Circuit Module

Abstract

To provide a circuit module capable of emitting heat, which is generated by an electric circuit including a coil member, farther from the coil member.SOLUTION: A circuit module comprises: a circuit board including a board main body including a first upper principal surface and a first lower principal surface, which are aligned in a vertical direction, and a first input / output electrode provided on the first upper principal surface; a plurality of conductive members having an elliptic spherical shape or a columnar shape extending upward; a conductive tabular member including a second upper principal surface and a second lower principal surface which are aligned in the vertical direction; and a coil member including a second input / output electrode. The plurality of conductive members are provided while being separated from each other on the first input / output electrode. The second lower principal surface is provided on each of the plurality of conductive members. The second input / output electrode is provided on the conductive tabular member. The conductive tabular member includes a first region which overlaps the second input / output electrode in a downward view and includes a second region which does not overlap the second input / output electrode in the downward view.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a circuit module. [Background technology]

[0002] A known example of a conventional invention relating to a circuit module is the microconverter described in Patent Document 1. The microconverter described in Patent Document 1 includes a chip-type microinductor and a semiconductor integrated circuit on which a control circuit and the like are formed. Stud terminals are arranged on a module substrate. The microinductor is arranged on the stud terminals. The semiconductor integrated circuit is arranged between the microinductor and the module substrate in the vertical direction. Furthermore, the semiconductor integrated circuit is arranged so as to overlap the microinductor when viewed from below. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-63676 Summary of the Invention [Problem to be solved by the invention]

[0004] In the field of the microconverter described in Patent Document 1, there is a risk that the heat generated by the microinductor and the stud terminal may heat up a semiconductor integrated circuit located near the microinductor and the stud terminal. Therefore, there is a demand for dissipating the heat generated by the electric circuit including the coil member farther away from the coil member.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a circuit module that can dissipate heat generated by an electric circuit including a coil member farther away from the coil member. [Means for solving the problem]

[0006] A circuit module according to one aspect of the present invention includes: a circuit board having a substrate body having a first upper main surface and a first lower main surface aligned in the vertical direction, and a first input / output electrode provided on the first upper main surface; a plurality of conductive members each having an oval spherical shape or a columnar shape extending upward; a conductive plate-like member having a second upper main surface and a second lower main surface aligned in the vertical direction; a coil member having a second input / output electrode; It is equipped with the plurality of conductive members are provided on the first input / output electrode at intervals from one another, the second lower principal surface is provided on each of the plurality of conductive members, the second input / output electrode is provided on the conductive plate-like member, The conductive plate-shaped member has a first region that overlaps with the second input / output electrode when viewed from below, and has a second region that does not overlap with the second input / output electrode when viewed from the below. [Effects of the Invention]

[0007] According to the circuit module of the present invention, heat generated by an electric circuit including a coil member can be dissipated farther from the coil member. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of a circuit module 1 according to the first embodiment. [Figure 2] FIG. 2 is a cross-sectional view of the circuit module 1 according to the first embodiment as viewed from the front. [Figure 3] FIG. 3 is a plan view of the circuit module 1 according to the first embodiment viewed downward. [Figure 4] FIG. 4 is a cross-sectional view of the circuit module 10 according to the comparative example, viewed from the front. [Figure 5] FIG. 5 is a cross-sectional view of the circuit module 10 according to the comparative example when the circuit board 11 is warped upward, as viewed from the front. [Figure 6]FIG. 6 is a cross-sectional view of the circuit module 1 according to the first embodiment when viewed from the front, with the circuit board 11 warped upward. [Figure 7] FIG. 7 is a perspective view of a circuit module 1a according to a first modified example. [Figure 8] FIG. 8 is a cross-sectional view of a circuit module 1a according to a first modified example, viewed from the front. [Figure 9] FIG. 9 is a cross-sectional view of a circuit module 1b according to a second modified example, viewed from the front. [Figure 10] FIG. 10 is a plan view of a circuit module 1b according to a second modification, viewed from below. [Figure 11] FIG. 11 is a perspective view of a circuit module 1c according to a third modified example. [Figure 12] FIG. 12 is an enlarged cross-sectional view of the vicinity of a conductive member 4a according to a third modified example, viewed from the front. [Figure 13] FIG. 13 is a perspective view of a circuit module 1d according to a fourth modified example. [Figure 14] FIG. 14 is a plan view of a circuit module 1e according to a fifth modification, viewed from below. [Figure 15] FIG. 15 is a plan view of a circuit module 1f according to a sixth modified example, viewed from below. DETAILED DESCRIPTION OF THE INVENTION

[0009] [First embodiment] A circuit module 1 according to a first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of the circuit module 1 according to the first embodiment. FIG. 2 is a cross-sectional view of the circuit module 1 according to the first embodiment as viewed from the front. FIG. 3 is a plan view of the circuit module 1 according to the first embodiment as viewed from below. Note that in FIG. 1, reference numerals are assigned only to representative first input / output electrodes 12a, 12b and conductive members 41a, 42b among the plurality of first input / output electrodes 12a, 12b and the plurality of conductive members 41a, 42b.

[0010] In this specification, directions are defined as follows. As shown in FIG. 1 , the direction from the first electronic component 2 to the circuit board 11 is defined as the downward direction. The opposite direction of the downward direction is defined as the upward direction. The direction from the second input / output electrode 22a to the second input / output electrode 22b is defined as the rightward direction. The opposite direction of the rightward direction is defined as the leftward direction. The rightward or leftward direction is perpendicular to the downward or upward direction. The direction perpendicular to the downward or rightward direction is defined as the forward direction. The opposite direction of the forward direction is defined as the rearward direction. However, the downward, upward, rightward, leftward, frontward, and rearward directions in this specification are defined for convenience of explanation and may not coincide with the downward, upward, rightward, leftward, frontward, and rearward directions when the circuit module 1 is in use. In addition, in each drawing, the downward and upward directions may be interchanged, the rightward and leftward directions may be interchanged, and the front and rear directions may be interchanged.

[0011] In this specification, the positional relationship of the members is defined as follows: The first member to the third member constitute the circuit module 1. In this specification, the phrase "the first member is disposed on the second member" refers to the following state: At least a portion of the first member is located directly above the second member. Therefore, when viewed from below, the first member overlaps with the second member. This definition also applies to directions other than the upward direction.

[0012] In this specification, "a first member being positioned above a second member" includes cases where at least a portion of the first member is positioned directly above the second member, and cases where the first member is not positioned directly above the second member but is positioned diagonally above the second member. In this case, the first member does not have to overlap with the second member when viewed from below. "Diagonally above" refers to, for example, the upper left or upper right. This definition also applies to directions other than the upward direction.

[0013] In this specification, unless otherwise specified, the various parts of the first member are defined as follows: The front part of the first member means the front half of the first member. The front end of the first member means the front end of the first member. The front end part of the first member means the front end of the first member and its vicinity. This definition also applies to directions other than the front direction. Furthermore, the corner part of the first member means the corner of the first member and its vicinity.

[0014] In this specification, "the first member and the second member are electrically connected" means that electricity is conducted between the first member and the second member. Therefore, the first member and the second member may or may not be in contact with each other. When the first member and the second member are not in contact with each other, a third member having electrical conductivity is disposed between the first member and the second member.

[0015] In this specification, a member extending in the vertical direction refers to a member inclined within a range of ±45° relative to the vertical direction. Similarly, a member extending in the front-rear direction does not necessarily refer only to a member that is parallel to the front-rear direction. A member extending in the front-rear direction refers to a member inclined within a range of ±45° relative to the front-rear direction. A member extending in the left-right direction refers to a member inclined within a range of ±45° relative to the left-right direction.

[0016] A circuit module 1 is used in electronic devices such as smartphones. As shown in Figures 1 to 3, the circuit module 1 includes a circuit board 11, a first electronic component 2, conductive plate-like members 3a and 3b, a plurality of conductive members 4a and 4b, a second electronic component 5, and three third electronic components 6. The circuit board 11 includes a board body 13 and first input / output electrodes 12a and 12b.

[0017] The substrate body 13 has a first upper principal surface S1 and a first lower principal surface S2 aligned in the vertical direction. The material of the substrate body 13 is, for example, glass epoxy. An electric circuit formed of a conductor layer (not shown) is provided on the first upper principal surface S1, the first lower principal surface S2, and inside the substrate body 13. The first input / output electrodes 12a and 12b are provided on the first upper principal surface S1. In this embodiment, the first input / output electrodes 12a and 12b are flat surfaces parallel to the first upper principal surface S1. In this embodiment, the first input / output electrodes 12a and 12b are aligned in this order from left to right. In this embodiment, the first input / output electrodes 12a are electrically connected to each other by a conductor layer (not shown). The first input / output electrodes 12b are also electrically connected to each other by a conductor layer (not shown).

[0018] The second electronic component 5 is, for example, an IC (Integrated Circuit). The second electronic component 5 is mounted on the first upper main surface S1. More specifically, the second electronic component 5 is fixed to a mounting electrode (not shown) on the first upper main surface S1 by solder (not shown).

[0019] The third electronic component 6 is, for example, a capacitor. In this embodiment, the third electronic component 6 is mounted on the first upper main surface S1. More specifically, the third electronic component 6 is fixed to a mounting electrode (not shown) on the first upper main surface S1 by solder (not shown). The third electronic component 6 is smaller than the first electronic component 2.

[0020] The first electronic component 2 is an element that generates heat during operation. The first electronic component 2 is, for example, a coil member. The coil member is, for example, an inductor. The first electronic component 2 includes a main body 21 and second input / output electrodes 22a, 22b. The main body 21 has a rectangular parallelepiped shape. The second input / output electrodes 22a, 22b are provided on the surface of the main body 21. In this embodiment, the second input / output electrode 22a is provided on the bottom surface and left surface of the main body 21. The second input / output electrode 22b is provided on the bottom surface and right surface of the main body 21.

[0021] The first electronic component 2 as described above is mounted on a circuit board 11. The mounting structure of the first electronic component 2 will be described in detail below. Note that since the mounting structure of the first electronic component 2 is bilaterally symmetrical, a description of the right side of the mounting structure of the first electronic component 2 will be omitted.

[0022] The second input / output electrode 22a is provided on the conductive plate-shaped member 3a. More specifically, the conductive plate-shaped member 3a has a second upper main surface S3 and a second lower main surface S4 aligned in the vertical direction. The conductive plate-shaped member 3a is made of a metal. The metal is, for example, copper. In this embodiment, the entire second input / output electrode 22a overlaps the second upper main surface S3 when viewed from below. The second input / output electrode 22a is provided on the second upper main surface S3. More specifically, the second input / output electrode 22a is fixed to the second upper main surface S3 by solder (not shown). This electrically connects the second input / output electrode 22a to the conductive plate-shaped member 3a. The conductive plate-shaped member 3a has a plate shape. When viewed from below, the conductive plate-shaped member 3a has a first region A1 overlapping the second input / output electrode 22a and a second region A2 not overlapping the second input / output electrode 22a.

[0023] The conductive plate-shaped member 3a is provided on each of the plurality of conductive members 4a. More specifically, the second lower principal surface S4 is provided on each of the plurality of conductive members 4a. Each of the plurality of conductive members 4a has an ellipsoidal spherical shape. In this specification, the concept of "sphere" includes the concept of "ellipsoidal sphere." In this embodiment, each of the plurality of conductive members 4a has a spherical shape. The conductive member 4a is made of a metal. The metal is, for example, copper. Note that the conductive member 4a only needs to be conductive. The second lower principal surface S4 is in contact with the upper end of each of the plurality of conductive members 4a. More specifically, the conductive plate-shaped member 3a is fixed to each of the plurality of conductive members 4a by solder (not shown). This electrically connects the conductive plate-shaped member 3a to each of the plurality of conductive members 4a.

[0024] Of the multiple conductive members 4a, the conductive members 4a that entirely overlap the second input / output electrode 22a when viewed from below are defined as conductive members 41a. That is, the outer edge of the conductive member 41a when viewed from below is surrounded by the outer edge of the second input / output electrode 22a when viewed from below. Also, of the multiple conductive members 4a, the conductive members 4a that have a portion that does not overlap the second input / output electrode 22a when viewed from below are defined as conductive members 42a. In this embodiment, both conductive members 41a and 42a are present. The second lower principal surface S4 is provided on each of the multiple conductive members 41a. Also, the second lower principal surface S4 is provided on each of the multiple conductive members 42a. In this embodiment, the conductive members 42a are lined up in the front direction. The conductive members 41a are lined up in the front direction and also in the right direction.

[0025] The plurality of conductive members 4a are provided on the first input / output electrode 12a at a distance from one another. More specifically, in this embodiment, the first input / output electrode 12a has a rectangular shape when viewed from below. The lower end of each of the plurality of conductive members 4a is in contact with the first input / output electrode 12a. More specifically, each of the plurality of conductive members 4a is fixed to the first input / output electrode 12a by solder (not shown). The first input / output electrode 12a is made of a metal. The metal is, for example, copper. As a result, each of the plurality of conductive members 4a is electrically connected to the first input / output electrode 12a. Therefore, the second input / output electrode 22a of the first electronic component 2 is electrically connected to the first input / output electrode 12a of the circuit board 11.

[0026] With the above-described mounting structure of the first electronic component 2, the first electronic component 2 is located above the second electronic component 5.

[0027] [effect] The circuit module 1 allows heat generated by the electric circuit including the coil member to be dissipated farther from the coil member. More specifically, the conductive plate member 3a has a first region A1 that overlaps the second input / output electrode 22a when viewed from below. This allows the second input / output electrode 22a of the first electronic component 2 to be electrically connected to the first input / output electrode 12a of the circuit board 11 via the conductive plate member 3a. The conductive plate member 3a also has a second region A2 that does not overlap the second input / output electrode 22a when viewed from below. This allows the areas of the second upper principal surface S3 and the second lower principal surface S4 of the conductive plate member 3a to be larger than when the conductive plate member does not have the second region A2. Furthermore, heat generated by the electric circuit including the coil member can be conducted to the conductive plate member 3a and radiated from the second region A2. Therefore, the circuit module 1 allows heat generated by the electric circuit including the coil member to be dissipated farther from the coil member.

[0028] Furthermore, the circuit module 1 can suppress poor contact. More specifically, even if the circuit board 11 warps in the vertical direction, the electrical connection between the second input / output electrodes 22a of the first electronic component 2 and the first input / output electrodes 12a of the circuit board 11 can be maintained. As a comparative example, a circuit module 10 in which the second input / output electrodes 22a are provided on the first input / output electrodes 12a will be described with reference to the drawings. FIG. 4 is a cross-sectional view of the circuit module 10 according to the comparative example, viewed from the front. FIG. 5 is a cross-sectional view of the circuit module 10 according to the comparative example, viewed from the front, when the circuit board 11 warps upward. FIG. 6 is a cross-sectional view of the circuit module 1 according to the first embodiment, viewed from the front, when the circuit board 11 warps upward. Note that the second electronic component 5 and the third electronic component 6 are omitted from FIGS. 4 to 6.

[0029] As shown in Fig. 4, the circuit module 10 according to the comparative example does not include the conductive plate-like members 3a, 3b and the plurality of conductive members 4a, 4b. The second input / output electrodes 22a, 22b are fixed to the first input / output electrode 12a by solder (not shown). When the circuit board 11 is warped upward due to the application of heat to the circuit board 11, for example, there is a risk that one of the second input / output electrodes 22a, 22b may peel off from one of the first input / output electrodes 12a, 12b, as shown in Fig. 5.

[0030] On the other hand, the circuit module 1 according to the first embodiment includes a plurality of oval-spherical conductive members 4a, 4b. As a result, even if the circuit board 11 warps upward, causing the conductive members 4a, 4b to peel off from the first input / output electrodes 12a, 12b as shown in FIG. 6, contact between any of the conductive members 4a and the first input / output electrode 12a is maintained, and contact between any of the conductive members 4b and the first input / output electrode 12b is also maintained, thereby maintaining electrical connection between the second input / output electrode 22a of the first electronic component 2 and the first input / output electrode 12a of the circuit board 11. As a result, the circuit module 1 can prevent poor contact.

[0031] Furthermore, the circuit module 1 can also suppress poor contact for the following reason. By making the conductive members 4a, 4b or the conductive plate-like members 3a, 3b more deformable than the circuit board 11, when the circuit board 11 warps in the vertical direction, the conductive members 4a, 4b or the conductive plate-like members 3a, 3b can follow the deformation of the circuit board 11. This makes it possible to maintain the electrical connection between the second input / output electrode 22a of the first electronic component 2 and the first input / output electrode 12a of the circuit board 11. As a result, the circuit module 1 can suppress poor contact.

[0032] Furthermore, the circuit module 1 can suppress parasitic inductance between the first input / output electrode 12a and the second input / output electrode 22a. More specifically, because the first input / output electrode 12a and the second input / output electrode 22a are conductors, parasitic inductance occurs between the first input / output electrode 12a and the second input / output electrode 22a. To address this, the circuit module 1 includes multiple conductive members 41a and 42a. This electrically connects the second input / output electrode 22a of the first electronic component 2 to the first input / output electrode 12a of the circuit board 11 via the multiple conductive members 41a and 42a. This results in the parasitic inductances occurring in the multiple conductive members 41a and 42a being parallel to each other. This reduces the combined parasitic inductance value. Therefore, the circuit module 1 can suppress parasitic inductance between the first input / output electrode 12a and the second input / output electrode 22a. As a result, for example, when the circuit module 1 is used in a switching power supply, switching loss can be suppressed, and the efficiency of the switching power supply can be improved. Furthermore, for example, when the circuit module 1 is used in a switching power supply, the switching frequency can be increased.

[0033] Furthermore, the circuit module 1 allows electronic components to be provided below the first electronic component 2. More specifically, the conductive members 4a, 4b have portions that do not overlap with the second input / output electrodes 22a, 22b when viewed from below. This eliminates the need to provide the conductive members 4a, 4b in areas that overlap with the second input / output electrodes 22a, 22b when viewed from below. This allows for a wider area on the first upper principal surface S1 where electronic components can be provided, in areas that overlap with the second input / output electrodes 22a, 22b. As a result, the circuit module 1 allows electronic components to be provided below the first electronic component 2.

[0034] Furthermore, according to the circuit module 1, heat generated by the electric circuit including the coil member can be more effectively dissipated from the conductive plate-shaped member 3a. More specifically, the entire second input / output electrode 22a overlaps the second upper principal surface S3 when viewed from below. This increases the contact area between the second input / output electrode 22a and the conductive plate-shaped member 3a. Therefore, heat generated by the electric circuit including the coil member is more easily conducted by the conductive plate-shaped member 3a. As a result, according to the circuit module 1, heat generated by the electric circuit including the coil member can be more effectively dissipated from the conductive plate-shaped member 3a.

[0035] [First Modification] The structure of a circuit module 1a according to a first modified example of the present invention will be described below with reference to the drawings. FIG. 7 is a perspective view of the circuit module 1a according to the first modified example. FIG. 8 is a cross-sectional view of the circuit module 1a according to the first modified example, viewed from the front. In FIG. 7, reference numerals are assigned only to representative first input / output electrodes 12a, 12b and conductive members 41a, 42b among the plurality of first input / output electrodes 12a, 12b and the plurality of conductive members 41a, 42b. Regarding the circuit module 1a according to the first modified example, only differences from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0036] The circuit module 1a according to the first modification differs from the circuit module 1 according to the first embodiment in that the conductive members 4a have a columnar shape that extends upward.

[0037] More specifically, in this modification, the conductive member 4a has a cylindrical shape that extends upward.

[0038] In the circuit module 1a described above, similarly to the circuit module 1, the heat generated by the electric circuit including the coil member can be dissipated farther from the coil member.

[0039] [Second Modification] The structure of a circuit module 1b according to a second modified example of the present invention will be described below with reference to the drawings. FIG. 9 is a cross-sectional view of the circuit module 1b according to the second modified example viewed from the front. FIG. 10 is a plan view of the circuit module 1b according to the second modified example viewed from the bottom. Note that in FIG. 10, only representative conductive members 41a and 41b among the multiple conductive members 41a and 41b are designated by reference numerals. Note that, for the circuit module 1b according to the second modified example, only the differences from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0040] The circuit module 1b of the second modified example differs from the circuit module 1 of the first embodiment in that the diameter of the conductive member 42a is larger than the sum of the diameter of the conductive member 41a and the thickness of the conductive plate-shaped member 3a in the vertical direction.

[0041] A through hole H is provided in the conductive plate-shaped member 3a. More specifically, the through hole H penetrates the conductive plate-shaped member 3a in the vertical direction. In this modification, the through hole H has a circular shape when viewed from below. The center of the through hole H when viewed from below coincides with the center of the conductive member 42a when viewed from below. Therefore, the outer edge of the through hole H when viewed from below is surrounded by the outer edge of the conductive member 42a when viewed from below. The through hole H has a shape that follows the upper part of the conductive member 42a.

[0042] The upper end of the conductive member 42a is exposed upward from the through-hole H. In addition, the upper end of the conductive member 42a is located above the second lower main surface S4.

[0043] The circuit module 1b described above also achieves the same effects as the circuit module 1. Furthermore, the circuit module 1b can more firmly fix the first electronic component 2. More specifically, the through-hole H has a shape that follows the upper portion of the conductive member 42a. This increases the contact area between the conductive plate member 3a and the conductive member 42a. The upper end of the conductive member 42a is exposed upward through the through-hole H. Furthermore, the upper end of the conductive member 42a is located above the second lower main surface S4. This makes it difficult to easily move the conductive plate member 3a in the left-right or front-back directions. As a result, the conductive plate member 3a is firmly fixed by the conductive member 42a. Therefore, the circuit module 1b can more firmly fix the first electronic component 2. As a result, even if the areas of the second upper main surface S3 and the second lower main surface S4 of the conductive plate member 3a are increased, misalignment of the first electronic component 2 during mounting can be suppressed.

[0044] [Third Modification] The structure of a circuit module 1c according to a third modified example of the present invention will be described below with reference to the drawings. FIG. 11 is a perspective view of the circuit module 1c according to the third modified example. FIG. 12 is an enlarged cross-sectional view of the vicinity of the conductive member 4a according to the third modified example, viewed from the front. Note that in FIG. 11, reference numerals are assigned only to representative first input / output electrodes 12a, 12b and conductive members 41a, 42b among the plurality of first input / output electrodes 12a, 12b and the plurality of conductive members 41a, 42b. Note that, for the circuit module 1c according to the third modified example, only the differences from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0045] The circuit module 1c according to the third modified example differs from the circuit module 1 according to the first embodiment in that a first recess R1 is provided in the first input / output electrodes 12a, 12b, and a second recess R2 is provided in the second lower main surface S4.

[0046] 12, the first recess R1 has a shape recessed downward. As in this modification, the first input / output electrodes 12a, 12b do not have to be flat surfaces parallel to the first upper main surface S1. More specifically, the first recess R1 has a first surface SR1 located below the first upper main surface S1 and a first side surface SS1 connecting the first upper main surface S1 and the first surface SR1. The first recess R1 may have a shape that follows the lower portion of the conductive member 4a.

[0047] The conductive member 4a is in contact with two or more points of the first recess R1. In this modification, the conductive member 4a is in contact with the first surface SR1 and the first side surface SS1 at a point PO1 on the first surface SR1 and at points PO2 and PO3 on the first side surface SS1.

[0048] The second recess R2 has a shape that is recessed upward. More specifically, the second recess R2 has a second surface SR2 located above the second lower main surface S4 and a second side surface SS2 connecting the second lower main surface S4 and the second surface SR2. The second recess R2 may have a shape that follows the upper part of the conductive member 4a.

[0049] The conductive member 4a is in contact with two or more points of the second recess R2. In this modification, the conductive member 4a is in contact with the second surface SR2 and the second side surface SS2 at a point PO4 on the second surface SR2 and at points PO5 and PO6 on the second side surface SS2.

[0050] The circuit module 1c described above also achieves the same effects as the circuit module 1. Furthermore, the circuit module 1c allows the conductive member 4a to be more firmly fixed to the first input / output electrode 12a. More specifically, the first input / output electrode 12a has a first recess R1 that is recessed downward. The conductive member 4a contacts the first recess R1 at two or more points. Therefore, the circuit module 1c allows the conductive member 4a to be more firmly fixed to the first input / output electrode 12a compared to when only the lower end of the conductive member 4a contacts the first input / output electrode 12a.

[0051] Furthermore, according to the circuit module 1c, the conductive plate member 3a can be more firmly fixed to the conductive member 4a. More specifically, the conductive plate member 3a has a second recess R2 that is recessed upward. The conductive member 4a contacts the second recess R2 at two or more points. Therefore, according to the circuit module 1c, the conductive plate member 3a can be more firmly fixed to the conductive member 4a than when only the upper end of the conductive member 4a contacts the conductive plate member 3a.

[0052] [Fourth Variation] The structure of a circuit module 1d according to a fourth modified example of the present invention will be described below with reference to the drawings. Fig. 13 is a perspective view of the circuit module 1d according to the fourth modified example. Note that in Fig. 13, reference numerals are assigned only to representative first input / output electrodes 12a, 12b and conductive members 41a, 42b among the plurality of first input / output electrodes 12a, 12b and the plurality of conductive members 41a, 42b. Note that, for the circuit module 1d according to the fourth modified example, only the differences from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0053] The circuit module 1d according to the fourth modification differs from the circuit module 1 according to the first embodiment in that the conductive plate member 3a has a first portion P1a extending upward from the second upper main surface S3, and the conductive plate member 3b has a first portion P1b extending upward from the second upper main surface S3. Note that the structure of the first portion P1b is symmetrical to that of the first portion P1a, and therefore a description of the structure of the first portion P1b will be omitted.

[0054] In this modified example, the conductive plate-shaped member 3a has a plurality of first portions P1a extending upward from the second upper main surface S3. The plurality of first portions P1a are aligned in the rightward direction at intervals from one another. The first portions P1a have left and right main surfaces aligned in the left-right direction. When viewed in the rightward direction, the first portions P1a have a rectangular shape with long sides extending in the front-rear direction and short sides extending in the up-down direction. The right main surface of the first portion P1a located at the rightmost of the plurality of first portions P1a is in contact with the left surface of the second input / output electrode 22a.

[0055] The circuit module 1d described above also achieves the same effects as the circuit module 1. Furthermore, the circuit module 1d can improve the heat dissipation of the conductive plate member 3a. More specifically, the conductive plate member 3a has a first portion P1a extending upward from the second upper main surface S3. This increases the surface area of ​​the conductive plate member 3a. Therefore, the circuit module 1d can improve the heat dissipation of the conductive plate member 3a.

[0056] Furthermore, the circuit module 1d can more firmly fix the first electronic component 2. More specifically, the right main surface of the rightmost first portion P1a among the multiple first portions P1a is in contact with the left surface of the second input / output electrode 22a. Furthermore, the left main surface of the leftmost first portion P1b among the multiple first portions P1b is in contact with the right surface of the second input / output electrode 22b. This allows the first portions P1a and P1b to more firmly fix the first electronic component 2 in the left-right direction. Therefore, the circuit module 1d can more firmly fix the first electronic component 2.

[0057] [Fifth Modification] The structure of a circuit module 1e according to a fifth modified example of the present invention will be described below with reference to the drawings. Fig. 14 is a plan view of the circuit module 1e according to the fifth modified example as viewed from below. Note that, regarding the circuit module 1e according to the fifth modified example, only the differences from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0058] The circuit module 1e according to the fifth modification differs from the circuit module 1 according to the first embodiment in that the plurality of conductive members 41a, 42a are located at the corners of the main body 21 when viewed from below.

[0059] More specifically, the plurality of conductive members 41a, 42a are located near a corner C formed by the front edge of the main body portion 21 and the left edge of the main body portion 21 when viewed from below.

[0060] As in this modification, the circuit module 1e may include a plurality of conductive plate-shaped members 3a, or may include only one conductive member 41a.

[0061] The circuit module 1e described above also achieves the same effects as the circuit module 1. Furthermore, according to the circuit module 1e, the plurality of conductive members 41a, 42a are located at the corners of the main body 21 when viewed from below, which makes it possible to more stably support the first electronic component 2.

[0062] [Sixth Modification] The structure of a circuit module 1f according to a sixth modified example of the present invention will be described below with reference to the drawings. Fig. 15 is a plan view of the circuit module 1f according to the sixth modified example, viewed from below. Note that, for the circuit module 1f according to the sixth modified example, only the differences from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0063] The circuit module 1f according to the sixth modification differs from the circuit module 1 according to the first embodiment in that the circuit module 1f further includes an insulating member .

[0064] The conductive plate-shaped member 3a is provided on the insulating member 7. More specifically, the second lower main surface S4 is provided on the insulating member 7. The insulating member 7 has an ellipsoidal spherical shape. In this modification, the insulating member 7 has a spherical shape. The insulating member 7 is made of a material such as resin. The insulating member 7 only needs to have insulating properties. The second lower main surface S4 is in contact with the upper end of the insulating member 7. More specifically, the conductive plate-shaped member 3a is fixed to the insulating member 7 with an adhesive (not shown). The insulating member 7 is provided on the first upper main surface S1. The insulating member 7 may be provided in a region other than the conductor layer provided on the first upper main surface S1, or may be provided on the conductor layer provided on the first upper main surface S1.

[0065] The circuit module 1f described above also achieves the same effects as the circuit module 1. Furthermore, according to the circuit module 1f, the insulating member 7 is provided on the first upper main surface S1 in an area other than the first input / output electrodes 12a, 12b, thereby making it possible to more stably support the first electronic component 2.

[0066] [Other embodiments] The circuit module according to the present invention is not limited to the circuit modules 1, 1a to 1f, and can be modified within the scope of the gist thereof. Furthermore, the structures of the circuit modules 1, 1a to 1f may be combined arbitrarily.

[0067] The circuit module 1 only needs to include at least one of the conductive plate-shaped members 3a and 3b, and at least one of the plurality of conductive members 4a and 4b.

[0068] The circuit module 1 may not necessarily include the second electronic component 5. Furthermore, the circuit module 1 may not necessarily include the third electronic component 6.

[0069] The first input / output electrodes 12a and 12b do not have to be arranged in this order from left to right.

[0070] The first input / output electrodes 12a may not be electrically connected to each other by a conductor layer, and the first input / output electrodes 12b may not be electrically connected to each other by a conductor layer.

[0071] The second input / output electrodes 22a do not necessarily have to be provided on the lower surface and left surface of the main body 21. The second input / output electrodes 22b do not necessarily have to be provided on the lower surface and right surface of the main body 21.

[0072] It is sufficient that there are a plurality of each of the conductive members 4a and 4b. Also, it is not necessary that both the conductive members 41a and 42a are present. Also, it is not necessary that both the conductive members 41b and 42b are present.

[0073] The first input / output electrodes 12a and 12b do not necessarily have to have a rectangular shape when viewed from below.

[0074] In the circuit module 1a, the conductive members 4a and 4b do not necessarily have to have a cylindrical shape extending upward. For example, the conductive members 4a and 4b may have a rectangular column shape extending upward.

[0075] The diameter of the conductive member 42a does not have to be larger than the sum of the diameter of the conductive member 41a and the thickness of the conductive plate-shaped member 3a in the vertical direction.

[0076] The through hole H does not have to have a circular shape when viewed from below. Furthermore, the center of the through hole H when viewed from below does not have to coincide with the center of the conductive member 42a when viewed from below.

[0077] In the circuit module 1c, the second lower main surface S4 does not necessarily have to be provided with the second recess R2, or the first input / output electrodes 12a and 12b do not necessarily have to be provided with the first recess R1.

[0078] The conductive members 4a and 4b may be in contact with two or more points on the first surface SR1 but not with the first side surface SS1. Alternatively, the conductive members 4a and 4b may be in contact with two or more points on the first side surface SS1 but not with the first surface SR1.

[0079] The conductive members 4a and 4b may be in contact with two or more points on the second surface SR2 but not with the second side surface SS2. Alternatively, the conductive members 4a and 4b may be in contact with two or more points on the second side surface SS2 but not with the second surface SR2.

[0080] In the circuit module 1d, the number of first portions P1a, P1b may be one or more. Furthermore, when the conductive plate member 3a has the first portion P1a extending upward from the second upper main surface S3, the conductive plate member 3b does not have to have the first portion P1b extending upward from the second upper main surface S3. Furthermore, when the conductive plate member 3b has the first portion P1b extending upward from the second upper main surface S3, the conductive plate member 3a does not have to have the first portion P1a extending upward from the second upper main surface S3.

[0081] The first portions P1a and P1b do not necessarily have to extend upward from the second upper main surface S3, and may extend downward from the second lower main surface S4.

[0082] The first portion P1a does not have to have a rectangular shape when viewed from the right, and the first portion P1b does not have to have a rectangular shape when viewed from the left.

[0083] The right principal surface of the rightmost first portion P1a among the plurality of first portions P1a may not be in contact with the left surface of the second input / output electrode 22a. Also, the left principal surface of the leftmost first portion P1b among the plurality of first portions P1b may not be in contact with the right surface of the second input / output electrode 22a.

[0084] In the circuit module 1e, the plurality of conductive members 41a, 42a do not have to be located near the corner C formed by the front edge of the main body 21 and the left edge of the main body 21 when viewed from below. The plurality of conductive members 41a, 42a may be located at the corner C formed by the front edge of the main body 21 and the left edge of the main body 21 when viewed from below.

[0085] In the circuit module 1e, the plurality of conductive members 41a, 42a may be located at a corner formed by the front edge of the main body 21 and the right edge of the main body 21 when viewed from below. In the circuit module 1e, the plurality of conductive members 41a, 42a may be located at a corner formed by the rear edge of the main body 21 and the left edge of the main body 21 when viewed from below. In the circuit module 1e, the plurality of conductive members 41a, 42a may be located at a corner formed by the rear edge of the main body 21 and the right edge of the main body 21 when viewed from below.

[0086] The insulating member 7 does not have to have a spherical shape. The insulating member 7 may have a columnar shape extending upward. For example, the insulating member 7 may have a rectangular columnar shape extending upward.

[0087] The circuit module 1f may include a plurality of insulating members 7.

[0088] The present invention has the following configuration.

[0089] (1) a circuit board having a substrate body having a first upper main surface and a first lower main surface aligned in the vertical direction, and a first input / output electrode provided on the first upper main surface; a plurality of conductive members each having an oval spherical shape or a columnar shape extending upward; a conductive plate-like member having a second upper main surface and a second lower main surface aligned in the vertical direction; a coil member having a second input / output electrode; It is equipped with the plurality of conductive members are provided on the first input / output electrode and spaced apart from one another; the second lower principal surface is provided on each of the plurality of conductive members, the second input / output electrode is provided on the conductive plate-like member, the conductive plate-like member has a first region that overlaps with the second input / output electrode when viewed from below, and a second region that does not overlap with the second input / output electrode when viewed from above; Circuit module.

[0090] (2) The conductive member has an oval spherical shape. The circuit module according to (1).

[0091] (3) the conductive member has an oval spherical shape, the conductive plate-like member is provided with a through-hole penetrating the conductive plate-like member in the vertical direction, the through hole has a shape that conforms to an upper portion of the conductive member, an upper end of the conductive member is exposed in the upward direction from the through hole and is located above the second lower main surface; A circuit module according to (1) or (2).

[0092] (4) The coil member has a main body portion having a rectangular parallelepiped shape, The plurality of conductive members are located at corners of the main body portion when viewed in the downward direction. A circuit module according to any one of (1) to (3).

[0093] (5) the conductive member has a portion that does not overlap with the second input / output electrode when viewed in the downward direction. A circuit module according to any one of (1) to (4).

[0094] (6) the first input / output electrode is provided with a first recess having a shape recessed downward, the conductive member has an oval spherical shape and is in contact with two or more points of the first recess; A circuit module according to any one of (1) to (5).

[0095] (7) a second recess having a shape recessed in the upward direction is provided on the second lower main surface, the conductive member has an oval spherical shape and is in contact with two or more points of the second recess; A circuit module according to any one of (1) to (6).

[0096] (8) the conductive plate-shaped member has one or more first portions extending in the upward direction from the second upper main surface or one or more first portions extending in the downward direction from the second lower main surface; A circuit module according to any one of (1) to (7).

[0097] (9) the second input / output electrode entirely overlaps the second upper main surface when viewed in the downward direction; A circuit module according to any one of (1) to (8).

[0098] (10) Further provided is one or more insulating members having an oval spherical shape or a columnar shape extending in the upward direction, the insulating member is provided on the first upper main surface, the second lower principal surface is provided on the insulating member; A circuit module according to any one of (1) to (9). [Explanation of symbols]

[0099] 1, 1a to 1f, 10: Circuit module 2: First electronic component 3a, 3b: Conductive plate member 4a, 4b, 41a, 41b, 42a, 42b: Conductive member 5: Second electronic component 6: Third electronic component 7: Insulating material 11: Circuit board 12a, 12b: 1st input / output electrode 13: Board body 21: Main body 22a, 22b: 2nd input / output electrode A1:First area A2:Second area C: Corner H: Through hole P1a,P1b: 1st part R1: First recess R2: Second recess S1: First upper principal surface S2: 1st lower main surface S3: Second upper principal surface S4: 2nd lower main surface SR1: 1st page SR2: 2nd side SS1: First side SS2: Second Side

Claims

1. a circuit board including a substrate body having a first upper main surface and a first lower main surface aligned in a vertical direction, and a first input / output electrode provided on the first upper main surface; a plurality of conductive members each having an oval spherical shape or a columnar shape extending upward; a conductive plate-like member having a second upper main surface and a second lower main surface aligned in the vertical direction; a coil member having a second input / output electrode; It is equipped with the plurality of conductive members are provided on the first input / output electrode at intervals from one another, the second lower principal surface is provided on each of the plurality of conductive members, the second input / output electrode is provided on the conductive plate-like member, the conductive plate-like member has a first region overlapping with the second input / output electrode when viewed in a downward direction, and a second region not overlapping with the second input / output electrode when viewed in the downward direction; Circuit module.

2. The conductive member has an oval spherical shape. The circuit module according to claim 1 .

3. the conductive member has an oval spherical shape, the conductive plate-like member is provided with a through-hole penetrating the conductive plate-like member in the vertical direction, the through hole has a shape that conforms to an upper portion of the conductive member, an upper end of the conductive member is exposed in the upward direction from the through hole and is located above the second lower main surface; The circuit module according to claim 1 .

4. The coil member has a main body portion having a rectangular parallelepiped shape, The plurality of conductive members are located at corners of the main body portion when viewed in the downward direction.

4. The circuit module according to claim 1.

5. the conductive member has a portion that does not overlap with the second input / output electrode when viewed in the downward direction.

4. The circuit module according to claim 1.

6. the first input / output electrode is provided with a first recess having a shape recessed downward, the conductive member has an oval spherical shape and is in contact with two or more points of the first recess; 4. The circuit module according to claim 1.

7. a second recess having a shape recessed in the upward direction is provided in the second lower main surface, the conductive member has an oval spherical shape and is in contact with two or more points of the second recess; 4. The circuit module according to claim 1.

8. the conductive plate-like member has one or more first portions extending in the upward direction from the second upper main surface or one or more first portions extending in the downward direction from the second lower main surface; 4. The circuit module according to claim 1.

9. the second input / output electrode entirely overlaps the second upper main surface when viewed in the downward direction; 4. The circuit module according to claim 1.

10. The device further includes one or more insulating members each having an oval spherical shape or a columnar shape extending in the upward direction, the insulating member is provided on the first upper main surface, the second lower main surface is provided on the insulating member; 4. The circuit module according to claim 1.

Images