Substrate processing apparatus and substrate processing method

Abstract

To improve throughput in a substrate processing apparatus and to suppress the exclusive floor area thereof.SOLUTION: A substrate processing apparatus comprises: a carrier block comprising a plurality of carrier mounting portions each of which includes a substrate carry-in / carry-out carrier mounting portion; a processing block provided at one of right and left sides with respect to the carrier block; a first carrier mounting portion and a second carrier mounting portion which are the carrier mounting portions and provided side by side in a longitudinal direction in a planar view and at least one of which is the substrate carry-in / carry-out carrier mounting portion; a plurality of substrate mounting portions which are provided at one of right and left sides with respect to a substrate transportation region formed between the first carrier mounting portion and the second carrier mounting portion in the planar view, and are disposed side by side in a vertical direction; a first substrate transportation mechanism provided in the transportation region; and a second substrate transportation mechanism transferring a substrate between a first substrate mounting portion and a second substrate mounting portion which is included in the plurality of substrate mounting portions, and transfers the substrate to the processing block.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] In the manufacturing process of semiconductor devices, semiconductor wafers (hereinafter referred to as wafers) are transported between various processing modules in a substrate processing apparatus to undergo processes such as liquid processing and heat treatment. Wafers are transported to the substrate processing apparatus by a carrier. Patent Document 1 discloses a substrate processing apparatus equipped with a carrier block that transfers wafers to and from the carrier. This carrier block is provided with two transport mechanisms that sandwich a stack consisting of multiple substrate mounting sections, and each transport mechanism includes a holder for transferring wafers between the mounting sections and a holder for transferring wafers to and from the carrier. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-69916 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that can increase the throughput of a substrate processing apparatus while reducing the floor space required. [Means for solving the problem]

[0005] The substrate processing apparatus of the present disclosure includes: a carrier block including a plurality of carrier placement sections including a carrier placement section for substrate loading / unloading on which a carrier is placed to load / unload a substrate into / from a carrier storing the substrate; a processing block provided on one of the left and right sides of the carrier block for processing the substrate; Each of the carrier mounting portions is arranged side by side in the front-rear direction in a plan view, Each one a first carrier placement unit and a second carrier placement unit which are carrier placement units for carrying in and out the substrate; a plurality of substrate placement sections, which are arranged on either the left or right side of a substrate transport area formed between the first carrier placement section and the second carrier placement section in a plan view, are arranged in a vertical direction, and each of which is provided with a substrate placed thereon; the first carrier placement portion and the second carrier placement portion a first substrate placement unit provided in the transport area and rotatable about a vertical axis for transferring the substrate between the carrier and a first substrate placement unit included in the plurality of substrate placement units; and a holding section that moves back and forth on the base and holds the substrate. a first substrate transport mechanism; a second substrate transport mechanism that moves up and down so as to transfer the substrate between the first substrate platform and a second substrate platform that is included in the plurality of substrate platforms and on which the substrate is placed in order to transfer the substrate to the processing block; Equipped with picture, The first substrate transport mechanism rotates to one orientation for transferring the substrate to the carrier of the first carrier mounting section, and to another orientation opposite to the one orientation for transferring the substrate to the carrier of the second carrier mounting section. [Effects of the Invention]

[0006] The present disclosure can increase the throughput of a substrate processing apparatus while reducing the floor space required. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a cross-sectional plan view of a coating and developing apparatus according to an embodiment of a substrate processing apparatus of the present disclosure. [Figure 2] FIG. 2 is a vertical sectional front view of the coating and developing apparatus. [Figure 3] FIG. 2 is a schematic perspective view of a carrier block provided in the coating and developing apparatus. [Figure 4] FIG. 4 is a side view of the carrier block. [Figure 5] 10 is an explanatory diagram showing the transfer of carriers in the carrier block. FIG. [Figure 6]10 is an explanatory diagram showing the transfer of carriers in the carrier block. FIG. [Figure 7] 10 is an explanatory diagram showing the transfer of carriers in the carrier block. FIG. [Figure 8] FIG. 2 is a plan view of the carrier block. [Figure 9] 10A and 10B are explanatory views showing the operation of a transport mechanism provided in the carrier block. [Figure 10] FIG. 2 is a vertical cross-sectional side view of a processing block provided in the coating and developing apparatus. [Figure 11] FIG. 2 is a schematic front view of the carrier block and the processing block. [Figure 12] FIG. 2 is a plan view of a shuttle provided in the processing block. [Figure 13] FIG. 2 is an explanatory view showing a wafer transport path in the coating and developing apparatus. [Figure 14] FIG. 2 is an explanatory view showing a wafer transport path in the coating and developing apparatus. [Figure 15] FIG. 10 is a plan view showing a modified example of the carrier block. [Figure 16] FIG. [Figure 17] FIG. 10 is a plan view showing another modified example of the carrier block. [Figure 18] FIG. 10 is a schematic front view showing another example of the configuration of the substrate processing apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0008] A coating and developing apparatus 1 according to one embodiment of a substrate processing apparatus of the present disclosure will be described with reference to the cross-sectional plan view of Fig. 1 and the longitudinal front view of Fig. 2. The coating and developing apparatus 1 includes a carrier block D1, a first stacked processing block D2, a second stacked processing block D3, and an interface block D4, which are arranged in this order in a horizontal linear fashion. Adjacent blocks (carrier block, first and second stacked processing blocks, and interface block) D1 to D4 are connected to each other. Each of the blocks D1 to D4 is partitioned by a housing, and a transport area for wafers W, which are circular substrates, is formed inside each housing.

[0009] The arrangement direction of the blocks D1 to D4 is the left-right direction, and for convenience of explanation, the carrier block D1 side is the left side and the interface block D4 is the right side. Furthermore, regarding the front-to-rear direction of the device, when looking at the carrier block D1 from the left, the front is the front and the back is the rear. The interface block D4 is connected to the right side. The arrangement direction (left-to-right direction) of the above-mentioned blocks D1 to D4 is shown as the X direction in each figure, and the front-to-rear direction is shown as the Y direction in each figure. The X direction and Y direction are linear directions that are perpendicular to each other.

[0010] Before describing each of blocks D1 to D4 in detail, the schematic configuration of coating and developing apparatus 1 will be described. Wafers W are transported to coating and developing apparatus 1 while stored in a carrier C, such as a FOUP (Front Opening Unify Pod). First stacked processing block D2 and second stacked processing block D3 are each vertically divided into two sections, each of which comprises a processing module (first processing module) and a main transport mechanism capable of transferring wafers to and from the processing module. The lower and upper sections of first stacked processing block D2, which is divided into two sections as described above, are designated processing block 2A and processing block 2B, respectively, and the lower and upper sections of second stacked processing block D3, which is divided into two sections, are designated processing block 2C and processing block 2D, respectively.

[0011] Processing blocks 2A and 2C are adjacent to each other and may be collectively referred to as the lower processing blocks. Processing blocks 2B and 2D are adjacent to each other and may be collectively referred to as the upper processing blocks, and FIG. 1 shows these upper processing blocks. Each of these upper processing blocks, processing blocks 2B and 2D, is provided with a transfer mechanism (bypass transfer mechanism) separate from the main transfer mechanism. This separate transfer mechanism will hereinafter be referred to as a shuttle. This shuttle transfers wafers W to downstream blocks on the transfer path without passing through the processing modules.

[0012] The lower processing block forms an outbound path for transporting wafers W from carrier block D1 to interface block D4, where a coating film such as a resist film is formed on the wafers W during the outbound path. The upper processing block forms a return path for transporting wafers W exposed by exposure machine 20 from interface block D4 to carrier block D1. On the return path, wafers W are transported to a processing module by a main transport mechanism in one of processing blocks 2B and 2D for processing, and then transported by a shuttle in the other processing block. In other words, there are two transport paths on the return path, and wafers W are transported via one of the two paths. A module is a location other than the transport mechanism (including the shuttle) where wafers W are placed. A module that processes wafers W is referred to as a processing module as described above, but this processing also includes acquiring images for inspection.

[0013] The carrier block D1 will be described below with reference to the schematic perspective view of Fig. 3 and the side view of Fig. 4. A transport mechanism for carriers C, for example, called an Overhead Hoist Transport (OHT), is provided in a clean room in which the coating and developing apparatus 1 is installed, and this transport mechanism (hereinafter referred to as the external transport mechanism) loads and unloads (loads and unloads) carriers C into and out of the carrier block D1. The carrier block D1 loads and unloads wafers W into and out of the carriers C transported by the external transport mechanism, and delivers the wafers W between the lower processing block and the upper processing block.

[0014] The carrier C comprises a rectangular container body and a lid C1. The lid C1 is detachable from the container body and covers an opening formed on the side of the container body for loading and unloading wafers W. When viewed in the direction of the opening, the left-right width L1 of the carrier C is greater than the front-to-back width L2. Note that the front-to-back and left-to-right used in the description of the carrier C do not necessarily correspond to the front-to-back and left-to-right used in the description of the device. A handle C2 is provided on the top of the container body of the carrier C. To avoid complication, the handle C2 and lid C1 are omitted from some drawings, and in Figure 4, the lid C1 is only shown on some carriers C. Since the lid C1 is provided as described above, the lid C1 indicates the opening direction of the opening of the carrier C.

[0015] The carrier block D1 is configured so that the components constituting the carrier block D1 are arranged in a layout that prevents the carrier block D1 from becoming too large, and also so that the carrier block D1 does not become too large when a large number of carriers C having the widths L1 and L2 are placed on the carrier block D1. The carrier block D1 is provided with three stages 11 to 13 that serve different purposes as carrier placement sections.

[0016] Stage 11, which constitutes the third carrier placement section, is the stage to which the external transfer mechanism transfers carrier C, and will be hereinafter referred to as external transfer stage 11. Stage 12 is the stage on which carrier C is placed to load (carry in) and unload (carry out) wafers W into carrier block D1, and is a carrier placement section for substrate loading and unloading. Because stage 12 moves for loading and unloading, as described below, it will be hereinafter referred to as movable stage 12. Stage 13 is a standby carrier placement section for temporarily retracting and placing carrier C when it cannot be transferred to destination stages 11 and 12, and will be hereinafter referred to as retract stage 13. Carrier block D1 is equipped with a rectangular housing 14, and the above-mentioned stages 11 to 13 are arranged symmetrically about the center from front to back on the left side of housing 14.

[0017] To explain the arrangement of the stages 11 to 13 in detail, a loading / unloading shelf 15 is provided on the upper part of the left vertical (perpendicular) side of the housing 14, and the loading / unloading shelf 15 is formed from the front end to the rear end of the side. Four external transfer stages 11 are provided on the loading / unloading shelf 15, lined up in the front-to-rear direction. Each external transfer stage 11 places a carrier C on it so that the opening of the carrier C faces right (i.e., the lid C1 is located on the right side), in accordance with the direction in which the external transport mechanism transports the carrier C. For example, the two external transfer stages 11 on the rear side are used as stages for loading the carrier C into the carrier block D1, and the two external transfer stages 11 on the front side are used as stages for unloading the carrier C from the carrier block D1.

[0018] Additionally, the left wall of the housing 14 is formed so that the front and rear central portions below the loading / unloading shelf 15 are pulled out and protruded to the left, forming a rectangular, vertically elongated protruding wall 16. The area surrounded by this protruding wall 16 is configured as a transfer area 17. Two openings 21 for loading and unloading wafers W are provided on each of the front and rear side surfaces of the protruding wall 16, and the two openings 21 formed on the same side are spaced apart from each other in the vertical direction. As a result, a total of four openings 21 are arranged in a 2 x 2 matrix when viewed left to right. The left and right positions of each opening 21 are the same, and each opening 21 is blocked from the inside of the housing 14 by a door 22.

[0019] The lower portions of the openings 21 on the rear side surface of the protruding wall 16 protrude rearward, and the lower portions of the openings 21 on the front side surface of the protruding wall 16 protrude forward, forming support portions 23. Therefore, the support portions 23 are also arranged in a 2x2 matrix in the left-right direction, and are provided corresponding to the openings 21 and doors 22, respectively. The movable stages 12 are provided on the support portions 23, and the carriers C are placed on each movable stage 12 so that their openings face a second direction toward the openings 21 of the protruding wall 16. The movable stage 12 provided on one side of the protruding wall 16, either in front or behind, constitutes a first carrier placement portion, and the movable stage 12 provided on the other side constitutes a second carrier placement portion. The left-right position of each movable stage 12 is aligned with the left-right position of the external transfer stage 11. The support portions 23 are provided with a movement mechanism for moving, for example, the movable stage 12 or door 22 corresponding to the support portion 23.

[0020] Each of the movable stages 12 is movable back and forth between a load position relatively close to the opening 21 and an unload position relatively far from the opening 21. The load position is a position where wafers W are loaded and unloaded into and from the carrier C, and the unload position is a position where the carrier C is transferred to and from a carrier transfer mechanism 26, which will be described later. The door 22 is capable of switching between holding and not holding the lid C1 for the carrier C in the load position, and when holding the lid C1, is movable to the height of the support part 23 below the opening 21. Therefore, the door 22 attaches and detaches the lid C1 to and from the carrier C and opens and closes the door 22.

[0021] Three shelves 24 are provided on the front and rear sides of the protruding wall portion 16. The front shelf 24 is provided in front of the front support portion 23, and the rear shelf 24 is provided behind the rear support portion 23, and an evacuation stage 13 is arranged on each shelf 24. As a result, when viewed in the left-right direction, the evacuation stages 13 are arranged in a 2 x 3 matrix. The carrier C is placed on the evacuation stage 13 on the shelf 24 with its opening facing the left-right direction, and more specifically, the opening is placed so that it faces the protruding wall portion 16. The left-right positions of the evacuation stages 13 on the shelf 24 are the same as each other, and are also the same as the left-right positions of the moving stage 12.

[0022] Carrier C is placed on the topmost retracting stage 13 at the same height as carrier C on the upper moving stage 12, with the carriers C on these stages 12, 13 lined up in front and behind. Carrier C is placed on the bottommost retracting stage 13 at the same height as carrier C on the lower moving stage 12, with the carriers C on these stages 12, 13 lined up in front and behind. Carrier C is placed on the middle retracting stage 13 at the same height as the upper support part 23.

[0023] Additionally, the bottom of the left side surface of the housing 14 is pulled out to the left to form a base 25. An evacuation stage 13 is also provided on the base 25, and the evacuation stage 13 of the base 25 is located to the left of the evacuation stage 13 of the shelf 24. Four evacuation stages 13 are provided on the base 25 in a line in the front-to-rear direction, and a carrier C is placed on each of the evacuation stages 13 so that the opening of the carrier C faces leftward.

[0024] Next, the carrier transfer mechanism 26, which is a transport mechanism for the carrier, will be described. The carrier transfer mechanism 26 includes an articulated arm 27 that can hold the handle C2 of the carrier C, and a movement mechanism 28 that can move the articulated arm 27 up and down and back and forth. Each arm of the articulated arm 27 is rotatable around a vertical axis. The tip of the articulated arm 27 is configured as a claw 29 that can open and close so as to grip the handle C2 of the carrier C, and this claw 29 is also rotatable around the vertical axis.

[0025] Then, the carrier C is transferred (transported) by the carrier transfer mechanism 26 in the order of external delivery stage 11 → movable stage 12 for unloading wafers W → movable stage 12 for retrieving wafers W → external delivery stage 11. When transferring a carrier C between stages in this manner, if the destination stage is not available (if it is occupied by another carrier C), the carrier C is placed on the evacuation stage 13 until the destination stage becomes available.

[0026] The carrier C is placed on each stage 11 to 13 in the orientation already described, but if the orientation of the carrier C differs between the source stage and the destination stage, the orientation of the carrier C is changed during transfer. As an example, Figures 5 to 7 show an example in which the carrier C is transferred from the external delivery stage 11 to the rear moving stage 12.

[0027] The claws 29 of the carrier transfer mechanism 26 grip the handles C2 of the carrier C on the external transfer stage 11, and the carrier C moves away from the external transfer stage 11 (FIG. 5). Then, while the carrier C is heading toward the movable stage 12, the claws 29 of the carrier transfer mechanism 26 rotate 90°, and the orientation of the carrier C changes from a state in which its opening faces rightward to a state in which it faces backward (FIG. 6), and the carrier C is placed on the movable stage 12 (FIG. 7). When transferring the carrier C between other stages, if the placement orientation of the carrier C differs between the source stage and the destination stage, the orientation of the carrier C is changed during transfer along the transfer path of the carrier C, as in the examples shown in FIGS. 5 to 7.

[0028] Returning to the explanation of the configuration of carrier block D1, two inspection modules 39 are provided below the loading / unloading shelf 15 and above the area where the carriers C are placed on the upper-level retracting stage 13 and the moving stage 12, and are arranged respectively at the rear and front of the protruding wall portion 16. Therefore, as shown in Fig. 8, in plan view, the rear-side inspection module 39 overlaps with the rear-side moving stage 12 and the retracting stage 13 on the shelf 24, and the front-side inspection module 39 overlaps with the front-side moving stage 12 and the retracting stage 13 on the shelf 24.

[0029] The inspection module 39 includes a housing extending in the front-to-rear direction, for example. A stage movable in the front-to-rear direction, and an imaging unit including a camera are provided within the housing, and the imaging unit intermittently captures images of the wafer W while it is placed on the stage and moving, thereby obtaining image data of the entire surface of the wafer W. The control unit 10, which will be described later, determines whether or not there is an abnormality in the wafer W based on the image data transmitted from the imaging unit. In this example, the inspection module 39 captures images of the wafer W before it is processed in the coating and developing apparatus 1.

[0030] Next, the internal configuration of the housing 14 will be described. A space 19 extending linearly from front to back in a plan view is formed within the housing 14. In other words, the space 19 is formed to extend in the Y direction, and the transfer area 17 formed by the protruding wall portion 16 described above is a space that protrudes in the X and Y directions from the center of this space 19 in the Y direction. A transfer mechanism 31, which is a first substrate transfer mechanism, is provided in the transfer area 17. The transfer mechanism 31 includes a base 32 that can be raised and lowered and rotated about a vertical axis, i.e., a longitudinal axis, and a wafer W holder 33 that can be advanced and retreated relative to the base 32. This configuration allows the transfer mechanism 31 to deliver the wafer W to and from the carrier C and the inspection module 39 placed on each of the movable stages 12. In other words, the transfer mechanism 31 is shared by these movable stages 12 and the inspection module 39.

[0031] In Figure 9, one side in the Y direction is shown as the -Y side, and the other side is shown as the +Y side. When transferring a wafer W to a carrier C on the rear moving stage 12, the operation of the transfer mechanism 31 is controlled so that the forward direction of the holder 33 is the -Y direction (rearward), and when transferring a wafer W to a carrier C on the front moving stage 12, the forward direction of the holder 33 is the +Y direction (forward). In other words, the orientation of the holder 33 is one direction and another direction opposite to the one direction. Similarly, when transferring a wafer W to the rear inspection module 39 and the front inspection module 39, respectively, the base 32 rotates so that the orientation of the holder 33 is one direction and another direction.

[0032] Regarding the space 19, the area from the center to the rear end in the elongation direction in plan view is configured as a transfer area for the wafer W, in which a transfer mechanism and modules are arranged. More specifically, a module stack T1 is provided to the right of the transfer mechanism 31 (i.e., either the left or right side) in the center between the front and rear of the space 19 in plan view. The module stack T1 is configured by stacking, in the vertical direction, a transfer module TRS on which the wafer W is temporarily placed (temporarily placed), a temperature adjustment module SCPL that adjusts the temperature of the temporarily placed wafer W, and the like. The other module stacks described below have a similar configuration.

[0033] The transfer mechanism 31 described above delivers and receives the wafer W to the modules that make up the module stack T1. At that time, the orientation of the base 32 is controlled so that the forward direction of the holder 33 faces the module stack T1 (i.e., faces the Y direction). A transfer mechanism 34 is provided behind the module stack T1. The transfer mechanism 34, which is a second substrate transfer mechanism, has the same configuration as the transfer mechanism 31, except that, for example, the shape of the holder 33 is different.

[0034] Furthermore, behind the transfer mechanism 34 and at the rear end of the space 19, for example, a plurality of hydrophobic treatment modules 35 are provided, stacked on top of each other. The hydrophobic treatment module 35, which is a second treatment module, is a module that supplies a treatment gas to the wafer W to perform a hydrophobic treatment before a coating film is formed, and the wafer W is transferred to and from the hydrophobic treatment module 35 by the transfer mechanism 34. The hydrophobic treatment module 35 includes a heating plate on which the wafer W is placed and heated, and a cover that can be raised and lowered to cover the heating plate. The hydrophobic treatment is performed on the wafer W by supplying a treatment gas into an enclosed space above the heating plate formed by the cover.

[0035] The temperature adjustment module SCPL can adjust the temperature of the wafer W placed thereon, and the wafer W is transferred by the lifting and lowering motion of the transfer mechanism. The transfer module TRS is configured to include, for example, multiple pins arranged horizontally, and the wafer W is transferred to and from these pins by the lifting and lowering motion of the transfer mechanism. The substrate placement units TRS and SCPL are also provided in blocks other than the carrier block D1 so as to form module stacks, and the modules that make up each module stack include those that have the role of transferring the wafer W between blocks.

[0036] The shuttle TRS for transferring wafers W to and from the shuttle differs from the above configuration in that it can be raised and lowered, but details will be described together with the shuttle. Hereinafter, the SCPLs and TRSs at various locations will be identified by numbers after the SCPLs and TRSs to distinguish them from one another. The modules that make up the module stack T1 of carrier block D1 are identified from bottom to top as TRS1, TRS2, SCPL1, TRS3, and SCPL2. In this specification, a module stack refers to modules that are stacked in a plan view, and the modules may be separated from one another or may be in contact with one another.

[0037] SCPL1 is located at the height of the lower processing block to form the outbound path, and TRS3 and SCPL2 are located at the height of the upper processing block to form the return path. TRS1 and TRS2 are used to transfer wafers W between transfer mechanisms 31 and 34. Transfer mechanism 31 can access TRS1 and TRS2, and transfer mechanism 34 can access TRS1 to TRS3, SCPL1, and shuttle TRS12B so that wafers W can be transferred along the transfer path described later in Figures 13 and 14.

[0038] The area of ​​the space 19 at the front side relative to the module stack T1 and at the height of the lower processing block is configured as a chemical liquid storage area 36. In this chemical liquid storage area 36, ​​for example, a large number of bottles are arranged vertically and horizontally. Therefore, the bottles, which serve as chemical liquid storage units, are provided on the opposite side of the module stack T1 in the front-rear direction from the side on which the transfer mechanism 34 is provided. Each bottle stores a processing liquid to be used in the processing block 2A, which will be described later. The processing liquid will be described in detail in the description of the processing block 2A.

[0039] Next, the first stacked processing block D2 (processing blocks 2A and 2B) will be described with reference to FIG. 10, which is a vertical cross-sectional side view. The front side of the first stacked processing block D2 is vertically partitioned to form eight stories, which are numbered E1 to E8 from bottom to top. The lower stories E1 to E4 are included in processing block 2A, and the upper stories E5 to E8 are included in processing block 2B. Each story is an area where a liquid processing module can be installed.

[0040] First, the upper processing block 2B will be described. In this example, each of the stories E6 to E8 is provided with a liquid processing module, a developing module 41 that supplies a developer to a wafer W. A transfer area 42 for wafers W is provided behind the stories E5 to E8. This transfer area 42 is linearly formed in a plan view from the left end to the right end of the processing block 2B, and is provided from the height of story E5 to the height of story E8. Behind the transfer area 42, processing modules are stacked, for example, seven levels vertically to form a processing module stack 43. Two processing module stacks 43 are provided laterally, spaced apart. The two processing module stacks 43 include a heating module 44 that performs PEB (post-exposure bake) and an inspection module 45. The inspection module 45 is similar to the inspection module 39 in the carrier block D1, except that the object of image acquisition for the wafer W after processing in the apparatus is the wafer W.

[0041] A main transport mechanism 3B is provided in the transport region 42. The main transport mechanism 3B has the same configuration as the transport mechanism 31, except that the main transport mechanism 3B is connected to a moving mechanism 46 so that the base 32 can also move left and right. Note that each of the transport mechanisms other than the shuttle in the coating and developing apparatus 1, including this main transport mechanism 3B, is provided with, for example, two holders 33, which can move forward and backward on the base 32 independently of each other. The moving mechanism 46 is provided below the processing module stack 43.

[0042] The main transport mechanism 3B delivers wafers W to each processing module in the processing block 2B and to modules located at the same height as the processing block 2B among the module stacks (T1 and T2, described later) provided in blocks adjacent to the processing block 2B. The main transport mechanism 3B can also deliver wafers W to a shuttle TRS provided in the processing block 2B.

[0043] A partitioned, flat space 5B is provided below the processing module stack 43, and the space 5B extends from the left end to the right end of the processing block 2B. A shuttle 4B and shuttle TRSs 12B and 12D are provided in the space 5B. The configurations of the shuttle and shuttle TRSs will be described in detail later.

[0044] The processing blocks other than processing block 2B, which will be described below, are generally configured similarly to processing block 2B, except for differences that will be explained later. Each processing block is equipped with a main transport mechanism equivalent to main transport mechanism 3B, and the reference numeral for this main transport mechanism is designated by the same alphabetic character as that of the processing block, instead of "B." Specifically, for processing block "2A," its main transport mechanism is designated as "3A." Furthermore, the other main transport mechanisms equivalent to main transport mechanism 3B are also configured to transfer wafers W to and from the processing modules and shuttle TRSs within the processing block in which the main transport mechanism is installed, as well as to the module stacks within the processing block or in blocks adjacent to the processing block in the horizontal direction.

[0045] Furthermore, the symbol for a space corresponding to the above-described space 5B where a shuttle can be installed is indicated by the same alphabetical character as that attached to the processing block instead of "B." Furthermore, if a shuttle is provided in a processing block, the symbol for that shuttle is also indicated by the same alphabetical character as that attached to the processing block. The shuttle TRS is indicated by the same alphabetical character as the processing block in which the shuttle is provided, with the source TRS indicated by "11" and the destination TRS indicated by "12." The transfer path for wafers W by the shuttle is indicated by the numeral "40" followed by the same alphabetical character as that attached to the shuttle. To give a specific example of the above symbol convention, the shuttle provided in processing block 2D (described later) is indicated as 4D, the source and destination TRSs of this shuttle 4D are indicated as TRS11D and TRS12D, respectively, and the transfer path for wafers W by shuttle 4D is indicated as 40D.

[0046] Returning to the explanation of the configuration of the processing blocks, processing block 2A, which is located below processing block 2B, differs from processing block 2B in that each of stories E2 to E4 is provided with an anti-reflection film forming module 47 as a liquid processing module. The anti-reflection film forming module 47 supplies and applies a chemical liquid for forming an anti-reflection film from a nozzle to the surface of wafer W, forming an anti-reflection film as a coating film. A heating module 48 is provided in processing module stack 43 of processing block 2A. This heating module 48 has a different function from heating module 44 of processing block 2B, and is used to remove solvent from the coating film. In processing block 2A, transfer region 42 is provided across the heights of stories E1 to E4. Note that processing block 2A does not have a shuttle or a shuttle TRS.

[0047] The anti-reflection film forming module 47 will be further described with reference to FIG. 11 . A chemical (processing liquid) for forming an anti-reflection film is stored in a bottle installed in the chemical storage area 36 of the carrier block D1, and the bottle is connected to the nozzle of each anti-reflection film forming module 47 via a pipe 52. A filter 53 for purifying the chemical liquid heading toward the nozzle is installed in the pipe 52, and the filter 53 is installed on the floor E1 of the processing block 2B. In this way, the bottle serving as a supply source of the chemical liquid is installed on the front side of the carrier block D1 adjacent to the processing block 2A, and the anti-reflection film forming module 47 is located forward of the transfer area 42, and the chemical storage area 36 is located forward of the space 19 of the carrier block D1. Therefore, the length of the pipe 52 can be relatively short, which is advantageous because it can more reliably reduce the risk of contamination of the anti-reflection film by particles generated from the pipe 52.

[0048] Next, returning to FIGS. 1 and 2, we will explain the second stacked processing block D3 (processing blocks 2C and 2D) that constitutes the processing blocks on the right side of the device. The second stacked processing block D3 has a configuration substantially similar to that of the first stacked processing block D2, and we will mainly explain the differences from the first stacked processing block D2. First, regarding the upper processing block 2D (another processing block), the positional relationship between the transport region 42, processing module stack 43, main transport mechanism, and spaces for installing shuttles stacked on the processing modules is the same as that of processing block 2B (one processing block). The processing modules installed in processing block 2D are the same as those in processing block 2B. Furthermore, shuttle space 5D in processing block 2D is located at the same height as space 5B and is connected to space 5B. Shuttle 4D and shuttle TRSs 11B and 11D are provided in space 5D.

[0049] In the lower processing block 2C, resist film forming modules 49 are provided on stories E2 to E4. The resist film forming modules 49 have the same configuration as the developing modules 41, except that the processing liquid supplied to the wafers W is resist instead of a developer. The processing module stack 43 also includes a heating module 48, similar to the processing block 2A.

[0050] Meanwhile, a module stack T2 is provided at the left end of the transfer area 42 of the second stack processing block D3, and is positioned so that a portion of the module stack T2 overlaps with the right end of the transfer area 42 of the first stack processing block D2 in plan view. The module stack T2 includes SCPL4, which is located at the height of the lower processing block, and SCPL3, which is located at the height of the upper processing block.

[0051] Next, the interface block D4 will be described. The interface block D4 has a module stack T3 in the center between the front and rear. This module stack T3 is composed of stacked TRS5 to TRS7 and a temperature adjustment module ICPL. The ICPL is a module to which the wafer W is transferred immediately before exposure. It is located at the bottom of the module stack T3 and, like the SCPL, adjusts the temperature of the placed wafer W. To transfer the wafer W along the transfer path described below, TRS5 and TRS6 are located at the height of the lower processing block, and TRS7 is located at the height of the upper processing block. Transfer mechanisms 61, 62, and 63 are located at the front, rear, and right of the module stack T3, respectively. These transfer mechanisms 61 to 63 are configured similarly to the transfer mechanism 31 of the carrier block D1.

[0052] A plurality of back surface cleaning modules 65 that supply a cleaning liquid to the back surface of the wafer W to clean it are stacked in front of the transfer mechanism 61. A plurality of post-exposure cleaning modules 66 that supply a cleaning liquid to the front surface of the wafer W after exposure are stacked in rear of the transfer mechanism 62. The transfer mechanisms 61 and 62 can transfer the wafer W between the modules that make up the module stack T3, and the transfer mechanism 61 can also transfer the wafer W to the back surface cleaning module 65, and the transfer mechanism 62 can also transfer the wafer W to the post-exposure cleaning module 66. The transfer mechanism 63 transfers the wafer W between the ICPL, TRS6, and the exposure machine 20.

[0053] Next, the shuttles 4B and 4D and the TRS for each shuttle will be described. The shuttle 4B transports wafers W from the processing block 2D to the carrier block D1. As shown in FIG. 1, of the TRSs 11B and 12B for the shuttle 4B, the destination TRS 12B is located at the left end of the space 5B so that the wafers W can be transferred between the TRSs 11B and 12B and the transport mechanism 34 in the carrier block D1. The source TRS 11B is located at the left end of the space 5D, to the right of the module stack T2, so that the wafers W can be transferred between the TRSs 11B and 12B and the main transport mechanism 3D in the processing block 2D.

[0054] The shuttle 4D transports the wafer W from the interface block D4 to the processing block 2B. Of the TRSs 11D and 12D for the shuttle 4D, the source TRS 11D is located at the right end of the space 5D so as to be able to transfer the wafer W between it and the transfer mechanism 62 in the interface block D4. The destination TRS 12D is located at the right end of the space 5B, to the left of the module stack T2, so as to be able to transfer the wafer W between it and the main transfer mechanism 3B in the processing block 2B.

[0055] The shuttle 4B, TRS11B, and TRS12B will be described below with reference to FIG. 12. The shuttle 4B includes a base body 71, an intermediate movable body 72, and a support body 73. The base body 71 is configured as an elongated member extending left and right, and is provided to fit within the space 5B of the processing block 2B. The intermediate movable body 72 is also an elongated member extending left and right, and is connected to the front side of the base body 71. The support body 73 is connected to the front side of the intermediate movable body 72, and is formed in the shape of a rectangular parallelepiped that is elongated left and right. The wafer W is supported on the support body 73 and transported horizontally and linearly left and right.

[0056] The base body 71 allows the intermediate movable body 72 to move left and right relative to the base body 71, and the support body 73 moves left and right relative to the intermediate movable body 72 in response to the movement of the intermediate movable body 72 relative to the base body 71. More specifically, the support body 73 moves leftward as the intermediate movable body 72 moves leftward (toward the carrier block D1), and the support body 73 moves rightward as the intermediate movable body 72 moves rightward (toward the interface block D4).

[0057] When support 73 is in a position (right transfer position) when transferring wafer W to TRS11B, the right end of support 73 is located to the right of the right end of intermediate movable body 72, and the right end of intermediate movable body 72 is located to the right of the right end of base body 71 (see the upper side of FIG. 12). When support 73 is in a position (left transfer position) when transferring wafer W to TRS12B, the left end of support 73 is located to the left of the left end of intermediate movable body 72, and the left end of intermediate movable body 72 is located to the left of the left end of base body 71 (see the lower side of FIG. 12).

[0058] TRS11B includes a support plate 75 formed to form a recess that is open on the left side in a plan view, three pins 76 protruding upward from the support plate 75, and an elevator mechanism (not shown) that raises and lowers the support plate 75. This elevator mechanism is connected to the underside of the support plate 75 so as not to interfere with the intermediate moving body 72 of the shuttle 4B, the support body 73, or the support plate 75. As shown in the upper side of FIG. 12 , the right end of the support body 73 at the right transfer position is accommodated in the recess formed by the support plate 75 in a plan view, and the wafer W can be transferred between the support body 73 and TRS11B by raising and lowering the pins 76. TRS12B has the same configuration as TRS11B, except that the support plate 75 is formed to form a recess that is open on the right side in a plan view. As shown in the lower part of Figure 12, the left end of the support 73 at the left transfer position is contained in the recess formed by the support plate 75 in a plan view, and the wafer W can be transferred between the support 73 and the TRS12B by raising and lowering the pins 76.

[0059] The main transfer mechanism 3D of the processing block 2D delivers the wafer W processed in the processing block 2D onto the pins 76 in the raised position of the TRS11B. When the pins 76 move to the lowered position and the wafer W is supported by the support 73 in the right transfer position, the intermediate movable body 72 and the support 73 each move to the left, while the pins 76 of the TRS11B return to the raised position. When the support 73 moves to the left transfer position, the pins 76 in the lowered position of the TRS12B move to the raised position to support the wafer W. When the support 73 moves toward the right transfer position, the pins 76 return to the lowered position. Thereafter, the transfer mechanism 34 of the carrier block D1 receives the wafer W.

[0060] The shuttles 4D, TRS11D, and TRS12D are configured similarly to the shuttles 4B, TRS11B, and TRS12B, respectively. Briefly, the base body 71 of the shuttle 4D is provided to fit within the space 5D of the processing block 2D. The set of shuttles 4D, TRS11D, and TRS12D is provided at a different height than the set of shuttles 4B, TRS11B, and TRS12B, e.g., below the set. The front and rear positions of the transfer path 40B for wafer W carried by the shuttle 4B and the transfer path 40D for wafer W carried by the shuttle 4D are the same. The transfer path 40B protrudes into the processing block 2D, and the transfer path 40D protrudes into the processing block 2D, corresponding to the positions of the TRS11B, TRS12B, TRS11D, and TRS12D described above. This protrusion allows the right side of the transfer path 40B and the left side of the transfer path 40D to overlap in a plan view.

[0061] The coating and developing apparatus 1 also includes a control unit 10 (see FIG. 1). The control unit 10 is configured by a computer and includes a program, a memory, and a CPU. The program incorporates steps that enable a series of operations in the coating and developing apparatus 1, which will be described later. The program causes the control unit 10 to output control signals to each component of the coating and developing apparatus 1, thereby controlling the operation of each component. Specifically, the control unit 10 controls the operations of the transport mechanisms 31, 32, 61-63, the main transport mechanisms 3A-3D, the shuttles 4B and 4D, and each processing module. This controls the transport and processing of wafers W, which will be described later. Note that the control of the operation of the processing modules also includes determining whether the wafers W are abnormal based on the image data described above. The program is stored on a storage medium, such as a compact disc, hard disk, or DVD, and installed in the control unit 10.

[0062] Next, an example of the processing and transport path of wafers W in the coating and developing apparatus 1 will be described with reference to FIGS. 13 and 14, which respectively show the outbound and return paths described above. In FIGS. 13 and 14, the transport mechanisms used for the transport of wafers W between modules are shown on or near some of the arrows indicating the transport of wafers W. In this example, of the four movable stages 12, the two lower movable stages 12 are stages (loaders) for unloading wafers W, and the two upper movable stages 12 are stages (unloaders) for recovering wafers W.

[0063] First, the transfer mechanism 31 transfers the wafer W from the carrier C on the lower movable stage 12. The wafer W is then transferred to the inspection module 39, where image data is acquired and the presence or absence of anomalies is determined. The wafer W is then transferred in the order of the transfer mechanism 31, TRS1, transfer mechanism 34, hydrophobization module 35, transfer mechanism 34, and SCPL1, where it is subjected to hydrophobization. The wafer W is then loaded into the processing block 2A by the main transfer mechanism 3A and transferred in the order of the anti-reflection film forming module 47 and heating module 48, where an anti-reflection film is formed. The wafer W is then transferred to the SCPL4 of the module stack T2, and then transferred in the order of the resist film forming module 49 and heating module 48 by the main transfer mechanism 3C of the processing block 2C, where a resist film is formed. The wafer W is then transferred to the TRS5 of the module stack T3 in the interface block D4.

[0064] Thereafter, the wafer W is transported by the transfer mechanism 61 at the front side of the block through the back surface cleaning module 65 and the ICPL in this order, and then by the transfer mechanism 63 to the exposure machine 20, where the resist film on the front side of the wafer W is exposed according to a predetermined pattern. After exposure, the wafer W is transported in the following order: transfer mechanism 63 → TRS 6 → transfer mechanism 62 at the rear side of the block → post-exposure cleaning module 66 → transfer mechanism 62.

[0065] The subsequent transfer path of the wafer W is divided into a path (referred to as the first transfer path) for processing in the processing block 2D and a path (referred to as the second transfer path) for processing in the processing block 2B. Regarding the first transfer path, the transfer mechanism 62 transfers the wafer W to the TRS7 of the module stack T3, and the main transfer mechanism 3D loads the wafer W into the processing block 2D. The wafer W is then transferred in the order of the heating module 44, SCPL3, developing module 41, and inspection module 45. After a resist pattern is formed on the wafer W, image data is acquired and the presence or absence of anomalies is determined. As described with reference to FIG. 12, the wafer W is then transferred in the order of the main transfer mechanism 3D, TRS11B, shuttle 4B, and TRS12B. The transfer mechanism 34 of the carrier block D1 then receives the wafer W, which is then transferred in the order of TRS2 and transfer mechanism 31 and stored in the carrier C.

[0066] Next, regarding the second transfer path, the wafer W is transferred in the order of transfer mechanism 62 → TRS11D → shuttle 4D → TRS12D → main transfer mechanism 3B, and the wafer W is taken into processing block 2B. The wafer W is then transferred by main transfer mechanism 3B in the order of heating module 44 → SCPL2 → developing module 41 → inspection module 45, and after being processed in the same way as the wafer W on the second transfer path, is transferred to TRS3 in carrier block D1. The wafer W is then transferred in the order of transfer mechanism 34 → TRS2, and thereafter, like the wafer W on the second transfer path, is stored in carrier C by transfer mechanism 31.

[0067] Because transfer is performed as described above, TRS1 in module stack T1 is a first substrate rest portion onto which wafer W is transferred by transfer mechanism 31. SCPL1, TRS2, and TRS3, which place wafer W so that wafer W can be transferred between carrier block D1 and the lower and upper processing blocks, are second substrate rest portions. Of these, SCPL1 is a lower substrate rest portion corresponding to the lower processing block, and TRS2 and TRS3 are upper substrate rest portions corresponding to the upper processing block.

[0068] As described above, the carrier block D1 of the coating and developing apparatus 1 has the transfer mechanisms 31 and 34 located to the left and rear of the module stack T1 (TRS, SCPL) for transferring wafers W between the carrier C and the lower and upper processing blocks. The transfer mechanism 31 is located in the transfer area 17 formed by the protruding wall 16, so that it is aligned with the moving stage 12 for loading and unloading wafers W. The roles of the transfer mechanisms 31 and 34 are divided so that the transfer mechanism 31 transfers wafers to and from the carrier C on the moving stage 12, and the transfer mechanism 34 transfers wafers between modules in the module stack T1. By dividing the roles of the transfer mechanisms in this way, the number of operational steps of the transfer mechanisms 31 and 34 (the number of sections along the transfer path where the transfer mechanisms 31 and 33 perform transfers) and the travel distance of the transfer mechanisms 31 and 33 in one operational step can be reduced, thereby increasing the throughput of the apparatus. The layout of the above-described transport mechanisms 31, 34, module stack T1, and moving stage 12 makes it possible to ensure a relatively large space in front of module stack T1, and this space can be used as chemical solution storage area 36. This reduces the floor space (footprint) occupied by coating and developing apparatus 1 and prevents it from becoming large, while, as already mentioned, placing chemical solution storage area 36 close to the liquid processing module prevents particles from getting into the coating film due to the length of piping 52, thereby preventing a decrease in the yield of semiconductor products.

[0069] Furthermore, movable stages 12 are disposed both in front of and behind the transport mechanism 31, and the transport mechanism 31 can access the carriers C on each movable stage 12 by changing the orientation of the base 32 and moving the holder 33 forward and backward. With this configuration, there is no need to connect the transport mechanism 31 to a moving mechanism and move it laterally to access each carrier C. This makes it possible to more reliably reduce the footprint and also improve throughput. Furthermore, since there is no need for a lateral movement mechanism, the manufacturing costs of the device can be reduced.

[0070] Furthermore, multiple movable stages 12 are provided one above the other in front of and behind the transfer region 17. By providing the movable stages 12 in this manner, a sufficient number of movable stages 12 is ensured while eliminating the need to move the base 32 of the transfer mechanism 31 laterally, allowing the transfer mechanism 31 to access the carrier C at the desired timing. In other words, this configuration more reliably reduces the footprint of the device and prevents a decrease in throughput.

[0071] Incidentally, the orientation of the carrier C when it is placed on the external transfer stage 11 by the external transfer mechanism (OHT) is different from the orientation of the carrier C when it is accessed by the transfer mechanism 31. The orientation can be changed, for example, by connecting the moving stage 12 to a rotation mechanism and rotating the moving stage 12 using the rotation mechanism. When such a rotation mechanism is provided, the external transfer mechanism can be configured to directly transfer the carrier C to the moving stage 12. In other words, the external transfer stage 11 and the moving stage 12 can be the same.

[0072] However, rather than using a rotation mechanism as the orientation change mechanism, it is preferable to use the carrier transfer mechanism 26 as the orientation change mechanism, as described above. As shown in Figures 5 to 7, by changing the orientation while the carrier transfer mechanism 26 is transferring the carrier C between stages and using the space for this transfer, there is no need to ensure space around the moving stage 12 for the rotation of the carrier C. As a result, the device does not need to be large, and since the orientation change and the movement to the destination stage are performed in parallel, a decrease in throughput is also prevented, which is preferable.

[0073] The carriers C on the retracting stages 13 of the shelves 24 are placed in a line in the front-to-rear direction relative to the carriers C on the moving stage 12 and the lower support portions 23 of the moving stage 12. Like the carriers C on the moving stage 12, the openings of the carriers C on the retracting stages 13 also face the front-to-rear direction. Because the width L1 of the carriers C is greater than the width L2 of the carriers C, the carriers C are arranged in a manner that minimizes the front-to-rear space they occupy. Therefore, even if the space on the left side of the carrier block D1 is reduced by the amount of the protruding wall portion 16 for installing the transport mechanism 31, it is possible to arrange many retracting stages 13 while minimizing the increase in the front-to-rear width of the carrier block D1. Note that, in the example shown in FIG. 4 and other figures, the retracting stages 13 of the rear shelves 24 are shown with their openings facing forward, and the retracting stages 13 of the front shelves 24 are shown with their openings facing backward. However, the front-to-rear orientation may be reversed.

[0074] Furthermore, by providing a large number of retraction stages 13 in this manner, unnecessary carriers C can be retracted from the movable stages 12 at any time, and other carriers C can be placed on the movable stages 12 to load or unload wafers W, thereby enabling efficient loading and unloading. Therefore, arranging carriers C on the retraction stages 13 in the layout described above, in a direction different from that when placed on the external delivery stage 11, as described above, contributes to preventing an increase in the size of the carrier block D1 and therefore an increase in the footprint of the apparatus, while also preventing a decrease in the throughput of the apparatus.

[0075] Furthermore, the inspection module 39, which has a horizontally long configuration due to the movement of the internal stage, utilizes the space formed in front and behind the protruding wall portion 16, and is arranged so that it extends in the front-to-rear direction from the protruding wall portion 16 and overlaps with each of the stages 11 to 13. This arrangement prevents an increase in the footprint of the device due to the provision of the inspection module 39.

[0076] Furthermore, a hydrophobic treatment module 35 is arranged as a treatment module in a space formed behind the transfer mechanism 34 that accesses each module of the module stack T1, and wafers W are transferred by the transfer mechanism 34. The arrangement of this hydrophobic treatment module 35 also prevents the left and right width of the coating and developing apparatus 1 from increasing.

[0077] Instead of the hydrophobic treatment module 35, another module such as an inspection module 45 may be provided and transported by the transfer mechanism 34. However, the hydrophobic treatment module 35 does not need to move the mounting portion (hot plate) on which the wafer W is placed laterally when performing the treatment. In other words, when providing a treatment module behind the transfer mechanism 34, it is preferable to provide a treatment module that performs treatment without moving the mounting portion for the wafer W laterally in this way in order to prevent the carrier block D1 from becoming larger.

[0078] Now, a supplementary explanation will be given regarding the arrangement of the hydrophobic processing module 35. Air flow generating units are provided on the upper part of the housing 14 of the carrier block D1, and on the upper part of each housing of the first and second stacking processing blocks D2 and D3, and the interface block D4. Each air flow generating unit takes in air from outside the coating and developing apparatus 1 and supplies that air to the transport path of the wafer W in the block in which the air flow generating unit is provided, thereby forming a downward air flow. Note that each block is also provided with an exhaust port so that such a downward air flow can be formed.

[0079] Furthermore, a vertically elongated filter is provided in the carrier block D1 on the front side of the module stack T1, and the airflow generating unit of the carrier block D1 also supplies air to this filter. Air is supplied from this filter toward the rear side of the space 19, passes between the modules constituting the module stack T1, and heads toward the hydrophobization treatment module 35. The air is then exhausted from an exhaust port located behind the module stack T1 and opening at the bottom of the device. By adjusting the balance between the air supply and exhaust volumes of the airflow generating units in each block, the transfer region 42 of the first stack processing block D2 is kept at a higher pressure than the space 19 of the carrier block D1. As a result, some of the air supplied to the transfer region 42 flows rearward into the space 19, and this air is also exhausted from an exhaust port on the rear side of the module stack T1.

[0080] The supply of air from the filter, which is the gas supply unit described above, and the inflow of air from the transport region 42 more reliably prevent the processing gas used in the hydrophobization processing module 35 from flowing into the transport region 42 of the first stack processing block D2. If the processing gas were to flow into the development module 41 via the transport region 42 and react with the developer, this could cause development defects, but the airflow control described above prevents such defects from occurring.

[0081] Furthermore, the processing blocks 2B and 2D are provided with shuttles 4B and 4D, respectively. The shuttles 4B and 4D transport wafers W to be processed in one of the processing blocks 2B and 2D toward the carrier block D1, bypassing the processing modules in the other processing block. Specifically, the shuttle 4B delivers the wafer W to the transfer mechanism 34 in the carrier block D1, and the shuttle 4D delivers the wafer W to the main transfer mechanism 3B in the processing block 2B, via the TRS, respectively. The shuttles 4B and 4D transporting the wafer W in this manner reduce the load on the main transfer mechanism 3B in the processing block 2B and the main transfer mechanism 3D in the processing block 2D (more specifically, the number of transfer processes required within the blocks). As a result, the throughput of the coating and developing apparatus 1 can be further improved.

[0082] Incidentally, instead of imaging and inspecting the processed wafer W in the inspection module 45 of the processing blocks 2B and 2D, the processed wafer W may be imaged and inspected in the inspection module 39 of the carrier block D1. In this case, the wafer W that has been processed and transferred to the module stack T1 may be transferred to the inspection module 39 by the transfer mechanism 31 before being returned to the carrier C. Alternatively, an inspection module may be provided in the processing module stack 43 of the processing block 2A, and the unprocessed wafer W may be transferred to each processing block for imaging and inspection. Note that only one of the two inspection modules 39 may be provided in the carrier block D1, or the carrier block D1 may not be provided with these inspection modules 39.

[0083] In the above example, the four movable stages 12 of the carrier block D1 are used as loaders and unloaders, but one movable stage 12 may also serve as both a loader and an unloader. Furthermore, even when using different stages as loaders and unloaders, the configuration is not limited to the above example, in which the lower movable stage 12 is used as the loader and the upper movable stage 12 is used as the unloader. Any movable stage may be set as the loader or unloader. The above-described transport mechanism 31 is configured to be shared by the four movable stages 12, which has the advantage of easily switching the use of the movable stages 12. Note that the orientation of the carriers C on the movable stages 12 is the same as the orientation of the carriers C on the retracting stage 13 of the loading / unloading shelf 15. Therefore, the retracting stage 13 may be provided instead of one of the movable stages 12 at the front or rear of the transport area 17.

[0084] Wafers W are stored in carriers C by lot. Meanwhile, in the manufacture of semiconductor devices, there is a trend toward producing a variety of products in small quantities. In response to this trend, there are cases where a relatively small number of wafers W are stored in a carrier C, and a large number of carriers C are loaded into the equipment for processing. In such cases, it is advantageous to install a larger number of the aforementioned retraction stages 13. The plan view of FIG. 15 and the side view of FIG. 16 show a carrier block D11 configured to install a larger number of stages 13.

[0085] In the carrier block D11, an evacuation stage 13 is provided on the shelf 15 where the external transfer stage 11 was provided in the carrier block D1 described above, instead of the external transfer stage 11. Three shelves 81 are provided on the carrier block D11, and these shelves 81 are located to the left of the evacuation stage 13 of the base 25. Four external transfer stages 11 are provided in a row in front and behind on the upper shelf 81. Then, for example, four evacuation stages 13 are each provided in a row in front and behind on the middle shelf 81 and the lower shelf 81. Carriers C can be transferred to and from the stages 11 and 13 of each shelf 81 by the carrier transfer mechanism 26.

[0086] In the carrier block D11, the carriers C are placed on each of the evacuation stages 13 on the shelf 15 and the middle and lower shelves 81 in the same orientation as the carriers C on the external delivery stage 11, but they may also be placed facing forward and backward, like the carriers C on the shelf 24. Note that the external delivery stage 11 only needs to be located in a position where the carriers C can be loaded and unloaded by an external transport mechanism accessed from above the device, and therefore may be located on the shelf 15 like the carrier block D1.

[0087] The plan view of FIG. 17 also shows a carrier block D12, which is a modification of the carrier block D1. The configuration of this carrier block D12 is outlined as follows: the carrier block D1 is separated into left and right halves at the boundary between the transfer region 17 of the carrier block D1 and the space 19, with a region 82 equipped with modules and a transfer mechanism formed between them, as if another block were interposed. A module stack T4 equipped with multiple TRSs is provided in the center of the front and rear of the region 82 on the left side. A transfer mechanism 83, configured similarly to the transfer mechanism 34, is provided between the module stacks T1 and T4. An inspection module 84 is provided behind the module stack T4 and the transfer mechanism 83 in a plan view. The transfer mechanism 83 transfers wafers W between the module stacks T1 and T4 and the inspection module 84. The transfer mechanism 31 transfers wafers W to the module stack T4 instead of the module stack T1.

[0088] Therefore, when a wafer W is transferred from a carrier C to the module stack T1, it passes through the module stack T4 and the transfer mechanism 83 in that order, and when a wafer W is transferred from the module stack T1 to a carrier C, it passes through the transfer mechanism 83 and the module stack T4 in that order. The inspection module 84 may be used for either pre-processing or post-processing inspection in the processing block. When inspecting a wafer W before processing, the wafer W is transferred to the inspection module 84 on the way from the module stack T4 to the module stack T1, and when inspecting a wafer W after processing, the wafer W is transferred to the inspection module 84 on the way from the module stack T1 to the module stack T4. As described above, the transfer of a wafer W between the transfer mechanism 31, which is the first substrate transfer mechanism, and the module stack T1, which is a plurality of substrate mounting portions arranged vertically, may be performed via a transfer mechanism 83 (third substrate transfer mechanism) different from the transfer mechanism 31.

[0089] In coating and developing apparatus 1, the upper processing block may be used as the outbound route for wafers W, and the lower processing block may be used as the return route for wafers W. Specifically, for example, an anti-reflective coating may not be formed within the apparatus, and resist film forming modules 49 may be provided as liquid processing modules in upper processing blocks 2B and 2D, respectively. Developing modules 41 may be provided as liquid processing modules in lower processing blocks 2A and 2C, respectively. Wafers W may be transported between blocks along a transport path reverse to the transport path described above, whereby resist film formation, exposure, and development may be carried out in that order to form a resist pattern.

[0090] Therefore, the shuttle is not limited to forming a return path, and the carrier block D1 is not limited to being configured to transfer the wafer W to the TRS for the shuttle that forms the return path. Also, a shuttle may be provided in each of the lower processing blocks 2A and 2C. For example, the liquid processing modules in these processing blocks 2A and 2C may both be resist film forming modules 49, and the shuttle may be used to transport the wafer W so that it is processed in the resist film forming module 49 of either processing block.

[0091] Furthermore, the liquid processing performed by the apparatus is not limited to the above examples, and may include forming an insulating film by applying a chemical liquid, forming a protective film for surface protection of a resist film by applying a chemical liquid, and applying an adhesive to bond wafers W together. Also, a cleaning process may be performed in which a cleaning liquid is supplied to the front or back surface of the wafer W. Therefore, the substrate processing apparatus of the present technology is not limited to a coating and developing apparatus.

[0092] Furthermore, the lower processing block and the upper processing block do not need to be connected to each other by the interface block D4. Specifically, a description will be given with reference to the schematic diagram of the substrate processing apparatus 8 in FIG. 18. In FIG. 18, the lower processing block and the upper processing block are designated G1 and G2, respectively. Assume that module stack T1 includes TRS21 to TRS23. TRS21 is used for delivery to and from carrier C, and wafers W are transported between carrier C and TRS21 by transfer mechanism 31. TRS22 and TRS23 are used for delivery to and from the lower processing block G1 and the upper processing block G2, and wafers W are transported between TRS21 and TRS22 and between TRS21 and TRS23 by transfer mechanism 34, respectively. Wafers W are loaded from carrier C via TRS21 into TRS22, and from TRS23 into the lower processing block G1 and the upper processing block G2, respectively, and are returned to carrier C via TRS22, TRS23, and TRS21 after processing. In other words, the apparatus may be configured so that the wafer W is processed in only one of the lower processing block and the upper processing block and then returned to the carrier C.

[0093] Furthermore, each of the lower processing block and the upper processing block is not limited to being composed of two processing blocks lined up horizontally, but may be composed of a single processing block. Furthermore, each of the lower processing block and the upper processing block may be composed of three or more processing blocks lined up horizontally, with wafers W being transported between the horizontally lined processing blocks. Furthermore, the processing blocks are not limited to being stacked vertically, but may be configured such that carrier block D1 is connected to only one processing block.

[0094] In each processing block, the liquid processing module is located at the front and the processing module stack 43 is located at the rear, but this layout may be reversed. In addition, in the carrier block D1, the layout of the transport mechanisms 31, 34 and the stages for the carrier C may be reversed. The arrangement of the carrier block D1 and the other blocks may also be reversed. The heights of the TRS and SCPL that make up the module stack T1 may be changed or the stacking order may be changed as appropriate within the range that allows wafers W to be transported within the apparatus.

[0095] The hydrophobic treatment module 35 may also be arranged so as to overlap the TRS and SCPL that make up the module stack T1. However, by arranging a large number of TRS and SCPL in the module stack T1 and placing wafers W on them, it is possible to quickly transfer wafers W between the carrier block D1 and the first processing block D2, and between the carrier C and the carrier block D1. Therefore, it is preferable to arrange the hydrophobic treatment module 35 behind the module stack T1, as described above.

[0096] 11, the bottles in the chemical liquid storage area 36 are for use in the liquid treatment in the lower processing block 2A, but depending on the liquid treatment to be performed in the upper processing block 2B, bottles for the liquid treatment in this processing block 2B may also be provided in the chemical liquid storage area 36. Even when the bottles of processing block 2B are provided in the chemical liquid storage area 36 in this way, the same effect as when the bottles of processing block 2A are provided in the chemical liquid storage area 36 can be achieved.

[0097] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects, and various omissions, substitutions, modifications, and combinations may be made to the above-described embodiments without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0098] C Carrier D1 Carrier Block SCPL Temperature Control Module TRS Handover Module W wafer 12 Moving stage 2A~2D Processing Blocks 31, 34 Conveying mechanism

Claims

1. a carrier block including a plurality of carrier placement sections including a carrier placement section for substrate loading / unloading on which a carrier is placed to load / unload a substrate into / from a carrier storing the substrate; a processing block provided on one of the left and right sides of the carrier block for processing the substrate; a first carrier placement portion and a second carrier placement portion, each of which is the carrier placement portion and is arranged side by side in the front-rear direction in a plan view, and each of which is a carrier placement portion for carrying in and out the substrate; a plurality of substrate placement sections, which are arranged on either the left or right side of a substrate transport area formed between the first carrier placement section and the second carrier placement section in a plan view, are arranged in a vertical direction, and each of which is provided with a substrate placed thereon; a first substrate transport mechanism including: a base that is provided in the transport area and rotates about a vertical axis but does not move in the front-to-back or left-to-right directions, in order to transfer the substrate between the carriers of the first carrier placement section and the second carrier placement section and a first substrate placement section included in the plurality of substrate placement sections; and a holding section that moves back and forth on the base and holds the substrate; a second substrate transport mechanism that moves up and down so as to transfer the substrate between the first substrate platform and a second substrate platform that is included in the plurality of substrate platforms and on which the substrate is placed in order to transfer the substrate to the processing block; Equipped with A substrate processing apparatus in which the first substrate transport mechanism rotates to one orientation for transferring the substrate to the carrier of the first carrier mounting section, and another orientation opposite to the one orientation for transferring the substrate to the carrier of the second carrier mounting section.

2. the plurality of carrier placement units include a third carrier placement unit on which the carrier is placed in a first orientation to load and unload the carrier into and from the carrier block; the carrier placement unit for substrate loading / unloading places the carrier in a second orientation different from the first orientation so that an opening for loading / unloading the substrate provided in the carrier faces either the front or rear side where the first substrate transport mechanism is located; The substrate processing apparatus according to claim 1 , further comprising an orientation change mechanism that changes the orientation of the carrier between the first orientation and the second orientation.

3. a carrier transport mechanism is provided to transport the carrier between the carrier placement sections; The substrate processing apparatus according to claim 2 , wherein the orientation changing mechanism is a transport mechanism for the carrier.

4. the plurality of carrier placement parts include a standby carrier placement part for causing the carrier to wait, in addition to the carrier placement part for carrying in and out the substrate and the third carrier placement part, 4. The substrate processing apparatus according to claim 3, wherein the carriers are placed in a line front to back with the openings facing forward or backward on each of the carrier placement sections for substrate loading and unloading and the carrier placement section for standby.

5. a plurality of carrier placement sections for carrying in and out substrates are provided in a vertical direction; 5. The substrate processing apparatus according to claim 1, wherein the first substrate transport mechanism moves up and down so as to be shared by each of the plurality of carrier placement sections for loading and unloading substrates.

6. the processing block includes a lower processing block and an upper processing block, each of which includes a first processing module that processes the substrate and a main transport mechanism that transfers the substrate to and from the first processing module, and which are stacked on top of each other; the second substrate platform includes a lower substrate platform and an upper substrate platform for transferring the substrate to and from the main transport mechanism of the lower processing block and the main transport mechanism of the upper processing block, respectively; 6. The substrate processing apparatus according to claim 1, wherein substrates before being transported to the processing block are transported to at least one of the lower platform and the upper platform.

7. A substrate processing apparatus as described in claim 6, wherein, if the side on which the plurality of substrate mounting portions are located with respect to the second substrate transport mechanism is defined as the front, a second processing module to which the substrate is transferred by the second substrate transport mechanism and which performs gas processing on the substrate is provided behind the second substrate transport mechanism.

8. At least one of the upper processing block and the lower processing block a processing block and another processing block arranged on the left and right, each of which includes the first processing module, the main transport mechanism, and a bypass transport mechanism for transporting the substrate to a downstream side of a transport path without passing through the first processing module; When the one processing block and one of the other processing blocks on the carrier block side are defined as one processing block, the substrate is transferred between the bypass transport mechanism and the second substrate transport mechanism in the one processing block; 8. The substrate processing apparatus according to claim 6, wherein the substrate is transferred between the bypass transport mechanism in the other processing block and the main transport mechanism in the one processing block.

9. a first processing module in at least one of the lower processing block and the upper processing block includes a liquid processing module that supplies a processing liquid to the substrate; A substrate processing apparatus as described in any one of claims 6 to 8, wherein a storage section for storing the processing liquid to supply to the liquid processing module is provided on the opposite side of the plurality of substrate mounting sections in the front-to-back direction from the side on which the second substrate transport mechanism is provided when viewed in a plane.

10. an inspection module for inspecting the substrate is provided so as to overlap the first carrier placement part or the second carrier placement part in a plan view; 10. The substrate processing apparatus according to claim 1, wherein the first substrate transport mechanism moves up and down so as to be shared by the carrier platform for substrate loading and unloading and the inspection module.

11. placing a carrier for storing substrates on each of a plurality of carrier placement sections in the carrier block; a step of loading / unloading the substrate onto / from a carrier placed on a carrier placement unit for substrate loading / unloading included in the plurality of carrier placement units; processing the substrate in a processing block provided on one side of the carrier block; a step of placing the carriers on a first carrier placement section and a second carrier placement section, each of which is the carrier placement section and is arranged side by side in the front-to-rear direction in a plan view, and which is a carrier placement section for carrying in and out the substrate; placing the substrate on each of a plurality of substrate placement units arranged in a vertical direction and provided on one of the left and right sides of a substrate transport area between the first carrier placement unit and the second carrier placement unit in a plan view; a step of rotating a first substrate transport mechanism provided in the transport region about a vertical axis to transfer the substrate between the carriers of the first carrier placement unit and the second carrier placement unit and a first substrate placement unit included in the plurality of substrate placement units; a step of lifting and lowering a second substrate transport mechanism to transfer the substrate between the first substrate platform and a second substrate platform included in the plurality of substrate platforms; transferring the substrate between the second substrate transport mechanism and the processing block; Equipped with The step of rotating about the vertical axis includes: a step of rotating a base provided on the first substrate transport mechanism without moving the base in the front-rear and left-right directions, so that the first substrate transport mechanism is rotated in one orientation for transferring the substrate to the carrier on the first carrier placement unit and in another orientation opposite to the one orientation for transferring the substrate to the carrier on the second carrier placement unit; transferring the substrate to the carriers of the first carrier placement unit and the second carrier placement unit by a holder that moves back and forth on the base; A substrate processing method comprising:

12. The processing block comprises a lower processing block and an upper processing block, each of which is provided with a first processing module for processing the substrate and a main transport mechanism for transferring the substrate to the first processing module, and which are stacked on top of each other; the second substrate platform includes a lower substrate platform and an upper substrate platform for transferring the substrate to and from the main transport mechanism of the lower processing block and the main transport mechanism of the upper processing block, respectively; 12. The substrate processing method according to claim 11, further comprising the step of transporting the substrate to at least one of the lower platform and the upper platform before being transported to the processing block.

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