Pusher, transport device, and substrate processing device

Abstract

To improve accuracy of seating detection of a substrate.SOLUTION: A pusher for holding a substrate includes a pusher body and a plurality of seating members 630 which are attached to the pusher body and on which the substrate is seated. Each of the plurality of seating members 630 includes a lever member 634 being a form of a pedestal member having a seating part on which the substrate is seated and a magnet 634-2a which is arranged at a position different from the seating part. The lever member 634 is supported by the pusher body such that the position of the magnet 634-2a moves according to seating or leaving of the substrate. Each of the plurality of seating members 630 includes: a seating sensor 638 configured to detect movement of the magnet 634-2a; and a magnetic member 637 which is arranged so as to block a portion between a movable range of the magnet 634-2a and the seating sensor 638.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present application relates to a pusher, a transport device, and a substrate processing device. [Background technology]

[0002] In recent years, substrate processing apparatuses have been used to perform various processes on substrates such as semiconductor wafers. One example of a substrate processing apparatus is a chemical mechanical polishing (CMP) apparatus for polishing a substrate.

[0003] As described in Patent Document 1, a CMP apparatus includes a polishing apparatus for polishing a substrate, a cleaning apparatus for cleaning and drying the substrate, and a load / unload apparatus for transferring substrates to the polishing apparatus and receiving substrates that have been cleaned and dried by the cleaning apparatus. The CMP apparatus also includes a transfer apparatus for transferring substrates between the polishing apparatus, cleaning apparatus, and load / unload apparatus. The CMP apparatus sequentially performs various processes, such as polishing, cleaning, and drying, on the substrates while transferring them using the transfer apparatus.

[0004] The transport device includes a hand for holding a substrate and a drive mechanism for moving the hand. The hand is provided with a plurality of pins on which the substrate sits, and is configured to detect when the substrate sits on the pins. An optical sensor having a light-emitting unit and a light-receiving unit is used to detect when the substrate sits on the pins. For example, the light-receiving unit is provided on the pin, and the light-emitting unit is provided at a predetermined location away from the pin, and when the substrate blocks the light-emitting unit and the light-receiving unit, it is detected that the substrate has sat on the pin. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-50436 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the conventional techniques have room for improvement in terms of improving the accuracy of detecting the seating of a substrate.

[0007] That is, in the conventional seating detection technology, an optical sensor is placed in the seating area where the substrate sits. The seating area contains cleaning water used in the cleaning process and slurry used in the polishing process, so the light from the optical sensor is diffused by the cleaning water or slurry, which can result in erroneous detection of the seating of the substrate.

[0008] Therefore, one object of the present invention is to improve the accuracy of detecting the seating of a substrate. [Means for solving the problem]

[0009] According to one embodiment, a pusher for holding a substrate is disclosed, the pusher including a pusher body and a plurality of seating members attached to the pusher body on which the substrate is seated, each of the plurality of seating members being a base member having a seating portion on which the substrate is seated and a magnet arranged at a position different from the seating portion, the base member being supported by the pusher body so that the position of the magnet moves in response to the seating or unseating of the substrate, a seating sensor configured to detect the movement of the magnet, and a magnetic member arranged to shield a portion between the range of motion of the magnet and the seating sensor. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to one embodiment of the present invention. [Figure 2] 2 is an exploded perspective view showing a transfer mechanism of the substrate processing apparatus shown in FIG. [Figure 3] FIG. 3 is a perspective view schematically showing a first polishing apparatus of the substrate processing apparatus shown in FIG. [Figure 4] 4 is a side view of the transfer robot of the substrate processing apparatus shown in FIG. [Figure 5] FIG. 5 is a perspective view showing the first transport device. [Figure 6] FIG. 6 is an enlarged perspective view of the seating member. [Figure 7] FIG. 7 is a cross-sectional view taken along line AA in FIG. [Figure 8] FIG. 8 is an enlarged perspective view of the seating member. [Figure 9] FIG. 9 is a cross-sectional view showing another example of the seating member. [Figure 10] FIG. 10 is a perspective view of the exchanger. [Figure 11] FIG. 11 is a plan view of the pusher and exchanger. [Figure 12] FIG. 12 is an enlarged perspective view of the lever-type seating member of the exchanger. [Figure 13] FIG. 13 is a flowchart of a substrate transfer method. [Figure 14] FIG. 14 is a flowchart of a substrate transfer method. DETAILED DESCRIPTION OF THE INVENTION

[0011] A pusher, a transport device, a substrate processing apparatus, and a substrate transport method according to an embodiment of the present invention will be described below with reference to the drawings. In the drawings described below, identical or corresponding components are designated by the same reference numerals, and duplicated descriptions will be omitted.

[0012] Fig. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to one embodiment of the present invention. As shown in Fig. 1, substrate processing apparatus 10 in this embodiment has a housing that is generally rectangular in plan view, and the interior of the housing is partitioned by partitions into a load / unload device 11, a polishing device 12, a cleaning device 13, and a transport mechanism 14. These load / unload device 11, polishing device 12, cleaning device 13, and transport mechanism 14 are each assembled independently and evacuated independently. In addition, substrate processing apparatus 10 is provided with a control device 15 (also referred to as a control panel) that controls the operations of load / unload device 11, polishing device 12, cleaning device 13, and transport mechanism 14.

[0013] <Load / unload device> The load / unload device 11 is equipped with a plurality of front load devices 113 (four in the illustrated example) on which substrate cassettes for stocking a large number of wafers (substrates) Wf are placed. These front load devices 113 are arranged adjacent to each other in the width direction (direction perpendicular to the longitudinal direction) of the substrate processing apparatus 10. The front load devices 113 can be equipped with an open cassette, a Standard Manufacturing Interface (SMIF) pod, or a Front Opening Unified Pod (FOUP). Here, an SMIF or FOUP is an airtight container that stores a substrate cassette inside and is covered with a partition wall, thereby maintaining an environment independent from the external space.

[0014] Furthermore, in the load / unload device 11, a traveling mechanism 112 is installed along the arrangement direction of the front load device 113, and a transfer robot 111 that is movable along the arrangement direction of the front load device 113 is installed on this traveling mechanism 112. The transfer robot 111 is able to access the substrate cassette loaded in the front load device 113 by moving on the traveling mechanism 112. This transfer robot 111 is equipped with two hands, one above and one below, and is able to use the upper and lower hands selectively, for example, by using the upper hand when returning the substrate Wf to the substrate cassette and the lower hand when transporting the substrate Wf before polishing. Alternatively, it is also possible to use only a single hand to carry the substrate Wf. It may also be transported.

[0015] Since the loading / unloading device 11 is the area that needs to be kept the cleanest, the interior of the loading / unloading device 11 is always maintained at a higher pressure than the exterior of the device, the polishing device 12, the cleaning device 13, and the transfer mechanism 14. In addition, a filter fan unit (not shown) having a clean air filter such as a HEPA filter or a ULPA filter is provided above the traveling mechanism 112 of the transfer robot 111, and clean air from which particles, toxic vapors, and gases have been removed is always blown downward by this filter fan unit.

[0016] The transport mechanism 14 is a device that transports substrates before polishing from the load / unload device 11 to the polishing device 12, and is provided to extend along the longitudinal direction of the substrate processing apparatus 10. As shown in Fig. 1, the transport mechanism 14 is disposed adjacent to both the load / unload device 11, which is the cleanest area, and the polishing device 12, which is the dirtiest area. Therefore, to prevent particles in the polishing device 12 from diffusing into the load / unload device 11 through the transport mechanism 14, an airflow is formed inside the transport mechanism 14 that flows from the load / unload device 11 side to the polishing device 12 side, as will be described later.

[0017] The structure of the transport mechanism 14 will be described in detail. Fig. 2 is an exploded perspective view showing the internal configuration of the transport mechanism 14. As shown in Fig. 2, the transport mechanism 14 has a cover 41 extending in the longitudinal direction, a slide stage 42 that is arranged inside the cover 41 and holds the substrate Wf, a stage movement mechanism 43 that moves the slide stage 42 linearly along the longitudinal direction, and an exhaust duct 44 that exhausts gas from inside the cover 41.

[0018] The cover 41 has a bottom panel, four side panels, and a top panel (not shown in FIG. 2). One of the longitudinal side panels has an inlet 41a formed therein, which communicates with the loading / unloading device 11. One of the widthwise side panels has an outlet 41b formed therein, which communicates with the polishing device 12, at the end opposite the inlet 41a. The inlet 41a and the outlet 41b can be opened and closed by a shutter (not shown). The transfer robot 111 of the loading / unloading device 11 can access the slide stage 42 inside the cover 41 through the inlet 41a, and the transfer robot 23 of the polishing device 12 can access the slide stage 42 inside the cover 41 through the outlet 41b.

[0019] The stage movement mechanism 43 may be, for example, a motor-driven mechanism using a ball screw or an air cylinder. A rodless cylinder is preferably used as the stage movement mechanism 43 because it can prevent dust from being generated from the sliding parts. The slide stage 42 is fixed to a movable part of the stage movement mechanism 43 and is moved linearly inside the cover 41 in the longitudinal direction by the power applied from the stage movement mechanism 43.

[0020] Four pins are provided on the outer periphery of the slide stage 42 so as to protrude upward. The substrate Wf placed on the slide stage 42 by the transfer robot 111 of the load / unload device 11 is supported on the slide stage 42 with its outer periphery guided and positioned by the four pins. These pins are made of resin such as polypropylene (PP), polychlorotrifluoroethylene (PCTFE), or polyetheretherketone (PEEK).

[0021] The exhaust duct 44 is provided on the other side panel in the longitudinal direction of the cover 41 (the side panel opposite to the carry-in opening 41a). When the carry-in opening 41a is opened and the exhaust duct 44 exhausts air, an air current is formed inside the cover 41 that flows from the carry-in opening 41a side to the carry-out opening 41b side. This allows particles inside the polishing apparatus 12 to be carried through the transport mechanism 14. Diffusion into the load / unload device 11 is prevented.

[0022] <Cleaning equipment> 1, the cleaning apparatus 13 includes a plurality of (four in this embodiment) cleaning modules 311a, 312a, 313a, and 314a, a wafer station 33a, and a cleaning apparatus transfer mechanism 32a that transfers wafers W between each of the cleaning modules 311a to 314a and the wafer station 33a. The cleaning modules 311a to 314a and the wafer station 33a are arranged in series along the longitudinal direction of the substrate processing apparatus 10. A filter fan unit (not shown) having a clean air filter is provided above each of the cleaning modules 311a to 314a, and clean air from which particles have been removed is constantly blown downward.

[0023] <Polishing equipment> 1, the polishing apparatus 12 includes a first polishing unit 20a having a first polishing apparatus 21a and a second polishing apparatus 21b, a second polishing unit 20b having a third polishing apparatus 21c and a fourth polishing apparatus 21d, and a polishing apparatus transport mechanism 22 disposed adjacent to the transport mechanism 14 and the first polishing unit 20a and the second polishing unit 20b. The polishing apparatus transport mechanism 22 is disposed between the cleaning apparatus 13 and the first polishing unit 20a and the second polishing unit 20b in the width direction of the substrate processing apparatus 10.

[0024] The first polishing apparatus 21a, the second polishing apparatus 21b, the third polishing apparatus 21c, and the fourth polishing apparatus 21d are arranged along the longitudinal direction of the substrate processing apparatus 10. The second polishing apparatus 21b, the third polishing apparatus 21c, and the fourth polishing apparatus 21d have the same configuration as the first polishing apparatus 21a, so the first polishing apparatus 21a will be described below.

[0025] 3 is a perspective view schematically illustrating the first polishing apparatus 21a. The first polishing apparatus 21a includes a polishing table 101a on which a polishing pad 102a having a polishing surface is attached, a top ring 25a for holding a substrate Wf and polishing the substrate Wf while pressing it against the polishing pad 102a on the polishing table 101a, a polishing liquid supply nozzle 104a for supplying a polishing liquid (also called a slurry) or a dressing liquid (e.g., pure water) to the polishing pad 102a, a dresser (not shown) for dressing the polishing surface of the polishing pad 102a, and an atomizer (not shown) for atomizing a mixture of a liquid (e.g., pure water) and a gas (e.g., nitrogen gas) or a liquid (e.g., pure water) onto the polishing surface.

[0026] The top ring 25a is supported by a top ring shaft 103a. A polishing pad 102a is attached to the upper surface of the polishing table 101a, and the upper surface of this polishing pad 102a forms a polishing surface for polishing the substrate Wf. A fixed grindstone can also be used instead of the polishing pad 102a. The top ring 25a and polishing table 101a are configured to rotate around their respective axes as indicated by the arrows in FIG. 3. The substrate Wf is held by vacuum suction on the lower surface of the top ring 25a. During polishing, a polishing liquid is supplied from a polishing liquid supply nozzle 104a to the polishing surface of the polishing pad 102a, and the substrate Wf to be polished is pressed against the polishing surface by the top ring 25a and polished.

[0027] Considering that a slurry is used during polishing, the polishing apparatus 12 is the dirtiest area. Therefore, in this embodiment, in order to prevent particles in the polishing apparatus 12 from scattering to the outside, exhaust is performed from the periphery of each polishing table of the first polishing apparatus 21a, the second polishing apparatus 21b, the third polishing apparatus 21c, and the fourth polishing apparatus 21d. The pressure inside the polishing apparatus 12 is vented from the outside of the apparatus, the surrounding cleaning apparatus 13, the load / unload The scattering of particles is prevented by creating a negative pressure below the polishing table 11 and the transport mechanism 14. Also, an exhaust duct (not shown) is usually provided below the polishing table, and a filter (not shown) is provided above it, and purified air is ejected through these exhaust ducts and filters, forming a downflow.

[0028] 1, the top ring 25a of the first polishing apparatus 21a moves between the polishing position and a first substrate transfer position TP1 by swinging the top ring head, and substrates are transferred to and from the first polishing apparatus 21a at the first substrate transfer position TP1. Similarly, the top ring 25b of the second polishing apparatus 21b moves between the polishing position and a second substrate transfer position TP2 by swinging the top ring head, and substrates are transferred to and from the second polishing apparatus 21b at the second substrate transfer position TP2. The top ring 25c of the third polishing apparatus 21c moves between the polishing position and a third substrate transfer position TP3 by swinging the top ring head, and substrates are transferred to and from the third polishing apparatus 21c at the third substrate transfer position TP3. The top ring 25d of the fourth polishing apparatus 21d moves between the polishing position and the fourth substrate transfer position TP4 by swinging the top ring head, and the substrate is transferred to and from the fourth polishing apparatus 21d at the fourth substrate transfer position TP4.

[0029] The polishing apparatus transport mechanism 22 includes a first transport device 24a that transports the substrate Wf to the first polishing unit 20a and a second transport device 24b that transports the substrate Wf to the second polishing unit 20b. The polishing apparatus transport mechanism 22 also includes a transport robot 23 that is disposed between the first transport device 24a and the second transport device 24b and that transfers substrates between the transport mechanism 14 and the first transport device 24a and the second transport device 24b. In the illustrated example, the transport robot 23 is disposed approximately in the center of the housing of the substrate processing apparatus 10.

[0030] 4 is a side view showing the transfer robot 23. As shown in Fig. 4, the transfer robot 23 has a hand 231 that holds the substrate Wf, an inversion mechanism 234 that inverts the hand 231 upside down, an extendable arm 232 that supports the hand 231, and a robot main body 233 that includes an arm up-down movement mechanism that moves the arm 232 up and down and an arm rotation mechanism that rotates the arm 232 about a vertical axis. The robot main body 233 is attached so as to be suspended from a frame on the ceiling of the polishing apparatus 12.

[0031] In this embodiment, the hand 231 is accessible to the slide stage 42 from the discharge port 41b of the transfer mechanism 14. The hand 231 is also accessible to the first transfer device 24a and the second transfer device 24b of the polishing apparatus 12. Therefore, the substrates Wf continuously transferred from the transfer mechanism 14 to the polishing apparatus 12 are sorted by the transfer robot 23 to the first transfer device 24a and the second transfer device 24b. The second transfer device 24b has a configuration similar to that of the first transfer device 24a, so the first transfer device 24a will be described below.

[0032] <First conveying device> Fig. 5 is a perspective view showing the first transfer device 24a. As shown in Fig. 5, the first transfer device 24a has a pusher 51a arranged at a first substrate transfer position TP1 relative to the first polishing apparatus 21a and an elevating mechanism 53a for raising and lowering the pusher 51a. The first transfer device 24a also has a pusher 51b arranged at a second substrate transfer position TP2 relative to the second polishing apparatus 21b and an elevating mechanism 53b for raising and lowering the pusher 51b.

[0033] The first transfer device 24a also has exchangers 52a, 52b, and 52c configured to hold the substrate Wf. The exchangers 52a to 52c are arranged on the same axis that passes through the first substrate transfer position TP1 and the second substrate transfer position TP2 in a plan view. The exchangers 52a to 52c are arranged at different heights. That is, the exchanger 52a is arranged at the bottom, the exchanger 52b is arranged at the middle, and the exchanger 52c is arranged at the top. The first transport device 24a has drive mechanisms 54a, 54b, and 54c configured to linearly move the exchangers 52a to 52c in a direction perpendicular to the lifting direction of the pushers 51a and 51b. For example, an electric actuator or a motor drive mechanism using a ball screw is used as the drive mechanisms 54a, 54b, and 54c. The exchangers 52a to 52c receive power from the different drive mechanisms 54a, 54b, and 54c, respectively, and are thereby able to move in different directions at different times. As described above, the exchangers 52a to 52c are arranged at different heights, and therefore can move freely without interfering with each other. This allows the exchangers 52a to 52c to move horizontally between the first substrate transfer position TP1 and the second substrate transfer position TP2 independently of each other.

[0034] The pusher 51a transfers the substrate Wf held in one of the exchangers 52a to 52c to the top ring 25a of the first polishing apparatus 21a, and transfers the polished substrate Wf in the first polishing apparatus 21a to one of the exchangers 52a to 52c. The pusher 51b transfers the substrate Wf held in one of the exchangers 52a to 52c to the top ring 25b of the second polishing apparatus 21b, and transfers the polished substrate Wf in the second polishing apparatus 21b to one of the exchangers 52a to 52c. In this way, the pushers 51a and 51b have the function of transferring the substrate Wf between the exchangers 52a to 52c and each top ring. The pusher 51b has a structure similar to that of the pusher 51a, and therefore, only the pusher 51a will be described below.

[0035] <Pusher> 5, the pusher 51a includes a pusher body 620 and a plurality of (three in this embodiment) seating members 630 attached to the pusher body 620. The pusher body 620 includes a circular base member 620a and three arm members 620b extending radially from the base member 620a. The arm members 620b are attached to the base member 620a at intervals of approximately 120°. The pusher 51a also includes a plurality of (three in this embodiment) cleaning devices 640 for cleaning the substrate Wf. The cleaning devices 640 are respectively disposed between adjacent arm members 620b.

[0036] The multiple seating members 630 are members on which the substrate sits. The multiple seating members 630 are attached to the ends of the arm member 620b at a predetermined interval (approximately 120°) from each other so as to surround the seating area SA on which the substrate sits. Note that in this embodiment, an example has been shown in which the pusher 51a includes three seating members 630, but the number of seating members 630 is arbitrary. It is sufficient for the pusher 51a to include three or more seating members 630 that can hold the substrate Wf as horizontally as possible and distribute the weight of the substrate Wf evenly. Since the multiple seating members 630 have the same configuration, the following will describe one seating member 630.

[0037] Fig. 6 is an enlarged perspective view of the seating member, Fig. 7 is a cross-sectional view taken along line AA in Fig. 6, and Fig. 8 is an enlarged perspective view of the seating member.

[0038] As shown in FIGS. 6 to 8, the seating member 630 includes a shaft member 632 supported by the pusher body 620, and a lever member 634 supported by the shaft member 632. The lever member 634 is a type of base member on which the substrate Wf is seated, and is a rod-shaped member that extends in the same direction as the extension direction of the arm member 620b. The lever member 634 includes a first end portion 634-1 having a seat portion 634-1a on which the substrate is seated, and a second end portion 634-2 provided on the opposite side of the shaft member 632 from the first end portion 634-1. A magnet 634 is attached to the second end portion 634-2. The lever member 634 is supported by the shaft member 632 such that a first end 634-1 projects into the seating area SA.

[0039] The seating member 630 includes a biasing member 636 for applying a force to the lever member 634 that rotates the lever member 634 around the shaft member 632. The biasing member 636 applies a force to the lever member 634 that rotates the lever member 634 so that a magnet 634-2a provided at the second end 634-2 moves downward. Therefore, when the board is not seated on the lever member 634, the second end 634-2 (magnet 634-2a) is in a downwardly moved state. In this embodiment, the biasing member 636 is a compression spring. Specifically, the compression spring is configured so that one end is attached to a housing 639 that covers the upper part of the lever member 634 and the other end is attached to a hole formed in the upper surface of the lever member 634 on the second end 634-2 side of the shaft member 632. The biasing member 636 is not limited to a compression spring, and any elastic body such as rubber may be used as long as it applies the above-mentioned biasing force to the lever member 634. Since the lever member 634 is supported by the biasing member 636, it is possible to absorb the impact when the substrate Wf is seated on the lever member 634.

[0040] The seating member 630 includes a seating sensor 638 for detecting that a substrate is seated on the pusher 51a, and a housing 639 configured to cover the second end 634-2 of the lever member 634 and the seating sensor 638. The seating sensor 638 is configured to detect that the second end 634-2 (magnet 634-2a) has moved upward. The lever member 634 is supported by the pusher body 620 so that the position of the magnet 634-2a moves in response to the seating or removal of the substrate. In other words, when a substrate is not seated on the lever member 634, the biasing member 636 biases the lever member 634, thereby keeping the magnet 634-2a in a downward position. On the other hand, when the board is seated on seating portion 634-1a of lever member 634, the weight of the board causes lever member 634 to rotate about shaft member 632, causing first end 634-1 to move downward and second end 634-2 to move upward. Seat sensor 638 is configured including a magnetic sensor that detects the upward movement of magnet 634-2a. When magnet 634-2a moves upward and approaches the magnetic sensor, seating sensor 638 detects a change in magnetic resistance, thereby detecting that second end 634-2 has moved upward, in other words, that the board has seated on seating portion 634-1a of lever member 634.

[0041] 8, seating member 630 further includes magnetic member 637 arranged to partially shield seat sensor 638 from the vertical range of motion of magnet 634-2a. Magnetic member 637 is a metal plate member extending in the vertical direction and arranged between magnet 634-2a and seat sensor 638. Magnetic member 637 is arranged to shield seat sensor 638 from the lower part of the range of motion of magnet 634-2a, but not to shield seat sensor 638 from the upper part of the range of motion of magnet 634-2a.

[0042] According to this embodiment, the accuracy of detecting the seating of a substrate on the pusher 51a can be improved. Specifically, in the prior art, seating detection was performed using an optical sensor provided on the seating portion 634-1a. However, because the seating portion 634-1a is positioned protruding into the seating area SA, and the seating area SA is mixed with cleaning water used in the cleaning process by the cleaning device 640 and slurry used in the polishing process, the cleaning water or slurry can cause the light of the optical sensor to be diffused, resulting in erroneous detection of the seating of a substrate. In contrast, in this embodiment, the seating sensor 638 is configured to detect the seating of a substrate by detecting the upward movement of the magnet 634-2a. The magnet 634-2a is located on the opposite side of the shaft member 632 from the first end 634-1 including the seating portion 634-1a and is away from the seating area SA. Therefore, the magnet 634-2a is less susceptible to disturbances from the cleaning water or slurry. As a result, the accuracy of detecting the seating of a substrate can be improved.

[0043] Furthermore, in this embodiment, the magnet 634-2a and the seating sensor 638 are covered by the housing 639, making them even less susceptible to disturbances caused by cleaning water or slurry. As a result, the accuracy of substrate seating detection can be improved. Furthermore, in this embodiment, the magnetic member 637 is disposed between the magnet 634-2a and the seating sensor 638. This prevents the seating sensor 638 from mistakenly detecting the seating of a substrate when the magnet 634-2a is located at the bottom of its range of motion. In other words, according to this embodiment, the seating sensor 638 can detect the seating of a substrate only when the magnet 634-2a is located at the top of its range of motion, thereby improving the accuracy of substrate seating detection. Furthermore, the improved accuracy of substrate seating detection can shorten the takt time of substrate processing in the substrate processing apparatus. In other words, the improved accuracy of substrate seating detection can be used as a trigger to vary the lifting and lowering speed of the pusher 51a. For example, taking the case where pusher 51a receives a substrate held by exchanger 52a as an example, the overall takt time can be shortened by raising pusher 51a at high speed until the substrate is received (seating detection is made), and then raising pusher 51a at low speed after the substrate is received (seating detection is made).

[0044] In the above embodiment, the seating member 630 is a lever-type seating member, but this is not limiting. FIG. 9 is a cross-sectional view showing another example of a seating member. As shown in FIG. 9, the seating member 650 includes a base 651, a support member 652 disposed on the base 651, and a plate-shaped stopper 653 attached to the support member 652. The seating member 650 also includes a seating pin 654, which is a type of seating member on which the substrate Wf is seated. The seating pin 654 is a rod-shaped member extending vertically and includes a first end 654-1 having a seating portion 654-1a on which the substrate is seated, and a second end 654-2 located below the first end 654-1. As in the above embodiment, a magnet 654-2a is provided at the second end 654-2.

[0045] The seating member 650 includes a spring member 656, which is a type of elastic member that supports the seating pin 654 so that it can move vertically. The spring member 656 is, for example, a compression coil spring, and is disposed in a hole formed in the upper surface of the base 651. Because the seating pin 654 is supported by the spring member 656, when the substrate Wf leaves the seat, the seating pin 654 is urged upward by the spring member 656. As shown in the left diagram of FIG. 9 , once the seating pin 654 moves upward to a predetermined position, the seating pin 654 comes into contact with a stopper 653. This restricts the seating pin 654 from moving upward. Meanwhile, as shown in the right diagram of FIG. 9 , when the substrate Wf sits on the seating pin 654, the seating pin 654 moves downward due to the weight of the substrate Wf, and the substrate Wf is supported by the support member 652. The seating pins 654 are supported by the spring members 656, and therefore can absorb the impact when the substrate Wf is seated on the seating pins 654.

[0046] The seating member 650 includes a seating sensor 658 for detecting that the substrate has been seated on the pusher 51a. The seating sensor 658 is disposed below the base 651 and is configured to detect that the second end 654-2 (magnet 654-2a) has moved downward. The seating sensor 658 includes a magnetic sensor that detects that the magnet 654-2a has moved downward. When the magnet 654-2a moves downward and approaches the magnetic sensor, the seating sensor 658 detects a change in magnetic resistance, thereby detecting that the second end 654-2 has moved downward, in other words, that the substrate has been seated on the seating portion 654-1a of the seating pin 654.

[0047] The seating member 650 includes a magnetic member 657 arranged to shield a part of the space between the seating sensor 658 and the range of movement of the magnet 654-2a in the up and down direction. The magnetic member 657 is a metal plate member that is arranged between the magnet 654-2a and the seating sensor 658 and extends in the vertical direction. The magnetic member 657 shields the space between the upper part of the range of movement of the magnet 654-2a and the seating sensor 658. The magnetic member 657 is also arranged so as not to shield the lower part of the movable range of the magnet 654-2a from the seating sensor 658. In this modification, the magnetic member 657 is also arranged between the magnet 654-2a and the seating sensor 658, which can prevent the seating sensor 658 from erroneously detecting the seating of the board when the magnet 654-2a is in the upper part of the movable range.

[0048] <Exchanger> Next, the exchanger will be described. Since the above-mentioned exchangers 52a, 52b, and 52c have the same configuration, only the exchanger 52a will be described below. Figure 10 is a perspective view of the exchanger. Figure 11 is a plan view of the pusher and exchanger. Figure 12 is an enlarged perspective view of the lever-type seating member of the exchanger.

[0049] 10, the exchanger 52a includes a plate-shaped exchanger body 505 and a plurality of (four in this embodiment) seating members 510 attached to the exchanger body 505. As shown in FIG. 11, the exchanger body 505 has a roughly U-shape and is formed so as not to interfere with the seating members 630.

[0050] The seating member 510 includes a plurality of (three in this embodiment) lever-type seating members 520 and one fixed seating member 530. The fixed seating member 530 has a conical inclined surface 530a for guiding the substrate to a seating area when the exchanger 52a receives the substrate from the pusher 51a, and a seating surface 530b on which the substrate guided to the seating area by the inclined surface 530a is seated.

[0051] 12, each of the three lever-type seating members 520 includes a shaft member 522 supported by the exchanger main body 505, and a lever member 524 supported by the shaft member 522. The lever member 524 is a rod-shaped member and includes a first end 524-1 having a seating portion 524-1a on which the substrate is seated, and a second end 524-2 provided on the opposite side of the shaft member 522 from the first end 524-1. A magnet 524-2a is provided at the second end 524-2.

[0052] The lever-type seating member 520 includes a biasing member 526 for applying a force to the lever member 524 to rotate the lever member 524. The biasing member 526 applies a force to the lever member 524 to rotate the lever member 524 so that a magnet 524-2a provided at the second end 524-2 moves downward. Therefore, when the board is not seated on the lever member 524, the second end 524-2 (magnet 524-2a) is in a downwardly moved state. In this embodiment, the biasing member 526 is a compression spring. Specifically, the compression spring is configured so that one end is attached to a housing 529 that covers the upper part of the lever member 524 and the other end is attached to a hole formed in the upper surface of the lever member 524 on the second end 524-2 side of the shaft member 522. Note that the biasing member 526 is not limited to a compression spring, and any elastic material such as rubber may be used as long as it applies the biasing force to the lever member 524. Since the lever member 524 is supported by the biasing member 526, the impact when the substrate Wf is seated on the lever member 524 can be absorbed.

[0053] The lever-type seating member 520 further includes a seating sensor 528 for detecting that a board has been seated on the exchanger 52a, and a housing 529 configured to cover the second end 524-2 of the lever member 524 and the seating sensor 528. The seating sensor 528 is configured to detect that the second end 524-2 (magnet 524-2a) has moved upward. In other words, when a board is not seated on the lever member 524, the biasing member 526 biases the lever member 524, so that the magnet 524-2a is positioned downward. On the other hand, when a board is seated on the seating portion 524-1a of the lever member 524, the board moves upward. The weight of the board causes lever member 524 to rotate about shaft member 522, causing first end 524-1 to move downward and second end 524-2 to move upward. Seating sensor 528 is configured to include a magnetic sensor that detects that magnet 524-2a has moved upward. When magnet 524-2a moves upward and approaches the magnetic sensor, seating sensor 528 detects a change in magnetic resistance, thereby detecting that second end 524-2 has moved upward, in other words, that the board has seated on seating portion 524-1a of lever member 524.

[0054] According to this embodiment, the accuracy of detecting the seating of a substrate on the exchanger 52a can be improved. Specifically, in conventional technology, seating detection is performed using an optical sensor provided on the seating portion 524-1a. However, because the seating portion 524-1a is positioned protruding into the seating area SA, which is mixed with cleaning water used in cleaning processes and slurry used in polishing processes, the cleaning water or slurry can cause the light of the optical sensor to be diffused, resulting in erroneous detection of the seating of a substrate. In contrast, in this embodiment, the lever-type seating member 520 is configured to detect the seating of a substrate by detecting the upward movement of the magnet 524-2a. The magnet 524-2a is located on the opposite side of the shaft member 522 from the first end 524-1, including the seating portion 524-1a, and is away from the seating area SA. Therefore, it is less susceptible to disturbances from the cleaning water or slurry. As a result, the accuracy of substrate seating detection can be improved. Furthermore, in this embodiment, the magnet 524-2a and the seating sensor 528 are covered by the housing 529, making them even less susceptible to disturbances caused by cleaning water or slurry, thereby improving the accuracy of detecting the seating of the substrate.

[0055] Furthermore, according to this embodiment, the pusher 51a has the seating member 630 or the seating member 650, and the exchanger 52a has the seating member 510, making it easier to grasp the real-time position of the substrate Wf. That is, in conventional technology, seating detection of the substrate Wf was performed using an optical sensor, which made it unclear how many substrates Wf were present in the seating detection area, and there was a risk that, for example, two substrates might be transferred in an overlapping state. In contrast, according to this embodiment, seating detection can be performed by both the pusher 51a and the exchanger 52a, making it easy to grasp the real-time position of the substrate Wf within the transport range of both drive systems.

[0056] Furthermore, if seating detection is performed using only one of the pusher 51a and the exchanger 52a, for example, even if the pusher 51a rises and partially lifts the substrate Wf on the exchanger 52a, an abnormality may not be detected. In this regard, according to this embodiment, seating detection is performed by both the pusher 51a and the exchanger 52a. Therefore, after simple alignment between the pusher 51a and the exchanger 52a to a degree that prevents mechanical interference, the center positions can be adjusted so that seating detection is performed correctly on both sides, and the substrate Wf can be transferred. Furthermore, since the behavior of the substrate Wf during transport can be grasped (for example, if some seating sensors are turned off during transport, the substrate Wf will float and fall, and a greater or lesser impact will be applied), transport adjustments can be automatically made to prevent damage to the substrate Wf, such as reducing acceleration at that point. Furthermore, although using an optical sensor to detect the seating of the substrate Wf may cause photocorrosion of the substrate Wf, this embodiment does not use an optical sensor, thereby preventing photocorrosion.

[0057] <Substrate transport method> As shown in FIG. 11, the first transport device 24a includes a determination member 240 for determining whether an abnormality has occurred in the pusher 51a or the exchanger 52a using the seating detection. The determination member 240 includes a storage medium 250. The storage medium 250 stores various data used by the first transport device 24a as well as a program for executing the processing by the determination member 240 described below. The determination member 240 can read and execute the program stored in the storage medium 250. Hereinafter, the substrate transport method of this embodiment will be described. The processing of the determination member 240 will be described in detail below. Fig. 13 is a flowchart of a substrate transport method. Fig. 13 shows, as an example, a flow for determining the horizontal state of the pusher 51a or the exchanger 52a when a substrate held by the exchanger 52a is transferred to the pusher 51a.

[0058] The substrate transfer method involves raising pusher 51a while the substrate is held by exchanger 52a (step 102). Next, the substrate is handed over to pusher 51a by three seating members 630 holding the substrate (transfer step 104). Next, the substrate transfer method involves detecting whether the substrate is seated by seating sensor 638 based on the movement of magnet 634-2a when the substrate is handed over to pusher 51a (detection step 106).

[0059] Next, the determining member 240 determines the horizontal state of the pusher 51a or the exchanger 52a based on the difference in timing of the substrate being seated on the three seating members 630 detected in the detecting step 106 (determining step 108). This determination is based on the fact that if the pusher 51a or the exchanger 52a is tilted, a large difference in timing of the substrate being seated on the three seating members 630 will occur. Specifically, the determining member 240 determines that there is no abnormality in the horizontal state of the pusher 51a or the exchanger 52a if the time from when the first of the three seating members 630 detects seating to when all of the seating members 630 (the remaining two seating members 630) detect seating is less than a predetermined threshold. On the other hand, if the time from when the first of the three seating members 630 detects a seat to when all of the seating members 630 (the remaining two seating members 630) detect a seat is equal to or greater than a predetermined threshold, the judgment member 240 judges that there is an abnormality in the horizontal state of the pusher 51a or the exchanger 52a.

[0060] When the determination member 240 determines that there is no abnormality in the horizontal state of the pusher 51a or the exchanger 52a (determination step 108, No), it stores the height of the pusher 51a when the seating of the substrate is detected in the detection step 106 (when the seating of the substrate on the three seating members 630 is detected) as the reference height (storage step 110). The storage step 110 is used in the abnormality determination described in Fig. 14 and is executed for the reference pusher 51a. The storage step 110 is not executed for pushers other than the reference pusher 51a.

[0061] On the other hand, if the judgment member 240 judges that there is an abnormality in the horizontal state of the pusher 51a or the exchanger 52a (judgment step 108, Yes), it stops the operation of the pusher 51a and outputs an alarm to prompt the user to adjust the level of the pusher 51a or the exchanger 52a (step 112).

[0062] According to the substrate transport method of this embodiment, it is possible to accurately determine whether or not there is an abnormality in the horizontal state of the pusher 51a or the exchanger 52a by the determination member 240. That is, as described above, the pusher 51a of this embodiment can accurately detect the seating of a substrate using the three seating members 630. Therefore, it is possible to improve the accuracy of determining the horizontal state of the pusher 51a or the exchanger 52a based on the detection of the seating of a substrate.

[0063] 13 shows how to determine the horizontal state when transferring a substrate from the exchanger 52a to the pusher 51a, but the present invention is not limited to this. For example, the horizontal state can also be determined based on the difference in timing of the pusher 51a withdrawing the substrate during the transfer step in which the exchanger 52a receives the substrate from the pusher 51a.

[0064] FIG. 14 is a flowchart of a substrate transfer method. 2 shows a flow for detecting an abnormality in the pusher 51a or the exchanger 52a when a substrate held by the exchanger 52a is transferred to the pusher 51a. The substrate transfer method begins by raising the pusher 51a while the substrate is held by the exchanger 52a (step 202). Next, the substrate is transferred to the pusher 51a by the three seating members 630 holding the substrate (transfer step 204). Next, the substrate transfer method begins by detecting the seating of the substrate by the seating sensor 638 based on the movement of the magnet 634-2a when the substrate is transferred to the pusher 51a (detection step 206).

[0065] Next, the determination member 240 compares the height of the pusher 51a when seating of the substrate is detected on each of the three seating members 630 with a reference height (comparison step 208). Next, the determination member 240 determines whether or not there is an abnormality in the pusher 51a or the exchanger 52a based on the comparison result in comparison step 208 (abnormality determination step 210).

[0066] Specifically, if the deviation in height of the pusher 51a from the reference height when seating of a substrate on at least one of the three seating members 630 is detected is equal to or greater than a predetermined threshold, the determination member 240 determines that a serious abnormality exists in the pusher 51a or the exchanger 52a. In other words, if the height of the pusher 51a deviates significantly from the reference height, it is considered that some serious abnormality has occurred in the pusher 51a or the exchanger 52a. In this case, the determination member 240 stops the operation of the pusher 51a and outputs an alarm to prompt the user to immediately inspect the pusher 51a or the exchanger 52a (step 212).

[0067] On the other hand, if the deviation in height of the pusher 51a from the reference height when seating of a substrate on each of the three seating members 630 is detected is smaller than a predetermined threshold and the deviation increases each time the transfer step 204 is performed, the determination member 240 detects a minor abnormality in the pusher 51a or the exchanger 52a. In other words, if the deviation in height of the pusher 51a from the reference height is small but increases in proportion to the number of times the substrate is transferred, it is likely that some minor abnormality has occurred, such as loosening of screws between components of the pusher 51a or the exchanger 52a. In this case, the determination member 240 continues the operation of the pusher and outputs a caution alarm to prompt the user to inspect the pusher 51a or the exchanger 52a (step 214).

[0068] On the other hand, if the deviation in height of the pusher 51a from the reference height when the seating of the substrate on each of the three seating members 630 is detected is smaller than a predetermined threshold value and the deviation does not increase each time the transfer step 204 is performed, the judgment member 240 judges that there is no abnormality in the pusher 51a or the exchanger 52a.

[0069] According to the substrate transport method of this embodiment, an abnormality in the pusher 51a or the exchanger 52a can be accurately detected by the determination member 240. That is, as described above, the pusher 51a of this embodiment can accurately detect the seating of a substrate using the three seating members 630. Therefore, the accuracy of determining an abnormality in the pusher 51a or the exchanger 52a based on the detection of the seating of a substrate can be improved.

[0070] 14 illustrates abnormality determination when a substrate is transferred from the exchanger 52a to the pusher 51a, but the present invention is not limited to this. For example, an abnormality can be detected by comparing the height of the pusher 51a when the substrate removal from the pusher 51a is detected during the transfer step in which the exchanger 52a receives the substrate from the pusher 51a with a reference height. Furthermore, abnormality determination for the exchanger 52a can be performed not only when a substrate is transferred between the exchanger 52a and the pusher 51a, but also when a substrate held by the transport robot 23 is transferred to the exchanger 52a.

[0071] Although several embodiments of the present invention have been described above, the above-described embodiments of the present invention are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. Furthermore, any combination or omission of the components described in the claims and specification is possible within the scope of solving at least part of the above-described problems or achieving at least part of the effects.

[0072] The present application discloses, as one embodiment, a pusher for holding a substrate, the pusher including a pusher body and a plurality of seating members attached to the pusher body and on which the substrate is seated, each of the plurality of seating members being a base member having a seating portion on which the substrate is seated and a magnet arranged at a position different from the seating portion, the base member being supported by the pusher body so that the position of the magnet moves in response to the seating or unseating of the substrate, a seating sensor configured to detect the movement of the magnet, and a magnetic member arranged to shield a portion between the range of motion of the magnet and the seating sensor.

[0073] Furthermore, the present application discloses, as one embodiment, a pusher in which the plurality of seating members include an axial member supported on the pusher body, the base member being a lever member supported on the axial member, the lever member including a first end having the seat portion and a second end provided on the opposite side of the axial member from the first end, the magnet being provided at the second end, and the plurality of seating members including a biasing member for applying to the lever member a force that rotates the lever member around the axial member so that the magnet moves downward.

[0074] Furthermore, the present application discloses, as one embodiment, a pusher in which the plurality of seating members further include a housing configured to cover the second end of the lever member and the seating sensor.

[0075] Furthermore, as one embodiment, the present application discloses a pusher in which the multiple seating members are attached to the pusher body at predetermined intervals so as to surround a seating area on which a substrate is seated, and the lever member is supported on the shaft member so that the first end protrudes into the seating area.

[0076] Furthermore, the present application discloses, as one embodiment, a pusher in which the base member is a seating pin extending in the vertical direction, the seating pin including a first end having the seating portion and a second end located below the first end, the second end being provided with the magnet, and the plurality of seating members include an elastic member that supports the seating pin so that it can move vertically.

[0077] Furthermore, as one embodiment, the present application discloses a conveying device including a pusher described above and a determination member configured to determine the horizontal state of the pusher based on a difference in timing of the seating or unseating of the substrate detected by the multiple seating members.

[0078] Furthermore, as one embodiment, the present application includes an elevation drive mechanism for elevating the pusher, an exchanger for transferring substrates between the pusher and the exchanger, and a drive mechanism for moving the exchanger in a direction perpendicular to the elevation direction of the pusher, wherein the exchanger includes an exchanger body and a plurality of lever-type seating members attached to the exchanger body on which substrates are seated, and each of the plurality of lever-type seating members includes a shaft member supported by the exchanger body and a lever-type seating member attached to the shaft member. Disclosed is a conveying device comprising: a supported lever member having a first end with the seat portion and a second end provided on the opposite side of the shaft member from the first end, the second end having the magnet; a biasing member for applying a force to the lever member that rotates the lever member about the shaft member so that the magnet moves downward; and a seating sensor configured to detect when the magnet has moved upward.

[0079] Furthermore, as one embodiment, the present application discloses a conveying device in which the determination member is configured to determine the horizontal state of the pusher or the exchanger based on a difference in timing of the seating or retraction of the substrate when the substrate held by the exchanger is transferred to the pusher or when the exchanger receives the substrate from the pusher.

[0080] Furthermore, as one embodiment, the present application discloses a conveying device in which the determination member is configured to compare a reference height of the pusher when seating or retraction of a substrate is detected with respect to a reference pusher, with the height of the pusher when seating or retraction of a substrate is detected for each of the plurality of seating members, and determine whether or not there is an abnormality in the pusher or the exchanger based on the comparison result.

[0081] Furthermore, as one embodiment, the present application discloses a conveying device in which the determination member determines that there is a serious abnormality in the pusher or the exchanger if the deviation of the pusher height from the reference height when the seating or removal of a substrate is detected for at least one of the plurality of seating members is equal to or greater than a predetermined threshold value.

[0082] Furthermore, as one embodiment, the present application discloses a conveying device in which the determination member determines that there is a minor abnormality in the pusher or the exchanger if the deviation in height of the pusher relative to the reference height when seating or retraction of a substrate is detected for each of the plurality of seating members is smaller than a predetermined threshold value and the deviation is increasing each time seating or retraction of a substrate is performed.

[0083] Furthermore, the present application discloses, as one embodiment, a substrate processing apparatus including a polishing apparatus configured to polish a substrate, a cleaning apparatus configured to clean the substrate, and the above-described transport apparatus configured to transport a substrate to be processed in the polishing apparatus or the cleaning apparatus. [Explanation of symbols]

[0084] 10. Substrate processing equipment 12 Polishing equipment 13 Cleaning equipment 15 Control device 22 Polishing device transport mechanism 24a First conveying device 24b Second conveying device 51a, 51b Pusher 52a, 52b, 52c Exchanger 53a, 53b Lifting mechanism 54a, 54b drive mechanism 101a Polishing table 505 Exchanger body 620 Pusher body 630 Seat member 632 Shaft member 634 Lever component (base component) 634-1 First end 634-1a Seating area 634-2 Second end 634-2a magnet 636 biasing member 637 Magnetic Materials 638 Seat Sensor 639 Housing 654 Seating pin (base component) 656 Spring members (elastic members) SA Seating Area Wf substrate

Claims

1. A pusher for holding a substrate, the pusher includes a pusher body and a plurality of seating members attached to the pusher body and on which a substrate is seated; Each of the plurality of seating members comprises: a base member having a seating portion on which a substrate is seated and a magnet disposed at a position different from the seating portion, the base member being supported by the pusher body so that the position of the magnet moves in response to the seating or removal of the substrate; an occupancy sensor configured to detect movement of the magnet; a magnetic member disposed so as to shield a part of the space between the movable range of the magnet and the seating sensor; Including, Pusher.

2. the plurality of seating members include a shaft member supported by the pusher body, the base member is a lever member supported by the shaft member, the lever member including a first end having the seat portion and a second end provided on the opposite side of the shaft member from the first end, the second end being provided with the magnet; The plurality of seating members include a biasing member for applying a force to the lever member that rotates the lever member around the shaft member so that the magnet moves downward. The pusher of claim 1 .

3. the plurality of seating members further include a housing configured to cover the second end of the lever member and the seating sensor. The pusher of claim 2 .

4. The plurality of seating members are spaced apart at predetermined intervals so as to surround a seating area on which a substrate is seated. and attached to the pusher body, The lever member is supported by the shaft member such that the first end projects into the seating area.

4. The pusher according to claim 2 or 3.

5. the base member includes a seating pin extending in a vertical direction, the seating pin including a first end having the seat portion and a second end located below the first end, the magnet being provided at the second end, The plurality of seating members include elastic members that support the seating pins so that they can move in the vertical direction. The pusher of claim 1 .

6. A pusher according to any one of claims 1 to 5; a determining member configured to determine the horizontal state of the pusher based on a difference in timing of seating or unseating of the substrate detected by the plurality of seating members, Conveying device.

7. an elevation drive mechanism for raising and lowering the pusher; an exchanger for transferring the substrate between the exchanger and the pusher; a drive mechanism for moving the exchanger in a direction perpendicular to the lifting direction of the pusher; Including, the exchanger includes an exchanger body and a plurality of lever-type seating members attached to the exchanger body and on which substrates are seated; Each of the plurality of lever-type seating members is a shaft member supported by the exchanger body; a lever member supported by the shaft member, the lever member including a first end having the seat portion and a second end provided on the opposite side of the shaft member from the first end, the second end being provided with the magnet; and a biasing member for applying a force to the lever member that rotates the lever member about the shaft member so that the magnet moves downward; an occupancy sensor configured to detect upward movement of the magnet; Including, The conveying device according to claim 6.

8. the determining member is configured to determine the horizontal state of the pusher or the exchanger based on a difference in timing of seating or retraction of the substrate when the substrate held by the exchanger is transferred to the pusher or when the exchanger receives the substrate from the pusher.

8. The conveying device according to claim 7.

9. the determining member is configured to compare a reference height of the pusher when seating or retraction of the substrate with respect to a reference pusher is detected with the height of the pusher when seating or retraction of the substrate with respect to each of the plurality of seating members is detected, and determine whether or not there is an abnormality in the pusher or the exchanger based on the comparison result.

9. The conveying device according to claim 8.

10. the determining member determines that there is a serious abnormality in the pusher or the exchanger if a deviation in height of the pusher from the reference height when seating or unseating of a substrate on at least one of the plurality of seating members is equal to or greater than a predetermined threshold value.

10. The conveying device according to claim 9.

11. the determining member determines that there is a minor abnormality in the pusher or the exchanger when a deviation in height of the pusher from the reference height when seating or unseating of the substrate is detected for each of the plurality of seating members is smaller than a predetermined threshold value and the deviation increases each time seating or unseating of the substrate is performed.

10. The conveying device according to claim 9.

12. a polishing apparatus configured to polish a substrate; a cleaning apparatus configured to clean the substrate; a transport device according to any one of claims 6 to 11 configured to transport a substrate to be processed in the polishing device or the cleaning device; A substrate processing apparatus comprising:

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