Dry adhesive for temporary bonding of semiconductor devices

Abstract

A dry-adhesive microfiber array with a plurality of fibers with enlarged tips is provided. The dry-adhesive can be bonded to the surface of a silicon wafer and / or carrier. The dry-adhesive can be debonded without the use of chemicals or heat and does not remain on the wafer surface. In addition, the adhesive strength can be adjusted by introducing a liquid to the interface between the dry-adhesive and the semiconductor device.

Description

[Technical Field]

[0001] <Cross-reference to related applications> This application claims the benefit under 35 U.S.C. § 119 of Provisional Application No. 63 / 049,314, filed July 8, 2020, which is incorporated herein by reference.

[0002] <Statement regarding federally funded research> none.

[0003] The present invention relates generally to dry adhesives, and more particularly to dry adhesives containing microscale and nanoscale fiber arrays used to temporarily bond silicon wafers to carriers during manufacturing. [Background technology]

[0004] Semiconductor manufacturing involves several processing steps. For example, silicon wafers processed into processors undergo cleaning, passivation, photolithography, etching, deposition, polishing, grinding, dicing, and chip / die packaging. At each processing step, careful handling of wafers, dies, and other semiconductor devices is required to increase throughput, reduce the manufacturing equipment footprint, limit / prevent particle contamination, and maintain high yields. The increasing adoption of wafer-level packaging (WLP) processes increases the need for appropriate wafer handling techniques. In WLP processes, die packaging is performed while the die is still on the wafer. Wafers are becoming thinner due to the increasing variety of mobile devices that use semiconductor chips / devices. To enable handling of thin wafers for WLP, manufacturing processes often temporarily bond wafers to a carrier or substrate. Because some processing steps are performed on the backside of the wafer, resulting in temporary bonding on the device side of the wafer, the bonding-debonding process (BDB) is crucial to prevent damage to the device side of the wafer. Generally, temporary bonding materials are required to adhere to a large surface, to high-stress substrates, and over a wide temperature range.

[0005] Temporary bonding can be achieved by several techniques. In one example, a liquid adhesive is used between the wafer and carrier. In adhesive bonding, a liquid thermoplastic adhesive is spin-coated onto the device side of the wafer and then cured at high temperatures of approximately 200–250°C. These additional steps can reduce throughput and increase overall costs. Furthermore, upon completion of processing, the wafer must be debonded from the carrier using means such as chemicals, heat, or lasers. Chemical debonding increases the likelihood of contamination from exposure to solvents and is not time-efficient for large wafers. Thermal debonding can reduce yields by bending or warping the substrate at high temperatures. Finally, laser debonding requires a transparent carrier, but wafer detection and alignment systems are often visual, which may require modification to other process steps. Another temporary bonding technique uses pressure-sensitive adhesive tape. However, this type of tape can leave residue after debonding, requiring additional processing steps to remove the residue from the wafer. Furthermore, many of these existing techniques are not easily tailored to specific applications, as the bond strength is determined by the inherent properties of the adhesive material used.

[0006] Therefore, it would be beneficial to develop a dry adhesive that overcomes these limitations by providing an efficient bonding / debonding process that allows fine control of bond strength while reducing the potential for contamination removal and wafer damage. Summary of the Invention

[0007] According to one embodiment of the present invention, a dry adhesive has an array of fibers that can adhere to smooth, flat, or textured surfaces, such as the surface of a silicon wafer. In some embodiments, the dry adhesive includes an array of microscale or nanoscale fibers extending from the surface, with the tips of the fibers having an enlarged shape. The tips contact the surface of the wafer and exert an adhesive force. Removal can be achieved by peeling the dry adhesive from the wafer or by moving the wafer in a direction parallel to the surface of the dry adhesive. Additionally, the adhesive strength of the dry adhesive can be increased by wetting it. As a result, the adhesive properties of the adhesive can be adjusted by introducing liquids such as water or isopropyl alcohol.

[0008] Dry adhesives can be formed as a thin film, tape, or directly bonded to the carrier surface. Dry adhesive debonding does not require chemicals or complex processing steps other than physically removing the wafer from the carrier. Because dry adhesives are not complex multi-component liquid adhesives, residues remaining on the wafer surface after debonding are significantly reduced. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is an image showing the structure of a dry adhesive according to one embodiment.

[0010] [Figure 2] FIG. 2 is a graph showing the adhesive strength of adhesives in dry and wet conditions. DETAILED DESCRIPTION OF THE INVENTION

[0011] In one exemplary embodiment, the dry-adhesive microfiber array 100 includes a plurality of fibers 101 attached to a backing layer, carrier, or substrate 102. In one embodiment, the fibers 101 are attached to the backing layer, carrier, or substrate 102 at a substantially perpendicular angle. Each fiber includes a stem 103 and an enlarged tip 104 (i.e., the tip radius is larger than the stem radius). In one embodiment, the tip 104 is a mushroom-shaped tip 104 with a flat surface. The stem 103 and tip 104 are symmetrical about an axis of symmetry such that the radius a of the stem 103 (up to the connection point 105 with the tip 104) is constant along the length of the stem 103. However, in alternative embodiments, the radius of the stem 103 may vary along its length, including an embodiment in which the radius of the stem 103 near the backing layer 102 is enlarged. The tip 104 is also symmetrical and radially positioned to enhance contact with the surface of a semiconductor device, such as a silicon wafer, chip, die, or semiconductor package. In one embodiment, the surface of the tip 104 and the cross section of the stem 103 are circular. However, in other embodiments, oval or elliptical shapes and / or cross sections may be employed. The shape of the underside of the mushroom-shaped tip 104 is linear, but may alternatively be convex or concave relative to the stem axial direction and tip surface.

[0012] In an alternative embodiment, the dry adhesive 100 may comprise a film or tape with fibers on both sides, such as double-sided tape. In this configuration, the tape 100 is placed on a carrier, and then the semiconductor device is placed on top of the tape 100. During debonding, the manufacturer can choose to either remove the carrier from the device or remove the device from the carrier. For example, if the wafer is to be transferred to another carrier for subsequent processing steps, the wafer and tape 100 may be removed from the carrier and placed on the surface of the other carrier. The dry adhesive fiber array 100 can be adhered to another carrier because its adhesive strength does not decrease when removed. Leaving the dry adhesive 100 attached to the wafer eliminates handling steps involving the device side of the wafer.

[0013] During the bonding process, multiple fibers 101 of the dry adhesive 100 are attached or otherwise bonded to the surface of a device, as known in the art. More specifically, the tips 104 of the fibers 101 contact the surface of the device, providing adhesive force. The bond strength of the dry adhesive 100 is tailored to the specific process. For example, a lower bond strength may be used if the device is undergoing a cleaning process that does not involve significant force or rough handling. Using a lower bond strength reduces the likelihood of damaging the device during debonding. Bond strength can be tailored by varying fiber design parameters, including fiber length, fiber radius, backing layer thickness, tip diameter, tip height, tip-to-side angle, fiber density, and material selection. In one exemplary embodiment, the fibers 101 are fabricated from polyurethane using a molding process known to those of ordinary skill in the art. In this exemplary embodiment, the dry adhesive 100 may have fibers 101 with a stem radius of 4 μm, a tip radius of 8 μm, and a length of 20 μm.

[0014] As previously discussed, varying the fiber properties can adjust bond strength. The presence of liquids, such as water or isopropyl alcohol, can also affect the adhesive properties of the dry adhesive 100. While liquid is present, the adhesive 100 is considered a dry adhesive because the liquid does not directly bond like glue. That is, the liquid is not the adhesive. Rather, the liquid affects the interface between the device surface and the tip 104 of the fiber 101. Figure 2 shows the adhesive force of the dry adhesive 100 in two states: dry (lower trace) and wetted with isopropyl alcohol (upper trace). The y-axis of Figure 2 represents the normal force in Newtons, while the x-axis represents individual measurements of the same dry adhesive 100. Figure 2 shows a series of 20 measurements, followed by an additional five measurements three days later. The additional five tests demonstrate the resilience of the fiber after exposure to isopropyl alcohol. As shown in Figure 2, the presence of isopropyl alcohol increases the normal adhesive force compared to the dry adhesive 100.

[0015] The difference in adhesive strength between the dry and wet states is exploited in the debonding step to minimize the force required to remove the device from the carrier. For example, a semiconductor device may be bonded with dry adhesive 100 and then wetted with isopropyl alcohol before processing begins. The presence of isopropyl alcohol increases the adhesive strength. After processing, adhesive 100 may be dried using a stream of cold or heated air. Upon drying, the adhesive strength is weakened, allowing for easier removal of the semiconductor device from the carrier.

[0016] The dry adhesive 100 offers unique advantages over existing mechanisms for bonding and debonding. For example, the dry adhesive 100 of the present invention allows for bonding and debonding at room temperature, preventing unnecessary heat exposure and potential failures due to changes in the coefficient of thermal expansion. Furthermore, because every debonding process is different (i.e., there is no standard debonding process), the ability to adjust the bond strength means that only the adhesive strength required to maintain attachment throughout the process is required, while ensuring that the mechanical removal step does not damage the device side of the wafer. Thus, compared to existing bonding mechanisms, the dry adhesive fiber array 100 allows for increased process throughput, simplified processing, provides a lower temperature bonding process, and higher yields.

[0017] The features disclosed in the above description, the appended claims, or the accompanying drawings are expressed in their specific form or in terms of means for performing a disclosed function or a method or process for achieving a disclosed result, and, where appropriate, these features may be utilized separately or in any combination to realize the invention in various forms. In particular, one or more features of any embodiment described herein may be combined with one or more features of any other embodiment described herein.

[0018] Protection may also be sought for any feature disclosed in one or more publications referred to in combination with and / or incorporated by reference into this disclosure.

Claims

1. 1. An adhesive for temporarily bonding a semiconductor device to a carrier, comprising: a microfiber array having a plurality of fibers with enlarged tips; a liquid disposed at an interface between the tip and a surface of the semiconductor device; the tip is configured to contact a surface of the semiconductor device directly or via the liquid; the tip is configured to be released from the semiconductor device by mechanical action. Adhesive material.

2. An adhesive for temporary bonding a semiconductor device, comprising: a microfiber array having a plurality of fibers with enlarged tips; a liquid disposed at an interface between the tip and a surface of the semiconductor device; the tip is configured to contact the surface of the semiconductor device directly or via the liquid; Adhesive material.

3. An adhesive for temporary bonding a semiconductor device, comprising: a microfiber array having a plurality of fibers with enlarged tips; the tip is configured to contact the surface of the semiconductor device directly or via a liquid; It is temporarily bonded in a wet state. Adhesive material.

4. The microfiber array is in a wet state. The adhesive of claim 3 .

5. A backing layer or substrate, the microfiber array is attached to the backing layer or the substrate; The adhesive according to any one of claims 1 to 4.

6. An adhesive described in any one of claims 1 to 5, wherein the semiconductor device is a silicon wafer, a chip, a die or a semiconductor package.

7. An adhesive described in any one of claims 1 to 6 for use in a wafer-level packaging process.

8. 1. A method of bonding a semiconductor device to a carrier, comprising: providing a microfiber array having a plurality of fibers terminating in an enlarged tip; contacting a tip of the microfiber array with a surface of the semiconductor device, so that the semiconductor device is attached to the microfiber array; attaching the microfiber array to the carrier; wetting the microfiber array to increase adhesion; A method comprising:

9. The method of claim 8 , further comprising debonding the microfiber array from the semiconductor device by mechanical action.

10. The method of claim 9 , wherein the mechanical action comprises peeling the microfiber array from the semiconductor device or moving the semiconductor device in a direction parallel to a surface of the carrier.

11. A method described in any one of claims 8 to 10, further comprising adjusting the bonding strength of the microfiber array by varying the density of the plurality of fibers on the surface of the backing layer to which the microfiber array is attached.

12. 12. The method of claim 8, further comprising manipulating the position of the carrier while the semiconductor device is attached to the microfiber array.

13. The method of claim 12 , further comprising drying the microfiber array before removing the semiconductor device from the carrier.

14. A method according to any one of claims 8 to 13, wherein the semiconductor device is a silicon wafer, a chip, a die or a semiconductor package.

15. A method for bonding a semiconductor device, comprising: providing an adhesive material comprising a microfiber array having a plurality of fibers terminating in an enlarged tip; and attaching the tips of the microfiber array to a surface of the semiconductor device; The method wherein the microfiber array is in a wet state.

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