Product holding device, product holding method, and semiconductor device manufacturing device

Abstract

This product holding device comprises: a stage (32) on which a product is to be placed; and vibration elements (38) that apply ultrasonic vibrations to the product (100) placed on the stage (32), and causes falling foreign matter (110) to float at a location away from the surface of the product (100). In addition, the product holding device (30) further comprises: a transport mechanism (42) that transports the floating foreign matter (110) to a location that is outside the product (100) in a plan view; and a collection mechanism (50) that collects the transported foreign matter (110).

Description

[Technical Field]

[0001] This specification discloses a product holding device that places and holds a product on a stage, a product holding method, and a semiconductor device manufacturing apparatus that has the product holding device. [Background technology]

[0002] Precision equipment such as semiconductor devices require that foreign matter not adhere to the product during the manufacturing process or storage period. However, when a product undergoes a predetermined process for manufacturing, the tool used to perform the process moves, and as the tool moves, minute foreign matter can fall onto the product's surface and adhere to it. Furthermore, during temporary storage of the product, minute foreign matter floating in the storage space can fall onto the product's surface and adhere to it.

[0003] Therefore, technologies using ultrasonic waves have been proposed to remove foreign matter adhering to the surface of products. However, because a certain amount of force is required to separate and remove foreign matter once it has adhered to a product, even with ultrasonic waves, it is difficult to separate and remove the foreign matter from the product, and the foreign matter often remains on the product. Furthermore, conventional technologies require a dedicated process to remove the adhering foreign matter, which complicates the manufacturing process and increases the takt time.

[0004] Therefore, some have proposed techniques for preventing foreign matter from adhering to the surface of a product. For example, Patent Document 1 discloses a technique in which a collection electrode is disposed around a sample and a voltage of the same polarity as the voltage applied to the sample is applied to the collection electrode. This allows the collection electrode to capture most of the foreign matter, such as particles, that are attracted by the electric field. As a result, it is possible to prevent foreign matter from adhering to the surface of the sample to some extent. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-106374 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in Patent Document 1, the collection electrodes are arranged only around the periphery of the sample. Therefore, if the sample is large and the distance from the center of the sample to the collection electrodes is long, the collection electrodes cannot capture foreign matter that falls near the center of the sample. In other words, there has not been a technology in the past that can effectively prevent sedimentary foreign matter from adhering to the surface of a product.

[0007] Therefore, this specification discloses a product holding device, a product holding method, and a semiconductor device manufacturing device that can more reliably prevent sedimentary foreign matter from adhering to products. [Means for solving the problem]

[0008] The product holding device disclosed in this specification is characterized by comprising a stage on which a product is placed, and a vibration source that applies ultrasonic vibrations to the product placed on the stage, thereby levitating falling foreign objects at a position spaced apart from the surface of the product.

[0009] In this case, the product holding device may further include a transfer mechanism that transfers the floating foreign object to a position that is outside the product in a plan view.

[0010] The transfer mechanism may include at least one of a blower that pressurizes air and a suction device that sucks air.

[0011] The transfer mechanism may also include an ultrasonic sound source that outputs ultrasonic traveling waves in a direction substantially parallel to the surface of the product.

[0012] The transport mechanism may also include an ultrasonic sound source and a reflector arranged facing each other with the product in between, and the transport mechanism may form a standing wave acoustic field by ultrasonic waves formed between the ultrasonic sound source and the reflector, and transport the foreign matter within the standing wave acoustic field by moving a node of sound pressure.

[0013] The product holding device may further include a recovery mechanism that recovers the foreign matter that has been transferred to the outside of the product by the moving mechanism.

[0014] The recovery mechanism may include at least one of a suction device that sucks and recovers the foreign matter that has been transported to the outside of the product by the moving mechanism, an adhesive body that adhesively holds the foreign matter, and an electric dust collector that recovers the foreign matter by utilizing Coulomb force.

[0015] The product holding method disclosed in this specification is characterized by applying ultrasonic vibrations to a product placed on a stage, thereby levitating any falling foreign matter at a position spaced apart from the surface of the product.

[0016] The semiconductor device manufacturing apparatus disclosed in this specification is a semiconductor device manufacturing apparatus that manufactures semiconductor devices by mounting chips on substrates, and is characterized in that it is equipped with the above-mentioned product holding device, and holds at least one of the substrate and the chip as the product in the product holding device.

[0017] In this case, the semiconductor device manufacturing apparatus may further include a controller, and the controller may drive the vibration source intermittently in accordance with the progress of the mounting process of the chip.

[0018] In this case, the controller may temporarily suspend the driving of the vibration source at at least one of the timings of adjusting the position of the mounting head relative to the substrate, the timings immediately before and after the chip held by the mounting head lands on the substrate, and the timings of checking the positional accuracy of the mounted chip. [Effects of the Invention]

[0019] According to the technology disclosed in this specification, adhesion of sedimentary foreign matter to products can be more reliably prevented. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 2 is a schematic diagram showing the configuration of a manufacturing apparatus. [Figure 2] FIG. 2 is a schematic diagram of the surface and vicinity of the product. [Figure 3] 10A and 10B are diagrams illustrating other examples of the transfer mechanism and the recovery mechanism. [Figure 4] 10A and 10B are diagrams illustrating other examples of the transfer mechanism and the recovery mechanism. [Figure 5] 10A and 10B are diagrams illustrating other examples of the transfer mechanism and the recovery mechanism. [Figure 6] 1 is a flowchart showing a manufacturing flow of a semiconductor device. DETAILED DESCRIPTION OF THE INVENTION

[0021] The configuration of a manufacturing apparatus 10 having a holding device 30 will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing the configuration of the manufacturing apparatus 10. The manufacturing apparatus 10 manufactures a semiconductor device by mounting one or more chips 104 on a substrate 102. The manufacturing apparatus 10 has a bonding head 12, a holding device 30, and a controller 22 that controls the driving of these. The bonding head 12 and the holding device 30 are arranged in a closed space inside a chamber 18. The chamber 18 is provided with a fan filter unit (hereinafter referred to as "FFU") 20 to keep the air inside the chamber 18 clean. The FFU 20 is a unit that combines a fan that sends air into the chamber 18 and a filter that removes foreign matter from the air.

[0022] The bonding head 12 bonds the chip 104 to the substrate 102. In this bonding, electrodes on the bottom surface of the chip 104 are joined to electrodes on the top surface of the substrate 102, resulting in an electrical connection. In this example, the properties of metal atoms are utilized to bond the electrodes together at room temperature. However, it goes without saying that bonding is not limited to room temperature bonding, and other forms of bonding may also be used. For example, the chip 104 may be heated to weld the electrodes together.

[0023] The bonding head 12 moves horizontally and vertically. The bonding head 12 also has a bonding tool 14 that holds the chip 104 by suction. When bonding the chip 104 to a target surface, the chip 104 held by the bonding tool 14 is brought into contact with the substrate 102 and bonded at room temperature.

[0024] The bonding head 12 further has a positioning camera 16 for capturing an image of the substrate 102. A controller 22, which will be described later, identifies the position of the bonding head 12 relative to the substrate 102 based on the image captured by this positioning camera 16, and positions the bonding head 12.

[0025] The holding device 30 holds a product 100 in the middle of manufacture, specifically, a substrate 102. As described above, one or more chips 104 are bonded to the upper surface of the substrate 102. The holding device 30 has a stage 32. The substrate 102 is placed on the upper surface of this stage 32. The stage 32 also has a suction hole 34 formed therein that communicates with the upper surface. A suction pump 36 is connected to the suction hole 34, and when the suction pump 36 is driven, the substrate 102 is suction-held to the stage 32.

[0026] The holding device 30 of this example further includes a vibration element 38, a transfer mechanism 42, and a collection mechanism 50. The vibration element 38 functions as a vibration source that applies ultrasonic vibrations to the product 100 via the stage 32. A plurality of such vibration elements 38 are provided, for example, on the bottom surface of the stage 32. The plurality of vibration elements 38 may be driven simultaneously in synchronization with one another, or may be driven independently of one another. Each vibration element 38 is a vibration generating source that generates longitudinal vibrations upon receiving a drive signal, which is a voltage signal. The vibration element 38 includes, for example, lead zirconate titanate (commonly known as PZT) that vibrates upon receiving an AC voltage, and is a bolt-tightened Langevin type vibrator (commonly known as a BLT or BL vibrator) in which the PZT is sandwiched between metal blocks and tightened with screws (bolts) to apply pressure.

[0027] The transfer mechanism 42 transfers the foreign matter 110 floating above the product 100 to a position that is outside the product 100 in a plan view. The configuration of this transfer mechanism 42 is not particularly limited as long as it can transfer the foreign matter 110, but the transfer mechanism 42 in this example has a blower nozzle 44 that blows air in a direction approximately parallel to the surface of the product 100.

[0028] The recovery mechanism 50 recovers the foreign matter 110 that has been transferred to the outside of the product 100. The configuration of this recovery mechanism 50 is not particularly limited, but the recovery mechanism 50 in this example includes a suction nozzle 52 that sucks and recovers the foreign matter 110.

[0029] The controller 22 controls the operation of the manufacturing apparatus 10. Specifically, it controls the movement of the bonding head 12 to bond the chip 104 to the substrate 102. In parallel with this bonding process, it also drives the vibration element 38, the transport mechanism 42, and the collection mechanism 50 to prevent foreign matter 110 from adhering to the surface of the product 100, as will be described later. The controller 22 is physically a computer having a processor and a memory.

[0030] Next, the reason for providing the vibration element 38, the transfer mechanism 42, and the recovery mechanism 50 in the manufacturing apparatus 10 will be explained with reference to Fig. 2. Fig. 2 is a schematic diagram of the vicinity of the surface of the product 100.

[0031] The chamber 18 is provided with an FFU 20, which prevents large foreign objects from entering the chamber 18. However, it is difficult to prevent the entry of minute foreign objects 110, such as particles, and minute foreign objects 110 are present within the chamber 18. Furthermore, minute foreign objects 110 may be generated during operation of the bonding head 12, etc. Conventionally, such foreign objects 110 gradually settle over time and fall onto and adhere to the surfaces of the product 100, i.e., the substrate 102 and the chip 104. If such foreign objects 110 adhere to the surfaces of the product 100, such as the surfaces of the electrodes, the quality of the semiconductor device may deteriorate. In particular, when bonding electrodes of the chip 104 and electrodes of the substrate 102 at room temperature, the bonding quality may be significantly deteriorated if foreign objects 110 adhere to the respective electrodes.

[0032] Therefore, in this example, the vibration element 38 is provided to more reliably prevent the adhesion of such foreign matter 110. As described above, the vibration element 38 applies vertical ultrasonic vibrations to the product 100 via the stage 32. As a result, the surface of the product 100 is ultrasonically vibrated in the vertical direction, as shown in FIG. 2. Lightweight foreign matter 110 that has fallen is repelled by this ultrasonic vibration and moves to the upper side of the product 100. Furthermore, among the fallen foreign matter 110, those that have a certain weight are levitated on the surface of the product 100. As a result, the foreign matter 110 cannot adhere to the surface of the product 100, and the surface of the product 100 is kept clean.

[0033] To prevent a large amount of the levitated or ejected foreign matter 110 from remaining on the upper side of the product 100, the transfer mechanism 42 transfers the foreign matter 110 to a position outside the product 100 in a plan view. In this example, the transfer mechanism 42 is a blower nozzle 44. By driving the blower nozzle 44, an airflow is generated in a direction substantially parallel to the plane of the product 100, and the foreign matter 110 is transferred. Note that because the foreign matter 110 targeted in this example is small and lightweight, even a relatively small airflow can transfer the foreign matter 110. The transferred foreign matter 110 is collected by the collection mechanism 50. In this example, the collection mechanism 50 is a suction nozzle 52 that sucks air in a direction substantially parallel to the surface of the product 100. By sucking and collecting the foreign matter 110 into the suction nozzle 52, a large amount of foreign matter 110 is prevented from accumulating on the upper side of the product 100.

[0034] As is clear from the above explanation, according to this example, the foreign matter 110 is effectively prevented from adhering to the surface of the product 100. As a result, the quality of the product 100 can be maintained at a high level. Note that the configuration described above is just one example, and as long as the holding device 30 has the stage 32 on which the product 100 is placed and the vibration element 38 that applies ultrasonic vibrations to the surface of the product 100, other configurations may be changed.

[0035] For example, only one vibration element 38 may be provided instead of multiple vibration elements. Furthermore, the vibration element 38 may be provided elsewhere, such as inside or on the side of the stage 32, rather than on the bottom surface of the stage 32. Furthermore, the vibration element 38 may vibrate at multiple frequencies rather than a single frequency. For example, some of the multiple vibration elements 38 may vibrate at a first frequency, and the other vibration elements 38 may vibrate at a second frequency. Furthermore, the levels of ultrasonic vibration output by the multiple vibration elements 38 may be the same or different from each other. For example, the output level may be different for each vibration element 38 so that the approximate center of the product 100 vibrates at a stronger level than the peripheral edge.

[0036] The configurations of the transfer mechanism 42 and the collection mechanism 50 may also be modified as appropriate. For example, the blower nozzle 44 may not be provided, and only the suction nozzle 52 may be provided and used as both the transfer mechanism 42 and the collection mechanism 50. In other words, even if the blower nozzle 44 is not provided, if the suction nozzle 52 is provided, an airflow directed toward the suction nozzle 52 is formed, and this airflow transfers the foreign matter 110. Furthermore, the blower nozzle 44 does not need to be parallel to the surface of the product 100, and may be provided obliquely above the product 100, at an angle relative to the surface of the product 100, as shown in FIG. 3.

[0037] Furthermore, the transfer mechanism 42 may transfer the foreign matter 110 using sound waves instead of airflow. For example, as shown in Fig. 4, the transfer mechanism 42 may have an ultrasonic sound source 46 provided on the side of the product 100. In this case, the ultrasonic sound source 46 outputs a traveling sound wave that travels in a direction substantially parallel to the surface of the product 100. The sound wave transfers the foreign matter 110 in the traveling direction of the sound wave.

[0038] As another example, as shown in FIG. 5 , the transfer mechanism 42 may transfer the foreign matter 110 using a standing wave field. In this case, the transfer mechanism 42 includes an ultrasonic sound source 46 provided to the side of the product 100 and a reflector 48 provided on the opposite side of the product 100 from the ultrasonic sound source 46. Ultrasonic waves emitted from the ultrasonic sound source 46 are reflected by the reflector 48. As a result, a standing wave of ultrasonic waves is formed between the ultrasonic sound source 46 and the reflector 48. In this standing wave field, the foreign matter 110 is attracted to the node of the standing wave and levitates. In this state, changing the frequency of the ultrasonic sound source 46 changes the position of the node of the standing wave, allowing the foreign matter 110 to be transferred in the acoustic axis direction, i.e., in a direction substantially parallel to the surface of the product 100. Furthermore, by forming such a standing wave field, the falling foreign matter 110 can be more reliably captured, thereby more reliably preventing the foreign matter 110 from adhering to the surface of the product 100.

[0039] Furthermore, the collection mechanism 50 is not limited to the suction nozzle 52, and may be an adhesive body 54 as shown in FIG. 4. The adhesive body 54 has an adhesive layer on its surface that captures and holds the foreign matter 110. By arranging such an adhesive body 54 downstream in the transfer direction of the foreign matter 110, the foreign matter 110 transferred by the transfer mechanism 42 can be captured, and the foreign matter 110 can be prevented from scattering again into the chamber 18. In another embodiment, the collection mechanism 50 may be one that collects the foreign matter 110 by utilizing Coulomb force. For example, the collection mechanism 50 may be an electrostatic precipitator having a discharge electrode and a dust collection electrode disposed downstream in the transfer direction.

[0040] Incidentally, the above-described vibration element 38 may be driven continuously while the manufacturing apparatus 10 is in operation, or may be driven intermittently depending on the progress of the mounting process of the chip 104. By driving the vibration element 38 continuously, adhesion of the foreign matter 110 to the surface of the product 100 can be more reliably prevented.

[0041] As another embodiment, the vibration element 38 may be temporarily stopped during the positioning process for positioning the bonding head 12 relative to the substrate 102. This will be described in detail with reference to the flowchart of Fig. 6. Fig. 6 is a flowchart showing an example of a manufacturing process for a semiconductor device.

[0042] When manufacturing the product 100, i.e., a semiconductor device, first, the substrate 102 is set on the stage 32 (S10). This setting is usually performed by a dedicated substrate transport device. Once the substrate 102 is set, the controller 22 starts driving the vibration element 38, and starts applying ultrasonic vibrations to the substrate 102 (S12). This effectively prevents sedimentary foreign matter 110 from adhering to the product 100.

[0043] Next, the controller 22 moves the bonding head 12 to a chip supply source (not shown) (S14). The bonding head 12 receives a new chip 104 at the chip supply source (S16). Thereafter, the bonding head 12 moves to a position directly above the substrate 102 (S18). Thereafter, the controller 22 temporarily suspends driving of the vibration element 38 (S20) and then executes a positioning process for the bonding head 12 (S22 to S28).

[0044] That is, the controller 22 causes the positioning camera 16 to capture an image of the substrate 102 while the bonding head 12 is stationary directly above the substrate 102 (S22). Based on the obtained image, the controller 22 identifies the relative position of the bonding head 12 with respect to the substrate 102 (S24), and determines whether the positioning of the bonding head 12 is appropriate based on this relative position (S26). If the relative position is inappropriate, the controller 22 fine-tunes the position of the bonding head 12 (S28) and returns to step S22. If the relative position is appropriate (Yes in S26), the controller 22 resumes driving the vibration element 38 (S30).

[0045] In this way, by temporarily stopping the vibration element 38 during the positioning process (the period of steps S22 to S28), the positioning accuracy can be improved. Furthermore, during this positioning period, the bonding head 12 does not move, or if it does move, it moves slowly and for a short period of time. Therefore, during this positioning period, it can be said that foreign matter 110 is less likely to fly up and adhere to the surface of the product 100. Therefore, by temporarily stopping the driving of the vibration element 38 during the positioning period, the risk of foreign matter adhering to the product 100 can be reduced, and the positioning accuracy of the bonding head 12 can be improved.

[0046] Once the bonding head 12 has been positioned appropriately, the controller 22 drives the vibration element 38 and lowers the bonding head 12 to bring the chip 104 into contact with the substrate 102 (S32). Once the chip 104 has been bonded to the substrate 102 through this contact, the controller 22 raises the bonding head 12 (S34). The same process is then repeated until the required number of chips 104 have been bonded.

[0047] The above-described process flow is merely an example and may be modified as needed. For example, in the above example, the driving of the vibration element 38 is temporarily stopped during the positioning process of the bonding head 12. However, if movement of the product 100 is undesirable, the driving of the vibration element 38 may be temporarily stopped at another timing. For example, in FIG. 6, the step of bringing the chip 104 into contact with the substrate 102 is illustrated as a single step S32. However, in reality, to prevent collision between the chip 104 and the substrate 102, the bonding head 12 descends in two stages. That is, the bonding head 12 descends at high speed to a predetermined reference height where the chip 104 and the substrate 102 approach each other, and then, after reaching the reference height, descends at a low speed while checking whether the chip 104 has landed on the substrate 102. It is desirable for the product 100 to remain stationary during this period of descent while checking for landing (i.e., immediately before landing) and immediately after landing. Therefore, the driving of the vibration element 38 may be temporarily stopped during the periods immediately before and after the landing.

[0048] Furthermore, after bonding the chip 104 to the substrate 102, an inspection process may be performed to check the bonding accuracy. In such an inspection process, the position of the chip 104 relative to the substrate 102, etc. may be inspected. During this inspection, the driving of the vibration element 38 may also be temporarily stopped.

[0049] Furthermore, although the above description has been given using a manufacturing apparatus that bonds the chip 104 to the substrate 102 as an example, the above-described holding apparatus 30 is not limited to the above-described manufacturing apparatus 10 and may be incorporated into other apparatuses. For example, the holding apparatus 30 may be used as an apparatus that holds a glass substrate in the process of manufacturing a flat panel display. Furthermore, the holding apparatus 30 is not limited to the manufacturing apparatus 10 and may be incorporated into other apparatuses, such as an inspection apparatus that inspects the quality of products. Furthermore, the holding apparatus 30 may be used independently rather than incorporated into other apparatuses. For example, the holding apparatus 30 may be used independently to temporarily store a product. Furthermore, the product held by the holding apparatus 30 is not particularly limited and may be a product other than a semiconductor device or a flat panel display. [Explanation of symbols]

[0050] 10 manufacturing equipment, 12 bonding head, 14 bonding tool, 16 positioning camera, 18 chamber, 22 controller, 30 holding device, 32 stage, 34 suction hole, 36 suction pump, 38 vibration element, 42 transfer mechanism, 44 blower nozzle, 46 ultrasonic sound source, 48 reflector, 50 recovery mechanism, 52 suction nozzle, 54 adhesive body, 100 product, 102 substrate, 104 chip, 110 foreign matter.

Claims

1. a stage on which a substrate is placed; a bonding head that moves relative to the stage and mounts a chip on the substrate placed on the stage; a vibration source that applies ultrasonic vibration to the substrate placed on the stage at least when the bonding head moves relative to the stage, thereby levitating any falling foreign matter at a position spaced apart from the surface of the substrate; A semiconductor device manufacturing apparatus comprising:

2. a stage on which a substrate is placed; a bonding head that moves relative to the stage and mounts a chip on the substrate placed on the stage; a vibration source that applies ultrasonic vibration to the substrate placed on the stage to levitate falling foreign matter at a position spaced apart from the surface of the substrate; a controller that activates the vibration source so as to levitate the falling foreign matter during the mounting process of the chip by the bonding head; A semiconductor device manufacturing apparatus comprising:

3. 3. The semiconductor device manufacturing apparatus according to claim 1, further comprising: A semiconductor device manufacturing apparatus comprising: a transfer mechanism that transfers the floating foreign matter to a position that is outside the substrate in a plan view.

4. 4. The semiconductor device manufacturing apparatus according to claim 3, The semiconductor device manufacturing apparatus is characterized in that the transfer mechanism includes at least one of a blower that pressurizes air and a suction machine that sucks air.

5. 4. The semiconductor device manufacturing apparatus according to claim 3, The semiconductor device manufacturing apparatus is characterized in that the transfer mechanism includes an ultrasonic sound source that outputs a traveling wave of ultrasonic waves in a direction substantially parallel to the surface of the substrate.

6. 4. The semiconductor device manufacturing apparatus according to claim 3, the transfer mechanism includes an ultrasonic source and a reflector disposed opposite to each other with the substrate interposed therebetween; The transport mechanism forms a standing wave acoustic field by ultrasonic waves formed between the ultrasonic sound source and the reflecting plate, and transports the foreign matter in the standing wave acoustic field by moving a node of sound pressure. A semiconductor device manufacturing apparatus characterized by:

7. 4. The semiconductor device manufacturing apparatus according to claim 3, further comprising: a recovery mechanism for recovering the foreign matter transferred to the outside of the substrate by the transfer mechanism;

8. 8. The semiconductor device manufacturing apparatus according to claim 7, The semiconductor device manufacturing apparatus is characterized in that the recovery mechanism includes at least one of a suction machine that sucks and recovers the foreign matter that has been transferred to the outside of the substrate by the transfer mechanism, an adhesive body that adhesively holds the foreign matter, and an electric dust collector that recovers the foreign matter by utilizing Coulomb force.

9. A product holding method characterized by applying ultrasonic vibrations to a product placed on a stage, thereby levitating any falling foreign matter at a position separated from the surface of the product.

10. applying ultrasonic vibrations to the substrate while the substrate is placed on a stage, thereby levitating any falling foreign matter at a position spaced apart from the surface of the substrate, thereby suppressing adhesion of the foreign matter to the substrate; Mounting a semiconductor chip on the substrate to which adhesion of foreign matter has been suppressed.

10. A method for manufacturing a semiconductor device comprising the steps of:

11. 2. The semiconductor device manufacturing apparatus according to claim 1, further comprising: Equipped with a controller, The semiconductor device manufacturing apparatus is characterized in that the controller drives the vibration source intermittently in accordance with the progress of the mounting process of the chip.

12. 12. The semiconductor device manufacturing apparatus according to claim 11, The semiconductor device manufacturing apparatus is characterized in that the controller temporarily suspends the driving of the vibration source at at least one of the following timings: when adjusting the position of the bonding head relative to the substrate; just before and just after the chip held by the bonding head lands on the substrate; and when checking the positional accuracy of the mounted chip.

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