Electro-optic modulator, optical modulation system, and integrated optical chip

Abstract

The present application provides an electro-optical modulator, comprising: an electrode conversion section having a first input electrode and a second input electrode, where the first input electrode is configured to receive a first modulation signal, and the second input electrode is configured to receive a second modulation signal; and an optical modulation section having a first modulation electrode, a second modulation electrode, a third modulation electrode, a first modulation arm, and a second modulation arm, where the first modulation arm is between the first modulation electrode and the second modulation electrode, and the second modulation arm is between the first modulation electrode and the third modulation electrode; where the first modulation electrode is coupled to the first input electrode and configured to receive the first modulation signal, the second modulation electrode and the third modulation electrode are respectively coupled to the second input electrode and configured to receive the second modulation signal, and the first modulation electrode, the second modulation electrode, and the third modulation electrode are respectively configured to modulate input light in the first modulation arm and the second modulation arm based on the first modulation signal and the second modulation signal. The present application further provides an optical modulation system and an integrated optical chip.

Description

[Technical Field]

[0001] This application relates to electro-optic modulators, optical modulation systems including electro-optic modulators, and integrated optical chips. [Background technology]

[0002] In optical communication systems, electro-optic modulators are the core components for converting electrical signals into optical signals. ( TFLN (Thin Film Liquid Crystal Display) modulator provides excellent linearity and cooling Unnecessary , low light loss , and high bandwidth. Thin-film lithium niobate modulator is a coherent optical communication technology with a communication speed higher than 130G. etc. It can be used in the scenario:

[0003] The TFLN modulator is electrically connected to an electrical chip. The electrical chip is configured to output an AC signal to drive the thin film lithium niobate modulator to operate, and the electrical chip Pu is Therefore, the electronic chip must be driven by a DC signal, and must include a complex peripheral circuit (including capacitors, inductors, etc.) to distinguish between the DC signal transmission channel and the AC signal transmission channel, preventing the DC signal from being transmitted to the TFLN modulator. At the same time Therefore, it is necessary to prevent AC signals from being transmitted to nodes that provide DC signals. The peripheral circuits increase the overall size and cost of the electrical chip, which is not conducive to miniaturization and cost control of the electrical chip, and is not conducive to packaging of the electrical chip and the TFLN modulator. Summary of the Invention

[0004] According to a first aspect, the present application provides an electro-optic modulator comprising: an electrode conversion portion having a first input electrode and a second input electrode, wherein the first input electrode is configured to receive a first modulation signal output by an electrical chip, and the second input electrode is configured to receive a second modulation signal output by the electrical chip; and an optical modulation portion having a first modulation electrode, a second modulation electrode, a third modulation electrode, a first modulation arm, and a second modulation arm, wherein the first modulation electrode is between the second modulation electrode and the third modulation electrode, the first modulation arm is between the first modulation electrode and the second modulation electrode, and the second modulation arm is between the first modulation electrode and the third modulation electrode. do. The first modulation electrode is coupled to the first input electrode and configured to receive the first modulation signal. There are. The second modulation electrode and the third modulation electrode Separately a second input electrode coupled to the second input electrode and configured to receive the second modulated signal; Separately Consists of There are. The first modulation electrode, the second modulation electrode, and the third modulation electrode ,before The input light in the first modulation arm and the second modulation arm is based on the first modulated signal and the second modulated signal It is configured to modulate ;strange The modulated input light is output from the first modulation arm and the second modulation arm. Modulated Light is output as

[0005] the current, There are two main driving methods for the electrical chip to drive the electro-optical modulator. The electric chip has different circuit structures in two operation modes. In mode 1, the electric chip has three output terminals electrically connected to the electro-optical modulator. do. One output provides a time-varying modulated signal, and the other two outputs are grounded. Maintain each In this driving method, the electric chip straight Current signal and AC signal Separately Filtering For this reason, peripheral circuits are included. In method 2, the electrical chip has two outputs electrically connected to the electro-optical modulator. do.The two output terminals respectively output a first modulation signal and a second modulation signal. The first modulation signal and the second modulation signal change independently over time, and simultaneously have the same amplitude and opposite direction. In this driving method, the electrical chip does not include peripheral circuits. The electro-optical modulator includes an electrode conversion part. . 1st input electrode and 2nd input electrode teeth, Converted into a first modulation electrode, a second modulation electrode, and a third modulation electrode And As a result, the signals transmitted to the first and second input electrodes are Separately , a first modulation electrode, a second modulation electrode, and a third modulation electrode via The electro-optic modulator can be loaded into the optical modulation section to modulate the input light in the first modulation arm and the second modulation arm. Therefore, the electro-optic modulator can be driven in Scheme 2. In other words, straight Electrical chips without peripheral circuitry for filtering current and alternating current signals can be used to drive an electro-optic modulator This helps reduce the size of the electrical chip that drives the electro-optic modulator, helps reduce the cost of the electrical chip that drives the electro-optic modulator, and facilitates packaging of the electro-optic modulator and the electrical chip in an optical modulation system.

[0006] In some implementations, the electro-optic modulator further comprises a substrate, the electrode converting portion and the light modulating portion being on the same surface of the substrate.

[0007] In this way, the electrode conversion portion can be electrically connected to the light modulation portion.

[0008] In some implementations, the electrode conversion portion further comprises a bridge portion. do. The bridge portion is incorporated into the substrate, and the bridge portion part is exposed to the surface of the substrate on which the electrode conversion portion is located. There are. The bridge portion exposed to the substrate part is applied to the first modulation electrode and the first input electrode. Separately are combined.

[0009] In this way, the first input electrode and First modulation electrode Between Electric Air connection Continued is established And, The electrical connection is Built into the board Implemented via a bridge section , As a result, The first input electrode and the second input electrode are connected to the end faces of the electro-optic modulator. It is on the same plane as This facilitates the packaging process of the electro-optic modulator.

[0010] In some implementations, two ends of the second input electrode are coupled to the second modulation electrode and the third modulation electrode, respectively, and the second modulation electrode, the second input electrode, and the third modulation electrode are surrounded to form a receiving area having an opening. There are. The first input electrode is within the accommodating area, and the first modulation electrode extends from outside the accommodating area into the accommodating area through the opening and is coupled to the first input electrode.

[0011] In this way, the first input electrode and First modulation electrode Between Electric Air connection Continued is established will be done.

[0012] In some implementations, electrode transformation portion The structure is axially symmetric as a whole.

[0013] In some implementations, the first modulating electrode, the second modulating electrode, and the third modulating electrode are metal. It is being produced. The light modulation portion further comprises a transparent Conductive layer Including nothing. The first modulation electrode, the second modulation electrode, and the third modulation electrode are Conductive layer on a surface remote from the substrate, Conductive layer is in electrical contact with

[0014] The first modulation electrode, the second modulation electrode, and the third modulation electrode made of a metal material easily absorb the input light in the first modulation arm and the second modulation arm. So,In order to reduce the amount of input light absorbed by the first modulation electrode, the second modulation electrode, and the third modulation electrode, and A predetermined distance should be maintained between the third modulation electrode and the adjacently arranged first and second modulation arms. Meiden Materials The first modulation electrode, the second modulation electrode, and the third modulation electrode are made of a transparent conductive material. It is set to In this case, the absorption function of the first modulating electrode, the second modulating electrode, and the third modulating electrode with respect to light may be reduced, and the first modulating electrode, the second modulating electrode and The third modulation electrode and the preset distance between the first modulation arm and the second modulation arm can be reduced. However, compared with metal materials, transparent conductive materials have weaker conductivity. stomach. This is not conducive to the conduction of electrical signals (including the first modulation signal and the second modulation signal). Therefore, in some embodiments, the first modulation electrode, the second modulation electrode, and the third modulation electrode are made of a metallic material. It is set to and a transparent insulating film that is in direct electrical contact with the first modulating electrode, the second modulating electrode, and the third modulating electrode. Conductive layer By adding Conductive layer , and The first modulation electrode, the second modulation electrode and the third modulation electrode are capable of transmitting an electrical signal together. In some aspects , excellent electrical conductivity can be implemented via the first modulating electrode, the second modulating electrode and the third modulating electrode made of metallic material. In another aspect , transparent Conductive layer has a small light absorption function, so it is transparent. Conductive layer and the distance between the first modulation arm and the transparency Conductive layer and the distance between the second modulation arm is reduced Can Transparent Conductive layer and the distance between the first modulation arm and the transparency Conductive layer When the distance between the first modulation electrode, the second modulation electrode, and the second modulation arm is reduced, the influence of the first electric field and the second electric field generated on the first modulation arm and the second modulation arm by the first modulation electrode, the second modulation electrode, and the third modulation electrode is improved. Therefore, The modulation efficiency of the electro-optic modulator is improved.

[0015] In some implementations, the transparent Conductive layer is in direct contact with the first modulation arm and the second modulation arm.

[0016] In this way, transparency Conductive layer and the distance between the first modulation arm and the transparency Conductive layer and the second modulation arm is 0, the influence of the first electric field and the second electric field generated on the first modulation arm and the second modulation arm by the first modulation electrode, the second modulation electrode and the third modulation electrode is larger, and the modulation efficiency of the electro-optic modulator is higher.

[0017] In some implementations, the electro-optic modulator further comprises a first Impedance Sheet , 2nd Impedance Sheet and third Impedance Sheet Including nothing. The first Impedance Sheet and the second Impedance Sheet are connected in series with each other and then coupled between the second modulation electrode and the third modulation electrode. Impedance Sheet and the second Impedance Sheet is connected to the node between There are. The third Impedance Sheet is coupled between the first modulation electrode and the node 。

[0018] In this way, the first modulated signal and the second modulated signal are Impedance Sheet , 2nd Impedance Sheet and third Via Impedance Sheet To avoid the case where the first modulated signal and the second modulated signal are reflected by the terminal, As a result, The modulation process of the input light but influence And obtain.

[0019] In some implementations, the first modulated signal and the second modulated signal are radio frequency signals.

[0020] In some implementations, the first modulation arm and the second modulation arm are made of lithium niobate. It is made do.

[0021] According to a second aspect, the present application further provides an electro-optic modulator according to any one of the implementations of the first aspect; and a first input electrode and a second input electrode. Separately An optical modulation system is provided that includes an electrical chip coupled to the first input electrode and configured to output a first modulated signal to the first input electrode and a second modulated signal to the second input electrode.

[0022] The optical modulation system includes an electrical chip and an optical chip electrically connected to each other. The electrode conversion portion in the optical chip is used. And , the result, The peripheral circuitry does not need to distinguish between a transmission channel for a DC signal and a transmission channel for an AC signal, which helps to reduce the size and cost of the optical modulation system.

[0023] the current, The electric chip Electro-optic modulator There are two main driving methods for operating the The electric chip has different circuit structures in two operation modes. In mode 1, the electric chip has three output terminals electrically connected to the electro-optical modulator. do. One output provides a time-varying modulated signal, and the other two outputs are grounded. Maintain each In this driving method, the electric chip ,straight Current signal and AC signal Separately Filtering For this reason, peripheral circuits are included. In method 2, the electrical chip has two outputs electrically connected to the electro-optical modulator. do. The two output terminals respectively output a first modulated signal and a second modulated signal. The first modulated signal and the second modulated signal vary over time. Separately The first modulation signal and the second modulation signal have the same amplitude and opposite direction at the same time. In this driving method, the electric chip does not include peripheral circuits. The electro-optic modulator includes an electrode conversion part. . 1st input electrode and 2nd input electrode teeth, Converted into a first modulation electrode, a second modulation electrode, and a third modulation electrode And As a result, the signals transmitted to the first and second input electrodes are Separately , a first modulation electrode, a second modulation electrode, and a third modulation electrode via The electro-optic modulator can be loaded into the optical modulation section to modulate the input light in the first modulation arm and the second modulation arm. Therefore, the electro-optic modulator can be driven in Scheme 2. In other words, ,straight Electrical chips without peripheral circuitry for filtering current and alternating current signals can be used to drive an electro-optic modulator This allows the overall size of the optical modulation system to be reduced, which helps reduce the cost of the optical modulation system.

[0024] According to a third aspect, the present application further provides an integrated optical chip including a laser configured to emit input light; and a modulator coupled to the laser and configured to receive the input light and modulate the input light, Modulated Light The electro-optic modulator according to any one of the preceding implementations is configured to output:

[0025] The integrated optical chip can integrate the electro-optic modulator and implement all the beneficial effects of the electro-optic modulator. [Brief explanation of the drawings]

[0026] [Figure 1] 1 is a schematic diagram of a module structure of an optical modulation system according to a first embodiment of the present application.

[0027] [Figure 2] 2 is a schematic diagram of the planar structure of the electro-optic modulator of FIG. 1.

[0028] [Figure 3] 3 is a schematic diagram of a cross-sectional structure of an electrode conversion portion in FIG. 2 taken along line AA.

[0029] [Figure 4] 3 is a schematic diagram of a cross-sectional structure of the optical modulation portion of FIG. 2 taken along line BB.

[0030] [Figure 5] 3 is a schematic diagram of a cross-sectional structure of an electro-optic modulator according to a modified embodiment of the first embodiment of the present application, taken along line BB in FIG. 2.

[0031] [Figure 6] 1 is an equivalent circuit diagram of an electro-optical modulator and an electric chip according to a first embodiment of the present application.

[0032] [Figure 7] 1 is a schematic diagram of a module structure of an integrated optical chip according to a first embodiment of the present application.

[0033] [Figure 8] FIG. 2 is a schematic diagram of a module structure of an integrated optical chip according to a modified embodiment of Embodiment 1 of the present application.

[0034] [Figure 9] FIG. 2 is a schematic diagram of a module structure of an integrated optical chip according to a modified embodiment of Embodiment 1 of the present application.

[0035] [Figure 10] FIG. 2 is a schematic diagram of a module structure of an integrated optical chip according to a modified embodiment of Embodiment 1 of the present application.

[0036] [Figure 11] FIG. 10 is a schematic diagram of a local plane structure of an electro-optic modulator in an optical modulation system according to a second embodiment of the present application.

[0037] [Figure 12] FIG. 12 is a schematic diagram of the cross-sectional structure of FIG. 11 taken along line CC. DETAILED DESCRIPTION OF THE INVENTION

[0038] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings of the embodiments of the present application. [Embodiment 1]

[0039] See Figure 1 I want to be done that.In this embodiment, the optical modulation system 1 includes an electro-optic modulator 10 and an electric chip 20, and the electro-optic modulator 10 is coupled to the electric chip 20. The electric chip 20 is configured to output a first modulation signal S+ and a second modulation signal S- to the electro-optic modulator 10. The first modulation signal S+ and the second modulation signal S- are high-frequency (greater than 10 Khz) AC signals. At the same time, the first modulation signal S+ and the second modulation signal S- output by the electric chip 20 have equal amplitudes and opposite directions. The electro-optic modulator 10 is further configured to receive input light L1 from an external light source (e.g., a laser), and the electro-optic modulator 10 modulates the input light L1 based on the first modulation signal S+ and the second modulation signal S-. hand , and outputs modulated input light. In this embodiment, the light modulated and output by the electro-optic modulator 10 is Modulated Light The input light L1 is defined as an intrinsic light. The electro-optic modulator 10 loads the first modulation signal S+ and the second modulation signal S- onto the input light L1 and changes the relevant parameters (e.g., phase, intensity, and polarization state) of the input light L1 to preserve the modulation information. Modulated Light Acquire L2, Modulated Light Output L2 In this embodiment, the electro-optic modulator 10 is a thin film lithium niobate modulator.

[0040] See Figure 2 I want to be done that. In this embodiment, the electro-optic modulator 10 includes an electrode conversion portion 11, an optical modulation portion 12, and a substrate 13, and the electrode conversion portion 11 and the optical modulation portion 12 are on the same surface of the substrate 13. The electrode conversion portion 11 is coupled to the electrical chip 20 and the optical modulation portion 12, respectively, and is configured to receive a first modulation signal S+ and a second modulation signal S− and transmit the first modulation signal S+ and the second modulation signal S− to the optical modulation portion 12. The optical modulation portion 12 is configured to receive the first modulation signal S+, the second modulation signal S−, and input light L1, and modulates the input light L1 based on the first modulation signal S+ and the second modulation signal S−. , modulated light It is configured to output L2.

[0041] The electrode conversion portion 11 is spaced apart The first input electrode 111 and the second input electrode 112 are included. 111 and the second input electrode 112 Electrical chip 20 Separately The first input electrode 111 is configured to receive the first modulated signal S+ output by the electrical tip 20, and the second input electrode 112 is configured to receive the second modulated signal S− output by the electrical chip 20.

[0042] The light modulation section 12 includes a first modulation electrode 121, a second modulation electrode 122, a third modulation electrode 123, a first modulation arm 124, and a second modulation arm 125. The first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123 are mutually spaced apart The first modulation electrode 121 is located between the second modulation electrode 122 and the third modulation electrode 123. An electrical signal is applied to the first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123. Separately When energized, the first modulating electrode 121 and the second modulating electrode 122 form a first capacitor to generate a first electric field; the first modulating electrode 121 and the third modulating electrode 123 form a second capacitor to generate a second electric field.

[0043] The first modulation arm 124 is located between the first modulation electrode 121 and the second modulation electrode 122, and the second modulation arm 125 is located between the first modulation electrode 121 and the third modulation electrode 123. The first modulation arm 124 and the second modulation arm 125 are connected to an input terminal P1 and an output terminal P2. Collected In other words, the first modulation arm 124 and the second modulation arm 125 have a common input end P1 and a common output end P2. The input end P1 is configured to receive an input light L1. A portion of the input light L1 enters the first modulation arm 124 for transmission and modulation, and On the other hand of part The electrical signal is incident on the first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123. SeparatelyWhen the first modulation arm 124 is in a first electric field, a portion of the input light L1 transmitted in the first modulation arm 124 is modulated by the first electric field, and a portion of the input light L1 transmitted in the second modulation arm 125 is modulated by the first electric field. On the other hand of part is the second electric field The input light L1 modulated by the first modulation arm 124 and the second modulation arm 125 converges at the output end P2, and then Modulated Light It is output as L2.

[0044] The first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123 are spaced apart and are generally parallel, with the first modulation electrode 121 being between the second modulation electrode 122 and the third modulation electrode 123. The first modulation electrode 121 is coupled to the first input electrode 111 and configured to receive a first modulation signal S+. The second modulation electrode 122 and the third modulation electrode 123 are coupled to the second input electrode 112. Separately are combined, Separately , and a second modulation signal S−. The first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123 are configured to modulate the input light L1 based on the first modulation signal S+ and the second modulation signal S−.

[0045] See Figure 3 I want to be done that. The substrate 13 includes a laminated substrate layer 131 and a dielectric layer 132, and the substrate layer 131 is on a surface of the dielectric layer 132 that is far from the electrode converting portion 11 and the light modulating portion 12. In other words, the dielectric layer 132 has two opposing surfaces, and the electrode converting portion 11 and the light modulating portion 12 are on one of the two surfaces. can be , the substrate layer 131 is be In this embodiment, the material of the substrate layer 131 is silicon (Si), and the material of the dielectric layer 132 is silicon dioxide (SiO2). In another embodiment, the material of the substrate layer 131 is Alternatively , indium phosphate (InP), gallium arsenide (GaAs), or a combination thereof, and the material of the dielectric layer 132 Alternatively, silicon (Si), silicon nitride (SiN), silicon oxide (SiO2), benzocyclobutene (BCB), or a combination thereof etc. It could be.

[0046] See both Figures 2 and 3 I want to be done that. In this embodiment, the electrode transition portion 11 further includes a bridge portion 116. The first input electrode 111, the second input electrode 112, the first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123 are all disposed on the surface of the dielectric layer 132 away from the substrate layer 131. arrangement The bridge portion 116 is embedded in the dielectric layer 132, and the part is exposed to the surface of the dielectric layer 132 away from the substrate layer 131. In contrast The exposed bridge portion 116 part is applied to the first input electrode 111 and the first modulation electrode 121. Separately are coupled to establish an electrical connection between the first input electrode 111 and the first modulation electrode 121 .

[0047] The first input electrode 111, the second input electrode 112, the first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123 are all disposed on the surface of the dielectric layer 132 away from the substrate layer 131. arrangement It has been So, First input electrode 111 and first modulation electrode 121 Electrical connection between on the surface of the dielectric layer 132 away from the substrate layer 131. arrangement was transmission structure via directly Establishment If the first input electrode 111 and the second input electrode 112 are connected to each other, they are easily short-circuited. If an insulating layer is added to avoid short-circuiting, it does not contribute to reducing the overall thickness of the electro-optic modulator 10. Like this The bridge portion 116 is embedded in the dielectric layer 132 to establish an electrical connection between the first input electrode 111 and the first modulation electrode 121. do. This helps to avoid short circuits between the first input electrode 111 and the second input electrode 112 and also helps to reduce the overall thickness of the electro-optic modulator 10 .

[0048] See Figure 4 I want to be done that. In this embodiment, the first modulation electrode 121, the second modulation electrode 122, the third modulation electrode 123, the first modulation arm 124, and the second modulation arm 125 are disposed on the surface of the dielectric layer 132 away from the substrate layer 131. arrangement The optical modulation section 12 further includes an optical waveguide 126, which is in direct contact with the surface of the dielectric layer 132 remote from the substrate layer 131. The optical waveguide 126 includes a base 1261, and a first modulation arm 124 and a second modulation arm 125 that protrude from the surface of the base 1261 in a direction away from the dielectric layer 132. The first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123 are on the surface of the base 1261 remote from the dielectric layer 132. In this embodiment, the base 1261, the first modulation arm 124, and the second modulation arm 125 are all made of lithium niobate. It is made In another embodiment, the optical waveguide 126 Alternatively, May not include base 1261.

[0049] In this embodiment, the first input electrode 111, the second input electrode 112, the first modulating electrode 121, the second modulating electrode 122 and the third modulating electrode 123 are all made of a conductive metal such as, for example, gold, aluminum, copper, titanium and platinum.

[0050] See Figure 5 I want to be done that. In a modified embodiment, the light-modulating portion 12 further comprises a transparent Conductive layer Contains 127. Transparent Conductive layer 127 is on the surface of the base 1261 away from the dielectric layer 132 arrangement The first modulation arm 124 and the second modulation arm 125 are made of a transparent material and partially cover the surface of the base 1261 that is away from the dielectric layer 132. Conductive layer 127. In other words, transparent Conductive layer 127 is a base 1261, a first modulation electrode 121, a second modulation electrode 122, and and 3 between the modulation electrodes 123. Transparent Conductive layer127 is, for example, an indium tin oxide (ITO) film or a tungsten-doped indium oxide (IWO) film. etc. It can be a transparent conductive oxide (TCO) film.

[0051] In this embodiment, the first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123 are made of a metal material, which easily absorbs the input light L1 in the first modulation arm 124 and the second modulation arm 125. In order to reduce the amount of absorption of the input light L1 by the first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123, as shown in FIG. and A predetermined distance should be maintained between the third modulation electrode 123 and the adjacently arranged first modulation arm 124 and second modulation arm 125 .

[0052] Compared with metal materials, transparent conductive materials have a smaller light absorption function. The first modulating electrode 121, the second modulating electrode 122, and the third modulating electrode 123 are made of transparent conductive materials. It is set to In this case, the absorption function of the first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123 for light may be reduced, and the first modulation electrode 121, the second modulation electrode 122 and The preset distance between the third modulation electrode 123 and the first and second modulation arms 124 and 125 can be reduced. However, compared with metal materials, transparent conductive materials have weaker electrical conductivity. stomach. This is not conducive to the conduction of electrical signals (including the first modulated signal S+ and the second modulated signal S-).

[0053] Therefore, in the above modified embodiment, the first modulating electrode 121, the second modulating electrode 122 and the third modulating electrode 123 are made of a metal material. It is set to Transparent Conductive layer 127 is added to make it transparent Conductive layer 127, the first modulation electrode 121, the second modulation electrode 122 and the third modulation electrode 123 can transmit electrical signals together. In some aspectsThe first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123 are made of a metal material, which has excellent conductivity. via It can be implemented. In another aspect , transparent Conductive layer 127 has a small light absorption function, so it is transparent. Conductive layer 127 and the first modulation arm 124 and the distance between Conductive layer The distance between the second modulation arm 127 and the second modulation arm 125 can be reduced. Conductive layer 127 is in direct contact with the first modulation arm 124 and the second modulation arm 125. In other words, the transparent Conductive layer 127 and the first modulation arm 124 and the distance between Conductive layer The distance between 127 and the second modulation arm 125 is zero.

[0054] transparent Conductive layer 127 and the first modulation arm 124 and the distance between Conductive layer When the distance between 127 and the second modulation arm 125 is reduced, the influence of the first electric field and the second electric field generated on the first modulation arm 124 and the second modulation arm 125 by the first modulation electrode 121, the second modulation electrode 122 and the third modulation electrode 123 is greater, and the modulation efficiency of the electro-optic modulator 10 is higher.

[0055] Therefore, in this modified embodiment, a transparent Conductive layer 127 has been added , Yu This helps improve the modulation efficiency of the electro-optic modulator 10 while ensuring good electrical conductivity.

[0056] See Figures 4 and 5 I want to be done that. In this embodiment, the electro-optic modulator 10 further comprises an insulating coverage Layer 14. Insulation coverage The material of layer 14 and dielectric layer 132 is the same. coverage The layer 14 covers the surfaces of the electrode conversion section 11 and the light modulation section 12 that are away from the substrate 13, and transmissionThe electrode converting portion 11 and the light modulating portion 12 are electrically insulated from the structure and are protected from scratches. , absolute edge coverage Layer 14 is not shown in some of the accompanying drawings. This allows for a better understanding of the structure of the electrode conversion section 11 and the light modulation section 12. .

[0057] The operation process of the optical modulation system 1 will be described below with reference to the equivalent circuit diagram of the electro-optic modulator 10 and the electrical chip 20.

[0058] See Figure 6 I want to be done that. In this embodiment, the electric chip 20 includes an amplifier 21, which has a first output terminal 211 and a second output terminal 212. The first output terminal 211 is coupled to the first input electrode 111, and the second output terminal 212 is coupled to the second input electrode 112. The positive-phase input terminal 213 of the amplifier 21 is configured to receive an initial modulation signal S0; Periodic modulation signal Amplify the amplitude of signal S0, Separately , first output end 211 from The first modulated signal S+ is output to the second output terminal 212. from The electro-optic modulator 10 includes a driving end 128. The driving end 128 is in a floating connection state and is configured to receive a DC driving signal D. The driving end 128 is a signal input pin on the electro-optic modulator 10. In the operation process of the electro-optic modulator 10, the external leads of the electro-optic modulator 10 line is connected to the driving end 128 and can input a driving signal D to the driving end 128. The driving end 128 is connected to the first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123. Separately The first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123 are coupled together. viaThe driving terminal 128 is configured to transmit the driving signal D to the amplifier 21. In other words, the driving terminal 128 is configured to transmit the driving signal D to the electric tip 20 to drive the electric tip 20 to start operating. In this embodiment, the first modulation electrode 121, the second modulation electrode 122 and the third modulation electrode 123 form a capacitor, so that the DC driving signal D is applied between the first modulation electrode 121, the second modulation electrode 122 and the third modulation electrode 123. capacitor and the first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123. On top Only the first modulation signal and the second modulation signal are transmitted to the electric chip 20. In this way, the transmission channels of the AC modulation signal (including the first modulation signal and the second modulation signal) and the DC drive signal D can be distinguished.

[0059] motion When the chip 20 starts to operate, it receives the initial modulation signal S0 and outputs the first output 211 via The first modulated signal S+ is output to the second output terminal 212. via The first modulation signal S+ is transmitted to the first modulation electrode 121 by the first input electrode 111, and the second modulation signal S− is transmitted to the second modulation electrode 122 and the third modulation electrode 123 by the second input electrode 112. Separately Transmitted do. At the same time, the input end P1 of the optical modulation section 12 receives input light L1 input by an external light source.

[0060] In this embodiment, the first modulated signal S+ and the second modulated signal S- are sinusoidal signals. In another embodiment, the first modulated signal S+ and the second modulated signal S- are sinusoidal signals. Alternatively , or other forms of AC signals, such as square wave signals. Come on The specific forms of the first modulation signal S+ and the second modulation signal S- are not limited in the present application. In the operation process of the optical modulation section 12, the first modulation signal S+ and the second modulation signal S- simultaneously have the same amplitude and opposite direction. By changing the first modulation signal S+ and the second modulation signal S- simultaneously, the first electric field and the second electric field are respectively changed, and the first modulation arm 124 and the second modulation arm 125 in the first electric field and the second electric field are respectively changed to modulate the input light L1. , modulated light In other words, in the above process, the change in the first modulated signal S+ and the second modulated signal S− is reflected in the change in the parameter of the light (for example, phase, intensity or polarization state), resulting in the modulated light, i.e., Modulated Light L2 holds the modulation information.

[0061] In this embodiment, the light modulation section 12 further comprises a first Impedance Sheet R1, 2nd Impedance Sheet R2 and 3 Impedance Sheet Including R3. Impedance Sheet R1, 2nd Impedance Sheet R2 and 3 Impedance Sheet R3 is each , a material layer having a specific impedance value, for example, a material layer made of titanium. Impedance Sheet R1 and 2 Impedance Sheet R2 is coupled between one end of the second modulation electrode 122 and one end of the third modulation electrode 123, Impedance Sheet R1 and 2 Impedance Sheet R2 is coupled to the end of the second modulation electrode 122 and the third modulation electrode 123, which is closer to the output terminal P2. Impedance Sheet R1 and 2 Impedance Sheet The node between R2 is coupled to the driving end 128 and one end of the first modulation electrode 121, and Impedance Sheet R3 is coupled between the first modulation electrode 121 and the node. Impedance Sheet R1, 2nd Impedance Sheet R2 and 3 Impedance Sheet R3 is Separately , the first modulation signal S+ and the second modulation signal S-, which are high frequency signals and are transmitted on the first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123, are terminated, so that the first modulation signal S+ and the second modulation signal S- are reflected; As a result , the modulation process of the input light L1 but influence will be It is designed to avoid such a case.

[0062] As described above, the electro-optical modulator 10 in this embodiment is configured to receive the first modulated signal S+ and the second modulated signal S− output by the electrical chip 20. The electro-optical modulator 10 is further configured to receive the input light L1, and modulate the input light L1 based on the first modulated signal S+ and the second modulated signal S− to obtain Modulated The first modulation signal S+ and the second modulation signal S− are AC signals. . electric The electronic chip 20 must be driven by a DC drive signal D to operate.

[0063] the current, There are two main driving methods for the electrical chip to drive the electro-optical modulator. The electric chip has different circuit structures in the two operating modes.

[0064] In scheme 1, the electrical chip has three outputs coupled to the electro-optical modulator. do. One output provides a time-varying modulated signal, and the other two outputs are grounded. Maintain each In this driving method, the electric chip ,straight Current signal and AC signal Separately Filtering For this reason, peripheral circuits are included. This method uses a coplanar waveguide Bass (C PW) Electrode structure of Signal transmission method and too called .

[0065] In method 2, the electrical chip has two outputs coupled to an electro-optic modulator. do. The two output terminals respectively output a first modulation signal and a second modulation signal. The first modulation signal and the second modulation signal change independently over time, and at the same time, the first modulation signal and the second modulation signal have the same amplitude and opposite direction. In this driving method, the electric chip does not include peripheral circuits. This method is as follows: Coplanar strip Bass (C PS) Electrode structure of Signal transmission method and too called .

[0066] In this embodimentThe electro-optic modulator 10 includes an electrode conversion section 11. . First input electrode 111 and second input electrode 112 teeth, The first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 123 are And As a result, the signals transmitted to the first input electrode 111 and the second input electrode 112 are Separately , Light modulation section 12 The first modulation electrode 121, the second modulation electrode 122, and the third modulation electrode 12 3 The electro-optic modulator 10 may be loaded with a CPS-based electrode structure and modulate the input light L1 in the first modulation arm 124 and the second modulation arm 125. In other words, in this embodiment, the electro-optic modulator 10 converts the CPS-based electrode structure into a CPW-based electrode structure, so that when the electro-optic modulator 10 is coupled to the electrical chip 20 for operation, the electro-optic modulator 10 can be driven in Scheme 2. In other words, ,teeth , an electrical chip 20 that does not include peripheral circuits for filtering DC and AC signals. may be used to drive the electro-optic modulator 10 This allows the overall size of the optical modulation system 1 to be smaller, helps reduce the cost of the optical modulation system 1, and facilitates packaging of the electro-optic modulator 10 and the electrical chip 20 within the optical modulation system 1.

[0067] Based on this, the second modulation electrode 122 and the third modulation electrode 123 form a capacitor, so that the driving signal D input at the driving end 128 of the electro-optic modulator 10 is filtered by the capacitor, and the second modulation electrode 122 and the third modulation electrode 123 On top Transmitted No. The drive signal D is The electrical tip 20 is loaded only along the path of the first modulation electrode 121 .

[0068] See Figure 7 I want to be done that. This embodiment further provides an integrated optical chip 100. The integrated optical chip 100 includes at least one electro-optic modulator 10, one laser 40, and one semiconductor optical amplifier 50. (SThe electro-optic modulator 10 includes a laser 40 coupled to the electro-optic modulator 10. The laser 40 is configured to output an input light L1 to the electro-optic modulator 10. The electro-optic modulator 10 is coupled to a semiconductor optical amplifier 50, which modulates the input light L1 to Modulated Light L2 is output to the semiconductor optical amplifier 50. The semiconductor optical amplifier 50 Modulated Light Amplify L2 and Modulated Light It is configured to output L2. Modulated Light L2 may continue to propagate in the optical fiber and may be received by a device such as a modulator or detector in the subsequent optical path.

[0069] In some modified embodiments, the specific structure of the integrated optical chip 100 is Alternatively , which can be seen in Figs.

[0070] 7, the integrated optical chip 100 in FIG. 8 further includes a receiver 60 coupled to the semiconductor optical amplifier 50. The receiver 60 receives the amplified optical signal output by the semiconductor optical amplifier 50. Modulated Light L2 is received and amplified Modulated Light L2, and configured to generate a corresponding electrical signal based on the electrical signal.

[0071] Compared with the integrated optical chip in Fig. 8, the integrated optical chip 100 in Fig. 9 further includes a semiconductor optical amplifier 50 coupled between the laser 40 and the electro-optical modulator 10. The semiconductor optical amplifier 50 between the laser 40 and the electro-optical modulator 10 receives the laser light output by the laser 40, amplifies the laser light, and Amplified The laser light is output to the electro-optic modulator 10 as input light L1.

[0072] Compared with the integrated optical chip in Figure 9, the integrated optical chip 100 in Figure 10 further includes a receiver 60 coupled to the laser 40. The receiver 60 includes: Modulated Light Demodulate L2, Modulated Light It is configured to obtain modulation information held in L2.

[0073] The integrated optical chip 100 shown in FIGS. 7 to 10 can integrate the aforementioned electro-optical modulator 10 in this embodiment and implement all the beneficial effects of the aforementioned electro-optical modulator 10 . [Embodiment 2]

[0074] See both Figures 11 and 12 I want to be done that. The optical modulation system in this embodiment includes an electro-optical modulator, where the electro-optical modulator includes an electrode conversion portion 31. The optical modulation system in this embodiment has the following features: And fruit The structure of the electrode conversion portion 31 is different from that of the optical modulation system 1 in the first embodiment. ,fruit The structure of the electrode conversion portion 11 is different from that of the first embodiment.

[0075] In this embodiment, the electrode conversion portion 31 is spaced apart The first input electrode 311 and the second input electrode 312 are connected to an electrical chip. Separately The first input electrode 311 is configured to receive the first modulated signal S+, and the second input electrode 312 is configured to receive the second modulated signal S− output by the electrical chip 20.

[0076] The two ends of the second input electrode 312 are respectively coupled to the second modulation electrode 122 and the third modulation electrode 123. In other words, the second modulation electrode 122, the second input electrode 312, and the third modulation electrode 123 are sequentially coupled in a head-to-tail manner. The second modulation electrode 122, the second input electrode 312, and the third modulation electrode 123 are surrounded to form a receiving area 317 having an opening 316. The first input electrode 311 is located within the receiving area 317. The first modulation electrode 121 extends from the outside of the receiving area 317 into the receiving area 317 through the opening 316 and is coupled to the first input electrode 311. In this embodiment, the electrode conversion portion 31 has an axisymmetric structure as a whole. Specifically, the electrode conversion portion 31 is axisymmetric with respect to the first modulation electrode 121. The electrode conversion portion 31 is set axisymmetrically. are. This is the first modulated signal S+ and the second modulated signal S- Between This helps ensure symmetry.

[0077] The first modulation electrode 121 is coupled to the first input electrode 311 and configured to receive the first modulation signal S+. The second modulation electrode 122 and the third modulation electrode 123 are coupled to the second input electrode 312. Separately are combined, Separately , and configured to receive the second modulated signal S−.

[0078] In this embodiment, the electro-optic modulator further includes a substrate 33. and the optical modulation part is on the same surface as the substrate 33. The substrate 33 includes a laminated substrate layer 331 and a dielectric layer 332, and the substrate layer 331 is on the surface of the dielectric layer 332, away from the electrode conversion portion 31. In this embodiment, the material of the substrate 33 is the same as the material of the substrate 13 in embodiment 1. Details will not be described again.

[0079] The electro-optical modulator in this embodiment can implement all the beneficial effects of the electro-optical modulator 10 in the first embodiment.

[0080] Please note that the above description is merely a specific implementation of the present application and is not intended to limit the scope of protection of the present application. Any modifications or replacements that can be easily thought of by those skilled in the art within the technical scope disclosed in the present application shall be included in the scope of protection of the present application. Occurred If not, the features in the implementations and implementations of the present application can be combined with each other. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims. (Other possible items) (Item 1) an electrode transduction portion having a first input electrode and a second input electrode, wherein the first input electrode is configured to receive a first modulated signal output by an electrical tip, and the second input electrode is configured to receive a second modulated signal output by the electrical tip; and an optical modulation section having a first modulation electrode, a second modulation electrode, a third modulation electrode, a first modulation arm, and a second modulation arm, wherein the first modulation electrode is between the second modulation electrode and the third modulation electrode, the first modulation arm is between the first modulation electrode and the second modulation electrode, and the second modulation arm is between the first modulation electrode and the third modulation electrode; Equipped with an electro-optic modulator, wherein the first modulation electrode is coupled to the first input electrode and configured to receive the first modulation signal, the second modulation electrode and the third modulation electrode are each coupled to the second input electrode and configured to receive the second modulation signal, respectively, and the first modulation electrode, the second modulation electrode and the third modulation electrode are configured to modulate input light in the first modulation arm and the second modulation arm based on the first modulation signal and the second modulation signal; and the modulated input light is output as modulated light from the first modulation arm and the second modulation arm. (Item 2) Item 1. The electro-optical modulator of item 1, further comprising a substrate, wherein the electrode converting portion and the light modulating portion are on the same surface of the substrate. (Item 3) the electrode conversion portion further includes a bridge portion, the bridge portion being embedded in the substrate, and a portion of the bridge portion being exposed on the surface of the substrate on which the electrode conversion portion is provided; 3. The electro-optic modulator of claim 2, wherein the portion of the bridge section exposed to the substrate is coupled to the first modulation electrode and the first input electrode, respectively. (Item 4) two ends of the second input electrode are respectively coupled to the second modulation electrode and the third modulation electrode, and the second modulation electrode, the second input electrode and the third modulation electrode are surrounded to form a receiving area having an opening; 3. The electro-optical modulator of claim 2, wherein the first input electrode is within the accommodating area, and the first modulation electrode extends from outside the accommodating area into the accommodating area through the opening and is coupled to the first input electrode. (Item 5) Item 5. The electro-optic modulator according to item 4, wherein the electrode conversion structure is an axially symmetric structure. (Item 6) the first modulating electrode, the second modulating electrode, and the third modulating electrode are metal; 6. The electro-optic modulator of any one of items 2 to 5, wherein the light modulation portion further comprises a transparent conductive layer on the substrate, and the first modulation electrode, the second modulation electrode, and the third modulation electrode are on a surface of the transparent conductive layer away from the substrate and are in electrical contact with the transparent conductive layer. (Item 7) 7. The electro-optic modulator of claim 6, wherein the transparent conductive layer is in direct contact with the first modulation arm and the second modulation arm. (Item 8) further comprising a first impedance plate, a second impedance plate, and a third impedance plate; 8. The electro-optic modulator of any one of items 6 to 7, wherein the first impedance plate and the second impedance plate are connected in series with each other and then coupled between the second modulation electrode and the third modulation electrode, the first modulation electrode is coupled to a node between the first impedance plate and the second impedance plate, and the third impedance plate is coupled between the first modulation electrode and the node. (Item 9) 9. The electro-optic modulator of any one of items 1 to 8, wherein the first modulating signal and the second modulating signal are radio frequency signals. (Item 10) 10. The electro-optic modulator of any one of items 1 to 9, wherein the first modulation arm and the second modulation arm are lithium niobate. (Item 11) An electro-optical modulator according to any one of items 1 to 10; and an electrical tip coupled to a first input electrode and a second input electrode, respectively, configured to output a first modulated signal to the first input electrode and a second modulated signal to the second input electrode; An optical modulation system comprising: (Item 12) a laser configured to emit input light; and Item 11. An electro-optic modulator according to any one of items 1 to 10, coupled to the laser and configured to receive the input light, modulate the input light, and output modulated light. An integrated optical chip comprising:

Claims

1. an electrode transduction portion having a first input electrode and a second input electrode, wherein the first input electrode is configured to receive a first modulated signal output by an electrical tip, and the second input electrode is configured to receive a second modulated signal output by the electrical tip; an optical modulation section having a first modulation electrode, a second modulation electrode, a third modulation electrode, a first modulation arm, and a second modulation arm, wherein the first modulation electrode is between the second modulation electrode and the third modulation electrode, the first modulation arm is between the first modulation electrode and the second modulation electrode, and the second modulation arm is between the first modulation electrode and the third modulation electrode; and a substrate on which the first modulation electrode, the second modulation electrode, the third modulation electrode, the first modulation arm, and the second modulation arm are disposed; Equipped with the first modulation electrode is coupled to the first input electrode and configured to receive the first modulation signal, the second modulation electrode and the third modulation electrode are separately coupled to the second input electrode and configured to separately receive the second modulation signal, the first modulation electrode, the second modulation electrode and the third modulation electrode are configured to modulate input light in the first modulation arm and the second modulation arm based on the first modulation signal and the second modulation signal; the modulated input light is output as modulated light from the first modulation arm and the second modulation arm, the light-modulating portion further includes a transparent conductive layer on the substrate, the first modulating electrode, the second modulating electrode, and the third modulating electrode being on a surface of the transparent conductive layer away from the substrate and in electrical contact with the transparent conductive layer; The electro-optic modulator, wherein the first modulation arm and the second modulation arm protrude from a surface of the substrate through the transparent conductive layer in a direction away from the substrate.

2. 2. The electro-optic modulator of claim 1, wherein the electrode conversion portion is on the same surface of the substrate as the light modulation portion.

3. the electrode conversion portion further includes a bridge portion, the bridge portion being embedded in the substrate, a portion of the bridge portion being exposed to the surface of the substrate on which the electrode conversion portion is located; 3. The electro-optic modulator of claim 2, wherein the portion of the bridge section exposed to the substrate is separately coupled to the first modulation electrode and the first input electrode.

4. two ends of the second input electrode are respectively coupled to the second modulation electrode and the third modulation electrode, and the second modulation electrode, the second input electrode and the third modulation electrode are surrounded to form a receiving area having an opening; 3. The electro-optic modulator of claim 2, wherein the first input electrode is within the accommodating area, and the first modulation electrode extends from outside the accommodating area into the accommodating area through the opening and is coupled to the first input electrode.

5. 5. The electro-optic modulator according to claim 4, wherein the electrode conversion portion has an axially symmetric structure.

6. 6. An electro-optic modulator according to claim 1, wherein the first, second and third modulation electrodes are made of metal.

7. 7. The electro-optic modulator of claim 6, wherein the transparent conductive layer is in direct contact with the first modulation arm and the second modulation arm.

8. further comprising a first impedance sheet, a second impedance sheet, and a third impedance sheet; 8. The electro-optic modulator of claim 6 or 7, wherein the first impedance sheet and the second impedance sheet are connected in series with each other and then coupled between the second modulation electrode and the third modulation electrode, the first modulation electrode is coupled to a node between the first impedance sheet and the second impedance sheet, and the third impedance sheet is coupled between the first modulation electrode and the node.

9. 9. An electro-optic modulator according to claim 1, wherein the first modulating signal and the second modulating signal are radio frequency signals.

10. 10. The electro-optic modulator of claim 1, wherein the first modulation arm and the second modulation arm are made of lithium niobate.

11. An electro-optic modulator according to any one of claims 1 to 10; and an electrical tip separately coupled to a first input electrode and a second input electrode, configured to output a first modulated signal to the first input electrode and a second modulated signal to the second input electrode; An optical modulation system comprising:

12. a laser configured to emit input light; and 11. An electro-optic modulator according to any one of claims 1 to 10, coupled to the laser and configured to receive the input light, modulate the input light, and output modulated light. An integrated optical chip comprising:

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