Method for manufacturing connection structure and connection film

Abstract

To provide a novel and improved manufacturing method of a connection structure capable of conducting temporary adhesion without heating, and a connection film.SOLUTION: There is provided a manufacturing method of a connection structure for connecting a first member and a second member by using a connection film, including a process for arranging a release film on one surface of the connection film, and mounting the connection film onto the first member so tat another surface of the connection film contacts with the first member, a process for temporarily adhering the connection film to the first member by irradiating a light to the connection film, a process for releasing the release film from the connection film, a process for mounting the second member onto the connection film, and a process for permanently crimping the first member and the second member by compressing the second member while heating the connection film.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a connection structure and a connection film. [Background technology]

[0002] Sandwiching a connecting film between components and applying pressure and heat to connect the components is widely used in various technical fields. The connecting film contains a thermosetting resin and hardens when heated. As an example of such a technique, a technique for anisotropically conductively connecting multiple electronic components via conductive particles contained in the resin is known, as disclosed in Patent Documents 1 to 3. In this technique, first, an anisotropic conductive film is mounted on a first electronic component. Next, the anisotropic conductive film is temporarily attached to the first electronic component by applying pressure while heating. Here, the anisotropic conductive film contains a film-forming resin, a thermosetting resin, and conductive particles.

[0003] Next, a second electronic component is mounted on the anisotropic conductive film. Then, the anisotropic conductive film is heated while pressure is applied to the second component, thereby permanently bonding the first and second electronic components together. In this process, the pressure and heat cause the resin component of the anisotropic conductive film to flow, while the conductive particles in the anisotropic conductive film disposed between the electrode terminals of the first and second electronic components are sandwiched between these electrode terminals. Furthermore, the heat hardens the thermosetting resin (heating promotes resin flow and simultaneously causes a curing reaction). This results in an anisotropic conductive connection between the first and second electronic components. In other words, an anisotropic conductive connection structure is produced. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-324471 [Patent Document 2] Japanese Patent Application Laid-Open No. 2011-17011 [Patent Document 3] Japanese Patent Application Laid-Open No. 2014-74139 Summary of the Invention [Problem to be solved by the invention]

[0005] The above-described temporary bonding and final pressure bonding processes are not limited to anisotropic conductive films, but are also performed in the field of various connecting films. However, in recent years, there has been a strong demand for lowering the heating temperature during final pressure bonding, not only in the field of anisotropic conductive films, but also in the field of various connecting films, from the viewpoint of reducing the effects of thermal stress and thermal load on each component.

[0006] In order to lower the heating temperature during final pressure bonding, it is necessary to lower the temperature at which the thermosetting resin begins to harden. Therefore, the heating temperature during temporary attachment must also be low. This is because if the heating temperature during temporary attachment is high, the thermosetting resin may begin to harden during temporary attachment. If part of the thermosetting resin hardens (the hardening progresses) during temporary attachment, the connection film may not be able to exhibit sufficient connection strength after final pressure bonding.

[0007] Setting the heating temperature during temporary attachment lower than the curing initiation temperature of the thermosetting resin can suppress the curing of the thermosetting resin during temporary attachment. However, if the temporary attachment temperature is too low, problems such as poor adhesion of the connection film to the components to be connected may occur. Furthermore, maintaining a relatively low and constant heating temperature during temporary attachment is difficult. This is particularly evident when performing continuous connections. This is because repeated connections make it difficult to maintain a constant tool temperature. If the temperature exceeds the limit, excessive heat is applied to the connection film during temporary attachment. If the temperature drops below the limit, the film may not adhere to the components to be connected, resulting in poor temporary attachment. Even with a small margin for the curing conditions of the adhesive temperature, ensuring that the usage method does not cause problems is highly desirable for mass production and precise production conditions. As the performance of the connection film itself improves, this demand is expected to increase.

[0008] Therefore, the present invention has been made in consideration of the above problems, and an object of the present invention is to provide a new and improved method for manufacturing a connection structure and a connection film that can be temporarily attached at a relatively low temperature (for example, room temperature (=25°C ± 15°C)) or without heating. [Means for solving the problem]

[0009] In order to solve the above problems, according to one aspect of the present invention, there is provided a method for manufacturing a connection structure in which a first component and a second component are connected using a connection film, the method comprising: providing a release film on one side of the connection film; and placing the connection film on the first component so that the other side of the connection film contacts the first component. Mounting process and, the release film; By irradiating the connecting film with light, At room temperature or without heating The method includes a step of temporarily attaching a connection film to a first component, a step of peeling a release film from the connection film, a step of mounting a second component on the connection film, and a step of pressurizing the second component while heating the connection film, thereby permanently pressure-bonding the first component and the second component, In the temporary attachment step, the connection film is fixed onto the first component at room temperature or without heating, and The method for producing a connection structure is provided, wherein the release film is cured or foamed by irradiation with light.

[0010] Here, the connection film may be made of a resin that can be hardened by either heat or light irradiation, or may be made of a thermoplastic resin.

[0011] The connection film may also contain a polymerizable compound, a heat-curing initiator that initiates curing of the polymerizable compound by heating, and a photo-curing initiator that initiates curing of the polymerizable compound by irradiation with light.

[0012] The connecting film may also contain a polymerizable compound and a heat-and-light curing initiator that initiates curing of the polymerizable compound by either heating or light irradiation.

[0013] The connecting film may further contain a photocuring initiator that initiates curing of the polymerizable compound by irradiation with light.

[0014] The connecting film may also contain a light absorbing agent that generates heat when irradiated with light.

[0016] The first component and the second component may be electronic components, and the connecting film may contain conductive particles. The conductive particles may provide an anisotropic conductive connection between the first component and the second component. Alternatively, the connecting film may not contain conductive particles and may provide an electrical connection between the first component and the second component. The connecting film may also be used for purposes other than electrical connection.

[0017] According to another aspect of the present invention, there is provided a connector for connecting a first component and a second component. , a release film is provided on one side A connection film is provided, characterized in that the connection film is a resin that can be hardened by heating, and by pressing the release film with a tool, the other side that is not supported by the release film can be temporarily attached to the first component at room temperature or without heating, and the release film hardens or foams by irradiation with light after the connection film is temporarily attached to the first component at room temperature or without heating.

[0018] Here, the connection film may be made of a resin that can be hardened by either heat or light irradiation, or may be made of a thermoplastic resin.

[0019] The connection film may also contain a polymerizable compound, a heat-curing initiator that initiates curing of the polymerizable compound by heating, and a photo-curing initiator that initiates curing of the polymerizable compound by irradiation with light.

[0020] The connecting film may also contain a polymerizable compound and a heat-and-light curing initiator that initiates curing of the polymerizable compound by either heating or light irradiation.

[0021] The connecting film may further contain a photocuring initiator that initiates curing of the polymerizable compound by irradiation with light.

[0022] The connecting film may also contain a light absorbing agent that generates heat when irradiated with light.

[0023] The first component and the second component may be electronic components, and the connecting film may contain conductive particles. The conductive particles may provide an anisotropic conductive connection between the first component and the second component. Alternatively, the connecting film may not contain conductive particles and may provide an electrical connection between the first component and the second component. The connecting film may also be used for purposes other than electrical connection. [Effects of the Invention]

[0024] As described above, according to the present invention, temporary attachment is performed by light irradiation, so temporary attachment can be performed at a relatively low temperature (for example, room temperature (=25°C ± 15°C)) or without heating. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a cross-sectional view showing one step of a connection method according to an embodiment of the present invention. [Figure 2A] 1 is a cross-sectional view showing one step of a connection method according to an embodiment of the present invention. [Figure 2B] 1 is a cross-sectional view showing one step of a connection method according to an embodiment of the present invention. [Figure 3] 1 is a cross-sectional view showing one step of a connection method according to an embodiment of the present invention. [Figure 4] 1 is a cross-sectional view showing the configuration of an anisotropic conductive connection structure according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0026] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this specification and drawings, components having substantially the same functional configurations are designated by the same reference numerals, and redundant explanations will be omitted.

[0027] <1. Structure of the connection film> First, the configuration of a connection film 10 according to this embodiment will be described with reference to FIGS. 1 to 4. The connection film 10 is a film that connects a first component and a second component. The first component and the second component may be any type of object. For example, both the first component and the second component may be electronic components or other types of objects. If they are electronic components, they may have electrically conductive electrodes or the like, and the first electronic component and the second electronic component may be positioned opposite each other so that they are electrically connected (for example, anisotropically connected via conductive particles). If both the first component and the second component are electronic components, the connection film 10 may be an anisotropic conductive film that anisotropically conductively connects these electronic components (the first electronic component 30 and the second electronic component 40) via conductive particles. Hereinafter, this embodiment will be described using an example in which the connection film 10 is an anisotropic conductive film. An anisotropic conductive film is an example of a conductive connection film (a film that can exhibit conductivity). Of course, the connection film 10 is not limited to a conductive connection film such as an anisotropic conductive film, and may be, for example, a film that does not contain conductive particles. Even if the connection film 10 does not contain conductive particles, the first component and the second component may be electronic components or other types of components. For example, the connection film 10 may not contain conductive particles and electrically connect the first electronic component 30 and the second electronic component 40. Furthermore, the connection film can be used for purposes other than electrical connection.

[0028] Here, taking the case where the connection film 10 is an anisotropic conductive film as an example, in addition to the above problems, the following problem must also be considered. Specifically, if the heating temperature during temporary attachment is high, as mentioned above, the thermosetting resin may begin to harden during temporary attachment. If a portion of the thermosetting resin hardens during temporary attachment, the thermosetting resin may not flow sufficiently during the final pressure-bonding process. As a result, the conductive particles sandwiched between the electrode terminals of the first electronic component and the electrode terminals of the second electronic component may not be sufficiently compressed, which may result in problems such as poor connection. In other words, not only is the connection strength reduced, but poor connection may also occur.

[0029] Setting the heating temperature during temporary attachment lower than the curing initiation temperature of the thermosetting resin can suppress (minimize) the progress of curing of the thermosetting resin during temporary attachment. However, in a production line where the temporary attachment process is performed continuously, it is not easy to maintain a constant heating temperature (the temperature of the tool used for heating and pressing). For example, in fields using anisotropic conductive films (anisotropic conductive connections or methods for manufacturing anisotropic conductive connectors), temporary attachment is generally performed continuously on a continuous production line. Here, in the above-mentioned production line where the temporary attachment process is repeatedly performed continuously, a predetermined length of the anisotropic conductive film is unwound from a reel and mounted on the first electronic component. Next, the anisotropic conductive film is temporarily attached to the first electronic component by applying pressure while heating. The above-mentioned process is repeated. In this production line, there is a high possibility of the above-mentioned upper deviation and the like occurring. Thus, the performance of the connection film described in this embodiment is required for continuous and stable use.

[0030] The connecting film 10 includes a film-forming resin and a curable resin. The connecting film 10 may further include conductive particles. The film-forming resin imparts film-forming properties to the connecting film 10. The film-forming resin may be any resin capable of imparting film-forming properties to the connecting film 10. For example, the film-forming resin may be an organic resin having an average molecular weight of 10,000 or more. From the viewpoint of improving coatability or film-forming properties, the film-forming resin is preferably an organic resin having an average molecular weight of 10,000 or more and 80,000 or less. Various resins such as phenoxy resin, polyester urethane resin, polyester resin, polyurethane resin, and modified resins thereof can be used as the film-forming resin. In this embodiment, only one of these film-forming resins can be used, or two or more can be used in any combination. From the viewpoint of improving film-forming properties and adhesive reliability, the film-forming resin is preferably a phenoxy resin. The connecting film 10 may also contain known additives such as rubber or elastomer.

[0031] The curable resin is a resin that can be cured by either light irradiation or heat. This allows the connection film 10 to be cured by either light irradiation or heat. As will be described in detail later, the connection film 10 has these characteristics, so the connection film 10 can be temporarily attached by light irradiation. In other words, heating is not required during temporary attachment (or minimal heating is sufficient). Furthermore, although the connection film 10 may be slightly cured by light irradiation, this is not a problem as long as the conductive particles can be sufficiently clamped or compressed during final pressure bonding. Even a connection film that does not contain conductive particles is not a problem as long as it does not interfere with the connection during final pressure bonding. Therefore, the effect of light irradiation on the connection film is negligible, or can be adjusted to be negligible, and it is safe to assume that problems such as poor connection are unlikely to occur. Examples of the composition of the curable resin are as follows. The following polymerizable compounds and various curing initiators are merely examples and are not limited to these.

[0032] (Composition Example 1) In Composition Example 1, the curable resin includes a polymerizable compound, a heat-curing initiator that initiates curing of the polymerizable compound by heating, and a photo-curing initiator that initiates curing of the polymerizable compound by light irradiation. Note that the photo-curing initiator may be omitted in Composition Example 1. That is, the curable resin may be a composition that includes a polymerizable compound and a heat-curing initiator that initiates curing of the polymerizable compound by heating.

[0033] The polymerizable compound is a resin that can be cured with either a heat-curing initiator or a photo-curing initiator. The cured polymerizable compound bonds the first electronic component 30 and the second electronic component 40 together, and, if the connection film 10 contains conductive particles, retains the conductive particles in the anisotropic conductive layer 10a (the cured connection film 10; see FIG. 4). Specifically, as will be described in detail later, some of the conductive particles are sandwiched between the first and second electrode terminal groups in the anisotropic conductive layer 10a, providing electrical continuity between these electrode terminal groups. Meanwhile, the remaining conductive particles are sufficient to prevent electrical continuity between the terminals in the arrangement direction of the first and second electrode terminal groups that sandwich the conductive particles. The cured polymerizable compound primarily maintains the state of the conductive particles sandwiched between the terminal groups and acts as an adhesive to maintain the bonded state of the electronic components. Examples of polymerizable compounds include epoxy polymerizable compounds and acrylic polymerizable compounds. The epoxy polymerizable compound is a monomer, oligomer, or prepolymer having one or more epoxy groups in one molecule. Examples of the epoxy polymerizable compound include various bisphenol-type epoxy resins (such as bisphenol A and F), polyglycidyl ethers, polyglycidyl esters, novolac-type epoxy resins, various modified epoxy resins such as rubber and urethane, naphthalene-type epoxy resins, biphenyl-type epoxy resins, phenol novolac-type epoxy resins, stilbene-type epoxy resins, triphenolmethane-type epoxy resins, dicyclopentadiene-type epoxy resins, triphenylmethane-type epoxy resins, glycidylamine-type epoxy compounds, glycidyl ester-type epoxy compounds, and prepolymers thereof.

[0034] The acrylic polymerizable compound is a monomer, oligomer, or prepolymer having one or more acrylic groups in one molecule. Examples of the acrylic polymerizable compound include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethyloltricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diacryloxypropane, 2,2-bis[4-(acryloxymethoxy)phenyl]propane, 2,2-bis[4-(acryloxyethoxy)phenyl]propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris(acryloxyethyl)isocyanelate, polyether acrylate, polyester acrylate, polyethylene glycol diacrylate, and the like. acrylate, polyalkylene glycol diacrylate, pentaerythritol acrylate, 2-cyanoethyl acrylate, cyclohexyl acrylate, dicyclopentenyloxyethyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, 2-ethoxyethyl acrylate, 2-ethylhexyl acrylate, n-hexyl acrylate, 2-hydroxyethyl acrylate, hydroxypropyl acrylate, isobornyl acrylate, isodecyl acrylate, isooctyl acrylate, n-lauryl acrylate, 2-methoxyethyl acrylate, 2-phenoxyethyl acrylate, tetrahydrofurfuryl acrylate, neopentyl glycol diacrylate, dipentaerythritol hexaacrylate, and urethane acrylate. In this embodiment, any one of the polymerizable compounds listed above may be used, or two or more may be used in any combination.

[0035] The thermosetting initiator is a curing initiator that initiates curing of a polymerizable compound by heating. Examples of the thermosetting initiator include a thermal anionic or thermal cationic curing initiator that cures an epoxy polymerizable compound, and a thermal radical curing initiator that cures an acrylic polymerizable compound. In this embodiment, an appropriate thermosetting initiator may be selected depending on the polymerizable compound.

[0036] Examples of thermal anionic curing initiators include organic acid dihydrazides, dicyandiamide, amine compounds, polyamidoamine compounds, cyanate ester compounds, phenolic resins, acid anhydrides, carboxylic acids, tertiary amine compounds, imidazoles, Lewis acids, Bronsted acid salts, polymercaptan curing agents, urea resins, melamine resins, isocyanate compounds, blocked isocyanate compounds, etc. One or more of these may be used in any combination.

[0037] Examples of the thermal cationic curing initiator include iodonium salts, sulfonium salts, phosphonium salts, ferrocenes, etc. One or more of these may be used in any combination.

[0038] Examples of the thermal radical curing initiator include organic peroxides, azo compounds, etc. One or more of these may be used in any combination.

[0039] The photocuring initiator is a curing initiator that initiates curing of a polymerizable compound by light irradiation. Examples of the photocuring initiator include a photoanionic or photocationic curing initiator that cures an epoxy polymerizable compound, and a photoradical polymerization initiator that cures an acrylic polymerizable compound. In this embodiment, an appropriate photocuring initiator may be selected depending on the polymerizable compound.

[0040] Examples of the photoanionic curing initiator include acetophenone, O-aroyloxime, nifedipine, etc., which generate a base when exposed to light.

[0041] Examples of photocationic curing initiators that can be used include onium salts such as iodonium salts, sulfonium salts, aromatic diazonium salts, phosphonium salts, and selenonium salts, metal arene complexes, complex compounds such as silanol / aluminum complexes, benzoin tosylate, and o-nitrobenzyl tosylate. Counter anions used in forming salts include propylene carbonate, hexafluoroantimonate, hexafluorophosphate, tetrafluoroborate, and tetrakis(pentafluorophenyl)borate. One or more of these may be used in any combination.

[0042] Examples of photoradical curing initiators include benzoin ethers such as benzoin ethyl ether and isopropyl benzoin ether, benzil ketals such as benzil and hydroxycyclohexyl phenyl ketone, ketones such as benzophenone and acetophenone and derivatives thereof, thioxanthones, bisimidazoles, etc. One or more of these may be used in any combination.

[0043] (Composition Example 2) In Composition Example 2, the curable resin contains a polymerizable compound and a thermo-photo-curing initiator that initiates curing of the polymerizable compound by either heating or light irradiation. The polymerizable compound is the same as in Composition Example 1. As a modified example, the connecting film may be made of a thermoplastic resin (including rubber and elastomer). (Examples of modified examples made of a thermoplastic resin include JP 2014-060025 A, JP 2015-170581 A, and JP 2015-147832 A.)

[0044] Examples of the thermo-photo-curing initiator include the above-listed curing initiators, such as a thermo-cationic curing initiator, a thermo-anionic curing initiator, and a radical polymerization initiator. The curable resin may further contain a photo-curing initiator. This allows for more reliable curing during temporary application.

[0045] In the following description, the curing of a polymerizable compound by light irradiation using a photocuring initiator or a thermo-photocuring initiator is also referred to as "photocuring," and the curing of a polymerizable compound by heat using a thermo-curing initiator or a thermo-photocuring initiator is also referred to as "thermal curing."

[0046] (Composition Example 3) In Composition Example 3, the curable resin further contains a light absorbing agent in addition to the composition of Composition Example 1 or Composition Example 2. Here, the light absorbing agent generates heat slightly when irradiated with light. Therefore, the light absorbing agent generates heat when irradiated with light during temporary attachment. The heat generated then causes the connection film 10 to melt slightly, and the connection film 10 is fixed to the first electronic component 30. Therefore, when the curable resin contains a light absorbing agent, the connection film 10 can be temporarily attached to the first electronic component 30 more firmly. The wavelength of light absorbed by the light absorbing agent is not particularly limited, but may be approximately 230 to 500 nm, for example.

[0047] Examples of the light absorber include benzotriazole-based, triazine-based, and benzophenone-based ultraviolet absorbers. In addition, when a photocationic curing initiator is used as the photocuring initiator in Composition Examples 1 and 2, a photoradical curing initiator may be used as the light absorber. The curable resin may have any of the compositions in Composition Examples 1 to 3, but Composition Example 3 is preferred. As will be described in detail later, when the connecting film contains a light absorber, the cumulative irradiation amount required for temporary attachment can be reduced.

[0048] The conductive particles are a material that provides electrical continuity between the electrode terminal group on the first electronic component 30 (hereinafter also referred to as the "first electrode terminal group," which generally has an array of electrode terminals) and the electrode terminal group on the second electronic component 40 (hereinafter also referred to as the "second electrode terminal group," which faces the first electrode terminal group) in the anisotropic conductive layer 10a. Specifically, the conductive particles sandwiched between the first electrode terminal group and the second electrode terminal group in the anisotropic conductive layer 10a provide electrical continuity between these electrode terminal groups. On the other hand, the other conductive particles do not provide electrical continuity between the terminals in the arrangement direction of the first electrode terminal group and the second electrode terminal group that sandwich the conductive particles (i.e., they do not cause electrical shorts that provide electrical continuity in the arrangement direction of the electrode terminal groups). Therefore, the conductive particles can electrically connect the first electrode terminal group and the second electrode terminal group while maintaining insulation between the electrode terminals constituting the first electrode terminal group and the electrode terminals constituting the second electrode terminal group within the anisotropic conductive layer 10a. That is, the conductive particles are sandwiched between each electrode terminal constituting the first electrode terminal group and each electrode terminal constituting the opposing second electrode terminal group within the anisotropic conductive layer 10a, thereby establishing an anisotropic conductive connection between them. The conductive particles may be dispersed to a degree that does not cause short circuits (they may be kneaded into the resin of the connection film 10), or may be arranged on the connection film 10 so that they are individually independent in a planar view of the film. This arrangement is determined appropriately depending on the size of each electrode terminal and the distance in the arrangement direction of the electrode terminals, but may also be regular. Note that when the connection film 10 is a film other than a conductive connection film (i.e., when the connection film does not require conductivity due to conductive particles), conductive particles may not be included in the connection film 10. Instead of the conductive particles, functional fillers tailored to the purpose may be individually or regularly arranged. Examples of such connection films include International Publication No. 2018 / 051799 and International Publication No. 2018 / 074318. Examples of regularly arranged conductive particles in anisotropic conductive films include Japanese Patent Application Laid-Open No. 2016-066573 and Japanese Patent Application Laid-Open No. 2016-103476.

[0049] The structure of the conductive particles is not particularly limited, and they may be so-called metal-coated resin particles or metal particles (e.g., gold, silver, copper, nickel, palladium, solder, etc., or alloys). The outermost surface of such conductive particles may be insulated to the extent that it does not impair its conductive function. This is to prevent adverse effects caused by particles being connected together. Metal-coated resin particles may be preferable because the rebound of the resin particles after compression facilitates electrical connection between the first electrode terminal group and the second electrode terminal group. The resin particles constituting the core of the metal-coated resin particles are preferably particles made of a plastic material that is highly resistant to compressive deformation. Examples of materials constituting the resin particles include (meth)acrylate resins, polystyrene resins, styrene-(meth)acrylic copolymer resins, urethane resins, epoxy resins, phenolic resins, acrylonitrile-styrene (AS) resins, benzoguanamine resins, divinylbenzene resins, styrene resins, and polyester resins. For example, when resin particles are formed from a (meth)acrylate resin, the (meth)acrylic resin is preferably a copolymer of a (meth)acrylic acid ester and, if necessary, a compound having a reactive double bond copolymerizable therewith and a bifunctional or polyfunctional monomer. Two or more types of conductive particles may be used. In this case, for example, two or more types of different metal-coated resin particles may be used. Therefore, the combination of conductive particles is not particularly limited.

[0050] The coating layer that coats the resin particles is made of a conductive material. As described above, examples of materials that constitute the coating layer include gold, silver, copper, nickel, palladium, and alloys thereof. The coating layer may be made of one or more of these materials, or may be made of two or more layers.

[0051] In addition to the above components, the connection film 10 may contain various additives. Examples of additives that can be added to the connection film 10 include a silane coupling agent, an inorganic filler, a colorant, an antioxidant, and an anti-rust agent. The type of silane coupling agent is not particularly limited. Examples of silane coupling agents include epoxy-based, amino-based, mercaptosulfide-based, and ureido-based silane coupling agents.

[0052] The inorganic filler is an additive for adjusting the fluidity and film strength of the connection film 10. The type of inorganic filler is not particularly limited. Examples of inorganic fillers include silica, talc, titanium oxide, calcium carbonate, and magnesium oxide.

[0053] The thickness of the connection film 10 is not particularly limited. However, if the film is too thick, the amount of unnecessary resin will be too large, causing problems such as fluidity. Therefore, the thickness is preferably 200 μm or less, more preferably 100 μm or less, and even more preferably 40 μm or less. If the film is too thin, it will be difficult to handle, so the thickness is preferably 5 μm or more, and more preferably 12 μm or more. The connection film 10 may also have a long shape. It may be cut to an appropriate length from a long connection film 10 and used. The connection film 10 may have a single-layer structure or a multi-layer structure. For example, the connection film 10 may have a two-layer structure, with one layer being an ACF layer (a layer containing conductive particles) and the other layer being an NCF layer (a layer not containing conductive particles).

[0054] A release film 20 is provided on one surface of the connection film 10. The peel strength (the force required for peeling) between the release film 20 and the connection film 10 is preferably reduced by light irradiation. This allows the release film 20 to be easily peeled off from the connection film 10 after temporary attachment.

[0055] Specifically, the release film 20 is preferably a photocurable film that is cured by light irradiation. In this case, the peel strength between the release film 20 and the connection film 10 is significantly reduced by light irradiation, making it easier to peel the release film 20 from the connection film 10 after temporary application. An example of a photocurable film is an ultraviolet (UV) curable film. There are also types of release films 20 that foam when irradiated with light. These also significantly reduce the peel strength between the release film 20 and the connection film 10 by light irradiation, so a similar effect can be expected. Such release films 20 may be optically transparent. There are also no particular limitations on other mechanisms as long as they achieve the same effect (reducing the peel strength between the release film and the connection film by light irradiation) and do not impair the performance of the connection film.

[0056] The connection film 10 may be slightly hardened by light irradiation during temporary attachment. This hardening also reduces the peel strength between the release film 20 and the connection film 10. Therefore, the release film 20 is not necessarily limited to a photocurable film. For example, a release film used in conventional anisotropic conductive films may be used. For example, the release film 20 may be a film containing PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), or the like. A release agent such as silicone may be applied to the surface of a film made of these materials. Furthermore, the above-described photocurable film may be laminated on the surface of a release film 20 made of these materials. The release film 20 in this embodiment may be considered to be releasably integrated with the connection film 10 and to have sufficient rigidity and flexibility to be wound around the connection film 10.

[0057] <2. Method for manufacturing connection structure> Next, a method for manufacturing a connection structure according to this embodiment will be described with reference to Figs. 1 to 4. Here, the method for manufacturing a connection structure will be described using an example in which the connection film 10 is an anisotropic conductive film, but it goes without saying that the connection film 10 may be another type of connection film. In this case, the same steps as below can be used to temporarily press-bond the connection film onto the components and to permanently press-bond the components together. The method for manufacturing a connection structure according to this embodiment includes a connection film mounting step, a temporary bonding step, a peeling step, an electronic component mounting step, and a permanent pressing step. Each step will be described below.

[0058] (2-1. Connecting film mounting process) 1, in the connection film mounting step, the connection film 10 is mounted on the first electronic component 30 so that the other surface of the connection film 10 (i.e., the exposed surface on which the release film 20 is not provided) is in contact with the first electronic component 30. Specifically, the connection film 10 is mounted on the region where the first electrode terminal group is formed.

[0059] The first electronic component 30 may be any electronic component having the above-described first electrode terminal group. As an example, the first electronic component 30 may be a substrate (hereinafter also referred to as "first substrate") on which the first electrode terminal group is formed. The first electrode terminal group may be made of ITO (indium tin oxide) or a metal film. Examples of metals that make up the metal film include gold, silver, copper, aluminum, zinc, titanium, and alloys of two or more of these. An insulating layer (oxide film) may be formed on the surface of the electrode terminal.

[0060] The material constituting the first substrate may be selected depending on the intended use of the anisotropic conductive connection structure 1 (a structure in which a first electronic component 30 and a second electronic component 40 are anisotropically conductively connected; see FIG. 4). For example, the first substrate may be made of a transparent plastic substrate. In this case, the first substrate may be made of, for example, polycarbonate, acrylic, polyethylene terephthalate (PET), triacetyl cellulose, cyclic olefin resin (COC), or the like. The first substrate may also be made of transparent glass, or the like.

[0061] (2-2. Temporary attachment process) Next, the connection film 10 is temporarily attached to the first electronic component 30. Specifically, as shown in FIG. 2A, light is irradiated onto the connection film 10 from a light source 600 installed on the back side of the first electronic component 30. At this time, the connection film 10 may be pressurized while being irradiated with light. When pressurizing, light may be irradiated before pressurization. Note that the position of the light source 600 is not limited thereto; it may be above the release film 20, as shown in FIG. 2B. Even if light is irradiated from the release film 20 side, performance is satisfactory as long as the peel strength with the connection film 10 is reduced. When pressurizing as shown in FIG. 2B, light is irradiated before pressurization. Regardless of the direction of light irradiation, the timing of light irradiation and pressurization can be adjusted as appropriate. There are no particular limitations as long as the peel strength between the release film 20 and the connection film 10 is reduced. The means of pressurization is not particularly limited, and any type of pressurizing tool may be used. For example, roll lamination is an example. In this manner, the connection film 10 is temporarily attached to the first electronic component 30. By this temporary attachment, the connection film 10 is fixed (temporarily attached) to the first electronic component 30. During this process, the photocuring initiator (or thermosetting initiator) in the curable resin slightly cures the polymerizable compound, but the connection film 10 is not substantially cured, or even if it is cured, the degree of curing is minimal. Here, the connection film 10 in this connection method is, for example, an anisotropic conductive film. Therefore, to evaluate whether or not temporary attachment has been achieved as a characteristic of the connection film, temporary attachment is considered to have been achieved if the following conditions 1 and 2 are met. This is because, if the conductivity between the components is not an issue, and conditions 1 and 2 are met, temporary attachment is practically acceptable. Furthermore, condition 3 may also be applied when the connection film 10 is a conductive connection film such as an anisotropic conductive film, or when electronic components are connected without containing conductive particles. In this embodiment, condition 3 is used to check whether the reaction is proceeding excessively during temporary attachment.If the connecting film 10 is a conductive connecting film such as an anisotropic conductive film, or if it does not contain conductive particles and electrically connects electronic components, the performance is determined by the conductivity achieved between the connected objects through the conductive particles in the film or direct connection between the terminals. Therefore, adding condition 3 allows for evaluation under more precise conditions. Note that condition 3 below is an example of a COG connection for an anisotropic conductive connection. Since the required performance (conduction resistance) varies depending on the combination of connecting components, please note that the desired conduction resistance value after acceleration testing may change if the combination of connecting components is changed.

[0062] (Condition 1) The release film 20 can be peeled off from the connecting film 10. (Condition 2) When the release film 20 is peeled off from the connecting film 10, the connecting film 10 does not peel off from the first electronic component 30. (Condition 3) The conductive resistance after the accelerated test described below is rated "A." In other words, the conductive resistance is low.

[0063] Here, when the connection film 10 is a conductive connection film such as an anisotropic conductive film, the conditions for temporary attachment are the pressure (MPa), the integrated irradiation amount per unit area (= illuminance (mW / cm 2 ) × irradiation time (sec)) may be adjusted so as to satisfy the above-mentioned conditions 1 to 3. For example, the pressure may be 0.5 MPa or more and 2 MPa or less, and the cumulative irradiation amount per unit area may be 150 to 500 (mW·sec / cm 2 The cumulative irradiation dose per unit area may be 200 to 400 (mW·sec / cm 2 ), and 250 to 300 (mW·sec / cm 2) is more preferable. If the cumulative irradiation dose is insufficient, light irradiation can be performed again. On the other hand, it is preferable that the cumulative irradiation dose per unit area is as small as possible within the range that satisfies conditions 1 to 3. This is to maximize the fluidity of the connection film 10 during final pressure bonding. If the release film 20 is made of the above-mentioned photocurable film (or if a light-irradiation film is laminated on the release film 20), temporary attachment that satisfies conditions 1 to 3 can be performed with a smaller cumulative irradiation dose. Furthermore, if the connection film 10 contains a light-absorbing agent, the resin portion of the connection film 10 melts due to heat generated by the light-absorbing agent and adheres to the first electronic component 30, so that the connection film 10 can be firmly temporarily attached to the first electronic component 30 even with a small cumulative irradiation dose. If conductivity between the items is not an issue, the pressure and cumulative irradiation dose can be adjusted in the same way as above so that conditions 1 and 2 are satisfied. This is not limited to the above and can be adjusted appropriately depending on the purpose.

[0064] As described above, in this embodiment, no heating is performed during temporary attachment. In other words, temporary attachment can be performed at a relatively low temperature (for example, room temperature (=25°C±15°C)) or without heating. As a result, even if the thermal curing initiation temperature of the curable resin (i.e., the temperature at which the thermal curing initiator or the thermo-light curing initiator starts to thermally cure) is low, temporary attachment can be performed with almost no thermal curing of the thermal curing initiator or the thermo-light curing initiator.

[0065] That is, the inventors of the present invention conducted a detailed study of the temporary attachment method according to this embodiment and found that the temperature of the connection film 10 during temporary attachment does not exceed room temperature (here, approximately 25°C ± 15°C). The same applies when heat is generated by the light absorber. On the other hand, the thermal curing initiation temperature is higher than room temperature. Therefore, in this embodiment, even if the thermal curing initiation temperature of the curable resin is low, temporary attachment can be performed without causing the thermal curing initiator or thermo-photocuring initiator to undergo much thermal curing. Therefore, for example, in a clean environment where room temperature can be maintained, there are few restrictions on other conditions. For example, temporary attachment and the associated production of connection bodies are less likely to be restricted by locations with high temperatures. This is considered to be an advantage in terms of industrial promotion.

[0066] Furthermore, the connection film 10 does not substantially cure or cures only slightly upon light irradiation (i.e., photo-curing). Even if the connection film 10 cures only slightly, the conduction resistance after the final pressure-bonding is favorable, as will be shown in the examples described later. In other words, even if the connection film 10 does not substantially cure upon light irradiation, or even if it cures only slightly, the fluidity of the connection film 10 during the final pressure-bonding is sufficiently ensured. Therefore, the conductive particles arranged between the electrode terminals of the first electronic component 30 and the electrode terminals of the second electronic component 40 are sandwiched between these electrode terminals during the final pressure-bonding.

[0067] Thus, according to this embodiment, temporary bonding is performed by light irradiation. Therefore, when the connection film 10 is a conductive connection film such as an anisotropic conductive film 10, or when electronic components are connected without containing conductive particles, temporary bonding that satisfies the above-mentioned conditions 1 to 3 can be performed even if the thermosetting initiation temperature is low. When conductivity between articles is not an issue, temporary bonding that satisfies the above-mentioned conditions 1 to 2 can be performed even if the thermosetting initiation temperature is low.

[0068] (2-3. Peeling process) Next, the release film 20 is peeled off from the connection film 10. Here, since the connection film 10 is temporarily attached onto the first electronic component 30, the connection film 10 is held on the first electronic component 30.

[0069] (2-4. Electronic component mounting process) 3, a second electronic component 40 is mounted on the connection film 10. Specifically, the second electronic component 40 is mounted on the connection film 10 so that the area where the second electrode terminal group is formed is in contact with the connection film 10.

[0070] The second electronic component 40 may be any electronic component having the second electrode terminal group described above. As an example, the second electronic component 40 may be a substrate (hereinafter also referred to as a "second substrate") on which the second electrode terminal group is formed. The material of the second electrode terminal group may be the same as that of the first electrode terminal group. The type of the second substrate is not particularly limited and may be the same as that of the first substrate. Furthermore, the second substrate may be a so-called flexible substrate or an integrated circuit (IC chip). Note that first electronic components 30 or second electronic components 40 may be connected to each other (for example, by stacking integrated circuits).

[0071] (2-5. Main crimping process) Next, the second electronic component 40 is permanently pressure-bonded to the connecting film 10. Specifically, as shown in FIG. 3, a cushioning material 200a is placed on the second electronic component 40. Next, the tool head 300 for permanent pressure bonding is moved in the direction of arrow A (i.e., downward), and the tool head 300 for permanent pressure bonding, which has been set (heated) to a predetermined temperature, is pressed against the cushioning material 200a. This applies pressure to the second electronic component 40. After a predetermined time has elapsed, the pressure is released. In other words, the second electronic component 40 is pressured while the connecting film 10 is being heated. This completes the permanent pressure bonding of the second electronic component 40 to the first electronic component 30.

[0072] This final pressure bonding causes the resin portion of the connection film 10 to flow, while the conductive particles arranged between the first and second electrode terminals are compressed by these electrode terminals. The curable resin is then cured by heating. This results in an anisotropic conductive connection between the first electronic component 30 and the second electronic component 40. This produces the anisotropic conductive connection structure 1 shown in FIG. 4. The anisotropic conductive connection structure 1 is a structure in which the first electronic component 30 and the second electronic component 40 are anisotropically conductively connected by the anisotropic conductive layer 10a. The anisotropic conductive layer 10a is formed by curing the connection film 10.

[0073] As described above, according to this embodiment, temporary attachment can be performed at a relatively low temperature (for example, room temperature (=25°C±15°C)) or without heating. As a result, when the connection film 10 is an anisotropic conductive film, temporary attachment can be performed accurately while reducing the conductive resistance after full pressure bonding, making it possible to manufacture a highly reliable anisotropic conductive connection structure 1 with high productivity. Furthermore, when the connection film 10 is another type of connection film, temporary attachment can also be performed accurately. [Example]

[0074] <1. Preparation of connecting film> First, anisotropic conductive films according to Experimental Examples 1-1 to 3-5 were fabricated using the following process. Specifically, a coating solution for the ACF layer was prepared by mixing a phenoxy resin (YP-70, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), a liquid epoxy resin (EP828, manufactured by Mitsubishi Chemical Corporation), a solid epoxy resin (YD014, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), conductive particles (AUL704, manufactured by Sekisui Chemical Co., Ltd.), thermal cationic curing initiators (SI-80L and SI-60L, both manufactured by Sanshin Chemical Co., Ltd.), and a light absorber (LA-31, manufactured by ADEKA Corporation) in the compositions shown in Tables 1 to 3 (the numerical values ​​for each material indicate parts by mass). Here, the phenoxy resin is an example of a film-forming resin, and the liquid epoxy resin and solid epoxy resin are examples of polymerizable compounds. The thermal cationic curing initiator is an example of a thermo-photocurable initiator. Furthermore, a coating solution for the NCF layer was prepared by removing the conductive particles from the coating solution for the ACF layer. On the other hand, a PET film (Purex manufactured by Teijin Limited, thickness 50 μm) and a UV-cured film (SELFA-SE manufactured by Sekisui Chemical Co., Ltd., thickness 50 μm) were prepared as release films. In Tables 1 to 3 and Table 4 described below, the PET film is referred to as the "normal substrate" and the UV-cured film is referred to as the "UV-release substrate."

[0075] Next, the coating liquid for the NCF layer was applied to a release film (PET film or UV-cured film) to a thickness of 10 μm after drying, and then dried in an oven. Through this process, an NCF layer was formed on the release film. Next, the coating liquid for the ACF layer was applied to a PET film to a thickness of 10 μm after drying, and then dried in an oven. After this, an ACF layer was laminated on the NCF layer. That is, each layer was laminated in the order of PET film or UV-cured film / NCF layer / ACF layer. Through the above process, the connection films of Experimental Examples 1-1 to 3-5 were obtained. Therefore, the connection films of Experimental Examples 1-1 to 3-5 had a two-layer structure of an NCF layer and an ACF layer. Furthermore, the above components were mixed in the composition shown in Table 4 to prepare a coating liquid for the NCF layer. Then, the coating liquid for the NCF layer was applied to a release film to a thickness of 20 μm after drying, and then dried in an oven. Through the above process, the connection films of Experimental Examples 4-1 to 4-3 were obtained. Therefore, the connecting films according to Experimental Examples 4-1 to 4-3 had a single-layer structure of an NCF layer. The compositions of the connecting films and the types of release films are summarized in Tables 1 to 4. The connecting films were cut to a width of 4.0 mm and a length of 25.0 mm before use.

[0076] <2. Preparation of electronic components and glass plates> A 0.5 mm thick ITO patterned glass was prepared as the first electronic component. A first group of ITO electrode terminals was formed on this ITO patterned glass, facing the second group of electrode terminals of the second electronic component. The second electronic component was a 0.5 mm thick, 1.8 mm x 20 mm outer diameter test IC, with 300 25 μm x 25 μm bumps arranged along the long side of the test IC, with a distance of 25 μm between bumps. The second group of electrode terminals (the bumps on the test IC) were Au-plated bumps (height: 15 μm). A polyimide film and a glass plate were also prepared (details will be described later).

[0077] In Experimental Examples 1-1 to 3-5, the connection film was an anisotropic conductive film, and therefore the first temporary attachment test and reliability evaluation test described below were carried out. However, the reliability evaluation test was carried out only for the experimental examples that received an A rating in the first temporary attachment test. In Experimental Examples 4-1 to 4-3, the connection film did not contain conductive particles, and therefore the second temporary attachment test and connection strength test described below were carried out. However, the connection strength test was carried out only for the experimental examples that received an A rating in the second temporary attachment test.

[0078] <3. First temporary application test> The connection film was temporarily attached onto the first electronic component by the above-described connection method. Specifically, first, the connection film was mounted on the first electronic component. Here, the connection film was mounted on the area where the first electrode terminal group was formed.

[0079] Next, a connection film was temporarily attached to the first electronic component. Specifically, pressure was applied to the connection film. The size of the bonding surface of the temporary attachment tool head was 10.0 mm wide and 40.0 mm long. Pressurization was generally performed at room temperature (RT), but in some experimental examples, heating was also performed. Pressurization and heating were performed under the following conditions: cushioning material: silicone rubber (thickness 350 μm), temporary attachment conditions (pressure conditions during temporary attachment): 70°C, 1 MPa, 1 second. Tables 1 to 3 show the pressure conditions during temporary attachment (heating temperature, applied pressure, and pressure time).

[0080] On the other hand, in some experimental examples, light was irradiated onto the connection film from a light source. In other words, the connection film was pressurized while irradiating it with light. This temporarily attached the connection film to the first electronic component. Here, an SP-9 manufactured by Ushio Inc. was used as the light source. The light source was positioned on the back side of the first electronic component, as shown in Figure 2A. The wavelength of the light irradiated from this light source was 365 nm, and the irradiation area (the area on the connection film where the light hits) was approximately 4.0 mm wide and 44.0 mm long. The irradiation intensity and irradiation time per unit area were different values ​​for each experimental example. For example, in experimental example 1-2, the irradiation intensity was 300 mW / cm 2 The irradiation time was 1 second. Pressurization and light irradiation were started simultaneously.

[0081] In the experimental examples in which light irradiation was performed, the temperature of the connection film was measured by placing a thermocouple at the location where the connection film would be installed and measuring the temperature profile during temporary attachment, but in all experimental examples the temperature of the connection film was below the upper limit of room temperature (approximately 40°C). For this reason, it is presumed that thermal curing hardly occurred.

[0082] The above process was repeated 10 times to prepare 10 experimental samples in which the connection film was temporarily attached to the first electronic component. Next, the release film was manually peeled off using tweezers. Experimental samples in which the connection film peeled off from the first electronic component along with the release film were deemed to have failed, and experimental samples in which the connection film remained on the first electronic component were deemed to have passed, and the number of samples that passed was evaluated. Experimental examples with 10 passing samples were rated A, and experimental examples with 9 or fewer passing samples were rated B. A is a pass, and B is a fail. The evaluation results are summarized in Tables 1 to 3.

[0083] <4. Reliability evaluation test> Next, the first electronic component and the second electronic component were permanently pressure-bonded using the connection method described above. Specifically, the second electronic component was mounted on the connection film so that the area where the second electrode terminal group was formed was in contact with the connection film. Next, a buffer material was placed on the second electronic component. Next, the tool head for permanent pressure bonding was moved in the direction of arrow A (i.e., downward) shown in Figure 3, and the tool head for permanent pressure bonding, which had been set (heated) to a predetermined temperature, was pressed against the buffer material. This applied pressure to the second electronic component. After a predetermined time had elapsed, the pressure was released. In other words, the second electronic component was pressed while the connection film was heated. Here, the buffer material was the same as the buffer material used for temporary bonding. Furthermore, the tool head for permanent pressure bonding was the same as the tool head for temporary bonding. The conditions for permanent pressure bonding of the connection film (heating temperature, applied pressure, and applied pressure time) are summarized in Tables 1 to 3. This resulted in an anisotropic conductive connection structure.

[0084] The following reliability evaluation test was conducted to evaluate the reliability of the resulting anisotropic conductive connection structure. Specifically, the conduction resistance of the anisotropic conductive connection structure was measured. The conduction resistance was measured by the four-terminal method using a digital multimeter (product number: Digital Multimeter 7555, manufactured by Yokogawa Electric Corporation), and the conduction resistance (initial conduction resistance) was measured when a current of 1 mA was applied. An initial conduction resistance of 2 Ω or less was rated A (pass), and an initial conduction resistance of more than 2 Ω was rated B (fail). Next, the anisotropic conductive connection structure was held in an environment of a temperature of 85°C and a relative humidity of 85% for 500 hours, and the conduction resistance (conductive resistance after accelerated testing) was measured again. After the accelerated testing, a conduction resistance of 10 Ω or less was rated A, and an initial conduction resistance of more than 10 Ω was rated B. A was a pass, and B was a fail. The results are summarized in Tables 1 to 4.

[0085] <6. Second temporary application test> In the second temporary attachment test, the first electronic component was replaced with a 50 μm thick polyimide film (Toray DuPont, product name: Kapton, dimensions: 4 cm × 3 cm), and the same test as the first temporary attachment test described above was conducted. Table 4 shows the pressure conditions (heating temperature - pressure - pressure time) during temporary attachment.

[0086] <7. Connection strength test> First, the second electronic component was replaced with a 0.5 mm thick glass plate and the above-described full-compression bonding was performed. The full-compression bonding conditions (heating temperature-pressure-pressure time) are summarized in Table 4. A connection structure was thus obtained. Next, the peel strength of the connection structure was measured. The peel strength was measured using a tensile tester (trade name: Tensilon, manufactured by A&D Corporation). Specifically, a polyimide film was cut into a 1 cm width, and a glass plate was placed and fixed horizontally. The polyimide film was then pulled at a 90-degree angle, and the tensile strength (peel strength) at which the polyimide film peeled was measured. A connection strength of 7 N or more was rated A, a connection strength of 2 N or more but less than 7 N was rated B, and a connection strength of less than 2 N was rated C. A was the pass level.

[0087] <8. Discussion> In Experimental Examples 1-1 to 1-7, the release film was a "normal substrate." In Experimental Example 1-1, when temporary attachment was performed by heating, the reliability evaluation test result was unsuccessful. This is presumably because thermal curing progressed during temporary attachment, significantly impairing the fluidity of the connection film during final pressure bonding.

[0088] In Experimental Examples 1-2, 1-4, 1-5, and 1-7, the temporary application test results were unsuccessful. This is presumably due to an insufficient cumulative irradiation amount. However, when further light irradiation was performed in the temporary application test of Experimental Examples 1-2, 1-4, 1-5, and 1-7, passing-level temporary application test results were obtained.

[0089] In Experimental Example 1-3, both the temporary application test results and the reliability evaluation test were passed. The cumulative irradiation amount in Experimental Example 1-3 was the same as in Experimental Example 1-2, but the connection film contained a light absorbing agent. For this reason, it is presumed that the temporary application was performed with sufficient strength. Furthermore, since the hardening of the thermosetting resin hardly progressed during the temporary application test, it is presumed that the connection film flowed sufficiently during the actual pressure bonding, and the conductive particles were sufficiently compressed.

[0090] In Experimental Example 1-6, the temporary application test passed, but the reliability evaluation test failed. The cumulative irradiation amount in Experimental Example 1-6 was the same as in Experimental Example 1-3, but the connection film contained a light absorbing agent. This is presumably why the cumulative irradiation amount was relatively excessive, causing the thermosetting resin to harden during the temporary application test. When the cumulative irradiation amount was reduced in the temporary application test in Experimental Example 1-6, the reliability evaluation test was able to be passed.

[0091] In Experimental Examples 2-1 to 2-3, the release film was a "UV peelable substrate." In Experimental Example 2-1, the temporary application test failed. This is presumably due to an insufficient cumulative irradiation dose. However, when the cumulative irradiation dose was further increased as in Experimental Example 2-2, a pass level temporary application test result was obtained. Similarly, in Experimental Example 2-3, the temporary application test result passed. Note that Experimental Example 2-2 had a lower cumulative irradiation dose than Experimental Example 1-3. It is presumed that because the release film was a "UV peelable substrate," the release film could be peeled off from the connecting film even with a small cumulative irradiation dose (i.e., even if the adhesive strength of the connecting film was low).

[0092] In Experimental Examples 3-1 to 3-5, the connecting film contained a light absorber, and the release film was a "UV peelable substrate." For this reason, it is presumed that temporary attachment was performed with sufficient strength even with a small cumulative irradiation dose, and the release film was able to be peeled off from the connecting film. Note that although the cumulative irradiation dose was the same in Experimental Examples 1-5 and 3-3, the temporary attachment test passed in Experimental Example 3-3. It is presumed that this is because the release film in Experimental Example 3-3 was a "UV peelable substrate."

[0093] In Experimental Examples 4-1 to 4-3, the connection strength was examined. In Experimental Example 4-3, the connection strength after permanent pressure bonding was unacceptable. Because the temporary application test was performed under heat, it is presumed that the thermosetting resin hardened during the temporary application test, preventing sufficient connection strength from being obtained after permanent pressure bonding. In Experimental Examples 4-1 and 4-2, temporary application tests were performed using light irradiation. In Experimental Example 4-1, the connection strength after permanent pressure bonding was acceptable, while in Experimental Example 4-2, the temporary application test failed. It is presumed that this was due to the insufficient cumulative irradiation dose in Experimental Example 4-2, as the release film was a "normal substrate." Therefore, a connection strength test was not performed. However, when further light irradiation was performed in the temporary application test of Experimental Example 4-2, a passing level temporary application test result was obtained. Note that even with a small amount of light, satisfactory performance can be achieved if an auxiliary agent such as a light absorber is used.

[0094] [Table 1]

[0095] [Table 2]

[0096] [Table 3]

[0097] [Table 4]

[0098] Although the preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the present invention is not limited to these examples. It is clear that a person skilled in the art to which the present invention pertains can conceive of various modifications and alterations within the scope of the technical ideas set forth in the claims, and it is understood that these also naturally fall within the technical scope of the present invention. [Explanation of symbols]

[0099] 10 Connecting Film 20 Release film 30 First Electronic Component 40 Secondary Electronic Components 100 Temporary adhesive tool head 200, 200a buffer material 300 Crimping Tool Heads 600 light sources

Claims

1. A method for manufacturing a connection structure that connects a first component and a second component using a connection film, comprising: a release film is provided on one surface of the connection film; Mounting the connection film on the first component so that the other surface of the connection film contacts the first component; a step of temporarily attaching the connection film to the first component at room temperature or without heating by irradiating the release film and the connection film with light, and fixing the connection film onto the first component; peeling the release film from the connection film; Mounting a second component on the connection film; and applying pressure to the second component while heating the connection film, thereby final pressure-bonding the first component and the second component, A method for manufacturing a connection structure, wherein in the temporary attachment step, the release film is cured by irradiating it with light.

2. A method for manufacturing a connection structure that connects a first component and a second component using a connection film, comprising: a release film is provided on one surface of the connection film; Mounting the connection film on the first component so that the other surface of the connection film contacts the first component; a step of temporarily attaching the connection film to the first component at room temperature or without heating by irradiating the release film and the connection film with light, and fixing the connection film onto the first component; peeling the release film from the connection film; Mounting a second component on the connection film; and applying pressure to the second component while heating the connection film, thereby final pressure-bonding the first component and the second component, A method for manufacturing a connection structure, characterized in that in the temporary attachment step, the release film is foamed by irradiating it with light.

3. The method for manufacturing a connection structure according to claim 1 or 2, wherein the light is irradiated from above the release film.

4. 4. The method for manufacturing a connection structure according to claim 1, wherein the peel strength between the release film and the connection film is reduced by light irradiation.

5. the connection film is a resin that can be hardened by heating, The method for manufacturing a connection structure described in any one of claims 1 to 4, characterized in that the connection film contains a polymerizable compound, a heat-curing initiator that initiates curing of the polymerizable compound by heating, and a photo-curing initiator that initiates curing of the polymerizable compound by light irradiation.

6. the connection film is a resin that can be hardened by heating, The method for manufacturing a connection structure described in any one of claims 1 to 4, characterized in that the connection film contains a polymerizable compound and a thermo-photo-curing initiator that initiates curing of the polymerizable compound by either heating or light irradiation.

7. the connection film is a resin that can be hardened by heating, The method for manufacturing a connection structure according to claim 6 , wherein the connection film further contains a photo-curing initiator that initiates curing of the polymerizable compound by irradiation with light.

8. 8. The method for manufacturing a connection structure according to claim 1, wherein the connection film contains a light absorbing agent that generates heat when irradiated with light.

9. the first component and the second component are electronic components; 9. The method for manufacturing a connection structure according to claim 1, wherein the connection film contains conductive particles.

10. A connection film having a release film on one surface for connecting a first component and a second component, the connection film is a resin that can be hardened by heating, the other surface of the connection film that is not supported by the release film can be temporarily attached to the first component at room temperature or without heating by pressing the release film with a tool; The release film is characterized in that the release film is cured by light irradiation after the connection film is temporarily attached to the first component at room temperature or without heating.

11. A connection film having a release film on one surface for connecting a first component and a second component, the connection film is a resin that can be hardened by heating, the other surface of the connection film that is not supported by the release film can be temporarily attached to the first component at room temperature or without heating by pressing the release film with a tool; The connection film is characterized in that the release film is foamed by light irradiation after the connection film is mounted on the first component at room temperature or without heating.

12. The connection film according to claim 10 or 11, wherein the peel strength between the release film and the connection film is reduced by light irradiation.

13. The connection film described in any one of claims 10 to 12, characterized in that it contains a polymerizable compound, a heat-curing initiator that initiates curing of the polymerizable compound by heating, and a photo-curing initiator that initiates curing of the polymerizable compound by irradiating it with light.

14. The connection film described in any one of claims 10 to 12, characterized in that it contains a polymerizable compound and a thermo-photo-curing initiator that initiates curing of the polymerizable compound by either heating or light irradiation.

15. The connecting film according to claim 14 , further comprising a photo-curing initiator that initiates curing of the polymerizable compound by irradiation with light.

16. The connection film according to any one of claims 10 to 15, wherein the connection film contains a light absorbing agent that generates heat when irradiated with light.

17. the first component and the second component are electronic components; The connection film according to any one of claims 10 to 16, characterized in that the connection film contains conductive particles.

Images