Component mounting line, inspection device and inspection method

Abstract

Provided is a component mounting line comprising a component mounting device for mounting a component onto a substrate, and an inspection device for receiving a substrate unloaded from the component mounting device and inspecting the component that the component mounting device mounted onto the substrate. The inspection device acquires an image of the component mounted on the substrate, measures the position of the component on the substrate on the basis of the acquired image, and determines whether the position measurement has been performed normally. With respect to a component for which the position measurement is determined to have been performed normally, the inspection device generates first component recognition information. With respect to a component for which the position measurement is determined to have not been performed normally, the inspection device generates second component recognition information.

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting line that includes a component mounting device that mounts components on a board and an inspection device that inspects the components mounted on the board, an inspection device that constitutes this component mounting line, and an inspection method using the inspection device. [Background technology]

[0002] Conventionally, a component mounting line has been known that includes a component mounting device that uses a mounting head to pick up components and mount them on a board, and an inspection device that receives the board transported from the component mounting device and inspects the components mounted on the board. In this component mounting line, the component mounting device measures the position of the component picked up by the mounting head and mounts the component on the board based on the measured component position. The inspection device measures the actual mounted position of the component based on an image (inspection image) obtained by capturing an image of the component mounted on the board from above, and determines the positional deviation between the mounted position and the target mounted position on the board. Information regarding the mounted position measured by the inspection device is fed back to the component mounting device and is used to correct the operating parameters of the mounting head when the component mounting device mounts the component on the board (see, for example, Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-134051 Summary of the Invention

[0004] The component mounting line of the present disclosure is a component mounting line including a component mounting device that mounts components onto a board, and an inspection device that receives the board carried out from the component mounting device and inspects each of the components mounted onto the board by the component mounting device, wherein the inspection device includes an image acquisition unit that acquires an image of each of the components mounted on the board, a measurement unit that measures the position of each of the components on the board as the mounting position of that component based on the image of each of the components acquired by the image acquisition unit, a determination unit that determines for each component whether the measurement of the mounting position by the measurement unit was performed normally for that component, and a generation unit that generates component recognition information that indicates whether the measurement of the mounting position by the measurement unit was performed normally for each component determined by the determination unit, and wherein the generation unit generates first component recognition information as the component recognition information for components for which it is determined by the determination unit that the measurement of the mounting position was performed normally, and generates second component recognition information as the component recognition information for components for which it is determined by the determination unit that the measurement of the mounting position was not performed normally. The component mounting device includes a mounting position information acquisition unit that acquires mounting position information, which is information about the mounting position of each of the components measured by the measurement unit; a component recognition information acquisition unit that acquires the component recognition information for each of the components generated by the generation unit; and a confirmation unit that confirms whether the measurement of the mounting position of each of the components has been performed normally, based on the component recognition information for each of the components acquired by the component recognition information acquisition unit. do 。 Another component mounting line of the present disclosure is a component mounting line including a component mounting device that mounts components onto a board, and an inspection device that receives the board carried out from the component mounting device and inspects each of the components mounted onto the board by the component mounting device, wherein the inspection device includes an image acquisition unit that acquires an image of each of the components mounted on the board, a measurement unit that measures the position of each of the components on the board as the mounting position of that component based on the image of each of the components acquired by the image acquisition unit, a judgment unit that judges for each component whether the measurement of the mounting position by the measurement unit has been performed normally, and a judgment unit that judges for each component whether the measurement of the mounting position by the measurement unit has been performed normally for each of the components judged by the judgment unit. and a generating unit that generates component recognition information that indicates whether the measurement of the mounting position of a component has been performed correctly by the determining unit, wherein the generating unit generates first component recognition information as the component recognition information for a component for which the determining unit determines that the measurement of the mounting position has been performed correctly, and generates second component recognition information as the component recognition information for a component for which the determining unit determines that the measurement of the mounting position has not been performed correctly, and the determining unit performs pattern matching processing between the image acquired by the image acquiring unit and a reference pattern of the component, calculates a matching rate between an area occupied by the component in the image and the reference pattern, and determines that the measurement of the mounting position of the component has not been performed correctly if the calculated matching rate is lower than the reference matching rate. .

[0005] The inspection device disclosed herein is an inspection device that inspects each component mounted on a board, and includes an image acquisition unit that acquires an image of each component mounted on the board; a measurement unit that measures the position of each component on the board as the mounting position of that component based on the image of each component acquired by the image acquisition unit; a determination unit that determines for each component whether the measurement of the mounting position by the measurement unit was performed normally; and a generation unit that generates component recognition information that indicates whether the measurement of the mounting position by the measurement unit was performed normally for each component for which the determination unit has made the determination, and the generation unit generates first component recognition information as the component recognition information for a component for which the determination unit has determined that the measurement of the mounting position was performed normally, and generates second component recognition information as the component recognition information for a component for which the determination unit has determined that the measurement of the mounting position was not performed normally. The determination unit performs a pattern matching process between the image acquired by the image acquisition unit and a reference pattern of the component, calculates a matching rate between an area occupied by the component in the image and the reference pattern, and if the calculated matching rate is lower than a reference matching rate, determines that the measurement of the mounting position of the component was not performed normally. do.

[0006] The inspection method disclosed herein is an inspection method for inspecting each component mounted on a board, comprising: an image acquisition step of acquiring an image of each of the components mounted on the board; and The method includes a measurement step of measuring the position of each of the components mounted on the board as the mounting position of that component; a determination step of determining for each component whether the measurement of the mounting position was performed normally in the measurement step; and a generation step of generating component recognition information that is information indicating whether the measurement of the mounting position was performed normally in the measurement step for each of the components determined in the determination step, wherein the generation step generates first component recognition information as the component recognition information for a component for which it is determined in the determination step that the measurement of the mounting position was performed normally, and generates second component recognition information as the component recognition information for a component for which it is determined in the determination step that the measurement of the mounting position was not performed normally. The determining step performs a pattern matching process between the image acquired in the image acquiring step and a reference pattern of the component, calculates a matching rate between an area occupied by the component in the image and the reference pattern, and determines that the measurement of the mounting position of the component was not performed normally if the calculated matching rate is lower than a reference matching rate. do. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to improve the reliability of the correction of the operating parameters in a component mounting device. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a configuration diagram of a component mounting line according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a perspective view of a component mounting device provided in a component mounting line according to an embodiment of the present disclosure. [Figure 3] FIG. 3 is a block diagram showing a control system of a component mounting line according to an embodiment of the present disclosure. [Figure 4] FIG. 4 is a perspective view of an inspection device provided in a component mounting line according to an embodiment of the present disclosure. [Figure 5] FIG. 5 is a plan view of an example of a board to be inspected by an inspection device provided in a component mounting line according to an embodiment of the present disclosure. [Figure 6]FIG. 6 is a diagram showing an example of an image obtained by one image capture by an inspection camera provided in an inspection device for a component mounting line according to an embodiment of the present disclosure. [Figure 7] FIG. 7 is a diagram illustrating the positional deviation of a component calculated by an inspection device on a component mounting line according to an embodiment of the present disclosure. [Figure 8] FIG. 8 is a diagram illustrating a first method of determination performed by a determination unit of an inspection device for a component mounting line according to an embodiment of the present disclosure. [Figure 9A] FIG. 9A is a diagram illustrating a first method of determination performed by a determination unit of an inspection device for a component mounting line according to an embodiment of the present disclosure. [Figure 9B] FIG. 9B is a diagram illustrating a first method of determination performed by a determination unit of an inspection device for a component mounting line according to an embodiment of the present disclosure. [Figure 10A] FIG. 10A is a diagram illustrating a second method of determination performed by the determining unit of the inspection device for the component mounting line according to the embodiment of the present disclosure. [Figure 10B-1] FIG. 10B-1 is a diagram illustrating a second method of determination performed by the determining unit of the inspection device for the component mounting line according to the embodiment of the present disclosure. [Figure 10B-2] FIG. 10B-2 is a diagram illustrating a second method of determination performed by the determining unit of the inspection device for the component mounting line according to the embodiment of the present disclosure. [Figure 10C-1] FIG. 10C-1 is a diagram illustrating a second method of determination performed by the determining unit of the inspection device for the component mounting line according to the embodiment of the present disclosure. [Figure 10C-2] FIG. 10C-2 is a diagram illustrating a second method of determination performed by the determining unit of the inspection device for the component mounting line according to the embodiment of the present disclosure. [Figure 11A] FIG. 11A is a diagram showing components in an inspection image for illustrating a third method of determination performed by a determination unit of an inspection device in a component mounting line according to an embodiment of the present disclosure. [Figure 11B]FIG. 11B is a diagram showing a component in an inspection image when the component is mounted without tilt, to illustrate a third method of judgment performed by the judgment unit of the inspection device of the component mounting line in one embodiment of the present disclosure. [Figure 11C] FIG. 11C is a side view of a component corresponding to an inspection image for explaining a third method of determination performed by the determining unit of the inspection device in the component mounting line according to the embodiment of the present disclosure. [Figure 12] FIG. 12 is a flowchart showing the flow of an inspection operation performed by an inspection device on a component mounting line according to an embodiment of the present disclosure. [Figure 13] FIG. 13 is a flowchart showing the flow of the operation parameter correction process executed by a component mounting device in a component mounting line according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0009] Prior to describing the embodiments of the present disclosure, a brief description of problems with conventional devices will be given below: There is a possibility that component placement position information obtained by an inspection device may contain unreliable information, and correcting operational parameters based on unreliable information may actually result in a decrease in component placement accuracy.

[0010] Therefore, an object of the present disclosure is to provide a component mounting line, an inspection device, and an inspection method that can improve the reliability of correcting operating parameters in a component mounting device.

[0011] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. Fig. 1 shows a configuration diagram of a component mounting line 1 according to an embodiment of the present disclosure. In Fig. 1, the component mounting line 1 includes a component mounting device 11, an inspection device 12, and a management device 13.

[0012] Component mounting device 11 receives board KB from an upstream device (e.g., a solder printing device) and mounts components BH on board KB. Inspection device 12 is located downstream of component mounting device 11, receives board KB carried out from component mounting device 11, and inspects the components BH mounted on board KB. Management device 13 is connected to component mounting device 11 and inspection device 12 in a communicable state, and manages component mounting device 11 and inspection device 12.

[0013] FIG. 2 is a perspective view of a component mounting device 11 provided in the component mounting line 1. In FIGS. 1 and 2, the component mounting device 11 includes a board transport path 21, a component supply unit 22, a mounting head 23, a head movement mechanism 24, a component camera 25, a mounting device input / output unit 26, and a mounting device control unit 27. The board transport path 21 carries in, positions, and carries out boards KB. The component supply unit 22 is, for example, a tape feeder, and supplies components BH to predetermined positions. The mounting head 23 includes a nozzle 23N extending downward. The mounting head 23 can raise and lower the nozzle 23N and rotate it about a vertical axis, and can also pick up components BH supplied by the component supply unit 22 onto the lower end of the nozzle 23N.

[0014] The head movement mechanism 24 is composed of an XY table mechanism equipped with a fixed beam 24a and a moving beam 24b that is movable relative to the fixed beam 24a. The head movement mechanism 24 moves the mounting head 23 in a horizontal plane by combining the operation of moving the moving beam 24b relative to the fixed beam 24a and the operation of moving the mounting head 23 relative to the moving beam 24b. The mounting head 23 picks up components BH supplied by the component supply unit 22 and places the picked-up components BH on the board KB by moving the moving beam 24b relative to the fixed beam 24a, raising and lowering the nozzle 23N, and rotating the nozzle 23N, and by using the nozzle 23N to pick up and release the components BH.

[0015] 1 and 2, component camera 25 is provided between board transport path 21 and component supply unit 22 with its imaging field of view facing upward. When mounting head 23 moves upward with component BH adsorbed to the lower end of nozzle 23N, component camera 25 captures an image of component BH from below. The image of component BH (pre-mounting image) captured by component camera 25 is used to measure the position (pre-mounting position) of component BH and to recognize component BH, etc.

[0016] The wearing device input / output unit 26 is composed of, for example, a touch panel. The wearing device input / output unit 26 accepts input operations by the worker and notifies the worker of the tasks that the worker should perform and various information by means of a screen, voice, etc.

[0017] Fig. 3 is a block diagram showing the control system of the component mounting line 1. As shown in Fig. 3, the mounting device control unit 27 includes a mounting device storage unit 31, a mounting control unit 32, a mounting device communication unit 33, and a feedback control unit 34. The feedback control unit 34 includes a mounting position information acquisition unit 41, a component recognition information acquisition unit 42, a confirmation unit 43, a correction unit 44, and an information aggregation unit 45.

[0018] The placement device storage unit 31 stores data (placement data) and a placement program required for placing components BH on the board KB. The placement data includes target coordinates, which are the target placement positions on the board KB for the components BH to be placed, as well as data such as the type and placement direction of the components BH to be placed at those target coordinates. The placement program is a control program that operates each unit of the component placement device 11 (component supply unit 22, placement head 23, head movement mechanism 24, component camera 25, etc.) to place a predetermined type of component BH at a predetermined position (target coordinates) in a predetermined placement direction in accordance with the placement data.

[0019] Based on the placement program, the placement control unit 32 operates the board transport path 21, component supply unit 22, placement head 23, and head movement mechanism 24. As a result, the board transport path 21 carries in and positions the board KB, the component supply unit 22 supplies the components BH, and the head movement mechanism 24 and placement head 23 operate in conjunction to repeatedly perform placement turns. As a result, the components BH are placed one after another on the board KB.

[0020] In one placement turn, the placement head 23 is operated to perform the following operations in this order: picking up a component BH (pickup operation), recognizing the component BH (recognition operation), and placing the component BH (placement operation). In the pick-up operation, the placement head 23 moves above the component supply unit 22 and picks up the component BH supplied by the component supply unit 22 onto the nozzle 23N. In the recognition operation, the placement head 23 moves above the component camera 25, which captures an image of the component BH picked up by the nozzle 23N from below. In the placement operation, the placement head 23 moves above the board KB and places the component BH, imaged by the component camera 25, at target coordinates on the board KB.

[0021] In the above-described recognition operation of the placement head 23, the placement control unit 32 causes the component camera 25 to capture an image of the component BH to acquire the image of the component BH (the pre-placement image described above). The placement control unit 32 measures the position of the component BH based on the acquired pre-placement image. This measurement of the position of the component BH is performed by determining the center position of the component BH using a predetermined method, and then measuring the determined center position of the component BH as the position of the component BH. The placement control unit 32 moves the placement head 23 so that the component BH is placed so that the determined center position of the component BH coincides with the target coordinates specified as the placement data.

[0022] The mounting device communication unit 33 is connected in a state in which it can communicate with both the management device 13 and the inspection device 12. Therefore, the mounting device communication unit 33 can receive information detected by the inspection device 12 as feedback information via the management device 13 or directly without via the management device 13.

[0023] The feedback control unit 34 performs feedback processing based on the feedback information received from the inspection device 12. The main content of the feedback processing is to correct the operating parameters of the mounting head 23 when the component mounting device 11 mounts the component BH on the board KB. Here, the "operation parameters" refer to control data for operating the mounting head 23 so that the component BH is mounted at the target coordinates on the board KB. The feedback control unit 34 will be described after the description of the inspection device 12.

[0024] 4 is a perspective view of inspection device 12. In FIGS. 1 and 4, inspection device 12 includes board transport unit 51, inspection camera 52, camera movement mechanism 53, inspection device input / output unit 54, and inspection device control unit 55. Board transport unit 51 carries in, positions, and carries out board KB. Inspection camera 52 has an imaging field facing downward, and by capturing images while positioned above board KB, captures images from above of components BH mounted on board KB by component mounting device 11. That is, in this embodiment, inspection camera 52 serves as an image acquisition unit that acquires images (inspection images) of each component BH mounted on board KB.

[0025] The image (inspection image) of component BH captured by inspection camera 52 is used to measure the position (mounting position) of component BH on board KB, etc. Camera movement mechanism 53 is made up of an XY table mechanism equipped with fixed beam 53a and movable beam 53b that is movable relative to fixed beam 53a, and moves inspection camera 52 horizontally. Camera movement mechanism 53 moves inspection camera 52 in the horizontal plane by combining the operation of moving movable beam 53b relative to fixed beam 53a and the operation of moving inspection camera 52 relative to movable beam 53b.

[0026] The inspection device input / output unit 54 is made up of, for example, a touch panel. The inspection device input / output unit 54 accepts input operations by the operator and notifies the operator of the work to be performed and various information by means of a screen, voice, etc.

[0027] 3, the inspection device control unit 55 includes an inspection device storage unit 61, an inspection image acquisition control unit 62, a measurement unit 63, a determination unit 64, a judgment unit 65, a generation unit 66, and an inspection device communication unit 67. The inspection device storage unit 61 stores an inspection program in addition to the above-mentioned placement data stored in the placement device storage unit 31. The inspection program is a control program that operates each unit of the inspection device 12 (such as the board transport unit 51, the inspection camera 52, and the camera movement mechanism 53) to inspect whether each component BH placed on the board KB by the component placement device 11 is placed in a predetermined orientation at the target coordinates defined in the placement data.

[0028] The inspection image acquisition control unit 62 acquires an inspection image of each component BH by having the inspection camera 52 capture images of all of the components BH mounted on the board KB. At this time, the inspection image acquisition control unit 62 causes the inspection camera 52 to repeatedly perform an imaging operation while moving the inspection camera 52 above the board KB positioned by the board transport unit 51, based on the inspection program stored in the inspection apparatus storage unit 61. The inspection image acquired by the inspection camera 52 in one imaging operation may include one component BH or multiple components BH, depending on the arrangement of the components BH on the board KB.

[0029] Fig. 5 is a plan view of an example of a board to be inspected by inspection device 12. Fig. 5 shows an example of a board KB to be inspected by inspection device 12, and each of the multiple dashed-dotted line areas AR shown in Fig. 5 indicates an area on the board KB obtained by one image capture by inspection camera 52. Fig. 6 is a diagram showing an example of an image (inspection image GZ) obtained by one image capture by inspection camera 52. In Fig. 6, multiple components BH are included in inspection image GZ.

[0030] The measurement unit 63 measures the position (the above-mentioned mounting position) on the board KB of one or more components BH included in each inspection image GZ, based on each of the multiple images (inspection images GZ) captured by the inspection camera 52. In measuring the mounting position of the component BH, the measurement unit 63 measures the position of the center ZP (see FIG. 6) of the component BH, based on the inspection image GZ acquired by the inspection image acquisition control unit 62.

[0031] The mounting position of component BH is calculated from the position of the center ZP of that component BH in the inspection image GZ (position based on the origin OR of the inspection image GZ) and the position of the origin OR of the inspection image GZ relative to the board KB. The position of the origin OR of the inspection image GZ can be obtained from the position of the inspection camera 52 when the inspection image GZ was acquired.

[0032] Furthermore, for each component BH whose mounting position has been measured, the measurement unit 63 compares the position of the center ZP of that component BH with the target coordinates of that component BH stored in the inspection device memory unit 61 to determine the positional deviation of that component BH from the target coordinates. FIG. 7 is a diagram illustrating the component positional deviation calculated by the inspection device 12. FIG. 7 shows a state in which the position of the center ZP of the target component BH is deviated from the target coordinates MZ. In FIG. 7, if the target coordinates on the board KB are expressed by coordinates of the X-axis and Y-axis that are orthogonal within the plane of the board KB, the difference (DX) in the X-axis direction and the difference (DY) in the Y-axis direction between the position of the center ZP of the component BH and the position of the target coordinates MZ are determined as the positional deviation (DX, DY) of the component BH.

[0033] The determination unit 64 performs a pass / fail determination on each component BH whose mounting position has been determined by the measurement unit 63, determining whether the mounting state of that component BH is good or bad. Specifically, the determination unit 64 compares the positional deviation of the component BH determined by the measurement unit 63 with a tolerance value defined for that component BH, and determines whether the positional deviation is equal to or less than the tolerance value. If the positional deviation of the component BH is equal to or less than the tolerance value, the determination unit 64 determines that the mounting state of that component BH is good, and if the positional deviation of the component BH exceeds the tolerance value, the determination unit 64 determines that the mounting state of that component BH is bad. Note that tolerance data for each component BH is stored in the inspection device storage unit 61.

[0034] In the example of Fig. 7, if the tolerance for positional misalignment is RX in the X-axis direction and RY in the Y-axis direction, then if DX≦RX and DY≦RY, the mounting state of component BH is determined to be good, and if DX>RX or DY>RY, the mounting state of component BH is determined to be bad. As shown in Fig. 6, if inspection image GZ contains multiple components BH, a pass / fail judgment is made for each of the multiple components BH contained in inspection image GZ.

[0035] The determination unit 65 determines whether the measurement of the mounting position by the measurement unit 63 was performed normally for each component BH whose mounting position has been measured by the measurement unit 63. In this embodiment, this determination is performed by any one of the following first, second, and third methods.

[0036] 8 to 9B are diagrams illustrating a first method of judgment performed by the judgment unit 65 of the inspection device 12. In the first method, the judgment unit 65 judges whether the entire part BH in the inspection image GZ is located within a measurement area KA set for that part BH, as shown in Fig. 8. The measurement area KA has a shape and size corresponding to the part BH, and is set at the target coordinate MZ of the part BH.

[0037] In the first method, the judgment unit 65 compares the component BH with the measurement area KA, and if the entire component BH is located within the measurement area KA as shown in Figure 9A, it judges that the measurement of the mounting position of the component BH was performed correctly, and if at least a part of the component BH is located outside the measurement area KA as shown in Figure 9B, it judges that the measurement of the mounting position of the component BH was not performed correctly.

[0038] 10A to 10C-2 are diagrams illustrating a second method of determination performed by the determination unit 65 of the inspection device 12. In the second method, the determination unit 65 performs pattern matching processing between the inspection image GZ and a reference pattern of the component BH, and calculates a matching rate between the region occupied by the component BH in the inspection image GZ and the reference pattern. This pattern matching processing is performed using a known method. For example, if the region BR occupied by the component BH in the inspection image GZ is the region shown in FIGS. 10B-1 and 10B-2 for the reference pattern KP shown in FIG. 10A, the matching rate is calculated from the reference pattern KP as shown in FIGS. 10C-1 and 10C-2, which is obtained by aligning the centers ZP of the reference pattern KP and the region BR.

[0039] In the second method, the determination unit 65 calculates the matching rate and then compares the calculated matching rate with a predetermined standard matching rate. If the matching rate is equal to or higher than the standard matching rate, it determines that the measurement of the mounting position of the component BH was performed correctly. On the other hand, if the calculated matching rate is lower than the standard matching rate, it determines that the measurement of the mounting position of the component was not performed correctly. The standard matching rate is, for example, 80%.

[0040] 11A to 11C are diagrams illustrating a third technique of judgment performed by the judgment unit 65 of the inspection device 12. In the third technique, the judgment unit 65 compares the dimensions (measured dimensions) obtained by measuring the dimensions of the part BH in the inspection image GZ with reference dimensions, and determines the difference between the measured dimensions and the reference dimensions as the dimension difference. For example, in the example of FIG. 11A, the measured dimension of the part BH in the X-axis direction is X1, and the measured dimension in the Y-axis direction is Y1.

[0041] On the other hand, the reference dimensions are dimensions determined from the design values ​​of component BH, and correspond to the dimensions of the component (denoted by the symbol "BHa" in the figure) in the inspection image GZ when the component is mounted on the board KB without any tilt, as shown in FIG. 11B. In the example of FIG. 11B, the reference dimension in the X-axis direction is X0, and the reference dimension in the Y-axis direction is Y0. A dimensional difference between the measured dimension and the reference dimension for the same component BH occurs, for example, when the component BH is mounted on the board KB with a portion of the component floating above the surface of the board KB, as shown in FIG. 11C.

[0042] In the third method, the judgment unit 65 obtains the measured dimensions of the component BH in the inspection image GZ, compares them with the reference dimensions to calculate the dimensional difference, and then compares the calculated dimensional difference with the reference dimensional difference established for that component BH. If the calculated dimensional difference is equal to or less than the reference dimensional difference, it is determined that the measurement of the mounting position for that component BH was performed correctly. On the other hand, if the calculated dimensional difference is greater than the reference dimensional difference, it is determined that the measurement of the mounting position for that component BH was not performed correctly.

[0043] 11A and 11B, the dimensional difference ΔX in the X-axis direction is ΔX=X0-X1, and the dimensional difference ΔY in the Y-axis direction is ΔY=Y0-Y1. The judgment unit 65 compares these dimensional differences (ΔX, ΔY) with the reference dimensional differences (DX, DY), and if both (ΔX, ΔY) are equal to or less than the reference dimensional difference (ΔX≦DX and ΔY≦DY), it determines that the measurement of the mounting position of that component BH was performed correctly. On the other hand, if at least one of (ΔX, ΔY) exceeds the reference dimensional difference (DX, DY) (if ΔX>DX or ΔY>DY), it determines that the measurement of the mounting position of that component BH was not performed correctly.

[0044] The generation unit 66 generates information (component recognition information) indicating whether or not the measurement of the mounting position was performed normally by the measurement unit 63 for each component BH for which the determination unit 65 has made the above determination. Specifically, the generation unit 66 generates first component recognition information as the component recognition information for each component BH for which the determination unit 65 has determined that the measurement of the mounting position was performed normally, and generates second component recognition information as the component recognition information for each component for which the determination unit 65 has determined that the measurement of the mounting position was not performed normally.

[0045] The inspection device communication unit 67 is connected in a state in which it can communicate with both the management device 13 and the component mounting device 11. The inspection device communication unit 67 transmits information (mounting position information) relating to the mounting position of each component BH measured by the measurement unit 63 and component recognition information (first component recognition information or second component recognition information) for each component BH on the board KB generated by the generation unit 66 to the component mounting device 11 via the management device 13 or directly without via the management device 13.

[0046] Next, we will explain the feedback control unit 34 included in the placement device control unit 27. As described above, the feedback control unit 34 includes the placement position information acquisition unit 41, the component recognition information acquisition unit 42, the confirmation unit 43, the correction unit 44, and the information aggregation unit 45.

[0047] The mounting position information acquisition unit 41 acquires mounting position information for each component BH on the board KB from the inspection device 12 via the management device 13 from the inspection device communication unit 67 of the inspection device 12, or directly without via the management device 13. The component recognition information acquisition unit 42 acquires component recognition information for each component BH on the board KB from the inspection device 12 via the management device 13 from the inspection device communication unit 67 of the inspection device 12, or directly without via the management device 13.

[0048] The confirmation unit 43 confirms whether the measurement of the mounting position of each component BH has been performed normally, based on the component recognition information for each component BH acquired by the component recognition information acquisition unit 42. As a result, each component acquired by the component recognition information acquisition unit 42 is sorted into those for which the first component recognition information is linked as the component recognition information and those for which the second component recognition information is linked as the component recognition information.

[0049] The correction unit 44 corrects the operation parameters when the component mounting device 11 mounts each component BH on the board KB, using the information about the mounting position (mounting position information) acquired by the mounting position information acquisition unit 41. In particular, for a component BH whose measurement of the mounting position has been confirmed to have been performed correctly by the confirmation unit 43, the correction unit 44 corrects the operation parameters using the mounting position information acquired by the mounting position information acquisition unit 41. On the other hand, for a component BH whose measurement of the mounting position has been confirmed to have been performed incorrectly by the confirmation unit 43, the correction unit 44 does not correct the operation parameters using the mounting position information acquired by the mounting position information acquisition unit 41.

[0050] The information collecting unit 45 collects information related to the placement accuracy of the component BH using the placement position information acquired by the placement position information acquisition unit 41. Specifically, for a component BH for which the confirmation unit 43 has confirmed that the placement position measurement was performed correctly, the information collecting unit 45 collects information related to the placement accuracy of the component BH using the placement position information acquired by the placement position information acquisition unit 41. On the other hand, for a component BH for which the confirmation unit 43 has confirmed that the placement position measurement was not performed correctly, the information collecting unit 45 does not collect information related to the placement accuracy of the BH using the placement position information acquired by the placement position information acquisition unit 41. This prevents a situation in which the placement accuracy of the component BH is reduced (the placement accuracy is evaluated low) due to an accidental placement defect, such as a simple mistake in picking up the component BH by the placement head 23.

[0051] When performing a component mounting operation to mount components BH on a board KB using the component mounting line 1 configured as described above, the component mounting device 11 first receives the board KB from an upstream device (e.g., a solder printing device) via the board transport path 21 and positions it at a predetermined component mounting operation position. Then, the mounting head 23 repeatedly picks up components BH supplied by the component supply unit 22 and mounts them on the board KB. Once all the components BH to be mounted on the board KB have been mounted in this manner, the component mounting device 11 transports the board KB to the downstream inspection device 12.

[0052] Inspection device 12 receives and carries in board KB carried out from component mounting device 11 by board transport section 51, positions it at a predetermined inspection position, and then performs an inspection of each component BH mounted on board KB.

[0053] The flowchart shown in Fig. 12 shows the procedure for performing this inspection (the inspection method by the inspection device 12). When performing the inspection, the inspection device 12 first loads and positions the board KB that has been unloaded from the component mounting device 11 (step ST1 shown in Fig. 12). After the board KB has been positioned, the inspection camera 52 is moved by the camera movement mechanism 53 to acquire images (inspection images GZ) of each component BH on the board KB (step ST2, image acquisition step). After acquiring the inspection images GZ of each component BH on the board KB, the inspection device 12 measures the mounting position of each component BH based on the inspection images GZ (measurement step of step ST3) to acquire mounting position information for each component BH (step ST4).

[0054] After acquiring the mounting position information for each component BH, the inspection device 12 determines whether the mounting state of each component BH is good or bad based on the mounting position information for each component BH (step ST5). If the determination is made that the mounting state of a component BH on the board KB is bad, the worker is notified via the inspection device input / output unit 54. This allows the worker to remove the board KB having the component BH determined to be badly mounted when the board KB is carried out of the inspection device 12, and to correct the mounting state of the component BH as necessary.

[0055] After determining whether each component BH mounted on the board KB is good or bad, inspection device 12 designates one of the multiple components BH for which mounting position information was acquired in step ST4 (step ST6). Then, for the designated component BH, it determines whether the mounting position measurement was performed correctly in the measurement step of step ST3 (step ST7, determination step). For each component BH for which the determination was made in this determination step, inspection device 12 generates component recognition information indicating whether the mounting position measurement was performed correctly in the measurement step of step ST3 (generation step). Specifically, for a component BH for which it is determined that the mounting position measurement was performed correctly (Yes (Y) in step ST7), it generates first component recognition information (step ST8), and for a component BH for which it is determined that the mounting position measurement was not performed correctly (No (N) in step ST7), it generates second component recognition information (step ST9).

[0056] After generating the component recognition information (first component information or second component information) in the generation step (step ST8 or step ST9), the inspection device 12 determines whether there are any unspecified components BH (step ST10). If there are any unspecified components BH (Y in step ST10), the process returns to step ST6, where the inspection device 12 specifies a new unspecified component BH, and then performs the processes of steps ST7 to ST9. On the other hand, if there are no unspecified components BH in step ST10 (N in step ST10), the inspection device 12 transmits the mounting position information and component recognition information for each component BH obtained up to that point to the component mounting device 11 via the management device 13 or directly without via the management device 13 (step ST11). After transmitting the mounting position information and component recognition information for all components BH to the component mounting device 11, the inspection device 12 transports the board KB to a downstream device (e.g., a reflow device) (step ST12), and the inspection work for the board KB is completed.

[0057] As described above, the component mounting device 11 mounts components BH on the board KB that has been brought in from the upstream side and then transports it to the inspection device 12. However, if the component mounting device 11 has received information (mounting position information and component recognition information) on the results of the inspection work on the board KB that has already had components BH mounted and transported to the inspection device 12 before mounting the components BH on the board KB, it performs correction processing work on the operating parameters based on that information.

[0058] The flowchart shown in Fig. 13 shows the procedure for performing the operation parameter correction processing work. When performing the operation parameter correction processing work, the component mounting device 11 first specifies one of the multiple components BH mounted on the board KB for which the results of the inspection work have been received from the inspection device 12 (step ST21 shown in Fig. 13). Then, based on the component recognition information acquired for the specified component BH, it checks whether the measurement of the mounting position of the component BH has been performed correctly (step ST22).

[0059] For components BH for which it is confirmed in step ST22 that the measurement of the placement position has been performed normally (Y in step ST22), the component placement device 11 corrects the operation parameters using the placement position information (step ST23) and compiles information related to the placement accuracy using the placement position information (step ST24).On the other hand, for components BH for which it is confirmed in step ST22 that the measurement of the placement position has not been performed normally (N in step ST22), the component placement device 11 does not correct the operation parameters (step ST25), and does not compile information related to the placement accuracy using the placement position information (step ST26).

[0060] After completing step ST24 or step ST26, the component mounting apparatus 11 determines whether there are any components BH that have not yet been specified (step ST27). If there are any components BH that have not yet been specified (Y in step ST27), the apparatus returns to step ST21, specifies a new component BH that has not yet been specified, and then performs steps ST22 to ST26. On the other hand, if there are no components BH that have not yet been specified in step ST27 (N in step ST27), the operation parameter correction process for the board KB is terminated. If new operation parameters are obtained by performing the operation parameter correction process, the component mounting apparatus 11 updates the values ​​of the operation parameters that have been used up until then, and operates the mounting head 23 using the updated operation parameters to mount the components BH on the board KB.

[0061] Thus, in component mounting line 1 in this embodiment, inspection device 12 acquires inspection image GZ of each component BH mounted on board KB, measures the position of each component BH on board KB as the mounting position of that component BH based on the acquired inspection image GZ of each component BH (measurement step of step ST3), and determines whether the measurement of the mounting position was performed correctly (determination step of step ST7). Then, for components BH whose mounting position measurement is determined to have been performed correctly, first component recognition information is generated as the component recognition information, and for components BH whose mounting position measurement is determined to have been performed incorrectly, second component recognition information is generated as the component recognition information (generation step of step ST8 or step ST9).

[0062] Furthermore, in the component mounting line 1 of this embodiment, the component mounting device 11 acquires the generated component recognition information (first component recognition information or second component recognition information) for each component BH, and checks whether the mounting position of each component BH was measured correctly based on the acquired component recognition information for each component BH. For components BH for which it is confirmed that the mounting position measurement was performed correctly, the operating parameters are corrected and the mounting position information is tallied based on the mounting position information acquired by the inspection device 12, and for components BH for which it is confirmed that the mounting position measurement was not performed correctly, the operating parameters are not corrected and the mounting position information is not tallied.

[0063] That is, in the component mounting line 1 of this embodiment, low-reliability data from the inspection results of the component BH is not used as feedback information, and only highly reliable data from the inspection results is used as feedback information to correct the operating parameters and compile the mounting position information. Therefore, the component mounting line 1 of this embodiment can improve the reliability of the correction of the operating parameters in the component mounting device 11 and the compilation results of the mounting position information (information related to the mounting accuracy of the component BH).

[0064] As described above, in the component mounting line 1 of this embodiment, when the inspection device 12 measures the mounting position of each component BH mounted on the board KB, it determines for each component BH whether the measurement was performed correctly, and corrects the operating parameters of the component mounting device 11 for only those components BH for which it is determined that the measurement of the mounting position was performed correctly (it does not correct the operating parameters for those components BH for which it is determined that the measurement of the mounting position was not performed correctly). This allows the component mounting device 11 to correct the operating parameters based only on highly reliable data from the inspection results of the inspection device 12. Therefore, the component mounting line 1 of this embodiment (or the inspection device 12, or the inspection method using the inspection device 12) can improve the reliability of the correction of the operating parameters of the component mounting device 11, thereby enabling the production of high-quality boards with high component BH mounting accuracy.

[0065] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above and various modifications are possible. For example, in the above-described embodiment, the first, second, and third methods are shown as methods by which the determination unit 65 of the inspection device 12 determines whether the measurement of the wearing position by the measurement unit 63 has been performed normally, but the determination unit 65 may use other methods to determine whether the measurement of the wearing position has been performed normally.

[0066] 12, inspection device 12 transmits mounting position information and component recognition information for each component BH to component mounting device 11, but the component BH for which second component recognition information is generated is not subsequently used as feedback information in component mounting device 11. Therefore, inspection device 12 can also be configured not to transmit mounting position information to component mounting device 11 in step ST11 for the component BH for which second component recognition information is generated in step ST9.

[0067] In the above-described embodiments, each component may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. [Industrial Applicability]

[0068] A component mounting line, an inspection device, and an inspection method are provided that can improve the reliability of correction of operating parameters in a component mounting device. [Explanation of symbols]

[0069] 1. Parts mounting line 11 Component placement device 12 Inspection equipment 13 Management device 41 Wearing position information acquisition unit 42 Parts recognition information acquisition unit 43 Verification Department 44 Correction unit 45 Information Collection Department 52 Inspection camera (image acquisition unit) 63 Measurement section 65 Judgment Department 66 Generation part GZ inspection image (image) KA measurement area KP Reference Pattern BH parts KB board

Claims

1. A component mounting line including a component mounting device that mounts components onto a board, and an inspection device that receives the board carried out from the component mounting device and inspects each component mounted on the board by the component mounting device, The inspection device includes: an image acquisition unit that acquires an image of each of the components mounted on the board; a measurement unit that measures the position of each of the components on the board as a mounting position of the component based on the image of each of the components acquired by the image acquisition unit; a determination unit that determines for each of the components whether the measurement of the mounting position by the measurement unit has been normally performed; a generating unit that generates component recognition information that indicates whether the measurement of the mounting position of each of the components for which the determination has been made by the determining unit has been normally performed by the measuring unit, the generation unit generates first component recognition information as the component recognition information for a component for which the determination unit has determined that the measurement of the mounting position has been performed normally, and generates second component recognition information as the component recognition information for a component for which the determination unit has determined that the measurement of the mounting position has not been performed normally; The component mounting device has a mounting position information acquisition unit that acquires mounting position information, which is information about the mounting position of each of the components measured by the measurement unit, a component recognition information acquisition unit that acquires the component recognition information for each of the components generated by the generation unit, and a confirmation unit that confirms whether the measurement of the mounting position for each of the components has been performed normally based on the component recognition information for each of the components acquired by the component recognition information acquisition unit.

2. 2. The component mounting line according to claim 1, wherein the component mounting device has a correction unit that corrects operation parameters for each component when the component mounting device mounts each component on a board using the mounting position information acquired by the mounting position information acquisition unit, and the correction unit corrects the operation parameters using the mounting position information acquired by the mounting position information acquisition unit for components for which it has been confirmed by the confirmation unit that measurement of the mounting position has been performed normally, and does not correct the operation parameters using the mounting position information acquired by the mounting position information acquisition unit for components for which it has been confirmed by the confirmation unit that measurement of the mounting position has not been performed normally.

3. 2. The component mounting line according to claim 1, wherein the component mounting device has an information aggregation unit that aggregates the mounting position information acquired by the mounting position information acquisition unit, and the information aggregation unit aggregates the mounting position information using the mounting position information acquired by the mounting position information acquisition unit for components for which it has been confirmed by the confirmation unit that the measurement of the mounting position has been performed normally, and does not aggregate the mounting position information using the mounting position information acquired by the mounting position information acquisition unit for components for which it has been confirmed by the confirmation unit that the measurement of the mounting position has not been performed normally.

4. 4. The component mounting line according to claim 1, wherein the determination unit determines whether the entire component in the image acquired by the image acquisition unit is located within a measurement area set for that component, and if at least a part of the component is located outside the measurement area, determines that the measurement of the mounting position for that component was not performed normally.

5. 4. The component mounting line according to claim 1, wherein the determination unit performs pattern matching processing between the image acquired by the image acquisition unit and a reference pattern of the component, calculates a matching rate between an area occupied by the component in the image and the reference pattern, and if the calculated matching rate is lower than the reference matching rate, determines that the measurement of the mounting position of the component was not performed normally.

6. 4. The component mounting line according to claim 1, wherein the determination unit determines that the measurement of the mounting position of the component was not performed normally when a dimensional difference, which is a difference between the dimension of the component in the image acquired by the image acquisition unit and a reference dimension, exceeds the reference dimensional difference.

7. 7. The component mounting line according to claim 1, wherein the inspection device transmits the mounting position information and the component recognition information for each of the components to the component mounting device via a management device that manages the component mounting device and the inspection device, or directly without going through the management device.

8. 7. A component mounting line according to claim 1, wherein the inspection device does not transmit the mounting position information and the component recognition information to the component mounting device for components for which the second component recognition information is generated by the generation unit.

9. 9. The component mounting line according to claim 8, wherein, for components for which the first component recognition information is generated by the generation unit, the inspection device transmits the mounting position information and the component recognition information for each of the components to the component mounting device via a management device that manages the component mounting device and the inspection device, or directly without going through the management device.

10. A component mounting line comprising a component mounting device that mounts components onto a board, and an inspection device that receives the board carried out from the component mounting device and inspects each component mounted onto the board by the component mounting device, The inspection device includes: an image acquisition unit that acquires an image of each of the components mounted on the board; a measurement unit that measures the position of each of the components on the board as a mounting position of the component based on the image of each of the components acquired by the image acquisition unit; a determination unit that determines for each of the components whether the measurement of the mounting position by the measurement unit has been normally performed; a generating unit that generates component recognition information that indicates whether the measurement of the mounting position of each of the components for which the determination has been made by the determining unit has been normally performed by the measuring unit, the generation unit generates first component recognition information as the component recognition information for a component for which the determination unit has determined that the measurement of the mounting position has been performed normally, and generates second component recognition information as the component recognition information for a component for which the determination unit has determined that the measurement of the mounting position has not been performed normally; the determination unit performs pattern matching processing between the image acquired by the image acquisition unit and a reference pattern of the component, calculates a matching rate between the area occupied by the component in the image and the reference pattern, and if the calculated matching rate is lower than the reference matching rate, determines that the measurement of the mounting position of the component was not performed normally.

11. An inspection device that inspects each component mounted on a board, an image acquisition unit that acquires an image of each component mounted on the board; a measurement unit that measures the position of each of the components on the board as a mounting position of the component based on the image of each of the components acquired by the image acquisition unit; a determination unit that determines whether or not the measurement of the mounting position by the measurement unit has been performed normally for each of the components; a generating unit that generates component recognition information that indicates whether the measurement of the mounting position of each of the components for which the determination has been made by the determining unit has been normally performed by the measuring unit, the generation unit generates first component recognition information as the component recognition information for a component for which the determination unit has determined that the measurement of the mounting position has been performed normally, and generates second component recognition information as the component recognition information for a component for which the determination unit has determined that the measurement of the mounting position has not been performed normally; the determination unit performs pattern matching processing between the image acquired by the image acquisition unit and a reference pattern of the component, calculates a matching rate between the area occupied by the component in the image and the reference pattern, and if the calculated matching rate is lower than the reference matching rate, determines that the measurement of the mounting position of the component was not performed normally.

12. 12. The inspection device according to claim 11, wherein the determination unit determines whether the entire component in the image acquired by the image acquisition unit is located within a measurement area set for the component, and if at least a portion of the component is located outside the measurement area, determines that the measurement of the mounting position for the component was not performed normally.

13. 12. The inspection device according to claim 11, wherein the determination unit determines that the measurement of the mounting position of the component was not performed normally when a dimensional difference between the dimension of the component in the image acquired by the image acquisition unit and a reference dimension exceeds the reference dimensional difference.

14. An inspection method for inspecting components mounted on a board, comprising: an image acquisition step of acquiring an image of each of the components mounted on the board; a measuring step of measuring, based on the image of each component acquired in the image acquisition step, the position of each component on the board that has been mounted on the board, as the mounting position of that component; a determining step of determining whether the measurement of the mounting position of each component has been performed normally in the measuring step; a generating step of generating component recognition information which is information indicating whether or not the measurement of the mounting position of each of the components for which the determination has been made in the determining step has been normally performed in the measuring step, The generating step generates first component recognition information as the component recognition information for a component for which it is determined in the determining step that the measurement of the mounting position has been performed normally, and generates second component recognition information as the component recognition information for a component for which it is determined in the determining step that the measurement of the mounting position has not been performed normally; The determining step performs a pattern matching process between the image acquired in the image acquiring step and a reference pattern of the component, calculates a matching rate between an area occupied by the component in the image and the reference pattern, and if the calculated matching rate is lower than a reference matching rate, determines that the measurement of the mounting position of the component was not performed normally. Testing method.

Images