Method for manufacturing embedded magnet frame, embedded magnet integrated structure and method for manufacturing the same

Abstract

To provide an embedded magnet frame, an integrated structure, and a manufacturing method in a field of semiconductor package technology.SOLUTION: A manufacturing method for an embedded magnet frame includes the steps of: manufacturing a conductive metal post, a first sacrifice block, and a second sacrifice block on a surface of a carrier plate; crimping a first dielectric layer on the surface of the carrier plate so that the first dielectric layer covers the conductive metal post, the first sacrifice block, and the second sacrifice block; thinning the first dielectric layer so as to expose surfaces of the conductive metal post, the first sacrifice block, and the second sacrifice block; etching the first sacrifice block and the second sacrifice block to form corresponding first mount cavity and second mount cavity; filling the inside of the first mount cavity with a magnetic slurry to form an embedded magnet; and removing the carrier plate to form an embedded magnet frame.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to the field of semiconductor packaging technology, and in particular to embedded magnet frames. How to make , Embedded magnet Integrated structure and the Regarding the manufacturing method. [Background technology]

[0002] With the increasing development of electronic technology, the performance of electronic products is required to be higher and higher, and the size is required to be smaller and smaller, which inevitably leads to the development of packaging substrates and packaging structures of electronic products toward high-density integration and miniaturization. Currently, packaging for magnetic devices mainly uses surface mounting processes, but because magnetic devices are large, adopting this packaging method results in a large volume of the packaged device, which cannot meet the requirements for miniaturization and high integration. In addition, the need for secondary mounting on the surface increases the production flow and production costs. Summary of the Invention [Problem to be solved by the invention]

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art by providing an embedded magnet frame, an integrated structure and a manufacturing method that are advantageous for realizing miniaturization and high integration of packaged products, and that save production flow and production costs. [Means for solving the problem]

[0004] In one aspect, a method for fabricating an embedded magnet frame according to an embodiment of the present invention includes the steps of: fabricating conductive metal posts, a first sacrificial block, and a second sacrificial block on a surface of a carrier plate; pressing a first dielectric layer onto the surface of the carrier plate so that the first dielectric layer covers the conductive metal posts, the first sacrificial block, and the second sacrificial block; thinning the first dielectric layer to expose surfaces of the conductive metal posts, the first sacrificial block, and the second sacrificial block; etching the first sacrificial block and the second sacrificial block to form corresponding first and second mounting cavities, where the second mounting cavity is used to mount a chip; filling the first mounting cavities with magnetic slurry to form embedded magnets; and removing the carrier plate to form the embedded magnet frame.

[0005] According to some embodiments of the present invention, the carrier plate comprises a substrate, a first metal layer, a second metal layer and a third metal layer stacked in sequence on the surface of the substrate, and the first metal layer and the second metal layer are physically separable.

[0006] According to some embodiments of the present invention, the first metal layer and the second metal layer are copper layers, and the third metal layer is a titanium layer.

[0007] According to some embodiments of the present invention, the step of fabricating the conductive metal posts, the first sacrificial block, and the second sacrificial block on the surface of the carrier plate includes the steps of applying a photoresist layer on the surface of the carrier plate; exposing and developing the photoresist layer to form a pattern corresponding to the conductive metal posts, the first sacrificial block, and the second sacrificial block; and forming the conductive metal posts, the first sacrificial block, and the second sacrificial block by electroplating according to the pattern.

[0008] According to some embodiments of the present invention, the step of filling the interior of the first mount cavity with a magnetic slurry and forming an embedded magnet includes the steps of filling the interior of the first mount cavity with the magnetic slurry by silk printing, solidifying the magnetic slurry, grinding and polishing the magnetic slurry, and forming the embedded magnet.

[0009] On the other hand, a method for manufacturing an embedded magnet integrated structure according to an embodiment of the present invention includes the steps of mounting a chip inside a second mounting cavity of an embedded magnet frame manufactured by the method for manufacturing an embedded magnet frame described in the embodiment of the above-mentioned aspect, packaging the chip with a photosensitive resin film so that the photosensitive resin film covers the upper and lower surfaces of the first dielectric layer, opening windows in the photosensitive resin film on the upper and lower surfaces of the first dielectric layer to form first windows, and forming a first line by electroplating at the position of the first window, so that the first line on the upper surface of the first dielectric layer and the first line on the lower surface of the first dielectric layer are electrically connected by the conductive metal post.

[0010] According to some embodiments of the present invention, the method further includes the steps of providing a second dielectric layer on each of the top and bottom surfaces of the photosensitive resin film, forming a solder resist layer on the surface of the second dielectric layer, opening a window in the solder resist layer, and forming a second window, and forming a second line by electroplating at the position of the second window, wherein the second line is electrically connected to the first line by a metal blind hole that penetrates the second dielectric layer.

[0011] On the other hand, an embedded magnet frame according to an embodiment of the present invention has a first dielectric layer having a first mounting cavity and a second mounting cavity penetrating the first dielectric layer, and the second mounting cavity includes the first dielectric layer used to mount a chip, a conductive metal post penetrating the first dielectric layer, and an embedded magnet disposed inside the first mounting cavity.

[0012] On the other hand, an embedded magnet integrated structure according to an embodiment of the present invention comprises an embedded magnet frame as described in the embodiment of the above-mentioned aspect, a chip provided in the second mount cavity, a photosensitive resin film filled in the second mount cavity to fix the chip and covering the upper and lower surfaces of the first dielectric layer, and a first line, wherein a first window is opened in each of the photosensitive resin films on the upper and lower surfaces of the first dielectric layer, the first line being provided within the first window, and the first line on the upper surface of the first dielectric layer and the first line on the lower surface of the first dielectric layer being electrically connected by the conductive metal post.

[0013] According to some embodiments of the present invention, the photosensitive resin film further comprises a second dielectric layer provided on the top and bottom surfaces of the photosensitive resin film, the second dielectric layer having a metal blind hole penetrating the second dielectric layer; a solder resist layer provided on the surface of the second dielectric layer, the solder resist layer having a second window; and a second line provided within the second window and electrically connected to the first line by the metal blind hole.

[0014] The embedded magnet frame, integrated structure, and manufacturing method according to the embodiments of the present invention have at least the following beneficial effects: Because the embedded magnets are already embedded inside the frame at the same time as the frame is manufactured, there is no need to subsequently mount a magnetic device on the surface of the package substrate, saving on production flow and production costs; and, because the embedded magnets are located inside the first dielectric layer, it is advantageous for realizing miniaturization and high integration of package products.

[0015] Additional aspects and advantages of the present invention will be set forth in part in the description that follows, and in part will be obvious from the description, or may be learned by practice of the present invention.

[0016] The above-mentioned and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the following detailed description of the embodiments in conjunction with the drawings. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a flowchart of steps in a method for making an embedded magnet frame according to an embodiment of the present invention. [Figure 2] 2A and 2B are schematic diagrams illustrating the configuration of a carrier plate according to an embodiment of the present invention. [Figure 3] FIG. 10 is a schematic diagram of the structure after fabricating conductive metal posts, a first sacrificial block, and a second sacrificial block on the surface of the carrier plate. [Figure 4] FIG. 10 is a structural schematic diagram after a first dielectric layer is pressure-bonded to the surface of a carrier plate and the first dielectric layer is thinned. [Figure 5] FIG. 10 is a schematic diagram of the structure after the first sacrificial block and the second sacrificial block have been etched away. [Figure 6] FIG. 10 is a schematic diagram of the structure after the first mount cavity is filled with magnetic slurry. [Figure 7] 1 is a structural schematic diagram of an embedded magnet frame according to an embodiment of the present invention. FIG. [Figure 8] FIG. 2 is a plan view of an embedded magnet frame according to an embodiment of the present invention. [Figure 9] 1 is a flowchart of steps in a method for fabricating an embedded magnet integrated structure according to one embodiment of the present invention. [Figure 10] 10 is a flowchart of steps in a method for fabricating an embedded magnet integrated structure according to another embodiment of the present invention. [Figure 11] FIG. 10 is a schematic diagram of the structure after a carrier film is provided on the bottom of the embedded magnet frame. [Figure 12] FIG. 10 is a schematic diagram of the structure after a chip is mounted inside the second mounting cavity. [Figure 13] FIG. 2 is a schematic diagram of the structure after the carrier film has been removed. [Figure 14] FIG. 1 is a schematic diagram of the structure after the chip is packaged with a photosensitive resin film. [Figure 15]FIG. 1 is a schematic diagram of the structure after a window is opened in the photosensitive resin film. [Figure 16] This is a schematic diagram of the structure after the window is opened, a seed layer is formed, and the hole is filled by electroplating. [Figure 17] 1 is a structural schematic diagram of an embedded magnet integrated structure according to one embodiment of the present invention. [Figure 18] FIG. 10 is a structural schematic diagram of an embedded magnet integrated structure according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0018] In this section, specific embodiments of the present invention will be described in detail, and better embodiments of the present invention will be illustrated in the drawings. The drawings are intended to graphically supplement the written description of the specification, thereby enabling intuitive and imaginative understanding of each technical feature and the overall technical solution of the present invention, but are not intended to limit the scope of protection of the present invention.

[0019] In describing the present invention, descriptions of orientations, such as up, down, front, rear, left, right, etc., are based on the orientations or positional relationships shown in the drawings and are intended merely to facilitate and simplify the description of the present invention. They do not indicate or imply that the present invention must have a specific orientation or be configured and operated in a specific orientation, and are not to be understood as limiting the present invention.

[0020] In describing the present invention, some means one or more, plural means two or more, greater than, less than, more than, etc. are understood to be exclusive of the number, and greater than or equal to, less than, less than, within, etc. are understood to be inclusive of the number. Descriptions such as first and second are merely for the purpose of distinguishing technical features and are not to be understood as indicating or implying relative importance, or as implying the number of technical features indicated, or as implying the context of the technical features indicated.

[0021] In describing the present invention, unless otherwise clearly limited, terms such as provide, mount, and connect should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above terms in the present invention in combination with the specific content of the technical solution.

[0022] In one aspect, as shown in FIG. 1 , an embodiment of the present invention provides a method for fabricating an embedded magnet frame, which includes step S100 of fabricating conductive metal posts 200, a first sacrificial block 300, and a second sacrificial block 400 on a surface of a carrier plate 100; step S200 of pressing a first dielectric layer 500 onto the surface of the carrier plate 100 so that the first dielectric layer 500 covers the conductive metal posts 200, the first sacrificial block 300, and the second sacrificial block 400; and step S300 of thinning the first dielectric layer 500 so that the conductive metal posts 200, the first sacrificial block 300, and the second sacrificial block 400 are covered with the first dielectric layer 500. The method includes step S300 of exposing the surface of second sacrificial block 400, step S400 of etching first sacrificial block 300 and second sacrificial block 400 to form corresponding first mounting cavity 310 and second mounting cavity 410, where second mounting cavity 410 is used to mount chip 600, step S500 of filling first mounting cavity 310 with magnetic slurry to form embedded magnet 700, and step S600 of removing carrier plate 100 to form embedded magnet frame 800.

[0023] 2, in some embodiments of the present invention, the carrier plate 100 includes a substrate 110, a first metal layer 120, a second metal layer 130, and a third metal layer 140 sequentially stacked on the surface of the substrate 110, and the first metal layer 120 and the second metal layer 130 are physically separable. The first metal layer 120, the second metal layer 130, and the third metal layer 140 may be provided on the upper surface of the substrate 110, on the lower surface of the substrate 110, or simultaneously on the upper and lower surfaces of the substrate 110 (which facilitates the subsequent simultaneous fabrication of two embedded magnet frames 800). For convenience, the present example will be described taking as an example a case where the first metal layer 120, the second metal layer 130, and the third metal layer 140 are provided on the upper surface of the substrate 110. Here, the first metal layer 120 and the second metal layer 130 are both copper layers, and are physically bonded together to facilitate separation of the plates in subsequent operations. The third metal layer 140 is a titanium layer, and when removing the carrier plate 100 in the subsequent process, the first metal layer 120 and the second metal layer 130 must first be separated before the second metal layer 130 and the third metal layer 140 can be etched away, with the third metal layer 140 serving to prevent over-etching.

[0024] To fabricate the conductive metal posts 200, the first sacrificial block 300 and the second sacrificial block 400 on the surface of the carrier plate 100, step S100 specifically includes: step S101 of applying a photoresist layer on the surface of the carrier plate 100; step S102 of exposing and developing the photoresist layer to form patterns corresponding to the conductive metal posts 200, the first sacrificial block 300 and the second sacrificial block 400; and step S103 of forming the conductive metal posts 200, the first sacrificial block 300 and the second sacrificial block 400 by electroplating according to the pattern.

[0025] The material of the conductive metal post 200, the first sacrificial block 300 and the second sacrificial block 400 is typically copper, but may be other metal materials.

[0026] As shown in FIGS. 3 and 4, after the conductive metal posts 200, the first sacrificial block 300, and the second sacrificial block 400 are fabricated, a first dielectric layer 500 is pressure-bonded to the surface of the carrier plate 100. The first dielectric layer 500 may be a regular resin film or a resin film containing glass fiber (a resin film containing glass fiber is advantageous for improving the rigidity of the package substrate). The first dielectric layer 500 must be thicker than the conductive metal posts 200, the first sacrificial block 300, and the second sacrificial block 400, so that it covers all of the conductive metal posts 200, the first sacrificial block 300, and the second sacrificial block 400. The first dielectric layer 500 is then thinned by mechanical grinding or the like to expose the surfaces of the conductive metal posts 200, the first sacrificial block 300, and the second sacrificial block 400.

[0027] 5, first sacrificial block 300 and second sacrificial block 400 are all etched away to form corresponding first mounting cavity 310 and second mounting cavity 410. As shown in FIG. 6, magnetic slurry is filled into first mounting cavity 310 by silk printing, and the magnetic slurry is solidified, ground, and polished to form embedded magnet 700.

[0028] 7 and 8, carrier plate 100 is removed, and the remaining portion forms embedded magnet frame 800. To remove carrier plate 100, first, the plate is separated to separate first metal layer 120 and second metal layer 130, and then second metal layer 130 and third metal layer 140 are etched away, allowing carrier plate 100 to be removed.

[0029] According to the method for manufacturing an embedded magnet frame of an embodiment of the present invention, the embedded magnet 700 is already embedded inside the frame at the same time as the frame is manufactured, so there is no need to subsequently secondary-mount a magnetic device on the surface of the package substrate, saving on production flow and production costs. Moreover, since the embedded magnet 700 is disposed inside the first dielectric layer 500, it is advantageous for realizing miniaturization and high integration of the package product.

[0030] On the other hand, the present invention further proposes an embedded magnet frame 800, corresponding to the method for manufacturing an embedded magnet frame of the embodiment of the above-mentioned aspect, as shown in Figures 7 and 8, which includes a first dielectric layer 500, a conductive metal post 200, and an embedded magnet 700, wherein the first dielectric layer 500 is provided with a first mount cavity 310 and a second mount cavity 410 that penetrate the first dielectric layer 500, the embedded magnet 700 is provided inside the first mount cavity 310, the inside of the second mount cavity 410 is used to mount a chip 600, and the conductive metal post 200 penetrates the first dielectric layer 500.

[0031] According to the embedded magnet frame of the embodiment of the present invention, the embedded magnet 700 is provided inside the first dielectric layer 500, and a second mounting cavity 410 that can be used to mount the chip 600 is provided, which is advantageous for realizing miniaturization and high integration of package products.

[0032] On the other hand, the embodiment of the present invention further proposes a method for manufacturing an embedded magnet integrated structure, and as shown in FIG. 9, this manufacturing method includes step S1000 of mounting chip 600 inside second mounting cavity 410 of embedded magnet frame 800 manufactured by the above-mentioned method for manufacturing an embedded magnet frame, and step S2000 of packaging chip 600 with photosensitive resin film 1000 so that photosensitive resin film 1000 covers the upper and lower surfaces of first dielectric layer 500. The method includes step S2000 of opening windows in the photosensitive resin film 1000 on the top and bottom surfaces of the first dielectric layer 500 to form first windows 1100, step S3000 of forming first lines 1200 by electroplating at the positions of the first windows 1100, and step S4000 of achieving electrical connection between the first lines 1200 on the top surface of the first dielectric layer 500 and the first lines 1200 on the bottom surface of the first dielectric layer 500 by conductive metal posts 200.

[0033] 11, to mount the chip 600 inside the second mounting cavity 410, first, a carrier film 900 with a certain adhesiveness is attached to the bottom of the embedded magnet frame 800 to temporarily carry the chip 600. As shown in FIG. 12, the chip 600 is placed inside the second mounting cavity 410 and pre-fixed with the carrier film 900. Then, the chip 600 is packaged with a photosensitive resin film 1000, which not only fills the second mounting cavity 410 but also covers the upper surface of the first dielectric layer 500. Then, as shown in FIGS. 13 and 14, the carrier film 900 is removed, and the photosensitive resin film 1000 is pressure-bonded to the lower surface of the first dielectric layer 500.

[0034] As shown in FIG. 15 , utilizing the properties of the photosensitive resin film 1000, excess portions of the photosensitive resin film 1000 are removed by exposure, opening windows in the photosensitive resin film 1000 and forming first windows 1100. As shown in FIG. 16 , after the windows are opened, the first windows 1100 are filled with metal by forming a sputter seed layer and filling the holes by electroplating. As shown in FIG. 17 , the conductive metal layer on the surface of the photosensitive resin film 1000 is ground away to form the desired first lines 1200 and / or pads. The first lines 1200 on the upper surface of the first dielectric layer 500 and the first lines 1200 on the lower surface of the first dielectric layer 500 are electrically connected by the conductive metal posts 200, and the first lines 1200 are also electrically connected to the embedded magnet 700 and the chip 600, thereby completing the fabrication of the embedded magnet integrated structure.

[0035] As shown in Figures 10 and 18, in some embodiments of the present invention, the method for manufacturing an embedded magnet integrated structure further includes step S5000 of providing second dielectric layer 1300 on each of the top and bottom surfaces of photosensitive resin film 1000, step S6000 of forming solder resist layer 1400 on the surface of second dielectric layer 1300, opening a window in solder resist layer 1400, and forming a second window, and step S7000 of forming second line 1500 by electroplating at the position of the second window, so that second line 1500 is electrically connected to first line 1200 by metal blind hole 1600 that penetrates second dielectric layer 1300.

[0036] Specifically, the above three steps are steps for adding more layers to the embedded magnet integrated structure, and those skilled in the art can add more layers to the embedded magnet integrated structure according to the above methods according to actual needs, and the specific number of layers can be selected according to actual needs.

[0037] According to the method for manufacturing an embedded magnet integrated structure of an embodiment of the present invention, by adopting the above-mentioned embedded magnet frame 800, the embedded magnet 700 is already embedded inside the frame at the same time as manufacturing the frame, so there is no need to subsequently mount a magnetic device on the surface of the package substrate, which saves on production flow and production costs, avoids misalignment between the pins of the mounted device and the package substrate, improves the fine wiring capability of the magnetic material-integrated package substrate structure, and effectively increases product yield. Furthermore, since the embedded magnet 700 is located inside the frame, it is advantageous for achieving miniaturization and high integration of package products.

[0038] Meanwhile, an embodiment of the present invention further proposes an embedded magnet integrated structure, as shown in FIG. 17 , corresponding to the above-mentioned method for manufacturing an embedded magnet integrated structure, which includes an embedded magnet frame 800, a chip 600, a photosensitive resin film 1000, and a first line 1200. The chip 600 is provided in a second mount cavity 410. The photosensitive resin film 1000 is filled in the second mount cavity 410 to fix the chip 600 and also covers the upper and lower surfaces of the first dielectric layer 500. A first window 1100 is provided in each of the photosensitive resin films 1000 on the upper and lower surfaces of the first dielectric layer 500, and a first line 1200 is provided in the first window. Electrical connection is realized between the first line 1200 on the upper surface of the first dielectric layer 500 and the first line 1200 on the lower surface of the first dielectric layer 500 via a conductive metal post 200.

[0039] Furthermore, in some embodiments of the present invention, embedded magnet integrated structure further includes second dielectric layer 1300, solder resist layer 1400, and second line 1500. Second dielectric layer 1300 is provided on the top and bottom surfaces of photosensitive resin film 1000, and second dielectric layer 1300 is provided with metal blind hole 1600 penetrating second dielectric layer 1300. Solder resist layer 1400 is provided on the surface of second dielectric layer 1300, and solder resist layer 1400 is provided with a second window. Second line 1500 is provided in the second window, and second line 1500 is electrically connected to first line 1200 by metal blind hole 1600.

[0040] According to the embedded magnet integrated structure of the embodiment of the present invention, the embedded magnet 700 is disposed inside the first dielectric layer 500, thereby eliminating the need for subsequent secondary mounting of a magnetic device on the surface of the package substrate, thereby saving on production flow and production costs, avoiding misalignment between the pins of the mounted device and the package substrate, improving the fine wiring capability of the magnetic material-integrated package substrate structure, and effectively improving product yield. Furthermore, since the embedded magnet 700 is disposed inside the frame, it is advantageous for realizing miniaturization and high integration of the package product.

[0041] The above describes in detail the embodiments of the present invention together with the drawings, but the present invention is not limited to the above embodiments, and various modifications are possible within the scope of knowledge possessed by those skilled in the art without departing from the gist of the present invention. [Explanation of symbols]

[0042] 100 Carrier Plate 110 Substrate 120 First Metal Layer 130 Second Metal Layer 140 Third Metal Layer 200 Conductive Metal Posts 300 First Sacrifice Block 310 First Mount Cavity 400 Second Sacrifice Block 410 Second Mount Cavity 500 first dielectric layer 600 chips 700 embedded magnet 800 Embedded magnet frame 900 Carrier Film 1000 Photosensitive resin film 1100 First Window 1200 First Track 1300 second dielectric layer 1400 solder resist layer 1500 Second Track 1600 Metal blind hole

Claims

1. fabricating conductive metal posts, a first sacrificial block, and a second sacrificial block on a surface of a carrier plate; pressing a first dielectric layer onto a surface of the carrier plate such that the first dielectric layer covers the conductive metal posts, the first sacrificial block, and the second sacrificial block; thinning the first dielectric layer to expose surfaces of the conductive metal posts, the first sacrificial block, and the second sacrificial block; etching the first sacrificial block and the second sacrificial block to form corresponding first mounting cavities and second mounting cavities used to mount chips; filling the first mounting cavity with a magnetic slurry to form an embedded magnet; removing the carrier plate to form an embedded magnet frame.

2. 2. The method for manufacturing an embedded magnet frame as described in claim 1, wherein the carrier plate comprises a substrate, a first metal layer, a second metal layer, and a third metal layer stacked in sequence on the surface of the substrate, and the first metal layer and the second metal layer are physically separable.

3. 3. The method for manufacturing an embedded magnet frame according to claim 2, wherein the first metal layer and the second metal layer are copper layers, and the third metal layer is a titanium layer.

4. The step of fabricating the conductive metal posts, the first sacrificial block, and the second sacrificial block on a surface of the carrier plate includes: applying a photoresist layer to a surface of the carrier plate; exposing and developing the photoresist layer to form a pattern corresponding to the conductive metal posts, the first sacrificial block, and the second sacrificial block; and forming the conductive metal posts, the first sacrificial block, and the second sacrificial block by electroplating in accordance with the pattern.

5. The step of filling the first mount cavity with the magnetic slurry to form the embedded magnet includes:

2. The method for manufacturing an embedded magnet frame according to claim 1, further comprising the steps of filling the magnetic slurry into the first mount cavity by silk printing, solidifying the magnetic slurry, grinding and polishing the magnetic slurry, and forming the embedded magnet.

6. a step of mounting the chip inside the second mount cavity of an embedded magnet frame manufactured by the method for manufacturing an embedded magnet frame according to any one of claims 1 to 5; packaging the chip with a photosensitive resin film, such that the photosensitive resin film covers the upper and lower surfaces of the first dielectric layer; forming a first window by opening a window in the photosensitive resin film on the upper and lower surfaces of the first dielectric layer; forming a first line by electroplating at the position of the first window, and achieving electrical connection between the first line on the upper surface of the first dielectric layer and the first line on the lower surface of the first dielectric layer by the conductive metal post.

7. providing a second dielectric layer on each of the upper and lower surfaces of the photosensitive resin film; forming a solder resist layer on a surface of the second dielectric layer, and opening a window in the solder resist layer to form a second window; 7. The method for manufacturing an embedded magnet integrated structure according to claim 6, further comprising the step of forming a second line by electroplating at the position of the second window, the second line being electrically connected to the first line by a metallic blind hole that penetrates the second dielectric layer.

8. An embedded magnet integrated structure, The embedded magnet integrated structure is An embedded magnet frame, a first dielectric layer having a first mounting cavity and a second mounting cavity extending through the first dielectric layer, the second mounting cavity being used to mount a chip; a conductive metal post extending through the first dielectric layer; an embedded magnet disposed inside the first mount cavity; the embedded magnet frame, the chip disposed in the second mounting cavity; a photosensitive resin film that is filled in the second mount cavity to fix the chip and that covers the upper and lower surfaces of the first dielectric layer; an embedded magnet integrated structure comprising: a first line, wherein a first window is opened in each of the photosensitive resin films on the upper and lower surfaces of the first dielectric layer, the first line being provided within the first window, and the first line on the upper surface of the first dielectric layer and the first line on the lower surface of the first dielectric layer being electrically connected by the conductive metal post.

9. a second dielectric layer provided on the upper and lower surfaces of the photosensitive resin film, the second dielectric layer having a metal blind hole penetrating the second dielectric layer; a solder resist layer provided on a surface of the second dielectric layer, the solder resist layer having a second window; 9. The embedded magnet integrated structure according to claim 8, further comprising: a second line provided in the second window and electrically connected to the first line by the metal blind hole.

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