Component mounting machine and component mounting method

Abstract

To load a substrate from a conveyor to a working position with a simple configuration.SOLUTION: The loading from a loading conveyor 211 to the working position Po is performed by a gripper 8 that grips a substrate B. In particular, this gripper 8 is supported by a head unit 5, and the transfer of the substrate B from the loading conveyor 211 to the working position Po is performed by movement of the head unit 5. In other words, the head unit 5, which is essential for mounting the component E, is also used for loading the substrate B from the loading conveyor 211 to the working position Po, and there is no need to add a mechanism for driving the gripper 8.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a technique for mounting components on a board supported at a work position, and more particularly to a technique for transporting the board to the work position. [Background technology]

[0002] In a component mounter, components are mounted on a board supported at a work position. In such a component mounter, a conveyor receives a board from outside the machine and transports it to the work position. Conventionally, transporting a board to the work position has been accomplished using a stopper or a sensor installed near the work position. In the former case, the board is stopped at the work position by hitting the stopper against the board being transported. In the latter case, the board is stopped at the work position by controlling the board's transport based on the results of a sensor detecting the board approaching the work position. In the former method using a stopper, as pointed out in Patent Document 1, an impact is applied to the board when it collides with the stopper. As a result, the board may fall from the work position. Furthermore, in the latter method using a sensor, multiple sensors are required to accurately stop the board at the work position, which can increase costs.

[0003] In contrast, Patent Document 1 provides a transport unit for transporting a board from a conveyor to a work position (mounting position). This transport unit transports the board to the work position by sandwiching the board between a front contact member that contacts the board from the front side and a rear contact member that contacts the board from the rear side, and by moving these front and rear contact members. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-10664 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the above-mentioned Patent Document 1, a drive mechanism is provided for driving two contact members for sandwiching the substrate, and adding such a drive mechanism can lead to a complicated device configuration and increased costs.

[0006] The present invention has been made in view of the above-mentioned problems, and has an object to enable the transfer of a board from a conveyor to a work position to be carried out with a simple configuration. [Means for solving the problem]

[0007] The component mounting machine of the present invention comprises a first conveyor that transports a board in the board transport direction, a board support unit that is arranged downstream of the first conveyor in the board transport direction and supports the board at a predetermined work position, a component supply unit that supplies components, a head unit that mounts the components on the board by transferring the components supplied by the component supply unit to a board supported by the board support unit, a board holding unit that is supported by the head unit and holds the board, and a control unit that performs a transport operation to transport the board to the work position by having the board that is stopped on the first conveyor held by the board holding unit and then moving the head unit.

[0008] The component mounting method of the present invention includes a step of stopping the substrate being transported by the first conveyor in the substrate transport direction, a step of a substrate holding section supported by the head unit holding the substrate stopped on the first conveyor and then the head unit moving to transport the substrate to a work position located downstream of the first conveyor in the substrate transport direction, and a step of mounting the components onto the substrate by the head unit transferring components supplied by the component supply section onto the substrate supported at the work position.

[0009] In the present invention (component mounter and component mounting method) configured in this manner, the head unit transfers components to a board supported at a work position, thereby mounting the components on the board. Furthermore, the board is carried from the conveyor (first conveyor) to the work position by a board holder that holds the board. In particular, this board holder is supported by the head unit, and the board is transferred from the conveyor to the work position by moving the head unit. In other words, the head unit, which is essential for mounting components, is also used to carry the board from the conveyor to the work position, eliminating the need for an additional mechanism to drive the board holder. In this way, the board can be carried from the conveyor to the work position with a simple configuration.

[0010] The mounter may also be configured to include a board sensor that detects a board supported by the first conveyor, and when the board sensor detects the board, the control unit moves the head unit to move the board holder toward the board supported by the first conveyor and start a transfer operation. In this configuration, the first conveyor receives a board from outside, and when the board sensor detects the board, it can start carrying the board into the work position. In this way, the board can be quickly carried into the work position depending on the timing when the first conveyor receives the board.

[0011] The mounter may also be configured so that the board holding unit is a gripper that grips the board, and the control unit performs the transfer operation by having the gripper grip the board that has stopped on the first conveyor and then moving the head unit. With this configuration, the board can be securely held by the gripper, and the board can be reliably transported to the work position.

[0012] The mounter may also be configured so that the gripper has a contact portion that contacts the board, and the control unit causes the contact portion of the gripper to contact the board stopped on the first conveyor, and then causes the gripper to grip the board. In this configuration, the contact portion can be brought into contact with the board, positioning the gripper relative to the board, and the gripper can grip the board. Therefore, the board can be securely held by the gripper, and the board can be reliably transported to the work position.

[0013] The mounter may also be configured so that the gripper has an upper gripping member and a lower gripping member facing the upper gripping member from below, and the upper and lower gripping members grip the board vertically. In this configuration, the board can be securely held by the upper and lower gripping members of the gripper, and the board can be reliably transported to the work position.

[0014] The mounter may also be configured such that the control unit causes the gripper to grip the board by performing a facing operation in which the upper gripping member faces the upper surface of the board at a distance and the lower gripping member faces the lower surface of the board at a distance, an upper abutting operation in which the upper gripping member is lowered after the facing operation to abut against the upper surface of the board, and a lower abutting operation in which the lower gripping member is raised after the upper abutting operation to abut against the lower surface of the board. In this configuration, when the upper gripping member abuts against the board from above during the upper abutting operation, the first conveyor supports the board from below. Therefore, it is possible to prevent the position of the board from changing when the upper gripping member abuts against the board. Furthermore, when the lower gripping member abuts against the board from below during the lower abutting operation, the upper gripping member abuts against the board from above. Therefore, it is possible to prevent the position of the board from changing when the lower gripping member abuts against the board. In this way, the substrate can be firmly gripped by the grippers while suppressing fluctuations in the position of the substrate due to contact between the upper gripping member and the lower gripping member.

[0015] The mounter may also be configured so that the upper gripping member has an upper contact member that contacts the upper surface of the board, and the lower gripping member has a lower contact member that contacts the lower surface of the board, the upper and lower contact members being made of silicone resin or rubber. In this configuration, the upper and lower gripping members contact the board through a highly elastic material such as silicone resin or rubber. This makes it possible to prevent damage to the board caused by gripping by the grippers.

[0016] The mounter may also be configured so that the upper contact member has upper surface contact protrusions that protrude downward and contact the upper surface of the board, and the lower contact member has lower surface contact protrusions that protrude upward and contact the lower surface of the board. In this configuration, the board is held by the gripper while being sandwiched between the protrusions on both the top and bottom sides. This allows the board to be firmly held by the gripper.

[0017] The mounter may also be configured so that the gripper has a support shaft that extends vertically and supports the upper and lower gripping members, and at least one of the upper and lower gripping members is slidable vertically relative to the support shaft. In this configuration, the board can be firmly gripped by the upper and lower gripping members supported by the support shaft.

[0018] The component mounter may also be configured so that the head unit has multiple mounting heads, each having an attachment section to which a suction nozzle is detachably attached, and the mounting head has an attachment section to which a suction nozzle is detachably attached so as to suck components onto the suction nozzle by supplying negative pressure to the suction nozzle attached to the attachment section, and the gripper has an attachment section that is detachable from the attachment section of the mounting head, and the mounting head supplies negative pressure to the gripper attached to the attachment section by the attachment section, thereby bringing the upper gripping member and the lower gripping member close to each other and sandwiching the substrate between the upper gripping member and the lower gripping member. With this configuration, gripping of the substrate by the gripper can be performed simply by performing the simple operation of attaching the gripper to the mounting head instead of the suction nozzle.

[0019] The mounter may also be configured so that the board holder is a suction head that suctions the board, and the control unit performs the transfer operation by having the suction head suction the board stopped on the first conveyor and then moving the head unit. With this configuration, the board can be securely held by the suction head while being reliably transported to the work position.

[0020] The mounter may also be configured so that the suction head has a contact member that contacts the top surface of the board, and the contact member is made of silicone resin or rubber. In this configuration, the suction head contacts the board via a highly elastic material such as silicone resin or rubber. This makes it possible to prevent damage to the board caused by suction by the suction head.

[0021] The component mounter may also be configured so that the head unit has multiple mounting heads, each having an attachment section to which a suction nozzle is detachably attached, and the mounting head has an attachment section detachably attachable to the attachment section of the mounting head, and the attachment section supplies negative pressure to the suction head attached to the attachment section, causing the suction head to suction the board. With this configuration, the suction head can suction the board simply by performing the simple operation of attaching the suction head to the mounting head instead of the suction nozzle.

[0022] The mounter may also be configured to further include a second conveyor disposed downstream of the board support unit in the board transport direction and transporting the board in the board transport direction, and the control unit causes the board supported at the work position of the board support unit to be held by the board holding unit, and then moves the head unit to transfer the board onto the second conveyor. In this configuration, the head unit, which is essential for mounting components, is also used to transport the board from the work position to the conveyor (second conveyor), eliminating the need for an additional mechanism to drive the board holding unit. Therefore, it is possible to transport the board from the work position to the conveyor with a simple configuration.

[0023] The mounter may also be configured so as to further include a second conveyor disposed downstream of the board support unit in the board transport direction and transporting the board in the board transport direction, and the control unit causes the board supported at the work position of the board support unit to be held by the board holding unit, and then moves the head unit to place the board on the board support unit and the second conveyor so that the board straddles the board support unit and the second conveyor, and then performs an assist operation of pushing the board from the upstream side to the downstream side in the board transport direction with the board holding unit to transfer the board onto the second conveyor. With this configuration, the board can be transported out even if it is too large in the board transport direction to fit on the second conveyor.

[0024] The mounter may also be configured so that the control unit causes the second conveyor to transport the board downstream in the board transport direction in parallel with the assisting operation, and stops the assisting operation when it confirms that the force required to push the board by the board holder has decreased. With this configuration, the assisting operation can be stopped when most or all of the board has moved to the second conveyor and the force required for the assisting operation has decreased. [Effects of the Invention]

[0025] As described above, according to the present invention, it is possible to carry a substrate from a conveyor to a work position with a simple configuration. [Brief explanation of the drawings]

[0026] [Figure 1] 1 is a plan view schematically showing the configuration of an example of a component mounter according to the present invention; [Figure 2] FIG. 2 is a front view schematically showing a part of the component mounter of FIG. [Figure 3] FIG. 2 is a block diagram showing an electrical configuration of the component mounter of FIG. 1. [Figure 4] 3A and 3B are diagrams schematically showing the configuration and operation of a gripper attached to the mounting head. [Figure 5]10 is a flowchart showing an example of an operation of mounting components on a board carried into a work position and then carrying the board out of the work position. [Figure 6] 6 is a flowchart showing an example of a substrate loading operation executed in step S101 of FIG. 5. [Figure 7A] 7A and 7B are diagrams schematically showing details of the substrate loading operation in FIG. 6; [Figure 7B] 7A and 7B are diagrams schematically showing details of the substrate loading operation in FIG. 6; [Figure 8] 6 is a flowchart showing an example of the substrate unloading operation executed in step S111 of FIG. 5. [Figure 9A] 9 is a diagram schematically showing details of the substrate carrying-out operation in FIG. 8. FIG. [Figure 9B] 9 is a diagram schematically showing details of the substrate carrying-out operation in FIG. 8. FIG. [Figure 10] FIG. 2 is a diagram schematically illustrating the configuration of a suction head attached to a mounting head. [Figure 11] 7 is a flowchart showing a modified example of the substrate loading operation executed in step S101 of FIG. 5. [Figure 12] 12 is a diagram schematically showing details of the substrate loading operation of FIG. 11. FIG. [Figure 13] 7 is a flowchart showing a modified example of the substrate carrying-out operation executed in step S111 of FIG. [Figure 14] 14 is a diagram schematically showing details of the substrate carrying-out operation in FIG. 13. FIG. [Figure 15] 10 is a flowchart showing another modified example of the substrate loading operation. [Figure 16] 10 is a flowchart showing another modified example of the substrate carrying-out operation. [Figure 17] 17A and 17B are diagrams schematically showing details of the substrate loading operation in FIG. 16. DETAILED DESCRIPTION OF THE INVENTION

[0027] Fig. 1 is a plan view schematically showing the configuration of an example of a component mounter according to the present invention, Fig. 2 is a front view schematically showing a part of the component mounter of Fig. 1, and Fig. 3 is a block diagram showing the electrical configuration of the component mounter of Fig. 1. In Fig. 1, Fig. 2 and the following figures, the X direction, which is the horizontal direction, the Y direction, which is the horizontal direction perpendicular to the X direction, and the Z direction, which is the vertical direction, are shown as appropriate.

[0028] 3, the component mounter 1 includes a controller 100 that performs overall control of the entire device. The controller 100 includes an arithmetic processing unit 110, which is a processor configured with a CPU (Central Processing Unit) and RAM (Random Access Memory). The controller 100 further includes a drive control unit 120, a negative pressure control unit 130, a clamp control unit 140, an imaging control unit 150, and a sensor control unit 160, and the respective control units 120, 130, 140, 150, and 160 execute control based on commands from the arithmetic processing unit 110, thereby performing operations described below. Each of these control units 120, 130, 140, 150, and 160 is configured, for example, by an electronic board on which an integrated circuit or the like is mounted.

[0029] The mounter 1 also includes a UI (User Interface) 190. The UI 190 is configured by, for example, a touch panel display, and the arithmetic processing unit 110 displays the operating status of the mounter 1 on the UI 190 and transmits instructions from an operator input to the UI 190 to the arithmetic processing unit 110. As a result, the arithmetic processing unit 110 transmits commands according to the instructions from the operator to the respective control units 120, 130, 140, 150, and 160, and operations according to these instructions are executed.

[0030] 1, the component mounter 1 includes a board carry-in unit 21 that carries in a board B from the upstream side in the X direction (board transport direction), a board support unit 22 that supports the board B at a predetermined work position Po (the position of the board B in FIG. 1), and a board carry-out unit 23 that carries out the board B downstream in the X direction. The board carry-in unit 21, board support unit 22, and board carry-out unit 23 are arranged in this order in the X direction.

[0031] The board carry-in section 21 has a pair of carry-in conveyors 211 arranged in parallel in the X direction. Each carry-in conveyor 211 is a belt conveyor arranged parallel to the X direction. In the Y direction, the spacing between these carry-in conveyors 211 is variable according to the width of the board B. Each carry-in conveyor 211 is connected to a carry-in motor Mci (FIG. 3), and when the drive control section 120 outputs a transport command to the carry-in motor Mci, the carry-in motor Mci rotates each carry-in conveyor 211, and the board B on each carry-in conveyor 211 is transported in the X direction. Note that a board detection position Pd for detecting the board B is provided for the board carry-in section 21. Details of detection of the board B at this board detection position Pd will be described later.

[0032] The substrate unloading section 23 has a pair of unloading conveyors 231 arranged in parallel in the X direction. Each unloading conveyor 231 is a belt conveyor arranged parallel to the X direction. In the Y direction, the spacing between these unloading conveyors 231 is variable according to the width of the substrate B. Each unloading conveyor 231 is connected to an unloading motor Mco (FIG. 3), and when the drive control section 120 outputs a transport command to the unloading motor Mco, the unloading motor Mco rotates each unloading conveyor 231, and the substrate B on each unloading conveyor 231 is transported in the X direction.

[0033] In the X direction, the substrate support unit 22 is disposed between the substrate load unit 21 and the substrate unload unit 23. The substrate support unit 22 has a pair of support rails 221 arranged in parallel in the X direction. In the Y direction, the spacing between these support rails 221 is variable depending on the substrate B. Each support rail 221 extends parallel to the X direction, and the upper surface of each support rail 221 is horizontal. Each support rail 221 supports the substrate B placed on its upper surface from below. Furthermore, the substrate support unit 22 has a clamper 222 provided on each support rail 221. Each clamper 222 clamps the substrate B supported at the work position Po by the corresponding support rail 221, thereby fixing the substrate B at the work position Po. Fixing and releasing the substrate B by each clamper 222 are performed by the clamp control unit 140, which controls each clamper 222 in response to commands from the calculation processing unit 110.

[0034] In this component mounter 1, the board carry-in unit 21 transports the board B received from outside the component mounter 1 in the X direction, and the board B is transferred to the board support unit 22 and fixed at the work position Po. Furthermore, the board carry-out unit 23 sends the board B transferred from the board support unit 22 out to the outside of the component mounter 1. The transfer of the board B from the board carry-in unit 21 to the board support unit 22 and the transfer of the board B from the board support unit 22 to the board carry-out unit 23 will be described in detail later.

[0035] Two component supply units 3 are aligned in the X direction on each side of the board support unit 22 in the Y direction, and each component supply unit 3 has multiple tape feeders 4 aligned in the X direction. Each tape feeder 4 has a component supply position 40 at its tip on the board support unit 22 side, and supplies components E to the component supply position 40. Specifically, multiple component supply reels are aligned corresponding to the multiple tape feeders 4, and each component supply reel stores multiple components E aligned at a predetermined pitch. The tape feeders 4 then intermittently transport the component supply tape pulled out from the corresponding component supply reel to the component supply position 40 at that pitch, thereby supplying the components E stored on the component supply tape to the component supply position 40. The components E are, for example, integrated circuits, transistors, or capacitors. Thus, in the component supply unit 3, multiple component supply positions 40 are aligned in the X direction, and components E are supplied to each component supply position 40.

[0036] The mounter 1 also includes a head unit 5 that mounts components E supplied to the component supply position 40 onto a board B at the work position Po, and an XY drive mechanism 6 that drives the head unit 5 in the X and Y directions. The XY drive mechanism 6 includes a pair of Y-axis rails 61 extending parallel to the Y direction, a Y-axis ball screw 62 extending parallel to the Y direction, and a Y-axis motor My that rotates the Y-axis ball screw 62. The XY drive mechanism 6 also includes an X-axis rail 63 extending parallel to the X direction, an X-axis ball screw 64 extending parallel to the X direction, and an X-axis motor Mx that rotates the X-axis ball screw 64. The X-axis ball screw 64 and the X-axis motor Mx are attached to the X-axis rail 63 and move integrally with the X-axis rail 63. The X-axis rail 63 is supported by the pair of Y-axis rails 61 so as to be movable in the Y direction, and is fixed to a nut of the Y-axis ball screw 62. Furthermore, the head unit 5 is supported by an X-axis rail 63 so as to be movable in the X direction, and is fixed to a nut of an X-axis ball screw 64. Therefore, the drive control unit 120 can move the head unit 5 in the Y direction by rotating the Y-axis ball screw 62 with the Y-axis motor My, and can move the head unit 5 in the X direction by rotating the X-axis ball screw 64 with the X-axis motor Mx.

[0037] The head unit 5 has multiple mounting heads 51 arranged in the X direction, and a suction nozzle N is detachably attached to the bottom end of each mounting head 51. The head unit 5 also has a Z-axis motor Mz that drives the mounting head 51 in the Z direction and an R-axis motor Mr that rotates the mounting head 51 in the R direction. The R direction is the rotation direction around a rotation axis parallel to the Z direction. The component mounter 1 has a negative pressure generator 71 that communicates with the internal flow path of each mounting head 51. The negative pressure generated by the negative pressure generator 71 in response to a command from the negative pressure control unit 130 is supplied to the suction nozzle N attached to the mounting head 51 via the internal flow path. The head unit 5 transfers the component E from the component supply position 40 to the board B by suctioning the component E onto the suction nozzle N using the negative pressure supplied to the suction nozzle N. The negative pressure generator 71 can be, for example, a negative pressure pump or an ejector.

[0038] The component mounter 1 also has a board recognition camera 72 that is attached to the head unit 5 and moves integrally with the head unit 5. The board recognition camera 72 faces the board B supported at the work position Po from above, and captures an image of the board B in response to a command from the imaging control unit 150. In particular, the imaging control unit 150 acquires a board image by capturing an image of the fiducial mark Bm attached to the board B with the board recognition camera 72, and the arithmetic processing unit 110 recognizes the position of the board B based on the board image received from the imaging control unit 150.

[0039] Furthermore, the component mounter 1 has a distance sensor 73 that is attached to the head unit 5 and moves integrally with the head unit 5. The distance sensor 73 faces the board B supported at the work position Po from above, measures the distance to the board B, and transmits the measured value to the sensor control unit 160. The calculation processing unit 110 also recognizes the height of the board B based on the measurement result of the distance sensor 73 received from the sensor control unit 160.

[0040] Furthermore, instead of the suction nozzle N, a gripper 8 for gripping the substrate B can be attached to the lower end of the mounting head 51. Figure 4 is a diagram showing the configuration and operation of the gripper attached to the mounting head. Gripper 8 has an upper jaw member 81 and a lower jaw member 82 that faces upper jaw member 81 from below.

[0041] The upper jaw component 81 has an upper jaw frame 811 extending in the X direction, and a contact component 812 attached to the underside of the upper jaw frame 811. The contact component 812 has an uneven shape, with multiple protrusions 812a protruding downward and arranged in the X direction. The arrangement direction of the protrusions 812a is not limited to the X direction, and may also be the Y direction. The contact component 812 is made of silicone resin or rubber.

[0042] Lower jaw component 82 has lower jaw frame 821 extending horizontally, and contact component 822 attached to the upper surface of lower jaw frame 821. Contact component 822 is provided with an uneven shape, and multiple convex portions 822a protruding upward are arranged in the X direction. Note that the arrangement direction of convex portions 822a is not limited to the X direction, and may also be the Y direction. This contact component 822 is made of silicone resin or rubber.

[0043] The gripper 8 also has a guide shaft 831 that protrudes downward from the upper jaw frame 811. This guide shaft 831 extends parallel to the Z direction. The gripper 8 also has a contact member 84 that protrudes upward from the lower jaw frame 821. This contact member 84 extends parallel to the Z direction. A guide hole 832 opens on the upper surface of the contact member 84. The guide hole 832 extends parallel to the Z direction inside the contact member 84 and the lower jaw frame 821, and the guide shaft 831 is fitted into the guide hole 832 from above. In other words, the guide shaft 831 is slidable relative to the guide hole 832 in the Z direction, making the distance between the upper jaw member 81 and the lower jaw member 82 variable.

[0044] Furthermore, the gripper 8 has a reinforcing shaft 85 extending parallel to the Z direction. The reinforcing shaft 85 is disposed on the opposite side of the guide shaft 831 from the contact member 812 and on the opposite side of the abutment member 84 from the contact member 822. The upper jaw frame 811 is provided with a through-hole 851 extending parallel to the Z direction, and the reinforcing shaft 85 is inserted into the through-hole 851 of the upper jaw frame 811, and the lower end of the reinforcing shaft 85 is fixed to the lower jaw frame 821. This reinforcing shaft 85 supports the upper jaw member 81 relative to the lower jaw member 82 so that the upper jaw member 81 can slide in the Z direction.

[0045] The gripper 8 also has a protrusion 86 that protrudes upward from the upper surface of the upper jaw frame 811, and a flange 861 that protrudes horizontally is provided at the upper end of the protrusion 86. A suction flow path 87 opens at the upper surface of this flange 861, and the suction flow path 87 communicates with the guide hole 832 via the protrusion 86, the upper jaw frame 811, and the inside of the guide shaft 831.

[0046] In contrast, the mounting head 51 has a head shaft 511 extending parallel to the Z direction and a pair of leaf springs 512 protruding downward from the lower end of the head shaft 511. When a flange 861 is pressed from below between the pair of leaf springs 512 facing each other in the X direction, the flange 861 enters between the pair of leaf springs 512 while pushing the pair of leaf springs 512 apart. As a result, the flange 861 engages with the pair of leaf springs 512, and the gripper 8 is attached to the mounting head 51. Furthermore, when the flange 861 is pulled downward from between the pair of leaf springs 512, the flange 861 retracts from between the pair of leaf springs 512 while pushing the space between them apart. As a result, the flange 861 disengages from the pair of leaf springs 512, and the gripper 8 is removed from the mounting head 51. Note that the suction nozzle N is similarly attached to and detached from the pair of leaf springs 512, thereby being attached to and detached from the mounting head 51.

[0047] The suction flow path 87 of the gripper 8 attached to the mounting head 51 communicates with the flow path inside the mounting head 51. Therefore, the negative pressure supplied by the negative pressure generator 71 to the flow path of the mounting head 51 is supplied to the guide hole 832 via the suction flow path 87. The negative pressure in this guide hole 832 brings the upper jaw member 81 and the lower jaw member 82 closer to each other, and the operation shown in the "close state" in Fig. 4 is performed. On the other hand, when the negative pressure generator 71 stops supplying the negative pressure, the upper jaw member 81 and the lower jaw member 82 move away from each other, and the operation shown in the "separated state" in Fig. 4 is performed.

[0048] 5 is a flowchart showing an example of the operation of mounting components on a board carried into a work position and then carrying the board out of the work position. The flowchart in FIG.

[0049] In step S101, a substrate carry-in operation is performed. Fig. 6 is a flowchart showing an example of the substrate carry-in operation performed in step S101 of Fig. 5, and Figs. 7A and 7B are diagrams schematically showing details of the substrate carry-in operation of Fig. 6. In step S201, the X-axis motor Mx and the Y-axis motor My drive the head unit 5, thereby causing the distance sensor 73 to face a substrate detection position Pd (Fig. 2) set with respect to the substrate carry-in section 21. This substrate detection position Pd is located between both ends of the carry-in conveyor 211 in the X direction, and between the pair of carry-in conveyors 211 in the Y direction. Then, when the distance sensor 73 detects that the substrate B, being transported in the X direction by the loading conveyor 211 of the substrate loading section 21, has reached the substrate detection position Pd ("YES" in step S202), the X-axis motor Mx, the Y-axis motor My, the Z-axis motor Mz, and the R-axis motor Mr drive the head unit 5, thereby causing the abutment member 84 of the gripper 8 to abut against the substrate B (step S203).

[0050] Specifically, the carry-in conveyor 211 stops the board B after the board B reaches the board detection position Pd. Meanwhile, the abutment member 84 faces the board B stopped on the carry-in conveyor 211 from the downstream side in the X direction at an interval, and then moves upstream in the X direction to abut against the board B (step S203). As a result, the abutment member 84 abuts against the downstream end of the board B in the X direction. At this time, for example, the abutment between the abutment member 84 and the board B can be confirmed based on an increase in the load of the X-axis motor Mx that drives the head unit 5, thereby causing the abutment member 84 to abut against the board B. Alternatively, the stop position of the board B can be determined by confirming the distance that the carry-in conveyor 211 has transported the board B since the board B reached the board detection position Pd using the output of the encoder of the carry-in motor Mci, and the abutment member 84 can be moved to this stop position to cause the abutment member 84 to abut against the board B.

[0051] In addition, when the abutting member 84 is in contact with the substrate B, the upper jaw member 81 faces the upper surface of the substrate B from above with a gap therebetween, and the lower jaw member 82 faces the lower surface of the substrate B from below with a gap therebetween. Furthermore, no negative pressure is supplied to the suction flow path 87 of the gripper 8, and the upper jaw member 81 and the lower jaw member 82 are spaced apart (spaced state).

[0052] In step S204, the Z-axis motor Mz lowers the gripper 8, causing the contact member 812 of the upper jaw member 81 to abut against the upper surface of the substrate B. At this time, the contact member 812 abuts against the upper surface of the substrate B by a plurality of protrusions 812a.

[0053] In step S205, the negative pressure generator 71 supplies negative pressure to the suction flow path 87 of the gripper 8 to raise the lower jaw member 82, thereby bringing the contact member 822 of the lower jaw member 82 into contact with the lower surface of the substrate B. At this time, the contact member 822 comes into contact with the lower surface of the substrate B by means of the multiple protrusions 822a.

[0054] When the substrate B is gripped in the Z direction by the upper jaw member 81 and the lower jaw member 82 in steps S204 and S205, the Z-axis motor Mz raises the gripper 8 (step S206). As a result, the substrate B rises together with the gripper 8 and moves upward away from the carry-in conveyor 211 of the substrate carry-in section 21.

[0055] In step S207, the X-axis motor Mx moves the head unit 5 in the X direction, thereby causing the substrate B to face the working position Po from above. In step S208, the Z-axis motor Mz lowers the gripper 8, thereby placing the substrate B at the working position Po provided on the substrate support part 22. As a result, the substrate B positioned at the working position Po is supported by the pair of support rails 221 of the substrate support part 22. Then, in step S209, the clamper 222 clamps the substrate B, thereby fixing the substrate B at the working position Po.

[0056] In step S210, negative pressure generator 71 stops supplying negative pressure to suction flow path 87 to lower lower jaw member 82, and Z-axis motor Mz raises upper jaw member 81. As a result, lower jaw member 82 moves downward from the lower surface of substrate B, and upper jaw member 81 moves upward from the upper surface of substrate B, and the grip of substrate B by upper jaw member 81 and lower jaw member 82 is released.

[0057] The order of clamping the substrate B in step S209 and releasing the grip by the gripper 8 in step S210 is not limited to this example. Therefore, the substrate B may be clamped after the grip by the gripper 8 is released.

[0058] Returning to Figure 5, the explanation will continue. Once board B has been loaded into work position Po by the board loading operation of step S101, board recognition is executed in step S102. That is, the X-axis motor Mx and the Y-axis motor My drive the head unit 5, causing board recognition camera 72 to face fiducial mark Bm of board B from above. Then, board recognition camera 72 captures an image of the fiducial mark Bm to obtain a board image, and calculation processing unit 110 recognizes the position of board B based on the board image.

[0059] In step S103, the X-axis motor Mx and the Y-axis motor My drive the head unit 5, causing the suction nozzle N to face the component supply position 40 from above. In step S104, the Z-axis motor Mz lowers the suction nozzle N so that it abuts against the component E supplied to the component supply position 40, and in step S105, the negative pressure generator 71 supplies negative pressure to the suction nozzle N, causing the suction nozzle N to pick up the component E. Then, in step S106, the Z-axis motor Mz raises the suction nozzle N. In this way, the suction nozzle N picks up the component E from the component supply position 40.

[0060] In step S107, the X-axis motor Mx and the Y-axis motor My drive the head unit 5 to move the suction nozzle N from above to face the mounting position on the board B, and in step S108 the Z-axis motor Mz lowers the suction nozzle N. This causes the component E picked up by the suction nozzle N to abut against the mounting position on the board B. Then, in step S109, the negative pressure generator 71 stops supplying negative pressure to the suction nozzle N, and the component E is released from the suction nozzle N and placed in the mounting position on the board B. At this time, a positive pressure may be supplied to the suction nozzle N to ensure that the component E is released from the suction nozzle N.

[0061] Once component E has been mounted in the mounting position on board B in this manner, it is confirmed whether mounting of component E in all mounting positions provided on board B has been completed (step S110). If there are mounting positions where component E has not been mounted (if "NO" in step S110), steps S103 to S109 are executed. On the other hand, if mounting of component E in all mounting positions has been completed (if "YES" in step S110), the board unloading operation of step S111 is executed.

[0062] Fig. 8 is a flowchart showing an example of the substrate carrying-out operation executed in step S111 of Fig. 5, and Fig. 9A and Fig. 9B are diagrams schematically showing details of the substrate carrying-out operation of Fig. 8. In step S301, the X-axis motor Mx, the Y-axis motor My, the Z-axis motor Mz, and the R-axis motor Mr drive the head unit 5, thereby bringing the abutment member 84 of the gripper 8 into contact with the substrate B located at the work position Po (step S301).

[0063] Specifically, by performing the same procedure as in step S203 above, the abutment member 84 is brought into contact with the downstream end of the substrate B in the X direction. As a result, the upper jaw member 81 faces the upper surface of the substrate B from above with a gap therebetween, and the lower jaw member 82 faces the lower surface of the substrate B from below with a gap therebetween. Furthermore, no negative pressure is supplied to the suction flow path 87 of the gripper 8, and the upper jaw member 81 and the lower jaw member 82 are spaced apart (spaced state).

[0064] In step S302, the Z-axis motor Mz lowers the gripper 8, causing the contact member 812 of the upper jaw member 81 to abut against the upper surface of the substrate B. At this time, the contact member 812 abuts against the upper surface of the substrate B by a plurality of protrusions 812a.

[0065] In step S303, the negative pressure generator 71 supplies negative pressure to the suction flow path 87 of the gripper 8 to raise the lower jaw member 82, thereby bringing the contact member 822 of the lower jaw member 82 into contact with the lower surface of the substrate B. At this time, the contact member 822 comes into contact with the lower surface of the substrate B by means of the multiple protrusions 822a.

[0066] When substrate B is gripped in the Z direction by upper jaw member 81 and lower jaw member 82 through steps S302 and S303, clamper 222 releases the clamp on substrate B (step S304). Note that the timing for releasing the clamp on substrate B is not limited to this example, and for example, the clamp on substrate B may be released before step S301.

[0067] In this state, the Z-axis motor Mz raises the gripper 8 while the clamped substrate B is being held by the gripper 8 (step S305). The substrate B rises along with the gripper 8 and moves upward away from the support rails 221 of the substrate support portion 22.

[0068] In step S306, the X-axis motor Mx moves the head unit 5 in the X direction, thereby causing the upper side of the substrate B to face the substrate discharge section 23. In step S307, the Z-axis motor Mz lowers the gripper 8, thereby placing the substrate B on the substrate discharge section 23. As a result, the substrate B is supported by the pair of discharge conveyors 231 of the substrate discharge section 23.

[0069] In step S308, negative pressure generator 71 stops supplying negative pressure to suction flow path 87 to lower lower jaw member 82, and Z-axis motor Mz raises upper jaw member 81. As a result, lower jaw member 82 moves downward from the lower surface of substrate B, and upper jaw member 81 moves upward from the upper surface of substrate B, releasing the grip of substrate B by upper jaw member 81 and lower jaw member 82. Substrate B, which has been transferred from substrate support unit 22 to substrate discharge unit 23 in this manner, is carried to the outside of component mounter 1 by substrate discharge unit 23 (step S309).

[0070] In the embodiment described above, the head unit 5 transfers components E to the board B supported at the work position Po, thereby mounting the components E on the board B (steps S103 to S110). Furthermore, the board B is carried from the carry-in conveyor 211 (first conveyor) to the work position Po by a gripper 8 (board holding unit) that grips the board B (steps S203 to S208). In particular, the gripper 8 is supported by the head unit 5, and the board B is transferred from the carry-in conveyor 211 to the work position Po by moving the head unit 5 (step S207). In other words, the head unit 5, which is essential for mounting components E, is also used to carry the board B from the carry-in conveyor 211 to the work position Po, and there is no need to add a mechanism to drive the gripper 8. In this way, the board B can be carried from the carry-in conveyor 211 to the work position Po with a simple configuration.

[0071] The above embodiment can also achieve the following effect. That is, the transfer of substrate B to the work position Po can be performed, for example, by controlling the transport position of substrate B by the belt conveyor while detecting the transport position of substrate B with a sensor. However, this method requires a sensor to be provided near the work position Po. In contrast, the above embodiment does not require such a sensor to be provided near the work position Po, which is advantageous in terms of cost.

[0072] Alternatively, the transfer of the substrate B to the work position Po can be carried out by, for example, causing the substrate B being transported by the belt conveyor to collide with a stopper provided at the work position Po. However, with this method, there is a possibility that the substrate B may fall due to the impact caused by the collision with the stopper. In contrast, in the above embodiment, a stopper is not used, and the occurrence of the substrate B falling can be prevented.

[0073] Furthermore, a distance sensor 73 (substrate sensor) is provided that detects the board B supported by the carry-in conveyor 211. When the distance sensor 73 detects the board B, the controller 100 moves the head unit 5 to move the gripper 8 toward the board B supported by the carry-in conveyor 211 (step S203), and starts a transfer operation (steps S204 to S208) to transfer the board B from the carry-in conveyor 211 to the work position Po. In this configuration, when the carry-in conveyor 211 receives the board B from the outside and the distance sensor 73 detects this board B (YES in step S202), the board B can start being carried into the work position Po (steps S204 to S208). In this way, the board B can be quickly carried into the work position Po in accordance with the timing at which the carry-in conveyor 211 receives the board B.

[0074] Furthermore, the controller 100 performs a transfer operation by having the gripper 8 grip the substrate B stopped on the carry-in conveyor 211 and then moving the head unit 5 (steps S204 to S208). With this configuration, the substrate B can be securely gripped by the gripper 8 and can be reliably carried into the work position Po.

[0075] Furthermore, the gripper 8 has a contact member 84 (contact portion) that contacts the board B, and the controller 100 causes the contact member 84 of the gripper 8 to contact the board B stopped on the carry-in conveyor 211 (step S203), and then causes the gripper 8 to grip the board B (steps S204 and S205). With this configuration, the contact member 84 is brought into contact with the board B, allowing the gripper 8 to position the gripper 8 relative to the board B and grip the board B. Therefore, the board B can be securely gripped by the gripper 8, and the board B can be reliably carried into the work position Po.

[0076] Further, the gripper 8 has an upper jaw member 81 (upper gripping member) and a lower jaw member 82 (lower gripping member) facing the upper jaw member 81 from below, and the upper jaw member 81 and the lower jaw member 82 grip the substrate B from the Z direction. With this configuration, the upper jaw member 81 and the lower jaw member 82 of the gripper 8 can firmly grip the substrate B, and the substrate B can be reliably carried into the work position Po.

[0077] Furthermore, controller 100 causes gripper 8 to grip substrate B by causing gripper 8 to perform an opposing operation (step S203) in which upper jaw member 81 faces the upper surface of substrate B with a gap therebetween and lower jaw member 82 faces the lower surface of substrate B with a gap therebetween, an upper contact operation (step S204) in which upper jaw member 81 is lowered after the opposing operation to contact the upper surface of substrate B, and a lower contact operation (step S205) in which lower jaw member 82 is raised after the upper contact operation to contact the lower surface of substrate B. In this configuration, when upper jaw member 81 contacts substrate B from above in step S204 (upper contact operation), input conveyor 211 supports substrate B from below. Therefore, it is possible to prevent the position of substrate B from fluctuating as upper jaw member 81 contacts substrate B. Furthermore, when lower jaw component 82 contacts substrate B from below in step S205 (lower contact operation), upper jaw component 81 contacts substrate B from above. Therefore, it is possible to suppress fluctuations in the position of substrate B due to contact of lower jaw component 82 with substrate B. In this way, substrate B can be firmly gripped by gripper 8 while suppressing fluctuations in the position of substrate B due to contact of upper jaw component 81 and lower jaw component 82.

[0078] Furthermore, upper jaw member 81 has contact member 812 (upper contact member) that contacts the upper surface of substrate B, and lower jaw member 82 has contact member 822 (lower contact member) that contacts the lower surface of substrate B. Contact member 812 and contact member 822 are made of silicone resin or rubber. In this configuration, upper jaw member 81 and lower jaw member 82 contact substrate B through a highly elastic material such as silicone resin or rubber (contact member 812 and contact member 822). This makes it possible to prevent damage to substrate B caused by gripping by gripper 8.

[0079] Furthermore, contact member 812 of upper jaw member 81 has a convex portion 812a (upper surface contact convex portion) that protrudes downward, and convex portion 812a comes into contact with the upper surface of substrate B, while contact member 822 of lower jaw member 82 has a convex portion 822a (lower surface contact convex portion) that protrudes upward, and convex portion 822a comes into contact with the lower surface of substrate B. In this configuration, substrate B is gripped by gripper 8 while being sandwiched between convex portions 812a and 822a from both the top and bottom. Therefore, substrate B can be firmly gripped by gripper 8.

[0080] Furthermore, the gripper 8 has a reinforcing shaft 85 (support shaft) that extends in the Z direction and supports the upper jaw member 81 and the lower jaw member 82, and the upper jaw member 81 is slidable in the Z direction relative to the reinforcing shaft 85. In this configuration, the upper jaw member 81 and the lower jaw member 82 supported by the reinforcing shaft 85 can firmly grip the substrate B.

[0081] The head unit 5 also has a plurality of mounting heads 51, and each mounting head 51 has a pair of leaf springs 512 (mounting portions) to which a suction nozzle N is detachably attached. The mounting head 51 applies negative pressure to the suction nozzle N attached to the pair of leaf springs 512, thereby suctioning a component E to the suction nozzle N. The gripper 8 also has a flange 861 (mounting portion) that is detachable from the pair of leaf springs 512 of the mounting head 51, and the mounting head 51 applies negative pressure to the gripper 8 attached to the pair of leaf springs 512 via the flange 861, thereby bringing the upper jaw member 81 and the lower jaw member 82 close to each other and sandwiching the board B between the upper jaw member 81 and the lower jaw member 82. With this configuration, the gripper 8 can grip the board B simply by performing the simple operation of attaching the gripper 8 to the mounting head 51 instead of the suction nozzle N.

[0082] Also provided is a pair of carry-out conveyors 231 (second conveyors) that are disposed downstream of the board support units 22 in the X direction and transport the board B in the X direction. The controller 100 then causes the gripper 8 to grip the board B supported at the work position Po of the board support units 22, and then moves the head unit 5, thereby transferring the board B onto the carry-out conveyors 231 (steps S301 to S308). With this configuration, the head unit 5, which is essential for mounting components E, is also used to carry the board B from the work position Po to the carry-out conveyors 231 (second conveyors), and there is no need to add a mechanism for driving the gripper 8. Therefore, the board B can be carried out from the work position Po to the carry-out conveyors 231 with a simple configuration.

[0083] Incidentally, the specific mechanism for holding the substrate B for transferring the substrate B from the substrate loading section 21 to the substrate support section 22, or from the substrate support section 22 to the substrate unloading section 23, is not limited to the above-mentioned gripper 8, but may also be the following suction head 9.

[0084] 10 is a diagram showing a schematic configuration of the suction head attached to the mounting head. The suction head 9 has a body 91 extending in the Z direction and a contact member 92 attached to the lower end of the body 91. A suction opening 921 is provided in the center of the contact member 92 when viewed from the bottom, and when the contact member 92 comes into contact with the upper surface of the board B, the suction opening 921 faces the upper surface of the board B. The contact member 92 is made of silicone resin or rubber. The suction head 9 also has a flange 93 attached to the upper end of the body 91. A suction flow path 94 opens on the upper surface of the flange 93, and the suction flow path 94 communicates with the suction opening 921 via the inside of the flange 93, the body 91, and the contact member 92.

[0085] When the flange 93 is pushed from below between the pair of leaf springs 512 of the head shaft 511, the flange 93 enters between the pair of leaf springs 512 while pushing the pair of leaf springs 512 apart. This causes the flange 93 to engage with the pair of leaf springs 512, and the suction head 9 is attached to the mounting head 51. Furthermore, when the flange 93 is pulled downward from between the pair of leaf springs 512, the flange 93 retreats from between the pair of leaf springs 512 while pushing the space between them apart. This causes the flange 93 to detach from the pair of leaf springs 512, and the suction head 9 is removed from the mounting head 51.

[0086] The suction flow path 94 of the suction head 9 attached to the mounting head 51 communicates with the flow path inside the mounting head 51. Therefore, the negative pressure supplied by the negative pressure generating unit 71 to the flow path of the mounting head 51 is supplied to the suction opening 921 via the suction flow path 94. The negative pressure to the suction opening 921 causes the substrate B to be sucked onto the suction head 9. When such a suction head 9 is used, the above-mentioned substrate carry-in operation and substrate carry-out operation can be performed as follows.

[0087] Fig. 11 is a flowchart showing a modified example of the substrate carry-in operation executed in step S101 of Fig. 5, and Fig. 12 is a diagram schematically showing details of the substrate carry-in operation of Fig. 11. In step S401, the X-axis motor Mx and the Y-axis motor My drive the head unit 5, thereby causing the distance sensor 73 to face the substrate detection position Pd (Fig. 2) set for the substrate carry-in section 21. Then, when the distance sensor 73 detects that the substrate B being transported in the X direction by the carry-in conveyor 211 of the substrate carry-in section 21 has reached the substrate detection position Pd ("YES" in step S402), the position at which the suction head 9 picks up the substrate B (the suction position) is recognized (step S403).

[0088] Specifically, the carry-in conveyor 211 stops the board B after the board B reaches the board detection position Pd. The calculation processing unit 110 then determines the stop position of the board B by checking the distance that the carry-in conveyor 211 has transported the board B after the board B reaches the board detection position Pd from the output of the encoder of the carry-in motor Mci, and recognizes the suction position based on this stop position. Alternatively, the suction position may be recognized based on an image of the board B captured by the board recognition camera 72.

[0089] In step S404, the X-axis motor Mx, the Y-axis motor My, the Z-axis motor Mz, and the R-axis motor Mr drive the head unit 5 to move the contact member 92 of the suction head 9 to the suction position recognized in step S403. As a result, the contact member 92 of the suction head 9 comes into contact with the upper surface of the substrate B.

[0090] In step S405, the negative pressure generator 71 supplies negative pressure to the suction opening 921 of the suction head 9. As a result, the substrate B is sucked onto the suction head 9. In step S406, the Z-axis motor Mz raises the suction head 9. As a result, the substrate B rises together with the suction head 9 and moves upward away from the carry-in conveyor 211 of the substrate carry-in section 21.

[0091] In step S407, the X-axis motor Mx moves the head unit 5 in the X direction, thereby placing the substrate B from above opposite the working position Po. In step S408, the Z-axis motor Mz lowers the suction head 9, thereby placing the substrate B at the working position Po provided on the substrate support section 22. As a result, the substrate B located at the working position Po is supported by the pair of support rails 221 of the substrate support section 22. Then, in step S409, the clamper 222 clamps the substrate B, thereby fixing the substrate B at the working position Po. In step S410, the negative pressure generator 71 stops supplying negative pressure to the suction opening 921. As a result, the suction of the substrate B by the suction head 9 is released.

[0092] The order of clamping substrate B in step S409 and releasing suction by suction head 9 in step S410 is not limited to this example. Therefore, substrate B may be clamped after suction by suction head 9 is released.

[0093] Fig. 13 is a flowchart showing a modified example of the board carrying-out operation executed in step S111 of Fig. 5, and Fig. 14 is a diagram schematically showing the details of the board carrying-out operation of Fig. 13. In step S501, the arithmetic processing unit 110 recognizes a position (suction position) on the board B located at the work position Po that is suitable for suction by the suction head 9. For example, based on an image of the board B captured by the board recognition camera 72, a flat area on the top surface of the board B where components E are not mounted is recognized as the suction position.

[0094] In step S502, the X-axis motor Mx, the Y-axis motor My, the Z-axis motor Mz, and the R-axis motor Mr drive the head unit 5 to move the contact member 92 of the suction head 9 to the suction position recognized in step S501. As a result, the contact member 92 of the suction head 9 comes into contact with the upper surface of the substrate B.

[0095] In step S503, the negative pressure generator 71 supplies negative pressure to the suction opening 921 of the suction head 9. As a result, substrate B is sucked onto the suction head 9. In addition, in step S504, the clamping of substrate B is released. Note that the timing for releasing the clamping of substrate B is not limited to this example, and the clamping of substrate B may be released, for example, before step S501.

[0096] In this state where the suction head 9 has thus sucked the unclamped substrate B, the Z-axis motor Mz raises the suction head 9 (step S505). The substrate B rises together with the suction head 9 and moves upward away from the support rails 221 of the substrate support section 22.

[0097] In step S506, the X-axis motor Mx moves the head unit 5 in the X direction, thereby causing the upper side of the substrate B to face the substrate discharge section 23. In step S507, the Z-axis motor Mz lowers the suction head 9, thereby placing the substrate B on the substrate discharge section 23. As a result, the substrate B is supported by the pair of discharge conveyors 231 of the substrate discharge section 23.

[0098] In step S508, the negative pressure generating unit 71 stops supplying negative pressure to the suction opening 921. This releases the suction of the board B by the suction head 9. The board B thus transferred from the board support unit 22 to the board discharge unit 23 is then carried to the outside of the component mounter 1 by the board discharge unit 23 (step S509).

[0099] In the embodiment described above, the head unit 5 transfers components E to the board B supported at the work position Po, thereby mounting the components E on the board (steps S103 to S110). Furthermore, the board B is carried from the carry-in conveyor 211 (first conveyor) to the work position Po by the suction head 9 (board holder) that picks up the board B (steps S403 to S408). In particular, the suction head 9 is supported by the head unit 5, and the board B is transferred from the carry-in conveyor 211 to the work position Po by moving the head unit 5 (step S407). In other words, the head unit 5, which is essential for mounting components E, is also used to carry the board B from the carry-in conveyor 211 to the work position Po, eliminating the need for an additional mechanism to drive the suction head 9. This makes it possible to carry the board B from the carry-in conveyor 211 to the work position Po with a simple configuration.

[0100] Also provided are a pair of unloading conveyors 231 (second conveyors) that are disposed downstream of the board support units 22 in the X direction and transport the board B in the X direction. The controller 100 then causes the suction head 9 to suck the board B supported at the work position Po of the board support units 22, and then moves the head unit 5 to transfer the board B onto the unloading conveyors 231 (steps S501 to S508). With this configuration, the head unit 5, which is essential for mounting components E, is also used to unload the board B from the work position Po to the unloading conveyors 231 (second conveyors), eliminating the need for an additional mechanism to drive the suction head 9. This makes it possible to unload the board B from the work position Po to the unloading conveyors 231 with a simple configuration.

[0101] Furthermore, the controller 100 performs a transfer operation by having the suction head 9 pick up the substrate B stopped on the carry-in conveyor 211 and then moving the head unit 5 (steps S405 to S408). With this configuration, the suction head 9 can firmly pick up the substrate B and reliably carry the substrate B into the work position Po.

[0102] The suction head 9 also has a contact member 92 that comes into contact with the upper surface of the substrate B. The contact member 92 is made of silicone resin or rubber. In this configuration, the suction head 9 comes into contact with the substrate B by means of a highly elastic material (contact member 92) such as silicone resin or rubber. Therefore, damage to the substrate B caused by suction by the suction head 9 can be suppressed.

[0103] Furthermore, the suction head 9 has a flange 93 (mounted portion) that can be attached to and detached from a pair of leaf springs 512 (mounting portion) of the mounting head 51, and the mounting head 51 supplies negative pressure to the suction head 9 that is attached to the pair of leaf springs 512 by the flange 93, thereby causing the suction head 9 to suction the substrate B. With this configuration, the suction head 9 can suction the substrate B simply by performing the simple operation of attaching the suction head 9 to the mounting head 51 instead of the suction nozzle N.

[0104] As described above, in this embodiment, the component mounter 1 corresponds to an example of a "component mounter" of the present invention, the controller 100 corresponds to an example of a "controller" of the present invention, the carry-in conveyor 211 corresponds to an example of a "first conveyor" of the present invention, the board support unit 22 corresponds to an example of a "board support unit" of the present invention, the carry-out conveyor 231 corresponds to an example of a "second conveyor" of the present invention, the component supply unit 3 corresponds to an example of a "component supply unit" of the present invention, the head unit 5 corresponds to an example of a "head unit" of the present invention, the mounting head 51 corresponds to an example of a "mounting head" of the present invention, the pair of leaf springs 512 correspond to an example of an "attachment unit" of the present invention, the distance sensor 73 corresponds to an example of a "board sensor" of the present invention, the gripper 8 corresponds to an example of a "board holding unit" and a "gripper" of the present invention, the upper jaw member 81 corresponds to an example of an "upper gripping member" of the present invention, the contact member 812 corresponds to an example of an "upper contact member" of the present invention, and the convex portion 812a corresponds to an example of an "upper surface" of the present invention. the lower jaw member 82 corresponds to an example of a "lower gripping member" of the present invention, the contact member 822 corresponds to an example of a "lower contact member" of the present invention, the convex portion 822a corresponds to an example of a "lower surface contact convex portion" of the present invention, the abutment member 84 corresponds to an example of an "abutment portion" of the present invention, the reinforcing shaft 85 corresponds to an example of a "support shaft" of the present invention, the flange 861 corresponds to an example of a "receiving portion" of the present invention, the suction head 9 corresponds to an example of a "substrate holding portion" and "suction head" of the present invention, the contact member 92 corresponds to an example of a "contact member" of the present invention, the flange 93 corresponds to an example of a "receiving portion" of the present invention, the substrate B corresponds to an example of a "substrate" of the present invention, the component E corresponds to an example of a "component" of the present invention, the suction nozzle N corresponds to an example of a "suction nozzle" of the present invention, the working position Po corresponds to an example of a "working position" of the present invention, the X direction corresponds to an example of a "substrate transport direction" of the present invention, and the Z direction corresponds to an example of a "vertical direction" of the present invention.

[0105] The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described embodiment without departing from the spirit of the present invention. For example, the substrate loading operation may be modified as shown in FIG. 15. FIG. 15 is a flowchart showing another modified example of the substrate loading operation. Here, differences from the above-described substrate loading operation will be mainly described, and common parts will be designated by corresponding reference numerals and will not be described as appropriate.

[0106] 15, the arithmetic processing unit 110 uses the X-axis motor Mx to move the head unit 5 in the X direction across the entire area from the board carry-in section 21 to the board carry-out section 23, while monitoring the detection results of the distance sensor 73 (board sensor) to check whether or not board B remains in the component mounter 1. Then, when the arithmetic processing unit 110 determines that board B exists in the component mounter 1 ("YES" in step S602), it notifies the operator via the UI 190 of an instruction to request removal of board B from the component mounter 1 (step S603). As a result, if board B was accidentally not removed from the component mounter 1 and remained in the component mounter 1 at the end of the previous component mounting, this board B can be removed before starting the current component mounting.

[0107] Furthermore, when the arithmetic processing unit 110 determines that the board B is not present in the component mounter 1 (step S602: NO), it causes the distance sensor 73 to face the board detection position Pd (step S201) in the same manner as described above. Then, when the distance sensor 73 detects the board B (step S202: YES), steps S203 to S210 are executed.

[0108] Furthermore, if the distance sensor 73 does not detect the board B, it is determined in step S604 whether or not a predetermined time has elapsed. If the predetermined time has not elapsed (if "NO" in step S604), the process returns to step S202. On the other hand, if the distance sensor 73 does not detect the board B even after the predetermined time has elapsed (if "YES" in step S604), the processing unit 110 notifies the operator via the UI 190 that an error has occurred in the transport of the board B to the mounter 1 (step S605).

[0109] Alternatively, the substrate unloading operation may be modified as shown in Figures 16 and 17. Figure 16 is a flowchart showing another modified example of the substrate unloading operation, and Figure 17 is a diagram schematically showing the details of the substrate load operation of Figure 16.

[0110] 16, the arithmetic processing unit 110 determines whether or not substrate B can fit on the carry-out conveyor 231, which is the destination of substrate B due to the movement of the head unit 5 in step S306 (step S701). For example, if the length of substrate B in the X direction is equal to or less than the length of the carry-out conveyor 231, it is determined that substrate B can fit, and if the length of substrate B in the X direction is longer than the length of the carry-out conveyor 231, it is determined that substrate B cannot fit. Then, if substrate B can fit ("YES" in step S701), steps S307 and S308 are executed as described above.

[0111] On the other hand, if the board B cannot be accommodated ("NO" in step S701), the gripper 8 places the board B on the support rail 221 and the carry-out conveyor 231 so that the board B straddles them in the X direction (step S702), and releases the grip of the board B (step S703). Subsequently, the calculation processing unit 110 causes the carry-out conveyor 231 to start transporting the board B in the X direction, and causes the gripper 8 to assist the transport of the carry-out conveyor 231.

[0112] Specifically, the arithmetic processing unit 110 drives the head unit 5 using the X-axis motor Mx to bring the abutment member 84 of the gripper 8 into contact with the edge of the substrate B (the upstream edge in the X direction) from the upstream side in the X direction, and then moves the gripper 8 further in the X direction. As a result, the force of the discharge conveyor 231 transporting the substrate B in the X direction and the force of the gripper 8 pressing the substrate B in the X direction (assist force) are applied to the substrate B, causing the substrate B to move in the X direction. Note that the orientation of the gripper 8 when assisting is opposite to the orientation of the gripper 8 when gripping the substrate B. The orientation of the gripper 8 can be changed by rotating the gripper 8 using the R-axis motor Mr.

[0113] In step S705, the calculation processing unit 110 checks whether the force output by the X-axis motor Mx, i.e., the assist force, has decreased below a predetermined value. As the substrate B moves from the support rails 221 to the carry-out conveyor 231, if the assist force decreases below the predetermined value ("YES" in step S705), the assist by the gripper 8 is terminated (step S706). Then, after the assist is terminated, the substrate B is transported in the X direction by the carry-out conveyor 231.

[0114] In this substrate unloading operation, the controller 100 causes the gripper 8 to hold the substrate B supported at the work position Po of the substrate support section 22, and then moves the head unit 5, thereby placing the substrate B on the substrate unloading section 23 and the unloading conveyor 231 so that the substrate B straddles them (step S702). Next, the controller 100 executes an assist operation to transfer the substrate B onto the unloading conveyor 231 by pushing the substrate B with the gripper 8 from the upstream side to the downstream side in the X direction (step S704). With this configuration, even if the dimensions of the substrate B are large in the X direction and the substrate B cannot fit on the unloading conveyor 231, the substrate B can be unloaded.

[0115] Furthermore, in parallel with the assisting operation, the controller 100 causes the discharge conveyor 231 to transport the substrate B downstream in the X direction (step S704). Then, when the controller 100 confirms that the force required to push the substrate B by the gripper 8 has decreased ("YES" in step S705), it stops the assisting operation (step S706). With this configuration, the assisting operation can be stopped at the timing when most or all of the substrate B has moved to the discharge conveyor 231 and the force required for the assisting operation has decreased.

[0116] Furthermore, it is not necessarily necessary to lift the substrate B when transferring it from the carry-in conveyor 211 to the support rail 221, or from the support rail 221 to the carry-out conveyor 231. Therefore, the step of lifting the gripper 8, such as step S206 or step S305, may be omitted, and the substrate B may be transferred by dragging it from the carry-in conveyor 211 to the support rail 221, or from the support rail 221 to the carry-out conveyor 231.

[0117] Furthermore, when the substrate B is gripped by the gripper 8, it is not always necessary to bring the contact member 84 into contact with the substrate B.

[0118] In addition, the upper jaw member 81 is slidable relative to the reinforcing shaft 85, and the lower jaw member 82 is fixed to the reinforcing shaft 85. However, the upper jaw member 81 may be fixed to the reinforcing shaft 85, and the lower jaw member 82 may be slidable relative to the reinforcing shaft 85. Alternatively, both the upper jaw member 81 and the lower jaw member 82 may be slidable relative to the reinforcing shaft 85.

[0119] Furthermore, the work of attaching or detaching the gripper 8 or suction head 9 to or from the mounting head 51 may be performed by either a machine or a worker. When performed by a machine, a known mechanism for attaching or detaching the suction nozzle N to or from the mounting head 51 can be used to attach or detach the gripper 8 or suction head 9 to or from the mounting head 51. [Explanation of symbols]

[0120] 1...Component mounting machine 100...Controller (control unit) 211...Loading conveyor (first conveyor) 22...Substrate support part 231...Exit conveyor (second conveyor) 3...Parts Supply Department 5...Head unit 51...Mounting head 512...Leaf spring (mounting part) 73...Distance sensor (substrate sensor) 8...Gripper (substrate holding part) 81...Upper jaw member (upper gripping member) 812...Contact member (upper contact member) 812a...Convex portion (top surface contact convex portion) 82... Lower jaw member (lower gripping member) 822...Contact member (lower contact member) 822a...Convex portion (lower surface contact convex portion) 84...Abutment member (abutment portion) 85...Reinforcing shaft (support shaft) 861...Flange (mounting part) 9...Suction head (substrate holding part) 92...Contact member 93...Flange (mounting part) B...Substrate E...Parts N...Suction nozzle Po: Working position X...X direction (board transport direction) Z...Z direction (vertical direction)

Claims

1. a first conveyor that conveys the substrate in a substrate conveyance direction; a substrate support section disposed downstream of the first conveyor in the substrate transport direction, the substrate support section supporting the substrate at a predetermined work position; a parts supply unit that supplies parts; a head unit that mounts the components supplied by the component supply unit onto the substrate supported by the substrate support unit by transferring the components to the substrate; a substrate holding section supported by the head unit and holding the substrate; a control unit that executes a transfer operation of transferring the substrate to the work position by holding the substrate stopped on the first conveyor in the substrate holding unit and then moving the head unit; Equipped with the substrate holding unit is a gripper that grips the substrate, the gripper has a contact portion that contacts the substrate, the control unit performs the transfer operation by causing the gripper to grip the substrate stopped on the first conveyor and then moving the head unit; the control unit causes the contact portion of the gripper to contact the substrate stopped on the first conveyor, and then causes the gripper to grip the substrate; The abutment portion faces the board stopped on the first conveyor from the downstream side of the board transport direction at a distance, and then proceeds upstream in the board transport direction to abut against the board, thereby abutting against the downstream end of the board in the board transport direction.

2. a substrate sensor that detects the substrate supported by the first conveyor; 2. The component mounter according to claim 1, wherein when the substrate sensor detects the substrate, the control unit moves the head unit to move the substrate holding unit toward the substrate supported by the first conveyor, thereby starting the transfer operation.

3. 3. The component mounter according to claim 1, wherein the gripper has an upper gripping member and a lower gripping member facing the upper gripping member from below, and the upper gripping member and the lower gripping member grip the board from a vertical direction.

4. A first conveyor that transports the substrate in a substrate transport direction; a substrate support section disposed downstream of the first conveyor in the substrate transport direction, the substrate support section supporting the substrate at a predetermined work position; a parts supply unit that supplies parts; a head unit that mounts the components supplied by the component supply unit onto the substrate supported by the substrate support unit by transferring the components to the substrate; a substrate holding section supported by the head unit and holding the substrate; a control unit that executes a transfer operation of transferring the substrate to the work position by holding the substrate stopped on the first conveyor in the substrate holding unit and then moving the head unit; Equipped with the substrate holding unit is a gripper that grips the substrate, the gripper has an upper gripping member and a lower gripping member facing the upper gripping member from below, and the upper gripping member and the lower gripping member grip the substrate from a vertical direction; the control unit performs the transfer operation by causing the gripper to grip the substrate stopped on the first conveyor and then moving the head unit; The control unit causes the gripper to grip the board by causing the gripper to perform an opposing operation in which the upper gripping member faces the upper surface of the board with a gap therebetween and the lower gripping member faces the lower surface of the board with a gap therebetween, an upper abutment operation in which the upper gripping member is lowered after the opposing operation to abut against the upper surface of the board, and a lower abutment operation in which the lower gripping member is raised after the upper abutment operation to abut against the lower surface of the board.

5. the upper gripping member has an upper contact member, and the upper contact member contacts an upper surface of the substrate; the lower gripping member has a lower contact member, and the lower contact member contacts the lower surface of the substrate; 5. The component mounter according to claim 3, wherein the upper contact member and the lower contact member are made of silicone resin or rubber.

6. the upper contact member has an upper surface contact protrusion that protrudes downward, and the upper surface contact protrusion comes into contact with the upper surface of the substrate; 6. The component mounter according to claim 5, wherein the lower contact member has a lower surface contact protrusion that protrudes upward, and the lower surface contact protrusion comes into contact with the lower surface of the board.

7. 7. A component mounter according to claim 3, wherein the gripper has a support shaft extending in the vertical direction and supporting the upper gripping member and the lower gripping member, and at least one of the upper gripping member and the lower gripping member is slidable in the vertical direction relative to the support shaft.

8. A first conveyor that transports the substrate in a substrate transport direction; a substrate support section disposed downstream of the first conveyor in the substrate transport direction, the substrate support section supporting the substrate at a predetermined work position; a parts supply unit that supplies parts; a head unit that mounts the components supplied by the component supply unit onto the substrate supported by the substrate support unit by transferring the components to the substrate; a substrate holding section supported by the head unit and holding the substrate; a control unit that executes a transfer operation of transferring the substrate to the work position by holding the substrate stopped on the first conveyor in the substrate holding unit and then moving the head unit; Equipped with the substrate holding unit is a gripper that grips the substrate, the gripper has an upper gripping member and a lower gripping member facing the upper gripping member from below, and the upper gripping member and the lower gripping member grip the substrate from a vertical direction; the control unit performs the transfer operation by causing the gripper to grip the substrate stopped on the first conveyor and then moving the head unit; the head unit has a plurality of mounting heads, the mounting head has a mounting portion to which a suction nozzle is detachably attached, and applies negative pressure to the suction nozzle attached to the mounting portion to suck the component onto the suction nozzle; the gripper has a mounting portion that is detachable from the mounting portion of the mounting head, The mounting head is a component mounter that supplies negative pressure to the gripper attached to the attachment section by the attachment portion, thereby bringing the upper gripping member and the lower gripping member closer together and sandwiching the board between the upper gripping member and the lower gripping member.

9. a second conveyor disposed downstream of the substrate support section in the substrate transport direction and configured to transport the substrate in the substrate transport direction; 9. The component mounter according to claim 1, wherein the control unit causes the substrate supported at the working position of the substrate support unit to be held by the substrate holding unit, and then moves the head unit to transfer the substrate onto the second conveyor.

10. A first conveyor that transports a substrate in a substrate transport direction; a substrate support section disposed downstream of the first conveyor in the substrate transport direction, the substrate support section supporting the substrate at a predetermined work position; a parts supply unit that supplies parts; a head unit that mounts the components supplied by the component supply unit onto the substrate supported by the substrate support unit by transferring the components to the substrate; a substrate holding section supported by the head unit and holding the substrate; a control unit that executes a transfer operation of transferring the substrate to the work position by holding the substrate stopped on the first conveyor in the substrate holding unit and then moving the head unit; a second conveyor disposed downstream of the substrate support section in the substrate transport direction and configured to transport the substrate in the substrate transport direction; Equipped with The control unit causes the substrate, which is supported at the working position of the substrate support unit, to be held by the substrate holding unit, and then moves the head unit, thereby placing the substrate on the substrate support unit and the second conveyor so that the substrate straddles the substrate support unit and the second conveyor, and then performs an assist operation of transferring the substrate onto the second conveyor by pushing the substrate with the substrate holding unit from the upstream side to the downstream side in the substrate transport direction.

11. 11. The component mounter according to claim 10, wherein the control unit causes the second conveyor to transport the board downstream in the board transport direction in parallel with the assisting operation, and stops the assisting operation when it confirms a reduction in the force required to push the board by the board holding unit.

12. stopping the substrate being transported by the first conveyor in the substrate transport direction; a step in which a control unit executes a transfer operation in which a substrate holding unit supported by a head unit holds the substrate stopped on the first conveyor, and then the head unit moves, thereby transferring the substrate to a work position located downstream of the first conveyor in the substrate transport direction; a step of mounting the components on the board by transferring the components supplied by a component supply unit onto the board supported at the work position using the head unit; Equipped with the substrate holding unit is a gripper that grips the substrate, the gripper has a contact portion that contacts the substrate, the control unit performs the transfer operation by causing the gripper to grip the substrate stopped on the first conveyor and then moving the head unit; the control unit causes the contact portion of the gripper to contact the substrate stopped on the first conveyor, and then causes the gripper to grip the substrate; A component mounting method in which the abutment portion faces the board stopped on the first conveyor from the downstream side in the board transport direction at a distance, then moves upstream in the board transport direction to abut against the board, and abuts against the downstream end of the board in the board transport direction.

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