Film formation system, film formation system control method, and article manufacturing method

Abstract

To provide a film deposition system capable of performing a series of processes to deposit a film on a substrate using a mask in a shorter time than in the past.SOLUTION: A film deposition system 1 includes a transport carrier 101 that holds a substrate W having a film deposition region and a mask M for shielding a non film deposition region other than the film deposition region and moves in a transport passage 104, transport means that is installed in the transport passage 104 for transporting the transport carrier 101 in a first direction and a second direction crossing the first direction, film deposition units 107A, 107B disposed along the transport passage 104 for depositing a film on the film deposition region of the substrate W, and a mask supply units 109a, 109B disposed along the transport passage 104 for supplying the mask M to the transport carrier 101.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a film formation system, a method for controlling the film formation system, and a method for manufacturing an article. [Background technology]

[0002] Conventionally, vapor deposition apparatuses that deposit a vapor deposition material onto a film formation target such as a glass substrate to form a film have been known. Specifically, organic layer vapor deposition apparatuses that deposit organic layers during the manufacture of organic electroluminescence (EL) display devices (organic EL displays) are known. The application fields of organic EL display devices are expanding beyond smartphones, televisions, and automotive displays to include virtual reality head-mounted displays (VR-HMDs). Organic layer vapor deposition apparatuses include so-called cluster types and in-line types. In in-line type vapor deposition apparatuses, glass substrates for film formation are transported in a line and film is formed in a vapor deposition chamber. Patent Document 1 discloses a vacuum system that deposits (forms a film) an organic material on a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2019-518863 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the device disclosed in Patent Document 1 sometimes requires a long time for the process. [Means for solving the problem]

[0005] The film formation system for solving the above problem includes a transport path extending in a first direction, a substrate having a film formation area, and a mask for shielding a non-film formation area other than the film formation area. holda transport means provided on the transport path and configured to move the transport carrier in the first direction and a second direction intersecting the first direction; a film forming unit disposed along the transport path and configured to form a film in a film forming area of ​​the substrate; and a mask supply unit disposed along the transport path and configured to supply the mask to the transport carrier. The transport carrier is capable of moving the substrate while holding it horizontally through the transport path, the film forming unit, and the mask supply unit. It is characterized by the following.

[0006] A method for controlling a film formation system for solving the above problem includes: a transport path extending in a first direction; a substrate having a film formation area; and a mask for shielding a non-film formation area other than the film formation area. hold a transport means provided on the transport path and configured to move the transport carrier in the first direction and a second direction intersecting the first direction; a film forming unit disposed along the transport path and configured to form a film in a film forming area of ​​the substrate; a mask supply unit disposed along the transport path and configured to supply the mask to the transport carrier; and a control unit. The first transport carrier is capable of moving the substrate while horizontally holding it through the transport path, the film forming unit, and the mask supply unit. A method for controlling a film formation system, comprising the steps of: the control unit transporting the first transport carrier holding the substrate to the mask supply unit; the control unit causing the first transport carrier to hold the mask at the mask supply unit; the control unit transporting the first transport carrier holding the substrate and the mask to the film formation unit; and the control unit forming a film in a film formation area of ​​the substrate held by the first transport carrier via the mask at the film formation unit. [Effects of the Invention]

[0007] According to the above means, a series of processes for forming a film on a substrate using a mask can be completed in a shorter time than conventionally possible. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram illustrating a film forming system according to a first embodiment. [Figure 2] FIG. 2 is a schematic view of a mover according to the first embodiment. [Figure 3] FIG. 2 is a partially enlarged view of the film forming system according to the first embodiment. [Figure 4] FIG. 2 is a schematic view showing a film formation chamber of the first embodiment. [Figure 5] FIG. 2 is a schematic view showing a mask supply chamber of the first embodiment. [Figure 6] FIG. 1 is a schematic diagram showing a control system according to a first embodiment. [Figure 7] 4 is a flowchart of a film formation process using the film formation system of the first embodiment. [Figure 8] 1 is a schematic diagram illustrating a film formation process using a film formation system according to a first embodiment. [Figure 9] 1 is a schematic diagram illustrating a film formation process using a film formation system according to a first embodiment. [Figure 10] 1 is a schematic diagram illustrating a film formation process using a film formation system according to a first embodiment. [Figure 11] 1 is a schematic diagram illustrating a film formation process using a film formation system according to a first embodiment. [Figure 12] 10A and 10B are schematic diagrams showing the movement of the mover after the film formation process is completed. [Figure 13] FIG. 10 is a schematic diagram illustrating a film forming system according to a second embodiment. [Figure 14] FIG. 10 is a schematic diagram showing a modified film forming system. DETAILED DESCRIPTION OF THE INVENTION

[0009] [First embodiment] A film forming system 1 according to a first embodiment will be described below with reference to the drawings.

[0010] Hereinafter, when there is no need to distinguish between components that may exist in multiple numbers, such as the movable element 101, the stator group 103, and the deposition chamber 107, a common numerical symbol will be used, and if necessary, a lowercase alphabet will be added after the numerical symbol to distinguish between the individual components.

[0011] First, we define the coordinate axes, directions, etc. used in the following description. First, the X-axis is taken along the horizontal direction, which is the transport direction of the mover 101, and the transport direction of the mover 101 is taken as the X-direction. The Z-axis is taken along the vertical direction, which is perpendicular to the X-direction, and the vertical direction is taken as the Z-direction. The vertical direction is the direction of gravity (mg direction). The Y-axis is taken along the direction perpendicular to the X-direction and the Z-direction, and the direction perpendicular to the X-direction and the Z-direction is taken as the Y-direction. Furthermore, the rotation direction around the X-axis is taken as the Wx-direction, the rotation direction around the Y-axis is taken as the Wy-direction, and the rotation direction around the Z-axis is taken as the Wz-direction.

[0012] The transport direction of the mover 101 does not necessarily have to be horizontal, but in that case, the transport direction can be defined as the X direction, and the Y and Z directions can be similarly defined. The X, Y, and Z directions are not necessarily limited to directions perpendicular to each other, and can also be defined as directions intersecting each other.

[0013] FIG. 1 is a schematic diagram of a film forming system according to the first embodiment.

[0014] The film formation system 1 has a movable element 101, which is a transport carrier, and a transport section that can transport the movable element 101. The transport section has a load lock chamber 102, a transport path 104, a film formation chamber (film formation section) 107, a mask supply chamber (mask supply section) 109, and a mask discharge chamber (mask discharge section) 119. The load lock chamber 102, the film formation chamber 107, the mask supply chamber 109, and the mask discharge chamber 119 are each connected to the transport path 104 via a gate valve 141.

[0015] (mover) Fig. 2 is a schematic diagram of the mover 101. Fig. 2A is a top view of the mover 101 as seen from the Z direction. Fig. 2B is a side view of the mover 101 as seen from the Y direction.

[0016] The mover 101 is a transport carrier that can be transported within the transport path. The mover 101, which is a transport carrier, has a base 310, and a magnetic material portion 201 is provided on the upper surface of the base 310. The magnetic material portion 201 is, for example, at least one of a permanent magnet group consisting of a plurality of permanent magnets and a ferromagnetic material. The magnetic material portion 201 has magnetic material portions 201A, 201B, 201C, and 201D. The magnetic material portions 201A to 201D exert electromagnetic forces on each other with the stator group 103.

[0017] The magnetic body 201 includes a first magnetic body and a second magnetic body. The first magnetic body, 201A and 201B, are arranged along the X direction. The second magnetic body, 201C and 201D, are arranged along the Y direction. That is, the magnetic body 201 is arranged on the four sides of the mover 101. In FIG. 2A, the number of magnetic body parts provided on the upper surface of the mover 101 is four, but the number and arrangement of the magnetic body parts 201 are not limited to this. The number and arrangement of the magnetic body parts 201 may be any number as long as the position of the mover 101 can be controlled at least in the X and Y directions by the electromagnetic force generated between the magnetic body parts 201A to 201D and the stator group 103. Therefore, the number of the first magnetic body part and the second magnetic body part may be at least one. Furthermore, it is preferable that the position of the mover 101 can also be controlled in the Z direction by the electromagnetic force generated between the magnetic body parts 201A to 201D and the stator group 103. Position control in the Z direction will be described later with reference to FIG. 3.

[0018] The mover 101 has an electrostatic chuck 301 on the underside of the base 310. The electrostatic chuck 301 exerts an attractive force between itself and the workpiece substrate W, thereby holding the substrate W and maintaining the flatness of the substrate W's film-forming surface. Maintaining the flatness of the film-forming surface can reduce alignment errors and improve the quality of the film formed. The substrate W is, for example, a glass substrate. Materials other than glass, such as polymeric films and metals, can also be selected. A glass substrate with a polyimide film or other film laminated thereon may also be used. The electrostatic chuck 301 generates electrostatic force by power supplied from a mover controller 305 (described later), enabling it to hold the substrate W in close contact with the substrate W. Note that the means by which the mover 101 holds the substrate W is not limited to an electrostatic chuck; any known method capable of holding the substrate W horizontally can be used instead. Because the mover 101 holds and transports the substrate W horizontally, alignment with the mask M can be performed in a short time.

[0019] The mover 101 can hold not only the substrate W but also the mask M at the same time. Because the mover 101 transports the substrate W and the mask M simultaneously, the film formation system 1 can perform the film formation process in a shorter time than conventional systems. Furthermore, since there is no need to provide separate robots for transporting the substrate and the mask, the sizes of the film formation chamber 107, the mask supply chamber 109, and the transport path 104 can be reduced. The mask M serves to shield non-film formation areas, which are areas of the substrate W other than the film formation area, during film formation on the substrate W. The mask M can have various opening patterns (mask patterns) depending on the shape of the film (organic layer) to be formed. The mask M is made of, for example, a magnetic material.

[0020] The mover 101 has a permanent magnet plate 302 on the upper surface side of the base 301. The permanent magnet plate 302 exerts an attractive force between itself and the mask M made of a magnetic material, thereby bringing the mask M into close contact with the substrate W. An actuator 304 is provided on the upper surface of the base 310, and the permanent magnet plate 302 can be moved in the Z direction by the actuator 304. When the permanent magnet plate 302 is above the mask M, the attractive force acting between the permanent magnet plate 302 and the mask M is set to be smaller than the gravity acting on the mask M. On the other hand, when the permanent magnet plate 302 is below the mask M, the attractive force acting between the permanent magnet plate 302 and the mask M is set to be larger than the gravity acting on the mask M. In this way, it is possible to control at any timing whether the mask M is brought into close contact with the substrate W.

[0021] The mover 101 has an alignment scope 303. The alignment scope 303 captures images of alignment marks (not shown) formed on the mask M and the substrate W, respectively, and transmits the image data to a mover controller 305. The mover controller 305 detects the amount of misalignment in the X and Y directions between the substrate W and the mask M based on the received image data and using the alignment scope 303 as a reference. The detected amount of misalignment is transmitted from the mover controller 305 to the integrated controller 410.

[0022] The mover 101 has a gap sensor 306 located adjacent to the alignment scope 303. The gap sensor 306 detects the position of the mask M in the Z direction. Since the electrostatic chuck 301 is fixed to the mover 101, when the substrate W is brought into close contact with the electrostatic chuck 301, the distance between the substrate W and the mask M can be calculated from the measurement value of the gap sensor 306.

[0023] The mover 101 has a mover controller 305. The mover controller 305 collects image data and measurement results from the alignment scope 303 and gap sensor 306. It is also capable of supplying power to the electrostatic chuck 301, enabling the electrostatic chuck 301 to stably adsorb to the substrate W. The mover controller 305 is also capable of issuing drive commands to the actuator 304, and is able to control the position of the mask M relative to the substrate W.

[0024] The mover 101 has a mask hook 307 on the side surface in the direction of travel of the base 310. The mask hook 307 has a shape that can engage with a mask bracket 308 to which the mask M is fixed.

[0025] 3 is a partial view of the film forming system 1 focusing on the magnetic material part 201 of the mover 101 and the stator group 103. Using FIG. 3, an example of a means for controlling the position of the mover 101 in the Z direction by an electromagnetic force generated between the magnetic material part 201 and the stator group 103 will be described. Details of the means are also disclosed in Japanese Patent Application Laid-Open No. 2020-28212, in which the present inventor is the inventor.

[0026] The magnetic body part 201A, which is the first magnetic body part, has a first permanent magnet group 501 and a second permanent magnet group 502. The first permanent magnet group 501 is composed of a plurality of first permanent magnets arranged in the X direction so that adjacent magnetic poles have different orientations. The second permanent magnet group 502 is composed of a plurality of second permanent magnets arranged in the Y direction so that adjacent magnetic poles have different orientations. The magnitude of the force generated in the X, Z, and Wy directions of the mover 101 can be controlled by controlling the value of the current applied to the coils of the stator group 103 (first stator group 103A) facing the first permanent magnet group 501. The magnitude of the force generated in the Y direction of the mover 101 can be controlled by controlling the value of the current applied to the coils of the stator group 103 (first stator group 103A) facing the second permanent magnet group 502. In other words, the magnetic body part 201A can control the forces of the mover 101 in the X, Y, Z, and Wy directions.

[0027] For the second magnetic body part, magnetic body part 201C, similarly to magnetic body part 201A, a first permanent magnet group and a second permanent magnet group are arranged, and by controlling the value of the current applied to the coils of stator group 103 (second stator group 103B), it becomes possible to control the magnitude of the force on four axes. In other words, by combining magnetic body part 201A and magnetic body part 201C, it is possible to independently control the force on six axes of mover 101, namely X, Y, Z, Wx, Wy, and Wz.

[0028] In this way, six-axis control of the movable element 101 is possible, so that the movable element 101 can move the film deposition system 1 along the stator group 103, and six-axis alignment operations can be performed in the film deposition chamber 107.

[0029] (Transportation section) The load lock chamber 102 has a stator group 103 and a door 131. The load lock chamber 102 is connected to the transfer path 104 via a gate valve 141A. The door 131 is opened, and a transfer device (not shown) transfers the substrate W into the load lock chamber 102, where the substrate W is attracted to the electrostatic chuck 301 of the mover 101 waiting inside the load lock chamber 102. In the load lock chamber 102, a stator group 103A is disposed extending in the X direction at a position where it can face the magnetic material portions 201A and 201B of the mover 101. Note that although the load lock chamber 102 is disposed in the X direction with respect to the transfer path 104 in FIG. 1, it may be disposed in the Y direction. After the door 131 is closed, the mover 101 is transferred in the X direction by the electromagnetic force generated between the mover 101 and the stator group 103. Moreover, the movable element 101 can enter the transfer path 104 by opening the gate valve 141A.

[0030] The transport path 104 has a stator group 103, the longitudinal direction of which is along the X direction. In other words, the transport path 104 extends in the X direction, which is the first direction. The stator group 103 has a first stator group and a second stator group. The first stator group, stator group 103A, has a plurality of first coils arranged at a predetermined interval in the X direction and is positioned so as to be able to face magnetic material portions 201A and 201B, which are the first magnetic material portions of the mover 101. In FIG. 1, the first stator group, stator group 103A, is composed of two stators spaced at a predetermined interval in the Y direction. The number of stators in stator group 103A is not limited to two, and may be one or three or more depending on the number of magnetic material portions of the mover 101. The second stator group, stator group 103B, has multiple second coils arranged at a predetermined interval in the Y direction and is positioned so as to face magnetic body portions 201C and 201D, which are second magnetic body portions of mover 101. In FIG. 1, there are two stator groups 103B, each consisting of two stators spaced at a predetermined interval in the X direction. The number of stators in stator group 103B is not limited to two and may be one, three, or more depending on the number of magnetic body portions of mover 101. The multiple first coils and multiple second coils may each have a core. Note that in this specification, coils may also be referred to as armatures. When current is applied to the multiple coils, stator group 103 applies a force that moves mover 101 in the direction in which stator group 103 extends (the direction in which the coils are arranged). Furthermore, stator group 103 applies a force that levitates mover 101 in the Z direction relative to stator group 103. Each of the stators has a position and orientation sensor group 401 formed of a plurality of linear encoders. The linear encoders detect the relative position of the mover 101 with respect to the linear encoders by reading a linear scale (not shown) provided on the mover 101.

[0031] 1, there is a point (intersection) on the transport path 104 where the stator group 103A extending in the X direction and the stator group 103B extending in the Y direction intersect. When the mover 101 reaches this intersection while being transported in the X direction, the stator group 103B and the magnetic material part 201C, and the stator group 103B and the magnetic material part 201D, respectively, begin to exert electromagnetic forces on each other. This allows the mover 101 to move not only in the X direction but also in the Y direction.

[0032] The film formation chamber 107 forms a film on the film formation surface (film formation area) of the substrate W transported by the mover 101. Before film formation, the substrate W and the mask M are aligned. The film formation chamber 107 includes a stator group 103B and a vapor deposition source 111. The film formation chamber 107 is connected to the transport path 104 via gate valves 141F and 141G. The vapor deposition source includes a crucible for accommodating the vapor deposition material, a heat source, a shutter, and the like. The film formation method is not limited to vapor deposition, and sputtering, in which the vapor deposition source is replaced with a metal target, may also be used. In FIG. 1, the film formation chamber 107 includes two stator groups 103B, and two movers 101 can be placed therein. While no special partitions or the like are required within the film formation chamber, the right-hand portion in FIG. 1 is referred to as a first processing unit 107R, and the left-hand portion as a second processing unit 107L. The first processing unit 107R and the second processing unit 107L have the same functions. Both the first processing unit 107R and the second processing unit 107L are capable of film formation, and both the first processing unit 107R and the second processing unit 107L are capable of alignment of the substrate W and the mask M.

[0033] FIG. 4 is a schematic cross-sectional view of the second processing unit 107L of the film formation chamber as viewed from the Y direction. Although not shown in FIG. 4, the first processing unit 107R has a similar configuration. The second processing unit 107L has a vacuum vessel 105. In FIG. 4, the vacuum vessel 105 contains a mover 101, a vapor deposition source 111, a bracket 323, an actuator 325, and a portion of a stage 321. The second processing unit 107L has a stage 321 on which a mask M can be placed, and a vapor deposition source 111 that can be moved by an actuator 325 provided on the stage 321. The vapor deposition source 111 can move not only in the Z direction in FIG. 4 but also in the Y and X directions. By moving in the X direction, it can also move to the first processing unit 107R.

[0034] A bracket 323 is provided on the mount 321. The bracket 323 can restrict the motion range of the mover 101 and can receive the mover 101 if, for example, the supply of power to the stator group 103B is stopped during film formation. A second position and orientation sensor group (not shown) formed of a plurality of sensors is provided on the bracket 323, and the second position and orientation sensor group can read the distance of the mover 101 to the sensor target 311 and its pattern. By reading the distance of the mover 101 to the sensor target 311 and its pattern, the position and orientation of the mover 101 are detected and the detection results are sent to the integrated controller 410.

[0035] The mask supply chamber 109 is connected to the transfer path 104 via a gate valve 141B. Unused masks M are stored in the mask supply chamber 109. The mask supply chamber 109 and the film formation chamber 107 are arranged in a straight line along the Y direction. That is, the mask supply chamber 109 is arranged opposite the film formation chamber 107 across the transfer path 104. By arranging the mask supply chamber 109 and the film formation chamber 107 opposite each other, the total movement distance of the mover 101 is shortened, and the film formation process can be shortened. However, the arrangement of the mask supply chamber 109 is not limited to this, and it may also be arranged next to the film formation chamber 107 in the X direction.

[0036] FIG. 5 is a schematic cross-sectional view of the mask supply chamber as viewed from the Y direction. The mask supply chamber 109 includes a stator group 103B, a mask table 331 on which multiple masks M can be stacked, and a mask lifting unit 332 that can move the mask table 331 up and down in the Z-axis direction. The mask supply chamber 109 also includes a vacuum vessel 105. In FIG. 5, the vacuum vessel 105 contains a mover 101, four masks M, the mask table 331, and part of the mask lifting unit 332. In the mask supply chamber 109, the mask lifting unit 332 moves in the +Z direction, thereby moving the mask bracket 308 within the range in which the mover 101 can move in the Z direction. The mask hook 307 of the mover 101 engages with the mask bracket 308, allowing the mover 101 to hold an unused mask M horizontally. When the number of stored masks M reaches 0 or becomes low, the door 110A is opened and the masks M are transported by a transport device (not shown) to replenish the masks M.

[0037] The mask discharge chamber 119 stores used masks M. Its configuration is the same as that of the mask supply chamber 109, and therefore is not shown in the drawing. After multiple film formations, the mover 101 carries the used mask M used in the film formation chamber 107 to the mask discharge chamber 119, where the mask M is stored. The mask discharge chamber 119 and the film formation chamber 107 are linearly arranged along the Y direction. That is, the mask discharge chamber 119 is arranged opposite the film formation chamber 107 via the transport path 104. By arranging the mask discharge chamber 119 and the film formation chamber 107 opposite each other, the total movement distance of the mover 101 is shortened, thereby shortening the film formation process. However, the arrangement of the mask discharge chamber 119 is not limited to this, and it may be arranged next to the film formation chamber 107 in the X direction. When the number of stored masks M reaches the upper limit of the number that can be stored in the mask discharge chamber 119, the door 119A is opened, and the masks M are removed. In this embodiment, the mask discharge chamber 119 is provided independently of the mask supply chamber 109, but the mask supply chamber 109 may also function as the mask discharge chamber 119.

[0038] 1, the film formation chamber 107 is arranged opposite the mask supply chamber 109 and the mask discharge chamber 119. By combining these three devices into one unit and arranging a plurality of units consecutively in the X direction, it is possible to reduce the layout area of ​​the entire film formation system 1. In FIG. 1, the film formation chamber 107A, the mask supply chamber 109A, and the mask discharge chamber 119A form one unit (first unit), and the film formation chamber 107B, the mask supply chamber 109B, and the mask discharge chamber 119B form one unit (second unit).

[0039] (Control System) 6 is a schematic diagram of the control system 3, which is a control unit that controls the operation of the film formation system 1. The control system 3 includes a coil current control unit 402, a mover control unit 403, a mask supply chamber control unit 406, a mask unloading chamber control unit 408, a wireless transmission unit 407, a general controller 410, and a film formation controller 411.

[0040] The integrated controller 410 is connected to the deposition controller 411, the mask supply chamber control unit 406, the mask discharge chamber control unit 408, the mover control unit 403, and the wireless transmission unit 407 so that they can communicate with each other. The integrated controller 410 controls the transportation of the mover 101 and the operations of the mask supply chamber 109 and the mask discharge chamber 119 in response to commands from the deposition controller 411.

[0041] The integrated controller 410 can send a command to the mask supply chamber control unit 406 to control the height of the mask lifting unit 332 of each mask supply chamber 109. The movable element 101 can engage with and transport the mask M controlled to the desired height.

[0042] The integrated controller 410 can send a command to the mask discharge chamber control unit 408 to control the height of the mask lifting unit of each mask discharge chamber 119 .

[0043] The mover control unit 403 calculates a current value for controlling the position and orientation of the mover 101 based on the target position of the mover 101 transmitted from the integrated controller 410 and the position and orientation information of the mover 101 acquired from the position and orientation sensor group 401. The integrated controller 410 commands the calculated current value to the coil current control unit 402. The coil current control unit 402 controls the amount of current in the stator group 103 based on the commanded current value. The current applied to the stator group 103 generates an electromagnetic force between the mover 101 and the magnetic material unit 201 facing it, thereby controlling the position of the mover 101 to the desired position.

[0044] The wireless transmission unit 407 communicates with each mover control unit 403 mounted on the mover 101, collects alignment error information and gap information between the substrate W and mask M, and notifies the integrated controller 410. The integrated controller 410 generates a new target position for the mover 101 based on the measured error information and notifies the mover control unit 403.

[0045] By repeating the above steps, the alignment error between the substrate W and the mask M can be suppressed to a sufficiently small value.

[0046] (Transportation method) Next, we will explain a method for transporting a substrate using the film formation system 1. Fig. 7 is a flowchart showing a film formation process (first step) on a substrate using the film formation system of the first embodiment, and Figs. 8 to 11 are schematic diagrams of each step in the film formation process.

[0047] First, a mover 101A, which is a first mover serving as a transport carrier, is waiting in the load lock chamber 102. After the door 131 is opened, a transport device (not shown) transports the substrate W1 into the load lock chamber 102A. The transported substrate W1 is attracted to the mover 101A by an electrostatic chuck of the mover 101A. After the door 131 is closed, the gate valve 141A is opened. In response to a command from the general controller 410, a current is applied to a plurality of first coils of the stator group 103A extending in the X direction. Electromagnetic force is generated between the mover 101A and the stator group 103A, causing the mover 101A to be transported in the +X direction and enter the transport path 104 ( FIG. 8A ). At this time, the mover 101A may be floating above or in contact with the stator group 103A.

[0048] Next, the mover 101A holding the substrate W1 advances along the transport path 104 in the +X direction to a position facing the first mask supply chamber, 109A (S11, FIG. 8B). The transport path 104 includes not only a stator group 103A (first stator group) extending in the X direction, but also a stator group 103B (second stator group) extending in the Y direction. The mask supply chamber 109 also includes a stator group 103B extending in the Y direction. The stator group 103A and the stator group 103B intersect at a position facing the mask supply chamber 109A, and the mover 101A can change its direction of travel from the X direction to the Y direction at this intersection. As shown in FIG. 8B, a second mover, 101B, holding the substrate W2, may be waiting in the load lock chamber 102 at this time.

[0049] Next, the mover 101A, still holding the substrate W1, is transported in the -Y direction to move to the mask supply chamber 109A. The mask lifting unit 332 in the mask supply chamber shown in FIG. 5 moves the mask table 331 in the +Z direction, causing the mask bracket 308 to move within a range within which the mover 101A can move in the Z direction. Then, the mask hook 307 of the mover 101A engages with the mask bracket 308, causing the mover 101A to hold an unused mask M (first mask) (S12, FIG. 9A). Also, as shown in FIG. 9A, the second mover 101B holding the substrate W2 starts moving in the +X direction.

[0050] Next, the mover 101A, while holding the substrate W1 and the unused mask M, is transported in the +Y direction to the first film formation chamber, film formation chamber 107A. The film formation chamber 107A is located opposite the mask supply chamber 109A across the transport path 104. Therefore, the mover 101A can move from the mask supply chamber 109A to the film formation chamber 107A only by the electromagnetic force generated between the mover 101A and the stator group 103B. The first film formation chamber 107A has a first processing unit 107AR and a second processing unit 107AL, and the mover 101A first moves to the first processing unit 107AR (S13, FIG. 9B). Furthermore, as shown in FIG. 9B, the second mover 101B, holding the substrate W2, moves in the +X direction to a position opposite the mask supply chamber 109A in order to receive the mask M from the mask supply chamber 109A.

[0051] In first processing section 107AR, an alignment operation is performed between substrate W1 and unused mask M. Specifically, first, mover 101A places mask M, which it has been holding, on stage 321. Also, mover 101A is set in a floating state without contacting stage 321 or mask M. Then, mover controller 305, which collects image data of alignment scope 303 of mover 101A and measurement results of gap sensor 306, issues a drive command to actuator 304 to control the position of substrate W in the Z direction relative to mask M. Also, the position and orientation of mover 101A are controlled via integrated controller 410 in accordance with the distance and pattern between second position and orientation sensor group (not shown) provided on bracket 323 and sensor target 311 (S14).

[0052] Next, the second movable element 101B is transported in the -Y direction to the first mask supply chamber 109, where it holds the mask M (second mask) (S15, FIG. 10A). The procedure by which the movable element 101B is supplied with the mask M (second mask) from the first mask supply chamber is the same as the procedure by which the movable element 101A is supplied with the mask M (first mask) from the first mask supply chamber.

[0053] Next, the mover 101B, holding the substrate W2 and the unused mask M, moves to the second processing unit 107AL of the first film formation chamber 107A (S16, FIG. 10B). The mover 101B moves in the +Y direction through the mask supply chamber 109A and returns to the transfer path 104. The electromagnetic forces acting at this time are the stator group 103B and the magnetic material portions 201C and 201D of the mover 101B. The mover 101B then moves in the -X direction through the transfer path 104 to a position facing the second processing unit 107AL of the film formation chamber 107A. The electromagnetic forces acting at this time are the stator group 103A and the magnetic material portions 201A and 201B of the mover 101B. The mover 101B then moves again in the +Y direction through the transfer path 104A and moves to the second processing unit 107AL of the film formation chamber 107A. In this series of operations, mover 101B may be floating above or in contact with stator groups 103A and 103B.

[0054] Next, in second processing section 107AL, an alignment operation is performed between substrate W2 held by movable element 101B and unused mask M (S17, FIG. 11). This alignment operation is performed in the same procedure as the operation for movable element 101A in S14.

[0055] Then, while the alignment operation is being performed on the mover 101B, a film is formed on the mover 101A (S18). The film is formed on the mover 101A while the mover 101A is floating above the mount 321 and the mask M. At this time, it is preferable to continue the alignment operation on the mover 101A during film formation. If the alignment operation is repeated while the mover 101A is being formed, even if the substrate W or mask M becomes misaligned due to temperature fluctuations or the like during film formation, the misalignment can be corrected. In this way, while one mover is being aligned, a film is formed on the other mover, so that the entire film formation process can be completed in a short time. Next, the deposition source 111 moves in the −X direction from the first processing unit 107AR to the second processing unit 107AL. Then, a film is formed on the mover 101B in the second processing unit 107AL (S19). This completes the first step. In this embodiment, film formation (S18) on the substrate held by the movable element 101A is performed after the step of S17, but film formation may also be started after the step of S14 is completed.

[0056] After the film formation work in the first step is completed, the way the mover 101A moves thereafter differs depending on whether the mask M is reused or not. This is because the mask needs to be collected for cleaning etc. after film formation has been performed a predetermined number of times. Figure 12 is a schematic diagram explaining the movement of the mover after the first step is completed.

[0057] When reusing the mask M, the mover 101A is returned to the transport path 104 while the mask M is still placed on the stand 321 of the first processing unit 107AR (FIG. 12A). By leaving the mask M in the first processing unit 107AR, the third mover (not shown), which is introduced into the transport path 104 after the second mover, can move to the film formation chamber 107A without passing through the mask supply chamber 109A. This allows the film formation cycle to be shortened. After returning to the transport path 104, the mover 101A starts moving again in the +X direction, heading for the second mask supply chamber, the mask supply chamber 109B.

[0058] If the mask M is not to be reused, the mover 101A holds the mask M again and returns to the transport path 104 (FIG. 12B). After returning to the transport path 104, the mover 101A moves in the -X and -Y directions toward the mask discharge chamber 119A. After placing the used mask M in the mask discharge chamber 119A, it moves in the +Y and +X directions toward the second mask supply chamber 109B.

[0059] The film formation work for the movable element 101B may be performed either before or after the first movable element performs the operation shown in FIG. 12A or FIG. 12B.

[0060] After the film formation process in the film formation chamber 107A, the movable element 101 is subjected to the film formation process in a second film formation chamber 107B having a deposition source different from that of the film formation chamber 107. By repeating the film formation process multiple times in this manner, an article that is an electronic device is manufactured.

[0061] [Second embodiment] FIG. 13 is a schematic diagram illustrating a film forming system according to the second embodiment.

[0062] In the second embodiment, as in the first embodiment, a permanent magnet group is arranged in the mover 101, and an armature group is arranged in the stator group 103. The armature (coil) uses a copper wire arranged around a ferromagnetic material core, so that a large attractive force acts between the armature group 103 and the magnetic material section 201 even when there is no armature current. Therefore, even a heavy mover can be transported with relatively little power.

[0063] 13A, the magnetic material part 503, which is a ferromagnetic material, is arranged in an area where there is no stator group 103. By arranging the magnetic material part 503 in an area where there is no stator group 103 in this way, it is possible to reduce the change in the attractive force of the stator group 103 with respect to the mover 101 on the transport path. This reduces the cogging force, and the torque of the coil required for transport can be reduced, allowing for more stable transport.

[0064] In the configuration shown in FIG. 13B, a magnetic material portion 504 made of a ferromagnetic material is disposed near the intersection of the stator group 103. The shape of the magnetic material portion 504 is generally triangular, as shown in FIG. 13B. The magnitude of the force acting in the X direction in this configuration when the mover 101 is located at the position shown in the figure will be described below. In this configuration, a large attractive force acts on the magnetic material portion 201D in the +X direction from the stator group 103B. A force in the -X direction acts on the magnetic material portion 201D from the -X side of the magnetic material portion 504. Therefore, the forces in the X direction from the stator group 103B and the magnetic material portion 504 cancel each other out on the magnetic material portion 201D. Therefore, the force acting on the magnetic material portion 210D is smaller than when the magnetic material portion 504 is not present.

[0065] 13C is a diagram schematically showing the magnitudes of the X-direction force Fx, the Y-direction force Fy, and the Z-direction force Fz required to transport the mover 101 at a constant speed. By arranging the magnetic material part 504 near the stator group 103 as in the configuration of FIG. 13B, the attractive force acting on the magnetic material part 201D is canceled out. As a result, the force acting on the magnetic material part 201D can be reduced, and as shown in FIG. 13C, the magnitudes of Fx and Fy can be significantly reduced (702) compared to the case where the magnetic material part 504 is not present (701).

[0066] The shape of the magnetic material part 504 is not limited to the triangular shape shown in Fig. 13B. For example, even if the shape is rectangular, by gradually changing the thickness, it is possible to reduce the change in attractive force in the same way as in the case of a triangular shape.

[0067] By changing the shape of the magnetic material part 504 in this way, it is possible to reduce the torque required for transporting it, and therefore the configuration of the film forming system 1 can be simplified.

[0068] (Other embodiments) The above-described embodiments merely exemplify preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. Furthermore, unless otherwise specified, the hardware and software configurations, processing flow, manufacturing conditions, dimensions, materials, shape, etc. of the device are not intended to limit the scope of the present invention.

[0069] For example, in the first embodiment, the mover 101 has a permanent magnet group, and the stator group 103 has an armature group having a plurality of coils, but this relationship may be reversed. That is, the mover 101 can have an armature group, and the stator group 103 can have a permanent magnet group. In this case, the mover 101 needs to be equipped with a coil current control unit 402.

[0070] Furthermore, in the first embodiment, the stator group 103 is located above the magnetic material portion 201 of the mover 101. However, as shown in FIG. 14, the stator group 103 may be located below the magnetic material portion 201. In this case, a repulsive force is generated between the stator group 103 and the magnetic material portion 201. Therefore, the mover 101 is transported in the X and Y directions while maintaining a non-contact state with the stator group 103. In this case, it is preferable that the stator group 103 uses a coreless coil that does not have an internal iron core. Note that, regarding the positional relationship between the stator group 103 and the magnetic material portion 201, the mover 101 may have an armature group, and the stator group 103 may have a permanent magnet group.

[0071] The present invention is suitable for forming a vapor-deposited film, particularly an organic film, on a film-forming target such as a substrate. The film-forming apparatus is used to deposit and form a thin film on a substrate or a substrate having a laminate formed thereon in the manufacture of various electronic devices such as semiconductor devices, magnetic devices, and electronic components, as well as optical components. More specifically, the film-forming apparatus is preferably used in the manufacture of electronic devices such as light-emitting elements, photoelectric conversion elements, and touch panels. The film-forming apparatus is preferably used in the manufacture of organic light-emitting elements such as organic electroluminescence (EL) elements, and organic photoelectric conversion elements such as organic thin-film solar cells. Examples of electronic devices include display devices (e.g., organic EL display devices) and lighting devices (e.g., organic EL lighting devices) equipped with light-emitting elements, and sensors (e.g., organic CMOS image sensors) equipped with photoelectric conversion elements.

[0072] A program for realizing one or more functions of the above-described embodiments can be provided to a system or device via a network or a recording medium, and can be read and executed by one or more processors in the computer of the system or device. Alternatively, the program can be implemented by a circuit (e.g., ASIC) that implements one or more functions. [Explanation of symbols]

[0073] M Mask W substrate 1. Film deposition system 3. Control System 101 Movable element (transport carrier) 102 Load Lock Chamber 103 Stator group 104 Transport path 105 Vacuum container 107 Film forming chamber (film forming section) 109 Mask supply room (mask supply section) 111 Vapor deposition source 119 Mask discharge chamber (mask discharge section) 131 Door 141 Gate valve 201 Magnetic material part 301 Electrostatic Chuck 302 Permanent Magnet Plate 303 Alignment Scope 304 Actuator 305 Mover Controller 306 Gap Sensor 307 Mask Hook 308 Mask Bracket 310 Base 311 Sensor Target 321 Mounting stand 323 Bracket 325 Actuator 331 Mask stand 332 Mask lifting unit 401 Position and Orientation Sensor Group 402 Coil current control section 403 Mover control unit 406 Mask supply chamber control unit 407 Wireless Transmission Unit 408 Mask discharge chamber control unit 410 Integrated Controller 411 Film Deposition Controller 501 1st permanent magnet group 502 2nd permanent magnet group 503 Magnetic material part 504 Magnetic material part

Claims

1. a conveying path extending in a first direction; a transport carrier that holds a substrate having a film formation area and a mask that shields a non-film formation area other than the film formation area; a film forming unit disposed along the transport path and configured to form a film in a film forming region of the substrate; a mask supply unit disposed along the transport path and configured to supply the mask to the transport carrier; The transport carrier is capable of moving the substrate while horizontally holding it through the transport path, the film forming unit, and the mask supply unit. A film forming system characterized by:

2. 2. The film forming system according to claim 1, wherein the transport carrier holds the substrate horizontally and moves the substrate in the first direction and a second direction intersecting the first direction within the transport path.

3. 3. The film forming system according to claim 1, wherein the film forming unit and the mask supply unit are disposed opposite each other across the transport path.

4. The film formation system according to claim 3 , further comprising a mask discharge unit, the mask discharge unit being disposed adjacent to the mask supply unit and along the transport path.

5. a conveying means provided on the conveying path for moving the conveying carrier in the first direction and the second direction; the conveying means includes a first stator group having a plurality of first coils arranged at predetermined intervals in the first direction, and a second stator group having a plurality of second coils arranged at predetermined intervals in the second direction, the transport carrier has a first magnetic material portion arranged at a position capable of facing the first stator group, and a second magnetic material portion arranged at a position capable of facing the second stator group, 3. The film forming system of claim 2, wherein the transport carrier moves in the first direction and the second direction by an electromagnetic force acting between the first stator group and the first magnetic material portion and an electromagnetic force acting between the second stator group and the second magnetic material portion.

6. 6. The film forming system of claim 5, wherein the transport carrier moves in the first direction and the second direction while levitating relative to the first stator group and the second stator group due to an electromagnetic force acting between the first stator group and the first magnetic material portion and an electromagnetic force acting between the second stator group and the second magnetic material portion.

7. The film forming system according to claim 5 , wherein the film forming unit and the mask supply unit each include the second stator group.

8. The film forming system according to claim 1 , wherein the film forming unit is capable of arranging a plurality of the transport carriers.

9. a conveying path extending in a first direction; a transport carrier for holding a substrate having a film formation region and / or a mask for shielding a non-film formation region other than the film formation region; a film forming unit disposed along the transport path and configured to form a film in a film forming region of the substrate; a mask supply unit that is disposed along the transport path and faces the film forming unit, and that supplies the mask to the transport carrier; The transport carrier is capable of moving the substrate while horizontally holding it through the transport path, the film forming unit, and the mask supply unit. A film forming system characterized by:

10. a first transport carrier that holds a transport path extending in a first direction, a substrate having a film formation area, and a mask that shields a non-film formation area other than the film formation area; a film formation unit that is arranged along the transport path and that forms a film on the film formation area of ​​the substrate; a mask supply unit that is arranged along the transport path and that supplies the mask to the first transport carrier; and a control unit, wherein the first transport carrier is capable of moving the substrate while horizontally holding it through the transport path, the film formation unit, and the mask supply unit, a step in which the control unit transports the first transport carrier holding the substrate to the mask supply unit; a step of the control unit causing the first transport carrier to hold the mask in the mask supply unit; a step in which the control unit transports the first transport carrier holding the substrate and the mask to the film formation unit; a step in which the control unit forms a film on a film formation area of ​​the substrate held by the first transport carrier via the mask in the film formation unit; A method for controlling a film forming system, comprising:

11. 11. A control method for a film formation system according to claim 10, wherein in a process of forming a film on a film formation area of ​​the substrate held by the first transport carrier via the mask in the film formation unit, the control unit levitates the first transport carrier relative to a stand of the film formation unit.

12. the film formation system includes a second transport carrier that moves within the transport path while holding a substrate having a film formation area and a mask that shields a non-film formation area other than the film formation area; a step in which the control unit transports the second transport carrier holding the substrate to the mask supply unit; a step of the control unit causing the second transport carrier to hold the mask in the mask supply unit; the control unit transporting the second transport carrier holding the substrate and the mask to the film forming unit, 12. A method for controlling a film formation system according to claim 10 or 11, wherein in a process of forming a film on a film formation area of ​​the substrate held by the first transport carrier via the mask in the film formation section, the control unit aligns the positions of the mask and the substrate held by the second transport carrier with respect to the second transport carrier.

13. the film formation system includes a third transport carrier capable of transporting a substrate having a film formation area and a mask for shielding a non-film formation area other than the film formation area within the transport path; after a step of forming a film on a film formation region of the substrate held by the first transport carrier via the mask in the film formation unit, the control unit places the mask held by the first transport carrier on a stand of the film formation unit, and then moves the first transport carrier to the transport path; 13. The method for controlling a film formation system according to claim 10, further comprising the step of causing the control unit to transport the third transport carrier to the film formation unit without passing through the mask supply unit.

14. a control method for a film formation system comprising: a transport path extending in a first direction; a transport carrier holding a substrate having a film formation area and / or a mask for shielding a non-film formation area other than the film formation area; a film formation unit disposed along the transport path and forming a film on the film formation area of ​​the substrate; a mask supply unit disposed along the transport path opposite the film formation unit and supplying the mask to the transport carrier; and a control unit, wherein the transport carrier is capable of moving the substrate while horizontally holding it through the transport path, the film formation unit, and the mask supply unit, a step of the control unit causing the transport carrier to hold the mask in the mask supply unit; a step in which the control unit transports the transport carrier holding the mask to the film forming unit; a step in which the control unit transports the transport carrier holding the substrate to the film forming unit; a step in which the control unit forms a film on a film formation area of ​​the substrate held by the transport carrier through the mask in the film formation unit; A method for controlling a film forming system, comprising:

15. A method for manufacturing an article using the film forming system according to any one of claims 1 to 9, comprising: transporting the substrate by the transport carrier; forming a film on a film formation region of the substrate transported by the transport carrier through the mask in the film formation unit; A method for manufacturing an article, comprising:

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