Substrate clamping method, working device, and working system

Abstract

A substrate clamping method of the present disclosure is used for a substrate transport apparatus comprising a substrate sensing sensor for sensing a substrate, wherein, when a work apparatus returns from an operation shut-down state: if the substrate sensing sensor is in a sensing state at the time of return, the substrate is transported in a first direction until a non-sensing state is reached, and the substrate is transported in a second direction to a clamping position on the basis of the substrate sensing sensor having changed from the sensing state to the non-sensing state; if the substrate sensing sensor is in the non-sensing state at the time of return, the substrate is transported in the first direction until the state changes to the sensing state, and the substrate is transported in the second direction to the clamping position on the basis of the substrate sensing sensor having changed from the non-sensing state to the sensing state. When the substrate sensing sensor is in the sensing state at the time of return, or when the substrate sensing sensor is in the non-sensing state at the time of return and when the substrate sensing sensor thereafter has changed to the sensing state, a movable member is moved to a waiting position and waits. Once the substrate is transported to the clamping position, the movable member is contacted with the substrate and pressed against a fixed member.

Description

[Technical Field]

[0001] This specification discloses a substrate clamping method, a working device, and a working system. [Background technology]

[0002] Conventionally, there has been known a method for clamping a board in which a board is clamped by being sandwiched between a movable member used in a working device and a board pressing member positioned at a predetermined position, and which can shorten the waiting time that occurs due to the movement of the movable member. For example, Patent Document 1 discloses a method for clamping a board in which a movable member is placed on standby in advance at an interference avoidance position near the board, where the movable member does not interfere with components mounted on the back surface of the board, and when the board is transported to a board fixing position, the movable member is moved to fix the board by being sandwiched between the movable member and the board pressing member. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 4835573 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the above-mentioned Patent Document 1 does not consider what to do when an abnormality occurs in the working device and the device stops operating. When an abnormality occurs in the working device and the device stops operating, the substrate support member may be retracted to a position that does not interfere with the work so that the worker can check the internal condition of the working device. In this case, depending on the timing of the movement of the movable member after the device restarts operation, it may take some time for the clamping to be completed, resulting in a delay in the restart of operation.

[0005] A primary object of the present disclosure is to shorten the waiting time that occurs due to the movement of a movable member when a working device stops operating and then resumes operating. [Means for solving the problem]

[0006] A first substrate clamping method of the present disclosure includes: 1. A substrate clamping method for a substrate transport device that includes a substrate detection sensor that detects a substrate at an entrance portion, an exit portion, or at least one portion between the entrance portion and the exit portion of a substrate transport path of a working device, and that, when the working device returns from a stopped state, if the substrate detection sensor is in a detection state in which it detects a substrate at the time of return, transports the substrate in a first direction until the substrate detection sensor becomes a non-detection state in which it does not detect the substrate, and transports the substrate in a second direction opposite to the first direction to a clamping position based on the substrate detection sensor changing from the detection state to the non-detection state, and that clamps the substrate transported to the clamping position by pressing the substrate against a fixed member with a movable member, If the substrate detection sensor is in the detection state at the time of the return, the movable member is moved from the predetermined position to a standby position before contacting the substrate, and waits there; When the substrate is transported to the clamp position by the substrate transport device, the movable member is brought into contact with the substrate and pressed against the fixed member.

[0007] In this first substrate clamping method, if the substrate detection sensor is in a detection state when returning, the movable member is moved from a predetermined position to a standby position before contacting the substrate, and waits there. Therefore, the waiting time can be shortened compared to when the substrate is clamped after being transported to the clamping position.

[0008] The second substrate clamping method of the present disclosure includes: a substrate transport device that is provided with a substrate detection sensor that detects a substrate at an entrance or exit of a substrate transport path of a working device, and that, when the working device returns from a stopped state, if the substrate detection sensor is in a non-detection state in which it does not detect a substrate at the time of the return, transports the substrate in a first direction until the substrate detection sensor changes to a detection state in which it detects the substrate, and transports the substrate in a second direction opposite to the first direction to a clamping position based on the change of the substrate detection sensor from the non-detection state to the detection state, and that clamps the substrate transported to the clamping position by pressing the substrate against a fixed member using a movable member, When the substrate detection sensor is in the non-detecting state during the return and then changes to the detecting state, the movable member is moved from a predetermined position to a standby position before contacting the substrate, and waits there; When the substrate is transported to the clamp position by the substrate transport device, the movable member is brought into contact with the substrate and pressed against the fixed member.

[0009] In this second substrate clamping method, when the substrate detection sensor is in a non-detecting state during return and then changes to a detecting state, the movable member is moved from a predetermined position to a standby position before contacting the substrate, and waits there. Therefore, the waiting time can be shortened compared to when the substrate is clamped after being transported to the clamping position.

[0010] A third substrate clamping method of the present disclosure includes: 1. A substrate clamping method for a substrate transport device comprising: a first substrate detection sensor that detects a substrate at an entrance or exit of a substrate carry-in path of a working device; and a second substrate detection sensor that detects a substrate between the entrance and exit; when the working device returns from a stopped state, if the first substrate detection sensor and the second substrate detection sensor are in a non-detection state where they do not detect a substrate at the time of return, the substrate is transported in a first direction until the first substrate detection sensor changes from the non-detection state to a detection state where it detects a substrate; and based on the change of the first substrate detection sensor from the non-detection state to the detection state, the substrate is transported in a second direction opposite to the first direction to a clamp position; and if the second substrate detection sensor is in a detection state where it detects a substrate at the time of return, the substrate is transported in the first direction until the second substrate detection sensor changes to a non-detection state where it does not detect the substrate; and based on the change of the second substrate detection sensor from the detection state to the non-detection state, the substrate is transported in the first direction until the second substrate detection sensor changes to the non-detection state where it does not detect the substrate; when the first substrate detection sensor and the second substrate detection sensor are in the non-detecting state at the time of the return and thereafter the first substrate detection sensor changes from the non-detecting state to the detecting state or when the second substrate detection sensor is in the detecting state at the time of the return, the movable member is moved from a predetermined position to a waiting position before contacting the substrate, and waits; When the substrate is transported to the clamp position by the substrate transport device, the movable member is brought into contact with the substrate and pressed against the fixed member.

[0011] In this third substrate clamping method, when the first substrate detection sensor and the second substrate detection sensor are in a non-detecting state during return and the first substrate detection sensor subsequently changes from a non-detecting state to a detecting state, or when the second substrate detection sensor is in a detecting state during return, the movable member is moved from a predetermined position to a standby position before contacting the substrate, and waits there. Therefore, the waiting time can be shortened compared to when the substrate is clamped after being moved to the clamping position.

[0012] The working device and working system of the present disclosure also achieve the same effects as the first substrate clamping method of the present disclosure. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a schematic configuration diagram of a component mounter 10 according to the present embodiment. [Figure 2] 2 is a schematic diagram of a substrate transfer device 20 and a clamp device 30. FIG. [Figure 3A] 10 is an explanatory diagram of a first substrate detection sensor 81. FIG. [Figure 3B] 10 is an explanatory diagram of a second substrate detection sensor 82. FIG. [Figure 4] FIG. 2 is a block diagram showing the electrical connections of a control device 70. [Figure 5] 10 is a flowchart illustrating an example of a return processing routine. [Figure 6] 10 is a flowchart illustrating an example of a return processing routine. [Figure 7A] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 7B] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 7C] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 7D] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 7E] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 8A]10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 8B] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 8C] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 8D] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 8E] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 9A] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 9B] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 9C] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 9D] 10A to 10C are explanatory diagrams showing the operation of each member during return. [Figure 10A] 10 is a time chart showing the operating states of each member during return. [Figure 10B] 10 is a time chart showing the operating states of each member during return. [Figure 11A] 10 is a time chart showing the operating states of each member during return. [Figure 11B] 10 is a time chart showing the operating states of each member during return. [Figure 12A] 10 is a time chart showing the operating states of each member during return. [Figure 12B] 10 is a time chart showing the operating states of each member during return. DETAILED DESCRIPTION OF THE INVENTION

[0014] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present disclosure will be described with reference to the drawings.

[0015] FIG. 1 is a schematic diagram of a component mounter 10 of this embodiment. FIG. 2 is a schematic diagram of a board transport device 20 and a clamp device 30. FIG. 3 is an explanatory diagram of a first board detection sensor 81 and a second board detection sensor 82. FIG. 4 is a block diagram showing the electrical connections of a control device 70. The left-right direction in FIGS. 1 and 2 is the X-axis direction (the direction perpendicular to the paper surface in FIG. 3 is the X-axis direction), the front (near) and rear (far) direction in FIGS. 1 and 2 is the Y-axis direction (the left-right direction is the Y-axis direction in FIG. 3), and the up-down direction in FIGS. 1 to 3 is the Z-axis direction. FIG. 3A is a diagram showing a cross section cut along a plane passing through the first board detection sensor 81 and parallel to the YZ plane. FIG. 3B is a diagram showing a cross section cut along a plane passing through the second board detection sensor 82 and parallel to the YZ plane.

[0016] 1, the component mounter 10 includes a component supply device 16 that supplies components, a board transport device 20 that transports a board S, a clamping device 30 that clamps the board S, a head 50 that picks up components onto a suction nozzle 51 and mounts them on the board S, an XY robot 40 that moves the head 50 in the X and Y directions, a first board detection sensor 81 (see FIG. 3), a second board detection sensor 82 (see FIG. 3), and a control device 70 (see FIG. 4) that controls the entire mounter. The component supply device 16, the board transport device 20, and the clamping device 30 are installed on a support table 14 provided in the middle section of the housing 12. In addition to these, the component mounter 10 also includes a mark camera 56 that captures an image of a reference mark attached to the board S, a parts camera 58 that captures an image of the suction posture of a component picked up by the suction nozzle 51, and the like. The mark camera 56 is installed on the head 50 or an X-axis slider 42 of the XY robot 40 (to be described later) so that it can be moved in the X and Y directions by the XY robot 40.

[0017] The component supply device 16 is, for example, a tape feeder that supplies components by pulling out a carrier tape, on which components are accommodated at predetermined intervals, from a reel and feeding it to a component supply position.

[0018] The substrate transport device 20 has a substrate transport path extending in the left-right direction (X-axis direction) and is a transport device for transporting a substrate S. For example, as shown in FIG. 2, it is a belt conveyor device that transports the substrate S by a conveyor belt 24. The substrate transport device 20 includes a pair of side frames 22 arranged at a predetermined interval in the Y-axis direction, a conveyor belt 24 provided on each of the pair of side frames 22, and a belt drive device 26 (see FIG. 4) that drives the conveyor belt 24 in a circular motion. Each of the pair of side frames 22 is supported by two support columns 21 aligned in the X-axis direction. Note that the lower ends of the two support columns 21 supporting one of the pair of side frames 22 (the side frame 22 on the right in the figure) are each fitted with a slider 28 that is movable on a guide rail 27 provided on the support base 14 along the Y-axis direction. The substrate transport device 20 is capable of transporting substrates S of different sizes by adjusting the distance between the pair of side frames 22 by moving the two support columns 21. The belt drive device 26 has, for example, a stepping motor that can be driven in both forward and reverse rotation directions. The substrate transport device 20 can transport the substrate S from the downstream side to the upstream side of the substrate transport path (reverse direction, first direction) by driving the belt drive device 26 in the reverse rotation direction to rotate the conveyor belt 24 in the reverse rotation direction. The substrate transport device 20 can transport the substrate S from the upstream side to the downstream side of the substrate transport path (forward direction, second direction) by driving the belt drive device 26 in the forward rotation direction to rotate the conveyor belt 24 in the forward rotation direction. The belt drive device 26 includes a stepping motor, and there is a risk of stepping out if a large load is applied. Therefore, a certain waiting time is set when switching the rotation direction of the substrate S in the substrate transport device 20.

[0019] As shown in Fig. 2, the clamping device 30 is a substrate holding device that holds the edge of the substrate S by sandwiching it between two members (a substrate pressing plate 32 and a clamper 34). The clamping device 30 includes a pair of substrate pressing plates 32 (fixed members) respectively provided at the upper ends of a pair of side frames 22, a pair of clampers 34 (movable members), and an elevating device 36 that raises and lowers the pair of clampers 34 via a support plate 35 by driving a motor 38 (see Fig. 4). The support plate 35 is provided with a plurality of support pins for supporting the back surface of the substrate S when the substrate S is clamped. Therefore, the substrate S is supported by the support pins at the same time as it is clamped by the clamping device 30.

[0020] The clamper 34 has a protrusion 34a that protrudes downward on its lower end surface, and when the support plate 35 is raised by the lifting device 36, the upper surface of the support plate 35 comes into contact with the protrusion 34a and is pushed up.

[0021] The substrate S is placed on the conveyor belt 24 and is transported by driving the conveyor belt 24 in a circular motion (see FIG. 2). Furthermore, when the clamper 34 is raised while the substrate S is transported to a predetermined clamping position by the substrate transport device 20 and placed on the conveyor belt 24, the substrate S is pushed up by the clamper 34 and pressed against the substrate pressure plate 32. As a result, the substrate S is sandwiched between the clamper 34 and the substrate pressure plate 32 and clamped.

[0022] 4, the head 50 is equipped with a Z-axis actuator 52 that moves the suction nozzle 51 up and down (in the Z-axis direction), and a θ-axis actuator 54 that rotates the suction nozzle 51 around the Z-axis. The suction port of the suction nozzle 51 is selectively connected to either a vacuum pump 62 or an air pipe 64 via a solenoid valve 60. By driving the solenoid valve 60 so that the suction port is connected to the vacuum pump 62, the suction nozzle 51 can apply negative pressure to the suction port to pick up a component, and by driving the solenoid valve 60 so that the suction port is connected to the air pipe 64, the suction nozzle 51 can apply positive pressure to the suction port to release the component from suction.

[0023] 1, the XY robot 40 includes a pair of Y-axis guide rails 43 provided on the upper section of the housing 12 along the front-to-back (Y-axis) direction, a Y-axis slider 44 spanned between the pair of Y-axis guide rails 43, an X-axis guide rail 41 provided on the underside of the Y-axis slider 44 along the left-to-right (X-axis) direction, and an X-axis slider 42 movable along the X-axis guide rail 41. The head 50 is attached to the X-axis slider 42 and can be moved to any position on the XY plane by the XY robot 40. The X-axis slider 42 is driven by an X-axis actuator 46 (see FIG. 4), and the Y-axis slider 44 is driven by a Y-axis actuator 48 (see FIG. 4).

[0024] As shown in FIG. 3A, the first board detection sensor 81 is provided at the entrance of the board transport path (board transport device 20) of the component mounter 10. The first board detection sensor 81 is, for example, a transmission-type optical sensor including a light-emitting unit 81a and a light-receiving unit 81b provided at positions facing each other across the board transport path. The light-emitting unit 81a is provided on the inner surface of one of the opposing side frames 22. The light-receiving unit 81b is provided on the inner surface of the other of the pair of side frames 22. The first board detection sensor 81 may also be a reflective-type optical sensor. If there is something (e.g., the board S) between the light-emitting unit 81a and the light-receiving unit 81b that blocks the light from the light-emitting unit 81a and the light-receiving unit 81b does not receive the light from the light-emitting unit 81a, the first board detection sensor 81 outputs a signal indicating that the board S has been detected to the control device 70 (see FIG. 4). On the other hand, if there is nothing between the light-emitting unit 81a and the light-receiving unit 81b that blocks the light from the light-emitting unit 81a and the light-receiving unit 81b receives the light from the light-emitting unit 81a, the first substrate detection sensor 81 outputs a signal to the control device 70 indicating that it is in a non-detection state in which the substrate S is not being detected.

[0025] As shown in FIG. 3B , the second board detection sensor 82 is provided between the entrance and exit (center) of the board transport path (board transport device 20) of the component mounter 10. The second board detection sensor 82 is, for example, a transmission-type optical sensor including a light-emitting unit 82a and a light-receiving unit 82b provided at opposing positions across the board transport path. The light-emitting unit 82a is provided on the inner surface of one of a pair of opposing side frames 22. The light-receiving unit 82b is provided on the inner surface of the other of the pair of side frames 22. The second board detection sensor 82 may also be a reflective-type optical sensor. If there is something (e.g., the board S) between the light-emitting unit 82a and the light-receiving unit 82b that blocks the light from the light-emitting unit 82a and the light-receiving unit 82b does not receive the light from the light-emitting unit 82a, the second board detection sensor 82 outputs a signal indicating that the board S has been detected to the control device 70 (see FIG. 4 ). On the other hand, if there is nothing between the light-emitting unit 82a and the light-receiving unit 82b that blocks the light from the light-emitting unit 82a and the light-receiving unit 82b receives the light from the light-emitting unit 82a, the second substrate detection sensor 82 outputs a signal to the control device 70 indicating that it is in a non-detection state in which it is not detecting the substrate S.

[0026] 4, the control device 70 includes a CPU 71, a ROM 72, a storage 73 (e.g., an HDD or SSD), a RAM 74, and an input / output interface 75. These are electrically connected via a bus 76. Various signals are input to the control device 70 via the input / output interface 75 from the elevation position sensor 37 that detects the elevation position of the clamper 34 (clamper position), the X-axis position sensor 47 that detects the position of the X-axis slider 42, the Y-axis position sensor 49 that detects the position of the Y-axis slider 44, the Z-axis position sensor 53 that detects the elevation position of the suction nozzle 51 (the elevation position of the component picked up by the suction nozzle 51), the mark camera 56, the parts camera 58, the first board detection sensor 81, the second board detection sensor 82, and the like. On the other hand, the control device 70 outputs various control signals to the component supply device 16, the belt drive device 26, the lifting device 36 (drive circuit that drives the motor 38), the X-axis actuator 46, the Y-axis actuator 48, the Z-axis actuator 52, the θ-axis actuator 54, the solenoid valve 60, etc. via the input / output interface 75.

[0027] Next, the operation of the component mounter 10 of this embodiment configured as described above will be described. First, the mounting operation in which the component mounter 10 mounts a component on the board S will be described. The mounting operation routine is stored in the storage 73 and is started after an operator inputs a mounting start command. When the mounting operation starts, the CPU 71 controls the board transport device 20 to transport the board S. Next, once the board S has been transported to the clamping position, the CPU 71 controls the clamping device 30 to clamp the board S. Next, the CPU 71 causes the suction nozzle 51 of the head 50 to pick up a component supplied from the component supply device 16. Specifically, the CPU 71 controls the X-axis actuator 46 and the Y-axis actuator 48 to move the suction nozzle 51 to a position directly above the component suction position of the desired component. Next, the CPU 71 controls the Z-axis actuator 52 and the solenoid valve 60 to lower the suction nozzle 51 and apply negative pressure to the suction port of the suction nozzle 51. This causes the desired component to be picked up by the suction nozzle 51. The CPU 71 then raises the suction nozzle 51 and controls the X-axis actuator 46 and Y-axis actuator 48 to move the suction nozzle 51, which has picked up a component at its tip, above the target mounting position on the board S. At that predetermined position, the CPU 71 controls the Z-axis actuator 52 and solenoid valve 60 to lower the suction nozzle 51 and apply positive pressure to the suction port of the suction nozzle 51 to release the component from suction. This releases the component that was picked up by the suction nozzle 51 and mounts it at a predetermined position on the board S. Other components to be mounted on the board S are mounted on the board S in the same manner, and when mounting of all components is complete, the CPU 71 performs a component presence inspection. The CPU 71 then controls the board transport device 20 to send the board S downstream.

[0028] Next, we will explain the work that an operator performs on the component mounter 10 when an abnormality occurs, such as a component picked up by the suction nozzle 51 falling while the component mounter 10 is performing the component mounting process described above. When an abnormality occurs, the CPU 71 controls various components to stop the operation of the component mounter 10 and also controls an alarm device (not shown) to notify the operator that an abnormality has occurred in the component mounter 10. The operator, noticing the alarm, inputs a clamp release command to the control device 70. Upon inputting the clamp release command, the CPU 71 controls the clamp device 30 to release the clamp on the board S and retract the clamper 34 and support plate 35 to a position that will not interfere with the operator's work, allowing the operator to check the internal condition of the board transport device 20. The operator then checks the internal condition of the board transport device 20, performs the necessary work (such as removing the dropped component or performing maintenance), performs the required recovery work to restore operation, and inputs a recovery request to the control device 70.

[0029] Next, the recovery process when the component mounter 10 is recovered from a stopped state will be described with reference to FIGS. 5 to 12. FIGS. 5 and 6 are flowcharts showing an example of a recovery process routine. FIGS. 7 and 10 are, respectively, an explanatory diagram showing the operation of each component when the second board detection sensor 82 is in a detecting state at the time of recovery, and a time chart showing the operating state of each component when the second board detection sensor 82 is in a detecting state at the time of recovery. FIGS. 8 and 11 are, respectively, an explanatory diagram showing the operation of each component when the second board detection sensor 82 is in a non-detecting state and the first board detection sensor 81 is in a detecting state at the time of recovery, and a time chart showing the operating state of each component when the second board detection sensor 82 is in a non-detecting state and the first board detection sensor 81 is in a detecting state at the time of recovery. 9 and 12 are respectively an explanatory diagram showing the operation of each component when the second board detection sensor 82 is in a non-detecting state at the time of recovery and then the first board detection sensor 81 changes to a detecting state, and a time chart showing the operating state of each component when the second board detection sensor 82 is in a non-detecting state at the time of recovery and then the first board detection sensor 81 changes to a detecting state. The recovery processing routine is stored in the storage 73 and is executed when the mounter 10 recovers from a stopped state. The recovery time refers to the timing when a recovery request is input by the operator.

[0030] When this routine starts, the CPU 71 determines whether or not a signal indicating a detection state has been input from the second substrate detection sensor 82 (S100). If the substrate S is blocking the light from the light-emitting portion 82a of the second substrate detection sensor 82 as shown in Fig. 7A, the CPU 71 inputs a signal from the second substrate detection sensor 82 indicating a detection state in which the substrate S is detected, and makes a positive determination. If the substrate S is not blocking the light from the light-emitting portion 82a of the second substrate detection sensor 82 as shown in Figs. 8A and 9A, the CPU 71 inputs a signal from the second substrate detection sensor 82 indicating a non-detection state in which the substrate S is not detected, and makes a negative determination.

[0031] If the determination in S100 is affirmative, the CPU 71 starts the process of moving the clamper 34 (S110), as shown in FIG. 7B. This process of moving the clamper 34 is executed, for example, as follows. That is, first, the CPU 71 detects the current position of the clamper 34 using the elevation position sensor 37. Then, the CPU 71 drives and controls the motor 38 of the elevation device 36 by position control so that the clamper 34 moves upward. The position control is performed by controlling the drive of the motor 38 by feedback control (such as PI control) based on the deviation between the position of the clamper 34 detected by the elevation position sensor 37 and the standby position so that the position coincides with the standby position. Here, the standby position is set to the position before the clamper 34 comes into contact with the substrate S. Therefore, it takes a certain amount of time for the clamper 34 to reach the standby position after it starts to move upward.

[0032] Next, the CPU 71 executes a reverse direction transport process (S120). Specifically, the CPU 71 controls the belt drive device 26 to drive in the reverse rotation direction, thereby driving the conveyor belt 24 in the reverse rotation direction to transport the substrate S in the reverse direction. Next, as shown in FIG. 7C, the CPU 71 waits until the substrate S is transported in the reverse direction and a signal indicating that the second substrate detection sensor 82 has entered a non-detection state is input (S130). Next, the CPU 71 detects the position of the substrate S relative to the substrate transport device 20 based on the signal indicating that the second substrate detection sensor 82 has entered a non-detection state being input (S135). After S135, the CPU 71 proceeds to S230.

[0033] On the other hand, if a negative determination is made in S100, the CPU 71 determines whether or not a signal indicating a detection state has been input from the first board detection sensor 81 (S140). If the board S is blocking the light from the light-projecting portion 81a of the first board detection sensor 81 as shown in Fig. 8A, the CPU 71 inputs a signal from the first board detection sensor 81 indicating a detection state in which the board S is detected, and makes a positive determination. On the other hand, if the board S is not blocking the light from the light-projecting portion 81a of the first board detection sensor 81 as shown in Fig. 9A, the CPU 71 inputs a signal from the first board detection sensor 81 indicating a non-detection state in which the board S is not detected, and makes a negative determination.

[0034] If the determination in S140 is affirmative, the CPU 71 starts the movement process of the clamper 34 as shown in FIG. 8B (S150). Next, the CPU 71 executes the reverse direction transport process of the substrate S (S160). The movement process of the clamper 34 and the reverse direction transport process have been described above. Next, as shown in FIG. 8C, the CPU 71 waits until the substrate S is transported in the reverse direction and a signal indicating that the first substrate detection sensor 81 has entered a non-detection state is input (S170). Subsequently, the CPU 71 detects the position of the substrate S relative to the substrate transport device 20 based on the input of the signal indicating that the first substrate detection sensor 81 has entered a non-detection state (S175). After S175, the CPU 71 proceeds to S230.

[0035] On the other hand, if a negative determination is made in S140, the CPU 71 executes the reverse direction conveying process (S180) as shown in FIG. 9B. The reverse direction conveying process has already been described. Next, the CPU 71 determines whether or not a signal indicating that the first substrate detection sensor 81 is in a detection state has been input from the first substrate detection sensor 81 (S190). Here, the CPU 71 executes the same process as S140.

[0036] If a negative determination is made in S190, the CPU 71 determines whether a predetermined time has elapsed since the start of the processing of S180 (S200). If a negative determination is made in S200, the CPU 71 returns to S190 again. On the other hand, if a positive determination is made in S200, the CPU 71 determines that there is no substrate S in the substrate transport device 20 (S205), and stops driving the belt drive device 26 (S210).

[0037] On the other hand, as shown in FIG. 9B, if the substrate S is transported in the reverse direction and a signal indicating that the first substrate detection sensor 81 has entered a detection state is input, an affirmative determination is made in S190, and the CPU 71 starts the process of moving the clamper 34 (S220) as shown in FIG. 9C. The process of moving the clamper 34 has already been described. Next, the CPU 71 detects the position of the substrate S relative to the substrate transport device 20 based on the signal indicating that the first substrate detection sensor 81 has entered a detection state (S225). After S135, S175, or S225, the CPU 71 executes the process of switching the transport direction of the belt drive device 26 (S230). Specifically, the CPU 71 controls the drive of the belt drive device 26 so that the drive direction of the belt drive device 26 switches from the reverse rotation direction to the forward rotation direction, thereby switching the transport direction of the substrate transport device 20 from the reverse direction to the forward direction. As described above, a certain waiting time is required to switch the transport direction.

[0038] Next, the CPU 71 executes a forward direction transport process (S240), as shown in FIGS. 7D, 8D, and 9C. Specifically, the CPU 71 controls the drive of the belt drive device 26 so that the belt drive device 26 rotates in the forward direction, and drives the conveyor belt 24 in the forward direction to transport the substrate S in the forward direction. Next, the CPU 71 waits until the substrate S reaches the clamp position (S250). Specifically, the CPU 71 waits until the substrate S has been transported in the forward direction by a predetermined transport distance. Here, the transport distance is determined based on the size information of the substrate S.

[0039] Here, as shown in FIGS. 10 to 12, the movement time from when the movement process of the clamper 34 is started until the clamper 34 reaches the standby position is longer than the transport time from when the CPU 71 switches the transport direction of the substrate transport device 20 from reverse to forward in S230 until the substrate S is transported to the clamp position. Furthermore, the movement time of the clamper 34 is shorter than the sum of the waiting time required for the substrate transport device 20 to switch the transport direction from reverse to forward and the transport time of the substrate S. Therefore, if the movement process of the clamper 34 is started at the timing shown in FIGS. 10A, 11A, and 12A (the timing of S110, S150, or S220), the clamper 34 will reach the standby position before the substrate S reaches the clamp position. Therefore, during the period from when the clamper 34 reaches the standby position until the substrate S reaches the clamp position, the CPU 71 controls the drive of the motor 38 of the lifting device 36 so that the clamper 34 waits at the standby position, as shown in FIGS. 7D, 8D, and 9C. In this way, the clamper reaches the standby position before the board S reaches the clamp position. Therefore, in the component mounter 10, there is no waiting time due to the movement of the clamper 34, as shown in Figures 10B, 11B, and 12B.

[0040] 7E, 8E, and 9D, the CPU 71 executes the clamping process for the substrate S. Specifically, the CPU 71 drives and controls the motor 38 of the lifting device 36 by torque control so that the clamper 34 presses and clamps the substrate S against the substrate presser plate 32. The torque control is performed by feedback control based on a current from a current sensor (not shown) provided in the drive circuit so that a predetermined target current is applied to the motor 38. The CPU 71 then completes the clamping process after confirming that the detected value of the clamp position of the clamper 34 detected by the lifting position sensor 37 has not changed for a certain period of time. After S210 or S260, the CPU 71 ends this routine.

[0041] Here, the correspondence between the main elements of this embodiment and the main elements of the invention described in the Disclosure of the Invention section will be explained. That is, the component mounter 10 of this embodiment corresponds to the working device of the present disclosure, the board transport device 20 corresponds to the board transport device of the present disclosure, the clamping device 30 corresponds to the clamping device, the board presser plate 32 corresponds to the fixed member, the clamper 34 corresponds to the movable member, the first board detection sensor 81 corresponds to the first board detection sensor, the second board detection sensor 82 corresponds to the second board detection sensor, and the control device 70 corresponds to the transport control unit and the clamping control unit.

[0042] In the component mounter 10 described above, if the first board detection sensor 81 and the second board detection sensor 82 are in a non-detecting state upon return, when the first board detection sensor 81 changes from a non-detecting state to a detecting state or when the second board detection sensor 82 is in a detecting state upon return, the clamping device 30 is controlled to move the clamper 34 to a standby position before contacting the board S and wait there. Therefore, compared to when the board S is clamped after being moved to the clamping position, the waiting time due to the movement of the clamper 34 can be shortened.

[0043] Furthermore, in the component mounter 10, the board transport device 20 can transport the board in both forward and reverse directions using a belt drive device 26 that can be driven in both forward and reverse rotation directions, and a waiting time occurs when switching between the forward and reverse directions. The movement time for the clamper 34 to move from a predetermined position to a standby position is longer than the transport time from when the transport direction of the board S switches from the reverse direction to the forward direction until the board is transported to the clamp position, and is shorter than the sum of the wait time until the transport direction switches from the reverse direction to the forward direction and the transport time. Therefore, no waiting time occurs due to the movement of the clamper 34.

[0044] In the above-described embodiment, the first board detection sensor 81 is provided at the entrance of the board transport path in the mounter 10. However, the first board detection sensor 81 may be provided at the exit of the board transport path in the mounter 10. In this case, in S160 and S180, the forward direction transport process may be executed instead of the reverse direction transport process. In this case, when a negative determination is made in S100 and a positive determination is made in S140, and the process proceeds to S230 via S150 to S175, or when negative determinations are made in S100 and S140, and the process proceeds to S230 via S180, S190, S220, and S225, the transport direction may be switched from the forward direction to the reverse direction in S230.

[0045] In the above-described embodiment, the mounter 10 has two board detection sensors, the first board detection sensor 81 and the second board detection sensor 82. However, the mounter 10 may have one board detection sensor at either the entrance or exit of the board transport path, or at a location between them (the center). In a modified example of the mounter 10 in which the board detection sensor is provided at the center, the CPU 71 determines whether the board detection sensor is in a detecting state at the time of return. If the board detection sensor is in a detecting state, the CPU 71 starts the movement process of the clamper 34, performs the reverse transport process until the board detection sensor becomes non-detecting, and then performs the same processes as S230 to S260 of the return process routine in the above-described embodiment. On the other hand, if the board detection sensor is in a non-detecting state at the time of return, the CPU 71 ends the return process. In a modified example of the mounter 10 in which the board detection sensor is provided at the entrance of the board transport path, the CPU 71 determines whether the board detection sensor is in a detecting state at the time of return. Therefore, if the board detection sensor is in a detecting state, the CPU 71 starts the movement process of the clamper 34, performs the reverse direction conveyance process until the board detection sensor is in a non-detecting state, and then executes the same processes as S230 to S260 of the return process routine in the above-described embodiment. On the other hand, if the board detection sensor is in a non-detecting state at the time of return, the CPU 71 executes the reverse direction conveyance process to detect the board, then starts the movement process of the clamper 34, and executes the same processes as S230 to S260 of the return process routine in the above-described embodiment. Furthermore, in a modified example of the mounter 10 in which the board detection sensor is provided at the outlet of the board conveyance path, in the return process, the CPU 71 determines whether the board detection sensor is in a detecting state at the time of return. Therefore, if the substrate detection sensor is in a detecting state, the CPU 71 starts the movement process of the clamper 34, performs the forward transport process until the substrate detection sensor becomes non-detecting, and after detecting the substrate, switches the transport direction of the substrate transport device 20 from the forward direction to the reverse direction, performs the reverse transport process of the substrate S, and performs the same processes as S250 and S260 of the return processing routine in the above-mentioned embodiment.On the other hand, if the board detection sensor is in a non-detecting state during recovery, the CPU 71 executes a forward-direction transport process. Upon detecting the board, the CPU 71 starts a process for moving the clamper 34, switches the transport direction of the board transport device 20 from the forward direction to the reverse direction, and executes a process for transporting the board S in the reverse direction, performing the same processes as S250 and S260 of the recovery process routine in the above-described embodiment. In these modified examples of the mounter 10, when the board detection sensor is in a detecting state during recovery or when the board detection sensor is in a non-detecting state during recovery and then changes to a detecting state, the clamper 34 is moved from a predetermined position to a target position and waits. Therefore, the waiting time can be shortened compared to when the board is clamped after being transported to the clamping position. Note that when the board S transported by the board transport device 20 is relatively large, the board detection sensor is preferably provided at the entrance or exit of the board transport path. When the board S transported by the board transport device 20 is relatively small, the board detection sensor is preferably provided in the center.

[0046] Furthermore, in the above-described embodiment, the component mounter 10 has been described as an example, but it may also be, for example, a method for clamping the board S. Furthermore, in the above-described embodiment, the board transport device 20 is incorporated into the component mounter 10, but the board transport device 20 may be provided separately from the component mounter. In that case, the component mounter 10 described in the above-described embodiment may be a component mounting system including the component mounter and the board transport device 20. Furthermore, in the above-described embodiment, the working device of the present disclosure has been described as a component mounter 10, but it may also be a printing device that prints solder on the board S. Note that these points are the same in the above-described modified examples.

[0047] Furthermore, in the above-described embodiment, the CPU 71 executes the reverse direction transport process of the substrate S in S120, S160, or S180. However, the CPU 71 may execute the forward direction transport process instead of the reverse direction transport process in S120, S160, or S180. In that case, instead of S190, the CPU 71 may determine whether the second substrate detection sensor 82 is in the detection state, and proceed to S200 if a negative determination is made, or proceed to S220 if a positive determination is made. In that case, the CPU 71 may switch the transport direction of the substrate S from the forward direction to the reverse direction in the transport direction switching process executed in S230, and execute the reverse direction transport process of the substrate S instead of the forward direction transport process of the substrate S executed in S240. [Industrial Applicability]

[0048] The present disclosure can be used in the component mounting machine manufacturing industry and the like. [Explanation of symbols]

[0049] 1 component mounter, 12 housing, 14 support stand, 16 component supply device, 20 board transport device, 21 support column, 22 side frame, 24 conveyor belt, 26 belt drive device, 27 guide rail, 28 slider, 30 clamp device, 32 board pressing plate, 34 clamper, 34a protrusion, 35 support plate, 36 lifting device, 37 lifting position sensor, 38 motor, 40 XY robot, 41 X-axis guide rail, 42 X-axis slider, 43 Y-axis guide rail, 44 Y-axis slider, 46 X-axis actuator, 47 X-axis position sensor, 48 Y-axis actuator, 49 Y-axis position sensor, 50 head, 51 suction nozzle, 52 Z-axis actuator, 53 Z-axis position sensor, 54 θ-axis actuator, 56 mark camera, 58 parts camera, 60 solenoid valve, 62 vacuum pump, 64 air piping, 70 Control device, 71 CPU, 72 ROM, 73 storage, 74 RAM, 75 input / output interface, 76 bus, 81 first board detection sensor, 81a light-emitting unit, 81b light-receiving unit, 82 second board detection sensor, 82a light-emitting unit, 82b light-receiving unit, S board.

Claims

1. 1. A substrate clamping method for a substrate transport device that includes a substrate detection sensor for detecting a substrate at an entrance portion, an exit portion, or at least one portion between the entrance portion and the exit portion of a substrate transport path of a working device, and that, when the working device returns from a stopped state, if the substrate detection sensor is in a detection state in which it detects a substrate at the time of return, transports the substrate in a first direction until the substrate detection sensor becomes a non-detection state in which it does not detect the substrate, and transports the substrate in a second direction opposite to the first direction to a clamping position based on the substrate detection sensor changing from the detection state to the non-detection state, and that clamps the substrate transported to the clamping position by pressing the substrate against a fixed member with a movable member, If the substrate detection sensor is in the detection state at the time of the return, the movable member is moved from the predetermined position to a standby position before contacting the substrate, and waits there; When the substrate is transported to the clamp position by the substrate transport device, the movable member is brought into contact with the substrate and pressed against the fixed member. How to clamp the board.

2. a substrate clamping method for a substrate transport device that includes a substrate detection sensor that detects a substrate at an entrance or exit of a substrate transport path of a working device, and that, when the working device returns from a stopped state, if the substrate detection sensor is in a non-detecting state in which it does not detect a substrate at the time of the return, transports the substrate in a first direction until the substrate detection sensor changes to a detecting state in which it detects the substrate, and, based on the change of the substrate detection sensor from the non-detecting state to the detecting state, transports the substrate in a second direction opposite to the first direction to a clamping position, and clamps the substrate transported to the clamping position by pressing it against a fixed member using a movable member, retracting the movable member to a predetermined position in response to the operation of the working device being stopped, and when the substrate detection sensor is in the non-detecting state at the time of the return and then changes to the detecting state, moving the movable member from the predetermined position to a standby position before contacting the substrate, and waiting; When the substrate is transported to the clamp position by the substrate transport device, the movable member is brought into contact with the substrate and pressed against the fixed member. How to clamp the board.

3. a substrate clamping method for a substrate transport device comprising: a first substrate detection sensor that detects a substrate at an entrance or exit of a substrate carry-in path of a working device; and a second substrate detection sensor that detects a substrate between the entrance and exit; when the working device returns from a stopped state, if the first substrate detection sensor and the second substrate detection sensor are in a non-detection state where they do not detect a substrate at the time of return, the substrate is transported in a first direction until the first substrate detection sensor changes from the non-detection state to a detection state where it detects a substrate; and based on the change of the first substrate detection sensor from the non-detection state to the detection state, the substrate is transported in a second direction opposite to the first direction to a clamp position; and if the second substrate detection sensor is in a detection state where it detects a substrate at the time of return, the substrate is transported in the first direction until the second substrate detection sensor changes to a non-detection state where it does not detect the substrate; and based on the change of the second substrate detection sensor from the detection state to the non-detection state, the substrate is transported in the first direction until the second substrate detection sensor changes to a non-detection state where it does not detect the substrate; when the first substrate detection sensor and the second substrate detection sensor are in the non-detecting state at the time of the return and thereafter the first substrate detection sensor changes from the non-detecting state to the detecting state or when the second substrate detection sensor is in the detecting state at the time of the return, the movable member is moved from a predetermined position to a waiting position before contacting the substrate, and waits; When the substrate is transported to the clamp position by the substrate transport device, the movable member is brought into contact with the substrate and pressed against the fixed member. How to clamp the board.

4. 4. The method for clamping a substrate according to claim 1, further comprising: the substrate transport device is capable of transporting a substrate in a first direction and a second direction opposite to the first direction by a motor that can be driven in both forward and reverse rotation directions, and a waiting time occurs when switching between the first direction and the second direction; a movement time required for the movable member to move from the predetermined position to a standby position before contacting the substrate is longer than a transport time required for the substrate to be transported to the clamp position after the transport direction of the substrate is switched from the first direction to the second direction, and shorter than the sum of a waiting time required for the transport direction to be switched from the first direction to the second direction and the transport time; How to clamp the board.

5. a substrate transport device that transports a substrate; a clamping device having a movable member and a fixed member that clamps the substrate between the movable member and the fixed member; a substrate detection sensor provided at least at an entrance portion, an exit portion, or a portion between the entrance portion and the exit portion of the substrate transport path, for detecting a substrate; a transport control unit that, when returning from a stopped state, controls the substrate transport device so that the substrate is transported in a first direction if the substrate detection sensor is in a detection state where it detects the substrate at the time of return, until the substrate detection sensor is in a non-detection state where it does not detect the substrate, and controls the substrate transport device so that the substrate is transported in a second direction opposite to the first direction to a clamp position based on the substrate detection sensor changing from the detection state to the non-detection state; a clamp control unit that controls the clamp device so that, if the substrate detection sensor is in the detection state at the time of the return, the movable member moves from a predetermined position to a standby position before contacting the substrate and waits there, and controls the clamp device so that the movable member presses the substrate transported to the clamp position against a fixed member; and A working device comprising:

6. a substrate transport device that transports a substrate; a working device that performs work on the substrate; a clamping device having a movable member and a fixed member that clamps the substrate between the movable member and the fixed member; a substrate detection sensor provided at least at an entrance portion, an exit portion, or a portion between the entrance portion and the exit portion of the substrate transport path, for detecting a substrate; a transport control unit that, when returning from a stopped state, controls the substrate transport device so that the substrate is transported in a first direction if the substrate detection sensor is in a detection state where it detects the substrate at the time of return, until the substrate detection sensor is in a non-detection state where it does not detect the substrate, and controls the substrate transport device so that the substrate is transported in a second direction opposite to the first direction to a clamp position based on the substrate detection sensor changing from the detection state to the non-detection state; a clamp control unit that controls the clamp device so that, if the substrate detection sensor is in the detection state at the time of the return, the movable member moves from a predetermined position to a standby position before contacting the substrate and waits there, and controls the clamp device so that the movable member presses the substrate transported to the clamp position against a fixed member; and A working system with.

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