [Means for solving the problem]

[0011] Base material and sensor and connector A sensor module having: the base member is a molded part on which a pattern wiring is directly formed, The base member is first surface and a second surface formed on the opposite side of the base member from the side on which the first surface is located. and the above first a first side wall perpendicular to the surface; first a second side wall perpendicular to the surface and the first side wall; and a third side wall opposite to the first side wall. It is equipped with the sensor includes at least a first sensor, a second sensor, and a third sensor that detect a physical quantity; The first sensor first Surface mounted, the second sensor is mounted to the first sidewall; the third sensor is mounted to the second sidewall; the connector is mounted on the second surface; the first sensor and the connector do not protrude beyond at least one of the first side wall, the second side wall, and the third side wall in a first direction perpendicular to the first surface; the second sensor and the third sensor are rectangular having short sides and long sides when viewed in a direction perpendicular to a surface on which they are mounted, the second sensor and the third sensor are mounted so that the short sides thereof are parallel to the first direction; each of the first side wall and the second side wall has a short side and a long side when viewed in a direction perpendicular to a surface on which the second sensor and the third sensor are mounted, The second sensor and the third sensor are mounted so that the short side direction of the second sensor and the short side direction of the first side wall and the second side wall are parallel to each other. A sensor module characterized by: [Effects of the Invention]

[0012] According to the present invention, it is possible to provide a small sensor module with a shape suitable for being housed in an electronic device. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a block diagram showing the configuration of a camera according to a first embodiment of the present invention; [Figure 2] 1 is a perspective view of the appearance of a camera according to a first embodiment of the present invention; [Figure 3] 1 is an exploded perspective view of a camera according to a first embodiment of the present invention; [Figure 4] FIG. 1 is a perspective view showing the internal structure of a top cover unit according to a first embodiment of the present invention; [Figure 5] 1A and 1B are an exploded perspective view and a side view of a shake detection unit according to a first embodiment of the present invention; [Figure 6] 1A and 1B are a perspective view and a cross-sectional view of a main part of a sensor module according to a first embodiment of the present invention, a plan view of a land shape, a perspective cross-sectional view of a via part, and an enlarged cross-sectional view of a via part. [Figure 7] 1 is a side view of a sensor module according to a first embodiment of the present invention; [Figure 8] 1 is a perspective view of the appearance of a sensor module according to a second embodiment of the present invention, and a cross-sectional view of a main part thereof; [Figure 9] 10A and 10B are an external perspective view and a cross-sectional view of a main part of a sensor module according to a third embodiment of the present invention; [Figure 10] 10A and 10B are an external perspective view and an exploded perspective view of a smartphone according to a fourth embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0014] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0015] MID (Molded Interconnect Device) refers to an injection-molded resin part with wiring and electrodes directly formed on it. [Example]

[0016] A first embodiment of the present invention will be described below with reference to FIGS.

[0017] (Block diagram showing an example configuration of a digital camera 100) 1 is a block diagram showing an example of the configuration of a digital camera (hereinafter referred to as camera) 100 according to this embodiment. The camera 100 is an interchangeable lens camera to which a lens unit 200 can be attached or detached.

[0018] FIG. 2 is a perspective view of the appearance of the camera 100. As shown in FIG.

[0019] The lens unit 200 shown in FIG. 1 is fixed to the camera 100 by a lens mount 201 provided on the lens unit 200 and a lens mount 101 provided on the camera 100 .

[0020] The lens unit 200 and the camera 100 are configured to be able to communicate with each other via a connector 202 provided on the lens unit 200 and a connector 102 provided on the camera 100 .

[0021] Specifically, the system control unit 307 and the lens drive control unit 203 communicate with each other, and based on a signal from the system control unit 307, the lens drive control unit 203 controls the lens drive unit 204, and the lens drive unit 204 drives the aperture 211 and the lens 210.

[0022] The lens 210 is used to form an optical image from a subject onto the image sensor 302 .

[0023] The shutter 301 is disposed between the image sensor 302 and the lens 210, and blocks light from the lens 210 to the image sensor 302 when not capturing an image.

[0024] During photography, the shutter 301 opens under the control of the system control unit 307 to allow an optical image formed by the lens 210 onto the image sensor 302 .

[0025] The image sensor 302 is an image sensor that is configured with a CCD, CMOS, or the like, and converts an optical image into an electrical signal.

[0026] The A / D converter 304 converts the analog signal into a digital signal. The A / D converter 304 is used to convert the analog signal output from the image sensor 302 into a digital signal.

[0027] The image processing unit 305 performs predetermined pixel interpolation, resizing such as reduction, and color conversion processing on the data from the A / D converter 304 or the data from the memory control unit 306 .

[0028] Furthermore, the image processing unit 305 performs predetermined calculation processing using the captured image data, and the system control unit 307 performs exposure control and distance measurement control based on the obtained calculation results.

[0029] This allows TTL (through-the-lens) AF (autofocus), AE (auto-exposure), and EF (pre-flash) processing to be performed.

[0030] The image processing unit 305 also performs predetermined calculation processing using the captured image data, and also performs TTL type AWB (auto white balance) processing based on the obtained calculation results.

[0031] The output data from the A / D converter 304 is written into a memory 308 via an image processing unit 305 and a memory control unit 306 , or directly via the memory control unit 306 .

[0032] The memory 308 stores image data converted into digital data by the A / D converter 304 for display on the display unit 105 or the display unit 106 .

[0033] The memory 308 also serves as a memory for displaying images (video memory).

[0034] The D / A converter 309 converts the image display data stored in the memory 308 into an analog signal and supplies it to the display unit 105 or the display unit 106 .

[0035] In this way, the image data for display written in the memory 308 is displayed on the display unit 105 or 106 via the D / A converter 309 .

[0036] The display unit 105 and the display unit 106 display, on a display device such as an LCD, an analog signal from the D / A converter 309 .

[0037] The digital signal that has been A / D converted once by the A / D converter 304 and stored in the memory 308 is converted to analog by the D / A converter 309 .

[0038] Then, by sequentially transferring and displaying the images on the display unit 105 or the display unit 106, a through image display (live view display) can be performed.

[0039] The nonvolatile memory 310 is a memory serving as an electrically erasable and recordable recording medium, and may be, for example, an EEPROM.

[0040] The nonvolatile memory 310 stores constants, programs, etc. for the operation of the system control unit 307.

[0041] The system control unit 307 is a control unit that has at least one processor, and controls the entire camera 100 and the lens unit 200 .

[0042] A RAM is used for the system memory 311. In the system memory 311, constants and variables for the operation of the system control unit 307, programs read from the nonvolatile memory 310, and the like are developed.

[0043] The system control unit 307 also controls the memory 308, the D / A converter 309, the display units 105 and 106, and so on, thereby performing display control.

[0044] The system timer 312 is a timekeeping unit that measures the time used for various controls and the time of a built-in clock.

[0045] The first shutter switch 104a is turned on when the shutter button 104 provided on the camera 100 is pressed halfway (a shooting preparation instruction) during operation, and generates a first shutter switch signal SW1.

[0046] The first shutter switch signal SW1 starts operations such as AF (autofocus) processing, AE (auto exposure) processing, AWB (auto white balance) processing, and EF (pre-flash) processing.

[0047] The second shutter switch 104b is turned on when the shutter button 104 is fully pressed (a photographing instruction) and generates a second shutter switch signal SW2.

[0048] The system control unit 307 drives the shutter blades 301a of the shutter 301 using the second shutter switch signal SW2.

[0049] Then, a series of operations for image capture processing, from reading out signals from the image sensor 302 to writing image data to the recording medium 330, is started.

[0050] The shutter blades 301a move at high speed inside the shutter 301 in a direction perpendicular to the optical axis of the lens 210, and stop moving instantly when they collide with a stopper member (not shown) inside the shutter 301.

[0051] By selecting and operating various function icons displayed on the display units 105 and 106, the various operation members of the operation unit 108 are assigned appropriate functions for each situation, and act as various function buttons.

[0052] The function buttons include, for example, an end button, a back button, an image forward button, a jump button, a narrow down button, an attribute change button, and the like.

[0053] For example, when the menu button is pressed, a menu screen in which various settings can be made is displayed on the display unit 105 or the display unit 106.

[0054] The power supply is turned on / off by a power switch 103 .

[0055] The power supply control unit 313 is configured with a battery detection circuit, a DC-DC converter, a switch circuit for switching between blocks to be energized, and the like, and detects whether a battery is installed, the type, and the remaining capacity.

[0056] Furthermore, the power supply control unit 313 controls the DC-DC converter based on the detection result and instructions from the system control unit 307, and supplies the necessary voltage to each unit including the recording medium 330 for the necessary period.

[0057] The power supply unit 314 is made up of a primary battery such as an alkaline battery or a lithium battery, a secondary battery such as an NiCd battery, an NiMH battery, or a Li battery, an AC adapter, or the like.

[0058] The recording medium I / F 315 is an interface with a recording medium 330 such as a memory card or a hard disk.

[0059] The recording medium 330 is a recording medium such as a memory card for recording captured images, and is composed of a semiconductor memory, an optical disk, a magnetic disk, or the like.

[0060] The communication unit 316 is connected wirelessly or via a wired cable, and transmits and receives video signals, audio signals, and the like.

[0061] The communication unit 316 can also be connected to a wireless LAN (Local Area Network) and the Internet.

[0062] The communication unit 316 can transmit images (including through images) captured by the image sensor 302 and images recorded on the recording medium 330, and can also receive image data and various other information from external devices.

[0063] (Shake detection unit 320 / gyro sensor) The shake detection unit 320 is, for example, a gyro sensor, and detects the amount of vibration of the camera.

[0064] The shake detection unit 320 detects the vibration and vibration amount in three axial directions of the camera 100: pitch direction, yaw direction, and roll direction.

[0065] In the camera 100 shown in FIG. 1, the image sensor driver 303 controls the movement of the image sensor 302 in accordance with the amount of shake detected by the shake detector 320, thereby performing optical shake correction.

[0066] Furthermore, the image processing unit 305 performs electronic shake correction on the image in accordance with the amount of shake detected by the shake detection unit 320 under the control of the system control unit 307 .

[0067] (An exploded perspective view of the camera 100) FIG. 3 is an exploded perspective view of the camera 100 with the front, rear, and lower cover members removed.

[0068] The base plate 120 is a structure that provides the strength of the camera 100, and a shutter 301, an image sensor 302, an image sensor drive unit 303, and a system control unit 307 are fastened to the base plate 120 with screws (not shown).

[0069] The top cover unit 110 is fastened to the base plate 120 with screws (not shown).

[0070] (Perspective view of the appearance of the top cover unit 110) FIG. 4(a) is an external perspective view of the top cover unit 110, and FIG. 4(b) is an exploded perspective view of the top cover unit 110. As shown in FIG.

[0071] The top cover unit 110 is made up of a top cover member 111 that covers the top surface of the camera 100, a power switch 103, a shutter button 104, and the like.

[0072] As shown in FIG. 4( b ), the shake detection unit 320 is fastened to the center of the top cover member 111 with a screw 401 .

[0073] (Exploded perspective view of the shake detection unit 320) FIG. 5( a ) is an exploded perspective view of the shake detection unit 320 , and FIGS. 5( b ) and 5 ( c ) are perspective views of the appearance of the shake detection unit 320 .

[0074] The shake detection unit 320 is composed of plates 505 and 506, a buffer member 504, a sensor module 508, and a flexible substrate 502F.

[0075] The sensor module 508 has gyro sensors 501P, 501R, and 501Y for measuring angular velocity, and an acceleration sensor 502A for detecting acceleration.

[0076] The sensor module 508 further includes three gyro sensors 501P, 501R, and 501Y and a passive element 502R (see FIG. 6) such as a resistor or a capacitor for driving the acceleration sensor 502A.

[0077] Flexible substrate 502F has terminal portion 502D and terminal portion 502E.

[0078] The terminal portion 502D is connected to a connector 502C (see FIG. 6) that the sensor module 508 has.

[0079] Terminal section 502E is electrically connected to a connector (not shown) that forms part of the path to system control section 307.

[0080] This allows the sensor module 508 and the system control unit 307 to perform various necessary communications via the flexible substrate 502F.

[0081] Through this communication, the system control unit 307 can acquire the detection values ​​detected by the gyro sensors 501P, 501R, and 501Y and the acceleration sensor 502A.

[0082] The buffer member 504 is made of an elastic material such as sponge that absorbs vibrations.

[0083] The shake detection unit 320 has two buffer members 504 .

[0084] The two buffer members 504 are arranged on different surfaces facing the sensor module 508, and are arranged to sandwich the sensor module 508 therebetween.

[0085] In this embodiment, the gyro sensor 501Y is disposed on a surface that is approximately parallel to the main surface 503Y, which is the surface on which the gyro sensor 501Y is disposed.

[0086] Plates 505 and 506 have surfaces that are approximately parallel to main surface 503Y, and plate 505 and plate 506 sandwich sensor module 508 and buffer member 504 therebetween.

[0087] Furthermore, one of the buffer members 504 is compressed by the plate 505 and the sensor module 508, and the other of the buffer members 504 is compressed by the plate 506 and the sensor module 508.

[0088] Therefore, the plates 505 and 506 are configured not to come into contact with the sensor module 508 .

[0089] The shake detection unit 320 is completed when the plate 505 and the plate 506 are fastened together with the screw 507 .

[0090] (Perspective view of the exterior of the sensor module 508) 6(a) and 6(b) are external perspective views of the sensor module 508, and FIG. 6(c) is a cross-sectional view of the main part of the sensor module 508.

[0091] Base member 503 shown in FIG. 6 is a member for holding gyro sensors 501P, 501R, and 501Y in predetermined positions, and is made of a material such as plastic or LCP (liquid crystal polymer).

[0092] The base member 503 has a first side wall 503P that is approximately perpendicular to the rotation axis in the pitch direction, a second side wall 503R that is approximately perpendicular to the rotation axis in the roll direction, and a main surface 503Y that is approximately perpendicular to the rotation axis in the yaw direction.

[0093] In other words, the first sidewall 503P is perpendicular to the main surface 503Y, and the second sidewall 503R is perpendicular to both the main surface 503Y and the first sidewall 503P.

[0094] The gyro sensor 501P is mounted on the first side wall 503P, the gyro sensor 501R is mounted on the second side wall 503R, and the gyro sensor 501Y is mounted on the main surface 503Y.

[0095] The gyro sensors 501P, 501R, and 501Y are directly mounted on the land portions of the pattern wiring 500 on the base member 503 by soldering.

[0096] The sensor module 508 is configured as described above.

[0097] Therefore, gyro sensor 501P detects vibrations and vibration amounts in the pitch direction of camera 100, gyro sensor 501R in the roll direction, and gyro sensor 501Y in the yaw direction.

[0098] The connector 502C is mounted on the surface of the main surface 503Y opposite to the surface on which the gyro sensor 501Y is mounted.

[0099] Here, the surface of the main surface 503Y on which the gyro sensor 501Y is mounted is called a first surface 509, and the surface of the main surface 503Y on which the connector 502C is mounted is called a second surface 510.

[0100] Additionally, acceleration sensor 502A is mounted on second side wall 503R.

[0101] As shown in FIGS. 6(a) and 6(b), a pattern wiring 500 is directly wired on a base member 503.

[0102] The pattern wiring 500 is formed by MID technology.

[0103] MID technology is a technology that forms patterns by irradiating a laser onto a specific location on a base material and then applying metal plating only to the laser-irradiated areas.

[0104] Gyro sensors 501P, 501R, and 501Y for detecting shake, acceleration sensor 502A, and various passive elements 502R for driving them will be described.

[0105] Gyroscopes 501P, 501R, and 501Y, acceleration sensor 502A, and passive element 502R are mounted directly on mounting lands provided by pattern wiring 500 on base member 503 by soldering or the like.

[0106] The pattern wiring 500 enables necessary electrical connections between the gyro sensors 501P, 501R, and 501Y, the acceleration sensor 502A, the passive element 502R, and the connector 502C.

[0107] FIG. 6C is a cross-sectional view of the main part of the sensor module 508.

[0108] Here, when the thickness of the main surface 503Y is Z and the shorter of the length of the first side wall 503P and the length of the second side wall 503R in the direction perpendicular to the main surface 503Y is W, W is greater than Z.

[0109] In addition, the height of the higher of the first side wall 503P and the second side wall 503R from the first surface 509 is defined as A, and the height of the higher of the first side wall 503P and the second side wall 503R from the second surface 510 is defined as B.

[0110] Also, the height from the first surface 509 to the top surface of the gyro sensor 501Y is defined as C, and the height from the second surface 510 to the top surface of the connector 502C is defined as D.

[0111] In this case, A is greater than or equal to C, and B is greater than or equal to D.

[0112] This embodiment is configured as described above.

[0113] Therefore, the gyro sensor 501Y and the connector 502C do not protrude beyond the higher of the first side wall 503P and the second side wall 503R in the direction perpendicular to the main surface 503Y.

[0114] Therefore, the height of the sensor module 508 in the direction perpendicular to the main surface 503Y can be reduced.

[0115] FIG. 6(d) shows an enlarged view of the land 522 formed on the first side wall 503P for mounting the gyro sensor 501P.

[0116] The gyro sensor 501P is mounted on the first side wall 503P with solder by reflow mounting.

[0117] In FIG. 6(d), G indicates the direction of gravity when cream solder is melted when the gyro sensor 501P is reflow-mounted on the first side wall 503P.

[0118] Moreover, H indicates a direction that is perpendicular to the direction of gravity and parallel to the first side wall 503P.

[0119] In the case of reflow mounting on a normal flat substrate, gravity always acts on the mounted components perpendicular to the surface on which the mounted components are mounted.

[0120] However, in the case of the shake detection unit 320 of this embodiment, gyro sensors 501P, 501R, and 501Y are mounted on three surfaces that are orthogonal to each other.

[0121] Therefore, gravity acts on at least one of the gyro sensors 501P, 501R, and 501Y in a direction parallel to the surface on which the sensor is mounted during reflow mounting.

[0122] In this embodiment, the gyro sensor 501P is mounted on the first side wall 503P in a state where gravity acts in the direction of the arrow G.

[0123] Therefore, when the solder melts, it may be affected by gravity in the direction of arrow G and may be displaced in the direction of arrow G from the desired mounting position.

[0124] Therefore, of the land arrays A and B, each consisting of five lands, the amount of solder applied to the lower land array B in FIG. 6(d) is made less than the amount of solder applied to the other land array A.

[0125] As a result, the surface tension of the solder applied to the land row A becomes greater than the surface tension of the solder applied to the land row B.

[0126] By doing so, the force acting on the gyro sensor 501P due to the surface tension of the solder is directed in the direction opposite to that of arrow G, thereby canceling out the gravity acting on the gyro sensor 501P in the direction of arrow G and preventing misalignment due to gravity during reflow mounting.

[0127] As shown in FIGS. 6(a) and 6(b), the base member 503 is provided with a plurality of vias 510 for electrically connecting one surface of the main surface 503Y to the other surface.

[0128] FIG. 6(e) is an enlarged perspective cross-sectional view of the base member 503 in the area where the via 510 is arranged, and FIG. 6(f) is an enlarged cross-sectional view of the base member 503 in the area where the via 510 is arranged.

[0129] The mold for molding the base member has a structure in which the main surface 503Y is the largest flat surface, and therefore productivity is improved if the mold is configured to punch in a direction perpendicular to the main surface 503Y.

[0130] Therefore, in this embodiment, the vias 510 are arranged only on the main surface 503Y, so that the direction of the holes 512 of the vias 510 coincides with the direction of removal from the mold, thereby simplifying the mold structure.

[0131] In this embodiment, as shown in FIGS. 6(e) and 6(f), the via 510 has a hole 512 shaped like two overlapping mortars, which is formed symmetrically with respect to the center in the thickness direction of the main surface 503Y.

[0132] The mortar has a shape in which the diameter is smallest at the center in the thickness direction of the main surface 503Y and the diameter increases with increasing distance from the center in the thickness direction.

[0133] If the diameter of the circle at via vertex 515 is via diameter 514 , hole 512 starts from via vertex 515 and increases in diameter at a constant via angle 513 until it opens to the surface of the base member and penetrates base member 511 .

[0134] On the inner wall of the hole 512, a pattern is directly wired by MID from one side to the other side of the main surface 503Y.

[0135] Therefore, the patterns to be wired on one surface and the other surface of the base member 511 are electrically connected through the vias 510 .

[0136] The reason why the hole 512 in this embodiment is not a simple cylindrical hole penetrating the main surface Y, but has the above-mentioned shape, is to make it easier to irradiate the laser onto the inner wall of the hole 512 for pattern formation.

[0137] (Side view of sensor module 508) 7A and 7B are side views of the sensor module 508, with FIG. 7A showing the first side wall 503P and FIG. 7B showing the second side wall 503R.

[0138] Here, the gyro sensors 501Y, 501R, and 501P of this embodiment are substantially rectangular when viewed from a direction perpendicular to the surface on which they are mounted.

[0139] Therefore, the gyro sensor 501R has a long side 501Ra and a short side 501Rb, and the gyro sensor 501P has a long side 501Pa and a short side 501Pb.

[0140] In this embodiment, the gyro sensor 501R and the gyro sensor 501P are attached to the base member 503 so that the short sides 501Rb and 501Pb are parallel to the direction orthogonal to the main surface 503Y.

[0141] Therefore, the height of the first side wall 503P and the second side wall 503R in the direction perpendicular to the main surface 503Y can be reduced.

[0142] The outline of this embodiment is shown below.

[0143] The sensor module 508 includes a base member 503 and a sensor 501 .

[0144] The base member 503 is an injection molded part on which the pattern wiring 500 is directly formed.

[0145] The base member 503 includes at least a main surface 503Y, a first side wall 503P perpendicular to the main surface 503Y, and a second side wall 503R perpendicular to the main surface 503Y and the first side wall 503P.

[0146] The main surface 503Y is the surface having the largest area among the main surface 503Y, the first side wall 503P, and the second side wall 503R.

[0147] The sensor 501 includes at least a first sensor 501Y, a second sensor 501P, and a third sensor 501R that detect three physical quantities that are orthogonal to each other.

[0148] The pattern wiring 500 is electrically connected to each of the first sensor 501Y, the second sensor 501P, and the third sensor 501R.

[0149] The first sensor 501Y is mounted on a land formed by the pattern wiring 500 on the main surface.

[0150] The second sensor 501P is mounted on a land formed by the pattern wiring 500 on the first sidewall.

[0151] The third sensor 501R is mounted on a land formed by the pattern wiring 500 on the second sidewall.

[0152] The larger of the widths of the first side wall 503P and the second side wall 503R in a first direction Y perpendicular to the main surface 503Y, namely, width W, is larger than width Z of the main surface 503Y in the first direction Y.

[0153] When viewed from directions R and P perpendicular to the surfaces on which the second sensor 501P and the third sensor 501R are mounted, the second sensor 501P and the third sensor 501R are rectangular having short and long sides.

[0154] The second sensor 501P and the third sensor 501R are characterized in that they are mounted in a direction perpendicular to the main surface 503Y so that their short sides are parallel to each other.

[0155] It is characterized in that it is electrically connected to other modules via a connector 502C mounted on the main surface 503Y.

[0156] A first sensor 501Y is mounted on one surface of the main surface 503Y.

[0157] A is the longer of the distance in the first direction from one surface to the upper surface of one surface of the first side wall 503P and the distance in the first direction from one surface to the upper surface of one surface of the second side wall 503R.

[0158] C is the distance in the first direction from one surface to the upper surface of the first sensor 501Y.

[0159] A is characterized by being equal to or larger than C.

[0160] In other words, the distance of A is greater than or equal to the distance of C.

[0161] A via 510 is formed in the main surface 503Y of the base member 503 to electrically connect one side of the main surface 503Y to the other side of the main surface 503Y.

[0162] The via 510 for electrically connecting one surface and the other surface of the first side wall 503P is not formed in the base member 503.

[0163] A via 510 for electrically connecting one surface and the other surface of the second side wall 503R is not formed in the base member 503.

[0164] The first sensor 501Y, the second sensor 501P, and the third sensor 501R are characterized by being gyro sensors.

[0165] The present invention is not limited to the configuration in which the three flat plates of the main surface 503Y, the first side wall 503P, and the second side wall 503R intersect at right angles.

[0166] For example, the base member 503 may have a main surface 503Y, a first side wall 503P that is not parallel to the main surface 503Y, and a second side wall 503R that is not parallel to the main surface 503Y and the first side wall 503P.

[0167] The angle formed between the inner wall of first side wall 503P and main surface 503Y may be an obtuse angle (greater than 90 degrees).

[0168] The angle formed between the inner wall of second side wall 503R and main surface 503Y may be an obtuse angle (greater than 90 degrees). [Example]

[0169] Next, a sensor module according to a second embodiment of the present invention will be described with reference to FIG.

[0170] In FIG. 8, pattern wiring and passive elements such as resistors and capacitors are omitted to simplify the drawing and make it easier to understand.

[0171] In the first example, an example in which electronic components are mounted on both sides of the main surface 503Y has been described, but in this embodiment, an example in which electronic components are mounted on only one side of the main surface 603Y will be described.

[0172] The only difference between the first and second embodiments is the sensor module, so in this embodiment, only the differences between the sensor module of the second embodiment and the sensor module of the first embodiment will be described.

[0173] (Perspective view of the sensor module 604) 8(a) and (b) are perspective views of a sensor module 604 according to a second embodiment of the present invention, and FIG. 8(c) is a cross-sectional view of a main part of the sensor module 604. In FIG.

[0174] The sensor module 604 has gyro sensors 601P, 601R, and 601Y mounted on a base member 603, the gyro sensors 601P, 601R, and 601Y mounted on a first side wall 603P, a second side wall 603R, and a main surface 603Y, respectively.

[0175] In the first embodiment, the connector 602C is mounted on the second surface 606, which is the surface opposite to the first surface 605, which is the surface of the main surface 603Y on which the gyro sensor 601Y is mounted.

[0176] On the other hand, in the second embodiment, it is mounted on the first surface 605 on which the gyro sensor 601Y is mounted.

[0177] Here, the greater of the height of the first side wall 603P and the height of the second side wall 603R from the first surface 605 is defined as A.

[0178] The height B is the greater of the height of the first side wall 603P and the height of the second side wall 603R from the second surface 606.

[0179] Furthermore, of all the components mounted on the first surface 605, in this embodiment, the height of the component that has the greatest height from the first surface 605 to the top surface of the mounted components is defined as C, which is the gyro sensor 601Y and the connector 602C.

[0180] In this case, A is greater than or equal to C and B is greater than or equal to 0.

[0181] This embodiment is configured as described above.

[0182] Therefore, the gyro sensor 601Y and the connector 602C do not protrude beyond the higher of the first side wall 603P and the second side wall 603R in the direction perpendicular to the main surface 603Y.

[0183] Therefore, the height of the sensor module 604 in the direction perpendicular to the main surface 603Y can be reduced.

[0184] The outline of this embodiment is shown below.

[0185] A first sensor 501Y is mounted on one surface of the main surface 503Y, and a connector 502C is mounted on the other surface opposite to the one surface of the main surface 503Y.

[0186] A is the longer of the distance in the first direction from one surface to the upper surface of one surface of the first side wall 503P and the distance in the first direction from one surface to the upper surface of one surface of the second side wall 503R.

[0187] B is the longer of the distance in the first direction from the other surface to the upper surface on the other surface side of the first side wall 503P and the distance in the first direction from the other surface to the upper surface on the other surface side of the second side wall 503R.

[0188] C is the distance in the first direction Y from one surface to the top surface of the first sensor 601Y.

[0189] D is the distance in the first direction Y from the other surface to the top surface of connector 502C.

[0190] A is characterized in that it is larger than or equal to C, and B is characterized in that it is larger than or equal to D. [Example]

[0191] Next, a sensor module according to a third embodiment of the present invention will be described with reference to FIG.

[0192] In FIG. 9, pattern wiring and passive elements such as resistors and capacitors are omitted to simplify the drawing and make it easier to understand.

[0193] In the first embodiment, the case where electronic components are mounted on both sides of the main surface 503Y has been described, and in the second embodiment, the case where electronic components are mounted on one side of the main surface 603Y has been described.

[0194] In this embodiment, an example will be described in which an electronic component having a large height in a direction perpendicular to the main surface 703Y is mounted on the second surface 707 opposite to the first surface 706, which is the surface of the main surface 703Y on which the gyro sensor 701Y is mounted.

[0195] The only difference between the first and third embodiments is the sensor module, so in this embodiment, only the differences between the sensor module of the third embodiment and the sensor module of the first embodiment will be described.

[0196] 9(a) and 9(b) are perspective views of a sensor module 704 according to a third embodiment of the present invention, and FIG. 9(c) is a cross-sectional view of a main part of the sensor module 704. In FIG.

[0197] In the sensor module 704, gyro sensors 701P, 701R, and 701Y are mounted on a first side wall 703P, a second side wall 703R, and a main surface 703Y, respectively, of a base member 703. In addition, in the first embodiment, the connector 502C is mounted on the second surface 707. On the other hand, in the third embodiment, the connector 702C, which is taller than the connector 502C, is mounted on the second surface 707.

[0198] Here, the area of ​​the main surface 703Y where components are mounted on the first surface 706 side is referred to as a first area 708, and the area of ​​the main surface 703Y where components are mounted on the second surface 707 side is referred to as a second area 705.

[0199] The main surface 703Y has a shape in which the first region 708 and the second region 705 are positioned at different positions in a direction perpendicular to the main surface 703Y.

[0200] More specifically, the greater of the height of the first side wall 703P and the height of the second side wall 703R from the second surface 707 of the first region 708 is A.

[0201] The greater of the height of the first side wall 703P and the height of the second side wall 703R from the second surface 707 of the second region 705 is defined as B. In this case, B is greater than A.

[0202] This embodiment is configured as described above.

[0203] Therefore, the gyro sensor 701Y and the connector 702C do not protrude beyond the higher of the first side wall 703P and the second side wall 703R in the direction perpendicular to the main surface 703Y.

[0204] Therefore, the height of the sensor module 704 in the direction perpendicular to the main surface 703Y can be reduced.

[0205] The outline of this embodiment is shown below.

[0206] A first sensor 601Y and a connector are mounted on one surface of the main surface 603Y.

[0207] A is the longer of the distance in the first direction from one surface to the upper surface of one surface of the first side wall 503P and the distance in the first direction from one surface to the upper surface of one surface of the second side wall 503R.

[0208] C is the greater of the distance in the first direction Y from one surface to the top surface of the first sensor 601Y and the distance in the first direction Y from one surface to the top surface of the connector.

[0209] A is characterized by being equal to or larger than C. [Example]

[0210] A fourth embodiment of the present invention will now be described with reference to FIG.

[0211] 10(a) and 10(b) are perspective views of the appearance of the smartphone 801, and FIG. 10(c) is an exploded perspective view of the smartphone 801. FIG.

[0212] The smartphone 801 has the sensor module 604 of the second embodiment mounted therein.

[0213] In the exploded perspective view of FIG. 10(c), internal components of the smartphone other than the sensor module 604 are omitted to simplify the drawing and make it easier to understand.

[0214] The exterior of the smartphone 801 is composed of a front case 805 , a frame 806 , and a rear case 807 .

[0215] The front case 805 has a first image capturing device 802, a first operation unit 803, and a monitor 804, the frame has a second operation unit 808, and the rear case has a second image capturing device 809 and a third image capturing device 810.

[0216] The sensor module 604 is supported by a support member (not shown) and is incorporated inside the smartphone 801.

[0217] In this embodiment, the sensor module 604 is disposed so that the main surface 603Y of the sensor module 604 and the front case 805 are parallel to each other.

[0218] Since the height of the sensor module 604 in the direction perpendicular to the main surface 603Y is small, the thickness of the smartphone 801, which is the dimension in the direction perpendicular to the main surface 603Y, can be reduced.

[0219] [Other Examples] Although the preferred embodiments of the present invention have been described above, the configuration of the present invention is not limited to those exemplified in the above embodiments.

[0220] The material, shape, size, form, number, location, etc. can be changed as appropriate within the scope of the present invention.

[0221] Furthermore, although the present invention has been described using the built-in camera of an electronic device and a smartphone as examples of these embodiments, it is applicable to various electronic devices such as personal computers, tablet terminals, game devices, drones, automobiles and their peripheral devices. [Explanation of symbols]

[0222] 500 patterns 501 Sensors 501Y First Sensor 501P Second Sensor 501R Third Sensor 503 Base material 503Y Main surface 503P First side wall 503R Second Side Wall 508 Sensor Module

Claims

1. A sensor module having a base member, a sensor, and a connector, the base member is a molded part on which a pattern wiring is directly formed, the base member includes a first surface, a second surface formed on the side of the base member opposite to the side on which the first surface is located, a first side wall perpendicular to the first surface, a second side wall perpendicular to the first surface and the first side wall, and a third side wall opposite to the first side wall; the sensor includes at least a first sensor, a second sensor, and a third sensor that detect a physical quantity; the first sensor is mounted on the first surface; the second sensor is mounted to the first sidewall; the third sensor is mounted to the second sidewall; the connector is mounted on the second surface; the first sensor and the connector do not protrude beyond at least one of the first side wall, the second side wall, and the third side wall in a first direction perpendicular to the first surface; the second sensor and the third sensor are rectangular having short sides and long sides when viewed in a direction perpendicular to a surface on which they are mounted, the second sensor and the third sensor are mounted so that the short sides thereof are parallel to the first direction; each of the first side wall and the second side wall has a short side and a long side when viewed in a direction perpendicular to a surface on which the second sensor and the third sensor are mounted, A sensor module characterized in that the second sensor and the third sensor are mounted so that the short side directions of the second sensor and the third sensor are parallel to the short side directions of the first side wall and the second side wall.

2. 2. The sensor module according to claim 1, wherein the first sensor, the second sensor, and the third sensor are electrically connected by the pattern wiring.

3. 3. The sensor module according to claim 1, wherein the sensor module is electrically connected to another module via a connector mounted on the second surface.

4. 4. The sensor module according to claim 1, further comprising a protrusion formed on a part of the base member so as to protrude from a corner where the first side wall on which the second sensor is mounted and the second side wall on which the third sensor is mounted intersect.

5. Let A be the larger of the distance in the first direction from the first surface to the upper surface of the first side wall on the first surface side and the distance in the first direction from the first surface to the upper surface of the second side wall on the first surface side, B be the larger of the distance in the first direction from the second surface to the upper surface of the first side wall on the second surface side and the distance in the first direction from the second surface to the upper surface of the second side wall on the second surface side, C be the distance in the first direction from the first surface to the upper surface of the first sensor, and D be the distance in the first direction from the second surface to the upper surface of the connector, 4. The sensor module according to claim 3, wherein A is equal to or larger than C, and B is equal to or larger than D.

6. 6. The sensor module according to claim 1, wherein a via is formed in the largest surface of the base member.

7. the second surface of the base member opposite the first surface has the largest area; a via is formed to electrically connect the first surface and the second surface; 6. The sensor module according to claim 1, wherein no vias are formed in the base member that forms the first side wall and the second side wall.

8. the first surface and the second surface of the base member have the largest area; a via is formed to electrically connect the first surface and the second surface; a via for electrically connecting one surface and the other surface of the first side wall is not formed in the base member; 6. The sensor module according to claim 1, wherein a via for electrically connecting one surface and the other surface of the second side wall is not formed in the base member.

9. 9. The sensor module according to claim 1, wherein the first sensor, the second sensor, and the third sensor are gyro sensors.

10. An electronic device incorporating the sensor module according to any one of claims 1 to 9.

11. a mounting surface of the first sensor on the first surface having a short side and a long side; the first surface and the second surface do not overlap in a direction perpendicular to the first surface, The sensor module according to claim 1 , wherein the first sensor and the connector overlap in a direction perpendicular to the first surface and parallel to a short side of the first sensor.

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