Mounting Equipment

Abstract

To provide a mounting device capable of accurately stabilizing a temperature while shortening an aging operation.SOLUTION: For an aging operation prior to a main mounting operation for mounting an electric component 100 onto a tape 300, a bonding head 2 and a bonding stage 3 are moved to an out-of-tape position 92 that is deviated from the tape 300. Then, the bonding head 2 and the bonding stage 3 are relatively contacted or approached at the out-of-tape position 92 while being heated by a head side heater 21, a stage side heater 31 and the like until a temperature is stabilized.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to a mounting apparatus for mounting electronic components on a tape-shaped circuit board on which mounting areas for electronic components are arranged side by side. [Background technology]

[0002] The mounting device, also known as a die bonder or flip chip bonder, places an electronic component on the mounting area of ​​a tape-shaped circuit board (hereinafter referred to as "tape") such as COF tape or TAB tape, and applies pressure and heat while sandwiching the mounting area and the electronic component. In this way, the mounting device electrically and mechanically connects the electronic component to the mounting area of ​​the tape.

[0003] This mounting device has a bonding stage that makes surface contact with the underside of the tape, and a bonding head that holds an electronic component and places it on the tape. The bonding head and bonding stage are heated, and when the electronic component held by the bonding head is pressed against the tape, heat is transferred to the electronic component and the tape, bonding the electrodes of the electronic component to the wiring circuit pattern in the mounting area of ​​the tape.

[0004] The tape expands when heated. Therefore, the mounting area for electronic components (circuits in the mounting area) is uniformly made small in anticipation of the expansion caused by heating of the tape. In other words, the bonding head and bonding stage are required to transfer the same amount of heat to each mounting area, and the temperatures of the bonding head and bonding stage are required to be stable.

[0005] However, the temperatures of the bonding head and bonding stage are unstable until a certain amount of time has passed since the mounting device started operating. That is, in the early stages of operation, heat transfers from the bonding head to the bonding stage, causing the temperature of the bonding head to drop. After a certain amount of time has passed, the thermal gradient between the bonding stage and the bonding head becomes gentler, the heat transfer from the bonding head to the bonding stage also decreases, and the temperature begins to stabilize.

[0006] In this way, when mounting a large number of electronic components in sequence, the temperatures of the bonding head and bonding stage during the initial mounting will be different from the temperatures of the bonding head and bonding stage during mounting after a certain amount of time has passed. As a result, during the initial mounting after the start of operation, the tape does not stretch as desired, and mounting accuracy will decrease.

[0007] An aging operation has been proposed in which the bonding head is heated to an equilibrium temperature before the start of operation of the mounting device (see, for example, Patent Document 1). In Patent Document 1, the aging operation is a simulated mounting operation. In the aging operation, the bonding head is moved toward and away from a substrate such as a lead frame on a heater rail, similar to the mounting operation, without a semiconductor chip present. This causes heat transfer to the bonding head during the aging operation, and the temperature of the bonding head stabilizes before the actual operation. Therefore, the temperature of the bonding head is stabilized from the initial mounting, suppressing a decrease in the mounting accuracy of electronic components mounted initially. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-270359 Summary of the Invention [Problem to be solved by the invention]

[0009] Patent Document 1 is based on the premise that electronic components are placed on a substrate such as a lead frame. If the technology of Patent Document 1 were applied to a mounting device that mounts electronic components on a tape such as the COF tape described above, the same part of the tape would be continuously exposed to heat for a long period of time during the aging operation, and the same part would repeatedly come into contact with the bonding head, which could damage the thin, flexible tape or the wiring circuit pattern formed on the tape.

[0010] Therefore, it is possible to perform the aging operation without placing the tape. However, after the aging operation is completed, it is not possible to move on to the actual mounting operation immediately, and the tape must be placed as an intervening step. In this case, by the time the actual mounting operation begins, the temperatures of the bonding head and bonding stage may have changed from their stable temperatures, which may make the aging operation ineffective.

[0011] The problem to be solved by the present invention is to provide a mounting apparatus that can perform the main mounting operation while keeping the temperature stable and preventing damage to the tape. [Means for solving the problem]

[0012] In order to achieve the above object, the mounting device according to the present invention is a mounting device for mounting electronic components in mounting areas arranged side by side on a tape-shaped circuit board, and includes a transport path along which the tape-shaped circuit board is laid out, tape transport means for running the tape-shaped circuit board on a transport path along the transport path in the main mounting operation, a bonding stage that can be placed on the transport path of the tape-shaped circuit board and supports the tape-shaped circuit board from below, a bonding head that presses and heats the electronic components against the mounting areas of the tape-shaped circuit board supported by the bonding stage, and a heating device for heating the bonding head or, in addition to the bonding head, the bonding stage. and a bonding head and / or a bonding stage are provided with a and a heater, wherein the bonding head and the bonding stage are moved to an off-tape position off the transport path of the tape-shaped circuit board as an aging operation prior to the main operation, and at the off-tape position, the holding surface on which the bonding head holds the electronic component comes into direct contact with the support surface on which the bonding stage supports the electronic component, and is heated by the heater.

[0013] A cleaner may be provided for cleaning the bonding head and the bonding stage at a cleaning position off the transport path of the tape-shaped circuit board, and the off-tape position may be set as the cleaning position.

[0014] A control unit for controlling the aging operation may be provided.

[0015] The control unit may execute the aging operation upon completion of the laying of the tape-shaped circuit board on the transport path.

[0016] The system may include a component supply unit that keeps the electronic components to be mounted on standby, and a pickup head that receives the next electronic component to be mounted from the component supply unit and passes it to the bonding head, and the bonding head and the pickup head may be configured to pass the electronic component at the off-tape position during this operation.

[0017] The heater may be provided in the bonding head, the bonding stage, or both.

[0018] The heater may be placed on the bonding stage during the aging operation. [Effects of the Invention]

[0019] According to the present invention, the main mounting operation can be performed while keeping the temperature stable and preventing damage to the tape-shaped circuit board. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 1 is a plan view showing a configuration of a mounting apparatus according to a first embodiment. [Figure 2] FIG. 1 is a side view showing the configuration of a mounting apparatus according to a first embodiment. [Figure 3] FIG. 2 is a schematic diagram showing the position of a heater and the configuration of a control unit. [Figure 4] FIG. 4 is a schematic diagram showing a first process of the main operation of the mounting device according to the first embodiment. [Figure 5] FIG. 10 is a schematic diagram showing a second process of the main operation of the mounting device according to the first embodiment. [Figure 6] FIG. 10 is a schematic diagram showing a third process of the main operation of the mounting device according to the first embodiment. [Figure 7] 5 is a time chart showing the timing of raising and lowering the bonding head according to the first embodiment. [Figure 8] 4A and 4B are schematic diagrams showing a first process of the aging operation of the mounting apparatus according to the first embodiment. [Figure 9] FIG. 10 is a schematic diagram showing a second process of the aging operation of the mounting device according to the first embodiment. [Figure 10] 4 is a graph comparing the timing of contact and separation between the bonding head and the bonding stage in a main operation and an aging operation according to the first embodiment. [Figure 11] FIG. 10A is a time chart showing the timing of contact and separation between the bonding head and the bonding stage during aging operation, FIG. 10B is a graph showing the temperature change of the bonding head, and FIG. 10C is a graph showing the temperature change of the bonding stage, relating to the first embodiment. [Figure 12] 5A and 5B are schematic views showing a cleaning operation of the mounting apparatus according to the first embodiment. [Figure 13] FIG. 10 is a side view showing the configuration of a mounting apparatus according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0021] (First embodiment) (Overall composition) An embodiment of a mounting apparatus according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a top view showing the configuration of the mounting apparatus 1. FIG. 2 is a side view showing the configuration of the mounting apparatus 1, omitting a loader 42 and an unloader 43, which will be described later, for convenience of explanation. FIG. 3 is a block diagram showing the configuration of a control unit 8 provided in the mounting apparatus 1. The mounting apparatus 1 is also called a die bonder or flip bonder, and presses an electronic component 100 against a mounting area 301 of a tape-shaped circuit board 300 (hereinafter referred to as "tape 300") and heats the mounting area 301 and the electronic component 100. In this way, the mounting apparatus 1 electrically and mechanically connects the electronic component 100 to the mounting area 301 of the tape 300.

[0022] The mounting method is, for example, the COF (Chip On Film) method. The tape 300 is a film made of polyimide or the like, and mounting areas 301 are arranged side by side at regular intervals along the length of the strip. A wiring circuit pattern is formed in the mounting areas 301. The wiring circuit pattern in the mounting areas 301 is formed uniformly small so that it will reach the desired size after stretching, in anticipation of the tape 300 being stretched by heating during mounting.

[0023] Electronic component 100 is directly connected by bump electrodes to the wiring circuit pattern in mounting area 301. This electronic component 100 is a component used in electronic circuits, and includes chips such as MEMS, semiconductor elements, resistors, and capacitors, and semiconductor elements include discrete semiconductors such as transistors, diodes, LEDs, and thyristors, as well as integrated circuits such as ICs and LSIs.

[0024] Such a mounting apparatus 1 includes a transport path 41, a loader 42, and an unloader 43 as tape running means. The transport path 41, the loader 42, and the unloader 43 lay down and guide the tape 300 so that the tape 300 passes through the mounting position 91. The transport path 41, the loader 42, and the unloader 43 also run the tape 300 intermittently so that each mounting area 301 stops at the mounting position 91. The mounting position 91 is a location where the mounting process is scheduled to take place, and is a fixed position where the electronic component 100 and the tape 300 are scheduled to be electrically and mechanically connected.

[0025] The mounting apparatus 1 also includes a component supply unit 5 as a component supply means and a pickup head 6. The component supply unit 5 has electronic components 100 lined up and waiting. The pickup head 6 receives the electronic components 100 from the component supply unit 5 and transports them to an off-tape position 92. The off-tape position 92 is a position off the transport path 41, and is a position off the transport path of the tape 300.

[0026] Furthermore, the mounting apparatus 1 includes a bonding head 2 and a bonding stage 3 as mounting means. The bonding stage 3 is configured to be positionable at the mounting position 91, and supports the underside of the tape 300 with a mounting area 301 stopped at the mounting position 3. The bonding head 2 picks up the electronic component 100 from the pickup head 6 at the off-tape position 92 and transfers it to the mounting position 91. Then, at the mounting position 91, the bonding head 2 presses the electronic component 100 against the mounting area 301 of the tape 300 supported by the bonding stage 3 and heats it.

[0027] The main use of the off-tape position 92 is to transfer the electronic component 100 between the bonding head 2 and the pickup head 6. As will be described later, this off-tape position 92 also serves as a temperature stabilization position in the pre-processing operation for stabilizing the temperatures of the bonding head 2 and the bonding stage 3.

[0028] Furthermore, the mounting apparatus 1 is equipped with a cleaner 7 that cleans the bonding head 2 and bonding stage 3 at an off-tape position 92. That is, the off-tape position 92 also serves as a cleaning position where the cleaner 7 cleans the bonding head 2 and bonding stage 3. Furthermore, as shown in Fig. 3, the mounting apparatus 1 is equipped with a control unit 8 that controls each of these hardware elements.

[0029] (Tape running means) The transport path 41 has a pair of rails 411 that guide the tape 300. The tape 300 runs intermittently while being guided by both rails 411. The running distance per pitch of the tape 300 matches the distance between the centers of adjacent mounting areas 301. A loader 42 that pays out the tape 300 and an unloader 43 that winds up the tape 300 are installed on both ends of the transport path 41, and the tape 300 passes through the transport path 41 and is stretched between the loader 42 and the unloader 43.

[0030] (Implementation means) The bonding head 2 is provided so as to be movable between a mounting position 91 and an off-tape position 92. The bonding head 2 holds the electronic component 100 at the off-tape position 92, moves to the mounting position 91, and descends, heating the electronic component 100 while pressing it against the tape 300 directly below. At the mounting position 91, the bonding stage 3 rises and enters the gap 412 in the transport path 41, making surface contact with the underside of the tape 300 that is pressed from above by the bonding head 2, and heating the electronic component 100 and the tape 300 while supporting them from below. The bonding stage 3 is also provided so as to be movable to the off-tape position 92.

[0031] The bonding head 2 has a flat lower surface. The flat lower surface is a holding surface for the electronic component 100, and suction holes are formed in the holding surface for sucking the electronic component 100. The bonding stage 3 has a flat upper surface. The flat upper surface is a support surface that comes into surface contact with the lower surface of the tape 300.

[0032] 3, a head-side heater 21 is embedded in the bonding head 2, and a stage-side heater 31 is embedded in the bonding stage 3. The head-side heater 21 and the stage-side heater 31 are, for example, pulse heaters. The head-side heater 21 heats the bonding head 2, and the stage-side heater 31 heats the bonding head 2. The bonding stage 3, which comes into surface contact with the tape 300 made of polyimide or the like, has stricter temperature restrictions than the bonding head 2, and the bonding head 2 has a higher temperature than the bonding stage 3.

[0033] It is preferable that a material with a low thermal expansion coefficient is used for the bonding head 2 and the bonding stage 3. Examples of materials with a low thermal expansion coefficient include SUS304, SUS430, and ceramic. By forming the bonding head 2 and the bonding stage 3 from a material with a low thermal expansion coefficient, misalignment between the electronic component 100 and the mounting area 301 caused by thermal expansion of the bonding head 2 and the bonding stage 3 is suppressed.

[0034] Such a bonding head 2 is attached to an elevator mechanism 22 for lowering at the mounting position 91 and a parallel movement mechanism 23 for moving between the mounting position 91 and an off-tape position 92. In addition, the bonding stage 3 is attached to an elevator mechanism 32 for raising at the mounting position 91 and a parallel movement mechanism 33 for moving between the mounting position 91 and an off-tape position 92.

[0035] The lifting mechanism 22, the parallel movement mechanism 23, the lifting mechanism 32, and the parallel movement mechanism 33 are, for example, ball screw mechanisms driven by motors. The movement direction of the lifting mechanism 22 and the lifting mechanism 32 is the up-down direction (Z direction), and the movement direction of the parallel movement mechanism 23 and the parallel movement mechanism 33 is the Y direction, which passes through the mounting position 91 and the off-tape position 92 at a constant height. In other words, the mounting position 91 and the off-tape position 92 are set on a straight line along the Y direction.

[0036] Furthermore, the mounting apparatus 1 is equipped with a position correction mechanism 24 to which the upper and lower dual-view camera 11 and the bonding head 2 are attached. The upper and lower dual-view camera 11 moves on the conveying path 4 so that it can be inserted directly above the mounting position 91, and captures images of the electronic component 100 positioned at the mounting position 91 and the position of the mounting area 301. The position correction mechanism 24 is, for example, a ball screw mechanism driven by a motor, and moves the bonding head 2 in a direction along the conveying path 4 (X direction) to correct positional deviation along the extension direction of the conveying path 4. Positional deviation along a direction perpendicular to the conveying path 4 (Y direction) is corrected by a parallel movement mechanism 23.

[0037] (Parts supply means) The component supply unit 5 holds a wafer sheet 200 on which electronic components 100 are arranged in a two-dimensional direction. The electronic components 100 are attached face-up, with the electrode-forming surface on which the bump electrodes are formed facing upward. The component supply unit 5 then positions the electronic components 100 one by one at pickup positions 93. The pickup positions 93 are where the pickup head 6 picks up the electronic components 100 from the component supply unit 5.

[0038] The component supply unit 5 is equipped with a camera 51 for identifying the positional relationship between the electronic component 100 to be picked up and the pickup position 93, and for accurately positioning the electronic component 100 at the pickup position 93. The pickup head 6 has a flat holding surface at its tip for holding the electronic component 100, and the holding surface is formed with suction holes that generate negative pressure. The pickup head 6 is also attached to a lifting mechanism 61, a parallel movement mechanism 62, and an inverting mechanism 63.

[0039] The lifting mechanism 61 moves the pickup head 6 toward or away from the component supply unit 5 at the pickup position 93. The parallel movement mechanism 62 moves the pickup head 6 between the pickup position 93 and the off-tape position 92. The lifting mechanism 61 and the parallel movement mechanism 62 are ball screw mechanisms, for example, like the lifting mechanism 22, the parallel movement mechanism 23, the lifting mechanism 32, and the parallel movement mechanism 33. The inversion mechanism 63 inverts the pickup head 6 holding the electronic component 100 upside down. The inversion mechanism 63 is, for example, a rotary motor that supports the pickup head 6 on a rotating shaft that extends at a constant height, and rotates the rotating shaft 180°.

[0040] As a result, the pickup head 6 picks up the electronic component 100 from the component supply unit 5 at the pickup position 93, moves to the off-tape position 92, and delivers the electronic component 100 to the waiting bonding head 2. At this time, the holding surface of the bonding head 2 faces downward, so the pickup head 6 is turned upside down between picking up the electronic component 100 at the pickup position 3 and delivering the electronic component 100 to the bonding head 2.

[0041] (Cleaner) The cleaner 7 has, for example, grinding stones on both the top and bottom surfaces and is attached to a parallel movement mechanism 71. The parallel movement mechanism 71 moves the cleaner 7 in a direction (X direction) along the transport path 41, thereby moving it from the retracted position to the off-tape position 92. For example, the parallel movement mechanism 71 is a ball screw mechanism driven by a motor. At the off-tape position 92, the cleaner 7 is positioned between the bonding head 2 and the bonding stage 3. As the bonding head 2 descends and the bonding stage 3 ascends, the bonding head 2 and the bonding stage 3 come into contact with the grinding stones present on the upper limit surface of the cleaner 7. Then, by swinging one of them relative to the other, the bonding head 2 and the bonding stage 3 can be cleaned.

[0042] (Control unit) The control unit 8 is a so-called computer that includes an arithmetic and control device also called a CPU or MPU, a main memory device also called a RAM, an external memory device such as an HDD or SSD, and an interface that transmits and receives control signals to each hardware component of the mounting device 1. This control unit 8 controls the mounting device 1 by loading the program and data stored in the external memory device into the main memory device, executing the program in the arithmetic and control device, and outputting a drive signal according to the execution result through the interface.

[0043] This control unit 8, through program processing, comprises a bonding head control unit 82, which is mainly composed of an arithmetic control unit and an interface, a bonding stage control unit 83, a tape running control unit 84, a pickup control unit 85, a cleaner control unit 87, a heating control unit 88, and a timing unit 89. To explain the bonding head control unit 82 and the bonding stage control unit 83 in more detail, the bonding head control unit 82 comprises an elevation control unit 822 and a parallel movement control unit 823, and the bonding stage control unit 83 comprises an elevation control unit 832 and a parallel movement control unit 833.

[0044] The timing unit 89 outputs a timing signal. The bonding head control unit 82 outputs a drive signal for moving the bonding head 2 up and down a predetermined distance and moving it in parallel, while measuring the timing based on the timing signal, in accordance with the main operation, pre-processing operation, or cleaning operation. The bonding stage control unit 83 outputs a drive signal for moving the bonding stage 3 up and down a predetermined distance and moving it in parallel, while measuring the timing based on the timing signal, in accordance with the pre-processing operation or cleaning operation. The heating control unit 88 outputs drive signals for turning on and off the head-side heater 21 and the stage-side heater 31 during the main operation and pre-processing operation.

[0045] During this operation, the tape running control unit 84 measures the timing based on the timing signal and outputs drive signals for unwinding and rewinding the loader 42 and unloader 43. During this operation, the pickup control unit 85 measures the timing based on the timing signal and outputs drive signals for a predetermined lifting distance, a predetermined parallel movement distance and reversal angle of the pickup head 6, and a two-dimensional movement distance of the component supply unit 5. During cleaning operation, the cleaner control unit 87 outputs a drive signal for a predetermined parallel movement distance of the cleaner 7 based on the timing signal.

[0046] (operation) (Actual operation) 4 to 7, the main operation of the mounting apparatus 1 under the control of the control unit 8 will be described. This operation is to mount the electronic component 100 in the mounting area 301 of the tape 300. This operation is performed after the tape 300 is stretched over the transport path 4 and the temperatures of the bonding head 2 and the bonding stage 3 are stabilized by the aging operation described below.

[0047] First, as shown in Fig. 4, the component supply unit 5 aligns the electronic component 100 to be picked up at the pickup position 93. The pickup head 6 descends at the pickup position 93, sucks and holds the electronic component 100, and then ascends again away from the component supply unit 5. The pickup head 6 then heads toward the off-tape position 92. During or after moving to the off-tape position 92, the pickup head 6 is rotated 180°.

[0048] The bonding head 2 moves in parallel toward the off-tape position 92 and descends at the off-tape position 92. The bonding head 2 then receives the electronic component 100 by suction and holding it from the pickup head 6. At this time, the pickup head 6 releases the electronic component 100 by breaking the vacuum or by opening to the atmosphere.

[0049] 5, the bonding head 2 that has received the electronic component 100 heads toward the mounting position 91 and descends at the mounting position 91. The bonding stage 3 supports the tape 300 on the transport path 4 from below at the mounting position 91. The loader 42 and unloader 43 stop the running of the tape 300 and position the mounting area 301 at the mounting position 91.

[0050] The bonding head 2 presses and heats the electronic component 100 against the mounting area 301 on the tape 300. By this pressing and pressure, the electronic component 100 is electrically and mechanically connected to the mounting area 301.

[0051] 6, when mounting of one electronic component 100 is completed, the bonding head 2 releases the electronic component 100, rises, and heads toward the off-tape position 92 to receive the next electronic component 100. After delivering the electronic component 100, the pickup head 6 heads toward the pickup position 93 to pick up the next electronic component 100. The component supply unit 5 moves in two dimensions to position the next electronic component 100 at the pickup position 93. The loader 42 and unloader 43 feed and rewind the tape 300 to run the tape 300, and stop the empty mounting area 301 located next to the mounting area 301 on which the electronic component 100 has been mounted at the mounting position 91.

[0052] 7 is a time chart showing the operation timing of the bonding head 2. As shown in FIG. 7, the bonding head 2 repeatedly moves between a close state and a separated state relative to the bonding stage 3. In the close state, the bonding head 2 moves close to the bonding stage 3 at the mounting position 91 to press the electronic component 100 against the tape 300 and heat it. The separated state refers to the state in which, after mounting of the electronic component 100 is completed, the bonding head 2 moves away from the bonding stage 3, receives the next electronic component 100 at the off-tape position 92, and brings the electronic component 100 into contact with the mounting area 301, thereby again moving close to the bonding stage 3.

[0053] The same time S1 is spent in each close state. The same time S2 is spent in each separated state. In other words, the bonding head 2 repeats the same approach and separation pattern during this operation. This approach and separation pattern is made up of elements: the timing of approaching the bonding stage 3, the time S1 during which it is close, the timing of separating from the bonding stage 3, and the time S2 during which it is separated; the location of approach and the details of movement during separation are not included as elements of the approach and separation pattern.

[0054] (cleaning operation) When the mounting of electronic components 100 is repeated using the above-described operation, dirt and the like adheres to the bonding head 2 and bonding stage 3, so a cleaning operation is performed at preset time intervals or after a preset number of mounting operations. During the cleaning operation, as shown in FIG. 12 , the bonding head 2, bonding stage 3, and cleaner 7 move to the off-tape position 92. The bonding head 2 descends and oscillates while making contact with the grindstone on the upper surface of the cleaner 7. The bonding stage 3 rises and oscillates while making contact with the grindstone on the lower surface of the cleaner 7. When cleaning is complete, the cleaner 7 retreats to a waiting position away from the off-tape position 92.

[0055] (Pre-processing operation) The pre-processing operation of the mounting apparatus 1 under the control of the control unit 8 will be described with reference to Figures 8 to 11. The pre-processing operation is performed prior to the main operation and includes a tape installation operation and an aging operation. In the tape installation operation, the loader 42 is caused to pay out the tape 300, the tape 300 is set in the transport path 4, and the tape 300 is wound around the unloader 43. The tape installation operation is completed before the aging operation or in parallel with the aging operation, by the time the aging operation is completed.

[0056] In the aging operation prior to the main operation, the head-side heater 21 and the stage-side heater 31 are turned on to heat the bonding head 2 and the bonding stage 3 under the same operating conditions as the main operation (for example, the same amount of heat per unit time as the main operation, i.e., the same set temperature as the main operation). The head-side heater 21 and the stage-side heater 31 are continuously turned on until the pre-processing operation is completed and the main operation is started, emitting the same amount of heat per unit time as the main operation, and continuing to heat the bonding head 2 and the bonding stage 3.

[0057] During the aging operation, as shown in FIG. 8, both the bonding head 2 and the bonding stage 3 are positioned at the off-tape position 92 and spaced apart from each other during heating. Then, first, the bonding stage 3 is raised to the same height as the height at which the tape 300 is supported, and then, as shown in FIG. 9, the bonding head 2 is lowered. This brings the holding surface of the bonding head 2 into contact with or close to the support surface of the bonding stage 3. The close proximity is preferably a distance equivalent to the thickness of the electronic component 100 and the tape 300, or a distance that is the same as the amount of heat conduction when the electronic component 100 and the tape 300 are present.

[0058] The separated state shown in FIG. 8 and the contact or proximity state shown in FIG. 9 (hereinafter referred to as the contact or proximity state or simply the contact state) are repeated a predetermined number of times, for example, 20 to 30 times or more. The number of repetitions of 20 to 30 or more is an example, and the number of repetitions required to achieve a stable temperature can be determined empirically, experimentally, by calculation, or by simulation. The separated state is maintained for the same time S2 as the separated state in the main operation shown in FIG. 7. The contact state is maintained for the same time S1 as the proximity state in the main operation shown in FIG. 7. That is, as shown in FIG. 10(b), in the aging operation, the bonding head 2 and bonding stage 3 operate at the off-tape position 92 with the tape 300 and electronic component 100 absent, in the same approach / separation pattern as in the main operation. Note that FIG. 10(a) shows the approach / separation pattern in the main operation.

[0059] (a) of Figure 11 is a time chart showing the timing of the separated and contact states of the bonding head 2 during the aging operation, (b) is a graph showing a schematic diagram of the temperature change of the bonding head 2 during the aging operation, and (c) is a graph showing a schematic diagram of the temperature change of the bonding stage 3 during the aging operation.

[0060] 11, at the beginning of the aging operation, there is a large temperature difference between the bonding head 2 and the bonding stage 3. The bonding head 2 has a higher temperature than the bonding stage 3. Therefore, during the time S1 when the bonding head 2 and the bonding stage 3 are in contact or close to each other, the temperature of the bonding head 2 drops significantly and the temperature of the bonding stage 3 rises significantly.

[0061] On the other hand, the difference between the bonding head 2 and room temperature is large, while the difference between the bonding stage 3 and room temperature is small. Therefore, during the time S2 when the bonding head 2 and bonding stage 3 are separated, the temperature rise of the bonding head 2 is small, and the temperature drop of the bonding stage 3 is small. Therefore, in Figure 11, the temperature drop of the bonding head 2 continues, and the temperature rise of the bonding stage 3 continues, until the separated state and the contact state are repeated for the fourth time.

[0062] However, because the temperature of the bonding head 2 continues to decrease and the temperature of the bonding stage 3 continues to increase, the temperature difference between the bonding head 2 and the bonding stage 3 becomes smaller in the latter part of the aging operation compared to the initial period. Therefore, during time S1 when the bonding head 2 and the bonding stage 3 are in contact or close proximity, the temperature decrease of the bonding head 2 becomes smaller than in the initial period, and the temperature increase of the bonding stage 3 becomes smaller than in the initial period.

[0063] Meanwhile, the temperature of the bonding head 2 continues to decrease, so the difference between the bonding head 2 and room temperature decreases. Also, the temperature of the bonding stage 3 continues to increase, so the difference between the bonding head 3 and room temperature increases. Therefore, during time S2 when the bonding head 2 and bonding stage 3 are separated, the temperature increase of the bonding head 2 caused by the head-side heater 21 becomes larger than at the beginning, and the temperature decrease of the bonding stage 3 becomes larger than at the beginning.

[0064] Eventually, the temperature drop of the bonding head 2 at time S1 and the temperature rise of the bonding head 2 at time S2 become balanced. Note that FIG. 11 shows a schematic diagram of a state in which, from the fifth time onward, the upper temperature limit T1, the lower temperature limit T2, the temperature drop rate, and the temperature rise rate of the bonding head 2 all maintain approximately constant values, and the average values ​​stabilize. Also, the temperature rise of the bonding stage 3 at time S1 and the temperature drop of the bonding stage 3 at time S2 become balanced. FIG. 11 also shows a schematic diagram of a state in which, from the fifth time onward, the upper temperature limit T3, the lower temperature limit T4, the temperature drop rate, and the temperature rise rate of the bonding stage 3 all maintain approximately constant values, and the average values ​​stabilize. That is, from the fifth time onward, the temperatures of the bonding head 2 and bonding stage 3 stabilize, exhibiting the same temperature change pattern and amount each time.

[0065] When the above pre-processing operations are completed, the tape 300 has already been stretched, and the mounting area 301 on the tape 300 where the electronic components 100 are to be mounted first is positioned at the mounting position 91, enabling the main operation to be started immediately. Therefore, the temperatures of the bonding head 2 and the bonding stage 3 remain stable, and a constant average value of heat is applied to the tape 300 from the first mounting to the last mounting, with the same upper temperature limits T1 and T3 (note that T1 ≠ T3), the same lower temperature limits T2 and T4 (note that T2 ≠ T4), the same temperature drop rate, and the same temperature rise rate. This uniformly stretches the mounting area 301 due to heat from the first mounting to the last mounting, allowing all electronic components 100 to be mounted with the same precision in all mounting areas 301.

[0066] Furthermore, during this pre-processing operation, the user does not perform trial and error to set stable temperatures for the bonding head 2 and bonding stage 3. In the pre-processing operation, it is sufficient to simply repeat contact or proximity and separation between the bonding head 2 and bonding stage 3 at the off-tape position 92 at the same timing as in this operation.

[0067] (Action and effect) As described above, the mounting apparatus 1 that mounts electronic components 100 on mounting areas 301 includes the transport path 4, bonding head 2, and bonding stage 3. The tape 300, on which the mounting areas 301 are arranged in a belt-like manner, runs along the transport path 4. The bonding stage 3 can be arranged on the transport path of the tape 300 by the transport path 4, and supports the tape 300 from below. The bonding head 2 holds the electronic component 100 and heats it by pressing it against the mounting area 301 of the tape 300 supported by the bonding stage 3. The bonding head 2 and bonding stage 3 are equipped with a head-side heater 21 and a stage-side heater 31.

[0068] Then, as an aging operation prior to the actual mounting operation of mounting the electronic component 100 on the tape 300, the bonding head 2 and the bonding stage 3 are moved to an off-tape position 92 away from the tape 300, and are heated while repeatedly coming into contact or approaching and separating at the off-tape position 92.

[0069] This allows the aging operation to be performed with or while the tape 300 is stretched across the transport path 4. More specifically, at the start of the aging operation or until the aging operation is completed, the mounting area 301 on the tape 300 where the electronic component 100 is first mounted can be positioned at the mounting position 91. This prevents the temperatures of the bonding head 2 and the bonding stage 3 from changing from their stable temperatures due to the operation of stretching the tape 300 after the aging operation, further improving mounting accuracy.

[0070] Moreover, since the aging operation is performed by moving the tape 300 at the mounting position 92 to the off-tape position 92, which is a position away from the transport path 4 of the tape 300, it is possible to prevent the tape 300 suspended over the transport path 4 from being heated by the heat (radiant heat) of the bonding head 3 during the aging operation. This makes it possible to prevent the tape 300 from unexpectedly expanding thermally or being damaged by heating. Therefore, it is possible to expect further improvements in mounting accuracy and also to improve mounting quality.

[0071] When the aging operation is performed with the tape 300 stretched across the transport path 4, the aging operation may be automatically started upon completion of positioning of the first mounting area 301 of the tape 300 at the mounting position 91. For example, the control unit 8 receives a signal from the tape travel control unit 84 indicating that the first mounting area 301 of the tape 300 has stopped at the mounting position 91. Then, upon receiving this signal, the bonding head control unit 82 and the bonding stage control unit 83 output drive signals so that the movements of the bonding head 2 and the bonding stage 3 perform the aging operation. This makes it possible to automatically execute and complete the aging operation simply by performing the tape installation operation.

[0072] Furthermore, the off-tape position 92 where the aging operation is performed is a position where the cleaner 7 cleans the bonding head 2 and bonding stage 3. This allows the movement mechanism that positions the off-tape position 92 to be used for the aging operation. However, as long as the aging operation, cleaning operation, and electronic component 100 delivery operation are performed at positions outside the tape 300, there is no problem in stabilizing the temperatures of the bonding head 2 and bonding stage 3 whether they are performed at the same location or at different locations.

[0073] This mounting apparatus 1 is provided with both a head-side heater 21 and a stage-side heater 31, but it may be provided with either one as long as it can stabilize the desired temperature. However, if the head-side heater 21 is provided on the bonding head 2, the temperature of the bonding head 2 that is not in contact with the tape 300 can be set higher, thereby shortening the time required to bond the electronic component 100 to the mounting area 301 of the tape 300. However, in order to stabilize the temperature in a range close to the desired temperature and to stabilize it quickly, it is desirable to also provide a stage-side heater 31.

[0074] Furthermore, to fully simulate this operation, a dummy electronic component 100 and a piece of dummy tape 300 may be placed on top of each other on the bonding stage 3, and the aging operation may be performed while sandwiching these dummies. This also allows for reproduction of the heat transfer behavior via the electronic component 100 and tape 300, allowing the temperature stabilized in this operation and the temperature stabilized in aging to match with high precision. In other words, temperature changes during mounting at the beginning of this operation are further suppressed.

[0075] (Second embodiment) In the first embodiment, as an aging operation, the bonding head 2 is configured to alternately repeat a predetermined number of times of contact or proximity with the bonding stage 3 and separation from the bonding stage 3 at an operation timing that simulates the actual mounting operation. However, the method of heating the bonding head 2 and bonding stage 3 is not limited to this.

[0076] For example, as shown in Figure 13, the mounting apparatus 1 is equipped with a heater 12 that is installed only during the aging operation and is removed during the actual mounting operation. The heater 12 is placed on the bonding stage 3 by an operator during the aging operation. The bonding head 2 moves toward the bonding stage 3 at an off-tape position 92. The bonding head 2 then maintains proximity to or contact with the heater 12 on the bonding stage 3 for a predetermined time. In other words, the bonding head 2 approaches or comes into contact with the bonding stage 3 on which the heater 12 is placed. The predetermined time of proximity or contact is the time required to reach a stable temperature, and is determined in advance by experience, experiment, calculation, or simulation.

[0077] After a predetermined time has elapsed, the heater 12 may be removed by an operator, or may be held by suction by the bonding head 2 and moved to a location other than the mounting position 91 or the off-tape position 92. In the case of a method in which the heater 12 is removed by the bonding head 2, the process can automatically proceed to the actual mounting operation.

[0078] In addition to the heater 12, the heater-side stage 21 and the stage-side stage 31 may also be turned on to apply more heat to the bonding head 2 and the bonding stage 3, thereby shortening the time required for the aging operation. The heater 12 may not be disposed on the bonding stage 3, and the heater-side stage 21 and the stage-side stage 31 may be turned on to perform the aging operation by keeping the bonding head 2 and the bonding stage 3 in contact or separated for a predetermined time only using the heater-side stage 21 and the stage-side stage 31.

[0079] The following method can be used to empirically or experimentally derive the predetermined time. That is, a thermometer such as a thermocouple is placed on the bonding stage 3 or attached to the bonding head 2, and the bonding head 2 and bonding stage 3 are brought into contact or close proximity. The temperature change indicated by the thermometer is observed, and the time required for the temperature to stabilize is measured, and the measurement result is used as the predetermined time. Similarly, when the bonding head 2 and bonding stage 3 are repeatedly brought into close proximity and spaced apart to simulate the actual mounting operation as an aging operation, the number of repetitions can be empirically or experimentally derived by counting the number of repetitions until the temperature stabilizes using the thermometer.

[0080] (Other embodiments) Although the embodiments of the present invention and modifications of each part have been described above, these embodiments and modifications of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and modifications are included within the scope and spirit of the invention, and are also included in the invention described in the claims. [Explanation of symbols]

[0081] 1 Mounting equipment 11. Top and bottom dual field of view camera 12 Heater 2 Bonding Heads 21 Head side heater 22 Lifting mechanism 23 Parallel movement mechanism 24 Position correction mechanism 3 Bonding Stage 31 Stage side heater 32 Lifting mechanism 33 Parallel movement mechanism 41 Transport path 411 Rail 412 Gap 42 Loader 43 Unloader 5. Parts Supply Department 51 Camera 6 Pickup head 61 Lifting mechanism 62 Parallel movement mechanism 63 Reversal mechanism 7 Cleaner 71 Parallel movement mechanism 8 Control Unit 82 Bonding head control unit 822 Lift control section 823 Parallel movement control section 83 Bonding stage control unit 832 Lift control section 833 Parallel movement control section 84 Tape running control unit 85 Pickup control section 87 Cleaner control unit 88 Heating control unit 89 Timing section 91 Mounting Position 92 Off-tape position 93 Pickup Position 100 Electronic Components 200 wafer sheets 300 Tape-shaped circuit board, tape 301 Implementation Area

Claims

1. A mounting device that mounts electronic components in mounting areas arranged side by side on a tape-shaped circuit board, a tape transport means having a transport path along which the tape-shaped circuit board is laid, and which transports the tape-shaped circuit board along a transport path along the transport path in the main mounting operation; a bonding stage that can be placed on the transport path of the tape-shaped circuit board and supports the tape-shaped circuit board from below; a bonding head that presses and heats the electronic component against the mounting area of ​​the tape-shaped circuit board supported by the bonding stage; a heater that heats the bonding head or, in addition, the bonding stage, and is provided on either or both of the bonding head and the bonding stage; Equipped with The bonding head and the bonding stage are As an aging operation prior to the main operation, the tape-shaped circuit board is moved to an off-tape position away from the transport path, At the off-tape position, a holding surface on which the bonding head holds the electronic component is in direct contact with a support surface on which the bonding stage supports the electronic component, and is heated by the heater. A mounting device characterized by:

2. In the aging operation, The holding surface of the bonding head and the support surface of the bonding stage are Repeating direct contact and separation at the off-tape position; 2. The mounting device according to claim 1,

3. a cleaner for cleaning the bonding head and the bonding stage at a cleaning position that is off the transport path of the tape-shaped circuit board; the off-tape position is set to the cleaning position; 3. The mounting device according to claim 1 or 2,

4. a bonding head control unit that controls the movement of the bonding head; a bonding stage control unit that controls movement of the bonding stage; a heating control unit that controls the heater, The control unit controlling the bonding head control unit and the bonding stage control unit to move the bonding head and the bonding stage from a mounting position where the main operation is performed to an off-tape position, and moving the bonding head and the bonding stage so that the holding surface of the bonding head and the supporting surface of the bonding stage come into direct contact with each other at the off-tape position, and controlling the heating control unit to drive the heater and control the aging operation; 4. The mounting device according to claim 1, wherein:

5. the control unit executes the aging operation after the tape-shaped circuit board has been laid on the transport path; 5. The mounting device according to claim 4,

6. a component supply unit that keeps the electronic components to be mounted on standby; a pickup head that receives the next electronic component to be mounted from the component supply unit and passes it to the bonding head; Equipped with the pickup head delivers the electronic component to the bonding head at the off-tape position during the main operation; 6. The mounting device according to claim 1, wherein:

7. In the main operation, the bonding head repeats a state in which the bonding head is close to the bonding stage by pressing the electronic component against the mounting area of ​​the tape-shaped circuit board supported on the support surface of the bonding stage for a first time period, and a state in which the bonding head is farther away from the bonding stage than the close state for a second time period, during the aging operation, the bonding head repeatedly brings the holding surface of the bonding head into direct contact with the bonding stage for a period of time equal to the first time without holding the electronic component on the holding surface of the bonding head, and moves the holding surface of the bonding head away from the bonding stage for a period of time equal to the second time; 7. The mounting device according to claim 1, wherein:

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