Component mounting device and component mounting method

Abstract

To provide a component mounting system and a component mounting method capable of performing substrate repair work without lowering the operating rate of the component mounting system even when a mounting error is detected.SOLUTION: The component mounting method includes the steps of: transporting a substrate by a transportation means and mounting a component onto the substrate which is held by the transportation means, by a mounting means (ST11); when error detection means detecting an error occurring during component attachment operation to a substrate(Yes in ST12), determining whether or not the error affects the component mounting work for subsequent substrates of the substrate (ST15); and, when it is determined that the error does not affect the component mounting work for the subsequent substrate (NO in ST15), carrying a subsequent substrate in by transportation means after carrying the substrate out, and carrying out component mounting work onto the subsequent substrate by a mounting means.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a component mounting apparatus and a component mounting method for mounting components on a board. [Background technology]

[0002] Component placement devices that place components on circuit boards can experience placement errors that prevent components from being placed on the board due to malfunctions in the vacuum suction system that supplies vacuum suction force to the nozzle that holds the components, misalignment between the nozzle and the component when picking up the component from the component supply unit, or poor shape of the component itself. Placement errors include pickup errors, in which the nozzle is unable to pick up the component, drop errors, in which the nozzle that has picked up the component drops the component while moving, and return errors, in which the nozzle returns the component without being able to place it on the board.

[0003] Incidentally, there is known a component mounting device that suspends component mounting operations and performs component mounting recovery when a mounting error is detected from the image capture results of a component recognition camera that captures an image of a component held by a nozzle or from measurement results from various sensors (for example, Patent Document 1). Patent Document 1 discloses an error recovery method in which, when a mounting error is detected during component mounting operations, the board recognition camera captures an image of the area near the component mounting position on the board and a teaching screen is displayed on a monitor device to assist the worker in performing the recovery operation. The worker can perform component mounting recovery operations while viewing the captured image of the area near the component mounting position displayed on the monitor device, and can then resume the component mounting operation after the recovery operation. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-64366 Summary of the Invention [Problem to be solved by the invention]

[0005] However, with conventional technologies including Patent Document 1, when a mounting error is detected, the worker can easily perform recovery work according to the situation while watching the monitor device, without having to visually check the board. However, there is a problem in that during the recovery work, the mounting of components on subsequent boards is suspended, causing boards to back up and reducing the efficiency of the component mounting work.

[0006] Therefore, an object of the present invention is to provide a component mounting device and a component mounting method that, when a mounting error is detected, can perform repair work on a board without reducing the operating rate of the component mounting device. [Means for solving the problem]

[0007] The component mounting device of the present invention comprises a transport means for transporting a board, a mounting means for mounting components onto the board held by the transport means, an error detection means for detecting an error that occurs during component mounting work on the board, and an error determination unit for determining whether the error will affect component mounting work on a board subsequent to the board, and if it is determined that the error will not affect the mounting work on the subsequent board, the transport means carries out the board and then carries in the subsequent board, and the mounting means carries out the component mounting work on the subsequent board. and further comprising an imaging means for imaging an upper surface of the board held by the transport means, and a mounting confirmation unit for acquiring component mounting information including a mounting state of components on the board based on the image captured by the imaging means, wherein when the error detection means detects an error, the imaging means images the board held by the transport means, the mounting confirmation unit acquires the component mounting information, and when the board for which the error was detected is re-introduced after being carried out, the mounting means mounts unmounted components on the board based on the component mounting information of the board. .

[0008] In the component mounting method of the present invention, a conveying means conveys a board, a mounting means mounts components onto the board held by the conveying means, an error detection means detects an error that occurs during component mounting work on the board, and when the error detection means detects an error, it determines whether or not the error will affect component mounting work on a board subsequent to the detected error, and if it is determined that the error will not affect component mounting work on the subsequent board, the conveying means carries out the board and then carries in the subsequent board, and the mounting means performs component mounting work on the subsequent board. When the error detection means detects the error, an imaging means images the board held by the transport means, and component mounting information including the component mounting state on the board is obtained based on the image captured by the imaging means. When the board in which the error was detected is re-introduced after being carried out, the mounting means mounts the unmounted component on the board based on the component mounting information of the component. . [Effects of the Invention]

[0009] According to the present invention, when a mounting error is detected, repair work for the board can be performed without reducing the operating rate of the component mounting device. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram illustrating the configuration of a component mounting system according to an embodiment of the present invention. [Figure 2] FIG. 1 is a plan view showing the configuration of a main part of a component mounting device according to an embodiment of the present invention; [Figure 3] FIG. 1 is a side view showing the configuration of a main part of a component mounting apparatus according to an embodiment of the present invention; [Figure 4] FIG. 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to an embodiment of the present invention. [Figure 5] FIG. 10 is an explanatory diagram of an example of error determination data used in the component mounting device according to the embodiment of the present invention. [Figure 6] FIG. 10 is an explanatory diagram of an example of component mounting information used in a component mounting device according to an embodiment of the present invention. [Figure 7] 1 is a flow diagram of a component mounting method according to an embodiment of the present invention; [Figure 8] 1 is a flow diagram of a mounting processing method according to an embodiment of the present invention; [Figure 9] 1 is a flow diagram of a re-insertion mounting processing method according to an embodiment of the present invention; [Figure 10] (a) (b) (c) An explanatory diagram of a component mounting process according to an embodiment of the present invention. [Figure 11] (a) (b) (c) An explanatory diagram of a component mounting process according to an embodiment of the present invention. [Figure 12] (a) (b) (c) An explanatory diagram of a component mounting process according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the component mounting system, management computer, and component mounting device. Corresponding elements in all drawings will be denoted by the same reference numerals below, and duplicated explanations will be omitted. In FIG. 1 and in some sections described below, two axes perpendicular to each other in a horizontal plane are shown: the X-axis in the board transport direction (the left-right direction in FIG. 1 ), and the Y-axis perpendicular to the board transport direction (the up-down direction in FIG. 1 ). In FIG. 3 and in some sections described below, the Z-axis (the up-down direction in FIG. 3 ) is shown as the height direction perpendicular to the horizontal plane.

[0012] First, the configuration of component mounting system 1 will be described with reference to Figure 1. Component mounting system 1 has the function of manufacturing a mounted board by mounting components on a board. Component mounting system 1 comprises a first conveyor M1, three component mounting devices M2 to M4, and a second conveyor M5, connected in series from upstream (left side of the drawing) to downstream (right side of the drawing) in the board transport direction. Each device is connected to a management computer 3 via a communication network 2. Each device also transmits and receives data to and from each other via the communication network 2. Note that the number of component mounting devices M2 to M4 provided in component mounting system 1 is not limited to three, and may be one, two, four or more.

[0013] The first conveyor M1, component mounting devices M2-M4, and second conveyor M5 each include a board transport mechanism 4-6. The board transport mechanisms 4-6 are connected in series and transport boards B from upstream devices to downstream devices. The first conveyor M1 receives boards B (arrow a) from upstream production equipment, such as a printing device that prints solder paste on electrodes E formed on the boards B, and transports them to the component mounting device M2. The first conveyor M1 also includes a built-in reader (not shown) that reads the board label C, such as a barcode or two-dimensional code, attached to the board B to read the board number (board ID) that identifies the board B. The first conveyor M1 reads the board number from the board label C of the board B and transmits it to the downstream component mounting device M2 and the management computer 3.

[0014] 1, component mounting device M2 performs a component mounting operation in which a mounting head picks up components D from a component supply unit and mounts them at a mounting position on board B transported from first conveyor M1. Component mounting devices M3 and M4 each perform a component mounting operation in which components D are mounted at a mounting position on board B transported from an upstream device. When component mounting devices M2 to M4 transport board B to a downstream device, they transmit the board number of board B to the downstream device and management computer 3.

[0015] The second conveyor M5 receives the board B after component mounting carried from the component mounting device M4 and carries it out to a reflow device connected downstream that heats the board B to melt the solder paste (arrow b). In addition to the line management function, the management computer 3 has the function of receiving and storing performance information, component mounting information, etc. acquired by the component mounting devices M2 to M4.

[0016] In FIG. 1, the first conveyor M1 and the second conveyor M5 have the functions of temporarily storing (placing) boards B received from upstream and transporting them downstream, as well as allowing workers to take boards B in and out of the board transport mechanisms 4 and 6. A board B1 on which a component D is found to be improperly mounted, such as a missing component, a misaligned component, or a component standing or floating, is removed from the second conveyor M5 by a worker (arrow c). The worker then performs repair work, such as removing the improperly mounted component D or correcting the mounted component D (arrow d), and then re-inserts the repaired board B1 from the first conveyor M1 (arrow e). A component D is then placed by component placement devices M2 to M4 in the previously unmounted positions on the re-inserted board B1.

[0017] Next, the configuration of component mounting devices M2 to M4 will be described with reference to Figures 2 and 3. A board transport mechanism 5 is installed along the X axis in the center of base 10. Board transport mechanism 5 carries in board B transported from an upstream device and positions and holds it at a mounting operation position by a mounting head, which will be described below. In addition, board transport mechanism 5 carries out board B to a downstream device after component mounting operation has been completed.

[0018] A component supply unit 11 is installed on each side (front and rear direction of the Y axis) of the board transport mechanism 5. In the component supply unit 11, multiple tape feeders 12 are arranged in parallel along the X axis. The tape feeders 12 pitch-feed a component tape formed with pockets for storing components D in a direction (tape feed direction) from the outside of the component supply unit 11 toward the board transport mechanism 5, thereby supplying components D to a component supply position 12a where the mounting head picks up the components.

[0019] 2 and 3, Y-axis tables 13 equipped with linear drive mechanisms are disposed on both ends of the X-axis on the top surface of base 10. A beam 14 similarly equipped with a linear mechanism is connected between the two Y-axis tables 13 so as to be freely movable along the Y-axis. A mounting head 15 is attached to beam 14 via plate 14a so as to be freely movable along the X-axis. Mounting head 15 is equipped with a plurality of component mounting units 20. A nozzle 21 for suctioning and holding a component D is attached to the bottom end of each component mounting unit 20. Each component mounting unit 20 is equipped with an elevator motor 20a for raising and lowering nozzle 21 along the Z-axis, and a flow sensor 20b for measuring the flow rate of air passing through nozzle 21.

[0020] The Y-axis table 13 and the beam 14 constitute a head movement mechanism 16 that moves the mounting head 15 in horizontal directions (X-axis direction, Y-axis direction). The head movement mechanism 16 and the mounting head 15 perform a component mounting operation by picking up components D from component supply positions 12a of the tape feeder 12 attached to the component supply unit 11 and mounting them at mounting positions on the board B held by the board transport mechanism 5. During the component mounting operation, the mounting head 15 moves above the component supply unit 11, picks up predetermined components D with each nozzle 21, moves above the board B, and repeats a series of mounting turns to mount the components D held by each nozzle 21 at their respective mounting positions.

[0021] 2 and 3, a head camera 17 is attached to the plate 14a on which the mounting head 15 is attached. As the mounting head 15 moves, the head camera 17 moves above the board B positioned at the mounting operation position of the board transport mechanism 5, and captures an image of a board mark (not shown) provided on the board B and the mounting position of the board B. The head camera 17 also captures an image of the board label C provided on the board B. The head camera 17 also moves above the component supply position 12a of the tape feeder 12, and captures an image of a component D being supplied to the component supply position 12a.

[0022] A component recognition camera 18 is installed between the component supply unit 11 and the board transport mechanism 5. When the mounting head 15, which has taken out a component D from the component supply unit 11, is positioned above the component recognition camera 18, the component recognition camera 18 captures an image of the component D held by the nozzle 21 from below. When the mounting head 15 mounts the component D on the board B, the mounting position is corrected taking into account the recognition results of the board B by the head camera 17 and the recognition results of the component by the component recognition camera 18.

[0023] In Figure 2, a touch panel 19 operated by the operator is installed in front of each of the component placement devices M2 to M4 at the position where the operator works. The touch panel 19 displays various information, and the operator inputs data and operates the component placement devices M2 to M4 using operation buttons and other controls displayed on the display. In Figure 3, a cart 22 with multiple tape feeders 12 pre-installed on top is installed in the component supply unit 11. The cart 22 holds a reel 24 that stores a wound component tape 23 holding components D. The component tape 23 is pulled out from the reel 24 and fed pitchwise by the tape feeder 12 to the component supply position 12a.

[0024] Next, with reference to Figure 4, the configuration of the control system of component mounting devices M2 to M4 will be described, focusing on the function of detecting mounting errors and performing repair work on board B. Component mounting devices M2 to M4 have similar configurations, and here, component mounting device M3 will be described as an example. Component mounting device M3 is located between component mounting devices M2 and M4. Component mounting device M3 includes a control device 30, a board transport mechanism 5, a tape feeder 12, a mounting head 15, a head movement mechanism 16, a head camera 17, a component recognition camera 18, a touch panel 19, and a communication unit 25. Mounting head 15 includes multiple component mounting units 20.

[0025] The control device 30 includes a memory unit 31, a transport processing unit 32, a mounting processing unit 33, a detection processing unit 34, an error determination unit 35, a mounting confirmation unit 36, and a notification processing unit 37. The memory unit 31 is a storage device that stores mounting data 38, error determination data 39, error record data 40, component mounting information 41, etc. The mounting data 38 stores various information for each type of mounting board, such as the type of component D to be mounted on board B, the coordinates of the mounting position on board B, and the mounting angle.

[0026] 4, the transport processing unit 32 controls the board transport mechanism 5 based on a board unloading notification sent from an upstream device (component mounting device M2) to load the board B unloaded from the upstream device and hold it at the mounting work position. The transport processing unit 32 also controls the board transport mechanism 5 based on a board unloading permission notification sent from a downstream device (component mounting device M4) to unload the board B to the downstream device. In this way, the transport processing unit 32 and the board transport mechanism 5 constitute transport means 42 that transports the board B.

[0027] Based on the placement data 38, the placement processing unit 33 controls the tape feeder 12, the placement head 15, the head moving mechanism 16, the head camera 17, and the component recognition camera 18 to perform a component placement operation in which the nozzle 21 picks up a component D from the component supply position 12a of the tape feeder 12 and places it at the placement position on the board B. Furthermore, when the placement processing unit 33 receives a notification from an upstream device (component placement device M2) that the board in question is defective (hereinafter referred to as a "defective board notification") or a notification that the board in question is a re-inserted board (hereinafter referred to as a "re-inserted board notification"), the placement processing unit 33 performs the operation described below in accordance with the content of the notification. In this way, the placement processing unit 33, the placement head 15, and the head moving mechanism 16 constitute placement means 43 that places a component D on the board B held by the transport means 42 (board transport mechanism 5).

[0028] 4, the detection processing unit 34 controls the head moving mechanism 16, the head camera 17, the component recognition camera 18, and the flow sensor 20b of the component mounting unit 20 to detect various errors that occur during the component mounting operation. Specifically, the detection processing unit 34 performs image processing on the image captured by the head camera 17 of the component supply position 12a of the tape feeder 12 to detect a component supply error in which the component D is not normally supplied to the component supply position 12a. The detection processing unit 34 also performs image processing on the image captured by the component recognition camera 18 of the nozzle 21 that picked up the component D to detect a component suction error in which the nozzle 21 is holding the component D in an abnormal state or is not holding the component D at all.

[0029] Furthermore, when the flow rate sensor 20b measures an inflow of outside air of a predetermined value or more from the nozzle 21 while the nozzle 21 is picking up the component D and moving it to the mounting position on the board B, the detection processing unit 34 determines that a component drop error has occurred, in which the component D has fallen from the nozzle 21. When the flow rate sensor 20b measures that the outside air flowing in from the nozzle 21 is a predetermined value or less after the component D that the detection processing unit 34 held has been transferred to the mounting position on the board B, the detection processing unit 34 determines that a component return error has occurred, in which the nozzle 21 is unable to transfer the component D to the board B and returns it. When the flow rate sensor 20b measures that the outside air flowing in from the nozzle 21 before holding the component D is a predetermined value or less, the detection processing unit 34 determines that a nozzle clogging error has occurred, in which the nozzle 21 is clogged with dust or the like.

[0030] It should be noted that, when the detection processing unit 34 detects a component suction error or a component drop error, it may also subsequently detect whether or not the nozzle 21 is clogged. In this way, the detection processing unit 34, head movement mechanism 16, head camera 17, component recognition camera 18, and flow sensor 20b constitute error detection means 44 that detects errors that occur during the component mounting operation on board B. When the detection processing unit 34 detects a mounting error, it associates the details of the error (error identification number), the date and time the error occurred, and information identifying the tape feeder 12 and nozzle 21 in which the error was detected, and stores the associated data in the memory unit 31 as error history data 40.

[0031] 4, when error detection means 44 detects an error, error determination unit 35 determines whether the detected error will affect the component mounting work on the subsequent board of board B on which the error was detected, based on error determination data 39 and depending on the type of error and the frequency of the error. If it is determined that there will be an effect, error determination unit 35 notifies touch panel 19, the display unit of management computer 3, or an information terminal carried by the worker that "an error has been detected and component mounting work has been stopped," and mounting means 43 stops the component mounting work on board B on which the error was detected. If it is determined that there will be no effect, transport means 42 removes board B on which the error was detected and then carries in the subsequent board, and mounting means 43 performs the component mounting work on the subsequent board.

[0032] An example of the error determination data 39 will now be described with reference to FIG. 5. The error determination data 39 includes an error identification number 50, error content 51, detection means usage information 52, impact on subsequent boards 53, and determination frequency 54. The error identification number 50 is a number that identifies the content of the error and serves as identification information when storing error information in error history data 40 or the like. The detection means usage information 52 is information indicating the relationship between sensors that detect errors, and here includes flow sensor usage information 52a, head camera usage information 52b, and component recognition camera usage information 52c. In the detection means usage information 52, "◯" indicates a sensor used for detection, and "-" indicates a sensor not used. For example, it indicates that a component supply error is detected by head camera 17.

[0033] The influence on subsequent boards 53 indicates whether the error will have an effect on the component mounting operation on subsequent boards. In this example, component supply errors, component pickup errors, component drop errors, and component return errors have no effect on subsequent boards, while nozzle clogging errors have an effect. In other words, when making a judgment based on the type of error, if a nozzle clogging error is detected, the error judgment unit 35 judges that there will be an effect on subsequent boards. Note that if the error detection means 44 detects a component pickup error or a component drop error and then subsequently detects a nozzle clogging error, the error judgment unit 35 also judges that there will be an effect.

[0034] 5, the judgment frequency 54 specifies a judgment value for judgment according to the frequency of errors. In this example, the judgment value is specified as the number of consecutive times. For example, the judgment frequency 54 for a component pickup error is two times, and if a component pickup error is detected two times in a row with the same nozzle 21, the error judgment unit 35 determines that there will be an impact on subsequent boards. Note that the judgment frequency 54 is not limited to the number of consecutive times, and may be the number of errors within a predetermined number of times (e.g., 100 times).

[0035] 4, when an error is detected by error detection means 44, detection processing unit 34 controls head movement mechanism 16 and head camera 17 to sequentially capture images of the mounting position of board B for which the error was detected. That is, detection processing unit 34, head movement mechanism 16, and head camera 17 form imaging means 45 that captures images of the top surface of board B held by transport means 42 (board transport mechanism 5). Mounting confirmation unit 36 ​​acquires component mounting information 41 including the mounting state of components D on board B based on the image captured by imaging means 45. In this way, when an error is detected by error detection means 44, imaging means 45 captures an image of board B held by transport means 42, and mounting confirmation unit 36 ​​acquires component mounting information 41. The acquired component mounting information 41 is stored in memory unit 31.

[0036] An example of component mounting information 41 will now be described with reference to Figure 6. Component mounting information 41 includes board number 60, component mounting position 61, component mounting coordinates 62, and mounting status 63. Board number 60 is information that identifies board B on which an error was detected, and is recorded on board label C attached to board B. In this example, board number 60 is "B1." Hereinafter, the board on which an error was detected will be referred to as "defective board B1."

[0037] Component mounting position 61 is a number specifying the mounting position of component D, and component mounting coordinates 62 are the XY coordinates of the mounting position and the mounting angle. Mounting status 63 is the mounting status of component D acquired by mounting confirmation unit 36 ​​from the image captured by imaging means 45 (head camera 17). "◯" indicates that the mounting status is good, "×" indicates a defect such as misalignment or floating, "-" indicates that component D is not in the mounting position (not mounted), and a blank indicates that it has not been confirmed (before confirmation).

[0038] In this example, an error is detected during component mounting at component mounting position P06, and a component D06 with a poor mounting state is confirmed at component mounting position P06 (see FIG. 10(b)). Note that the mounting states of components D at component mounting positions P01 to P05, which were mounted before the error was detected, are good. Furthermore, there are no components D at component mounting positions P07 and P08, which have not yet been mounted (no fallen components or the like have been found). The imaging means 45 images the defective board B1 to the extent that it does not affect the transport means 42's loading of subsequent boards. In this example, the imaging means 45 has finished imaging the defective board B1 up to component mounting position P08, and the mounting states at component mounting positions P09 and P10 have not yet been confirmed.

[0039] 4, communication unit 25 is a communication device that transmits and receives various information to and from other devices and management computer 3 via communication network 2. Notification processing unit 37 transmits component mounting information 41 to other devices (component mounting devices M2, M4) and management computer 3 via communication unit 25. In other words, notification processing unit 37 and communication unit 25 constitute notification means 46 that notifies component mounting information 41.

[0040] Furthermore, notification processing unit 37 transmits a board removal notification to another downstream device (component mounting device M4) and management computer 3 via communication unit 25. That is, notification processing unit 37 and communication unit 25 constitute removal sending means 47 that sends a notification to other devices that transport means 42 will remove board B. When transmitting the board removal notification, removal sending means 47 also transmits board number 60 of board B to be removed. Furthermore, when removing a board in which an error has been detected, removal sending means 47 also transmits a defective board notification (indicating that the board is defective) and a re-input board notification (indicating that the board is a re-input board).

[0041] Next, a component mounting method in component mounting system 1 will be described with reference to Fig. 1, 10 to 12, and along the flows of Fig. 7 to Fig. 9. In Fig. 7, first, when a board unloading notification is sent from an upstream device and board B is ready to be loaded, transport means 42 loads board B and holds it at the mounting work position (ST1: board loading step). Next, mounting processing unit 33 determines whether board B held at the mounting work position is a defective board (ST2: defective board determination step).

[0042] If a defective board notification is sent from an upstream device together with the board removal notification, the mounting processing unit 33 determines that the board is defective, and if no defective board notification is sent, it determines that the board B is not defective. If the board B held at the mounting work position is not a defective board (No in ST2), the mounting means 43 performs normal component mounting work (ST3: mounting processing step).

[0043] 8, in the mounting process step (ST3) (mounting process method), first, mounting means 43 sequentially mounts components D at mounting positions on board B held by transport means 42 (board transport mechanism 5) based on mounting data 38 (ST11: component mounting step). Error detection means 44 detects errors that occur on board B during the component mounting operation (ST12: error detection step).

[0044] If no error is detected (No in ST12), the component mounting process (ST11) and the error detection process (ST12) are repeated until mounting of all components D is completed (No in ST13). When mounting of all components is completed (Yes in ST13), the unloading sending means 47 sends a board unloading notification and the board number 60 to downstream devices and the management computer 3 (ST14: board unloading notification process).

[0045] In Fig. 8, when the error detection means 44 detects an error (Yes in ST12), the error determination unit 35 determines whether the error will affect the component mounting operation on the subsequent board B2 of the defective board B1 based on the error determination data 39 and the error record data 40 (ST15: error determination step). In Fig. 10(a), a component drop error occurs while component mounting device M3 is mounting component D06 at component mounting position P06 on board B1. Therefore, the error determination unit 35 determines whether the error will affect the subsequent board B2 on component mounting device M2.

[0046] If it is determined that the error will affect the subsequent board B2 ("Yes" in ST15), the error determination unit 35 notifies the touch panel 19, the display unit of the management computer 3, or an information terminal carried by the operator that the component mounting operation of the component mounting device M3 has stopped (ST16: error stop notification process). Next, an error stop process (ST17) is executed until the operator performs error recovery work. In the error stop process (ST17), the imaging means 45 captures an image of the defective board B1 held by the transport means 42, and the mounting confirmation unit 36 ​​acquires the component mounting information 41.

[0047] 10(b), the head camera 17 (imaging means 45) of the component mounting device M3 captures an image of the component mounting position P06 on the defective board B1. The component D06 that was scheduled to be mounted at the component mounting position P06 is misaligned, and the mounting confirmation unit 36 ​​determines that the mounting state is defective and records "X" in the mounting state 63 of the component mounting information 41 (see FIG. 6). The head camera 17 continues to capture images of the defective board B1 until the operator begins error recovery work for the component mounting device M3.

[0048] 8, once the operator has completed error recovery work such as cleaning or replacing the nozzle 21 that caused the component drop error, the component mounting work in the component mounting device M3 is resumed (ST18: mounting restart process). Once the component mounting work is resumed, the component mounting process (ST11) is executed for the unmounted component D. If it is determined in the error determination process (ST15) that the error has no effect on the subsequent board B2 ("NO" in ST15), the imaging means 45 and the mounting confirmation unit 36 ​​continue to acquire component mounting information 41 (ST20: mounting status acquisition process) until a board removal notification is sent from the upstream device ("NO" in ST19).

[0049] When a board removal notification is sent from the upstream device ("Yes" in ST19), the removal sending means 47 sends a defective board notification in addition to the board removal notification and board number 60 to the downstream device and management computer 3 (ST21: defective board removal notification step). In this way, when the error detection means 44 detects an error (Yes in ST12), the imaging means 45 images the board B1 held by the transport means 42 (ST17, ST20), and based on the image captured by the imaging means 45, component mounting information 41 including the mounting state of the components D on the board B1 is acquired (ST17, ST20).

[0050] In FIG. 7, when the mounting process step (ST3) is completed and a notice of permission to unload the substrate is sent from the downstream device, the transport means 42 unloads the substrate B1 to the downstream device (ST4: substrate unloading step).

[0051] 10(c), an error that occurred while component mounting device M3 was mounting component D06 at component mounting position P06 on board B1 has been determined by error determination unit 35 to have no effect on the subsequent board B2 on component mounting device M2 ("No" in ST15). Therefore, when component mounting device M2 completes the component mounting operation on board B2 ("Yes" in ST19), board B1 is transported from component mounting device M3 to component mounting device M4 (arrow f). At this time, a board transport notification, board number 60, and defective board notification are sent to component mounting device M4 (ST21).

[0052] Furthermore, the component mounting operation on board B2 in component mounting device M2 is completed without detecting any errors (Yes in ST13), and board B2 is transported from component mounting device M2 to component mounting device M3 (arrow g). At this time, component mounting device M3 is notified of a board transport notification and board number 60 (ST14). When board B2 is transported into component mounting device M3 (ST1), it is determined that board B2 is not a defective board because a defective board notification has not been issued (No in ST2), and the mounting processing step (ST3) is executed (FIGS. 11(a) to 11(c)).

[0053] That is, if it is determined that the error will not affect the component mounting operation on the subsequent board B2 ("None" in ST15), the transport means 42 carries out board B1 and then carries in the subsequent board B2 (ST1) (FIG. 11(a)), and the mounting means 43 performs the component mounting operation on the subsequent board B2 (ST3) (FIGS. 11(b) and 11(c)). In this way, the component mounting method of this embodiment determines whether or not the component mounting operation on the subsequent board B2 will be affected when a mounting error is detected, and if there is no effect, performs the component mounting operation on the subsequent board B2 without stopping component mounting device M3, thereby not reducing the availability rate of component mounting device M3.

[0054] In FIG. 7, in the defective substrate determination process (ST2), if the substrate B held at the mounting work position is determined to be a defective substrate (Yes), the mounting processing unit 33 determines whether the substrate B held at the mounting work position is a re-input substrate (ST5: re-input substrate determination process).

[0055] In the re-input board determination step (ST5), the mounting processing unit 33 determines that the board is a re-input board if a re-input board notification is transmitted from an upstream device together with the board removal notification, and determines that the board is not a re-input board if a re-input board notification is not transmitted. Note that the mounting processing unit 33 may determine that the board is a re-input board if component mounting information 41 corresponding to board number 60 is stored in the storage unit 31. In other words, the imaging means 45 and the mounting confirmation unit 36 ​​have previously acquired component mounting information 41 for that board B, so the board is determined to be a re-input board.

[0056] 7, if the board B held at the mounting position is not a re-entered board (No in ST5), a non-mounting confirmation process is executed (ST6: non-mounting confirmation process step). In the non-mounting confirmation process step (ST6), the imaging means 45 confirms that there are no fallen components or debris at the mounting position where the component D is to be mounted. When the non-mounting confirmation process step (ST6) is completed, the carry-out sending means 47 sends the board number 60 and a defective board notification together with the board carry-out notification to the downstream equipment and the management computer 3 (ST7: defective board carry-out notification process), and the board carry-out process (ST4) is executed. Note that if the downstream equipment becomes ready to accept board B and a board carry-out permission notification is sent, the non-mounting confirmation process step (ST6) is stopped midway. This prevents a decrease in the operating rate of the downstream equipment.

[0057] 11(a), a defective board B1 transported from component mounting device M3 is held at the mounting position of component mounting device M4. Because a re-input board notification has not been sent from component mounting device M3, it is determined not to be a re-input board in the re-input board determination step (ST5) (No), and the non-mounting confirmation processing step (ST6) is executed. That is, as shown in FIG. 11(b), the head camera 17 (imaging means 45) of component mounting device M4 captures an image of the mounting position where component mounting device M4 is scheduled to mount component D, and the presence or absence of a fallen component, etc. is confirmed.

[0058] In FIG. 11(c), when the non-mounting confirmation process (ST6) is completed, the defective board B1 is carried out onto the downstream second conveyor M5 (arrow h). In FIG. 1, the defective board B1 carried into the second conveyor M5 is removed from the second conveyor M5 by an operator (arrow c), and repair work is carried out. In this example, component D06, which was improperly mounted, is removed from the defective board B1. The operator then re-inserts the repaired defective board B1 into the first conveyor M1 (arrow e). The first conveyor M1 reads the board number 60 from the board label C of the defective board B1 using its built-in reader, and transmits a board removal notice, board number 60, defective board notice, and re-inserted board notice to the downstream component mounting device M2.

[0059] 12(a), the defective board B1 re-input onto the first conveyor M1 is then carried into the component mounting device M2 (ST1). In the defective board determination step (ST2), since a defective board notification has been sent, the board B1 is determined to be a defective board (Yes). Also, in the re-input board determination step (ST5), since a re-input board notification has been sent, the defective board B1 is determined to be a re-input board (Yes).

[0060] In FIG. 7, if the board B1 held at the mounting work position is a re-input board (Yes in ST5), a re-input mounting process is executed (ST8: re-input mounting process step).

[0061] 9, in the re-entry mounting processing step (ST8) (re-entry mounting processing method), the mounting means 43 executes the re-entry mounting processing in order for the mounting positions at which the component mounting devices M2 to M4 are designated to mount the component D, based on the mounting data 38 and the component mounting information 41. First, the mounting means 43 determines whether the component D has already been mounted at the mounting position (ST31: mounting completion determination step). Specifically, if the component mounting information 41 is not stored in the memory unit 31, the mounting means 43 determines that the component D has already been mounted. Furthermore, if the mounting status 63 of the component mounting information 41 is recorded as "◯", the mounting means 43 determines that the component D has already been mounted at that mounting position.

[0062] If it is determined that a component D has been placed at that mounting position (Yes in ST31), the imaging means 45 takes an image of that mounting position to confirm that the component D has been properly placed (ST32: placed processing step). If it is determined that a component D has not been placed at that mounting position (No in ST31), the imaging means 45 takes an image of that mounting position to confirm that there is no component D or dust, and then the mounting means 43 places the component D at that mounting position (ST34: not placed processing step). If the re-input mounting process has not been completed for all mounting positions after the placed processing step (ST32) or not placed processing step (ST34) (No in ST33), the process returns to the placed determination step (ST31) and the placed processing step (ST32) or not placed processing step (ST34) is executed.

[0063] In Figure 7, when the re-input mounting process is completed at all mounting positions (Yes in ST33), the unloading sending means 47 sends a substrate unloading notification, substrate number 60, defective substrate notification, and re-input substrate notification to downstream devices and the management computer 3 (ST9: re-input substrate unloading notification process), and the substrate unloading process (ST4) is executed.

[0064] 12(a), a re-entry mounting process step (ST8) is performed on a defective board B1 held at the mounting work position of component mounting device M2. Because component mounting information 41 is not stored in memory unit 31 of component mounting device M2, imaging means 45 sequentially captures images of the mounting positions based on mounting data 38 to confirm that components D have been properly mounted (ST32). After confirmation of all mounting positions has been completed, carry-out transmitting means 47 transmits a board carry-out notification, board number 60, defective board notification, and re-entry board notification to downstream component mounting device M3 (ST9), and the defective board B1 is carried out to component mounting device M3 (arrow j).

[0065] 12(b), a re-entry mounting process step (ST8) is performed on the defective board B1 held at the mounting work position of the component mounting device M3. Component mounting information 41 is stored in the memory unit 31 of the component mounting device M3, and the imaging means 45 performs the re-entry mounting process on the mounting positions in order based on the component mounting information 41. Specifically, for component mounting positions P01 to P05 whose mounting status 63 is "o" in the component mounting information 41 (FIG. 6), the imaging means 45 images the mounting positions in order to confirm that the components D have been properly mounted (ST32).

[0066] The mounted component processing step (ST32) may be executed after the unmounted component processing (ST34). Furthermore, the mounted component processing step (ST32) may be stopped midway if the downstream equipment is ready to accept the substrate and a notice of permission to unload the substrate is transmitted. In other words, the mounted component processing step (ST32) may be executed if there is sufficient time after the unmounted component D is mounted. This can prevent a decrease in the availability of the downstream equipment.

[0067] For component mounting position P06 where mounting status 63 is "x", if it is confirmed from the imaging results of imaging means 45 that component D06 has been mounted correctly, the worker determines that repair is complete and proceeds to the next process. If it is confirmed from the imaging results of imaging means 45 that there are no components or debris at component mounting position P06, mounting means 43 mounts component D06 at component mounting position P06 (ST34). For component mounting positions P07 to P10 where mounting status 63 is "-" or blank, if it is confirmed from the imaging results of imaging means 45 that there are no components or debris at component mounting position P06, mounting means 43 mounts component D at the mounting position (ST34).

[0068] 12(c), when the re-entry mounting processing step (ST8) is completed, the carry-out transmitting means 47 transmits a board carry-out notification, board number 60, defective board notification, and re-entry board notification to the downstream component mounting device M4 (ST9), and the defective board B1 is carried out to the component mounting device M4 (arrow k). In the component mounting device M4, the re-entry mounting processing step (ST8) is performed on the defective board B1.

[0069] In this way, when board B1 in which an error was detected is re-introduced after being carried out (Yes in ST1 and ST2, Yes in ST5), mounting means 43 mounts unmounted component D on board B1 based on component mounting information 41 of board B1 (No in ST8 and ST31, ST34). Also, if component mounting information 41 of board B1 includes a location (component mounting position P06-P10) where the mounting status 63 is faulty, unmounted, or unconfirmed, imaging means 45 captures an image of that location, and mounting means 43 mounts component D at that location (ST34). In this way, when a mounting error is detected and board B1 is re-introduced, by performing only the necessary repair work based on acquired component mounting information 41, it is possible to prevent a decrease in the availability rate of component mounting devices M2-M4.

[0070] As explained above, component mounting devices M2-M3 of this embodiment include transport means 42 for transporting board B1, mounting means 43 for mounting components D onto board B1 held by transport means 42, error detection means 44 for detecting errors that occur during component mounting on board B, and error determination unit 35 for determining whether the error will affect the component mounting on board B2 that follows board B1. If it is determined that the error will not affect the mounting on board B2, transport means 42 transports board B1 and then loads the subsequent board B2, and mounting means 43 performs component mounting on the subsequent board B2. This allows repair work on board B1 to be performed without reducing the operating rate of component mounting devices M2-M4 when a mounting error is detected.

[0071] Although the above description is given assuming that component mounting devices M2 to M4 are each equipped with error determination unit 35 and placement confirmation unit 36, management computer 3 may also be equipped with error determination unit 35 and placement confirmation unit 36. That is, component mounting system 1 may be equipped with transport means 42, placement means 43, error detection means 44, and error determination unit 35. In this case, error determination unit 35 of management computer 3 determines the effect on the subsequent board B2 based on the errors transmitted from component mounting devices M2 to M4, placement confirmation unit 36 ​​of management computer 3 creates component placement information 41 from component placement states 63 transmitted from component mounting devices M2 to M4, and management computer 3 instructs component mounting devices M2 to M4 to transport board B and place components D. [Industrial Applicability]

[0072] The component mounting device and component mounting method of the present invention have the advantage that, when a mounting error is detected, repair work can be performed on the board without reducing the operating rate of the component mounting device, and are useful in fields where components are mounted on boards. [Explanation of symbols]

[0073] 5. Substrate transport mechanism (transport means) 15 Mounting head (mounting means) 16 Head movement mechanism (mounting means, error detection means, imaging means) 17 Head camera (error detection means, imaging means) 18 Part recognition camera (error detection means) 20b Flow sensor (error detection means) 42 Transportation 43 Attachment means 44 Error detection methods 45 Imaging means 46 Means of Notification 47 Means of sending and receiving B, B2 board B1 Defective board (board) D, D06 parts

Claims

1. a transport means for transporting the substrate; a mounting means for mounting components onto the substrate held by the transport means; an error detection means for detecting an error that occurs during component mounting work on the board; an error determination unit that determines whether the error affects component mounting operations on subsequent boards on the board; If it is determined that the error will not affect the mounting operation on the subsequent board, the transport means carries out the board and then carries in the subsequent board, and the mounting means performs the component mounting operation on the subsequent board; an imaging means for imaging the top surface of the substrate held by the transport means; a mounting confirmation unit that acquires component mounting information including a mounting state of components on the board based on the image captured by the imaging means, When the error detection means detects the error, the imaging means images the board held by the transport means, and the mounting confirmation unit acquires the component mounting information. When the board on which the error was detected is re-introduced after being removed, the mounting means mounts the unmounted components on the board based on the component mounting information for the board.

2. 2. The component mounting device according to claim 1, wherein the error determination unit determines whether the error will affect component mounting operations on the subsequent board, depending on the type of the error.

3. 3. The component mounting device according to claim 1, wherein the error determination unit determines whether the error will affect component mounting operations on the subsequent board, depending on the frequency of the error.

4. The substrate transport system further includes a sending unit for sending a notification to another device that the transport unit is going to send out the substrate; 4. The component mounting device according to claim 1, wherein when the board in which the error has been detected is unloaded, the unloading transmission means also transmits a message indicating that the board is defective.

5. 5. The component mounting device according to claim 1, wherein the imaging means images the board within a range that does not affect the carrying-in of the subsequent board by the transport means.

6. 6. The component mounting device according to claim 1, further comprising: a storage unit that stores the component mounting information; or a notification unit that notifies the component mounting information.

7. 7. A component mounting device according to claim 1, wherein if the component mounting information for the board includes a location where the mounting state is poor, not mounted, or not confirmed, the imaging means takes an image of the location, and the mounting means mounts a component at the location.

8. A transport means transports the substrate; a mounting means for mounting components onto the substrate held by the transport means; an error detection means for detecting an error occurring during component mounting on the board; When the error detection means detects an error, it is determined whether or not the error will affect component mounting operations on subsequent boards on the board; If it is determined that the error will not affect the component mounting operation on the subsequent board, the transport means carries out the board and then carries in the subsequent board, and the mounting means performs the component mounting operation on the subsequent board; When the error detection means detects the error, an imaging means images the substrate held by the transport means, component placement information including a placement state of components on the board is acquired based on the image captured by the imaging means; When the board on which the error was detected is reloaded after being carried out, the mounting means mounts the unmounted component on the board based on the component mounting information of the component.

Images