Processing method of workpiece

Abstract

To provide a workpiece processing method that can firmly fix the thermocompression sheet to a workpiece and a frame.SOLUTION: A workpiece processing method includes an integration step 1 for heating and press-bonding a thermocompression sheet to a frame having an opening for accommodating a workpiece and the workpiece accommodated in the opening, and integrating the frame and the workpiece via the thermocompression sheet, and a processing step 2 of processing the workpiece integrated with the frame with the thermocompression sheet, and in the integration step 1, the thermocompression sheet is fixed to the frame by pressing the thermocompression sheet against the frame heated by a heat table having a heat source while heating the thermocompression sheet with a heat roller having a heat source.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a method for processing a workpiece. [Background technology]

[0002] When various plate-shaped workpieces, such as wafers on which semiconductor devices are formed, are ground to thin them or when they are divided into individual device chips, adhesive tape has traditionally been applied to the surface of the workpiece to protect the surface during processing and prevent the chips from falling apart after division.

[0003] However, when the surface of a workpiece has unevenness, such as electrode bumps of a semiconductor device, an adhesive tape is required that has an adhesive layer thick enough to absorb the unevenness and to prevent the unevenness from affecting the results of processing such as grinding. However, such adhesive tape can leave residue of the adhesive layer on the unevenness of the workpiece, which can cause malfunction of the device.

[0004] Therefore, a method has been devised in which, instead of adhesive tape, a resin sheet made of a thermoplastic resin without an adhesive layer is thermocompressed to absorb the irregularities and leave no residue (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2019-212812 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the resin sheet as in Patent Document 1 does not have an adhesive layer, and therefore presents a new problem in that it is difficult to fix to an annular frame that supports a workpiece.

[0007] The present invention has been made in consideration of the above problems, and its object is to provide a method for processing a workpiece that can firmly fix a thermocompression sheet to the workpiece and frame. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems and achieve the object, a method for processing a workpiece of the present invention comprises an integration step of heating and compressing a thermocompression sheet to a frame having an opening for accommodating a workpiece and the workpiece accommodated in the opening, thereby integrating the frame and the workpiece via the thermocompression sheet, and a processing step of processing the workpiece integrated with the frame by the thermocompression sheet, wherein in the integration step, the workpiece is fixed to one side of the thermocompression sheet and the frame is fixed to the other side of the thermocompression sheet, and the thermocompression sheet is fixed to the frame by heating and pressing the thermocompression sheet with a heat roller equipped with a heat source. The thermocompression sheet does not have an adhesive layer in the area where the workpiece and the frame are attached. It is characterized by:

[0011] In addition, in the method for processing a workpiece of the present invention, the integration step may include a workpiece fixing step for fixing the workpiece to one side of the thermo-compression sheet, and a frame fixing step for fixing the frame to the other side of the thermo-compression sheet. [Effects of the Invention]

[0013] The present invention can firmly fix the thermocompression sheet to the workpiece and the frame. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view showing an example of a workpiece to be processed by a method for processing a workpiece according to a first embodiment. [Figure 2] FIG. 2 is a flowchart showing the flow of the method for processing a workpiece according to the first embodiment. [Figure 3]FIG. 3 is a perspective view showing a schematic view of the workpiece and the frame being positioned on the heat table prior to the integration step shown in FIG. [Figure 4] FIG. 4 is a perspective view schematically illustrating an example of the integration step shown in FIG. [Figure 5] FIG. 5 is a perspective view showing cutting, which is an example of the processing step shown in FIG. [Figure 6] FIG. 6 is a flow chart showing the flow of the integration step in the method for processing a workpiece according to the second embodiment. [Figure 7] FIG. 7 is a perspective view schematically illustrating an example of the frame fixing step shown in FIG. [Figure 8] FIG. 8 is a cross-sectional view schematically showing a first example of the workpiece fixing step shown in FIG. [Figure 9] FIG. 9 is a cross-sectional view schematically showing a second example of the workpiece fixing step shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0015] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0016] (First embodiment) A first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing an example of a workpiece 10 to be processed by a method for processing a workpiece 10 according to the first embodiment. The workpiece 10 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, with a substrate 11 made of silicon (Si), sapphire (Al2O3), gallium arsenide (GaAs), silicon carbide (SiC), or the like.

[0017] The workpiece 10 has a plurality of planned dividing lines 13 set in a grid pattern on the surface 12 of the substrate 11, and devices 14 formed in each region partitioned by the planned dividing lines 13. The devices 14 are, for example, integrated circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integrations), image sensors such as CCDs (Charge Coupled Devices) or CMOSs ​​(Complementary Metal Oxide Semiconductors), or MEMS (Micro Electro Mechanical Systems).

[0018] The back surface 15 of the workpiece 10, which is located on the opposite side to the front surface 12 on which the devices 14 are formed, is ground to a finish thickness by, for example, a grinding device. After being thinned, the workpiece 10 is divided along the planned division lines 13 by cutting or the like to be singulated into individual device chips 16. Although the device chips 16 are square in shape in FIG. 1, they may also be rectangular.

[0019] In the first embodiment, the workpiece 10 has a surface 12 provided with a plurality of bumps 17, which are convex portions that protrude from the surface of the device 14, thereby providing the workpiece with an uneven surface. Each of the plurality of bumps 17 is electrically connected to the device 14, and functions as an electrode for inputting and outputting electrical signals to and from the device 14 when the workpiece 10 is divided into device chips 16. The bumps 17 are formed of a metal material such as gold, silver, copper, or aluminum.

[0020] The workpiece 10 is not limited to that of the first embodiment and may include, for example, a package substrate. The package substrate is formed by forming bumps on the surface thereof as electrodes for individual devices, and sealing a plurality of devices arranged on a plane with sealing resin. The package substrate is thinned by grinding the sealing resin on the back side, and is divided into individual device chips 16 of a predetermined thickness sealed with sealing resin.

[0021] In the first embodiment, the workpiece 10 has bumps 17 mounted thereon to form irregularities on the surface 12, but the present invention is not necessarily limited to the mounting of bumps 17, and irregularities may be formed on the surface 12 by another structure such as the material constituting the device 14, or no irregularities may be formed.

[0022] 2 is a flow chart showing the flow of the method for processing the workpiece 10 according to the first embodiment. The method for processing the workpiece 10 includes an integration step 1 and a processing step 2.

[0023] Fig. 3 is a perspective view showing a schematic view of the positioning of the workpiece 10 and the frame 20 on the heat table 40 before the integration step 1 shown in Fig. 2. Fig. 4 is a perspective view showing a schematic view of an example of the integration step 1 shown in Fig. 2. The integration step 1 is a step in which a thermocompression sheet 30 is heated and compressed to the frame 20 and the workpiece 10, thereby integrating the frame 20 and the workpiece 10 via the thermocompression sheet 30. The integration step 1 of the first embodiment is performed by a heat table 40 and a heat roller 50 each having a heat source therein.

[0024] 2, the frame 20 is formed in a ring shape in a plan view with an opening 21 that is larger than the outer diameter of the workpiece 10. The frame 20 is capable of accommodating the workpiece 10 inside the opening 21. The frame 20 is made of a material such as metal or resin.

[0025] The thermocompression sheet 30 is a thermoplastic resin formed into a sheet shape. The planar shape of the thermocompression sheet 30 is larger than the opening 21 of the frame 20. In the first embodiment, the thermocompression sheet 30 is formed into a flat disk shape with a first surface 31 and a second surface 32 whose outer shape is larger than the inner diameter of the opening 21. The thermocompression sheet 30 is flexible, non-adhesive, and thermoplastic, and does not have an adhesive layer. In the first embodiment, the thermocompression sheet 30 is made of a resin that is transparent or translucent to visible light. In addition, in the first embodiment, the thermocompression sheet 30 is a sheet of a polymer synthesized using an alkene as a monomer, and is made of a thermoplastic resin such as polyethylene, polypropylene, or polystyrene.

[0026] The heat table 40 has an internal heat source and heats the workpiece 10 and frame 20 supported on the holding surface 41. The heat table 40 also has a holding surface 41 at the top center that has a diameter larger than the outer diameter of the frame 20. The holding surface 41 has a suction hole in the area where the workpiece 10 and frame 20 are placed. The suction hole is connected to one end of an exhaust path inside the heat table 40 and is connected via the exhaust path to a suction source 42 provided at the other end of the exhaust path. The exhaust path is provided with a switching unit 43 that switches between a communication state and a cutting state. When the switching unit 43 is in the communication state, negative pressure generated by the suction source 42 acts on the workpiece 10 and frame 20 supported on the holding surface 41, and the workpiece 10 and frame 20 are suction-held on the heat table 40.

[0027] Heat roller 50 has an internal heat source. Heat roller 50 is cylindrical with its axis extending horizontally, and can roll while rotating around its axis from one end to the other end of holding surface 41 of heat table 40, and can press an object supported on heat table 40 in a direction to spread it out onto holding surface 41. The surface of heat roller 50 may be coated with a fluororesin.

[0028] In the integration step 1 of the first embodiment, first, the heat source of the heat table 40 is activated to heat the holding surface 41 to a predetermined temperature, and the heat source of the heat roller 50 shown in FIG. 4 is activated to heat the surface to a predetermined temperature. Next, as shown in FIG. 3, the workpiece 10 and the frame 20 are positioned on the holding surface 41 of the heat table 40. At this time, the workpiece 10 is placed and positioned in the opening 21 of the frame 20 with the front surface 12 of the workpiece 10 facing upward. As a result, the workpiece 10 is heated from the back surface 15 side and the frame 20 is heated from the bottom surface side via the holding surface 41.

[0029] Next, the thermocompression sheet 30 is placed on the workpiece 10 and the frame 20 from the front surface 12 side of the workpiece 10. At this time, the first surface 31 of the thermocompression sheet 30 covers the entire holding surface 41 so that when negative pressure is applied from the suction source 42, the negative pressure does not leak through gaps. Next, the switching unit 43 of the heat table 40 is operated to connect the suction source 42 and the holding surface 41, and negative pressure is applied to the workpiece 10 and the frame 20 placed on the holding surface 41. As a result, the underside of the frame 20 comes into close contact with the holding surface 41 of the heat table 40 (see FIG. 4).

[0030] Next, as shown in Fig. 4, a heat roller 50, the surface of which has been heated to a predetermined temperature, is placed on one end of the heat table 40. The heat roller 50 is then rolled on the second surface 32 of the thermocompression-bonding sheet 30 from one end to the other of the heat table 40 in the direction indicated by the arrow in Fig. 4. At this time, the heat roller 50 presses the thermocompression-bonding sheet 30 in a direction that spreads it out, thereby thermocompression-bonding the thermocompression-bonding sheet 30 to the workpiece 10 and the frame 20.

[0031] As described above, in the integration step 1 of the first embodiment, the back surface 15 of the workpiece 10 and the lower surface of the frame 20 are heated by the heat table 40, and the second surface 32 of the thermocompression sheet 30 is heated by the heat rollers 50. That is, thermocompression bonding is performed by pressing the thermocompression sheet 30 with the heat rollers 50 while heating from both sides. As a result, the first surface 31 of the thermocompression sheet 30 is pressure-bonded to the front surface 12 of the workpiece 10 and the upper surface of the frame 20, and the workpiece 10 and the frame 20 are integrated via the thermocompression sheet 30. Note that the thermocompression sheet 30 is preferably heated to a temperature above its softening point and below its melting point when thermocompression-bonded by the heat rollers 50.

[0032] After thermocompression bonding the thermocompression sheet 30, first, the portion outside the outer periphery of the frame 20 is cut and removed with a cutter or the like. Next, the switching unit 43 is operated to disconnect the suction source 42 from the holding surface 41, thereby releasing the suction to the workpiece 10 and frame 20 placed on the holding surface 41. In a production line in which a plurality of workpieces 10 are processed one after another, the heat sources of the heat table 40 and heat rollers 50 are not stopped, and thermocompression bonding to the thermocompression sheet 30 is performed on the workpieces 10 and frames 20 one after another. In addition, the thermocompression sheet 30 is cooled by being carried out from the heat table 40 in the production line.

[0033] 5 is a cross-sectional view showing cutting, which is an example of processing step 2 shown in Fig. 2. Processing step 2 is a step of processing workpiece 10 integrated with frame 20 by thermocompression sheet 30. In processing step 2 of the first embodiment, workpiece 10 is cut by cutting device 60, but in the present invention, for example, grinding by a grinding device or laser processing by a laser processing device may also be performed.

[0034] The cutting device 60 used in processing step 2 of the first embodiment includes a chuck table 61, a cutting unit 62, a moving unit (not shown) that moves the chuck table 61 and the cutting unit 62 relatively, and an imaging unit (not shown). The cutting unit 62 includes a disk-shaped cutting blade 63, a spindle 64 that serves as the rotation axis of the cutting blade 63, and a mount flange that is attached to the spindle 64 and to which the cutting blade 63 is fixed. The cutting blade 63 and the spindle 64 have a rotation axis that is parallel to the holding surface of the chuck table 61 that holds the workpiece 10 to be cut. The cutting blade 63 is attached to the tip of the spindle 64.

[0035] In processing step 2 of the first embodiment, first, the front surface 12 of the workpiece 10 is suction-held on the holding surface of the chuck table 61 via the thermocompression sheet 30. Next, the cutting unit 62 and the workpiece 10 are aligned. Specifically, a moving unit (not shown) moves the chuck table 61 to the processing area below the cutting unit 62, and an imaging unit (not shown) photographs and aligns the workpiece 10, thereby aligning the planned dividing line 13 of the workpiece 10 with the processing feed direction of the cutting device 60 and aligning the processing point of the cutting blade 63 above the extension of the planned dividing line 13.

[0036] Next, the spindle 64 of the cutting unit 62 is rotated to rotate the cutting blade 63, and cutting water is started to be supplied toward the back surface 15 of the workpiece 10. Next, the cutting unit 62 is lowered to a predetermined height by a moving unit (not shown), and the chuck table 61 and the cutting blade 63 of the cutting unit 62 are moved relatively along the planned division line 13. Then, the grinding wheel portion of the cutting blade 63 rotating about the horizontal rotation axis comes into contact with the workpiece 10, cutting the workpiece 10, and cutting marks 18 along the planned division line 13 are formed in the workpiece 10 and the thermocompression-bonded sheet 30.

[0037] When cutting is performed along all of the planned division lines 13, the workpiece 10 is divided into individual device chips 16. The device chips 16 are supported on a thermocompression sheet 30 with the outer periphery pressed against a frame 20. The device chips 16 are individually picked up from the thermocompression sheet by, for example, a pickup device and mounted on a predetermined wiring board or the like for use.

[0038] Second Embodiment A second embodiment of the present invention will be described with reference to the drawings. Fig. 6 is a flow chart showing the flow of integration step 1 in the method for processing workpiece 10 according to the second embodiment. In the method for processing workpiece 10 of the second embodiment, integration step 1 includes frame fixing step 1-1 and workpiece fixing step 1-2.

[0039] 7 is a perspective view schematically illustrating an example of the frame fixing step 1-1 shown in FIG. 6. The frame fixing step 1-1 is a step of fixing the frame 20 to the thermocompression sheet 30. In the frame fixing step 1-1 of the second embodiment, the frame 20 is fixed to the first surface 31 of the thermocompression sheet 30.

[0040] In the frame fixing step 1-1 of the second embodiment, first, the heat source of the heat table 40 is activated to heat the holding surface 41 to a predetermined temperature, and the heat source of the heat roller 50 shown in Fig. 7 is activated to heat the front surface to a predetermined temperature. Next, as shown in Fig. 7, the frame 20 is positioned on the holding surface 41 of the heat table 40. As a result, the workpiece 10 is heated from the back surface 15 side and the frame 20 is heated from the bottom surface side via the holding surface 41.

[0041] Next, the thermocompression sheet 30 is placed on the upper surface of the frame 20. At this time, the first surface 31 of the thermocompression sheet 30 covers the entire holding surface 41 so that when negative pressure is applied from the suction source 42, the negative pressure does not leak through gaps. Next, the switching unit 43 of the heat table 40 is operated to connect the suction source 42 and the holding surface 41, and negative pressure is applied to the frame 20 placed on the holding surface 41. As a result, the underside of the frame 20 is in close contact with the holding surface 41 of the heat table 40.

[0042] Next, as shown in Fig. 7, a heat roller 50 whose surface has been heated to a predetermined temperature is placed on one end of the heat table 40. The heat roller 50 is then rolled on the second surface 32 of the thermocompression sheet 30 from one end to the other of the heat table 40 in the direction indicated by the arrow in Fig. 7. At this time, the heat roller 50 presses the thermocompression sheet 30 in a direction that spreads it out, thereby thermocompression bonding the thermocompression sheet 30 to the frame 20.

[0043] Thus, in frame fixing step 1-1 of the second embodiment, the frame 20 is heated from the underside by the heat table 40, and the thermocompression sheet 30 is heated from the second side 32 by the heat rollers 50. That is, thermocompression bonding is performed by pressing the thermocompression sheet 30 with the heat rollers 50 while heating from both sides. This results in a pressure bond between the first side 31 of the thermocompression sheet 30 and the upper side of the frame 20. Note that when thermocompression bonding is performed by the heat rollers 50, the thermocompression sheet 30 is preferably heated to a temperature above its softening point and below its melting point.

[0044] After thermocompression bonding the thermocompression sheet 30 to the frame 20, first, the portion outside the outer periphery of the frame 20 is cut and removed with a cutter or the like. Next, the switching unit 43 is operated to disconnect the suction source 42 from the holding surface 41, thereby releasing the suction to the frame 20 placed on the holding surface 41. In a production line in which a plurality of workpieces 10 are processed one after another, the thermocompression bonding of the thermocompression sheet 30 to the frames 20 is carried out one after another without stopping the heat sources of the heat table 40 and heat rollers 50.

[0045] 8 is a cross-sectional view schematically showing a first example of the workpiece fixing step 1-2 shown in FIG. 6. The workpiece fixing step 1-2 is a step of fixing the workpiece 10 to the thermocompression sheet 30. In the workpiece fixing step 1-2 of the first example of the second embodiment, the workpiece 10 is fixed to the first surface 31 of the thermocompression sheet 30. That is, in the first example, similar to the first embodiment, the thermocompression sheet 30 is fixed to the same surface (first surface 31) of the workpiece 10 as the surface (first surface 31) to which the frame 20 is pressure-bonded.

[0046] The workpiece fixing step 1-2 of the second embodiment is performed by the heat table 40 and the decompression chamber 70. The decompression chamber 70 includes an upper body 71, a lower body 72, decompression units 73 and 74, atmosphere release units 75 and 76, a sheet fixing portion 77, and outer periphery fixing portions 78 and 79.

[0047] The upper body 71 includes a concave lid that opens downward. The lower body 72 is provided below the upper body 71 and includes a concave box that opens upward. The openings of the upper body 71 and the lower body 72 have the same shape, and are larger than the outer diameter of the workpiece 10 and smaller than the inner diameter of the frame 20. The upper body 71 can be raised and lowered relative to the lower body 72, and by lowering the upper body 71 so that the opening overlaps the opening of the lower body 72, the upper body 71 and the lower body 72 become one body, forming a space inside the upper body 71 and the lower body 72 that is isolated from the outside.

[0048] At this time, a thermocompression sheet 30 can be fixed between the upper body 71 and the lower body 72. When the thermocompression sheet 30 is fixed between the upper body 71 and the lower body 72, the thermocompression sheet 30 separates the internal spaces of the upper body 71 and the lower body 72 into an upper body 71 side and a lower body 72 side.

[0049] A heat table 80 is provided inside the lower body 72. The heat table 80 may be the same as the heat table 40 used in frame fixing step 1-1, or may be a separate table. The heat table 80 is provided so that when the workpiece 10 is placed on the holding surface 81, the height of the upper surface (surface 12) of the workpiece 10 is approximately the same as the height of the opening of the lower body 72 or slightly lower than the height of the opening of the lower body 72.

[0050] The decompression unit 73 includes a pipe having one end connected to a side wall or ceiling (side wall in the second embodiment) of the upper body 71 and the other end connected to a suction source (not shown). The decompression unit 73 reduces the pressure inside the upper body 71 by opening an on-off valve provided in the pipe and generating negative pressure using the suction source. The decompression unit 74 includes a pipe having one end connected to a side wall or bottom wall (side wall in the second embodiment) of the lower body 72 and the other end connected to a suction source (not shown). The decompression unit 74 reduces the pressure inside the lower body 72 by opening an on-off valve provided in the pipe and generating negative pressure using the suction source.

[0051] The atmosphere venting unit 75 includes a pipe having one end connected to the side wall or ceiling (ceiling in the second embodiment) of the upper body 71 and the other end open to the atmosphere. The atmosphere venting unit 75 opens the interior of the upper body 71 to the atmosphere by opening an on-off valve provided in the pipe. The atmosphere venting unit 76 includes a pipe having one end connected to the side wall or bottom wall (side wall in the second embodiment) of the lower body 72 and the other end open to the atmosphere. The atmosphere venting unit 76 opens the interior of the lower body 72 to the atmosphere by opening an on-off valve provided in the pipe.

[0052] The sheet fixing portion 77 is provided on the upper main body 71 side. When the upper main body 71 and the lower main body 72 are integrated to sandwich the thermocompression sheet 30 therebetween, the sheet fixing portion 77 fixes the thermocompression sheet 30 at a portion that is to be placed inside the decompression chamber 70. The sheet fixing portion 77 fixes the thermocompression sheet 30 so as to divide the space inside the decompression chamber 70 into a space on the upper main body 71 side that is surrounded by the upper main body 71 and the thermocompression sheet 30, and a space on the lower main body 72 side that is surrounded by the lower main body 72 and the thermocompression sheet 30.

[0053] The outer periphery fixing portion 78 is provided around the entire outer periphery of the opening of the upper main body 71. The outer periphery fixing portion 79 is provided around the entire outer periphery of the opening of the lower main body 72. The outer periphery fixing portions 78, 79 include a sealing material made of an elastically deformable elastic body such as rubber. The outer periphery fixing portions 78, 79 fix the thermocompression sheet 30 when the upper main body 71 and the lower main body 72 are integrated to sandwich the thermocompression sheet 30 therebetween.

[0054] In workpiece fixing step 1-2 of the first example of the second embodiment, first, the heat source of the heat table 80 is activated to heat the holding surface 81 to a predetermined temperature. Next, the upper body 71 of the decompression chamber 70 is raised and separated from the lower body 72, and with the on-off valves of the decompression unit 74 and the atmosphere release unit 76 closed, the workpiece 10 is placed on the holding surface 81 of the heat table 80. At this time, the back surface 15 side of the workpiece 10 is placed on the holding surface 81 so that the front surface 12 of the workpiece 10 faces up. As a result, the workpiece 10 is heated from the back surface 15 side via the holding surface 81.

[0055] Next, with the on-off valves of the decompression unit 73 and the atmosphere release unit 75 closed, the thermocompression sheet 30 bonded to the frame 20 is carried in so that the second surface 32 of the thermocompression sheet 30 abuts against the sheet fixing portion 77 and the outer periphery fixing portions 78, 79. Next, the upper body 71 is lowered so that its opening overlaps the opening of the lower body 72, thereby integrating with the lower body 72 and sealing the interiors of the upper body 71 and the lower body 72. At this time, the thermocompression sheet 30 separates the interior space of the decompression chamber 70 into a space on the upper body 71 side surrounded by the upper body 71 and the thermocompression sheet 30, and a space on the lower body 72 side surrounded by the lower body 72 and the thermocompression sheet 30.

[0056] Next, with the on-off valve of the atmosphere release unit 75 closed, the on-off valves of the decompression units 73 and 74 are opened, and the decompression units 73 and 74 decompress the space inside the decompression chamber 70. More specifically, the decompression unit 73 decompresses the space on the upper body 71 side surrounded by the upper body 71 and the second surface 32 of the thermocompression sheet 30, and the decompression unit 74 decompresses the space on the lower body 72 side surrounded by the lower body 72 and the first surface 31 of the thermocompression sheet 30. After decompression for a predetermined time, the on-off valves of the decompression units 73 and 74 are closed again.

[0057] Next, with the on-off valves of the decompression units 73 and 74 and the atmosphere release unit 76 closed, the on-off valve of the atmosphere release unit 75 is opened. Then, gas enters the space on the upper body 71 side, which is surrounded by the upper body 71 and the second surface 32 of the thermocompression sheet 30, through the piping of the atmosphere release unit 75, and the air pressure approaches atmospheric pressure. As a result, the entering gas presses the thermocompression sheet 30 toward the surface 12 of the workpiece 10.

[0058] When the thermocompression sheet 30 comes into contact with the surface 12 of the workpiece 10, it is heated through the workpiece 10 because the workpiece 10 is heated by the heat table 80, and is brought into close contact with the surface 12 of the workpiece 10. As a result, the first surface 31 of the thermocompression sheet 30, to which the frame 20 is pressed against the outer periphery, is pressed against the surface 12 of the workpiece 10, and the workpiece 10 and the frame 20 are integrated via the thermocompression sheet 30.

[0059] When the thermocompression sheet 30 is heated by the heat table 80 via the workpiece 10, it is preferably heated to a temperature above its softening point and below its melting point. After the thermocompression sheet 30 has been thermocompressed to the workpiece 10, the open / close valve of the atmosphere release unit 76 is opened to open the space on the lower body 72 side, surrounded by the thermocompression sheet 30 and the first surface 31, to the atmosphere, and the upper body 71 is raised. The thermocompression sheet 30 is cooled by being carried out of the heat table 80 in the production line.

[0060] Fig. 9 is a cross-sectional view schematically showing a second example of the workpiece fixing step 1-2 shown in Fig. 6. In the workpiece fixing step 1-2 of the second example of the second embodiment, the workpiece 10 is fixed to the second surface 32 of the thermocompression sheet 30. That is, in the second example, the thermocompression sheet 30 is fixed to the surface (second surface 32) of the workpiece 10 opposite to the surface (first surface 31) to which the frame 20 is pressure-bonded.

[0061] The workpiece fixing step 1-2 in the second example is the same procedure as the workpiece fixing step 1-2 in the first example shown in Figure 8, except that it is performed by reversing the first surface 31 and the second surface 32 of the thermocompression sheet 30, so its explanation will be omitted.

[0062] As described above, in the processing method for workpiece 10 according to the embodiment, when thermocompression-bonding thermocompression sheet 30 without an adhesive layer to frame 20, both heat table 40 and heat roller 50 are used to directly heat and press both thermocompression sheet 30 and frame 20 to which thermocompression sheet 30 is fixed. This makes it possible to firmly bond thermocompression-bonded sheet 30 without an adhesive layer to frame 20, which has many irregularities and scratches on its surface and is made of metal, making it more difficult for resin to bond to than workpiece 10 (semiconductor wafer).

[0063] The present invention is not limited to the above-described embodiment, and can be implemented in various modifications without departing from the gist of the present invention.

[0064] That is, for example, the thermocompression bonding of the thermocompression sheet 30 to the workpiece 10 and the frame 20 may be performed simultaneously as in the first embodiment, or separately as in the second embodiment. Furthermore, the workpiece 10 and the frame 20 may be pressure-bonded to the same surface of the thermocompression sheet 30 as in the first embodiment and the first example of the second embodiment, or may be pressure-bonded to different surfaces as in the second example of the second embodiment. When the workpiece 10 and the frame 20 are pressure-bonded to different surfaces of the thermocompression sheet 30, the thermocompression sheet 30 may also be pressure-bonded to the workpiece 10 by the heat roller 50 in the workpiece fixing step 1-2.

[0065] Furthermore, although in each embodiment the thermocompression sheet 30 is pressure-bonded to the front surface 12 of the workpiece 10 having the device 14, in the present invention it may also be thermocompression-bonded to the back surface 15 of the workpiece 10. When the thermocompression sheet 30 is pressure-bonded to the front surface 12, in processing step 2, for example, grinding may be performed to grind the back surface 15 of the workpiece 10, or laser processing such as stealth dicing may be performed from the back surface 15. When the thermocompression sheet 30 is pressure-bonded to the back surface 15, for example, cutting as in the first embodiment, or laser processing such as dicing may be performed from the front surface 12 of the workpiece 10.

[0066] Also, for example, after fixing the thermocompression sheet 30 to the surface 12 side of the workpiece 10 having the device 14 and the frame 20 by thermocompression bonding, a layer that absorbs the unevenness of the device 14 may be formed using a UV-curable liquid resin. [Explanation of symbols]

[0067] 10 Workpiece 20 frames 21 Aperture 30 Thermocompression sheet 40, 80 heat table 50 Heat Roller

Claims

1. A method for processing a workpiece, comprising: an integration step of heating and compressing a thermocompression sheet to a frame having an opening for accommodating a workpiece and the workpiece accommodated in the opening, thereby integrating the frame and the workpiece via the thermocompression sheet; a processing step of processing the workpiece integrated with the frame by the thermocompression sheet; Equipped with In the integration step, the workpiece is fixed to one side of the thermocompression sheet, the frame is fixed to the other side of the thermocompression sheet, and the thermocompression sheet is fixed to the frame by pressing the thermocompression sheet against the frame, which is heated by a heat table equipped with a heat source, while being heated by a heat roller equipped with a heat source; The method for processing a workpiece is characterized in that the thermocompression sheet does not have an adhesive layer in the area where the workpiece and the frame are attached.

2. The integration step comprises: a workpiece fixing step of fixing the workpiece to the one surface of the thermocompression sheet; a frame fixing step of fixing the frame to the other surface of the thermocompression sheet; The method for processing a workpiece according to claim 1, comprising:

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