Film capacitor and method for manufacturing the same

Abstract

A film capacitor according to the present disclosure is to be mounted on a substrate, and comprises: a multilayer body of dielectric films; a first electrode; a second electrode; a terminal electrode which comprises a connection part that is electrically connected to the first electrode or the second electrode, and an extension part that extends from the connection part toward the substrate in a direction along the first electrode or the second electrode; and an outer covering material which covers the multilayer body, the first electrode, the second electrode, the connection part, and at least a part of the extension part. This film capacitor is formed into a columnar shape which has a lateral surface that connects the first electrode and the second electrode to each other; the lateral surface has a curved part; and if the film capacitor is mounted on the substrate, at least a part of the extension part is arranged at a position that is deviated from a point of the curved part closest to the substrate within a space that is formed between the substrate and a region of the curved part facing the substrate.

Description

[Technical Field]

[0001] The present disclosure relates to a film capacitor and a method for manufacturing the film capacitor. [Background technology]

[0002] 2. Description of the Related Art A film capacitor is known in which a laminate of dielectric films is sealed with resin.

[0003] For example, Patent Document 1 describes a film capacitor that is coated with resin and has an exterior sealed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 08-316110 Summary of the Invention [Problem to be solved by the invention]

[0005] The film capacitor described in Patent Document 1 has room for improvement in terms of miniaturization and height reduction.

[0006] The present invention provides a film capacitor that has been made smaller and thinner, and a method for manufacturing the film capacitor. [Means for solving the problem]

[0007] A film capacitor according to one embodiment of the present invention is a film capacitor mounted on a substrate, and comprises: a laminate of dielectric films; a first electrode formed on one end surface of the laminate; a second electrode formed on the other end surface of the laminate; a terminal electrode having a connection portion electrically connecting to the first electrode or the second electrode; and an extension portion extending from the connection portion toward the substrate in a direction along the first electrode or the second electrode; and an exterior material covering the laminate, the first electrode, the second electrode, the connection portion, and at least a portion of the extension portion; the film capacitor is formed in a columnar shape having a side connecting the first electrode and the second electrode, the side having a curved portion, and at least a portion of the extension portion is positioned within a space formed between the substrate and the area of ​​the curved portion facing the substrate when the film capacitor is mounted on the substrate, and is shifted from the position of the curved portion closest to the substrate.

[0008] A method for manufacturing a film capacitor according to one aspect of the present invention includes the steps of forming a laminate of dielectric films, forming external electrodes on both ends of the laminate, connecting terminal electrodes to the external electrodes, the terminal electrodes having connection portions with the external electrodes and extension portions extending from the connection portions, immersing the laminate with the terminal electrodes connected in a liquid exterior material, and hardening the exterior material, wherein the step of immersing the laminate with the terminal electrodes connected in the liquid exterior material includes tilting the extension portions of the terminal electrodes from a direction perpendicular to the liquid surface of the exterior material. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a film capacitor that has been made smaller and thinner, and a method for manufacturing the film capacitor. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view showing a film capacitor according to a first embodiment; [Figure 2] Front view of the film capacitor in Figure 1 [Figure 3] Side view of the film capacitor in Figure 1 [Figure 4]Figure 1: Film capacitor with the exterior casing omitted [Figure 5] Figure 2: Film capacitor with the exterior casing omitted [Figure 6] Figure 3: Film capacitor with the exterior casing omitted [Figure 7] Front view of the film capacitor in Figure 1 mounted on a board [Figure 8] Flowchart showing the manufacturing method of a film capacitor [Figure 9A] FIG. 1 is a diagram showing the state before the laminate is immersed in liquid resin. [Figure 9B] A diagram showing a state in which the laminate is immersed in liquid resin. [Figure 9C] A diagram showing the state in which the laminated body immersed in the liquid resin is pulled up. [Figure 10] FIG. 10 is a perspective view showing a film capacitor according to a second embodiment; [Figure 11] Front view of the film capacitor in Figure 10 [Figure 12] Side view of the film capacitor in Figure 10 [Figure 13] A diagram showing the film capacitor of Figure 10 mounted on a board [Figure 14] A diagram showing a state in which the laminate is immersed in liquid resin. [Figure 15] FIG. 10 is a perspective view showing a film capacitor according to a third embodiment. [Figure 16] Front view of the film capacitor in Figure 14 [Figure 17] Side view of the film capacitor in Figure 14 [Figure 18] Figure 15 showing the film capacitor without the outer casing [Figure 19] Figure 17 showing the film capacitor without the outer casing [Figure 20] A diagram showing a state in which the laminate is immersed in liquid resin. [Figure 21] FIG. 10 is a perspective view showing a film capacitor according to a fourth embodiment. [Figure 22] Front view of the film capacitor in Figure 21 [Figure 23] Figure 21 showing the film capacitor without the outer casing [Figure 24] Figure 22 showing the film capacitor without the outer casing [Figure 25] FIG. 22 is a perspective view showing the terminal electrodes of the film capacitor of FIG. 21. [Figure 26] A diagram showing a state in which the laminate is immersed in liquid resin. [Figure 27] A diagram showing the film capacitor of Figure 21 mounted on a board. DETAILED DESCRIPTION OF THE INVENTION

[0011] (Background to the invention) Wound film capacitors, which are formed by winding a dielectric film, generally have rounded sides. When mounted on a circuit board, these rounded sections become dead space, hindering efforts to make devices more compact.

[0012] Furthermore, when the exterior is sealed by painting with resin, as in the film capacitor described in Patent Document 1, excess resin adheres to the terminals, which creates an even larger dead space when the capacitor is mounted on a board.

[0013] Therefore, the present inventor(s) studied a film capacitor in which terminal electrodes are arranged in areas that become dead spaces when mounted on a substrate, and arrived at the following invention.

[0014] A film capacitor according to a first aspect of the present invention is a film capacitor mounted on a substrate, and comprises: a laminate of dielectric films; a first electrode formed on one end surface of the laminate; a second electrode formed on the other end surface of the laminate; a terminal electrode having a connection portion electrically connecting to the first electrode or the second electrode; and an extension portion extending from the connection portion toward the substrate in a direction along the first electrode or the second electrode; and an exterior material covering the laminate, the first electrode, the second electrode, the connection portion, and at least a portion of the extension portion; the film capacitor is formed in a columnar shape having a side connecting the first electrode and the second electrode, the side having a curved portion, and at least a portion of the extension portion is positioned within a space formed between the substrate and a region of the curved portion facing the substrate when the film capacitor is mounted on the substrate, and is shifted from the position of the curved portion closest to the substrate.

[0015] With this configuration, the distance between the film capacitor and the substrate when mounted on the substrate can be reduced, thereby making it possible to achieve a smaller and thinner device.

[0016] In the film capacitor according to a second aspect of the present invention, a portion of the exterior material that covers at least a part of the extension portion may be disposed in the space.

[0017] This configuration allows excess exterior material adhering to the terminal electrodes to be placed in dead space, thereby reducing the distance between the film capacitor and the board when mounted. Furthermore, the board mounting area can be reduced, improving design flexibility.

[0018] In the film capacitor according to the third aspect of the present invention, the portion of the exterior material that covers at least a part of the extended portion may be disposed at a position farther from the substrate than the position of the curved portion that is closest to the substrate.

[0019] With this configuration, it is possible to achieve further miniaturization and a lower profile.

[0020] In the film capacitor according to the fourth aspect of the present invention, the extension portion may include a first extension portion extending from the connection portion along the curved portion, and a second extension portion extending from the first extension portion toward the substrate.

[0021] With this configuration, the spacing between the terminal electrodes can be changed without increasing the mounting area.

[0022] In the film capacitor according to the fifth aspect of the present invention, the terminal electrode may further have a substrate connecting portion extending from the extension portion in a direction along the substrate, and the substrate connecting portion may be disposed within the space.

[0023] With this configuration, it is possible to provide a film capacitor that is compatible with surface mounting while reducing the mounting area.

[0024] In the film capacitor according to the sixth aspect of the present invention, part of the side surface of the film capacitor may be in contact with the substrate.

[0025] This configuration increases the number of contact points between the substrate and the film capacitor, thereby improving stability when mounted on the substrate.

[0026] In the film capacitor according to the seventh aspect of the present invention, the curved portion may have a diameter of 8 mm or more.

[0027] With this configuration, a large space can be formed between the substrate and the film capacitor, so that the mounting area can be reduced and the effect of a low profile can be easily achieved.

[0028] A method for manufacturing a film capacitor according to an eighth aspect of the present invention includes the steps of forming a laminate of dielectric films, forming external electrodes on both ends of the laminate, connecting terminal electrodes to the external electrodes, the terminal electrodes having connection portions with the external electrodes and extension portions extending from the connection portions, immersing the laminate with the terminal electrodes connected in a liquid exterior material, and hardening the exterior material, wherein the step of immersing the laminate with the terminal electrodes connected in the liquid exterior material includes tilting the extension portions of the terminal electrodes from a direction perpendicular to the liquid surface of the exterior material.

[0029] With this configuration, it is possible to manufacture a film capacitor that is small in size and has a low profile.

[0030] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In each drawing, elements are exaggerated for ease of explanation.

[0031] (Embodiment 1) FIG. 1 is a perspective view showing a film capacitor 1 according to a first embodiment. FIG. 2 is a front view of the film capacitor 1 of FIG. 1. FIG. 3 is a side view of the film capacitor 1 of FIG. 1. FIG. 4 is a view of the film capacitor 1 of FIG. 1, omitting the exterior material 15. FIG. 5 is a view of the film capacitor 1 of FIG. 2, omitting the exterior material 15. FIG. 6 is a view of the film capacitor 1 of FIG. 3, omitting the exterior material 15. The X, Y, and Z directions in the drawings indicate the horizontal, height, and vertical directions of the film capacitor 1, respectively.

[0032] [Overall configuration] As shown in Figures 1 to 3, film capacitor 1 is a columnar film capacitor with an oval cross section. In other words, film capacitor 1 has a side surface 4 including two curved portions 2 and a flat portion 3 connecting the curved portions 2, and is formed in a columnar shape. Note that although the boundaries between curved portions 2 and flat portions 3 in Figures 1 to 6 are shown by solid lines, this is merely for convenience, and in an actual film capacitor, curved portions 2 and flat portions 3 do not necessarily have to be separated by a boundary. The same applies to Figure 7 and subsequent figures.

[0033] As shown in Fig. 4, the film capacitor 1 has a dielectric film laminate 11, a first electrode 12, a second electrode 13, and a terminal electrode 14. The laminate 11, the first electrode 12, the second electrode 13, and at least a portion of the terminal electrode 14 are covered with an exterior material 15. The film capacitor 1 is mounted on a substrate 30 (see Fig. 7) by the terminal electrode 14.

[0034] The laminate 11 of the film capacitor 1 of this embodiment is formed by stacking dielectric films each having a metal vapor deposition film formed on its surface and then winding them. Therefore, the laminate 11 is also referred to as a wound body. In this embodiment, the wound body of the dielectric film is pressed into a flat shape, so that the laminate 11 is formed into a columnar shape with an oval cross section. The laminate 11 can also be formed by stacking the dielectric films without winding them.

[0035] The dielectric film may be a plastic film such as polyethylene terephthalate, polypropylene, polyphenylene sulfide, or polyethylene naphthalate. The metal vapor deposition film formed on the surface of the plastic film may be a metal such as Al or Zn. A first electrode 12 is formed on one end of the dielectric film laminate 11, and a second electrode 13 is formed on the other end. The first electrode 12 and the second electrode 13 may be formed by thermally spraying, for example, Zn onto one end and the other end of the laminate 11.

[0036] In the present embodiment, the terminal electrodes 14 include two terminal electrodes 14: one terminal electrode 14 electrically connected to the first electrode 12, and the other terminal electrode 14 electrically connected to the second electrode 13. As shown in FIGS. 4 to 6, the terminal electrodes 14 have a connection portion 16 electrically connected to the first electrode 12 or the second electrode 13, and an extension portion 17 extending from the connection portion 16 in a direction along the first electrode 12 or the second electrode 13 (arrow A1 in FIG. 2). The connection portion 16 is connected to the first electrode 12 or the second electrode 13 by welding. The terminal electrodes 14 are formed of a conductive material, such as a lead wire, for example.

[0037] The exterior material 15 is arranged to cover the laminate 11, the first electrode 12, the second electrode 13, the connection portion 16 of the terminal electrode 14, and at least a part of the extension portion 17 of the terminal electrode 14. As the exterior material 15, for example, a synthetic resin such as an epoxy resin can be used.

[0038] The exterior material 15 can be formed by immersing a film capacitor (see Figure 4) in which a first electrode 12 and a second electrode 13 are formed on a laminate 11 and terminal electrodes 14 are connected to the first electrode 12 and the second electrode 13, into a liquid resin, for example, by a dip coating method.

[0039] When the film capacitor 1 is immersed in the liquid resin, the laminate 11 including the first electrode 12 and the second electrode 13 is coated with the resin, and the resin also adheres to the connection portion 16 of the terminal electrode 14 and at least a part of the extension portion 17 of the terminal electrode 14. That is, as shown in FIGS. 9A to 9C described below, both the exterior material 15 and the resin film 21 at the base of the extension portion 17 are formed. In this embodiment, the resin film 21 formed on the extension portion 17 is disposed in a portion that becomes a dead space when the film capacitor 1 is mounted on a substrate.

[0040] FIG. 7 is a front view of the film capacitor 1 of FIG. 1 mounted on a substrate 30. As shown in FIG. 7, in this embodiment, the film capacitor 1 is mounted on the substrate 30 so that the curved portion 2 on one of the side surfaces 4 faces the main surface 30a of the substrate 30. At this time, a space Sp1 is formed between the substrate 30 and a region 2a of the curved portion 2 facing the substrate 30. Since no other components can be mounted in the space Sp1, the space Sp1 becomes dead space on the substrate 30. In this embodiment, the terminal electrode 14 is formed so that at least a portion of the extension portion 17 is located within the space Sp1 when the film capacitor 1 is mounted on the substrate 30. Furthermore, the extension portion 17 is drawn to a position shifted from the position N1 of the curved portion 2 that is closest to the substrate 30.

[0041] By arranging the extension portion 17 in this manner, the exterior material 15 can be formed so that the resin film 21 fits into the space Sp1 when the film capacitor 1 is mounted on the substrate 30. The portion of the extension portion 17 where the resin film 21 is formed cannot be inserted into the through-hole of the substrate 30, so by forming the resin film 21 to fit into the space Sp1, the dead space can be further reduced. This reduces the dead space, contributing to the miniaturization and low-profile of the device.

[0042] Furthermore, the resin film 21 is disposed at a position farther from the substrate 30 (a position farther from the substrate 30 in the direction of arrow A2) than the position N1 of the curved portion 2 that is closest to the substrate 30. In other words, when the film capacitor 1 is mounted on the substrate 30, the distance between the position N1 and the substrate 30 is smaller than the distance between the resin film 21 and the substrate 30. By disposing the resin film 21 in this manner, the dead space can be further reduced.

[0043] In order to ensure the size of the space Sp1 formed when the film capacitor 1 is mounted on the substrate 30, the diameter D1 of the curved portion 2 is preferably 8 mm or more. The larger the diameter D1 of the curved portion 2, the larger the space Sp1 formed when the film capacitor 1 is mounted on the substrate 30. This makes it possible to easily fit the resin film 21 of the extension portion 17 into the space Sp1.

[0044] Furthermore, it is preferable that the distance D2 from the extension 17 of the terminal electrode 14 to the flat portion 3 be equal to or less than ¼ of the diameter D1 of the curved portion 2. By arranging the extension 17 in this manner, the resin film 21 can be easily accommodated in the space Sp1.

[0045] 7, the substrate 30 may be in contact with the film capacitor 1 at a position N1. In this case, the number of contact points between the film capacitor 1 and the substrate 30 can be increased, thereby improving stability during mounting.

[0046] [Manufacturing method] 8 is a flowchart showing a method for manufacturing the film capacitor 1. The method for manufacturing the film capacitor 1 will be described with reference to FIG.

[0047] First, a dielectric film laminate 11 is formed (step S11). After a dielectric film having a metal vapor deposition film formed on its surface is rolled up into a cylindrical shape, the laminate 11 is pressed at a predetermined pressure to form an oval cross section.

[0048] Next, a first electrode 12 and a second electrode 13 (external electrodes) are formed on both ends of the laminate 11 (step S12). The first electrode 12 and the second electrode 13 can be formed by spraying a metal such as Zn onto both ends of the laminate 11.

[0049] Next, terminal electrodes 14 are connected to the first electrode 12 and the second electrode 13 (step S13). The terminal electrodes 14 are formed of a conductive material such as a lead wire, and can be connected to the first electrode 12 and the second electrode 13 by welding.

[0050] Next, the laminate 11 with the terminal electrodes 14 connected thereto is immersed in liquid resin 22 (step S14). By immersing the laminate 11 in liquid resin such as epoxy resin and then lifting it up, a film of resin can be adhered to the laminate 11. FIG. 9A illustrates the laminate 11 before being immersed in the liquid resin 22. FIG. 9B illustrates the laminate 11 being immersed in a liquid packaging material. As shown in FIGS. 9A and 9B, when the laminate 11 is immersed in the liquid resin 22, the extension portion 17 may be tilted from a normal line NL perpendicular to the liquid surface 22a of the resin 22. At this time, the extension portion 17 may be tilted so that the angle θ1 from the direction perpendicular to the liquid surface 22a is, for example, between 20 degrees and 45 degrees. The value of the angle θ1 can be adjusted as appropriate depending on the shape or size of the film capacitor. FIG. 9C illustrates the laminate 11 after being lifted up from the liquid resin 22. When the laminate 11 is pulled up from the liquid resin 22, a resin film 21 is formed at the base of the extension 17 of the terminal electrode 14 due to surface tension, as shown in FIG. 9C.

[0051] Finally, the exterior material is cured (step S15), completing the film capacitor 1. The completed film capacitor 1 is mounted on a substrate 30, as shown in Fig. 7. By immersing the extension portion 17 at an angle from the perpendicular direction to the liquid surface 22a, the resin film 21 is formed to fit in the space Sp1 between the substrate 30 and the curved portion 2, as shown in Fig. 7.

[0052] [effect] The film capacitor 1 according to the first embodiment can provide the following effects.

[0053] The film capacitor 1 includes a laminate 11, a first electrode 12, a second electrode 13, a terminal electrode 14, and an exterior material 15. The laminate 11 is formed by winding a dielectric film. The first electrode 12 is formed on one end surface of the laminate 11. The second electrode 13 is formed on the other end surface of the laminate 11. The terminal electrode 14 has a connection portion 16 and an extension portion 17. The connection portion 16 is electrically connected to the first electrode 12 or the second electrode 13. The extension portion 17 extends from the connection portion 16 toward the substrate 30 in a direction along the first electrode 12 or the second electrode 13. The exterior material 15 covers the first electrode 12, the second electrode 13, the connection portion 16, and at least a portion of the extension portion 17. The film capacitor 1 is formed in a columnar shape having a side surface 4 connecting the first electrode 12 and the second electrode 13, and the side surface 4 has a curved portion 2. When the film capacitor 1 is mounted on the substrate 30, at least a portion of the extension portion 17 is positioned within the space Sp1 formed between the area of ​​the curved portion 2 facing the substrate 30 and the substrate 30, at a position shifted from the position of the curved portion 2 closest to the substrate 30.

[0054] This configuration makes it possible to provide a film capacitor that is small and low-profile. When mounted on a substrate, the distance between the film capacitor and the substrate can be reduced, allowing for the device to be small and low-profile.

[0055] Furthermore, the portion of the exterior material 15 that covers at least a part of the extension portion 17 is disposed in the space Sp1.

[0056] With this configuration, the extensions 17 of the terminal electrodes 14 are arranged to fit within the space Sp1, so that the resin film 21 can be accommodated in the portion (space Sp1) that becomes dead space when the film capacitor 1 is mounted on the substrate 30. This reduces the mounting area when the film capacitor 1 is mounted on the substrate 30, and also makes it possible to achieve a low profile.

[0057] Furthermore, the portion of the exterior material 15 that covers at least a part of the extension portion 17 is disposed at a position farther from the substrate 30 than the position of the curved portion 2 that is closest to the substrate 30 .

[0058] With this configuration, the resin film 21 can be accommodated in the dead space when the film capacitor 1 is mounted on the substrate 30. This contributes to miniaturization and a low profile of the device.

[0059] Furthermore, a part of the side surface 4 of the film capacitor 1 and the substrate 30 are in contact with each other.

[0060] With this configuration, the number of contact points between the film capacitor 1 and the substrate 30 can be increased, improving stability during mounting.

[0061] The diameter of the curved portion 2 is 8 mm or more.

[0062] With this configuration, the dead space when the film capacitor 1 is mounted on the substrate 30 is increased, making it easier to fit the resin film 21 into the dead space, thereby achieving a smaller size and a lower height.

[0063] The method for manufacturing the film capacitor 1 includes the steps of forming a laminate 11 of dielectric films, forming external electrodes 12, 13 on both ends of the laminate 11, connecting terminal electrodes 14 to the external electrodes 12, 13, each having a connection portion 16 with the external electrode and an extension portion 17 extending from the connection portion 16, immersing the laminate 11 with the terminal electrode 14 connected thereto in liquid resin 22, and curing the resin 22. The step of immersing the laminate 11 with the terminal electrode 14 connected thereto in liquid resin 22 includes tilting the extension portion 17 of the terminal electrode 14 from a direction perpendicular to a liquid surface 22a of the resin 22.

[0064] This configuration allows the manufacture of a film capacitor that is compact and low-profile. By tilting the extension portion 17 with respect to the liquid surface 22a of the liquid resin 22, the resin film 21 can be contained in the area that would become dead space when the film capacitor 1 is mounted on the substrate 30. This allows the device to be low-profile.

[0065] In the above-described embodiment, the film capacitor 1 is described as a columnar film capacitor having an oval cross section, but the shape of the film capacitor 1 is not limited to this. For example, the film capacitor 1 may have any shape with curved sides, such as a cylindrical or elliptical cylindrical shape.

[0066] In the above-described embodiment, the case where the exterior material 15 is formed by the dip coating method has been described as an example, but the present invention is not limited to this. The exterior material 15 can be formed by a method including a step of immersing in a liquid.

[0067] In the above-described embodiment, the terminal electrode 14 is formed by a lead wire, but the present invention is not limited to this. For example, the terminal electrode 14 may be formed by a flat terminal. The terminal electrode 14 may be connected to the first electrode 12 or the second electrode 13 by soldering.

[0068] (Embodiment 2) Second Embodiment A film capacitor 1A according to a second embodiment of the present invention will be described.

[0069] In the second embodiment, differences from the first embodiment will be mainly described. In the second embodiment, the same or equivalent configurations as those in the first embodiment will be denoted by the same reference numerals. Also, in the second embodiment, descriptions that overlap with those in the first embodiment will be omitted.

[0070] Fig. 10 is a perspective view showing a film capacitor according to embodiment 2. Fig. 11 is a front view of the film capacitor of Fig. 10. Fig. 12 is a side view of the film capacitor of Fig. 10. Fig. 13 is a diagram showing the film capacitor of Fig. 10 mounted on a substrate. Note that the X, Y, and Z directions in the diagram indicate the horizontal, height, and vertical directions of the film capacitor 1A, respectively.

[0071] 10 to 12, the extension direction of the extension portion 117 differs from that of the first embodiment. In the film capacitor 1 of the first embodiment, the extension portion 17 of the terminal electrode 14 is formed to extend in a direction along the flat portion 3, but in the film capacitor 1A of the second embodiment, the extension portion 117 is arranged to extend in a direction intersecting the flat portion 103 (arrow A3 in FIG. 11). Because the extension portion 117 is arranged in this manner, the film capacitor 1A of the second embodiment is mounted on a substrate so that the flat portion 103 faces the main surface 30a of the substrate 30, as shown in FIG.

[0072] 13, position N2 closest to the substrate 30 is the flat portion 103 facing the main surface 30a of the substrate 30. The extension portion 117 is disposed at a position shifted from position N2, and therefore, when the film capacitor 1A is mounted on the substrate 30, the resin film 121 of the exterior material 115 is disposed so as to fit into the space Sp2 between the substrate 30 and a region 102a of the curved portion 102 facing the substrate 30.

[0073] 14 is a diagram showing a state in which laminate 111, in which terminal electrodes are connected to the first electrode and the second electrode, is immersed in liquid resin 22. As in the first embodiment, laminate 111 is immersed in resin 22 so that extension portion 117 is inclined at angle θ2 with respect to normal line NL perpendicular to liquid surface 22a of liquid resin 22. When exterior material 115 is formed in this manner, resin film 121 can be formed to fit within space Sp2.

[0074] [effect] The film capacitor 1A according to the second embodiment can provide the following effects.

[0075] Since the flat portion 103 is disposed facing the main surface 30a of the substrate 30, it is possible to improve stability during mounting. In addition, it is possible to further reduce the height.

[0076] (Embodiment 3) A film capacitor 1B according to a third embodiment of the present invention will be described.

[0077] In the third embodiment, differences from the first embodiment will be mainly described. In the third embodiment, the same or equivalent configurations as those in the first embodiment will be denoted by the same reference numerals. Also, in the third embodiment, descriptions that overlap with those in the first embodiment will be omitted.

[0078] Fig. 15 is a perspective view showing a film capacitor 1B according to embodiment 3. Fig. 16 is a front view of the film capacitor 1B of Fig. 15. Fig. 17 is a side view of the film capacitor 1B of Fig. 15. Fig. 18 is a view of the film capacitor 1B of Fig. 15 without the exterior covering 215. Fig. 19 is a view of the film capacitor 1B of Fig. 17 without the exterior covering 215.

[0079] 15 to 19, in the third embodiment, the shape of the terminal electrode 214 is different from that in the first embodiment. Specifically, the extension portion of the terminal electrode 214 includes a first extension portion 217a extending from the connecting portion 216 along the curved portion 202 of the film capacitor 1B, and a second extension portion 217b extending from the first extension portion 217a toward the substrate (not shown).

[0080] The terminal electrode 214 can be formed by bending a lead wire or the like to form the connection portion 216, the first extension portion 217a, and the second extension portion 217b. The connection portion 216 of the terminal electrode 214, on which the connection portion 216, the first extension portion 217a, and the second extension portion 217b have been formed in advance, can be attached to the first electrode 212 and the second electrode 213 on both ends of the laminate 211 by welding.

[0081] By arranging the first extension portion 217a along the side surface 204 of the film capacitor 1B, it is possible to change the distance between the two terminal electrodes 214 connected to the first electrode 212 and the second electrode 213, respectively. Furthermore, because the first extension portion 217a extends from the connection portion 216 along the curved portion 202, when the film capacitor 1B is mounted on a substrate, the resin film 221 formed on the first extension portion 217a is disposed within the space formed between the substrate and the curved portion 202. Therefore, it is possible to change the distance between the terminal electrodes 214 while accommodating the resin film 221 in the dead space, thereby improving the degree of freedom in design.

[0082] 20 is a diagram showing a state in which laminate 211, in which terminal electrodes are connected to the first electrode and the second electrode, is immersed in liquid resin 22. As in the first embodiment, laminate 111 is immersed in resin 22 so that extension 117 is inclined at angle θ3 with respect to normal line NL perpendicular to liquid surface 22a of liquid resin 22. At this time, it is preferable that first extension 217a is immersed in resin 22. When exterior material 215 is formed in this manner, resin film 221 can be formed to fit into the dead space.

[0083] [effect] The film capacitor 1B according to the third embodiment can provide the following effects.

[0084] In the film capacitor 1B, the extension portion includes a first extension portion 217a extending from the connection portion 216 along the curved portion 202, and a second extension portion 217b extending from the first extension portion 217a toward the substrate.

[0085] With this configuration, the spacing between the terminal electrodes 214 can be changed without increasing the mounting area, thereby improving the degree of freedom in design.

[0086] (Fourth embodiment) A film capacitor 1C according to a fourth embodiment of the present invention will be described.

[0087] In the fourth embodiment, differences from the first embodiment will be mainly described. In the fourth embodiment, the same or equivalent configurations as those in the first embodiment will be denoted by the same reference numerals. Also, in the fourth embodiment, descriptions that overlap with those in the first embodiment will be omitted.

[0088] Fig. 21 is a perspective view showing a film capacitor 1C according to embodiment 4. Fig. 22 is a front view of the film capacitor 1C of Fig. 21. Fig. 23 is a view of the film capacitor 1C of Fig. 21 without a sheath 315. Fig. 24 is a view of the film capacitor of Fig. 22 without a sheath 315. Fig. 25 is a perspective view showing a terminal electrode 314 of the film capacitor of Fig. 21.

[0089] The fourth embodiment differs from the first embodiment in that the terminal electrode 314 has a substrate connecting portion 318. Specifically, as shown in Figures 21 to 24, the terminal electrode 314 further has the substrate connecting portion 318 extending from the extension portion 317 in a direction along the substrate 31 (see Figure 27). In addition, a resin film 321 is formed on at least a part of the extension portion 317.

[0090] In this embodiment, as shown in Fig. 25, the terminal electrode 314 is formed in a shape having a connection portion 316, an extension portion 317, and a substrate connection portion 318. The substrate connection portion 318 is formed in a plate shape. The terminal electrode 314 can be formed, for example, by bending a metal plate that has been cut into a predetermined shape by press working.

[0091] FIG. 26 illustrates a state in which a laminate 311, in which terminal electrodes 314 are connected to first electrodes 312 and second electrodes 313, is immersed in liquid resin 22. In the fourth embodiment, the laminate is immersed in resin 22 so that substrate connection portion 318 is inclined at angle θ4 with respect to a normal line NL perpendicular to liquid surface 22a of liquid resin 22. Angle θ4 can be adjusted appropriately depending on the shape or size of the film capacitor. Forming exterior material 315 in this manner can prevent resin film 321 from being formed on main surface 318a (see FIG. 25) of substrate connection portion 318 connected to substrate 31. Forming resin 22 in this manner covers at least a portion of connection portion 316 and extension portion 317 of terminal electrode 314 with resin.

[0092] Fig. 27 is a diagram showing the state in which the film capacitor 1C of Fig. 21 is mounted on a substrate 31. As shown in Fig. 27, the film capacitor 1C is mounted on the substrate 31 by surface mounting. At this time, the terminal electrodes 314 are arranged to fit within a space Sp3 formed between a region 302a of the curved portion 302 that faces the substrate 31 and the main surface 31a of the substrate 31. Therefore, it is possible to provide a film capacitor 1C that is compatible with surface mounting without increasing the mounting area.

[0093] [effect] The film capacitor 1C according to the fourth embodiment can provide the following effects.

[0094] In the film capacitor 1C, the terminal electrode 314 further has a substrate connection portion 318 extending from the extension portion 317 in a direction along the substrate 31. The substrate connection portion 318 is disposed within the space Sp3.

[0095] With this configuration, it is possible to provide a film capacitor 1C that is compatible with surface mounting while reducing the mounting area. [Industrial Applicability]

[0096] The present invention is useful for capacitors used in various electronic devices, electrical devices, industrial devices, vehicle devices, etc. [Explanation of symbols]

[0097] 1. 1A~1C film capacitor 2, 102, 202, 302 curved section 3, 103 squamous part 4, 204 Side 11, 111, 211, 311 laminate 12, 212, 312 1st electrode (external electrode) 13, 213, 313 2nd electrode (external electrode) 14, 214, 314 terminal electrode 15, 115, 215, 315 exterior materials 16, 216, 316 connection 17, 117, 317 extension section 30, 31 PCB 217a 1st extension section 217b 2nd extension section 318 PCB connection part

Claims

1. A film capacitor mounted on a substrate, a laminate of dielectric films; a first electrode formed on one end surface of the laminate; a second electrode formed on the other end surface of the laminate; a terminal electrode having a connection portion electrically connected to the first electrode or the second electrode, an extension portion extending from the connection portion toward the substrate in a direction along the first electrode or the second electrode, and a substrate connection portion extending from the extension portion in a direction along the substrate; an exterior material that covers the laminate, the first electrode, the second electrode, the connection portion, and at least a portion of the extension portion; Equipped with the film capacitor is formed in a pillar shape having a side surface connecting the first electrode and the second electrode, The side surface has a curved portion, at least a part of the extension portion is disposed in a space formed between a region of the curved portion facing the substrate and the substrate when the film capacitor is mounted on the substrate, and at a position shifted from a position of the curved portion closest to the substrate; a portion of the exterior material that covers at least a part of the extension portion and the board connection portion are disposed in the space; Film capacitor.

2. a portion of the sheath material covering at least a part of the extension portion is disposed at a position farther from the substrate than a position of the curved portion closest to the substrate; The film capacitor according to claim 1 .

3. the extension portion includes a first extension portion extending from the connection portion along the curved portion, and a second extension portion extending from the first extension portion toward the substrate; The film capacitor according to claim 1 .

4. a part of the side surface of the film capacitor is in contact with the substrate; The film capacitor according to claim 1 .

5. The diameter of the curved portion is 8 mm or more. The film capacitor according to claim 1 .

6. A film capacitor mounted on a substrate, a laminate of dielectric films; a first electrode formed on one end surface of the laminate; a second electrode formed on the other end surface of the laminate; a terminal electrode having a connection portion electrically connected to the first electrode or the second electrode, and an extension portion extending from the connection portion toward the substrate in a direction along the first electrode or the second electrode; an exterior material that covers the laminate, the first electrode, the second electrode, the connection portion, and at least a portion of the extension portion; Equipped with the film capacitor is formed in a pillar shape having a side surface connecting the first electrode and the second electrode, The side surface has a curved portion, at least a part of the extension portion is disposed in a space formed between a region of the curved portion facing the substrate and the substrate when the film capacitor is mounted on the substrate, and at a position shifted from a position of the curved portion closest to the substrate; the terminal electrode further has a substrate connection portion extending from the extension portion in a direction along the substrate, The board connection portion is disposed within the space. Film capacitor.

7. a part of the side surface of the film capacitor is in contact with the substrate; The film capacitor according to claim 6.

8. The diameter of the curved portion is 8 mm or more. The film capacitor according to claim 6.

9. A method for manufacturing a film capacitor having a pair of electrodes and a side surface with a curved portion connecting the pair of electrodes, the film capacitor being mounted on a substrate, comprising: forming a stack of dielectric films; forming external electrodes on both ends of the laminate; connecting a terminal electrode to the external electrode, the terminal electrode having a connection portion with the external electrode, an extension portion extending from the connection portion along the external electrode, and a substrate connection portion extending from the extension portion; immersing the laminate with the terminal electrodes connected in a liquid exterior material; curing the exterior material; Including, the step of immersing the laminate with the terminal electrodes connected thereto in a liquid exterior material includes tilting the extending portions of the terminal electrodes from a direction perpendicular to a liquid surface of the exterior material; at least a part of the extension portion is disposed in a space formed between a region of the curved portion facing the substrate and the substrate when the film capacitor is mounted on the substrate, and at a position shifted from a position of the curved portion closest to the substrate; the substrate connection portion extends in a direction along the substrate when the film capacitor is mounted on the substrate, a portion of the exterior material that covers at least a part of the extension portion and the board connection portion are disposed in the space; Manufacturing method of film capacitors.

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