Ceramic electronic component with carrier substrate, ceramic electronic component mounting structure, and electronic component series

Abstract

To provide a ceramic electronic component with a carrier base that suppresses a ceramic element body of the ceramic electronic component from cracking when mounted.SOLUTION: There is provided a ceramic electronic component with a carrier base that comprises a ceramic electronic component 1 which has a first principal face 1A and a second principal face 1B, a first end face 1C and a second end face 1D, and a first side face 1E and a second side face 1F, and also has at least two external electrodes 4a, 4b formed on an outer surface, and a carrier base 5 which is stuck on the second principal face 1B of the ceramic electronic component 1, wherein a first pressure-sensitive adhesive layer 7 is formed on the first principal face 1A of the ceramic electronic component 1.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a ceramic electronic component with a carrier substrate, in which a carrier substrate is attached to a ceramic electronic component. The present invention also relates to a mounting structure for a ceramic electronic component and an electronic component series. [Background technology]

[0002] Ceramic electronic components such as multilayer ceramic capacitors are widely used in various devices including electronic devices and electric devices (hereinafter referred to as "electronic devices, etc.") For example, Patent Document 1 (JP 2000-100647 A) discloses a multilayer ceramic capacitor with a typical structure.

[0003] Recently, electronic devices have become smaller and more functional. As a result of the miniaturization of electronic devices, the internal volume (space volume) of electronic devices that house electronic circuits made up of electronic components has become extremely small. Furthermore, as electronic devices become more functional, the number of electronic components required to configure an electronic circuit has increased rapidly.

[0004] Therefore, as electronic devices become smaller and more functional, there is a demand for smaller electronic components that make up electronic circuits. For example, in the case of multilayer ceramic capacitors, extremely thin products with ceramic bodies only a few tens of micrometers thick are now in practical use. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-100647 Summary of the Invention [Problem to be solved by the invention]

[0006] As described above, along with the trend toward smaller size and higher performance of electronic devices and the like, there is a demand for smaller, particularly thinner, electronic components. However, in the case of ceramic electronic components, the reduction in thickness poses a problem of a decrease in mechanical strength against external forces.

[0007] Generally, surface-mount ceramic electronic components are picked up by the nozzle of a mounter and then carried to a predetermined position on a substrate or the like for mounting. At this time, there is a risk that the impact of the nozzle will cause cracks in the ceramic body of the thinned ceramic electronic component. If cracks occur in the ceramic body, there is a risk that moisture will penetrate from the outside, causing IR (insulation resistance) defects in the ceramic electronic component.

[0008] Furthermore, even though it is possible to further reduce the thickness of the ceramic body from the viewpoint of manufacturing technology and product characteristics, there have been cases where the thickness of the ceramic body has been made to exceed a certain value in order to maintain mechanical strength against external forces.

[0009] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a ceramic electronic component with a carrier substrate that is less likely to cause cracks in the ceramic body of the ceramic electronic component when it is sucked by the nozzle of a mounter device, for example. [Means for solving the problem]

[0010] In order to solve the above-mentioned conventional problems, a ceramic electronic component with a carrier substrate according to one embodiment of the present invention is , facing each other in the height direction a first major surface and a second major surface; Opposite in the longitudinal direction a first end surface and a second end surface; Opposite in the width direction an external electrode having a first side surface and a second side surface and disposed on at least the first end surface; 2 ends a ceramic electronic component having an external electrode disposed on a surface of the ceramic electronic component; Product Attached, No electrical functionsa ceramic electronic component with a carrier substrate, the ceramic electronic component including a carrier substrate, wherein a first adhesive layer is formed on a first main surface of the ceramic electronic component, and the surface of the first adhesive layer opposite to the ceramic electronic component is exposed, and, A carrier substrate and Connect A second adhesive layer is provided, and the second adhesive layer is The second principal surface of and connected only to the carrier substrate The adhesive strength of the first adhesive layer is greater than the adhesive strength of the second adhesive layer, and the dimension of the ceramic electronic component in the height direction is 100 μm or less. It shall be. Also , the present invention Another The ceramic electronic component with a carrier substrate according to the embodiment of the present invention is Opposite in the height direction a first major surface and a second major surface; Opposite in the longitudinal direction a first end surface and a second end surface; Opposite in the width direction an external electrode having a first side surface and a second side surface and disposed on at least the first end surface; 2 ends a ceramic electronic component having an external electrode disposed on a first main surface of the ceramic electronic component; and Made of ceramic with no electrical function a ceramic electronic component with a carrier substrate, the ceramic electronic component including a carrier substrate, wherein a first adhesive layer is formed on a first main surface of the ceramic electronic component, the surface of the first adhesive layer opposite to the ceramic electronic component is exposed, and a bonding layer is formed between a second main surface of the ceramic electronic component and the carrier substrate, the bonding layer being more brittle than a ceramic body of the ceramic electronic component and more brittle than the carrier substrate; Made of ceramic A fragile layer is provided, and the fragile layer is connected only to the ceramic electronic component and the carrier substrate. The carrier substrate does not overlap any of the first end face, the second end face, the first side face, and the second side face, and the dimension of the ceramic electronic component in the height direction is 100 μm or less. It shall be. [Effects of the Invention]

[0011] The present invention fruit The ceramic electronic component with a carrier substrate according to this embodiment is prevented from cracking or the like in the ceramic body of the ceramic electronic component when it is sucked by, for example, the nozzle of a mounter device.

[0012] Furthermore, the present invention fruit When the ceramic electronic component with the carrier substrate according to this embodiment is mounted on a substrate or the like, the first adhesive layer can be used for temporary fixing. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view of a ceramic electronic component 100 with a carrier substrate. [Figure 2] FIG. 1 is an exploded perspective view of a ceramic electronic component 100 with a carrier substrate. [Figure 3] FIG. 1 is a cross-sectional view of a ceramic electronic component 100 with a carrier substrate. [Figure 4] 4(A) to 4(F) are explanatory views showing steps in an example of a method for manufacturing a ceramic electronic component 100 with a carrier substrate. [Figure 5] 5(G) to 5(L) are continuations of FIG. 4(F), and are explanatory views each showing a step in an example of a method for manufacturing the ceramic electronic component 100 with a carrier substrate. [Figure 6] FIG. 2 is an explanatory diagram of an electronic component series 200. [Figure 7] 7(A) to 7(D) are explanatory diagrams showing the mounting structure (mounting process) of the multilayer ceramic capacitor 1. FIG. [Figure 8] Fig. 8(A) is a side view of the ceramic electronic component 300 with a carrier substrate, and Fig. 8(B) is a cross-sectional view of the ceramic electronic component 300 with a carrier substrate. [Figure 9] 9(A) to 9(D) are explanatory views showing steps in an example of a method for manufacturing a ceramic electronic component 300 with a carrier substrate. [Figure 10] Fig. 10(A) is a side view of the ceramic electronic component 400 with a carrier substrate, and Fig. 10(B) is a cross-sectional view of the ceramic electronic component 400 with a carrier substrate. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0015] It should be noted that each embodiment exemplifies an embodiment of the present invention, and the present invention is not limited to the content of the embodiment. Furthermore, it is possible to combine the contents described in different embodiments, and such combinations are also included in the present invention. Furthermore, the drawings are intended to facilitate understanding of the specification and may be drawn schematically, and the dimensional ratios of the depicted components or between the components may not match the dimensional ratios of those components described in the specification. Furthermore, components described in the specification may be omitted in the drawings, or the number of components may be omitted.

[0016] [First embodiment] (Ceramic electronic component 100 with carrier substrate) 1 to 3 each show a ceramic electronic component 100 with a carrier substrate according to a first embodiment. FIG. 1 is a perspective view of the ceramic electronic component 100 with a carrier substrate. FIG. 2 is an exploded perspective view of the ceramic electronic component 100 with a carrier substrate. FIG. 3 is a cross-sectional view of the ceramic electronic component 100 with a carrier substrate, showing a portion XX indicated by a dashed-dotted arrow in FIG. 1. As shown in FIGS. 1 and 2, the ceramic electronic component 100 with a carrier substrate has a height direction T, a width direction W, and a length direction L.

[0017] In this embodiment, the ceramic electronic component 100 with a carrier substrate includes a multilayer ceramic capacitor 1 as the ceramic electronic component. However, the type of ceramic electronic component in the present invention is arbitrary and is not limited to a multilayer ceramic capacitor. Instead of a capacitor, for example, an inductor, a thermistor, a varistor, a resistor, or the like may be used. Furthermore, the ceramic electronic component is not limited to a multilayer ceramic electronic component, and may be a so-called bulk ceramic electronic component.

[0018] The multilayer ceramic capacitor 1 has a first main surface (the lower main surface in the drawing) 1A and a second main surface (the upper main surface in the drawing) 1B that face each other in the height direction T. The multilayer ceramic capacitor 1 also has a first side surface 1C and a second side surface 1D that face each other in the width direction W. The multilayer ceramic capacitor 1 also has a first end surface 1E and a second end surface 1F that face each other in the length direction L.

[0019] The dimensions of the multilayer ceramic capacitor 1 are arbitrary, but in this embodiment, the dimensions are 100 μm in height, 300 μm in width, and 600 μm in length.

[0020] The multilayer ceramic capacitor 1 includes a ceramic body 2. The ceramic body 2 is made up of a plurality of ceramic layers 2a stacked together, as shown in Fig. 3. The number of ceramic layers 2a is optional.

[0021] The ceramic body 2 (ceramic layer 2a) may be made of any material, such as a dielectric ceramic containing BaTiO3 as its main component. However, instead of BaTiO3, dielectric ceramics containing other materials as their main components, such as CaTiO3, SrTiO3, or CaZrO3, may also be used.

[0022] Internal electrodes 3a and 3b are formed between the ceramic layers 2a. The number and thickness of the internal electrodes 3a and 3b are arbitrary. However, in principle, the internal electrodes 3a and 3b are alternately arranged in the height direction T. Note that there may be an interlayer between the ceramic layers 2a where no internal electrodes 3a and 3b are arranged.

[0023] The internal electrode 3a is extended to a first end face 1E of the multilayer ceramic capacitor 1. The internal electrode 3b is extended to a second end face 1F of the multilayer ceramic capacitor 1.

[0024] The main component material of the internal electrodes 3a and 3b can be any material, but in this embodiment, Ni is used. However, other metals such as Cu, Ag, Pd, and Au may be used instead of Ni. Furthermore, Ni, Cu, Ag, Pd, and Au may be alloyed with other metals.

[0025] An external electrode 4a is formed on a first end face 1E of the multilayer ceramic capacitor 1. However, the external electrode 4a is formed in a cap shape, with its edge portion extending from the first end face 1E to the first main face 1A, the second main face 1B, the first side face 1C, and the second side face 1D. An external electrode 4b is formed on a second end face 1F of the multilayer ceramic capacitor 1. However, the external electrode 4b is formed in a cap shape, with its edge portion extending from the first end face 1E to the first main face 1A, the second main face 1B, the first side face 1C, and the second side face 1D.

[0026] The internal electrode 3a is connected to the external electrode 4a, and the internal electrode 3b is connected to the external electrode 4b.

[0027] In this embodiment, the external electrodes 4a, 4b have a multi-layer structure. However, in Fig. 3, for ease of viewing, the external electrodes 4a, 4b are shown as a single layer. In this embodiment, the external electrodes 4a, 4b are composed of a first layer formed by baking a conductive paste mainly composed of Ni, a second layer formed by plating mainly composed of Cu, a third layer formed by plating mainly composed of Ni, and a fourth layer formed by plating mainly composed of Sn. However, the structure of the external electrodes 4a, 4b and the materials of each layer are arbitrary and can be changed.

[0028] The ceramic electronic component 100 with a carrier substrate includes a carrier substrate 5. The material of the carrier substrate 5 is arbitrary, but in this embodiment, a resin is used. The dimensions of the carrier substrate 5 are also arbitrary, but in this embodiment, the height is 200 μm, the width is 300 μm, and the length is 600 μm. The surface roughness of the carrier substrate 5 is also arbitrary and can be set appropriately. The carrier substrate 5 is produced, for example, by resin molding, but the surface roughness may be adjusted after production by barrel polishing, sandblasting, or the like.

[0029] The carrier substrate 5 is attached to the second main surface 1B of the multilayer ceramic capacitor 1 via a second adhesive layer 6. The second adhesive layer 6 may be made of any material, for example, the same material as the adhesive layer of sticky notes commercially available as stationery. The thickness of the second adhesive layer 6 is also arbitrary. In this embodiment, the second adhesive layer 6 is provided over the entire second main surface 1B of the multilayer ceramic capacitor 1 and the entire underside of the carrier substrate 5, but it may also be provided partially. In this case, the adhesive force between the multilayer ceramic capacitor 1 and the carrier substrate 5 can be weakened. The adhesive force here refers to the force required to separate the multilayer ceramic capacitor 1 and the carrier substrate 5 when a force is applied to them in a direction separating them from each other.

[0030] The carrier base 5 is provided to prevent defects such as cracks from occurring in the ceramic body 2 of the multilayer ceramic capacitor 1 (ceramic electronic component) when the ceramic electronic component 100 with the carrier base is sucked by a nozzle or the like of a mounter device. Therefore, when the ceramic electronic component 100 with the carrier base is sucked by a nozzle or the like of a mounter device, the upper surface of the carrier base 5 is sucked. Note that the carrier base 5 is no longer needed after the multilayer ceramic capacitor 1 (ceramic electronic component) is mounted on a substrate or the like, and is therefore, in principle, removed and discarded after mounting.

[0031] In this embodiment, the dimensions of the multilayer ceramic capacitor 1 and the dimensions and shape of the carrier base 5 when viewed in a planar direction are the same: both are rectangular with a width of 300 μm and a length of 600 μm. However, the dimensions and shapes of the two when viewed in a planar direction do not need to be the same, and the carrier base 5 may be smaller or larger than the multilayer ceramic capacitor 1.

[0032] A first adhesive layer 7 is formed on the first main surface 1A of the multilayer ceramic capacitor 1. The first adhesive layer 7 may be made of any material, for example, the same material as the second adhesive layer 6. The thickness of the first adhesive layer 7 is also arbitrary.

[0033] The first adhesive layer 7 is used for temporarily fixing the multilayer ceramic capacitor 1 (ceramic electronic component) to a substrate or the like when mounting the multilayer ceramic capacitor 1 (ceramic electronic component) on the substrate or the like. That is, the multilayer ceramic capacitor 1 is mounted by joining the external electrodes 4a, 4b to mounting electrodes on the substrate or the like by, for example, reflow soldering, and the first adhesive layer 7 can be used for temporary fixing before reflow soldering is performed.

[0034] In this embodiment, the first adhesive layer 7 is formed over the entire first main surface 1A of the multilayer ceramic capacitor 1. However, the first adhesive layer 7 may be formed partially on the first main surface 1A of the multilayer ceramic capacitor 1. For example, the first adhesive layer 7 may be formed only on portions of the first main surface 1A of the multilayer ceramic capacitor 1 where the external electrodes 4a, 4b are not formed. In this case, it is possible to prevent the first adhesive layer 7 from interfering with the bonding between the external electrodes 4a, 4b and mounting electrodes on a substrate or the like.

[0035] In the ceramic electronic component 100 with a carrier substrate, the adhesive strength between the multilayer ceramic capacitor 1 (ceramic electronic component) and the carrier substrate 5 is preferably smaller than the adhesive strength of the temporary fixation between the multilayer ceramic capacitor 1 and a substrate or the like. In this case, after the multilayer ceramic capacitor 1 is temporarily fixed to a substrate or the like, the carrier substrate 5 can be pulled upward to easily remove the carrier substrate 5 from the multilayer ceramic capacitor 1 while maintaining the temporary fixation. To achieve this, for example, different materials may be used for the first adhesive layer 7 and the second adhesive layer 6, and the adhesive strength of the first adhesive layer 7 may be made greater than the adhesive strength of the second adhesive layer 6. Alternatively, the first adhesive layer 7 and the second adhesive layer 6 may be made of the same material, and the area of ​​the first adhesive layer 7 may be made greater than the area of ​​the second adhesive layer 6.

[0036] The following experiment was conducted to compare the adhesive strength of the first adhesive layer 7 and the second adhesive layer 6 in a ceramic electronic component 100 with a carrier substrate. In this experiment, different materials were used for the first adhesive layer 7 and the second adhesive layer 6. First, a test substrate (not shown) was prepared using the same material as the carrier substrate 5. The test substrate had an adhesive surface, and the surface roughness of the adhesive surface was the same as that of the carrier substrate 5. Next, the first main surface 1A of the multilayer ceramic capacitor 1 was attached to the adhesive surface of the test substrate via the first adhesive layer 7. Next, a force was applied to the test substrate and the carrier substrate 5 in a direction separating them from each other. The applied force was gradually increased. As a result, the multilayer ceramic capacitor 1 and the carrier substrate 5 separated earlier than the multilayer ceramic capacitor 1 and the test substrate. The above experiment confirmed that the adhesive strength of the first adhesive layer 7 was greater than the adhesive strength of the second adhesive layer 6.

[0037] When the ceramic electronic component 100 with a carrier substrate is attached by a nozzle of a mounter, the carrier substrate 5 can be used as the attachment part, so that cracks are less likely to occur in the ceramic body 2 of the multilayer ceramic capacitor 1 (ceramic electronic component).

[0038] When the ceramic electronic component 100 with the carrier substrate is mounted on a substrate or the like, the first adhesive layer 7 can be used for temporary fixing.

[0039] In this embodiment, resin is used as the material of the carrier substrate 5. However, as described above, the material of the carrier substrate 5 is arbitrary, and other materials, such as ceramic, may be used instead of resin. Furthermore, when ceramic is used as the material of the carrier substrate 5, the structure may be a single layer or may be a laminate of multiple ceramic layers. Furthermore, when a carrier substrate 5 having multiple ceramic layers laminated thereon is used, dummy electrodes may be provided between the ceramic layers. Furthermore, when a carrier substrate 5 having multiple ceramic layers laminated thereon is used and dummy electrodes are provided between the ceramic layers, the dummy electrodes may or may not be exposed to the outside of the carrier substrate 5.

[0040] (One Example of a Manufacturing Method for the Carrier Substrate-Attached Ceramic Electronic Component 100) The ceramic electronic component 100 with a carrier substrate can be manufactured, for example, by the method shown in FIGS. 4(A) to 5(L).

[0041] First, as shown in FIG. 4(A), a plurality of carrier substrates 5 are prepared.

[0042] Next, as shown in Fig. 4(B), a first jig 50 is prepared. The first jig 50 is made of, for example, a metal flat plate, and has a plurality of recessed first storage sections 51 formed on one main surface. Although not shown, vacuum suction holes are provided on the bottom surface of the first storage section 51 of the first jig 50, so that when an item to be stored is vacuum-sucked, the item will not fall even if the surface of the first jig 50 on which the first storage section 51 is formed is turned downward.

[0043] 4(C), the carrier base 5 is stored in the first storage section 51 of the first jig 50. For example, the storage can be performed by placing a plurality of carrier bases 5 on the surface of the first jig 50 on which the first storage section 51 is formed, and vibrating the first jig 50 to drop the carrier bases 5 into the first storage section 51. After storing the carrier bases 5 in the first storage section 51, the carrier bases 5 are adsorbed by the vacuum suction holes.

[0044] 4(D), a second adhesive layer 6 is formed on the surface of the carrier base 5 that is exposed from the first storage section 51 of the first jig 50. The second adhesive layer 6 can be formed by any method, for example, screen printing or inkjet printing.

[0045] Next, as shown in FIG. 4(E), a plurality of multilayer ceramic capacitors 1 (ceramic electronic components) are prepared.

[0046] Next, as shown in FIG. 4(F), a second jig 60 is prepared. Like the first jig 50, the second jig 60 is also made of, for example, a metal flat plate, and has multiple recessed second storage sections 52 formed on one main surface. Although not shown, vacuum suction holes are also provided on the bottom surface of the second storage section 61 of the second jig 60, so that when an object to be stored is vacuum-sucked, the object will not fall even if the surface of the second jig 60 on which the second storage section 61 is formed is turned downward. In this embodiment, the depth of the second storage section 52 is smaller than the depth of the first storage section 51.

[0047] 5(G), the multilayer ceramic capacitors 1 are stored in the second storage sections 61 of the second jig 60. For example, the storage can be performed by placing a plurality of multilayer ceramic capacitors 1 on the surface of the second jig 60 on which the second storage sections 61 are formed, and vibrating the second jig 60 to drop the multilayer ceramic capacitors 1 into the second storage sections 61. After storing the multilayer ceramic capacitors 1 in the second storage sections 61, the multilayer ceramic capacitors 1 are sucked by the vacuum suction holes.

[0048] Next, as shown in Figure 5(H), a second jig 60 containing a multilayer ceramic capacitor 1 is placed on top of a first jig 50 containing a carrier base 5 on which a second adhesive layer 6 is formed, with the second main surface 1B of the multilayer ceramic capacitor 1 facing downward.

[0049] Next, as shown in FIG. 5(I), the second jig 60 is lowered toward the first jig 50, and the carrier substrate 5 is attached to the second main surface 1B of the multilayer ceramic capacitor 1 by the second adhesive layer 6.

[0050] Next, the suction of the multilayer ceramic capacitor 1 by the vacuum suction holes in the second storage section 61 is stopped, and the second jig 60 is raised in a direction away from the first jig 50. As a result, as shown in Fig. 5(J), the multilayer ceramic capacitor 1 with the carrier base 5 attached remains on the first jig 50. The first main surface 1A of the multilayer ceramic capacitor 1 is exposed to the outside (upper side).

[0051] Next, as shown in Fig. 5(K), a first adhesive layer 7 is formed on the first main surface 1A of the multilayer ceramic capacitor 1. The first adhesive layer 7 may be formed by any method, but may be formed by the same method as the method for forming the second adhesive layer 6. In this way, a ceramic electronic component 100 with a carrier substrate is completed.

[0052] Finally, as shown in FIG. 5(L), the ceramic electronic component 100 with the carrier substrate is removed from the first jig 50.

[0053] (Electronic Components Series 200) 6 shows a series of electronic components 200 according to the first embodiment. A series of electronic components is a transport form for a plurality of electronic components used when transporting a plurality (a large number) of electronic components from an electronic component manufacturer or the like to a manufacturer of electronic devices or electric devices that is a user of the electronic components.

[0054] The serial electronic components 200 are provided with a long carrier tape 21 having a certain thickness. The material of the carrier tape 21 is not limited, but resin or paper can be used. The carrier tape 21 is preferably flexible.

[0055] A plurality of recessed storage sections 22 are formed on the upper main surface of the carrier tape 21. The electronic component series 200 according to this embodiment is characterized in that an adhesion-preventing layer 23 is provided on at least a portion of the inner surface (inner wall) of the storage section 22.

[0056] The adhesion-preventing layer 23 is intended to prevent, for example, the first adhesive layer 7 of the ceramic electronic component 100 with a carrier substrate from adhering to the inner wall of the storage section 22. Any material may be used for the adhesion-preventing layer 23, but for example, substances that are currently commercially available as mold release agents may be used.

[0057] The housing sections 22 of the series of electronic components 200 each house a ceramic electronic component 100 with a carrier substrate.

[0058] The housing 22 housing the ceramic electronic component 100 with a carrier substrate is sealed with a long sealing tape 24. The sealing tape 24 may be made of any material, such as resin or paper. The sealing tape 24 is also preferably flexible.

[0059] The electronic component string 200 is suitable for transporting the ceramic electronic component 100 with the carrier substrate, in which the first adhesive layer 7 is exposed on the outer surface, because the adhesion-preventing layer 23 is provided on at least a portion of the inner surface (inner wall) of the storage section 22. The electronic component string 200 can be rolled up to be compact for transport.

[0060] (Mounting structure for ceramic electronic components) With reference to FIGS. 7(A) to 7(D), a mounting structure (mounting process) for the multilayer ceramic capacitor 1 of the above-described ceramic electronic component 100 with a carrier substrate will be described.

[0061] 7(A), a substrate 70 is prepared. Mounting electrodes 71a and 71b are formed on the upper main surface of the substrate. Cream solder 72 is printed in advance on the main surfaces of the mounting electrodes 71a and 71b.

[0062] 7(B), the ceramic electronic component 100 with the carrier substrate is temporarily fixed to the substrate 70 by the first adhesive layer 7. At this time, most of the first adhesive layer 7 is directly attached to the main surface of the substrate 70, but some of the first adhesive layer 7 is attached to the cream solder 72 printed on the mounting electrodes 71a and 71b.

[0063] 7(C), the carrier base 5 and the second adhesive layer 6 are removed from the multilayer ceramic capacitor 1 and discarded. As described above, if the adhesive strength of the first adhesive layer 7 is made greater than the adhesive strength of the second adhesive layer 6, the carrier base 5 and the second adhesive layer 6 are separated from the multilayer ceramic capacitor 1 by lifting the carrier base 5 in a direction away from the substrate 70. Note that all or part of the second adhesive layer 6 may remain on the second main surface 1B of the multilayer ceramic capacitor 1.

[0064] 7(D), the cream solder 72 is heated to melt and then cooled to form solder fillets 73. The solder fillets 73 bond the external electrode 4a of the multilayer ceramic capacitor 1 to the mounting electrode 71a, and bond the external electrode 4b to the mounting electrode 71b. The first adhesive layer 7 between the cream solder 72 and the external electrodes 4a and 4b may evaporate and / or melt into the solder fillets 73. The first adhesive layer 7 between the main surface of the substrate 70 and the multilayer ceramic capacitor 1 may also evaporate.

[0065] In this way, the multilayer ceramic capacitor 1 is mounted on the substrate 70.

[0066] [Second embodiment] (Ceramic electronic component 300 with carrier substrate) 8(A) and 8(B) show a ceramic electronic component 300 with a carrier substrate according to the second embodiment. Fig. 8(A) is a side view of the ceramic electronic component 300 with a carrier substrate. Fig. 8(B) is a cross-sectional view of the ceramic electronic component 300 with a carrier substrate.

[0067] The ceramic electronic component 300 with a carrier substrate is obtained by partially modifying the structure of the ceramic electronic component 100 with a carrier substrate according to the first preferred embodiment described above.

[0068] In the ceramic electronic component 100 with a carrier substrate, the carrier substrate 5 is made of resin, but in the ceramic electronic component 300 with a carrier substrate, this is changed and the carrier substrate 35 is made of ceramic. Also, in the ceramic electronic component 100 with a carrier substrate, the multilayer ceramic capacitor 1 and the carrier substrate 5 are attached to each other by a second adhesive layer 6 provided therebetween, but in the ceramic electronic component 300 with a carrier substrate, this is changed and the multilayer ceramic capacitor 1 and the carrier substrate 35 are attached to each other by a fragile layer 36 provided therebetween.

[0069] The carrier substrate 35 includes a ceramic body 32 in which a plurality of ceramic layers 32a are laminated. In this embodiment, the ceramic layers 32a are made of a dielectric ceramic having the same composition as the ceramic body 2 (ceramic layers 2a) of the multilayer ceramic capacitor 1. However, the ceramic layers 32a may be made of a ceramic having a different composition from that of the ceramic body 2.

[0070] Dummy electrodes 33 are formed between the ceramic layers 32a. In the application documents of this application, the dummy electrodes 33 may be referred to as metal layers. In this embodiment, as will be described later, the ceramic body 32 of the carrier substrate 35 and the ceramic body 2 of the multilayer ceramic capacitor 1 are simultaneously fired while being attached to each other, and the dummy electrodes 33 serve to approximate the behavior (shrinkage, etc.) of the ceramic body 32 and the ceramic body 2 during firing. The dummy electrodes 33 do not have any electrical role.

[0071] 8(A) and 8(B), in this embodiment, the dummy electrodes 33 are exposed from the side surfaces and end surfaces of the carrier base 35. When the dummy electrodes 33 are exposed from the side surfaces and end surfaces of the carrier base 35, the manufacture of the carrier base 35 becomes easier. That is, the process of manufacturing the carrier base 35 generally includes the steps of producing an unsintered mother laminate and cutting the unsintered mother laminate into individual unsintered laminates. However, if the width of the dummy electrodes 33 is made smaller than the width of the carrier base 35 and the length of the dummy electrodes 33 is made smaller than the length of the carrier base 35 so that the dummy electrodes 33 are not exposed from the side surfaces and end surfaces of the carrier base 35, it becomes extremely difficult to control the cutting position when cutting the unsintered mother laminate into individual unsintered laminates, resulting in a complicated process. That is, if the cutting position is incorrect, the dummy electrodes 33 will be exposed from the side surfaces and end surfaces of the carrier substrate 35, and defective products with exposed dummy electrodes 33 will be mixed with original products without exposed dummy electrodes 33 from the side surfaces and end surfaces, resulting in quality variations. In contrast, if the width of the dummy electrodes 33 and the width of the carrier substrate 35 are made the same as the width and length of the carrier substrate 35 from the beginning, and the dummy electrodes 33 are designed to be exposed from the side surfaces and end surfaces of the carrier substrate 35, strict control of the cutting position is not required when cutting the unsintered mother laminate into individual unsintered laminates, and manufacturing of the carrier substrate 35 becomes easier. Furthermore, if the dummy electrodes 33 are exposed from the side surfaces and end surfaces of the carrier substrate 35, the problem of a step between the areas with dummy electrodes 33 and the areas without dummy electrodes 33 does not occur.

[0072] In this embodiment, the fragile layer 36 is also made of ceramic. The fragile layer 36 is made by simultaneously firing the ceramic body 2 of the multilayer ceramic capacitor 1 and the ceramic body 32 of the carrier substrate 35. The fragile layer 36 is made of a ceramic that is more fragile than the ceramic body 2 of the multilayer ceramic capacitor 1 and the ceramic body 32 of the carrier substrate 35.

[0073] There are several possible methods for making the ceramic constituting the fragile layer more fragile than the ceramic body 2 of the multilayer ceramic capacitor 1 and the ceramic body 32 of the carrier substrate .

[0074] For example, the ceramic that constitutes the fragile layer 36 may be one that has a higher sintering temperature than the dielectric ceramic of the ceramic body 2 and the ceramic body 32. The ceramic of the ceramic body 2 and the ceramic body 32 may then be fired at a temperature that is lower than the sintering temperature of the ceramic that constitutes the fragile layer 36. In this case, the ceramic that constitutes the fragile layer 36 remains unsintered and is more brittle than the ceramic body 2 and the ceramic body 32.

[0075] Alternatively, even if the ceramic constituting the fragile layer 36 has the same composition as the ceramic (dielectric ceramic) of the ceramic body 2 and the ceramic body 32, by increasing the porosity of the ceramic constituting the fragile layer 36, the ceramic constituting the fragile layer 36 can be made more brittle than the ceramic of the ceramic body 2 and the ceramic body 32. In order to increase the porosity of the ceramic constituting the fragile layer 36, for example, powder that disappears during firing may be added to the ceramic green sheet used to produce the fragile layer 36.

[0076] In the ceramic electronic component 300 with a carrier substrate, the adhesive strength between the multilayer ceramic capacitor 1 and the substrate or the like due to the first adhesive layer 7 is preferably greater than the adhesive strength between the multilayer ceramic capacitor 1 and the carrier substrate 35 due to the fragile layer 36.

[0077] For example, the following design is preferable. First, a test substrate (not shown) is prepared using the same material as the carrier substrate 35, and has an attachment surface with the same surface roughness as the surface of the carrier substrate 35 that is not in contact with the fragile layer 36. Next, a ceramic electronic component 300 with a carrier substrate is prepared, and a first adhesive layer 7 is attached to the attachment surface of the test substrate. Next, a force is applied to the test substrate and the carrier substrate 35 in a direction that separates them from each other. The applied force is gradually increased. As a result, the design is such that the multilayer ceramic capacitor 1 and the carrier substrate 35 separate before the multilayer ceramic capacitor 1 and the test substrate separate. In other words, the design is such that the adhesive force of the first adhesive layer 7 is greater than the adhesive force of the fragile layer 36.

[0078] When the ceramic electronic component 300 with a carrier substrate is attached by the nozzle of a mounter, the carrier substrate 35 can be used as the attachment part, so that cracks are less likely to occur in the ceramic body 2 of the multilayer ceramic capacitor 1 (ceramic electronic component).

[0079] When the ceramic electronic component 300 with the carrier substrate is mounted on a substrate or the like, the first adhesive layer 7 can be used for temporary fixing.

[0080] 8(A) and 8(B), in this embodiment, the dummy electrodes 33 are exposed from both the side surfaces and the end surfaces of the carrier base 35. However, this may be modified in design so that the dummy electrodes 33 are exposed from only one of the side surfaces or the end surfaces of the carrier base 35, or may not be exposed from either the side surfaces or the end surfaces.

[0081] (One Example of a Manufacturing Method for the Carrier Substrate-Attached Ceramic Electronic Component 300) The ceramic electronic component 300 with a carrier substrate can be manufactured, for example, by the method shown in FIGS. 9(A) to 9(D).

[0082] First, as shown in FIG. 9(A), a predetermined number of ceramic green sheets 43 for producing the ceramic element body 2 of the multilayer ceramic capacitor 1 are stacked. A conductive paste 44 for producing the internal electrodes 3a, 3b is printed on the main surfaces of the predetermined ceramic green sheets 43. A ceramic green sheet 45 for producing the fragile layer 36 is stacked thereon. The thickness and number of ceramic green sheets 45 are arbitrary. A predetermined number of ceramic green sheets 46 for producing the ceramic element body 32 of the carrier substrate 35 are stacked thereon. A conductive paste 47 for producing the dummy electrodes 33 is printed on the main surfaces of the predetermined ceramic green sheets 46. Next, the entire assembly is pressed from above and below to integrate, producing an unfired laminate 48.

[0083] Next, as shown in Figure 9(B), the unsintered laminate 48 is fired to produce a laminate 49 in which the ceramic element 2 of the multilayer ceramic capacitor 1 and the ceramic element 32 of the carrier substrate 35 are attached via the fragile layer 36.

[0084] Next, as shown in FIG. 9(C), an external electrode 4a is formed on the first end face 1E of the ceramic body 2 of the multilayer ceramic capacitor 1, and an external electrode 4b is formed on the second end face 1F.

[0085] Next, as shown in FIG. 9(D), a first adhesive layer 7 is formed on the first main surface 1A of the ceramic body 2 of the multilayer ceramic capacitor 1.

[0086] In this way, the ceramic electronic component 300 with the carrier substrate is completed.

[0087] [Third embodiment] (Ceramic electronic component with carrier substrate 400) 10(A) and 10(B) show a ceramic electronic component 400 with a carrier substrate according to the third embodiment. Fig. 10(A) is a side view of the ceramic electronic component 400 with a carrier substrate. Fig. 10(B) is a cross-sectional view of the ceramic electronic component 400 with a carrier substrate.

[0088] The ceramic electronic component 400 with a carrier substrate is a partial modification of the configuration of the ceramic electronic component 300 with a carrier substrate according to the second embodiment described above. Specifically, in the ceramic electronic component 300, the dummy electrodes 33 are exposed from the side surfaces and end surfaces of the carrier substrate 35. However, in the ceramic electronic component 400, this is modified so that the width of the dummy electrodes 33 is smaller than the width of the carrier substrate 35, and the length of the dummy electrodes 33 is smaller than the length of the carrier substrate 35, so that the dummy electrodes 33 are not exposed from either the side surfaces or end surfaces of the carrier substrate 35.

[0089] In the ceramic electronic component 400 with a carrier substrate, the dummy electrodes 33 are not exposed from either the side or end faces of the carrier substrate 35, so the occurrence of unwanted electrical short circuits via the exposed dummy electrodes 33 is suppressed.

[0090] The ceramic electronic component with a carrier substrate, the mounting structure of the ceramic electronic component, and the electronic component series according to the embodiments have been described above. However, the present invention is not limited to the above-described content, and various modifications can be made within the spirit and scope of the invention.

[0091] For example, although the ceramic electronic components 100, 300, and 400 with a carrier substrate include a multilayer ceramic capacitor 1 as the ceramic electronic component, the type of ceramic electronic component is arbitrary and is not limited to a multilayer ceramic capacitor. Instead of a capacitor, for example, an inductor, a thermistor, a varistor, or a resistor may be used. Furthermore, the ceramic electronic component is not limited to a multilayer ceramic electronic component, and may be a so-called bulk ceramic electronic component.

[0092] Furthermore, in the ceramic electronic components 100, 300, and 400 with a carrier substrate, the ceramic electronic component (multilayer ceramic capacitor 1) has two external electrodes 4a and 4b, but the number of external electrodes may be three or more.

[0093] Furthermore, when viewed in the planar direction, the ceramic electronic components 100, 300, and 400 with a carrier substrate have the same shape and size as the multilayer ceramic capacitor 1 and the carrier substrates 5 and 35, but the shapes and / or sizes of the two may be different.

[0094] Furthermore, in the ceramic electronic components 300 and 400 with carrier substrate, the dummy electrodes (metal layers) 33 are formed between the ceramic layers 32a of the carrier substrate 35, but the dummy electrodes 33 can be omitted.

[0095] A ceramic electronic component with a carrier substrate according to one embodiment of the present invention is as described in the section "Means for Solving the Problems."

[0096] In this ceramic electronic component with a carrier substrate, it is also preferable that the second main surface of the ceramic electronic component and the carrier substrate are attached to each other by a second adhesive layer provided therebetween.

[0097] In this case, it is also preferable to prepare a test substrate made of the same material as the carrier substrate and having an attachment surface with the same surface roughness as the surface of the carrier substrate to which the ceramic electronic component is attached, attach the first adhesive layer to the attachment surface of the test substrate, and then apply force to the test substrate and the carrier substrate in directions that move them apart, so that the ceramic electronic component separates from the carrier substrate before the ceramic electronic component separates from the test substrate.It is also preferable that the adhesive strength of the first adhesive layer is greater than that of the second adhesive layer.

[0098] It is also preferred that the carrier substrate be made of a resin.

[0099] It is also preferable that the second main surface of the ceramic electronic component and the carrier substrate are attached to each other via a brittle layer that is more brittle than the ceramic body of the ceramic electronic component and the carrier substrate.

[0100] In this case, it is also preferable to prepare a test substrate made of the same material as the carrier substrate and having an attachment surface with the same surface roughness as the surface of the carrier substrate to which the ceramic electronic component is not attached, attach the first adhesive layer to the attachment surface of the test substrate, and then apply force to the test substrate and the carrier substrate in directions that move them apart from each other, so that the ceramic electronic component and the carrier substrate separate before the ceramic electronic component and the test substrate separate.

[0101] It is also preferable that the carrier substrate is made of ceramic, which allows the ceramic body of the ceramic electronic component and the ceramic body of the carrier substrate to be produced by co-firing, thereby improving the productivity of ceramic electronic components with a carrier substrate.

[0102] It is also preferable that the carrier substrate has a multilayer structure in which a plurality of ceramic layers are stacked, and a metal layer (dummy electrode) is formed between at least one of the ceramic layers. In this case, when the ceramic body of the ceramic electronic component and the ceramic body of the ceramic carrier substrate are produced by co-firing, the behavior (shrinkage, etc.) of the two during firing can be adjusted to approximate each other.

[0103] The metal layer may or may not be exposed from the side or end face of the carrier substrate. When the metal layer is exposed from the side or end face of the carrier substrate, strict control of the cutting position is not required when cutting the unfired mother laminate into individual unfired laminates, making it easier to manufacture the carrier substrate. In addition, there is no problem of a step occurring between areas with a metal layer and areas without a metal layer. On the other hand, when the metal layer is not exposed from the side or end face of the carrier substrate, the occurrence of unnecessary electrical short circuits mediated by the exposed metal layer is suppressed.

[0104] It is also preferable that the carrier substrate and the ceramic electronic component are made of ceramics having the same composition, which eliminates the need to prepare separate materials and improves productivity of the ceramic electronic component with the carrier substrate.

[0105] It is also preferable that the brittle layer is made of ceramic, which allows the ceramic body of the ceramic electronic component, the ceramic body of the ceramic carrier substrate, and the brittle layer to be produced by co-firing, thereby improving the productivity of ceramic electronic components with carrier substrates.

[0106] It is also preferable that the external electrodes are formed on at least the first main surface, and the first adhesive layer is formed on one main surface on which no external electrodes are formed. In this case, it is possible to prevent the first adhesive layer from interfering with the bonding of the external electrodes. Alternatively, it is also preferable that the first adhesive layer is formed on the entire first main surface. In this case, it is possible to improve the adhesive strength of the first adhesive layer.

[0107] It is also preferable that the ceramic electronic component is a multilayer ceramic electronic component in which a plurality of ceramic layers and a plurality of internal electrodes are laminated.

[0108] Also preferred is a ceramic electronic component mounting structure comprising a substrate and a ceramic electronic component with a carrier substrate of the present invention, in which the ceramic electronic component with the carrier substrate is attached to the main surface of the substrate by a first adhesive layer. In this case, the carrier substrate can be easily removed from the ceramic electronic component and discarded.

[0109] Also preferred is an electronic component series comprising a long tape having a plurality of storage compartments formed on one main surface thereof and at least one ceramic electronic component with a carrier substrate of the present invention, wherein an adhesion-preventing layer is provided on at least a portion of the inner surface of the storage compartment to prevent adhesion of the first adhesive layer, and the ceramic electronic component with a carrier substrate of the present invention is stored in the storage compartment. In this case, the ceramic electronic component with a carrier substrate of the present invention can be transported smoothly. [Explanation of symbols]

[0110] 1. Multilayer ceramic capacitors (ceramic electronic components) 2. Ceramic element 3a, 3b...Internal electrodes 4a, 4b...external electrode 5, 35... Carrier base 6...Second adhesive layer 7...1st adhesive layer 36...vulnerable layer 100, 300, 400... Ceramic electronic components with carrier substrate

Claims

1. A ceramic electronic component having a first main surface and a second main surface that face each other in the height direction, a first end face and a second end face that face each other in the length direction, and a first side face and a second side face that face each other in the width direction, and having an external electrode arranged on at least the first end face and an external electrode arranged on at least the second end face; a carrier substrate having no electrical function attached to the ceramic electronic component, a first adhesive layer is formed on the first main surface of the ceramic electronic component; the first adhesive layer has an exposed surface opposite to the ceramic electronic component; a second adhesive layer is provided to connect the ceramic electronic component and the carrier substrate; the second adhesive layer is connected only to the second main surface of the ceramic electronic component and the carrier base, The adhesive strength of the first adhesive layer is greater than the adhesive strength of the second adhesive layer, the dimension of the ceramic electronic component in the height direction is 100 μm or less; Ceramic electronic components with carrier substrate.

2. preparing a test substrate made of the same material as the carrier substrate and having an attachment surface with the same surface roughness as the surface of the carrier substrate to which the ceramic electronic component is attached; The first adhesive layer is attached to the attachment surface of the test substrate, When a force is applied to the test substrate and the carrier substrate in a direction in which they move away from each other, separation occurs between the ceramic electronic component and the carrier substrate prior to separation between the ceramic electronic component and the test substrate; 2. A ceramic electronic component with a carrier substrate according to claim 1.

3. The carrier substrate is made of a resin.

3. A ceramic electronic component with a carrier substrate according to claim 1 or 2.

4. A ceramic electronic component having a first main surface and a second main surface opposing each other in the height direction, a first end face and a second end face opposing each other in the length direction, and a first side face and a second side face opposing each other in the width direction, and having an external electrode arranged on at least the first end face and an external electrode arranged on at least the second end face; a carrier substrate made of ceramic and having no electrical function, attached to the second main surface of the ceramic electronic component, a first adhesive layer is formed on the first main surface of the ceramic electronic component; the first adhesive layer has an exposed surface opposite to the ceramic electronic component; a brittle layer made of ceramic is provided between the second main surface of the ceramic electronic component and the carrier substrate, the brittle layer being more brittle than the ceramic body of the ceramic electronic component and more brittle than the carrier substrate; the fragile layer is connected only to the ceramic electronic component and the carrier substrate; the carrier substrate does not overlap any of the first end surface, the second end surface, the first side surface, and the second side surface; the dimension of the ceramic electronic component in the height direction is 100 μm or less; Ceramic electronic components with carrier substrate.

5. preparing a test substrate made of the same material as the carrier substrate and having an attachment surface with the same surface roughness as the surface of the carrier substrate to which the ceramic electronic component is attached; The first adhesive layer is attached to the attachment surface of the test substrate, When a force is applied to the test substrate and the carrier substrate in a direction in which they move away from each other, separation occurs between the ceramic electronic component and the carrier substrate prior to separation between the ceramic electronic component and the test substrate; 5. A ceramic electronic component with a carrier substrate according to claim 4.

6. the carrier substrate is formed into a multilayer structure in which a plurality of ceramic layers are stacked, A metal layer is formed between at least one of the ceramic layers.

5. A ceramic electronic component with a carrier substrate according to claim 4.

7. the carrier substrate and the ceramic electronic component are made of ceramics having the same composition; 7. A ceramic electronic component with a carrier substrate according to claim 4.

8. the external electrode is formed on at least the first main surface, the first adhesive layer is formed on the first main surface on which the external electrodes are not formed; 8. A ceramic electronic component with a carrier substrate according to claim 1.

9. The first adhesive layer is formed on the entire first main surface.

8. A ceramic electronic component with a carrier substrate according to claim 1.

10. The ceramic electronic component is a multilayer ceramic electronic component in which a plurality of ceramic layers and a plurality of internal electrodes are laminated.

10. A ceramic electronic component with a carrier substrate according to claim 1.

11. a long tape having a plurality of storage sections formed on one main surface thereof; An electronic component series comprising at least one ceramic electronic component with a carrier substrate according to any one of claims 1 to 10, an adhesion-preventing layer that prevents the first adhesive layer from adhering to at least a portion of the inner surface of the storage section; The ceramic electronic component with the carrier substrate is housed in the housing. Electronic Components Association.

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