Processing equipment

Abstract

To provide a processing device capable of being disposed in a saved space, and continuously performing wafer grinding work in a simple constitution.SOLUTION: A processing device includes: a plurality of chucks 22 adsorbing and holding a wafer W; an index table 21 where the plurality of chucks 22 are disposed on a concentric circle and the plurality of chucks 22 are conveyed among a rough grinding means 41, a middle grinding means 51 and a fine grinding means 61; and a plurality of tilt mechanisms tilting each of rotary shafts 01 of the plurality of chucks 22. In a plan view, each of perpendicular lines passing through each of rotation centers of the plurality of chucks 22 and facing each of tilt shafts L1 of the plurality of tilt mechanisms is set to pass through the rotation center of the index table 21. Such a mechanism as to tilt the rough grinding stone 41, the middle grinding stone 51 and the fine grinding stone 61 similarly coming in contact with the plurality of chucks 22 is not provided.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus for grinding a wafer. [Background technology]

[0002] 2. Description of the Related Art In the field of semiconductor manufacturing, back grinding is performed to grind the back surface of a semiconductor wafer such as a silicon wafer (hereinafter referred to as a "wafer") to form a thin film.

[0003] Patent Document 1 discloses a processing device that includes a mechanism for tilting the rotation axis of a rough grinding wheel that rough grinds a wafer, and a mechanism for tilting the rotation axis of a chuck, and that performs fine grinding following rough grinding by rotating an index table after rough grinding.

[0004] It is generally known that, in order to properly press the grindstone against the wafer, it is preferable that the rotation axis of the grindstone and the rotation axis of the chuck are slightly inclined.

[0005] In the above-mentioned processing device, since the contact conditions between the rough grinding wheel and the wafer and the contact conditions between the fine grinding wheel and the wafer are different, the inclination of the chuck is first adjusted based on the fine grinding wheel so that the fine grinding wheel makes appropriate contact with the wafer after rough grinding, and then the inclination of the rough grinding wheel is adjusted based on the chuck, thereby reducing the variation in the wafer's total thickness variation (TTV) between chucks. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent No. 6283081 Summary of the Invention [Problem to be solved by the invention]

[0007] However, the above-mentioned processing device requires a mechanism for tilting the rotation axis of the rough grinding wheel so as to reproduce the contact condition between the fine grinding wheel and the chuck, which poses the problem of making the device configuration complicated.

[0008] It is also possible to change the layout of the rough grinding wheels and fine grinding wheels to correspond to the arrangement of the chuck, but changing the layout in which the rough grinding wheels and fine grinding wheels are offset to the outside of the chuck would increase the spacing between the rough grinding wheels and fine grinding wheels, resulting in an increase in the size of the device.

[0009] Therefore, a technical problem to be solved arises, namely, a space-saving installation device that can perform continuous wafer grinding processing with a simple configuration, and an object of the present invention is to solve this problem. [Means for solving the problem]

[0010] In order to achieve the above object, the processing apparatus of the present invention is a processing apparatus that grinds wafers successively using a rough grinding mechanism having a rough grinding wheel, a medium grinding mechanism having a medium grinding wheel, and a fine grinding mechanism having a fine grinding wheel, and is equipped with a plurality of chucks that suction-hold the wafers, an index table that arranges the plurality of chucks concentrically and transports the plurality of chucks between the rough grinding mechanism, the medium grinding mechanism, and the fine grinding mechanism, and a plurality of tilt mechanisms that tilt the rotation axes of the plurality of chucks, respectively, and is set so that each perpendicular line passing through the rotation centers of the plurality of chucks and to each tilt axis of the plurality of tilt mechanisms passes through the rotation center of the index table in a plan view, and no mechanism is provided for tilting the rough grinding wheel, the medium grinding wheel, and the fine grinding wheel that contact the plurality of chucks in the same way.

[0011] According to this configuration, by adjusting the contact condition by appropriately tilting the chuck for one grinding mechanism, the effort of adjusting the contact condition between the other grinding mechanisms and the chuck can be eliminated, and the contact condition between each grinding mechanism and the chuck can be appropriately adjusted while maintaining the size of the device without providing a mechanism for tilting the rotation axis of the grinding mechanism.

[0012] Furthermore, in the processing device according to the present invention, it is preferable that the rough grinding mechanism, the medium grinding mechanism, and the fine grinding mechanism are arranged on the outer periphery of the plurality of chucks in the radial direction of the index table, and that the distances between any two adjacent grinding mechanisms among the rough grinding mechanism, the medium grinding mechanism, and the fine grinding mechanism are different from each other.

[0013] In addition, in the processing device of the present invention, it is preferable that the rough grinding mechanism, the medium grinding mechanism, and the fine grinding mechanism are arranged on the inner side of the multiple chucks in the radial direction of the index table, and that the distances between each two adjacent grinding mechanisms among the rough grinding mechanism, the medium grinding mechanism, and the fine grinding mechanism are different from each other. [Effects of the Invention]

[0014] In the present invention, by adjusting the contact condition by appropriately tilting the chuck relative to one grinding mechanism, the effort of adjusting the contact condition between other grinding mechanisms and the chuck can be eliminated, and the contact condition between each grinding mechanism and the chuck can be appropriately adjusted while maintaining the size of the device without providing a mechanism for tilting the rotation axis of the grinding mechanism. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a perspective view showing a processing apparatus according to an embodiment of the present invention; [Figure 2] FIG. [Figure 3] FIG. [Figure 4] FIG. [Figure 5] FIG. 5 is a plan view of FIG. 4 omitting the column and various grinding devices. [Figure 6] FIG. 6 is a cross-sectional view taken along line AA in FIG. 5. [Figure 7] FIG. 10 is a plan view schematically showing the arrangement of grinding wheels and chucks in a conventional processing device. [Figure 8] FIG. 3 is a plan view schematically showing the arrangement of the grinding wheels and the chucks. [Figure 9] FIG. 10 is a plan view showing another arrangement position of the grinding wheel. DETAILED DESCRIPTION OF THE INVENTION

[0016] The present invention will be described below with reference to the drawings. When referring to the number, numerical value, amount, range, etc. of components, unless otherwise specified or when the number is clearly limited to a specific number in principle, the number is not limited to the specific number, and may be greater than or less than the specific number.

[0017] Furthermore, when referring to the shape or positional relationship of components, etc., it includes things that are substantially similar or approximate to those shapes, etc., unless otherwise specified or when it is clearly considered otherwise in principle.

[0018] In addition, the drawings may exaggerate characteristic parts to make the features easier to understand, and the dimensional proportions of the components may not be the same as in reality. In addition, in cross-sectional views, hatching of some components may be omitted to make the cross-sectional structure of the components easier to understand.

[0019] Fig. 1 is a perspective view showing the processing device 1 as viewed from one side. Fig. 2 is a perspective view showing the processing device 1 as viewed from the other side. Fig. 3 is a front view of the processing device 1. Fig. 4 is a plan view of the processing device 1. Fig. 5 is a plan view omitting the column 3 and various grinding devices.

[0020] The processing apparatus 1 continuously grinds wafers W using three grinding wheels. The processing apparatus 1 may continuously process wafers W using two grinding wheels or four or more grinding wheels. The processing apparatus 1 grinds the back surface of the wafers W to form a thin film. The wafers W ground using the processing apparatus 1 are preferably silicon wafers, silicon carbide wafers, or other wafers exhibiting high hardness and brittleness, but are not limited to these. The processing apparatus 1 includes a holding means 2 and a main unit arranged above the holding means 2.

[0021] The holding means 2 includes an index table 21 that is rotatable around a rotation axis a1 connected to a motor (not shown), and four chucks 22 placed on the index table 21.

[0022] The chucks 22 are arranged at 90-degree intervals around the rotation axis a1. Each chuck 22 has an adsorbent made of porous ceramic embedded in its upper surface. A conduit formed within the chuck 22 is connected to a vacuum source (not shown), and the wafer W placed on the chuck 22 is adsorbed by negative pressure. The chuck 22 is connected to a motor (not shown) and can rotate around the rotation axis a2.

[0023] The holding means 2 is divided into an alignment stage S1, a rough grinding stage S2, a medium grinding stage S3, and a fine grinding stage S4.

[0024] At the alignment stage S1, the wafer W is transferred onto the chuck 22 by a transfer device (not shown) or the like and aligned at a predetermined position. The wafer W held by suction on the chuck 22 is then sent to the rough grinding stage S2.

[0025] In the rough grinding stage S2, the wafer W is roughly ground. The rotation speed of the chuck 22 in the rough grinding stage S2 is set to, for example, 310 rpm. The roughly ground wafer W is sent to the medium grinding stage S3.

[0026] In the medium grinding stage S3, the wafer W is subjected to medium grinding. The rotation speed of the chuck 22 in the medium grinding stage S3 is set to, for example, 320 rpm. The wafer W that has been medium ground is sent to the fine grinding stage S4.

[0027] In the precision grinding stage S4, the wafer W is precision ground. The rotation speed of the chuck 22 in the precision grinding stage S4 is set to, for example, 300 rpm. The precision-ground wafer W is sent to the alignment stage S1 and is then transferred from the chuck 22 to a rack or the like (not shown) by a transfer device or the like (not shown).

[0028] The main unit comprises an arch-shaped column 3 arranged to straddle the index table 21, a rough grinding means 4 attached to the column 3 above the rough grinding stage S2, a medium grinding means 5 attached to the column 3 above the medium grinding stage S3, and a fine grinding means 6 attached to the column 3 above the fine grinding stage S4.

[0029] The column 3 includes a base 31 formed in a U-shape when viewed from the front, and central pillars 32 and 33 projecting forward and backward from the center of the base 31.

[0030] The base 31 is provided so as to straddle the rough grinding stage S2, the medium grinding stage S3, and the fine grinding stage S4. As a result, in a plan view, the alignment stage S1 is exposed to the side of the column 3. Therefore, when transporting the wafer W to or from the chuck 22, a transport device or the like can access the chuck 22 without being interfered with by the column 3. The rigidity of the base 31 is increased by connecting two support pillars 31a erected on the outer periphery of the index table 21.

[0031] The central pillar 32 is disposed on the opposite side of the support pillar 31a across the rough grinding stage S2 in plan view. The central pillar 33 is disposed between the medium grinding stage S3 and the fine grinding stage S4 in plan view. The lower ends of the central pillars 32 and 33 extend above the index table 21.

[0032] A groove 3b is disposed on the front surface 3a of the column 3, recessed in the vertical direction V. A rough grinding means 4 is housed in the groove 3b. Grooves 3d and 3e are disposed side by side on the rear surface 3c of the column 3, recessed in the vertical direction V. A medium grinding means 5 is housed in the groove 3d. A fine grinding means 6 is housed in the groove 3e.

[0033] The rough grinding means 4 includes a rough grinding wheel 41, a first spindle 42 having the rough grinding wheel 41 attached to its lower end, and a first spindle feed mechanism 43 that raises and lowers the first spindle 42 in the vertical direction V.

[0034] The rough grinding wheel 41 is configured by arranging a plurality of cup-shaped grinding wheels at the bottom end in the circumferential direction. The grit size of the rough grinding wheel 41 is set to, for example, #2000.

[0035] The first spindle 42 includes a saddle 42a having the rough grinding wheel 41 attached to its lower end, and a motor (not shown) provided inside the saddle 42a to rotate the rough grinding wheel 41. The rotation speed of the rough grinding wheel 41 is set to, for example, 3000 rpm.

[0036] The first spindle feed mechanism 43 connects the saddle 42a to a rear guide 72, which will be described later, and feeds the first spindle 42 in the vertical direction V. Note that the first spindle feed mechanism 43 does not include a lifting means for feeding the first spindle 42, but the lifting means may be, for example, a motor-driven ball screw.

[0037] The medium grinding means 5 includes a medium grinding wheel 51, a second spindle 52 having the medium grinding wheel 51 attached to its lower end, and a second spindle feed mechanism 53 that raises and lowers the second spindle 52 in the vertical direction V.

[0038] The medium grinding wheel 51 is configured by arranging a plurality of cup-shaped grinding wheels at the lower end in the circumferential direction. The grit size of the medium grinding wheel 51 is set to, for example, #4000.

[0039] The second spindle 52 includes a saddle 52a having the medium grinding wheel 51 attached to its lower end, and a motor (not shown) provided inside the saddle 52a to rotate the medium grinding wheel 51. The rotation speed of the medium grinding wheel 51 is set to, for example, 2000 rpm.

[0040] The second spindle feed mechanism 53 has the same configuration as the first spindle feed mechanism 43, and connects the saddle 52a to a rear guide 82 (described later), and feeds the second spindle 52 in the vertical direction V.

[0041] The precision grinding means 6 includes a precision grinding wheel 61, a third spindle 62 having the precision grinding wheel 61 attached to its lower end, and a third spindle feed mechanism 63 that raises and lowers the third spindle 62 in the vertical direction V.

[0042] The precision grinding wheel 61 is configured by arranging a plurality of cup-shaped grinding wheels at the bottom end in the circumferential direction. The grit size of the precision grinding wheel 61 is set to, for example, #8000.

[0043] The third spindle 62 includes a saddle 62a having the precision grinding wheel 61 attached to its lower end, and a motor (not shown) provided inside the saddle 62a to rotate the precision grinding wheel 61. The rotation speed of the precision grinding wheel 61 is set to, for example, 2000 rpm.

[0044] The third spindle feed mechanism 63 has the same configuration as the first spindle feed mechanism 43, and connects the saddle 62a to a rear guide 92 (described later), and feeds the third spindle 62 in the vertical direction V.

[0045] The processing apparatus 1 is provided with an in-process gauge (not shown) that measures the thickness of the wafer W during processing. The in-process gauges are respectively disposed on the rough grinding stage S2, the medium grinding stage S3, and the fine grinding stage S4. The operations of the first spindle feed mechanism 43, the second spindle feed mechanism 53, and the third spindle feed mechanism 63 are controlled based on the film thickness measured by the in-process gauge.

[0046] Specifically, when the thickness of the wafer W measured by the in-process gauge provided on the rough grinding stage S2 reaches a desired value, the first spindle feed mechanism 43 is driven to raise the saddle 42a, thereby separating the wafer W from the rough grinding wheel 41. Similarly, when the thickness of the wafer W measured by the in-process gauge provided on the medium grinding stage S3 reaches a desired value, the wafer W and the medium grinding wheel 51 are separated, and when the thickness of the wafer W measured by the in-process gauge provided on the fine grinding stage S4 reaches a desired value, the wafer W and the fine grinding wheel 61 are separated.

[0047] The processing device 1 is provided with a first guide 7 that supports the first spindle 42 so that it can slide in the vertical direction V, a second guide 8 that supports the second spindle 52 so that it can slide in the vertical direction V, and a third guide 9 that supports the third spindle 62 so that it can slide in the vertical direction V.

[0048] The first guide 7 is composed of a front guide 71 disposed on the front surface of the base 31 and the central pillar 32, respectively, and a rear guide 72 disposed in the groove 3b. The front guide 71 and the rear guide 72 are, for example, linear guides. A saddle 42a is directly attached to a slider 71a of the front guide 71. In addition, the saddle 42a is attached to the rear guide 72 via a first spindle feed mechanism 43.

[0049] The front guide 71 and the rear guide 72 are provided parallel to each other along the vertical direction V. As a result, the front guide 71 and the rear guide 72 restrict the saddle 42a to move along the vertical direction V.

[0050] The second guide 8 is composed of a front guide 81, one disposed on the rear surface of the base 31 and one disposed on the central pillar 33, and a rear guide 82 disposed in the groove 3d. The front guide 81 and the rear guide 82 are, for example, linear guides. A saddle 52a is directly attached to a slider 81a of the front guide 81. In addition, the saddle 52a is attached to the rear guide 82 via a second spindle feed mechanism 53.

[0051] The front guide 81 and the rear guide 82 are provided parallel to each other along the vertical direction V. As a result, the front guide 81 and the rear guide 82 restrict the saddle 52a to move along the vertical direction V.

[0052] The third guide 9 is composed of a front guide 91, one disposed on the rear surface of the base 31 and one disposed on the central pillar 33, and a rear guide 92 disposed in the groove 3e. The front guide 91 and the rear guide 92 are, for example, linear guides. A saddle 62a is directly attached to a slider 91a of the front guide 91. In addition, the saddle 62a is attached to the rear guide 92 via a third spindle feed mechanism 63.

[0053] The front guide 91 and the rear guide 92 are provided parallel to each other along the vertical direction V. As a result, the front guide 91 and the rear guide 92 restrict the saddle 62a to move along the vertical direction V.

[0054] The operation of the processing device 1 is controlled by a control unit (not shown). The control unit controls each of the components that make up the processing device 1. The control unit is composed of, for example, a CPU, a memory, etc. The functions of the control unit may be realized by control using software, or may be realized by operation using hardware.

[0055] In this way, the processing apparatus 1 successively transports the wafer W, which is vacuum-held on the chuck 22 of the alignment stage S1, through the rough grinding stage S2, the medium grinding stage S3, and the fine grinding stage S4 while still mounted on the same chuck 22. Furthermore, the chuck 22 that vacuum-holds the wafer W can be made more rigid than other wafer holding devices such as belt conveyors. This improves the throughput of the grinding process and enables the wafer W to be ground with high quality.

[0056] Furthermore, since the column 3 can be formed with a larger diameter and higher rigidity than the index table 21, resonance and axial tilt of the rough grinding means 4, medium grinding means 5 and fine grinding means 6 caused by normal forces generated during grinding of the wafer W are suppressed, and the wafer W can be ground with high quality.

[0057] Next, we will explain the tilt mechanism of the holding means 2. As shown in Figures 4 and 5, the holding means 2 has two movable support parts 24 and one fixed support part 25 arranged around the periphery of the chuck 22. The movable support part 24 is arranged on the outer periphery side of the index table 21 in the radial direction relative to the chuck 22. The fixed support part 25 is arranged on the inner periphery side of the index table 21 in the radial direction relative to the chuck 22.

[0058] As shown in FIG. 6, the movable support portion 24 is a differential screw mechanism that includes a slide block 24a, a fixed block 24b, and an adjustment screw 24c.

[0059] The slide block 24a is joined to the index table 21. A screw portion is drilled in the center of the slide block 24a, and the pitch of the screw portion of the slide block 24a is set to, for example, 1.25 mm.

[0060] The fixed block 24b is joined to a tilt table 26 on which the chuck 22 is placed. A screw portion is drilled in the center of the fixed block 24b, and the pitch of the screw portion of the fixed block 24b is smaller than that of the screw portion 24d, and is set to, for example, 1.00 mm.

[0061] The adjustment screw 24c is threaded into the threaded portion of the slide block 24a and the threaded portion of the fixed block 24b. The adjustment screw 24c is rotated forward or backward by a drive motor (not shown). When the adjustment screw 24c makes one rotation, the chuck 22 moves up or down by an amount equal to the pitch difference (0.25 mm) between the slide block 24a and the fixed block 24b.

[0062] The fixed support portion 25 is a bolt that fastens the tilt table 26 to the index table 21.

[0063] In this way, the movable support members 24 raise and lower the tilt table 26 while the fixed support members 25 fix the tilt table 26 in the vertical direction V, so that the rotation axis a2 of the chuck 22 can be tilted according to the amount of expansion and contraction of each of the two movable support members 24. Note that the configuration of the tilt mechanism is not limited to the one using the differential screw mechanism and bolts described above, and any configuration may be used.

[0064] Next, the layout of the chuck 22 will be described with reference to the drawings.

[0065] 7(a), in a conventional processing apparatus 100, a rough grinding wheel 101, a medium grinding wheel 102, and a fine grinding wheel 103 are disposed offset to the outside of a chuck 104. When a tilt mechanism for tilting the chuck 104 is operated, the chuck 104 tilts with a tilt axis 106 that passes through a rotation center 105 of the chuck 104 and is parallel to two movable support parts (not shown) as a reference so that the inside of the tilt axis 106 is higher and the outside of the tilt axis 106 is lower. In addition, a perpendicular line 107 to the tilt axis 106 of the chuck 104 in a plan view is disposed so as not to pass through a rotation center 109 of an index table 108.

[0066] Although both ends of the processing area 110 of the rough grinding wheel 101 and the fine grinding wheel 103 are arranged on the tilt axis 106, the processing area 110 of the medium grinding wheel 102 intersects with the tilt axis 106 at the rotation center 105. In other words, since the contact conditions between the wafer W and the rough grinding wheel 101 and the fine grinding wheel 103 and the contact conditions between the wafer W and the medium grinding wheel 102 are different, it is necessary to tilt the rough grinding wheel 101 and the medium grinding wheel 102 with respect to the chuck 104 so as to reproduce the contact condition between the fine grinding wheel 103 and the chuck 104.

[0067] It is also possible to arrange the rough grinding wheel 101, the medium grinding wheel 102, and the fine grinding wheel 103 in rotational symmetry so that they also come into contact with the chuck 104 in the same way, as shown in Figure 7(b).

[0068] However, in such a processing apparatus 100, if the outer diameters of the rough grinding wheel 101, medium grinding wheel 102, and fine grinding wheel 103 are set to 300 mm, the distance L from the outer periphery of the medium grinding wheel 102 to the outer periphery of the fine grinding wheel 103 is approximately 925 mm, and compared to the distance L (810 mm) from the outer periphery of the medium grinding wheel 102 to the outer periphery of the fine grinding wheel 103 in the processing apparatus 100 shown in Figure 7(a), the size of the apparatus increases by the amount that the medium grinding wheel 102 has moved to the left side of the paper in Figure 10.

[0069] 8, when the tilt mechanism is operated in the processing apparatus 1 according to this embodiment, the chuck 22 tilts so that the inside of the tilt axis L1 is higher and the outside of the tilt axis L1 is lower, based on the tilt axis L1 which passes through the rotation center O1 of the chuck 22 and is parallel to the two movable support parts 24. In other words, the tilt axis L1 is at approximately the same height as the rotation center O1 on the top surface of the chuck 22.

[0070] The chuck 22 is disposed so that a perpendicular line L2 to the tilt axis L1 passes through the rotation center O1 in a plan view and passes through the rotation center O2 of the index table 21. In other words, the chuck 22 is disposed rotationally symmetrically with respect to the rotation center O2.

[0071] The rough grinding wheel 41, the medium grinding wheel 51, and the fine grinding wheel 61 are disposed offset to the outside of the chuck 22. In addition, the rough grinding wheel 41, the medium grinding wheel 51, and the fine grinding wheel 61 contact the wafer W on an arc C having an end point P, which is one of the intersection points of the rotation center O1 and the tilt axis L1 and the outer periphery of the chuck 22, as viewed from above.

[0072] Therefore, the rough grinding wheel 41, the medium grinding wheel 51, and the fine grinding wheel 61 contact all of the chucks 22 in the same manner, so if the degree of contact is adjusted by tilting the chuck 22 relative to one of the rough grinding wheel 41, the medium grinding wheel 51, and the fine grinding wheel 61, there is no need to adjust the degree of contact between the other grinding wheels and the chuck 22. In other words, the degree of contact between each grinding wheel and the chuck 22 can be appropriately adjusted without providing a mechanism for tilting the rough grinding wheel 41, the medium grinding wheel 51, and the fine grinding wheel 61.

[0073] In addition, the distance L from the outer periphery of the rough grinding wheel 41 to the outer periphery of the medium grinding wheel 51 is approximately 864 mm, which allows the device to be made smaller than the conventional processing device 100 in which the grinding wheels are arranged rotationally symmetrically.

[0074] The arrangement positions of the rough grinding wheel 41, the medium grinding wheel 51 and the fine grinding wheel 61 are not limited to those shown in FIG. 8, in which each wheel is offset to the outside of the chuck 22 and the medium grinding wheel 51 and the fine grinding wheel 61 are spaced apart.

[0075] For example, as shown in Figure 9(a), the grinding wheels may be arranged inside the chuck 22, with the medium grinding wheel 51 and the fine medium grinding wheel 61 being close to each other. In this case, the distance from the outer periphery of the medium grinding wheel 51 to the outer periphery of the fine grinding wheel 61 is approximately 558 mm.

[0076] 9(b), each grinding wheel may be disposed inside the chuck 22, with the rough grinding wheel 41 and the medium grinding wheel 51 being close to each other. In this case, the distance from the outer periphery of the medium grinding wheel 51 to the outer periphery of the fine grinding wheel 61 is approximately 735 mm.

[0077] 9(c), each grinding wheel may be disposed outside the chuck 22, with the medium grinding wheel 51 and the fine grinding wheel 61 spaced apart. In this case, the distance from the outer periphery of the medium grinding wheel 51 to the outer periphery of the fine grinding wheel 61 is approximately 1041 mm.

[0078] It should be noted that the present invention can be modified in various ways without departing from the spirit of the present invention, and it goes without saying that the present invention also covers such modifications. [Explanation of symbols]

[0079] 1...Processing equipment 2...holding means 21 Index Table 22. Zipper 24...Movable support part 25...Fixed support part 26 Tilt table 3. Column 41 Rough grinding wheel 51 Medium grinding wheel 61...Precision grinding wheel 7. First Guide 8. Second Guide 9. Third Guide L1 Tilt axis L2: Perpendicular O1: Center of rotation (of the chuck) O2: Center of rotation (of index table) W: Wafer a1: Rotation axis (of index table) a2: Rotation axis (of the chuck)

Claims

1. A processing apparatus for continuously grinding a wafer using a rough grinding mechanism having a rough grinding wheel, a medium grinding mechanism having a medium grinding wheel, and a fine grinding mechanism having a fine grinding wheel, a plurality of chucks for suction-holding the wafer; an index table that arranges the plurality of chucks on concentric circles and transports the plurality of chucks among the rough grinding mechanism, the medium grinding mechanism, and the fine grinding mechanism; a plurality of tilt mechanisms for tilting the rotation axes of the plurality of chucks, respectively; Equipped with a perpendicular line passing through each rotation center of the plurality of chucks in a plan view and perpendicular to each tilt axis of the plurality of tilt mechanisms is set to pass through the rotation center of the index table; A processing device characterized in that no mechanism is provided for tilting the rough grinding wheel, the medium grinding wheel, and the fine grinding wheel, which contact the plurality of chucks in the same manner.

2. the rough grinding mechanism, the medium grinding mechanism, and the fine grinding mechanism are disposed on an outer circumferential side of the plurality of chucks in a radial direction of the index table, 2. The processing apparatus according to claim 1, wherein the distances between adjacent two of the rough grinding mechanism, the medium grinding mechanism, and the fine grinding mechanism are different from each other.

3. the rough grinding mechanism, the medium grinding mechanism, and the fine grinding mechanism are disposed on an inner peripheral side of the plurality of chucks in a radial direction of the index table, 2. The processing apparatus according to claim 1, wherein the distances between adjacent two of the rough grinding mechanism, the medium grinding mechanism, and the fine grinding mechanism are different from each other.

Images