Dresser, polishing pad dressing method, and glass substrate manufacturing method

Abstract

To solve the problems that a diamond dresser has a problem that a use life of a polishing pad becomes short because it grinds and removes the surface of the polishing pad, and a method for removing a clogging substance from a fine hole of a polishing pad using a brush dresser has a problem that the surface of the polishing pad is difficult to be ground, but a clogging substance accumulated in a fine hole cannot be surely removed; and to provide a dresser and a dressing method which can remove a clogging surface on a polished surface of a polishing pad while suppressing destruction of the polished surface of the polishing pad or coarsening of the polished surface, and can uniform dress the polished surface of the polishing pad.SOLUTION: A dresser has a cylindrical body part having a curve surface, and a dress part formed on the curve surface of the body part, wherein the dress part has a height from the curve surface of the body part of 1.0 mm or more and 30 mm or less.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a dresser used for dressing a polishing pad, a dressing method using the dresser, and a method for manufacturing a glass substrate using the dresser. [Background technology]

[0002] For example, the surface of a glass substrate used in a flat panel display (FPD) such as an LCD (Liquid Crystal Display) or an OLED (Organic Light-Emitting Diode) is polished by a polishing device. For example, Patent Document 1 describes a method of polishing the surface of a glass substrate using a polishing pad and a slurry.

[0003] The polishing pad has many micropores and grooves (hereinafter also referred to as "micropores") that hold abrasive grains dispersed in a slurry, and polishing is performed with the abrasive grains held on the polishing surface of the polishing pad by these micropores. However, repeated polishing of glass substrates causes clogging of the micropores on the polishing surface of the polishing pad, which reduces the polishing accuracy and polishing efficiency of the glass substrate, and may result in, for example, an uneven surface of the glass substrate or a long time required for polishing.

[0004] Therefore, after polishing a predetermined number of glass substrates, a dresser or the like on which diamond particles are electrodeposited is brought into contact with the polishing surface of the polishing pad to scrape off the area of ​​the polishing surface of the polishing pad that will be used to polish the glass substrates, thereby eliminating clogging. Patent Document 2 discloses a diamond dresser on which diamond particles are electrodeposited to form an abrasive grain layer, and a brush dresser made of a brush. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-122351 [Patent Document 2] Japanese Patent Application Publication No. 11-333698 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the diamond dresser described in Patent Document 2 has the problem of shortening the service life of the polishing pad because it grinds away the surface of the polishing pad. In particular, suede-type polishing pads, which have a polyurethane foam layer (hereinafter also referred to as a "NAP layer") on the polishing surface of the polishing pad, tend to have a shortened service life because the NAP layer is easily ground away by the diamond dresser.

[0007] In addition, the method of using a brush dresser to remove clogging materials from the micropores of a polishing pad has the problem that, although the surface of the polishing pad is hardly ground, the clogging materials accumulated in the micropores cannot be reliably removed. Furthermore, when the polishing pad is a suede-type polishing pad, the NAP layer on the polishing surface is destroyed, causing unevenness on the polishing surface of the polishing pad, which can result in problems such as not being able to sufficiently reduce the surface roughness or waviness of the polished glass substrate, or causing the polished glass substrate to have uneven surface roughness.

[0008] The inventors also found that when using a circular, flat dresser such as that disclosed in Patent Document 2, the accuracy of removing clogging materials from the polishing surface tends to be uneven. This is thought to be because the contact time between the polishing pad and the dresser varies depending on the location.

[0009] For example, when a circular, flat dresser is used and the polishing pad and the circular, flat dresser are rotated relative to each other, the contact time between the central portion and the outer periphery of the polishing pad differs. Therefore, for example, if the contact time between the outer periphery of the polishing pad and the dresser is shorter than the contact time between the central portion of the polishing pad and the dresser, there is a risk that clogging substances in the central portion of the polishing pad may be removed but clogging substances in the outer periphery of the polishing pad may not be removed.

[0010] An object of the present invention is to provide a dresser and a dressing method that can remove clogging substances on the polishing surface of a polishing pad while preventing the polishing surface of the polishing pad from being damaged or becoming rough due to the generation of irregularities, and that can uniformly dress the polishing surface of the polishing pad. [Means for solving the problem]

[0011] (1) A dresser according to the present invention comprises a cylindrical main body having a curved surface and a dressing portion formed on the curved surface of the main body, the dressing portion having a height of 1.0 mm or more and 30 mm or less from the curved surface of the main body. (2) The dresser according to (1), wherein the dressing portion is formed in a spiral shape along the curved surface of the main body portion, and the dressing portion is formed at a lead angle of 10° or more and 80° or less with respect to a direction perpendicular to the axial direction of the main body portion. (3) The dresser according to (2), wherein the number of the dressing portions formed spirally along the curved surface of the main body is 3 or more and 30 or less. (4) The dresser according to (2) or (3), wherein the pitch of the dressing portions in the axial direction of the main body portion is 10 mm or more and 200 mm or less. (5) The dresser according to any one of (2) to (4), wherein the width of the dress portion in a direction perpendicular to the extending direction of the dress portion is 1.0 mm or more and 25 mm or less. (6) The dresser according to any one of (1) to (5), wherein the axial length of the main body is 1500 mm or more and 5500 mm or less. (7) The dresser according to any one of (1) to (6), wherein the diameter of the main body is 30 mm or more and 200 mm or less. (8) A dresser according to any one of (1) to (7), wherein the dressing portion has an end face that contacts the polishing surface of the polishing pad during dressing, and a side face that connects the end face and the main body portion, and a chamfered portion is formed between the end face and the side face. (9) A dresser described in any one of (1) to (8), wherein the dressing portion has an end face that contacts the polishing surface of the polishing pad during dressing and a side face that connects the end face and the main body portion, and the end face of the dressing portion has a recess. (10) The dresser according to (9), wherein the depth of the recess is 0.1 mm or more and 0.8 mm or less. (11) A method for dressing a polishing surface of a polishing pad using the dresser according to any one of (1) to (10), characterized in that the dresser is rotated around the central axis of the main body as a rotation axis while the dressing portion is in contact with the polishing surface of the polishing pad, and the dresser and the polishing pad are moved relative to each other to dress the polishing surface of the polishing pad. (12) The method for dressing a polishing pad according to (11), wherein the polishing surface of the polishing pad is dressed while the dresser is oscillated in the axial direction of the main body. (13) The method for dressing a polishing pad according to (11) or (12), wherein the polishing surface of the polishing pad is dressed while supplying a slurry to the polishing surface of the polishing pad. (14) A method for manufacturing a glass substrate, comprising a polishing step of polishing a glass substrate with a polishing pad dressed using a dresser according to any one of (1) to (10). (15) The method for producing a glass substrate according to (14), wherein the glass substrate is for a display. [Effects of the Invention]

[0012] According to the present invention, it is possible to provide a dresser and a dressing method that can remove clogging substances on the polishing surface of a polishing pad while suppressing damage or roughening of the polishing surface of the polishing pad, and that can uniformly dress the polishing surface of the polishing pad. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a plan view showing the first embodiment. [Figure 2]FIG. 2 is a cross-sectional view taken along line 2-2 of FIG. [Figure 3] FIG. 3 is an enlarged view of the dress portion in the cross-sectional view taken along line 2-2 of FIG. [Figure 4] FIG. 4 is a plan view showing a modified example of the first embodiment. [Figure 5] FIG. 5 is a plan view showing the second embodiment. [Figure 6] FIG. 6 is a cross-sectional view taken along line 6-6 of FIG. [Figure 7] FIG. 7 is a plan view showing the third embodiment. [Figure 8] FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. [Figure 9] FIG. 9 is a plan view showing the fourth embodiment. [Figure 10] FIG. 10 is a plan view showing a modified example of the fourth embodiment. [Figure 11] FIG. 11 is a plan view showing the fifth embodiment. [Figure 12] FIG. 12 is a conceptual diagram showing the principle of removing clogging substances using the dresser of the present invention. [Figure 13] FIG. 13 is a plan view of a dressing method using the dresser according to the first embodiment. [Figure 14] FIG. 14 is a side view of a dressing method using the dresser according to the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0015] 1 to 11 are conceptual diagrams showing a dresser according to the present invention, Fig. 12 is a conceptual diagram showing the principle of removing clogging substances using the dresser according to the present invention, and Figs. 13 and 14 are conceptual diagrams showing a dressing method. Figs. 13 and 14 show the dresser of the first embodiment shown in Fig. 1.

[0016] 1 to 11 are conceptual diagrams of a dresser used to dress a polishing pad used in polishing a glass substrate, such as a flat panel display (FPD) such as an LCD (Liquid Crystal Display) or an OLED (Organic Light-Emitting Diode).

[0017] The dresser according to the present invention includes a cylindrical main body having a curved surface and a dressing portion formed on the curved surface of the main body. In this specification, the axial direction of the cylindrical main body is referred to as the X-direction, and the direction perpendicular to the axial direction is referred to as the Y-direction.

[0018] (First embodiment) 1, in the first embodiment, the dress portion 14 is formed in a spiral shape along the curved surface of the main body portion 12. In the first embodiment, the number of threads, pitch P, lead L, and lead angle α are defined as follows:

[0019] (Number of articles) In the first embodiment, the number of threads refers to the number of dressing portions 14 formed spirally along the curved surface of the main body portion 12. The number of threads in the dresser 10 shown in FIG. 1 is three. Therefore, when the dresser 10 shown in FIG. 1 is cut along the cut surface 2-2, dressing portions 14 are formed in three locations on the curved surface of the main body portion 12 as shown in FIG. 2.

[0020] The greater the number of grooves, the better the removal performance of clogging materials from the polishing pad. Therefore, the number of grooves is preferably 3 or more, more preferably 5 or more, and even more preferably 10 or more. If the number of grooves is too large, the dressing portion 14 may be too densely packed on the curved surface of the main body portion 12, which may reduce the removal performance. Therefore, the number of grooves is preferably 30 or less, more preferably 25 or less, and even more preferably 20 or less.

[0021] (Pitch P) In the first embodiment, the pitch P refers to the distance in the X direction of the dress portion 14 spirally formed along the curved surface of the main body 12. The smaller the pitch P, the denser the dress portions 14 are formed on the curved surface of the main body 12. If the pitch P is too small, the dress portions 14 will be too densely arranged on the curved surface of the main body 12, which may result in a decrease in the performance of removing clogging substances. Therefore, the pitch P is preferably 10 mm or more, more preferably 15 mm or more, and even more preferably 20 mm or more. Furthermore, if the pitch P is too large, the number of contacts between the dress portion 14 and the polishing surface of the polishing pad during dressing will decrease, which may result in a decrease in the performance of removing clogging substances. Therefore, the pitch P is preferably 200 mm or less, more preferably 100 mm or less, and even more preferably 50 mm or less.

[0022] (Lead L) In the first embodiment, the lead L refers to the distance in the X direction that a specific dress portion 14, of the one or more dress portions 14 formed spirally along the curved surface of the main body 12, travels when the dress portion 14 makes one full revolution around the curved surface of the cylindrical main body 12. Therefore, in the case of a dresser with one thread, the lead L and the pitch P match, but if the number of threads is not one, they do not match, and the lead L is the product of the number of threads and the pitch P. Therefore, the lead L is determined by the number of threads and the pitch P and is not particularly limited.

[0023] (Lead angle α) In the first embodiment, the lead angle α refers to the acute angle α (0°<α<90°) formed by the dressing portion 14 and the direction perpendicular to the axial direction of the main body portion 12 (Y direction). If the lead angle α is too small, the performance of removing clogging substances will decrease. Therefore, the lead angle α is preferably 10° or more, more preferably 20° or more, even more preferably 30° or more, and particularly preferably 40° or more. Furthermore, if the lead angle α is too large, the performance of removing clogging substances will decrease. Therefore, the lead angle α is preferably 80° or less, more preferably 70° or less, even more preferably 60° or less, and particularly preferably 50° or less.

[0024] (Main body) The main body 12 of the dresser 10 according to the present invention is cylindrical and has a curved surface. The material of the main body 12 is not particularly limited, but is, for example, stainless steel. The main body 12 may also have a hollow structure. The hollow structure allows the dresser to be lightweight and can be driven with less power.

[0025] If the diameter of the main body 12 is large, more dressing portions 14 can be formed on the curved surface of the main body 12, which is expected to improve the performance of removing clogging materials per rotation of the dresser 10. Therefore, the diameter of the main body 12 is preferably 20 mm or more, more preferably 40 mm or more, even more preferably 60 mm or more, and particularly preferably 80 mm or more. If the diameter of the main body 12 is small, the dresser 10 of the present invention can be rotated with less power, and a dressing device using the dresser 10 of the present invention can have a simple structure. Therefore, the diameter of the main body 12 is preferably 300 mm or less, more preferably 200 mm or less, even more preferably 150 mm or less, and particularly preferably 120 mm or less.

[0026] When the polishing pad is circular, the axial length of the main body 12 is preferably longer than the diameter of the polishing pad. When the polishing pad is rectangular, the axial length of the main body 12 is preferably longer than at least one side of the rectangular polishing pad. This allows the polishing surface to be dressed at once, improving polishing efficiency. The axial length of the main body 12 can be adjusted appropriately depending on the size of the polishing pad to be dressed, but is, for example, 1500 mm or more and 5500 mm or less.

[0027] (Dress Department) The dressing portion 14 is a convex portion formed on the curved surface of the main body portion 12, and is a portion that dresses the polishing pad. An enlarged view of the dressing portion 14 in FIG. 2 is shown in FIG. 3. The dressing portion 14 has an end face 16 that abuts against the polishing surface of the polishing pad during dressing, and a side face 18 that connects the end face 16 and the main body portion 12. A chamfered portion 20 may also be formed between the end face 16 and the side face 18.

[0028] The material of the dress portion 14 may be different from that of the main body portion 12, but from the viewpoint of ease of processing, it is preferable to use the same material. The dress portion 14 is made of, for example, stainless steel.

[0029] If the height H of the dress portion 14 is too low, it becomes difficult to remove clogging substances from the polishing pad. Therefore, the height H of the dress portion 14 is 1.0 mm or more, preferably 2.0 mm or more, more preferably 3.0 mm or more, and even more preferably 5.0 mm or more. Furthermore, if the height H of the dress portion 14 is too high, force may be applied to the dress portion 14 near the main body portion 12 when removing clogging substances, which may cause deformation of the dress portion 14. Therefore, the height H of the dress portion 14 is 30 mm or less, preferably 20 mm or less, more preferably 15 mm or less, and even more preferably 10 mm or less.

[0030] In the first embodiment, the width W of the dress portion 14 is measured in a direction perpendicular to the extension direction of the dress portion 14 (the direction inclined by the lead angle α from the Y direction). If the width W of the dress portion 14 is too small, the strength will be low and the dress portion 14 may be deformed. Therefore, the width W of the dress portion 14 is preferably 1.0 mm or more, more preferably 2.0 mm or more, and even more preferably 3.0 mm or more. Furthermore, if the width W of the dress portion 14 is small, the pressure applied when pressed against the polishing pad will be high, thereby improving the performance of removing clogging substances. Therefore, the width W of the dress portion 14 is preferably 15 mm or less, more preferably 10 mm or less, even more preferably 8.0 mm or less, and particularly preferably 5.0 mm or less.

[0031] In the first embodiment, the aspect ratio H / W (dimensionless) of the dress portion 14, obtained by dividing the height H of the dress portion 14 by the width W, is preferably 5.0 or less, more preferably 3.0 or less, and particularly preferably 2.0 or less. By having the aspect ratio below the upper limit, the dress portion becomes less susceptible to deformation. Furthermore, the aspect ratio is preferably 0.1 or more, more preferably 0.5 or more, and even more preferably 1.0 or more.

[0032] Furthermore, it is preferable that the corners formed by the end face 16 and side face 18 of the dressing portion 14 are chamfered. In this case, a chamfered portion 20 is formed between the end face 16 and the side face 18. The chamfered portion 20 is preferably a C-chamfer or an R-chamfer. Chamfering the corners can prevent the polishing surface of the polishing pad from becoming uneven during dressing. This is particularly effective when used with a suede-type polishing pad that has a NAP layer formed on the polishing surface of the polishing pad.

[0033] C-chamfering and R-chamfering are sufficient as long as they can remove the corners formed by the end face and side face of the dressing portion. Therefore, in the case of C-chamfering, the chamfering depth is, for example, 0.3 mm to 1.0 mm. C-chamfering is preferable because it is easy to process. R-chamfering results in a smooth shape, which can better prevent unevenness from occurring on the polishing surface of the polishing pad during dressing.

[0034] (Modification of the first embodiment) A modification of the first embodiment is shown in Fig. 4. The dresser 10 shown in Fig. 4 has a recess 22 on the end surface 16 of the dressing portion 14.

[0035] (Concave on the end surface of the dressing part) In FIG. 4, the recesses 22 are formed along the width direction of the dress portion 14, but the direction is not limited thereto and may be formed, for example, along the axial direction of the cylindrical main body portion 12. By forming the recesses 22 on the end surface 16 of the dress portion, the performance of removing clogging substances is improved. The width of the recesses 22 is preferably 0.1 mm or more, more preferably 0.3 mm or more, and even more preferably 0.5 mm or more. If the width is equal to or greater than the above-mentioned lower limit, the performance of removing clogging substances by the recesses 22 is improved. Furthermore, the width of the recesses 22 is preferably 2.0 mm or less, more preferably 1.5 mm or less, and even more preferably 1.2 mm or less.

[0036] The depth of the recesses 22 is preferably 0.1 mm or more, more preferably 0.2 mm or more, and even more preferably 0.3 mm or more. If the depth is equal to or greater than the lower limit, it can be expected that the performance of removing clogging substances by the recesses 22 will be improved. The depth of the recesses 22 is preferably 0.8 mm or less, more preferably 0.7 mm or less, and even more preferably 0.6 mm or less.

[0037] If the distance between adjacent recesses 22 is too small, the strength of the dress portion 14 may decrease, so the distance between adjacent recesses 22 is preferably 1.0 mm or more, more preferably 2.0 mm or more, and even more preferably 3.0 mm or more. Also, if the distance between adjacent recesses 22 is too large, improvement in removal performance by the recesses 22 cannot be expected. Therefore, the distance between adjacent recesses 22 is preferably 50 mm or less, more preferably 30 mm or less, and even more preferably 20 mm or less.

[0038] The dressers of the second to fifth embodiments will be described below. The dressers of the second to fifth embodiments differ from the dresser of the first embodiment in the shape of the dressing portion. Except for the shape of the dressing portion, the main body, the height and width of the dressing portion, and the chamfering of the corners formed by the end faces and side faces are the same for the dressers described in the second to fifth embodiments as for the dresser of the first embodiment, unless otherwise specified.

[0039] (Second embodiment) A dresser 10 according to a second embodiment is shown in FIG. 5. In the dresser 10 according to the second embodiment, the dress portions 14 are formed parallel to the axial direction (X direction) of the main body 12. The dresser 10 according to the second embodiment has a plurality of dress portions 14 on the curved surface of the main body 12. The plurality of dress portions 14 are formed in a striped pattern. The number of dress portions 14 is not particularly limited, but may be, for example, 3 to 30. FIG. 6 is a cross-sectional view of the dresser 10 according to the second embodiment taken along line 6-6. The dresser 10 shown in FIG. 6 has eight dress portions 14 formed thereon.

[0040] In the case of the dresser 10 of the second embodiment, the width W of the dressing portion 14 is measured in a direction perpendicular to the axial direction of the main body 12. In the dresser 10 of the second embodiment, by providing a recess 22 (see FIG. 4) on the end face 16 of the dressing portion 14, it is expected that the performance of removing clogging substances will be improved.

[0041] (Third embodiment) FIG. 7 shows a dresser 10 according to a third embodiment. In the dresser 10 according to the third embodiment, the dressing portions 14 are formed in a zigzag pattern on the curved surface of the main body 12. Other than the zigzag pattern, the dressing portions 14 may be formed in a wavy pattern, such as a sine curve. A wavy pattern such as a sine curve has fewer corners than a zigzag pattern, thereby preventing scratches on the polishing surface of the polishing pad. FIG. 8 is a cross-sectional view of the dresser 10 according to the third embodiment. The dresser 10 shown in FIG. 8 has six dressing portions 14. In the dresser 10 according to the third embodiment, the dressing portions 14 may also have recesses 22 (see FIG. 4) on the end surfaces 16 of the dressing portions 14, which is expected to improve the performance of removing clogging substances.

[0042] (Fourth embodiment) A dresser 10 according to a fourth embodiment is shown in FIG. 9. In the dresser 10 according to the fourth embodiment, the dress portions 14 are formed in a checkerboard pattern on the curved surface of the main body 12. Each dress portion 14 is, for example, rectangular with one side measuring 3.0 mm to 30 mm. The shape of each dress portion 14 is not limited to a rectangular shape. As shown in FIG. 10, the shape of each dress portion 14 shown in FIG. 9 may be changed from rectangular to circular. That is, the dress portions 14 may be formed in a polka dot shape. The diameter of the circular dress portion 14 is not particularly limited, but is, for example, 3.0 mm to 30 mm. In the dresser 10 according to the fourth embodiment, by providing a recess 22 (see FIG. 4) on the end surface 16 of the dress portion 14, improved performance in removing clogging substances can be expected.

[0043] (Fifth embodiment) The dresser 10 shown in FIG. 11 has a mesh-like dress portion 14. The width of the mesh-like dress portion 14 is preferably 1.0 mm or more, more preferably 2.0 mm or more, and even more preferably 3.0 mm or more. Being equal to or greater than the lower limit described above prevents deformation of the dress portion 14. Furthermore, the width W of the dress portion 14 is preferably 15 mm or less, more preferably 10 mm or less, even more preferably 8.0 mm or less, and particularly preferably 5.0 mm or less. A smaller width W of the dress portion 14 increases the pressure applied when pressed against the polishing pad, which is thought to improve the performance of removing clogging substances. In the dresser 10 of the fifth embodiment, providing a recess 22 (see FIG. 4) on the end face 16 of the dress portion 14 can also be expected to improve the performance of removing clogging substances.

[0044] (Principle of Removal of Clogged Substances by a Dresser in an Embodiment of the Present Invention) 12 is a conceptual diagram showing the principle of removal of clogging material 26 by the dresser 10 of the present invention. The polishing pad 28 is made of, for example, synthetic resin fiber, nonwoven fabric, or urethane, and is a porous material having numerous micropores 24. Abrasive grains in the slurry are held in the micropores 24, and the glass substrate is polished by being pressed against the polishing surface of the polishing pad 28.

[0045] However, as the polishing operation progresses, the micropores 24 of the polishing pad 28 become clogged with abrasive grains whose polishing ability has decreased, polishing debris, etc., and are no longer able to hold new abrasive grains that are supplied. Therefore, the polishing pad 28 is dressed by the dresser 10, for example, every time a predetermined number of glass substrates are polished.

[0046] As shown in Figures 12(a) to 12(c), clogging substances 26 in the micropores 24 are removed by the dressing portion 14 pressing the protrusions that form the micropores 24 from the side of the protrusions. At this time, the clogging substances 26 can be removed from the micropores 24 of the polishing pad 28 because the height H (see Figure 3) of the dressing portion 14 from the curved surface of the main body 12 is 1.0 mm or more. Furthermore, because the dresser 10 moves relative to the polishing pad 28, the dressing portion 14 presses adjacent protrusions in sequence. Ultimately, the clogging substances 26 are removed from the micropores 24 on the entire surface of the polishing pad.

[0047] (Dressing method using a dresser according to an embodiment of the present invention) Dressing of a polishing pad using the dresser of the present invention is performed as follows. The polishing pad 28 is located on the XY plane as shown in FIG. 13. The dresser 10 is positioned above the polishing surface of the polishing pad 28, which has finished polishing a predetermined number of glass substrates, and the dressing portion 14 is brought into contact with the polishing surface of the polishing pad 28. Next, the dresser 10 is rotated around the central axis of the main body 12 as the axis of rotation and moved from one end of the polishing pad 28 to the other end (in the direction of arrow A). The moving direction is perpendicular to the axial direction of the main body 12. At this time, a slurry 32 may be supplied from a slurry supply portion 30 to the polishing surface of the polishing pad 28. By dressing while supplying the slurry 32, clogging substances 26 can be efficiently removed. For example, cerium oxide is used as the slurry 32.

[0048] Alternatively, the dressing may be performed while the dresser 10 is oscillated in the axial direction (direction of arrow B) of the main body 12. This allows the clogging substances 26 to be removed efficiently.

[0049] The rotation direction of the dresser 10 (the direction of arrow C) at the contact point between the dresser 10 and the polishing pad 28 is preferably the same as the movement direction of the dresser 10 (the direction of arrow A) relative to the polishing pad 28. This makes it easier for the dressing portion 14 to press the side surfaces of the convex portions on the polishing surface of the polishing pad 28, thereby enabling efficient removal of the clogging substances 26.

[0050] After the dresser 10 is moved from one end of the polishing pad 28 to the other, the dressing portion 14 and the polishing pad 28 may be separated, and the polishing pad 28 and the dresser 10 may be rotated relatively in the XY plane, followed by another dressing. By rotating the polishing pad 28 and the dresser 10 relatively in the XY plane and dressing the polishing pad 28 from multiple directions, clogging substances 26 on the polishing pad 28 can be reliably removed. That is, for example, when a circular polishing pad 28 is used as shown in FIG. 13, the polishing pad 28 is rotated about point O.

[0051] According to the above configuration, clogging substances 26 on the polishing surface of the polishing pad 28 can be removed while preventing the polishing surface of the polishing pad 28 from being destroyed or roughened, and the polishing surface of the polishing pad 28 can be uniformly dressed. [Explanation of symbols]

[0052] 10...Dresser 12...Main body 14...Dress Club 16...End face 18...Side 20...Beveled part 22...recess 24...Micropore 26...Clogging substances 28...Polishing pad 30...Slurry supply section 32...Slurry 34...Spray nozzle

Claims

1. A dresser for dressing a polishing surface of a polishing pad, a cylindrical main body having a curved surface; a dress portion formed on the curved surface of the main body portion, the dress portion has a height of 1.0 mm or more and 30 mm or less from the curved surface of the main body portion, the dressing portion has an end surface that contacts the polishing surface of the polishing pad during dressing, and a side surface that connects the end surface and the main body portion; A chamfer is formed between the end surface and the side surface, The dresser is characterized in that the material of the dress portion is stainless steel.

2. 2. The dresser according to claim 1, wherein the dressing portion is formed in a spiral shape along the curved surface of the main body portion, and the dressing portion is formed at a lead angle of 10° to 80° with respect to a direction perpendicular to the axial direction of the main body portion.

3. 3. The dresser according to claim 2, wherein the number of the dressing portions formed spirally along the curved surface of the main body is 3 or more and 30 or less.

4. 4. The dresser according to claim 2, wherein the axial pitch of the dressing portions is 10 mm or more and 200 mm or less.

5. 5. The dresser according to claim 2, wherein the width of the dress portion in a direction perpendicular to the extending direction of the dress portion is 1.0 mm or more and 25 mm or less.

6. 6. The dresser according to claim 1, wherein the axial length of the main body is 1500 mm or more and 5500 mm or less.

7. 7. The dresser according to claim 1, wherein the diameter of the main body is 30 mm or more and 200 mm or less.

8. the dressing portion has an end surface that contacts the polishing surface of the polishing pad during dressing, and a side surface that connects the end surface and the main body portion; 8. The dresser according to claim 1, wherein the end surface of the dressing portion has a recess.

9. 9. The dresser according to claim 8, wherein the depth of the recess is 0.1 mm or more and 0.8 mm or less.

10. A dressing method for dressing a polishing surface of a polishing pad using the dresser according to any one of claims 1 to 9, rotating the dresser about the central axis of the main body as a rotation axis while the dressing portion is in contact with the polishing surface of the polishing pad; a dresser for dressing a polishing pad, the dressing being performed by moving the dresser and the polishing pad relatively to each other;

11. 11. The method for dressing a polishing pad according to claim 10, wherein the polishing surface of the polishing pad is dressed while the dresser is oscillated in the axial direction of the main body.

12. 12. The method for dressing a polishing pad according to claim 10, wherein the polishing surface of the polishing pad is dressed while supplying a slurry to the polishing surface of the polishing pad.

13. A method for manufacturing a glass substrate, comprising a polishing step of polishing a glass substrate with a polishing pad that has been dressed using the dresser according to any one of claims 1 to 9.

14. The method for manufacturing a glass substrate according to claim 13, wherein the glass substrate is for a display.

Images